JP5449801B2 - Heat transport unit and electronic equipment - Google Patents

Description

  The present invention relates to a heat transport unit and an electronic device that efficiently transports heat received from a heating element such as a semiconductor integrated circuit, an LED element, a power device, and an electronic component.

  Electronic parts such as semiconductor integrated circuits, LED elements, and power devices are used in electronic equipment, industrial equipment, and automobiles. These electronic components are heating elements that generate heat due to a current flowing inside. If the heat generation of the heating element exceeds a certain temperature, there is a problem that the operation cannot be guaranteed, which adversely affects other parts and the housing, and as a result, the performance of the electronic device or the industrial device itself may be deteriorated.

  In order to cool such a heat generating body, the cooling device using the heat pipe which has the cooling effect by vaporization and condensation of the enclosed refrigerant | coolant is proposed.

  The heat pipe takes heat from the heating element and moves when the refrigerant sealed inside vaporizes. The vaporized refrigerant is cooled and condensed by heat dissipation, and the condensed refrigerant recirculates again. By repeating this vaporization and condensation, the heat pipe cools the heating element.

  The cooling mechanism of the heat pipe is transported by a heat receiving member that captures heat from the heating element (the refrigerant evaporates), a heat transport member that transports the deprived heat (the evaporated refrigerant moves and the condensed refrigerant recirculates), and is transported And a heat radiating member that dissipates the heat (cools and condenses the evaporated refrigerant). Here, Patent Document 1 proposes an example of a heat pipe. Patent Document 1 discloses a technique in which a refrigerant vaporized by heat from a heating element is moved to a separate member through a pipe, and the separate member is cooled by a secondary cooling member such as a heat sink. Patent Document 2 discloses an electronic substrate having a cooling function.

In recent years, electronic components to be cooled are not only relatively large semiconductor integrated circuits such as CPUs (Central Processing Units) and dedicated ICs, but also very small electronic devices such as high-intensity LEDs (Light Emitting Devices). Often parts. Such a small electronic component is not only small in size, but often includes a plurality of electronic components. For this reason, a cooling device using a heat pipe often needs to cool a plurality of small electronic components.
JP 2004-37001 A JP-A-11-101585

  Improving heat transport efficiency (determined by the rate of vaporized refrigerant diffusion and condensed refrigerant reflux and the number of cycles per unit period) is important for improving cooling capacity in cooling devices using heat pipes. It is.

  The heat transport member included in the heat pipe in the prior art is a pipe including a wick, and it is difficult for the refrigerant evaporated from the heat receiving member to enter the pipe, or the refrigerant condensed by the heat radiating member enters the pipe. It has a problem that it is difficult to meet. This is because it is affected by the physical connection structure between the heat receiving member or the heat radiating member and the pipe. For this reason, the speed of heat transport in a pipe provided with a wick that is a heat transport member is low.

  The heat pipe of Patent Document 1 uses the entire internal space of a flat plate material as a heat transport member. For this reason, the entire internal space diffuses the vaporized refrigerant and recirculates the condensed refrigerant. If the heating element to be cooled is a large semiconductor integrated circuit, a certain heat transport efficiency can be obtained even if the entire internal space is used as a heat transport member. However, when cooling a plurality of small heat generating elements such as LEDs, the heat generating area of the heat generating element and the heat receiving and heat transporting area of the heat pipe are unbalanced, and the heat transport efficiency with respect to the size and capacity of the heat pipe is low. bad. This is because the amount of refrigerant increases with respect to the amount of heat generated by the heating element, and the efficiency of vaporization of the refrigerant deteriorates. The efficiency of reflux is also reduced.

  Patent Document 2 discloses a plate heat pipe in which pores are aligned. In the case of a plate heat pipe disclosed in Patent Document 2, each pore performs diffusion of vaporized refrigerant and reflux of condensed refrigerant. However, depending on the number of heating elements in contact with the plate-type heat pipe and the amount of heat generation, the pores are divided into pores with high heat transport and pores with poor heat transport. The heat transport efficiency is determined by the diffusion rate of the vaporized refrigerant and the recirculation speed of the condensed refrigerant and the number of cycles. At this time, more refrigerant is required for cooling the heating element having a high calorific value. In the plate-type heat pipe of Patent Document 2, since the refrigerant is sealed for each pore, the refrigerant is divided into pores with insufficient refrigerant or excess refrigerant, and heat transport as a whole plate-type heat pipe is performed. Inefficiency.

  Moreover, since the plate-type heat pipe of Patent Document 2 has only pores as gaps, it can diffuse the vaporized refrigerant, but cannot efficiently recirculate the condensed refrigerant. This is because high-efficiency heat transport is realized by performing both the diffusion of the vaporized refrigerant and the reflux of the condensed refrigerant at high speed.

  Also, metal plates such as copper and aluminum are widely used as heat transport members. However, since metal plates can only be transported according to the thermal conductivity, there is a limit to improving heat transport efficiency. There is.

  As described above, in the cooling device using the heat pipe of the prior art, heat cannot be transported at a high speed while flexibly supporting various heating elements.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a heat transport unit and an electronic device that can flexibly cope with the type of heating element to be cooled and can transport heat taken from the heating element at high speed.

In view of the above problems, the heat transport unit of the present invention is a heat transport unit that transports the heat of a plurality of arranged heating elements along a first direction from one end to the other end, An upper plate, a lower plate facing the upper plate, an internal space formed by joining the upper plate and the lower plate, and capable of enclosing a refrigerant, and a plurality of the internal spaces partitioned along the first direction And a groove formed in the first direction on each of the upper , lower, left and right surfaces of the plurality of passages, and a communication path through which the refrigerant can move between the plurality of passages , The diffusion and recirculation of the enclosed refrigerant is promoted, and the plurality of passages are formed from the one end to the other end, and the heating element corresponds to each width of the plurality of passages. One of the plurality of passages having a size to be Corresponding to the position and disposed on the one end side, and the passage in which the heating element is disposed is configured so that the refrigerant that has been encapsulated and vaporized is transferred from the one end side to the first end. While diffusing along one direction, the condensed refrigerant is recirculated from the other end side to the one end side along the first direction, and the heating element is disposed in the communication path. The refrigerant sealed in the non-passage is moved to the passage where the heating element is disposed .

  The heat transport unit of the present invention can efficiently and efficiently transport the heat from the heating element in the first direction which is a certain direction. In particular, even when the heating element is very small compared to the heat transport unit, heat is transported in each of the passages divided into a plurality of sections, so that heat transport is performed in accordance with the heat generation amount of the heating element. Is called.

  In addition, when heat transport is insufficient with only the refrigerant sealed in a certain passage, the refrigerant is exchanged via the communication path, so the heat transport efficiency in the passage that is the main body of heat transport is high. Increase in flexibility.

  In addition, since the vapor diffusion path for diffusing the vaporized refrigerant and the capillary flow path for recirculating the condensed refrigerant are provided inside the passage, both the diffusion of the vaporized refrigerant and the reflux of the condensed refrigerant are performed at high speed. Is called. Since the condensed refrigerant is recirculated at high speed by the capillary channel, the refrigerant diffusion / reflux cycle is also accelerated, and the heat transport unit can transport heat with high efficiency.

A heat transport unit according to a first aspect of the present invention is a heat transport unit that transports heat of a plurality of heating elements arranged in the first direction from one end to the other end. An upper plate, a lower plate facing the upper plate, an internal space formed by joining the upper plate and the lower plate, and capable of enclosing a refrigerant, and the internal space divided along the first direction. a plurality of passages, and in each of the upper, lower, left and right surfaces of said plurality of passages, comprising a groove formed in the first direction, and a refrigerant movable communication path the plurality of passages between said grooves Promotes diffusion and reflux of the encapsulated refrigerant, the plurality of passages are formed from the one end to the other end, and the heating element has a width of each of the plurality of passages. Any of the plurality of passages having a size corresponding to The passage that is disposed on the one end side and in which the heating element is disposed is configured to allow the refrigerant that has been encapsulated and vaporized to flow from the one end side. While diffusing along the first direction, the condensed refrigerant is recirculated along the first direction from the other end side to the one end side, and the heating element is disposed in the communication path. The refrigerant sealed in the non-passing passage is moved to the passage where the heating element is disposed .

