TWI743945B - Thin vapor chamber wick structure element and manufacturing method thereof - Google Patents

Abstract

A thin vapor chamber wick structure element includes a first metal sheet and a wick structure layer. The first metal sheet has a groove structure. The wick structure layer is formed in the groove structure, and the wick structure layer has a first wick structure area and a second wick structure area. The first wick structure area consists of spherical-like copper members with the first particle size distribution and chain-like copper members; and the second wick structure area includes a spherical-like copper members with a second particle size distribution and chain-like copper members. The first particle size is larger than second particle size. The thin vapor chamber wick structure element of the present invention includes two different wick structures, thereby improving the efficiency of the liquid phase and the gas phase circulation of the working fluid and heat conduction capability in the thin vapor chamber.

Description

Thin-type temperature equalizing plate capillary structure element and manufacturing method thereof

The invention relates to a thin-type uniform temperature plate capillary structure element, especially a thin-type uniform temperature plate capillary structure element with a porous capillary structure, which is used for sealing and processing with another metal sheet to form a thin uniform temperature plate.

The temperature equalizing plate is used for dissipating heat and cooling, and it is a flat closed cavity. The inner wall of the closed cavity has a capillary structure and contains a working fluid. The working principle of the equalizing plate is that when part of the equalizing plate is in contact with the heat source, the working fluid near the Evaporator in the closed cavity of the equalizing plate will absorb the heat energy of the heat source and cause it to boil and change from liquid phase to liquid phase. The gas phase releases latent heat and flows quickly to the condenser. When the working fluid in the gas phase flows to the condensing end away from the heat source in the closed cavity, the working fluid changes from the gas phase to the liquid phase, and flows back to the heat absorption end by the capillary force of the capillary structure. Through the phase change and conduction of the above-mentioned working fluid, the uniform temperature plate achieves the function of heat dissipation and cooling of the hot spot.

In this regard, the common copper mesh of the prior art is used as a capillary structure, and the capillary structure is simple, resulting in insufficient capillary force and poor heat dissipation function. Even if the Copper Moven Mesh was later developed as a new option to enhance capillary force, the processes of weaving, cutting, manual laying, and pressing of graphite jigs of copper mesh still made the capillary structure more complex. Hybrid and unfavorable for automated operations on mass production. On the other hand, when the thickness of the uniform temperature plate element is thinner, the density of the capillary voids of the copper mesh in the process of pressing and other processes is loosened, resulting in insufficient capillary force. Therefore, when the capillary structure in the cavity of the uniform temperature plate is actuated by the working fluid, Insufficient flow efficiency results in poor heat dissipation efficiency.

Therefore, how to make the working fluid in the capillary structure of the ultra-thin uniform temperature plate, the liquid phase transportation in the horizontal direction and the vertical upward vaporization transportation at the heating end are optimized. It is an extremely need to solve the problem of making a high-efficiency ultra-thin uniform temperature plate. The subject. Therefore, there is a need in the art for a capillary structure for an ultra-thin uniform temperature plate that can replace the copper mesh.

In view of this, the capillary structure element of the thin-type uniform temperature plate of the present invention is arranged in the groove structure on the surface of the first metal sheet of two different capillary structures. The capillary structure elements of the temperature equalization plate formed by two different capillary structures produce different vertical vaporization capacity and horizontal liquid transport capacity, which improves the liquid and gas phase of the working fluid in the thin equalization plate. The efficiency of phase circulation further enhances the heat dissipation and heat conduction functions of the thin uniform temperature plate.

One category of the present invention is to provide a thin vapor chamber (Vapor Chamber) capillary structure element for sealing and processing with a second metal sheet to form a thin vapor chamber. The capillary structure element of the thin-type uniform temperature plate includes a first metal sheet and a capillary structure layer. The first metal sheet has a groove structure. The capillary structure layer is formed in the groove structure, and the capillary structure layer further has a first capillary structure and a second capillary structure. The first capillary structure includes N first-type spherical copper members with a first average particle size distribution and P chain-shaped copper members connected to each other to form a porous structure. The second capillary structure includes M second-type spherical copper members with a second average particle size distribution and Q chain-shaped copper members connected to each other to form a porous structure. The first capillary structure is located on the thin uniform temperature plate In the endothermic zone of the element, the first average particle size is greater than the second average particle size, M>N and Q>P, and M, N, P, and Q are all natural numbers. Among them, the first type of spherical copper members account for more than 50% of the weight of the first capillary structure, and the second type of spherical copper members account for more than 30% of the weight of the second capillary structure. The second capillary structure accounts for more than 70% of the weight of the capillary structure layer. In the first capillary structure and the second capillary structure with the same volume, the number of the second type of spherical copper members is greater than the number of the first type of spherical copper members.

Wherein, the first average particle size and the second average particle size are both larger than the average diameter of the chain-shaped copper member. The first metal sheet includes at least one of copper, copper alloy, copper-plated stainless steel, titanium, and titanium alloy.

Wherein, the first capillary structure and the second capillary structure are continuous structures, and the second capillary structure is located in a non-heat absorption area of the temperature equalizing plate element.

Another category of the present invention is to provide a method for manufacturing a thin-type uniform temperature plate capillary structure element, which includes the following steps: providing a first metal sheet having a groove structure, wherein the groove structure has a first region and a second Two areas. A first slurry and a second slurry are provided. The first slurry includes a first organic solvent, a first polymer, a first type spherical copper powder with a first average particle size distribution, and a copper Oxide powder. The second slurry includes a second organic solvent, a second polymer, and a second type spherical copper powder with a second average particle size distribution and a copper oxide powder. The first average particle size Greater than the second average particle size. Lay the first slurry on the first area. Lay the second slurry on the second area. The first slurry is heated to volatilize the first organic solvent, crack the first polymer, and sinter the first type of spherical copper powder and copper oxide powder to form a first capillary structure. The second slurry is heated to volatilize the second organic solvent, crack the second polymer, and sinter the second type of spherical copper powder and copper oxide powder to form a second capillary structure. Among them, the first capillary structure and the second capillary structure are continuous structures, and the first area is a heat absorption area of the uniform temperature plate element.

