JP2016066652A - Cooling device and electronic equipment having the same mounted therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device capable of cooling a heating body which is installed vertically.SOLUTION: A heat reception portion 3 has a rectangular parallelepiped shape whose front and rear faces 3a and 3b have the maximum areas. The rear face 3b is brought into contact with a heating body 2. Plural fins 9 are provided at narrow intervals from the rear face 3b so that a flow path 9a for working fluid between the fins 9 extends vertically. A partition plate 10 for partitioning the inside of the heat reception portion 3 vertically is provided, and compartments the inside of the heat reception portion 3 into an upper space 11 and a lower space 12. The upper space 11 and the lower space 12 are provided with a feedback path connection port 13 and a heat radiation path connection port 14.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cooling device for an electronic device in which electronic components such as a central processing unit (CPU), a large scale integrated circuit (LSI), and an insulated gate bipolar transistor (IGBT) are mounted, and an electronic device in which the electronic device is mounted. .

  Conventionally, this type of cooling device has the following configuration.

  That is, as shown in FIG. 5, the conduit portion 130 of the casing 112 is adjacent to the evaporator portion 132 in which the refrigerant boils by the heat of the inverter 108 that is a heating element, and the evaporator portion 132 in the conduit portion 130. And a circulation part 134 through which the refrigerant circulates directly from the inlet 114 toward the outlet 116. The evaporator part 132 is provided with a plurality of fins 140 protruding from the bottom wall part 120 toward the flow part 134, and the refrigerant flows through the gaps between the plurality of fins 140. The refrigerant flow velocity v in the evaporator section 132 is slower than the refrigerant flow velocity V in the circulation section 134 (see, for example, Patent Document 1).

JP2013-016589A

  In the cooling device disclosed in Patent Document 1, since the inverter 108 as a heating element is installed horizontally, the housing 112 is filled with the refrigerant and protrudes from the bottom wall portion 120 toward the circulation portion 134. The refrigerant flows through the gaps between the plurality of fins 140.

  When the casing (cooling device) having such a configuration is installed vertically, that is, when the inverter 108 that is a heating element is installed vertically, when the refrigerant flows, the inverter whose liquid level is the heating element. There is a problem that the inverter 108 which is a heating element cannot be cooled because it is located below the upper end of the 108.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object of the present invention is to provide a cooling device that can cool a vertically installed heating element.

  In order to achieve this object, the present invention provides a cooling device that cools a heating element installed in a vertical direction by a phase change of a working fluid, a heat receiving unit including a heat receiving plate on which the heating element is installed, and a heat dissipation path The heat-dissipating part and the return path are connected in order to form a circulation path for the working fluid, and the heat receiving part has a rectangular parallelepiped shape with a front surface and a rear surface having a maximum area, the rear surface is in contact with the heating element, and the rear surface The plurality of fins are erected so that the flow path of the working fluid between the fins is vertical, and a return path connection port is provided at the lower part of the side surface parallel to the fins, and a heat radiation path connection port is provided at the upper part of the side surface. And providing at least one partition plate for partitioning the inside of the heat receiving portion in the vertical direction, dividing the inside of the heat receiving portion into a plurality of spaces, and providing the return path connection port and the heat dissipation path connection port in the plurality of spaces, respectively. It is a cooling device according to claim to, thereby is to achieve the intended purpose.

  As described above, the cooling device of the present invention is a cooling device that cools a heating element installed in a vertical direction by a phase change of a working fluid, a heat receiving unit including a heat receiving plate on which the heating element is installed, a heat radiation path, and a heat radiation unit. The return path is connected in order to form a circulation path for the working fluid, and the heat receiving portion has a rectangular parallelepiped shape with a front surface and a rear surface having a maximum area, the rear surface is brought into contact with the heating element, and a plurality of the heat receiving portions are formed from the rear surface. The fin is erected so that the flow path of the working fluid between the fins is vertical, and has a return path connection port at a lower portion of a side surface parallel to the fin, and a heat radiation path connection port at an upper portion of the side surface, At least one partition plate for partitioning the inside of the heat receiving portion in the vertical direction is provided, the inside of the heat receiving portion is divided into a plurality of spaces, and each of the plurality of spaces has the return path connection port and the heat dissipation path connection port. A cooling device for the symptoms.

