WO2017046986A1

WO2017046986A1 - Cooling device and electronic device equipped with same

Info

Publication number: WO2017046986A1
Application number: PCT/JP2016/003328
Authority: WO
Inventors: 杉山　誠; 若菜野上; 辰乙郁
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2015-09-15
Filing date: 2016-07-14
Publication date: 2017-03-23

Abstract

In the present invention, a heat receiving part (3) has an oblong rectangular parallelepiped shape in which a front face and a rear face have the largest surface area, the heat receiving part comprising: a heat receiving plate; a heat radiation internal path (25); a feedback internal path (24); a fin part (2) having a plurality of flat plate-shaped fins; an outlet (31); an inlet (30); one or a plurality of partition walls (34); a plurality of heat receivers (11); a heat radiation internal path opening (35); and a feedback internal path opening (36). In the heat receiving plate, a plurality of heating elements are disposed on the front face and/or the rear face. The partition walls (34) are provided between the front face and the rear face of the heat receiving part (3) and are oriented in a direction parallel to the fins. The heat receivers (11) are formed to be surrounded by the partition walls (34) and the inner walls of the heat receiving part (3). The amount of heat generated by the heating elements disposed via the heat receiving plate to the most downstream heat receiver (21) on the feedback path (6) side is less than the amount of heat generated by the heating elements disposed via the heat receiving plate to the upstream heat receivers.

Description

COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

The present invention relates to a cooling device for cooling an electronic component and an electronic apparatus equipped with the cooling device.

Conventionally, the following configuration is known as this type of cooling device.

That is, as shown in FIG. 8, a conventional cooling device 110 includes a housing 112 that is a heat receiving portion, and the housing 112 includes an inlet 114 through which a refrigerant flows, an outlet 116 through which a refrigerant flows, and a pipe. And a road portion 130. In the pipe line section 130, an evaporator section 132 and a circulation section 134 are provided adjacent to each other. In the evaporator section 132, the refrigerant flowing from the inlet 114 is vaporized by the heat of the inverter 108, which is a heating element. The vaporized refrigerant flows through the flow part 134 and flows out from the outlet 116. The evaporator part 132 is provided with a plurality of fins 140 that protrude from the bottom wall part 120 toward the flow part 134. A refrigerant | coolant distribute | circulates the clearance gap between the some fin 140 (for example, refer patent document 1).

JP 2013-016589 A

In the conventional cooling device 110 disclosed in Patent Document 1, since the inverter 108 is installed horizontally on the bottom surface of the housing 112, the bottom wall portion 120 of the housing 112 is filled with a liquid-phase refrigerant. The refrigerant flows through the gaps between the plurality of fins 140 protruding from the bottom wall part 120 toward the flow part 134.

The plurality of inverters 108 are cooled by increasing the distance from the inlet 114 to the outlet 116 of the casing 112 having such a configuration. In such a case, if a large amount of liquid-phase refrigerant is vaporized in a range close to the inlet 114, that is, upstream of the casing 112, and the liquid-phase refrigerant does not spread sufficiently downstream of the casing 112, the cooling device 110 becomes a state where the inverter 108 cannot be cooled. This state is a so-called dry-out state. In this state, the temperature of the inverter 108 increases. However, if an excessive amount of liquid-phase refrigerant is supplied in order to suppress dry-out, a thick liquid-phase refrigerant layer covers the fins 140 and becomes thermal resistance. Then, the cooling device 110 cannot create an ideal state in which a thin liquid phase refrigerant layer covers the fins 140, and the cooling performance of the cooling device 110 is lowered.

Therefore, the cooling device according to the present invention is configured such that the liquid phase refrigerant reaches the most downstream side on the return path side of the heat receiving portion. Thereby, the downstream dryout of the heat receiving part on the return path side is suppressed. That is, the cooling device according to the present invention does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

In order to achieve this object, a cooling device according to the present invention is a cooling device that cools a heating element by a phase change of a refrigerant, and sequentially connects a heat receiving unit, a heat radiation path, a heat radiation unit, and a return path. A circulation path for the formed refrigerant is provided. The heat receiving part has a horizontally long rectangular parallelepiped shape with a front surface and a rear surface having a maximum area, a heat receiving plate, a heat dissipation internal path, a return internal path, a fin portion having a plurality of flat fins, an outlet, and an inlet And one or a plurality of partition walls, a plurality of heat receivers, a heat dissipation internal path opening, and a return internal path opening. The heat receiving plate is provided with a plurality of heating elements on at least one of the front surface and the rear surface. The heat dissipation internal path is provided in the upper part of the heat receiving part, and the refrigerant flows through the heat dissipation internal path. The return internal path is provided below the heat receiving part, and the refrigerant flows through the return internal path. The fin portion is provided between the heat dissipation internal path and the return internal path. The outflow port connects the heat dissipation path and the heat dissipation internal path. The inflow port connects the return path and the return internal path. The partition wall is provided between the front surface and the rear surface of the heat receiving unit so as to be parallel to the fins. The heat receiver is formed by being surrounded by the partition wall and the inner wall of the heat receiving portion. The heat radiation internal path opening communicates the heat radiation internal path of each heat receiver in the partition wall. The return internal path opening communicates the return internal path of each heat receiver in the partition wall. The inflow port and the outflow port are provided on the same side surface of the heat receiving unit. The fin portion protrudes inward from the heat receiving plate, and is provided so that the refrigerant flow path constituted by the gap between the fins is in the vertical direction. The calorific value of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is smaller than the calorific value of the heating element installed in the upstream heat receiver via the heat receiving plate. This achieves the intended purpose.

