CN114705071A

CN114705071A - Mobile terminal, temperature-uniforming plate and manufacturing method of temperature-uniforming plate

Info

Publication number: CN114705071A
Application number: CN202210517695.5A
Authority: CN
Inventors: 靳林芳; 陈丘; 金永福; 刘用鹿; 肖永旺; 朱旭; 陈琳; 骆洋; 胡锦炎
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-07-05
Anticipated expiration: 2042-05-13
Also published as: WO2023216482A1; CN114705071B

Abstract

The embodiment of the application provides a mobile terminal, a temperature-uniforming plate and a manufacturing method of the temperature-uniforming plate. The temperature equalizing plate is positioned in a window of a middle frame of the mobile terminal and is stacked between the display screen and the battery, and the width and the area of an evaporation area of the temperature equalizing plate are relatively far smaller than those of a condensation area of the temperature equalizing plate. The temperature-equalizing plate is internally provided with a connecting structure, and the connecting structure is fixedly connected with the first cover plate and the second cover plate of the temperature-equalizing plate; at least one cover plate is made of composite materials and comprises high-strength materials and easily-welded materials, the sealing welding temperature of the temperature-equalizing plate is lower than the softening temperature of the high-strength materials, and the temperature-equalizing plate has high strength, high rigidity and controllable flatness due to the design. The flatness of the outer surface of the second cover plate is a positive directional tolerance, so that the thin heat dissipation design of the high-reliability ultrathin temperature equalizing plate and the mobile terminal is realized, and meanwhile, the battery safety of the mobile terminal and the reliability of the display screen are guaranteed.

Description

Mobile terminal, temperature-uniforming plate and manufacturing method of temperature-uniforming plate

Technical Field

The application relates to the technical field of terminals, in particular to a mobile terminal, a temperature-uniforming plate and a manufacturing method of the temperature-uniforming plate.

Background

In terminal equipment such as cell-phone, flat panel, notebook, PC, big screen etc. the electron device heating power promotes gradually along with product iteration, but the whole size of equipment, thickness are towards compact, small and exquisite orientation development, lead to the heat to gather and can't in time dispel in the equipment, make its temperature rise, not only influenced user experience, probably lead to the device high temperature to damage moreover. Therefore, various efficient heat dissipation solutions are needed to solve the problem of heat dissipation of the terminal device.

The Vapor Chamber (VC) is a cavity with a micro-nano wick structure inside and filled with fluid working medium, and is widely used for heat dissipation of electronic products. Specifically, the fluid working medium in the temperature-equalizing plate can absorb heat at a small-area heating source to form steam, so that the steam is quickly conducted to a large-area radiating surface to achieve the purpose of efficient heat radiation, and the steam can flow back to the heating source by utilizing the capillary force of the liquid absorbing core structure after being condensed into liquid to evaporate and absorb heat again.

In a mobile terminal taking a mobile phone as an example, a middle frame is used for assembling devices such as a display screen and a battery, and as the power consumption of a plurality of electronic devices (such as a camera module, an antenna module and a wired/wireless quick charging module) is increased, the required battery capacity is also increased, so that the occupied area of the battery in the mobile phone can reach more than 50%, the heat dissipation challenge in a limited space is more and more severe, the case and reliability of the battery are considered, how to reasonably utilize a battery cold area to set a temperature equalizing plate, and how to realize the thin design of the mobile terminal is difficult in the industry. If the ultrathin VC is used as a bearing part, the rigidity, the strength and the hardness of the ultrathin VC are far higher than those of the conventional copper alloy VC, so that the thin wall of the ultrathin VC can be ensured not to generate depression, wrinkle deformation and the like in internal vacuum and use falling stress, and if the rigidity, the rigidity and the strength of the uniform temperature plate are insufficient, the thermal performance of the VC is lost, and the reliability of a screen and the safety of a battery can be influenced.

Disclosure of Invention

The embodiment of the application provides a mobile terminal, a temperature-uniforming plate and a manufacturing method of the temperature-uniforming plate, which can ensure the strength of the temperature-uniforming plate and the safety and reliability of the cooperation between the temperature-uniforming plate and a display screen, a battery and other devices while realizing the thin design of the mobile terminal.

Therefore, the embodiment of the application adopts the following technical scheme:

in a first aspect, an embodiment of the present application provides a mobile terminal, which includes a display screen, a middle frame, a temperature-uniforming plate, and a battery. The middle frame comprises a first surface, a second surface and a window penetrating through the first surface and the second surface; the temperature equalizing plate is fixed to the middle frame, and at least part the temperature equalizing plate is located in the window, the temperature equalizing plate includes first apron, second apron and connection structure, first apron with form the working chamber between the second apron, connection structure is located the working chamber, connection structure with first apron fixed connection, connection structure with second apron fixed connection, the plane degree of the surface of second apron has directional positive tolerance, connection structure with the connection position of second apron is the peak value region of the plane degree of the surface of second apron, directional positive tolerance is: the temperature equalizing plate is positioned in the window, and the outer surface of the second cover plate has a convex deformation tendency from the outer edge of the second cover plate to the position of the connecting structure; the display screen is positioned on one side of the first cover plate, which is far away from the second cover plate; the battery is located the second apron and keeps away from one side of first apron.

Because the connecting structure fixedly connects the first cover plate and the second cover plate, the flatness of the outer surface of the first cover plate can be limited through the constraint of the flatness of the outer surface of the second cover plate. This application needs to set the plane degree of the surface of the temperature equalization board towards the display screen in less plane degree scope, specifically speaking, the plane degree of the surface of the temperature equalization board towards the display screen is less than the assembly clearance between temperature equalization board and the display screen. Assembly gap or to be understood as: the first mounting surface on the middle frame is used for mounting the display screen, the second mounting surface is used for mounting the temperature-equalizing plate, and the assembling clearance between the display screen and the temperature-equalizing plate can be determined according to the size of the temperature-equalizing plate, the position of the first mounting surface and the position of the second mounting surface. According to the embodiment of the application, the flatness of the outer surface of the temperature-equalizing plate facing the display screen is controlled, and the temperature-equalizing plate is easy to machine and manufacture and easy to realize accurate assembly yield from the manufacturing process of the temperature-equalizing plate and the assembly process of the mobile terminal, and the gap size between the display screen and the temperature-equalizing plate can be reasonably controlled, so that the thin design of the mobile terminal is facilitated.

In a possible embodiment, the connecting structure and the first cover plate are integrally formed, the connecting structure surrounds and forms a connecting groove, and the opening position of the connecting groove is located on the outer surface of the first cover plate. This scheme is through setting up connection structure and first apron into integrated into one piece framework, and forms the recess at first apron surface through setting up connection structure, and this recess can be at the in-process of samming board and the cooperation of plastic tool, and the recess not only marks as connection structure in the position of samming board surface, can also cooperate with the plastic tool for this scheme has simple structure, practices thrift the advantage of cost.

In a possible implementation manner, the connecting structure includes a bottom wall and a side wall, the side wall is connected between the bottom wall and the first cover plate, the bottom wall is located at the bottom of the connecting groove, the bottom of the connecting groove and the opening position of the connecting groove are oppositely arranged along a first direction, the first direction is the direction in which the display screen, the temperature equalization plate and the battery are stacked, and the bottom wall and the second cover plate are fixedly connected. This scheme provides a concrete connection structure's design, can be through die casting technology and first apron integrated into one piece, easily preparation.

In a possible embodiment, the connecting structure and the second cover plate are fixed by welding. In particular, the welded structure between the bottom wall and the second cover plate is a large area of the brazed connection, which can be understood as: the welding area between the bottom wall and the second cover plate is larger than that of the spot welding manner with respect to the spot welding. If the welding between diapire and the second apron is the spot welding, the locating action of spot welding receives external force to influence easily and produces the deformation, and it is relatively poor to connect the reliability, and the atress between connection structure and the second apron can not better combination, that is to say, connection structure can not participate in the atress supporting role of second apron. This application is fixed through brazing of great area, can be so that to be connected between connection structure and the second apron more reliably, more stable.

In one possible embodiment, the second cover plate comprises a first material layer and a second material layer which are arranged in a stacked manner, the welding temperature of the first material layer is lower than that of the second material layer, the softening temperature of the second material layer is higher than that of the first material layer, and the first material layer is used for sealing and welding the first cover plate and the second cover plate; and/or is welded and fixed with the connecting structure and the first cover plate. The second material layer is positioned on one side of the first material layer, which faces away from the first cover plate. Specifically, the welding between the connecting structure and the second cover plate adopts a low-temperature welding mode, specifically, the welding temperature is less than or equal to 850 ℃, and the benefit of defining the low-temperature welding mode is that: the performance and the strength of the temperature-equalizing plate can be ensured, and after the temperature-equalizing plate is subjected to high-temperature processes such as welding and the like, the problem of strength reduction caused by high-temperature annealing is not easy to occur in the material of the temperature-equalizing plate. The scheme can ensure the performance and the strength of the temperature equalizing plate.

In one possible embodiment, the second material layer is a stainless steel material with nitrogen element; or the second material layer is made of a titanium alloy material. The second material layer has high strength and is mainly used for supporting and bearing.

In one possible embodiment, the content e of nitrogen element [0.03 wt.%, 5 wt.%). According to the scheme, the temperature-uniforming plate with higher strength can be obtained by limiting the content of nitrogen, and the yield and the manufacturing cost of the manufacturing process can be ensured.

In a possible embodiment, the flatness of the outer surface of the first cover plate is: more than or equal to-0.1 mm and less than or equal to 0.05 mm. This scheme is through the roughness face of the surface of injecing first apron, can obtain the better mobile terminal of reliability, is favorable to guaranteeing the reliability and the security of display screen.

In a possible embodiment, the flatness of the outer surface of the second cover plate is: 0.1mm or more and 0.3mm or less. The scheme can obtain the integral form of the temperature equalizing plate by limiting the flatness of the second cover plate, and has the advantage of easy realization for the shaping process.

In a possible embodiment, the working chamber includes an evaporation area and a condensation area, a capillary channel and a vapor channel are provided in the working chamber, the capillary channel and the vapor channel both extend from the evaporation area to the condensation area, at least a portion of the connection structure is provided in the condensation area, and the connection structure is located in the vapor channel. This application has injectd the concrete position of connection structure in the temperature-uniforming plate, sets up connection structure in the condensation zone, can promote the intensity of condensation zone, and the condensation zone is used for supporting the battery, can match the equipment environment of temperature-uniforming plate in mobile terminal better.

In a possible embodiment, a direction extending from the evaporation zone to the condensation zone is a length direction of the temperature equalization plate, a width direction of the temperature equalization plate is perpendicular to the length direction, a ratio between a size of the evaporation zone in the width direction and a size of the condensation zone in the width direction is less than or equal to 0.5, in the condensation zone, the capillary channel includes a plurality of first sub-channels arranged side by side and at intervals, the vapor channel includes a plurality of second sub-channels arranged side by side and at intervals, the plurality of second sub-channels are arranged between the adjacent first sub-channels in a one-to-one correspondence, and the connection structure is arranged in the second sub-channels. This scheme can increase the stock solution volume of evaporation zone, also can increase capillary passageway and steam channel's area of contact, helps promoting the thermal behavior of samming board operation. The capillary channel of the condensation zone adopts the structural design of a willow branch leaf type, and the contact area of the capillary channel and the steam channel is increased aiming at the capillary with a parallel framework, so that the reflux of condensate is facilitated.

In a possible embodiment, one end of the first sub-channel and one end of the second sub-channel are connected to the main capillary channel, and the ends of the first sub-channel and the second sub-channel are the ends of the first sub-channel and the second sub-channel far away from the main capillary channel, and the ends are in the same direction of liquid backflow in the same first sub-channel and the direction of vapor flow in the adjacent second sub-channel. This application can reduce impedance, promotes the radiating efficiency through the unanimous design of terminal liquid reflux direction and the steam flow direction in the adjacent second subchannel towards the same first subchannel.

In a possible implementation manner, the thickness direction of the temperature equalization plate is a direction of stacking between the first cover plate and the second cover plate, the horizontal cross section of the temperature equalization plate is a cross section perpendicular to the thickness direction of the temperature equalization plate, on the horizontal cross section of the temperature equalization plate, the extending direction of each first sub-channel is the length direction of the temperature equalization plate, and the cross section of the connection structure includes a long strip shape. According to the scheme, the specific form of the connecting structure is limited, the connecting structure with a large area can be obtained, and the strength of the temperature equalizing plate is improved.

In a possible embodiment, the number of the connecting structures is one, and the connecting structures are located in the center of the working cavity in the width direction of the temperature equalizing plate; alternatively, the first and second electrodes may be,

the number of the connecting structures is even, and the connecting structures are distributed on two sides of the central position of the working cavity in the width direction of the temperature-uniforming plate; alternatively, the first and second electrodes may be,

the number of the connecting structures is three or more than three, and in the width direction of the temperature-uniforming plate, one of the connecting structures is located at the center of the working cavity, and the rest of the connecting structures are distributed on two sides of the center of the working cavity. This application sets up connection structure's quantity and specific position according to the samming plate size of difference and the demand of equipment environment, and visible samming plate can adapt to different service environment, can match different electronic equipment.

In a possible embodiment, in the condensation area, the inner surface of the first cover plate corresponding to the vapor channel is of a hydrophilic layer structure. Through right the internal surface modification of first apron is handled and is formed first hydrophilic layer, the problem of freezing and bulging of first apron can be solved to this scheme, because first apron is close to the display screen, this scheme can promote the fail safe nature of display screen.

