CN100404196C - Method for preparing copper/molybdenum/copper electronic packaging composite material with special layer thickness proportion - Google Patents
Method for preparing copper/molybdenum/copper electronic packaging composite material with special layer thickness proportion Download PDFInfo
- Publication number
- CN100404196C CN100404196C CNB2006100728230A CN200610072823A CN100404196C CN 100404196 C CN100404196 C CN 100404196C CN B2006100728230 A CNB2006100728230 A CN B2006100728230A CN 200610072823 A CN200610072823 A CN 200610072823A CN 100404196 C CN100404196 C CN 100404196C
- Authority
- CN
- China
- Prior art keywords
- copper
- molybdenum
- composite material
- thickness
- spraying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a method which adopts rolling technology after copper layers are electroplated or sprayed on a molybdenum plate to produce copper /molybdenum /copper electronic packaging composite material with a special layer thickness proportion, which belongs to the field of electronic packaging material, and is mainly applied to metal packaging industry in semiconductor industry, such as integrated circuits, laser devices, etc. The method comprises five procedures: surface treatment, electric plating or spraying, anneal, cold rolling and subsequent treatment. Compared with the prior art, the present invention has the advantages that the production process steps are simplified, the production period is shortened, the production efficiency is high, and the cost is low. The finished products of the present invention have the advantages of high heat conduction, high strength, special thickness proportion, good adaptability and uniformity of size, high rate of finished products, and good stamping performance, and have the thermal expansion coefficient and the thermal conductivity which are matched with semiconductor material. By using the method, people can produce copper /molybdenum /copper multiple-layer metal composite material of which the thickness proportion of molybdenum layers and copper layers is over 1: 4: 1.
Description
Technical field
The invention belongs to the electronic package material field, be mainly used in the Metal Packaging industry of semicon industries such as integrated circuit, Laser Devices, particularly relate to a kind of employing rolling technology preparation behind plating on the molybdenum plate or spraying copper layer and have the method for the copper/molybdenum/copper Electronic Packaging multilayer materials of special layers thickness rate example.
Background technology
Electronic package material claims the thermal control material again, is a kind of encapsulating material with low-expansion coefficient and high conduction, heat conductivility that is used for microelectronics industry, and military thermal controls apparatus also needs this material.Development along with electronics industry, particularly the raising of integrated circuit packaging density and high-power are all more and more stricter to the requirement of electronic package material, traditional homogenous material can't satisfy the requirement to the material combination property, and the combination property advantage of composite uniqueness has obtained to pay attention to widely.
Copper/molybdenum/copper is a kind of " sandwich " structure, and core is a metal molybdenum, and is two-sided coated with copper coin.This material had both had the low bulk performance of molybdenum, the high conduction, the heat conductivility that have copper again, and the not high problem of compactness that has encapsulating materials such as W/Cu, Mo/Cu, SiC/Al hardly, can adjust its thermal coefficient of expansion and thermal conductivity by the thickness of adjusting molybdenum, copper, but have characteristics such as high strength punch forming simultaneously concurrently.At present, the production technology of copper/molybdenum/carbon/carbon-copper composite material has liquid-solid in conjunction with rolling, as publication number is CN1408485A, the patent that open day is on April 9th, 2003 is described, at first copper coin and molybdenum ingot are placed graphite mo(u)ld, be heated to the copper coin fusing, rolling again technology is prepared into copper/molybdenum/copper product after the cooling.But this method production process is various, and the surface quality and the rolling back THICKNESS CONTROL of fusing cooling back copper coin are relatively poor, particularly are restricted when the composite of preparation molybdenum layer and copper layer thickness large percentage.United States Patent (USP) (US4950554, US4988392, US4957823) be to adopt the welding milling method to prepare the copper composite material of molybdenum and copper, the present invention compares, increased the operation of welding before rolling in the United States Patent (USP), rolling mill practice is comparatively complicated, to the also raising greatly of requirement of rolling equipment, increase the difficulty of implementing, strengthened the preparation cost of material accordingly.
Summary of the invention
The object of the present invention is to provide a kind of production process to simplify, shorten the production cycle, production efficiency height, the method for the copper/molybdenum/copper/molybdenum/copper electronic package composite material of the preparation special layers thickness rate example that cost is low.Its finished product has high heat conduction, high strength, the special thickness ratio, and size adaptability and high conformity, yield rate height, punching performance are good, have the thermal coefficient of expansion and the thermal conductivity that are complementary with semi-conducting material simultaneously.
According to above-mentioned purpose, technical scheme of the present invention is to comprise surface treatment, plating or spraying, annealing, cold rolling, five steps of subsequent treatment, and its concrete steps are as follows:
A, surface treatment: with thickness is the molybdenum plate process surface treatment of 0.1-1mm, removes the dirt on surface, obtains certain cleannes and different roughness, reaches the purpose that strengthens combined strength bination.