As described above, the cooling device according to the present invention is a cooling device that cools a heating element by a phase change of the refrigerant, and is a refrigerant that is formed by sequentially connecting a heat receiving part, a heat radiation path, a heat radiation part, and a return path. Provide a circulation path. The heat receiving part has a horizontally long rectangular parallelepiped shape with a front surface and a rear surface having a maximum area, a heat receiving plate, a heat dissipation internal path, a return internal path, a fin portion having a plurality of flat fins, an outlet, and an inlet And one or a plurality of partition walls, a plurality of heat receivers, a heat dissipation internal path opening, and a return internal path opening. The heat receiving plate is provided with a plurality of heating elements on at least one of the front surface and the rear surface. The heat dissipation internal path is provided in the upper part of the heat receiving part, and the refrigerant flows through the heat dissipation internal path. The return internal path is provided below the heat receiving part, and the refrigerant flows through the return internal path. The fin portion is provided between the heat dissipation internal path and the return internal path. The outflow port connects the heat dissipation path and the heat dissipation internal path. The inflow port connects the return path and the return internal path. The partition wall is provided between the front surface and the rear surface of the heat receiving unit so as to be parallel to the fins. The heat receiver is formed by being surrounded by the partition wall and the inner wall of the heat receiving portion. The heat radiation internal path opening communicates the heat radiation internal path of each heat receiver in the partition wall. The return internal path opening communicates the return internal path of each heat receiver in the partition wall. The inflow port and the outflow port are provided on the same side surface of the heat receiving unit. The fin portion protrudes inward from the heat receiving plate, and is provided so that the refrigerant flow path constituted by the gap between the fins is in the vertical direction. The calorific value of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is smaller than the calorific value of the heating element installed in the upstream heat receiver via the heat receiving plate. In this way, the liquid-phase refrigerant spreads to the most downstream side on the return path side of the heat receiving portion. Thereby, the downstream dryout of the heat receiving part on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

That is, the liquid-phase refrigerant in the return path flows into the return internal path from the inflow port, and flows out from the return internal path to the fin portion. Then, the liquid-phase refrigerant that has flowed out to the fin portion receives heat generated from the heating element via the fins, becomes a two-phase refrigerant of a gas phase and a liquid phase, and is in a high pressure state. This is because the volume of the refrigerant expands when the refrigerant vaporizes.

The heat generation amount of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is configured to be smaller than the heat generation amount of the heating element installed in the upstream heat receiving device via the heat receiving plate. Therefore, the temperature of the most downstream heat receiver is lower than the temperature of the upstream heat receiver. Therefore, in the most downstream heat receiver, since the amount of heat received by the refrigerant is smaller than that of the upstream heat receiver, the volume of the refrigerant that expands by vaporizing the liquid-phase refrigerant is also small. Accordingly, the pressure in the most downstream heat receiver is lower than the pressure in the upstream heat receiver. The refrigerant easily flows to the downstream most downstream heat receiver. Therefore, dryout is suppressed in the downstream heat receiver on the return path side.

As described above, the calorific value of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is larger than the calorific value of the heating element installed in the upstream heat receiver via the heat receiving plate. The structure is also small. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, and can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

FIG. 1 is a schematic view of an electronic apparatus equipped with the cooling device according to the first embodiment of the present invention. FIG. 2 is a view showing an appearance of a heat receiving portion of the cooling device. FIG. 3 is an exploded perspective view of a heat receiving portion of the cooling device. FIG. 4 is an exploded perspective view of a heat receiving portion of the cooling device. FIG. 5 is a view seen from the front side with the heat receiving plate on the front side of the heat receiving unit of the cooling device removed. FIG. 6 is an exploded perspective view of the heat receiving portion of the cooling device according to the second embodiment of the present invention. FIG. 7 is a view seen from the front side with the heat receiving plate on the front side of the heat receiving unit of the cooling device removed. FIG. 8 is a schematic view showing a conventional cooling device.

A cooling device according to an embodiment of the present invention is a cooling device that cools a heating element by a phase change of the refrigerant, and circulates the refrigerant formed by sequentially connecting a heat receiving part, a heat radiation path, a heat radiation part, and a return path. Provide a route. The heat receiving part has a horizontally long rectangular parallelepiped shape with a front surface and a rear surface having a maximum area, a heat receiving plate, a heat dissipation internal path, a return internal path, a fin portion having a plurality of flat fins, an outlet, and an inlet And one or a plurality of partition walls, a plurality of heat receivers, a heat dissipation internal path opening, and a return internal path opening. The heat receiving plate is provided with a plurality of heating elements on at least one of the front surface and the rear surface. The heat dissipation internal path is provided in the upper part of the heat receiving part, and the refrigerant flows through the heat dissipation internal path. The return internal path is provided below the heat receiving part, and the refrigerant flows through the return internal path. The fin portion is provided between the heat dissipation internal path and the return internal path. The outflow port connects the heat dissipation path and the heat dissipation internal path. The inflow port connects the return path and the return internal path. The partition wall is provided between the front surface and the rear surface of the heat receiving unit so as to be parallel to the fins. The heat receiver is formed by being surrounded by the partition wall and the inner wall of the heat receiving portion. The heat radiation internal path opening communicates the heat radiation internal path of each heat receiver in the partition wall. The return internal path opening communicates the return internal path of each heat receiver in the partition wall. The inflow port and the outflow port are provided on the same side surface of the heat receiving unit. The fin portion protrudes inward from the heat receiving plate, and is provided so that the refrigerant flow path constituted by the gap between the fins is in the vertical direction. The calorific value of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is smaller than the calorific value of the heating element installed in the upstream heat receiver via the heat receiving plate. In this way, the liquid-phase refrigerant spreads to the most downstream heat receiver on the return path side. Thereby, the dry-out of the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

The heat generation amount of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is configured to be smaller than the heat generation amount of the heating element installed in the upstream heat receiving device via the heat receiving plate. Therefore, the temperature of the most downstream heat receiver is lower than the temperature of the upstream heat receiver. Therefore, in the most downstream heat receiver, since the amount of heat received by the refrigerant is smaller than that of the upstream heat receiver, the volume of the refrigerant that expands by vaporizing the liquid-phase refrigerant is also small. Accordingly, the pressure in the most downstream heat receiver is lower than the pressure in the upstream heat receiver. Thereby, a refrigerant | coolant becomes easy to flow into the downstream most heat receiving device with a low pressure. Therefore, dryout is suppressed in the downstream heat receiver on the return path side.

As described above, the heating value of the heating element installed on the most downstream heat receiving plate on the return path side is configured to be smaller than the heating value of the heating element installed upstream. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

Further, the heat receiving unit may include a partition plate provided between the return internal path and the fin portion so as to be parallel to the bottom surface of the heat receiving unit, and the partition plate may have a plurality of openings. .

Since the partition plate provided between the return internal path and the fin portion has a plurality of openings, the liquid-phase refrigerant in the return path flows into the return internal path from the inlet and is provided in the partition plate. It flows out from the opening into the heat receiving part. In each heat receiver, since the liquid phase refrigerant is supplied to the fin portion only from the opening of the partition plate, a large amount of the liquid phase refrigerant is prevented from flowing out from the return internal path to the fin portion. Thereby, dryout is suppressed in the downstream heat receiver.

As described above, dry-out in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiver with an excessive amount of liquid-phase refrigerant, and can form a thin liquid-phase refrigerant layer in the heat receiver, resulting in high cooling performance. Have.