In a possible embodiment, in the condensation area, the inner surface of the second cover plate corresponding to the vapor channel is of a hydrophilic layer structure. Through right the internal surface modification of second apron forms the hydrophilic layer of second, the problem of the freezing tympanites of second apron can be solved to this scheme, and the second apron is close to the battery and is used for bearing the weight of the battery, and battery installation environment can be guaranteed to this scheme, promotes the stability of battery performance.

In a possible embodiment, in the working chamber, the surface of the connecting structure is a hydrophobic layer structure. The scheme can enable the working medium in the steam channel to enter the capillary channel more quickly, and can avoid icing and bulging.

In a possible implementation manner, in the condensation area, the inner surface of the first cover plate corresponding to the vapor channel is a hydrophobic layer structure, and the surface of the connection structure is a hydrophobic layer structure.

In a possible embodiment, the temperature equalizing plate includes a plurality of reinforcing pillars, the reinforcing pillars are disposed in the working cavity, the reinforcing pillars are fixedly connected with one of the first cover plate and the second cover plate, the reinforcing pillars are in contact with or spaced from the other of the first cover plate and the second cover plate, the number of the connecting structures is at least one, the connecting area between each connecting structure and the first cover plate or the second cover plate is a first area, the connecting area between each reinforcing pillar and the first cover plate or the second cover plate is a second area, and the first area is more than twice as large as the second area. The reinforcing columns are arranged to ensure the sizes of the capillary channel and the steam channel of the working cavity in the temperature-uniforming plate, and the strength of the temperature-uniforming plate can be improved. The reinforcing columns and the connecting structures are combined and arranged inside one temperature-uniforming plate, so that the thermal performance of the temperature-uniforming plate can be guaranteed while the high-strength temperature-uniforming plate is obtained.

In one possible embodiment, all or most (> 60%) of the battery is within the coverage of the isothermal plate. The scheme limits the assembly relation between the temperature-equalizing plate and the battery, and the temperature-equalizing plate has high enough strength and rigidity and can bear the function of supporting the battery.

In a second aspect, an embodiment of the present application provides a temperature equalization plate, including a first cover plate, a second cover plate, and a connection structure, where a working cavity is formed between the first cover plate and the second cover plate, the connection structure is located in the working cavity, the connection structure is fixedly connected to the first cover plate, the connection structure is fixedly connected to the second cover plate, a flatness of an outer surface of the second cover plate has a positive orientation tolerance, and a connection position of the connection structure and the second cover plate is a peak area of the flatness of the outer surface of the second cover plate; the positive orientation tolerance is a position from an outer edge of the second cover plate to the connecting structure, and an outer surface of the second cover plate has a tendency to deform convexly as a whole.

The application provides a temperature-uniforming plate has the advantage of high strength, and the restriction of the plane degree through the second apron to the temperature-uniforming plate, can satisfy the equipment environment of temperature-uniforming plate in mobile terminal, from the manufacture craft of temperature-uniforming plate, mobile terminal's assembly technology angle, all have easily processing preparation, realize accurate equipment yield easily, can also the clearance size between reasonable control display screen and the temperature-uniforming plate, do benefit to mobile terminal's slim design.

In a possible implementation manner, the connecting structure includes a bottom wall and a side wall, the side wall is connected between the bottom wall and the first cover plate, the bottom wall is located at the bottom of the connecting groove, the bottom of the connecting groove and the opening position of the connecting groove are oppositely arranged along a first direction, the first direction is a direction in which a display screen, a temperature equalization plate and a battery in the mobile terminal are stacked, and the bottom wall and the second cover plate are fixedly connected. This scheme provides a concrete connection structure's design, can be through die casting technology and first apron integrated into one piece, easily preparation.

In a possible embodiment, the bottom wall and the second cover plate are fixed by welding. In particular, the welded structure between the bottom wall and the second cover plate is a large area of the brazed connection, which can be understood as: the welding area between the bottom wall and the second cover plate is larger than that of the spot welding manner with respect to the spot welding. If the welding between diapire and the second apron is the spot welding, the locating action of spot welding receives external force to influence easily and produces the deformation, and it is relatively poor to connect the reliability, and the atress between connection structure and the second apron can not better combination, that is to say, connection structure can not participate in the atress supporting role of second apron. This application is fixed through brazing of great area, can be so that to be connected between connection structure and the second apron more reliably, more stable.

In a possible embodiment, the second cover plate comprises a first material layer and a second material layer arranged in a stacked manner, the welding temperature of the first material layer is lower than the welding temperature of the second material layer, the softening temperature of the second material layer is higher than the welding temperature of the first material layer, the first material layer is used for being welded and fixed with the connecting structure and the first cover plate, and the second material layer is located on the side of the first material layer facing away from the first cover plate. Specifically, the sealing welding of the first cover plate and the second cover plate and the welding between the connecting structure and the second cover plate adopt a low-temperature welding mode, specifically, the welding temperature is less than or equal to 850 ℃, and the benefit of defining the low-temperature welding mode is that: the performance and the strength of the temperature-equalizing plate can be ensured, and after the temperature-equalizing plate is subjected to high-temperature processes such as welding and the like, the problem of strength reduction caused by high-temperature annealing is not easy to occur in the material of the temperature-equalizing plate. The scheme can ensure the performance and the strength of the temperature equalizing plate.

In one possible embodiment, the second material layer is a stainless steel material with nitrogen element; or the second material layer is made of a titanium alloy material. The second material layer has high strength and is mainly used for supporting.

In a possible embodiment, the flatness of the outer surface of the first cover plate is: more than or equal to-0.01 mm and less than or equal to-0.1 mm. This scheme is through the roughness face of the surface of injecing first apron, can obtain the better mobile terminal of reliability, is favorable to guaranteeing the reliability and the security of display screen.

In a possible embodiment, the thickness direction of the temperature equalizing plate is the direction of stacking between the first cover plate and the second cover plate, the horizontal cross section of the temperature equalizing plate is a cross section perpendicular to the thickness direction of the temperature equalizing plate, on the horizontal cross section of the temperature equalizing plate, the extending direction of each first sub-channel is the length direction of the temperature equalizing plate, and the cross section of the connecting structure is in a long strip shape. According to the scheme, the specific form of the connecting structure is limited, the connecting structure with a large area can be obtained, and the strength of the temperature equalizing plate is improved.

In a possible embodiment, the number of the connecting structures is one, and the connecting structures are located in the center of the working cavity in the width direction of the temperature equalizing plate; or the number of the connecting structures is even, and the connecting structures are distributed on two sides of the central position of the working cavity in the width direction of the temperature-uniforming plate; or the number of the connecting structures is three or an odd number greater than three, one of the connecting structures is located at the center of the working cavity in the width direction of the temperature-uniforming plate, and the rest of the connecting structures are distributed on two sides of the center of the working cavity. This application sets up connection structure's quantity and specific position according to the samming plate size of difference and the demand of equipment environment, and visible samming plate can adapt to different service environment, can match different electronic equipment.

In one possible embodiment, the first cover plate corresponding to the vapor channel includes a first main body layer and a first hydrophilic layer formed by modifying an inner surface of the first cover plate; and/or, in the condensation area, the second cover plate corresponding to the vapor channel comprises a second main body layer and a second hydrophilic layer, and the second hydrophilic layer is formed by modifying the inner surface of the second cover plate. Through right the internal surface modification of first apron is handled and is formed first hydrophilic layer, the problem of freezing and bulging of first apron can be solved to this scheme, because first apron is close to the display screen, this scheme can promote the fail safe nature of display screen. Through right the internal surface modification of second apron forms the hydrophilic layer of second, the problem of the freezing tympanites of second apron can be solved to this scheme, and the second apron is close to the battery and is used for bearing the weight of the battery, and battery installation environment can be guaranteed to this scheme, promotes the stability of battery performance.

In a third aspect, an embodiment of the present application provides a method for manufacturing a vapor chamber, including the following steps:

providing a temperature equalizing plate, wherein the temperature equalizing plate comprises a first cover plate, a second cover plate and a connecting structure, a working cavity is formed between the first cover plate and the second cover plate, the connecting structure is positioned in the working cavity, and the connecting structure is fixedly connected with the first cover plate and the second cover plate;

shaping the temperature equalizing plate, wherein in the shaping process, force is applied to the position of the connecting structure to deform the temperature equalizing plate, so that the flatness of the outer surface of the second cover plate has a positive orientation tolerance, and the connecting position of the connecting structure and the second cover plate is a peak area of the flatness of the outer surface of the second cover plate; the positive orientation tolerance is a position from an outer edge of the second cover plate to the connecting structure, and an outer surface of the second cover plate has a tendency of convex deformation as a whole.

This application passes through connection structure fixed connection between first apron and second apron, not only can improve the intensity of samming board, and connection structure be used for carrying out the plastic with the cooperation of plastic tool to the samming board, can promote the reliability of display screen and battery. In the shaping process, the shaping jig applies force to the first cover plate, and the first cover plate and the second cover plate are fixed through the connecting structure and are deformed under the action of the force of the shaping jig. On the one hand, it is possible to ensure that the first cover plate and the second cover plate have the same tendency to deform, for example: the flatness of the outer surface of the shaped first cover plate can be controlled to be less than 0.05mm, namely less than or equal to 0.05mm, and the outer surface of the first cover plate in the structural form has no large protruding part, so that the requirement of an assembly gap between the first cover plate and the display screen is met. Because the display screen is fixed in one side of the surface of first apron, this scheme is through the control to the plane degree of the surface of first apron, be favorable to the security and the reliable and stable nature of display screen, under the condition that mobile terminal received temperature variation (temperature variation can lead to display screen or center to produce the deformation) or other exogenic actions (for example mobile terminal falls or receives the striking, or the exogenic force that appears in the assembling process can lead to the fact that the mobile terminal part structure produces the deformation), reliable position relation still can be guaranteed between display screen and the first apron, the display screen can not receive the top of the surface of first apron and hold the power and lead to the display screen impaired. On the other hand, through connection structure fixed connection first apron and second apron, first apron and second apron can warp in step at the in-process of plastic, can guarantee that the working chamber of temperature-uniforming plate can keep suitable size, for example with the thickness design of working chamber in qualified scope, in order to satisfy the normal operating requirement of vapour passageway and capillary channel, this application is at the in-process to the temperature-uniforming plate plastic, the basic holding of the thickness of working chamber is unchangeable, or the change space of thickness is in the allowed band, still can satisfy the normal operating requirement of vapour passageway and capillary channel.

In a possible embodiment, the connection structure and the first cover plate are integrally formed, the connection structure surrounds and forms a connection groove, an opening position of the connection groove is located on an outer surface of the first cover plate, and the step of shaping the temperature equalization plate includes:

and providing a jig, wherein the jig comprises a supporting seat and a gland, the supporting seat is used for bearing the uniform temperature plate, the second cover plate is fixed on the supporting seat, the gland comprises a shaping column, the shaping column extends into the connecting groove and supports the bottom of the connecting groove, and the gland applies the pressure of the first cover plate so as to deform the uniform temperature plate.

In a possible embodiment, the pressing cover is in contact with the outer surface of the first cover plate during the process of shaping the temperature equalization plate. This scheme can avoid first apron evagination under the plastic process through the deformation of the first apron of gland restraint.

In a fourth aspect, an embodiment of the present application provides a mobile terminal, including:

the middle frame comprises a first surface, a second surface and a window penetrating through the first surface and the second surface;

the temperature equalizing plate is fixed to the middle frame, at least part of the temperature equalizing plate is positioned in the window, the temperature equalizing plate comprises a first cover plate, a second cover plate and a connecting structure, a working cavity is formed between the first cover plate and the second cover plate, a capillary channel, a steam channel and a working medium are arranged in the working cavity, the capillary channel and the steam channel are used for conveying the working medium between an evaporation area and a condensation area, the connecting structure is positioned in the working cavity, the connecting structure is fixedly connected with the first cover plate, the connecting structure is fixedly connected with the second cover plate, the second cover plate comprises a first material layer and a second material layer which are arranged in a stacked mode, the welding temperature of the first material layer is lower than that of the second material layer, the softening temperature of the second material layer is higher than that of the first material layer, and the first material layer is used for being welded and fixed with the connecting structure and the first cover plate, the second material layer is positioned on one side of the first material layer, which faces away from the first cover plate;

the display screen is positioned on one side, far away from the second cover plate, of the first cover plate;

and the battery is positioned on one side of the second cover plate, which is far away from the first cover plate.

This scheme is through connection structure's setting to and the second apron is combined material's setting, makes the temperature equalization board have higher intensity.

In one possible implementation, the second material layer is a stainless steel material with nitrogen element; or the second material layer is made of a titanium alloy material.

In one possible implementation, the content of nitrogen element e [0.03 t.%, 5 t.%).

In a possible implementation, the thickness of the second material layer is greater than the thickness of the first material layer.

In a possible implementation manner, the second material layer is formed on the surface of the first material layer by means of electroplating.

In a possible implementation manner, an electroplating bottom layer M4 is arranged between the second material layer and the first material layer.

In a possible implementation manner, the second cover plate further includes a third material layer, a welding temperature of the third material layer is lower than a welding temperature of the second material layer, and the third material layer is located on a side of the second material layer, which faces away from the first material layer.

For the beneficial effects and the detailed analysis of the various possible implementations of the fourth aspect, reference may be made to the description of the corresponding specific possible implementation portions of the first aspect.

