JPS6383587A - Flat board type heat pipe - Google Patents

Flat board type heat pipe

Info

Publication number
JPS6383587A
JPS6383587A JP22821386A JP22821386A JPS6383587A JP S6383587 A JPS6383587 A JP S6383587A JP 22821386 A JP22821386 A JP 22821386A JP 22821386 A JP22821386 A JP 22821386A JP S6383587 A JPS6383587 A JP S6383587A
Authority
JP
Japan
Prior art keywords
heat pipe
channels
flat
flat board
board type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22821386A
Other languages
Japanese (ja)
Inventor
Masaru Ishizuka
勝 石塚
Yoshiro Miyazaki
芳郎 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22821386A priority Critical patent/JPS6383587A/en
Publication of JPS6383587A publication Critical patent/JPS6383587A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2250/00Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
    • F28F2250/04Communication passages between channels

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

PURPOSE:To permit heat transfer between an upper plate and a lower plate of a flat board type heat pipe, by a method wherein operating liquid is permitted to move freely by capillary effect through narrow pipelines between partitioning plates, which are constituted by partitioning the hollow flat board type space between the upper plate and the lower plate by the partitioning plates. CONSTITUTION:A plurality of partitioning plates 3 are provided in a sealed hollow space 2, pinched by both flat plates 1a, 1b of a flat board type heat pipe, orthogonally to the flat plates 1a, 1b with a narrow gap between each others, whereby the sealed hollow space 2 is divided into a multitude of channels 6. The partitioning plates 3 are provided with holes 4, 4a, connecting between the channels 6 while predetermined operating fluid 5 is sealed in the hollow space 2. The channels 6 are formed by predetermined narrow gaps, therefore, the operating fluid 5 may be movable into the direction of the channels 6 by capillary effect. When holes 4a, smaller than the holes 4, are provided on parts covered by the operating fluid 5, the movement of the operating fluid 5 between neighboring channels 6 may be effected.