The heat receiving section is provided in a return internal path and includes a return internal pipe through which the refrigerant flows, and the return internal path opening communicates with the return internal pipe of each heat receiver in the partition wall. May be configured to have a plurality of openings.

As a result, since the return internal pipe has a plurality of openings, the liquid-phase refrigerant in the return path flows into the return internal pipe from the inflow port, and flows out into the heat receiving section from the opening provided in the return internal pipe. To do. Then, the liquid-phase refrigerant that has flowed out to the fin portion receives heat generated from the heating element via the fins, becomes a two-phase refrigerant of a gas phase and a liquid phase, and is in a high pressure state. This is because the volume of the refrigerant expands when the refrigerant vaporizes.

The heat generation amount of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is configured to be smaller than the heat generation amount of the heating element installed in the upstream heat receiving device via the heat receiving plate. Therefore, the temperature of the most downstream heat receiver is lower than the temperature of the upstream heat receiver. Therefore, in the most downstream heat receiver, since the amount of heat received by the refrigerant is smaller than that of the upstream heat receiver, the volume of the refrigerant that expands by vaporizing the liquid-phase refrigerant is also small. Accordingly, the pressure in the most downstream heat receiver is lower than the pressure in the upstream heat receiver. The refrigerant easily flows to the downstream most downstream heat receiver. Therefore, dryout is suppressed in the most downstream heat receiver on the return path side.

In addition, in the configuration in which the liquid-phase refrigerant flows in the return internal conduit compared to the configuration in which the liquid-phase refrigerant flows directly through the bottom surface of the heat receiver, the liquid-phase refrigerant in the return internal conduit is the heat receiver. It is hard to be heated by the heat inside. Therefore, the cooling device having the above-described configuration can suppress the liquid-phase refrigerant from being vaporized in the return internal pipe and preventing the vaporized refrigerant from flowing backward to the return path.

As described above, the heat generation amount of the heating element installed in the most downstream heat receiver on the return path side via the heat receiving plate is larger than the heat generation amount of the heating element installed in the upstream heat receiving device via the heat receiving plate. The structure is also small. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

Further, the total opening area of the opening portions of the partition plates in each heat receiver may be the smallest in the most upstream heat receiver, and may be configured to increase as the downstream heat receiver becomes.

Since the partition plate provided between the return internal path and the fin portion has a plurality of openings, the liquid phase refrigerant in the return path flows into the return internal path from the inflow port, and the opening provided in the partition plate Out into the heat receiving part.

The total opening area of the openings of the partition plates in each heat receiver is configured to be the smallest in the most upstream heat receiver and increase as the downstream heat receiver is reached. Therefore, since the total opening area is small in the most upstream heat receiver, the liquid-phase refrigerant hardly flows out from the opening of the partition plate in the most upstream heat receiver. In addition, since the total opening area increases as the downstream heat receiver becomes, the liquid phase refrigerant tends to flow out from the opening of the partition plate as the downstream heat receiver becomes. Thereby, dryout is suppressed in the downstream heat receiver.

As described above, the total opening area of the opening portions of the partition plates in each heat receiver may be the smallest in the most upstream heat receiver and may increase as the downstream heat receiver is increased. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiver with an excessive amount of liquid-phase refrigerant, and can form a thin liquid-phase refrigerant layer in the heat receiver, resulting in high cooling performance. Have.

Further, the total opening area of the opening of the return internal pipe line in each heat receiver may be the smallest in the most upstream heat receiver, and may increase as the downstream heat receiver becomes larger.

Since the return internal conduit has a plurality of openings, the liquid-phase refrigerant in the return route flows into the return internal conduit from the inlet and flows out into the heat receiving portion from the opening provided in the return internal conduit.

The total opening area of the opening of the return internal pipe line in each heat receiver is configured to be the smallest in the most upstream heat receiver and increase as it becomes the downstream heat receiver. Therefore, since the total opening area is small in the most upstream heat receiver, the liquid-phase refrigerant hardly flows out from the opening of the return internal pipe line in the most upstream heat receiver. Further, since the total opening area becomes larger as the downstream heat receiver becomes, the liquid-phase refrigerant tends to flow out from the opening of the return internal pipe line as the downstream heat receiver becomes. Thereby, dryout is suppressed in the downstream heat receiver.

As described above, the total opening area of the opening portion of the return internal pipe line in each heat receiver may be the smallest in the most upstream heat receiver and may be increased as the downstream heat receiver is reached. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiver with an excessive amount of liquid-phase refrigerant, and can form a thin liquid-phase refrigerant layer in the heat receiver, resulting in high cooling performance. Have.

Further, the number of openings of the partition plate in each heat receiver may be the smallest in the most upstream heat receiver and may be increased as the downstream heat receiver is reached.

Thereby, since the number of openings of the partition plate in the most upstream heat receiver is the smallest, the liquid-phase refrigerant hardly flows out from the opening of the partition plate in the most upstream heat receiver. In addition, since the number of openings of the partition plate increases as the downstream heat receiver becomes, the liquid phase refrigerant tends to flow out from the opening of the partition plate as the downstream heat receiver becomes. Thereby, dryout is suppressed in the downstream heat receiver.

As described above, the number of openings of the partition plate in each heat receiver may be the smallest in the most upstream heat receiver, and may increase as the number of downstream heat receivers increases. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiver with an excessive amount of liquid-phase refrigerant, and can form a thin liquid-phase refrigerant layer in the heat receiver, resulting in high cooling performance. Have.

In addition, the number of openings of the return internal pipe line in each heat receiver may be the smallest in the most upstream heat receiver, and may increase as the number of downstream heat receivers increases.

Thereby, since the number of openings in the return internal conduit in the most upstream heat receiver is the smallest, the liquid-phase refrigerant hardly flows out from the opening in the return internal conduit in the most upstream heat receiver. In addition, since the number of openings in the return internal pipe increases as the heat receiver becomes downstream, the liquid-phase refrigerant tends to flow out from the opening of the return internal pipe as the heat sink becomes downstream. Thereby, dryout is suppressed in the downstream heat receiver.

As described above, the number of openings in the return internal pipe line in each heat receiver may be the smallest in the most upstream heat receiver, and may increase as the number of downstream heat receivers increases. Thereby, the dryout in the downstream heat receiver on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiver with an excessive amount of liquid-phase refrigerant, and can form a thin liquid-phase refrigerant layer in the heat receiver, resulting in high cooling performance. Have.