The step of heating the first slurry and the step of heating the second slurry are simultaneously performed under the same polymer cracking and powder sintering process conditions.

Among them, the copper oxide powder is copper oxide powder or cuprous oxide powder.

The step of heating the first slurry further includes the following sub-steps of heating and volatilizing the first slurry. Thermal cracking of the first polymer. The second type of spherical copper powder and copper oxide powder are sintered at a high temperature in a nitrogen-hydrogen mixed atmosphere to form a first capillary structure.

Another category of the present invention is to provide a thin-type uniform temperature plate capillary structure element, which is applied to a uniform temperature plate element, which includes a first metal sheet, a first capillary structure, and a second capillary structure. The first metal sheet has a groove structure, and the groove structure has a first area and a second area. The first capillary structure is arranged in the first area. The second capillary structure is arranged in the second area. Wherein, the first area is used as one of the heat absorption areas of the temperature equalizing plate element, and the average pores of the first capillary structure are larger than the average pores of the second capillary structure. Wherein, the first capillary structure and the second capillary structure are continuous structures, and the second capillary structure is located in a non-heat absorption area of the temperature equalizing plate element.

Among them, the thickness of the uniform temperature plate element is less than 1.0mm; the thickness of the first metal sheet is less than 0.1mm; the thickness of the first capillary structure is less than 0.3mm; the thickness of the second capillary structure is less than 0.3mm.

Among them, the first capillary structure is formed by the heating process of the first slurry, the first slurry contains the first type of spherical copper powder; the second capillary structure is formed by the second slurry through the heating process, and the second The slurry contains the second type of spherical copper powder and copper oxide powder.

Wherein, the first slurry further includes a colloid formed by mixing a first organic solvent and a first polymer, and the second slurry further includes a colloid formed by mixing a second organic solvent and a second polymer. The heating The process includes a drying process, a cracking process, and a sintering process, and the sintering process It is carried out in a mixed atmosphere of nitrogen and hydrogen.

Another category of the present invention is to provide a method for manufacturing the capillary structure element of the thin uniform temperature plate, which is applied to the production of the capillary structure included in the uniform temperature plate element. The manufacturing method includes the following steps: providing a first metal sheet with a trench structure, wherein the trench structure has a first region and a second region; providing a first slurry containing a first copper powder, and containing copper oxide Powder second slurry; laying the first slurry on the first area; laying the second slurry on the second area; curing the first slurry to make it a first solidified body; solidifying the second slurry to make it A second cured body; heating the first cured body to form a first capillary structure located in the first area; and heating the second cured body to form a second capillary structure located in the second area. Among them, the first area is used as one of the heat absorption areas of the uniform temperature plate element.

Wherein, the second slurry also contains a second copper powder. The average particle size (D50) of the first copper powder is larger than the average particle size of the second copper powder; the average particle size of the second copper powder is larger than the average particle size of the copper oxide powder. The copper oxide powder is selected from the group consisting of copper oxide powder, cuprous oxide powder and tetra copper oxide powder.

Furthermore, the first slurry further includes a first colloid formed by mixing the first organic solvent and the first polymer, and the first copper powder is uniformly mixed in the first colloid. The second slurry also includes a second colloid formed by mixing a second organic solvent and a second polymer, and the copper oxide powder is uniformly mixed in the second colloid.

Wherein, the step of heating the first solidified body further includes the following sub-steps: cracking and eliminating the first polymer in the first solidified body; and sintering the first copper powder in the first solidified body under a nitrogen-hydrogen mixed atmosphere A first capillary structure located in the first area is formed.

Wherein, the step of heating the second solidified body further includes the following sub-steps Step: cracking and eliminating the second polymer in the second solidified body; and sintering the copper oxide powder in the second solidified body under a nitrogen-hydrogen mixed atmosphere to form a second capillary structure located in the second region.

In the conventional powder sintered capillary structure technology, there is a single capillary structure in the entire temperature equalizing plate or heat transfer tube. The thin-type equalizing plate capillary structure element of the present invention provides two sintered capillary structures with different particle size distributions. The pores of the capillary structure are different. The first capillary structure with larger pores facilitates the liquid phase working fluid to evaporate into the gas phase, and the second capillary structure with smaller and denser pores facilitates the flow of the liquid phase working fluid. The use of the thin uniform temperature plate composed of the present invention can increase the circulation efficiency of the liquid phase and gas phase of the working fluid, thereby improving the anti-heat and heat conduction functions of the thin uniform temperature plate. In particular, the capillary structure of the prior art is composed of copper mesh or copper powder sintering. The capillary structure of the present invention is formed by two slurries composed of copper powder and copper oxide powder of different average particle sizes or materials. The two different capillary structures. As a result, the design can be more flexible, and more efficiently mass-produce thin capillary structure elements containing capillary structures.

V: Thin-type uniform temperature plate

1: Thin-type uniform temperature plate capillary structure element

11: The first metal sheet

111: upper surface

112: groove structure

1121: The first area

1122: second area

12: Capillary structure layer

121: The first capillary structure

1211: The first type of spherical copper components

1212: The first chain-shaped copper member

122: second capillary structure

1221: The second type of spherical copper components

1222: The second chain-shaped copper member

61: The first slurry

610: The first type of spherical copper powder

612: The first copper oxide powder

62: second slurry

620: The second type of spherical copper powder

622: The second copper oxide powder

21: The second metal sheet

3: Vacuum chamber

41: Endothermic

42: Condensing side

5: Airflow channel

H: heat source

S1-S52: steps

S411-S412: Step

S421-S422: steps

FIG. 1A is a top view of a thin capillary structure element of a temperature equalizing plate according to an embodiment of the present invention.

