JPH05125407A - Production of cu-mo composite rolled sheet - Google Patents
Production of cu-mo composite rolled sheetInfo
- Publication number
- JPH05125407A JPH05125407A JP28851791A JP28851791A JPH05125407A JP H05125407 A JPH05125407 A JP H05125407A JP 28851791 A JP28851791 A JP 28851791A JP 28851791 A JP28851791 A JP 28851791A JP H05125407 A JPH05125407 A JP H05125407A
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- sintered body
- rolled
- composite
- rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Powder Metallurgy (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体支持用の電極若
しくは半導体素子搭載用基盤に用いられるＣｕ−Ｍｏ系
複合圧延板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a Cu-Mo composite rolled sheet used as an electrode for supporting a semiconductor or a substrate for mounting a semiconductor element.
【０００２】[0002]
【従来の技術】従来のＣｕ−Ｍｏ系複合圧延板の製造方
法は数種類あり、一つはＭｏの多孔質焼結体にＣｕを含
浸させ所定の板厚まで圧延加工する方法（以下、スケル
トン法という）であり、一つはＣｕ粉末とＭｏ粉末を混
合した粉末をプレス成型して圧粉体を生成し、該圧粉体
を焼結した後圧延加工する方法（以下、粉末混合法とい
う）であり、一つはＭｏ板にＣｕ板をクラッドさせた後
に所定の厚みまで圧延等により加工し、その後、打ち抜
き、切断等によって製造する方法（以下、クラッド法と
いう）である。2. Description of the Related Art There are several conventional methods for producing a Cu-Mo composite rolled sheet. One is a method for impregnating a porous Mo sintered body with Cu and rolling the sheet to a predetermined sheet thickness (hereinafter referred to as a skeleton method). One is a method in which a powder obtained by mixing Cu powder and Mo powder is press-molded to produce a green compact, and the green compact is sintered and then rolled (hereinafter referred to as a powder mixing method). One is a method (hereinafter referred to as a clad method) in which a Cu plate is clad with a Mo plate, processed by rolling or the like to a predetermined thickness, and then punched or cut.
【０００３】[0003]
【発明が解決しようとする課題】混合法では全体に均一
拡散されるため、目的にあった素材の供給ができるが、
スケルトン法では、ＣｕをＭｏ多孔質焼結体に溶浸させ
るため、その焼結体表層部にＣｕが堆積する恐れがあ
り、表層部を研削する必要が生ずるという問題がある。[Problems to be Solved by the Invention] In the mixing method, since the material is uniformly dispersed throughout, it is possible to supply the material suitable for the purpose.
In the skeleton method, since Cu is infiltrated into the Mo porous sintered body, Cu may be deposited on the surface layer of the sintered body, and there is a problem that the surface layer needs to be ground.
【０００４】又、スケルトン法及び混合法で生成する焼
結体の厚みは、６〜１０mmである。しかし、この焼結体
の圧延加工はＣｕ−Ｍｏ系の複合素材については非常に
困難であり、無理に加工すると前記焼結体の板幅方向に
クラック（ひび割れ）が生ずる。又、加工率は３０％〜
５０％で加工が不可能になってしまう。又、前記焼結体
の板幅方向にクラック（ひび割れ）が生じなかった場合
でも、前記板幅方向に対して垂直な方向にクラック（ひ
び割れ）が生じ良品をえることはできない。The thickness of the sintered body produced by the skeleton method and the mixing method is 6 to 10 mm. However, the rolling process of this sintered body is very difficult for the Cu-Mo-based composite material, and if it is forcibly processed, cracks occur in the plate width direction of the sintered body. In addition, the processing rate is 30% ~
Processing becomes impossible at 50%. Even if no crack (crack) is generated in the plate width direction of the sintered body, a crack (crack) is generated in the direction perpendicular to the plate width direction, and a good product cannot be obtained.
