200902928 六、發明說明： 【發明所屬之技術領域】 本發明係主要涉及一種以電化學方式應用於均熱板等散熱裝 置’可以低溫製成所需形狀的薄型化成品的高孔隙率毛細結 製法創新發明者。 a 【先前技術】 ^ 按’現今電子設備在要求高效能（如電腦設備、通訊設備等）、 高功率（如LED、液晶電視、電漿電視等）之需求下，對於散熱之 需求也越來越高，各種散熱技術也就應運而生。200902928 VI. Description of the Invention: [Technical Field] The present invention relates to a high-porosity capillary forming method for electrochemically applying a heat dissipating device such as a heat equalizing plate to a thinned product which can be formed into a desired shape at a low temperature. Innovative inventors. a [Prior Art] ^ According to the demand for high-performance (such as computer equipment, communication equipment, etc.) and high-power (such as LED, LCD TV, plasma TV, etc.), the demand for heat dissipation is increasing. The higher the heat dissipation technology comes into being.
^「熱管」具高熱傳導率、超靜音、結構簡單及多用途等特性 ，是目前廣泛應用之散熱技術，其原理係於密閉腔體内壁結合一 ，細結構層，在抽真空後注人工作流體，而其中間之空為 ，，流動之用；其操作係利用冷熱端之飽和蒸氣壓力差使熱端^ 蒸氣往冷端流動，使熱端之液體持續蒸發而吸收熱量，在冷凝端 放出熱量而凝結以達到快速傳熱之目的。上述工作 ^ : „細結構層再回流至蒸發段，達到持續之熱;：： 散熱效果。隨著糾轉增加，「鮮」的散熱效率逐漸 =使用’更雨導熱效率的「均熱板」（板式熱管）技術也就應運 目麟使_「鮮」及「均熱板」製造技術均仍有其 二、溝槽：於内表面形成同—方向的複數溝槽。毛細結構直 L徑=致’但其孔隙率無法提升。雖可薄型化但其散熱效果較 以ϋΐ結：將銅粉或銅網以高溫燒結之方式結合於表面以形 散熱效果佳但由於經過高溫熱處理使基本強度極低 狗古ΐ材”加。且毛細結構不从量產製程中 "^丨構郎質，因此紐有效㈣主導傳敎性 月匕之孔隙率孔徑大小，造成成品良莠不齊。 号…性 網i二ϊϊί:以擴散接合之方式結合銅板與銅粉或銅纖維 =經過㈣熱處理使基㈣度降低，不賴型化而使材料g 200902928 發泡:屬==1;、以;s二金屬為毛細結構體，其 且結銅結構體：其製程複雜而 須加熱至高溫而使基材軟化。4雜、設備科’且製程 七、運用光微影技術或是籍穷 :這種方法可以製造出均方法來製造金屬微結構 昂貴。 且被細的毛細結構，但是其製造成本 f 邮二ΐ半刻方法(ttlve Ι〇η 毛細結構毛細力強，但是使構：以此方法所形成的 製造的成本昂貴。 更用的材枓文+導體製程的限制，同時 薄型化之要Ϊ，’若欲達到高功率散熱且 【發明内容】 出了以解決上述缺點之新製程。 本發明之主要目的系 法’可於基材表面直_成 孔畴毛細結構之製造 化、低熱阻係數、高散執=孔隙率毛細結構，可達到結構薄变 ，一：以之;穩定、設 解決課題之技術手段： +良丰#夕重進步性者。 容器U㈡明係預先備製-可組成-中空密閉 填充電解液、於—電化學反應槽内 :置入電解液中’啟動電源即ifί接的基材： ，基材與後;，孔隙率毛細結構雜 空並注入I作流體；其中，而於其内部抽真 冷电基材可先與散熱鰭片接合再形成 200902928 毛，，可避免先形成高孔隙率毛細結構再接合散敖 了於尚溫造成毛細功能之喪失而降低不良率；其中，若二、 之於基Ξ之高孔隙率毛細結構體上再覆蓋-支撐柱形： 射成高孔_毛绿敎雜；其中，: tril】之組射經由電紅大悄整生搞需之組織。 造二 預備私序.如第1圖所示預先成型備製— 成一中空密閉容器10的容器基材n盘^(銅貝^可組合 基材12上可預先與散熱鰭片12A接合。'"材而其中盍板 π與㈣繼基材 蔽；如第3圖所示，設—電源3^二= 立先以絕緣材料20遮 溶液）的電化學反應槽40，將蓋板如2\填容充哭電^夜(频銅水 源30之負極32,而電源3〇jE^qi (令為基材11)連接電 11與蓋板基材12表面快逮生即可於容器基材 毛細結構體111、121如第4、q(图又张^層預疋厚度之高孔隙率 步在蓋板細所生成有高孔隙圖所示’進- 毛細:：序支撐圖Γ所怎構二 隙率 in -121 ，如第8圖所示，而於密閉容哭1〇 成—欲閉容器10 所構成的内部空間6〇抽真空並注人 1作^結構體11卜121 200902928 純金 施例所述形狀。 卄，、形狀不限疋於貫 或合Ϊ照本發明實施例所述，電解料體可為銅、錄、鱗純金屬 r ϋ 金屬:=篇=述’散熱鰭片可為銅、耗、鐵等純 用配===解液可為硫酸銅水溶液或其他常 電流===;;組;孔隙率毛細結㈣ ㈣如ΐΐϊί發明「高孔隙率毛細結構之製造法」，可直接π f二9電子元件上形成高孔轉毛細結構，制 程、步驟間早、加工簡易、快速及低成本之多重進步=皿衣 綜上所述’當知本發明具有產業上利用性盘生 明未見於任何刊物，亦具新穎性，#符合 > ^本兔 提出發明專利申請，懇請責審杳％ 見疋，羑依法 【圖式簡單朗】 細惠料利為禱。 第1圖:===可封裝組成密閉容器之容器基材 之 第2圖：ίίΓ於容器基材與蓋板基材上包覆絕緣材料 第3圖：係本發明電化學反應槽平面示意圖。 第4圖：於容器基材與蓋板基材上生成高孔隙率結 第5圖：^、本發明於蓋板基材駐支撐柱形狀絕緣母模示意 ϊίί”成ΐ孔隙率毛細結構體支撐柱示意圖。 第8圖：係本發明容器基材與蓋板基材封裝完示意圖 200902928 第9圖：係本發明之製造程序方塊圖。 【主要元件符號說明】 10... .密閉容器 11....容器基材 12....盖板基材 12A. ...散熱鰭片 m、121.... 南孔隙率毛細結構體 122.. ..尚孔隙率毛細結構體支撐柱 20....絕緣材料 21.·· .絕緣母模 30....電源 31..…正極 32... .負極 40....電化學反應槽 50....電解料體 60... .