CN112247152A - Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure - Google Patents
Preparation method of super-hydrophilic foam copper with capillary effect and sandwich structure Download PDFInfo
- Publication number
- CN112247152A CN112247152A CN202011147623.3A CN202011147623A CN112247152A CN 112247152 A CN112247152 A CN 112247152A CN 202011147623 A CN202011147623 A CN 202011147623A CN 112247152 A CN112247152 A CN 112247152A
- Authority
- CN
- China
- Prior art keywords
- copper
- capillary effect
- flat
- plate body
- sandwich structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 105
- 239000010949 copper Substances 0.000 title claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 64
- 230000000694 effects Effects 0.000 title claims abstract description 29
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000006260 foam Substances 0.000 title description 8
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000011889 copper foil Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 20
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 19
- 239000001257 hydrogen Substances 0.000 claims abstract description 16
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 16
- 239000008367 deionised water Substances 0.000 claims abstract description 13
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 9
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 7
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000010792 warming Methods 0.000 claims 3
- 238000003756 stirring Methods 0.000 claims 2
- 229910001369 Brass Inorganic materials 0.000 claims 1
- 239000010951 brass Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 17
- 238000012546 transfer Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 5
- 238000005245 sintering Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 3
- 239000007791 liquid phase Substances 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- 238000010586 diagram Methods 0.000 description 5
- 241000784732 Lycaena phlaeas Species 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BHNHQGCKFZLERV-UHFFFAOYSA-N [Cu+4] Chemical compound [Cu+4] BHNHQGCKFZLERV-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/002—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature
- B22F7/004—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of porous nature comprising at least one non-porous part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
- B22F3/1134—Inorganic fillers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a preparation method of sandwich structure super-hydrophilic copper with capillary effect, which comprises the following steps: uniformly mixing copper powder, ammonium chloride and deionized water, and then carrying out vacuum defoaming to form a viscous mixture W1 for later use; processing a copper foil to form a flat-bottom groove in the middle of the copper foil to obtain a first plate body; pouring the viscous mixture W1 into the flat-bottom groove to completely fill the flat-bottom groove, and then uniformly paving a nano copper soldering paste layer on the copper foil part around the flat-bottom groove; two plate bodies are superposed to form a sandwich structure; and (3) heating the sandwich structure to 350-360 ℃ in a protective atmosphere environment containing hydrogen, keeping the temperature, continuously heating to 900-920 ℃ for keeping the temperature, continuously heating to 1000-1020 ℃ for keeping the temperature, and cooling to obtain the composite material. The method realizes one-step sintering molding, has simple process, short flow and low cost, can obtain the super hydrophilic copper with the sandwich structure, good product quality and structural stability, high yield and excellent capillary effect, and can be widely used as gas-liquid phase change heat transfer and radiation components, water absorption materials and the like.
Description
Technical Field
The invention relates to the technical field of heat and mass transfer, in particular to a preparation method of super-hydrophilic copper with a capillary effect and a sandwich structure.
Background
In recent years, with the breakthrough of integrated circuit technology, semiconductor technology and electronic component quality, the development of high performance, miniaturization and integration in the electronic industry is directly faced with the problem of heat dissipation. Electronic components, assemblies, circuit boards, circuits, etc. do not operate reliably at higher temperatures, even shortening their operating life. Copper is widely used in the field of heat transfer and dissipation because of its good heat-conducting property. However, pure copper as a heat sink has not been able to meet the current heat dissipation requirements. On the basis, a copper-based heat pipe and a soaking plate are developed by combining gas-liquid phase change heat transfer of working medium water.
