CN105547026A - Thermal column processing method - Google Patents
Thermal column processing method Download PDFInfo
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- CN105547026A CN105547026A CN201511000177.2A CN201511000177A CN105547026A CN 105547026 A CN105547026 A CN 105547026A CN 201511000177 A CN201511000177 A CN 201511000177A CN 105547026 A CN105547026 A CN 105547026A
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- cylinder
- copper powder
- upper cover
- capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a thermal column processing method. The thermal column processing method comprises the following steps that a column body and a base plate are fixedly installed into a whole; capillary structures are prepared on the inner wall of the base plate and the inner wall of the column body; an upper cover is matched with the column body tightly, and then integral sintering is conducted; and a thermal column is filled with media, vacummized, degassed and sealed, and the finished thermal column is obtained. By the adoption of the thermal column processing method, positioning and mandrel demolding are not needed during processing, and the phenomenon that the capillary structures are damaged due to demolding is avoided; sintering requirements can be met through an extremely small amount of heat in the sintering process, the technological steps are simple, the efficiency is high, and the stability is good.
Description
Technical field
The present invention relates to heat dissipation technology, particularly relate to a kind of plume processing method.
Background technology
Plume is seethed with excitement by liquid working substance or evaporates and absorbs amount of heat, and produce steam, steam discharges a large amount of latent heats of vaporization in the place's condensation of plume wall, realizes the exchange of heat.Plume is widely used in the field such as LED lamp, cooling electronic component, the heat on LED chip or electronic devices and components surface is constantly absorbed bottom plume, liquid working substance circulating vaporization-condensation process constantly in condenser pipe, the latent heat of vaporization is dispersed in external environment or the heat dissipation equipment that matches via condensation tube wall rapidly, thus effectively control the temperature of LED chip or electronic devices and components, ensure that stability and the reliability of its work.
Existing plume capillary structure layer is generally formed by copper powder sintering, its main processing procedure comprises plug location, fill out powder, sintering, plug demoulding etc., because the fusing point of copper powder is about about 1080 DEG C, its sintering peak temperature general control is at about 850 ~ 980 DEG C, as everyone knows, during sintering, copper powder volume when being less than 600 DEG C there is no change, but copper powder can produce the sharply expansion of 2% ~ 3% when temperature is in 600 ~ 800 DEG C of regions, therefore in the knockout course after having sintered, because copper powder expanding volume increases, must additionally apply more external force plug could be detached, and plume its tube surfaces after high temperature sintering softens, plume is easily made to be out of shape under external force, even cannot demoulding time serious, thus cause the increase of plume fraction defective.
For improving plug release problems, at present usual by plug through nitrogen treatment or in mandrel surface coating anti-reaction layer, as tungsten powder (w), boron nitride (NB), refractory ceramics powder (A1203) etc.But, the anti-reaction layer be coated with when plug withdrawing is easily peeled off because of frictional force and then is residued in body, capillary structure is caused to block, cause working media to reflux to have some setbacks, the performance affecting plume even damages plume, be difficult to ensure product quality, also directly affect transmission efficiency and radiating effect.And its production process is loaded down with trivial details, production efficiency is low, and cost is high.Not can solve heat dissipation problem, the service life of product is also had a great impact.
Summary of the invention
The present invention provides a kind of plume processing method to solve deficiency of the prior art, integral type capillary structure is formed by the once sintered inside at cylinder, without the need to plug, there is not the phenomenon that the demoulding destroys capillary structure, processing step is simple, efficiency is high, good stability.
For achieving the above object, the technical solution used in the present invention is:
A kind of plume processing method, comprises the following steps:
1) cylinder and base plate are fixedly mounted, form an entirety;
2) on the inwall of base plate and cylinder, capillary structure is prepared;
3) by upper cover and cylinder tight fit, then integral type sintering is carried out;
4) Filled Dielectrics carried out to plume and vacuumize deairing and sealing, completing plume finished product.
In existing technology, all use plug to position and sinter, after sintering, plug is taken out, in sintering process, plug will absorb a large amount of heats in sintering furnace, and after sintering, needing the cool time more grown just can carry out subsequent handling, not only cause the waste of the energy, also greatly reduce operating efficiency simultaneously.And take the said method in the present invention, without the need to location and the plug demoulding, there is not the phenomenon that the demoulding destroys capillary structure in process, sintering process only needs little energy just can reach sintering requirement, and processing step is simple, efficiency is high, good stability.