Description

【発明の詳細な説明】 【発明の目的】 (産業上の利用分野) この発明は平板形ヒートパイプに関する。 (従来の技術) 従来の平板形ヒートパイプでは、たとえば「HE A 
T P I P E S J P、D、DUNN、D、
A、REAY共著、第2版、第197頁乃至第198頁
の例で示すように、主として平板の広さ方向への熱輸送
力に主眼をおいヅ た構造となっており1作動液の流路であるウィークは広
さ方向の液の輸送のたわに設けられていた。 したがって、平板の厚み方向にも大きな熱流束がある場
合、すなわち平板の一方の面が加熱面で、他方の面が冷
却面という熱の流れがある場合には。 加熱面がドライアウトを起し、使用出来なくなる可能性
があった。 (発明が解決しようとする問題点) この発明は、広さ方向のみならず厚み方向にも大きな熱
輸送力をもつ平板形ヒートパイプを提供することを目的
としている。 〔発明の構成〕 (問題点を解決するための手段) 平板形ヒートパイプの上板、下板の間の平板状の中空空
間を仕切り板で仕切って構成される仕切り板間のせまい
管路内を作動液体が毛細管作用により、自由に移動でき
るようにし、平板形ヒートパイプの上板、下板の間の熱
伝達を可能にしたヒートパイプであり、仕切り板の面の
直角方向にも作動流体の移動が可能となるよう仕切り板
には穴が設けである。 (作用) 仕切り板に穴が設けられている為、ヒートパイプの平面
方向への作動流体の移動を可能としながら、仕切り板間
のヒートパイプの平面にそった方向に延びかつ、対向す
る平面間をつなぐせまい管路により作動液体は平面に直
角な方向にも移動可能な為1両面の熱移動を可能として
いる。 (実施例) 第1図を参照して、本発明の一実施例について説明する
。平板形ヒートパイプの両方の平面板1a。 1bにはさまれた密閉された中空空間2には平面板la
、 lbに直角に複数の仕切り板3がたがいに狭間隙を
置いて設けられ、これにより密閉された中空空間2はせ
まい多数のチャンネル6に分けられている。又仕切り板
3にはチャンネル6間をつなぐ穴4,4aが設けられて
おり、中空空間2には所定の作動流体5が封入されてい
る。 第2図に1作動液体5が、前記チャンネル6内に保持さ
れている様子を示す0作動流体5がチャンネル6内に、
第2図に示されている如くチャンネル6が所定の狭間隙
によって形成されている為保持されるので、作動流体5
はキャピラリ効果により、チャンネル6方向に自由に移
動できるのはいうまでもなく、例えば片方の平面板、1
bから他方の平面板1aに仕切板3の穴4のおいていな
い部分を伝って移動することができる。 又、作動流体5で覆われた部分にも穴4よりも小さな穴
4aを設けておくととなりあったチャンネル6の間でも
作動流体5の移動は可能となる。したがって、この形式
の平板形ヒートパイプでは、平板の広さ方向のみならず
、厚み方向にも大きな熱伝達能力をもつことになる。 仕切り板の設は方は任意であり、例えば同心円状に配し
てもよいことは言うまでもない。 〔発明の効果〕 このように形成することによって、加熱面がドライアウ
トすることなく、広さ方向のみならず厚さ方向にも充分
大きな熱輸送力をもつ平板状のヒートパイプが実現でき
るものである。
DETAILED DESCRIPTION OF THE INVENTION OBJECTS OF THE INVENTION (Field of Industrial Application) The present invention relates to a flat heat pipe. (Prior art) In the conventional flat plate heat pipe, for example, "HE A
T P I P E S J P, D, DUNN, D.
As shown in the example in co-authored by A. REAY, 2nd edition, pages 197 to 198, the structure focuses mainly on the heat transport force in the width direction of the flat plate, and the flow rate of one working fluid is Weaks, which are roads, were installed alongside the transport of liquid in the width direction. Therefore, if there is a large heat flux in the thickness direction of the flat plate, that is, if there is a heat flow where one side of the flat plate is a heating surface and the other side is a cooling surface. There was a possibility that the heating surface would dry out and become unusable. (Problems to be Solved by the Invention) An object of the present invention is to provide a flat heat pipe that has a large heat transport capacity not only in the width direction but also in the thickness direction. [Structure of the invention] (Means for solving the problem) A flat heat pipe is operated in a narrow conduit between the partition plates, which is constructed by partitioning a flat hollow space between the upper plate and the lower plate with partition plates. This is a heat pipe that allows liquid to move freely through capillary action, allowing heat transfer between the upper and lower plates of a flat heat pipe. Working fluid can also move in a direction perpendicular to the surface of the partition plate. There are holes in the partition plate to ensure this. (Function) Since holes are provided in the partition plates, while allowing the movement of the working fluid in the plane direction of the heat pipe, the holes extend in the direction along the plane of the heat pipe between the partition plates and between the opposing planes. The working liquid can also move in a direction perpendicular to the plane due to the narrow conduit connecting the two, making it possible to transfer heat from one side to the other. (Example) An example of the present invention will be described with reference to FIG. Both flat plates 1a of the flat plate heat pipe. In the sealed hollow space 2 sandwiched between 1b and 1b, there is a flat plate la.
, lb, a plurality of partition plates 3 are provided with narrow gaps between them, and the sealed hollow space 2 is divided into a large number of narrow channels 6. Further, the partition plate 3 is provided with holes 4, 4a that connect the channels 6, and the hollow space 2 is filled with a predetermined working fluid 5. FIG. 2 shows how a working fluid 5 is held in the channel 6. A working fluid 5 is held in the channel 6.
As shown in FIG. 2, the working fluid 5 is retained because the channel 6 is formed by a predetermined narrow gap.
Needless to say, can move freely in the direction of channel 6 due to the capillary effect.
b to the other flat plate 1a along the part of the partition plate 3 where the holes 4 are not provided. Furthermore, if a hole 4a smaller than the hole 4 is provided in the portion covered with the working fluid 5, the working fluid 5 can be moved even between adjacent channels 6. Therefore, this type of flat plate heat pipe has a large heat transfer capacity not only in the width direction of the flat plate but also in the thickness direction. It goes without saying that the partition plates may be arranged in any manner, for example, in concentric circles. [Effects of the Invention] By forming the heat pipe in this way, it is possible to realize a flat heat pipe that has a sufficiently large heat transport force not only in the width direction but also in the thickness direction without drying out the heating surface. be.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示した概略斜視図、第2図
は、第1図の要部を拡大して示す部分断面図である。 la 、 lb・・・平面板      2・・・中空
空間3・・・仕切り板       4,4a・・・穴
5・・・作動流体       6・・・チャンネル代
理人 弁理士 則 近 憲 佑 同    竹 花 喜久男 第1図
FIG. 1 is a schematic perspective view showing an embodiment of the present invention, and FIG. 2 is a partially sectional view showing an enlarged main part of FIG. 1. la, lb...Flat plate 2...Hollow space 3...Partition plate 4, 4a...hole 5...Working fluid 6...Channel agent Patent attorney Noriyuki Chika Yudo Kikuo Takehana Figure 1

Claims (1)