Other specific embodiments and advantages of the present application will be described in detail in the detailed description that follows.

Drawings

The drawings that accompany the detailed description can be briefly described as follows.

Fig. 1 is a schematic perspective exploded view of a mobile terminal according to an embodiment of the present application;

FIG. 2 is a schematic plan view of a mobile terminal according to an embodiment of the present application;

FIG. 3 is a schematic plan view of a mobile terminal according to an embodiment of the present application;

FIG. 4 is a cross-sectional view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 5 is a cross-sectional view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 6 is a cross-sectional view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 7 is a cross-sectional view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 8A is a schematic diagram illustrating a deformation trend of a uniform temperature plate according to an embodiment of the present application in a case that a second cover plate is fixedly connected to a connecting structure;

FIG. 8B is a schematic diagram illustrating a deformation trend of the second cover plate of the temperature-uniforming plate fixedly connected to the two connecting structures according to an embodiment of the present application;

fig. 8C is a schematic deformation trend of the temperature equalization plate according to an embodiment of the present disclosure in a case that the second cover plate is fixedly connected to three connecting structures;

FIG. 9 is a schematic illustration of the distribution and basic morphology of the connecting structures and reinforcing pillars in a vapor plate provided in accordance with an embodiment of the present application;

FIG. 10 is a schematic illustration of the distribution and basic morphology of the connecting structures and reinforcing columns in a vapor plate provided in accordance with an embodiment of the present application;

FIG. 11 is a schematic illustration of the distribution and basic morphology of the connection structures in a vapor plate provided in accordance with an embodiment of the present application;

FIG. 12 is a schematic illustration of the distribution and basic morphology of the connection structures in a vapor plate provided in accordance with an embodiment of the present application;

FIG. 13 is a cross-sectional view of a second cover plate in a vapor plate provided in accordance with an embodiment of the present application;

FIG. 14 is a cross-sectional view of a second cover plate in a vapor plate provided in accordance with an embodiment of the present application;

FIG. 15 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 16A is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 16B is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 16C is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 17 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 18 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 19 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 20 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 21 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 22 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 23 is a schematic view of a vapor chamber provided in accordance with an embodiment of the present application;

FIG. 24 is a schematic view of the state of liquid on the surface of a fixing body in the case that the solid surface in the vapor chamber is a hydrophobic layer and a hydrophilic layer;

fig. 25 schematically shows a variation of the droplet in the working chamber in the case where the surface of the connecting structure is a hydrophobic layer and the inner surfaces of the first cover plate and the second cover plate are hydrophilic layers;

fig. 26 is a schematic diagram of a shaping process in a manufacturing method of a vapor chamber according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may include, for example, a fixed connection, a detachable connection, an interference connection, or an integral connection; the specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

According to the application, the temperature equalizing plate is combined with the middle frame of the mobile terminal, so that the dual functions of heat dissipation and bearing are realized, and the thin design of the mobile terminal is realized. The mobile terminal provided by the present application may be, but is not limited to: the mobile phone, the tablet computer, the notebook computer, and the related module, the structural member, the functional member, etc. with the heat dissipation function.

Fig. 1 is a schematic exploded perspective view of a mobile terminal according to an embodiment of the present disclosure, where the mobile terminal includes a display 10, a middle frame 20, a temperature-uniforming plate 30, a battery 40, a circuit board 50, and a rear case 60. The middle frame 20 is used for assembling the display screen 10, the temperature-uniforming plate 30, the battery 40 and the circuit board 50. The middle frame 20 comprises a first surface S1 and a second surface S2 which are oppositely arranged and an outer side surface S3 connected between the first surface S1 and the second surface S2, the display screen 10 is assembled to the middle frame 20 from one side of the first surface S1, heat dissipation film materials 201 such as graphite heat dissipation fins, graphene heat conduction films and copper molds can be arranged between the display screen 10 and the middle frame 20, the middle frame 20 is further connected with a mounting and positioning structure 202, and the mounting and positioning structure 202 is used for assembling the temperature equalization plate 30. The battery 40 is assembled to the middle frame 20 from one side of the second surface S2, and the second surface S2 may also be used to mount a main board or other electronic devices, such as a camera module, an antenna module, and the like. In one embodiment, the outer side surface S3 may serve as an outer surface of the mobile terminal, and the outer side surface S3 is connected between an edge of the display screen 10 and an edge of the rear case 60. In one embodiment, the outer side surface S3 may also be hidden by the rear case 60, i.e. the edge of the rear case 60 is abutted with the edge of the display screen 10. The middle frame 20 is further provided with a window W penetrating the first surface S1 and the second surface S2. The area of the window W may be larger than the area of the cell 40. The window W is used for mounting the temperature-uniforming plate 30, specifically, the temperature-uniforming plate 30 may be completely accommodated inside the window W, in other embodiments, only a part of the temperature-uniforming plate 30 may be accommodated in the window W, and a part of the temperature-uniforming plate 30 may be located outside the window W. The temperature-equalizing plate 30 and the middle frame 20 can be connected through the glue structure 203, and can assist other connecting and positioning modes such as screws, rivets, laser spot welding and the like. The temperature-equalizing plate 30 located in the window W is disposed corresponding to the battery 40, and the temperature-equalizing plate 30 located outside the window W may be disposed corresponding to the heat generating device on the circuit board 50. The area of the vapor chamber 30 inside the window W is larger, and the area of the vapor chamber 30 outside the window W is smaller, for example, the area of the vapor chamber 30 inside the window W is twice or more than twice the area of the vapor chamber 30 outside the window W. The direction in which the display screen 10, the middle frame 20 and the battery 40 are stacked is a first direction, and the first direction can also be understood as a thickness direction of the mobile terminal, in the first direction, the battery 40 is within the coverage area of the temperature-uniforming plate 30, that is, the battery 40 is assembled on the surface of the temperature-uniforming plate 30, and the vertical projection of all or most (60%) of the battery 40 on the temperature-uniforming plate 30 is located inside the temperature-uniforming plate 30. The scheme limits the assembly relation between the temperature-equalizing plate and the battery, and the temperature-equalizing plate has high enough strength and rigidity and can bear the function of supporting the battery.

The temperature equalization plate 30 and the middle frame 20 are fixedly connected, and the temperature equalization plate and the middle frame are combined to share the bearing function of the mobile terminal. In one embodiment, the vapor chamber 30 is assembled to the window W of the middle frame 20 from one side of the display screen 10. Referring to fig. 2, fig. 2 is an exploded view of a cross section of a mobile terminal according to an embodiment of the present application, in which a window W of a middle frame 20 has a stepped hole shape, the window W includes a first section W1 and a second section W2 that are connected, a size of the first section W1 is larger than a size of the second section W2, the first section W1 is located between the second section W2 and a first surface S1, and the second section W2 is located between the first section W1 and a second surface S2. In the present embodiment, the sectional shape of the temperature equalization plate module is identical to the sectional shape of the window W, and the temperature equalization plate 30 is mounted into the window W from the side of the first surface S1. The fixing mode between the temperature equalizing plate 30 and the middle frame 20 can be any one or combination of welding, bonding, riveting, screw fixing and metal encapsulation injection molding. In another embodiment, the temperature-uniforming plate 30 is assembled to the window W of the middle frame 20 from one side of the battery 40. Referring to fig. 3, fig. 3 is an exploded schematic view of a cross-section of a mobile terminal according to an embodiment of the present application, in which a window W of a middle frame 20 is in a stepped hole shape, the window W includes a first section W1 and a second section W2 that are connected, a size of the first section W1 is smaller than a size of the second section W2, the first section W1 is located between the second section W2 and a first surface S1, and the second section W2 is located between the first section W1 and a second surface S2. In the present embodiment, the sectional shape of the temperature-uniforming plate 30 is matched with the sectional shape of the window W, and the temperature-uniforming plate 30 is mounted into the window W from the side of the second surface S2.

Referring to fig. 2 and 3, in one embodiment, the battery 40 is fixedly connected to the temperature-uniforming plate 30 through an adhesive. The side of the battery 40 facing away from the vapor chamber 30 is provided with a heat conductive film 70. It can be understood that: the heating elements (such as the heating device 52 on the circuit board 50 and the battery 40) on the mobile terminal are positioned between the temperature equalizing plate 30 and the heat conducting film 70 to form a sandwich heat dissipation mode, which has high heat dissipation efficiency, can realize rapid heat conduction, and solves the problem of heat generation of the mobile terminal. Specifically, the heat conductive film 70 may be a graphene material (e.g., a graphene film) or a thin temperature equalization plate module (may be a thin film temperature equalization plate), and since the heat conductive film 70 does not need to have a load-bearing function and does not need to have strength and rigidity requirements, it may be a thin film structure for the design of a thin mobile terminal.

The thermal film 70 may have an irregular shape, or have no fixed profile structure, or have a flexible structure, so that it can be matched to various devices in the mobile terminal, such as a wireless charging device, an antenna, NFC, and the like.

In one embodiment, the heat generating device 52 on the circuit board 50 may be a main heat generating device such as an AP application processor, a power management chip, a charging device, etc. The number of circuit boards 50 in the mobile terminal may be one or more (including two), for example, two circuit boards 50 are distributed on both sides of the battery 40, wherein one circuit board 50 is disposed on the top of the mobile terminal and the other circuit board is disposed on the bottom of the mobile terminal. The number of the battery 40 in the mobile terminal may be one or two.

In one embodiment, the mobile terminal further comprises a wireless charging coil 80, the wireless charging coil 80 is located on one side of the heat conductive film 70 facing away from the battery 40, and the wireless charging coil 80 can be fixed on the inner surface of the rear case 60.

The vapor chamber 30 can have the function of supporting the battery 40 regardless of the direction from which the vapor chamber 30 is assembled to the middle frame 20 (which can be understood as a load-bearing vapor chamber extending into the battery compartment). The heat conductivity coefficient of the temperature equalizing plate can reach more than 5000W/m-K by utilizing internal vacuum two-phase heat dissipation, but the thickness of the load-bearing temperature equalizing plate extending into the battery compartment is less than or equal to 0.5 mm, the thickness of the temperature equalizing plate is ultrathin, if the strength, the rigidity and the hardness of the temperature equalizing plate are insufficient, the temperature equalizing plate can generate structural deformation and change the planeness in the using process of the mobile terminal under the condition of falling, a steam channel or a capillary structure in the temperature equalizing plate is damaged, so that the temperature equalizing plate can not work normally, and the heat conductivity coefficient can be reduced even to be 15W/m-K of stainless steel. The flatness-changed vapor chamber may structurally abut against other components, such as a screen, and even cause a battery safety accident. Therefore, the temperature equalization plate provided by the application can only keep the ultrathin high heat dissipation performance of the mobile terminal by meeting the requirements of high strength, high rigidity and high flatness required by the structural middle frame. Therefore, the present application has requirements for the strength, rigidity, and other properties and flatness of the vapor chamber 30. The vapor chamber 30 is described in detail below.

Fig. 4 and 5 are schematic cross-sectional views of two kinds of series-structured vapor chambers, wherein the vapor region 301 of the vapor chamber in fig. 4 has a thickness greater than that of the condensation region 302, thereby forming a 2.5D structure, and the vapor chamber in fig. 5 is a flat plate. Fig. 6 and 7 show two kinds of temperature equalization plates with parallel architectures. Referring to fig. 4, 5, 6 and 7, the temperature-uniforming plate 30 includes a first cover plate 31 and a second cover plate 32, and the first cover plate 31 and the second cover plate 32 are interconnected to form a working chamber 33 therebetween. Specifically, the first cover plate 31 and the second cover plate 32 may be connected by a seal welding manner, and enclose a working cavity 33 inside the temperature equalizing plate, the working cavity 33 is pumped through to maintain a negative pressure, and a cooling working medium is injected. In the process of manufacturing the first cover plate 31 and the second cover plate 32, a connection structure 34, a reinforcing column 36 and a capillary channel 35 (also called a capillary wick, i.e. a capillary structure in the working chamber 33, which is a main channel for the cooling liquid to flow) are formed on the surfaces of the first cover plate 31 and the second cover plate 32. The reinforcing column 36 and the connecting structure 34 in the embodiment shown in fig. 4 and 5 are formed by punching.

Referring to fig. 4, in a specific embodiment, the first cover plate 31 includes a first main body 311 and a first edge 312, the first edge 312 is located at the periphery of the first main body 311, the first main body 311 is bent and extended relative to the first edge 312, and the first main body 311 surrounds to form an accommodating space. The second cover plate 32 includes a second main body 321 and a second edge 322, and the first edge 312 and the second edge 322 are butted together to form a skirt of the vapor-dispensing plate 30. Specifically, the first edge 312 and the second edge 322 are fixedly sealed by welding. The first body 311 and the second body 312 together enclose a working chamber 33.

As shown in fig. 6 and 7, the second cover 32 has a flat plate-like structure, i.e., the second body 321 and the second edge 322 are coplanar. The reinforcing columns 36 and the connecting structures 34 in the embodiment shown in fig. 6 and 7 are etched.

