JP2017166710A - Cooling device and electronic equipment mounted with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device with high cooling performance.SOLUTION: In a cooling device 1 configured to cool with phase change of refrigerant, a heat reception part 3 includes a heat reception plate mounted with a heating body on at least one of a front face and a rear face, and includes a heat radiation internal passage 24 at its an upper part, a return internal passage 25 at its lower part, and a fin 2 provided therebetween. In the fin part 2, a plurality of fins projecting from the heat reception plate to the inside is provided on a flat plate so that flow passages for refrigerant between the fins are provided vertically. An inflow port 21 and an outflow port 20 are provided on a side surface of the heat reception part 3. A bottom surface 30 of the return internal passage is inclined downwardly toward one side surface opposite to the side surface where the inflow port 21 is installed.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cooling device for an electronic device in which electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate bipolar transistor (IGBT), and a diode are mounted, and an electronic device in which the electronic device is mounted. It is.

  Conventionally, this type of cooling device has the following configuration.

  That is, as shown in FIG. 10, an evaporator section 132 in which the refrigerant boils due to heat of the inverter 108 that is a heating element is disposed in the duct section 130 of the housing 112, and the evaporator section 132 is adjacent to the duct section 130. And a circulation part 134 through which the refrigerant circulates directly from the inlet 114 toward the outlet 116. The evaporator section 132 is provided with a plurality of fins 140 protruding from the housing bottom surface 120 toward the flow section 134, and the refrigerant flows through the gaps between the plurality of fins 140 (for example, Patent Document 1).

JP2013-016589A

  In the cooling device disclosed in Patent Document 1, since the inverter 108 that is a heating element is installed horizontally, the bottom wall portion 120 of the housing 112 is filled with a liquid-phase refrigerant, and the circulation portion 134 extends from the bottom wall portion 120. The refrigerant circulates through the gaps between the plurality of fins 140 protruding toward the side.

  In the housing 112 (heat receiving portion) having such a configuration, the heat of the heating element is cooled by the latent heat of vaporization when the liquid-phase refrigerant evaporates, so it is necessary to spread the liquid-phase refrigerant over the entire surface of the fin 140. is there. However, most of the refrigerant (gas phase refrigerant) evaporated on the surface of the fin 140 passes through the circulation part 134, and the liquid phase refrigerant is formed on the surface of the fin 140 located far from the inlet 114 by the flow of the gas phase refrigerant. The action of supplying is reduced. That is, in order to supply the liquid refrigerant to the entire surface of the fin 140 in such a configuration, an amount of liquid refrigerant that is excessive enough to fill the bottom wall portion 120 of the housing 112 with the liquid refrigerant is required. Therefore, the surface of the fin 140 is covered with a thick liquid phase refrigerant layer. As a result, the thick liquid phase refrigerant layer becomes a thermal resistance, and an ideal state in which the thin liquid phase refrigerant layer covers the fin 140 can be created. Therefore, the cooling performance is lowered.

  Further, when the casing 112 (heat receiving section) having such a configuration is installed vertically, that is, the inverter 108 as a heating element is installed vertically, and the casing 112 (heat receiving section) flows down the inlet 114 downward. A case where the fins 140 are installed in the vertical direction with the outlet 116 facing upward will be described.