【０００５】一方、クラッド法では圧延方向に対しての
材質は均一であるが、圧延条件の選定が極めて難しく、
微妙な層圧比を制御（例えばＣｕ：Ｍｏ：Ｃｕ＝１：
１：１をＣｕ：Ｍｏ：Ｃｕ＝１．１：１：１．１に変え
る場合等）することが困難である。従って、目的の特性
を得るための加工は難しくコストが高くなってしまい、
特に段付き加工を行うと中間層が露出したり表面層が不
均一になったりするため、均一な特性が得られないとい
う問題がある。On the other hand, in the clad method, the material in the rolling direction is uniform, but it is extremely difficult to select the rolling conditions.
Control subtle layer pressure ratio (eg Cu: Mo: Cu = 1:
It is difficult to change 1: 1 to Cu: Mo: Cu = 1.1: 1: 1.1). Therefore, it is difficult to process to obtain the desired characteristics and the cost becomes high.
In particular, when the step processing is performed, the intermediate layer is exposed and the surface layer becomes uneven, so that there is a problem that uniform characteristics cannot be obtained.
【０００６】本発明の課題は、上記問題点を解決するた
めのＣｕ−Ｍｏ系複合圧延板の製造方法を提供すること
である。An object of the present invention is to provide a method for producing a Cu-Mo composite rolled sheet for solving the above problems.
【０００７】[0007]
【課題を解決するための手段】本発明によれば、１０〜
７０重量％の範囲の混合比でＣｕ粉末とＭｏ粉末とを混
合させ圧粉体を得、該圧粉体を焼結して相対密度９０％
以上で厚さ５mm以下の焼結体を生成した後、該焼結体を
圧延加工して複合圧延板とするＣｕ−Ｍｏ複合圧延板の
製造方法が得られる。According to the present invention,
Cu powder and Mo powder were mixed at a mixing ratio in the range of 70% by weight to obtain a green compact, and the green compact was sintered to obtain a relative density of 90%.
After producing a sintered body having a thickness of 5 mm or less as described above, a method for producing a Cu-Mo composite rolled plate is obtained, in which the sintered body is rolled to form a composite rolled plate.
【０００８】又、前記焼結体の厚さが５mm以下２mmを越
えている時、前記圧延加工として熱間圧延加工及び冷間
圧延加工が行われ前記熱間圧延加工では前記焼結体を厚
さ１．５mm以下まで圧延加工して圧延加工体を得、前記
冷間圧延加工では前記圧延加工体を圧延加工して厚さ
０．２〜０．５mmの前記複合圧延板とするＣｕ−Ｍｏ複
合圧延板の製造方法が得られる。When the thickness of the sintered body is less than 5 mm and more than 2 mm, hot rolling and cold rolling are performed as the rolling, and the thickness of the sintered body is increased in the hot rolling. Cu-Mo to obtain a rolled product by rolling to a thickness of 1.5 mm or less, and in the cold rolling process, the rolled product is rolled into the composite rolled plate having a thickness of 0.2 to 0.5 mm. A method for manufacturing a composite rolled plate is obtained.
【０００９】又、前記焼結体の厚さが２mm以下の時、前
記圧延加工として冷間圧延加工のみを行って厚さ０．２
〜０．５mmの前記複合圧延板とするＣｕ−Ｍｏ複合圧延
板の製造方法が得られる。Further, when the thickness of the sintered body is 2 mm or less, only cold rolling is performed as the rolling process to obtain a thickness of 0.2.
A method for manufacturing a Cu-Mo composite rolled plate, which is the composite rolled plate of 0.5 mm, is obtained.
【００１０】ここで、本発明において、ＣｕとＭｏの混
合比を１０〜７０重量％に限定したのは、１０％より少
なく７０％より大きくなると前記焼結体にクラックが生
じるからである。又、厚さ５mm以下の焼結体In the present invention, the mixing ratio of Cu and Mo is limited to 10 to 70% by weight because cracks occur in the sintered body when it is less than 10% and more than 70%. Also, a sintered body with a thickness of 5 mm or less
【００１１】[0011]
【実施例】以下、本発明の実施例を説明する。EXAMPLES Examples of the present invention will be described below.
