CN114340305B

CN114340305B - Driving pump, cold plate assembly, mobile terminal device and electronic system

Info

Publication number: CN114340305B
Application number: CN202111151033.2A
Authority: CN
Inventors: 靳林芳; 吴睿康; 陈奇; 王英先; 刘毅; 陈丘; 王风平; 刘用鹿; 李思杨
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-08-02
Filing date: 2021-09-29
Publication date: 2023-01-13
Anticipated expiration: 2041-09-29
Also published as: WO2023011400A1; CN116438930A; CN114340305A

Abstract

The application provides a drive pump, a cold plate assembly, a mobile terminal device and an electronic system. The impeller of the driving pump is connected with the bearing into a whole, the rotating shaft is connected with the base into a whole, the bearing is in running fit with the rotating shaft, and the bearing can rotate around the rotating shaft. The cold plate assembly comprises a cold plate and a water nozzle connected with the cold plate, and the thickness of the cold plate is not more than 1.5mm. The mobile terminal device comprises the driving pump or the cold plate assembly. The electronic system comprises mobile terminal equipment and a peripheral, wherein the mobile terminal equipment can independently perform liquid cooling heat dissipation, and a tee joint device is arranged in the mobile equipment. The external equipment and the mobile terminal equipment are detachably connected, and when the external equipment and the mobile terminal equipment are connected, the three-way device can communicate the internal liquid cooling pipeline of the mobile terminal equipment with the external liquid cooling pipeline of the external equipment, so that the external equipment and the mobile terminal equipment integrally form a liquid cooling heat dissipation system. The scheme of this application can promote the product property ability of driving pump and cold drawing subassembly to guarantee liquid cooling system's heat dispersion.

Description

Driving pump, cold plate assembly, mobile terminal device and electronic system

Technical Field

The application relates to the technical field of terminal equipment, in particular to a driving pump, a cold plate assembly, mobile terminal equipment and an electronic system.

Background

As the functions of the mobile terminal devices are more and more, the performance is stronger and the heat productivity thereof is also increased sharply. If an effective heat dissipation design is lacked, the temperature of the mobile terminal equipment is too high or too low due to the accumulation of heat or cold, so that the performance of the equipment is reduced and limited, the thermal experience of a user is poor, the reliability of the equipment is reduced, the safety of a battery is ensured, and other adverse effects are caused. Therefore, the heat dissipation design of the mobile terminal not only becomes one of the important bottlenecks in improving the device performance and reliability of the mobile terminal, but also is one of the most concerned indexes of consumers.

However, some components in the heat dissipation system formed by the existing mobile terminal device have poor heat dissipation performance due to product defects, and thus the heat dissipation requirements of the product cannot be met.

Disclosure of Invention

The technical scheme of this application provides a driving pump, cold drawing subassembly, mobile terminal equipment and electronic system, can promote cooling system's heat dispersion through the product design of the part among the optimization cooling system.

In a first aspect, the present disclosure provides a drive pump, which includes a volute, a base assembly, and an impeller assembly; a first pump liquid tank is arranged on the surface of the volute; the base component comprises a base and a rotating shaft, the rotating shaft and the base are connected into a whole, a second pump liquid tank is arranged on the surface of the base, and the second pump liquid tank surrounds the periphery of the rotating shaft; the surface of the base provided with the second pump liquid tank is assembled with the surface of the volute provided with the first pump liquid tank, and the second pump liquid tank and the first pump liquid tank enclose a pump liquid space; the impeller component comprises a bearing and an impeller, and the bearing and the impeller are connected into a whole; the impeller assembly is located between the base and the volute and located in the liquid pumping space, and the bearing is rotatably sleeved on the periphery of the rotating shaft so that the impeller assembly can rotate around the rotating shaft.

In the scheme of this application, through making the pivot and base into an organic whole, make bearing and impeller into the integral type, the size precision of easy control pivot, the degree of beating, axiality and roughness, the axiality and the degree of beating of impeller, the size precision of bearing, the axiality, degree of beating and roughness, the size precision and the roughness of blade, and the size precision in pump liquid space, axiality and roughness, make impeller subassembly and base subassembly after the shaping only need can form the high accuracy through simple and easy self-assembling formula, the cooperation of low noise, need not to additionally use the frock clamp of high accuracy assembly, can promote the rotation precision and the performance of driving pump by a wide margin, thereby make the operational reliability of driving pump obtain promoting, be favorable to promoting liquid cooling system's heat dispersion.

In one implementation manner of the first aspect, the impeller includes an impeller main body and a plurality of blades, the plurality of blades are connected to the periphery of the impeller main body, and every two adjacent blades are arranged at intervals; the bearing is connected with the impeller main body into a whole; the impeller main body and the groove wall of the first pump liquid groove form a first movement fit clearance, and the impeller main body and the groove wall of the second pump liquid groove form a second movement fit clearance, wherein the first movement fit clearance and the second movement fit clearance are both the size along the radial direction of the impeller; each blade and the inner wall of the liquid pumping space form a third movement fit clearance and a fourth movement fit clearance respectively, wherein the third movement fit clearance is the size along the radial direction of the impeller, and the fourth movement fit clearance is the size along the axial direction of the impeller; the first movement fit clearance, the second movement fit clearance, the third movement fit clearance and the fourth movement fit clearance are all 0.1-500 mu m.

The values of the moving seal cavities can be designed according to needs, can be different, or at least two of the moving seal cavities can be the same. The above-mentioned clearance of the impeller assembly with the inner wall of the pumping space is a critical design parameter affecting the performance of the drive pump. By designing the movement fit clearance within the range of 0.1-500 microns, the defects of large friction, high noise, large input power, weak drop-resistant deformation capability, sensitivity to solid foreign matters in working media, easy interference, even stalling and the like generated when the driving pump works due to the fact that the movement fit clearance is too small can be avoided, and the defects of performance reduction and the like of the driving pump due to the fact that the movement fit clearance is too large can be avoided. Therefore, the design of the movement fit clearance can not only ensure the performance of the driving pump, but also give consideration to the working reliability of the driving pump. The performance and the reliability of the driving pump are improved, so that the heat dissipation performance of the liquid cooling heat dissipation system is optimized.

In one implementation manner of the first aspect, the rotating shaft and the base are connected into a whole through an injection molding process, and the base has an injection molding characteristic structure; and/or the bearing and the impeller are connected into a whole through an injection molding process, and the impeller has an injection molding characteristic structure.

In this scheme, use injection molding process can guarantee the manufacturing accuracy to guarantee the assembly precision, thereby guarantee the operational reliability of driving pump, promote liquid cooling system's heat dispersion. An injection feature is a feature that remains on the part being formed after injection molding. Injection molding features include, but are not limited to, a glue injection port structure or a thimble structure.

In one implementation manner of the first aspect, a second mounting groove and a third mounting groove are arranged on one side of the base, which is far away from the second pump liquid tank, and a wiring trough is arranged on the top surface of the trough wall of the second mounting groove; the driving pump comprises a flexible circuit board and a coil winding; the flexible circuit board is arranged in the third mounting groove; and the coil winding is arranged in the second mounting groove, and a lead in the coil winding penetrates through the wiring slot and is welded with a welding disc on the flexible circuit board.

In the scheme, the coil winding welded with the welding disc on the flexible circuit board is used for generating electromagnetic force when being electrified, and the electromagnetic force can drive the impeller component to rotate. Through setting up the wiring trough, can carry out spacing and guide to coil winding's lead wire, be convenient for carry out welding operation to the lead wire, guarantee welding quality. In addition, the design of arranging the wiring bundling grooves to accommodate the leads can save space, and the base assembly can be well suitable for assembling base assemblies with compact structural size and narrow structural space.

In one implementation of the first aspect, the impeller comprises an impeller body and an odd number of blades; the odd number of blades are connected to the periphery of the impeller main body, and every two adjacent blades are arranged at intervals; the bearing is connected with the impeller main body into a whole.

In the scheme, the number of the blades is odd, so that the resonance noise generated when the driving pump works can be reduced or avoided.

In one implementation manner of the first aspect, the driving pump comprises a liquid inlet pipe and a liquid outlet pipe which are connected with the base, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, and the liquid inlet pipe and the liquid outlet pipe are both positioned at the outer side of the second pump liquid tank and are both communicated with the second pump liquid tank; the impeller comprises an impeller main body and a plurality of blades connected to the periphery of the impeller main body; the bearing is connected with the impeller main body into a whole; a space is formed between every two adjacent blades; when the impeller assembly rotates around the rotating shaft, each interval can be communicated with the liquid inlet pipe so as to suck working media into the interval from the liquid inlet pipe; each interval can also be communicated with a liquid outlet pipe so as to discharge the working medium from the liquid outlet pipe; the pressure intensity of the working medium discharged from the liquid outlet pipe is larger than that of the working medium before entering the liquid inlet pipe.

In the scheme, each interval rotates along with the impeller, and when the interval is aligned and communicated with the liquid inlet pipe, the working medium is sucked into the interval from the liquid inlet pipe and rotates along with the impeller. In the process, the working medium is gradually boosted. When the gap is in aligned communication with the outlet pipe, working fluid is pumped out of the outlet pipe. The design can ensure that the working medium keeps sufficient flow and flow velocity in the whole liquid cooling pipeline, and is favorable for improving the heat dissipation performance of the heat dissipation system.

In a second aspect, the technical scheme of the application provides a mobile terminal device, which comprises a liquid cooling pipeline, a heating device and the driving pump; the liquid cooling pipeline passes through the heating device from the inside or the outside of the heating device, and a working medium is arranged in the liquid cooling pipeline; the base of the driving pump is connected with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, the liquid inlet pipe is communicated with one end of the second pump liquid tank and the liquid cooling pipeline, and the liquid outlet pipe is communicated with the other end of the second pump liquid tank and the liquid cooling pipeline; the driving pump is used for sucking the working medium in the liquid cooling pipeline into the liquid pumping space through the liquid inlet pipe, boosting the working medium in the liquid pumping space, and discharging the boosted working medium to the liquid cooling pipeline from the liquid outlet pipe so as to drive the working medium to circularly flow in the liquid cooling pipeline.

This scheme has higher precision, lower noise, higher operational reliability's actuating pump through the design, can effectively promote mobile terminal's heat dispersion.

In a third aspect, the technical scheme of the application provides a cold plate assembly, which comprises a water nozzle and a cold plate; the cold plate comprises a first cover plate and a second cover plate, the first cover plate and the second cover plate are stacked and welded, the first cover plate and the second cover plate enclose a cold plate cavity, and the cold plate cavity is provided with an opening communicated with the outside; the thickness of the cold plate is less than or equal to 1.5mm; the water nozzle is connected with the first cover plate and/or the second cover plate and is provided with a channel, and the channel is communicated with the cold plate cavity through an opening.

The cold plate assembly in the scheme can be used in the mobile terminal equipment, so that the heat dissipation performance of the mobile terminal equipment is enhanced. Wherein, the water injection well choke of cold drawing subassembly can communicate with the liquid cooling pipeline in the mobile terminal equipment. In order to ensure that the thickness of the whole mobile terminal device is smaller, the cold plate is made to be very thin, for example, the thickness is less than or equal to 1.5mm. The thickness of the water nozzle is usually larger than that of the cold plate so as to be connected with the liquid cooling pipeline with larger caliber. The water nozzle can be arranged at a non-thickness bottleneck position in the mobile terminal equipment. Therefore, the cold drawing subassembly of this scheme can also realize the thickness attenuate of complete machine through being connected ultra-thin cold drawing and water injection well choke.

In one implementation manner of the third aspect, the opening is formed on a side of the first cover plate facing away from the second cover plate; the water injection well choke is connected with the first apron deviates from one side in cold plate chamber. The connecting structure of the water nozzle and the cold plate has simple design and better mass production.

In one implementation of the third aspect, the opening is surrounded by a partial area of an edge of the first cover plate and a partial area of an edge of the second cover plate; and a part of area of the first cover plate and a part of area of the second cover plate which enclose the opening are both positioned in the channel of the water nozzle and are both connected with the water nozzle. This scheme provides another kind of water injection well choke and connection structure of cold drawing, and this design is simple, but the volume production nature is better.

In one implementation of the third aspect, the overall physical dimension of the cold plate is at least 10 times the wall thickness of the first cover plate or the wall thickness of the second cover plate; the material of the first cover plate is a composite material, the composite material of the first cover plate comprises a first easily-welded material close to the second cover plate and a reinforcing material far away from the second cover plate, and the first easily-welded material of the first cover plate is welded with the second cover plate; and/or the material of the second cover plate is a composite material, the composite material of the second cover plate comprises a first easily-welded material close to the first cover plate and a reinforcing material far away from the first cover plate, and the first easily-welded material of the second cover plate is welded with the first cover plate.

In the scheme, the overall external dimension refers to the occupied distance of the cold plate in the X direction, the Y direction or the Z direction in an XYZ coordinate system. The relation between the overall external dimension and the wall thickness of the cold plate is designed as above, so that the cold plate is lighter and thinner; the cold plate can have a larger area to enhance the heat dissipation effect. In addition, at least one cover plate of the cold plate is designed into a composite material, a reinforcing material in the composite material can play a role in increasing the structural strength and the rigidity, and a welding performance of the cold plate can be increased by an easily-welded material in the composite material, so that the working reliability of the cold plate is integrally ensured, and the heat dissipation performance of the mobile terminal equipment is favorably improved.

In one implementation of the third aspect, the first easily weldable material is discontinuously distributed on the surface of the reinforcing material to expose a partial surface of the reinforcing material.

In the scheme, the easily-welded material can be divided into a plurality of mutually-separated areas, and the surface of the reinforcing material is exposed at the intervals of the areas. The design can save the using amount of easily welded materials. The cold plate assembly with the design can accommodate non-corrosive working media.

In one implementation of the third aspect, the yield strength of the reinforcement material is greater than or equal to 150Mpa, and/or the surface hardness of the reinforcement material is greater than or equal to HV100, and/or the modulus of elasticity of the reinforcement material is greater than or equal to 120Mpa. The reinforced material has high strength and hardness and good deformation resistance. Therefore, the cold plate has better structural strength and rigidity, and is favorable for realizing large-area cold plates, so that the heat dissipation performance of the cold plate is improved.

In one implementation of the third aspect, the reinforcement material comprises stainless steel, titanium, a titanium alloy, tungsten, a tungsten alloy, chromium, or a chromium alloy. The reinforcing material has good manufacturability and is easy to produce in mass.

In one implementation manner of the third aspect, the melting point of the first easily weldable material is less than or equal to 950 ℃; and/or the first easily weldable material comprises copper, a copper alloy, nickel or a nickel alloy. The easily-welded material is good in manufacturability and easy to produce in quantity.

In one implementation manner of the third aspect, the material of the first cover plate is a composite material, the composite material of the first cover plate further includes a second easily weldable material, and the second easily weldable material of the first cover plate is located on a side, away from the second cover plate, of the reinforcing material of the first cover plate; the water nozzle is welded with the second easily-welded material of the first cover plate.

In this scheme, also be the easily welded material through making one side that first apron and water injection well choke are connected, can promote the welding quality of cold drawing and water injection well choke, ensure the operational reliability of cold drawing subassembly, be favorable to promoting the heat dispersion of cold drawing.

In one implementation manner of the third aspect, at least a partial region of the water nozzle is provided with the easily-welded material, and the easily-welded material of the water nozzle is welded with the second easily-welded material of the first cover plate.

In the scheme, the easily-welded material of the water nozzle can be formed through various processes, including but not limited to an electroplating process, a coating process, an assembling process or a composite material forming process and the like. The water nozzle is made of easily-welded materials, so that the welding quality of the water nozzle and the cold plate can be further enhanced.

In one implementation of the third aspect, the water nozzle and the first cover plate are welded by a solder paste or by a non-solder process. In the scheme, the soldering paste can be used for soldering, and the soldering process is mature and low in cost. The non-paste process refers to a soldering process that does not use solder paste, such as laser soldering or diffusion soldering. The process precision of the no-soldering paste is higher, and the welding quality can be ensured.

In one implementation manner of the third aspect, the material of the second cover plate is a composite material, the composite material of the second cover plate further includes a second easily weldable material, and the second easily weldable material of the second cover plate is located on a side, away from the first cover plate, of the reinforcing material of the second cover plate; the water nozzle is also welded with a second easily-welded material of the second cover plate.

In this scheme, also be the easily welded material through making one side that second apron and water injection well choke are connected, can promote the welding quality of cold drawing and water injection well choke, ensure the operational reliability of cold drawing subassembly, be favorable to promoting the heat dispersion of cold drawing.

In one implementation manner of the third aspect, at least a partial area of the water nozzle is provided with the easily-welded material, and the easily-welded material of the water nozzle is further welded with the second easily-welded material of the second cover plate.

