CN101456122A - High-conductivity high silicon aluminum base alloy and manufacture method thereof - Google Patents
High-conductivity high silicon aluminum base alloy and manufacture method thereof Download PDFInfo
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- CN101456122A CN101456122A CN 200810204594 CN200810204594A CN101456122A CN 101456122 A CN101456122 A CN 101456122A CN 200810204594 CN200810204594 CN 200810204594 CN 200810204594 A CN200810204594 A CN 200810204594A CN 101456122 A CN101456122 A CN 101456122A
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Abstract
The invention discloses an aluminium high silicon aluminum base alloy with high conductivity and a method for preparing the same, wherein the method comprises the following steps: a, smelting a pure alloy of Al, Si and M to obtain a prefabricated alloy of Al-aSi-bM, wherein M is one or more of rare earth, Nb, Fe, Cu, Zr, Ti, V and Cr, a is more than or equal to 5 and less than or equal to 60, and b is more than or equal to 0.1 and less than or equal to 10; b, smelting the obtained prefabricated alloy Al-aSi-bM into a vacuum induction melting furnace, and after finishing the smelting, performing spray molding on the molten Al-aSi-bM master alloy under the protection of nitrogen-argon mixed gas; c, performing extrusion molding on the Al-aSi-bM alloy in the spray molding state in a hot extruder; and d, performing multi-pass cold rolling on the Al-aSi-bM alloy obtained after the hot extrusion. By adopting the process method of the invention, while the high silicon aluminum base alloy with excellent high conductivity performance is obtained, the process is greatly simplified, and the cost is reduced, thus the method is advantageous to mass production and popularization of application.
Description
Technical field
The present invention relates to a kind of method for preparing high-conductivity high silicon aluminum base alloy.
Technical background
All the time, copper and copper alloy are seen it is the first-selection of making conductive material because its good electric conductivity always, but along with the rapid minimizing of global copper stock number and day by day totally, the transaction value of copper begins rise at full speed.Show according to update, the transaction value of present copper per ton reaches about 7000 dollars, so the cost of investment of great number causes the rise in price of products such as copper conductor, makes world work about electric power person recognize improvement clear-headedly or seeks a kind of importance and urgency of new power transmission line.And the skyrocketing of copper valency, also make the big-and-middle-sized manufacturing of lot of domestic and foreign processing enterprise, begin to seek the substitute of copper and alloy thereof one after another.
Compare, the marketing price of present industrial aluminum per ton only is about 2800 dollars, and therefore, the aluminum alloy materials of seeking a kind of instead of copper alloy becomes the focal issue of attracting attention in the world.
China once carried out the research work of this respect in the eighties in 20th century, but all was to concentrate the high purity aluminum alloy direction, promptly pursued the content (Si, Fe, Ti, Cu etc.＜1%) that reduces impurity element in the aluminium alloy simply, in the hope of improving conductance.Therefore, many producers have to adopt the method for lower import aluminium of Si content and homemade aluminium blending, Si content is dropped to below the 0.08%wt, and then handle to remove impurity elements such as the Ti, the Cr that introduce in the import aluminium, Mn with boronation.Obviously, this way is both uneconomical also unreasonable, though the raffinal silicon alloy has satisfied electric conductivity requirement (IACS〉45%), because silicone content is low excessively in the alloy, cause that alloy strength is low, wearability is not high, still can't satisfy the requirement of long distance powedr transmission.But present gold period of the power industry develop rapidly of China and World Economics developed country just, big capacity lead is that the demand in global power industry just constantly increases, and the new line transmission line capability constantly increases, and old circuit capacity-increasing transformation is extremely urgent.Therefore, it is self-evident to prepare a kind of significance and importance of high silicon high conductivity aluminium alloy.