The heating element may be installed on the heat receiving plate at a distance from the bottom surface of the heat receiving unit.

Thus, the heating element is configured to be installed on the heat receiving plate at a distance from the bottom surface of the heat receiving part, so that the liquid phase refrigerant flowing in the return internal path provided at the lower part of the heat receiving part, that is, the heat receiving part The liquid refrigerant flowing through the bottom surface is spaced from the heating element. Therefore, the liquid phase refrigerant is less likely to receive heat from the heating element. Therefore, the liquid-phase refrigerant flowing in the return internal path receives heat and becomes a gas-phase refrigerant, and a state where the liquid-phase refrigerant does not reach the downstream of the return internal path through the fin portion is suppressed. Thereby, dryout is suppressed downstream of the heat receiving part on the return path side.

As described above, the heating element may be installed on the heat receiving plate at a distance from the bottom surface of the heat receiving unit. Thereby, the dry-out downstream of the heat receiving part on the return path side is suppressed. That is, the cooling device having the above configuration does not need to fill the heat receiving portion with an excessive amount of liquid phase refrigerant, can form a thin liquid phase refrigerant layer in the heat receiving portion, and has high cooling performance.

Moreover, the electronic apparatus according to an embodiment of the present invention may be equipped with the cooling device having the above-described configuration. As a result, the electronic device having the above-described configuration can operate stably because it is equipped with a cooling device having high cooling performance.

(Embodiment 1)
Hereinafter, Embodiment 1 will be described with reference to the drawings.

FIG. 1 is a schematic diagram of an electronic device equipped with the cooling device of the first embodiment.

As shown in FIG. 1, the electronic device 50 has a first heating element group 28, a second heating element group 29, and a cooling device 1 mounted in a case 51. The first heating element group 28 and the second heating element group 29 are composed of a plurality of heating elements. The first heating element group 28 and the second heating element group 29 include, for example, a power semiconductor element, a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate bipolar transistor (IGBT), a diode, and the like. The heating element may be configured.

The cooling device 1 cools the first heating element group 28 and the second heating element group 29 by the phase change of the refrigerant. The cooling device 1 includes a refrigerant circulation path formed by sequentially connecting the heat receiving section 3, the heat radiation path 5, the heat radiation section 4, and the return path 6. With this configuration, the inside of the circulation path provided in the cooling device 1 is a sealed space. Although not shown in FIG. 1, the refrigerant is sealed in the circulation path after the pressure is reduced. As the refrigerant, chlorofluorocarbons, fluorinated solvents and the like are used, but are not limited thereto. Aluminum is suitable for the material of the heat receiving part 3, the heat radiating part 4, and the first fin 22 and the second fin 23, which will be described later, but is not limited thereto.

The cooling device 1 is connected to a water cooling chiller (not shown) for cooling the refrigerant vaporized by the heat of the first heating element group 28 and the second heating element group 29. The cooling water cooled by the water cooling chiller is supplied from the cooling water supply path 7 to the heat radiating unit 4. The vaporized refrigerant is cooled and liquefied by exchanging heat with the cooling water of the water-cooled chiller in the heat radiating section 4. The heat-exchanged cooling water returns to the water-cooled chiller via the cooling water return path 8 and is cooled in the water-cooled chiller.

In the present embodiment, the cooling method of the refrigerant is a water cooling method using a water cooling chiller, but an air cooling method using a cooling fan or other methods may be used.

Next, the basic mechanism of the cooling device 1 having the above configuration will be described.

The circulation path provided in the cooling device 1 is one in which a refrigerant is sealed after the inside is depressurized. The pressure in the circulation path becomes the saturation pressure of the refrigerant according to the external temperature by the action of the refrigerant. The heat of the first heating element group 28 and the second heating element group 29 is transmitted to the refrigerant through the heat receiving portion 3, and the liquid refrigerant is vaporized, whereby the first heating element group 28 and the second heating element group 28 are heated. The body group 29 is cooled. The refrigerant vaporized in the heat receiving part 3 becomes a gas-liquid two-phase mixed flow with the liquid refrigerant not vaporized, and moves from the heat receiving part 3 to the heat radiating part 4 through the heat radiation path 5. The vaporized refrigerant is cooled by the cooling water of the water-cooled chiller supplied from the cooling water supply path 7, becomes a liquid-phase refrigerant again, and returns to the heat receiving unit 3 through the return path 6.

Therefore, the liquid-phase refrigerant is vaporized in the heat receiving part 3, the vaporized refrigerant passes through the heat radiation path 5 and is cooled and liquefied in the heat radiation part 4, and the liquefied refrigerant passes through the feedback path 6 and again. The cycle supplied into the heat receiving unit 3 is repeated. Thereby, the cooling device 1 cools the first heating element group 28 and the second heating element group 29.

The diameter of the return path 6 is smaller than the diameter of the heat dissipation path 5. Thereby, since the flow path pressure loss of the return path 6 becomes higher than the flow path pressure loss of the heat radiation path 5, the refrigerant is prevented from flowing back from the heat receiving portion 3 to the return path 6.

FIG. 2 is a diagram illustrating an appearance of the heat receiving unit 3 of the cooling device 1 according to the first embodiment.

3 and 4 are exploded perspective views of the heat receiving unit 3 of the cooling device 1 according to the first embodiment.

FIG. 5 is a view of the first heat receiving plate 15 of the heat receiving unit 3 of the cooling device according to the first embodiment as viewed from the front side.

As shown in FIG. 2, FIG. 3, and FIG. 4, the heat receiving part 3 has a horizontally long rectangular parallelepiped shape with the maximum area on the front and rear surfaces.

The heat receiving unit 3 is installed so that the front surface and the rear surface are parallel to the vertical direction. The heat receiving unit 3 includes a first heat receiving plate 15 on the front surface and a second heat receiving plate 16 on the rear surface. The first heat receiving plate 15 is provided with a first heating element group 28 (see FIG. 1), and the second heat receiving plate 16 is provided with a second heating element group 29 (see FIG. 1).

In addition, although a heat generating body, a heat receiving plate, a fin, etc. are each divided into the first and second, this means that there are two each, and unless otherwise specified, the first and second There is no difference.

Further, in the present embodiment, the heat receiving section 3 includes two heating element groups and two heat receiving plates, respectively, but the first heating element group 28 is provided on either the front surface or the rear surface. Only the heat receiving plate 15 may be provided (not shown).

