CN101456122B - High-conductivity high silicon aluminum base alloy and manufacture method thereof - Google Patents
High-conductivity high silicon aluminum base alloy and manufacture method thereof Download PDFInfo
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- CN101456122B CN101456122B CN 200810204594 CN200810204594A CN101456122B CN 101456122 B CN101456122 B CN 101456122B CN 200810204594 CN200810204594 CN 200810204594 CN 200810204594 A CN200810204594 A CN 200810204594A CN 101456122 B CN101456122 B CN 101456122B
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Abstract
The invention discloses an aluminium high silicon aluminum base alloy with high conductivity and a method for preparing the same, wherein the method comprises the following steps: a, smelting a pure alloy of Al, Si and M to obtain a prefabricated alloy of Al-aSi-bM, wherein M is one or more of rare earth, Nb, Fe, Cu, Zr, Ti, V and Cr, a is more than or equal to 5 and less than or equal to 60, andb is more than or equal to 0.1 and less than or equal to 10; b, smelting the obtained prefabricated alloy Al-aSi-bM into a vacuum induction melting furnace, and after finishing the smelting, performing spray molding on the molten Al-aSi-bM master alloy under the protection of nitrogen-argon mixed gas; c, performing extrusion molding on the Al-aSi-bM alloy in the spray molding state in a hot extruder; and d, performing multi-pass cold rolling on the Al-aSi-bM alloy obtained after the hot extrusion. By adopting the process method of the invention, while the high silicon aluminum base alloy withexcellent high conductivity performance is obtained, the process is greatly simplified, and the cost is reduced, thus the method is advantageous to mass production and popularization of application.
Description
Technical field
The present invention relates to a kind of method for preparing high-conductivity high silicon aluminum base alloy.
Technical background
All the time, copper and copper alloy are seen it is the first-selection of making conductive material because its good electric conductivity always, but along with the rapid minimizing of global copper stock number and increasingly totally, the transaction value of copper begins rise at full speed.Show according to update, the transaction value of present copper per ton reaches 7000 dollars, so the cost of investment of great number causes the rise in price of the products such as copper conductor, so that world work about electric power person recognizes improvement or seeks a kind of importance and urgency of new power transmission line clear-headedly.And the skyrocketing of copper valency, also so that the big-and-middle-sized manufacturing of lot of domestic and foreign processing enterprise, begin one after another to seek the substitute of copper and alloy thereof.
Compare, the price of market exchange of present industrial aluminum per ton only is 2800 dollars, and therefore, the aluminum alloy materials of seeking a kind of instead of copper alloy becomes the focal issue of attracting attention in the world.
China once carried out the research work of this respect in the eighties in 20th century, but all was to concentrate the high purity aluminum alloy direction, namely pursued simply the content (Si, Fe, Ti, Cu etc.<1%) that reduces impurity element in the aluminium alloy, in the hope of improving conductance.Therefore, many producers have to adopt the method for the lower Imported Aluminium of Si content and domestic aluminium blending, Si content is dropped to below the 0.08%wt, and then process to remove the impurity elements such as the Ti, the Cr that introduce in the Imported Aluminium, Mn with boronation.Obviously, this way is both uneconomical also unreasonable, although the raffinal silicon alloy has satisfied electric conductivity requirement (IACS>45%), because Silicon In Alloys content is excessively low, cause that alloy strength is low, wearability is not high, still can't satisfy the requirement of long distance powedr transmission.But present gold period of the power industry develop rapidly of China and World Economics developed country just, high-capacity leads is that the demand in global power industry just constantly increases, and the new line transmission line capability constantly increases, and old circuit capacity-increasing transformation is extremely urgent.Therefore, it is self-evident to prepare a kind of significance and importance of high silicon high conductivity aluminium alloy.
In the last few years, many developed countries also began to try to explore the problem of silumin electric conductivity, and worked out a collection of cond aluminium with certain specific character, such as 5005 alloys of the U.S., 8076 alloys; The Ductalex alloy of Switzerland; Gondola Alhoflex etc.Wherein active in the research in this field with Japan, high strength aluminium, ultra heat resisting aluminum etc. have successively been developed, but it is purpose that these focuses concentrate on the aluminium alloy that develops specific use basically, really improves the silumin electric conductivity, explores the also few of silumin electrical conduction mechanism.With respect to abroad, China for the exploratory development of silumin electric conductivity aspect still less, Domestic Scientific Research mechanism stresses how to improve element silicon solubility in aluminum substrate mostly for the research of silumin, how to improve the aspect such as intensity, wear resistance, heat resistance of silumin.And, Domestic Scientific Research mechanism at present only simply emphasize to utilize the advantages such as silumin thermal coefficient of expansion aspect electronic package material is little, rub resistance, but ignored and how to have improved the silumin conductance, made it satisfy industrial wire conductance, made it be used for transmission line of electricity.