In the last few years, many developed countries also began to try to explore the problem of silumin electric conductivity, and worked out a collection of cond aluminium with certain specific character, as 5005 alloys of the U.S., 8076 alloys; The Ductalex alloy of Switzerland; Gondola Alhoflex etc.Wherein active in the research in this field with Japan, high-strength aluminium, ultra heat resisting aluminum etc. have successively been developed, but it is purpose that these focuses concentrate on the aluminium alloy that develops specific use basically, really improves the silumin electric conductivity, explores the also few of silumin electrical conduction mechanism.With respect to abroad, China for the exploratory development of silumin electric conductivity aspect still less, domestic scientific research institution stresses how to improve element silicon solubility in aluminum substrate mostly for the research of silumin, how to improve the aspect such as intensity, wear resistance, hear resistance of silumin.And, domestic scientific research institution at present only simply emphasize to utilize advantages such as silumin thermal coefficient of expansion aspect electronic package material is little, rub resistance, but ignored and how to have improved the silumin conductance, made it satisfy industrial lead conductance, made it be used for transmission line of electricity.
Therefore, by to further investigation to the silumin electrical conduction mechanism, find out the basic reason that element silicon reduces the aluminum substrate conductance, thereby adopt simple and easy to do preparation method to obtain the silumin of high conductivity, add the good intensity of high silicon content aluminium alloy itself, good mechanical properties such as wear resistance so in the future, will not be problems with expensive copper conductor in the silumin replacement current power transmission industry of excellent performance.
Summary of the invention
The present invention provides a kind of easy preparation according to deficiency of the prior art, has good electrical conductivity, the high silica/aluminum-based alloy material of mechanical property and thermal stability.
For achieving the above object, the present invention is achieved through the following technical solutions:
A kind of method for preparing high-conductivity high silicon aluminum base alloy is characterized in that, comprises the steps:
A, obtain prealloy Al-aSi-bM with pure Al, Si, M alloy melting, wherein, M is one or more among rare earth, Nb, Fe, Cu, Zr, Ti, V, the Cr, 5≤a≤60,0.1≤b≤10;
B, the prealloy Al-aSi-bM that obtains is put into vacuum induction melting furnace, melting finishes, and protects molten state Al-aSi-bM foundry alloy injection molding with nitrogen-argon mixture gas again;
C, will be injected into kenel Al-aSi-bM alloy and put into the heat extruder extrusion modling;
D, that the Al-aSi-bM alloy that obtains after the hot extrusion is carried out multi-pass is cold rolling.
The expression formula of described acieral foundry alloy is Al-aSi-bM, and wherein a, b are that the parts by weight that Si and M occupy respectively, a are 5-60 based on 100 parts of acieral gross weight umbers, and b is 0.1-10, and surplus is Al.
Among the step a, the used aluminium and the material purity of silicon are more than 99.5%, if M is in Nb, Fe, Cu, Zr, Ti, V, the Cr element any one, Nb, Fe, Cu, Zr, Ti, V, Cr material purity are not less than 99%, if M chooses rare earth element, then be mishmetal, main alloy element Ce accounts for the mishmetal quality more than 40%.With the bulk of pure aluminium powder, silicon, the bulk of M is raw material, and each element makes prealloy Al-Si-M. by vacuum melting furnace after being made into raw material by required mass percent.
Among the step b; induction melting adopts Frequency Induction Heating; heating power is 5～20kW; temperature is 1000-1200 ℃, and it is 3-4mm that injection molding equipment adopts double-deck unrestricted formula aerodynamic atomization nozzle, nozzle diameter, tiltedly draw angle is that 37 °, eccentric throw are that 30mm, melt quality flow rate are that 6～8kg/min, protective gas pressure are that vacuum in 0.6-0.8MPa, the quartz glass tube is 10
-3～10
-4Pa.
Among the described step c, Al-Si-M alloy powder extrusion temperature is 300～310 ℃, and extrusion load is 200～400MP, and extrusion time is 3～4h, and the extruding number of times is 1～5 time.
Among the described step c, earlier progressively be pressurized to 200～400MP pressure stable, be warming up to the 50%-60% of powder melting temperature (Tm, ℃) then, be incubated lower the temperature after 3～4 hours cold rolling.
In the described steps d, progressively be depressed into 70～150KN pressure stable earlier under the room temperature, kept 1～2 hour, remove pressure then.Cold deformation need continue 1-2 hour.