As a kind of preferred version of plume processing method of the present invention, the concrete steps of capillary structure are prepared for be coated with one deck organic gel on cylinder and plate inner wall in described step 2, then copper powder is sprayed on organic gel surface uniformly, main body and plate inner wall are formed continuous print capillary structure, organic gel makes copper powder dispersion more even for adsorbing copper powder, preparation technology is simple, and can reduce the thickness of copper powder, improves capillary force.Further, one deck organic gel can be also coated with on the inwall of upper cover, then copper powder is sprayed on organic gel surface uniformly, make upper cover inwall also forms capillary structure, when by upper cover and cylinder tight fit, copper powder on upper cover inwall is connected with the copper powder on inboard wall of cylinder, makes the inwall of base plate, cylinder, upper cover to be formed the continuous capillary structure be interconnected.
As a kind of preferred version of plume processing method of the present invention, the concrete steps preparing capillary structure in described step 2 are by copper powder and the abundant mix and blend of organic gel, then in cylinder, suitable plug is inserted, the copper powder being mixed with organic gel is poured in cylinder, the thickness of copper powder on base plate and inboard wall of cylinder is controlled by plug, form integral type capillary structure, in order to improve the effect of capillary structure, also the certain thickness copper powder being mixed with organic gel can be applied on upper cover inwall, make like this to be formed respectively along upper cover in whole staving, the upper capillary structure that cylinder and plate inner wall are arranged, middle capillary structure and bottom capillary structure, upper capillary structure, middle capillary structure is connected with bottom capillary structure, form integrated radiating structure.
As plume processing method of the present invention a kind of preferred version described in step 2 in prepare the concrete steps of capillary structure for carry out copper powder filling on base plate, filling copper powder thickness is 1-4mm, then in cylinder, load the capillary structure that wire mesh shape becomes, silk screen is close to inboard wall of cylinder and is arranged, copper powder close contact on silk screen lower end and base plate, by copper powder sintering and silk screen complex method, form whole capillary structure.
As a kind of preferred version of plume processing method of the present invention, time in step 3 by upper cover and cylinder tight fit, the capillary structure on upper cover inwall is connected with the capillary structure on inboard wall of cylinder.
As a kind of preferred version of plume processing method of the present invention, also comprise sintering front in upper cover, the step of fixing soldering paste between base plate and cylinder, soldering paste melts in sintering process, solidifies formation solder joint after the cooling period.
As a kind of preferred version of plume processing method of the present invention, described upper cover and cylinder, between base plate and cylinder, be interference fit.
Accompanying drawing explanation
Fig. 1 is the three-dimensional cutaway view of plume provided by the invention.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Embodiment 1
As shown in Figure 1, a kind of plume, this plume comprises upper cover 2, capillary 1, cylinder 4, base plate 5 and capillary structure 3, wherein capillary structure 3 comprises the upper capillary structure arranged along upper cover, cylinder and plate inner wall respectively, middle capillary structure and bottom capillary structure, described upper capillary structure, middle capillary structure are connected with bottom capillary structure, form integrated radiating structure.Under vacuum state, liquid heat transfer working medium is heated, and vaporization is rapid spreads, chance condensation is formed liquid state and can be flowed to heating surface rapidly by the sinter layer capillary structure of periphery, circulate benignly thus, there will not be can not backflow phenomenon smoothly by obstruct, thus ensures that plume normally works.
This plume is adding man-hour, first cylinder 4 and base plate 5 is fixedly mounted, forms an entirety, when fixedly mounting, can adopt interference fit, make to be tightly connected between cylinder 4 and base plate 5, certainly, other mode also can be adopted to make plume and base plate compact siro spinning technology.Then copper powder is sprayed on organic gel surface uniformly, main body and plate inner wall are formed continuous print capillary structure, use the same method and on upper cover inwall, be coated with one deck organic gel and spray certain thickness copper powder, wherein on base plate, the copper powder thickness of capillary structure is 1-4mm, on column side wall, the copper powder thickness of capillary structure is 0.2-0.5mm, and the copper powder thickness above covering capillary structure is 0.2-0.5mm.Then the cylinder entirety with upper cover and base plate is sintered, the formula that is sintered into one capillary structure.