With this configuration, the heat transport unit can transport the heat taken from the heating element along the first direction at high speed and with high efficiency. Furthermore, the heat transport unit transports heat at high speed from end to end along the first direction of the heat transport unit.

  In the heat transport unit according to the second invention of the present invention, in addition to the first invention, at least a part of the plurality of passages includes a vapor diffusion path through which the vaporized refrigerant diffuses and a capillary flow through which the condensed refrigerant circulates. Provide a road.

  With this configuration, the passage can diffuse the vaporized refrigerant and recirculate the condensed refrigerant at a higher speed and easily. Since the passage can move the refrigerant at high speed, the heat taken from the heating element can be transported at high speed.

  In the heat transport unit according to the third aspect of the present invention, in addition to the second aspect, at least a part of the plurality of passages has one or a plurality of intermediate plates having internal through holes, and the internal through holes are Forming a capillary channel.

  With this configuration, the heat transport unit can easily form the vapor diffusion path and the capillary channel. In addition, due to an increase in capillary suction, the heat transport capability is unlikely to decrease even when the heat transport unit is inclined at an angle. Further, since the vaporized refrigerant is uniformly dispersed, there is little damage deformation of the component container due to the refrigerant freezing at a very low temperature.

  In the heat transport unit according to the fourth aspect of the present invention, in addition to the third aspect, the internal through hole includes at least one of a circular hole, a square hole, a polygonal hole, and a slit hole.

  With this configuration, various capillary channels can be formed, and high-speed reflux of the condensed refrigerant can be realized.

  In the heat transport unit according to the fifth invention of the present invention, in addition to any of the third to fourth inventions, there are a plurality of intermediate plates, and internal through holes provided in each of the plurality of intermediate plates. Are partially overlapped to form a capillary channel having a cross-sectional area smaller than the horizontal cross-sectional area of the internal through hole.

  With this configuration, a capillary channel having a very fine cross-sectional area can be formed. Since the capillary flow path having this fine cross-sectional area causes a strong capillary phenomenon, the reflux of the condensed refrigerant can be promoted.

  In the heat transport unit according to the sixth invention of the present invention, in addition to any of the third to fifth inventions, the intermediate plate has a protrusion along the boundary dividing the passage, and the upper plate and the lower plate. By sandwiching the intermediate plates between the plates, the protrusions form boundaries that separate the passages.

  With this configuration, the passages are reliably separated from each other.

In heat transporting unit according to a ninth aspect of the present invention, the first in addition to any of the sixth invention, the plurality of passages plurality of stages, are stacked in the thickness direction of the heat transfer unit, said plurality The passage has a multi-stage configuration in the thickness direction.

  With this configuration, it is possible to transport heat from the heating elements disposed on both the upper plate and the lower plate of the heat transport unit. Alternatively, the heat transport unit can transport the heat from the heating element at a higher speed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In addition, the heat pipe in this specification refers to the cooling of the heating element by repeating that the refrigerant sealed in the internal space is vaporized by receiving heat from the heating element and the evaporated refrigerant is cooled and condensed. Means a member, component, apparatus, or device that realizes the function to perform. In addition, the heat transport unit in the present specification means a member, component, apparatus, or device having a function of transporting heat from a heating element by moving a refrigerant.

(Embodiment 1)
(Conceptual explanation of heat pipe)
Since the heat transport unit of the present invention utilizes the function and operation of the heat pipe, the concept of the heat pipe will be described first.

  The heat pipe encloses a refrigerant inside, and a surface serving as a heat receiving surface is in contact with a heating element such as an electronic component. The internal refrigerant is vaporized by receiving heat from the heating element, and takes the heat of the heating element when vaporized. The vaporized refrigerant moves through the heat pipe. This movement carries the heat of the heating element. The moved and evaporated refrigerant is cooled and condensed on a heat radiation surface or the like (or by a secondary cooling member such as a heat sink or a cooling fan). The refrigerant that has condensed into a liquid recirculates inside the heat pipe and moves to the heat receiving surface again. The refrigerant that has moved to the heat receiving surface is vaporized again and takes the heat of the heating element.

  The heat pipe cools the heating element by repeating the vaporization and condensation of the refrigerant. For this reason, the heat pipe needs to have a vapor diffusion path for diffusing the vaporized refrigerant therein and a capillary channel for recirculating the condensed refrigerant.

  The heat pipe has a cylindrical shape and has a structure in which the refrigerant vaporized in the vertical direction is diffused and the refrigerant condensed in the vertical direction is recirculated, and the heat receiving portion in contact with the heating element and the cooling for cooling the refrigerant Some have a structure in which the part is separate and connected by a pipe.

  Heat pipes having these structures are unsuitable when the volume is large (particularly, the volume tends to increase in the vertical direction) and the mounting space is narrow. For this reason, a flat and thin heat pipe is often desired. For this reason, a flat heat pipe has also been proposed.

  Here, the heat pipe can transport the heat taken from the heating element by the diffusion of the evaporated refrigerant and the reflux of the condensed refrigerant. Cooling of the heating element requires a function for depriving heat from the heating element, a function for transporting the deprived heat, and a function for dissipating the transported heat, so that the heat deprived from the heating element can be efficiently transported. Desired. Although heat transport is possible even with a metal plate having high thermal conductivity such as copper or aluminum, their transport efficiency is not high.

  Utilizing the function of the heat pipe that diffuses the vaporized refrigerant and recirculates the condensed refrigerant is a prerequisite for improving the heat transport efficiency. This invention proposes the heat transport unit which improves heat transport efficiency by the further device.

(Overview)
First, an overall outline of the heat transport unit in the first embodiment will be described.

  FIG. 1 is a perspective view of a heat transport unit according to Embodiment 1 of the present invention. FIG. 1 shows a state in which the end portion of the heat transport unit 1 is cut out to make the inside visible. FIG. 2 is a top view of the heat transport unit according to Embodiment 1 of the present invention.

  The heat transport unit 1 includes an upper plate 2, a lower plate 3, an inner space 4 formed by joining the upper plate 2 and the lower plate 3, and a plurality of passages dividing the inner space 4 along the first direction. 5. A groove 7 formed in the first direction on at least a part of the inner wall of each of the plurality of passages and a communication path 8 through which the refrigerant can move between the plurality of passages 5 are provided. The first direction is along the longitudinal direction of the heat transport unit 1 as shown in FIGS.

  Further, the shape and size of the heat transport unit 1 are not particularly limited, but it is often convenient to use a square shape having a short direction and a long direction. Of course, it may be bent or refracted, and may have a shape such as a circle, an ellipse, or a polygon. Furthermore, in FIG. 1 in which the heat transport unit 1 may be curved, it is a flat plate shape, but is not limited to a flat plate shape, and may have a large thickness.

  The upper plate 2 and the lower plate 3 face each other and are joined with a boundary 6 and a side wall 9 forming the passage 5 interposed therebetween. By this joining, the internal space 4 is formed, and at the same time, a plurality of passages 5 partitioned in the first direction are also formed. The internal space 4 can enclose a refrigerant, and the encapsulated refrigerant is enclosed in each of the plurality of passages 5. For this reason, the vaporized refrigerant can be diffused and the condensed refrigerant can be recirculated for each of the plurality of divided passages 5. In other words, each of the plurality of divided passages 5 has a function as a heat pipe. In other words, the passage 5 transports heat from the heating element by vaporization and condensation (movement of the refrigerant) of the refrigerant in the passage 5.

  The heat transport unit 1 includes a plurality of passages 5 in which the internal space 4 is divided, so that heat transport can be realized according to the position of the heating element disposed in the heat transport unit 1. The size of the heating element is often small compared to the size of the heat transport unit. For example, a light emitting element such as an LED is very small. When a heating element is arranged in a certain passage 5, heat transport from the heating element is mainly performed in the passage 5 at the position where the heating element is arranged, so that it is not necessary for the refrigerant to move in an extra area. The movement of the refrigerant becomes efficient. For this reason, compared with the heat pipe which is not divided into the some channel | path 5, efficient heat transport is realizable. Moreover, since the movement width of the refrigerant is limited as compared with the case where the entire internal space 4 is a passage, the refrigerant easily moves along a first direction that is substantially perpendicular to the movement width. Also in this respect, the speed of heat transport in the first direction is increased.