The operation principle of overall technical architecture of the present invention is: the high silicon-base aluminum alloy by sprayup process preparation is under the condition of the metamorphism of rare earth and supersonic condensing, can generate the tiny rare earth aluminium silicon compound that a large amount of disperses distributes, and the also obviously refinement of the size of primary silicon is spherical distribution in the matrix.This method has reduced the solid solubility of aluminium silicon solid solution, has reduced the distortion of aluminum substrate lattice greatly, thereby has reduced the scattering of electronics, so conductance is significantly improved.
The conductance of the high silica/aluminum-based alloy of the present invention's preparation satisfies industry transmission of electricity industry lead application standard (greater than 40%IACS) more than 45%IACS.The alloy that preparation is described has the favorable conductive ability.
The specific embodiment
Embodiment 1
Purity being not less than 99.5% pure Al, Si and being made into raw material by required atomic percent, is that 45% mishmetal is made into raw material by required atomic percent with the Ce constituent content, makes prealloy Al-20Si-0.35Re in vacuum melting furnace; Al-20Si-0.35Re puts into vacuum induction melting furnace with prealloy, at argon gas-nitrogen protection injection molding, smelting temperature is 1000 ℃, and protection air pressure is by force 0.8MPa, and nozzle diameter is 3-4mm, tiltedly draw angle is that 37 °, eccentric throw are that 30mm, melt quality flow rate are 6～8kg/min; L-20Si-0.35Re puts into heat extruder with the injection molding alloy A, and 300 ℃ of extrusion temperatures carry out 1 hot extrusion under the pressure 300MP, each insulation compacting 4h.At room temperature, carry out under the pressure 70MP 2 times cold rolling, suppress 2h at every turn, the compacting obtain length 80mm, width 40mm, the cuboid acieral of thickness 3mm.The conductance of this alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 2
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-0.35Re.This scheme is to be replaced 1 time by 2 times by the hot extrusion number of times, and pressure 350MP replaces 300MP.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 3
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-0.35Re.This scheme is to be replaced 1 time by 3 times by the hot extrusion number of times, and pressure 400MP replaces 300MP.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm, the conductance of this alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 4
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-5Si-0.35Nb.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 5
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-60Si-0.35Zr.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 6
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-0.1V.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
Embodiment 7
Technical scheme such as embodiment 1, prepared composition are the high silica/aluminum-based alloy of Al-20Si-10Cr.Prepare length 80mm with embodiment 1 described technical scheme, width 40mm, the cuboid acieral of thickness 3mm.The conductance of alloy adopts bridge-type resistance instrument to measure, and the results are shown in following table.
The high silica/aluminum-based alloy composition proportion and the conductance parameter list of embodiment 1-7 preparations
| Embodiment | Resistivity/Ω .m |
| 1 | 0.038 |
| 2 | 0.023 |
| 3 | 0.020 |
| 4 | 0.018 |
| 5 | 0.048 |
| 6 | 0.038 |
| 7 | 0.047 |
The foregoing description only is used for that the present invention will be described, does not constitute the restriction to the claim scope, and other substantial equivalence means that it may occur to persons skilled in the art that are all in claim scope of the present invention.
Claims (10)
1. a method for preparing high-conductivity high silicon aluminum base alloy is characterized in that, comprises the steps:
A, obtain prealloy Al-aSi-bM with pure Al, Si, M alloy melting, wherein, M is one or more among rare earth, Nb, Fe, Cu, Zr, Ti, V, the Cr, 5≤a≤60,0.1≤b≤10;
B, the prealloy Al-aSi-bM that obtains is put into the vacuum induction melting furnace melting, melting finishes, and protects molten state Al-aSi-bM foundry alloy injection molding with nitrogen-argon mixture gas again;
C, will be injected into kenel Al-aSi-bM alloy and put into the heat extruder extrusion modling;
D, that the Al-aSi-bM alloy that obtains after the hot extrusion is carried out multi-pass is cold rolling.
2. the method for preparing high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that, among the step a, the used aluminium and the material purity of silicon are more than 99.5%, when M was in Nb, Fe, Cu, Zr, Ti, V, the Cr element any one, Nb, Fe, Cu, Zr, Ti, V, Cr material purity were not less than 99%, when M chooses rare earth element, then be mishmetal, main alloy element Ce accounts for more than 40% of mishmetal quality.
