JP2015185708A - Cooling device and data center having the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable reduction of the temperature of condensed working fluid and enhancement of cooling performance in a cooling device for cooling a rack type server.SOLUTION: A heat receiving part 12, a heat radiation passage 13, a heat radiation part 15, a feedback passage 14, and the heat receiving part 12 are successively connected in this order to form an annular circulation passage in which working fluid 17 is accommodated. In a cooling device 4 configured so that a check valve 21 is provided at the upstream of the heat receiving part 12, the heat radiation part 15 has a rectangular parallelepiped heat radiation case 16, a partition plate 33 for partitioning the inside of the heat radiation case 16 into right and left parts, and a liquefaction chamber 34 and a cooling water chamber 35 which are disposed at the right and left sides of the partition plate 33. In the liquefaction chamber 34, plural first heat radiation fins 38 each having plural openings 38a are provided in the up-and-down direction of the partition plate 33, and the first heat radiation fins 38 are configured to be inclined upwards from the partition plate 33 side.

Description

  The present invention relates to a cooling device and a data center including the same.

  In a power conversion circuit of a large power consumption electronic device or an electric vehicle, a large current of several tens of amperes flows through an electronic component such as a CPU or a semiconductor switching element, so that a large amount of heat is generated in this portion.

  Therefore, conventionally, electronic components have been cooled by a cooling device using a loop heat pipe as in Patent Document 1, for example.

  Hereinafter, the loop heat pipe shown in Patent Document 1 will be described with reference to FIG.

  As shown in FIG. 8, the loop heat pipe includes a loop circuit 103 that includes a rising pipe 101 and a down pipe 102 separately, a heat medium 112 that is a working fluid sealed in the loop circuit 103 under vacuum, and a loop circuit 103. And a heating unit 113 positioned below the riser pipe 101 and a lower part in the loop circuit 103, and a heat in the loop circuit 103. And a check valve 107 that limits the circulation direction of the medium 112.

  Here, when heat is generated in the electronic component brought into contact with the heating unit 113, the generated heat is transmitted to the heating unit 113, and heat is applied to the heat medium 112 circulating in the heating unit 113 to vaporize.

  The circulation direction is restricted by the check valve 107, and the vaporized heat medium 112 rises up the ascending pipe 101, is led to the cooler 105, is cooled, condenses, and liquefies. In addition, the heat applied by the heating unit 113 is released here.

  The heat medium 112, which has released heat by the cooler 105 and liquefied, descends the downcomer 102 and circulates again to the heating unit 113 via the check valve 107.

JP 61-038396 A

  In such a conventional cooling device, a heat exchange pipe 111 for cooling is inserted into the cooler 105, and water is supplied to the heat exchange pipe 111 as a coolant, but it is vaporized. There is a problem that the contact probability between the heat medium 112 and the heat exchange pipe 111 is low, and the cooling capacity of the cooler 105 is low.

  Further, for the purpose of cooling the electronic component, it is necessary to lower the temperature of the heat medium 112 condensed by releasing heat from the cooler 105, and it has been required to lower the temperature of the condensed heat medium 112.

  Therefore, the present invention aims to reduce the temperature of the condensed heat medium (hereinafter referred to as working fluid) and increase the cooling capacity.

  In order to achieve this object, the present invention is a cooling device that cools a rack-type server including a plurality of electronic devices having electronic components in a housing, and includes a heat receiving part, a heat radiation path, a heat radiation part, a return path, The heat receiving part is connected in order to form a circulation path in which the working fluid is stored in an annular shape, and the heat receiving part is a cooling device having a check valve upstream of the heat receiving part. The part is configured to be divided into one liquefaction chamber and the other cooling water chamber by dividing the inside of the heat radiating case left and right with a partition plate. The liquefaction chamber is provided with a first radiating fin having a plurality of openings or notches and a first connecting portion to the heat radiating path on the upper side and a second connecting portion to the return path on the lower side. A plurality of the first radiating fins are provided in the vertical direction of the partition plate, and the first radiating fin is inclined upward from the partition plate side. Further, the cooling water chamber is provided with a cooling water inlet and a cooling water outlet, and a plurality of second paths for separating a path from the cooling water inlet side to the cooling water outlet side into a plurality of parallel paths in the cooling water chamber. The cooling device is characterized in that two radiating fins are provided on the cooling water chamber side of the partition plate so as to be orthogonal to the first radiating fins, thereby achieving the intended purpose.

