CN111928706A - Flat heat pipe based on composite structure liquid absorption core, assembly method and electronic component - Google Patents
Flat heat pipe based on composite structure liquid absorption core, assembly method and electronic component Download PDFInfo
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- CN111928706A CN111928706A CN202010780007.5A CN202010780007A CN111928706A CN 111928706 A CN111928706 A CN 111928706A CN 202010780007 A CN202010780007 A CN 202010780007A CN 111928706 A CN111928706 A CN 111928706A
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- bottom plate
- heat pipe
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- flat heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/16—Arc welding or cutting making use of shielding gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/32—Accessories
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/007—Auxiliary supports for elements
- F28F9/0075—Supports for plates or plate assemblies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a flat heat pipe based on a composite structure liquid absorption core, which comprises: the liquid filling device comprises base plates, a liquid suction core and a liquid filling pipe, wherein the liquid suction core is arranged between the base plates and comprises supporting columns and a foam nickel component; the bottom plate comprises an upper bottom plate and a lower bottom plate, and support columns are arranged on the upper bottom plate and the lower bottom plate; the foam nickel component is matched with the inner wall surface structure of the bottom plate; a liquid filling pipe is arranged between the upper bottom plate and the lower bottom plate, and working media are filled in the flat heat pipe through the liquid filling pipe; the support column and the foam nickel on the foam nickel component form a channel for the working medium in the flat heat pipe to flow together. According to the invention, the support columns arranged in an array manner and the foam nickel are adopted to form a channel for flowing of the working medium in the heat pipe together, so that the capillary force is good, the reflux resistance of the liquid working medium can be reduced, the flat heat pipe has better heat transfer performance, and the flat heat pipe is more reliable in the use process.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a flat heat pipe based on a composite structure liquid absorption core, an assembly method and an electronic component.
Background
With the rapid development of aerospace technology in China, the detection requirement of the spacecraft is developed towards the direction of multiple functions and multiple targets, and the types of loads needing to be carried are correspondingly increased. However, since the carrying space of the spacecraft is preferred, in order to meet the application requirements, the load needs to be made smaller in structure and lighter in weight through a modular design, and finally highly integrated electronic equipment is processed. The high integration makes the electronic devices inside the device more compact, which leads to a drastic increase in the power density in a small spatial range when the device is operating, which directly contributes to an increase in the amount of heat generated. The over-high temperature easily causes the failure of the device, so that the device is difficult to maintain high stability; meanwhile, the device is easily affected by the temperature difference to cause the failure of the device, so that the device is difficult to keep higher stability; meanwhile, the device is influenced by temperature difference to easily form larger thermal stress, and the working performance and reliability of the device are reduced, so that the detection task and the service life of the spacecraft are influenced. Relevant research results have demonstrated that temperature changes will affect the failure rate of electronic devices and exhibit an exponential growth relationship with increasing temperature, typically with each 10 c increase, the reliability of the device will decrease by half. The excessive temperature will cause the performance of the device to be significantly reduced in use, for example, the stability of the circuit connection interface will be affected, the loss of the device will be further increased, and finally, the function of the device will even be disabled. Statistics show that excessive temperatures have become a major factor in electronic device failure, and over half of device failures are associated with excessive temperatures. Therefore, the heat generated by the high-power device is effectively discharged in time, the overhigh temperature of the device/single machine is avoided, the normal trial operation of each component is ensured, and the aerospace thermal control subsystem needs to take corresponding measures to carry out heat dissipation and temperature control on the high-power device so as to ensure the reliability and the performance of the device. This brings new challenges to satellite thermal control technology, and effective heat dissipation measures need to be taken, considering more reasonable thermal design. The guarantee of the operation reliability of the high-power device depends on the perfection degree of the heat control of the device, so that the high-efficiency heat dissipation of the high-power device is one of important heat control technologies needing to be broken through in the field of aerospace heat management at present.
