CN113136542A - Preparation method of gold-coated silver bonding wire - Google Patents
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- CN113136542A CN113136542A CN202110450753.2A CN202110450753A CN113136542A CN 113136542 A CN113136542 A CN 113136542A CN 202110450753 A CN202110450753 A CN 202110450753A CN 113136542 A CN113136542 A CN 113136542A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
- C23C10/20—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions only one element being diffused
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Abstract
The invention provides a preparation method of a gold-coated silver bonding wire, which comprises the following steps: taking a silver wire blank with the wire diameter of 15-30 mu m as a blank; adding nano-gold into a stable solvent, and carrying out ultrasonic treatment for 30-60 min to prepare nano-gold immersion plating solution; immersing the silver wire blank in the nano gold immersion plating solution, and forming a stable alloy layer on the gold and silver contact surface by adopting a vacuum heating immersion plating or infrared heating immersion plating mode; processing the silver wire blank after immersion plating by adopting a vacuum heating drying or vacuum infrared drying mode to form an integrated gold-coated silver bonding wire; and annealing the obtained gold-coated silver bonding wire to obtain the gold-coated silver bonding wire. The preparation method of the invention enables the nano-gold and the silver wire to be in nano-level contact to form a firm gold-silver alloy transition layer, the prepared gold-clad-silver bonding wire has the advantages of uniform and controllable gold layer, strong gold-silver interface bonding force, environment-friendly production process, good weldability, excellent oxidation resistance, excellent conductivity and overall excellent reliability of the bonding wire.
Description
Technical Field
The invention relates to a preparation method of a gold-coated silver bonding wire, belonging to the field of electronic packaging.
Background
With the development of the integrated circuit manufacturing industry and the packaging industry, the demand for bonding wires (inner leads between a chip and a frame) as one of four major base materials of a semiconductor package is increasing. The vigorous development of microelectronics has made chips advance to high performance, high density and miniaturization, and thus has made higher demands on bonding wires between the chips and the frame. The traditional bonding alloy wire becomes the bonding lead most applied in the packaging industry due to the advantages of excellent electrochemical performance, high reliability and the like, but the gold bonding wire is high in price, and the search for products with equivalent performance and low price is urgent for reducing the cost.
The silver has good electric conduction, heat conduction and mechanical properties, and is a better candidate substitute product for the bonding gold wire. Although the silver wire has lower cost advantage and better bonding performance, the silver wire is easy to oxidize, the conductivity of the oxidized silver wire is poor, the bonding reliability is influenced, and the application of the silver wire in the field of high-end electronic packaging industry is further limited. The surface of the silver wire is plated with inert metal to form a protective layer, so that the oxidation resistance of the lead can be improved on the premise of not reducing the bonding performance of the silver wire, and the gold plating performance is particularly good among a plurality of inert elements.
At present, the gold plating process of the silver-based bonding wire is mainly completed by chemical plating and electroplating, and the existing processes have certain defects, such as: the process pollutes the environment, the components of the plating solution contain acid and alkali ions, and the acid and alkali ions are easy to remain on the surface of the wire body, thereby influencing the stability of the bonding wire and the like. In addition, there are some problems with the solid phase composite technique, such as: the thickness of the gold layer is not easy to control, the gold layer is not uniform, and the like.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a preparation method of a gold-coated-silver bonding wire, the obtained gold layer is uniform and controllable, the gold-silver interface bonding force is strong, and the production process is environment-friendly.
In order to achieve the purpose, the invention adopts the technical scheme that:
a preparation method of a gold-coated silver bonding wire comprises the following steps:
(1) silver wire blank: taking a silver wire blank with the wire diameter of 15-30 mu m as a blank;
(2) preparing a nano gold immersion plating solution: adding nano-gold into a stable solvent, and carrying out ultrasonic treatment for 30-60 min to prepare nano-gold immersion plating solution;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing the silver wire blank in the nano gold immersion plating solution, and forming a stable alloy layer on the gold and silver contact surface by adopting a vacuum heating immersion plating or infrared heating immersion plating mode;
(4) and (3) vacuum treatment: processing the silver wire blank after immersion plating by adopting a vacuum heating drying or vacuum infrared drying mode to form an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the obtained gold-coated silver bonding wire to obtain the gold-coated silver bonding wire.
