TWI578140B - Substrate module dissipating heat by phase transformation - Google Patents

Description

Substrate module for dissipating heat by phase change

The present invention relates to a substrate module, and more particularly to a substrate module having a phase change fluid.

Referring to FIG. 1A and FIG. 1B , the conventional aluminum substrate module 10 is composed of a substrate 11 , an insulating layer 12 and a conductive layer 13 . The aluminum substrate module 10 is formed by first forming an oxide layer (alumina layer) by hard-anodizing the aluminum substrate, and then bonding the epoxy layer to the oxide layer to form the insulating layer 12. The conductive layer 13 is formed by re-gluing a copper foil. In addition, the LED module 16 can be disposed on the insulating layer 12, and the LED module 16 conducts heat to the heat absorbing end 11A of the substrate 11, and then passes from the heat absorbing end 11A to the heat dissipating end 11B of the substrate 11, and the heat of the heat dissipating end 11B. After being transferred to the thermal grease layer 14, the heat dissipation fins 15 are finally used to achieve the heat dissipation effect, but the more heat conduction medium, the less heat that the heat dissipation fins 15 can dissipate, and the thermal conductivity of the thermal grease layer 14 The heat collecting ability is poor, so that the overall heat dissipation effect is not good, so that the temperature of the insulating layer 12 cannot be rapidly lowered, thereby affecting the service life of the LED module 16. Moreover, the heat sink fin 15 is bulky and heavy, and is not suitable for being set to a thin device (for example, a notebook computer or a tablet computer).

Therefore, how to design an aluminum substrate module, which has high heat dissipation efficiency and thin volume, is worthy of consideration by those who have ordinary knowledge in the field.

The invention provides a substrate module, which can improve the heat dissipation efficiency of the substrate module and has a light and thin volume.

The present invention provides a substrate module that is adapted to be disposed on a heat source for dissipating heat to a heat source. The substrate module includes a substrate, an insulating layer and at least one conductive layer, and the insulating layer is disposed on the substrate. The heat absorbing end is disposed on the insulating layer. The substrate has a heat absorbing end and a heat dissipating end, and the inside of the substrate is sealed with an accommodating space, and the inner wall surface of the accommodating space is coated with a capillary structure, the capillary structure comprises a plurality of grooves, and the plurality of grooves The slot is coated with a sintered layer. Moreover, there is a working fluid in the accommodating space. When the heat generated by the heat source is absorbed by the working fluid, the working fluid will change from the liquid to the gas, and the gaseous working fluid will flow to the heat radiating end.

In the above substrate module, the substrate may be made of aluminum.

In the above substrate module, the substrate may be made of copper.

In the above substrate module, a plurality of drainage columns are disposed in the accommodating space, and the drainage column is connected between the heat absorbing end and the heat dissipation end of the substrate. Moreover, the surface of the drainage column has, for example, a plurality of grooves.

In the above substrate module, the drainage column is made of copper powder or made of aluminum.

In the above substrate module, the sintered layer is sintered from copper powder.

In the above substrate module, a heat pipe is included, wherein the heat pipe is disposed at a heat dissipation end of the substrate.

In the present invention, when the heat source generates heat, the inside of the substrate module The working fluid can absorb a large amount of heat by phase change and utilize the capillary structure to achieve a good circulation effect. Therefore, no bulky heat dissipation fins can be added to the substrate module, thereby reducing the space occupied by the whole.

The above described features and advantages of the present invention will be more apparent from the following description.

Please refer to FIG. 2A and FIG. 2B . FIG. 2A illustrates a substrate module according to an embodiment of the present invention, and FIG. 2B is a schematic diagram of operation of the substrate module. The aluminum substrate module 20 includes a substrate 21, an insulating layer 22, and a conductive layer 23. The conductive layer 23 is electrically connected to the contact end 261 of the LED module 26, and the conductive layer 23 and the contact end 261 are disposed. The method can be adjusted by those skilled in the art. The bottom surface of the LED module 26 is in contact with the insulating layer 22. The waste heat generated by the LED module 26 is transmitted to the substrate 22 and the substrate 21 to external environment. In addition, an accommodating space 213 is sealed in the inner surface of the substrate 21, and a surface of the inner wall of the accommodating space 213 is coated with a capillary structure, which is a sintered layer 212, which is sintered by using copper powder, and There is also a working fluid 214 in the accommodating space 213, and the working fluid 214 is, for example, pure water. In FIG. 2B, the direction of the arrow represents the flow direction of the working fluid 214. When the substrate 21 is used for heat dissipation, the heat absorbing end 21A of the substrate 21 receives the heat of the insulating layer 22, so that the working fluid 214 located therein absorbs the heat therein and evaporates into a gas. At this time, the working fluid 214 flows into the heat dissipating end 21B in the accommodating space 213 due to the pressure difference. jobs The fluid 214 is cooled and condensed at the heat dissipating end 21B and then enters the pores of the sintered layer 212, and then is returned to the endothermic end 21A by the capillary force of the sintered layer 212 to complete the entire cycle.