As shown in FIG. 5, the second heating element group 29 is composed of a first heating element 43, a second heating element 44, and a third heating element 45. Each heating element constituting the second heating element group 29 is brought into contact with the second heat receiving plate 16 to thermally connect each heating element and the second heat receiving plate 16. Although not shown, the first heating element group 28 is also composed of a plurality of heating elements. Each heating element constituting the first heating element group 28 is brought into contact with the first heat receiving plate 15 to thermally connect each heating element and the first heat receiving plate 15. The first heat receiving plate 15 and the second heat receiving plate 16 are appropriately provided with fixing screw holes 19 for fixing the heating element groups. Thus, the first heat generating group 28 can be fixed to the first heat receiving plate 15 and the second heat generating group 29 can be fixed to the second heat receiving plate 16 with screws. The first heating element group 28 and the second heating element group 29 are installed so as to be parallel to the vertical direction so that the heat receiving portion 3 is sandwiched therebetween.

A space is provided as a heat radiating internal path 25 at the top of the heat receiving portion 3 having a horizontally long rectangular parallelepiped shape. In addition, a space is provided as a return internal path 24 below the heat receiving unit 3. That is, the heat receiving unit 3 includes a heat dissipation internal path 25 and a return internal path 24. The refrigerant flows through the heat dissipation internal path 25 and the return internal path 24.

The heat receiving portion 3 includes a fin portion 2 provided at a central portion between the heat dissipation internal path 25 and the return internal path 24.

The heat receiving unit 3 includes an outlet 31 that connects the heat dissipation path 5 and the heat dissipation internal path 25, and an inlet 30 that connects the return path 6 and the return internal path 24.

The outlet 31 and the inlet 30 are provided on the same side surface of the heat receiving unit 3. The side surface on which the outflow port 31 and the inflow port 30 are provided is a side surface that connects the front surface and the rear surface on which the first heat receiving plate 15 and the second heat receiving plate 16 are provided.

The fin part 2 has a plurality of flat first fins 22 and a plurality of flat second fins 23. The first fin 22 protrudes from the first heat receiving plate 15 to the inside of the heat receiving portion 3, and is provided so that the refrigerant flow path constituted by the gap between the first fins 22 is in the vertical direction. The second fin 23 protrudes from the second heat receiving plate 16 to the inside of the heat receiving portion 3, and is provided so that the refrigerant flow path constituted by the gap between the second fins 23 is in the vertical direction.

The heat receiving unit 3 includes a partition plate 32 provided between the return internal path 24 and the fin portion 2 so as to be parallel to the bottom surface of the heat receiving unit 3.

The partition plate 32 has a plurality of openings 33.

The heat receiving unit 3 is parallel to the first fin 22 and the second fin 23 between the front surface and the rear surface of the heat receiving unit 3, that is, between the first heat receiving plate 15 and the second heat receiving plate 16. One or a plurality of partition walls 34 are provided so as to be oriented. In the present embodiment, the heat receiving unit 3 includes two partition walls 34. The partition wall 34 is provided so as to divide the longitudinal direction of the heat receiving unit 3 into approximately equal parts. The heat receiving unit 3 includes a plurality of heat receivers 11 that are sections formed by being surrounded by the partition wall 34 and the inner wall of the heat receiving unit 3. In the present embodiment, three heat receivers 11 are formed.

The heat receiving unit 3 includes a heat radiating internal path opening 35 that communicates the heat radiating internal path 25 of each heat receiver 11 in the partition wall 34. Further, the heat receiving unit 3 includes a return internal path opening 36 that communicates the return internal path 24 of each heat receiver 11 in the partition wall 34. The heat dissipating internal path opening 35 and the return internal path opening 36 may be openings actually provided in the partition wall 34, or the structure in which the partition wall 34 is provided avoiding the heat dissipating internal path 25 and the return internal path 24. It may be what you did.

The partition plate 32 has a plurality of openings 33. At least one opening 33 is provided in one heat receiver 11.

Next, the partition wall 34 will be described.

On the side surface side where the inlet 30 and the outlet 31 are installed, the pressure is low due to the action of the heat radiating unit 4 connected to the outlet 31. Therefore, the refrigerant that has flowed out into the fin portion 2 in the heat receiving portion 3 tends to flow to the side surface where the inlet 30 and the outlet 31 having a low pressure are installed. When a plurality of heating elements are provided on one heat receiving plate as in the present embodiment, the lateral width of the heat receiving unit 3 may be increased. In such a case, the distance from the side surface where the inflow port 30 and the outflow port 31 are installed to the opposite side surface becomes longer. Therefore, compared with the case where the horizontal width of the heat receiving part 3 is small, the area far from the side surface on which the inflow port 30 and the outflow port 31 are installed increases, and the area that is easily dried out increases. Therefore, by partitioning the inside of the heat receiving section 3 with the partition wall 34, the refrigerant supplied to the heat receiver 11 that is a partitioned section flows through the first fin 22 and the second fin 23 in the heat receiver 11. . Then, after the heat exchange with the first fins 22 and the second fins 23, the refrigerant flows to the heat dissipation path 5 side through the heat dissipation internal path 25 and the heat dissipation internal path opening 35 provided in the partition wall 34. Therefore, even when the lateral width of the heat receiving part 3 is large, by partitioning the heat receiving part 3 with the partition wall 34, dryout in a region far from the side surface where the inlet 30 and the outlet 31 are installed is suppressed. The

Next, a characteristic configuration in the present embodiment will be described.

As shown in FIG. 5, the second heat receiving plate 16 is provided with a second heating element group 29 including a first heating element 43, a second heating element 44, and a third heating element 45. ing. Here, the amount of heat generated by the third heating element 45 installed in the most downstream heat receiver 21 on the return path 6 side via the second heat receiving plate 16 is equal to the upstream heat receiver 11 (the most upstream heat receiver 20. The amount of heat generated by each of the first heating element 43 and the second heating element 44 installed via the second heat receiving plate 16 is smaller.

That is, in the second heat receiving plate 16, the amount of heat generated by the third heating element 45 installed on the most downstream side of the refrigerant flow viewed from the return path 6 side is the first installed on the upstream side of the most downstream side. It is smaller than each calorific value of the heating element 43 and the second heating element 44.

Here, upstream means the side closer to the return path 6, and downstream means the side far from the return path 6. That is, the most upstream heat receiver 20 is a heat receiver closest to the return path 6 among the heat receivers 11. The most downstream heat receiver 21 is a heat receiver farthest from the return path 6 among the heat receivers 11.