In one implementation of the third aspect, the water nozzle and the second cover plate are welded by a soldering paste or by a non-soldering process. In the scheme, the soldering paste can be used for soldering, and the soldering process is mature and low in cost. The non-paste process refers to a soldering process that does not use solder paste, such as laser soldering or diffusion soldering. The process precision of the no-soldering paste is higher, and the welding quality can be ensured.

In one implementation of the third aspect, the water nozzle is constructed of a weldable material. In the scheme, the water nozzle is made of easily-welded materials. The design enables the water nozzle to have good welding performance, and the welding quality of the water nozzle and the cold plate can be further enhanced.

In one implementation manner of the third aspect, the melting point of the second easily weldable material is less than or equal to 950 ℃; and/or the second easily weldable material comprises copper, a copper alloy, nickel or a nickel alloy. The easily-welded material is good in manufacturability and easy to produce in large quantity.

In one implementation manner of the third aspect, the melting point of the easily-welded material of the water nozzle is less than or equal to 950 ℃; and/or the easily-welded material of the water nozzle comprises copper, copper alloy, nickel or nickel alloy. The easily-welded material is good in manufacturability and easy to produce in large quantity.

In one implementation manner of the third aspect, a surface of the first cover plate facing the second cover plate and a surface of the second cover plate facing the second cover plate each include an edge region and a support region, and the edge region surrounds a periphery of the support region; the supporting part is convexly arranged in the supporting area of the first cover plate and used for supporting the second cover plate, and the supporting part and the second cover plate are welded through soldering paste or through a non-soldering paste process; or the supporting part is convexly arranged on the supporting area of the second cover plate and used for supporting the first cover plate, and the supporting part and the first cover plate are welded through soldering paste or through a non-soldering paste process.

In this scheme, the supporting part in the cold drawing and the apron that this supporting part supported can the welding together. The support roots may be formed using a stamping process or an etching process. If the supporting part is formed by stamping, the material of the supporting part is the same as that of the cover plate connected with the supporting part; if the supporting part is formed by etching, the material of the supporting part is the same as the easily-welded material on one side of the cover plate connected with the supporting part. Through the design of the supporting part, the structural strength and the rigidity of the cold plate can be enhanced, and the working reliability of the cold plate is ensured. The support part is welded with the corresponding cover plate, so that the connection strength of the support part and the corresponding cover plate can be ensured, and the support part can reliably play a supporting role.

In one implementation of the third aspect, the edge region of the first cover plate and the edge region of the second cover plate are soldered by a solder paste or by a fluxless process. In the scheme, the soldering paste welding process is mature, and the cost is low. The soldering precision of the non-soldering paste process is high, the problem of the overflow of the soldering paste in the soldering paste process can be avoided, the yield of the soldering process can be ensured, and the production cost can be reduced.

In a fourth aspect, the present disclosure provides a mobile terminal device, comprising a liquid cooling conduit, a heat generating device, and the cold plate assembly of any one of claims 8 to 26; the liquid cooling pipeline passes through the heating device from the inside or the outside of the heating device, and working media are filled in the liquid cooling pipeline; the cold plate in the cold plate component is connected with the heating device; the cold plate component comprises two water nozzles, the two water nozzles are spaced, and channels of the two water nozzles are communicated with the liquid cooling pipeline. In this scheme, through using the cold drawing in mobile terminal equipment, can effectively promote mobile terminal equipment's heat dispersion.

In one implementation of the fourth aspect, the cold plate and the heat generating device are connected by a thermal interface material. In this embodiment, the thermal interface material may have a thermal conductivity of greater than or equal to 0.8 (W/m.K), such as 1 (W/m.K), 10 (W/m.K), or even greater than 100 (W/m.K). Thermal interface materials include, but are not limited to, carbon fiber thermal pads, graphene thermal pads, or liquid metal thermal interface materials. The cold plate is connected with the heating device through a thermal interface material, so that the contact thermal resistance can be reduced, and the heat dissipation performance can be improved.

In a fifth aspect, the technical solution of the present application provides an electronic system, including a mobile terminal device, a peripheral device and a working medium; the mobile terminal equipment comprises a heating device, a driving pump, a three-way device and an internal liquid cooling pipeline, wherein the internal liquid cooling pipeline passes through the heating device, and the driving pump and the three-way device of the mobile terminal equipment are both communicated with the internal liquid cooling pipeline; the external equipment comprises a driving pump and an external liquid cooling pipeline, and the driving pump of the external equipment is communicated with the external liquid cooling pipeline; the peripheral is detachably connected with the mobile terminal equipment; when the external equipment is connected with the mobile terminal equipment, the three-way device is in a first state that the internal liquid cooling pipeline is communicated with the external liquid cooling pipeline, and the driving pump of the mobile terminal equipment and/or the external driving pump can drive working media to circularly flow in the external liquid cooling pipeline and the internal liquid cooling pipeline; after the peripheral equipment is separated from the mobile terminal equipment, the three-way device is in a second state that the internal liquid cooling pipeline is closed, and the driving pump of the mobile terminal equipment can drive the working medium to circularly flow in the internal liquid cooling pipeline.

In the scheme, the mobile terminal equipment can independently dissipate heat of the mobile terminal equipment, and the peripheral equipment also has heat dissipation capacity. When the external device is connected with the mobile terminal equipment through the three-way device, the three-way device can communicate the internal liquid cooling pipeline of the mobile terminal equipment with the external liquid cooling pipeline of the external device, so that the external device and the mobile terminal equipment integrally form an internal and external mixed liquid cooling heat dissipation system. From this, participate in the heat dissipation jointly through mobile terminal equipment and peripheral hardware, can realize stronger to the environment heat-sinking capability, greatly promote heat dispersion. Under the common scene that the mobile terminal equipment is not connected with the external equipment, the active liquid cooling heat dissipation system in the mobile terminal equipment can be used for realizing the active heat dissipation with high heat dissipation performance and high temperature uniformity. Therefore, the temperature of the mobile terminal equipment can be greatly reduced, the performance of the heating device can be greatly released, the mobile terminal equipment can stably run under full load or even overload, and the thermal experience requirements of users are met.

Drawings

In order to explain the technical solutions in the embodiments or the background art of the present application, the drawings used in the embodiments or the background art of the present application will be explained below.

Fig. 1 is a schematic structural block diagram of a mobile terminal device in a first embodiment of the present application;

fig. 2 is a schematic perspective view of a drive pump of the mobile terminal device of fig. 1 from one perspective;

FIG. 3 is a schematic perspective view of the drive pump of FIG. 2 from another perspective;

FIG. 4 is an exploded view of the drive pump of FIG. 2;

FIG. 5 is a schematic perspective view of the volute of the drive pump of FIG. 4;

FIG. 6 is a perspective view of the impeller assembly of the drive pump of FIG. 4 from one perspective;

FIG. 7 is a perspective view of the impeller assembly of FIG. 6 from another perspective;

FIG. 8 is an exploded view of the impeller assembly of FIG. 7;

FIG. 9 is a perspective view of the base assembly of the drive pump of FIG. 4 from one perspective;

FIG. 10 is a perspective view of the base assembly of FIG. 9 from another perspective;

FIG. 11 is a schematic view of an assembly of the base assembly, coil windings and flexible circuit board of the drive pump of FIG. 4;

FIG. 12base:Sub>A isbase:Sub>A schematic sectional view A-A of the drive pump of FIG. 2;

FIG. 12b is an enlarged partial view of the structure at W in FIG. 12 a;

fig. 13 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 14 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 15 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 16 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 17 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 18 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 19 is a schematic configuration diagram of a liquid cooling control apparatus of the mobile terminal device in fig. 1;

fig. 20 is a schematic structural block diagram of a mobile terminal device in the second embodiment of the present application;

fig. 21 is a schematic block diagram of a mobile terminal device in a third embodiment of the present application;

fig. 22 is a schematic block diagram of a mobile terminal apparatus according to a fourth embodiment of the present application;

fig. 23 is a schematic cross-sectional view of the third liquid-cooling conduit of the mobile terminal unit of fig. 22;

fig. 24 is another cross-sectional structural view of the third liquid-cooling conduit of the mobile terminal apparatus of fig. 22;

fig. 25 is a schematic structural view of a circuit board assembly in the fifth embodiment of the present application;

fig. 26 is a schematic structural diagram of a system-in-package module in the sixth embodiment of the present application;

fig. 27 is a schematic structural view of a capillary pump in the seventh embodiment of the present application;

FIG. 28 is a schematic perspective view of a cold plate according to a seventh embodiment of the present disclosure;

FIG. 29 is an exploded view of the cold plate of FIG. 28;

FIG. 30 is a partial cross-sectional view of the cold plate of FIG. 28;

FIG. 31 is a partial cross-sectional view of the cold plate of FIG. 28;

FIG. 32 is a partial cross-sectional structural view of the cold plate of FIG. 28;

FIG. 33 is a partial cross-sectional structural view of the cold plate of FIG. 28;

fig. 34 is a schematic structural diagram of a mobile terminal apparatus in a seventh embodiment of the present application;

fig. 35 is another schematic configuration diagram of a mobile terminal device in the seventh embodiment of the present application;

fig. 36 is a schematic structural diagram of a mobile terminal device in a seventh embodiment of the present application;

FIG. 37 is a schematic view of the assembled structure of the third cold plate and the water nozzle of the mobile terminal device in FIG. 36;

FIG. 38 is an exploded view of the third cold plate and water nozzle of FIG. 37;

FIG. 39 is a cross-sectional view of the third cold plate and water nozzle of FIG. 37;

FIG. 40 is another cross-sectional structural view of the third cold plate and water nozzle of the mobile terminal device of FIG. 36;

fig. 41 is a schematic cross-sectional structural view of a piezoelectric pump in an eighth embodiment of the present application;

fig. 42 is another schematic cross-sectional structural view of a piezoelectric pump in example eight of the present application;

fig. 43 is a schematic structural diagram of a wearable device in an eighth embodiment of the present application;

fig. 44 is another schematic structural view of a wearable device in the eighth embodiment of the present application;

fig. 45 is a schematic structural diagram of a mobile terminal device in an eighth embodiment of the present application;

FIG. 46 is a block diagram of an electronic system in an embodiment nine of the present application;

FIG. 47 is a cross-sectional schematic diagram of a cable of a peripheral device of the electronic system of FIG. 46;

FIG. 48 is another cross-sectional structural view of a cable of the peripheral device of the electronic system of FIG. 46;

FIG. 49 is a block diagram of another exemplary electronic system in a ninth embodiment of the present application;

FIG. 50 is a block diagram of another exemplary electronic system according to a ninth embodiment of the present application;

FIG. 51 is a block diagram of an electronic system in an embodiment nine of the present application;

fig. 52 is a schematic block diagram of an electronic system in accordance with a tenth embodiment of the present application;

fig. 53 is another schematic block diagram of an electronic system in a tenth embodiment of the present application;

fig. 54 is another schematic block diagram of an electronic system in a tenth embodiment of the present application;

fig. 55 is another schematic block diagram of an electronic system in a tenth embodiment of the present application;

fig. 56 is a schematic block diagram of an electronic system in an eleventh embodiment of the present application;

fig. 57 is another schematic block diagram of an electronic system in an eleventh embodiment of the present application;

FIG. 58 is a block diagram of an electronic system in accordance with a twelfth embodiment of the present application;

fig. 59 is another schematic block diagram of an electronic system according to a twelfth embodiment of the present application.

Detailed Description

The mobile terminal device may include a mobile phone, a tablet computer, an intelligent watch, a notebook computer, a wearable device, and the like, and may also include a charger, a game handle, a back clip, a car machine, or an electric car in a broad sense. As the functions of the mobile terminal devices are more and more, the performance is stronger and the heat productivity thereof is also increased sharply. For example, a stronger computing chip, a 5G technology with higher power consumption than 4G, a fast charging technology with a larger current, and the like all bring about a significant increase in heat generation amount, and put higher demands on the heat dissipation performance of the device. Without an effective heat dissipation design, the accumulation of heat or cold can result in the temperature of the mobile terminal device being too high or too low, resulting in the following adverse effects:

(1) Performance degradation and limitation

For semiconductor devices, high temperatures can affect their efficiency and performance, e.g., leakage current can increase and quantum efficiency can decrease. On the other hand, when the temperature is too high, the temperature control strategy of the device can be triggered for the purpose of protecting the device, and the power consumption is controlled in a mode of reducing the frame frequency, so that the temperature of the device is reduced. For a lithium ion battery, at a low temperature of more than-20 ℃, the actual capacity attenuation can exceed 50%, even if the internal resistance is too high, normal start cannot be performed, or abnormal shutdown is triggered by instantaneous high power consumption at a low temperature. For mobile terminal equipment such as mobile phones and the like, the internal resistance is small and the heat productivity is low when the battery discharges, and the heat of a central processing unit and the like needs to be transferred to a battery area under a low-temperature environment so as to improve the performance of the battery.

(2) Poor user thermal experience

Too high a temperature may cause a user of the handheld device to feel a strong discomfort, which may greatly affect the user experience.

(3) Reliability degradation of the device

The mobile terminal equipment can work in different regions or seasons and needs to work in an environment with a high temperature of 45 ℃ and a low temperature of-40 ℃. High temperature can generate thermal stress in materials of all levels of structures of the equipment, so that the materials are aged and failed due to long-term thermal stress, and the devices are deformed and damaged due to high temperature. If the temperature exceeds the safe temperature threshold of the material and device, it can directly lead to device failure and be unusable.

(4) Battery safety

If the working temperature of the organic diaphragm material in the lithium ion battery pack exceeds 70 ℃ during charging and discharging, irreversible exothermic reaction can occur, and the battery is short-circuited and has safety accidents.

Therefore, the heat dissipation design of the mobile terminal not only becomes one of the important bottlenecks in improving the device performance and reliability of the mobile terminal, but also is one of the most concerned indexes of consumers. Taking a mobile phone as an example, the mobile phone is currently undergoing a fourth-generation heat dissipation technology evolution: the first generation is characterized by the application of a local Thermal Interface Material (TIM), the thermal conductivity is 1 (W/m.K) -10 (W/m.K), and the thermal conductivity is improved to 100 (W/m.K) by the latest development of liquid metal TIM, carbon fiber/graphene TIM and the like. The second generation is characterized by large-area application of the thin artificial graphite soaking film, and the heat conductivity coefficient is 800 (W/m.K) -1500 (W/m.K). The thermal conductivity coefficient can be improved to 2000 (W/m.K) by newly developing a high-heat-flux thick graphene film (t is more than or equal to 0.1 mm). Because of flexible design, adjustable thickness and small invalid area, the heat pipe and other two-phase heat dissipation devices tend to be replaced. In the third generation, heat Pipes (HP), loop Heat Pipes (LHP) and vapor chamber temperature-equalizing plates (VC) are used as application characteristics, and the heat conductivity coefficient is 5000 (W/m.K) -15000 (W/m.K). The technology is developed to replace copper and copper alloy VC with high-strength VC such as stainless steel, titanium or composite materials and the like, and the high-strength VC is used as a bearing structure support of a mobile phone for large-area use. The fourth generation is forced air cooling heat dissipation technology with built-in fan as application characteristic, the shell of the mobile phone is provided with an air inlet/outlet, and the inside of the mobile phone is provided with an air duct. Because the mobile phone occupies the valuable internal space, cold air cannot be directly blown to the main heating chip, the heat dissipation effect is limited, and the mobile phone industry and the industrial chain are not mass-produced in large scale and do not become the industry development trend. It should be noted that the above-mentioned four-generation heat dissipation technology is evolved simultaneously on the mobile phone, and is not in an alternative relationship.

However, the heat conductivity coefficient of the heat dissipation technology is still low, and the heat dissipation technology cannot fully exchange heat with a heating device and cannot effectively reduce the temperature of the heating device. In addition, pipelines cannot be reasonably arranged according to the power consumption and the architecture layout conditions of different heating devices, so that the heat in a high-temperature area in the equipment cannot be transferred to a low-temperature area, and the temperature of the whole machine is unevenly distributed.

In view of this, the embodiment of the present application provides an active liquid cooling heat dissipation scheme, which can overcome the defects that the conventional heat dissipation scheme cannot sufficiently dissipate heat and cannot make the temperature of the whole device uniform, and the following details are provided. In the following description of the embodiments of the present application, "and/or" is used to describe an association relationship of objects, and means that three relationships may exist between the objects, unless otherwise specified. For example a and/or B are used to denote: a exists alone, A and B exist simultaneously, and B exists alone.

In the following description of the embodiments of the present application, "a plurality" means two or more than two.

In the following description of embodiments of the present application, the terms "first", "second", and the like are used merely for distinguishing technical features for clear description, and are not to be construed as implying relative importance or implying any number of indicated technical features.