In terms of the current situation, the heat pipe has the characteristics of large heat transfer capacity, compact structure, no moving part, no energy consumption and the like, and is increasingly applied to the field of spacecrafts. The geometry of conventional heat pipes limits their application, typically to one-dimensional heat transfer, while flat plate heat pipe configurations are more advantageous for heat transfer in two-dimensional planes. The flat heat pipe has excellent heat transfer performance, has the same plane heat diffusion function as the heat diffusion plate, is easy to arrange, install and integrate heat dissipation devices, and can effectively solve the heat dissipation problem of high-power devices on the spacecraft. At present, the flat heat pipe technology is widely applied to electronic equipment such as computers, mobile phones, household appliances and the like; in the field of thermal control of spacecrafts, the flat plate heat pipe technology is still in a starting stage at home and is not widely applied. The structure of the flat heat pipe can be optimized and designed, and factors influencing the heat transfer performance can be studied through experiments. Therefore, the research of the flat heat pipe technology has important application value in the aerospace heat management system.
From the heat exchange principle, because the flat heat pipe utilizes the latent heat of vapor-liquid phase change heat exchange, the performance improvement effect of the vapor-liquid phase change heat exchange strengthened by the micro-nano capillary structure on the flat heat pipe is obvious. The wire mesh capillary wick can enhance the boiling heat exchange effect of the working medium, but has obvious thermal contact resistance with the inner wall of the heat pipe. And for the sintered liquid absorption cores, the problem of poor contact between the sintered liquid absorption cores and the inner wall of the heat pipe does not exist, and the liquid absorption cores with various performances can be customized according to actual needs. The metal powder particle size, amount of filler powder, etc. can be reasonably controlled during sintering to achieve the desired wick. But the sintered capillary structure has a certain defect, and the biggest defect at present is the complexity of the processing technology, and a higher-quality liquid absorbing core can be obtained only through a refined processing process, but the process has higher difficulty and needs to invest more cost, and if the quality of the processing technology is lower, the quality problem of the capillary core is easily caused. The microchannel wick channels are integral with the heat pipe wall itself, and there is no thermal contact resistance between them, which makes it a distinct advantage. In addition, the processing technology is simple, and the boiling heat exchange effect can be enhanced to a certain degree. In the application of the space field, the silk screen structure is difficult to achieve a good heat transfer effect, the sintered metal core is difficult to process and has heavier relative mass, and the micro-channel structure has the best heat transfer effect under the gravity environment but is influenced by the gravity factor to the greatest extent. After retrieval, the flat heat pipe in the prior art also has many defects.
Through retrieval, patent document CN207963589U discloses a high performance flat heat pipe with a composite structure, which is a method of combining a groove liquid absorption structure and a sintered capillary structure in the prior art, and synchronously enhances the capillary force and axial liquid flow rate of the flat heat pipe, thereby accelerating the liquid absorption and liquid guiding speed of a condensation end and achieving the purpose of improving the heat conduction and heat dissipation capability of the flat heat pipe. But the disadvantage is that the sintering process of the sintering type structure has more uncontrollable factors to influence the quality of the final finished product.
Patent document CN206583340U discloses a flat heat pipe structure, and proposes a flat heat pipe formed by one-step integral sintering of a novel condensation end cover plate, a porous capillary and a support return water structure, which can solve the problems of poor performance and high manufacturing cost of the conventional flat heat pipe. However, the prior art has the disadvantage that the performance of the manufactured flat heat pipe is difficult to meet the heat dissipation requirement of high heat flow density due to the integral sintering process.
Patent document CN20394950U discloses a flat heat pipe, which comprises an upper plate and a lower plate, wherein the upper plate and the lower plate are oppositely arranged and tightly buckled and sintered together, and a liquid filling pipe is further arranged at one end of the flat heat pipe to pump vacuum and fill working medium to form a complete flat heat pipe. The upper plate and the lower plate are both sintered with capillary structures with the same or different structures, and the capillary structures are also support structures. However, the disadvantages of the prior art are that the sintered capillary structure as a support structure makes the whole process uncontrollable, has large processing errors, and cannot meet the requirement that the support column needs to be reprocessed during integrated installation.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a flat heat pipe based on a composite structure liquid absorption core, an assembly method and an electronic component, so that the design and processing of the flat heat pipe and the subsequent integrated reprocessing are more controllable, a high-number foam nickel and support column arrangement structure is adopted as a liquid absorption core structure, and simultaneously, support columns play a role in strengthening the mechanical property of the flat heat pipe.
