JP4123190B2 - Floor heating panel - Google Patents

Floor heating panel Download PDF

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JP4123190B2
JP4123190B2 JP2004155282A JP2004155282A JP4123190B2 JP 4123190 B2 JP4123190 B2 JP 4123190B2 JP 2004155282 A JP2004155282 A JP 2004155282A JP 2004155282 A JP2004155282 A JP 2004155282A JP 4123190 B2 JP4123190 B2 JP 4123190B2
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heat
hot water
water pipe
heating panel
floor heating
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JP2005337553A (en
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俊樹 田村
太 前田
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Description

本発明は、床材内部に温水パイプを配置する床暖房パネルに関するものである。   The present invention relates to a floor heating panel in which a hot water pipe is disposed inside a floor material.

従来より、床材内部に温水パイプを配置する床暖房パネルについては、種々知られているが、その中に、例えば、特開平８−１２８６５８号公報に開示するように、床材の裏面に開口した下向き溝部を凹設し、この下向き溝部内に温水パイプを配置するとともに、前記床材の最裏面に亙って均熱板を被覆配置してなるものがある。かかる床暖房パネルは、典型的には、図３に例示するような構造を有するものであり、温水パイプ４上方の床材１が薄い等の理由から床面８の昇温性能に優れるという利点を有する反面、床面８の温度ムラが発生し易いという問題点もある。   Conventionally, various types of floor heating panels in which hot water pipes are arranged inside the flooring material are known. For example, as disclosed in JP-A-8-128658, an opening is provided on the back surface of the flooring material. In some cases, the downward groove portion is recessed, a hot water pipe is disposed in the downward groove portion, and a soaking plate is disposed over the outermost surface of the flooring. Such a floor heating panel typically has a structure as illustrated in FIG. 3, and is advantageous in that it has excellent temperature rise performance of the floor surface 8 because the floor material 1 above the hot water pipe 4 is thin. However, there is also a problem that temperature unevenness of the floor surface 8 is likely to occur.

すなわち、かかる問題点を改善するため、例えば、図３にも示すように、従来例に係る床暖房パネルＡ−０では、均熱板５を設ける一方、下向き溝部３の底面９と、温水パイプ４との間に空間部７を形成する、或いは、温水パイプ４と均熱板５を直接的に接触させる等の方策が採られているが、未だ、上記問題点を完全に解消するには至っていない。特に、ここで残された未解決課題としては、均熱板５として、通常、好んで使用されるアルミニウムの熱吸収率が小さいため、温水パイプ４の下側面１６からの放射熱の熱吸収効率が低く、均熱板５に温水パイプ４の下側面１６からの放射熱が効率よく伝達され難いことが挙げられる。
特開平８−１２８６５８号公報 That is, in order to improve such a problem, for example, as shown in FIG. 3, in the floor heating panel A-0 according to the conventional example, the heat equalizing plate 5 is provided, while the bottom surface 9 of the downward groove 3 and the hot water pipe are provided. Measures such as forming the space 7 between the two and the hot water pipe 4 and the heat equalizing plate 5 directly are taken, but still the above problems are not solved completely. Not reached. In particular, as an unsolved problem left here, the heat absorption efficiency of the radiant heat from the lower side surface 16 of the hot water pipe 4 is low because the heat absorption rate of aluminum that is normally used as the soaking plate 5 is small. The radiant heat from the lower surface 16 of the hot water pipe 4 is difficult to be efficiently transmitted to the soaking plate 5.
JP-A-8-128658

本発明は、上記背景技術に鑑みて発明されたものであり、その課題は、温水パイプから均熱板への熱伝達を、より効率的に達成し得る床暖房パネルを提供することである。   This invention is invented in view of the said background art, The subject is providing the floor heating panel which can achieve more efficiently the heat transfer from a warm water pipe to a heat equalizing board.