【００１２】相対密度が９０〜９８％であり、厚みが７
mmである焼結体を上記加工条件と同一にして圧延加工し
た場合、加工率はわずか１５％で圧延方向に垂直なクラ
ックが生じ加工不可能になる。The relative density is 90 to 98% and the thickness is 7
When a sintered body having a size of mm is rolled under the same working conditions as described above, the working rate is only 15% and cracks perpendicular to the rolling direction occur, making it impossible to work.
【００１３】又、１０〜７０重量％の範囲でＣｕ粉末を
Ｍｏ粉末と混合しプレス成型した後プレス成型した混合
物をＨ2 雰囲気中又は還元雰囲気中で、かつ、１０００
°〜１４００℃の温度で焼結させ、厚み４mmでかつ相対
密度が９０〜９８％である焼結体を得る。この焼結体を
Ｈ2 雰囲気中にて９００°〜１０００℃の温度で１５分
間加熱保持した後、圧下率２０％以下で、まず熱間圧延
加工する。次に、同雰囲気かつ同温度で数分間加熱保持
した後、同圧下率で熱間圧延加工する。この工程を繰り
返し行い最終仕上がりの厚みより０．５mm厚くするよう
に仕上げる。最終的に、冷間圧延加工にて０．２〜０．
５mmに仕上げると全くひび割れのない複合圧延板を製造
することができる。Further, Cu powder is mixed with Mo powder in the range of 10 to 70% by weight, press-molded, and then the press-molded mixture is mixed in H 2 atmosphere or reducing atmosphere, and 1000
Sintering is performed at a temperature of ° to 1400 ° C to obtain a sintered body having a thickness of 4 mm and a relative density of 90 to 98%. This sintered body is heated and held at a temperature of 900 ° to 1000 ° C. for 15 minutes in an H 2 atmosphere and then hot-rolled at a reduction rate of 20% or less. Next, after heating and holding in the same atmosphere and at the same temperature for several minutes, hot rolling is performed at the same reduction rate. Repeat these steps to finish the product so that it is 0.5 mm thicker than the final finished thickness. Finally, 0.2 to 0.
When finished to 5 mm, it is possible to manufacture a composite rolled plate with no cracks.
【００１４】又、１０〜７０重量％の範囲でＣｕ粉末を
Ｍｏ粉末と混合しプレス成型した後、Ｈ2 雰囲気中又は
還元雰囲気中で焼結し、厚み２mmでかつ相対密度が９０
〜９８％である焼結体を得る。この焼結体を冷間にて圧
下率２０％以下で圧延加工することによって厚み０．２
〜０．５mmで全くひび割れのない複合圧延板を製造する
ことができる。Further, Cu powder is mixed with Mo powder in the range of 10 to 70% by weight, press-molded, and then sintered in an H 2 atmosphere or a reducing atmosphere to have a thickness of 2 mm and a relative density of 90.
A sinter that is ~ 98% is obtained. A thickness of 0.2% was obtained by cold rolling this sintered body at a rolling reduction of 20% or less.
It is possible to produce a composite rolled plate having a crack of no more than 0.5 mm.
【００１５】上記厚み４mmと２mmの焼結体を圧延加工し
てできた複合圧延板は、１００％の相対密度を有し、部
位による組織の差は見られなかった。又、ヒ−トシンク
材として重要な特性である熱膨脹係数及び熱伝導率は、
表１に示す通り１００％純粋なＣｕ（以下純Ｃｕとい
う）と１００％純粋なＭｏ（以下純Ｍｏという）の配合
比とよく対応している。The composite rolled plate obtained by rolling the above-mentioned sintered bodies having the thicknesses of 4 mm and 2 mm had a relative density of 100%, and no difference in the structure depending on the site was observed. The thermal expansion coefficient and the thermal conductivity, which are important properties as a heat sink material, are
As shown in Table 1, it corresponds well with the compounding ratio of 100% pure Cu (hereinafter referred to as pure Cu) and 100% pure Mo (hereinafter referred to as pure Mo).