  When the heating element is installed in the vertical direction, when the working fluid flows, the liquid level is located below the upper end of the heating element, and according to the present invention, the heating element cannot be cooled. By dividing into a plurality of upper and lower spaces with the partition plate, the distance from the liquid surface to the upper end of the fin is shorter than when not divided into the upper and lower spaces, so that a heat transfer area through the fins due to the liquid phase of the working fluid can be secured. Therefore, the cooling capacity can be secured.

  Therefore, it is possible to provide a cooling device that can cool a vertically installed heating element.

Schematic of an electronic device equipped with the cooling device of Embodiment 1 of the present invention The block diagram which shows the external appearance of the heat receiving part of the cooling device The perspective view which saw through the inside of the heat receiving part of the cooling device (A) The front view which saw through the inside of the heat receiving part of the cooling device, (b) The block diagram which shows the AA cross section of (a) (A) The front view which saw through the inside of the 1 step | paragraph type heat receiving part of the cooling device, (b) The front view which looked through the inside of the 2 step | paragraph type heat receiving part of the cooling device Configuration diagram of conventional cooling system

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic diagram of an electronic device on which the cooling device according to Embodiment 1 of the present invention is mounted.

  As shown in FIG. 1, the electronic device 50 includes a power semiconductor element that serves as a heating element 2 and a cooling device 1 in a case 51.

  The cooling device 1 includes a heat receiving part 3 for cooling the heating element 2 and a heat radiating part 4, and the heat receiving part 3 and the heat radiating part 4 are connected by a heat radiating path 5 and a return path 6. With this configuration, the inside of the cooling device 1 becomes a sealed space, and although not shown in FIG. 1, the cooling device 1 is depressurized and sealed with a working fluid that is a refrigerant. As the working fluid, pure water, ethanol, chlorofluorocarbons, fluorinated solvents and the like are used.

  The cooling device 1 also includes a fan 7 for finally radiating the heat transported by the refrigerant to the heat radiating section 4 to the outside air, and a backflow preventing section for preventing the backflow of the working fluid on the heat receiving section 3 side of the return path 6. 8 is provided.

  Further, as shown in FIG. 1, the heat dissipation path 5 is divided into a heat dissipation path 5 a and a heat dissipation path 5 b immediately after exiting the heat receiving part 3, and the return path 6 immediately before entering the heat receiving part 3, It is divided into 6b under the return path.

  Next, a description will be given with reference to FIGS.

  As shown in FIG. 2, the heat receiving portion 3 has a rectangular parallelepiped shape in which the front surface 3 a and the rear surface 3 b have the maximum area, and the rear surface 3 b is in contact with the heating element 2 as shown in FIG. 1.

  As shown in FIG. 3, a plurality of fins 9 are provided from the rear surface 3b at narrow intervals so that the flow path 9a of the working fluid between the fins 9 is in the vertical direction.

  A partition plate 10 for partitioning the inside of the heat receiving portion 3 in the vertical direction is provided, the inside of the heat receiving portion 3 is divided into an upper space 11 and a lower space 12, and a return path connection port 13 and a heat radiation path connection port 14 are provided in each space. Yes.

  Specifically, the lower side of one side surface 11a parallel to the fins of the upper space 11 is connected to the return path upper connection port 13a connected to the return path 6a, and the upper side of the side surface 11b facing the one side surface 11a is connected to the heat dissipation path 5a. There is a connection port 14a on the heat dissipation path to be connected, and a lower part of one side surface 11a parallel to the fin 9 in the lower space 12 is opposed to the lower return path connection port 13b connected to the lower return path 6b and one side surface 11a. A heat radiation path lower connection port 14b connected to the heat radiation path lower 5b is provided on the upper side of the side surface 11b.

  In this embodiment, the return path connection port 13 and the heat dissipation path connection port 14 are provided on different side surfaces, but the return path connection port 13 and the heat dissipation path connection port 14 may be provided on the same side surface. Labor saving of piping work can be expected.