The partition plate 32 provided between the return internal path 24 and the fin portion 2 so as to be parallel to the bottom surface of the heat receiving portion 3 has a plurality of openings 33. Therefore, the liquid-phase refrigerant in the return path 6 flows into the return internal path 24 from the inflow port 30, and flows out from the opening 33 provided in the partition plate 32 to the fin portion 2. Then, the liquid-phase refrigerant that has flowed out to the fin portion 2 receives heat generated from the first heating element 43 installed on the upstream side via the second fin 23, and the two phases of the gas phase and the liquid phase are received. It becomes a refrigerant of the phase, and the pressure becomes high. This is because the volume of the refrigerant expands when the refrigerant vaporizes.

The amount of heat generated by the third heating element 45 installed in the most downstream heat receiver 21 on the return path 6 side via the second heat receiving plate 16 is the upstream heat receiver 11 (including the most upstream heat receiver 20). The first heat generating body 43 and the second heat generating body 44 installed through the second heat receiving plate 16 are configured to have a smaller heat generation amount. Therefore, the temperature of the most downstream heat receiver 21 is lower than the temperature of the upstream heat receiver 11 (including the most upstream heat receiver 20). Therefore, in the most downstream heat receiver 21, since the amount of heat received by the refrigerant is less than that of the upstream heat receiver 11 (including the most upstream heat receiver 20), the volume of the refrigerant that expands by vaporizing the liquid-phase refrigerant. There are few. Therefore, the pressure in the most downstream heat receiver 21 is lower than the pressure in the upstream heat receiver 11 (including the most upstream heat receiver 20). The refrigerant easily flows to the most downstream heat receiver 21 having a low pressure. Therefore, dryout is suppressed in the most downstream heat receiver 21 on the return path 6 side.

As described above, the amount of heat generated by the third heating element 45 installed in the most downstream heat receiving device 21 on the return path 6 side via the second heat receiving plate 16 is equal to the upstream heat receiving device 11 (the most upstream heat receiving device 11). The heat generation amount of each of the first heat generating body 43 and the second heat generating body 44 installed in the heat receiving device 20 via the second heat receiving plate 16 is smaller. Thereby, the dry-out in the most downstream heat receiver 21 is suppressed. That is, the cooling device 1 does not need to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant, and can form a thin liquid phase refrigerant layer in the heat receiving unit 3, and has high cooling performance. .

Further, the total opening area of the openings 33 of the partition plate 32 in each heat receiver 11 may be the smallest in the most upstream heat receiver 20 and may be configured to increase as the downstream heat receiver 11 is reached. Here, the total opening area means the total area of the openings of the opening 33 in each heat receiver 11.

The partition plate 32 has a plurality of openings 33. The liquid-phase refrigerant cooled and liquefied by the heat radiating unit 4 flows through the return path 6 and flows into the return internal path 24 from the inlet 30 of the most upstream heat receiving unit 3 on the return path 6 side. The liquid refrigerant flowing into the return internal path 24 receives the heat generated from the first heating element group 28 and the second heating element group 29 via the heat receiving unit 3, and the gas phase, the liquid phase, And the pressure is high. This is because the volume of the refrigerant expands when the refrigerant vaporizes. This high-pressure two-phase refrigerant flows out from the plurality of openings 33 of the partition plate 32 to the fin portion 2, flows upward in the vertical gaps of the first fin 22 and the second fin 23, Liquid phase refrigerant is supplied to the surfaces of the first fin 22 and the second fin 23. Then, while receiving heat from the first fin 22 and the second fin 23, the refrigerant flows into the outlet 31 having a low pressure through the heat radiation internal path 25 by the action of the heat radiation unit 4.

In the heat receiver 11 (including the most downstream heat receiver 21) downstream from the most upstream heat receiver 20, the liquid-phase refrigerant is not supplied from the return path 6, but from one upstream heat receiver 11. Supplied. That is, the liquid-phase refrigerant in the heat receiver 11 that is one upstream is supplied to the heat receiver 11 from the return internal path opening 36 provided in the partition wall 34. The subsequent operation is the same as that in the most upstream heat receiver 20.

The total opening area of the openings 33 of the partition plate 32 in each heat receiver 11 is configured to be the smallest in the most upstream heat receiver 20 and increase as the downstream heat receiver 11 is reached. Therefore, since the total opening area is small in the most upstream heat receiver 20, the liquid-phase refrigerant hardly flows out from the opening 33 of the partition plate 32 in the most upstream heat receiver 20. Further, since the total opening area becomes larger as the downstream heat receiver 11 is reached, the liquid phase refrigerant is more likely to flow out from the opening 33 of the partition plate 32 as the downstream heat receiver 11 is reached. Thereby, in the downstream heat receiver 11, dryout is suppressed.

As described above, the total opening area of the openings 33 of the partition plate 32 in each heat receiver 11 is configured to be the smallest in the most upstream heat receiver 20 and become larger toward the downstream heat receiver 11. Thereby, the dryout in the downstream heat receiver 11 by the side of the return path 6 is suppressed. In other words, the cooling device 1 does not need to fill the heat receiver 11 with an excessive amount of liquid-phase refrigerant, can form a thin liquid-phase refrigerant layer in the heat receiver 11, and has high cooling performance. .

Further, the number of openings 33 of the partition plate 32 in each heat receiver 11 may be the smallest in the most upstream heat receiver 20 and may increase as the number of downstream heat receivers 11 increases. Thereby, since the number of openings 33 of the partition plate 32 in the most upstream heat receiver 20 is the smallest, the liquid-phase refrigerant hardly flows out from the openings 33 of the partition plate 32 in the most upstream heat receiver 20. Further, since the number of the openings 33 increases as the downstream heat receiver 11 is reached, the liquid-phase refrigerant is more likely to flow out from the openings 33 of the partition plate 32 as the downstream heat receiver 11 is reached. Thereby, in the downstream heat receiver 11, dryout is suppressed.

As described above, the number of the openings 33 in each heat receiver 11 may be the smallest in the most upstream heat receiver 20 and may be increased as the downstream heat receiver 11 is reached. Thereby, the dryout in the downstream heat receiver 11 by the side of the return path 6 is suppressed. In other words, the cooling device 1 does not need to fill the heat receiver 11 with an excessive amount of liquid-phase refrigerant, can form a thin liquid-phase refrigerant layer in the heat receiver 11, and has high cooling performance. .

Further, in the cooling device 1, the first heating element group 28 and the second heating element group 29 are spaced apart from the bottom surface of the heat receiving unit 3 by the first heat receiving plate 15 and the second heat receiving plate 16, respectively. You may make it the structure installed in.