Fig. 1B is a cross-sectional view of the capillary structure element of the thin-type uniform temperature plate taken along the AA' line in the specific embodiment of Fig. 1A according to the present invention.

FIG. 2 is a schematic diagram showing the circulation of the working fluid of the thin-type uniform temperature plate according to an embodiment of the present invention.

FIG. 3 is a flow chart showing the steps of a manufacturing method of a thin-type uniform temperature plate capillary structure element according to a specific embodiment of the present invention.

4 is a flow chart showing the steps of a method for manufacturing a thin-type uniform temperature plate capillary structure element according to another embodiment of the present invention.

FIG. 5 is a schematic diagram drawn according to the flow of FIG. 4.

FIG. 6 is a flowchart illustrating the steps of a method for manufacturing a thin-type uniform temperature plate capillary structure element according to another specific embodiment of the present invention.

FIG. 7 is a schematic diagram drawn according to the flow of FIG. 6.

FIG. 8 is a flow chart of the manufacturing method of the capillary structure element of the thin-type uniform temperature plate according to another specific embodiment of the present invention.

FIG. 9 is a schematic diagram drawn according to the flow of FIG. 8.

FIG. 10A is a flowchart showing the sub-steps of step S41 according to a specific embodiment of the present invention.

FIG. 10B is a flowchart showing the sub-steps of step S42 according to a specific embodiment of the present invention.

FIG. 11A is a schematic diagram of the first capillary structure after sintering according to an embodiment of the present invention.

FIG. 11B is a schematic diagram of the second capillary structure after sintering according to an embodiment of the present invention.

12 is a schematic diagram showing the appearance of a single first cuprous oxide crystal powder sintering process through reduction and diffusion reactions to form a chain-shaped copper component according to a specific embodiment of the present invention.

In order to make the advantages, spirit and characteristics of the present invention easier and clearer to understand, the following will use specific embodiments and refer to the accompanying drawings for detailed and discussion. It should be noted that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. again, Each device in the figure is only used to express its relative position and is not drawn according to its actual scale, so it is explained first.

Please refer to FIG. 1A and FIG. 1B. FIG. 1A is a top view of a thin-type uniform temperature plate capillary structure element according to an embodiment of the present invention. Fig. 1B is a cross-sectional view of the capillary structure element of the thin-type uniform temperature plate along the section line A-A' in a specific embodiment of Fig. 1A according to the present invention. For ease of description, the subsequent drawings are drawn in accordance with the cross-sectional method of the A-A' cross-sectional line in FIG. 1A. As shown in FIG. 1A and FIG. 1B, the thin-type uniform temperature plate capillary structure element 1 of the present invention includes a first metal sheet 11 and a capillary structure layer 12. The first metal sheet 11 has an upper surface 111, and the upper surface 111 has a groove structure 112. The trench structure 112 can be roughly divided to have a first area 1121 and a second area 1122. The first capillary structure 121 is disposed in the first area 1121 and the second capillary structure 122 is disposed in the second area 1122.

Among them, the first capillary structure 121 and the first area 1121 are located in one of the heat-absorbing areas (Evaporator) of the thin-type uniform temperature plate element, and the second capillary structure 122 and the second area 1122 are located in one of the non-heat-absorbing areas of the thin-type uniform temperature plate element. The non-endothermic area means the area that does not touch the heat source, including the condensation area (Condenser) or the adiabatic area (adiabatic). The first capillary structure 121 in the first region 1121 is composed of N first-type spherical copper members 1211 with a first particle size distribution and P first chain-shaped copper members 1212 interconnected to form a porous structure. The first capillary structure 121 and the second capillary structure 122 are continuous structures, and the continuous structure of the first capillary structure 121 and the second capillary structure 122 can further achieve the action of liquid-gas circulation.

Specifically, the capillary structure layer 12 located in the trench structure 112 includes a first capillary structure 121 and a second capillary structure 122. The first capillary structure 121 further includes a porous structure formed by connecting N first-type spherical copper members 1211 and P first chain-shaped copper members 1212 with the first particle size distribution. The second capillary structure 122 includes M second particles with a second particle size distribution The spherical copper member 1221 and Q second chain-shaped copper members 1222 are connected to each other to form a porous structure. Wherein, the average particle diameter (D50) of the N first-type spherical copper members 1211 with the first particle size distribution in the first capillary structure is larger than the M second-type spherical copper members with the second particle size distribution in the second capillary structure The average particle size (D50) of the member 1221. Among them, M>N; Q>P; M, N, P, Q are natural numbers.

Please refer to FIG. 2 in combination. FIG. 2 is a schematic diagram illustrating the circulation of the working fluid of the thin-type uniform temperature plate according to an embodiment of the present invention. The thin plate has a vacuum chamber 3 formed between the first metal sheet 11 and the second metal sheet 21. The vacuum chamber 3 serves as an air flow channel 5, and a working fluid is contained in the capillary structure layer 12 . The working fluid transfers heat energy in the way of boiling, evaporation and condensation cycle, and then achieves the effect of rapid heat conduction. As shown in FIGS. 1 to 2, the trench structure 112 can be divided into a first area 1121 and a second area 1122. In most embodiments, the first area 1121 and the second area 1122 are not obtained by vertical division, but by horizontal division. Among them, the first area 1121 is located at the heat-absorbing end 41 of the thin-type uniform temperature plate, that is, the end close to the heat source H. The second area 1122 is an area other than the first area 1121, and it may also be located at the condensation end 42 of the thin-type uniform temperature plate, that is, the end far away from the heat source H. The capillary structure force of the capillary structure layer helps the working fluid to flow in the capillary structure layer. The operating mode of the working fluid on the capillary structure layer 12 is described in detail in the following description.