The temperature equalizing plate 30 can rapidly conduct the heat of the small-area heat source to the large-area heat dissipation surface, thereby achieving the purpose of efficient heat dissipation. The working mechanism of the heat pump type heat pump device is that the characteristics of heat absorption by boiling and heat release by condensation of a fluid working medium are utilized, and the effect of quickly conveying the heat at the hot end to the cold end through vapor flow is realized. Specifically, referring to fig. 4, the working chamber 33 is a sealed chamber, and the working chamber 33 includes an evaporation zone 301 and a condensation zone 302. The working cavity 33 is internally provided with a capillary channel 35, a steam channel 37 and a working medium. The working medium can be pure water, methanol, ethanol, etc. Both capillary passage 35 and vapor passage 37 extend from evaporation zone 301 to condensation zone 302. Capillary channel 35 and vapor channel 37 are used to transport the working fluid between evaporation zone 301 and condensation zone 302. The capillary channel 35 and the vapor channel 37 are in physical direct contact or connected to achieve gas-liquid two-phase conversion of the working medium. The heat source in the mobile terminal is arranged corresponding to the evaporation area 301, and specifically, the heat source may be a power device on a circuit board in the mobile terminal, or other heat generating devices. The heat generated by the heat source enters the temperature-uniforming plate 30 through a heat conduction manner, the evaporation zone 301 absorbs the heat of the heat source, and the working medium liquid phase in the capillary channel 35 in the evaporation zone 301 is boiled and changed into vapor phase. The vapor diffuses to the condensation area 302 through the vapor passage 37, and when the vapor contacts the inner wall of the working chamber 33 with lower temperature in the condensation area 302, the vapor is rapidly condensed into liquid working medium and releases heat. The liquid working substance is returned to evaporation zone 301 by the capillary force of capillary passage 35.

In one embodiment, the connection structure 34 is disposed in the working chamber 33, and the connection structure 34 and the first cover plate 31 and the second cover plate 32 are all in a fixed connection relationship. The connecting structure 34 can not only improve the strength of the temperature equalizing plate, but also adjust the flatness of the temperature equalizing plate 30. The connecting structure 34 is used for being matched with a shaping jig, and the flatness of the temperature-uniforming plate 30 is adjusted through the shaping jig. Referring to fig. 8A, 8B and 8C, the present application provides a vapor chamber 30 having a positive tolerance for the orientation of the outer surface of the second cover plate 32, and the connection location of the connection structure 34 and the second cover plate 32 is a peak region R of the flatness of the outer surface of the second cover plate 32. That is, the second cover 32 has a convex structure, and the connecting structure 34 is located at a region of the second cover 32 where the convex amount is large. Projecting amount of the second cover 32: it means that the middle area of the second cover plate 32 has a convex deformation tendency with reference to the edge position of the second cover plate 32. It is understood that the peak region R refers to a region where the protrusion amount of the outer surface of the second cover 32 is large, and of course, the connection structure 34 may be located at a position where the protrusion amount of the second cover 32 is maximum. The positive orientation tolerance is a tendency for the outer surface of the second cover plate 32 to be deformed outwardly as a whole from the outer edge of the second cover plate 32 to the position of the connecting structure 34. Fig. 8A schematically shows the deformation tendency in the case where the second lid 32 is fixedly connected to one of the connection structures 34, and in the case shown in fig. 8A, the peak region R is small in area, and the connection position of the connection structure 34 and the second lid 32 is located at the position where the amount of projection of the second lid 32 is maximum. In fig. 8A, the part inside the larger circle is an enlarged schematic view of the part inside the smaller circle, and shows that the uneven structure is visible in a partial region in an enlarged state of the surface of the second cover 32. Fig. 8B schematically shows the deformation tendency in the case where the second cover 32 is fixedly connected to the two connecting structures 34, in the case shown in fig. 8B, the area of the peak region R is larger than the peak region R shown in fig. 8A, the connecting positions of the two connecting structures 34 and the second cover 32 are located within the peak region R, and a larger amount of protrusion (larger than the amount of protrusion at the positions of the connecting structures 34) is also present in the second cover 32 between the two connecting structures 34. Fig. 8C schematically shows the deformation tendency in the case where the second lid 32 is fixedly connected to the three connection structures 34, and in the case shown in fig. 8C, the area of the peak region R is larger than the peak region R shown in fig. 8B, the connection positions of the three connection structures 34 and the second lid 32 are located within the peak region R, the connection position of the connection structure 34 located in the middle with the second lid 32 is the position where the amount of projection is the largest, and the amount of projection outside the connection of the other two connection structures 34 and the second lid 32 is slightly smaller (smaller than the amount of projection at the position of the connection structure 34 located in the middle).

The outer surface of the second cover plate 32 has a tendency to deform outwardly as a whole, and it is understood that the tendency to deform outwardly as a whole is not considered the concave-convex form at a certain local position from the outer edge to the position of the connection structure 34. In one embodiment, the outer surface of the second cover plate 32 may have a linear deformation tendency from the outer edge to the connecting structure 34, and the specific deformation curve may be a straight line or a curve having an ascending tendency. In another embodiment, a small range of concave-convex variation is allowed for the flatness of the outer surface of the second cover plate 32 from the outer edge to the connecting structure 34, it can be understood that a small amplitude oscillation is allowed on the basis of the linear deformation tendency, and the specific deformation curve can be a wavy line or a sawtooth line with an ascending tendency. That is, in the case of ignoring the rugged microstructure at a local position, the overall deformation tendency of the outer surface of the second cover plate 32 of the temperature-uniforming plate provided by the present application is a tendency of gradually bulging from the outer edge to the position of the connection structure 34.

According to the present application, at least a portion of the temperature-equalizing plate 30 is assembled in the window W of the middle frame 20, the temperature-equalizing plate 30 forms a portion of the middle frame 20, and the temperature-equalizing plate 30 not only has a heat dissipation function, but also is used for carrying the battery 40. Therefore, the strength of the vapor chamber 30 is highly required, and the battery 40 needs to be carried. Moreover, since the vapor chamber 30 is located between the display screen 10 and the battery 40, the flatness of the vapor chamber 30 is also required to ensure the safety and reliability of the display screen 40. The present application can define the flatness of the outer surface of the first cover plate 31 by defining the outer surface of the second cover plate 32 to have a positive orientation tolerance, and the connection structure 34 and the second cover plate 32 are connected at the peak region R of the outer surface of the second cover plate 32, since the connection structure 34 fixedly connects the first cover plate 31 and the second cover plate 32, and by the constraint of the flatness of the outer surface of the second cover plate 32. The present application requires that the flatness of the surface of the vapor chamber 30 facing the display screen 10 is set within a small flatness range, and specifically, the flatness of the surface of the vapor chamber 30 facing the display screen 10 is smaller than the assembly gap between the vapor chamber 30 and the display screen 10. Assembly gap or to be understood as: the first installation surface on the middle frame 20 is used for installing the display screen 10, the second installation surface is used for installing the temperature-uniforming plate 30, and the assembly gap between the display screen 10 and the temperature-uniforming plate 30 can be determined according to the size of the temperature-uniforming plate 30, the position of the first installation surface and the position of the second installation surface. In a specific embodiment, the flatness of the outer surface of the temperature-uniforming plate 30 facing the display screen 10 is greater than or equal to-0.1 mm and less than or equal to 0.05mm, and the flatness of the outer surface of the temperature-uniforming plate 30 facing the display screen 10 is controlled within the range, so that from the perspective of the manufacturing process of the temperature-uniforming plate 30 and the assembling process of the mobile terminal, the temperature-uniforming plate has the advantages of easy processing and manufacturing, easy realization of accurate assembling yield, reasonable control of the gap size between the display screen 10 and the temperature-uniforming plate 30, and contribution to the thinning design of the mobile terminal. In a specific embodiment, the flatness of the outer surface of the first cover plate 31 is 0.05 mm.

The flatness of the outer surface of the second cover plate 32 is: 0.1mm or more and 0.3mm or less. In a specific embodiment, the flatness of the outer surface of the second cover plate 32 is 0.25 mm. The battery 40 and the temperature-uniforming plate 30 are fixedly connected through a back adhesive, the back adhesive is used for fixing the battery 40 on one hand, and on the other hand, the thickness of the back adhesive can adjust the assembling space of the battery. The expansion space is typically located between the rear case and the battery.

This application passes through connection structure 34 fixed connection between first apron 31 and second apron 32, not only can improve the intensity of temperature-uniforming plate 30, and combines connection structure 34 to be used for carrying out the characteristic of plastic with the cooperation of plastic tool to the temperature-uniforming plate, can promote display screen 10 and battery 40's reliability. Referring to fig. 24, in a specific embodiment, in the shaping process, the shaping jig applies a force to the first cover plate 31, and since the first cover plate 31 and the second cover plate 32 are fixed by the connecting structure 34, both the first cover plate 31 and the second cover plate 32 are deformed by the force of the shaping jig. On the one hand, it is possible to ensure that the first cover plate 31 and the second cover plate 32 have the same tendency to deform, for example: the flatness of the outer surface of the shaped first cover plate 31 can be controlled below 0.05mm, namely, less than or equal to 0.05mm, and the outer surface of the first cover plate 31 in such a structural form has no large protruding part, so that the requirement of the assembly gap between the first cover plate 31 and the display screen 10 is met. Because the display screen 10 is fixed on one side of the outer surface of the first cover plate 31, the scheme is favorable for the safety and stability and reliability of the display screen 10 by controlling the flatness of the outer surface of the first cover plate 31, under the condition that the mobile terminal is subjected to temperature change (the temperature change can cause the display screen or the middle frame to deform) or other external force actions (for example, the mobile terminal falls or is impacted, or the external force generated in the assembling process can cause the structure of the mobile terminal part to deform), the reliable position relation can still be ensured between the display screen 10 and the first cover plate 31, and the display screen 10 cannot be damaged due to the propping force of the outer surface of the first cover plate 31. On the other hand, the first cover plate 31 and the second cover plate 32 are fixedly connected through the connecting structure 34, the first cover plate 31 and the second cover plate 32 can be deformed synchronously in the shaping process, and it can be ensured that the working cavity 33 of the vapor chamber plate can keep a proper size, for example, the thickness of the working cavity 33 is designed in a qualified range to meet the normal working requirements of the vapor channel 37 and the capillary channel 35.

The direction extending from the evaporation zone 301 to the condensation zone 302 of the temperature-uniforming plate 30 is the length direction of the temperature-uniforming plate 30, and the width direction of the temperature-uniforming plate is perpendicular to the length direction. In one embodiment, the direction from the top to the bottom of the mobile terminal is consistent with the length direction of the temperature equalization plate in the mobile terminal. In a specific embodiment, the ratio between the dimension of the evaporation zone 301 in the width direction and the dimension of the condensation zone 302 in the width direction is less than or equal to 0.5, the number of the connection structures 34 can be configured according to the specific dimension of the temperature equalization plate 30, and a plurality of the connection structures 34 can be provided for the temperature equalization plate 30 with a larger dimension.

In one embodiment, referring to fig. 9 and 10, the number of the connecting structures 34 provided in the temperature-uniforming plate 30 is one, and the connecting structures 34 are located at the center of the working chamber 33 in the width direction of the temperature-uniforming plate. Fig. 9 and 10 schematically show the specific location and basic configuration of the connecting structure 34 and the arrangement of the reinforcing posts 36. In the embodiment shown in fig. 9, the connecting structure 34 is elongated, but it is also understood that the cross-sectional shape of the connecting structure 34 includes an elongated shape, for example, the connecting structure may be rectangular, racetrack shaped. In the embodiment shown in fig. 9, stiffening columns 36 have a square cross-sectional shape, and the cross-sectional area of stiffening columns 36 is significantly smaller than the cross-sectional area of connecting structure 34. In the embodiment shown in fig. 10, the cross-section of the connecting structure 34 is circular, and the cross-sectional shape of the reinforcing column 36 may also be, but is not limited to, circular, and the cross-sectional area of the reinforcing column 36 is significantly smaller than the cross-sectional area of the connecting structure 34. According to the scheme, the specific form of the connecting structure is limited, the connecting structure with a large area can be obtained, and the strength of the temperature equalizing plate is improved.

Referring to fig. 5, in one embodiment, the reinforcing column 36 in the temperature equalizing plate 30 is disposed in the working chamber 33, the reinforcing column 36 is fixedly connected with one of the first cover plate 31 and the second cover plate 32, the reinforcing column 36 is in contact with or spaced from the other of the first cover plate 31 and the second cover plate 32, the number of the connecting structures 34 is at least one, the connecting area between each connecting structure 34 and the first cover plate 31 or the second cover plate 32 is a first area, the connecting area between each reinforcing column 36 and the first cover plate 31 or the second cover plate 32 is a second area, and the first area is more than twice the second area. The reinforcing columns are arranged to ensure the sizes of the capillary channel and the steam channel of the working cavity in the temperature-uniforming plate, and the strength of the temperature-uniforming plate can be improved. The reinforcing columns and the connecting structures are combined and arranged inside one temperature-uniforming plate, so that the thermal performance of the temperature-uniforming plate can be guaranteed while the high-strength temperature-uniforming plate is obtained.

Referring to fig. 11, in one embodiment, the number of the connecting structures 34 provided in the temperature-uniforming plate 30 is an even number (fig. 11 schematically shows a case of two connecting structures 34), in the width direction of the temperature-uniforming plate 30, the connecting structures 34 are distributed on both sides of the central position C of the working chamber 33 (which may be symmetrically distributed or asymmetrically distributed), and the position indicated by the dashed line in fig. 11 is the central position C of the working chamber 33 in the width direction of the temperature-uniforming plate 30.