The grain diameter of the nano-gold is less than or equal to 80nm, and the mass concentration of the nano-gold in the nano-gold immersion plating solution is 0.4-15%.
The stabilizing solvent comprises the following components in mass concentration: 0.02-2% of stabilizer, 0.5-12% of auxiliary agent, 0.05-1% of surfactant and the balance of water.
The stabilizer is one or the mixture of two or more of tetrahydrofuran, dimethyl sulfoxide, N-methyl pyrrolidone, formamide and methyl guanamine.
The auxiliary agent is one or a mixture of two or more of formaldehyde, methanol, ethanol and acetone.
The surfactant is a nonionic surfactant or/and a block copolymerization surfactant; the nonionic surfactant is: allyl alcohol polyoxyalkyl ether F-6 or/and polyethylene glycol 1000; the block co-cluster surfactant is: any one or mixture of two or more of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123, propylene glycol block polyether L-64 and propylene glycol block polyether F68.
The temperature of the vacuum heating immersion plating or the infrared heating immersion plating in the step (3) is 500-600 ℃, and the time is 5-15 min.
And (4) drying by vacuum heating or vacuum infrared drying at 80-120 ℃ for 30 s-5 min.
The annealing temperature of the step (5) is 500-680 ℃, and the time is 5-15 min.
And (4) before the vacuum treatment in the step (4), repeating the step (3) to ensure that the silver wire blank after immersion plating is immersed in the nano-gold immersion plating solution again to finish the immersion plating again, wherein the immersion plating times are more than or equal to 1 time.
The invention has the beneficial effects that:
the invention adopts a stabilizing solvent consisting of a stabilizing agent, an auxiliary agent and a surfactant to stably suspend nano-gold particles in a solution, wherein the larger the size of the nano-gold particles is, the larger the required construction effect is, the higher the requirement on the surfactant is, the larger the size of the nano-gold particles is, and the larger the thickness of a gold plating layer is after single immersion plating generally. The surfactant is selected from polyether, polyalcohol and polyalkyl substances, and active groups on molecules of the surfactant can form chemical bonding with nano materials, so that the nano gold particles can stably exist in a solution. Meanwhile, the stabilizer is added to assist the surfactant, so that the compatibility among the auxiliary agent, the surfactant and the nano gold particles is better, the solution stability is better, and the gold layer on the outer surface of the silver wire blank is good in uniformity through the dip plating process of the stable gold solution. The vacuum treatment and thermal stabilization treatment process is used for enabling the gold layer and the silver billet to be combined more firmly and improving the comprehensive performance of the gold-coated-silver bonding wire.
The preparation method of the invention leads the nano gold and the silver wire to be in nano-level contact, and the gold and silver elements are mutually diffused through the gold and silver contact surface treatment to form a firm gold and silver alloy transition layer, thus leading the gold-plated layer and the silver wire blank to be integrated. The one-time or multi-time dip plating is combined, the thickness of the gold-coated layer is controllable, the coating is compact, the production equipment is simple, and the production process is green and environment-friendly. The cost price of the prepared gold-coated silver bonding wire is greatly reduced, and the compatibility of the bonding process is strong; meanwhile, the welding performance is good, the oxidation resistance is excellent, the conductivity is excellent, and the reliability of the bonding wire is overall excellent.
Detailed Description
The following examples further illustrate the embodiments of the present invention in detail.
EXAMPLE 1 preparation of a Nanogold immersion plating solution
1 #: 0.5mg of N-methylpyrrolidone, 12.5mg of acetone and 1.25mg of a polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123 were dissolved in water to prepare a stable solvent in an amount of 2.5g in total. And (3) selecting 10mg of 10-30 nm nanogold, adding into the stable solvent, and carrying out ultrasonic treatment for 30min to prepare a nanogold immersion plating solution No. 1.
2 #: 0.5mg of N-methylpyrrolidone, 0.3mg of methylguanamine, 100mg of acetone, 1mg of a polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123 and 5mg of a propylene glycol block polyether F68 were dissolved in water to prepare a stable solvent having a total weight of 2.5 g. And (3) selecting 25mg of 10-30 nm nanogold, adding into the stable solvent, and carrying out ultrasonic treatment for 30min to prepare a nanogold immersion plating solution No. 2.