  As described above, the present invention is a cooling device that cools a rack-type server including a plurality of electronic devices having electronic components in a housing. The heat receiving portion, the heat radiating path, the heat radiating portion, the return path, and the heat receiving portion are sequentially arranged. The cooling unit is configured to be connected to form a circulation path in which a working fluid is stored, and the heat receiving unit is provided with a check valve upstream of the heat receiving unit. The inside is divided into right and left by a partition plate and separated into one liquefaction chamber and the other cooling water chamber. The liquefaction chamber has a first connection portion to the heat radiation path upward, and the return path. And a plurality of first radiating fins having a plurality of openings or notches are provided in the vertical direction of the partition plate, the first radiating fins facing upward from the partition plate side. The configuration is slanted. Further, the cooling water chamber is provided with a cooling water inlet and a cooling water outlet, and a plurality of second paths for separating a path from the cooling water inlet side to the cooling water outlet side into a plurality of parallel paths in the cooling water chamber. Since the two radiating fins are provided on the cooling water chamber side of the partition plate so as to be orthogonal to the first radiating fins, the temperature of the condensed working fluid can be lowered and the cooling capacity can be increased.

  That is, the vaporized working fluid flowing from the first connection portion side to the heat dissipation path to the second connection portion side to the return path in the liquefaction chamber of the radiator is downward from above in the liquefaction chamber. Proceeding from the first connecting portion side to the second connecting portion side through the openings of the plurality of first radiating fins and the gap between the tip portion of the first radiating fin and the inner wall of the radiating case. It becomes.

  Further, the cooling water flowing from the cooling water inlet side to the cooling water outlet side in the cooling water chamber of the radiator is cooled from the cooling water inlet side to the cooling water outlet by the plurality of second radiating fins in the cooling water chamber. It progresses to the side in a state separated into a plurality of parallel paths.

  Therefore, heat transfer from the working fluid and the cooling water to the first and second radiation fins is effectively performed in the liquefaction chamber and the cooling water chamber of the radiator.

  And since the opening or notch of the 1st radiation fin inclined upward from the partition plate side is not provided in the partition plate vicinity, the working fluid which contacted the 1st radiation fin and was cooled and condensed is the 1st It flows to the partition plate side according to the inclination of the radiating fin and accumulates in the vicinity of the partition plate.

  At this time, since the partition plate is cooled in the cooling water chamber by the second radiating fin cooled by the cooling water, the working fluid retained in the vicinity of the partition plate is cooled to a temperature lower than the condensation temperature.

  After that, the condensed working fluid further accumulates, and when the water level exceeds the lower end of the opening or notch of the first radiating fin, the condensed working fluid falls on the first radiating fin immediately below the opening or notch. Then, it flows toward the partition plate according to the inclination of the first heat radiation fin and accumulates in the vicinity of the partition plate.

  By repeating this operation from the first radiating fin on the uppermost stage to the first radiating fin on the lowermost stage, the condensation accumulated on the bottom surface of the liquefaction chamber falls from the opening or notch of the first radiating fin on the lowermost stage. The working fluid flows to the return path at a temperature lower than the condensation temperature.

  Moreover, since the clearance of the inner wall facing the 1st radiation fin and the partition plate of a radiation case is provided, the vaporized working fluid which flowed into the liquefaction chamber from the 1st connection part side is this clearance gap and the 1st radiation fin. It is possible to flow through both the opening and the notch, and the pressure loss can be reduced.

  In the present invention, since the outer periphery of the partition plate is welded to the inner surface of the radiator case, the degree of sealing in the liquefaction chamber can be maintained high, and the negative pressure in the circulation path in which the working fluid is stored can be maintained. The refrigerant can be continuously circulated by the amount of heat of the semiconductor switching element.