Therefore, by to the further investigation to the silumin electrical conduction mechanism, find out the basic reason that element silicon reduces the aluminum substrate conductance, thereby adopt simple and easy to do preparation method to obtain the silumin of high conductivity, add the good intensity of high silicon content aluminium alloy itself, the good mechanical properties such as wear resistance so in the future, will not be problems with expensive copper conductor in the silumin replacement current power transmission industry of excellent performance.
Summary of the invention
The present invention provides a kind of easy preparation according to deficiency of the prior art, has good electrical conductivity, the high silica/aluminum-based alloy material of mechanical property and thermal stability.
For achieving the above object, the present invention is achieved through the following technical solutions:
A kind of method for preparing high-conductivity high silicon aluminum base alloy is characterized in that, comprises the steps:
A, obtain prealloy Al-aSi-bM with pure Al, Si, M alloy melting, wherein, M is one or more among rare earth, Nb, Fe, Cu, Zr, Ti, V, the Cr, 5≤a≤60,0.1≤b≤10;
B, the prealloy Al-aSi-bM that obtains is put into vacuum induction melting furnace, melting is complete, protects molten state Al-aSi-bM foundry alloy injection molding with nitrogen-argon mixture gas again;
C, will be injected into kenel Al-aSi-bM alloy and put into the heat extruder extrusion modling;
D, that the Al-aSi-bM alloy that obtains after the hot extrusion is carried out multi-pass is cold rolling.
The expression formula of described acieral foundry alloy is Al-aSi-bM, and wherein a, b are that the parts by weight that Si and M occupy respectively, a are 5-60 take 100 parts of acieral gross weight umbers as the basis, and b is 0.1-10, and surplus is Al.
Among the step a, used aluminium and the material purity of silicon are more than 99.5%, if M is in Nb, Fe, Cu, Zr, Ti, V, the Cr element any one, Nb, Fe, Cu, Zr, Ti, V, Cr material purity are not less than 99%, if M chooses rare earth element, then be mishmetal, main alloy element Ce accounts for the mishmetal quality more than 40%.Take the bulk of the bulk of pure aluminium powder, silicon, M as raw material, each element makes prealloy Al-Si-M. by vacuum melting furnace after being made into raw material by required mass percent.
Among the step b; induction melting adopts Frequency Induction Heating; heating power is 5~20kW; temperature is 1000-1200 ℃, and it is that 3-4mm, oblique pull angle are that 37 °, eccentric throw are that 30mm, melt quality flow rate are that 6~8kg/min, protective gas pressure are that vacuum in 0.6-0.8MPa, the quartz glass tube is 10 that injection molding equipment adopts Double layer non-limited airflow atomizing nozzle, nozzle diameter
-3~10
-4Pa.
Among the described step c, Al-Si-M alloy powder extrusion temperature is 300~310 ℃, and extrusion load is 200~400MP, and extrusion time is 3~4h, and extrusion passes is 1~5 time.
Among the described step c, first progressively be pressurized to the stable pressure of 200~400MP, then be warming up to the 50%-60% of powder melting temperature (Tm, ℃), be incubated lower the temperature after 3~4 hours cold rolling.
In the described steps d, progressively be depressed into the stable pressure of 70~150KN first under the room temperature, kept 1~2 hour, then remove pressure.Cold deformation need to continue 1-2 hour.
The operation principle of overall technical architecture of the present invention is: the high silicon-base aluminum alloy by sprayup process preparation is under the condition of the metamorphism of rare earth and supersonic condensing, can generate the tiny rare earth aluminium silicon compound that a large amount of disperses distributes, and the also obviously refinement of the size of primary silicon is spherical distribution in the matrix.This method has reduced the solid solubility of aluminium silicon solid solution, has greatly reduced the distortion of aluminum substrate lattice, thereby has reduced the scattering of electronics, so conductance is significantly improved.
The conductance of the high silica/aluminum-based alloy of the present invention's preparation satisfies industry transmission of electricity industry wire application standard (greater than 40%IACS) more than 45%IACS.The alloy that preparation is described has good conductive capability.