The point that contacts the heat source H extends to the surroundings and is called a heat-absorbing end 41. The heat-absorbing end 41 extends outward from the point where it contacts the heat source H, and accounts for about 5-30% of the area of the upper surface 111. Other areas, such as the adiabatic zone and the condensation end 42, account for about 70-95% of the area of the upper surface 111. The upper surface 111 of the condensing end 42 is calculated from the place farthest away from the heat absorbing end 41.

The working fluid boils in the vertical direction of the first capillary structure 121 in the form of a liquid phase, and a thin water film is formed on the surface of the first-type spherical copper member 1211 on the upper layer, and evaporates to form a gas-phase working fluid. The surface of the first type spherical copper member 1211 with larger particle size is easier to form a large area The thin water film reduces the thermal resistance of the phase change from the liquid phase to the gas phase. However, the second capillary structure 122 in the second region 1122 is composed of a second type of spherical copper member 1221 and a second chain-shaped copper member 1222 mixed with smaller particle diameters. Such a stacked structure of the porous capillary structure layer 12 is conducive to the rapid delivery of the working fluid in the horizontal direction. However, if the second capillary structure 122 is located at the heating end, since the second type of spherical copper member 1221 has a small particle size, it will not be conducive to the formation of a large-area thin water film and reduce the phase change thermal resistance of the liquid phase to the gas phase. Therefore, in the present invention, the first capillary structure 121 is used to replace the second capillary structure 122 at the heat absorption end 41, so that the capillary structures in two different regions can each perform their own advantages of different functions, thereby optimizing the working fluid in the thin uniform temperature plate element. Liquid and gas circulation. Please refer to the arrow indication in Figure 2. The arrow is the moving direction of the working fluid. When the working fluid is in the first region 1121, after the working fluid absorbs the heat energy of the heat source H from the heat absorption end 41, the working fluid changes from the liquid phase to the gas phase. Then, the working fluid in the gas phase moves toward the second area 1122 in the airflow channel 5, and the working fluid emits heat to the external environment on the way. The working fluid after the heat release changes from the gas phase to the liquid phase and condenses at the condensation end 42. Then, the working fluid returns to the heat-absorbing end 41 of the first region 1121 through the continuous and porous capillary structure. In this way, the working fluid forms a complete heat conduction method in the vacuum cavity 3, thereby achieving a rapid heat dissipation effect.

In detail, when the working fluid absorbs the heat energy transferred from the heat source H to the heat-absorbing end 41 of the thin uniform temperature plate V, the working fluid transforms from the liquid phase to the gas phase, and moves vertically from the first capillary structure 121 to the capillary structure 12 and The air flow channel 5 between the second metal sheets 21. Then, the working fluid in the gas phase flows to the condensing end 42 through the gas flow channel 5. In the process of flowing to the condensing end 42, the working fluid exchanges heat with the external environment through heat conduction to release heat, then transforms from the gaseous phase to the liquid phase at the condensing end 42 and moves vertically from the air flow channel 5 into the first capillary of the condensing end 42 Structure 121. By virtue of the continuity and porosity of the capillary structure 12, the working fluid acts from the capillary action of the second capillary structure 122 of the condensing end 42, Then it reaches the first capillary structure 121 of the heat-absorbing end 41. In this way, it is the complete heat conduction cycle of the working fluid. In particular, the average pores of the first capillary structure 121 are larger than the average pores of the second capillary structure 122. The larger average pores of the first capillary structure 121 will facilitate the transportation of the working fluid in the gas phase, while the average pores of the second capillary structure are smaller. It will be beneficial to increase the capillary force and improve the horizontal transportation of the working fluid in the liquid phase. Wherein, the thickness of the thin-type uniform temperature plate capillary structure element of the present invention is less than 1.0 mm, the thickness of the first metal sheet is less than 0.1 mm, and the thickness of the first capillary structure and the second capillary structure are both less than 0.3 mm. Furthermore, the thin-type uniform temperature plate of the present invention can be an ultra-thin uniform temperature plate (thickness less than 1.0 mm), or a larger type uniform temperature plate (thickness greater than 1.0 mm). Cooperating with the capillary members of the temperature equalizing plate of different thickness, the thickness of the first metal sheet, the first capillary structure, and the second capillary structure of different thicknesses are designed.

Wherein, the first capillary structure is formed by the first slurry through a heating process to form a first capillary structure containing a first type of spherical copper member and a first chain-shaped copper member, and the first slurry includes a first particle distribution The first type of spherical copper powder, copper oxide powder, the first organic solvent and the first polymer are mixed; the second capillary structure is formed by the second slurry through a heating process to form a second type of spherical copper member and The second capillary structure of the second chain-shaped copper member, and the second slurry includes a second type of spherical copper powder with a second particle size distribution, copper oxide powder, a second organic solvent, and a second polymer mixed. The colloid formed by organic solvent and polymer and evenly disperse the spherical copper powder and copper oxide powder with the first particle size distribution in the colloid or between the spherical copper powder and copper oxide powder with the second particle size distribution Between, make it generate porous, even and dense capillary pores. The copper oxide powder may be copper oxide (CuO) powder, cuprous oxide (Cu ₂ O) powder, or tetracopper oxide (Cu ₄ O ₃ ) powder. These three compounds belong to the oxidation form of copper, which can be reduced to reduced copper under appropriate conditions. The copper oxide powder contains a plurality of copper oxide particles, so the capillary member of the uniform temperature plate is formed by reducing one or more copper oxide particles and then sintering each other and sintering with nearby spherical copper powder particles. Porous structure.

