JP2013222921A - Heat sink for heat dissipation unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that the number of components and work man-hours are large, and assembly is complicated when a heat sink for a heat dissipation unit is manufactured.SOLUTION: In a heat sink 11 for a heat dissipation unit which is constituted by integrating two rectangular parallelepiped metal bodies A1 and B2, the metal body A1 is in the box shape obtained by putting four side faces on one heat receiving face 5, the heat receiving face 5 is provided with a plurality of grooves 6 for coolant circulation paths in parallel with one of the side faces at equal intervals, the side faces are provided with entrances 7 for coolant circulation paths and exits 8 for coolant circulation paths at positions to be the diagonal vicinity of the heat receiving face 5, the metal body B2 is integrated by being put on the metal body A1 so as to cover the grooves 6 for coolant circulation paths, and the heat sink for a heat dissipation unit with small work man-hours, easy assembly, and high mass productivity is provided.

Description

  The present invention relates to a method of manufacturing a heat absorber that is a component part of a heat dissipation unit that dissipates heat from a heat generating portion of an electronic device by natural convection.

  In recent years, in electronic devices, the contact temperature of each electronic component has increased for the normal operation of the electronic component against the increase in heat generation due to higher integration of electronic components such as semiconductors and higher operating clock frequencies. It has become a big problem how to keep the temperature within the operating temperature range. Measures for heat dissipation are also important from the standpoints of operational stability and ensuring the operational life.

  However, the conventional air-cooling method combining a heat sink and a fan is increasingly lacking in capacity for electronic components with high heat generation. In view of this, for example, a highly efficient cooling device with higher capacity that circulates a refrigerant as shown in (Patent Document 1) has been proposed.

  In general, in order to cool a heating element having a high calorific value, a method of radiating heat absorbed by the heat receiving portion from the heat radiating portion having a large area to the air is employed.

  Such a cooling device includes a heat receiving unit that receives heat generated from the heating element, a channel that transports the refrigerant that has received heat at the heat receiving unit, a pump that moves the refrigerant, and a heat radiating unit that radiates heat from the refrigerant. Yes. The main cooling principle is that the heat generated in the heating element is transferred to the inside of the heat receiving section and exchanges heat with the refrigerant circulating inside, so that the temperature of the refrigerant rises. Next, the refrigerant is transported to the heat radiating part through the flow path by the pump, and the temperature of the heat radiating part is increased. Next, a method is adopted in which air is sent to the surface of the heat dissipating part that has become high temperature and heat exchange is performed to diffuse it into the air.

  A heat receiving portion (referred to as a heat absorber in the present invention) used in the cooling device has a plurality of plate-like fins that receive heat generated from the heating element therein, and an inflow through which refrigerant flows into the central portion of the fins. Nozzle. The refrigerant flows into the central portion of the fin through the inflow nozzle and enters between the fins. And after a refrigerant | coolant flows into the bottom part between fins, it absorbs the heat | fever of a fin and has a structure discharged | emitted from the both sides of a fin.

JP 2007-180505 A

  When manufacturing the heat absorber of the cooling device for electronic parts in the prior art, there is a problem that the number of parts is large and the manufacturing method is troublesome.

  In addition, when the inlet or the inlet nozzle is arranged perpendicular to the plate-like fin, the shape of the heat absorber itself is not simple, and the manufacturing labor is increased.

  SUMMARY OF THE INVENTION The present invention is directed to the formation of a heat sink for a heat radiating unit having the same structure as the above-described prior art, which requires a small number of work steps, is easy to assemble and has high productivity.

In order to achieve the above object, the heat sink for a heat dissipating unit of the present invention comprises:
It is a heat sink for a heat radiating unit configured by integrating two rectangular parallelepiped metal bodies A and B, and the metal body A is a box shape with four side surfaces standing on one heat receiving surface,
The heat receiving surface is provided with a plurality of grooves at equal intervals parallel to one of the side surfaces,
The side surface is provided with a refrigerant circulation path inlet and a refrigerant circulation path outlet at a position near the diagonal of the heat receiving surface,
The metal body B is characterized by being integrated by covering the metal body A so as to cover the groove.

  According to the present invention, the heat sink for a heat radiating unit is configured by integrating two rectangular parallelepiped metal bodies A and B, and the metal body A is a box shape in which four side surfaces are set up on one heat receiving surface. A plurality of grooves parallel to one of the side surfaces are provided at equal intervals on the heat receiving surface, and a refrigerant circulation path inlet and a refrigerant circulation path are provided on the side surface at positions near the diagonal of the heat receiving surface. By providing an outlet and integrating the metal body B by covering the metal body A so as to cover the groove, the number of work steps is reduced, the assembly is easy, and the mass productivity is high.