上記課題を解決するために、請求項１に係る発明の床暖房パネルにあっては、床材の裏面に開口した下向き溝部を凹設し、前記下向き溝部内に温水パイプを配置するとともに、前記床材の最裏面に亙って均熱板を被覆配置してなる床暖房パネルにおいて、前記床材の裏面と、前記均熱板との間に熱輻射層を介在せしめる床暖房パネルであり、裏側面に第二の熱輻射層が密着して形成された第二の均熱板で前記温水パイプの上側面の全部または一部を被覆するとともに、前記第二の均熱板の端部を前記温水パイプの下面に接する前記均熱板に連結して、温水パイプの上側面からの熱を均熱板に伝導し、温水パイプの下側面からの放射熱を第二の熱輻射層の垂直部とその裏側の第二の均熱板を経由して、或いは、熱輻射層を介して均熱板に伝えるよう構成されたものであることを特徴とするものである。 In order to solve the above-mentioned problem, in the floor heating panel of the invention according to claim 1, the downward groove portion opened in the back surface of the flooring is recessed, the hot water pipe is disposed in the downward groove portion, and In the floor heating panel formed by covering and arranging the soaking plate over the back surface of the floor material, a floor heating panel in which a heat radiation layer is interposed between the back surface of the floor material and the soaking plate , Covering all or part of the upper surface of the hot water pipe with a second heat equalizing plate formed by adhering a second heat radiation layer to the back side surface, and the end of the second heat equalizing plate Connected to the soaking plate in contact with the lower surface of the hot water pipe, conducts heat from the upper surface of the hot water pipe to the soaking plate, and radiates heat from the lower surface of the hot water pipe to the vertical of the second heat radiation layer. To the soaking plate via the heat sink and the second soaking plate on the back side It is characterized in that those cormorants configured.

本発明の床暖房パネルでは、床材の裏面に開口した下向き溝部を凹設し、前記下向き溝部内に温水パイプを配置するとともに、前記床材の最裏面に亙って均熱板を被覆配置してなる床暖房パネルにおいて、前記床材の裏面と前記均熱板との間に熱輻射層を介在せしめるため、温水パイプから均熱板への熱伝達をより効率的に達成され、その結果、床面の温度ムラが緩和されることとなる。   In the floor heating panel of the present invention, a downward groove portion opened on the back surface of the floor material is recessed, a hot water pipe is disposed in the downward groove portion, and a soaking plate is disposed over the back surface of the floor material. In the floor heating panel formed, a heat radiation layer is interposed between the back surface of the flooring and the soaking plate, so that heat transfer from the hot water pipe to the soaking plate can be achieved more efficiently, and as a result, The temperature unevenness on the floor will be alleviated.

以下、本発明の実施形態を図面に基づき説明する。なお、本発明の床暖房パネルは、下記の実施形態にのみ限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the floor heating panel of this invention is not limited only to the following embodiment, Of course, it can add various changes within the range which does not deviate from the summary of this invention.

［参考例］
図１は、本発明の参考例である床暖房パネルの要部の概略を模式的に示すもので、（ａ）は、断面図、（ｂ）は、その拡大断面図である。すなわち、本参考例の床暖房パネルＡ−１では、床材１の裏面２に開口した下向き溝部３を凹設し、この下向き溝部３内に温水パイプ４を配置するとともに、床材１の最裏面に亙って均熱板５を被覆配置してなるものである。ここでは、床材１は、厚さ１２ｍｍの合板製、温水パイプ４は、外径７．２ｍｍの架橋ポリエチレン製、均熱板５は、厚さ１５０μｍのアルミニウム箔で構成しており、また、上記図３に示した従来例に係る床暖房パネルＡ−０と同様に、下向き溝部３の底面９と、温水パイプ４との間に空間部７を設けて、上方の床材の局所的な加熱を回避して床面の温度ムラの緩和に寄与し得るようにしている。 [ Reference example ]
FIG. 1 schematically shows an outline of a main part of a floor heating panel which is a reference example of the present invention, in which (a) is a cross-sectional view and (b) is an enlarged cross-sectional view thereof. That is, in the floor heating panel A-1 of the present reference example , the downward groove 3 opened on the back surface 2 of the floor material 1 is recessed, the hot water pipe 4 is disposed in the downward groove 3, and the floor material 1 A soaking plate 5 is placed over the back surface. Here, the flooring 1 is made of plywood having a thickness of 12 mm, the hot water pipe 4 is made of cross-linked polyethylene having an outer diameter of 7.2 mm, the soaking plate 5 is made of aluminum foil having a thickness of 150 μm, Similar to the floor heating panel A-0 according to the conventional example shown in FIG. 3, a space 7 is provided between the bottom surface 9 of the downward groove 3 and the hot water pipe 4, and the upper floor material is locally disposed. By avoiding heating, it can contribute to alleviating uneven temperature on the floor.