At present, a vapor chamber mainly comprises a cavity (such as a copper pipe and a copper box), a capillary structure (a sintering layer, a silk screen or a groove) and a working medium (water, ethanol and the like), wherein the capillary structure is a key structure which directly influences heat transfer efficiency. At present, the capillary structures in the soaking plates on the market comprise wire mesh fibers, copper powder particles, foam copper and the like, and generally adopt stainless steel wire meshes as the capillary structures, but the porosity of the stainless steel wire meshes is only about 30%, and the connectivity of pores is not good, so that the stainless steel wire meshes are not beneficial to the flowing of refrigerating liquid. If pure copper or pure copper powder sintering process is adopted as the capillary structure, the porosity of more than 50 percent can be ensured, and the capillary structure has better capillary force, but the hydrophilicity is unstable. Moreover, the existing soaking plate process technology is complex, a series of process procedures such as cutting, electroplating, stamping, welding, surface treatment, high-temperature sintering, liquid injection, packaging, testing and the like are required, even two to three times of welding are required, and the excessive process procedures and technical requirements make the quality of the finished soaking plate difficult to guarantee, the stability is poor, the yield is low, and the cost is high.
Therefore, the preparation of a heat dissipation structure with low cost, simple process, high porosity and high permeability is still an urgent problem to be solved in the industry.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the preparation method of the sandwich structure super-hydrophilic copper is simple in process, short in flow, low in cost, good in product quality and structure stability, high in yield and excellent in capillary effect.
The solution of the invention is realized by the following steps:
a preparation method of super-hydrophilic copper with a capillary effect and a sandwich structure comprises the following steps:
(1) copper powder, ammonium chloride and deionized water are mixed and stirred uniformly, and then vacuum defoaming is carried out to form a viscous mixture W1 for later use;
(2) processing a copper foil to form a flat-bottom groove structure in the middle of the copper foil to obtain a first plate body, wherein an outlet is reserved on the first plate body and is used as a gas channel or a liquid injection port;
(3) pouring the viscous mixture W1 into the flat-bottom groove structure, completely filling the flat-bottom groove, compacting and flattening (middle layer), and then uniformly paving a nano copper paste layer on the copper foil part around the flat-bottom groove except the reserved outlet;
(4) a second plate body is taken to be overlapped with the first plate body, and the first plate body, the middle layer and the second plate body are overlapped to form a sandwich structure;
(5) heating the sandwich structure to 350-360 ℃ in a protective atmosphere environment containing hydrogen, preserving heat to enable water and ammonium chloride to be completely volatilized and sublimated, then continuously heating to 900-920 ℃ and preserving heat, removing an oxide layer through reaction with the hydrogen, enabling an upper plate and a lower plate to be firmly connected through copper paste, continuously heating to 1000-1020 ℃ and preserving heat to enable foamy copper formed in the middle to be fully recrystallized, and cooling to obtain the super-hydrophilic copper with the capillary effect.
In the scheme, a flat-bottom groove structure with a low middle part and high periphery can be formed by mechanically stamping a common copper foil; the shape of the part of the flat-bottom groove structure can be set according to the requirement, and the opening shape of the flat-bottom groove can be a rectangle, a square or any required special-shaped structural pattern.
Preferably, in the viscous mixture W1, the amounts of the copper powder, the ammonium chloride and the deionized water are 80-85 parts, 10-20 parts and 5-10 parts in sequence.
Preferably, the particle size of the copper powder is 200-500 nm.
Preferably, in the step (4), the temperature is slowly increased to 350-360 ℃ at the speed of 8-10 ℃/min; heating to 350-360 ℃, and then keeping the temperature for 1-2 hours; heating to 900-920 ℃, and then keeping the temperature for 1-2 hours; the temperature is raised to 1000-1020 ℃ and the heat preservation time is 1-2 hours.
Preferably, the second board body can be a plane copper foil or a copper foil with a flat-bottom stamping groove structure which is symmetrical to the first board body; and a corresponding outlet is reserved at the position of the second plate body corresponding to the outlet of the first plate body.
Preferably, when the second board body is a copper foil with a punched flat-bottom groove structure, which is symmetrical to the first board body, step (4) further includes, before the first board body and the second board body are stacked together: copper powder, ammonium chloride and deionized water are mixed and stirred uniformly, then vacuum defoaming is carried out to form a viscous mixture W2, the viscous mixture is poured into the flat-bottom groove structure of the second plate body, the groove is completely filled, and the second plate body is compacted and flattened.