B, plating or spraying: thickness is the oxygen-free copper layer of 0.01-0.25mm in molybdenum plate electroplating surface or spraying;
C, annealing: under vacuum or gas shield state, will to reach the elimination material stress, purify the surface and be next step cold rolling preparing through electroplating or the copper/molybdenum/copper composite plate of spraying annealing in process 1.5 hours under 500-900 ℃ of temperature.
D, cold rolling: cold rolling through the 2-10 passage on four-high mill annealed composite plate, to obtain the dimensions that final finished requires, its width is 50mm-300mm, and the thickness of described final finished is 0.1-1mm.
E, subsequent treatment: comprise mainly and cut limit, annealing, aligning, check that with the final finished that obtains to meet the demands, the thickness ratio of above-mentioned finished product sheet material copper/molybdenum/copper is 1: 4: 1～1: 6: 1.
Gas described in the said method is a kind of in hydrogen, nitrogen, the argon gas.
The present invention compared with prior art has production process and simplifies, and the production cycle shortens, production efficiency height, the advantage that cost is low; The high heat conduction of its finished product, high strength have the special thickness ratio, and size adaptability and high conformity, yield rate height, punching performance are good, have the thermal coefficient of expansion that is complementary with semi-conducting material and the advantage of thermal conductivity simultaneously.The thickness that can produce molybdenum layer and copper layer with this method is than the copper/molybdenum/copper multilayer material greater than 1: 4: 1.Specific as follows:
1, adopt plating or spraying-rolling mill practice to prepare copper/molybdenum/copper electronic package material, can prepare the copper/molybdenum/copper electronic package material that coats the rolling special thickness ratio that is difficult to prepare in back with conventional, the ratio of its molybdenum layer and copper layer was greater than 1: 4: 1, and satisfy high heat conduction, high-intensity performance requirement.
2, thermal conductivity and thermal coefficient of expansion can be controlled by the thickness proportion of copper, molybdenum layer, make copper/molybdenum/copper/molybdenum/copper electronic package composite material of preparing have thermal coefficient of expansion and the thermal conductivity that is complementary with various semiconductor chips.
3, copper/molybdenum of preparing/copper/molybdenum/copper electronic package composite material possesses good punching performance, has improved the mouldability and the production efficiency of part.
4, adopt plating or spraying process production of copper/molybdenum/copper electronic package material, simplified production process, shortened the production cycle, help improving production efficiency of products and control cost.
The specific embodiment
Method produced according to the present invention has prepared the finished product of 3 batches of copper/molybdenum/copper/molybdenum/copper electronic package composite materials, in order to contrast conveniently, will adopt also the listing in the table of copper/molybdenum/copper/molybdenum/copper electronic package composite material end properties of art methods preparation.Wherein table 1 is dimensions and the step of preparation process and the process parameter table of the copper/molybdenum/copper/molybdenum/copper electronic package composite material of the present invention and prior art for preparing, and table 2 is for adopting preparation method's gained copper molybdenum copper product end properties index of the present invention and prior art performance indications contrast table.Wherein conical cup test value CCV is a parameter that embodies material Sheet Metal Forming Technology performance, concrete experiment method is by steel ball sample to be washed into the awl cup, when finding material breaks, stop test, measure the maximum dimension D cmax and the minimum diameter Dcmin of rim of a cup, and calculate conical cup test value CCV with CCV=(Dcmax+Dcmin)/2.According to experimental principle, conical cup test value CCV is big more, and expression material punching performance is good more, and sequence number 1-3# is the embodiment of the invention in the above-mentioned tabulation, and 4-5# is the prior art Comparative Examples.