Schematic diagram of a data center provided with a cooling device for cooling the rack type server according to the first embodiment of the present invention. (A) Side view of a cooling device that cools the rack type server, (b) Rear view of the cooling device that cools the rack type server (A) Side view of inner cooling loop of cooling device for cooling same rack type server, (b) Configuration diagram showing AA cross section of FIG. (A) Internal perspective plan view of heat radiating part of cooling device for cooling same rack type server, (b) Configuration diagram showing BB cross section of FIG. 4 (a) (A) Inside transparent side view detail view of heat radiating part of cooling device for cooling same rack type server, (b) Configuration diagram showing CC section of FIG. 5 (a), (c) A in FIG. 5 (b) Part detail drawing, (d) The block diagram which shows the DD cross section of FIG.5 (b) (A) Inside transparent side view detail drawing of the other thermal radiation part of the cooling device which cools the same rack type server, (b) The block diagram which shows the EE cross section of Fig.6 (a) (A) The internal block diagram of the heat radiating part of the cooling device for cooling the rack type server, (b) The side view showing the manufacturing method of the heat radiating fin of the heat radiating part of the cooling device for cooling the rack type server, (c) The rear view which shows the manufacturing method of the radiation fin of the thermal radiation part of the cooling device which cools a rack type server, (d) The side view which shows the manufacturing method of the other thermal radiation fin of the thermal radiation part of the cooling device which cools the rack type server Schematic showing a conventional cooling device

(Embodiment 1)
FIG. 1 is a schematic diagram of a data center 1 in which a plurality of rack servers 2 are accommodated as rack units. The rack-type server 2 has a housing 22 (FIG. 2) provided with openings on the front side and the back side, and a plurality of electronic devices provided inside the housing 22 and perpendicular to the racks in the vertical direction. 3 is provided with the operation panel and the display unit facing the front side. On the back side, wirings and power lines for connecting the electronic devices 3 to each other or an external device are provided.

  Note that not all electronic devices have an operation panel or a display unit. A plurality of rack-type servers 2 are installed in the data center 1 and are called an electronic computer room, a server room, etc. as a whole.

  As shown in FIG. 2, the cooling device 4 according to the present embodiment includes an outer cooling loop 5 and a plurality of inner cooling loops 6. The outer cooling loop 5 includes an outdoor cooling tower 7, an outward water cooling pipe 8, and water cooling heat exchange. This is a water cooling cycle in which the refrigerant is circulated by sequentially connecting the unit 9 and the return water cooling pipe 10.

  That is, the refrigerant 11 is water, and the forward water cooling pipe 8 and the return water cooling pipe 10 connect the water cooling heat exchange unit 9 and the outdoor cooling tower 7 here. The water-cooling heat exchanging unit 9 is provided on the back side 23 of the housing 22, the two headers 24 a and 24 b, the cooling water inlet pipe 25 a connected to the heat radiating part 15 of the inner cooling loop 6, and the cooling water outlet pipe 25 b. (FIG. 3), and flexible pipes 26a and 26b connecting the headers 24a and 24b, the cooling water inlet pipe 25a, and the cooling water outlet pipe 25b.

  FIG. 3A is a side view of the inner cooling loop 6 of the cooling device 4 that cools the rack type server 2 according to the first embodiment of the present invention, and FIG. 3B is AA in FIG. It is sectional drawing. As shown in FIG. 3, the heat receiving part 12, the heat radiation path 13, the return path 14, and the heat radiation part 15 of the inner cooling loop 6 are provided in the case 3 a together with the electronic device 3. Further, the heat radiating portion 15 is connected to the outer cooling loop 5 outside the case 3a via a cooling water inlet pipe 25a and a cooling water outlet pipe 25b. The heat radiation path 13 and the return path 14 connect the heat receiving part 12 and the heat radiation part 15.

  And the heat receiving part 12, the heat radiation path | route 13, the heat radiation part 15, and the return path 14 are connected in order, the circulation path through which the working fluid 17 circulates is formed, and the heat of the heat receiving part 12 is moved to the heat radiation part 15. A check valve 21 is provided on the connection side of the return path 14 and the heat receiving part 12, that is, between the heat radiating part 15 and the heat receiving part 12 in the circulation path.

  The atmospheric pressure in the circulation path is determined by the working fluid 17 to be used. For example, when the working fluid 17 is water, it is often set lower than the atmospheric pressure.

  Hereinafter, a detailed configuration of each unit will be described.