Referring to fig. 12, in one embodiment, the number of the connecting structures 34 provided in the temperature-uniforming plate 30 is three or an odd number greater than three (the case of three connecting structures 34 is schematically expressed in fig. 12), in the width direction of the temperature-uniforming plate 30, one of the connecting structures 34 is located at the central position C of the working chamber 33, and the rest of the connecting structures 34 are symmetrically distributed at both sides of the central position C of the working chamber 33. The position indicated by the broken line in fig. 12 is the center position C of the working chamber 33 in the width direction of the temperature-uniforming plate 30. This application sets up connection structure's quantity and specific position according to the samming plate size of difference and the demand of equipment environment, and visible samming plate can adapt to different service environment, can match different electronic equipment.

The connection structures 34 illustrated in fig. 11 and 12 are symmetrically disposed on both sides of the central position C, and it is understood that the connection structures 34 are substantially symmetrical on both sides of the central position C, and are not limited to absolute complete symmetry, for example, the connection structures 34 on both sides of the central position C may have different shapes, and the connection structures 34 on both sides of the central position C may have unequal distances from the central position C.

The connecting structure 34 and the first cover plate 31 are integrally formed, in a specific embodiment, the connecting structure 34 may be formed by performing a stamping process on the first cover plate 31, and in other embodiments, the connecting structure 34 may also be formed by performing an etching process on the first cover plate 31.

Referring to fig. 4, the connection structure 34 surrounds and forms a connection recess 341, and an opening position of the connection recess 341 is located on an outer surface of the first cover plate 31. The outline of the opening position of the connection groove 341 is circular, rectangular or racetrack shaped. In one embodiment, the second cover plate 32 includes a flat plate-shaped structure, the connecting structure 34 has a trapezoid shape in a cross section of the temperature equalization plate in a direction perpendicular to the second cover plate 32, a size of an opening position of the connecting groove 341 is larger than a size of a bottom of the connecting groove 341, and the bottom of the connecting groove 341 and the opening position of the connecting groove 341 are disposed opposite to each other along a first direction, which is a direction in which the display screen 10, the temperature equalization plate 30 and the battery 40 are stacked. This scheme provides a concrete connection structure's design, can be through stamping process and first apron integrated into one piece, easily preparation. This scheme is through setting up connection structure and first apron into integrated into one piece framework, and forms the recess at first apron surface through setting up connection structure, and this recess can be at the in-process of samming board and the cooperation of plastic tool, and the recess not only marks as connection structure in the position of samming board surface, can also cooperate with the plastic tool for this scheme has simple structure, practices thrift the advantage of cost. The connecting structure 34 includes a bottom wall 342 and a side wall 343, the side wall 343 is connected between the bottom wall 342 and the first cover plate 31, the bottom wall 342 is located at the bottom of the connecting groove 341, and the bottom wall 342 is fixedly connected with the second cover plate 32.

The bottom wall 342 and the second cover plate 32 are fixed by welding. Specifically, the welded structure between the bottom wall 342 and the second lid plate 32 is a large area of the brazed connection, which can be understood as: the welding area between the bottom wall 342 and the second lid plate 32 is larger than that of the spot welding manner with respect to the spot welding. If the welding between the bottom wall 342 and the second cover plate 32 is spot welding, the positioning function of the spot welding is easily affected by external force to generate deformation, the connection reliability is poor, and the stress between the connection structure 34 and the second cover plate 32 cannot be better combined, that is, the connection structure 34 cannot participate in the stress supporting function of the second cover plate 32. The present application can make the connection between the connecting structure 34 and the second cover plate 32 more reliable and stable through the brazing fixation with a larger area. The connecting structure 34 connects the first cover plate 31 and the second cover plate 32 into a whole, so as to enhance the rigidity of the temperature equalization plate, and the first cover plate 31 and the connecting structure 34 can share the supporting function with the second cover plate 32.

The welding between the connecting structure 34 and the second cover plate 32 is performed by means of low-temperature welding, specifically, the welding temperature is less than or equal to 850 ℃, and the benefit of defining the low-temperature welding mode is that: the performance and the strength of the temperature-equalizing plate can be ensured, and after the temperature-equalizing plate is subjected to high-temperature processes such as welding and the like, the problem of strength reduction caused by high-temperature annealing is not easy to occur in the material of the temperature-equalizing plate.

In one embodiment, the vapor chamber 30 is made of a composite material, and one or both of the first cover plate 31 and the second cover plate 32 may be made of a composite material. The composite material may include a weldable material and a high strength material. The sealing welding between the first cover plate 31 and the second cover plate 32 is completed by an easy-to-weld material, the temperature of the easy-to-weld material is lower than the welding temperature of high-strength materials such as stainless steel, titanium alloy and the like, a welding process of low-temperature welding can be adopted, after the high-temperature manufacture procedure of the uniform-temperature plate such as welding and the like, the problem of strength reduction caused by high-temperature annealing of the high-strength materials is solved, and the performance and the strength of the uniform-temperature plate can be ensured. In one embodiment, the easy-to-weld material may be a pure copper/copper alloy material, and the high-strength material may be a stainless steel material having annealing softening resistance.

Referring to fig. 13, in a specific embodiment, the second cover plate 32 is made of a composite material, and the second cover plate 32 includes a first material layer M1 and a second material layer M2 which are stacked, wherein a welding temperature of the first material layer M1 is lower than a welding temperature of the second material layer M2, and a softening temperature of the second material layer M2 is higher than a welding temperature of the first material layer M1. The material with high softening temperature has the annealing softening resistance. The second material layer M2 may be made of a stainless steel material resistant to high temperature annealing softening, such as high nitrogen steel. The method specifically comprises the following steps: the second material layer M2 is a stainless steel material with nitrogen element in a content e [0.03 wt.%, 5 wt.%). In another embodiment, the second material layer M2 may also be a titanium alloy material, and the titanium alloy material also has a high softening temperature. The first material layer M1 is used for being welded and fixed (a low-temperature welding process may be adopted) with the connecting structure 34 and the first cover plate 31, and the first material layer M1 is made of a material with good compatibility with working media (located in the working chamber 33) such as water and the like and low welding temperature, such as pure copper or copper alloy. The second material layer M2 is located on the side of the first material layer M1 facing away from the first cover plate 31, and the second material layer M2 has high strength and is mainly used for supporting.

The temperature-uniforming plate provided by the embodiment of the application is fixedly connected with the connecting structure 34 between the first cover plate 31 and the second cover plate 32, the second cover plate 32 is limited to be made of the composite material, the welding temperature can be reduced based on the first material layer M1, the problem of working medium compatibility between the second material layer M2 and the working cavity 33 of the temperature-uniforming plate 30 is solved, the strength of the temperature-uniforming plate 30 is improved based on the second material layer M2 (high-nitrogen steel), the problem of strength reduction of the temperature-uniforming plate 30 in the conventional high-welding-temperature scheme is solved, and the flatness of the second cover plate 32 is not emphasized in the scheme.

In a specific embodiment, the thickness of the second material layer M2 is greater than the thickness of the first material layer M1. Since the primary function of the first material layer M1 is soldering, the support of the primary function of the second material layer M2, by limiting the thickness of the second material layer M2 to be greater than that of the first material layer M1, can obtain a higher strength of the vapor chamber 30 in a limited space.

The first material layer M1 and the second material layer M2 may be integrated by electroplating or compounding, that is, the second cover plate 32 is formed by preparing laminated materials by electroplating or compounding.

In one embodiment, the second material layer M2 is subjected to a surface cleaning process and then electroplated to form the first material layer M1 on the surface of the second material layer M2. The second material layer M2 is formed on the surface of the first material layer M1 by electroplating. An electroplating base layer M4 is arranged between the second material layer M2 and the first material layer M1, and the electroplating base layer M4 may be electroplated nickel. The plating primer layer M4 is not necessary, and the plating primer layer M4 is set according to the requirement of the processing technology.

In another embodiment, first material layer M1 and second material layer M2 are combined into a one-piece composite material by removing an oxide layer from the surfaces of first material layer M1 and second material layer M2 (e.g., by mechanical or plasma cleaning), and then performing vacuum hot rolling, vacuum cold rolling, or vacuum diffusion welding.

Referring to fig. 14, in a specific embodiment, the second cover plate 32 further includes a third material layer M3, the third material layer M3 has a lower welding temperature than the second material layer M2, and the third material layer M3 is located on a side of the second material layer M2 facing away from the first material layer M1. The third material layer M3 may be the same as the first material layer M1, both having the same strength or stiffness. The third material layer M3 may function as: for reinforcing the strength of the second cap plate 32 or eliminating internal stress. The third material layer M3 may be a functional layer provided for electrical connection or corrosion prevention.

In one embodiment, the second cover plate 32 is a three-layer structure made of two materials, and the second material layer M2 and the third material layer are both made of pure copper (e.g., T1, T2, T3, T4), oxygen-free copper (TU 1, TU 2), or pure copper with other elements added (e.g., TP1 and TP 2). The first material layer M1 is high nitrogen steel.

In a specific embodiment, the second cover plate 32 includes a three-layer structure, the second material layer M2 and the third material layer M3 are both TU2 copper, the second material layer M2 is high nitrogen steel with 0.2-0.3 wt.% of nitrogen, the first material layer M1, the second material layer M2 and the third material layer M3 are subjected to a composite process to form a second material layer M2 with a thickness of 0.015mm, a first material layer M1 with a thickness of 0.15mm and a third material layer with a thickness of 0.015mm, the total thickness of the second cover plate 32 is 0.18mm, and the thickness ratio of the three-layer structure is 1:10: 1. In this embodiment, the ingredients and properties of the various materials are shown in the following tables (table one, table two, and table three).

Watch 1

Watch two

Watch III

In a specific application, the material and thickness ratio of each layer of the second cover plate 32 can be adjusted according to the target required performance. This application is the copper product based on first material layer M1, has reduced welding temperature to solved stainless steel and working medium compatibility problem, for the design of high nitrogen steel based on second material layer M2, solved soaking board intensity decline problem.

The ecr (ratio of evaporation and condensation width) of the vapor chamber 30 represents the ratio of the widths of the evaporation zone 301 and the condensation zone 302, and represents a specific configuration of the vapor chamber 30. For the temperature equalization plates with different widths, for example, ECR is less than or equal to 0.5, and the thickness of the two-phase channel is less than or equal to 0.2mm, the problem of difficult liquid return of the capillary channel 35 often exists, because the narrow vapor channel causes a larger vapor pressure drop, which increases the temperature difference, and the too narrow capillary channel 35 is not favorable for the backflow liquid supplement of the evaporation zone 301. The embodiment of the application provides two solutions: the first scheme is as follows: a plurality of temperature equalizing plates or heat pipes are used in combination; the second scheme is as follows: a temperature equalizing plate with a bionic structure is constructed in parallel.

The first scheme includes two combinations. Referring to fig. 15, a first combination of the first scheme is: in a specific embodiment, the plurality of temperature-equalizing

plates

30A, 30B or heat pipes may be implemented by using a common cover plate, that is, a plurality of temperature-equalizing

plates

30A, 30B or heat pipes arranged in parallel are formed between the first cover plate 31 and the second cover plate 32, specifically: as shown in FIG. 15, there are several independent temperature-uniforming

plates

30A, 30B or heat pipes with ECR >0.5 sharing the main heat source in the large temperature-uniforming plate 30 with ECR ≦ 0.5, which share the total heat load, and these temperature-uniforming

plates

30A, 30B or heat pipes share the first cover plate 31 and the second cover plate 32, but the capillary channels and the vapor channels are mutually independent and isolated. Each single temperature-equalizing

plate

30A, 30B or heat pipe can be understood as a heat transfer highway (heat transfer main road), two phases exchange heat, and the equivalent heat conductivity coefficient is more than or equal to 5000W/m-K; the

uniform temperature plates

30A and 30B or the heat pipes conduct heat by metal materials, no two-phase heat exchange exists, and the heat conduction coefficient is less than or equal to 2500W/m-K. The heat conductivity coefficient of the graphene plate can reach 1000-2500W/m-K, is 2-100 times of that of copper, stainless steel or titanium alloy, has the density of about-2 g/ml, is 50-70% lower than that of the copper, stainless steel or titanium alloy, and is used for enhancing heat dissipation or reducing weight, so that the graphene plate can be embedded between the independent temperature-equalizing

plates

30A and 30B or the heat pipes, and the graphene plate can be connected to each temperature-equalizing plate or each heat pipe in a low-heat-resistance mode such as welding or bonding.

In a first combination manner of the first scheme, the positions and the number of the connecting structures 34 may be set according to a specific use environment of the temperature-uniforming plate 30, for example, the connecting structures 34 may be set in the temperature-uniforming plate 30 located at the middle position of the first cover plate 31 and the second cover plate 32, or the connecting structures 34 may be set between the first cover plate 31 and the second cover plate 32 and at the position between the adjacent temperature-uniforming

plates

30A and 30B or the heat pipes, so that the strength of the entire temperature-uniforming plate 30 is improved by the connecting structures 34, the flatness of the temperature-uniforming plate 30 is constrained, and the flatness of the surface of the second cover plate 32 away from the first cover plate 31 has a positive orientation tolerance.