【００１６】[0016]
【表１】 [Table 1]
【００１７】[0017]
【発明の効果】本発明によれば、段付け曲げ加工等を施
してもクラッド法で生成されるクラッド材のように異な
る材質層が生じることなく、熱特性も全くかわらない。
又、打ち抜き加工によるクラックが全く発生しない。According to the present invention, even if a step bending process or the like is performed, a different material layer such as a clad material produced by the clad method does not occur, and the thermal characteristics are not changed at all.
Moreover, no cracks are generated by punching.
【００１８】又、十分緻密化したＣｕ−Ｍｏ系素材をラ
ッピング加工等で薄くしようとする場合、仕上げ厚みは
０．６mmが限度であり、０．２〜０．５mmにまで薄く加
工することができる。When thinning a sufficiently densified Cu-Mo-based material by lapping or the like, the finish thickness is limited to 0.6 mm, and it is possible to work thinly to 0.2 to 0.5 mm. it can.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成３年１１月２８日[Submission date] November 28, 1991
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００３[Name of item to be corrected] 0003
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００３】[0003]
【発明が解決しようとする課題】混合法では全体に均一
拡散されるため、目的にあった素材の供給ができるが、
スケルトン法では、ＣｕをＭｏ多孔質焼結体に溶浸させ
るため、その焼結体表層部にＣｕが堆積する恐れがあ
り、表層部を研削する必要が生ずるという問題がある。
又、前記混合法において、ＣｕとＭｏの混合比が１０重
量％より少なくなると前記焼結体にクラックが生じ、７
０重量％より大きくなると前記焼結体の熱膨脹率が大き
くなる。従って、一般的なヒートシンク材として使用す
ることは不可能になり、製造コストの面においても非常
に高くなってしまうという問題がある。 [Problems to be Solved by the Invention] In the mixing method, since the material is uniformly dispersed throughout, it is possible to supply the material suitable for the purpose.
In the skeleton method, since Cu is infiltrated into the Mo porous sintered body, Cu may be deposited on the surface layer of the sintered body, and there is a problem that the surface layer needs to be ground.
In the mixing method, the mixing ratio of Cu and Mo is 10 times.
If it is less than the amount%, cracks will occur in the sintered body,
When it is more than 0% by weight, the coefficient of thermal expansion of the sintered body becomes large.
Become Therefore, it should be used as a general heat sink material.
Becomes impossible, and in terms of manufacturing cost
There is a problem that it becomes high.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】削除[Correction method] Delete
───────────────────────────────────────────────────── フロントページの続き (72)発明者 水上 正彦 富山県富山市岩瀬古志町２番地 東京タン グステン株式会社富山製作所内 (72)発明者 市田 晃 富山県富山市岩瀬古志町２番地 東京タン グステン株式会社富山製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiko Mizukami 2 Iwase Koshi-cho, Toyama City, Toyama Prefecture Tokyo Tangusten Co., Ltd. Toyama Works (72) Inventor Akira Ichida 2 Iwase Koshi-cho, Toyama City, Toyama Prefecture Tokyo Tan Gusten Co., Ltd. Toyama Works
Claims (3)
粉末とＭｏ粉末とを混合させ圧粉体を得、該圧粉体を焼
結して相対密度９０％以上で厚さ５mm以下の焼結体を生
成した後、該焼結体を圧延加工して複合圧延板とするＣ
ｕ−Ｍｏ複合圧延板の製造方法。1. Cu at a mixing ratio in the range of 10 to 70% by weight.
Powder and Mo powder are mixed to obtain a green compact, and the green compact is sintered to produce a sintered body having a relative density of 90% or more and a thickness of 5 mm or less, and then the sintered body is rolled. C as composite rolling plate
Method for manufacturing u-Mo composite rolled plate.