As a result, the liquid-phase refrigerant flowing in the return internal path 24 provided in the lower part of the heat receiving unit 3, that is, the liquid-phase refrigerant flowing in the bottom surface of the heat receiving unit 3, the first heating element group 28 and the second The distance from the heating element group 29 is set. Therefore, the refrigerant hardly receives heat from the first heating element group 28 and the second heating element group 29. Therefore, the liquid-phase refrigerant flowing in the return internal path 24 receives heat and becomes a gas-phase refrigerant, and the state where the liquid-phase refrigerant flows out to the fin portion 2 and does not reach the downstream of the return internal path 24 is suppressed. Thereby, dryout is suppressed downstream of the heat receiving part 3 on the return path 6 side.

As described above, the first heating element group 28 and the second heating element group 29 are separated from the bottom surface of the heat receiving unit 3 by the first heat receiving plate 15 and the second heat receiving plate 16, respectively. It may be configured to be installed. Thereby, the dryout of the downstream of the heat receiving part 3 by the side of the return path 6 is suppressed. That is, the cooling device 1 does not need to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant, and can form a thin liquid phase refrigerant layer in the heat receiving unit 3, and has high cooling performance. .

(Embodiment 2)
FIG. 6 is an exploded perspective view of the heat receiving unit 3 of the cooling device 1 according to the second embodiment.

FIG. 7 is a view of the first heat receiving plate 15 of the heat receiving unit 3 of the cooling device 1 according to the second embodiment as viewed from the front side.

Components similar to those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIGS. 6 and 7, the heat receiving unit 3 includes a return internal pipe 37 connected to the inflow port 30. The return internal pipe 37 is provided in the return internal path 24, and the refrigerant flows through the return internal pipe 37. The inflow port 30 connects the return path 6 and the return internal conduit 37. The return internal path opening 36 communicates the return internal pipe line 37 of each heat receiver 11 in the partition wall 34. The return internal conduit 37 has a plurality of openings 38.

The heat receiving unit 3 includes a heat radiating internal path opening 35 that communicates with the heat radiating internal path 25 of each of the heat receivers 11 at the upper part of the heat receiving unit 3 in the partition wall 34. In addition, the heat receiving unit 3 includes a return internal path opening 36 in the partition wall 34, which is located below the heat receiving unit 3 and communicates with the return internal pipe line 37 of each heat receiver 11. The heat dissipating internal path opening 35 and the return internal path opening 36 may be openings actually provided in the partition wall 34, or the structure in which the partition wall 34 is provided avoiding the heat dissipating internal path 25 and the return internal conduit 37. It may be what.

The return internal conduit 37 has a plurality of openings 38. At least one opening 38 is provided in one heat receiver 11.

As shown in FIG. 7, the second heat receiving plate 16 is provided with a second heating element group 29 including a first heating element 43, a second heating element 44, and a third heating element 45. ing. Here, the amount of heat generated by the third heating element 45 installed in the most downstream heat receiver 21 on the return path 6 side via the second heat receiving plate 16 is equal to the upstream heat receiver 11 (the most upstream heat receiver 20. The amount of heat generated by each of the first heat generating body 43 and the second heat generating body 44 installed via the first heat receiving plate 15 is smaller.

Since the return internal pipe 37 has a plurality of openings 38, the liquid-phase refrigerant in the return path 6 flows into the return internal pipe 37 from the inlet 30 and is provided in the return internal pipe 37. It flows out from 38 to the fin part 2. Then, the liquid-phase refrigerant that has flowed out to the fin portion 2 receives heat generated from the first heating element 43 installed on the upstream side via the second fin 23, and the two phases of the gas phase and the liquid phase are received. It becomes a refrigerant of the phase, and the pressure becomes high. This is because the volume of the refrigerant expands when the refrigerant vaporizes.

In addition, in the configuration in which the liquid-phase refrigerant flows in the return internal pipe 37 compared to the configuration in which the liquid-phase refrigerant flows directly through the bottom surface of the heat receiver 11, the liquid-phase refrigerant in the return internal pipe 37 The refrigerant is hardly heated by the heat in the heat receiver 11. Therefore, the cooling device 1 can prevent the liquid-phase refrigerant from evaporating in the return internal pipe 37 and flowing back to the return path 6 side.

As described above, the amount of heat generated by the third heating element 45 installed in the most downstream heat receiver 21 on the return path 6 side via the second heat receiving plate 16 is equal to the upstream heat receiver 11 (the most upstream heat receiver 11). The first heat generating body 43 and the second heat generating body 44 installed in the heat receiving device 20 via the second heat receiving plate 16 are configured to have a smaller heat generation amount. Thereby, the dry-out in the most downstream heat receiver 21 is suppressed. That is, the cooling device 1 does not need to fill the heat receiving unit 3 with an excessive amount of liquid phase refrigerant, and can form a thin liquid phase refrigerant layer in the heat receiving unit 3, and has high cooling performance. .

Further, the total opening area of the opening portions 38 of the return internal pipes 37 in each heat receiver 11 may be the smallest in the most upstream heat receiver 20 and may be increased as the downstream heat receiver 11 is reached.

The return internal conduit 37 has a plurality of openings 38. The liquid-phase refrigerant cooled and liquefied by the heat radiating unit 4 flows through the return path 6 and flows into the return internal conduit 37 from the inlet 30 of the most upstream heat receiving unit 3 on the return path 6 side. The liquid refrigerant flowing into the return internal pipe 37 receives the heat generated from the first heating element group 28 and the second heating element group 29 via the heat receiving unit 3, and the gas phase and the liquid phase are received. And the pressure is high. This is because the volume of the refrigerant expands when the refrigerant vaporizes. The high-pressure two-phase refrigerant flows out from the plurality of openings 38 of the return internal pipe 37 to the fin portion 2 and flows upward through the vertical gaps of the first fin 22 and the second fin 23. Thus, the liquid-phase refrigerant is supplied to the surfaces of the first fin 22 and the second fin 23. Then, while receiving heat from the first fin 22 and the second fin 23, the refrigerant flows into the outlet 31 having a low pressure through the heat radiation internal path 25 by the action of the heat radiation unit 4.

In the heat receiver 11 (including the most downstream heat receiver 21) downstream from the most upstream heat receiver 20, the liquid-phase refrigerant is not supplied from the return path 6, but from one upstream heat receiver 11. Supplied. That is, the liquid-phase refrigerant in the return internal conduit 37 in the upstream heat receiver 11 passes through the return internal passage opening 36 provided in the partition wall 34 to the return internal conduit 37 in the downstream heat receiver 11. Supplied. The subsequent operation is the same as that in the most upstream heat receiver 20.