  In this type of cooling device, the pressure in the vicinity of the outlet 116 is low due to the action of a radiator (not shown). The liquid-phase refrigerant that has flowed into the housing 112 (heat receiving portion) from the inflow port 114 receives the heat generated from the inverter 108, becomes a two-phase refrigerant of a gas phase and a liquid phase, and is in a high pressure state. This is because the volume expands when the refrigerant changes from the liquid phase to the gas phase. The two-phase refrigerant having a high pressure flows into the outlet 116 having a low pressure. Explaining this phenomenon in detail, the flow of the gas-phase refrigerant generated when the liquid-phase refrigerant changes to the gas phase involves the liquid-phase refrigerant located in the vicinity of the liquid-phase refrigerant and the liquid-phase refrigerant located downstream of the flow. The liquid-phase refrigerant is supplied to the fin 140 surface on the outlet 116 side located downstream of the refrigerant flow. However, since the refrigerant flow passes through a path having a small flow resistance, the refrigerant flow in the housing 112 is unevenly distributed, and in the gap between the fins 140, the refrigerant is more likely to flow in the gap located at the center portion, and is located at the end. The more the gap is, the more difficult it is for the refrigerant to flow. In addition, much of the refrigerant flows through the flow part 134 where the flow resistance becomes smaller than the gap between the fins 140. Therefore, the fin 140 located in the region where the refrigerant does not easily flow is in a so-called dry-out state in which the refrigerant is not supplied and cannot be cooled, and the temperature of the inverter 108 increases. Further, in order to suppress dryout, an excessive amount of liquid phase refrigerant is required, and as a result, a thick liquid phase refrigerant layer becomes a thermal resistance, and an ideal state in which the thin liquid phase refrigerant layer covers the fin 140 is created. Cannot be performed and cooling performance is lowered.

  Therefore, the present invention prevents the local dryout in the heat receiving part by supplying the liquid phase refrigerant to a region far from the side surface where the inlet is installed, and it is not necessary to fill the heat receiving part with an excessive amount of liquid phase refrigerant. It is an object of the present invention to provide a cooling device with high cooling performance capable of forming a liquid refrigerant layer in a heat receiving part.

  In order to achieve this object, the present invention provides a cooling device that cools by phase change of the refrigerant to form a circulation path for the refrigerant by sequentially connecting a heat receiving part, a heat radiation path, a heat radiation part, and a return path, The heat receiving unit includes a front surface and a rear surface, a heat receiving plate for installing a heating element on at least one of the front surface or the rear surface, a heat dissipation internal path above the heat receiving unit, a return internal path below the heat receiving unit, Between the heat dissipation internal path and the feedback internal path, there are a fin portion, an outlet connecting the heat dissipation path and the heat dissipation internal path, and an inlet connecting the feedback path and the feedback internal path. The inflow port and the outflow port are each provided on a side surface of the heat receiving portion, and the fin portion includes fins on a plurality of flat plates protruding inward from the heat receiving plate by gaps between the fins. Refrigerant flow path is above And a bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface on which the inflow port is installed. The purpose of the period is achieved.

  As described above, in the cooling device that cools by phase change of the refrigerant, the present invention forms the circulation path of the refrigerant by sequentially connecting the heat receiving portion, the heat radiating path, the heat radiating portion, and the return path. A heat receiving plate provided with a heating element on at least one of the front surface or the rear surface, a heat dissipating internal path above the heat receiving part, a return internal path below the heat receiving part, and the heat dissipating internal path A fin portion between the return internal path, an outlet connecting the heat dissipation path and the heat dissipation internal path, and an inlet connecting the return path and the return internal path; And the outlet are respectively provided on side surfaces of the heat receiving portion, and the fin portion includes fins on a plurality of flat plates protruding inward from the heat receiving plate, and a refrigerant flow path constituted by gaps between the fins. Set up vertically The bottom surface of the return internal path is a cooling device characterized in that it is inclined downward toward the other side surface opposite to the side surface on which the inlet is installed, and is a region far from the side surface on which the inlet is installed By supplying the liquid refrigerant to the heat receiving portion, local dryout in the heat receiving portion is prevented, and it is not necessary to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, and a thin liquid phase refrigerant layer can be formed in the heat receiving portion. A cooling device with high cooling performance can be provided.

  That is, according to the present invention, the bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface on which the inflow port is installed, so that the liquid phase that has flowed out from the inflow port to the return internal path This refrigerant makes it easier for the liquid-phase refrigerant to move from the side surface where the inlet is installed to the other side along the downward slope due to gravity. Cooling performance that makes it easy to supply and, as a result, prevents local dryout in the heat receiving part, and does not need to fill the heat receiving part with an excessive amount of liquid phase refrigerant, and can form a thin liquid phase refrigerant layer in the heat receiving part It is possible to provide a high cooling device.