The directional terms used in the embodiments of the present application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", "top", "bottom", and the like, refer only to the orientation of the drawings. Accordingly, the directional terms are used for better and clearer illustration and understanding of the embodiments of the present application, and are not intended to indicate or imply that the devices or elements referred to must be in a particular orientation, constructed and operated in a particular manner, and therefore should not be considered as limiting the embodiments of the present application.

In the description of the embodiments of the present application, the terms "mounted", "connected", "disposed on" \8230 "(" connected "or" connected "in the above) are to be understood broadly, for example," connected "may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate.

Example one

Fig. 1 is a block diagram showing a structure of a mobile terminal device 10 according to a first embodiment. As shown in fig. 1, the mobile terminal device 10 may include a housing 11, and the housing 11 may be a single housing or a housing assembly formed by assembling several housings.

As shown in fig. 1, the mobile terminal apparatus 10 may further include a heat generating device, a driving pump 18, a liquid cooling control device 15, and a liquid cooling pipe 19 in the housing 11. The liquid cooling pipe 19 connects the driving pump 18 and the liquid cooling control device 15, and may pass through a heat generating device. The liquid cooling pipeline 19, the driving pump 18 and the liquid cooling control device 15 are filled with flowable working media, and the liquid cooling pipeline 19, the driving pump 18 and the liquid cooling control device 15 can form a flowing pipeline of the working media.

The working medium can be a cooling liquid, such as water, an ethylene glycol solution, a propylene glycol solution or a fluorinated liquid, and the working medium can also comprise gas. The working medium can be a single component, or can be a mixture of at least two working media (such as a mixture of at least two cooling fluids). The working fluid may remain in a single phase (i.e., no phase change occurs) or may be in two phases (i.e., switching between liquid and gas phases) during flow.

The heating device refers to a single device with a certain function and capable of generating heat during working or a module consisting of a plurality of single devices. The heat generating device includes, but is not limited to, a camera module 12, a sensor 13, a System On Chip (SOC) 14, a charging module (Charge IC) 16, a battery 17, a System In Package (SIP) module, a speaker module, a circuit board assembly, and the like. The heat generating device is disposed on the circuit board. The circuit board can be a single-layer board or a multi-layer board which is stacked and arranged at intervals. For multilayer boards, a heat generating device may be disposed on each board. For example, sandwich circuit boards or sandwich circuit boards each include two layers of circuit boards. The sandwich circuit board comprises a sandwich circuit board, wherein heating devices can be arranged on three surfaces (two opposite surfaces of one circuit board and one surface of the other circuit board) of two circuit boards of the sandwich circuit board, and the heating devices can be arranged on four surfaces (two surfaces of each circuit board, and the total four surfaces) of two circuit boards of the sandwich circuit board.

In the first embodiment, the heat generating device, the driving pump 18, the liquid cooling control device 15, the liquid cooling pipeline 19 and the working medium may form an active liquid cooling heat dissipation system, which can perform a good active heat dissipation on the mobile terminal device 10.

The drive pump 18, the liquid cooling control device 15, and the liquid cooling pipe 19 will be described in detail one by one.

As shown in fig. 1, the driving pump 18 may be connected to the liquid cooling pipe 19, and the driving pump 18 is used for driving the working fluid to circulate in the liquid cooling pipe 19. There may be at least one drive pump 18, depending on the actual requirements. The location of the drive pump 18 can be designed according to product needs. The actuation pump 18 includes, but is not limited to, a micro-mechanical actuation pump, a piezoelectric pump, an electroosmotic pump, or a micro-electro-mechanical system (MEMS) micropump. A structure of the micro-mechanical drive pump will be described below.

As shown in fig. 2, 3 and 4, the drive pump 18 may include a volute 181, a seal ring 182, an impeller assembly 183, a gasket 184, a base assembly 185, coil windings 186 and a flexible circuit board 187. The following will be described one by one.

As shown in fig. 4 and 5, the volute 181 may also be referred to as an upper cover, an upper case, or a first case, etc. The volute 181 may be approximately plate-shaped. A seal groove 181b and a first pump liquid groove 181c are formed in a plate surface 181a (surface having a normal line in the thickness direction) on the side of the scroll case 181, and the seal groove 181b surrounds the outer periphery of the first pump liquid groove 181 c. The sealing groove 181b may be circular for installing the sealing ring 182.

As shown in fig. 5, the first pumping groove 181c may include a body region 181f, a first liquid guiding region 181d, and a second liquid guiding region 181e. The body region 181f may be approximately a circular region. Both the first liquid guiding region 181d and the second liquid guiding region 181e may be substantially linear. The first liquid guide region 181d and the second liquid guide region 181e are connected to different positions of the main body region 181f, and both the first liquid guide region 181d and the second liquid guide region 181e extend outward of the main body region 181 f. The distance between the first liquid guiding region 181d and the second liquid guiding region 181e may be no greater than 15 times the distance between two adjacent blades of the impeller (the impeller will be described later), and this design is advantageous in ensuring the lift and performance of the driving pump 18. The center C1 of the body region 181f and the center C2 of the sealing groove 181b may not coincide with each other, but may be eccentrically disposed.

The first pump fluid tank 181c is configured to receive an impeller assembly 183, which will be described below.

As shown in fig. 6-8, the impeller assembly 183 may include an impeller 183a, a bearing 183e, a magnet 183f, and a magnetically permeable ring 183g. Which will be described separately below.

As shown in fig. 7 and 8, the impeller 183a may include an impeller body 183b, and a plurality of blades 183c connected to a circumference of the impeller body 183b, and the impeller body 183b and the blades 183c may be integrally connected.

The impeller main body 183b may be substantially disk-shaped, and has a central through hole 183d formed therein, and an axis of the central through hole 183d passes through a center of the impeller main body 183 b. A shaft sleeve 183h may be provided on one side surface of the impeller main body 183b, and the shaft sleeve 183h may be integrally connected to the impeller main body 183b, which may be integrally injection molded. The interior cavity of the shaft sleeve 183h communicates with and aligns with the central through bore 183 d.

The shape of the vane 183c (which may be called a lobed shape) may be designed as desired, and the embodiment is not limited thereto. The number of lobes 183c may be designed as desired, and may be, for example, greater than or equal to 5. The number of lobes 183c may be odd, and illustratively may be prime. The number of the vanes 183c is odd, and resonance noise generated when the drive pump 18 operates can be reduced or avoided. All of the lobes 183c may be evenly distributed around the central through-hole 183d with a space between adjacent lobes 183 c.

As shown in fig. 7 and 8, the bearing 183e may be approximately cylindrical tubular. The bearing 183e may be located within the sleeve 183h and may be integral with the sleeve 183h.

As shown in fig. 7 and 8, the magnetic conducting ring 183g may be annular and located on the side of the impeller body 183b where the shaft sleeve 183h is located, and the magnetic conducting ring 183g may be integrally connected to the impeller body 183 b. The magnetic conductive ring 183g surrounds the outer periphery of the shaft sleeve 183h and may be concentric with the central through hole 183 d. The outer peripheral surface of the magnetic ring 183g may be close to the root of the blade 183c, the blade 183c may be located at the outer periphery of the magnetic ring 183g, and the blade 183c and the magnetic ring 183g may not overlap.

As shown in fig. 7 and 8, the magnet 183f may have a circular ring shape. The magnet 183f may be fixed to an inner circumferential surface of the magnetic ring 183g, and for example, the magnet 183f may be adhered to the inner circumferential surface of the magnetic ring 183g by an adhesive. The magnet 183f may be concentric with the magnetic conductive ring 183g.

In one embodiment, the impeller 183a, the bearing 183e and the magnetic conductive ring 183g may be formed by an integral molding process, such as an insert injection molding process, an integrated sintering process, a 3D printing process, and the like. The product precision can be guaranteed through integrated molding, and the cost is low.

As shown in fig. 6 and 7, after the impeller 183a, the bearing 183e and the magnetic conductive ring 183g are integrally injection molded, the impeller body 183b has a visible injection molding feature, which includes but is not limited to a glue injection port structure or a thimble structure. The injection gate structure may be a groove (or a pit) or a columnar structure (the columnar structure is polished after injection molding is completed, so that a groove may be formed), and the thimble structure may be a groove (or a pit). For example, the gate structure 183i shown in fig. 6 is a pit formed by a pin after injection molding and demolding, and the pin structure 183j shown in fig. 7 is a pit formed by a pin after injection molding and demolding. The injection molding features on the impeller body 183b may have at least one, for example, there are multiple locations for the glue injection port structure 183i and the thimble structure 183 j.

Unlike the above-described integral injection molding, in other embodiments, the impeller 183a, the bearing 183e, and the magnetic conductive ring 183g may be separate components that are connected by assembly.

In one embodiment, the shaft sleeve 183h of the impeller assembly 183 is rotatably engaged with a shaft in the base assembly 185 about which the impeller assembly 183 is rotatable (as will be described further below). Wherein the bushing 183h can increase the rotational stability of the impeller assembly 183. In other embodiments, the impeller body 183b may not have the bushing 183h thereon.

Fig. 9 and 10 are schematic structural views of the base assembly 185 at different viewing angles, and fig. 10 shows a back structure of the base assembly 185 of fig. 9.

As shown in fig. 9 and 10, the base assembly 185 may also be referred to as a lower cover, a lower case, or a second housing, etc. The base assembly 185 may include a base (185 a) and a shaft 185j, which may be integrally formed. The base (185 a) and the rotating shaft 185j may be formed by an integral molding process (e.g., insert injection molding process, integral sintering process, or 3D printing process), which may reduce the cost and ensure the product precision. In other embodiments, the base (185 a) and the shaft 185j may be separately manufactured and then assembled.

As shown in fig. 9, the base (185 a) may be substantially plate-shaped, and a second pumping groove 185e is formed in a plate surface 185d (surface having a normal line along the thickness direction) on the base (185 a). The second pumping groove 185e may include a body region 185h, a third liquid guiding region 185g and a fourth liquid guiding region 185f. The body region 185h may be approximately a circular region. The third liquid guiding area 185g and the fourth liquid guiding area 185f may be both substantially linear. The third liquid guiding area 185g and the fourth liquid guiding area 185f are connected to different positions of the main area 185h, and both the third liquid guiding area 185g and the fourth liquid guiding area 185f extend outside the main area 185 h. The distance between the third fluid guiding region 185g and the fourth fluid guiding region 185f can be no more than 15 times the distance between two adjacent vanes 183c, which is favorable for ensuring the lift and performance of the driving pump 18.

As shown in fig. 9, a second liquid pipe 185b and a first liquid pipe 185c may be protruded from a side surface (a surface perpendicularly connected to a plate surface 185 d) of the base 185 a. The second liquid pipe 185b and the first liquid pipe 185c are spaced apart. The second liquid pipe 185b communicates with the fourth liquid guiding area 185f, and the first liquid pipe 185c communicates with the third liquid guiding area 185 g. Thus, the second liquid pipe 185b and the first liquid pipe 185c are both communicated with the second pump liquid tank 185e. One of the second liquid pipe 185b and the first liquid pipe 185c may be used as an inlet pipe (or inlet port) for driving the pump 18, and the other may be used as an outlet pipe (or outlet port) for driving the pump 18.

Referring to fig. 9 and 1, the first liquid pipe 185c and the second liquid pipe 185b are both in communication with the liquid cooling conduit 19. Thus, the driving pump 18 can drive the working medium to circulate in the liquid cooling pipe 19 and the liquid cooling control device 15.

As shown in fig. 9, the base (185 a) may be formed with a first installation groove 185i, and the first installation groove 185i is positioned at an inner side of the second pump fluid groove 185e while being spaced apart from each other. The rotation shaft 185j is positioned in the first installation groove 185i with a gap from the inner wall of the first installation groove 185 i. The gap is for receiving a boss 183h (described later).

In this embodiment, the base (185 a) and the shaft 185j may be integrally injection molded. As shown in fig. 9, after the base (185 a) and the shaft 185j are integrally molded, the base (185 a) has visible molding features 185r, and the molding features 185r can be located on the inner and outer sides of the second pump fluid groove 185e, for example. The injection molding feature 185r may be, for example, a thimble structure, which may be a groove or a dimple formed after injection molding and demolding. There can be multiple locations for the injection molding feature 185 r.

As shown in fig. 4 and 9, the gasket 184 may be fitted over the rotation shaft 185j and mounted at the bottom of the first mounting groove 185 i.

As shown in fig. 10, a second mounting groove 185k may be formed on the base (185 a). The second mounting groove 185k may have a harness groove 185q formed on a top surface of a groove wall thereof, and the harness groove 185q may pass through an inner surface and an outer surface of the groove wall. The harness slot 185q shown in fig. 10 is a single, larger slot. Or, if necessary, the harness slot 185q may include at least two smaller slots separated by a plurality of walls extending in the radial direction of the second mounting slot 185k. A limit post 185m may be provided in the second installation groove 185k, and a space is provided between the limit post 185m and the inner wall of the second installation groove 185k.

As shown in fig. 10, after base (185 a) and shaft 185j are integrally injection molded, injection molding features 185s and 185n are visible on base (185 a). Injection molding feature 185s may be, for example, a top surface of a pocket wall of second pocket 185k, and injection molding feature 185s may be, for example, a thimble structure, which may be a pocket or dimple formed after injection molding. There may be multiple locations for the injection molding feature 185 s. The injection feature 185n may be, for example, located at the top end of the retention post 185m, and the injection feature 185n may be, for example, a gate structure, which may be a cylindrical protrusion formed after injection and demolding. There can be multiple injection molding features 185n.

As shown in fig. 10, a third mounting groove 185p may be formed on the base (185 a). The third mounting groove 185p may be adjacent to the harness groove 185 q. The third mounting groove 185p may penetrate the side of the base (185 a). The outline of the third mounting groove 185p, which is not visible, is indicated by dashed lines in FIG. 9.

Fig. 11 shows an assembly structure of the coil winding 186, the flexible circuit board 187, and the base (185 a).

As shown in fig. 11, the coil winding 186 may be installed in the second installation groove 185k and fitted around the outer circumference of the stopper 185 m. The leads 186a (three are shown in bold lines in fig. 11) of the coil winding 186 are receivable within the wire harness slot 185q, the wire harness slot 185q having a restraining and guiding function for the leads 186 a.

As shown in fig. 11, the flexible circuit board 187 is mounted in the third mounting groove 185p. One end of the flexible circuit board 187 may protrude out of the third mounting groove 185p to be connected with the main board of the mobile terminal apparatus 10. The flexible circuit board 187 has a pad 187a, and the lead 186a protruding from the harness groove 185q may be soldered to the pad 187a. To increase the connection strength, glue may be dispensed on the pad 187a after the lead 186a is soldered to the pad 187a, the glue covering the pad and the end of the lead 186a connected to the pad 187a.

In the first embodiment, the wire bundling groove 185q is formed, so that the lead 186a can be limited and guided, the welding operation of the lead 186a is facilitated, and the welding quality is ensured. Moreover, the design of forming the wire-tying groove 185q to accommodate the lead 186a can save space, and is suitable for assembling the base unit 185 having a compact size and a small space.

Fig. 12base:Sub>A isbase:Sub>A schematic cross-sectional viewbase:Sub>A-base:Sub>A of the drive pump 18 of fig. 2, wherein the coil windings 186 are not shown for clarity of illustration, but such representation does not affect critical assembly structures.

As shown in fig. 12a, the impeller assembly 183 may be mounted to a base assembly 185. Wherein, the shaft sleeve 183h of the impeller assembly 183 can be fitted into the first fitting groove 185i of the base assembly 185, the bearing 183e of the impeller assembly 183 can be fitted over the rotating shaft 185j of the base assembly 185, and the lower end surface of the bearing 183e can be in contact with or not in contact with the gasket 184. The vanes 183c, the magnetic rings 183g, and the magnets 183f of the impeller assembly 183 may be received in a second pump fluid slot 185e in the base assembly 185. In the axial direction of the rotating shaft 185j, a part of each of the vane 183c, the magnetic conductive ring 183g, and the magnet 183f may be located in the second pumping groove 185e, and another part may be exposed to the outside of the second pumping groove 185e. The impeller body 183b in the impeller assembly 183 may be located outside the second pumping groove 185e in the axial direction of the rotation shaft 185 j.

As shown in fig. 12a, the sealing ring 182 is installed in the sealing groove 181b of the scroll case 181. The volute 181 may be fixedly connected to a base (185 a) of the base assembly 185, wherein the volute 181 has a surface with a sealing groove 181b, which may cooperate with a surface of the base (185 a) having a second pumping groove 185e. Due to manufacturing and/or assembly accuracy limitations, the surface of the volute 181 and the surface of the base (185 a) may not be a zero clearance fit, and a small assembly clearance may be formed therebetween.