Wherein, upper cover 2 center is provided with capillary 1, for medium filling in cylinder and vacuumize.Carry out Filled Dielectrics by capillary 1 pair of plume and vacuumize deairing and sealing, completing plume finished product.
In order to improve sealing effectiveness, at upper cover, between base plate and cylinder, be equipped with soldering paste groove, in soldering paste groove, appropriate soldering paste is housed respectively, before sintering soldering paste is fixed in soldering paste groove, in sintering process, soldering paste melts, form solder joint after cooling, upper cover can be reinforced further, firmly determine and seal between base plate and cylinder.
Embodiment 2
The structure of plume is in the same manner as in Example 1, making step is also substantially identical, be only when preparing capillary structure, first cylinder and base plate are fixedly mounted, form an entirety, then by copper powder and the abundant mix and blend of organic gel, then in cylinder, suitable plug is inserted, the copper powder being mixed with organic gel is poured in cylinder, the thickness of copper powder on base plate and inboard wall of cylinder is controlled by plug, on upper cover inwall, apply the certain thickness copper powder being mixed with organic gel simultaneously, then by upper cover with cylinder tight fit, capillary structure on upper cover inwall is connected with the capillary structure on inboard wall of cylinder, then integral type sintering is carried out.
Embodiment 3
First cylinder and base plate are fixedly mounted, form an entirety, in inner surface brush one deck organic gel of base plate, then fill copper powder, be also stained with one deck copper powder at the inner surface of upper cover according to same mode simultaneously, and in cylinder, load the capillary structure of wire mesh shape one-tenth, silk screen is close to inboard wall of cylinder and is arranged, copper powder close contact on silk screen lower end and base plate, then closely cooperates upper cover and cylinder, and makes the copper powder close contact of silk screen upper end and upper lid surface.Then the cylinder entirety with upper cover and base plate is sintered, become copper powder, silk screen compound integral capillary structure.
Wherein, on base plate, the copper powder thickness of capillary structure is 1-4mm, and preferred copper powder thickness is 2-3mm, and the specification of silk screen is 150-200 order.
Above-mentioned two kinds of methods, without the need to location and the plug demoulding, there is not the phenomenon that the demoulding destroys capillary structure in process, processing step is simple, efficiency is high, good stability, and wherein capillary structure is integral type structure, and back-flow velocity is fast, good heat conduction effect, and Temperature Distribution is homogeneous.
Although be illustrated embodiments of the present invention in description, these embodiments just as prompting, should not limit protection scope of the present invention.Carry out various omission, displacement and change without departing from the spirit and scope of the present invention all should be included in protection scope of the present invention.
Claims (8)
1. a plume processing method, is characterized in that, comprises the following steps:
1) cylinder and base plate are fixedly mounted, form an entirety;
2) on the inwall of base plate and cylinder, capillary structure is prepared;
3) by upper cover and cylinder tight fit, then integral type sintering is carried out;
4) Filled Dielectrics carried out to plume and vacuumize deairing and sealing, completing plume finished product.
2. plume processing method according to claim 1, it is characterized in that: prepare the concrete steps of capillary structure in described step 2 for be coated with one deck organic gel on cylinder and plate inner wall, then copper powder is sprayed on organic gel surface uniformly, main body and plate inner wall are formed continuous print capillary structure.
3. plume processing method according to claim 1, it is characterized in that: the concrete steps preparing capillary structure in described step 2 are by copper powder and the abundant mix and blend of organic gel, then in cylinder, suitable plug is inserted, the copper powder being mixed with organic gel is poured in cylinder, controls the thickness of copper powder on base plate and inboard wall of cylinder by plug.
4. the plume processing method according to Claims 2 or 3, it is characterized in that: be also included in the step that upper cover inwall prepares capillary structure, upper cover inwall will be coated with one deck organic gel and spray certain thickness copper powder or the copper powder being mixed with organic gel is fixed on upper cover inwall, when by upper cover and cylinder tight fit, the copper powder on upper cover inwall is connected with the copper powder on inboard wall of cylinder.