  Furthermore, when installing the heat receiving part, due to the influence of installation accuracy, the bottom surface of the heat receiving part is inclined when the heat receiving part is inclined so as to rise upward toward the other side opposite to the side where the inflow port is installed. Even so, the bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface where the inflow port is installed, so that the heat receiving portion is inclined in the direction opposite to the bottom surface of the return internal path. Reduce the influence of the upward slope of the bottom and reduce the influence of installation accuracy. Compared with the case where the bottom surface of the return internal path does not have a downward slope, the bottom surface of the return internal path becomes an upward slope toward the side surface opposite to the side surface where the inflow port is installed. It is difficult to enter a so-called dry-out state in which the liquid refrigerant is not supplied to a part of the fins in the far region and cannot be cooled. Therefore, even when the heat receiving unit main body is inclined and installed, the bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface where the inflow port is installed. It becomes easy to supply the liquid-phase refrigerant to the fin portion in the region far from the side surface where the is installed.

  Accordingly, it is possible to suppress a so-called dry-out state in which the liquid-phase refrigerant is not supplied to the region far from the side surface where the inlet and the outlet are installed and cannot be cooled. As a result, by supplying the liquid-phase refrigerant to a region far from the side where the inlet is installed, local dry-out in the heat-receiving unit is prevented, and there is no need to fill the heat-receiving unit with an excessive amount of liquid-phase refrigerant. It is possible to provide a cooling device with high cooling performance capable of forming a refrigerant layer in the heat receiving portion.

Schematic of an electronic device equipped with the cooling device of Embodiment 1 of the present invention The figure which shows the external appearance of the heat receiving part of the cooling device An exploded perspective view of the heat receiving part of the cooling device An exploded perspective view of the heat receiving part of the cooling device The figure which shows the XX 'cross section of the heat receiving part of the cooling device The disassembled perspective view of the heat receiving part of the cooling device of Embodiment 2 of this invention. An exploded perspective view of the heat receiving part of the cooling device An exploded perspective view of the heat receiving part of the cooling device The figure which shows the XX 'cross section of the heat receiving part of the cooling device Schematic showing a conventional cooling device

A cooling device according to an embodiment of the present invention is a cooling device that cools by a phase change of the refrigerant, and forms a circulation path of the refrigerant by sequentially connecting a heat receiving part, a heat radiation path, a heat radiation part, and a return path,
The heat receiving unit includes a front surface and a rear surface, a heat receiving plate in which a heating element is installed on at least one of the front surface or the rear surface, a heat dissipation internal path above the heat receiving part, and a return internal path below the heat receiving part. A fin portion between the heat dissipation internal path and the feedback internal path, an outlet connecting the heat dissipation path and the heat dissipation internal path, and an inlet connecting the feedback path and the feedback internal path. The inlet and the outlet are respectively provided on side surfaces of the heat receiving portion, and the fin portion includes fins on a plurality of flat plates protruding inward from the heat receiving plate by gaps between the fins. The flow path of the refrigerant is arranged in the vertical direction, and the bottom surface of the return internal path is lowered toward the other side surface opposite to the side surface on which the inflow port is installed, with respect to the bottom surface of the heat receiving part. Characterized by having an inclination By supplying liquid-phase refrigerant to a region far from the side where the inlet is installed, it is necessary to prevent local dryout in the heat-receiving unit and fill the heat-receiving unit with an excessive amount of liquid-phase refrigerant. Therefore, it is possible to provide a cooling device with high cooling performance capable of forming a thin liquid phase refrigerant layer in the heat receiving portion.

  That is, according to the present invention, the bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface on which the inflow port is installed, so that the liquid phase that has flowed out from the inflow port to the return internal path This refrigerant makes it easier for the liquid-phase refrigerant to move from the side surface where the inlet is installed to the other side along the downward slope due to gravity. Cooling performance that makes it easy to supply and, as a result, prevents local dryout in the heat receiving part, and does not need to fill the heat receiving part with an excessive amount of liquid phase refrigerant, and can form a thin liquid phase refrigerant layer in the heat receiving part It is possible to provide a high cooling device.