As shown in fig. 12a, a base (185 a) may cover the sealing groove 181 b. When the base (185 a) and the scroll case 181 are assembled, the region inside the sealing groove 181b (the sealing groove 181b surrounds the outer circumference of the region) may be referred to as a stationary seal chamber, which includes not only the pumping space 18a described below, but also a small assembly gap between the sealing groove 181b and the pumping space 18a, which is described above, between the scroll case 181 and the base (185 a). The seal ring 182 located in seal groove 181b is compressed, thereby sealing the stationary seal cavity.

As shown in fig. 12a, the first pumping groove 181c of the scroll 181 and the second pumping groove 185e of the base (185 a) may enclose a pumping space 18a. A seal ring 182 surrounds the outer periphery of the pumping liquid space 18a, and the seal ring 182 prevents leakage of the working medium in the pumping liquid space 18a. The sealing ring 182 is spaced from the pumping space 18a by the surface of the volute 181 and the base (185 a), and the function of this spacing of the sealing ring 182 from the pumping space 18a will be described below.

As shown in fig. 5 and 9, the first liquid guiding region 181d of the first pump liquid groove 181c may correspond to the third liquid guiding region 185g of the second pump liquid groove 185 e; a main region 181f of the first pumping groove 181c may correspond to a main region 185h of the second pumping groove 185 e; the second liquid guiding area 181e of the first pump liquid groove 181c may correspond to the fourth liquid guiding area 185f of the second pump liquid groove 185e.

As shown in fig. 12a, in the axial direction of the rotating shaft 185j, a portion of each of the vane 183c, the magnetic ring 183g, and the magnet 183f, which exceeds the second pumping groove 185e, may extend into the first pumping groove 181 c. The impeller body 183b may be located within the first pump fluid tank 181 c. That is, the impeller unit 183 is accommodated in the pumping space 18a.

As shown in fig. 12a, the impeller assembly 183 has a slight clearance for movement with the inner wall of the pumping space 18a. For example, as shown in fig. 12b, the impeller main body 183b and the groove wall of the first pump liquid groove 181c form a first fitting clearance d1, and the first fitting clearance d1 is a dimension in the radial direction of the impeller 183 a. The impeller main body 183b and the groove wall of the second pumping groove 185e form a second movement fit clearance d2, and the second movement fit clearance d2 is a dimension in the radial direction of the impeller 183 a. The single vane 183c may form a third movement fit clearance d3 with the inner wall of the pumping space 18a, the third movement fit clearance d3 being a dimension in the radial direction of the impeller 183 a. The single vane 183c may also form a fourth clearance with the inner wall of the pumping space 18a, which is a dimension in the axial direction of the impeller 183 a. For example, the single vane 183c forms a fourth fitting clearance d41 with a groove wall of the second pump fluid groove 185e, the single vane 183c forms a fourth fitting clearance d42 with a groove wall of the first pump fluid groove 181c, and the fourth fitting clearance d41 and the fourth fitting clearance d42 are each a dimension in the axial direction of the impeller 183 a. The first, second, third, fourth and fourth play fit clearances d1, d2, d3, d41 and d42 may be 0.1 μm to 500 μm, such as 0.1 μm, 1 μm, 20 μm, 100 μm or 500 μm. Illustratively, each of the kinematic fit clearances described above may be in the range of 1 μm to 20 μm, inclusive. It is understood that the size of each of the kinematic fit clearances in fig. 12b is merely illustrative, and the specific values thereof may be different or at least two thereof may be the same according to the product requirements.

As shown in fig. 7, 12a and 12b, the impeller 183a is rotatable in the pumping space 18a, and each adjacent two vanes 183c in the impeller 183a, the peripheral side surface of the impeller body 183b of the impeller 183a, and the inner wall of the pumping space 18a may define a movement seal chamber including the space between the adjacent two vanes 183 c. The number of the moving seal chambers is plural, and the number of the moving seal chambers is related to the number of the vanes 183c of the impeller 183 a. All moving seal cavities are distributed about the axis of rotation 185 j. All the moving sealed cavities belong to a part of the static sealed cavities, so that the projection of all the moving sealed cavities on the base (185 a) is positioned in the projection of the static sealed cavities on the base (185 a).

As shown in fig. 5, 9 and 12a, in the first embodiment, the main body region 181f of the first pumping liquid groove 181c of the volute 181 is eccentrically disposed with respect to the sealing groove 181b, and a region of the main body region 181f having a wider distance from the sealing groove 181b corresponds to the third mounting groove 185p of the base (185 a), so that the design is advantageous in that: on the premise that the sealing groove 181b surrounds the periphery of the first pump liquid groove 181c, the sealing groove 181b is offset relative to the main body region 181f in a direction close to the third mounting groove 185p (so as to realize the eccentric design), so that the sealing groove 181b occupies a space on the scroll casing 181 corresponding to the third mounting groove 185p, which is beneficial to reducing the diameter of the region surrounded by the sealing groove 181b, thereby ensuring that the overall size of the scroll casing 181 is small (the base (185 a) and the overall size of the scroll casing 181 can be substantially the same), and finally beneficial to reducing the overall size of the drive pump 18. In contrast, if the center of the main body region 181f is aligned with the center of the seal groove 181b, the diameter of the region surrounded by the seal groove 181b needs to be enlarged, which may result in an increase in the outer size of the scroll case 181 (for example, in the view of fig. 5, the lower boundary of the scroll case 181 needs to be expanded), which is disadvantageous for the miniaturization of the drive pump 18.

In one embodiment, the coil windings 186 and the impeller assembly 183 may form a motor that drives the pump 18. The coil winding 186 and the impeller assembly 183 are respectively installed at opposite sides of the base (185 a), i.e., the motor is a split type. The design of the split type motor cancels a waterproof sleeve structure (a structure for waterproof shielding of the coil winding 186) of the traditional micro mechanical driving pump, and waterproof isolation is carried out on the coil winding 186 through the base (185 a), so that the space can be saved, and the thickness of the micro mechanical driving pump is reduced.

The overall thickness (the dimension in the extending direction of the rotating shaft 185 j) of the drive pump 18 of the first embodiment is small, and may be, for example, less than or equal to 20mm, or may even be no more than 10mm. Such a drive pump 18 may be referred to as a micro-drive pump. The micro drive pump can save space and can be applied to the mobile terminal device 10 having a small overall size.

In the first embodiment, a driving signal of the mobile terminal device 10 may be applied to the coil winding 186 of the driving pump 18 through the flexible circuit board 187, so that electromagnetic induction is generated between the coil winding 186 and the magnet 183f, and a torque for driving the magnet 183f to rotate is generated, thereby driving the impeller assembly 183 to rotate around the rotating shaft 185 j. The impeller assembly 183 may be rotated in the forward direction or the reverse direction according to a different driving signal.

When impeller assembly 183 rotates, working medium can be sucked into pump liquid space 18a through first liquid pipe 185c and pumped out of pump liquid space 18a through second liquid pipe 185 b; or the working fluid is sucked into the pumping space 18a through the second liquid pipe 185b and pumped out of the pumping space 18a through the first liquid pipe 185c. Wherein, for a single moving sealed cavity, the moving sealed cavity will be communicated with the first liquid pipe 185c or the second liquid pipe 185b (the interval between two adjacent vanes 183c will be communicated with the first liquid pipe 185c or the second liquid pipe 185 b) at a certain moment, and suck working medium with lower pressure. As the impeller assembly 183 rotates, the pressure of the working fluid within the moving seal cavity increases gradually. When the moving sealed chamber is communicated with the second liquid pipe 185b or the first liquid pipe 185c (the interval between the adjacent two vanes 183c is communicated with the second liquid pipe 185b or the first liquid pipe 185 c), the working medium of higher pressure is discharged. I.e. the pressure of the working medium pumped out of the liquid outlet is greater than the pressure of the working medium to be fed into the liquid inlet.

The pressure of the working medium in the pumping liquid space 18a is large, and the pressure of the working medium outside the pumping liquid space 18a is small. As shown in fig. 12a, the working fluid in pumping space 18a will leak in the direction of the proximity of sealing ring 182 under the action of the pressure difference. As described above, the pumping space 18a is spaced from the sealing ring 182 by the volute 181 and the surface of the base (185 a). When the working medium flows through the gap between the pump liquid space 18a and the sealing ring 182, the pressure of the working medium is gradually reduced, and the pressure of the working medium finally leaked to the sealing ring 182 is small, and the sealing ring 182 can ensure that the working medium after pressure reduction is separated, so that the working medium cannot be leaked continuously, and the working medium is sealed in the driving pump 18.

In this embodiment, the clearance between the impeller assembly 183 and the inner wall of the pumping space 18a is a critical design parameter that affects the performance of the drive pump 18. By designing the movement fit clearance within the range of 0.1-500 mu m, the defects of high friction, high noise, high input power, weak drop deformation resistance, sensitivity to solid foreign matters in working media, easiness in interference, even stalling and the like generated when the driving pump 18 works due to the fact that the movement fit clearance is too small can be avoided, and the defects of performance reduction and the like of the driving pump 18 due to the fact that the movement fit clearance is too large can be avoided. The design of the movement fit clearance of the embodiment can not only ensure the performance of the driving pump 18, but also give consideration to the working reliability of the driving pump 18.

In the first embodiment, the shaft 185j is integrally formed with the base (185 a), and the shaft 185j and the base (185 a) are kept stationary while the pump 18 is driven. The bearing 183e is integrally formed with the impeller 183a, and the bearing 183e rotates with the impeller 183a when the drive pump 18 is operated. Because the size precision, the runout degree, the coaxiality, the surface roughness and the like of the rotating shaft 185j, the coaxiality, the runout degree and the like of the impeller 183a, the size precision, the coaxiality, the runout degree, the surface roughness and the like of the bearing 183e, the size precision, the surface roughness and the like of the blade 183c, the size precision, the coaxiality, the surface roughness and the like of the pump liquid space 18a are easily controlled by an integral forming process (such as an injection molding process), the formed impeller assembly 183 and the base assembly 185 can form high-precision and low-noise matching only through a simple self-matching formula without additionally using a high-precision assembling tool clamp, the rotating precision and the performance of the driving pump 18 can be greatly improved, the production yield is greatly improved, and the cost is reduced.

In the first embodiment, the liquid cooling control device 15 is used to adjust the indexes such as the flow mode and the flow speed of the working medium and other flow indexes to meet the heat dissipation requirement of the system, so as to prevent the non-condensable gas, the foreign matters and the like from entering the driving pump 18 or the narrow part of the flow pipeline of the working medium, which may cause the rotation blockage of the driving pump 18, abnormal friction or noise. The liquid-cooled control means 15 may be arranged in a low pressure region of the flow line of the working substance, for example in a low pressure region of the inlet of the drive pump 18, downstream of a sudden change in the diameter of the pipe of the flow line, or in a sudden drop in the flow rate in a cold plate (which will be described below). The number and the position of the liquid cooling control devices 15 can be set according to design requirements, and are not limited to those shown in fig. 1.

The liquid cooling control device 15 may include at least one of flow control devices such as a flow distributor, an expansion valve, a stop valve, a safety valve, a gas-liquid separator, a dryer, a gas collection and dust removal device, and the like. The liquid cooling control device 15 will be described as an example of a gas collecting and dust removing device.

As shown in fig. 13, in the first embodiment, the liquid cooling control apparatus 15 may include a housing 151 and a filter 152 installed in the housing 151. Wherein the housing 151 has an inner cavity with an inlet 151a and an outlet 151b. The portion of the housing 151 adjacent to the filter 152 may be made of a transparent material to observe the operation of the filter 152. Illustratively, the entire housing 151 may be made of a transparent material. A filter screen 152 is mounted in the interior chamber between the inlet 151a and the outlet 151b.

The filter 152 may have a number of mesh structures, the mesh having a small pore size, for example, approximately 50 μm. Illustratively, the end of the filter screen 152 facing the inlet 151a may form a guide tip. The pilot tip may be approximately conical with the conical tip facing the inlet 151a. The filter screen 152 can be made of a material compatible with the working medium, so that the working medium does not react with the filter screen 152 and the working medium does not corrode the filter screen 152. For example, the filter screen 152 may be made of a conductive material (e.g., metal), and the filter screen 152 can generate a strong adsorption force to the impurities when being powered on, so as to enhance the filtering effect of the impurities (the adsorption and filtering effect of the filter screen 152 on the impurities will be described below).

The inlet 151a and the outlet 151b of the liquid cooling control device 15 can be communicated with the liquid cooling channel 19, and the working medium can enter the liquid cooling control device 15. Fig. 13 shows the working medium entering the housing 151 of the liquid cooling control device 15 in dotted shading. When the active liquid cooling heat dissipation system works, solid impurities (for example, plastic particles or plastic fibers falling off from an injection molding part under the friction impact of a working medium) and non-condensable gas are possibly generated and introduced, so the solid impurities and the non-condensable gas (hereinafter, collectively referred to as impurities) can be mixed in the working medium. In FIG. 13, solid impurities are indicated by black filled circles and non-condensable gases are indicated by open circles.

As shown in fig. 13, after the working medium carrying impurities flows into the inner cavity of the housing 151 from the inlet 151a, the impurities are adsorbed by the filter screen 152, and the working medium can pass through the filter screen 152 and flow out from the outlet 151b. The shape design of the guide tip of the filter screen 152 can reduce the fluid resistance and avoid the fluid from generating turbulence, so that the driving pump 18 does not need a large pressure head and can avoid reducing the flow of the working medium.

The scheme of embodiment one can adsorb impurity in filter screen 152 through design liquid cooling controlling means 15 to block impurity in liquid cooling controlling means 15, avoid it to get into drive pump 18, can ensure drive pump 18's working property, avoid drive pump 18 to appear stifled commentaries on classics, noise etc. unusually.

As shown in fig. 14, unlike the liquid cooling control apparatus 15 of the first embodiment, the liquid cooling control apparatus 15 of the second embodiment may include at least two filters, for example, a first filter 153, a second filter 154, and a third filter 155. The first filter 153, the second filter 154, and the third filter 155 are sequentially arranged, the first filter 153 is adjacent to the inlet 151a, and the third filter 155 is adjacent to the outlet 151b. The filters may be connected or may not be connected and spaced apart, for example, the first filter 153, the second filter 154 may be connected and the second filter 154 and the third filter 155 may be spaced apart. The shape of each filter screen and the number (or number of stages) of the filter screens can be designed according to actual needs, and fig. 14 is only an illustration.

The mesh apertures of the respective filter meshes are sequentially reduced in the direction from the inlet 151a to the outlet 151b. For example, the aperture size relationship of the meshes of the first filter 153, the second filter 154 and the third filter 155 is: the aperture of the first filter 153 > the aperture of the second filter 154 > the aperture of the third filter 155. The mesh size of the entire filter mesh may be in the range of 10 μm to 200 μm.

The operating principle of the liquid cooling control apparatus 15 in the second embodiment is as follows: after the working medium carries impurities to flow into the inner cavity of the housing 151 from the inlet 151a, the impurities with larger particle sizes are adsorbed by the first filter screen 153, the impurities with medium particle sizes are adsorbed by the second filter screen 154, and the impurities with smaller particle sizes are adsorbed by the third filter screen 155. That is, the liquid cooling control device 15 has a function of filtering in stages.

In the second embodiment, by designing the multi-stage filter screens, the total fluid impedance of the liquid cooling control device 15 is small, the filtering effect is good, the reliability is high, and the replacement period is longer.

As shown in fig. 15, unlike the above embodiments, the housing 151 of the liquid cooling control apparatus 15 in the third embodiment may include a first portion 151c, a second portion 151d, and a third portion 151e connected in sequence, and the pipe diameter of the second portion 151d is larger than the pipe diameters of the first portion 151 and the third portion 151 e. The second portion 151d may be raised relative to the first portion 151 and the third portion 151e, which together define an interior of the housing 151.

As shown in fig. 15, a first filter 156 and a second filter 157 may be disposed within the housing 151, and both may be located within the area enclosed by the second portion 151 d. First filter 156 and second filter 157 may be integrally formed, or they may be of unitary construction. Wherein the first filter 156 may surround the outer periphery of the second filter 157, a side of the first filter 156 facing the outlet 151b (e.g., a right side of the first filter 156 in fig. 15) may abut against the second portion 151d, and the remaining sides of the first filter 156 (e.g., a left side and an upper side of the first filter 156 in fig. 15) may have a first interval 15a from the second portion 151 d. An end of the second filter 157 facing the inlet 151a (e.g., the left end of the second filter 157 in fig. 15) may have a second spacing from the first and

second portions

151 and 151 d.

The liquid cooling control device 15 in the third embodiment operates on the following principle: after the working medium carrying impurities flows into the inner cavity of the housing 151 from the inlet 151a, a part of the fluid will enter the first space 15a with smaller fluid impedance, and the impurities therein will be adsorbed by the first filter 156. Another part of the fluid will flow through the second filter 157, and the impurities therein will be adsorbed by the second filter 157.