3. prepare the method for high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that, among the step b, induction melting adopts Frequency Induction Heating, and heating power is 5～20kW, and temperature is 1000-1200 ℃.
4. prepare the method for high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that, among the step b, injection molding equipment adopts double-deck unrestricted formula aerodynamic atomization nozzle.
5. as preparing the method for high-conductivity high silicon aluminum base alloy as described in the claim 4, it is characterized in that the nozzle diameter of described injection molding equipment is that 3-4mm, melt quality flow rate are 6～8kg/min.
6. prepare the method for high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that, among the step b, protective gas pressure is 0.6-0.8MPa, and the vacuum in the vacuum induction melting furnace is 10
-3～10
-4Pa.
7. prepare the method for high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that, among the described step c, Al-aSi-bM alloy powder extrusion temperature is 300～310 ℃, extrusion load is 200～400MP, and extrusion time is 3～4h, and the extruding number of times is 1～5 time.
8. the method for preparing high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that described step c is progressively to be pressurized to earlier 200～400MP pressure stable, be warming up to the 50%-60% place hot pressing of powder melting temperature then, it is cold rolling to be incubated after 3～4 hours cooling.
9. prepare the method for high-conductivity high silicon aluminum base alloy according to claim 1, it is characterized in that, in the described steps d, progressively be depressed into 70～150KN pressure stable earlier under the room temperature, kept 1～2 hour, remove pressure then.
10. a high-conductivity high silicon aluminum base alloy is made by the described method for preparing high-conductivity high silicon aluminum base alloy of arbitrary claim among the claim 1-9.
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| CN104390828A (en) * | 2014-12-12 | 2015-03-04 | 西南铝业（集团）有限责任公司 | Preparation method of AHS aluminum alloy spectrum standard sample |
| CN106191563A (en) * | 2016-08-16 | 2016-12-07 | 江苏中色锐毕利实业有限公司 | A kind of auto parts and components silico-aluminum and preparation method thereof |
| CN106319297A (en) * | 2016-08-16 | 2017-01-11 | 江苏中色锐毕利实业有限公司 | High-strength eutectic aluminum-silicon alloy and preparation method thereof |
| CN108796314A (en) * | 2018-07-16 | 2018-11-13 | 中南大学 | A kind of preparation method of alusil alloy used for electronic packaging |
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| JP3724033B2 (en) * | 1996-01-30 | 2005-12-07 | 住友電気工業株式会社 | High-strength, high-heat-resistant aluminum alloy and its manufacturing method, conductive wire and overhead wire |
| JP4906206B2 (en) * | 2001-09-27 | 2012-03-28 | 東洋アルミニウム株式会社 | Al-Si powder alloy material and method for producing the same |
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| JP2007009262A (en) * | 2005-06-29 | 2007-01-18 | Mitsubishi Alum Co Ltd | Aluminum alloy sheet with excellent thermal conductivity, strength and bendability and its manufacturing method |
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| CN104390828A (en) * | 2014-12-12 | 2015-03-04 | 西南铝业（集团）有限责任公司 | Preparation method of AHS aluminum alloy spectrum standard sample |
| CN106191563A (en) * | 2016-08-16 | 2016-12-07 | 江苏中色锐毕利实业有限公司 | A kind of auto parts and components silico-aluminum and preparation method thereof |
| CN106319297A (en) * | 2016-08-16 | 2017-01-11 | 江苏中色锐毕利实业有限公司 | High-strength eutectic aluminum-silicon alloy and preparation method thereof |
| CN106319297B (en) * | 2016-08-16 | 2018-11-27 | 江苏中色锐毕利实业有限公司 | A kind of high intensity cocrystallized Al-Si alloy and preparation method thereof |
| CN108796314A (en) * | 2018-07-16 | 2018-11-13 | 中南大学 | A kind of preparation method of alusil alloy used for electronic packaging |
| CN108941538A (en) * | 2018-09-14 | 2018-12-07 | 上海家声汽车零部件有限公司 | Carbon/oxide enhancing lubricating pump of automobile precision powder metallurgical gear and preparation method |
| CN111826556A (en) * | 2020-07-15 | 2020-10-27 | 宣城建永精密金属有限公司 | High-voltage electrical system conductor and casting process thereof |
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