内部空間^ "Heat pipe" has the characteristics of high thermal conductivity, ultra-quiet, simple structure and multi-purpose. It is widely used in the heat dissipation technology. The principle is based on the inner wall of the closed cavity, a fine structure layer, and the work is done after vacuuming. The fluid, while the middle space is, for the flow; the operation is to use the saturated vapor pressure difference between the hot and cold ends to make the hot end steam flow to the cold end, so that the hot end liquid continues to evaporate to absorb heat, and the heat is released at the condensation end. Condensation to achieve rapid heat transfer. The above work ^: „The fine structure layer is reflowed to the evaporation section to achieve continuous heat;:: The heat dissipation effect. As the correction increases, the heat dissipation efficiency of “fresh” gradually becomes “using the soaking plate with the rainier heat conduction efficiency”. (Plate-type heat pipe) technology should also be used in the production of _ "fresh" and "soaked plate" manufacturing technology, there are still two, the groove: the same surface to form a plurality of grooves in the same direction. The capillary structure is straight L-path = cause 'but its porosity cannot be increased. Although it can be thinned, its heat-dissipating effect is more entangled: the copper powder or copper mesh is bonded to the surface by high-temperature sintering to form a good heat dissipation effect, but the basic strength is extremely low due to the high-temperature heat treatment. The capillary structure is not from the mass production process, and therefore, the effective (4) dominates the pore size of the crustality of the moon, causing the finished product to be mixed. No....Sexual network i 二ϊϊί: Combined by diffusion bonding Copper plate and copper powder or copper fiber = after (4) heat treatment, the base (four) degree is lowered, and the material g 200902928 is foamed: genus = =1;; s bis metal is a capillary structure, and the copper structure is : The process is complicated and needs to be heated to high temperature to soften the substrate. 4 Miscellaneous, Equipment Division and Process 7. Using Photolithography or Poor: This method can produce a uniform method to manufacture metal microstructures. And it is made of fine capillary structure, but its manufacturing cost f is a two-and-a-half method (ttlve Ι〇 毛 capillary structure is strong, but the structure: the manufacturing method formed by this method is expensive. +conductor process Limitation, at the same time, the need for thinning, 'If you want to achieve high power dissipation and [invention]] A new process to solve the above shortcomings. The main purpose of the present invention is to make the surface of the substrate straight and pore-like. Structure manufacturing, low thermal resistance coefficient, high dispersion = porosity capillary structure, can achieve structural thinning, one: with it; stable, set the technical means to solve the problem: + Liang Feng # 夕 重 progressive. Container U (2) Ming system pre-prepared - can be composed - hollow sealed filled electrolyte, in - electrochemical reaction tank: placed in the electrolyte 'starting power supply ie if the substrate:: substrate and after; porosity porosity structure miscellaneous Empty and inject I into a fluid; wherein, the inside of the cold-cooled substrate can be first joined with the heat-dissipating fins to form 200902928 hair, which can avoid the formation of high-porosity capillary structure and then the bonding is caused by the temperature. The loss of capillary function reduces the defect rate; wherein, if it is on the high porosity capillary structure of the base, it is covered