The scheme of embodiment three is through the sectional area of increase filter screen, can filter more impurity, avoids the foreign matter to pile up in the position of flow dead angle, reduces the load and the impedance of filter screen, prolongs the replacement cycle.

It will be readily appreciated that in the third embodiment, only one side of the first filter 156 facing the inlet 151a (for example, the left side of the first filter 156 in fig. 15) is spaced from the second portion 151d, and the remaining sides of the first filter 156 (for example, the upper side and the right side of the first filter 156 in fig. 15) are abutted against the second portion 151d, so as to shunt the fluid and filter impurities.

As shown in fig. 16, according to the third embodiment, in the fourth embodiment, a backflow prevention structure 15b may be provided in the second portion 151d of the housing 151 of the liquid cooling control apparatus 15. The backflow prevention structure 15b may be protruded at any region on the inner surface of the second portion 151d, and the illustration of fig. 16 is merely an illustration.

The shape of the backflow prevention structure 15b may be approximately plate-shaped or strip-shaped, and the shape shown in fig. 16 is only an illustration.

The backflow preventing structure 15b may be inclined toward the flow direction of the fluid, that is, the backflow preventing structure 15b is inclined in a direction from the inlet of the first space 15a to the inside of the first space 15a. For example, as shown in fig. 16, the backflow preventing structure 15b located on the left side of the inner surface of the second portion 151d extends to the upper right or lower right, and the backflow preventing structure 15b located on the right side of the inner surface of the second portion 151d extends to the upper left or lower left.

The number of the backflow preventing structures 15b may be designed as desired, and the illustration in fig. 16 is merely an illustration.

Under the action of gravity, the fluid entering the second portion 151d may flow backward, which may cause impurities in the fluid in the second portion 151d to flow backward into the first portion 151c, impair the filtering action of the first filter 156 in the second portion 151d, or lose the filtering action of the first filter 156.

In the fourth embodiment, by designing the backflow-preventing structure 15b in the second portion 151d, the backflow-preventing structure 15b is inclined towards the flow direction of the fluid in the second portion 151d, when the fluid flows in a backward direction (for example, turbulent eddies occur), the flow resistance of the backflow-preventing structure 15b to the solid foreign matters in the fluid is large, and the backflow-preventing structure has a strong adsorption effect on the non-condensable gas in the fluid, so that the solid foreign matters and the non-condensable gas can be ensured to be stably deposited at the dead flow angle in the second portion 151d, and the backflow of the solid foreign matters and the non-condensable gas into the first portion 151c can be avoided. Therefore, the fourth embodiment can reduce or prevent the reverse flow of the fluid in the second portion 151d, ensure that the second filter 157 can reliably perform the filtering function, and can prolong the replacement period and the service life of the first filter 156 and the second filter 157.

As shown in fig. 17, according to an embodiment of the third embodiment, in the fifth embodiment, a waterproof and breathable layer 158 may be provided on an outer surface of the second portion 151d of the housing 151 of the liquid-cooled controller 15, and the waterproof and breathable layer 158 may be provided at a convex position of the second portion 151d with respect to the first portion 151 c. The waterproof and breathable layer 158 may or may not surround the second portion 151d for one revolution.

The waterproof breathable layer 158 may be made of a waterproof breathable material, for example, may be made of a waterproof breathable film. The waterproof and breathable layer 158 is permeable to small molecules of gas, but impermeable to liquids and solids of larger molecules. After the waterproof and breathable layer 158 is designed, when the pressure in the active liquid cooling heat dissipation system is greater than the external atmospheric pressure, the gas in the fluid in the second portion 151d can escape to the outside through the waterproof and breathable layer 158, so that the inner cavity environment of the liquid cooling control device 15 can meet the heat dissipation requirement, for example, the inner cavity has a sufficient effective volume, and the gas content in the inner cavity is not higher than the design threshold value.

In the fifth embodiment, the waterproof and breathable layer 158 is designed on the outer surface of the second portion 151d because the gas in the fluid is likely to be accumulated in the second portion 151d in a large amount. It will be readily appreciated that a waterproof and breathable layer 158 may also be provided on the outer surface of the first portion 151c and/or the outer surface of the third portion 151 e.

In addition, the waterproof breathable layer 158 may be designed based on the fourth embodiment, that is, the liquid cooling control device 15 may include the backflow prevention structure 15b and the waterproof breathable layer 158 at the same time. In fact, the design of the waterproof and breathable layer 158 is applicable to the first to fourth embodiments described above, wherein the waterproof and breathable layer 158 may be provided on any region of the outer surface of the housing 151.

As shown in fig. 18, unlike the third embodiment, a side of the first filter 156 facing the inlet 151a (e.g., a left side of the first filter 156 in fig. 18) and a side of the outlet 151b (e.g., a right side of the first filter 156 in fig. 18) may be adjacent to the second housing 151d, and the remaining side of the first filter 156 (e.g., an upper side of the first filter 156 in fig. 18) may be spaced apart from the second housing 151 d. The end of second filter 157 facing inlet 151a may be offset from the end of first filter 156 facing inlet 151a, with the end of first filter 156 facing inlet 151a being closer to inlet 151a and the end of second filter 157 facing inlet 151a being further from inlet 151a. The end of the second filter 157 facing the outlet 151b may be offset from the end of the first filter 156 facing the outlet 151b, with the end of the first filter 156 facing the outlet 151b being further from the outlet 151b and the end of the second filter 157 facing the outlet 151b being closer to the outlet 151b.

In other embodiments, all sides of the first filter 156 may abut the second housing 151d; and/or, an end of second filter 157 facing outlet 151b may be substantially aligned with an end of first filter 156 facing outlet 151b.

In the sixth embodiment, the fluid will flow along the path with the least flow resistance, the impurities in the fluid will be preferentially adsorbed by the second filter 157, and the larger impurities will be collected at the end of the second filter 157 facing the inlet 151a. The fluid will also pass through first filter 156. First filter 156 can also adsorb impurities in the fluid.

In the sixth embodiment, the waterproof and breathable layer 158 may be provided on the outer surface of the housing 151.

As shown in fig. 19, unlike the above-described embodiments, the first portion 151c and the third portion 151e in the housing 151 of the liquid cooling control apparatus 15 of the seventh embodiment may have a step difference, that is, the connection position of the first portion 151c on the second portion 151d is not collinear with the connection position of the third portion 151e on the second portion 151d, and the two connection positions have a step difference (for example, a step difference in the up-down direction in fig. 19). For example, the first portion 151c may be near the top of the second portion 151d (top referring to the end opposite the level of working fluid within the second portion 151 d), and the third portion 151e may be near the bottom of the second portion 151d (bottom being the end opposite the top of the second portion 151 d).

Illustratively, a filter 159 in the second portion 151d may be disposed at a corner of the second portion 151d near the third portion 151 e.

In the sixth embodiment, the second portion 151d has a larger diameter and a larger volume, and can be used as a liquid storage tank. Due to the large caliber and volume of the second portion 151d, the flow rate of the fluid entering the second portion 151d from the first portion 151c will decrease, which is beneficial to the rising of the gas and the falling of the solid in the fluid, thereby realizing the gas-liquid separation. The settled solid impurities will be adsorbed by the filter screen 159. The third portion 151e is attached to the bottom of the second portion 151d to facilitate the flow of fluid filtered by the screen 159 out of the second portion 151 d.

In the seventh embodiment, the outer surface of the housing 151 may be provided with a waterproof and breathable layer 158.

The drive pump 18 of the first embodiment is very precise, and the dynamic seal has a seal gap of 0.1 μm to 500 μm, for example, 1 μm to 20 μm, and its operating conditions are also severe. This causes foreign substances to seriously affect the operational performance of the drive pump 18, resulting in noise generation of the drive pump 18. The liquid cooling control device 15 is designed to ensure that the drive pump 18 can operate reliably for a long period of time.

In the first to seventh embodiments, the liquid cooling control device 15 may be a separate component, which facilitates maintenance of the liquid cooling control device 15 alone. In other embodiments, the filter screen, the waterproof, breathable membrane, and the backflow prevention structure described above may be integrated within the drive pump 18, the liquid cooling conduit 19, and/or the cold plate.

In one embodiment, the material of the liquid cooling pipe 19 includes, but is not limited to, plastic, metal, or composite material. The liquid cooling pipe 19 may be rigid and not easily bent and deformed; or the mobile terminal device 10 may be flexible and easily bent and deformed, so that the impact of falling deformation and the like during the use of the mobile terminal device 10 can be buffered, or the mobile terminal device 10 is suitable for a folding scene. The liquid cooling pipe 19 may be, for example, a plastic corrugated pipe, a metal corrugated pipe, a flexible plastic pipe, a flexible metal pipe, or the like.

In the first embodiment, in order to avoid evaporation (evaporation loss) of the working medium in the liquid-cooling pipe 19, a surface (which may be an outer surface or an inner surface) of the liquid-cooling pipe 19 may be coated with a lyophobic layer.

In the first embodiment, the liquid cooling pipe 19 may be attached to the surface of the heat generating device through a thermal interface material, and the liquid cooling pipe 19 is in indirect contact with the heat generating device (or called the liquid cooling pipe 19 passes through the heat generating device from the outside of the heat generating device). Such liquid cooling pipes 19 may be referred to as external liquid cooling pipes. The thermal interface material may have a thermal conductivity greater than or equal to 0.8 (W/m.K), such as 1 (W/m.K), 10 (W/m.K), or even in excess of 100 (W/m.K). The thermal interface material includes, but is not limited to, a carbon fiber thermal pad, a graphene thermal pad, or a liquid metal thermal interface material. The thermal interface material may also have a certain elasticity, and the compressibility of the thermal interface material may be greater than or equal to 5%. The elastic thermal interface material can fully extrude air between the two, and ensure that the two are in close contact.

As shown in fig. 1, the liquid cooling pipe 19 of the first embodiment is connected to the heat generating devices in series. Working medium flows through each heating device in sequence, and shunt cannot be generated. The heating devices are connected in series, and the advantages are that: the flow of the working medium passing through each heating device is equal, so that the working medium cannot be shunted or attenuated, and the full heat dissipation of each heating device is facilitated.

The working principle of the active liquid cooling heat dissipation system of the first embodiment is as follows: the driving pump 18 drives the working medium to circularly flow in the liquid cooling pipeline 19, and the working medium absorbs the heat of the heating device when flowing through the heating device and releases the heat to other low-temperature areas in the mobile terminal equipment 10, so that the heat dissipation of the heating device and the temperature uniformity of the whole machine can be realized. According to the requirement, the liquid cooling control device 15 can adjust the indexes such as the flow mode, the flow speed and the like of the working medium and other flow indexes to meet the heat dissipation requirement of the system, and prevent bubbles, foreign matters and the like from entering the driving pump 18 or the narrow part of the flow pipeline of the working medium.

The heat dissipation efficiency can be characterized by a heat transfer coefficient. The heat exchange coefficient of the active liquid cooling heat dissipation system of the first embodiment can reach 10W/(m) ² ·℃)-1000W/(m ² C.) is, for example, 50W/(m) ² ·℃)-500W/(m ² And DEG C), which shows that the active liquid cooling heat dissipation system has higher heat dissipation efficiency, can fully dissipate heat of the mobile terminal equipment 10, and reduces the temperature of a heating device.

Temperature differences can be used to characterize temperature uniformity. In the first embodiment, taking the mobile terminal device 10 as a folding mobile phone with the active liquid cooling heat dissipation system as an example, the temperature difference between the main screen and the auxiliary screen of the folding mobile phone is less than or equal to 8 ℃. Particularly, for some heating devices in the mobile terminal device 10, the temperature difference is less than or equal to 2 ℃, and the constant temperature can be realized. This shows that the active liquid-cooled heat dissipation system can maintain good temperature uniformity of the mobile terminal device 10.

In the first embodiment, when the working medium can generate phase change in the flowing process (that is, the active liquid cooling heat dissipation system adopts the phase change active cooling technology), the working medium in the flowing pipeline can absorb heat through phase change latent heat (which refers to the heat absorbed or released in the process of changing from one phase to another phase of a substance with unit mass under the conditions of constant temperature and pressure), and the equivalent specific heat of the working medium is 10-10000 times that of the working medium when no phase change occurs, so that the demand of the active liquid cooling heat dissipation system on the working medium is less. For example, compared with the conventional mode of sensible heat absorption through temperature rise of the working medium, the scheme of the embodiment can reduce the working medium demand by more than 80%. This can greatly reduce the head and head requirements for the drive pump 18, and can make the operating noise of the drive pump 18 less, or even quiet.

In addition, the active liquid cooling heat dissipation system of the first embodiment can use the driving pump, so that the volume of the active liquid cooling heat dissipation system can be smaller, the active liquid cooling heat dissipation system is suitable for a mobile terminal with a smaller size, and the heat dissipation performance and the temperature equalization performance of the mobile terminal are greatly improved.

Example two

As shown in fig. 20, unlike the first embodiment, in the mobile terminal device 20 according to the second embodiment, the liquid cooling pipes 19 connect the heat generating devices in parallel. By "parallel" it is meant that the liquid-cooled conduit 19 may include a main conduit 191 and a plurality of branch conduits (e.g., branch conduit 192, branch conduit 193, branch conduit 194) each having two ends in communication with the main conduit 191, the branch conduits being arranged side-by-side and spaced apart (similar to a parallel circuit). The number of the branch pipes shown in fig. 20 is merely illustrative, and the second embodiment is not limited thereto. In fact, the number of branch pipes in the second embodiment may be at least one. In fig. 20, a main pipe 191 may be schematically represented by a thick line frame located around, and the main pipe 191 connects the camera module 12, the driving pump 18, the chip-scale system 14, and the liquid cooling control device 15. The branch conduit 192, the branch conduit 193 and the branch conduit 194 may be schematically represented by thick lines located within the area enclosed by the main conduit 191 and connected at both ends thereof to the main conduit 191. Branch line 192 is also connected to charging module 16, branch line 193 is also connected to battery 17, and branch line 194 is also connected to battery 17.

It should be understood that the shapes and positions of the main pipe 191 and the branch pipes, the number of the branch pipes and the connected heat generating devices shown in fig. 20 are illustrative, and are not intended to limit the embodiment.

In the second embodiment, the liquid cooling pipes 19 cover the heat generating devices in parallel, and the working medium is distributed from the main pipe 191 to the branch pipes, exchanges heat with the heat generating devices connected to the branch pipes, and then converges in the main pipe 191.

The parallel connection of the heating devices has the advantages that: the working medium which enters each heating device along the flowing direction of the working medium has lower temperature because the working medium does not absorb heat, and the working medium has larger heat absorption capacity, thereby being beneficial to the heat dissipation and temperature equalization of the heating devices. And the total flow resistance of the liquid cooling pipes 19 in parallel is smaller compared to the liquid cooling pipes in series. On the premise that the input power of the driving pump 18 is not changed, the total flow of the liquid cooling pipelines 19 can be ensured to be larger, and the heat dissipation performance of the active liquid cooling heat dissipation system can be improved; on the premise that the total flow rate of the liquid cooling pipes 19 is constant, the input power of the drive pump 18 can be made small, which is beneficial to reducing the rotating speed of the drive pump 18 and inhibiting the vibration noise generated by the drive pump 18.

In the second embodiment, the liquid cooling control device 15 may be provided at the inlet or in the middle of the branch pipe 192, the branch pipe 193, and/or the branch pipe 194 as necessary. During the use of the mobile terminal device 20, corresponding adjustments may be made for different scenarios. If the charging module 16 connected to the branch pipe 192 does not generate heat for the shooting scene, the liquid cooling control device 15 located on the branch pipe 192 may close the branch pipe 192. Or for the game scenario, the batteries 17 connected to the

branch pipes

193 and 194 generate less heat, and the liquid-cooling control device 15 located on the

branch pipes

193 and 194 may close the

branch pipes

193 and 194.

EXAMPLE III

As shown in fig. 21, unlike the first and second embodiments, in the mobile terminal apparatus 30 according to the third embodiment, the liquid cooling pipes 19 connect the heat generating devices in a series-parallel manner. By "parallel-series" is meant that the liquid cooling pipes 19 are both in series and in parallel.

Illustratively, the liquid-cooled conduits 19 may include a trunk conduit 191, a branch conduit 192, a branch conduit 193, a branch conduit 194, and a branch conduit 195. The main pipe 191 may be a pipe extending from both ends of the driving pump 18, both ends of the liquid cooling control device 15, and both ends of the chip-scale system 14. The branch conduit 192 is connected in parallel with the branch conduit 193, and both can be connected to the battery 17. Branch conduit 194 is connected in parallel with branch conduit 195. Wherein the branch pipe 194 may be connected to the charging module 16; the branch pipe 195 may connect the camera module 12 and the sensor 13 in series. It can be considered that branch conduit 192 is connected in parallel with branch conduit 193 to form a first branch conduit, and branch conduit 194 is connected in parallel with branch conduit 195 to form a second branch conduit, the first branch conduit being in series relationship with the second branch conduit.