The first type of spherical copper components account for more than 50% of the weight of the first capillary structure, and the second type of spherical copper components account for more than 30% of the weight of the second capillary structure.

Wherein, the first slurry may also include the first type of spherical copper powder, the first copper oxide powder, an organic solvent and a polymer, and the second slurry may include the second type of spherical copper powder, the second copper Oxide powder, organic solvent and polymer. Those skilled in the art can adjust the content of the first type of spherical copper powder in the first capillary structure 121 according to the manufacturing process or their respective requirements. When the content of the first type of spherical copper powder is 100% (as in the specific embodiment described above), the vertical and parallel pore structures of the working fluid in the first capillary structure 121 are almost the same. When the content of the spherical copper powder of the first type decreases, the vertical and parallel pores of the working fluid in the first capillary structure 121 will be affected by the powders added in other shapes. If the other powder added to the first capillary structure 121 is the first copper oxide powder, the flow rate of the working fluid in the parallel direction in the first capillary structure 121 will be increased, and the vaporization rate in the vertical direction will be reduced. However, in order to maintain the effect brought about by the first capillary structure 121 in the present invention, the content of the first type spherical copper powder with the first average particle size distribution needs to be greater than 70%.

In the same way, the addition ratio of the second type of spherical copper powder to the second copper oxide powder in the second capillary structure 122 can also be adjusted by those skilled in the art according to the manufacturing process or their respective requirements. When the content of the second type of spherical copper powder and the second copper oxide powder mixed in the second capillary structure 122 changes, the flow rate of the working fluid in the parallel direction in the second capillary structure 122 also changes. In a specific embodiment, the content of the copper oxide powder in the second capillary structure 122 needs to be greater than 15%, and the appropriate addition range is between 15% and 50%.

Compared with the capillary structure formed by single copper powder sintering, copper mesh, copper wire or composite structure, the thin-type uniform temperature plate capillary structure element 1 of the present invention is sintered to form different areas by printing pastes of different formulations. The design and manufacture of the capillary structure 12 used can further achieve the circulation efficiency of the working fluid in the gas phase and the liquid phase, so as to improve the efficiency of the uniform temperature plate element.

In addition, it should be understood that the above-mentioned first area 1121 and second area 1122 are not limited to the positions depicted in the figure. Those skilled in the art can refer to the structure of the thin uniform temperature plate, the heat source H, and the first capillary of the present invention. The working principle between the structure 121 and the second capillary structure 122 and the working fluid is based on designing the positions of the first area 1121 and the second area 1122, and is not limited thereto.

In the conventional technology, the capillary structure in the ultra-thin temperature equalizing plate is made by the weaving, cutting, laying and pressing of graphite jigs of copper mesh. The production of the capillary structure of the equalizing plate becomes complicated and It is unfavorable for automated operations in mass production, and when the thickness of the uniform temperature plate element is less than 0.35mm, a thinner copper mesh is required. Limited by the capillary limit of the copper mesh, the capillary force is often insufficient. In addition, the structure of the copper mesh is simple, and the liquid-to-gas phase transition in the heating zone is mostly carried out by a pool boiling mechanism. The phase change thermal resistance is relatively large, resulting in poor heat transfer efficiency. The present invention uses paste printing and sintering of copper powders of different particle sizes mixed with copper oxide powders to form two different capillary structures, which can increase the liquid phase and gas phase of the working fluid in the capillary structure of the isothermal plate The circulation efficiency of the pore structure is better than that of the capillary structure of the copper mesh, and the capillary force is relatively improved, which increases the heat conduction efficiency of the temperature equalization plate, and thus has a better temperature equalization effect.

Please refer to FIG. 3 together. FIG. 3 is a method for manufacturing a thin-type uniform temperature plate capillary structure element according to a specific embodiment of the present invention, which is applied to make a thin-type uniform temperature plate element including a capillary structure element. The method includes the following steps: Step S1: providing a first metal sheet with a groove structure, wherein the groove structure has a first area and a second area. Step S2: Provide a first slurry containing the first type of spherical copper powder and copper oxide powder, and a second slurry containing the first type of spherical copper powder and copper oxide powder. Step S32: Lay the second slurry on the second area. Step S31: Lay the first slurry on the first area. Step S41: curing the first slurry to make it a first cured body. Step S42: curing the second slurry to become a second cured body. Step S51: Heating the first cured body to form a first capillary structure located in the first area. Step S52: heating the second cured body to form a second capillary structure located in the second area. Among them, the first area is used as the heat absorption area of the thin uniform temperature plate element. When the thin uniform temperature plate capillary structure element formed by this method is used to make the uniform temperature plate element, it can maintain sufficient pores and capillary force at the same time under the condition that the thickness of the thin uniform temperature plate element is extremely small, and two different pore sizes The capillary structure can also improve the thermal conductivity of the product. In the embodiment shown in FIG. 3, step S41 and step S42 can be performed at the same time, and step S51 and step S52 can be performed at the same time to complete the capillary structure element 1 of the uniform temperature plate. Wherein, the first metal sheet 11 includes at least one of copper or copper alloy. It can also be stainless steel plated with copper on the surface, or can be titanium or titanium alloy.