The total opening area of the openings 38 of the return internal pipes 37 in each heat receiver 11 is configured to be the smallest in the most upstream heat receiver 20 and increase as the downstream heat receiver 11 is reached. Therefore, since the total opening area of the most upstream heat receiver 20 is small, the liquid phase refrigerant hardly flows out from the opening 38 of the return internal pipe 37 in the most upstream heat receiver 20. Further, since the total opening area becomes larger as the downstream heat receiver 11 is reached, the liquid phase refrigerant is more likely to flow out from the opening 38 of the return internal pipe 37 as the downstream heat receiver 11 is reached. Thereby, in the downstream heat receiver 11, dryout is suppressed.

As described above, the total opening area of the openings 38 of the return internal pipe 37 in each heat receiver 11 is configured to be the smallest in the most upstream heat receiver 20 and increase as the downstream heat receiver 11 is reached. Yes. Thereby, the dryout in the downstream heat receiver 11 by the side of the return path 6 is suppressed. In other words, the cooling device 1 does not need to fill the heat receiver 11 with an excessive amount of liquid-phase refrigerant, can form a thin liquid-phase refrigerant layer in the heat receiver 11, and has high cooling performance. .

Further, the number of openings 38 of the return internal pipe 37 in each heat receiver 11 may be the smallest in the most upstream heat receiver 20 and may increase as the downstream heat receiver 11 is reached. As a result, the number of openings 38 of the return internal conduit 37 in the most upstream heat receiver 20 is the smallest, so that the liquid-phase refrigerant flows out from the opening 38 of the return internal conduit 37 in the most upstream heat receiver 20. Hateful. Further, since the number of the opening portions 38 increases as the downstream heat receiver 11 is reached, the liquid phase refrigerant is more likely to flow out from the opening portion 38 of the return internal pipe 37 as the downstream heat receiver 11 is formed. Thereby, in the downstream heat receiver 11, dryout is suppressed.

As described above, the number of openings 38 in each heat receiver 11 may be the smallest in the most upstream heat receiver 20 and may increase as the number of downstream heat receivers 11 increases. Thereby, the dryout in the downstream heat receiver 11 by the side of the return path 6 is suppressed. In other words, the cooling device 1 does not need to fill the heat receiver 11 with an excessive amount of liquid-phase refrigerant, can form a thin liquid-phase refrigerant layer in the heat receiver 11, and has high cooling performance. .

As described above, since the cooling device according to the present invention has high cooling performance, it cools electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), an insulated gate bipolar transistor (IGBT), and a diode. It is useful as a cooling device.

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Fin part 3 Heat receiving part 4 Heat radiating part 5 Heat radiating path 6 Return path 7 Cooling water supply path 8 Cooling water return path 11 Heat receiver 15 1st heat receiving plate 16 2nd heat receiving plate 19 Fixing screw hole 20 Maximum Upper heat receiver 21 Most downstream heat receiver 22 First fin 23 Second fin 24 Return internal path 25 Radiation internal path 28 First heating element group 29 Second heating element group 30 Inlet 31 Outlet 32 Partition Plate 33 Opening 34 Partition wall 35 Heat dissipation internal path opening 36 Return internal path opening 37 Return internal conduit 38 Opening 43 First heating element 44 Second heating element 45 Third heating element 50 Electronic device 51 Case

Claims

In the cooling device that cools the heating element by the phase change of the refrigerant,
A circulation path for the refrigerant formed by sequentially connecting a heat receiving section, a heat radiation path, a heat radiation section, and a return path;
The heat receiving part is
The front and back are horizontally long rectangular parallelepiped shapes with the largest area,
A heat receiving plate in which a plurality of the heating elements are installed on at least one of the front surface or the rear surface;
A heat dissipating internal path through which the refrigerant flows, provided above the heat receiving portion;
A return internal path that is provided at a lower portion of the heat receiving section and through which the refrigerant flows;
A fin portion provided between the heat dissipation internal path and the return internal path, and having a plurality of plate-like fins;
An outlet that connects the heat dissipation path and the heat dissipation internal path;
An inlet connecting the return path and the return internal path;
One or more partition walls provided between the front surface and the rear surface of the heat receiving portion so as to be parallel to the fins;
A plurality of heat receivers formed by being surrounded by the partition wall and the inner wall of the heat receiving unit;
In the partition wall, a heat dissipation internal path opening for communicating the heat dissipation internal path of each of the heat receivers,
A return internal path opening for communicating the return internal path of each of the heat receivers in the partition wall;
The inflow port and the outflow port are provided on the same side surface of the heat receiving unit,
The fin protrudes from the heat receiving plate and is provided so that a flow path of the refrigerant formed by a gap between the fins is in the vertical direction.
The amount of heat generated by the heating element installed in the most downstream heat receiving device on the return path side via the heat receiving plate is the amount of heat generated by the heating element installed in the upstream heat receiving device via the heat receiving plate. Smaller cooling device.
The heat receiving part is
A partition plate provided between the return internal path and the fin portion so as to be parallel to the bottom surface of the heat receiving portion,
The cooling device according to claim 1, wherein the partition plate has a plurality of openings.
The heat receiving part is
Provided in the return internal path, comprising a return internal conduit through which the refrigerant flows,
The return internal path opening communicates the return internal pipe line of each of the heat receivers in the partition wall,
The cooling device according to claim 1, wherein the return internal conduit has a plurality of openings.
The cooling device according to claim 2, wherein a total opening area of the openings of the partition plates in each of the heat receivers is the smallest in the most upstream heat receiver and increases as the downstream heat receiver is reached.
4. The cooling device according to claim 3, wherein a total opening area of the openings of the return internal pipe line in each of the heat receivers is the smallest in the most upstream heat receiver and becomes larger as the downstream heat receiver becomes.
The cooling device according to claim 2, wherein the number of the openings of the partition plate in each of the heat receivers is the smallest in the most upstream heat receiver and increases as the downstream heat receiver becomes.
4. The cooling device according to claim 3, wherein the number of the openings of the return internal pipe line in each of the heat receivers is the smallest in the most upstream heat receiver and increases as the downstream heat receiver is increased.
The cooling device according to claim 1, wherein the heating element is installed on the heat receiving plate at a distance from a bottom surface of the heat receiving unit.
An electronic device equipped with the cooling device according to claim 1.