Referring to fig. 16A, 16B and 16C, the second combination of the first scheme is: the integral temperature-uniforming plate 30 (with larger area) with the ECR less than or equal to 0.5 is internally provided with a plurality of independent sub temperature-uniforming

plates

30A and 30B with the ECR more than 0.5, which are respectively a first temperature-uniforming plate 30A and a second temperature-uniforming plate 30B, the first temperature-uniforming plate and the second temperature-uniforming plate share a first cover plate and a second cover plate, but the steam channel and the capillary channel in the first temperature-uniforming plate and the second temperature-uniforming plate are mutually isolated; the first vapor chamber 30A and the second vapor chamber 30B do not share a main heat source, and the first vapor chamber 30A and the second vapor chamber 30B transfer heat in series between the evaporation zone 301 and the condensation zone 302. The arrangement of the evaporation zone 30B1 of the second temperature equalization plate 30B adjacent to the condensation zone 30A2 of the first temperature equalization plate 30A and the arrangement between the evaporation zone 30B1 of the second temperature equalization plate 30B and the condensation zone 30B2 of the first temperature equalization plate 30A can include a variety, as illustrated below. The first specific scheme is as follows: as shown in fig. 16A, the evaporation zone 30A1 and the condensation zone 30A2 of the first temperature-uniforming plate 30A are aligned in the first direction a1, the evaporation zone 30B1 and the condensation zone 30B2 of the second temperature-uniforming plate 30B are aligned in the second direction a2, the second direction a2 is perpendicular to the first direction a1, and the evaporation zone 30B1 of the second temperature-uniforming plate 30B and the condensation zone 30A2 of the first temperature-uniforming plate 30A are aligned side by side in the second direction a 2. The second specific scheme is as follows: as shown in fig. 16B, the evaporation area 30A1 and the condensation area 30A2 of the first temperature equalization plate 30A are arranged in the first direction a1, but compared with the first solution, the evaporation area 30B1 of the second temperature equalization plate 30B is smaller in size, the condensation area 30A2 of the first temperature equalization plate 30A is surrounded by the evaporation area 30B1 of the second temperature equalization plate 30B in an L shape, along the first direction a1, the partial evaporation area 30B1 of the second temperature equalization plate 30B is located on the side of the condensation area 30A2 of the first temperature equalization plate 30A, and in the second direction a2, the partial evaporation area 30B1 of the second temperature equalization plate 30B is still distributed on the side of the condensation area 30A2 of the first temperature equalization plate 30A. The third specific scheme is as follows: the evaporation zone 30B1 of the second vapor chamber 30B is located on three sides of the condensation zone 30A2 of the first vapor chamber 30A, i.e., the evaporation zone 30B1 of the second vapor chamber 30B comprises three portions, a first portion is located on one side of the condensation zone 30A2 of the first vapor chamber 30A along the first direction a1, and a second portion and a third portion are located on two opposite sides of the condensation zone 30A2 of the first vapor chamber 30A along the second direction a 2. The first direction may be a length direction, and the second direction may be a width direction.

A second combination of the first variant can be understood as: the integral temperature-uniforming plate 30 is formed by splicing a plurality of sub temperature-uniforming

plates

30A and 30B, and each sub temperature-uniforming

plate

30A and 30B realizes relay type two-phase heat transfer in a relay type distribution mode from an evaporation zone 301 to a condensation zone 302 of the integral temperature-uniforming plate 30, which can be equivalent to a mode of connecting the plurality of temperature-uniforming

plates

30A and 30B in series. The second combination method can also realize the improvement of the heat conduction efficiency by adopting a combination mode of the whole temperature-uniforming plate and the graphene plate, for example, embedding a part of cover plate (first cover plate or second cover plate) of the whole temperature-uniforming plate into the graphene material.

In a second combination of the first solution, the positions and the number of the connecting structures 34 may be set according to the specific use environment of the temperature equalization plate, for example, the connecting structures 34 may be set in the sub temperature equalization plate 30B located in the middle of the first cover plate 31 and the second cover plate 32, or the connecting structures 34 may be set in the positions between the adjacent sub

temperature equalization plates

30A and 30B, so as to improve the strength of the entire temperature equalization plate through the connecting structures 34, constrain the flatness of the temperature equalization plate, and realize that the flatness of the surface of the second cover plate 32 departing from the first cover plate 31 has a positive orientation tolerance.

The second scheme is specifically described as follows.

The second scheme is summarized as a temperature-uniforming plate with a parallel-structure bionic structure, and can be understood as that a capillary channel and a vapor channel in the temperature-uniforming plate are designed to be similar to a willow tree, the roots are in an evaporation area, and branches and leaves are in a condensation area. The temperature-equalizing plate obtained by the second scheme adopts a parallel framework, can meet extremely ultrathin design requirements of two phase regions of the temperature-equalizing plate, and can also solve the following problems: aiming at the serious thermal performance problem that the working medium can not quickly flow back and supplement liquid when the temperature-equalizing plate (i.e. the width and the area of the evaporation zone are smaller than those of the condensation zone and the difference is too large) has the ECR less than or equal to 0.5. As shown in fig. 17, inside the vapor-permeable plate 30, the capillary channels 35 and the vapor channels 37 have a tree-root shape in a narrow region (evaporation region 301) of the vapor-permeable plate, and have a tree-like shape in a condensation region 302 in a wide region of the vapor-permeable plate 30. The vapor channel 37 and the capillary channel 35 of the condensation area 302 are designed to be dendritic alternately at intervals, that is, the vapor channel 37 is designed to be a slender reflux groove structure, so that condensed liquid drops can be absorbed favorably, and the phenomenon that vapor is statically blocked in the area along the vapor channel 37 and cannot participate in circulation is avoided.

In summary, in one embodiment, the direction extending from the evaporation zone 301 to the condensation zone 302 is the first direction a1 of the temperature-equalizing plate 30, the second direction a2 of the temperature-equalizing plate 30 is perpendicular to the first direction a1, the ratio between the dimension of the evaporation zone 301 in the second direction a2 and the dimension of the condensation zone 302 in the second direction a2 is less than or equal to 0.5, in the condensation zone 302, the capillary channel 35 includes a plurality of first sub-channels 351 arranged side by side and at intervals, the vapor channel 37 includes a plurality of second sub-channels 371 arranged side by side and at intervals, the plurality of first sub-channels 351 are arranged between the adjacent second sub-channels 371 in a one-to-one correspondence, and the connection structure 34 in the temperature-equalizing plate 30 is arranged in the second sub-channels 371. This scheme can increase the stock solution volume of evaporation zone, also can increase capillary passageway and steam flow path's area of contact, helps promoting the thermal behavior of samming board operation. The capillary channel of the condensation zone adopts the structural design of a willow branch leaf type, and the contact area of the capillary channel and the steam channel is increased aiming at the capillary with a parallel framework, so that the reflux of condensate is facilitated. The thickness direction of the temperature-uniforming plate 30 is the direction of stacking between the first cover plate 31 and the second cover plate 32, the horizontal cross section of the temperature-uniforming plate 30 is the cross section perpendicular to the thickness direction of the temperature-uniforming plate 30, the extending direction of each first sub-channel 351 on the horizontal cross section is the first direction a1 of the temperature-uniforming plate, and the cross-sectional shape of the connecting structure 34 includes a long strip shape.

By way of example, the second protocol includes, but is not limited to, the following six types of protocols.

The first type of scheme: referring to FIG. 17, the vapor zone 301 of the vapor plate 30 is located at the top, the condensation zone 302 is located at the bottom, the size of the condensation zone 302 is larger than that of the vapor zone 301, and ECR is less than or equal to 0.5. Capillary channels 35 in evaporation zone 301 are parallel, that is, evaporation zone 301 includes a plurality of capillary roots 353 arranged in parallel and connected to main capillary channel 352, and capillary roots 353 can be symmetrically distributed on two sides of main capillary channel 352. The advantage of the multiple parallel capillary roots 353 is: on one hand, the liquid storage amount of the evaporation zone 301 is increased, and on the other hand, the contact area of the capillary channel 35 and the vapor channel 37 is increased, which is helpful for improving the thermal performance of the operation of the vapor-homogenizing plate 30. A main capillary channel 352 extends from evaporation zone 301 to condensation zone 302, main capillary channel 352 being used for liquid return. The condensation zone 302 comprises a plurality of capillary branches arranged in parallel (a capillary branch can be understood as a first sub-channel 351, and a vapor channel 37 between adjacent capillary branches or beside a capillary branch can be understood as a second sub-channel 371), one end of each capillary branch is connected to the main capillary channel 352, and the structural design of the capillary branches is beneficial in that: the contact area of the capillary channel 35 and the vapor channel 37 is increased to facilitate the backflow of the condensate. In addition, as the capillary roots of the evaporation zone 301 also use a parallel framework, in order to improve the capillary thermal performance of the evaporation zone 301, the cover plate of the evaporation zone 301 can be locally lifted, and the channel thickness of the evaporation zone 301 is increased, and the temperature equalization plate provided by the scheme can be a 2.5D temperature equalization plate.

The second scheme is as follows: referring to fig. 18, the present solution differs from the first category of solutions in that: within evaporation zone 301, capillary roots may be arranged in a serial configuration (not shown). The condensation zone 302 includes a plurality of capillary branches (first sub-channels 351) arranged in parallel, the plurality of capillary branches can be connected to the evaporation zone 301 through a plurality of main capillary channels 352, the capillary channels 35 of the present embodiment adopt a combination of a parallel architecture and a serial architecture, and the evaporation zone 301 and the condensation zone 302 are connected by using a plurality of main capillary channels 352.

The third scheme is as follows: referring to fig. 19, the present solution differs from the second solution in that: the capillary roots in the evaporation zone 301 are designed to be bamboo-root-shaped, that is, a plurality of capillary roots are respectively connected to the plurality of main capillary channels 352, and the plurality of capillary roots are converged to be bamboo-root-shaped, which is beneficial to increase the contact area between the capillary channels 35 and the vapor channels 37.

The fourth scheme is as follows: referring to fig. 20, the present solution is different from the third solution in that: the capillary root of the evaporation zone 301 is designed as a bayonet-type independent capillary root architecture. That is, the plurality of capillary roots are connected to the plurality of main capillary channels 352, respectively, and are independent from each other without being joined, and the vapor channels 37 are opened to each other, so that the gas circulation inside the vapor chamber 30 is smoother.

The fifth scheme is as follows: referring to fig. 21, the arrangement of capillary roots in the evaporation zone 301 is similar to the first embodiment, in which the evaporation zone 301 adopts a natural root-branching capillary root structure. In this embodiment, the number of the main capillary channels 352 is plural (including two), and the lengths thereof are different. Within condensation zone 302 is included a plurality of capillary branches (first sub-channels 351) arranged in parallel, which can be connected to evaporation zone 301 via a plurality of main capillary channels 352. One of the primary capillary passages 352 is longer in size to facilitate reducing the flow pressure drop of the gas in vapor passage 37. The end of the capillary branch (first sub-channel 351) connected to one of the main capillary channels 352 faces toward the evaporation zone 301 (it is understood that the main capillary channel 352 is inverted to expand the transfer path and reduce the pressure drop), and the end of the capillary branch (first sub-channel 351) connected to the other main capillary channel 352 faces away from the evaporation zone 301.

In the first, second, third, fourth and fifth embodiments, at least a portion of the connecting structure 34 in the working cavity 33 of the vapor-homogenizing plate 30 may be disposed in the condensation zone 302 and between adjacent capillary branches (the first sub-channel 351), i.e., in the vapor channel 37 (the second sub-channel 371). This application has injectd the concrete position of connection structure in the temperature-uniforming plate, sets up connection structure in the condensation zone, can promote the intensity of condensation zone, and the condensation zone is used for supporting the battery, can match the equipment environment of temperature-uniforming plate in mobile terminal better.

Scheme in the sixth category: referring to fig. 22, a serial capillary root structure (not shown) is adopted in the evaporation zone 301, and a serial capillary branch structure is adopted in the condensation zone 302, that is, the evaporation zone 301 and the condensation zone 302 both use serial capillary channels 35, and the main capillary channel 352 connecting the evaporation zone 301 and the condensation zone 302 is a parallel structure. In a sixth version, the connecting structure 34 in the working chamber 33 of the vapor-panel may be disposed in the condensation zone 302 and between the primary capillary channels 352.

Referring to fig. 23, in one embodiment of the present application, the capillary channel 35 may be configured as a capillary channel of a Loop Heat Pipe (LHP) -like structure: by applying the design concept of the loop heat pipe, the evaporation area 301 and the condensation area 302 are divided by using the design of the capillary channel and the design of the supporting structure, so that the internal gas and liquid form a circulating route of loop flow. Vapor generated in the evaporation zone 301 enters the cavity and condenses into liquid in the condensation zone 302, and the liquid is absorbed by the capillary. Liquid seeps in the capillary channel 35 and enters the evaporation area 301 through the condensate return area to supplement the liquid, so that the circulation flow of the LHP-like loop heat pipe is formed. In this embodiment, the connecting structure 34 in the working chamber 33 of the vapor chamber may be disposed in the vapor passage 37 between the capillary passages 35 of the condensation zone 302.

In the embodiments shown in fig. 17, 18, 19, 20, 21 and 23, the first sub-channel 351 is a capillary channel (also called a capillary branch, similar to a structure of a branch continuous to the trunk, having an end remote from the trunk), and the second sub-channel 371 is a vapor channel. One end of the first sub-channel 351 and the second sub-channel 371 is connected with the main capillary channel 352, and the terminal end (free end in a suspended shape) of the first sub-channel 351 and the second sub-channel 371 is one end of the first sub-channel 351 and the second sub-channel 371 away from the main capillary channel 352. It is understood that the portion of the vapor passage between adjacent first sub-passages 351 is the second sub-passage 371. The liquid reflux direction in the end facing the same first sub-passage 351 coincides with the vapor flow direction in the adjacent second sub-passage 371. In fig. 17, 18, 19, 20, 21, and 23, the lines with arrows in the first sub-passage 351 and the second sub-passage 371 schematically indicate the liquid reflux direction and the vapor flow direction. This application can reduce impedance, promotes the radiating efficiency through the design that the terminal liquid reflux direction in the same first subchannel 351 and the unanimous of vapour flow direction in adjacent second subchannel 371.