3 #: 0.3mg of N-methylpyrrolidone, 0.3mg of dimethyl sulfoxide, 0.4mg of tetrahydrofuran, 50mg of acetone, 50mg of formaldehyde, 4mg of propylene glycol block polyether L-64 and 3mg of polyethylene glycol 1000 were dissolved in water to prepare a stable solvent having a total weight of 2.5 g. And (3) selecting 50mg of 30-50 nm nanogold, adding into the stable solvent, and carrying out ultrasonic treatment for 60min to prepare the nanogold immersion plating solution.
4 #: 0.5mg of N-methylpyrrolidone, 0.5mg of dimethyl sulfoxide, 0.5mg of formamide, 50mg of acetone, 20mg of formaldehyde, 8mg of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123, 6mg of propylene glycol block polyether L-64 and 6mg of propylene glycol block polyether F68 were dissolved in water to prepare a stable solvent having a total weight of 2.5 g. And (3) selecting 100mg of nano-gold with the particle size of 30-50 nm, adding the nano-gold into the stable solvent, and carrying out ultrasonic treatment for 45min to prepare a nano-gold immersion plating solution No. 4.
5 #: 0.5mg of N-methylpyrrolidone, 1mg of tetrahydrofuran, 1mg of methylguanamine, 100mg of methanol, 200mg of ethanol, 10mg of allyl alcohol polyoxyalkyl ether F-6 and 10mg of polyethylene glycol 1000 were dissolved in water to prepare a stable solvent having a total weight of 2.5 g. And (3) selecting 300mg of nano-gold with the particle size of 30-80 nm, adding the nano-gold into the stable solvent, and carrying out ultrasonic treatment for 60min to prepare a nano-gold immersion plating solution No. 5.
Example 2 preparation of gold-coated silver bonding wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) fresh silver wire blank: taking a fresh superfine silver wire blank with the wire diameter of 15 mu m as a blank;
(2) preparing a nano gold leaching solution No. 1: preparing a nano gold leaching solution 1# by adopting the method of the embodiment 1;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing a fresh silver wire blank in the nano-gold immersion plating solution No. 1, and carrying out vacuum heating immersion plating for 15min at 500 ℃ to form a stable alloy layer on a gold and silver contact surface;
(4) and (3) vacuum treatment: vacuum infrared heating and drying at 100 ℃ for 30s to enable the gold-plated layer to be in close contact with the silver wire blank, so as to form an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the gold-coated silver bonding wire at 500 ℃ for 5min to obtain a gold layer with the thickness of 50-80 nm.
Example 3 preparation of gold-coated silver bonding wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) fresh silver wire blank: taking a fresh superfine silver wire blank with the wire diameter of 15 mu m as a blank;
(2) preparing a nano gold immersion plating solution No. 2: preparing a nano gold leaching solution 2# by adopting the method of the embodiment 1;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing a fresh silver wire blank in the nano-gold immersion plating solution No. 2, and carrying out vacuum heating immersion plating for 15min at 550 ℃ to form a stable alloy layer on a gold and silver contact surface;
(4) and (3) vacuum treatment: vacuum heating and drying at 80 ℃ for 3min to enable the gold-plated layer to be in close contact with the silver wire blank, so as to form an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the gold-coated silver bonding wire at 550 ℃ for 5min to obtain a gold layer with the thickness of 150-200 nm.
Example 4 preparation of gold-coated silver bonding wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) fresh silver wire blank: taking a fresh superfine silver wire blank with the wire diameter of 30 mu m as a blank;
(2) preparing a nano gold immersion plating solution: preparing nano gold immersion plating solutions 1# and 3# by adopting the embodiment 1;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing a fresh silver wire blank in a nano-gold immersion plating solution No. 3, carrying out vacuum heating immersion plating for 15min at 600 ℃, and then carrying out vacuum heating immersion plating for 15min at 600 ℃ in the nano-gold immersion plating solution No. 1 to form a stable alloy layer on a gold and silver contact surface;
(4) and (3) vacuum treatment: drying for 1min at 100 ℃ in vacuum and infrared mode to enable the gold-plated layer to be in close contact with the silver wire blank, and forming an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the gold-coated silver bonding wire at 580 ℃ for 5min to obtain a gold layer with the thickness of 400-500 nm.