The invention provides a flat heat pipe based on a composite structure liquid absorption core, which comprises: the liquid filling device comprises base plates, a liquid suction core and a liquid filling pipe, wherein the liquid suction core is arranged between the base plates and comprises supporting columns and a foam nickel component;
moreover, the bottom plate comprises an upper bottom plate and a lower bottom plate, and support columns are arranged on the upper bottom plate and the lower bottom plate; the foam nickel component is matched with the inner wall surface structure of the bottom plate; a liquid filling pipe is arranged between the upper bottom plate and the lower bottom plate, and working media are filled in the flat heat pipe through the liquid filling pipe; the support column and the foam nickel on the foam nickel component form a channel for the working medium in the flat heat pipe to flow together.
Preferably, the liquid filling device further comprises a liquid filling port, and the liquid filling port is arranged at one end of the liquid filling pipe.
Preferably, the supporting columns and the bottom plate are designed and processed integrally, and the positions of the supporting columns on the upper bottom plate and the lower bottom plate are symmetrically arranged.
Preferably, the support columns are arranged in an equally spaced array.
Preferably, the nickel foam in the nickel foam assembly is attached to the inner wall surfaces of the upper and lower plates, and corresponds to the size and arrangement position of the support columns.
Preferably, the foamed nickel and the inner wall of the bottom plate are tightly buckled by adopting a molecular diffusion welding connection mode; the bottom plate, the support columns and the support columns are also tightly buckled in a molecular diffusion welding connection mode.
Preferably, the upper bottom plate, the lower bottom plate, the support columns and the liquid filling pipe are made of light high-thermal-conductivity materials.
The invention provides an assembly method of a flat heat pipe based on a composite structure liquid absorption core, which comprises the following steps:
s0: processing a substrate into an upper base plate integrated structure and a lower base plate integrated structure with supporting columns arranged in an array manner by a substrate machine;
s1: after the upper bottom plate and the lower bottom plate with the supporting columns are machined, respectively welding foamed nickel components on the inner wall surfaces of the upper bottom plate and the lower bottom plate;
s2: after the foam nickel assembly is welded, welding the edge surfaces of the upper base plate and the lower base plate, and welding the supporting cylindrical surfaces;
s3: after the upper base plate and the lower base plate are welded, the liquid filling pipe is connected to the liquid filling port through argon arc welding, the whole assembly is subjected to vacuum leak detection test, and the welding line is determined to meet the requirement required by design (the maximum single-hole leakage rate is not more than 2 multiplied by 10)- 8Pa·m3/s)；
S4: after the leakage detection is qualified, the working medium is filled, the liquid filling pipe is sealed to be dead to perform the leakage detection again when the designed filling amount is reached, and the assembly is completed after the leakage detection is qualified.
According to the electronic component, the flat heat pipe based on the composite structure liquid absorption core is used for heat dissipation treatment.
Preferably, the heat source device is arranged on the flat heat pipe, and the heat sink is arranged below the flat heat pipe.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the support columns arranged in an array manner and the foam nickel are adopted to form a channel for flowing of the working medium in the heat pipe together, so that the capillary force is good, the reflux resistance of the liquid working medium can be reduced, the flat heat pipe has better heat transfer performance, and the flat heat pipe is more reliable in the use process.
2. According to the invention, the support columns are arranged, so that the mechanical property of the flat heat pipe is improved, the shell of the flat heat pipe can be effectively prevented from deforming in the use process, and meanwhile, the thickness of the shell of the flat heat pipe can be reduced.
3. According to the invention, the foam nickel and the inner wall surface of the bottom plate are connected in a molecular diffusion welding connection mode, so that no redundant welding flux influences the porous structure of the foam nickel, the mechanical property is good, and the thermal contact resistance between the foam nickel and the inner wall surface of the bottom plate is reduced.
4. According to the invention, the upper bottom plate and the lower bottom plate and the support columns are connected in a molecular diffusion welding manner, so that the whole structure of the flat heat pipe is tightly attached, the mechanical strength is high, both the upper bottom plate and the lower bottom plate can be used as heating surfaces, and the operation is convenient during use.