The sintered layer 212 described above may also be replaced with a metal mesh or, for example, a plurality of metal meshes may be stacked to form a capillary structure. The metal mesh not only helps the working fluid 214 to flow within its mesh structure, but is itself a metallic material (such as copper or aluminum), which also increases the thermal conductivity.

It can be seen from the above that when the LED module 26 is operated, the working fluid 214 inside the substrate 21 can absorb a large amount of heat by phase change, so that the substrate 21 has a good heat dissipation effect, and further can dissipate heat of the substrate module 20. The efficiency is greatly improved. Please compare FIG. 1A and FIG. 2A. Since the substrate module 20 has a good heat dissipation effect, in this embodiment, the bulk heat dissipation fins 15 need not be added as needed to help dissipate heat, thereby reducing the substrate module. 20 The volume occupied in an electronic device.

Please refer to FIG. 3A. FIG. 3A illustrates a substrate module 30 according to still another embodiment of the present invention. In the accommodating space 313 of the substrate 31 of the present embodiment, a plurality of drainage columns 315 are also disposed in comparison with the substrate 21 shown in FIG. 2B. The drainage column 315 is also sintered by copper powder, and is also a capillary structure. For example, the working fluid 214, which is available in a liquid form, flows in the drainage column 315. The drainage columns 315 are connected between the heat absorbing end 31A of the substrate 31 and the heat dissipation end 31B of the substrate 31. In FIG. 3A, the direction of the arrow represents the flow direction of the working fluid 214, as seen by the flow direction of the working fluid 214, through which the working fluid 214 can be returned to the endothermic end 31A, In this way, the reflow speed of the working fluid 214 can be accelerated, thereby improving the heat dissipation efficiency of the substrate module 30. In addition to increasing the heat dissipation efficiency of the substrate module 30, the structure of the substrate 31 itself is not high (mainly made of aluminum), and the drainage column 315 can also exert the effect of supporting the structure of the substrate 31, so that the substrate 31 is subjected to an external force. It is not easy to produce deformation.

In addition, when the substrate module 30 is manufactured, the drain column 315 is first formed, and then inserted into a socket (not shown) of the sintered layer 212 by the jig. Wherein, the drainage column 315 and the jack are combined in a tightly fitting manner, so that in addition to being able to firmly fix the drainage column 315 on the jack, the drain column 315 can be brought into contact with the jack. The structure produces microscopic damage, allowing the working fluid 214 to flow more smoothly between the sintered layer 212 and the drainage column 315. In FIG. 3B, FIG. 3B illustrates a substrate module 30' according to still another embodiment of the present invention. Compared with the drainage column 315 shown in FIG. 3A, the drainage column 415 of the substrate 31" in FIG. 3B is It is made of aluminum and has a plurality of grooves 415a on its surface. It is known to those skilled in the art that the heat dissipation efficiency of the aluminum substrate module 30' can be improved.

Referring to FIG. 4A, FIG. 4A illustrates a substrate module 40 according to another embodiment of the present invention. In the aluminum substrate module 40 of the present embodiment, the substrate 41 is compared with the substrate module 20 of FIG. 2B. The inner sidewall is not formed with the sintered layer 212, but is formed with a plurality of grooves 47, which are also one of the capillary structures, so that the grooves 47 can also help the liquid working fluid 214 to flow therein. Thereby, a good cycle is formed, and the overall heat dissipation efficiency of the substrate module 40 is effectively increased. In the substrate module 40' of Fig. 4B, a sintered layer 212 is further coated on the trench 47 of the substrate 41', which is conventional in the art. The knowledgeable person should be aware that the heat dissipation efficiency of the aluminum substrate module 40' can be improved. In the substrate module 40" of FIG. 4C, a plurality of rectangular grooves 47' are formed on the inner side wall of the substrate 41", and the rectangular grooves 47' can also help the liquid working fluid 214 to flow therein, increasing The heat dissipation efficiency of the substrate module 40 ′′ is not provided. In the above embodiment, no heat dissipation fins or other heat dissipation devices are disposed on the substrate module, but the heat dissipation end of the substrate module 20 may also be selected according to the situation. The heat dissipation device is provided. Please refer to FIG. 5 , which illustrates a substrate module 50 according to another embodiment of the present invention. The substrate module 50 of the present embodiment includes a substrate module 50 of the present embodiment. The heat pipe 55, wherein the heat pipe 55 is mounted on the substrate 51, a heat dissipation paste layer 54 is first attached to the bottom of the heat pipe 55, and the heat dissipation paste layer 54 and the heat dissipation end of the substrate 51 are further provided together with the heat dissipation fins 55. 21B is bonded to each other, whereby the heat dissipation efficiency of the substrate module 20 can be further improved by the heat pipe 55. In addition, since the substrate 51 has a good heat dissipation effect, the heat pipe 55 can be configured to help. The heat dissipation can improve the overall heat dissipation of the substrate module 50.