Referring to fig. 24, fig. 24 is a schematic view illustrating a state of liquid on a surface of a fixing body in a case where the solid surface in the temperature-uniforming plate 30 is a hydrophobic layer and a hydrophilic layer. The solid surface may be understood as the inner surface of the first cover plate 31 and/or the second cover plate 32, the surface of the connecting structure, the surface of the reinforcing column, the surface of the capillary channel. When the solid surface is a hydrophobic layer, the liquid is converged into a droplet form on the solid surface, and the contact area between the liquid and the solid surface is small. In the case where the solid surface is a hydrophilic layer, the liquid is adsorbed on the solid surface, and the area of contact between the liquid and the solid surface is large.

In one embodiment, the inner surface of the first cover plate 31 and/or the inner surface of the second cover plate 32 are modified, and the inner wall of the vapor channel 37 is designed to be a hydrophilic layer structure, so that the phenomenon of agglomerated liquid drops in a part of evaporation channels in the condensation area 302 can be avoided, and the agglomerated liquid drops can be frozen and swelled during cold and hot impact. In a specific embodiment, in the condensation area 302, the first cover plate 31 corresponding to the vapor channel 37 includes a first main body layer and a first hydrophilic layer, the first hydrophilic layer and the first main body layer are of an integral structure, and the first hydrophilic layer is formed by modifying the inner surface of the first cover plate 31, so that the solution can solve the problem of icing and swelling of the first cover plate 31, and the solution can improve the safety and reliability of the display screen due to the proximity of the first cover plate 31 to the display screen. In a specific embodiment, in the condensation area 302, the second cover plate 32 corresponding to the vapor channel 37 includes a second main body layer and a second hydrophilic layer, the second hydrophilic layer and the second main body layer are an integral structure, the second hydrophilic layer is formed by modifying the inner surface of the second cover plate 32, the solution can solve the problem of icing and swelling of the second cover plate 32, the second cover plate 32 is adjacent to the battery and is used for bearing the battery, and the solution can ensure the battery installation environment and improve the stability of the battery performance.

In one embodiment, the surface of the connecting structure is designed as a hydrophobic structure, which may better avoid ice formation and swelling. Referring to fig. 25, fig. 25 schematically shows a change process of a liquid droplet in a working chamber in the case that the surface of the connecting structure is a hydrophobic layer and the inner surfaces of the first cover plate and the second cover plate are hydrophilic layers. The uppermost illustration in fig. 25: in the condensation area of the temperature equalizing plate, liquid drops generated by condensation are condensed on the surface of the connecting structure and grow larger gradually. The illustration in the middle position in fig. 25 illustrates: the liquid drops contact the hydrophilic first cover plate or the hydrophilic second cover plate after being condensed to be large enough on the surface of the connecting structure, and the liquid drops are pulled and adsorbed due to the hydrophilic layer structure on the inner surfaces of the first cover plate and the second cover plate. The droplets are pulled from the hydrophobic attachment structure surface to the hydrophilic second cover plate inner surface. The lowest illustration in fig. 25: the surface of the capillary wick, namely the capillary channel in the application, is of a hydrophilic layer structure, has the characteristics of hydrophilicity and water absorption, and sucks liquid drops to realize the liquid return effect.

The surface modification treatment may be, but is not limited to: hydrophilic, coarse, passivation and other treatment modes. The first hydrophilic layer or the second hydrophilic layer can prevent liquid in the vapor channel 37 from agglomerating into liquid drops, and the liquid in the vapor channel 37 can be rapidly absorbed by the capillary channel 35. Particularly, in the case that the capillary passage 35 based on the condensation area 302 is configured by a plurality of capillary branches arranged in parallel, the first hydrophilic layer or the second hydrophilic layer is particularly obvious for solving the problems of liquid aggregation into liquid drops and icing and swelling.

In one embodiment, the inner walls of the vapor channel 37 of the evaporation area 301 and the reflux area of the vapor-distributing plate are configured as a hydrophobic layer, so that the surface of the vapor channel 37 is smooth, and the vapor flow resistance is reduced, so that the vapor can rapidly flow from the evaporation area 301 to the condensation area 302. In the condensation area 302, the inner wall of the vapor channel 37 is designed to be a hydrophilic layer structure, so that the vapor in the condensation area 302 can be quickly absorbed by the capillary channel 35, and the working efficiency and the temperature equalizing effect of the temperature equalizing plate are improved.

In one embodiment, in the condensation area 302, the inner surface of the first cover plate 31 corresponding to the vapor channel 37 is of a hydrophobic structure, and the surface of the connection structure 34 is of a hydrophobic structure.

The application also provides a manufacturing method of the temperature-uniforming plate, which comprises the following steps:

providing a temperature-equalizing plate, and referring to fig. 4, 5, 6 and 7, a temperature-equalizing plate 30 includes a first cover plate 31, a second cover plate 32 and a connecting structure 34, a working chamber 33 is formed between the first cover plate 31 and the second cover plate 32, the connecting structure 34 is located in the working chamber 33, the connecting structure 34 is fixedly connected with the first cover plate 31, and the connecting structure 34 is fixedly connected (for example, welded and fixed) with the second cover plate 32;

and shaping the temperature equalizing plate 30, wherein in the shaping process, force is applied to the position of the connecting structure 34, so that the temperature equalizing plate 30 is deformed, and the flatness of the outer surface of the second cover plate 32 has a positive orientation tolerance. The connection position of the connection structure 34 and the second cover plate 32 is a peak area of the flatness of the outer surface of the second cover plate 32; the positive orientation tolerance is a tendency for the outer surface of the second lid plate 32 to have a convex deformation as a whole from the outer edge of the second lid plate 32 to the position of the connecting structure 34.

Referring to fig. 26, the present application uses a shaping tool 90 to shape the temperature-uniforming plate 30 to determine the flatness of the outer surface of the second cover plate 32 as a positive orientation tolerance. The connecting structure 34 and the first cover plate 31 are integrally formed, the connecting structure 34 surrounds and forms a connecting groove 341, an opening position of the connecting groove 341 is located on an outer surface of the first cover plate 31, and the step of shaping the temperature equalization plate 30 includes: a shaping jig 90 is provided. The shaping jig 90 comprises a supporting seat 91 and a pressing cover 92, the supporting seat 91 is used for bearing the uniform temperature plate 30, the second cover plate 32 is fixed on the supporting seat 91, the pressing cover 92 comprises a shaping column 921, the shaping column 921 extends into the connecting groove 341 and presses against the bottom of the connecting groove 341, and the pressing cover 92 is used for applying the pressing force F against the first cover plate 31, so that the uniform temperature plate 30 is deformed. The curved curve S in fig. 26 is used to show the deformation tendency of the vapor chamber 30.

In the process of shaping the vapor chamber 30, the pressing cover 92 contacts with the outer surface of the first cover plate 31, and the scheme can restrict the deformation of the first cover plate 31 through the pressing cover 92, so that the first cover plate 31 is prevented from protruding outwards in the shaping process.

In actual use, application scenarios of the mobile terminal vary widely, for example: an AP application processor (comprising a CPU and a GPU) under the 3D game is a main heat source; the main heat source under photographing is AP and a camera module; when QQ music and high-definition video are played, the AP application processor and Speaker are main heat sources; the main heat source during the video chat is AP, a front camera module and a communication module (which can be a 3G/4G/5G communication module or a WiFi communication module). Under these circumstances the cell is a relatively cool region due to low internal resistance and low current (< 2A). When the VC soaking plate dissipates heat, the main heat source adjacent region is an evaporation region, the battery and other adjacent regions are condensation regions, and the areas of the condensation regions are relatively large, so that the main application scene of the soaking plate 30 provided by the embodiment of the application is realized. However, in the scenes of waiting for the standby wired or standby wireless quick charging and the like, the wired charging chip (more than or equal to 60W) or the wireless charging chip (more than or equal to 30W) and the battery become the main heating source of the mobile terminal, the areas such as the AP application processor and the like are relatively cool areas, when the temperature equalization board dissipates heat, the areas (such as the battery area and the charging chip area) adjacent to the main heating source are evaporation areas, the areas adjacent to the AP application processor are condensation areas, and the areas of the condensation areas are relatively small. However, in such an application scenario, the design difficulty of the temperature equalization plate is not great, and the temperature equalization plate provided by the embodiment of the application can be directly applied to the scenario without hardware design again. The condensation zone and the evaporation zone are relative scenes, no absolute limit exists, and the thermal performance design challenge of the vapor chamber is mainly under the condition that the evaporation zone is far smaller than the condensation zone, and the width of the evaporation zone is far smaller than that of the condensation zone (ECR is less than or equal to 0.5).

Finally, the description is as follows: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A mobile terminal, comprising:

a middle frame (20) including a first surface (S1), a second surface (S2), and a window (W) passing through the first surface (S1) and the second surface (S2);

a vapor chamber (30) fixed to the middle frame (20) and at least a portion of the vapor chamber (30) is located in the window (W), the temperature equalizing plate (30) comprises a first cover plate (31), a second cover plate (32) and a connecting structure (34), a working chamber (33) is formed between the first cover plate (31) and the second cover plate (32), the connecting structure (34) is positioned in the working cavity (33), the connecting structure (34) is fixedly connected with the first cover plate (31), the connecting structure (34) and the second cover plate (32) are fixedly connected, the flatness of the outer surface of the second cover plate (32) has a positive orientation tolerance, the connection structure (34) and the second cover plate (32) are connected at a location that is a peak region (R) of flatness of an outer surface of the second cover plate (32), and the positive orientation tolerance is: the temperature equalizing plate is positioned in the window (W), and the outer surface of the second cover plate (32) has a convex deformation tendency from the outer edge of the second cover plate (32) to the position of the connecting structure (34);

the display screen (10) is positioned on one side, away from the second cover plate (32), of the first cover plate (31);

a battery (40) located on a side of the second cover plate (32) remote from the first cover plate (31).

2. The mobile terminal according to claim 1, wherein the connecting structure (34) and the first cover plate (31) are integrally formed, the connecting structure (34) surrounds and forms a connecting groove (341), and an opening position of the connecting groove (341) is located on an outer surface of the first cover plate (31).

3. The mobile terminal of claim 2, wherein the connection structure (34) comprises a bottom wall (342) and a side wall (343), the side wall (343) is connected between the bottom wall (342) and the first cover plate (31), the bottom wall is located at the bottom of the connection recess (341), the bottom of the connection recess (341) and the opening of the connection recess (341) are oppositely disposed along a first direction, the first direction is a direction in which the display, the thermal equalizing plate and the battery are stacked, and the bottom wall (342) and the second cover plate (32) are fixedly connected.

4. A mobile terminal according to claim 1, wherein the connection structure (34) and the second cover plate (32) are fixed by welding.

5. Mobile terminal according to claim 4, characterized in that said second cover plate (32) comprises a first material layer (M1) and a second material layer (M2) arranged one above the other, said first material layer (M1) having a welding temperature lower than the welding temperature of said second material layer (M2), said second material layer (M2) having a softening temperature higher than the welding temperature of said first material layer (M1), said first material layer (M1) being intended to be welded to said connection structure (34) and to said first cover plate (31), said second material layer (M2) being located on the side of said first material layer (M1) facing away from said first cover plate (31).

6. The mobile terminal according to claim 5, characterized in that the second material layer (M2) is a stainless steel material with nitrogen element; alternatively, the second material layer (M2) is a titanium alloy material.

7. Mobile terminal according to claim 6, characterized in that in case the second material layer (M2) is a stainless steel material with nitrogen element, the content e [0.03 wt.%, 5 wt.%) of nitrogen element.

8. A mobile terminal according to claim 1, characterized in that the flatness of the outer surface of the first cover plate (31) is: more than or equal to-0.1 mm and less than or equal to 0.05 mm.

9. A mobile terminal according to claim 1, characterized in that the flatness of the outer surface of the second cover plate (32) is: 0.1mm or more and 0.3mm or less.

10. The mobile terminal according to claim 1, wherein the working cavity (33) comprises an evaporation zone (301) and a condensation zone (302), a capillary channel (35) and a vapor channel (37) are arranged in the working cavity (33), the capillary channel (35) and the vapor channel (37) both extend from the evaporation zone (301) to the condensation zone (302), at least a part of the connection structure (34) is arranged in the condensation zone (302), and the connection structure (34) is located in the vapor channel (37).

11. The mobile terminal according to claim 10, wherein a direction extending from the evaporation zone (301) to the condensation zone (302) is a length direction of the vapor chamber (30), the width direction of the temperature equalizing plate is perpendicular to the length direction, the ratio of the size of the evaporation zone (301) in the width direction to the size of the condensation zone (302) in the width direction is less than or equal to 0.5, in the condensation zone (302), the capillary channel (35) comprises a plurality of first sub-channels (351) which are arranged side by side and at intervals, the vapor channel (37) comprises a plurality of second sub-channels (371) which are arranged side by side and at intervals, the plurality of second sub-channels (371) are correspondingly arranged between the adjacent first sub-channels (351) one by one, the connecting structure (34) is disposed within the second sub-channel (371).