It should be understood that the shapes and positions of the main pipe 191 and the branch pipes, the number of the branch pipes and the connected heat generating devices shown in fig. 21 are illustrative, and are not intended to limit the embodiment.

The third embodiment can combine the advantages of the first and second embodiments:

for the heating devices or heating device groups (composed of at least two heating devices) connected in series, the flow of the working medium passing through each heating device or heating device group is equal, and the working medium cannot be shunted or attenuated, so that the heat of each heating device or heating device group can be fully dissipated.

For the heating devices or heating device groups connected in parallel, the working medium begins to enter each heating device or heating device group along the flowing direction of the working medium, and the working medium has higher heat absorption capacity because the temperature is lower without absorbing heat, thereby being beneficial to the heat dissipation and temperature equalization of the heating devices or heating device groups.

In addition, compared with the design that the liquid cooling pipelines are completely connected in series, the total flow resistance of the liquid cooling pipeline 19 connected in series and in parallel is smaller. On the premise that the input power of the driving pump 18 is not changed, the total flow of the liquid cooling pipelines 19 can be ensured to be larger, and the heat dissipation performance of the active liquid cooling heat dissipation system can be improved; on the premise that the total flow of the liquid cooling pipes 19 is constant, the input power of the driving pump 18 can be made smaller, which is beneficial to reducing the rotating speed of the driving pump 18 and inhibiting the vibration noise generated by the driving pump 18.

Three liquid cooling pipe 19 layouts (series, parallel, series-parallel) are described above. In fact, the appropriate layout can be selected according to the needs. For example, the layout of the liquid cooling pipe 19 may be determined by comprehensively evaluating the pressure loss and flow rate of the liquid cooling pipe 19, the output performance of the drive pump 18, the heat generation amount and layout of the heat generating device, and the like. Therefore, the heating device can realize the lowest temperature and the highest temperature uniformity of the whole machine under the lowest liquid cooling power consumption through proper flow pipeline design and flow distribution mode.

Example four

This embodiment will describe a flexible, bendable liquid cooling pipe. The liquid cooling pipe can be used for foldable equipment such as a foldable mobile phone or a notebook computer. This liquid cooling pipeline also can be used for wearable equipment, like intelligent wrist-watch, intelligent bracelet etc. For example, this liquid cooling pipeline can be established in the wrist strap of intelligent wrist-watch to the coiling and the expansion of adaptation wrist strap, thereby make the wrist strap participate in the heat dispersion that the heat dissipation promoted wearable equipment.

Fig. 22 is a schematic configuration block diagram of a foldable mobile terminal device 40. As shown in fig. 22, the mobile terminal device 40 may include a first portion 41 and a second portion 43 connected by a hinge 42. The hinge 42 enables the mechanical movement to enable the first portion 41 and the second portion 43 to fold and unfold relative to each other. One of the first and

second portions

41, 43 may be, for example, a primary screen portion and the other may be, for example, a secondary screen portion.

As shown in fig. 22, a first liquid cooling pipeline 491 is disposed in the first portion 41, and the first liquid cooling pipeline 491 may be an external liquid cooling pipeline (or an internal liquid cooling pipeline to be described later), and is not limited to a serial, parallel or series-parallel arrangement. The second portion 43 is provided with a second liquid cooling pipeline 493, and the second liquid cooling pipeline 493 may be an external liquid cooling pipeline (or an internal liquid cooling pipeline to be described later), which is not limited to a serial, parallel or serial-parallel arrangement.

As shown in fig. 22, the mobile terminal device 40 may further include a third liquid-cooled conduit 492 (which may be referred to as a trans-axial liquid-cooled conduit) spanning the hinge 42, with "spanning" meaning that the third liquid-cooled conduit 492 extends in a direction that intersects the axis of rotation of the first portion 41 (i.e., the axis of rotation of the hinge 42). Two third fluid cooling conduits 492 are illustrated, and the number of third fluid cooling conduits 492 may be determined in practice according to the layout of the fluid cooling conduits. Opposite ends of the third liquid-cooling pipeline 492 are respectively connected to the first liquid-cooling pipeline 491 and the second liquid-cooling pipeline 493 (fig. 22 shows the third liquid-cooling pipeline 492 connected to the first liquid-cooling pipeline 491 and the second liquid-cooling pipeline 493 by using a closed dashed frame, and the same representation is adopted hereinafter). Thus, the first, third and second liquid-cooled

conduits

491, 492, 493 are in communication and form a loop, enabling heat exchange between the first and

second portions

41, 43.

Fig. 23 shows a schematic cross-sectional structure of a third liquid-cooled conduit 492 in the mobile terminal apparatus 40. As shown in fig. 23, the third liquid-cooled conduit 492 may be a hollow structure with a wall 492a enclosing a passage 492c. Channel 492c is for the flow of working fluid. The tube wall 492a is flexible and bendable, such that the third fluid-cooled conduit 492 is a flexible fluid-cooled conduit. The material of the tube wall 492a includes, but is not limited to, a polymer material (e.g., polyimide), or a metal-plastic composite (polyimide copper clad material). The third liquid-cooled conduit 492 has a bendable region 492b. When the first portion 41 is folded or unfolded relative to the second portion 43, the bendable region 492b can be bent or unfolded accordingly. The number of the bendable regions 492b may be designed as desired and is not limited to that shown in fig. 23.

Fig. 24 shows another schematic cross-sectional structure of the third liquid-cooled conduit 492 in the mobile terminal apparatus 40. Unlike the structure shown in fig. 23, the tube wall 492a of the third liquid-cooled tube 492 of fig. 24 may have at least two layers, for example, three layers. Channels 492c are formed between every two adjacent layers of the tube walls 492a, and each channel 492c can be used for flowing the working medium. The third liquid cooling pipeline 492 has larger flow, which is beneficial to improving the heat exchange efficiency of the working medium, thereby improving the heat dispersion and temperature equalization performance of the mobile terminal device.

The hinge 42 is typically the thickest portion of the mobile terminal device 40. In order to make the product thin, the thickness of the product at the hinge 42 is controlled, and thus the thickness dimension space of the mobile terminal device 40 at the hinge 42 is limited. To accommodate this requirement, the third fluid-cooled conduit 492 may be in the form of a flat sheet (like a flexible circuit board) spanning the hinge 42, for example, the third fluid-cooled conduit 492 may have a width of 4mm to 5mm and a thickness of less than 0.8 mm. The third liquid-cooled conduit 492 may be arranged in such a manner: when the third liquid-cooled tube 492 is bent, a thickness direction of the third liquid-cooled tube 492 may be directed to a rotation axis of the hinge 42.

To avoid loss of working fluid from the channel 492c due to evaporation, a barrier layer may be provided on the surface of the tube wall 492 a. For example, as shown in fig. 23 for the third fluid-cooled conduit 492, a barrier may be provided on the inner and/or outer surface of any of the walls 492 a. As for the third liquid-cooled conduit 492 shown in fig. 24, a barrier layer may be provided on the surface of any of the tube walls 492 a; alternatively, a barrier may be provided on the surface of a portion of the tube walls 492a, such as the outer surfaces of the outermost two tube walls 492a of the third liquid-cooled tubes 492.

The material of the barrier layer includes, but is not limited to, metal (e.g., copper) or inorganic. The barrier layer may have at least one layer. The manufacturing process of the barrier layer includes, but is not limited to, attaching, spraying, and the like. The barrier layer has the function of blocking working media.

In the fourth embodiment, by designing the flexible third liquid-cooling pipeline 492, not only the folding requirement of the mobile terminal device 40 can be met, but also the heat exchange between the first part 41 and the second part 43 of the mobile terminal device 40 can be realized, which is beneficial to further realizing the temperature equalization of the whole machine, and the heat of the main heating area can be diffused to the whole machine, thereby maximizing the heat dissipation area of the whole machine and improving the heat dissipation performance of the mobile terminal device 40.

The liquid cooling pipes (the liquid cooling pipe 19, the first liquid cooling pipe 491 or the second liquid cooling pipe 493) are all attached to the surface of the heat generating device, and the liquid cooling pipes are in indirect contact with the heat generating device, and such liquid cooling pipes can be called as external liquid cooling pipes. The liquid cooling pipe, which will be described later, is located inside the heat source and is in direct contact with the heat generating device, and this liquid cooling pipe may be referred to as a built-in liquid cooling pipe.

EXAMPLE five

Fig. 25 is a schematic cross-sectional view of a circuit board assembly 50 in the mobile terminal device according to the fifth embodiment, in which the cross-section of the device is not shown by hatching for clarity.

As shown in fig. 25, the circuit board assembly 50 may include a first circuit board 51 and a second circuit board 55, the first circuit board 51 and the second circuit board 55 being stacked with a space therebetween. The first circuit board 51 and the second circuit board 55 can be connected and supported by a frame 54, and the first circuit board 51, the frame 54 and the second circuit board 55 can enclose a closed space. The first circuit board 51 and the second circuit board 55 can be disposed with heat generating devices, for example, the first circuit board 51 can be disposed with the heat generating device 52 and the heat generating device 53, and the second circuit board 55 can be disposed with the heat generating device 56, the heat generating device 57 and the heat generating device 58. Since the heat of the heat generating device can be transferred to the circuit board, the circuit board can also be regarded as the heat generating device.

As shown in fig. 25, the first circuit board 51 may have a first liquid cooling passage 51a inside thereof, and the first liquid cooling passage 51a is located between upper and lower surfaces (both upper and lower surfaces are device arrangement surfaces) of the first circuit board 51. The first liquid cooling passage 51a may penetrate a side surface of the first circuit board 51 (a normal direction of the side surface may be substantially perpendicular to the thickness direction of the first circuit board 51) in an extending direction (a direction perpendicular to the thickness direction) of the first circuit board 51. There may be at least one first liquid cooling passage 51a, and the illustration in FIG. 25 is merely exemplary. The first liquid-cooling passages 51a may be spaced apart from each other, or at least a part thereof may communicate with each other.

As shown in fig. 25, the second circuit board 55 may have a second liquid-cooling passage 55a inside, the second liquid-cooling passage 55a being located between upper and lower surfaces of the second circuit board 55. The second liquid cooling passage 55a may penetrate a side surface of the second circuit board 55 (a normal direction of the side surface may be substantially perpendicular to the thickness direction of the second circuit board 55) in an extending direction of the second circuit board 55 (a direction perpendicular to the thickness direction). There may be at least one second liquid-cooled passage 55a, and the illustration in fig. 25 is merely an illustration. The second liquid-cooling passages 55a may be separated from each other, or at least a part thereof may communicate.

In the fifth embodiment, since the first liquid-cooling passage 51a is embedded in the first circuit board 51 and the second liquid-cooling passage 55a is embedded in the second circuit board 55, the first liquid-cooling passage 51a and the second liquid-cooling passage 55a may be referred to as a built-in liquid-cooling pipe.

In a fifth embodiment, other areas in the mobile terminal device also have liquid cooling pipelines (hereinafter referred to as other liquid cooling pipelines), and the other liquid cooling pipelines may include external liquid cooling pipelines (the external liquid cooling pipelines are not limited to be connected in series, in parallel, or in series-parallel), and/or internal liquid cooling pipelines (for example, the internal liquid cooling pipelines in the fifth embodiment, or the internal liquid cooling pipelines to be described later). The first liquid cooling passage 51a and the second liquid cooling passage 55a in the electric board assembly 50 can both communicate with the other liquid cooling pipes. Thus, the working medium can enter the first liquid cooling passage 51a and the second liquid cooling passage 55a through other liquid cooling pipes. Working medium in the first liquid cooling channel 51a can dissipate heat of the heating device on the first circuit board 51, and working medium in the second liquid cooling channel 55a can dissipate heat of the heating device on the second circuit board 55.

In the fifth embodiment, the working medium in the first liquid cooling passage 51a and the second liquid cooling passage 55a directly contacts the circuit board, and a heat conducting medium is not needed, so that the thermal contact resistance between the working medium and the circuit assembly 50 is reduced, the total thermal resistance of the circuit assembly 50 is greatly reduced, the heat of the circuit assembly 50 can be absorbed by the working medium more, and the heat dissipation performance of the circuit assembly 50 can be greatly improved.

It will be readily appreciated that the first circuit board 51 and the second circuit board 55 of the circuit board assembly 50 are provided with built-in liquid cooling conduits, by way of example only. In fact, only one of the first circuit board 51 and the second circuit board 55 needs to have a built-in liquid cooling pipe. In addition, the design of the built-in liquid cooling channel in the fifth embodiment can also be applied to a single-layer circuit board.

EXAMPLE six

Fig. 26 is a schematic cross-sectional structure diagram of a system-in-package module 60 in the mobile terminal device according to the sixth embodiment, in which the cross-section of the device is not shown by hatching for clarity.

As shown in fig. 26, the system-in-package module 60 may include a first package substrate 61, a second package substrate 70, and a sealing frame 66 located between the first package substrate 61 and the second package substrate 70. The first package substrate 61 and the second package substrate 70 are stacked with a space therebetween, the sealing frame 66 connects the first package substrate 61 and the second package substrate 70, and the first package substrate 61, the sealing frame 66, and the second package substrate 70 may enclose an enclosed space 60a. The heat generating device 63, the heat generating device 64, and the heat generating device 65 may be disposed on the first package substrate 61. The second package substrate 70 may arrange the heat generating device 67, the heat generating device 68, and the heat generating device 69. The heat generating device 62, the heat generating device 63, the heat generating device 65, the heat generating device 67, and the heat generating device 69 may be located in the closed space 60a.

In the sixth embodiment, the closed space 60a of the system-in-package module 60 can also be used as a liquid-cooling duct, which is a built-in liquid-cooling duct (the liquid-cooling duct is shown by the shaded area in fig. 26).

In a sixth embodiment, other areas in the mobile terminal device also have liquid cooling pipes (hereinafter referred to as other liquid cooling pipes), and the other liquid cooling pipes may include external liquid cooling pipes (the external liquid cooling pipes are not limited to be connected in series, in parallel, or in series-parallel), and/or internal liquid cooling pipes (for example, the internal liquid cooling pipe in the fifth embodiment, or the internal liquid cooling pipe in the sixth embodiment). The enclosed space 60a of the system in package module 60 is in communication with the other liquid cooling conduits.

Therefore, the working medium can enter the closed space 60a through other liquid cooling pipelines to be in contact with the heating device 63, the heating device 65, the heating device 67 and the heating device 69 in the closed space 60a, and the heating devices can be immersed in the working medium. Thus, the heat generating devices can be radiated by the medium. It is understood that the heat generated by the heat generating devices (such as the heat generating device 64 and the heat generating device 68) located outside the enclosed space 60a can be absorbed by the working medium in the enclosed space 60a, so that the heat generating devices can also dissipate heat through the working medium.

In the sixth embodiment, since the closed space 60a of the system-in-package module 60 is used as the liquid cooling pipeline, the working medium is directly contacted with the heating device, and a heat conducting medium is not needed, so that the contact thermal resistance between the working medium and the system-in-package module 60 is greatly reduced, the total thermal resistance of the system-in-package module 60 is greatly reduced, the heat of the system-in-package module 60 can be absorbed by the working medium more, and the heat dissipation performance of the system-in-package module 60 can be greatly improved.

It is understood that the sixth embodiment describes the built-in liquid cooling pipe with respect to the system-in-package module 60, which is merely an example. In fact, the built-in liquid cooling pipeline can be applied to any heating device with an inner cavity.

The structure and layout of the liquid cooling pipes in the above embodiments are applicable to the embodiments to be described below. For the sake of brevity, the structure and layout of the liquid cooling pipes will not be described in detail below.

EXAMPLE seven

In the seventh embodiment, different from the above-mentioned embodiments, the driving pump in the mobile terminal device may be a capillary pump, and the mobile terminal device may further include a cold plate. The following describes the design of the capillary pump and the cold plate, respectively, and then describes the heat dissipation design of the mobile terminal device including the capillary pump and the cold plate.

Fig. 27 illustrates the principle structure of the capillary pump. As shown in fig. 27, the capillary pump 78 may include an inlet tube 781, a body 782, and an outlet tube 785, the inlet tube 781 and the outlet tube 785 being coupled to different locations of the body 782, respectively. It should be understood that the inlet tube 781 and the outlet tube 785 are shown as being connected to opposite sides of the main body 782, which is merely illustrative and not limiting.

As shown in fig. 27, the body 782 can have a cavity 783, the cavity 783 communicating with the inlet tube 781. A capillary structure 784 is provided in the cavity 783, and the capillary structure 784 occupies only a part of the space of the cavity 783. The capillary structure 784 has a large number of microchannels which have a capillary action and can adsorb liquid working media, but do not adsorb gaseous working media. The wicking structure 784 may be made of, for example, sintered powder, porous felt, porous cotton, metal foam, fiber tow, or other material having a wicking action. A capillary structure 784 may be adjacent to the cavity 783.