The dimensions of table 1 the present invention and prior art copper/molybdenum/copper/molybdenum/copper electronic package composite material and step of preparation process and process parameter table
Table 2 adopts the performance and the prior art performance comparison table of preparation method's gained copper molybdenum copper product of the present invention
| Sequence number | Conical cup test value CCV (mm) | Copper molybdenum copper product thermal conductivity W/m.K | Thermal coefficient of expansion (/K) |
| 1 | 26 | 218 | 6.1 |
| 2 | 25 | 210 | 5.9 |
| 3 | 22 | 208 | 5.7 |
| 4 | 18 | 194 | 6.5 |
| 5 | 20 | 225 | 6.9 |
Claims (2)
1. the preparation method with copper/molybdenum/copper/molybdenum/copper electronic package composite material of special layers thickness rate example is characterized in that this method comprises surface treatment, plating or spraying, annealing, cold rolling, five steps of subsequent treatment, and its concrete steps are as follows:
A, surface treatment: with thickness is the molybdenum plate process surface treatment of 0.1-1mm, removes the dirt on molybdenum plate surface, obtains certain cleannes and roughness;
B, plating or spraying: thickness is the oxygen-free copper layer of 0.01-0.25mm in molybdenum plate electroplating surface or spraying;
C, annealing: under vacuum or gas shield state, will be through electroplating or the copper/molybdenum/copper composite plate of spraying under 500-900 ℃ of temperature annealing in process 1-2 hour;
D, cold rolling: cold rolling through the 2-10 passage on four-high mill annealed composite plate, to obtain the dimensions that final finished requires, the thickness of described final finished is 0.1-1mm;
E, subsequent treatment: comprise mainly and cut limit, annealing, aligning, check that with the final finished that obtains to meet the demands, the thickness ratio of the copper/molybdenum of finished product sheet material/copper is 1: 4: 1～1: 6: 1.
2. the preparation method with special layers thickness rate example copper/molybdenum/copper/molybdenum/copper electronic package composite material according to claim 1 is characterized in that gas described in the said method is a kind of in hydrogen, nitrogen, the argon gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100728230A CN100404196C (en) | 2006-04-10 | 2006-04-10 | Method for preparing copper/molybdenum/copper electronic packaging composite material with special layer thickness proportion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100728230A CN100404196C (en) | 2006-04-10 | 2006-04-10 | Method for preparing copper/molybdenum/copper electronic packaging composite material with special layer thickness proportion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1850436A CN1850436A (en) | 2006-10-25 |
| CN100404196C true CN100404196C (en) | 2008-07-23 |
Family
ID=37131946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100728230A Active CN100404196C (en) | 2006-04-10 | 2006-04-10 | Method for preparing copper/molybdenum/copper electronic packaging composite material with special layer thickness proportion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100404196C (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054804A (en) * | 2009-11-04 | 2011-05-11 | 江苏鼎启科技有限公司 | Cu/Mo/Cu heat sink material and preparation method thereof |
| CN101862752B (en) * | 2010-05-18 | 2012-09-19 | 上海六晶金属科技有限公司 | Cold-rolling method of molybdenum-copper alloy thin plate |
| CN102529217B (en) * | 2011-12-26 | 2015-04-22 | 西安建筑科技大学 | Method for preparing copper/molybdenum composite board with molybdenum fibers by accumulative roll bonding |
| CN102941441B (en) * | 2012-11-02 | 2015-10-21 | 中南大学 | A kind of high bond strength high accuracy copper-molybdenum-copper laminated composite materials preparation method |
| CN104195568A (en) * | 2014-08-20 | 2014-12-10 | 常熟市良益金属材料有限公司 | Preparation method of metal material for electronic packaging |
| CN104404505B (en) * | 2014-11-25 | 2015-08-26 | 开封大学 | The spraying preparation method of Cu/Mo/Cu composite sheet |
| CN104867989B (en) * | 2015-06-01 | 2017-04-19 | 李云 | High-efficiency flexible GaAs solar cell and manufacturing method thereof |
| CN105583227B (en) * | 2016-01-07 | 2017-06-16 | 四川飞龙电子材料有限公司 | A kind of manufacture method of copper-molybdenum carbon/carbon-copper composite material |
| CN108555039B (en) * | 2018-03-30 | 2019-12-13 | 中国石油大学(北京) | Preparation method of copper/steel laminated composite material and composite material prepared by preparation method |
| CN109207692A (en) * | 2018-09-06 | 2019-01-15 | 合肥圣达电子科技实业有限公司 | A kind of package casing manufacturing method controlling inside cavity hydrogen content |
| CN109877156B (en) * | 2019-03-20 | 2020-10-27 | 汕尾市索思电子封装材料有限公司 | Copper-molybdenum-copper laminated composite material and manufacturing method thereof |
| CN110712419A (en) * | 2019-09-24 | 2020-01-21 | 无锡乐普金属科技有限公司 | Preparation method of copper-molybdenum-copper alloy material |