  In addition, since at least a part of the inner wall of each of the plurality of passages 5 includes the groove 7, the groove 7 promotes diffusion of the vaporized refrigerant and reflux of the condensed refrigerant. Since the groove 7 is formed along the first direction, the groove 7 can promote diffusion and recirculation of the refrigerant along the first direction. Here, since the movement of the refrigerant realizes heat transport, heat is transported in the first direction which is the moving direction of the refrigerant. The groove 7 can particularly promote the reflux of the condensed refrigerant.

  Furthermore, when a small heating element is disposed in the heat transport unit 1, the heat generation amount in one passage 5 is large, and the heat generation amount in other passages 5 may be small. In the passage 5 at a position where the heat generation amount is large, the heat transport load of the heating element due to repeated vaporization and condensation of the refrigerant is large. For this reason, the passage 5 at a position where the calorific value is large requires more refrigerant. Conversely, in the passage 5 at a position where the amount of heat generation is small, the heat transport load of the heating element due to repeated vaporization and condensation of the refrigerant is small. For this reason, the passage 5 at a position where the calorific value is small does not require much refrigerant.

  The communication path 8 enables the refrigerant to move between the paths 5. For this reason, the amount of the refrigerant is distributed in a balanced manner between the passage 5 that requires a large amount of refrigerant and the passage 5 that does not require a large amount of refrigerant. For this reason, even if it is the channel | path 5 of a position with big calorific value, or the channel | path 5 of a small calorific value, a required quantity of refrigerant | coolants can be ensured and efficient heat transport can be implement | achieved for every channel | path 5. . Alternatively, the distribution of the refrigerant can cope with the temporal change in the amount of heat generated by the heating element. For this reason, heat transport can be realized while appropriately responding to changes in the amount of heat generated by the heating element.

  In addition, since at least a part of the passage 5 includes a vapor diffusion passage for diffusing the vaporized refrigerant and a capillary passage for returning the condensed refrigerant, the movement of the refrigerant in each passage 5 can be further accelerated. In particular, the vapor diffusion channel and the capillary channel can be coupled with the groove 7 to promote the movement of the refrigerant. Here, at least a part of the plurality of passages 5 has one or a plurality of intermediate plates having internal through holes, and the internal through holes form capillary reflux.

  As described above, the heat transport unit 1 according to Embodiment 1 has the internal space divided into the plurality of passages 5, so that heat transport from the small heating elements can be performed for each passage 5. Good heat transport. In addition, since the refrigerant is distributed to the passage 5 in a well-balanced manner, the heat transport unit 1 can realize heat transport according to the difference or change in the amount of heat generation.

  Next, the detail of each part is demonstrated.

(Upper plate)
The upper plate 2 will be described with reference to FIGS. FIG. 3 is a perspective view of the heat transport unit according to Embodiment 1 of the present invention. Unlike FIG. 1, the passage 5 shown in FIG. 3 has a vapor diffusion passage and a capillary passage inside. FIG. 4 is an exploded front view of the heat transport unit according to Embodiment 1 of the present invention. FIG. 4 shows a state viewed from the end side of the heat transport unit 1.

  The upper plate 2 has a predetermined shape and area. 1 to 3, the upper plate 2 has a flat plate shape, but may be curved, bent, or refracted other than the flat plate shape.

  The upper plate 2 is formed of metal, resin, etc., but is formed of metal having high thermal conductivity or high rust prevention (durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. It is preferred that Further, the upper plate 2 may have various shapes such as a square, a rhombus, a circle, an ellipse, and a polygon.

  It is also preferable that the upper plate 2 has a groove 7 formed in the first direction on one side thereof and on the side of the passage 5. This is because the groove 7 promotes the diffusion of the vaporized refrigerant in the first direction and the reflux of the condensed refrigerant in the first direction. For example, the groove 7 communicates with the capillary channel 11, and the refrigerant cooled and condensed on the surface of the upper plate 2 is easily transmitted from the groove 7 to the capillary channel 11. Alternatively, the groove 7 communicates with the vapor diffusion path 12 and can promote the diffusion of the vaporized refrigerant. In addition, since the groove 7 communicates with the vapor diffusion path 12, the vaporized refrigerant can easily come into contact with the surface of the upper plate 2 by a large area, and heat dissipation of the vaporized refrigerant is promoted.

  Although the upper plate 2 is referred to as “upper portion” for convenience, it does not have to physically exist at the upper position and is not particularly distinguished from the lower plate 3. Further, the upper plate 2 may be a surface in contact with the heating element or a surface facing the heating element.

  The upper plate 2 includes a refrigerant inlet. When the upper plate 2, the intermediate plate 10, and the lower plate 3 are laminated and joined, an internal space 4 is formed. Since the internal space 4 needs to enclose a refrigerant, the refrigerant is enclosed from the inlet after the upper plate 2 and the like are joined. The inlet is sealed when the refrigerant is sealed, and the internal space is sealed.

  The refrigerant may be sealed from the inlet after the stacking, or may be sealed when the upper plate 2, the lower plate 3, and the intermediate plate 10 are stacked. Moreover, it is preferable that the refrigerant is sealed under vacuum or reduced pressure. By being performed under vacuum or reduced pressure, the internal space of the first heat pipe 2 is in a vacuum or reduced pressure state, and the refrigerant is enclosed. When the pressure is reduced, the refrigerant vaporization / condensation temperature becomes low, and there is an advantage that the refrigerant vaporization / condensation repeats actively.

  It is also preferable that the upper plate 2 is provided with a protruding portion or an adhesive portion used for joining with the intermediate plate 10 or the lower plate 3.

(Lower plate)
Next, the lower plate 3 will be described with reference to FIGS.

  The lower plate 3 faces the upper plate 2 and sandwiches one or more intermediate plates 10. Here, the intermediate plate 10 may be disposed for each of the divided passages 5 and may be stacked between the upper plate 2 and the lower plate 3, and the upper plate 2 and the lower plate may be stacked in a region across the divided passages 5. It may be laminated between the plates 3.

  The lower plate 3 is made of metal, resin, etc., but is made of metal having high thermal conductivity or high rust prevention (durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. It is preferred that Moreover, although it may have various shapes, such as a square, a rhombus, a circle, an ellipse, and a polygon, since it forms the heat transport unit 1 facing the upper plate 2, it has the same shape and area as the upper plate 2. It is preferable that

  It is also preferable that the lower plate 3 has a groove 7 on one surface thereof that faces the passage 5. This is because the groove 7 promotes the diffusion of the vaporized refrigerant in the first direction and the reflux of the condensed refrigerant in the first direction. For example, the groove 7 communicates with the capillary channel 11, and the refrigerant cooled and condensed on the surface of the upper plate 2 is easily transmitted from the groove 7 to the capillary channel 11. Alternatively, the groove 7 communicates with the vapor diffusion path 12 and can promote the diffusion of the vaporized refrigerant. In addition, since the groove 7 communicates with the vapor diffusion path 12, the vaporized refrigerant can easily come into contact with the surface of the upper plate 2 by a large area, and heat dissipation of the vaporized refrigerant is promoted. This has the same significance as that the groove 7 is provided in the upper plate 2. In addition, the groove | channel 7 may be a recessed part other than a slit-shaped groove | channel.

  The lower plate 3 is referred to as a “lower portion” for convenience, but does not have to physically exist at the lower position, and is not particularly distinguished from the upper plate 2.

  It is also preferable that the lower plate 11 includes a protrusion or an adhesive portion that is joined to the intermediate plate 12.

  Further, the lower plate 11 may or may not be in contact with the heating element.

  It is also preferable that the lower plate 3 is provided with a protruding portion or an adhesive portion used for joining with the intermediate plate 10 or the upper plate 2.

(Internal space)
The internal space 4 will be described.

  The inner space 4 is formed by joining the upper plate 2 and the lower plate 3. As shown in FIG. 1, the internal space 4 is a space sandwiched between the upper plate 2 and the lower plate 3. At this time, the side surfaces of the upper plate 2 and the lower plate 3 are surrounded by the side walls 9, so that the sealed internal space 4 is formed.