In the seventh embodiment, the working medium flowing through the liquid cooling pipeline can generate phase change between a gas state and a liquid state, and the liquid working medium absorbs heat when flowing through the heating device and is changed into the gas working medium; the gaseous working medium is cooled and released in the circulation process to become a liquid working medium. Since the power consumption load of the heat generating device is varied and sometimes does not reach a high power consumption level, the heat generation amount of the heat generating device is not significant. This causes the liquid working medium and the gaseous working medium to produce insufficient phase change, i.e. a part of the liquid working medium is converted into the gaseous working medium, and the other part of the liquid working medium does not produce phase change. The gaseous working medium may not be fully cooled to release heat, so that a part of the gaseous working medium is liquefied into a liquid working medium, and the other part of the gaseous working medium does not generate phase change. Therefore, the working medium in the liquid cooling pipeline can be a gas-liquid mixed working medium.

A gas-liquid mixed working substance may enter the cavity 783 of the capillary pump 78 from an inlet tube 781 in the capillary pump 78. At the moment, the liquid working medium in the gas-liquid mixed working medium is absorbed by the capillary structure 784, and the gaseous working medium is left in the cavity 783, so that the gas-liquid mixed working medium is subjected to gas-liquid separation. The liquid working medium absorbed by the capillary structure 784 can absorb the heat of the heating device and is vaporized into a gaseous working medium. Gaseous working fluid vaporized from the liquid working fluid can escape from capillary structure 784 and enter outlet tube 785 under capillary forces. Part of the gaseous working medium can be liquefied in the outlet pipe 785 and changed into liquid working medium; another part of the gaseous working substance can be kept in the gaseous state. Thus, exiting capillary pump 78 via outlet tube 785 may be a gas-liquid mixture of working fluid.

In the seventh embodiment, the inlet pipe 781 and the outlet pipe 785 of the capillary pump 78 are both communicated with the liquid cooling pipe, so that the capillary pump 78 can drive the gas-liquid mixed working medium to circulate in the liquid cooling pipe.

The volume of the capillary pump in the seventh embodiment is extremely small, so that the volume of the active liquid cooling heat dissipation system can be smaller, and the active liquid cooling heat dissipation system can be suitable for a mobile terminal with a smaller size.

In a seventh embodiment, the cold plate is connected to a liquid cooled conduit. The cold plate is provided with a cold plate cavity, the cold plate cavity is communicated with the liquid cooling pipeline, and working media in the liquid cooling pipeline can enter and exit the cold plate cavity. The cold plate is connected to the heat generating device, which may be a direct cold plate contact to the heat generating device, or a connection of the cold plate to the heat generating device through a thermal interface material. The cold plate can absorb the heat of the heating device and carry out soaking and heat dissipation on the heating device. The cold plate may have other fittings such as shielding, snap-fit, heat sink fittings, etc. Because the area of the cold plate is larger, the requirements on the strength and the flatness are higher.

As shown in fig. 28 to 30, the cold plate 71 according to the seventh embodiment may include a first cover plate 711 and a second cover plate 712, and the first cover plate 711 and the second cover plate 712 are stacked and may enclose the cold plate cavity 71b. The first cover plate 711 and the second cover plate 712 are fixedly connected, for example, may be welded together. The wall thickness of the first and

second cover plates

711, 712 is small, such as only 0.15mm, which facilitates adapting the cold plate 71 to smaller sized mobile terminals.

As shown in fig. 29, a surface of the second cover plate 712 facing a side of the first cover plate 711 may include an edge region 713 and a support region 714, the edge region 713 being an edge of the surface, the edge region 713 surrounding and being connected to an outer circumference of the support region 714. The supporting region 714 may be formed by protruding a plurality of supporting portions 715, and the supporting portions 715 may be spaced apart from each other. The support portion 715 is integrally connected to the support region 714. The structure of the supporting portion 715 may be designed as required, and may be, for example, approximately a circular truncated cone structure or a wall-shaped structure. The support 715 may be formed by punching or etching the second cover 712. The support portion 715 may be used to support the first cover plate 711.

In particular, the gas within the cold plate chamber 71b needs to be collected at a design location (e.g., a higher location) where the gas is not allowed to flow backwards. The support 715 having a special wall-shaped structure may also function to prevent the reverse flow of gas.

In other embodiments, the supporting portion 715 may be protruded from a surface of the first cover plate 711 facing the second cover plate 712, and the second cover plate 712 is not provided with the supporting portion 715. Alternatively, the supporting portions 715 may be protruded on both surfaces of the first cover plate 711 and the second cover plate 712 facing each other, and the supporting portions 715 on both surfaces are staggered and do not interfere with each other.

In the seventh embodiment, at least one cover plate of the cold plate 71 is made of a composite material consisting of at least two layers of different materials, which may be laminated together. The composite material at least comprises an easily-welded material and a reinforcing material. The manufacturing process of the composite material includes but is not limited to pressing, diffusion welding, electroplating, chemical deposition and the like. The first and second easily weldable materials appearing hereinafter are merely names taken to distinguish the positions of the material layers, and both actually belong to the easily weldable materials. And, the first easily weldable material and the second easily weldable material may be the same or different.

Several cold plate designs of embodiment seven will be described below.

As shown in fig. 30, in a first embodiment of the seventh embodiment, the second cover plate 712 is made of a composite material comprising two layers of different materials: an inner layer of a solderable material 712a (which may be referred to as a first solderable material 712 a) and an outer layer of a reinforcement material 712b, the solderable material 712a being laminated with the reinforcement material 712b. If the support part 715 is formed by stamping, the material of the support part 715 is the composite material; if the support portion 715 is formed by etching, the material of the support portion 715 is the easy-soldering material 712a.

The easily-weldable material 712a has a melting point of 950 ℃ or less, for example, 750 ℃, and has a low welding temperature, so that the welding quality is high when the easily-weldable material is welded. The solderable material 712a includes, but is not limited to, copper or copper alloys, nickel or nickel alloys, phosphorous, and the like.

The overall dimensions of the cold plate 71 are much greater than the wall thickness of the first 711 or second 712 cover plates, which may be 0.15mm, for example. For example, the overall physical dimension of the cold plate 71 is at least 10 times the wall thickness of the first cover plate 711 or the wall thickness of the second cover plate 722.

As shown in fig. 30, the overall outer dimension refers to a distance occupied by the cold plate 71 in the X direction, the Y direction, or the Z direction in the XYZ coordinate system. For example, the length of the cold plate 71 may be defined as the distance the cold plate 71 occupies in the Y-direction. The width of the cold plate 71 may be defined as the distance the cold plate 71 occupies in the X direction. The thickness of the cold plate 71 may be defined as the distance the cold plate 71 occupies in the Z-direction. The thickness of the cold plate 71 may be less than or equal to 1.5mm.

A cold plate 71 having an overall physical dimension much greater than its own wall thickness risks insufficient strength and rigidity.

To avoid irreversible plastic deformation of the cold plate 71, which may affect the performance of the cold plate 71, the cover plate of the cold plate 71 may use a reinforcing material 712b. The reinforcing material 712b has high strength and hardness, and has good deformation resistance. For example, the reinforcing material 712b may have a yield strength of greater than or equal to 150MPa, a surface hardness of greater than or equal to HV100, and an elastic modulus of greater than or equal to 120MPa. In this embodiment, the yield strength, the surface hardness, and the elastic modulus of the reinforcing material 712b may be independent of each other, and at least one of the three parameters may satisfy the above numerical range. Reinforcing material 712b includes, but is not limited to, stainless steel or stainless steel alloys, titanium or titanium alloys, tungsten or tungsten alloys, aluminum or aluminum alloys, chromium or chromium alloys, aluminum or aluminum alloys, and the like.

The following table lists the material parameters for several common solderable materials 712a and reinforcing materials 712b. It is to be understood that the practical application of the present embodiment is not limited thereto.

TABLE 1 physical parameters of metallic materials (Normal temperature)

TABLE 2 comparison of Performance parameters for Cold plates made of stainless Steel or copper alloy materials

As shown in fig. 30, the easy-welding material 712a of the second cover plate 712 faces the first cover plate 711, and the reinforcing material 712b faces away from the first cover plate 711. The solderable material 712a is soldered to the second cover plate 712. Specifically, the easy-welding material 712a on the support portion 715 of the second cover plate 712 is welded to the corresponding region of the first cover plate 711, and the easy-welding material 712a of the edge region 713 of the second cover plate 712 is welded to the corresponding region of the first cover plate 711. The soldering may be, for example, soldering using solder paste (the black hatching in fig. 30 indicates solder paste 71a and solder paste 71 c).

In the welding process of the cold plate, a graphite jig is needed. The cover plate of the conventional cold plate is made of stainless steel materials, and the welding temperature is high. At such high welding temperatures, metal components in the stainless steel material are easily precipitated and bonded with the graphite jig, resulting in abrasion and damage of the graphite jig. This not only affects the weld quality (e.g., there may be abnormalities such as a lost weld, a wavy weld, etc., where the lost weld may result in a poor seal of the cold plate 71), but also results in increased costs. Moreover, welding of stainless steel materials needs to be performed in an environment friendly environment. For example, ammonia gas is decomposed into hydrogen and nitrogen gas before the hydrogen gas is passed into a welding tunnel furnace to provide a weldable atmosphere. Since hydrogen is flammable and explosive, it is necessary to operate in a safe and environmentally friendly environment. In addition, for titanium and titanium alloy materials, because the surface protection layer is damaged at high temperature, the titanium and the titanium alloy are very active and are easy to oxidize and nitride, welding is needed under the special protection environment of inert gas, and an ultra-low vacuum environment is also needed in front and rear section processing. Therefore, the product needs to be sent out to a supply chain manufacturer with environmental protection quality for processing, but this will cause the process chain to be too long, increase the difficulty of process control, and prolong the delivery cycle.

In view of this, in the first embodiment, the second cover plate 712 is made of a composite material, and the welding temperature of the easy-to-weld material 712a is low, so that the graphite jig is not damaged by abrasion due to precipitation of metal components, and thus the welding quality is high and the cost is reduced. Moreover, the welding of the easy-welding material 712a does not need hydrogen, inert gas or ultra-low vacuum environment, and does not need to send the product out to a supply chain manufacturer with environmental protection quality for processing, so that the process chain can be shortened, and the process control difficulty can be reduced. In addition, a suitable easy-to-weld material 712a can be selected to ensure that the easy-to-weld material 712a and the liquid working medium in the cold plate cavity 71b do not generate galvanic micro-reaction, thereby ensuring the reliability of the cold plate 71.

On the other hand, the second cover plate 712 of the first embodiment is made of a composite material, and the reinforcing material can make the second cover plate 712 have a larger strength and be not easily deformed, so as to meet the requirements of the cold plate 71 for high strength and high flatness.

As shown in fig. 31, in the second embodiment of the seventh embodiment, unlike the first embodiment, both the first cover plate 711 and the second cover plate 712 may be made of a composite material. The first cover plate 711 may include an outer layer of reinforcing material 711b and an inner layer of easy-to-weld material 711a (which may be referred to as a first easy-to-weld material 711 a). The second cover plate 712 may include an outer layer of reinforcing material 712b and an inner layer of welding-susceptible material 712a. Illustratively, the easy solder material 712a may be discontinuously disposed on the surface of the reinforcing material 712b, and the easy solder material 712a may be divided into a plurality of spaced-apart regions, wherein the spacing of each region exposes the surface of the reinforcing material 712b. Alternatively, the easy-soldering material 712a may be continuously distributed on the surface of the reinforcing material 712b, so as to completely cover the surface of the reinforcing material 712b.

Reinforcing material 711b may be the same as or different from reinforcing material 712b, both of which may be selected from the reinforcing materials listed above. The solderable material 711a may be the same as or different from the solderable material 712a and both may be selected from the solderable materials listed above.

The easy-welding material 711a of the first cover plate 711 is welded to the easy-welding material 712a of the second cover plate 712. Specifically, the easy-welding material 712a on the support portion 715 of the second cover plate 712 is welded to the corresponding region of the easy-welding material 711a on the first cover plate 711, and the easy-welding material 712a at the edge of the second cover plate 712 is welded to the easy-welding material 711a at the edge of the first cover plate 711. The soldering may be, for example, soldering using a solder paste (the black hatching in fig. 31 indicates solder paste 71a and solder paste 71 c). The cold plate 71 shown in fig. 31 is made of the first cover plate 711 and the second cover plate 712, so that the cold plate 71 has high strength and flatness, the welding process difficulty can be effectively reduced, the welding yield is improved, the sealing performance of the cold plate 71 is ensured, the cost is reduced, and the reliability of the cold plate 71 is further improved.

As shown in fig. 32, in a third embodiment of the seventh embodiment, unlike the second embodiment, the first cover plate 711 may include an outer layer of surface functional material 711c, an intermediate reinforcing material 711b, and an inner layer of easy-to-weld material 711a. The second cover plate 712 may include an outer layer of surface functional material 712c, an intermediate reinforcing material 712b, and an inner layer of frangible material 712a. Hereinafter, the surface functional material 711c and the surface functional material 712c are collectively referred to as a surface functional material, and the reinforcing material 711b and the reinforcing material 712b are collectively referred to as a reinforcing material.

Among them, the surface functional material may be used to surface-treat the reinforcing material so that the first cover plate 711 or the second cover plate 712 has corresponding properties. For example, the surface functional material may be nickel, and the corrosion-resistant layer is formed by plating nickel on the reinforcing material; alternatively, the surface functional material may be copper, and the welding performance of the first cover plate 711 or the second cover plate 712 is improved by plating copper on the reinforcing material; alternatively, the surface functional material may be gold, and the conductivity of the first cover plate 711 or the second cover plate 712 is improved by locally plating gold on the reinforcing material (the cold plate 71 may be used as a common ground for the antenna and the camera module, which requires the cold plate 71 to have better conductivity); alternatively, zinc may be plated on the reinforcing material to improve the corrosion resistance of the first cover plate 711 or the second cover plate 712; alternatively, the reinforcing material may be painted to improve the corrosion resistance of the first cover plate 711 or the second cover plate 712 or meet the color requirement of the appearance.

The surface functional material 711c may be provided only in a partial region of the reinforcing material 711b, or may be provided in all regions of the reinforcing material 711 b. The distribution of the surface functional material 712c may also be designed as such.

In the present embodiment, the surface functional material 712c in the second cover plate 712 may be the same as or different from the surface functional material 711c in the first cover plate 711. In other embodiments, one of the first cover plate 711 and the second cover plate 712 may have the surface functional material, but both of them are not required to have the surface functional material.

As shown in fig. 32, the first cover plate 711 and the second cover plate 712 may be welded. Specifically, the easy-welding material 712a on the support portion 715 of the second cover plate 712 is welded to the corresponding region of the easy-welding material 711a of the first cover plate 711, and the easy-welding material 712a on the edge of the second cover plate 712 is welded to the easy-welding material 711a on the edge of the first cover plate 711. For example, soldering may be performed using solder paste (black shading in fig. 32 indicates solder paste). After the first cover plate 711 and the second cover plate 712 are welded, the surface functional material 711c of the first cover plate 711 and the surface functional material 712c of the second cover plate 712 are both located on the outside of the cold plate 71, and the easy-welding material 711a of the first cover plate 711 and the easy-welding material 712a of the second cover plate 712 are both located on the inside of the cold plate 71.

The third embodiment, which uses a composite material containing a surface functional material to fabricate the cover plate, further enhances the processability or performance of the cold plate 71.

As shown in fig. 33, in a fourth embodiment of the seventh embodiment, different from the third embodiment, the easy-welding material 712a of the edge of the second cover plate 712 and the easy-welding material 711a of the edge of the first cover plate 711 are welded by a non-solder paste welding process, such as laser welding, diffusion welding (e.g., pressure diffusion welding), and the like. In fig. 33, a welding portion between the edge of the second cover plate 712 and the edge of the first cover plate 711 is indicated by a dotted line.

During the welding of the cold plate 71, a graphite jig is required. The edge of the conventional cold plate uses soldering paste welding, the soldering paste easily overflows to pollute the graphite jig, the service life of the graphite jig is shortened, and the cost is sharply improved.

In contrast, in the fourth embodiment, the edge of the second cover plate 712 and the edge of the first cover plate 711 are soldered without solder paste, so that the problem caused by the overflow of the solder paste can be effectively avoided, and the cost can be reduced.

In addition, in the fourth embodiment, the solder paste can be used for soldering the corresponding area of the easy-to-solder material 712a on the support part 715 of the second cover plate 712 and the easy-to-solder material 711a of the first cover plate 711, because the soldering efficiency is high and the quality is easy to ensure by using the solder paste. And even the solder paste overflows, the problem of polluting the graphite jig does not exist.