Preferably, the capillary attraction of the capillary effect can be adjusted by the pore size of the copper powder in the viscous mixture, and the pore size can be adjusted by the content of ammonium chloride in the viscous mixture.
Preferably, in the step (3), the thickness of the nano-copper paste layer is 100 μm or less.
Preferably, in the step (5), the hydrogen-containing protective atmosphere contains a mixed gas of hydrogen and nitrogen; the protective atmosphere containing hydrogen is a vacuum container filled with hydrogen and nitrogen, and the vacuum container can be a vacuum tube furnace.
Preferably, the amount of the copper powder, the ammonium chloride and the deionized water in the viscous mixture W2 is 80-85 parts, 10-20 parts and 5-10 parts in sequence.
Compared with the prior art, the invention has the following advantages:
(1) the method can simultaneously realize the connection between the upper plate and the lower plate of the copper with the sandwich structure, the formation of the copper foam, the connection between the copper foam and the upper plate and the lower plate, the support between the upper plate and the lower plate, the acquisition of the super-hydrophilic and capillary forces, and the integrated sintering forming is realized, and the super-hydrophilic copper with the sandwich structure prepared by the method has excellent capillary effect, has stronger hydrophilicity compared with the sandwich structure prepared by the prior method, and the connection among the components is more stable, the product quality and the structure stability are good, the yield is high, the uniformly distributed copper foam formed in the product is a penetrating porous foam structure, has excellent hydrophilicity and capillary effect, can be widely used as a gas-liquid phase change heat-transfer heat-dissipation component, a water absorption material and the like, is integrally formed with the upper plate and the lower plate, has mechanical strength, and can play a supporting role, the upper plate and the lower plate are prevented from being contacted together due to uneven stress, so that the compression strength is better, and the overall heat transfer performance is more stable.
(2) The pore size and the pore size distribution of the interlayer of the sandwich structure copper are convenient to adjust, so that the hydrophilicity and the capillary attraction are easily adjusted according to needs, and the practicability is extremely strong.
(3) The shape of the copper in the sandwich structure can be adjusted according to the requirement without limiting the geometrical shape.
(4) Compared with the existing method, the preparation method provided by the invention has the advantages of simpler and more convenient process, low cost, strong flexibility and controllability, high practicability and suitability for large-scale production.
Drawings
Fig. 1 is a structural view of super-hydrophilic copper having a sandwich structure in which an upper plate prepared in example 1 is a planar copper foil.
Fig. 2 is a structural diagram of super-hydrophilic copper with a sandwich structure in which the upper plate and the lower plate prepared in example 2 are symmetrical groove structures.
Fig. 3 is a structural diagram of the super-hydrophilic copper with a sandwich structure, in which the upper plate and the lower plate prepared in example 3 are of symmetrical groove structures and the pore size of the middle layer of copper foam is adjustable.
Reference numerals:
firstly, a plate is arranged; ② a nano copper-tin paste layer; thirdly, the plate is arranged; and fourthly, crystallizing the foamy copper.
Detailed Description
The description is to be regarded as illustrative and explanatory only and should not be taken as limiting the scope of the invention in any way. Furthermore, those skilled in the art can combine features from the embodiments of this document and from different embodiments accordingly based on the description of this document.
Example 1:
a preparation method of super-hydrophilic copper with a capillary effect and a sandwich structure comprises the following steps:
(1) according to parts by weight, 80 parts of copper powder with the average particle size of 400nm, 10 parts of ammonium chloride and 5 parts of deionized water are mixed and stirred uniformly, and then vacuum defoaming is carried out to form a viscous mixture for later use.
(2) And mechanically stamping the common copper foil to form a flat-bottom groove structure with a low middle part and high periphery as a lower plate. An outlet is reserved on the edge of the groove structure of the lower plate and is used as a gas channel or a liquid injection port.