  As shown in FIG. 3, the heat receiving part 12 is box-shaped and provided vertically. An electronic component 19 (for example, a CPU), which is a heating element, is attached to the side surface of the heat receiving unit 12 in a state where it can conduct heat. The heat receiving unit 12 transmits heat from the electronic component 19 to the working fluid 17. Further, one end of the heat dissipation path 13 and the return path 14 is connected to the side surface of the heat receiving portion 12.

  FIG. 4A is an internal perspective view of the planar portion of the heat radiating portion of the cooling device that cools the rack type server according to the first embodiment of the present invention as viewed from above, and FIG. 4B is B in FIG. 4A. -B sectional view, FIG. 5A is a detailed view of an internal see-through side surface of the heat radiating portion, and FIG. 5B is a CC cross sectional view of FIG. 5A of the heat radiating portion.

  As shown in FIGS. 4 to 5, the heat radiating portion 15 that releases the heat of the working fluid 17 is a cuboid-shaped heat radiating case 16, a partition plate 33 that partitions the inside of the heat radiating case 16 left and right, and liquefies to the left and right of the partition plate 33. The chamber 34 and the cooling water chamber 35 are arranged.

  The liquefaction chamber 34 is provided with a first connection part 36 to the heat dissipation path 13 on the upper side and a second connection part 37 to the return path 14 on the lower side. 38 (seven in this embodiment) are provided in the vertical direction of the partition plate 33. The first heat radiating fin 38 has a plurality of openings 38a (9 in the present embodiment).

  In addition, the cooling water chamber 35 is provided with a cooling water inlet 39 and a cooling water outlet 40, and in this cooling water chamber 35, the path from the cooling water inlet 39 side to the cooling water outlet 40 side is a plurality of parallel paths. A plurality of second radiating fins 41 to be separated are provided on the cooling water chamber 35 side of the partition plate 33, and the outer periphery of the partition plate 33 is welded to the inner surface of the radiating case 16.

  The first radiating fins 38 are integrated with the surface of the partition plate 33 on the liquefaction chamber 34 side by welding, and the second radiating fins 41 are integrated with the surface of the partition plate 33 on the cooling water chamber 35 side by welding. ing.

  The first radiating fins 38 are inclined upward from the partition plate 33 side (θ in FIG. 5C), and the second radiating fins 41 are arranged substantially perpendicular to the first radiating fins 38. Is arranged. Here, θ is preferably 5 to 45 °.

  Further, as shown in FIG. 5B, in order to secure a flow path for the working fluid 17 from the first connection portion 36 to the second connection portion 37 in addition to the plurality of openings 38 a of the first radiating fins 38. The inclined tip portion of the first radiating fin 38 is disposed away from the inner wall of the radiating case 16.

  The second radiating fins 41 are separated from the radiating case 16 in order to secure a chamber space on the cooling water inlet 39 side and the cooling water outlet 40 side in the cooling water chamber 35 so as not to prevent the cooling water 29 from entering and exiting. Are arranged.

  In the above configuration, the cooling action of the electronic component 19 will be described from the inner cooling loop 6.

  As shown in FIG. 3, the inner cooling loop 6 includes a heat receiving part 12, a heat radiation path 13, a heat radiation part 15, and a feedback path 14, and a working fluid 17 (for example, water) flows through the inner cooling loop 6. Below, the working fluid 17 is demonstrated as water.

  During normal operation, water up to the liquid level 20 (water level h) indicated by the wavy line in the heat dissipating section 15 in FIG. 4B is accumulated on the bottom surface of the liquefaction chamber 34.

  When the rack type server 2 shown in FIG. 1 is started, a large current flows through the electronic component 19 and heat generation starts rapidly. Then, in response to the heat, the water in the heat receiving section 12 shown in FIG. 3 suddenly boils and vaporizes, and vigorously flows into the liquefaction chamber 34 of the heat radiating section 15 through the heat dissipation path 13. At this time, due to the presence of the check valve 21, the water in the heat receiving portion 12 does not go in the direction of the return path 14.

  As shown in FIGS. 4 to 5, the vaporized water, that is, the steam that has flowed into the upper portion of the liquefaction chamber 34 from the first connection portion 36, is in contact with the first radiating fin 38 at the uppermost stage, The plurality of openings 38 a of the heat radiating fins 38, the gaps between the inclined tips of the first heat radiating fins 38 and the inner wall of the heat radiating case 16 pass through the first radiating fins 38 directly below.