  Furthermore, when installing the heat receiving part, due to the influence of installation accuracy, the bottom surface of the heat receiving part is inclined when the heat receiving part is inclined so as to rise upward toward the other side opposite to the side where the inflow port is installed. Even so, the bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface where the inflow port is installed, so that the heat receiving portion is inclined in the direction opposite to the bottom surface of the return internal path. Reduce the influence of the upward slope of the bottom and reduce the influence of installation accuracy. Compared with the case where the bottom surface of the return internal path does not have a downward slope, the bottom surface of the return internal path becomes an upward slope toward the side surface opposite to the side surface where the inflow port is installed. It is difficult to enter a so-called dry-out state in which the liquid refrigerant is not supplied to a part of the fins in the far region and cannot be cooled. Therefore, even when the heat receiving unit main body is inclined and installed, the bottom surface of the return internal path is inclined downward toward the other side surface opposite to the side surface where the inflow port is installed. It becomes easy to supply the liquid-phase refrigerant to the fin portion in the region far from the side surface where the is installed.

  As a result, by supplying the refrigerant to a region far from the side surface where the inlet is installed, local dryout in the heat receiving unit is prevented, and it is not necessary to fill the heat receiving unit with an excessive amount of liquid phase refrigerant. A cooling device with high cooling performance that can form a layer in the heat receiving part can be provided.

  Moreover, you may make it the structure which provides the said inflow port and the said outflow port in the same side surface of the said heat receiving part. As a result, by supplying the refrigerant to a region far from the side surface where the inlet is installed, local dryout in the heat receiving unit is prevented, and it is not necessary to fill the heat receiving unit with an excessive amount of liquid phase refrigerant. A cooling device with high cooling performance that can form a layer in the heat receiving part can be provided.

  Moreover, you may make it the structure which provides the said outflow port in the other side surface facing the side surface in which the said inflow port was installed. As a result, by supplying the refrigerant to a region far from the side surface where the inlet is installed, local dryout in the heat receiving unit is prevented, and it is not necessary to fill the heat receiving unit with an excessive amount of liquid phase refrigerant. A cooling device with high cooling performance that can form a layer in the heat receiving part can be provided.

Moreover, you may make it the electronic device carrying the cooling device of this invention. As a result, by supplying the refrigerant to a region far from the side surface where the inlet is installed, local dryout in the heat receiving unit is prevented, and it is not necessary to fill the heat receiving unit with an excessive amount of liquid phase refrigerant. It is possible to provide an electronic apparatus equipped with a cooling device with high cooling performance capable of forming a layer in a heat receiving portion.
(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic diagram of an electronic device 50 on which the cooling device 1 according to Embodiment 1 of the present invention is mounted.

  As shown in FIG. 1, the electronic device 50 includes a case 51 in which two power semiconductor elements serving as a heating element A28 and a heating element B29 that are heating elements and the cooling device 1 are provided.

  The cooling device 1 includes a heat receiving part 3 for cooling the heat generating element A 28 and the heat generating element B 29, and a heat radiating part 4. The heat receiving part 3 and the heat radiating part 4 are connected by the heat radiating path 5 and the return path 6. Yes. With this configuration, the inside of the cooling device 1 becomes a sealed space, and although not shown in FIG. 1, the inside of the cooling device 1 is decompressed and filled with a refrigerant. As the refrigerant, chlorofluorocarbons, fluorinated solvents and the like are used, but are not limited thereto. Aluminum is suitable for the material of the heat receiving part 3, the heat radiating part 4, and fins A22 and B23, which will be described later, but is not limited thereto.

  The heat radiation unit 4 of the cooling device 1 is connected to a water-cooled chiller (not shown) for cooling the heat transported by the refrigerant. The cooling water cooled by the water-cooled chiller is supplied from the cooling water supply path 7 to the heat radiating unit 4, and the heat transported by the refrigerant in the heat radiating unit 4 is heat-exchanged with the cooling water, whereby the refrigerant is cooled and becomes a liquid phase refrigerant. . The received cooling water returns to the water cooling chiller via the cooling water return path 8 and is cooled in the water cooling chiller.