The specific embodiment
Embodiment 1
Purity being not less than 99.5% pure Al, Si and being made into raw material by required atomic percent, is that 45% mishmetal is made into raw material by required atomic percent with the Ce constituent content, makes prealloy Al-20Si-0.35Re in vacuum melting furnace; Prealloy Al-20Si-0.35Re is put into vacuum induction melting furnace, at argon gas-nitrogen protection injection molding, smelting temperature is 1000 ℃, and protection air pressure is by force 0.8MPa, and nozzle diameter is that 3-4mm, oblique pull angle are that 37 °, eccentric throw are that 30mm, melt quality flow rate are 6~8kg/min; Injection molding alloy A l-20Si-0.35Re is put into heat extruder, and 300 ℃ of extrusion temperatures carry out 1 hot extrusion under the pressure 300MP, each insulation compacting 4h.At room temperature, carry out under the pressure 70MP 2 times cold rolling, suppress 2h at every turn, the compacting obtain length 80mm, width 40mm, the cuboid acieral of thickness 3mm.The conductance of this alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 2
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-0.35Re.This scheme is to be replaced 1 time by 2 times by the hot extrusion number of times, and pressure 350MP replaces 300MP.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 3
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-0.35Re.This scheme is to be replaced 1 time by 3 times by the hot extrusion number of times, and pressure 400MP replaces 300MP.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm, the conductance of this alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 4
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-5Si-0.35Nb.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 5
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-60Si-0.35Zr.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 6
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-0.1V.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 7
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-10 Cr.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
High silica/aluminum-based alloy composition proportion and the conductance parameter list of embodiment 1-7 preparation
Embodiment | Resistivity/Ω .m |
1 | 0.038 |
2 | 0.023 |
3 | 0.020 |
4 | 0.018 |
5 | 0.048 |
6 | 0.038 |
7 | 0.047 |
Above-described embodiment only for the present invention will be described, does not consist of the restriction to the claim scope, and other substantial equivalence means that it may occur to persons skilled in the art that are all in claim scope of the present invention.
Claims (10)
1. a method for preparing high-conductivity high silicon aluminum base alloy is characterized in that, comprises the steps:
A, obtain prealloy Al-aSi-bM with pure Al, Si, M alloy melting, wherein, M is rare earth, 5≤a≤60,0.1≤b≤10;
B, the prealloy Al-aSi-bM that obtains is put into the vacuum induction melting furnace melting, melting is complete, protects molten state Al-aSi-bM foundry alloy injection molding with nitrogen-argon mixture gas again;
C, will be injected into kenel Al-aSi-bM alloy and put into the heat extruder extrusion modling;
D, that the Al-aSi-bM alloy that obtains after the hot extrusion is carried out multi-pass is cold rolling.
2. prepare as claimed in claim 1 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, among the step a, the rare earth element that M chooses is mishmetal, and main alloy element Ce accounts for more than 40% of mishmetal quality.
3. prepare as claimed in claim 1 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, among the step b, induction melting adopts Frequency Induction Heating, and heating power is 5~20kW, and temperature is 1000-1200 ℃.
4. prepare as claimed in claim 1 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, among the step b, injection molding equipment adopts Double layer non-limited airflow atomizing nozzle.
5. prepare as claimed in claim 4 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, the nozzle diameter of described injection molding equipment is that 3-4mm, melt quality flow rate are 6~8kg/min.
6. prepare as claimed in claim 1 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, among the step b, protective gas pressure is 0.6-0.8MPa, and the vacuum in the vacuum induction melting furnace is 10
-3~ 10
-4Pa.
7. prepare as claimed in claim 1 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, among the described step c, Al-aSi-bM alloy powder extrusion temperature is 300 ~ 310 ℃, extrusion load is 200 ~ 400MP, and extrusion time is 3 ~ 4h, and extrusion passes is 1 ~ 5 time.
8. the method for preparing as claimed in claim 1 high-conductivity high silicon aluminum base alloy, it is characterized in that described step c is progressively to be pressurized to first the stable pressure of 200 ~ 400MP, then be warming up to the 50%-60% place hot pressing of powder melting temperature, it is cold rolling to be incubated after 3 ~ 4 hours cooling.
9. prepare as claimed in claim 1 the method for high-conductivity high silicon aluminum base alloy, it is characterized in that, in the described steps d, progressively be depressed into the stable pressure of 70 ~ 150KN first under the room temperature, kept 1 ~ 2 hour, then remove pressure.
10. a high-conductivity high silicon aluminum base alloy is made by the described method for preparing high-conductivity high silicon aluminum base alloy of arbitrary claim among the claim 1-9.
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CN106319297B (en) * | 2016-08-16 | 2018-11-27 | 江苏中色锐毕利实业有限公司 | A kind of high intensity cocrystallized Al-Si alloy and preparation method thereof |
CN106191563B (en) * | 2016-08-16 | 2018-11-27 | 江苏中色锐毕利实业有限公司 | A kind of auto parts and components silico-aluminum and preparation method thereof |
CN108796314B (en) * | 2018-07-16 | 2020-04-21 | 中南大学 | Preparation method of aluminum-silicon alloy for electronic packaging |
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CN1077606C (en) * | 1996-01-30 | 2002-01-09 | 住友电气工业株式会社 | High strength heat-resistant aluminium alloy, conduction wire and aerial conductor and method for producing high strength heat-resistant aluminium alloy |
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