5. plume processing method according to claim 1, it is characterized in that: prepare the concrete steps of capillary structure in described step 2 for carry out copper powder filling on base plate, filling copper powder thickness is 1-4mm, then in cylinder, load the capillary structure that wire mesh shape becomes, silk screen is close to inboard wall of cylinder and is arranged, the copper powder close contact on silk screen lower end and base plate.
6. plume processing method according to claim 5, it is characterized in that: be also included in the step that upper cover inwall prepares capillary structure, upper cover inwall will be coated with one deck organic gel and spray certain thickness copper powder or the copper powder being mixed with organic gel is fixed on upper cover inwall, when by upper cover and cylinder tight fit, the copper powder on upper cover inwall is connected with the silk screen on inboard wall of cylinder.
7. plume processing method according to claim 1, is characterized in that: also comprise sintering front in upper cover, the step of fixing soldering paste between base plate and cylinder, soldering paste melts in sintering process, solidifies formation solder joint after the cooling period.
8. plume processing method according to claim 1, is characterized in that: described upper cover and cylinder, be interference fit between base plate and cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511000177.2A CN105547026A (en) | 2015-12-25 | 2015-12-25 | Thermal column processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511000177.2A CN105547026A (en) | 2015-12-25 | 2015-12-25 | Thermal column processing method |
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| CN105547026A true CN105547026A (en) | 2016-05-04 |
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| CN201511000177.2A Pending CN105547026A (en) | 2015-12-25 | 2015-12-25 | Thermal column processing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328278A (en) * | 2017-08-04 | 2017-11-07 | 锘威科技(深圳)有限公司 | Plume structure, its preparation method and tool |
| CN107917632A (en) * | 2017-12-14 | 2018-04-17 | 东莞市合众导热科技有限公司 | A kind of composite type heat rod structure |
| CN111380388A (en) * | 2019-12-31 | 2020-07-07 | 苏州天脉导热科技股份有限公司 | Processing technology of copper powder capillary structure for ultrathin soaking plate |
| CN112247152A (en) * | 2020-10-23 | 2021-01-22 | 广东思泉新材料股份有限公司 | Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure |
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| CN101907415A (en) * | 2009-06-04 | 2010-12-08 | 泰硕电子股份有限公司 | Method for arranging capillary materials in radiating pipe |
| CN202259440U (en) * | 2011-08-31 | 2012-05-30 | 华南理工大学 | Thermal column used for LED packaging |
| CN102748972A (en) * | 2011-04-19 | 2012-10-24 | 泰硕电子股份有限公司 | Method for producing heat pipe |
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2015
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2681071Y (en) * | 2004-02-25 | 2005-02-23 | 徐惠群 | Heat pipe capillary structure heated at pipe end face |
| US20070277961A1 (en) * | 2006-06-02 | 2007-12-06 | Delta Electronics Inc. | Heat dissipation module and heat column thereof |
| CN101336063A (en) * | 2007-06-25 | 2008-12-31 | 台达电子工业股份有限公司 | Heat radiating device, two-phase type thermal transmission element and preparation thereof |
| CN101907415A (en) * | 2009-06-04 | 2010-12-08 | 泰硕电子股份有限公司 | Method for arranging capillary materials in radiating pipe |
| CN102748972A (en) * | 2011-04-19 | 2012-10-24 | 泰硕电子股份有限公司 | Method for producing heat pipe |
| CN202259440U (en) * | 2011-08-31 | 2012-05-30 | 华南理工大学 | Thermal column used for LED packaging |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107328278A (en) * | 2017-08-04 | 2017-11-07 | 锘威科技(深圳)有限公司 | Plume structure, its preparation method and tool |
| CN107917632A (en) * | 2017-12-14 | 2018-04-17 | 东莞市合众导热科技有限公司 | A kind of composite type heat rod structure |
| CN111380388A (en) * | 2019-12-31 | 2020-07-07 | 苏州天脉导热科技股份有限公司 | Processing technology of copper powder capillary structure for ultrathin soaking plate |
| CN112247152A (en) * | 2020-10-23 | 2021-01-22 | 广东思泉新材料股份有限公司 | Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure |
| CN112247152B (en) * | 2020-10-23 | 2021-12-10 | 广东思泉新材料股份有限公司 | Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure |
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Application publication date: 20160504 |