  At this time, a part of the steam that has contacted the first radiating fins 38 becomes condensed water, which flows toward the partition plate 33 according to the inclination of the first radiating fins 38, and the condensed water that has not dropped at the plurality of openings 38 a It collects in the rain gutter-shaped water storage part 38b formed by the partition plate 33 and the first radiation fins 38.

  Here, in FIG. 5 (b), the steam flow 17 a passing through the plurality of openings 38 a of the first radiating fin 38 is indicated by a solid arrow, the inclined tip end portion of the first radiating fin 38 and the inner wall of the radiating case 16. The steam flow 17b passing through the gap between the two is indicated by a dashed arrow.

  The vapor that has passed through the gaps between the plurality of openings 38a of the first radiating fin 38, the inclined tip of the first radiating fin 38 and the inner wall of the radiating case 16 is the second tier from the top. The first radiation fin 38 passes through the openings 38a of the first radiation fin 38 and the gap between the inclined tip of the first radiation fin 38 and the inner wall of the radiation case 16 while being in contact with the first radiation fin 38. Toward the heat radiation fin 38.

  At this time, a part of the steam that has contacted the first radiating fin 38 in the second stage from the top also becomes condensed water and flows toward the partition plate 33 according to the inclination of the first radiating fin 38 and falls at the plurality of openings 38a. Condensed water that does not exist accumulates in the rain gutter-shaped water storage portion 38 b formed by the partition plate 33 and the first radiating fins 38.

  Thus, the steam that has flowed from the first connection portion 36 into the upper portion of the liquefaction chamber 34 contacts the first radiating fins 38 from the uppermost stage toward the lowermost stage, and a part thereof becomes condensed water. It accumulates in the rain gutter-shaped water reservoir 38b.

  When the water level of the condensed water accumulated in the water storage portion 38b becomes higher than the lowermost end of the plurality of openings 38a of the first radiating fins 38, the overflowed condensed water is separated from the lower surfaces of the first radiating fins 38 from the openings 38a. 33, it falls to the water storage section 38b directly below.

  In this way, the condensed water sequentially overflows from the water storage portions 38b of each stage, and finally accumulates on the bottom surface of the liquefaction chamber 34 to form the water level h in FIG. Is maintained.

  As shown in FIG. 5B, the first radiating fin 38 in the lowermost stage is submerged below the normal water level h, but this configuration leads to the return path 14 from the second connecting portion 37. Water can be further reduced below the condensation temperature.

  On the other hand, as shown in FIG. 5 (d), the cooling water that has flowed from the cooling water inlet pipe 25a through the cooling water inlet 39 into the cooling water chamber 35 enters the plurality of second spaces from the chamber space 39a on the cooling water inlet 39 side. The heat radiation fins 41 flow almost uniformly, and flow from the chamber space 40a on the cooling water outlet 40 side through the cooling water outlet 40 to the cooling water outlet pipe 25b.

  At this time, the cooling water cools the second radiation fins 41 and also cools the partition plate 33 and the first radiation fins 38 integrated by welding.

  The steam that has flowed into the liquefaction chamber 34 contacts the surface of the first radiating fin 38 cooled in this way and condenses to become condensed water, accumulates in the water storage portion 38b of each stage, and overflows in stages. However, the water level finally accumulates on the bottom surface of the liquefaction chamber 34 and maintains the water level h during normal operation.

  Here, as shown in FIGS. 4B and 5, the first radiating fins 38 are the same in each step, and the openings 38 a are arranged at the same position in each step.

  Since the steam flowing into the upper part of the liquefaction chamber 34 from the first connection part 36 has a horizontal vector, it hardly passes through the openings 38a arranged at the same position in each stage from top to bottom. However, when it passes through the openings 38a of the first radiation fin 38 in the second stage from the bottom, it is almost condensed water.