  Since the interior space 4 is hermetically sealed, the refrigerant can be enclosed.

  A refrigerant inlet is provided in a part of the upper plate 2 and the lower plate 3, and the refrigerant is injected into the internal space 4 from the inlet.

  If the internal space 4 is not partitioned by the passage 5, the internal space 4 has a volume that conforms to the volume of the heat transport unit 1, and thus the refrigerant moving space is large. When the heating element to be cooled by the heat transport unit 1 is large, it is appropriate that the moving space of the refrigerant is large, but when the heating element to be cooled by the heat transport unit 1 is small, the refrigerant is It is not appropriate that the movement space is too large. This is because the moving space is large, the moving distance of the refrigerant becomes long, and the moving speed of the refrigerant from the end to the end of the heat transport unit 1 becomes slow. Furthermore, since the amount of the refrigerant in the internal space 4 also increases, the load of vaporization and condensation of the refrigerant based on the amount of heat from the heating element also increases, and the vaporization and condensation of the refrigerant (and the diffusion of the vaporized refrigerant and the concentration of the condensed refrigerant) The cycle of reflux) tends to be long.

  For this reason, the heat transport unit 1 divides the internal space 4 into a plurality of passages 5 along the first direction as described below. The first direction is from the end in the longitudinal direction of the heat transport unit 1 to the other end.

(aisle)
The passage 5 will be described.

  As shown in FIG. 2, the internal space 4 is divided into a plurality of passages 5 along the first direction.

  The passage 5 receives the heat from the heating element and diffuses the vaporized refrigerant sealed in the passage 5 along the first direction. Similarly, the passage 5 circulates the cooled and condensed refrigerant along the first direction. That is, each of the plurality of passages 5 has an actual heat transport function in the heat transport unit 1.

  The plurality of passages 5 are divided along the first direction, and are separated from adjacent passages 5 by a boundary 6. The groove 7 is provided facing the inside of the passage 5. A vapor diffusion path 12 and a capillary flow path 11 are also provided inside the passage 5. Also from this, each of the some channel | path 5 bears the function of heat transport.

  The number of the passages 5 in the heat transport unit 1 may be any number, and may be determined from the viewpoints of manufacturing ease and durability. In addition, the internal space 4 of the heat transport unit 1 is divided into a plurality of passages 5 even when the heating element to be cooled is small in size. In order to achieve this, the width and number of the passages 5 may be determined depending on the size and number of the heating elements.

  In FIG. 2, the individual passages 5 are continuous from the end to the end of the heat transport unit 1, but may be divided or cut off in the middle. That is, a plurality of passages 5 may be provided in the same row from the end to the end of the heat transport unit 1. The channel | path 5 should just be divided by the wall member formed along a boundary.

  Moreover, since the groove | channel 7 should just be provided in the inside of the channel | path 5, it is not only provided in the upper board 2 and the lower board 3 (as FIG. 1 shows), but it opposes the channel | path 5 of the boundary 6 or the side wall 9. May be provided on the surface.

  As described above, the grooves 7 are provided on the upper, lower, left, and right surfaces in the passage 5, so that the refrigerant can move more easily along the first direction, and the refrigerant moves along the first direction (vaporized refrigerant). Diffusion and recirculation of the condensed refrigerant).

  As described above, since the internal space 4 is divided into the plurality of passages 5, the efficiency of heat transport along the first direction is improved.

(Intermediate plate)
Next, the intermediate plate 10 will be described with reference to FIGS.

  The intermediate plate 10 is a single plate member or a plurality of plate members. One or a plurality of intermediate plates 10 may be laminated for each of the plurality of passages 5 in which the internal space 4 is divided into a plurality. Alternatively, one or a plurality of intermediate plates 10 may be stacked across the plurality of passages 5.

  The intermediate plate 10 is formed of metal, resin, or the like, but is formed of metal having high thermal conductivity or high rust prevention (durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. It is preferred that Moreover, although it may have various shapes such as a square, a rhombus, a circle, an ellipse, and a polygon, since the heat transport unit 1 is formed by being sandwiched between the upper plate 2 and the lower plate 3, the upper plate 2 and the lower plate The same shape as the plate 3 is preferable.

  Further, the intermediate plate 10 may have protrusions and adhesive portions that are used when connected to the upper plate 2 and the lower plate 3. In addition, the intermediate plate 10 has an internal through hole 17. The internal through hole 17 forms the capillary channel 11. Further, the intermediate plate 10 may have a notch 16. The notch 16 forms the vapor diffusion path 12.

  Finally, the intermediate plate 10 is laminated and joined between the upper plate 2 and the lower plate 3 to form the heat transport unit 1. The intermediate plate 10 may be singular or plural. However, as will be described later, in order to form the capillary channel 11 having a smaller cross-sectional area, it is preferable that there are a plurality of intermediate plates 10.

(Intermediate plate, vapor diffusion path and capillary flow path)
Next, the vapor diffusion path 12 and the capillary flow path 11 will be described.

  The intermediate plate 10 forms a vapor diffusion path 12 that diffuses the refrigerant vaporized inside the passage 5 and a capillary passage 11 that recirculates the refrigerant condensed inside the passage 5. The vapor diffusion path 12 diffuses the refrigerant vaporized in the passage 5 along the first direction. The capillary channel 11 circulates the refrigerant condensed in the first direction in the passage 5. That is, each of the plurality of passages 5 performs heat transfer according to the first direction.

  The intermediate plate 10 has a cutout portion 16 and an internal through hole 17, and the cutout portion 16 forms a vapor diffusion path 12 by the lamination of the intermediate plate 10, and the internal through hole 17 is connected to the capillary channel 11. Form.

  The vapor diffusion path 12 in the pattern shown in FIG. 5 will be described.

  Furthermore, since the vapor diffusion path 12 is formed in each of the plurality of passages 5, the vaporized refrigerant diffuses along the first direction in each of the plurality of passages 5. Further, the groove 7 is formed along the first direction, and the groove 7 communicates with the vapor diffusion path 12, so that the vaporized refrigerant easily follows the orientation of the groove 7, and the vaporized refrigerant is in the first direction. It becomes easy to diffuse at high speed along. Further, the groove 7 makes it easier for the vaporized refrigerant to come into indirect contact with the surface of the heat transport unit 1 and promotes cooling of the vaporized refrigerant.

  Next, the capillary channel 11 will be described.

  The capillary channel 11 is formed by the overlap of the internal through holes 17 when the intermediate plate 10 is laminated. The internal through-hole 17 may have any shape such as a square, a circle, an ellipse, a rectangle, a polygon, and a slit.

  The internal through-hole 17 is a through-hole penetrating the front and back of the intermediate plate, and forms the capillary channel 11 through which the condensed refrigerant recirculates. The capillary channel 11 may be formed by the internal through-hole 17 included in the single intermediate plate 10, or may be formed by the internal through-hole 17 included in the plurality of intermediate plates 10 to be stacked. When the single intermediate plate 10 is stacked on the passage 5, the internal through-hole 17 of the single intermediate plate 10 forms the capillary channel 11 as it is.

  When the plurality of intermediate plates 10 are stacked, only a part of the internal through-holes 17 provided in each of the plurality of intermediate plates 10 overlap, and the cross-sectional area smaller than the cross-sectional area in the planar direction of the internal through-holes 17 is obtained. A capillary channel 11 having the same is formed. Thus, when there are a plurality of intermediate plates 10, the capillary channel 11 having a cross-sectional area smaller than the cross-sectional area of the internal through-hole 17 itself is formed, so that the condensed refrigerant recirculates in the capillary channel 11. Can be more effective. This is because the movement of the liquid by capillary action is promoted by the small cross-sectional area of the capillary.

  The internal through hole 17 may be formed by excavation, pressing, wet etching, dry etching, or the like.

  When there are a plurality of intermediate plates 10, the internal through hole 17 is provided in a required intermediate plate among the plurality of intermediate plates 10. Here, the plurality of intermediate plates 10 are stacked such that only a part of the internal through holes 17 overlap each other. The capillary channel 11 has a cross-sectional area smaller than the cross-sectional area of the internal through-hole 17 in the planar direction, with a part of the internal through-holes 17 overlapping when the plurality of intermediate plates 10 are stacked. Such holes having a cross-sectional area smaller than the cross-sectional area of the internal through-hole 17 are laminated in the thickness direction of the passage 5, and the holes in the thickness direction are connected to each other to form a flow path in the thickness direction. Moreover, since it becomes a stepped hole in the thickness direction, a flow path that can flow in the planar direction as well as in the thickness direction is formed. The flow path formed in the thickness / planar direction has a very small cross-sectional area, and recirculates the condensed refrigerant in the thickness direction or the thickness / planar direction.