  In the present embodiment, the water cooling type using a water cooling chiller is used, but an air cooling type using a cooling fan or other methods may be used.

  Next, a basic mechanism of the cooling device 1 having the above configuration will be described.

  The cooling device 1 is a device in which the inside is decompressed and then a refrigerant is enclosed, and the inside of the cooling device 1 becomes a saturation pressure of the refrigerant according to the external temperature by the action of the refrigerant. The heat of the heating element A28 and the heating element B29 is transmitted to the refrigerant through the heat receiving portion 3, and the refrigerant changes from the liquid phase to the gas phase, whereby the heating element A28 and the heating element B29 are cooled. The refrigerant vaporized in the heat receiving part 3 becomes a gas-liquid two-phase mixed flow with the non-boiling liquid phase refrigerant, moves from the heat receiving part 3 to the heat radiating part 4 through the heat radiating path 5, and the cooling water. It is cooled by the cooling water supplied from the supply path 7 and is liquefied again to become a liquid phase refrigerant, and returns to the heat receiving unit 3 through the return path 6.

  Therefore, the refrigerant is vaporized in the heat receiving part 3, the vaporized refrigerant passes through the heat radiation path 5 and is liquefied in the heat radiation part 4, and the liquefied refrigerant passes through the return path 6 and is supplied again into the heat receiving part 3. The heating element A28 and the heating element B29 are cooled by repeating the cycle.

  The return path 6 is assumed to have a smaller path diameter than the heat dissipation path 5. Thereby, since the flow path pressure loss of the return path 6 becomes higher than the flow path pressure loss of the heat radiation path 5, it is possible to prevent the refrigerant from flowing backward from the heat receiving portion 3 to the return path 6.

  FIG. 2 is a diagram illustrating an appearance of the heat receiving unit 3 of the cooling device 1 according to the present embodiment.

  3 and 4 are exploded perspective views of the heat receiving portion 3 of the cooling device 1 according to the present embodiment.

  FIG. 5 is a diagram showing an XX ′ cross section of the heat receiving unit 3 of the cooling device 1 of the present embodiment.

As shown in FIGS. 2, 3, 4, and 5, the heat receiving portion 3 has a rectangular parallelepiped shape with the maximum front and rear surfaces.
The heat receiving unit 3 is installed so that the front surface and the rear surface are in the vertical direction.

  A heat receiving plate A15 on which the heating element A28 is installed is provided on the front surface, and a heat receiving plate B16 on which the heating element B29 is installed on the rear surface.

  In addition, although a heat generating body, a heat receiving plate, a fin, etc. are each divided into A and B, this means that there are two each, and there is no difference between A and B unless otherwise specified.

In the present embodiment, the heating element A28, the heating element B29, the heat receiving plate A15, and the heat receiving plate B16 are provided on both the front surface and the rear surface of the heat receiving unit 3, but the heating element is provided on either the front surface or the rear surface. A28 and a heat receiving plate A15 may be provided. (Not shown)
The two heating elements A28 and B29 (described in FIG. 1) are thermally connected by bringing the heating element A28 into contact with the heat receiving plate A15 and the heating element B29 in contact with the heat receiving plate B16. The heat receiving plate A15 and the heat receiving plate B16 are appropriately provided with fixing screw holes 19 for fixing the heat generating member A28 and the heat generating member B29. Secure with. It installs in the perpendicular direction so that the heat receiving part 3 may be pinched | interposed between two heat generating body A28 and heat generating body B29.
A space is provided in the upper part of the heat receiving part 3 having a rectangular parallelepiped shape as a heat dissipation internal path 24, and a space for providing the return internal path 25 is provided in the lower part.

  The fin part 2 is provided in the center part between the heat radiation internal path 24 and the return internal path 25 in the heat receiving part 3.

  The heat receiving section 3 is provided with an outlet 20 that connects the heat dissipation path 5 and the heat dissipation internal path 24, and an inlet 21 that connects the feedback path 6 and the feedback internal path 25.

  The side surface on which the outlet 20 and the inlet 21 are provided is a side surface that connects the front surface and the rear surface on which the heat receiving plate A and the heat receiving plate B are provided.

