CN107830757A - Equalizing plate structure and its production technology - Google Patents
Equalizing plate structure and its production technology Download PDFInfo
- Publication number
- CN107830757A CN107830757A CN201710867162.9A CN201710867162A CN107830757A CN 107830757 A CN107830757 A CN 107830757A CN 201710867162 A CN201710867162 A CN 201710867162A CN 107830757 A CN107830757 A CN 107830757A
- Authority
- CN
- China
- Prior art keywords
- cavity
- mounting base
- plate structure
- radiating
- equalizing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Abstract
The invention discloses equalizing plate structure and its production process, the temperature-uniforming plate shaped by the samming board production technology includes mounting base, has vacuum cavity and capillary structure in the mounting base；The upper end of the mounting base is provided with the heat radiation sam plate for sealing the cavity, and the thickness of the heat radiation sam plate is 3mm 5mm；Coolant is inoculated with the cavity.Because the thickness for the support plate that radiates is 3mm 5mm.Therefore, heat caused by the element on radiating support plate, which can quickly be delivered in cavity to be absorbed and transmitted by coolant, distributes, so as to accelerate the efficiency of radiating.And it instead of traditional pipeline that fluid injection is set on equalizing plate structure；Therefore not only cause equalizing plate structure good appearance of the present invention, and coolant will not be caused to leak, performance is more reliable and more stable.
Description
Technical field
The present invention relates to electronic original part field of radiating, and in particular to equalizing plate structure and its production technology.
Background technology
Temperature-uniforming plate is the electronic original part radiating and cooling use for heating；Current temperature-uniforming plate is to set one on one piece of bottom plate
Individual cavity, one piece of cover plate is set on bottom plate, is provided with capillary structure and cooling liquid etc. in cavity, and be the one of bottom plate
Side sets a Water filling valve, and cooling liquid is injected into cavity by valve, and sets a valve not only to influence outward appearance, and
And can also coolant be caused to reveal；And the cover sheet thickness of existing temperature-uniforming plate is preferable, therefore the efficiency for absorbing heat is low, causes
Heat dispersion is poor.In view of disadvantages described above, is necessary to design a kind of equalizing plate structure and its production technology in fact.
The content of the invention
The technical problems to be solved by the invention are：Samming panel forming method is provided, dissipated to solve existing temperature-uniforming plate
The problem of poor thermal efficiency.
In order to solve the above technical problems, the technical scheme is that, average-temperature structure, including mounting base, the installation
Cavity is provided with bottom plate；The upper end of the mounting base is provided with the radiating support plate for sealing the cavity, the thickness of the radiating support plate
Spend for 3mm-5mm；The multiple support rims for supporting the radiating support plate are provided with the cavity；It is inoculated with cooling down in the cavity
Liquid.
Further, the either flush of the top surface of the support rim and the mounting base.
Further, the steel wire of multiple-layer stacked is additionally provided with the cavity；The steel wire is provided with support described in empty avoiding
The emptiness avoiding hole of boss.
Further, four diagonal angles of the mounting base are equipped with mounting hole.
A kind of equalizing plate structure production technology, comprises the following steps：
Step 1：Process the mounting base；
Step 2：Assembling；The steel wire is encased in the cavity；
Step 3：Drilling；A liquid injection hole is bored on the radiating support plate；
Step 4：Welding；The radiating support plate is welded on the upper end of the mounting base；
Step 5：The coolant is injected into the cavity by the liquid injection hole；
Step 6：Close the liquid injection hole；
Step 7：Process the thickness of the radiating support plate；Radiated described in milling support plate thickness to 0.5mm-3mm.
Further, the step 1 is processing mounting base profile, the cavity and the support rim.
Further, the step 1 is the installation of the processing mounting base profile, the cavity and the support rim
Hole.
Further, it is further comprising the steps of between the step 1 and the step 2：
1), turning support rim；
2), the support rim of gained in step 1) is installed in the mounting hole of the support rim.
Further, the step 6 be a length is pressed into not less than the seal pin close-fitting of the fluid injection hole depth it is described
In liquid injection hole.
Further, in the step 3, the radiating support plate is connected on the mounting base by vacuum diffusion welding.
Compared with prior art, the equalizing plate structure shaped by the equalizing plate structure production technology can radiate support plate
Thickness be 3mm-5mm.Therefore, heat caused by the element on radiating support plate, which can be quickly delivered in cavity, is cooled
Liquid absorbs, so as to accelerate the efficiency of radiating.And it instead of traditional pipeline that fluid injection is set on equalizing plate structure；Therefore
Not only so that equalizing plate structure good appearance of the present invention, and coolant will not be caused to leak.
Brief description of the drawings
Fig. 1 is the sectional view of temperature-uniforming plate of the present invention.