  Further, when the capillary channel 11 having a smaller cross-sectional area than the inner through hole 17 is formed so that only a part of the inner through hole 17 overlaps, rather than directly processing the capillary channel 11, There is also an advantage that it can be manufactured easily.

  That is, in the passage 5, the capillary channel 11 recirculates the condensed refrigerant in the thickness direction and the planar direction. In particular, since the internal space 4 is divided into a plurality of passages 5, the capillary channel 11 can easily recirculate the condensed refrigerant in the first direction in the passages 5. In addition, since the groove 7 communicates with the capillary channel 11, the condensed refrigerant can easily follow the orientation of the groove 7 in the first direction. As a result, the condensed refrigerant recirculates in the first direction. In addition, although the capillary flow path 11 recirculates the condensed refrigerant | coolant, it can also pass the vaporized refrigerant | coolant.

  It is also preferable that the capillary channel 11, the corner of the groove 7, and the corner of the notch 16 are chamfered or provided with R. The cross section of the capillary channel 11 may have various cross sectional shapes such as a hexagon, a circle, an ellipse, a square, and a polygon. The cross-sectional shape of the capillary channel 11 is determined by the shape of the internal through hole 17 and the way in which the internal through holes 17 are overlapped. Moreover, a cross-sectional area is determined similarly.

  As described above, the vapor diffusion path 12 provided in the passage 5 diffuses the refrigerant vaporized in the passage 5 in the first direction, and the capillary flow path 11 provided in the passage 5 includes the passage 5. The refrigerant condensed inside is refluxed in the first direction.

  Here, the internal space 4 of the heat transport unit 1 is originally divided into a plurality of passages 5 along the first direction, so that the longitudinal direction of the first direction is extremely short with respect to the short direction (width direction). A large passage 5 is formed. Therefore, the physically vaporized refrigerant and the condensed refrigerant easily move along the longitudinal direction of the passage 5. Being easy to move along the longitudinal direction of the passage 5 means being easy to move along the first direction. Further, in the passage 5, the vapor diffusion path 12 formed along the first direction and the groove 7 formed along the first direction communicate with each other, so that the vaporized refrigerant is further along the first direction. Easily spread. Similarly, in the passage 5, the capillary channel 11 formed in the thickness and plane direction along the first direction and the groove 7 formed in the first direction communicate with each other. It becomes easier to recirculate along the first direction. The fact that the condensed refrigerant is easy to recirculate means that not only the heat transport speed from end to end of the passage 5 is increased, but also the cycle time from the diffusion of the evaporated refrigerant to the return of the condensed refrigerant is shortened. Thus, the number of cycles per unit time of vaporization and condensation of the refrigerant is improved. As a result, the heat transport unit 1 can realize high heat transport efficiency.

  Thus, the heat transport unit 1 is formed by the combination of the passage 5 that divides the internal space along the first direction, the groove 7 that is formed along the first direction in the passage 5, the vapor diffusion passage 12, and the capillary passage 11. Can transport heat at high speed along the first direction.

(Connection way)
Next, the communication path 8 will be described.

  As shown in FIG. 1, the heat transport unit 1 includes a communication path 8 that connects a plurality of passages 5 and allows a refrigerant to move. The communication path 8 is provided at the boundary 6 of the passage 5.

  The communication path 8 enables the refrigerant to move between the paths 5. The refrigerant is sealed in each of the plurality of passages 5, but there may be a passage 5 having a high heat generation amount and a passage 5 having a small heat generation amount depending on the type and position of the heating element. In this case, the required amount of refrigerant differs between the passage 5 where the heat generation amount is high and the passage 5 where the heat generation amount is small. At this time, if the refrigerant cannot move between the passages 5, the necessary refrigerant is insufficient or excessive in each of the passages 5. In this case, the internal space 4 of the heat transport unit 1 is divided into a plurality of passages 5 along the first direction, and each of the plurality of passages 5 includes a vapor diffusion path 12 and a capillary passage 11. Even if the passage 5 can move the refrigerant with high efficiency, there is a fear that the heat transport efficiency may be reduced due to the excessive or insufficient amount of the refrigerant.

  Since the communication path 8 enables the movement of the refrigerant between the passages 5, the passage 5 that requires a large amount of refrigerant and the passage 5 that requires a small amount of refrigerant exchange the refrigerant with each other, and the amount of refrigerant Can balance. For example, since the passage 5 having a large calorific value requires a large amount of refrigerant, the refrigerant can be obtained from the passage 5 having a small calorific value (via the communication path 8). If a sufficient amount of refrigerant can be obtained in the passage 5 having a large calorific value, the refrigerant can be moved in accordance with the large calorific value. That is, it is not necessary to reduce the heat transport efficiency even in the passage 5 having a large calorific value.

  Thus, by providing the communication path 8 through which the refrigerant can move between the passages 5, it is possible to distribute the refrigerant without excess or deficiency for each passage 5, and the heat transport unit 1 is configured with the number of heating elements, the size, and the calorific value. Heat transfer can be performed with high efficiency while responding flexibly to the position.

  FIG. 4 is an internal view of the heat transport unit according to Embodiment 1 of the present invention. FIG. 4 schematically shows the inside of the heat transport unit 1.

  The heat transport unit 1 includes a plurality of passages 5 and a communication path 8 that can move the refrigerant between the plurality of passages 5. The communication path 8 may be provided at the boundary 6 that separates the plurality of passages 5, but may be provided at the bottom of the boundary 6. That is, when the groove 7 is formed in the upper plate 2 or the lower plate 3, if the groove in the direction perpendicular to the groove 7 is formed in at least a part of the upper plate 2 and the lower plate 3, the boundary 6 and the upper plate 2 or between the boundary 6 and the lower plate 3. This gap serves as a communication path 8 and connects the plurality of paths 5 to each other. The connecting path 8 shown in FIG. 7 is formed in this way.

  The exchange of refrigerant in the passages 5 will be described with reference to FIG. FIG. 5 is an operation explanatory diagram of the heat transport unit according to the first embodiment of the present invention.

  The heat transport unit 1 shown in FIG. 5 includes a plurality of passages 5a to 5e, and a heating element 30 is disposed in the passages 5b and 5e. For this reason, the passages 5b and 5e are passages with a large calorific value, and the other passages are passages with a small calorific value. The heat transport unit 1 has a communication path 8 through which the refrigerant can move between the paths 5.

  The passages 5b and 5e have a larger amount of heat generation than the other passages by the heating element 30. Since the amount of generated heat is large, the passages 5b and 5e need to increase the speed and cycle of refrigerant diffusion and reflux. At this time, the passages 5b and 5e move heat by the latent heat of the vaporized refrigerant, so that more refrigerant is required than the other passages.

  On the other hand, since the passages 5a, 5c, and 5d have only a small amount of heat generation, a small amount of refrigerant is required. Since the communication path 8 penetrates the paths 5a to 5e, the refrigerant sealed in the paths 5a, 5c, and 5d can move to the paths 5b and 5e via the communication path 8. As a result, when the amount of refrigerant that the passages 5b and 5e have is insufficient, the passages 5b and 5e can use the refrigerant that has been supplied from the passages 5a, 5c, and 5d. As a result, the passages 5b and 5e having a large calorific value can have a sufficient amount of refrigerant in their passages, and the heat taken away from the heating element 30 can be transported at high speed and efficiency.

  Further, FIG. 5 illustrates the case where refrigerant is exchanged between the passages 5b and 5e in which the heating elements 30 are disposed and the passages 5a, 5c and 5d in which the heating elements 30 are not disposed. Even when the arranged passage 5 obtains the refrigerant from other passages 5, the communication passage 8 works effectively. For example, when the heating elements are arranged in all the passages 5 and the temperature of the heating element in a certain passage 5 suddenly rises, this passage 5 receives supply of refrigerant from the other passages 5 ( The heat transport efficiency (supplied by the movement of the refrigerant through the connecting path 8) can be maintained.