The perspective view which shows the component of the heat sink for heat radiating units of the 1st Embodiment of this invention. The perspective view which shows the structure of the metal body A of the heat sink for the thermal radiation unit The perspective view which shows the heat absorber for the heat radiating unit Cross-sectional view showing the heat sink for the heat dissipation unit Front sectional view showing the heat absorber for the heat dissipation unit Front sectional view showing the state of refrigerant circulation inside the heat sink for the heat radiating unit The perspective view which shows the thermal radiation unit using the heat sink for the thermal radiation unit

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a perspective view showing components of a heat sink 11 for heat dissipation unit of the present invention, and FIG. 2 is a perspective view showing a metal body A. FIG. The heat sink 11 for the heat radiating unit is composed of a metal body A1, a metal body B2, and gas pipes 4 and liquid pipes 3 of two refrigerant circulation circuit pipes.

  The metal body A1 is a box-shaped metal body in which four heat receiving surfaces 5 are provided with four side surfaces. Further, a plurality of coolant circulation path grooves 6 are provided at equal intervals in the metal body A1 on the heat receiving surface 5 side in parallel with one side surface. In addition, this groove | channel 6 for refrigerant | coolant circulation paths is provided so that it may not contact the side surface of the metal body A1, and the upper space 9 and the lower space 10 may be provided. One side surface of the metal body A1 is provided with a hole for the refrigerant circulation path inlet 7 in the vicinity of the lower space 10. And the hole of the refrigerant | coolant circulation path outlet 8 is provided in the side surface near the position opposite to this refrigerant | coolant circulation path inlet 7. As shown in FIG. That is, the refrigerant circulation path inlet 7 and the refrigerant circulation path outlet 8 are provided in the vicinity of the diagonal positions of the heat receiving surface 5. Further, in the present embodiment, the refrigerant circulation path inlet 7 is provided so that the refrigerant flows perpendicularly to the refrigerant circulation path groove 6, and the refrigerant circulation path outlet 8 is provided in the refrigerant circulation path groove 6. The refrigerant was provided so as to flow out in parallel. The metal body B2 has a structure similar to that of the metal body A1 or a flat plate. The liquid pipe 3 and the gas pipe 4 that are refrigerant circulation pipes are cylindrical pipes that are hollow inside.

  Then, the metal body A1 is integrated so as to cover the metal body B2, and the part in contact with the metal is subjected to a treatment such as brazing and is brought into close contact therewith. The top of the coolant circulation groove 6 is closed by the metal body B2. Further, the liquid pipe 3 is connected to the refrigerant circulation path inlet 7 provided in the metal body A1, and the gas pipe 4 is connected to the refrigerant circulation path outlet 8. By firmly bonding each of them, the heat sink 11 for a heat radiating unit as shown in FIG. 3 is completed.

  According to such a heat sink 11 for a heat radiating unit, the metal body A1 and the metal body B2 can be easily mass-produced by a method such as die casting, and since there are few components, the heat radiating unit can be easily assembled with less work steps. The heat absorber 11 can be manufactured.

  Further, a recess 12 for embedding the heating element is provided on the surface of the metal body A1 that contacts the heating element, that is, the heat receiving surface 5. The control board 20 serving as a heating element is embedded in the recess 12. With this configuration, space is used effectively, leading to weight reduction or product miniaturization. Moreover, it becomes possible to absorb heat efficiently.

  As shown in FIG. 4, the top portion 13 of the coolant circulation groove 6 of the metal body A1 is flat. Further, the inner peripheral side of the side surface of the metal body A1 is made lower than the outer peripheral side, and a contact step 14 for contacting the metal body A1 and the metal body B2 is provided. According to such a configuration, the metal body B <b> 2 comes into contact with the metal body A <b> 1 at the top portion 13 of the coolant circulation path groove 6 and the contact stage 14. In this way, the gap between the contact portions when the metal body A1 and the metal body B2 are overlapped is reduced. Furthermore, the independence of the refrigerant path between the cooling circulation path grooves 6 is maintained, and the refrigerant circulation efficiency is improved.

  As shown in FIG. 5, a step (liquid pipe use) that allows the liquid pipe 3 to come into contact with the rear circumference diameter narrower than the front circumference diameter of the refrigerant circulation path inlet 7 provided on the side surface of the metal body A1. A contact step 15) is provided. Similarly, the refrigerant circulation path outlet 8 has a step that allows the gas pipe 4 to come into contact by making the inner circumference diameter narrower than the front circumference diameter of the refrigerant circulation path outlet 8 (gas pipe contact stage 16). Turn on. When the liquid pipe 3 and the gas pipe 4 are connected, the liquid pipe contact stage 15 and the tip of the liquid pipe 3 come into contact with each other, and the gas pipe contact stage 16 and the tip of the gas pipe 4 come into contact with each other. In this way, the liquid pipe 3 and the gas pipe 4 can be in close contact with the metal body A1. Moreover, it is possible to prevent the liquid pipe 3 and the gas pipe 4 from entering too far into the back, and the connection state of the metal body A1 can be made uniform. And the workability | operativity at the time of manufacturing will improve.