12. The mobile terminal of claim 11, wherein one end of the first sub-channel (351) and the second sub-channel (371) is connected to a main capillary channel (352), and the first sub-channel (351) and the second sub-channel (371) end at the end of the first sub-channel (351) and the second sub-channel (371) far away from the main capillary channel (352), and the end faces the same liquid backflow direction in the first sub-channel (351) and the vapor flow direction in the adjacent second sub-channel (371).

13. The mobile terminal of claim 11, wherein a thickness direction of the temperature-uniforming plate (30) is a direction of the stacked arrangement between the first cover plate (31) and the second cover plate (32), a horizontal cross-section of the temperature-uniforming plate (30) is a cross-section perpendicular to the thickness direction of the temperature-uniforming plate (30), an extending direction of each of the first sub-channels (351) is a length direction of the temperature-uniforming plate (30) on the horizontal cross-section of the temperature-uniforming plate (30), and a cross-sectional shape of the connecting structure (34) includes a long strip.

14. The mobile terminal according to claim 11, wherein the number of the connecting structures (34) is one, and the connecting structure (34) is located at a center position of the working chamber (33) in a width direction of the temperature-uniforming plate (30); alternatively, the first and second electrodes may be,

the number of the connecting structures (34) is even, and the connecting structures (34) are distributed on two sides of the central position of the working cavity (33) in the width direction of the temperature-uniforming plate (30); alternatively, the first and second electrodes may be,

the number of the connecting structures (34) is three or more than three, and in the width direction of the temperature-uniforming plate (30), one of the connecting structures (34) is located at the center of the working cavity (33), and the rest of the connecting structures (34) are distributed on two sides of the center of the working cavity (33).

15. The mobile terminal according to claim 10, wherein, in the condensation area (302), the inner surface of the first cover plate (31) corresponding to the vapor channel (37) is of a hydrophilic layer structure.

16. The mobile terminal according to any of the claims 10-15, wherein at the condensation area (302), the inner surface of the second cover plate (32) corresponding to the vapor channel (37) is of a hydrophilic layer structure.

17. A mobile terminal according to claim 15, characterized in that, within the working chamber (33), the surface of the connection structure (34) is of a hydrophobic layer structure.

18. A mobile terminal according to claim 10, characterized in that in the condensation area (302), the inner surface of the first cover plate (31) corresponding to the vapor channel (37) is a hydrophobic layer structure, and the surface of the connection structure (34) is a hydrophobic layer structure.

19. The mobile terminal of claim 1, wherein the temperature uniforming plate includes a plurality of reinforcing posts (36), the reinforcing column (36) is arranged in the working cavity (33), the reinforcing column (36) is fixedly connected with one of the first cover plate (31) and the second cover plate (32) into a whole, the reinforcing column (36) is arranged in contact with or with a gap from the other of the first cover plate (31) and the second cover plate (32), the number of the connecting structures (34) is at least one, the connecting area between each connecting structure (34) and the first cover plate (31) or the second cover plate (32) is a first area, the connecting area between each reinforcing column (36) and the first cover plate (31) or the second cover plate (32) is a second area, and the first area is more than twice of the second area.

20. The mobile terminal of claim 1, wherein the battery (40) is within a coverage area of the vapor chamber (30).

21. A temperature equalization plate, characterized by comprising a first cover plate (31), a second cover plate (32) and a connecting structure (34), wherein a working cavity (33) is formed between the first cover plate (31) and the second cover plate (32), the connecting structure (34) is positioned in the working cavity (33), the connecting structure (34) is fixedly connected with the first cover plate (31), the connecting structure (34) is fixedly connected with the second cover plate (32), the flatness of the outer surface of the second cover plate (32) has a positive orientation tolerance, and the connecting position of the connecting structure (34) and the second cover plate (32) is a peak region (R) of the flatness of the outer surface of the second cover plate (32); the positive orientation tolerance is the tendency for the outer surface of the second cover plate (32) to deform convexly as a whole from the outer edge of the second cover plate (32) to the location of the connecting structure (34).

22. The temperature-uniforming plate according to claim 21, wherein the connecting structure (34) and the first cover plate (31) are integrally formed, the connecting structure (34) surrounds and forms a connecting groove (341), and an opening position of the connecting groove (341) is located on an outer surface of the first cover plate (31).

23. The temperature-equalizing plate of claim 22, wherein the connecting structure (34) comprises a bottom wall (342) and a side wall (343), the side wall (343) is connected between the bottom wall (342) and the first cover plate (31), the bottom wall (342) is located at the bottom of the connecting groove (341), the bottom of the connecting groove (341) and the opening of the connecting groove (341) are oppositely arranged along a first direction, the first direction is a direction in which a display (10), the temperature-equalizing plate (30) and a battery (40) in a mobile terminal are arranged in a stacked manner, and the bottom wall (342) and the second cover plate (32) are fixedly connected.

24. Temperature-equalizing plate according to claim 23, characterized in that said bottom wall (342) and said second cover plate (32) are fixed by means of welding.

25. Temperature-equalizing plate according to claim 24, characterized in that the second cover plate (32) comprises a first material layer (M1) and a second material layer (M2) arranged one above the other, the first material layer (M1) having a welding temperature lower than the welding temperature of the second material layer (M2), the second material layer (M2) having a softening temperature higher than the welding temperature of the first material layer (M1), the first material layer (M1) being intended for welded fastening with the connection structure (34) and the first cover plate (31), the second material layer (M2) being located on the side of the first material layer (M1) facing away from the first cover plate (31).

26. Temperature-uniforming plate according to claim 25, characterized in that the second material layer (M2) is a stainless steel material with nitrogen element; alternatively, the second material layer (M2) is a titanium alloy material.

27. The vapor chamber of claim 26, wherein the amount of nitrogen element e [0.03 wt.%, 5 wt.% ].

28. Temperature-uniforming plate according to claim 21, characterized in that the flatness of the outer surface of the first cover plate (31) is: more than or equal to-0.01 mm and less than or equal to-0.1 mm.

29. A temperature-uniforming plate according to any one of claims 21-28, wherein the flatness of the outer surface of the second cover plate (32) is: 0.1mm or more and 0.3mm or less.

30. A temperature-uniforming plate according to claim 21, wherein the working chamber (33) comprises an evaporation zone (301) and a condensation zone (302), a capillary channel (35) and a vapor channel (37) are provided in the working chamber (33), the capillary channel (35) and the vapor channel (37) each extend from the evaporation zone (301) to the condensation zone (302), at least part of the connection structure (34) is provided in the condensation zone (302), and the connection structure (34) is located in the vapor channel (37).

31. Vapor-distribution plate according to claim 30, characterized in that the direction extending from the evaporation zone (301) to the condensation zone (302) is the length direction of the vapor-distribution plate (30), the width direction of the temperature equalizing plate (30) is perpendicular to the length direction, the ratio of the dimension of the evaporation zone (301) in the width direction to the dimension of the condensation zone (302) in the width direction is less than or equal to 0.5, in the condensation zone (302), the capillary channel (35) comprises a plurality of first sub-channels (351) arranged side by side and at intervals, the vapor channel (37) comprises a plurality of second sub-channels (371) which are arranged side by side and at intervals, the plurality of second sub-channels (371) are correspondingly arranged between the adjacent first sub-channels (351) one by one, the connecting structure (34) is disposed within the second sub-channel (371).

32. A temperature-uniforming plate according to claim 31, wherein one end of the first sub-channel (351) and the second sub-channel (371) is connected to a main capillary channel (352), and the first sub-channel (351) and the second sub-channel (371) end at the end of the first sub-channel (351) and the second sub-channel (371) far away from the main capillary channel (352), and end in the same direction of liquid backflow in the first sub-channel (351) and vapor flow in the adjacent second sub-channel (371).

33. The temperature-uniforming plate according to claim 31, wherein a thickness direction of the temperature-uniforming plate (30) is a direction of stacking between the first cover plate (31) and the second cover plate (32), a horizontal cross section of the temperature-uniforming plate (30) is a cross section perpendicular to the thickness direction of the temperature-uniforming plate (30), an extending direction of each of the first sub-channels (351) is a length direction of the temperature-uniforming plate (30) in the horizontal cross section of the temperature-uniforming plate (30), and a cross-sectional shape of the connecting structure (34) comprises a long strip.

34. A temperature-uniforming plate according to claim 31, wherein the number of the connecting structures (34) is one, and the connecting structures (34) are located at the center of the working chamber (33) in the width direction of the temperature-uniforming plate (30); or the number of the connecting structures (34) is even, and the connecting structures (34) are distributed on two sides of the central position of the working cavity (33) in the width direction of the temperature-uniforming plate (30); or the number of the connecting structures (34) is three or an odd number larger than three, in the width direction of the temperature-uniforming plate (30), one of the connecting structures (34) is located at the central position of the working cavity (33), and the rest of the connecting structures (34) are distributed on two sides of the central position of the working cavity (33).

35. A temperature-uniforming plate according to claim 30, wherein the first cover plate (31) to which the vapor channel (37) corresponds includes a first body layer and a first hydrophilic layer formed by modifying an inner surface of the first cover plate (31); and/or, in the condensation zone (302), the second cover plate (32) to which the vapour channels (37) correspond comprises a second body layer and a second hydrophilic layer, the second hydrophilic layer being formed by a modification treatment of the inner surface of the second cover plate (32).

36. A temperature-uniforming plate according to claim 35, wherein, within the working chamber (33), the surface of the connection structure (34) is of a hydrophobic-layer structure.

37. A temperature-equalizing plate according to claim 30, characterized in that, in the condensation zone (302), the inner surface of the first cover plate (31) corresponding to the vapor channels (37) is of a hydrophobic-layer structure, and the surface of the connecting structure (34) is of a hydrophobic-layer structure.

38. The vapor plate of claim 21, wherein the vapor plate (30) comprises a plurality of reinforcing posts (36), the reinforcing column (36) is arranged in the working cavity (33), the reinforcing column (36) is fixedly connected with one of the first cover plate (31) and the second cover plate (32) into a whole, the reinforcing column (36) is arranged in contact with or with a gap from the other of the first cover plate (31) and the second cover plate (32), the number of the connecting structures (34) is at least one, the connecting area between each connecting structure (34) and the first cover plate (31) or the second cover plate (32) is a first area, the connecting area between each reinforcing column (36) and the first cover plate (31) or the second cover plate (32) is a second area, and the first area is more than twice of the second area.

39. A manufacturing method of a vapor chamber is characterized by comprising the following steps:

shaping the temperature equalizing plate, wherein in the shaping process, force is applied to the position of the connecting structure to deform the temperature equalizing plate, so that the flatness of the outer surface of the second cover plate has a positive orientation tolerance, and the connecting position of the connecting structure and the second cover plate is a peak area of the flatness of the outer surface of the second cover plate; the positive orientation tolerance is a position from an outer edge of the second cover plate to the connecting structure, and an outer surface of the second cover plate has a tendency to deform convexly as a whole.

40. The method for manufacturing the temperature equalization plate as claimed in claim 39, wherein the connecting structure and the first cover plate are integrally formed, the connecting structure surrounds and forms a connecting groove, the opening position of the connecting groove is located on the outer surface of the first cover plate, and the step of shaping the temperature equalization plate comprises:

41. The method of claim 40, wherein the pressing cover is in contact with the outer surface of the first cover plate during the shaping of the temperature equalization plate.

42. A mobile terminal, comprising:

a temperature-equalizing plate (30) fixed to the middle frame (20), at least a part of the temperature-equalizing plate (30) being located in the window (W), the temperature-equalizing plate (30) including a first cover plate (31), a second cover plate (32) and a connecting structure (34), a working chamber (33) being formed between the first cover plate (31) and the second cover plate (32), a capillary channel (35), a vapor channel (37) and a working medium being provided in the working chamber (33), the capillary channel (35) and the vapor channel (37) being used for conveying the working medium between the evaporation zone (301) and the condensation zone (302), the connecting structure (34) being located in the working chamber (33), the connecting structure (34) being fixedly connected to the first cover plate (31), the connecting structure (34) being fixedly connected to the second cover plate (32), the second cover plate (32) including a first material layer (M1) and a second material layer (M2) which are stacked, the welding temperature of the first material layer (M1) is lower than that of the second material layer (M2), the softening temperature of the second material layer (M2) is higher than that of the first material layer (M1), the first material layer (M1) is used for being fixedly welded with the connecting structure (34) and the first cover plate (31), and the second material layer (M2) is located on the side, facing away from the first cover plate (31), of the first material layer (M1);

43. The mobile terminal according to claim 42, wherein the second material layer (M2) is a stainless steel material with nitrogen element; alternatively, the second material layer (M2) is a titanium alloy material.

44. The mobile terminal according to claim 43, characterized in that the content e [0.03 wt.%, 5 wt.% ] of the nitrogen element.

45. The mobile terminal of claim 42, wherein the thickness of the second material layer (M2) is greater than the thickness of the first material layer (M1).

46. The mobile terminal of claim 45, wherein the second material layer (M2) is formed on the surface of the first material layer (M1) by electroplating.

47. The mobile terminal of claim 46, wherein a plating primer layer (M4) is disposed between the second material layer (M2) and the first material layer (M1).

48. A mobile terminal according to claim 42, characterized in that the second cover plate (32) further comprises a third material layer (M3), the soldering temperature of the third material layer (M3) being lower than the soldering temperature of the second material layer (M2), the third material layer (M3) being located on the side of the second material layer (M2) facing away from the first material layer (M1).