Please refer to FIGS. 4 and 5. FIG. 4 shows a flow chart of the manufacturing method of the thin-type uniform temperature plate capillary structure element 1 according to another specific embodiment of the present invention, and FIG. 5 is a flowchart according to the flow of FIG. 4 The schematic diagram. In practical applications, as shown in Figs. 4 and 5, steel plate printing can be used for the laying of the slurry, and step S31 and step S32 are performed in sequence to lay the first slurry 61 and the second slurry 62 in the trench Structure 112. At this time, since the first slurry 61 and the second slurry 62 have fluidity and viscosity at the same time, they can be tightly combined with each other, and then a continuous capillary structure layer 12 is formed after heating, baking and sintering. It should be noted that the laying sequence of the first slurry 61 and the second slurry 62 is not limited to this. In the embodiment of FIG. 4, step S41 and step S42 can be performed at the same time, and step S51 and step S52 can be performed at the same time to complete the thin-type uniform temperature plate capillary structure element 1.

Wherein, when heating and baking, the organic solvent in the first slurry 61 evaporates first, then the polymer is cracked and removed, and then the first copper oxide powder 612 is continuously heated in a hydrogen-containing atmosphere until the first copper oxide powder 612 is reduced to the first chain shape The copper member 1212 is sintered with the first-type spherical copper powder 610 to form a first capillary structure 121 with a porous structure. In addition, when heating and baking, the organic solvent in the second slurry 62 evaporates first, then the polymer is cracked and removed, and then the second copper oxide powder 622 is continuously heated in a hydrogen-containing atmosphere until the second copper oxide powder 622 is reduced to the second chain The copper-shaped member 1222 is sintered with the second-type spherical copper powder 620 to form the first capillary structure 122 with a porous structure. Among them, the organic solvent and the polymer form a colloid, which is used to disperse and suspend the spherical copper powder and copper oxide powder in the first slurry 61 and the second slurry 62 to form a slurry for easy placement The capillary structure layer 12 is processed in the groove structure 112 of the first metal sheet 11. The organic solvent may be an alcohol solvent, and the polymer may be a natural resin (Natural Resin) or a synthetic resin (Synthetic Resin). The first copper oxide powder 612 and the second copper oxide powder 622 may also be cuprous oxide powder (Cu ₂ O).

Please refer to FIGS. 6 and 7. FIG. 6 shows a step flow diagram of a method for manufacturing a thin-type uniform temperature plate capillary structure element 1 according to another specific embodiment of the present invention, and FIG. 7 is a flow chart based on the flow of FIG. 6 The schematic diagram. In practical applications, in addition to the implementations shown in Figures 5 and 6, the implementations of Figures 6 and 7 can also be performed after step S31, and then steps S41 and S51 are performed to heat and sinter the first slurry 61 to form the first slurry. A capillary structure 121. Then, step S32, step S42 and step S52 are performed to heat and sinter the second slurry 62 to form the second capillary structure 122. In the manufacturing method of the present invention, the first slurry 61 is laid and sintered in sequence, and then the second slurry 62 is laid and sintered to form the capillary structure layer 12. The above purpose is to lay the first slurry 61 on the first area 1121 to form the first capillary structure 121, and to lay the second slurry 62 on the second area 1122 to form the second capillary structure 122. In addition to the above-mentioned production methods, in order to achieve this goal, those with ordinary knowledge in the field can adjust them by themselves. The most suitable manufacturing method is not limited to the above method. In another embodiment described below, the second slurry is placed first and then the first slurry is placed. The detailed steps are described in the following embodiment.

Among them, the particle size of the first type of spherical copper powder 610 is larger than that of the second type of spherical copper powder 620, and the particle size of the second type of spherical copper powder 620 is larger than that of the first copper oxide powder 612 and the second type of spherical copper powder 620. The particle size of the copper oxide powder 622. Since the gap between the spherical copper powder and the first cuprous oxide powder such as the first particle size distribution in the first region 1121 is larger than the second spherical copper powder 620 and the second copper oxide powder in the second region 1121 622 stacked out of the gap. Therefore, the larger pores in the first region 1121 are conducive to vertical gas transport, and the denser pore stacks in the second region 1122 are conducive to increasing the horizontal capillary force and promoting the efficiency of parallel flow of the working fluid. With different thicknesses of the first metal sheet 11, the first capillary structure 121, and the second capillary structure 122, the average particle size of the first type of spherical copper powder 610, the second type of spherical copper powder 620, and copper oxide powder It is also different, but in principle it is scaled up or down according to the above description.

In a preferred embodiment, the above-mentioned copper oxide powder is cuprous oxide (Cu ₂ O) powder, and the average particle size (D50) is between 2 um and 5 um. The cuprous oxide powder has an octagonal crystal structure. When sintering is carried out in the presence of hydrogen, the cuprous oxide powder is reduced and sintered into a chain-like copper component.

Please refer to FIGS. 8 and 9. FIG. 8 shows a flow chart of a method for manufacturing a thin uniform temperature plate capillary structure element 1 according to another specific embodiment of the present invention, and FIG. 9 is based on the flow chart of FIG. 8 Schematic diagram shown. In practical applications, the step flow of the embodiment of FIG. 6 and FIG. 7 can also be performed first in step S32 in the embodiment of FIG. 8 and FIG. 9, and then steps S42 and S52 are performed to heat and sinter the second slurry 62 The first capillary structure 122 is formed. Then, step S31, step S41 and step S51 are performed to heat and sinter the first slurry 61 to form the first capillary structure 121. Original hair According to the manufacturing method of the Ming Dynasty, the second slurry 62 is laid and sintered in sequence, and then the first slurry 61 is laid and sintered to form the capillary structure layer 12. The above purpose is to lay the first slurry 61 on the first area 1121 to form the first capillary structure 121, and to lay the second slurry 62 on the second area 1122 to form the second capillary structure 122. In addition to the above-mentioned production methods, in order to achieve this goal, those skilled in the art can adjust the most suitable manufacturing method by themselves, and are not limited to the above-mentioned methods. In another embodiment described below, the second slurry is placed first and then the first slurry is placed. The detailed steps are described in the following embodiment. In addition, the steps of heating and curing are described in detail in the following examples.