Embodiment
Following embodiment will combine above-mentioned accompanying drawing and further illustrate.
Hereinafter, a variety of specific details are elaborated, to provide the saturating of the concept to forming described embodiment basis
Thorough understanding.However, it will be apparent to those skilled in the art that described embodiment can be in these no specific details
In it is some or all in the case of put into practice.In other cases, well-known processing step is not specifically described.
As shown in figure 1, equalizing plate structure, including mounting base 1, the mounting base 1 is interior to be provided with cavity 2；The installation
The upper end of bottom plate 1 is provided with the radiating support plate 3 for sealing the cavity 2, and the thickness of the radiating support plate 3 is 3mm-5mm.The cavity
The multiple support rims 4 for supporting the radiating support plate 3 are additionally provided with 1.Coolant is inoculated with the cavity 1.Due to the support plate 3 that radiates
Thickness be 3mm-5mm, so installed in radiating support plate 3 on electronic component caused by heat can be quick by the support plate 3 that radiates
It is delivered in coolant, so as to realize quick heat radiating.Wherein coolant is the liquid such as alcohol, heat dissipation vehicle, the third trunk.
Further, the either flush of the top surface of the support rim 4 and the mounting base 1.Therefore, support rim is passed through
4 pairs of radiating support plates 3 are played a supporting role, the rigidity of increase radiating support plate 3.
Further, the steel wire 5 of multiple-layer stacked is additionally provided with the cavity 2；The steel wire 5 is provided with branch described in empty avoiding
Support the emptiness avoiding hole of boss 4.Therefore it is uniform by the energy coolant distribution of steel wire 5, and add coolant and heat carrier
Contact area, consequently facilitating by the heat absorbed in coolant discharge.Wherein steel wire 5 is the steel wire of 1000 mesh.
Further, four diagonal angles of the mounting base 1 are equipped with mounting hole.Therefore bottom plate 1 is easily installed to install.
A kind of equalizing plate structure production technology, comprises the following steps：
Step 1：Process the mounting base 1；Shaped with a square plate using CNC, and cavity 2 and installation bottom
Plate is integrally formed.
Step 2：Assembling；The steel wire 5 is encased in the cavity 2.
Step 3：Drilling；A liquid injection hole is bored on the radiating support plate 3.
Step 4：Welding；The radiating support plate 3 is welded on the upper end of the mounting base 1；
Step 5：The coolant is injected into the cavity 2 by the liquid injection hole.
Step 6：Close the liquid injection hole.
Step 7：Process the thickness of the radiating support plate 3；Radiated described in milling support plate 3 thickness to 3mm-5mm.
Further, the step 1 is the processing profile of mounting base 1, the cavity 2 and the support rim 4.
Further, the step 1 is the peace of the processing profile of mounting base 1, the cavity and the support rim 4
Fill hole.Therefore, support rim 4 can use pin close-fitting to be arranged in mounting hole.
Further, it is further comprising the steps of between the step 1 and the step 2：
1), turning support rim 4；
2), the support rim 4 of gained in step 1) is installed in the mounting hole of the support rim.
Further, the step 6 be a length is pressed into not less than the seal pin close-fitting of the fluid injection hole depth it is described
In liquid injection hole.And adhesive glue can be scribbled on the inwall of liquid injection hole and the outer wall of pin, so as to ensure pin and radiating support plate 3
Installation is more firm.
Further, in the step 3, the radiating support plate 3 is connected on the mounting base 1 by vacuum diffusion welding.
Further, the order of the step 3 and the step 4 can exchange.
Therefore the production method of equalizing plate structure of the present invention, the thickness of radiating support plate 3 can not only be enabled to control 3mm-
5mm, and without adding the pipeline of a fluid injection in addition, the attractive in appearance of temperature-uniforming plate is ensure that, and prevent asking for coolant leakage
Topic.
The present invention is not limited to above-mentioned specific embodiment, one of ordinary skill in the art from above-mentioned design,
Without performing creative labour, a variety of conversion made, it is within the scope of the present invention.
Claims (10)
1. equalizing plate structure, it is characterised in that：Including mounting base, vacuum cavity is provided with the mounting base；The installation
The upper end of bottom plate is provided with the radiating support plate for sealing the cavity, and the thickness of the radiating support plate is 3mm-5mm；Set in the cavity
There are the multiple support rims for supporting the radiating support plate；Coolant is inoculated with the cavity.
2. equalizing plate structure as claimed in claim 1, it is characterised in that the top surface of the support rim and the mounting base
Either flush.
3. equalizing plate structure as claimed in claim 2, it is characterised in that；The steel wire of multiple-layer stacked is additionally provided with the cavity
Net；The steel wire is provided with the emptiness avoiding hole of support rim described in empty avoiding.
4. equalizing plate structure as claimed in claim 3, it is characterised in that；Four diagonal angles of the mounting base are equipped with peace
Fill hole.