  Further, as shown in FIG. 4A, the vertical distance h1 between the upper end 9b and the top surface 11c of the fin 9 in the upper space 11 and the vertical distance h2 between the lower end 9c and the bottom surface 11d are The distance h1 on the upper end side is longer than the distance h2.

  Next, the basic mechanism of the cooling device 1 having the above configuration will be described with reference to FIGS.

  The cooling device 1 encloses a working fluid (hereinafter referred to as a refrigerant) that is a refrigerant after decompressing the inside, and the inside of the cooling device 1 becomes a saturation pressure of the refrigerant according to the external temperature by the action of the refrigerant. . The heat of the heating element 2 is transmitted to the refrigerant through the rear surface 3b of the heat receiving portion 3 and the fins 9, and the refrigerant changes from the liquid phase to the gas phase, whereby the heating element 2 is cooled. The refrigerant vaporized in the heat receiving unit 3 passes through the heat dissipation path 5 and moves to the heat dissipation unit 4, is cooled by the fan 7, is liquefied again, becomes a liquid phase refrigerant, and returns to the heat receiving unit 3 through the return path 6.

  In this way, the refrigerant is vaporized in the heat receiving part 3, the vaporized refrigerant passes through the heat radiation path 5 and is liquefied in the heat radiation part 4, and the liquefied refrigerant passes through the return path 6 and is supplied again into the heat receiving part 3. The heating element 2 is cooled by repeating the cycle.

  In the present embodiment, a plurality of plate-like fins 9 protruding from the rear surface 3 b are provided adjacent to and in parallel on the rear surface 3 b in contact with the heating element 2. Thereby, the heat received by the rear surface 3b from the heating element 2 can be dissipated from the wide surface of the fin 9 and the heat can be transmitted to the refrigerant, so that the heat of the heating element 2 can be efficiently transmitted to the refrigerant. .

  Further, as shown in FIG. 4A, the vertical distance h1 between the upper end 9b and the top surface 11c of the fin 9 in the upper space 11 and the vertical distance h2 between the lower end 9c and the bottom surface 11d are The distance h1 on the upper end side is longer than the distance h2.

  From the viewpoint of securing the heat transfer area of the fin 9, it is preferable that the distance h <b> 2 is short as long as it does not hinder the flow of the refrigerant flowing into the heat receiving unit 3 from the connection port 13 a on the return path. In order to allow the refrigerant to flow evenly through the path 9a, a part of the upper space 11 formed by the distance h1 needs to play a header role, and the distance h1 is preferably longer than the distance h2.

  Next, the multi-stage structure (two-stage system in this embodiment) that divides the heat receiving section 3 into a plurality of upper and lower spaces (in this embodiment, the upper space 11 and the lower space 12) by the partition plate 10 is a feature of the present application. The effect of will be described in comparison with a one-stage system in which the partition plate 10 is not provided. Here, the heating element 2 is provided in the heating element contact surface region 15 indicated by a broken line with respect to the heat receiving portion 3.

  In the case of the one-stage type, as shown in FIG. 5 (a), the refrigerant region in the vertical direction in the heat receiving section 3 is from the bottom to the liquid phase refrigerant region 16, the gas phase / liquid phase refrigerant mixed region 17, and the gas phase refrigerant region. 18, and the liquid level in the heat receiving portion 3 is the upper surface of the liquid phase refrigerant region 16.

  The gas-phase / liquid-phase refrigerant mixed area 17 has a configuration in which the interval between the fins 9 is narrowed, so that when the bubble of the vapor rising to the vicinity of the liquid level leaves the liquid surface and rises between the fins 9, the liquid refrigerant is lifted together. The regions where the heating element 2 can be cooled are the gas-phase / liquid-phase refrigerant mixed region 17 and the liquid-phase refrigerant region 16, and the gas-phase refrigerant region 18 is not effective for cooling, resulting in insufficient cooling capacity. It becomes.

  When the upper space 11 and the lower space 12 are two-stage spaces having substantially the same volume, as shown in FIG. 5B, the gas-phase refrigerant area 18 that is not effective for cooling disappears, and the vertical direction in the heat receiving section 3 is eliminated. The refrigerant region is composed of a liquid phase refrigerant region 16 and a gas phase / liquid phase refrigerant mixed region 17 from the bottom.