Please refer to FIG. 10A and FIG. 10B. FIG. 10A is a flowchart of the sub-steps of step S41 according to a specific embodiment of the present invention. FIG. 10B is a flowchart showing the sub-steps of step S42 according to a specific embodiment of the present invention. As shown in FIG. 10A, the step S41 of heating the first solidified body further includes the following sub-steps, step S411: cracking and eliminating the first polymer in the first solidified body; step S412: sintering in a nitrogen-hydrogen mixed atmosphere The first copper powder in the first solidified body forms a first capillary structure located in the first area. As shown in FIG. 10B, the step S42 of heating the second solidified body further includes the following sub-steps, step S421: cracking and eliminating the second polymer in the second solidified body; step S422: sintering in a nitrogen-hydrogen mixed atmosphere The first copper powder in the first solidified body forms a first capillary structure located in the first area. It should be noted that the heating sequence of heating the first solidified body S41 and heating the second solidified body S42 can also be carried out at the same time, and the heating sequence is not limited to this.

Steps S51 and S52 are sintering in a nitrogen-hydrogen mixed atmosphere. The purpose of nitrogen gas is to keep the environment of the production process under oxygen-free, and the purpose of hydrogen gas is to carry out the reduction reaction. When the first cured body and the second cured body are baked at a high temperature, the first polymer and the second polymer in the first cured body and the second cured body are first cracked and eliminated. In practical applications, polymers The decomposition temperature ranges from about 250°C to 600°C, and the reduction and sintering temperature of spherical copper powder and cuprous oxide is between about 650°C to 850°C. Therefore, during high-temperature heating and baking, the polymer will be decomposed and eliminated first, leaving copper powder and cuprous oxide powder with a higher melting point and gaps. During the high-temperature sintering process, the gap between the copper powder and the reduced cuprous oxide is further sintered to form a porous capillary structure.

Please refer to Figure 11A and Figure 11B. FIG. 11A is a schematic diagram of the first capillary structure after sintering according to an embodiment of the present invention. FIG. 11B is a schematic diagram of the second capillary structure after sintering according to an embodiment of the present invention. As shown in FIG. 11A, in a specific embodiment, when the first slurry 61 is heated, the organic solvent in the colloid will volatilize due to its low boiling point. Then, the temperature is increased for baking, the polymer in the colloid will be further cracked and removed, leaving only the first type of spherical copper powder and the first copper oxide powder. Then, a higher temperature sintering process is performed in a hydrogen-containing atmosphere. The first type of spherical copper powder and the first copper oxide powder undergo reduction and diffusion reactions at the same time, and the first type of spherical copper member 1211 and the first chain are sintered. And form a plurality of first chain-shaped copper members 1212 and a second chain-shaped copper member 1222 that are connected to each other. The plurality of chain-shaped copper members are connected to each other to form a chain or net shape, and are further connected to form a three-dimensionality The porous first capillary structure 121. In the same way, the heating process of the second slurry 62 is similar when it is heated, so it will not be repeated here. The second type of spherical copper powder and the second copper oxide powder undergo reduction and diffusion reactions at the same time to reduce to the second type of balls. The second chain-shaped copper member 1221 and the second chain-shaped copper member 1222 form a plurality of second chain-shaped copper members 1222 and a second chain-shaped copper member 1221 that are connected to each other. The plurality of chain-shaped copper members are connected to each other to form a chain or a net. The shape is further connected to form a three-dimensional porous second capillary structure 122.

Please refer to FIG. 12. FIG. 12 is a schematic diagram illustrating the appearance of a chain-shaped copper component formed by a reduction and diffusion reaction in a single cuprous oxide crystal powder sintering process according to an embodiment of the present invention. When a single first copper oxide powder 612 is sintered in a hydrogen-containing atmosphere and simultaneously reduced and diffused, the first chain-shaped copper member 1212 will be formed. In particular, when the first copper oxide powder 612 is cuprous oxide of octahedral crystals, the change may be that the cuprous oxide (Cu ₂ O) is reduced to a reduced copper, and the appearance of its individual particles may be changed by octahedral. The crystal structure is diffused and reduced along the corresponding two end points into the first chain-shaped copper member 1212, as shown in FIG. 12. The sintering diffusion reduction of the second copper oxide powder is reduced to the second chain-shaped copper member 1222. The appearance change is similar to that of the first copper oxide powder 612, so it will not be repeated here.

The capillary structure element 1 of the thin-type uniform temperature plate of the present invention is provided with two different capillary structure layers 12 in the groove structure 112 on the upper surface 111 of the first metal sheet 11. Therefore, the capillary structure elements of the thermal guide plate formed by two different capillary structures produce different vertical vaporization capacity and horizontal liquid transport capacity, which improves the liquid phase of the working fluid in the thin uniform temperature plate And the efficiency of gas circulation. In addition, the thin uniform temperature plate capillary structure element of the present invention is formed by printing two kinds of pastes mixed with spherical copper powder and octagonal cuprous oxide crystal powder with different particle size distributions and ratios, and sintered, which has three-dimensionality. The capillary structure of the pores and the design flexibility of the capillary structure with better functions in different regions. Therefore, the heat dissipation and heat conduction functions of the uniform temperature plate are improved, and finally, the effect of better heat dissipation and lightness is achieved, and the mass production efficiency of the uniform temperature plate can be increased and the production yield of the uniform temperature plate product can be improved.