さらに、本参考例の床暖房パネルＡ−１では、前記床材１の裏面２と、均熱板５との間に熱輻射層６を介在せしめるものである。すなわち、放射熱吸収率が小さいアルミニウム製均熱板５が露出したままでは、温水パイプ４の下側面１６からの放射熱の均熱板５における熱吸収効率が低く、均熱板５に温水パイプ４の下側面１６からの放射熱が効率よく吸収され難いという上記問題点を放射熱吸収率が大きい上記熱輻射層６を介在させることにより解消し、放射熱の均熱板５における熱吸収効率の実質的な向上を図ろうとするものである。 Furthermore, in the floor heating panel A-1 of the present reference example , a heat radiation layer 6 is interposed between the back surface 2 of the flooring 1 and the soaking plate 5. That is, if the aluminum soaking plate 5 having a small radiant heat absorption rate is exposed, the heat absorbing efficiency of the radiant heat from the lower surface 16 of the hot water pipe 4 in the soaking plate 5 is low, and the soaking plate 5 has a hot water pipe. 4 is solved by interposing the heat radiation layer 6 having a high radiant heat absorption rate, and the heat absorption efficiency of the radiant heat soaking plate 5 is reduced. It is intended to substantially improve the above.

具体的には、熱輻射層６の形成は、カーボン等の放射熱吸収率の高い素材をホットメルト系樹脂中に添加、分散せしめ、均熱板５の所定の面上に塗布する方法、
或いは、放射熱吸収率の高い樹脂素材、例えば、ＰＥＴ（ポリエチレン テレフタレート）よりなるフィルム（厚さ：例えば、１０〜１５μｍ程度）を貼付する方法等により達成できる。 Specifically, the heat radiation layer 6 is formed by adding and dispersing a material having a high radiant heat absorption rate such as carbon in a hot melt resin, and applying the material on a predetermined surface of the soaking plate 5;
Alternatively, it can be achieved by a method of applying a resin material having a high radiant heat absorption rate, for example, a film (thickness: about 10 to 15 μm, for example) made of PET (polyethylene terephthalate).

この結果、温水パイプ４から均熱板５への熱伝達が、より効率的に達成され、床面８での温度ムラが緩和されることとなるというものである。なお、熱輻射層６の材料構成、材質、厚み、形成方法等については、これらのみに限定されるものではなく、上記課題解決に寄与する限りにおいて何ら制約のないことはいうまでもない。   As a result, heat transfer from the hot water pipe 4 to the soaking plate 5 is achieved more efficiently, and temperature unevenness on the floor surface 8 is alleviated. It should be noted that the material configuration, material, thickness, formation method, and the like of the heat radiation layer 6 are not limited to these, and it goes without saying that there are no restrictions as long as it contributes to the solution of the above problems.

［第１の実施形態］
一方、図２は、上記と異なる本発明の第１の実施形態である床暖房パネルの要部の概略を模式的に示すもので、（ａ）は、断面図、（ｂ）は、その拡大断面図である。すなわち、本実施形態の床暖房パネルＡ−２では、上記第１の実施形態の床暖房パネルＡ−１と同様に、床材１の裏面２に開口した下向き溝部３を凹設し、この下向き溝部３内に温水パイプ４を配置するとともに、床材１の最裏面に亙って均熱板５を被覆配置してなるものであり、さらに、前記床材１の裏面２と、均熱板５との間に介在する熱輻射層６を有するものである。 First Embodiment
On the other hand, FIG. 2 schematically shows the outline of the main part of the floor heating panel according to the first embodiment of the present invention different from the above, (a) is a cross-sectional view, and (b) is an enlarged view thereof. It is sectional drawing. That is, in the floor heating panel A-2 of the present embodiment, the downward groove 3 opened in the back surface 2 of the flooring 1 is recessed, as in the floor heating panel A-1 of the first embodiment. A hot water pipe 4 is disposed in the groove 3 and a soaking plate 5 is disposed over the outermost back surface of the flooring 1. Further, the back surface 2 of the flooring 1 and a soaking plate are provided. 5 has a heat radiation layer 6 interposed therebetween.