  As described above, the heat transport unit 1 can change the size, the number, the heat generation amount, the position, and the heat generation amount of the heating element by the communication path 8 in which the refrigerant can move between the passages 5 that divide the internal space 4 into a plurality of passages. High heat transport efficiency can be maintained according to flexibility.

(Manufacturing process)
Here, the manufacturing process of the heat transport unit 1 will be described.

  The heat transport unit 1 is manufactured by stacking and joining the upper plate 2, the lower plate 3, and the intermediate plate 10.

  Each of the upper plate 2, the lower plate 3, and the plurality of intermediate plates 10 is matched to a predetermined positional relationship. In addition, the plurality of intermediate plates 10 are adjusted to a positional relationship such that only a part of each of the internal through holes 17 provided in each of the plurality of intermediate plates 10 overlap.

  At least one of the upper plate 2, the lower plate 3, and the plurality of intermediate plates 10 has a joint protrusion.

  The upper plate 2, the lower plate 3, and the plurality of intermediate plates 10 are aligned and stacked, and are directly joined and integrated by heat press. At this time, each member is directly joined by the joining projection.

  Here, the direct bonding refers to applying heat treatment while pressing the surfaces of the two members to be bonded together, and firmly bonding the atoms together by an atomic force acting between the surface portions. That is, the surfaces of the two members can be integrated without using an adhesive. At this time, the bonding protrusion realizes strong bonding. That is, since the bonding protrusions are pulled together and the contact area is increased, thermal bonding is realized, so that the role of the bonding protrusions is high.

  As direct bonding conditions in the heat press, the press pressure is preferably in the range of 40 kg / cm 2 to 150 kg / cm 2, and the temperature is preferably in the range of 250 to 400 ° C.

  Next, the refrigerant is injected through an injection port opened in a part of the upper plate 2 and the lower plate 3. Thereafter, the inlet is sealed and the heat transport unit 1 is completed. The refrigerant is sealed under vacuum or reduced pressure. By being performed under vacuum or reduced pressure, the internal space of the heat transport unit 1 is in a vacuum or reduced pressure state and the refrigerant is enclosed. When the pressure is reduced, the refrigerant vaporization / condensation temperature becomes low, and there is an advantage that the refrigerant vaporization / condensation repeats actively.

(Explanation of heat transport unit operation)
Next, the operation of the heat transport unit will be described.

  FIG. 6 is an operation explanatory diagram of the heat transport unit according to Embodiment 1 of the present invention.

  The heat transport unit 1 shown in FIG. 6 has a plurality of passages in which the internal space 4 is divided. Among the plurality of passages, the heating elements 30 are disposed in the passages 5b and 5e, and the remaining passages are provided. The heating element 30 is not arranged. The heating element 30 is, for example, a light emitting element such as an LED, and since a plurality of the heating elements 30 are used as a set although they are small in size, as shown in FIG. Therefore, it is necessary to cool the plurality of heating elements 30 having a small size.

  The heating element 30 is disposed on the surface of the upper plate 2 or the lower plate 3, for example. The heating element 30 generates heat. The upper plate 2 and the lower plate 3 take away heat from the heating element 30.

  Here, the passages 5b and 5e in which the heating element 30 is disposed take heat of the heating element 30. The refrigerant contained in the passages 5b and 5e is vaporized by the heat taken away. The vaporized refrigerant moves in the first direction in the passages 5b and 5e according to the groove 7 and the vapor diffusion path 12 formed in the first direction. Since the heat transport unit 1 limits the movement space of the refrigerant to the divided passages, the vaporized refrigerant easily moves along the first direction only in the passage. In addition, since the groove 7 and the vapor diffusion path 12 are formed in the first direction, the vaporized refrigerant easily moves in the first direction. Thus, the movement speed of the vaporized refrigerant becomes faster because the movement space is limited and the movement direction is easily specified.

  Thus, the passages 5b and 5e move the refrigerant evaporated by the heat taken away from the heating element 30 at high speed along the first direction.

  Next, the vaporized refrigerant that has moved along the first direction is cooled and condensed at the end and the surface of the heat transport unit 1 during and after the movement. The passages 5b and 5e recirculate the condensed refrigerant. Even in the recirculation, the moving space where the condensed refrigerant recirculates is limited in units of passages. For this reason, the condensed refrigerant naturally easily moves along the first direction only inside the passage. In addition, since the groove 7 and the capillary channel 11 are formed along the first direction, the condensed refrigerant is more likely to move along the first direction. Thus, the movement speed of the condensed refrigerant | coolant becomes quick because movement space is limited and a moving direction is easy to be specified.

  In addition, since the passages 5b and 5e that require a larger amount of refrigerant can obtain the refrigerant from other passages that do not require a large amount of refrigerant, the refrigerant that is necessary for the amount of generated heat. Can also be included. As a result, since the refrigerant is vaporized and condensed in accordance with the heat generation amount, the number of cycles of the diffusion of the vaporized refrigerant and the reflux of the condensed refrigerant is also improved. As a result, the moving speed of the vaporized refrigerant, the moving speed of the condensed refrigerant, and the number of times of moving the refrigerant per unit time are improved. That is, the heat transport efficiency is increased.

  Combined with the above functions and operations, the heat transport unit 1 can realize high heat transport efficiency.

  As described above, the heat transport unit 1 according to Embodiment 1 is capable of transporting the heat of the heating element in a predetermined direction with high efficiency in combination with various structures and functions.

  Although heat transport in the first direction has been described, the first direction does not refer to a single direction but may refer to directions on both sides. Further, the first direction may be a straight line, a curve, or a refraction line.

  Further, the number of passages and the number of intermediate plates are not particularly limited.

(Embodiment 2)
Next, a second embodiment will be described.

  In the second embodiment, a heat transport unit having a two-stage structure will be described with reference to FIGS. 7 and 8 are perspective views of the heat transport unit according to Embodiment 2 of the present invention. Among the reference numerals given in FIGS. 7 and 8, elements having the same reference numerals as those in FIGS. 1 to 6 are equivalent elements already described.

  The heat transport unit 50 has a two-stage structure, and the row of passages 5 has a two-stage structure in the thickness direction. The heat transport unit 50 has an upper stage 40 and a lower stage 41, and each internal space 4 of the upper stage 40 and the lower stage 41 is divided into a plurality of passages 5 along the first direction. 7 and 8, the internal space 4 of each of the upper stage 40 and the lower stage 41 is divided into a plurality of passages 5, but only one of the upper stage 40 and the lower stage 41 is divided into a plurality of passages 5. Or the structure of the sections may be different.

  For example, only the upper stage 40 may be divided into a plurality of passages 5. Alternatively, the upper stage 40 may be divided into five passages 5, and the lower stage 41 may be divided into ten passages 5. In any case, the upper stage 40 and the lower stage 41 of the two-stage structure may have a flexible structure according to the specifications. Moreover, it may have not only a two-stage structure but also a three-stage structure or more.

  FIG. 7 shows the heat transport unit 50, in which the passage 5 does not have the intermediate plate 10, and FIG. 8 shows the heat transport unit 50, in which the passage 5 has one or more intermediate portions. A heat transport unit 50 having a plate 10 is shown. As described in the first embodiment, the passage 5 may be provided with the intermediate plate 10 as necessary.

  7 and 8, the heat transport unit 50 has a two-stage structure of an upper stage 40 and a lower stage 41. The upper stage 40 and the lower stage 41 are separated by the lower plate 3 of the upper stage 40 and the upper plate 2 of the lower stage 41 being formed by a common member or being stacked with different members. Here, when the lower plate 3 of the upper stage 40 and the upper plate 2 of the lower stage 41 are formed of a common member, direct heat transfer is performed between the upper stage 40 and the lower stage 41.

  The upper stage 40 is formed by joining the upper plate 2 and the lower plate 3. By joining the upper plate 2 and the lower plate 3, an internal space 4 is formed in the upper stage 40.