【特許請求の範囲】[Claims] 平板形に設けた中空空間に作動流体を封入した平板形ヒ
ートパイプにおいて、前記中空空間をせまい管路に分け
るように仕切り板を設け、前記仕切り板に前記管路間に
開口する穴をあけたことを特徴とする平板形ヒートパイ
プ。
In a flat heat pipe in which a working fluid is sealed in a hollow space provided in a flat plate shape, a partition plate is provided to divide the hollow space into narrow pipes, and a hole is made in the partition plate to open between the pipes. A flat plate heat pipe characterized by:
JP22821386A 1986-09-29 1986-09-29 Flat board type heat pipe Pending JPS6383587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22821386A JPS6383587A (en) 1986-09-29 1986-09-29 Flat board type heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22821386A JPS6383587A (en) 1986-09-29 1986-09-29 Flat board type heat pipe

Publications (1)

Publication Number Publication Date
JPS6383587A true JPS6383587A (en) 1988-04-14

Family

ID=16872959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22821386A Pending JPS6383587A (en) 1986-09-29 1986-09-29 Flat board type heat pipe

Country Status (1)

Country Link
JP (1) JPS6383587A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110296A (en) * 1988-10-17 1990-04-23 Nippon Alum Mfg Co Ltd Flat plate type heat pipe
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
US6003591A (en) * 1997-12-22 1999-12-21 Saddleback Aerospace Formed laminate heat pipe
WO2001063195A1 (en) * 2000-02-25 2001-08-30 Fujitsu Limited Thin heat pipe and method of manufacturing the heat pipe
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6745825B1 (en) 1997-03-13 2004-06-08 Fujitsu Limited Plate type heat pipe
US6749013B2 (en) * 1997-12-25 2004-06-15 The Furukawa Electric Co., Ltd. Heat sink
WO2008109804A1 (en) * 2007-03-08 2008-09-12 Convergence Technologies Limited Vapor-augmented heat spreader device
JP2010087461A (en) * 2008-09-04 2010-04-15 Fuchigami Micro:Kk Heat transport unit and electronic instrument
JP2011102691A (en) * 2009-11-10 2011-05-26 Pegatron Corp Vapor chamber and method for manufacturing the same
JP2013130332A (en) * 2011-12-21 2013-07-04 Toshiba Corp Bubble-driven cooling device
WO2019131599A1 (en) * 2017-12-25 2019-07-04 株式会社フジクラ Heatsink module
JP2019148369A (en) * 2018-02-27 2019-09-05 新光電気工業株式会社 Loop type heat pipe
WO2022259716A1 (en) * 2021-06-07 2022-12-15 株式会社村田製作所 Thermal diffusion device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5359957A (en) * 1976-11-11 1978-05-30 Ngk Spark Plug Co Ltd Ceramic heat transmission plate and method for producing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5359957A (en) * 1976-11-11 1978-05-30 Ngk Spark Plug Co Ltd Ceramic heat transmission plate and method for producing same

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02110296A (en) * 1988-10-17 1990-04-23 Nippon Alum Mfg Co Ltd Flat plate type heat pipe
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6745825B1 (en) 1997-03-13 2004-06-08 Fujitsu Limited Plate type heat pipe
US6003591A (en) * 1997-12-22 1999-12-21 Saddleback Aerospace Formed laminate heat pipe
US6209200B1 (en) 1997-12-22 2001-04-03 Sadleback Aerospace Formed laminate heat pipe
US6749013B2 (en) * 1997-12-25 2004-06-15 The Furukawa Electric Co., Ltd. Heat sink
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
WO2001063195A1 (en) * 2000-02-25 2001-08-30 Fujitsu Limited Thin heat pipe and method of manufacturing the heat pipe
WO2008109804A1 (en) * 2007-03-08 2008-09-12 Convergence Technologies Limited Vapor-augmented heat spreader device
JP2010087461A (en) * 2008-09-04 2010-04-15 Fuchigami Micro:Kk Heat transport unit and electronic instrument
JP2011102691A (en) * 2009-11-10 2011-05-26 Pegatron Corp Vapor chamber and method for manufacturing the same
JP2013130332A (en) * 2011-12-21 2013-07-04 Toshiba Corp Bubble-driven cooling device
WO2019131599A1 (en) * 2017-12-25 2019-07-04 株式会社フジクラ Heatsink module
JP2019148369A (en) * 2018-02-27 2019-09-05 新光電気工業株式会社 Loop type heat pipe
WO2022259716A1 (en) * 2021-06-07 2022-12-15 株式会社村田製作所 Thermal diffusion device

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