5. According to the invention, the support column and the bottom plate are designed and processed in an integrated structure, so that the whole processing process is more controllable, the errors of design and processing are reduced to the greatest extent, and the reprocessing space can be reserved according to the system integration requirement.
6. The wick flat heat pipe has good gravity resistance, can work at any inclination angle, and is beneficial to installation.
7. The invention can adopt corresponding cooling modes according to different heat dissipation requirements, and has strong practicability.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural diagram of a bottom plate, a support pillar and a nickel foam component of the present invention
FIG. 3 is a schematic assembly flow diagram of the present invention;
FIG. 4 is a top view of the present invention;
FIG. 5 is a side cross-sectional view of the present invention;
fig. 6 is a schematic diagram of the integration of the present invention with an electronic component system.
In the figure:
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1 and 2, the flat heat pipe based on a composite-structure wick provided by the invention comprises a bottom plate 1, a wick, a liquid filling port 4 and a liquid filling pipe 5, wherein the bottom plate 1 comprises an upper bottom plate and a lower bottom plate, the wick is arranged between the upper bottom plate and the lower bottom plate, the liquid filling port 4 is reserved at one end of the bottom plate 1, the liquid filling pipe 5 is arranged at one end of the liquid filling port 4, the upper bottom plate and the lower bottom plate are oppositely arranged, and the upper bottom plate and the lower bottom plate can be tightly buckled together by welding through side seams of the upper bottom plate and the lower bottom plate.
Further, the liquid absorption core comprises support columns 2 and foam nickel components 3, the support columns 2 are integrally machined with the upper base plate and the lower base plate in an array arrangement mode, the support columns 2 of the upper base plate and the lower base plate are symmetrical in position, the support columns 2 play a role in strengthening the mechanical property of the whole structure, and the support columns 2 are arranged in an array mode; the foam nickel component 3 is matched with the inner wall surface of the bottom plate 1, and the foam nickel in the foam nickel component 3 is welded on the inner wall surfaces of the upper bottom plate and the lower bottom plate.
Still further, the foam nickel is processed according to the size of the inner wall of the bottom plate 1 and the arrangement position of the support columns 2, the foam nickel is made of high-number sectional materials, and the foam nickel is welded on the inner wall surfaces of the upper bottom plate and the lower bottom plate.
Furthermore, the porous structure formed by combining the upper bottom plate, the lower bottom plate, the support columns 2 and the foam nickel in the foam nickel component 3 becomes a channel for the flow of the working medium in the flat heat pipe, and the structure has good capillary force and can reduce the reflux resistance of the liquid working medium, so that the flat heat pipe has better heat transfer performance. .
According to the inventionPreferred embodiment(s) of the inventionFor further explanation.
Based on the basic embodiment, the upper base plate, the lower base plate and the support columns 2 are connected in a molecular diffusion welding mode, so that the whole structure is tightly attached, the mechanical strength is high, the upper base plate and the lower base plate can be used as heating surfaces, and the operation is convenient during use.
Based on the basic embodiment, the mode that the foamed nickel is welded on the inner wall surfaces of the upper base plate and the lower base plate is also connected by adopting molecular diffusion welding, no redundant welding flux influences the porous structure of the foamed nickel, the mechanical property is good, and meanwhile, the thermal contact resistance between the foamed nickel and the inner wall surface of the base plate 1 is reduced.
Based on above-mentioned basic embodiment, support column 2 welds on bottom plate 1 according to the mode of equidistant array range, can improve the mechanical properties of flat heat pipe, can prevent effectively that the casing from taking place to warp in the use, can reduce the casing thickness of flat heat pipe simultaneously, and its whole thickness can accomplish 5.5mm, can satisfy the heat dissipation demand of spacecraft high power device.
Based on the above basic embodiment, the upper and lower bottom plates, the supporting pillars 2 and the liquid filling pipe 5 are made of a light high-conductivity material.
According to the inventionVariation exampleFor further explanation.
Based on the basic embodiment, the structure of the supporting column 2 may be a cylindrical shape or a square column shape.
Based on the basic embodiment, the arrangement mode that the supporting columns 2 are welded on the bottom plate 1 can adopt the equal-spacing array arrangement, and can be further arranged according to the installation requirements of other devices.
Based on the basic embodiment, the working medium filled in the invention can be acetone or ammonia gas.