これに加えて、本実施形態の床暖房パネルＡ−２は、第二の均熱板１０を具備し、これが、温水パイプ４の上側面１１の全部または一部を被覆し、この第二の均熱板１０の端部１２が均熱板５と連結するものである。この第二の均熱板１０も、均熱板５と同様に、熱放射効率の低い（すなわち、放射熱吸収率の低い）材質であるアルミニウム等により形成した場合、温水パイプ４の上側面１１から下向き溝部３の底面９及び側面１３への熱放射が抑制され、上方の床材の局所的な加熱を回避して床面の温度ムラの緩和に寄与し得ることとなる。他方、温水パイプ４の上側面１１が、熱伝導性に優れ、均熱効果の高いアルミニウム製の第二の均熱板１０で覆われており、しかも、この第二の均熱板１０の端部１２が均熱板５と連結しているので、温水パイプ４の上側面１１からの熱が効果的に均熱板５に伝導されることとなる。   In addition to this, the floor heating panel A-2 of the present embodiment includes a second heat equalizing plate 10, which covers all or part of the upper side surface 11 of the hot water pipe 4, The end 12 of the soaking plate 10 is connected to the soaking plate 5. Similarly to the soaking plate 5, the second soaking plate 10 is also made of aluminum or the like having a low heat radiation efficiency (that is, a low radiant heat absorption rate), and the upper side surface 11 of the hot water pipe 4. Therefore, the heat radiation to the bottom surface 9 and the side surface 13 of the downward groove 3 can be suppressed, and local heating of the upper floor material can be avoided to contribute to the relief of temperature unevenness on the floor surface. On the other hand, the upper side surface 11 of the hot water pipe 4 is covered with an aluminum second heat equalizing plate 10 having excellent heat conductivity and high heat equalizing effect, and the end of the second heat equalizing plate 10 is also covered. Since the part 12 is connected to the soaking plate 5, the heat from the upper side surface 11 of the hot water pipe 4 is effectively conducted to the soaking plate 5.

さらに、本実施形態の床暖房パネルＡ−２では、上記第二の均熱板１０の裏側面１４に密着した第二の熱輻射層１５を形成している。この第二の熱輻射層１５についても、上記熱輻射層６と同様の材質で同様にして形成し得る。この結果、温水パイプ４の下側面１６からの放射熱を第二の熱輻射層１５の垂直部１７とその裏側の第二の均熱板１０を経由して、或いは、熱輻射層６を介して均熱板５に効率的に導き得ることとなる。この結果、温水パイプ４から均熱板５への熱伝達が、より一層効率的に達成され、床面８での温度ムラが、さらに効率的に緩和されることとなる。   Furthermore, in the floor heating panel A-2 of the present embodiment, a second heat radiation layer 15 that is in close contact with the back side surface 14 of the second heat equalizing plate 10 is formed. The second heat radiation layer 15 can also be formed in the same manner using the same material as that of the heat radiation layer 6. As a result, the radiant heat from the lower surface 16 of the hot water pipe 4 is routed through the vertical portion 17 of the second heat radiation layer 15 and the second heat equalizing plate 10 on the back side or through the heat radiation layer 6. Thus, the heat can be efficiently led to the soaking plate 5. As a result, heat transfer from the hot water pipe 4 to the soaking plate 5 is achieved more efficiently, and the temperature unevenness on the floor surface 8 is more efficiently mitigated.

本発明の参考例である床暖房パネルの要部の概略を模式的に示すもので、（ａ）は、断面図、（ｂ）は、その拡大断面図である。BRIEF DESCRIPTION OF THE DRAWINGS The outline of the principal part of the floor heating panel which is a reference example of this invention is shown typically, (a) is sectional drawing, (b) is the expanded sectional view. 本発明の第１の実施形態である床暖房パネルの要部の概略を模式的に示すもので、（ａ）は、断面図、（ｂ）は、その拡大断面図である。BRIEF DESCRIPTION OF THE DRAWINGS The outline of the principal part of the floor heating panel which is the 1st Embodiment of this invention is shown typically, (a) is sectional drawing, (b) is the expanded sectional view. 従来例に係る床暖房パネルの要部の概略を模式的に示すもので、（ａ）は、断面図、（ｂ）は、その拡大断面図である。The outline of the principal part of the floor heating panel which concerns on a prior art example is shown typically, (a) is sectional drawing, (b) is the expanded sectional view.