  The lower stage 41 is also formed by joining the upper plate 2 and the lower plate 3 together. By joining the upper plate 2 and the lower plate 3, an internal space 4 is formed in the lower stage 41. The internal space 4 is a space sandwiched between the upper plate 2 and the lower plate 3 as shown in FIGS. At this time, the side surfaces of the upper plate 2 and the lower plate 3 are surrounded by the side walls 9, so that the sealed internal space 4 is formed.

  The side wall 9 that forms the internal space 4 may be formed of a pillar member that connects the upper plate 2 and the lower plate 3. Further, the left and right sides of the internal space 4 are sealed with side walls 9.

  Since the inner space 4 is hermetically sealed in this way, the refrigerant can be enclosed.

  A refrigerant inlet is provided in a part of the upper plate 2 and the lower plate 3, and the refrigerant is injected into the internal space 4 from the inlet. The internal space 4 is further divided into a plurality of passages 5 along the first direction. The first direction is from the end in the longitudinal direction of the heat transport unit 1 to the other end.

  The passage 5 receives the heat from the heating element and diffuses the vaporized refrigerant sealed in the passage 5 along the first direction. Similarly, the passage 5 circulates the cooled and condensed refrigerant along the first direction. That is, each of the plurality of passages 5 has an actual heat transport function in the heat transport unit 50.

  The plurality of passages 5 are divided along the first direction, and are separated from adjacent passages 5 by a boundary 6. The groove 7 is provided facing the inside of the passage 5. A vapor diffusion path 12 and a capillary flow path 11 are also provided inside the passage 5. Also from this, each of the some channel | path 5 bears the function of heat transport.

  The number of the passages 5 in the heat transport unit 50 may be any number, and it may be determined from the viewpoint of ease of manufacture and durability. Further, the internal space 4 of the heat transport unit 50 is divided into a plurality of passages 5 even when the heating element to be cooled is small in size, the optimal amount of refrigerant and the optimal refrigerant moving space are separated. In order to achieve this, the width and number of the passages 5 may be determined depending on the size and number of the heating elements.

  The individual passages 5 are preferably continuous from the end portion to the end portion of the heat transport unit 50, but may be divided or cut off in the middle. That is, a plurality of passages 5 may be provided in the same row from the end to the end of the heat transport unit 50.

  The internal space 4 is formed by joining the upper plate 2 and the lower plate 3. When the internal space 4 is formed, the boundary 6 of the passage 5 is formed by joining the protrusions along the boundary line dividing the passage 5. The boundary 6 becomes an inner wall that separates the passages 5 as they are. The formation of the boundary 6 may be performed at the same time as the formation of the side wall 9.

  In addition, since the boundary 6 which divides adjacent channel | paths 5 becomes a pillar in the internal space 4, it also plays the role which improves the intensity | strength and durability of the heat transport unit 50. FIG.

  Moreover, since the groove | channel 7 should just be provided in the inside of the channel | path 5, it may be provided not only in the upper plate 2 and the lower plate 3, but in the surface facing the channel | path 5 of the boundary 6 or the side wall 9. FIG.

  As described above, the grooves 7 are provided on the upper, lower, left, and right surfaces in the passage 5, so that the refrigerant can move more easily along the first direction, and the refrigerant moves along the first direction (vaporized refrigerant). Diffusion and recirculation of the condensed refrigerant).

  The passage 5 may include one or a plurality of intermediate plates 10 as shown in FIG.

  The intermediate plate 10 forms a vapor diffusion path 12 that diffuses the refrigerant vaporized inside the passage 5 and a capillary passage 11 that recirculates the refrigerant condensed inside the passage 5. The vapor diffusion path 12 diffuses the refrigerant vaporized in the passage 5 along the first direction. The capillary channel 11 circulates the refrigerant condensed in the first direction in the passage 5. As is apparent from FIG. 8, each of the passages 5 includes a capillary channel 11 and a vapor diffusion channel 12 that follow a first direction formed by stacking the intermediate plates 10. That is, each of the plurality of passages 5 performs heat transfer according to the first direction.

  The laminated pattern of the intermediate plate 10 and the structure pattern of the vapor diffusion path 12 and the capillary channel 11 formed by the intermediate plate 10 are the same as those described in the first embodiment with reference to the drawings. One or more intermediate plates 10 having internal through holes and notches are stacked inside the passage 5. At this time, the notch forms the vapor diffusion path 12, and the internal through hole forms the capillary channel 11.

  Since the vapor diffusion path 12 is formed in each of the plurality of passages 5, the vaporized refrigerant diffuses along the first direction in each of the plurality of passages 5. Further, the groove 7 is formed along the first direction, and the groove 7 communicates with the vapor diffusion path 12, so that the vaporized refrigerant easily follows the orientation of the groove 7, and the vaporized refrigerant is in the first direction. It becomes easy to diffuse at high speed along. Moreover, the groove | channel 7 becomes easy to contact the vaporized refrigerant | coolant indirectly with the surface of the heat transport unit 50, and cooling of the vaporized refrigerant | coolant is accelerated | stimulated.

  The capillary channel 11 is formed by internal through holes or by overlapping of the internal through holes. The internal through-hole 17 is a through-hole penetrating the front and back of the intermediate plate, and may have any shape such as a circle, an ellipse, a rectangle, a polygon, and a slit. The internal through hole forms a capillary channel 11 through which the condensed refrigerant recirculates. The capillary channel 11 may be formed by an internal through-hole that a single intermediate plate 10 has, or may be formed by an internal through-hole that a plurality of laminated intermediate plates 10 have. When the single intermediate plate 10 is stacked on the passage 5, the internal through hole of the single intermediate plate 10 forms the capillary channel 11 as it is.

  Alternatively, when a plurality of intermediate plates 10 are stacked, only a part of the internal through holes provided in each of the plurality of intermediate plates 10 overlap, so that the cross section area of the internal through holes is smaller than the plane sectional area. A capillary channel 11 having an area is formed. Thus, when there are a plurality of intermediate plates 10, the capillary channel 11 having a cross-sectional area smaller than the cross-sectional area of the internal through hole itself is formed. Can be more effective. This is because the movement of the liquid by capillary action is promoted by the small cross-sectional area of the capillary. The internal through hole may be formed by excavation, pressing, wet etching, dry etching, or the like.

  Since the capillary channel 11 formed by laminating the plurality of intermediate plates 10 is a stepped hole in the thickness direction, a channel that can flow in the plane direction as well as the thickness direction is formed. The flow path formed in the thickness / planar direction has a very small cross-sectional area, and recirculates the condensed refrigerant in the thickness direction or the thickness / planar direction.

  That is, in the passage 5, the capillary channel 11 recirculates the condensed refrigerant in the thickness direction and the planar direction. In particular, since the internal space 4 is divided into a plurality of passages 5, the capillary channel 11 can easily recirculate the condensed refrigerant in the first direction in the passages 5. In addition, since the groove 7 communicates with the capillary channel 11, the condensed refrigerant can easily follow the orientation of the groove 7 in the first direction. As a result, the condensed refrigerant recirculates in the first direction. In addition, although the capillary flow path 11 recirculates the condensed refrigerant | coolant, it can also pass the vaporized refrigerant | coolant.

  The heat transport unit 50 in the second embodiment includes an upper stage 40 and a lower stage 41 having a plurality of passages 5 having such a vapor diffusion path 12 and a capillary channel 11. For this reason, each of the upper stage 40 and the lower stage 41 can transport heat from different heating elements, and heat from the heating element arranged on the bottom surface of the lower plate 3 of the lower stage 41 is added to the lower stage 41. The upper stage 40 can also be used for transportation.

  Thus, the heat transport unit 50 having the two-stage structure (or multi-stage structure) in the second embodiment can perform heat transport with high flexibility. The heat transport unit 50 having a multi-stage structure makes the arrangement of the heat generating elements flexible and increases the heat transport speed from the heat generating elements. Alternatively, the heat transport unit 50 having a multi-stage structure can broaden the operating temperature range of the heat transport unit 50 itself by enclosing the refrigerants having different operation temperatures such as water and alcohol.