| CN113493878B (en) * | 2020-04-08 | 2022-05-27 | 安泰科技股份有限公司 | Efficient and uniform metal copper infiltration composite material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11297909A (en) * | 1998-04-10 | 1999-10-29 | Sumitomo Metal Electronics Devices Inc | Metallic plate for radiating heat and package for electronic parts using it |
| JP2000114441A (en) * | 1998-10-09 | 2000-04-21 | Sumitomo Metal Electronics Devices Inc | Multilayer metal plate and its manufacture |
| CN1408485A (en) * | 2001-09-18 | 2003-04-09 | 长沙升华微电子材料有限公司 | Method for producing copper-molybdenum-copper three layer composite plate |
| JP2005150607A (en) * | 2003-11-19 | 2005-06-09 | Shinko Electric Ind Co Ltd | Base and package for semiconductor device |
| JP2006069074A (en) * | 2004-09-02 | 2006-03-16 | Sumitomo Electric Ind Ltd | Method of manufacturing composite film and method for reforming surface of resin film |
-
2006
- 2006-04-10 CN CNB2006100728230A patent/CN100404196C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11297909A (en) * | 1998-04-10 | 1999-10-29 | Sumitomo Metal Electronics Devices Inc | Metallic plate for radiating heat and package for electronic parts using it |
| JP2000114441A (en) * | 1998-10-09 | 2000-04-21 | Sumitomo Metal Electronics Devices Inc | Multilayer metal plate and its manufacture |
| CN1408485A (en) * | 2001-09-18 | 2003-04-09 | 长沙升华微电子材料有限公司 | Method for producing copper-molybdenum-copper three layer composite plate |
| JP2005150607A (en) * | 2003-11-19 | 2005-06-09 | Shinko Electric Ind Co Ltd | Base and package for semiconductor device |
| JP2006069074A (en) * | 2004-09-02 | 2006-03-16 | Sumitomo Electric Ind Ltd | Method of manufacturing composite film and method for reforming surface of resin film |
Non-Patent Citations (2)
| Title |
|---|
| Cu/Mo复合材料研究进展. 朱爱辉，吕新矿，王快社，王训宏.中国铝业，第30卷第1期. 2006 |
| Cu/Mo复合材料研究进展. 朱爱辉，吕新矿，王快社，王训宏.中国铝业，第30卷第1期. 2006 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1850436A (en) | 2006-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100404196C (en) | Method for preparing copper/molybdenum/copper electronic packaging composite material with special layer thickness proportion | |
| CN102941702B (en) | Infiltration preparation method of Cu-MoCu-Cu three-layer composite plate | |
| CN111455205B (en) | Preparation method of high-thermal-conductivity low-expansion Diamond-Cu composite material with sandwich structure | |
| KR101499297B1 (en) | High permeability amorphous powder core and making process using by warm temperarture pressing | |
| CN100404197C (en) | Preparation method of copper/molybdenum/copper electronic package composite material | |
| CN110340142B (en) | Method for preparing steel-aluminum composite plate by two-step rolling | |
| CN103949472B (en) | A kind of copper-molybdenum copper-copper three layer composite plate and manufacture method thereof | |
| CN103264261B (en) | A kind of preparation method of many laminations molybdenum-carbon/carbon-copper composite material | |
| CN102284701A (en) | Preparation method for Cu-MoCu-Cu composite sheet | |
| CN1166466C (en) | Method for producing copper-molybdenum-copper three layer composite plate | |
| CN101862751B (en) | Cold rolling method for tungsten-copper alloy sheet | |
| CN108913973B (en) | Preparation method of tungsten-nickel-copper alloy foil | |
| CN111101007B (en) | Preparation method of high-performance nickel-based alloy composite strip | |
| CN114309119A (en) | Graphene/copper composite deformed copper-chromium-zirconium alloy laminated strip and preparation method thereof | |
| CN109351976B (en) | Copper-molybdenum copper-copper composite material for semiconductor high-power device and preparation method thereof | |
| CN102593009B (en) | The manufacture method of substrate for power module, substrate for power module and power module | |
| CN114807642B (en) | Segregation-free alloy and high yield preparation method thereof | |
| CN115028467B (en) | Low-void-rate ceramic copper-clad plate and preparation method thereof | |
| CN114774723B (en) | Battery aluminum foil with high mechanical property and high conductivity and production method thereof | |
| CN101862752B (en) | Cold-rolling method of molybdenum-copper alloy thin plate | |
| KR101417999B1 (en) | Manufacturing method of copper clad aluminum wire | |
| CN103706797A (en) | Method for manufacturing wide multi-layer Cu-CuMo70-Cu composite materials | |
| CN111850353B (en) | 5G novel aluminum strip for capacitor shell and preparation method thereof | |
| CN101862829A (en) | Sintering method for tungsten-copper alloy sheet | |
| CN116516195A (en) | Diamond/copper composite material and electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: ANTAI SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ANTAI SCIENCE AND TECHNOLOGY CO., LTD.; APPLICANT Effective date: 20070914 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20070914 Address after: 100081 No. 76 South College Road, Beijing, Haidian District Applicant after: Antai Science and Technology Co., Ltd. Address before: 100081 No. 76 South College Road, Beijing, Haidian District Applicant before: Antai Science and Technology Co., Ltd. Co-applicant before: Central Iron & Steel Research Institute |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |