JP5193403B2 - Waste heat socket - Google Patents

Description

  The present invention relates to a heat exhaust socket in which a heat diffusion module for cooling electronic components such as a semiconductor integrated circuit, a light emitting element, and a power device is mounted.

  Electronic parts such as semiconductor integrated circuits, LED elements, and power devices are used in electronic equipment, industrial equipment, and automobiles. These electronic components are mounted on an electronic board mounted on the housing. At this time, a semiconductor integrated circuit including a central processing unit (hereinafter referred to as “CPU”) is often mounted on an electronic board after being mounted on a socket (see, for example, Patent Document 1). Such a socket only connects the semiconductor integrated circuit and the electronic substrate by an electrical signal. On the other hand, an electronic component such as a semiconductor integrated circuit is a heating element that generates heat due to a current flowing inside. If the heat generation of the heating element exceeds a certain temperature, there is a problem that the operation cannot be guaranteed, which adversely affects other parts and the housing, and as a result, the performance of the electronic device or the industrial device itself may be deteriorated.

  As described above, the socket only electrically connects the electronic component and the electronic board, and cannot cool the heat generated by the electronic component. For this reason, in the conventional electronic substrate, in order to cool the electronic component, a heat sink is erected on the surface of the electronic component (for example, see Patent Document 2).

Alternatively, the surface of the electronic component may be a heat pipe that combines a heat receiving portion that takes heat away from the electronic component, a transport portion that transports heat from the heat receiving portion, and a heat radiating portion that dissipates the transported heat by fins. (See, for example, Patent Document 3).
JP 2008-234836 A JP 2006-237366 A JP 2004-37001 A

  When a heat sink is erected on an electronic component as in Patent Document 2, a large mounting space is required in the vertical direction of the electronic substrate. If the electronic device with the built-in electronic substrate is an industrial device or a stationary electronic device (for example, a desktop personal computer), it can occupy a large mounting space in the vertical direction of the electronic substrate, but the electronic device is small and thin. In the case of a device (for example, a portable terminal, a notebook personal computer, etc.), there is no room for such mounting space.

  Alternatively, even a stationary electronic device requires high-density mounting, so it is difficult to mount a heat pipe in the vertical direction of the electronic substrate. Furthermore, although the electronic devices of the same genre are different in the components mounted on the electronic substrate between the stationary device and the portable device, there is a demerit that increases the manufacturing process.

  In addition, when a heat pipe having a spread in the planar direction as in Patent Document 3 is attached to an electronic component, the shape and structure thereof are determined in advance, and thus there is a problem that the shape and structure does not match the electronic substrate. sell. Not only the heat pipe but also a metal heat spreader having a flat plate shape is attached to the electronic component, and if the shape and structure of the heat spreader are determined in advance, the shape and structure of the electronic substrate cannot be flexibly supported.

  Alternatively, when a metal plate member is mounted on an electronic component after the electronic substrate is manufactured, it is necessary to shape the plate member in accordance with the shape and structure of the electronic substrate. Even in this case, there is a problem of increasing the manufacturing process.

  Also, heat pipes that diffuse heat by vaporizing and condensing encapsulated refrigerant are often superior to plate members and heat sinks made only of metal to take heat away from electronic components that are heating elements. . However, since it is necessary to enclose a refrigerant in the heat pipe, there is a problem that the outer shape and size cannot be shaped according to the shape and structure of the electronic substrate after the heat pipe is manufactured.

  On the other hand, heat pipes are often better than metal plate members for diffusing heat, but not only for diffusing heat, but also for dissipating heat to the outside air. The members are often excellent. In particular, the capacity of the heat pipe can be maintained if the area covers the electronic component and the surrounding area, but the heat pipe of a size that covers a further area beyond this area has an increased thermal diffusion efficiency due to the increase in size. Sometimes it gets worse. There are a wide variety of electronic parts that need to be cooled and electronic boards on which electronic parts are mounted, and it is difficult to manufacture a wide variety of heat pipes that can be adapted to all of them. Further, depending on the characteristics, shape, and size of the electronic component, the member that performs intensive heat diffusion can be variously changed.

  In addition, in the electronic component mounted on the electronic board, more heat is generated in the exchange portion of the electrical signal with the socket and the electronic board than in the electronic component itself. For this reason, it is necessary to diffuse the heat generated from the electronic component with a planar spread.

  Thus, a cooling device that matches a wide variety of electronic components and electronic substrates requires an optimal combination of a heat diffusion module having excellent concentrated heat diffusion characteristics and a plate member having excellent heat dissipation characteristics.

  However, the conventional techniques have the following problems (1) to (5).

  (1) When a heat sink is used, the electronic board and the vertical mounting space are occupied.

  (2) An integrated cooling device provided with a heat receiving portion and a heat radiating portion having a predetermined shape cannot be applied to various electronic substrates.

  (3) Preparing a heat diffusion module having a large size in advance does not allow flexible handling of various electronic substrates.

  (4) Afterwards, when only a metal plate is mounted on an electronic component so as to correspond to the shape and structure of the electronic substrate, the thermal diffusion characteristics are weak and the cooling capacity is inferior. Furthermore, the manufacturing process is increased.

  (5) When a metal plate is mounted on an electronic component, the burden on heat transfer from the electronic component is large, and the burden on the metal plate that dissipates heat is large.

  In particular, heat diffusion module bodies that diffuse heat intensively (metal heat spreaders, heat pipes that use refrigerant, liquid cooling jackets, etc.) are available in multiple types according to the electronic parts whose size and heat generation are determined by standards and types. The expansion of the size is sufficient. On the other hand, a heat radiating member that widely dissipates the diffused heat depends on the shape and structure of the electronic board rather than the electronic component. Therefore, a standardized electronic component (for example, a CPU, the size of a certain part number CPU is determined) Unlike the CPU, which is used only for a wide variety of electronic devices), a wide variation is required in the shape and size of the heat dissipation member. This is because there are various electronic boards to be mounted even with the same electronic component. For this reason, in order to solve the problems in the above problems (2) to (5), a heat diffusion module (this size is easy to determine in advance) that performs intensive heat diffusion from an electronic component that is a heating element, It is required to optimally combine with a heat radiating member that radiates the diffused heat (a wide variety of sizes are required).

  In view of such a problem, an apparatus that efficiently performs cooling while flexibly responding to a variety of shapes and structures of electronic devices, electronic substrates, and electronic components to be mounted is (A) concentrated from a heating element. It is necessary to flexibly combine the members that are good at each of thermal diffusion, (B) efficient and wide-spreading of diffused heat.

  The present invention solves the problems (1) to (5) above, while flexibly and optimally combining a heat diffusion module that excels in heat diffusion and a heat radiating part that dissipates the diffused heat. An object of the present invention is to provide an exhaust heat socket that can be easily applied to an electronic board.

In view of the above problems, the exhaust heat socket of the present invention has a flat plate-shaped main body portion having a front surface and a back surface to contact a heating element, and a protruding portion protruding from a side surface of the main body portion, and diffuses heat in a planar direction and a vertical direction. This is a heat exhaust socket that is used to mount a heat diffusion module that discharges heat from a heating element that contacts at least one of the front and back surfaces of the heat diffusion module. A mounting portion having an open space penetrating vertically, and a heat radiating portion that physically contacts only the mounting portion and protrudes outward from the side surface of the mounting portion. By mounting the heat diffusion module to be mounted, it comes into contact with at least a part of the front and back surfaces of the protrusion protruding from the main body of the heat diffusion module, and the surface of the heat diffusion module. And the back surface is exposed to the outside by an open space penetrating up and down to cover the outer periphery of the heat diffusion module, and even if the heat diffusion module is mounted in the open space, the heat radiating part does not contact the heat diffusion module. The mounting portion receives the heat diffused from the heating element in the plane direction and the vertical direction by the heat diffusion module from the projecting portion in contact with the heat diffusion module and conducts it to the heat radiating portion, and the heat radiating portion is conducted from the mounting portion. Heat is released to the outside world.

  In the heat exhaust socket of the present invention, a heat diffusion module can be mounted in a planar manner on the surface of an electronic component that is a heating element. For this reason, the mounting volume in the vertical direction of the electronic substrate can be reduced to the minimum. A cooling device that integrates heat diffusion and heat dissipation can be provided simply by mounting the heat diffusion module on the socket.

  In addition, various heat diffusion modules such as heat pipes, heat spreaders, liquid cooling jackets, etc., which can be easily mounted with a pre-standardized shape and size. For this reason, it is possible to realize a cooling device that is combined with the heat radiation portion having various shapes and sizes in accordance with the shape and structure of the electronic substrate in various variations and is flexibly adapted to the shape and structure of the electronic substrate.

  Moreover, a cooling device with different cooling characteristics can be realized simply by replacing the heat diffusion module, and a cooling device that matches the characteristics of the heating element can be easily realized.

  Further, by providing the heat diffusion module and the exhaust heat socket separately, a cooling device based on many variations can be configured on the user side.

A heat exhaust socket according to a first aspect of the present invention has a flat plate-shaped main body portion having a front surface and a back surface with which a heating element is contacted, and a projecting portion protruding from a side surface of the main body portion, and heat is applied in a planar direction and a vertical direction. An exhaust heat socket that is used to mount a diffusing heat diffusion module and exhausts heat from a heating element that contacts at least one of the front and back surfaces of the heat diffusion module. A mounting portion having an open space penetrating vertically that can be mounted and a heat radiating portion that physically contacts only the mounting portion and protrudes to the outside from the side surface of the mounting portion. By attaching the heat diffusion module attached to the heat diffusion module, the heat diffusion module comes into contact with at least a part of the front and back surfaces of the heat diffusion module and protrudes from the main body of the heat diffusion module. And the back surface is exposed to the outside by an open space penetrating up and down to cover the outer periphery of the heat diffusion module, and even if the heat diffusion module is mounted in the open space, the heat radiating part does not contact the heat diffusion module. The mounting portion receives the heat diffused from the heating element in the plane direction and the vertical direction by the heat diffusion module from the projecting portion in contact with the heat diffusion module and conducts it to the heat radiating portion, and the heat radiating portion is conducted from the mounting portion. Heat is released to the outside world.

With this configuration, the heat dissipation socket can be equipped with a heat diffusion module that contacts the heating element. Furthermore, since the heat radiating unit and the heat diffusion module which are separate from the heat diffusion module can be thermally connected, the heat diffused from the heat diffusion module can be cooled. In addition, since the heat diffusion module that is easily standardized and the heat radiating part having flexibility in accordance with the shape and structure of the electronic substrate are combined in various ways, a highly flexible cooling device can be realized.
With this configuration, the heat diffusion module can conduct heat from the outer periphery of the main body portion to the mounting portion. Further, the heat diffusion module is fixed by the mounting portion, and the heat diffusion module and the heat dissipation portion are combined.
With this configuration, the heat diffused by the heat diffusing module is efficiently conducted to the mounting portion (further, the heat radiating portion).
With this configuration, the protruding portion and the mounting portion have planar contact, and the thermal resistance between the protruding portion and the mounting portion is reduced.
With this configuration, the heat taken from the heating element is diffused toward the heat radiating surface and the outer edge, and easily reaches the protrusion. Since the protruding portion is in thermal contact with the mounting portion, the heat that has been diffused and reached by the thermal diffusion module is easily conducted directly to the mounting portion .
With this configuration, the protruding portion can be easily formed and the strength can be secured.

In the waste heat socket according to the second aspect of the present invention, in addition to the first aspect, the mounting portion includes a cooling portion that cools the heat conducted from the heat diffusion module.

  With this configuration, the burden on the heat radiating portion can be reduced.

In the exhaust heat socket according to the fourth aspect of the present invention, the cooling unit includes at least one of a circulation path through which the refrigerant circulates inside the mounting part, a circulation path through which the cold air circulates inside the mounting part, and a Peltier element.

  With this configuration, the burden on the heat radiating portion can be reduced.

In the exhaust heat socket according to the fourth aspect of the present invention, in addition to any of the first to third aspects, the heat radiating portion is a heat radiating plate protruding from the outer edge of the mounting portion.

With this configuration, the heat conducted from the heat diffusion module is efficiently dissipated to the outside air. In the waste heat socket according to the fifth aspect of the present invention, in addition to the fourth aspect, the heat sink protrudes only from a part of the side surface of the mounting portion.

  With this configuration, the exhaust heat socket can be reduced in size.

In the waste heat socket according to the sixth aspect of the present invention, in addition to the fourth or fifth aspect, it can be attached to and detached from the side surface of the mounting portion.

  With this configuration, the heat diffusion module and various heat sinks are combined flexibly.

In the waste heat socket according to the seventh aspect of the present invention, in addition to the sixth aspect , the heat radiating plate is fixed to the mounting portion by at least one of a fixing member and an elastic member.

  With this configuration, the heat radiating plate can be easily and reliably fixed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In addition, the heat pipe in this specification refers to the cooling of the heating element by repeating that the refrigerant sealed in the internal space is vaporized by receiving heat from the heating element and the evaporated refrigerant is cooled and condensed. Means a member, component, apparatus, or device that realizes the function to perform. The word “pipe” is included in the heat pipe, but the pipe as a so-called member is not an essential requirement. The term “heat pipe” is used.

(Embodiment 1)
(Conceptual explanation of heat pipe)
Since the heat diffusion module of the present invention uses the function and operation of the heat pipe, the concept of the heat pipe will be described first.

  The heat pipe encloses a refrigerant inside, and a surface serving as a heat receiving surface is in contact with a heating element such as an electronic component. The internal refrigerant is vaporized by receiving heat from the heating element, and takes the heat of the heating element when vaporized. The vaporized refrigerant moves through the heat pipe. This movement carries the heat of the heating element. The moved and evaporated refrigerant is cooled and condensed on a heat radiation surface or the like (or by a secondary cooling member such as a heat sink or a cooling fan). The refrigerant that has condensed into a liquid recirculates inside the heat pipe and moves to the heat receiving surface again. The refrigerant that has moved to the heat receiving surface is vaporized again and takes the heat of the heating element.

  The heat pipe cools the heating element by repeating the vaporization and condensation of the refrigerant. For this reason, it is preferable that the heat pipe has a vapor diffusion path for diffusing the vaporized refrigerant and a capillary flow path for refluxing the condensed refrigerant.

  The heat pipe has a cylindrical shape and has a structure in which the refrigerant vaporized in the vertical direction is diffused and the refrigerant condensed in the vertical direction is recirculated, and the heat receiving portion in contact with the heating element and the cooling for cooling the refrigerant Some have a structure in which the part is separate and connected by a pipe.

  Heat pipes having these structures are unsuitable when the volume is large (particularly, the volume tends to increase in the vertical direction) and the mounting space is narrow. For this reason, a flat and thin heat pipe is often desired. For this reason, a flat heat pipe has also been proposed. However, in the prior art, it was difficult to construct a flat heat pipe, but by laminating a plurality of thin plates, the laminated plates are provided with notches and through holes, so that a vapor diffusion path is formed in a thin internal space. The inventor has realized that a capillary channel is formed.

(Overview)
First, an overall outline of the heat exhaust socket will be described. 1 and 2 are perspective views of the heat exhaust socket according to Embodiment 1 of the present invention.

  The exhaust heat socket shown in FIG. 1 and the exhaust heat socket shown in FIG. 2 have a difference in whether the heat diffusion module includes a protrusion.

  The exhaust heat socket 1 includes a mounting portion 3 for mounting a heat diffusion module 2 having a flat plate-shaped main body portion 5, and a heat radiating portion 4 for connecting the mounting portion 3 and radiating heat conducted from the heat diffusion module 2. I have. At least a part of the heat diffusion module 2 is brought into thermal contact with the mounting portion 3. Due to this thermal contact, heat is conducted from the heat diffusion module 2 to the mounting portion 3 (and also the heat radiating portion 4). The heat diffusion module 2 is mounted in the open space 13.

  In the heat exhaust socket shown in FIG. 1, the heat diffusion module 2 is composed of a flat plate-shaped main body 5 having no protrusions. The mounting portion 3 only needs to fix at least a part of the outer periphery of the main body 5, and as shown in FIGS. 1 and 2, the entire outer periphery may be fixed, or only a part of the outer periphery may be fixed. Also good. Moreover, since the mounting part 3 should just be able to thermally connect the thermal radiation part 4 and the heat-diffusion module 2, the mounting part 3 and the thermal radiation part 4 may be a separate element, or may be an integral element. good.

  The heat diffusion module 2 diffuses the heat taken from the heating element 12. The diffused heat reaches the outer periphery of the heat diffusion module 2. Since the outer periphery of the heat diffusion module is in thermal contact with the mounting portion 3, the heat diffused by the heat diffusion module 2 is conducted to the mounting portion 3. Since the mounting portion 3 is connected to the heat radiating portion 4, the mounting portion 3 conducts heat to the heat radiating portion 4. The heat radiating part 4 dissipates the conducted heat to the outside air. In this way, the exhaust heat socket 1 can be combined with the mounted heat diffusion module 2 to cool the heating element 12.

  That is, the exhaust heat socket 1 combines the heat diffusion module 2 that diffuses heat concentrated from the heating element 12 and the heat radiating portion 4 that dissipates the conducted heat. In this case, since various heat diffusion modules and the heat radiating part 4 having various shapes (particularly shapes that can be shaped afterwards) can be combined, not only the heating element 12 can be efficiently cooled, but also flexiflex. A highly efficient cooling device (the exhaust heat socket 1 to which the heat diffusion module 2 is attached can be a cooling device capable of cooling the heating element 12).

  When the heat radiating unit 4 directly dissipates heat from the heat generating body 12, the burden on the heat radiating unit 4 is large and the cooling effect is small. By combining the heat diffusing module 2 and the heat radiating section 4, intensive heat diffusion and wide heat dissipation are optimally combined.

  The exhaust heat socket 1 only needs to be able to cool the heating element 12 by mounting the heat diffusion module 2, so the type and shape of the heat diffusion module 2 to be mounted are not selected. The exhaust heat socket 1 can be used as a socket on an extension of the electrical socket of the heating element 12.

  The heat diffusion module 2 may be any member that takes heat away from the heating element 12 and diffuses, such as a heat spreader, a heat pipe, and a liquid cooling jacket.

  A heat spreader is a flat heat diffusion member formed of a material having high thermal conductivity such as metal, and a heat pipe encloses a refrigerant in the internal space as described above, and heat is generated by repeated vaporization and condensation of the refrigerant. The liquid cooling jacket diffuses heat by the movement of the refrigerant moving through the internal space. Both of these take heat from the heating element 12 and diffuse to the outer edge. The heat diffusion module 2 has a function of depriving and diffusing heat from the heating element 12 and has a shape (preferably a flat plate shape) that can be attached to the attachment portion 3. Any of the liquid cooling jackets or any of them may be used.

  Next, the heat-dissipating socket 1 shown in FIG. 2 is mounted with the heat diffusion module 2 having the protruding portion 6 protruding from the main body portion 5.

  The heat diffusion module 2 has a protruding portion 6 protruding from the main body portion 5, and at least a part of the front surface 10 and the back surface 9 of the protruding portion 6 is in thermal contact with at least a part of the front surface and the back surface of the mounting portion 3. To do.

  As shown in FIG. 2, the exhaust heat socket 1 has an open space 13, and the heat diffusion module 2 is mounted in the open space 13. The arrows in FIG. 2 indicate a state where the separate heat diffusion module 2 is mounted in the open space 13. The open space 13 has a shape and size that allows the heat diffusion module 2 to be mounted. When the heat diffusion module 2 is inserted into the open space 13, the heat diffusion module 2 is opened by an elastic body or a fastener. It is fixed inside the space 13. The mounting unit 3 has an open space 13 that matches several types of heat diffusion modules 2 in advance, and the heat diffusion module 2 is mounted in the open space 13. Even when the open space 13 has a size larger than that of the heat diffusion module 2, the mounting unit 3 can mount the heat diffusion module 2 by filling the remaining space with a filler.

  By mounting the heat diffusion module 2 on the mounting portion 3, the heat diffusion module 2 and the mounting portion 3 can be in thermal contact, and the heat diffusion module 2 can conduct heat to the mounting portion 3.

  The mounting portion 3 connects the heat radiating portion 4. Since the heat radiating part 4 is connected to the mounting part 3, the mounting part 3 can conduct heat to the heat radiating part 4. In FIG. 2, the heat radiating unit 4 is connected to the side surface 11 of the mounting unit 3, but the heat radiating unit 4 may be connected to various places such as the front surface and the back surface of the mounting unit 3.

  The heat dissipation part 4 includes a metal plate member and a member formed of a material having high thermal conductivity and heat dissipation characteristics, and dissipates heat that is conducted. Whereas the heat diffusion module 2 is excellent in heat diffusion characteristics, the heat dissipation part 4 is excellent in heat dissipation characteristics.

  Moreover, although it is appropriate that the heat radiation part 4 is formed of a plate member, it may have various variations in accordance with the shape / structure of the electronic substrate, or may be adapted to the shape / structure of the electronic substrate. It may be shaped afterwards. When the heat radiating part integrated with the heat diffusing module is shaped afterwards (cutting or bending), there is a demerit that gives a burden or an impact to the heat diffusing module. Therefore, even when the heat radiating part 4 is shaped, there is no burden or impact on the heat diffusion module.

  Of course, by preparing the exhaust heat socket 1 having a wide variety of heat dissipating sections 4 in advance, variations of the cooling device configured in combination with the heat diffusion module can be easily expanded. In this case as well, it is only necessary to widen the variation of the heat radiating part 4 with less manufacturing cost and manufacturing process than the heat diffusion module 2.

  Next, an outline of the operation of the heat exhaust socket 1 will be described.

  The exhaust heat socket 1 is mounted in accordance with a heating element 12 which is an electronic component mounted on an electronic board.

  The mounting unit 3 mounts the heat diffusion module 2. The heat diffusion module 2 is inserted and fixed in the open space 13 of the mounting portion 3. At this time, the heat diffusion module 2 has a front surface and a back surface, but one of the front surface and the back surface is a heat receiving surface 8 in contact with the heating element 12, and a surface opposite to the heat receiving surface is a heat radiating surface 7. The heat diffusion module 2 is in contact with the heating element at the heat receiving surface 8. At this time, it includes not only direct contact but also indirectly contact if heat conduction is possible. For example, the heat receiving surface 8 comes into contact with the heating element 12 via a thermal bonding agent (thermal grease or a material obtained by adding a filler to thermal grease).

  The heat diffusion module 2 diffuses the heat of the heating element 12 taken from the heat receiving surface in the planar direction and the vertical direction. As a result, the heat diffusing module 2 diffuses the heat taken away from the heating element on the side of the heat radiating surface 7 and particularly on the outer periphery of the heat radiating surface 7. When the heat diffusion module 2 does not have the protruding portion 6, heat is conducted from the side surface of the heat diffusion module 2 to the mounting portion 3. On the other hand, when the heat diffusion module 2 has the protrusion 6, the heat diffused to the protrusion 6 reaches. Since the back surface 9 of the protrusion 6 is in thermal contact with the surface of the mounting portion 3 (direct contact and indirect contact), the protrusion 6 (particularly the back surface 9) conducts heat to the mounting portion 3.

  Since the mounting unit 3 connects the heat radiating unit 4, the mounting unit 3 transfers heat to the heat radiating unit 4. The heat radiating unit 4 dissipates heat to the outside air or a housing of an electronic device. At this time, if the heat radiating part 4 has a large surface area, heat can be efficiently dissipated to the outside air. Furthermore, since the heat radiating part 4 can dissipate heat in various ways according to the shape and structure of the electronic substrate, it is possible to dissipate heat according to the amount of heat of the heating element 12. In this way, by mounting the heat diffusion module 2 on the exhaust heat socket 1, the heating element 12 is cooled by the conduction path between the heat diffusion module 2, the mounting portion 3, and the heat radiating portion 4.

  Here, when the heating element 12 is mounted on one side of the electronic substrate, the heat radiating portion 4 extends only from a part of the side surface of the mounting portion 3 as shown in FIG. Specifically, the heat radiating part 4 extends in a direction having a space margin on the electronic substrate. Alternatively, depending on the shape and structure of the electronic substrate, when the single heat dissipating part 4 cannot be enlarged, the plurality of heat dissipating parts 4 may be extended from each of the side surfaces of the mounting part 3. Alternatively, the heat radiating part 4 may be shaped afterwards in accordance with the shape and structure of the electronic substrate.

  As described above, the heat diffusing module 2 is easily determined to have a certain shape and a certain size according to standards and types, but the heat radiating unit 4 is likely to have various shapes and sizes. Thus, the heat exhaust socket 1 can cool the heat generating body mounted on various electronic boards by combining the heat diffusion module 2 and the heat radiating part 4 in a variety of ways. The cooling device is configured by mounting the heat diffusion module 2 on the exhaust heat socket 1, and this cooling device can cool the heating element 12 by various combinations of the heat diffusion module 2 and the heat radiating unit 4.

  In addition, the state seen from the other surface of the waste heat socket 1 is demonstrated.

  FIG. 3 is a bottom view of the exhaust heat socket according to Embodiment 1 of the present invention. FIG. 4 is a front view of the exhaust heat socket in the first embodiment of the present invention. FIG. 3 shows a state when the heat exhaust socket 1 is viewed from the bottom surface, and FIG. 4 shows a state when the heat exhaust socket 1 is viewed from the top surface.

  As shown in FIG. 3, the heating element 12 is in contact with the heat receiving surface 8 of the heat diffusion module 2. The heat diffusion module 2 diffuses the heat taken from the heat receiving surface 8 to the outer edge as indicated by the arrow. The heat diffused to the outer edge is transmitted to the heat radiating surface 7, which is the opposite surface to the heat receiving surface 8, and is transmitted to the protruding portion 6 that is biased toward the heat radiating surface 7 and protrudes from the outer edge of the main body 5.

  As shown in FIG. 4, since the protruding portion 6 is in thermal contact with the mounting portion 3, the protruding portion 6 conducts the conducted heat to the mounting portion 3. The mounting part 3 conducts heat to the heat radiating part 4 to be connected, and the heat radiating part 4 dissipates heat to the outside air.

  FIG. 5 is a side view of the exhaust heat socket according to the first embodiment of the present invention. FIG. 5 shows a state where the heat diffusion module 2 is mounted on the exhaust heat socket 1 as viewed from the side. A broken line arrow indicates a state in which heat from the heating element 12 is conducted. The heat diffusion module 2 takes heat from the heating element 12 at the heat receiving surface 8. The heat diffusion module 2 diffuses heat in the planar direction and the vertical direction, as indicated by broken line arrows in FIG. For this reason, heat is conducted to the protruding portion 6 protruding from the outer edge of the heat radiating surface 7. Since the back surface 9 of the protruding portion 6 is in contact with the mounting portion 3, the heat reaching the protruding portion 6 is conducted to the mounting portion 3. The mounting portion 3 conducts heat to the heat radiating portion 4 to be connected. The heat radiating part 4 dissipates the conducted heat to the outside air, as indicated by the dashed arrows.

As described above, the heat exhaust socket 1 dissipates the heat of the heating element 12 to the outside air through the heat radiating section 4 by mounting the heat diffusing module 2. Next, details of each section will be described.

(Heat diffusion module)
First, the heat diffusion module will be described.

  FIG. 6 is a perspective view of the heat diffusion module according to Embodiment 1 of the present invention. FIG. 7 is a bottom view of the heat diffusion module according to Embodiment 1 of the present invention.

  6 and 7 both show the thermal diffusion module 2 having the protruding portion 6, the protruding portion 6 may not be provided like the thermal diffusion module 2 shown in FIG. 1.

  FIG. 6 shows the heat diffusion module 2 in which the protrusions 6 protrude from the opposite side surfaces of the main body 5. On the other hand, FIG. 7 shows the heat diffusion module 2 in which the protruding portion 6 protrudes from all side surfaces of the main body portion 5.

  The heat diffusion module 2 is a plate-shaped heat spreader made of a material having high thermal conductivity such as metal, a heat pipe that diffuses heat by vaporizing and condensing the refrigerant enclosed inside, and a heat circulating through the inside. Widely includes members that diffuse heat from the heating element, such as a liquid cooling jacket that diffuses.

  As shown in FIGS. 6 and 7, the heat diffusion module 2 has a flat plate-shaped main body 5 and a protrusion 6 protruding from the main body 5. Moreover, it has the heat receiving surface 8 which is a surface which contacts a heat generating body, and the heat radiating surface 7 which is a surface on the opposite side to a heat receiving surface.

  The main body 5 preferably has a flat plate shape, but the thickness and the outer shape may be arbitrarily determined and may have a curvature. Moreover, although the magnitude | size of the main-body part 5 should just be determined arbitrarily, as an example, the main-body part 5 has a square of 20 mm square or more and 100 mm square or less, and also has thickness of 1 mm or more and 5 mm or less. The size defined in this way is introduced from the size of an electronic component that is a heating element to be cooled, the ease of mounting on a circuit board, and the like. Since the main body 5 has a size that is an example of this, a balance between mounting and cooling can be appropriately achieved.

  The heat diffusion module 2 includes a protruding portion 6 that protrudes from the main body portion 5. The protruding portion 6 may protrude from any position of the main body portion 5, but preferably protrudes from a position where thermal contact with the mounting portion 3 is easy. 6 and 6, the protruding portion 6 has the same surface as the heat radiating surface 7 and protrudes from the side surface of the main body portion 5. Since the heat diffusion module 2 is mounted on the mounting portion 3 that fixes the side surface that is the outer periphery thereof, the protruding portion 6 preferably protrudes from the side surface of the main body portion 5. This is because the protruding portion 6 protrudes from the side surface of the main body portion 5 so that the back surface 9 of the protruding portion 6 is likely to be in thermal contact with the mounting portion 3. Moreover, although the protrusion part 6 has the surface 10, the back surface 9, and the side surface, since the surface 10 or the back surface 9 can contact the mounting part 3 in an area wider than a side surface, the front surface 10 or the back surface 9 is a mounting part. It is preferable that the protruding portion 6 protrudes from the side surface of the main body portion 5, which is a position where it is easy to contact 3.

  Further, when the protruding portion 6 protrudes from the side surface of the main body portion 5, it is preferable that the protruding portion 6 protrudes from a position that is biased toward the heat radiating surface 7 rather than the heat receiving surface 8.

  Alternatively, the protruding portion 6 may protrude along the heat radiating surface 7 so that the heat radiating surface 7 and the surface 10 are the same surface. This shows a structure in which the protrusion 6 is integrated with the heat radiating surface 7 of the main body 5 as shown in FIGS.

  The heat of the heating element 12 diffuses in the vertical direction in addition to the planar direction of the main body 5. In particular, the heat receiving surface 8 is a surface that receives heat from the heating element 12, but since the heat radiating surface 7 is a surface that is in contact with cold outside air, the heat diffused by the main body 5 is directed to the heat radiating surface 7 rather than the heat receiving surface 8. Easy to approach. For this reason, since the protrusion part 6 plays the role which conducts heat to the mounting part 3, it is suitable to be provided in the position close | similar to the thermal radiation surface 7 where heat gathers more easily.

  The protruding portion 6 protrudes from the side surface of the main body portion 5 so that the protruding portion 6 shown in FIGS. Furthermore, the back surface 9 of the protrusion 6 is in surface contact with the surface of the mounting portion 3 to conduct heat. Of course, unlike FIGS. 6 and 7, the protruding portion 6 may protrude from the side surface of the main body 5 in a form that is not flush with the heat radiating surface 7.

  In FIG. 6, the protrusion part 6 protrudes from the two opposing side surfaces of the main-body part 5 which has a square shape. In FIG. 7, the protrusion part 6 protrudes from all the side surfaces of the main-body part 5 which has a square shape. Since the protrusion 6 conducts the heat diffused by the main body 5 to the mounting portion 3, the protrusion 6 may protrude from any position of the main body 5. However, since the protruding portion 6 conducts heat to the heat radiating portion 4 through the mounting portion 3, it is appropriate to protrude in accordance with the position where the heat radiating portion 4 exists. For example, in FIG. 2, the heat radiating part 4 extends from one side surface of the mounting part 3 having a rectangular outer shape. For this reason, the protrusion part 6 should just protrude from the side surface of the main-body part 5 matched with the side surface which this thermal radiation part 4 extends | stretches. However, since the protrusion 6 also plays a role of strengthening the fixing to the mounting portion 3, it is not necessary to match only the extending position of the heat radiating portion 4.

(Heat pipe type heat diffusion module)
Next, the case where the heat diffusion module 2 is a heat pipe having a flat plate shape will be described.

  In addition, even if the heat diffusion module 2 is a metal heat spreader or a heat pipe in which a refrigerant is sealed, there is no difference in that the protrusion 6 is provided and the mounting portion 3 is mounted. Also, the mechanism for transferring the heat taken from the heating element 12 to the heat radiating part 4 via the mounting part 3 to cool the heating element 12 is the same whether it is a heat spreader or a heat pipe.

  Further, the structure and configuration of the protruding portion 6 are the same regardless of whether it is a heat spreader or a heat pipe.

  FIG. 8 is an exploded view of the thermal diffusion module according to Embodiment 1 of the present invention. FIG. 8 shows a heat pipe 30 formed by laminating a plurality of plate members, and shows a configuration in which the plate members constituting the heat pipe 30 are disassembled into a state before lamination. The heat pipe 30 shown in FIG. 8 is an example of the heat diffusion module 2.

  The heat pipe 30 includes a main body portion 5 and a protruding portion 6.

  First, the main body 5 is a part having a function of a heat pipe that cools the heating element by vaporizing and condensing the refrigerant. The main body 5 includes a vapor diffusion path 23 that diffuses the vaporized refrigerant in the planar direction and the vertical direction, and a capillary channel 24 that recirculates the condensed refrigerant in the vertical direction or the vertical / planar direction. As is clear from FIG. 8, the main body 5 is thin and flat. The main body 5 may have various shapes such as a square, a circle, an ellipse, and a polygon.

  The main body 5 includes a flat plate-like upper plate 20, a lower plate 21 facing the upper plate 20, and a single or plural intermediate plates 22 stacked between the upper plate 20 and the lower plate 21. By stacking and joining the upper plate 20, the lower plate 21, and the intermediate plate 22, an internal space 27 in which the refrigerant can be enclosed is formed. The intermediate plate 22 forms a vapor diffusion path 23 and a capillary channel 24.

  The internal space 27 encloses the refrigerant, the vapor diffusion path 23 diffuses the vaporized refrigerant, and the capillary channel 24 circulates the condensed refrigerant.

(Upper plate)
The upper plate 20 will be described.

  The upper plate 20 is flat and has a predetermined shape and area. In addition, you may have a curve and a bending.

  The upper plate 20 is formed of metal, resin, or the like, but is formed of metal having high thermal conductivity or high rust prevention (durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. It is preferred that Further, the upper plate 20 may have various shapes such as a square, a rhombus, a circle, an ellipse, and a polygon.

  In order to form the protruding portion 6, the shape and area of the upper plate 20 may be different from those of the lower plate 21 and the intermediate plate 22. For example, the upper plate 20 may have a protruding portion as compared with the lower plate 21 and the intermediate plate 22. The upper plate 20 may have a larger area than the lower plate 21 and the intermediate plate 22. This protruding portion forms the protruding portion 6.

  It is also preferable that the upper plate 20 has a concave portion 28 that communicates with at least one of the vapor diffusion path 23 and the capillary flow path 24 on one surface thereof that faces the intermediate plate 22. Since the recess 28 communicates with the capillary channel 24, the condensed refrigerant is easily transmitted from the upper plate 20 to the capillary channel 24. Alternatively, since the recess 28 communicates with the vapor diffusion path 23, the vaporized refrigerant easily comes into contact with a large area on the surface of the upper plate 20, and heat dissipation of the vaporized refrigerant is promoted.

  It is also preferable that the upper plate 20 includes a protruding portion and an adhesive portion that are joined to the intermediate plate 22. Although the upper plate 20 is referred to as “upper portion” for convenience, it does not have to physically exist in the upper position, and is not particularly distinguished from the lower plate 21. Further, the upper plate 20 may be a heat receiving surface in contact with the heating element or a heat radiating surface opposite to the heat receiving surface.

  Further, the upper plate 20 includes a refrigerant inlet 30. When the upper plate 20, the intermediate plate 22, and the lower plate 21 are laminated and joined, an internal space 27 is formed. Since the internal space 27 needs to enclose the refrigerant, the refrigerant is enclosed from the inlet 30 after joining the upper plate 20 and the like. The inlet 30 is sealed when the refrigerant is sealed, and the internal space is sealed.

  In addition, a refrigerant | coolant may be enclosed from the inlet 30 after lamination | stacking, and a refrigerant | coolant may be enclosed when the upper board 20, the lower board 21, and the intermediate | middle board 22 are laminated | stacked.

(Lower plate)
The lower plate 21 faces the upper plate 20 and sandwiches one or more intermediate plates 22.

  The lower plate 21 is formed of metal, resin, or the like, but is formed of metal having high thermal conductivity or high rust prevention (durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. It is preferred that Moreover, although it may have various shapes, such as a square, a rhombus, a circle, an ellipse, and a polygon, since the main-body part 5 is formed facing the upper board 20, it is the same shape and area as the upper board 20. Preferably there is.

  However, in order to form the protruding portion 6, the shape and area of the lower plate 21 may be different from those of the upper plate 20 and the intermediate plate 22. For example, the lower plate 21 may have a protruding portion as compared with the upper plate 20 and the intermediate plate 22. This protruding portion forms the protruding portion 6.

  It is also preferable that the lower plate 21 has a concave portion 28 communicating with the vapor diffusion path 23 and the capillary flow path 24 on one surface of the lower plate 21 facing the intermediate plate 22. The recess 28 communicates with the capillary channel 24 so that the condensed refrigerant is easily transmitted from the lower plate 21 to the capillary channel 24. Further, since the recess 28 communicates with the vapor diffusion path 23, the vaporized refrigerant easily comes into contact with the surface of the lower plate 21 over a wide area, and heat dissipation of the vaporized refrigerant is promoted. This is similar to the case where the recess 28 is provided in the upper plate 20.

  The lower plate 21 is referred to as “lower” for convenience, but does not have to physically exist at the lower position, and is not particularly distinguished from the upper plate 20.

  It is also preferable that the lower plate 21 includes a protruding portion or an adhesive portion that is bonded to the intermediate plate 22.

  Further, the lower plate 21 may or may not be in contact with the heating element.

(Intermediate plate)
The intermediate plate 22 is a single plate member or a plurality of plate members. In FIG. 8, the main body 5 has four intermediate plates 22. The intermediate plate 22 is stacked between the upper plate 20 and the lower plate 21.

  The intermediate plate 22 is formed of metal, resin, or the like, but is formed of metal having high thermal conductivity or high rust prevention (durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. It is preferred that Moreover, although it may have various shapes such as a square, a rhombus, a circle, an ellipse, and a polygon, the main body 5 is formed by being sandwiched between the upper plate 20 and the lower plate 21, so that the upper plate 20 and the lower plate It is preferable that it is the same shape as 21. Since the intermediate plate 22 is sandwiched between the upper plate 20 and the lower plate 21, the area of the intermediate plate 22 may be the same as or slightly smaller than the upper plate 20 and the lower plate 21.

  However, the shape and area of the intermediate plate 22 may be different from those of the upper plate 20 and the lower plate 21 in order to form the protruding portion 6. For example, a specific intermediate plate 22 (if there are a plurality of intermediate plates 22, any one or a plurality of intermediate plates) is relative to the upper plate 20, the lower plate 21, and the other intermediate plates 22. You may have the part which protruded. The protruding portion 6 is formed when the protruding portions are laminated to form the main body portion 5. For example, when the upper plate 20, the lower plate 21, and the other intermediate plate 22 have a square with a predetermined angle, the specific intermediate plate 22 has a region that protrudes from a side having the square with the predetermined angle. Suppose that When all of the upper plate 20, the lower plate 21, and the intermediate plate 22 are laminated, the protruding region protrudes from the side surface of the main body 5. The region protruding from the side surface forms the protruding portion 6.

  The protruding portion 6 may be formed by any protrusion of the upper plate 20, the lower plate 21, and the intermediate plate 22.

  Further, the intermediate plate 22 may have protrusions and adhesive portions used when connected to the upper plate 20 and the lower plate 21. In addition, the intermediate plate 22 has an internal through hole 26 having a minute cross-sectional area. The internal through hole 26 forms a capillary channel 24.

  The main body 5 is formed by stacking and joining the intermediate plate 22 between the upper plate 20 and the lower plate 21. The intermediate plate 22 may be singular or plural. However, as will be described later, in order to form the capillary channel 24 having a smaller cross-sectional area, it is preferable that there are a plurality of intermediate plates 22.

(Intermediate plate, vapor diffusion path and capillary flow path)
Next, the vapor diffusion path 23 and the capillary flow path 24 will be described with reference to FIG. FIG. 9 is a front view showing an example of the intermediate plate according to Embodiment 1 of the present invention.

  The intermediate plate 22 forms a vapor diffusion path 23 that diffuses the vaporized refrigerant in at least one of the planar direction and the thickness direction, and a capillary channel 24 that recirculates the condensed refrigerant in the vertical direction or the vertical / planar direction.

  First, the vapor diffusion path 23 will be described.

  The intermediate plate 22 has a notch 25 and an internal through hole 26.

  The notch 25 forms a vapor diffusion path 23. When the intermediate plate 22 is laminated between the upper plate 20 and the lower plate 21, the cutout portion 25 forms a gap. This gap becomes the vapor diffusion path 23.

  Here, the notch 25 is formed toward at least one of the planar direction and the thickness direction of the main body 5, so that the vapor diffusion path 23 also faces at least one of the planar direction and the thickness direction of the main body 5. Formed. For this reason, the vaporized refrigerant diffuses in at least one of the planar direction and the thickness direction. When the lower plate 21 and the upper plate 20 are connected by the notch 25, the refrigerant that is received and vaporized by the lower plate 21 moves in the plane direction and the thickness direction, and the vaporized refrigerant (and heat) is changed. The lower plate 21 reaches the upper plate 20. That is, the vapor diffusion path 23 moves the vaporized refrigerant in both the planar direction and the thickness direction (of course, either one may be used depending on the shape of the vapor diffusion path 23).

  In particular, as shown in FIG. 9, when the notch 25 is formed radially from the center of the intermediate plate 22, the vapor diffusion path 23 is also formed radially from the center of the main body 5. become. Since the heating element is often installed at a substantially central portion of the main body portion 5, the refrigerant receives heat most at the substantially central portion of the main body portion 5. For this reason, the refrigerant | coolant of the center part vicinity of the main-body part 5 vaporizes first. At this time, since the vapor diffusion path 23 is formed radially from the substantially central portion of the main body portion 5, the vaporized refrigerant generated near the center diffuses radially. As a result, the vaporized refrigerant (heat taken away from the heating element) reaches the heat radiating surface opposite to the heat generating element, and is transmitted from the heat radiating surface to the protruding portion 6.

  As described above, the intermediate plate 22 has the notch 25 and the vapor diffusion path 23 extending in at least one of the planar direction and the thickness direction is formed, so that the vaporized refrigerant is flat in the main body 5. It diffuses in at least one of the direction and the thickness direction. As a result, the heat from the heating element diffuses in the main body portion 5 in the plane direction from the center toward the periphery. As a result, even if it is a thin and flat heat pipe, the heat of a heat generating body can be moved efficiently.

  In addition, the notch 25 (namely, vapor | steam diffusion path 23) may be another shape even if it is not radial.

  Since the vapor diffusion path 23 is radial, even if the vaporized refrigerant diffuses in the plane direction, the cooling capacity of the heating element is not sufficient if the refrigerant that has been diffused and cooled and condensed does not recirculate at high speed. The main body 5 has a capillary flow path 24 that efficiently recirculates the condensed refrigerant after diffusing using the entire surface of the main body 5, thereby diffusing at least one of the high planar direction and the thickness direction. (And reflux) performance is realized. Furthermore, the condensed refrigerant can be recirculated with further efficiency by the concave portion 28 communicating with the capillary channel 24. The concave portion 28 also has a role of promoting the reflux of the condensed refrigerant.

  Next, the capillary channel 24 will be described.

  The intermediate plate 22 has an internal through hole 26. The internal through hole 26 is a minute through hole, and forms a capillary channel 24 through which the condensed refrigerant recirculates. When the intermediate plate 22 has a notch 25 as shown in FIG. 9, an internal through hole 26 is formed in a portion other than the notch 25.

  Here, when there is a single intermediate plate 22, the internal through hole 26 provided in the intermediate plate 22 becomes the capillary channel 24 as it is.

  On the other hand, when there are a plurality of intermediate plates 22, only a part of the internal through-holes 26 provided in each of the plurality of intermediate plates 22 overlap, and the cross-sectional area in the planar direction of the internal through-holes 26 overlaps. A capillary channel 24 having a smaller cross-sectional area is formed. Thus, when there are a plurality of intermediate plates 22, the capillary channel 24 having a cross-sectional area smaller than the cross-sectional area of the internal through-hole 26 itself is formed, so that the condensed refrigerant recirculates in the capillary channel 24. Can be more effective. It is because the movement of the liquid by a capillary phenomenon is promoted because the cross-sectional area of the capillary channel 24 is small.

  Here, each of the intermediate plates 22 is provided with a plurality of internal through holes 26. This is because the plurality of internal through holes 26 can form a capillary channel having a plurality of channels.

  The internal through-hole 26 penetrates from the front surface to the back surface of the intermediate plate 22, and the shape thereof may be circular, elliptical, or rectangular. However, since the capillary passage 24 is formed by overlapping a part of the internal through hole 26, the internal through hole 26 is suitably rectangular. This is also suitable from the viewpoint of manufacturing ease.

  The internal through hole 26 may be formed by excavation, pressing, wet etching, dry etching, or the like.

  When there are a plurality of intermediate plates 22, the internal through hole 26 is provided in each of the plurality of intermediate plates 22. Here, since the plurality of intermediate plates 22 are stacked such that only a part of the internal through holes 26 overlap each other, the positions of the internal through holes 26 may be shifted for each adjacent intermediate plate 22. Is appropriate. For example, the position of the internal through-hole 26 in a certain intermediate plate 22 and the position of the internal through-hole 26 in another intermediate plate 22 adjacent to this intermediate plate 22 are such that a part of the cross section of the internal through-hole 26 overlaps each other. It's off. In this way, the position of the internal through hole 26 is shifted for each adjacent intermediate plate 22, so that when the plurality of intermediate plates 22 are stacked, the cross section area of the internal through hole 26 smaller than the cross-sectional area in the plane direction is cut. A capillary channel 24 having an area is formed.

  The capillary channel 24 has a cross-sectional area smaller than the cross-sectional area of the internal through-hole 26 in the planar direction, with a part of the internal through-holes 26 overlapping when the plurality of intermediate plates 22 are stacked. Such holes having a cross-sectional area smaller than the cross-sectional area of the internal through-hole 26 are stacked in the vertical direction of the main body portion 5, and the vertical holes are connected to form a vertical flow path. . Moreover, since it becomes a stepped hole in the vertical direction, a flow path that can flow in the plane direction as well as the vertical direction is formed. The flow path formed in the vertical / planar direction has a very small cross-sectional area, and the condensed refrigerant is circulated in the vertical direction or the vertical / planar direction.

  In addition, when the capillary channel 24 having a smaller cross-sectional area than the internal through hole 26 is formed so that only a part of the internal through hole 26 overlaps, rather than directly processing the capillary channel 24, There is also an advantage that it can be manufactured easily.

  In addition, although the capillary flow path 24 recirculates the condensed refrigerant | coolant, it can also pass the vaporized refrigerant | coolant.

  In addition, the capillary channel 24, the corners of the recesses 28, and the corners of the cutouts 25 are preferably chamfered or provided with R. The cross section of the capillary channel 24 may have various cross sectional shapes such as a hexagon, a circle, an ellipse, a rectangle, and a polygon.

(Protruding part)
The protrusion 6 is formed by any of the upper plate 20, the lower plate 21, and the intermediate plate 22 having a larger area than the others.

  When the upper plate 20 forms the protruding portion 6, the protruding portion 6 protrudes from the side surface of the main body portion 5 in the same plane as the upper plate 20. Depending on the shape of the upper plate 20, the protruding portion 6 protrudes from any side surface of the main body portion 5.

  When the intermediate plate 22 forms the protruding portion 6, the protruding portion 6 protrudes from the middle of the side surface of the main body portion 5. Depending on the shape of the intermediate plate 22, the protruding portion 6 protrudes from any side surface of the main body portion 5.

  When the lower plate 21 forms the protruding portion 6, the protruding portion 6 protrudes from the side surface of the main body portion 5 on the same plane as the lower plate 21. Depending on the shape of the lower plate 21, the protruding portion 6 protrudes from any side surface of the main body portion 5.

  In addition, it is preferable that a protrusion part protrudes from the position biased to the heat radiating surface in a heat receiving surface and a heat radiating surface. This is because the heat diffused from the heat receiving surface needs to be transmitted to the protrusion 6. For this reason, when the lower plate 21 forms a heat receiving surface, the upper plate 20 or the intermediate plate 22 located closer to the upper plate 20 than the lower plate 21 forms the protruding portion 6. When the upper plate 20 forms a heat receiving surface, the opposite is true.

  The protrusion 6 may be formed by bonding and welding another member after the main body 5 is formed.

  Further, the protruding portion 6 may have an internal space and may have a structure in which the vaporized refrigerant is diffused inside. In this case, heat is efficiently transmitted to the protrusion 6. Moreover, in order to reduce the thermal resistance between the protrusion part 6 and the mounting part 3, it is appropriate that the area is large. On the other hand, if the area of the protrusion 6 is large, the heat conduction from the main body 5 is deteriorated or the diffusion of the refrigerant in the protrusion 6 is deteriorated. Therefore, the area of the protrusion 6 is optimal. It is preferable that

(Manufacturing process)
Here, the manufacturing process of the heat pipe will be described.

  The main body 5 is manufactured by laminating and joining the upper plate 20, the lower plate 21, and the intermediate plate 22.

  The upper plate 20, the lower plate 21, and the plurality of intermediate plates 22 (four intermediate plates 22 in FIG. 8) are matched to each other so as to overlap each other at the same position. In addition, the plurality of intermediate plates 22 are adjusted to a positional relationship such that only a part of each of the internal through holes 26 provided in each of the plurality of intermediate plates 22 overlaps.

  At least one of the upper plate 20, the lower plate 21, and the plurality of intermediate plates 22 has a joint protrusion.

  The upper plate 20, the lower plate 21, and the plurality of intermediate plates 22 are laminated after being aligned, and are directly joined and integrated by heat press. At this time, each member is directly joined by the joining projection.

  Here, the direct bonding refers to applying heat treatment while pressing the surfaces of the two members to be bonded together, and firmly bonding the atoms together by an atomic force acting between the surface portions. That is, the surfaces of the two members can be integrated without using an adhesive. At this time, the bonding protrusion realizes strong bonding.

As a condition of direct bonding at a heat press, the press pressure ^is in the range of ^{40kg / cm 2 ~150kg / cm 2} , the temperature is preferably in the range of 250 to 400 ° C..

  Next, the refrigerant is injected through the injection port 30 opened in a part of the upper plate 20 and the lower plate 21. Thereafter, the injection port 30 is sealed to complete the main body 5. The refrigerant is sealed under vacuum or reduced pressure. By being performed under vacuum or reduced pressure, the internal space of the main body portion 5 is in a vacuum or reduced pressure state, and the refrigerant is enclosed. When the pressure is reduced, the refrigerant vaporization / condensation temperature becomes low, and there is an advantage that the refrigerant vaporization / condensation repeats actively.

  The main body 5 is manufactured through the above steps. At this time, the protrusion 6 is also formed because at least one of the upper plate 20, the lower plate 21, and the intermediate plate 22 has a larger area than the other.

  The heat diffusion module 2 is attached to the exhaust heat socket of the present invention and is not an essential component of the present invention.

(Thermal diffusion module that is a heat spreader)
The heat diffusion module 2 may be a heat spreader made of metal or a material having high heat conductivity. In this case, any plate material having various shapes such as a square and a polygon and having a flat plate shape may be used. When the protrusion 6 is provided, the protrusion 6 may be attached to the main body 5 by forming the protrusion 6 on the heat spreader, welding, or bonding by mold shaping.

(Mounting part)
Next, the mounting part 3 will be described.

  The mounting part 3 is an element that connects the heat diffusion module 2 and the heat radiating part 4, and may be a separate element from the heat radiating part 4 or an integral element.

  FIG. 10 is a perspective view of the exhaust heat socket in the first embodiment of the present invention.

  As shown in FIG. 10, the mounting portion 3 has a ring shape that fixes the outer periphery of the heat diffusion module 2. Furthermore, the mounting portion 3 has an open space 13 so that the heat diffusion module 2 can be mounted. The heat diffusion module 2 is fitted into the open space 13. The mounting portion 3 fixes the heat diffusion module 2 fitted in the open space 13 by an elastic body.

  The mounting portion 3 may be formed of various materials such as metal, resin, and alloy. However, since the heat from the heat diffusion module 2 (particularly the protruding portion 6) needs to be conducted to the heat radiating portion 4, heat conduction is performed. It is preferable that the material is made of a material having high properties. Alternatively, in the mounting portion 3, the portion for fixing the heat diffusion module 2 is formed of a heat insulating and lightweight material such as resin, and the portion connected from the protruding portion 6 to the heat radiating portion 4 has high thermal conductivity such as metal. It is also preferable to form it with a raw material.

  The mounting portion 3 fixes the heat diffusion module 2 and transmits heat conducted from the protruding portion 6 to the heat radiating portion 4. At this time, the front surface or back surface of the protrusion 6 is in thermal contact with the surface of the mounting portion. Since it only needs to be in thermal contact, direct contact or indirect contact may be used. Alternatively, contact via a thermal bonding agent (thermal grease or a material obtained by adding a filler to thermal grease) may be used. In addition, it is suitable that the back surface of the protrusion part 6 and the surface of the mounting part 3 are in surface contact. This is because heat is transferred from the protruding portion 6 to the mounting portion 3, and the thermal resistance is reduced by surface contact. The mounting portion 3 receives heat not only from the protruding portion 6 but also from the main body portion 5.

  Moreover, the mounting part 3 should just be able to fix at least one part of the outer periphery of the thermal diffusion module 2, and does not need to be able to fix the whole outer periphery. Further, the mounting portion 3 may fix not only the heat diffusion module but also an electronic component that is a heating element. In this case, the outer periphery of the electronic component and the outer periphery of the heat diffusion module 2 are respectively fixed.

  Note that the mounting portion 3 may have a receptacle corresponding to the protruding portion 6 in order to facilitate surface contact with the protruding portion 6.

  In addition, the mounting portion 3 fixes the heat diffusion module 2 by various means such as fitting, clipping, joining, and adhesion.

(Heat dissipation part)
Next, the heat radiation part 4 will be described.

  The heat radiating part 4 is connected to the mounting part 3 and extends from the mounting part 3. The mounting portion 3 conducts heat from the protruding portion 6 to the heat radiating portion 4, and the heat radiating portion 4 radiates the conducted heat. The heat dissipating part 4 may be extended from the side surface of the mounting part 3, or may be extended from the upper surface or the bottom surface of the mounting part 3.

  As an example, the heat radiating portion 4 may be a heat radiating plate 40 protruding from the outer edge of the mounting portion 3. The heat radiating part 4 shown in FIG. 10 is a heat radiating plate 40 protruding from both side surfaces of the mounting part 3.

  The heat radiating plate 40 is a plate member made of a material having high thermal conductivity such as metal, and has a large surface area, so that the conducted heat can be efficiently dissipated to the outside air.

  As shown in FIG. 10, the heat dissipating part 40 may protrude from two opposite side surfaces of the mounting part 3 having a square shape, may protrude from one side surface, or may protrude from all side surfaces. . The heat radiating plate 40 may protrude from any part of the mounting portion 3, but may be protruded from a part that can be easily extended in accordance with the shape and structure of the electronic substrate.

  It is also preferable that the heat radiating plate 40 is detachable from the mounting portion 3 so that the heat radiating plate 40 can protrude flexibly in accordance with the shape and structure of the electronic substrate. For example, an insertion part such as a slit is provided on the side surface of the mounting part 3, and the insertion part is filled with a thermal bonding agent (a material obtained by adding a filler or the like to thermal grease or thermal grease). The separate heat sink 40 is attached to the mounting part 3 by providing a fixing member or an elastic body. At this time, since the insertion portions are provided on all the side surfaces of the rectangular mounting portion 3, the heat radiating plate 40 is inserted and fixed on the side surface at a position where it can be easily inserted in accordance with the shape and structure of the electronic substrate. Is done. As a result, the flexible heat sink 40 can be installed.

  In FIG. 11, the mounting part 3 which fixes the heat sink 40 with an insertion part is shown. FIG. 11 is an internal structure diagram of the mounting portion according to Embodiment 1 of the present invention.

  The mounting portion 3 includes an insertion portion 41 on the side surface. The insertion part 41 fixes the heat sink 40 inserted by the elastic part 42 while inserting the heat sink 40. Since the heat sink 40 is pressed by the elastic portion 42, the heat sink 40 is securely fixed.

  As described above, since the heat radiating plate 40 is detachable from the mounting portion 3, the heat radiating portion 4 corresponding to the shape and structure of the electronic substrate is formed. Moreover, since the heat sink 40 can be attached to the mounting part 3 afterwards, the mounting part 3 and the heat sink 40 are provided separately, and the user can realize an optimal combination of the mounting part and the heat sink.

  Since the heat sink 40 is a plate member, it has a large surface area and dissipates heat from the surface to the outside air. Here, since the heat sink 40 is a plate member, it can be adjusted to various shapes and sizes. For example, the heat radiating plate 40 can be shaped according to the shape and structure of the electronic substrate and then attached to the mounting portion 3. Alternatively, the heat radiating plate 40 can be bent in accordance with the shape and structure of the electronic substrate and then attached to the mounting portion 3. Since the heat radiating plate 40 is bent or curved, it is possible to fit the shape and structure of the electronic substrate and to improve the heat radiation efficiency.

  FIG. 12 is a side view of the exhaust heat socket in the first embodiment of the present invention. In FIG. 12, the heat sink 40 has a bend. The heat radiating plate 40 having a bend increases the surface area and increases the contact volume with the outside world. As a result, the heat sink 40 can dissipate heat with higher efficiency than when it is not bent. Alternatively, other electronic components present in the extending direction of the heat sink 40 are also avoided.

  Thus, since the heat sink 40 is bent or curved, efficient heat dissipation can be performed while fitting to the shape and structure of the electronic substrate.

  In addition, the heat sink 40 may be curved in a substantially S shape or may be bent more complicatedly. Moreover, although the heat sink 40 should just extend | stretch from at least one part of the side surface of the mounting part 3, the size of the heat sink 40 extended from a certain side surface is large, and the size of the heat sink 40 extended from another side surface is small. Good. These may be determined based on the shape and structure of the electronic substrate. For example, a heat sink 40 having a large size extends in a space where heat dissipation is easy on the structure of an electronic substrate or a housing that stores the electronic substrate, and a heat sink 40 having a small size extends in a space where heat dissipation is not easy. Stretches.

  The heat radiating plate 40 may be in thermal contact with the heat diffusion module 2 and the protrusion 6 via the mounting portion 3, but may be in direct contact with the heat diffusion module 2 and the protrusion 6. Further, in order to dissipate the conducted heat to the outside air, the heat radiating plate 40 may be devised to increase the surface thermal conductivity or enlarge the surface area by making the surface a mesh structure.

  Moreover, when the thermal diffusion module 2 is formed by laminating a plurality of plate members, it is preferable that the thickness of the heat radiating plate 40 is larger than the thickness of the plate members. This is because the efficiency with which the radiator plate 40 dissipates heat is proportional to the area and thickness of the radiator plate. For example, when the heat diffusion module 2 is a heat pipe in which a plurality of plate members are stacked, one of the plurality of stacked plate members may be enlarged and used as a heat sink. In this case, the mounting portion and the heat radiating portion can be omitted, but the performance as a heat radiating plate may be insufficient. Since the heat pipe is required to be thin, the thickness of each laminated plate member is very thin. For this reason, when the board | plate member laminated | stacked is utilized as a heat sink, heat dissipation efficiency is low. This is because the thickness is insufficient.

  On the other hand, since the heat sink 40 which is a separate body from the heat diffusion module 2 can have various thicknesses, it has a degree of freedom to increase the heat dissipation efficiency.

  As described above, the waste heat socket according to the first embodiment can dissipate heat from a heat radiating part that is equipped with a standardized heat diffusing module and is flexible in the shape and structure of the electronic board and has improved heat radiation efficiency. The heating element can be cooled efficiently.

(Embodiment 2)
Next, a second embodiment will be described.

  In the exhaust heat socket in the second embodiment, the mounting unit 3 has a cooling unit that cools the heat from the heat diffusion module 2 by a function other than conduction. Since the mounting unit 3 includes a cooling unit that cools the heat conducted from the heat diffusion module 2, the heat radiation load in the heat radiation unit 4 can be reduced. This is because the temperature of heat conducted from the mounting portion 3 to the heat radiating portion 4 is lowered, so that the heat radiating burden in the heat radiating portion 4 is reduced.

  FIG. 13 is a front view of the exhaust heat socket according to Embodiment 2 of the present invention. The state which looked through the inside of the mounting part 3 is shown.

  The exhaust heat socket 50 includes a mounting portion 3 and a heat radiating portion 4. Here, the mounting portion 3 has a ring shape that fixes at least a part of the outer periphery of the main body portion of the heat diffusion module 2, and further includes a circulation path 51 through which the refrigerant circulates. The circulation path 51 is provided inside the mounting portion 3 and circulates the refrigerant inside the mounting portion 3. The refrigerant can enter and exit from the outside of the mounting portion 3, for example, and the cooled refrigerant is supplied to the circulation path 51. As the refrigerant circulates in the circulation path 51, the heat conducted from the heat diffusion module 2 to the mounting portion 3 is cooled. Since the heat that cannot be cooled is conducted from the mounting portion 3 to the heat radiating portion 4, it is dissipated by the heat radiating portion 4.

  Thus, the heat diffused by the heat diffusion module 2 is dissipated from the heat radiating unit 4 while being cooled by the refrigerant circulation in the mounting unit 3. As a result, the heat diffused by the heat diffusion module 2 is cooled by both the circulation path 51 and the heat radiating unit 4.

  In FIG. 13, the refrigerant circulation path 51 is illustrated as the cooling unit included in the mounting unit 3, but other configurations may be used. For example, the cooling unit may be a circulation path through which cool air circulates or may be a Peltier element. Further, it may be a blow of cool air by a fan, and any member that lowers the temperature of heat conducted from the mounting portion 3 to the heat radiating portion 4 may be used.

  As described above, the exhaust heat socket 50 according to the second embodiment can cool the heat diffused by the heat diffusion module 2 by utilizing the mounting portion 3.

(Embodiment 3)
Next, Embodiment 3 will be described.

  First, a modification of the heat sink will be described.

  FIG. 14 is a side view of the heat exhaust socket according to Embodiment 3 of the present invention. The exhaust heat socket 60 shown in FIG. 14 includes a heat radiating plate 40 extending from opposite side surfaces of the mounting portion 3. The heat radiating plate 40 extends in a substantially S shape. By stretching in a substantially S-shape, it has high deflection resistance. Moreover, since the heat radiation space is increased, the heat radiation efficiency is also increased.

  For example, when the heat radiating plate 40 comes into contact with the housing of the electronic device and radiates heat, vibration from the electronic device is transmitted to the heat radiating plate 40. Even in such a case, the heat radiating plate 40 has a substantially S shape, so that it is resistant to deflection and the deterioration of the heat exhaust socket 60 is prevented.

  Alternatively, as shown in FIG. 15, a configuration in which the heat radiating plate 40 extends from both opposing side surfaces and the area of the heat radiating plate 40 extending from one side surface is larger than the area of the heat radiating plate 40 extending from the other side surface is also suitable. It is. FIG. 15 is a side view of the exhaust heat socket according to the third embodiment of the present invention. As shown in FIG. 15, when the heating element 12 is biased to one side of the heat diffusion module 2, the heat diffused by the heat diffusion module 2 is biased to the position of the heating element 12. This can be dealt with by the large area of the heat sink 40 extending from the side where the heating element 12 is biased. That is, the heat diffusion module 2 diffuses a large amount of heat by the heat radiating plate 40 on the side close to the heating element 12. Since the area of the heat sink 40 on the side close to the heating element 12 is larger than that of the other heat sink 40, it has a high heat dissipation capability.