(3) The sticky mixture is poured into the groove of the lower plate (r), the groove is completely filled, and the mixture is compacted and flattened (middle layer).
(4) Uniformly paving a thin nano copper paste layer around the upper surface of the lower plate (except the reserved outlet); the other plane copper foil (upper plate) with the same size and without stamping is horizontally placed right above the lower plate I, so that the plane copper foil and the lower plate I are completely overlapped together, the lower plate I, the middle layer and the upper plate together form a sandwich structure, and an outlet is reserved in the position of the upper plate III corresponding to the reserved outlet of the lower plate I.
(5) Putting the sandwich structure into a vacuum tube furnace filled with nitrogen and hydrogen protective gas, slowly heating to 350-360 ℃ at the speed of 8-10 ℃/min, and keeping for 1h to completely volatilize and sublimate water and ammonium chloride; continuously heating to 900-920 ℃ in a vacuum tube furnace, preserving heat for 1-2 hours, removing an oxide layer through reaction with hydrogen, and firmly connecting an upper plate and a lower plate through copper soldering paste; continuously heating to 1000-1020 ℃ in a vacuum tube furnace and preserving heat for 1h to fully recrystallize the foamy copper formed in the middle to obtain crystalline foamy copper; cooling to room temperature, and taking out to obtain the final product with capillary effect and sandwich structure of super hydrophilic copper, with a schematic structure diagram shown in figure 1.
Example 2:
a preparation method of super-hydrophilic copper with a capillary effect and a sandwich structure comprises the following steps:
(1) according to parts by weight, 80 parts of copper powder with the average particle size of 400nm, 10 parts of ammonium chloride and 5 parts of deionized water are mixed and stirred uniformly, and then vacuum defoaming is carried out to form a viscous mixture for later use.
(2) And mechanically stamping the common copper foil to form a flat-bottom groove structure with a low middle part and high periphery as a lower plate. An outlet is reserved on the edge of the flat-bottom groove structure of the lower plate and is used as a gas channel or a liquid injection port.
(3) Pouring a viscous mixture into the groove of the lower plate I, completely filling the groove, and compacting and flattening (an intermediate layer); a thin nano copper paste layer is uniformly laid on the periphery of the upper surface of the lower plate (except the reserved outlet).
(4) Similarly, a sticky mixture is poured into the groove of the other symmetrical and punched copper foil (the upper plate III), the groove is completely filled, compacted and flattened (the middle layer), an outlet is reserved at the position corresponding to the reserved outlet of the lower plate I, and then the lower plate I, the middle layer and the upper plate III are horizontally placed right above the lower plate I to be completely overlapped with the lower plate I, so that a sandwich structure is formed by the lower plate I, the middle layer and the upper plate III.
(5) Putting the sandwich structure into a vacuum tube furnace filled with nitrogen and hydrogen protective gas, slowly heating to 350-360 ℃ at the speed of 8-10 ℃/min, and keeping for 1h to completely volatilize and sublimate water and ammonium chloride; continuously heating to 900-920 ℃ in a vacuum tube furnace, preserving heat for 1-2 hours, removing an oxide layer through reaction with hydrogen, and firmly connecting an upper plate and a lower plate through copper soldering paste; continuously heating to 1000-1020 ℃ in a vacuum tube furnace and preserving heat for 1h to fully recrystallize the foamy copper formed in the middle to obtain crystalline foamy copper; cooling to room temperature, and taking out to obtain the final product with capillary effect and sandwich structure of super hydrophilic copper, with a schematic structure diagram shown in figure 2.
Example 3:
a preparation method of super-hydrophilic copper with a capillary effect and a sandwich structure comprises the following steps:
(1) according to parts by weight, 80 parts of copper powder with the average particle size of 400nm, 10 parts of ammonium chloride and 5 parts of deionized water are mixed and stirred uniformly, and then vacuum defoaming is carried out to form a viscous mixture W1.