again - supporting the column shape: shooting into a high hole _ hair green noisy; wherein: tril group Shooting through the electric red The organization of the need. The second preparation of the private sequence. As shown in Figure 1, the pre-formed preparation - the container substrate of a hollow closed container 10 n disk ^ (copper shell can be combined with the substrate 12 can be pre-heated fins 12A joint. '" material and wherein the 盍 π and (4) follow the substrate; as shown in Figure 3, the power supply 3 ^ two = first with the insulating material 20 to cover the solution of the electrochemical reaction tank 40, will The cover plate, such as 2\filling, is filled with crying electricity ^ night (the negative electrode 32 of the frequency copper water source 30, and the power supply 3〇jE^qi (for the substrate 11) is connected to the electric 11 and the surface of the cover substrate 12 can be quickly caught. In the container substrate capillary structure 111, 121 such as the fourth, q (the high porosity of the layer of the pre-thickness of the layer is formed in the high-porosity pattern of the cover sheet to form a high-porosity diagram) - capillary:: sequence support diagram Γ 构 构 构 in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in in 121 200902928 The shape of the pure gold example.卄, the shape is not limited to or according to the embodiment of the present invention, the electrolytic material body can be copper, recorded, scaled pure metal r ϋ metal: = article = description 'heat sink fin can be copper, consumption, Pure use of iron and other === solution can be copper sulphate aqueous solution or other constant current ===;; group; porosity capillary (4) (4) ΐΐϊ 发明 发明 「 「 「 制造 制造 制造 制造 制造 制造 制造 制造 高 高 高 高 发明 发明 发明 发明The formation of high-porosity to capillary structure on the second 9 electronic components, the process, the early steps, the simple processing, the rapid and the low-cost multiple advancement = the above mentioned in the case of the invention, the industrial use of the invention is not seen in Any publication, also novelty, #conformity> ^ Rabbit submitted a patent application for invention, 恳 责 责 疋 疋 疋 疋 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Fig. 1: === can package the substrate of the container constituting the closed container. Fig. 2: 包覆 Γ 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器 容器Figure 4: Formation of high porosity knots on the container substrate and the cover substrate. Figure 5: ^, the invention is applied to the cover substrate in the shape of the support column shape insulating mold ϊ ίί" into the porosity of the capillary structure support Fig. 8 is a schematic view showing the packaging of the container substrate and the cover substrate of the present invention. 200902928. Fig. 9 is a block diagram of the manufacturing procedure of the present invention. [Explanation of main components] 10... Closed container 11. ...container substrate 12....cover substrate 12A....heat fins m,121.... south porosity capillary structure 122... porosity porosity capillary support column 20 ....Insulation material 21.·· .Insulation master 30....Power supply 31.....Positive 32....Negative electrode 40..Electrochemical reaction tank 50....Electrolyte body 60. .. . interior space