  In addition, since the heat sink 40 can be attached to the mounting portion 3 afterwards, the heat sink 40 having a large area and the heat sink 40 having a small area may be attached in accordance with the position of the heating element 12.

  In addition, the heat sink 40 does not need to be fixed in space and may be in thermal contact with the inner surface of the housing. By being in thermal contact with the inner surface of the housing, the heat radiating plate 40 can conduct heat to the housing and dissipate heat.

  Moreover, the exhaust heat socket demonstrated in Embodiment 1-3 is mounted in an electronic device with an electronic substrate etc.

  Note that the heat radiation plate 40 may be formed with an electrical line for exchanging electrical signals with an electronic component that is the heating element 12 or an electronic component mounted on the heat diffusion module 2. In this case, the exhaust heat socket enables not only cooling but also electrical connection between the electronic component and the electronic board.

  Next, a modified example of the mounting portion 3 will be described with reference to FIG.

  FIG. 16 is a front view of the exhaust heat socket according to Embodiment 3 of the present invention. The mounting part 3 fixes only the opposite side surface of the main body part 5. Since the role of the mounting portion 3 is to fix the heat diffusion module 2 and to conduct heat from the heat diffusion module 2 to the heat radiating portion 4, depending on the shape of the electronic component or the electronic substrate, the entire outer periphery of the main body portion 5 Instead, only a part of the structure may be fixed. In this case, there are advantages in terms of cost and degree of freedom of mounting.

  Moreover, the mounting part 3 may be a clip member that the heat radiating part 4 clips and fixes the side surface of the heat diffusion module 2 as shown in FIG. FIG. 17 is a schematic diagram of a mounting portion according to Embodiment 3 of the present invention. The clip member 65 is provided at one end of the heat dissipating unit 4, and the heat dissipating unit 4 and the heat diffusion module 2 are thermally connected by the clip member 65 sandwiching the heat diffusion module 2. Since the mounting portion 3 is the clip member 65 as described above, the heat diffusion module 2 can be easily mounted. It is also superior in terms of cost. In addition, there is an advantage that it is easy to cope with the structure and shape of the electronic substrate and electronic device.

  Next, a modified example of the heat diffusion module will be described. FIG. 18 is a side view of the exhaust heat socket according to the third embodiment of the present invention. FIG. 18 shows a state where the inside of the heat diffusion module is seen through.

  The heat diffusion module 2 seals the electronic component 70 that is a heating element and the heat diffusion member 75. That is, the heat diffusion module 2 is a package that integrates an electronic component and a heat diffusion member 75 that diffuses the heat of the electronic component. Since the electronic component 70 is electrically mounted on the electronic substrate 72, it is mounted directly or via a socket. The socket realizes electrical connection between the electronic component 70 and the electronic substrate 72, but the heat diffusion module 2 shown in FIG. 18 also has a role of this electrical socket. For this reason, the exhaust heat socket in which the heat diffusion module is mounted includes two roles of electrical mounting and cooling mounting.

  The heat diffusion module 2 seals the electronic component 70 including the ball grid terminals 73 and the heat diffusion member 75. A surplus space generated when sealing is filled with a filler 71. The thermal diffusion member 75 is a heat spreader or a heat pipe having the function of the thermal diffusion module 2 described in the first and second embodiments. The heat diffusion member 75 is in thermal contact with the mounting portion 3. For this reason, as in the first and second embodiments, the heat diffusing member 75 diffuses the heat taken from the electronic component 70 and conducts the diffused heat to the mounting portion. The heat conducted to the mounting portion 3 is dissipated from the heat radiating portion 4 to the outside air.

  The electronic component 70 includes a ball grid terminal 73 (which may of course be a pin terminal or a lead terminal), and is electrically connected to the ball grid terminal 74 provided on the electronic substrate 72. For this reason, the electronic component 70 sealed by the heat diffusion module 2 can be electrically connected to the electronic substrate 72.

  As described above, the heat diffusion module 2 also includes the electronic component 70 that is a heating element, thereby realizing an electronic substrate or an electronic device that can reduce the mounting volume and improve the cooling efficiency. The exhaust heat socket shown in FIG. 18 can be widely applied to electronic boards and electronic devices having a cooling function.

  FIG. 19 illustrates an example of such an electronic device. FIG. 19 is a schematic diagram of an electronic device according to Embodiment 3 of the present invention.

  The electronic device 100 is an electronic device that is required to be thin and small, such as a car TV or a personal monitor.

  The electronic device 100 includes a display 101, a light emitting element 102, and a speaker 103. An exhaust heat socket is housed inside the electronic device 100 to realize cooling of the heating element. By using such an exhaust heat socket, cooling of the heating element can be realized without hindering downsizing and thinning of the electronic device.

  As mentioned above, the exhaust heat socket demonstrated in Embodiment 1-3 is an example explaining the meaning of this invention, and includes the deformation | transformation and remodeling in the range which does not deviate from the meaning of this invention.

It is a perspective view of the waste heat socket in Embodiment 1 of this invention. It is a perspective view of the waste heat socket in Embodiment 1 of this invention. It is a bottom view of the exhaust heat socket in Embodiment 1 of this invention. It is a front view of the waste heat socket in Embodiment 1 of this invention. It is a side view of the waste heat socket in Embodiment 1 of this invention. It is a perspective view of the thermal diffusion module in Embodiment 1 of this invention. It is a bottom view of the thermal diffusion module in Embodiment 1 of this invention. It is an exploded view of the thermal diffusion module in Embodiment 1 of this invention. It is a front view which shows an example of the intermediate | middle board in Embodiment 1 of this invention. It is a perspective view of the waste heat socket in Embodiment 1 of this invention. It is an internal structure figure of the mounting part in Embodiment 1 of this invention. It is a side view of the waste heat socket in Embodiment 1 of this invention. It is a front view of the waste heat socket in Embodiment 2 of this invention. It is a side view of the waste heat socket in Embodiment 3 of this invention. It is a side view of the waste heat socket in Embodiment 3 of this invention. It is a front view of the waste heat socket in Embodiment 3 of this invention. It is a schematic diagram of the mounting part in Embodiment 3 of this invention. It is a side view of the waste heat socket in Embodiment 3 of this invention. It is a schematic diagram of the electronic device in Embodiment 3 of this invention.

DESCRIPTION OF SYMBOLS 1 Heat exhaust socket 2 Heat diffusion module 3 Mounting part 4 Heat radiating part 5 Main body part 6 Projection part 7 Heat radiating surface 8 Heat receiving surface 9 Back surface 12 Heating element 13 Open space 20 Upper plate 21 Lower plate 22 Intermediate plate 40 Heat radiating plate

Claims (9)

Used to mount a heat diffusion module that has a flat plate-shaped main body having a front surface and a back surface to contact the heating element, and a protrusion protruding from the side surface of the main body, and diffuses heat in a planar direction and a vertical direction. , An exhaust heat socket for discharging the heat of the heating element that contacts at least one of the front and back surfaces of the heat diffusion module,
The waste heat socket is
A mounting portion having an open space penetrating vertically, wherein the heat diffusion module can be detachably mounted;
A heat dissipating part that physically contacts only the mounting part and protrudes from the side surface of the mounting part;
The mounting portion is in contact with at least a part of the front and back surfaces of the protruding portion protruding from the main body portion of the heat diffusion module by mounting the heat diffusion module mounted in the open space, and the heat Exposing the front surface and the back surface of the diffusion module to the outside by the open space penetrating vertically, covering the outer periphery of the heat diffusion module,
The heat dissipating part does not come into contact with the heat diffusion module even when the heat diffusion module is mounted in the open space.
The mounting portion receives heat diffused from the heating element in the plane direction and the vertical direction by the heat diffusion module from the protrusion that contacts the heat diffusion module and conducts the heat to the heat dissipation portion,
The heat dissipation part is a heat exhaust socket that releases heat conducted from the mounting part to the outside.   The exhaust heat socket according to claim 1, wherein the mounting portion includes a cooling portion that cools heat conducted from the heat diffusion module. The exhaust heat socket according to claim 2 , wherein the cooling unit includes at least one of a circulation path through which the coolant circulates inside the mounting part, a circulation path through which cool air circulates inside the mounting part, and a Peltier element. The exhaust heat socket according to any one of claims 1 to 3 , wherein the heat radiating portion is a heat radiating plate protruding from an outer edge of the mounting portion. The heat dissipation socket according to claim 4 , wherein the heat radiating plate protrudes from only a part of a side surface of the mounting portion. The waste heat socket according to claim 4 or 5 , wherein the heat radiating plate is detachable from a side surface of the mounting portion. The waste heat socket according to claim 6 , wherein the heat radiating plate is fixed to the mounting portion by at least one of a fixing member and an elastic member. The thermal diffusion module;
The exhaust heat socket according to any one of claims 1 to 7, wherein the heat diffusion module is mounted on the mounting portion. An electronic board on which electronic components are mounted;
A heat diffusion module installed in the electronic component;
An electronic device comprising: the waste heat socket according to any one of claims 1 to 8, wherein the heat diffusion module is mounted.

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