  In this way, the condensed water retained in the water storage section 38b is cooled to a temperature lower than the condensing temperature by contacting the partition plate 33 cooled by the cooling water, and the water level h accumulated on the bottom surface of the liquefaction chamber 34 is further reduced. The condensed water is also cooled by the lowermost first heat dissipating fin 38 that is submerged, and becomes a lower temperature. In the present embodiment, the case where the plurality of openings 38a are provided in the first radiating fin 38 has been described. However, as shown in FIG. The steam flowing into the upper portion of the liquefaction chamber 34 from the first passage can pass near the tip of the first radiating fin 38 and near the inner wall of the liquefaction chamber 34, and the tip of the first radiating fin 38 and the inner wall of the radiating case 16 can be passed. Even if there is no gap between them, it is possible to achieve a pressure loss equivalent to that when a plurality of openings 38a are provided.

  Next, a method of integrating the first radiating fin 38 and the second radiating fin 41 with the partition plate by welding will be described with reference to FIG. Here, Cu, Al, SUS, or the like can be used as the material of the first radiating fins 38 and the second radiating fins 41. However, when the working fluid 17 is water, Cu is preferable. FIG. 7A is an internal configuration diagram showing a state in which the first radiating fin 38 is welded to the upper part of the partition plate 33 and the second radiating fin 41 is separately welded to the lower part in order.

  FIG. 7B shows a plurality of L-shaped cross-section fins as shown in the figure as the first heat radiating fins 38, rollers are used as electrodes, and an AC voltage is applied to the rollers and the partition plate 33, for example. It shows a construction method in which the central part of the short side is integrated by seam welding in which welding is continuously performed with a roller.

  FIG. 7C shows a case where the fin shape is formed in a square wave shape, and it is easier to fix the fins and reduce the number of welding operations compared to the plurality of fins shown in FIG.

  In addition, when the 1st radiation fin 38 and the 2nd radiation fin 41 are not integrated with a partition plate by welding, integration by screwing is also possible, but when the thermal resistance of a connection surface is considered, it is integrated by welding. Is preferable.

  Next, the cooling action of the outer cooling loop 5 that cools the cooling water 29 that passes through the cooling water pipe 32 and exchanges heat with the working fluid 17 will be described with reference to FIG.

  The cooled forward cooling water 28 is sent from the outdoor cooling tower 7, and is divided into a plurality of heat radiating portions 15 from the header 24 a of the water-cooling heat exchanger 9 through the outgoing water cooling pipe 8, and then merges at the header 24 b to return water cooling pipe Cycle to 10.

  At this time, the cooling water 29 that has received the heat from the vaporized working fluid 17 flowing through the cooling water pipe 32 in the heat radiating section 15 becomes the return cooling water 30, passes through the return water cooling pipe 10, and the outdoor cooling tower 7. Carried to. Then, the heat from the heat radiating unit 15 is released to the outside air 31, and the return path cooling water 30 is cooled to the outside air temperature level.

  The backward cooling water 30 cooled by the outdoor cooling tower 7 becomes the outward cooling water 28, and the outward cooling water 28 is sent again to the water-cooling heat exchange unit 9, and heat is taken from the heat radiating unit 15 of the inner cooling loop 6. By such circulation, the electronic device 3 is continuously cooled.

  Further, as shown in FIG. 2B, the cooling water 29 flowing in parallel to the plurality of heat radiating portions 15 has the same flow path pressure loss in the path from the header 24a to the heat radiating portion 15 to the header 24b. Thus, the cooling water 29 having a uniform flow rate flows into each heat radiating portion 15. As a result, any heat radiating portion 15 of the water-cooled heat exchanging portion 9 has the same cooling performance.

  As described above, in the data center including the cooling device 4 for cooling the rack type server according to the embodiment of the present invention, the heat taken from the heat radiation part 15 of the inner cooling loop 6 shown in FIG. As shown, it is discharged from the outdoor cooling tower 7 to the outside air 31. Therefore, the indoor temperature rise due to the exhaust heat of the cooling device 4 can be prevented, and an increase in power consumption is suppressed as the entire data center 1 including air conditioning.

  As described above, the partition plate 33 that partitions the inside of the heat radiating case 16 to the left and right, the liquefaction chamber 34 and the cooling water chamber 35 on the left and right of the partition plate 33, and the first radiating fins 38 and the partition plate 33 are formed. Condensed water is retained in the reservoir for a predetermined time, and the first radiating fin 38 in the lowermost stage is submerged below the normal water level h of the condensed water, so that the condensed water retained on the bottom surface of the liquefaction chamber 34 is After cooling to a temperature lower than the condensation temperature, it will flow to the return path. This decrease in the temperature of the condensed water in the return path has the effect of automatically lowering the saturated vapor pressure (saturated vapor temperature) in the liquefaction chamber 34 and the heat receiving unit 12, and consequently increases the cooling capacity of the heat receiving unit 12. Is possible.