Based on the basic embodiment, the light high-conductivity material in the invention is aluminum, aluminum alloy, aluminum-based silicon carbide and the like.
As shown in fig. 3, a schematic view of an assembly process of a flat heat pipe according to the present invention is shown, so that the method for assembling a flat heat pipe based on a composite-structure wick provided by the present invention includes the following steps:
s0: processing a substrate into an upper bottom plate and a lower bottom plate which are provided with support columns in array arrangement;
s1: after the upper bottom plate and the lower bottom plate with the supporting columns are machined, respectively welding foamed nickel components on the inner wall surfaces of the upper bottom plate and the lower bottom plate;
s2: after the foam nickel assembly is welded, welding the edge surfaces of the upper base plate and the lower base plate, and welding the supporting cylindrical surfaces;
s3: after the upper base plate and the lower base plate are welded, the liquid filling pipe is connected to the liquid filling port through argon arc welding, the whole assembly is subjected to vacuum leak detection test, and the welding line is determined to meet the requirement required by design (the maximum single-hole leakage rate is not more than 2 multiplied by 10)- 8Pa·m3/s)；
S4: after the leakage detection is qualified, the working medium is filled, the liquid filling pipe is sealed to be dead to perform the leakage detection again when the designed filling amount is reached, and the assembly is completed after the leakage detection is qualified.
According to the electronic component, the flat heat pipe based on the composite structure liquid absorption core is used for heat dissipation treatment.
As shown in fig. 4 and 5, the support column 2 and the foamed nickel in the foamed nickel component 3 jointly form a flow channel of the working medium, and the hollow part in the middle is a flow area of steam.
As shown in fig. 6, the electronic component provided by the present invention includes a flat heat pipe 6, a heat sink 7 and a heat source device 8, wherein the heat source device 8 is disposed on the flat heat pipe 6, and the heat sink 7 is disposed below the flat heat pipe 6. The electronic component adopts the flat heat pipe based on the composite structure liquid absorption core to carry out heat dissipation treatment. When the heat source device is used, liquid on the heating surface is evaporated by heat generated by the high-power electronic component, steam reaches the heat dissipation surface through a channel formed by the support column 2 and the foamed nickel, the heat is released by condensation on the heat dissipation surface, and the condensed liquid returns to the heat source surface through the capillary structure of the foamed nickel. The flat heat pipe designed by the invention has good mechanical property and heat transfer property, is integrated with a high-power device and then carries a satellite to carry out verification test, has good reliability, and provides a new measure for satellite thermal control design.
According to the invention, the internal support columns of the flat heat pipe are optimally arranged, so that the pressure-bearing requirement at the working temperature can be met, and the flat heat pipe has better reliability in the using process. Meanwhile, the composite structure enables the flat heat pipe to have better antigravity performance, the support structure integrally processed with the shell can reserve a reprocessing space according to the requirements of an integrated system, the high-mesh foam nickel and the support mechanism are used as a capillary core structure together through diffusion welding, the processing technology is more controllable, a proper cooling mode can be adopted according to different heat dissipation requirements, and the composite structure is suitable for heat dissipation of single-machine components of a spacecraft.
The invention can adopt corresponding cooling modes according to different heat dissipation requirements, when the space at the heat source is insufficient, the heat generated can be transmitted to other positions by virtue of the flat heat pipe, and then the heat sink is combined to complete the heat dissipation process; when the area of the heat source is too small, the local heat flux density is too large, the heat source can be directly arranged on the flat heat pipe, and the heat flux density is reduced, the temperature distribution is more uniform by virtue of good soaking property of the heat source, so that the heat source has strong practicability.