A kind of 5. production technology for producing the equalizing plate structure as described in claim 3 or 4, it is characterised in that；Comprise the following steps：
Step 1：Process the mounting base；
Step 2：Assembling；The steel wire is encased in the cavity；
Step 3：Drilling；A liquid injection hole is bored on the radiating support plate；
Step 4：Welding；The radiating support plate that the step 3 obtains is welded on to the upper end of the mounting base；
Step 5：The coolant is injected into the cavity by the liquid injection hole；
Step 6：Close the liquid injection hole；
Step 7：Process the thickness of the radiating support plate；Radiated described in milling support plate thickness to 3mm-5mm.
6. equalizing plate structure production technology as claimed in claim 5, it is characterised in that；The step 1 is the processing installation
Bottom plate profile, the cavity and the support rim.
7. equalizing plate structure production technology as claimed in claim 5, it is characterised in that；The step 1 is the processing installation
The mounting hole of bottom plate profile, the cavity and the support rim.
8. equalizing plate structure production technology as claimed in claim 7, it is characterised in that；The step 1 and the step 2 it
Between it is further comprising the steps of：
1), turning support rim；
2), the support rim of gained in step 1) is installed in the mounting hole of the support rim.
9. equalizing plate structure production technology as claimed in claim 5, it is characterised in that；The step 6 is that a length is not small
It is pressed into the seal pin close-fitting of the fluid injection hole depth in the liquid injection hole.
10. equalizing plate structure production technology as claimed in claim 5, it is characterised in that；In the step 3, the radiating carries
Plate is welded on the mounting base by vacuum extension.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710867162.9A CN107830757A (en) | 2017-09-22 | 2017-09-22 | Equalizing plate structure and its production technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710867162.9A CN107830757A (en) | 2017-09-22 | 2017-09-22 | Equalizing plate structure and its production technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107830757A true CN107830757A (en) | 2018-03-23 |
Family
ID=61644053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710867162.9A Pending CN107830757A (en) | 2017-09-22 | 2017-09-22 | Equalizing plate structure and its production technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107830757A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050523A (en) * | 2018-10-12 | 2020-04-21 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
| CN111343838A (en) * | 2020-03-12 | 2020-06-26 | 苏州永腾电子制品有限公司 | Temperature-equalizing plate and production process thereof |
Citations (7)
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| US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
| CN201563336U (en) * | 2009-11-27 | 2010-08-25 | 唯耀科技股份有限公司 | Uniform-temperature radiator support structure |
| CN201600071U (en) * | 2009-12-07 | 2010-10-06 | 唯耀科技股份有限公司 | Metal mesh radiator structure of samming radiator |
| CN102692002A (en) * | 2012-06-13 | 2012-09-26 | 华南理工大学 | Heat radiating device of high-power LED (light-emitting diode) |
| CN103415183A (en) * | 2013-07-23 | 2013-11-27 | 苏州天脉导热科技有限公司 | Phase change soaking plate |
| CN105352352A (en) * | 2015-11-18 | 2016-02-24 | 上海利正卫星应用技术有限公司 | Ultra-thin even-temperature plate device and manufacturing method thereof |
| CN105865241A (en) * | 2016-04-11 | 2016-08-17 | 广州华钻电子科技有限公司 | Ultrathin soaking plate and manufacturing method thereof |
-
2017
- 2017-09-22 CN CN201710867162.9A patent/CN107830757A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
| CN201563336U (en) * | 2009-11-27 | 2010-08-25 | 唯耀科技股份有限公司 | Uniform-temperature radiator support structure |
| CN201600071U (en) * | 2009-12-07 | 2010-10-06 | 唯耀科技股份有限公司 | Metal mesh radiator structure of samming radiator |
| CN102692002A (en) * | 2012-06-13 | 2012-09-26 | 华南理工大学 | Heat radiating device of high-power LED (light-emitting diode) |
| CN103415183A (en) * | 2013-07-23 | 2013-11-27 | 苏州天脉导热科技有限公司 | Phase change soaking plate |
| CN105352352A (en) * | 2015-11-18 | 2016-02-24 | 上海利正卫星应用技术有限公司 | Ultra-thin even-temperature plate device and manufacturing method thereof |
| CN105865241A (en) * | 2016-04-11 | 2016-08-17 | 广州华钻电子科技有限公司 | Ultrathin soaking plate and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111050523A (en) * | 2018-10-12 | 2020-04-21 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
| CN111050523B (en) * | 2018-10-12 | 2022-03-15 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
| CN111343838A (en) * | 2020-03-12 | 2020-06-26 | 苏州永腾电子制品有限公司 | Temperature-equalizing plate and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180323 |
|
| RJ01 | Rejection of invention patent application after publication |