  Here, the height of the liquid-phase refrigerant region 16 in the case of the single-stage type is approximately twice the height of the two-stage type liquid-phase refrigerant region 16, and the height of the gas-phase / liquid-phase refrigerant mixed region 17 is almost the same. It is the same.

  That is, in the present embodiment, the refrigerant region in the vertical direction in the heat receiving portion 3 in the case of a predetermined calorific value of the heating element 2 is shown, and when the calorific value increases, the gas phase / liquid phase refrigerant The height of the mixed area 17 is reduced, and a gas-phase refrigerant area 18 that is not effective for cooling is generated even in the two-stage type. Therefore, the refrigerant area in the vertical direction in the heat receiving unit 3 is the liquid-phase refrigerant area 16, gas-phase / liquid This can be achieved by increasing the number of stages, such as a three-stage type and a four-stage type, so as to be configured by the phase refrigerant mixed region 17.

  Further, in the present embodiment, the case where the upper space 11 and the lower space 12 are two-stage spaces having substantially the same volume has been described, but the height of the liquid refrigerant region 16 is different between the upper space 11 and the lower space 12. Further, it is possible to cope with the generation of the gas-phase refrigerant region 18 by increasing the space where the height of the liquid-phase refrigerant region 16 is higher.

  As described above, when the heating element is installed in the vertical direction, by dividing it into a plurality of upper and lower spaces by the partition plate, the distance between the liquid surface and the upper end of the fin becomes shorter than when not divided into the upper and lower spaces, Since the heat transfer area through the fins by the liquid phase of the refrigerant can be secured, the cooling capacity can be secured, and a cooling device that can cool the vertically installed heating element can be provided.

  As described above, in the cooling device according to the present invention, when the heating element is installed in the vertical direction, the distance between the liquid surface and the upper end of the fin is not divided into the upper and lower spaces by dividing the heating element into a plurality of upper and lower spaces by the partition plate. Since the heat transfer area through the fins by the liquid phase of the refrigerant can be ensured by being shorter than the case, the cooling capacity can also be ensured, so that it is useful as a cooling device for electronic devices and the like.

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Heat generating body 3 Heat receiving part 3a Front surface 3b Rear surface 4 Heat radiating part 5 Heat radiating path 5a Above heat radiating path 5b Under heat radiating path 6 Upper end 9c Lower end 10 Partition plate 11 Upper space 11a, 11b Side surface 11c Top surface 11d Bottom surface 12 Lower space 13 Return path connection port 13a Return path upper connection port 13b Return path lower connection port 14 Heat dissipation path connection port 14a Heat dissipation path upper connection port 14b Heat-dissipation path lower connection port 15 Heating element contact surface region 16 Liquid phase refrigerant region 17 Gas phase / liquid phase refrigerant mixed region 18 Gas phase refrigerant region 50 Electronic device 51 Case

Claims (3)

In the cooling device for cooling the heating element installed in the vertical direction by the phase change of the working fluid,
A heat receiving part provided with a heat receiving plate for installing the heating element, a heat radiation path, a heat radiation part, and a return path are connected in order to form a circulation path for the working fluid,
The heat receiving part is
A rectangular parallelepiped shape having a maximum front surface and rear surface, the rear surface is brought into contact with the heating element, and a plurality of fins are erected from the rear surface so that the flow path of the working fluid between the fins is vertical. A return path connection port at the lower part of the side surface parallel to the fin, and a heat dissipation path connection port at the upper part of the side surface;
At least one partition plate for partitioning the heat receiving portion in the vertical direction is provided, the heat receiving portion is divided into a plurality of spaces, and each of the plurality of spaces has the return path connection port and the heat dissipation path connection port. A characteristic cooling device. 2. The cooling device according to claim 1, wherein the upper end and the lower end of the fin, and the distance in the vertical direction to the opposing side surfaces or partition plate are longer on the upper end side than on the lower end side. An electronic apparatus comprising the cooling device according to claim 1.

Images