  The fin portion 2 is provided with a plurality of plate-like fins A22 that protrude from the heat receiving plate A15 into the heat receiving portion 3 in parallel, and a plurality of plate fins that protrude from the heat receiving plate B16 into the heat receiving portion 3. B23 are arranged in parallel. The fin A22 and the fin B23 are arranged so that the flow path of the refrigerant between the fins is in the vertical direction. That is, it arrange | positions so that the clearance gap between each fin of fin A22 may become an up-down direction. The fin B23 is similarly arranged.

  Next, a characteristic configuration in the present embodiment will be described.

  As shown in FIG. 3, the bottom surface 30 of the return internal path has a downward slope toward the other side surface facing the side surface on which the inflow port 21 is installed.

  Accordingly, the liquid-phase refrigerant is easily moved from the side surface where the inflow port 21 is installed to the other side along the downward slope due to gravity, so that the liquid-phase refrigerant is distant from the side surface where the inflow port 21 is installed. As a result, local dryout in the heat receiving unit 3 is prevented, and it is not necessary to fill the heat receiving unit 3 with an excessive amount of liquid refrigerant, and a thin liquid phase refrigerant layer is formed in the heat receiving unit 3. The cooling device 1 with high cooling performance that can be formed can be provided.

  Note that the downward inclination of the bottom surface 30 of the return internal path increases the slope of the downward inclination of the bottom surface 30 of the return internal path as the heat receiving portion 3 increases, that is, as the bottom surface 30 of the return internal path increases. preferable. When the heat receiving part 3 becomes large, the distance between the side surface where the inflow port 21 is installed and the other side surface facing the side surface becomes longer, so that the liquid-phase refrigerant flowing from the inflow port 21 is installed in the inflow port 21. It is difficult to reach the other side opposite to the side face, and a liquid phase refrigerant is not supplied to a region far from the side face where the outflow port 20 is installed, so that a so-called dry-out state is likely to occur.

  Therefore, by increasing the downward slope of the bottom surface 30 of the return internal path, the liquid refrigerant can easily move from the side surface where the inlet 21 is installed to the other surface along the downward slope due to gravity. By enhancing the action, it becomes easier to supply the liquid-phase refrigerant to a region far from the side surface where the inlet 21 is installed. As a result, local dryout in the heat-receiving unit 3 is prevented, and the heat-receiving unit with an excessive amount of liquid-phase refrigerant. Therefore, it is possible to provide the cooling device 1 with high cooling performance that does not need to satisfy the inside 3 and can form a thin liquid phase refrigerant layer in the heat receiving portion 3.

  Furthermore, when the heat receiving unit 3 is installed, due to the influence of the installation accuracy, the bottom surface of the heat receiving unit 3 is inclined upward toward the other side opposite to the side on which the inflow port 21 is installed. The bottom surface 30 of the return internal path is inclined downward toward the other side surface opposite to the side surface on which the inflow port 21 is installed, so that the bottom direction 30 is opposite to the bottom surface 30 of the return internal path. The influence of the upward gradient of the bottom surface of the heat receiving part 3 that is inclined toward the bottom is reduced, and the influence of the installation accuracy is reduced. Compared to the case where the bottom surface 30 of the return internal path does not have a downward slope, the bottom surface 30 of the return internal path has an upward slope toward the side surface opposite to the side surface on which the inflow port 21 is installed. It is difficult to enter a so-called dry-out state in which the liquid-phase refrigerant is not supplied and cannot be cooled to a part of the fin in the region far from the installed side surface. Therefore, even when the heat receiving unit 3 main body is installed at an inclination, the bottom surface 30 of the return internal path is inclined downward toward the other side surface opposite to the side surface on which the inflow port 21 is installed. It becomes easy to supply the liquid refrigerant to the fin portion 2 in a region far from the side surface where the inlet 21 is installed.

  That is, by supplying the refrigerant to a region far from the side surface where the inflow port 21 is installed, local dryout in the heat receiving unit 3 is prevented, and it is not necessary to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant. It is possible to provide the cooling device 1 with high cooling performance capable of forming a liquid phase refrigerant layer in the heat receiving part 3.