In addition, in the present invention, the method of preparing the capillary structure element of the thin-type uniform temperature plate with the slurry is favorable for printing or laying in the groove structure of the first metal sheet for heating baking and sintering. And it can effectively reduce the thickness of the temperature equalizing plate element while maintaining sufficient porosity and capillary force, which can also improve the yield of the product during mass production. The thin-type uniform temperature plate capillary structure element of the present invention and the manufacturing method thereof can also be used for ultra-thin uniform temperature plates (capillary thickness <100um) and large-scale uniform temperature plates (capillary thickness 200um~500um), and the copper powder in the slurry ( The ratio of Cu powder to Cu ₂ O Powder can be adjusted to the most suitable process method, and it is not limited to this.

Compared with the prior art, the thin capillary structure element 1 of the present invention is provided with two microscopically different capillary structure layers 12 on the upper surface 111 of the first metal sheet 11 in the groove structure 112, and the working fluid is used in the groove structure 112. The vertical vaporization mechanism and the horizontal liquid transport mechanism in the two different capillary structure layers 12 are different. The thin-type uniform temperature plate capillary structure element 1 formed by the two microscopically different capillary structures improves the thin-type uniform temperature plate V. The efficiency of the liquid phase and gas phase circulation of the working fluid improves the heat conduction function of the thin uniform temperature plate V.

To sum up, compared to the conventional method of making a metal copper mesh applied to a capillary structure in an ultra-thin uniform temperature plate, the paste of the present invention can be directly printed and further sintered, and by using different particle sizes The two capillary structures formed by the copper powder mixed with the slurry of copper oxide powder improve the efficiency of the liquid and gas phase circulation of the working fluid in the thin uniform temperature plate.

Through the detailed description of the above preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent for which the present invention is intended. Therefore, the scope of the patent application for the present invention should be interpreted in the broadest way based on the above description, so as to cover all possible changes and equivalent arrangements.

1: Thin-type uniform temperature plate capillary structure element

11: The first metal sheet

111: upper surface

112: groove structure

1121: The first area

1122: second area

12: Capillary structure layer

121: The first capillary structure

1211: The first type of spherical copper components

1212: The first chain-shaped copper member

V: Thin-type uniform temperature plate

122: second capillary structure

1221: The second type of spherical copper components

1222: The second chain-shaped copper member

Claims (10)

A thin-type uniform temperature plate capillary structure element is used for sealing and processing with a second metal sheet to form a thin-type uniform temperature plate. The thin-type uniform temperature plate capillary structure element includes: A first metal sheet having a groove structure; A capillary structure layer is formed in the groove structure, and the capillary structure layer further has: A first capillary structure, comprising N first-type spherical copper members and P chain-shaped copper members with a first average particle size distribution connected to each other to form a porous structure; and A second capillary structure, comprising M second-type spherical copper members with a second average particle size distribution and Q chain-shaped copper members connected to each other to form a porous structure; Wherein, the first capillary structure is located in a heat absorption zone of the thin-type uniform temperature plate element, the first average particle size is larger than the second average particle size, M>N and Q>P. For the thin-type uniform temperature plate capillary structure element described in item 1 of the scope of patent application, the first type of spherical copper members account for more than 50% of the weight of the first capillary structure, and the second type of spherical copper members The weight percentage of the second capillary structure is greater than 30%. In the thin-type temperature uniform plate capillary structure element described in the first item of the scope of patent application, the second capillary structure accounts for more than 70% of the capillary structure layer by weight. In the thin-type uniform temperature plate capillary structure element described in the first item of the patent application, the first metal sheet includes at least one of copper, copper alloy, copper-plated stainless steel, titanium, and titanium alloy. For the thin-type uniform temperature plate capillary structure element described in item 1 of the scope of patent application, in the first capillary structure and the second capillary structure of the same volume, the number of the second type spherical copper members is greater than the number of the first capillary structure The quantity of a type of spherical copper components. The thin-type uniform temperature plate capillary structure element described in item 1 of the scope of patent application, wherein the first Both the average particle diameter and the second average particle diameter are larger than the average diameter of the chain-shaped copper member. The thin capillary structure element of the uniform temperature plate described in the scope of the patent application, wherein the first capillary structure and the second capillary structure are continuous structures, and the second capillary structure is located on a non-uniform temperature plate element. Endothermic zone. A method for manufacturing thin-type uniform temperature plate capillary structure elements. The manufacturing method includes the following steps: Providing a first metal sheet having a groove structure, wherein the groove structure has a first area and a second area; A first slurry and a second slurry are provided. The first slurry includes a first organic solvent, a first polymer, a first type spherical copper powder with a first average particle size distribution, and a Copper oxide powder, the second slurry includes a second organic solvent, a second polymer, and a second type spherical copper powder with a second average particle size distribution and a copper oxide powder, the first The average particle size is greater than the second average particle size; Laying the first slurry on the first area; Laying the second slurry on the second area; Heating the first slurry to volatilize the first organic solvent, cracking the first polymer, sintering the first type spherical copper powder and the copper oxide powder to form a first capillary structure; Heating the second slurry to volatilize the second organic solvent, cracking the second polymer, sintering the second type of spherical copper powder and the copper oxide powder to form a second capillary structure; Wherein, the first capillary structure and the second capillary structure are continuous structures, and the first area is a heat absorption area of the uniform temperature plate element. The manufacturing method described in item 8 of the scope of patent application, wherein the step of heating the first slurry The steps of heating the second slurry are simultaneously performed under the same polymer cracking and powder sintering process conditions. According to the manufacturing method described in item 8 of the scope of patent application, the copper oxide powder is copper oxide powder or cuprous oxide powder.

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