The invention is used for cooling and temperature equalization of high-power components of spacecrafts, is simultaneously suitable for the heat dissipation aspect of high-heat-flux-density electronic devices/equipment, can be used as a high-power electronic chip packaging heat sink, high-power microwave/laser device heat dissipation, T/R assembly packaging shell and the like, and has wide application prospect in the fields of aerospace and even civil use.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. A flat plate heat pipe based on composite structure liquid absorption core is characterized by comprising: a bottom plate (1), a liquid absorbing core and a liquid filling pipe (5),
the liquid absorption cores are arranged between the bottom plates (1) and comprise supporting columns (2) and foam nickel components (3);
the bottom plate (1) comprises an upper bottom plate and a lower bottom plate, and support columns (2) are arranged on the upper bottom plate and the lower bottom plate;
the foamed nickel component (3) is matched with the inner wall surface of the bottom plate (1);
a liquid filling pipe (5) is arranged between the upper bottom plate and the lower bottom plate, and working media are filled in the flat heat pipe through the liquid filling pipe (5);
and the support column (2) and the foamed nickel on the foamed nickel component (3) jointly form a channel for the working medium in the flat heat pipe to flow.
2. A composite wick-based flat plate heat pipe according to claim 1 further comprising a liquid fill port (4), the liquid fill port (4) being disposed at one end of a liquid fill tube (5).
3. A flat heat pipe based on composite structure wick according to claim 1, characterized in that the supporting columns (2) are integrally designed and processed with the base plate (1), and the positions of the supporting columns (2) on the upper and lower base plates are symmetrically arranged.
4. A composite wick-based flat plate heat pipe according to claim 3 wherein the support columns (2) are arranged in an equally spaced array.
5. A composite wick-based flat plate heat pipe according to claim 1 wherein the nickel foam in the nickel foam assembly (3) is attached to the inner wall surface of the base plate (1), the nickel foam in the nickel foam assembly (3) corresponding to the size and arrangement of the support columns (2).
6. The composite-structure-wick-based flat-plate heat pipe according to claim 1, wherein the nickel foam is tightly fastened to the inner wall of the base plate (1) by a molecular diffusion welding connection method; the bottom plate (1) and the support columns (2) are tightly buckled by adopting a molecular diffusion welding connection mode.
7. A composite wick-based flat plate heat pipe according to claim 1 wherein the upper and lower base plates, support columns (2) and liquid-filled tubes (5) are made of a lightweight high thermal conductivity material.
8. A method for assembling a flat heat pipe based on a composite structure liquid absorption core is characterized by comprising the following steps:
s0: machining a base plate (1) into an upper base plate integrated structure and a lower base plate integrated structure which are provided with supporting columns (2) arranged in an array manner, wherein the supporting columns (2) on the upper base plate and the lower base plate are symmetrical one by one;
s1: after the upper bottom plate and the lower bottom plate with the support columns (2) are machined, respectively welding foamed nickel components (3) on the inner wall surfaces of the upper bottom plate and the lower bottom plate;
s2: after the foam nickel component is welded, welding an upper base plate and a lower base plate with support columns (2), and welding the surfaces of the support columns (2);
s3: after the upper bottom plate and the lower bottom plate are welded, a liquid filling pipe (5) is connected to a liquid filling port (4) through argon arc welding, and the whole assembly is subjected to vacuum leak detection test to determine that a welding line meets the requirements required by design;
s4: after the leakage detection is qualified, the working medium is filled, the liquid filling pipe (5) is sealed to be dead when the designed filling amount is reached, the leakage detection is carried out again, and the assembly is completed after the leakage detection is qualified.
9. An electronic component characterized by heat dissipation using a composite-wick-based flat-plate heat pipe according to any one of claims 1 to 7.
10. The electronic component as claimed in claim 9, comprising a flat heat pipe (6), a heat sink (7) and a heat source device (8), wherein the heat source device (8) is arranged on the flat heat pipe (6), and the heat sink (7) is arranged below the flat heat pipe (6).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010780007.5A CN111928706A (en) | 2020-08-05 | 2020-08-05 | Flat heat pipe based on composite structure liquid absorption core, assembly method and electronic component |
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| CN202010780007.5A CN111928706A (en) | 2020-08-05 | 2020-08-05 | Flat heat pipe based on composite structure liquid absorption core, assembly method and electronic component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112611242A (en) * | 2020-12-17 | 2021-04-06 | 南京航空航天大学 | Ultra-thin flat heat pipe with cross-scale super-infiltration liquid absorption core and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN112611242B (en) * | 2020-12-17 | 2022-02-01 | 南京航空航天大学 | Ultra-thin flat heat pipe with cross-scale super-infiltration liquid absorption core and manufacturing method thereof |
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