In the above substrate module, the substrate is mostly made of aluminum, so the substrate module can also be referred to as an aluminum substrate module. However, the substrate can also be replaced with other materials such as copper or thermally conductive plastic.

In summary, when the substrate of the present invention is in operation, the working fluid inside can absorb a large amount of heat by phase change, so the substrate has a good heat dissipation effect, and the heat dissipation effect of the substrate module is greatly improved. And there is a lighter and thinner volume. In addition, the substrate module of the present invention can be applied to a variety of heat sources, such as switching regulators, CPUs, inverters, and the like.

Although the present invention has been disclosed above in the preferred embodiment, it is not intended to be used The scope of the present invention is defined by the scope of the appended claims, and the scope of the invention is defined by the scope of the appended claims. Subject to it.

<Prior technology>

14‧‧‧ Thermal paste layer

15‧‧‧ Heat sink fins

16‧‧‧heat source

10‧‧‧Aluminum substrate module

11‧‧‧Substrate

11A‧‧‧Heat end

11B‧‧‧heating end

12‧‧‧Insulation

13‧‧‧ Conductive layer

<Embodiment>

26‧‧‧heat source

261‧‧‧Contact end

20, 30, 30', 40, 40', 40", 50‧‧‧ substrate modules

21, 31, 31', 41, 41', 41", 51‧‧‧ substrates

21A‧‧‧Heat end

21B‧‧‧heat side

22‧‧‧Insulation

23‧‧‧ Conductive layer

212‧‧‧Sintered layer

213‧‧‧ accommodating space

214‧‧‧Working fluid

315, 415‧‧‧ drainage column

415a‧‧‧ trench

47, 47’ ‧ ‧ trench

55‧‧‧heat pipe

54‧‧‧ Thermal paste layer

FIG. 1A is a perspective view of a conventional substrate module.

FIG. 1B is a schematic diagram showing the operation of a conventional substrate module.

2A is a perspective view of a substrate module according to an embodiment of the present invention.

FIG. 2B is a schematic diagram showing the operation of a substrate module according to an embodiment of the invention.

FIG. 3A illustrates a substrate module according to another embodiment of the present invention.

FIG. 3B illustrates a substrate module according to another embodiment of the present invention.

FIG. 4A illustrates a substrate module according to another embodiment of the present invention.

FIG. 4B illustrates a substrate module according to another embodiment of the present invention.

FIG. 4C illustrates a substrate module according to another embodiment of the present invention.

FIG. 5 illustrates a substrate module according to another embodiment of the present invention.

26‧‧‧LED module

261‧‧‧Contact end

20‧‧‧Substrate module

21‧‧‧Substrate

21A‧‧‧Heat end

21B‧‧‧heat side

22‧‧‧Insulation

23‧‧‧ Conductive layer

Claims (8)

A substrate module comprising: a substrate having a heat absorbing end and a heat dissipating end, wherein the substrate is internally sealed with an accommodating space; an insulating layer disposed on the heat absorbing end of the substrate; a conductive layer is disposed on the insulating layer; wherein the substrate further comprises: a capillary structure disposed on an inner wall surface of the accommodating space of the substrate, the capillary structure comprising a plurality of grooves, and the number a trench is coated with a sintered layer; and a working fluid is filled in the accommodating space of the substrate, and when the heat generated by the heat source is absorbed by the working fluid, the working fluid changes from the liquid The gas is formed into a gas, and the working fluid in the form of a gas flows toward the heat radiating end. The substrate module of claim 1, wherein the substrate is made of aluminum. The substrate module of claim 1, wherein the substrate is made of copper. The substrate module of claim 1, wherein a plurality of drainage columns are disposed in the accommodating space, and the drainage column is connected between the heat absorbing end of the substrate and the heat dissipation end of the substrate. The substrate module of claim 4, wherein the drainage column is made of aluminum, and the drainage column has a plurality of grooves on a surface thereof. The substrate module of claim 4, wherein the reference The flow column is sintered from copper powder. The substrate module of claim 1, wherein the sintered layer is sintered from copper powder. The substrate module of claim 1, further comprising a heat pipe, wherein the heat pipe is disposed at a heat dissipation end of the substrate.