  In addition, as shown in FIGS. 2, 3, 4, and 5, the inflow port 21 and the outflow port 20 may be provided on the same side surface of the heat receiving unit 3. Thereby, by supplying the refrigerant to a region far from the side surface where the inlet 21 is installed, local dryout in the heat receiving unit 3 is prevented, and it is not necessary to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant. It is possible to provide the cooling device 1 having a high cooling performance capable of forming a thin liquid phase refrigerant layer in the heat receiving portion 3.

  Moreover, you may make it the electronic device 50 carrying the cooling device 1 of this invention. Thereby, by supplying the refrigerant to a region far from the side surface where the inlet 21 is installed, local dryout in the heat receiving unit 3 is prevented, and it is not necessary to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant. It is possible to provide the electronic device 50 equipped with the cooling device 1 having a high cooling performance capable of forming a thin liquid phase refrigerant layer in the heat receiving portion 3.

(Embodiment 2)
FIG. 6 is a diagram illustrating an appearance of the heat receiving unit 3 of the cooling device 1 according to the present embodiment.

  7 and 8 are exploded perspective views of the heat receiving unit 3 of the cooling device 1 according to the present embodiment.

  FIG. 9 is a diagram illustrating an XX ′ cross section of the heat receiving unit 3 of the cooling device 1 according to the present embodiment.

  The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In Embodiment 1, as shown in FIGS. 2, 3, 4, and 5, the inflow port 21 is installed and the outflow port 20 is provided on the same side as the side surface. In the present embodiment, as shown in FIGS. 6, 7, 8, and 9, the outlet 20 is provided on the other side opposite to the side where the inlet 21 is installed. Compared with the configuration of the first embodiment, the present embodiment differs in the position where the outlet 20 is provided, but there is no significant difference in features. Thereby, by supplying the refrigerant to a region far from the side surface where the inlet 21 is installed, local dryout in the heat receiving unit 3 is prevented, and it is not necessary to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant. It is possible to provide the cooling device 1 with high cooling performance capable of forming a thin liquid phase refrigerant layer in the heat receiving part 3.

  As described above, since the cooling device according to the present invention has high cooling performance, electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate polar transistor (IGBT), and a diode are mounted. It is useful as a cooling device for electronic devices.

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Fin part 3 Heat receiving part 4 Heat radiating part 5 Heat radiating path 6 Return path 7 Cooling water supply path 8 Cooling water return path 15 Heat receiving plate A
16 Heat receiving plate B
19 Fixing screw hole 20 Outlet 21 Inlet 22 Fin A
23 Fin B
24 Heat dissipation internal path 25 Return internal path 28 Heating element A
29 Heating element B
30 Bottom of return internal path 50 Electronic device 51 Case

Claims (4)

In the cooling device that cools by phase change of the refrigerant,
A heat receiving part, a heat radiation path, a heat radiation part, a return path are connected in order to form a circulation path for the refrigerant,
The heat receiving part is
A heat receiving plate comprising a front surface and a rear surface, and a heating element installed on at least one of the front surface or the rear surface;
Connecting the heat dissipation internal path to the upper part of the heat receiving part, the feedback internal path to the lower part of the heat receiving part, and the fin part, the heat dissipation path and the heat dissipation internal path between the heat dissipation internal path and the feedback internal path And an inflow port connecting the return path and the return internal path,
The inlet and the outlet are each provided on a side surface of the heat receiving part,
The fin portion is provided with fins on a plurality of flat plates projecting inward from the heat receiving plate such that a refrigerant flow path constituted by gaps between the fins is in the vertical direction,
The cooling apparatus according to claim 1, wherein the bottom surface of the return internal path is inclined downward toward the other side surface facing the side surface on which the inflow port is installed. The cooling device according to claim 1, wherein the inflow port and the outflow port are provided on the same side surface of the heat receiving unit. The cooling device according to claim 1, wherein the outlet is provided on the other side opposite to the side where the inlet is installed. The electronic device carrying the cooling device as described in any one of Claims 1-3.