おいて、前記焼結体の厚さが５mm以下２mmを越えている
時、前記圧延加工として熱間圧延加工及び冷間圧延加工
が行われ前記熱間圧延加工では前記焼結体を厚さ１．５
mm以下まで圧延加工して圧延加工体を得、前記冷間圧延
加工では前記圧延加工体を圧延加工して厚さ０．２〜
０．５mmの前記複合圧延板とするＣｕ−Ｍｏ複合圧延板
の製造方法。2. The method for producing a composite rolled plate according to claim 1, wherein when the thickness of the sintered body is 5 mm or less and more than 2 mm, hot rolling and cold rolling are performed as the rolling. In the hot rolling process, the thickness of the sintered body is 1.5
The rolled body is rolled to a thickness of 0.2 mm or less to obtain a rolled body, and in the cold rolling, the rolled body is rolled to a thickness of 0.2 to
A method for producing a Cu-Mo composite rolled plate having the 0.5 mm composite rolled plate.
おいて、前記焼結体の厚さが２mm以下の時、前記圧延加
工として冷間圧延加工のみを行って厚さ０．２〜０．５
mmの前記複合圧延板とするＣｕ−Ｍｏ複合圧延板の製造
方法。3. The method for producing a composite rolled plate according to claim 1, wherein when the thickness of the sintered body is 2 mm or less, only cold rolling is performed as the rolling to obtain a thickness of 0.2 to 0. .5
mm of the Cu-Mo composite rolled plate as the composite rolled plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3288517A JP2717895B2 (en) | 1991-11-05 | 1991-11-05 | Method for producing Cu-Mo composite rolled sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3288517A JP2717895B2 (en) | 1991-11-05 | 1991-11-05 | Method for producing Cu-Mo composite rolled sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05125407A true JPH05125407A (en) | 1993-05-21 |
| JP2717895B2 JP2717895B2 (en) | 1998-02-25 |
Family
ID=17731258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3288517A Expired - Lifetime JP2717895B2 (en) | 1991-11-05 | 1991-11-05 | Method for producing Cu-Mo composite rolled sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2717895B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05186802A (en) * | 1992-01-10 | 1993-07-27 | Tokyo Tungsten Co Ltd | Molybdenum multiple powder, molybdenum composite sheet and their production |
| US5493153A (en) * | 1992-11-26 | 1996-02-20 | Tokyo Tungsten Co., Ltd. | Plastic-packaged semiconductor device having a heat sink matched with a plastic package |
| CN100404197C (en) * | 2006-04-10 | 2008-07-23 | 安泰科技股份有限公司 | Preparation method of copper/molybdenum/copper electronic package composite material |
| CN109848424A (en) * | 2018-12-03 | 2019-06-07 | 有研工程技术研究院有限公司 | A kind of grid pulse travelling-wave tubes aperture plate molybdenum foil and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107891636B (en) * | 2017-11-22 | 2019-09-10 | 无锡乐普金属科技有限公司 | Copper-molybdenum copper-copper composite plate preparation method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825851A (en) * | 1971-08-12 | 1973-04-04 |
-
1991
- 1991-11-05 JP JP3288517A patent/JP2717895B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825851A (en) * | 1971-08-12 | 1973-04-04 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05186802A (en) * | 1992-01-10 | 1993-07-27 | Tokyo Tungsten Co Ltd | Molybdenum multiple powder, molybdenum composite sheet and their production |
| US5493153A (en) * | 1992-11-26 | 1996-02-20 | Tokyo Tungsten Co., Ltd. | Plastic-packaged semiconductor device having a heat sink matched with a plastic package |
| CN100404197C (en) * | 2006-04-10 | 2008-07-23 | 安泰科技股份有限公司 | Preparation method of copper/molybdenum/copper electronic package composite material |
| CN109848424A (en) * | 2018-12-03 | 2019-06-07 | 有研工程技术研究院有限公司 | A kind of grid pulse travelling-wave tubes aperture plate molybdenum foil and preparation method thereof |
| CN109848424B (en) * | 2018-12-03 | 2021-08-10 | 有研工程技术研究院有限公司 | Molybdenum foil for grid control pulse traveling wave tube grid mesh and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2717895B2 (en) | 1998-02-25 |
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