Example 5 preparation of gold-coated silver bonding wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) fresh silver wire blank: taking a fresh superfine silver wire blank with the wire diameter of 20 mu m as a blank;
(2) preparing a nano gold immersion plating solution No. 4: preparing a nanogold immersion plating solution No. 4 by using the method of example 1;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing a fresh silver wire blank in the nano-gold immersion plating solution No. 4, and carrying out vacuum heating immersion plating for 15min at the temperature of 550 ℃ to form a stable alloy layer on a gold and silver contact surface;
(4) and (3) vacuum treatment: heating and drying at 120 ℃ for 5min in vacuum to enable the gold-plated layer to be in close contact with the silver wire blank so as to form an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the gold-coated silver bonding wire at 600 ℃ for 10min to obtain a gold layer with the thickness of 350-450 nm.
Example 6 preparation of gold-coated silver bonding wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) fresh silver wire blank: taking a fresh superfine silver wire blank with the wire diameter of 30 mu m as a blank;
(2) preparing a nano gold immersion plating solution No. 5: preparing a nanogold leaching solution No. 5 by adopting the method of the embodiment 1;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing a fresh silver wire blank in a nano gold immersion plating solution No. 5, and carrying out vacuum heating immersion plating for 5min at 500 ℃ to form a stable alloy layer on a gold and silver contact surface;
(4) and (3) vacuum treatment: heating and drying the gold-plated layer and the silver wire blank in vacuum at 100 ℃ for 5min to ensure that the gold-plated layer and the silver wire blank are contacted more closely to form an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the gold-coated silver bonding wire at 680 ℃ for 10min to obtain a gold layer with the thickness of 100-300 nm.
Claims (10)
1. A preparation method of a gold-coated silver bonding wire is characterized by comprising the following steps:
(1) silver wire blank: taking a silver wire blank with the wire diameter of 15-30 mu m as a blank;
(2) preparing a nano gold immersion plating solution: adding nano-gold into a stable solvent, and carrying out ultrasonic treatment for 30-60 min to prepare nano-gold immersion plating solution;
(3) and (3) immersion plating of nano gold on the silver wire blank: immersing the silver wire blank in the nano gold immersion plating solution, and forming a stable alloy layer on the gold and silver contact surface by adopting a vacuum heating immersion plating or infrared heating immersion plating mode;
(4) and (3) vacuum treatment: processing the silver wire blank after immersion plating by adopting a vacuum heating drying or vacuum infrared drying mode to form an integrated gold-coated silver bonding wire;
(5) and (3) thermal stability treatment: and annealing the obtained gold-coated silver bonding wire to obtain the gold-coated silver bonding wire.
2. The preparation method according to claim 1, wherein the particle size of the nano-gold is not more than 80nm, and the mass concentration of the nano-gold in the nano-gold immersion plating solution is 0.4-15%.
3. The method of claim 1, wherein the stabilizing solvent comprises the following components in mass concentration: 0.02-2% of stabilizer, 0.5-12% of auxiliary agent, 0.05-1% of surfactant and the balance of water.
4. The process according to claim 3, wherein the stabilizer is one or a mixture of two or more of tetrahydrofuran, dimethyl sulfoxide, N-methylpyrrolidone, formamide and methylguanamine.
5. The method according to claim 3, wherein the auxiliary is one of formaldehyde, methanol, ethanol, and acetone, or a mixture of two or more thereof.
6. The production method according to claim 3, wherein the surfactant is a nonionic surfactant or/and a block copolymerization type surfactant; the nonionic surfactant is: allyl alcohol polyoxyalkyl ether F-6 or/and polyethylene glycol 1000; the block co-cluster surfactant is: any one or mixture of two or more of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123, propylene glycol block polyether L-64 and propylene glycol block polyether F68.
7. The method according to claim 1, wherein the temperature of the vacuum heating immersion plating or the infrared heating immersion plating in the step (3) is 500 to 600 ℃ for 5 to 15 minutes.
8. The preparation method according to claim 1, wherein the temperature for vacuum heating drying or vacuum infrared drying in the step (4) is 80 ℃ to 120 ℃ for 30s to 5 min.
9. The method according to claim 1, wherein the annealing temperature in the step (5) is 500 to 680 ℃ and the time is 5 to 15 min.
10. The preparation method according to any one of claims 1 to 9, further comprising, before the vacuum treatment in the step (4), repeating the step (3) to immerse the immersion-plated silver wire blank in the nanogold immersion-plating solution again to complete the immersion-plating again, wherein the immersion-plating times are more than or equal to 1.
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