(2) And mechanically stamping the common copper foil to form a flat-bottom groove structure with a low middle part and high periphery as a lower plate. An outlet (the periphery of the flat-bottom groove, namely the side face) is reserved at the edge of the flat-bottom groove structure of the lower plate and is used as a gas channel or a liquid injection port.
(3) Pouring a viscous mixture W1 into the groove of the lower plate I, completely filling the groove, and compacting and flattening (an intermediate layer); a thin nano copper paste layer is uniformly laid on the periphery of the upper surface of the lower plate (except the reserved outlet).
(4) Similarly, 80 parts by weight of copper powder with the average particle size of 400nm, 20 parts by weight of ammonium chloride and 5 parts by weight of deionized water are mixed and stirred uniformly, and then vacuum defoaming is carried out to form a viscous mixture W2; pouring a viscous mixture W2 into the groove of the other symmetrical and punched copper foil (upper plate III), completely filling the groove, compacting and flattening (middle layer), reserving an outlet at the position corresponding to the reserved outlet of the lower plate I, and then horizontally placing the lower plate I right above the lower plate I to completely overlap the lower plate I, so that the lower plate I, the middle layer and the upper plate III form a sandwich structure.
(5) Putting the sandwich structure into a vacuum tube furnace filled with nitrogen and hydrogen protective gas, slowly heating to 350-360 ℃ at the speed of 8-10 ℃/min, and keeping for 1h to completely volatilize and sublimate water and ammonium chloride; continuously heating to 900-920 ℃ in a vacuum tube furnace, preserving heat for 1-2 hours, removing an oxide layer through reaction with hydrogen, and firmly connecting an upper plate and a lower plate through copper soldering paste; continuously heating to 1000-1020 ℃ in a vacuum tube furnace and preserving heat for 1h to fully recrystallize the foamy copper formed in the middle to obtain crystalline foamy copper (IV), wherein the lower part of the crystalline foamy copper (IV) is small-aperture crystalline foamy copper, and the upper part of the crystalline foamy copper (IV) is large-aperture crystalline foamy copper; cooling to room temperature, and taking out to obtain the final product with capillary effect and sandwich structure of super hydrophilic copper, with a schematic structure diagram shown in figure 3.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011147623.3A CN112247152B (en) | 2020-10-23 | 2020-10-23 | A kind of preparation method of sandwich structure superhydrophilic copper foam with capillary effect |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011147623.3A CN112247152B (en) | 2020-10-23 | 2020-10-23 | A kind of preparation method of sandwich structure superhydrophilic copper foam with capillary effect |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112247152A true CN112247152A (en) | 2021-01-22 |
CN112247152B CN112247152B (en) | 2021-12-10 |
Family
ID=74263535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011147623.3A Active CN112247152B (en) | 2020-10-23 | 2020-10-23 | A kind of preparation method of sandwich structure superhydrophilic copper foam with capillary effect |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112247152B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7592655B2 (en) | 2022-01-14 | 2024-12-02 | 福田金属箔粉工業株式会社 | Copper porous sintered sheet and method for producing the same |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009049397A1 (en) * | 2007-10-19 | 2009-04-23 | Metafoam Technologies Inc. | Heat management device using inorganic foam |
CN102818467A (en) * | 2012-09-12 | 2012-12-12 | 锘威科技(深圳)有限公司 | Flat plate heating pipe and manufacturing method thereof |
CN105547026A (en) * | 2015-12-25 | 2016-05-04 | 江苏宏力光电科技股份有限公司 | Thermal column processing method |
CN110328367A (en) * | 2019-06-21 | 2019-10-15 | 延安速源节能科技有限公司 | A kind of preparation method of porous copper-based material |
CN110763061A (en) * | 2019-10-31 | 2020-02-07 | 东莞市合众导热科技有限公司 | A kind of soaking plate and its processing method |