  The cooling device according to the present invention is a cooling device that cools a rack-type server including a plurality of electronic devices having electronic components in a housing. The heat receiving unit, the heat radiation path, the heat radiation unit, the return path, and the heat reception unit are sequentially arranged. The cooling unit is configured to be connected to form a circulation path in which a working fluid is stored, and the heat receiving unit is provided with a check valve upstream of the heat receiving unit. The inside is divided into right and left by a partition plate and separated into one liquefaction chamber and the other cooling water chamber. The liquefaction chamber has a first connection portion to the heat radiation path upward, and the return path. And a plurality of first radiating fins having a plurality of openings or notches are provided in the vertical direction of the partition plate, the first radiating fins facing upward from the partition plate side. In the cooling water chamber A cooling water inlet and a cooling water outlet are provided, and in the cooling water chamber, a plurality of second radiating fins for separating a path from the cooling water inlet side to the cooling water outlet side into a plurality of parallel paths are provided on the partition plate. The cooling water chamber is provided so as to be orthogonal to the first heat dissipating fins, and is useful for cooling electronic devices in a data center and semiconductor switching elements in an inverter circuit of an electric vehicle.

DESCRIPTION OF SYMBOLS 1 Data center 2 Rack type server 3 Electronic equipment 3a Case 4 Cooling device 5 Outer cooling loop 6 Inner cooling loop 7 Outdoor cooling tower 8 Outward water cooling pipe 9 Water cooling heat exchange part 10 Return water cooling pipe 11 Refrigerant 12 Heat receiving part 13 Heat radiation path 14 Return Path 15 Heat radiation part 16 Heat radiation case 17 Working fluid 17a Steam flow 17b Steam flow 19 Electronic component 20 Liquid level 21 Check valve 22 Housing 23 Back side 24a Header 24b Header 25a Cooling water inlet pipe 25b Cooling water outlet pipe 26a Flexible Pipe 26b Flexible pipe 28 Outbound cooling water 29 Cooling water 30 Return path cooling water 31 Outside air 32 Cooling water piping 33 Partition plate 34 Liquefaction chamber 35 Cooling water chamber 36 First connection portion 37 Second connection portion 38 First radiation fin 39 Cooling water inlet 40 Cooling water outlet 41 Second radiating fin

Claims (4)

A cooling device that cools a rack-type server equipped with a plurality of electronic devices having electronic components in a housing. It operates in a ring by connecting a heat receiving part, a heat radiating path, a heat radiating part, a return path, and the heat receiving part in order. In the cooling device having a configuration in which a circulation path in which a fluid is stored is formed, and the heat receiving unit is provided with a check valve upstream of the heat receiving unit,
The heat dissipation part is
The heat dissipation case is divided into left and right with a partition plate and separated into one liquefaction chamber and the other cooling water chamber.
In the liquefaction chamber,
A first connection portion to the heat dissipation path is provided above, a second connection portion to the return path is provided below, and a first heat dissipation fin having a plurality of openings or notches is provided in the vertical direction of the partition plate. Multiple in
The first heat radiating fin is inclined upward from the partition plate side,
In the cooling water chamber,
A cooling water inlet and a cooling water outlet are provided, and in the cooling water chamber, a plurality of second radiating fins for separating a path from the cooling water inlet side to the cooling water outlet side into a plurality of parallel paths are provided on the partition plate. A cooling device provided on the cooling water chamber side so as to be orthogonal to the first radiation fin. The first heat dissipating fin has a plurality of openings, and a gap is provided between a tip portion of the first heat dissipating fin and an inner wall facing the partition plate of the heat dissipating case. The cooling device described. The first heat dissipating fin is integrated with the liquefaction chamber surface of the partition plate by welding, and the second heat dissipating fin is integrated with the cooling water chamber surface of the partition plate by welding. The cooling device according to 1. A data center comprising a plurality of rack-type servers and comprising the cooling device according to any one of claims 1 to 3.

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