  The refrigerant passes through the heat sink 11 for the heat radiation unit as shown in FIG. That is, liquid refrigerant is supplied from the liquid pipe 3, passes through the refrigerant circulation path inlet 7, and accumulates liquid refrigerant in the lower space 10. And the heat receiving surface 5 of the heat sink 11 for heat radiating units receives heat from a heat generating body, and a liquid refrigerant evaporates. The vaporized refrigerant rises in each refrigerant circuit groove 6, passes through the upper space 9 and the refrigerant circuit outlet 8 in this order, and exits to the gas pipe 4.

  A heat radiating unit 19 using the heat radiating unit heat absorber 11 has a configuration as shown in FIG. As shown in FIG. 7, the electronic device device 17 includes an electronic device 18 serving as a base station for communication devices, and a heat dissipation unit 19 provided above the top surface of the electronic device 18. The heat dissipating unit 19 includes a heat dissipating member 21, a heat dissipating unit heat absorber 11 provided below the heat dissipating member 21, a refrigerant circulation path connecting the heat dissipating unit heat absorber 11 and the heat dissipating member 21, and heat dissipation of these heat dissipating units. , A heat sink 11 for heat radiation unit, and a main body case 26 covering the refrigerant circulation path. In the refrigerant circulation path, the liquid pipe 3 and the gas pipe 4 constitute a circulation path. A refrigerant is enclosed inside the refrigerant circuit, and a well-known refrigerant capable of phase change from liquid to gas and from gas to liquid is used as the refrigerant. In the radiator 21, cooling fins 23 are erected in the heat dissipation path 24 through which the refrigerant passes, so that heat is easily released to the air passing through the radiator 21. According to the above configuration, the heat generated in the electronic device 18 is absorbed by the refrigerant being vaporized by the heat radiating unit heat absorber 11 that constitutes the heat radiating unit 19. The vaporized refrigerant rises to the radiator via the gas pipe 4, is cooled by the outside air introduced from the vent 25 by the radiator 21, is liquefied again, and is used for the heat radiating unit via the liquid pipe 3. It circulates to the heat absorber 11. In this way, the heat generated in the electronic device 18 is cooled by circulating the refrigerant.

  The heat sink for a heat radiating unit of the present invention is useful as a means for forming a heat absorber for a heat radiating unit that has a small number of parts and man-hours, is easy to assemble, and has high mass productivity. The heat radiating unit is configured to be integrated with an electronic device device that becomes a base station of a communication device.

1 Metal body A
2 Metal body B
3 Liquid pipe 4 Gas pipe 5 Heat receiving surface 6 Refrigerant circulation path groove 7 Refrigerant circulation path inlet 8 Refrigerant circulation path outlet 9 Upper space 10 Lower space 11 Heat sink for heat radiation unit 12 Recess 13 Top 14 Contacting stage 15 For liquid pipe Contact stage 16 Gas tube contact stage 17 Electronic device 18 Electronic device 19 Heat radiation unit 20 Control board (heating element)
21 radiator 23 cooling fin 24 heat dissipation path 25 vent 26 body case

Claims (4)

It is a heat sink for a heat radiating unit configured by integrating two rectangular parallelepiped metal bodies A and B, and the metal body A is a box shape with four side surfaces standing on one heat receiving surface,
The heat receiving surface is provided with a plurality of grooves at equal intervals parallel to one of the side surfaces,
The side surface is provided with a refrigerant circulation path inlet and a refrigerant circulation path outlet at a position near the diagonal of the heat receiving surface,
The heat sink for a heat radiating unit, wherein the metal body B is integrated with the metal body A so as to cover the groove. The shape of the top portion of the groove of the metal body A is flattened,
The heat sink for a heat radiating unit according to claim 1, wherein the metal body B is in contact with the top portion. A lower step than the outer peripheral side is provided on the inner peripheral side of the side surface of the metal body A,
The heat sink for a heat radiating unit according to claim 1, wherein the metal body B is in contact with and integrated with the step. Steps are provided at the refrigerant circuit inlet and the refrigerant circuit outlet,
2. When connecting the refrigerant circuit pipe to the refrigerant circuit inlet and the refrigerant circuit outlet, this stage and the tip of the refrigerant circuit pipe are in contact with each other to be integrated. The heat sink for heat dissipation units described in 1.

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