CN111599693A (en) * | 2019-02-20 | 2020-08-28 | 中科院微电子研究所昆山分所 | a bonding method |
-
2020
- 2020-10-23 CN CN202011147623.3A patent/CN112247152B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009049397A1 (en) * | 2007-10-19 | 2009-04-23 | Metafoam Technologies Inc. | Heat management device using inorganic foam |
CN102818467A (en) * | 2012-09-12 | 2012-12-12 | 锘威科技(深圳)有限公司 | Flat plate heating pipe and manufacturing method thereof |
CN105547026A (en) * | 2015-12-25 | 2016-05-04 | 江苏宏力光电科技股份有限公司 | Thermal column processing method |
CN111599693A (en) * | 2019-02-20 | 2020-08-28 | 中科院微电子研究所昆山分所 | a bonding method |
CN110328367A (en) * | 2019-06-21 | 2019-10-15 | 延安速源节能科技有限公司 | A kind of preparation method of porous copper-based material |
CN110763061A (en) * | 2019-10-31 | 2020-02-07 | 东莞市合众导热科技有限公司 | A kind of soaking plate and its processing method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7592655B2 (en) | 2022-01-14 | 2024-12-02 | 福田金属箔粉工業株式会社 | Copper porous sintered sheet and method for producing the same |
Also Published As
Publication number | Publication date |
---|---|
CN112247152B (en) | 2021-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102901390B (en) | Composite capillary core with differential thermal coefficients for loop heat pipe and preparation method of composite capillary core | |
CN105177338A (en) | Preparation method for scale-adjustable nano porous metal material | |
CN104962771A (en) | Directional porous SiC and diamond reinforced Al base composite material and preparation method thereof | |
CN112317972B (en) | A low temperature rapid manufacturing method of unidirectional high temperature resistant welded joint | |
CN108188400A (en) | A kind of micro-nano twin-stage Porous Cu and preparation method thereof | |
CN102061431A (en) | Tungsten-copper composite material and preparation method thereof | |
CN117870426B (en) | A heat spreader with a laser sintered liquid wick structure and a preparation method thereof | |
CN112440025B (en) | Double-sided micro-nano composite preformed soldering lug for electronic device and low-temperature interconnection method | |
CN112247152B (en) | A kind of preparation method of sandwich structure superhydrophilic copper foam with capillary effect | |
CN109136618A (en) | A kind of preparation method of gradient foam aluminum material | |
CN110734295A (en) | Preparation method of aluminum nitride ceramic copper-clad plates | |
CN109112364A (en) | A kind of Aluminum Matrix Composites Strengthened by SiC used for electronic packaging and preparation method | |
TWI743945B (en) | Thin vapor chamber wick structure element and manufacturing method thereof | |
CN112382717A (en) | Thermoelectric device packaging interface and connecting method thereof | |
CN101726203B (en) | Manufacturing method of high porosity capillary structure | |
CN113758325A (en) | A VC radiator with built-in copper/diamond sintered liquid-absorbing core and preparation method thereof | |
CN103143714A (en) | Method for preparing Cu/MoCu/Cu three-layer composite plate blank | |
CN114953630A (en) | Porous interlayer self-packaging type liquid metal phase change interface material and preparation method and use method thereof | |
CN108213407A (en) | A kind of preparation method of the porous heating surface of function division | |
CN116532638B (en) | Tungsten copper composite material micro-channel radiator with tungsten framework structure and preparation method thereof | |
CN116061508A (en) | Diamond metal composite structure, heat conducting fin and preparation method thereof | |
CN101294776A (en) | Preparation method of heat pipe with porous aluminum core | |
CN116583086A (en) | Preparation method of high-heat-conductivity insulating copper/diamond composite material | |
CN116817648A (en) | Ceramic temperature equalizing plate and manufacturing method thereof | |
JP6497192B2 (en) | Heat dissipation fin using porous metal, heat sink and module mounted with the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Ren Zeming Inventor after: Ji Yuwei Inventor before: Ren Zeming Inventor before: Xue Mingshan |
|
GR01 | Patent grant | ||
GR01 | Patent grant |