  Here, since the internal space 4 of the heat transport unit 50 is partitioned into a plurality of passages 5 along the first direction, the longitudinal direction of the first direction is very much smaller than the short direction (width direction). A large passage 5 is formed. For this reason, the vaporized refrigerant and the condensed refrigerant are likely to move along the longitudinal direction of the passage 5. Being easy to move along the longitudinal direction of the passage 5 means being easy to move along the first direction. Further, in the passage 5, the vapor diffusion path 12 formed along the first direction and the groove 7 formed along the first direction communicate with each other, so that the vaporized refrigerant is further along the first direction. Easily spread. Similarly, in the passage 5, the capillary channel 11 formed in the thickness and plane direction along the first direction and the groove 7 formed in the first direction communicate with each other. It becomes easier to recirculate along the first direction. The fact that the condensed refrigerant is easy to recirculate means that not only the heat transport speed from end to end of the passage 5 is increased, but also the cycle time from the diffusion of the evaporated refrigerant to the return of the condensed refrigerant is shortened. Thus, the number of cycles per unit time of vaporization and condensation of the refrigerant is improved. As a result, the heat transport unit 50 can realize high heat transport efficiency.

  Thus, the heat transport unit 50 is formed by the combination of the passage 5 that divides the internal space along the first direction, the groove 7 that is formed along the first direction in the passage 5, the vapor diffusion passage 12, and the capillary passage 11. Can transport heat at high speed along the first direction.

  Although not shown in FIGS. 7 and 8, similarly to the heat transport unit 1 of the first embodiment, the heat transport unit 50 has a communication path through which the refrigerant can move between the passages 5. With this communication path, the refrigerant can move between the passages 5, and the amount of refrigerant in each of the plurality of passages 5 can be balanced. For example, since a larger amount of refrigerant is required in a passage having a large calorific value, the passage having a large calorific value obtains a surplus refrigerant in a passage having a small calorific value. Thus, the communication path can realize the interchange of the refrigerant in the paths 5. As a result, the amount of refrigerant in the plurality of passages 5 is optimized, and the heat transport efficiency in each of the passages 5 is improved.

  Thus, the heat transport unit 50 according to the second embodiment can realize high-speed and high-efficiency heat transport along the first direction while flexibly responding to the arrangement and the number of heating elements.

(Embodiment 3)
Next, Embodiment 3 will be described with reference to FIGS.

  FIG. 9 is an internal view of the electronic device according to the third embodiment of the present invention. The electronic device 80 includes a substrate on which an electronic component 81 serving as a heating element is mounted and a housing 82. In addition, the heat transport unit 1 is mounted so as to be in thermal contact with the electronic component 81. A cooling fan 90 is provided at the end of the heat transport unit 1. The heat transport unit 1 transports the heat taken from the electronic component 81 to the side opposite to the arrangement position of the electronic component 81 at a high speed by the operation described in the first and second embodiments. The cooling fan 90 can cool the transported heat by blowing air. At this time, the electronic component 81 is a small light emitting element such as an LED, and the heat transport unit 1 transports heat from the electronic component 81 with the passage 5 as a reference. For this reason, the heat transport unit 1 can transport heat at a very high speed and efficiently. Since the transported heat is cooled by the cooling fan 90, the refrigerant is condensed and refluxed. Thus, the heat transport unit 1 can efficiently transport the heat from the electronic component 81 by the diffusion and reflux of the refrigerant.

  As described above, the electronic device on which the heat transport unit 1 is mounted can efficiently transport the heat from the electronic component 81 that is a heating element, so that it is possible to prevent the electronic component 81 from being excessively heated and troubled due to excessive heat generation. The heat transport unit 1 includes the heat transport unit 50 having the other structure and form described in the second embodiment.

  A specific example of the electronic device is illustrated in FIG. FIG. 10 is a perspective view of an electronic device according to Embodiment 3 of the present invention. The electronic device 80 is an electronic device that is required to be thin and small, such as a car TV or a personal monitor.

  The electronic device 80 includes a display 83, a light emitting element 84, and a speaker 85. The heat transport unit 1 is stored inside the electronic device 80, and the cooling of the heating element is realized.

  By using such a heat transport unit 1, cooling of the heating element can be realized without hindering the downsizing and thinning of the electronic device. That is, the heat transport unit 1 can transport and cool the heat from the heating element at high speed, and can suppress the heat generation of the heating element.

  The heat transport unit 1 is replaced with a heat radiating fin or a liquid cooling device mounted on a notebook computer, a portable terminal, a computer terminal or the like, or mounted on a light, an engine, or a control computer unit of an automobile or industrial equipment. It can be suitably replaced with a heat dissipating frame or a cooling device. Since the heat transport unit 1 has a higher cooling capacity than the conventionally used radiating fins and radiating frames, it can naturally be reduced in size. Furthermore, it is possible to flexibly handle the heating element, and various electronic components can be cooled. As a result, the heat transport unit 1 has a wide application range.

  The heat transport units and electronic devices described in the first to third embodiments are examples for explaining the gist of the present invention, and include modifications and alterations without departing from the gist of the present invention. The heat transport unit 1 may be flat, curved, or thick three-dimensional. The shape and appearance are not particularly limited.

The perspective view of the heat transport unit in Embodiment 1 of this invention Top view of heat transport unit in Embodiment 1 of the present invention The perspective view of the heat transport unit in Embodiment 1 of this invention The internal view of the heat transport unit in Embodiment 1 of this invention Operation explanatory diagram of the heat transport unit in Embodiment 1 of the present invention Operation explanatory diagram of the heat transport unit in Embodiment 1 of the present invention The perspective view of the heat transport unit in Embodiment 2 of this invention The perspective view of the heat transport unit in Embodiment 2 of this invention The internal view of the electronic device in Embodiment 3 of this invention The perspective view of the electronic device in Embodiment 3 of this invention

DESCRIPTION OF SYMBOLS 1, 50 Heat transport unit 2 Upper plate 3 Lower plate 4 Internal space 5 Passage 6 Boundary 7 Groove 8 Connection way 9 Side wall 10 Intermediate plate 11 Capillary flow path 12 Steam diffusion path

Claims (8)

A heat transport unit that transports heat of a plurality of arranged heating elements along a first direction from one end to the other end,
An upper plate,
A lower plate facing the upper plate;
An internal space formed by joining the upper plate and the lower plate and capable of enclosing a refrigerant;
A plurality of passages dividing the internal space along the first direction;
A groove formed in the first direction on each of the upper , lower, left and right surfaces of the plurality of passages;
A communication path through which the refrigerant can move between the plurality of paths,
The groove promotes diffusion and reflux of the encapsulated refrigerant,
The plurality of passages are formed from the one end to the other end,
The heating element has a size corresponding to each width of the plurality of passages, corresponds to any position of the plurality of passages, and is disposed on the one end side,
The passage in which the heating element is disposed diffuses the vaporized refrigerant, which is the encapsulated refrigerant, from the one end side along the first direction, and the condensed refrigerant From one end side to the other end side along the first direction,
The communication path is a heat transport unit that moves the refrigerant sealed in a path where the heating element is not disposed to a path where the heating element is disposed . At least some of the plurality of passages are
The heat transport unit according to claim 1, further comprising a vapor diffusion path through which the vaporized refrigerant diffuses and a capillary channel through which the condensed refrigerant recirculates.   The heat transport unit according to claim 2, wherein at least a part of the plurality of passages includes one or a plurality of intermediate plates having internal through holes, and the internal through holes form the capillary flow path.   The heat transport unit according to claim 3, wherein the internal through hole includes at least one of a circular hole, a square hole, a polygonal hole, and a slit hole.   There are a plurality of intermediate plates, and the internal through holes provided in each of the plurality of intermediate plates overlap each other, and are smaller than the horizontal sectional area of the internal through holes. The heat transport unit according to any one of claims 3 to 4, wherein a capillary channel having an area is formed. The intermediate plate has a protrusion along a boundary dividing the passage, and the intermediate plate is stacked between the upper plate and the lower plate so that the protrusion separates the passages. heat transporting unit according to any one of claims 3 to 5 which forms a boundary. 7. The heat according to claim 1, wherein the plurality of passages in a plurality of stages are stacked in a thickness direction of the heat transport unit, and the plurality of passages have a plurality of stages in the thickness direction. Transport unit. The heat transport unit according to any one of claims 1 to 7 ,
A heating element disposed in a part of the heat transport unit;
An electronic apparatus comprising a housing for storing the heat transport unit and the heating element.

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