符号の説明Explanation of symbols

１ 床材
２ 裏面（床材１）
３ 下向き溝部（裏面２）
４ 温水パイプ
５ 均熱板
６ 熱輻射層
７ 空間部
８ 床面
９ 底面（下向き溝部３）
１０ 第二の均熱板
１１ 上側面（温水パイプ４）
１２ 端部（第二の均熱板１０）
１３ 側面（下向き溝部３）
１４ 裏側面（第二の均熱板１０）
１５ 第二の熱輻射層
１６ 下側面（温水パイプ４）
１７ 垂直部（第二の熱輻射層１５）
１８ ホットメルト
Ａ 床暖房パネル
Ａ−０ 床暖房パネル（従来例）
Ａ−１ 床暖房パネル
Ａ−２ 床暖房パネル 1 flooring 2 back side (flooring 1)
3 Downward groove (Back 2)
4 Hot water pipe 5 Heat equalizing plate 6 Thermal radiation layer 7 Space 8 Floor surface 9 Bottom surface (downward groove 3)
10 Second soaking plate 11 Upper surface (hot water pipe 4)
12 end (second soaking plate 10)
13 Side (downward groove 3)
14 Back side (second soaking plate 10)
15 Second heat radiation layer 16 Lower side surface (hot water pipe 4)
17 Vertical portion (second heat radiation layer 15)
18 Hot melt A Floor heating panel A-0 Floor heating panel (conventional example)
A-1 Floor heating panel A-2 Floor heating panel

Claims (1)

床材の裏面に開口した下向き溝部を凹設し、前記下向き溝部内に温水パイプを配置するとともに、前記床材の最裏面に亙って均熱板を被覆配置してなる床暖房パネルにおいて、前記床材の裏面と、前記均熱板との間に熱輻射層を介在せしめる床暖房パネルであり、裏側面に第二の熱輻射層が密着して形成された第二の均熱板で前記温水パイプの上側面の全部または一部を被覆するとともに、前記第二の均熱板の端部を前記温水パイプの下面に接する前記均熱板に連結して、温水パイプの上側面からの熱を均熱板に伝導し、温水パイプの下側面からの放射熱を第二の熱輻射層の垂直部とその裏側の第二の均熱板を経由して、或いは、熱輻射層を介して均熱板に伝えるよう構成されたものであることを特徴とする床暖房パネル。 In the floor heating panel formed by recessing a downward groove opening on the back surface of the flooring, arranging a hot water pipe in the downward groove, and covering and arranging a soaking plate over the backmost surface of the flooring, It is a floor heating panel in which a heat radiation layer is interposed between the back surface of the flooring and the heat equalizing plate, and a second heat equalizing plate in which a second heat radiation layer is formed in close contact with the back side surface. Covering all or part of the upper surface of the hot water pipe and connecting the end of the second heat equalizing plate to the heat equalizing plate in contact with the lower surface of the hot water pipe, Heat is conducted to the heat equalizing plate, and radiant heat from the lower surface of the hot water pipe is routed through the vertical portion of the second heat radiating layer and the second heat equalizing plate on the back side, or through the heat radiating layer. The floor heating panel is configured to be transmitted to a soaking plate .
JP2004155282A 2004-05-25 2004-05-25 Floor heating panel Expired - Fee Related JP4123190B2 (en)

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JP2004155282A JP4123190B2 (en) 2004-05-25 2004-05-25 Floor heating panel

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JP2005337553A JP2005337553A (en) 2005-12-08
JP4123190B2 true JP4123190B2 (en) 2008-07-23

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JP7241213B2 (en) 2020-09-16 2023-03-16 三菱重工機械システム株式会社 Main line billing processing device, billing processing method and program

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DE102007011087A1 (en) * 2007-02-28 2008-09-04 Oliver Panarotto Panel for lining surface with at least one liquid channel has first and second channel connecting elements enabling channels of two panels to be connected via connecting elements in liquid-tight, especially water-tight manner
JP2009121709A (en) * 2007-11-12 2009-06-04 Daiken Corp Panel for heating and its manufacturing method
JP5830645B2 (en) * 2011-12-19 2015-12-09 パナソニックＩｐマネジメント株式会社 Hot water floor heating panel
JP5822300B2 (en) * 2011-12-27 2015-11-24 住商メタレックス株式会社 A method for reforming an existing flooring floor to a flooring floor with hot water heating and a hot water panel used for the reforming

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7241213B2 (en) 2020-09-16 2023-03-16 三菱重工機械システム株式会社 Main line billing processing device, billing processing method and program

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