In the present embodiment, the non-solder-paste welding is not performed on all the welding areas of the first cover plate 711 and the second cover plate 712, but it is considered that the efficiency of the welding between the large number of supporting portions 715 on the second cover plate 712 and the first cover plate 711 is low and the welding quality is not easily guaranteed (especially, laser welding is used). In other embodiments, all the welding areas of the first cover plate 711 and the second cover plate 712 may be welded without using solder paste according to actual requirements.

The above embodiments of the seventh embodiment describe the composite material design of the cover plate of the cold plate 71 and the welding process design of the cover plate, and these two designs can be independent of each other and can be combined according to the needs, and are not limited to the ones shown in fig. 30-33. For example, the welding design in the first to third embodiments described above may be modified to: the edges of the first cover plate 711 and the second cover plate 712 are soldered using no solder paste.

Fig. 34 is a block diagram showing a configuration of a mobile terminal device 72 in a fifth embodiment of the seventh embodiment. The mobile terminal device 72 may be, for example, a smart watch, and the mobile terminal device 72 may be coupled to the cold plate 71 (hereinafter referred to as the first cold plate 71 for ease of distinction) using the capillary pump 78 described above.

As shown in fig. 34, the mobile terminal apparatus 72 may include a main body 722 and two wristbands 721. The main body 722 may include, for example, a housing 723, a heat generating device mounted in the housing 723, the capillary pump 78, the liquid cooling control device 15, the first cold plate 71, and the like as the functional main body 722 of the mobile terminal apparatus 72. The heat generating devices may be, for example, a chip-scale system 14 and a sensor 13. The chip scale system 14 and the sensor 13 may be in contact with the first cold plate 71. "contact" may refer to direct contact (rigid contact) or indirect contact through a thermal interface material (elastic contact).

As shown in fig. 34, the mobile terminal apparatus 72 may further include a second cold plate 73 and a liquid-cooling control device 15 provided in one band 721. The number of the second cold plates 73 may be two, for example, and both the second cold plates 73 are connected to the liquid cooling control device 15. Second cold plate 73 may be made of a flexible, easily bendable composite material, and second cold plate 73 can be bent or rolled along with wristband 721. The second cold plate 73 may have a composite material design as described above, or may be made of conventional materials.

As shown in fig. 34, a liquid cooling pipe 79 may be disposed in the housing 723, and the liquid cooling pipe 79 connects the capillary pump 78, the first cold plate 71, and the liquid cooling control device. Liquid cooling conduits 79 may extend from within housing 723 to within wristband 721. The portion of the liquid-cooled conduit 79 within the wristband 721 may be connected to a second cold plate 73, the liquid-cooling control apparatus 15, and another second cold plate 73 in that order. Finally, liquid cooling pipe 79 connects capillary pump 78, liquid cooling control unit 15, first cold plate 71 in case 723, and second cold plate 73, liquid cooling control unit 15 in band 721. It is understood that the positions of the capillary pump 78, the liquid cooling control device 15, the first cold plate 71, the second cold plate 73, and the liquid cooling control device 15 on the liquid cooling pipe 79 and the positions relative to the housing 723 and the wristband 721 can be flexibly designed according to the requirement, and are not limited to the illustration.

Referring to fig. 34, the capillary pump 78 can drive the cooling liquid to circulate in the liquid cooling control device 15, the first cooling plate 71, the second cooling plate 73, and the liquid cooling pipe 79. The first cold plate 71 can absorb heat of the system-on-chip 14 and the sensor 13 to dissipate heat of the system-on-chip 14 and the sensor 13. The first cold plate 71 can exchange heat with the second cold plate 73 by the cooling fluid circulating, so that heat is exchanged between the main body 722 and the wristband 721, thereby equalizing the temperatures of the main body 722 and the wristband 721, and dissipating heat to the outside through the wristband 721 having a large area. Therefore, the fifth embodiment can realize the temperature equalization of the mobile terminal device 72 and the heat dissipation of the heat generating device.

In other embodiments, the second cold plate 73 in the mobile terminal device 72 may also be of no composite material design and may be fabricated using conventional materials.

Fig. 35 is a block diagram showing a structure of a mobile terminal device 72' in a sixth embodiment of the seventh embodiment. The most important difference from the fifth embodiment is that the second cold plate 73 can be arranged in both watchbands 721 of the mobile terminal 72'. A second cold plate 73 may be arranged inside one of the straps 721 (for example, the strap 721 on the left in the figure). Two second cold plates 73 may be arranged inside another bracelet 721 (for example bracelet 721 to the right in fig. 35).

As shown in fig. 35, the sixth embodiment is different from the fifth embodiment in that the capillary pump 78 and the first cold plate 71 may not be provided in the housing of the mobile terminal device. Two capillary pumps 78 may be disposed within the wristband 721 on the right in fig. 35, and the two capillary pumps 78 may be connected in series, which may reduce the system fluid impedance of the mobile terminal device 72'. It will be appreciated that the two capillary pumps 78 may also be connected in parallel, which may increase the flow of working fluid through the system. The liquid cooling control device 15 may not be provided in the right wristband 721. This design allows for a limited internal space of housing 723, and capillary pump 78 can be disposed by using the internal space of wristband 721.

As shown in fig. 35, liquid-cooled conduit 79 connects liquid-cooled controller 15, chip-scale system 14, sensor 13 in housing 723, and second cold plate 73 and capillary pump 78 in wristband 721. It is understood that the positions of capillary pump 78, liquid-cooling control device 15, second cold plate 73 on liquid-cooling duct 79 and relative to housing 723 and wristband 721 can be flexibly designed according to the needs, and are not limited to those shown in fig. 35.

In the sixth embodiment, since the second cold plates 73 are disposed in the two bands 721, the heat exchange area and the heat dissipation area can be increased, and the temperature equalization and the heat dissipation performance can be further improved.

Example seven, embodiment five and embodiment six, describe the use of the capillary pump 78 and cold plate in a smart watch, by way of example only. Indeed, the capillary pump 78 and cold plate may also be used in other types of mobile terminal devices, such as cell phones, tablet computers. In addition, the capillary pump 78 and the cold plate may be arranged independently of each other and need not be used in the same mobile terminal device at the same time. I.e., at least one of the capillary pump 78 and the cold plate may be used as desired for any type of mobile terminal device.

In other embodiments of the seventh embodiment, the second cold plate 73 in the belt may be replaced by a flexible liquid-cooled conduit (such as the liquid-cooled conduit 492 described above), and the flexible liquid-cooled conduit may have a certain heat dissipation capability.

Fig. 36 is a schematic structural diagram of a mobile terminal device 74 in a seventh implementation manner of the seventh embodiment. The mobile terminal device 74 may be, for example, a notebook computer, which may include a screen portion 741, a hinge 743, and a keyboard portion 747. The screen part 741 may include a screen and an upper case mounted with the screen, a camera module mounted to the upper case, and the like, and the keyboard part 747 includes a keyboard and a lower case mounted with the keyboard, a main board mounted in the lower case, and the like. The screen section 741 is rotatably connected to the keyboard section 747 via the hinge 743. The hinge 743 has a passage therein, and the passage of the hinge 743 also serves as part of the liquid cooling conduit of the mobile terminal 74.

As shown in fig. 36, mobile terminal equipment 74 may also include a water nozzle 746, a third cold plate 742, a fourth cold plate 745, and a drive pump 744. In the embodiment of the present application, the water nozzle is a communication component for communicating the cold plate with other components having internal passages (e.g., the hinge 743). The structure of the water nozzle can be designed according to the requirement. It is to be understood that the term "nozzle" is not intended to limit the configuration of the communicating member.

As shown in fig. 36, both the water nozzle 746 and the third cold plate 742 may be located inside the screen portion 741. The nozzle 746 may be welded to the third cold plate 742 and is pivotally connected to the hinge 743. The water nozzle 746 has a passage therein that communicates with the cold plate cavity of the third cold plate 742. A fourth cold plate 745 may be mounted inside keyboard section 747. A fourth cold plate 745 may also be connected to the water nozzle.

In this embodiment, the third cold plate 742 and the fourth cold plate 745 are laid in a large area in the mobile terminal device 74 to sufficiently dissipate heat generated by the heat generating device. The area of the third cold plate 742 and the area of the fourth cold plate 745 are both substantially larger than the area of the water nozzle 746. For example, the area of the third cold plate 742 and the area of the fourth cold plate 745 may be at least 10 times the area of the water nozzle 746. The area of the cold plate is the projected area of the cold plate in the thickness direction of the cold plate, and the area of the water nozzle 746 is the projected area of the water nozzle 746 in the thickness direction of the cold plate.

In this embodiment, to ensure that the overall thickness of the mobile terminal device 74 is small, the third cold plate 742 and the fourth cold plate 745 are thin, for example, the thicknesses of the third cold plate and the fourth cold plate are less than or equal to 1.5mm. The water nozzle 746 is disposed at a non-thickness bottleneck position in the mobile terminal device 74, but the thickness of the water nozzle 746 is much greater than the thickness of the third cold plate 742 and the fourth cold plate 745. The third cold plate 742 can be connected with a liquid cooling pipeline with a larger caliber only by switching with the water nozzle 746, so that the thinnest thickness of the whole machine is realized.

The drive pump 744 may be located inside the keyboard section 747. The drive pump 744 may be in communication with the cold plate cavity of the fourth cold plate 745, as well as the passages of the hinge 743. Thus, drive pump 744 communicates third cold plate 742 with fourth cold plate 745 so that working fluid can circulate between third cold plate 742 and fourth cold plate 745. The actuation pump 744 includes, but is not limited to, a micromechanical actuation pump, a piezoelectric pump, or a capillary pump.

Fig. 37, 38 and 39 may show an assembly structure of the third cold plate 742 and the water nozzle 746, wherein fig. 38 is an exploded structure diagram of the structure shown in fig. 37, and fig. 39 is a partial sectional view diagram of B-B of fig. 37. The third cold plate 742 and the water nozzle 746 may form a cold plate assembly 748.

As shown in fig. 38 and 39, the edge of the first cover plate 7421 of the third cold plate 742 may be designed with an opening 742a and an opening 742c. The opening 742a communicates with the cold plate cavity 742b of the third cold plate 742. In other embodiments, the

openings

742a and 742c may be formed at other positions on the first cover 7421, and are not limited to the edges. The water nozzle 746 may be welded to the first cover plate 7421 and closes the

openings

742a and 742c. The passage 746a of the water nozzle 746 is in communication with the opening 742a and the opening 742c, whereby the passage 746a of the water nozzle 746 is in communication with the cold plate chamber 742b through the opening 742 a.

As shown in fig. 39, the first cover plate 7421 of the third cold plate 742 may be made of a composite material. The first cover 7421 may include a second solderable material 7421a on an outer layer, a reinforcement material 7421b in the middle, and a first solderable material 7421c on an inner layer, the second solderable material 7421a facing away from the cold plate cavity 742b, the first solderable material 7421c facing toward the cold plate cavity 742b. The second easily-weldable material 7421a and the water nozzle 746 can be welded by a non-soldering paste process, so that the problem that the graphite jig is polluted by the overflow of soldering paste can be avoided, and the cost can be reduced. In other embodiments, the second solderable material 7421a and the water nozzle 746 may be soldered with solder paste according to actual requirements.

In the seventh embodiment, the water nozzle 746 is a rotating component, and in consideration of wear resistance and strength requirements, the water nozzle 746 may be made of high-strength materials such as stainless steel by 3D printing or metal powder metallurgy. To further enhance the quality of the weld between the water nozzle 746 and the first cover plate 7421, a weld promoting material 7461 may be provided on the outer surface of the water nozzle 746 (as shown in fig. 39) or in the area of the weld in the outer surface, the weld promoting material 7461 may be formed, for example, by nickel or copper plating. The easy-welding material 7461 is welded to the second easy-welding material 7421a of the first cover 7421. Alternatively, the nozzle 746 may be made directly from a weldable material.

As shown in fig. 39, the composite material of the second cover sheet 7422 of the third cold plate 742 may include a solderable material 7422a (which may be referred to as a first solderable material 7422 a) on an inner layer and a reinforcing material 7422b on an outer layer. The easy-to-weld material 7422a of the second cover 7422 is welded to the first easy-to-weld material 7421c of the first cover 7421, for example, by a non-solder paste welding, for example, a laser welding or a diffusion welding without solder paste. In other embodiments, the easy-to-solder material 7422a and the first easy-to-solder material 7421c may be soldered by using a solder paste, such as soldering with a solder paste.

In the seventh embodiment, it can be understood that the supporting portion of the third cold plate 742 and the cover plate supported by the supporting portion can be welded together, for example, by a laser welding or diffusion welding process without solder paste.

The overall outer dimensions of the third cold plate 742 are much larger than its wall thickness. For example, the overall external dimensions of the third cold plate 742 are at least 10 times the wall thickness of the first cap plate 7421 or the second cap plate 7422. As shown in fig. 37, the overall outer dimension refers to a distance occupied by the third cold plate 742 in the X, Y, or Z direction in the XYZ coordinate system. For example, the length of the third cold plate 742 may be defined as the distance the third cold plate 742 occupies in the Y-direction, which is approximately equal to the Y-direction distance from one water nozzle 746 to the other water nozzle 746. Similarly, the width of the third cold plate 742 may be defined as the distance the third cold plate 742 occupies in the X-direction, which is approximately the distance from the lowest of the third cold plate 742 to the highest of the camber. Similarly, the thickness of the third cold plate 742 may be defined as the distance the third cold plate 742 occupies in the Z-direction. The thickness of the third cold plate 742 may be less than or equal to 1.5mm. In addition, a span may be defined for the third cold plate 742 having an approximately bridge shape, which refers to the length of the contour curve of the third cold plate 742, which may be the length of the curve on the outside of the third cold plate 742 in fig. 37, or the length of the curve on the inside of the third cold plate 742. The wall thickness of the third cold plate 742 may be, for example, 0.15mm.

The third cold plate 742, which has an overall outer dimension much greater than its wall thickness, risks insufficient strength and rigidity. However, the reinforcing material in the third cold plate 742 can make the third cold plate 742 have high strength and less deformation, so that the third cold plate 742 has high strength and high flatness.

The seventh embodiment is different from the first to fourth embodiments in that, in order to improve the welding quality between the third cold plate 742 and the water nozzle 746, a weldable material may be used for the outer layer of the first cover plate 7421 of the third cold plate 742.

It is understood that the second cover 7422 may have an opening and the nozzle 746 may be welded to the second cover 7422. In addition, the composite design of the third cold plate 742 shown in fig. 39 is merely illustrative. The third cold plate 742 may also be made of a composite material according to any of the embodiments described above, provided that the side of the cold plate 742 that is welded to the water nozzle 746 is made of a weldable material. In the seventh embodiment of the seventh embodiment, the water nozzle 746 is welded to a cover plate of the third cold plate 742. In a seventh embodiment, the cold plate assembly of the eighth embodiment is different from the seventh embodiment in that the water nozzle can be welded with both cover plates of the third cold plate. As will be described below.

As shown in fig. 40, in the eighth embodiment, a part of the edge of the first cover plate 7421 'of the third cold plate 742' of the cold plate assembly 748 'and a part of the edge of the second cover plate 7422' may be inserted into the channel 746a 'of the water nozzle 746', and the cold plate cavity 742b 'of the third cold plate 742' communicates with the channel 746a 'of the water nozzle 746'.

As shown in fig. 40, the first cover sheet 7421' is a composite material including a second solderable material 7421a, a reinforcing material 7421b and a first solderable material 7421c. The second cover sheet 7422' is a composite material including a first solderable material 7422a, a reinforcing material 7422b, and a second solderable material 7422c. The second easy soldering material 7421a and the second easy soldering material 7422c are disposed oppositely, the first easy soldering material 7421c and the first easy soldering material 7422a are disposed oppositely, that is, in the view angle of fig. 40, the second easy soldering material 7421a and the second easy soldering material 7422c are located at the outer side, and the first easy soldering material 7421c and the first easy soldering material 7422a are located at the inner side.

As shown in fig. 40, the nozzle 746' may also be made of a composite material. The composite material of water nozzle 746' may include a solderable material 7461' on the inside and a base material 7462' on the outside. The easy-to-weld material 7461 'may be the same as or different from the first easy-to-weld material 7421a and the first easy-to-weld material 7422c, but the easy-to-weld material 7461' may be selected from the easy-to-weld materials described above. The base material 7462' may have high wear resistance and strength properties, such as stainless steel, titanium alloy, etc., but is not limited to the above-mentioned reinforcing materials.

As shown in fig. 40, the weldable material 7461 'of the water nozzle 746' may be welded to the second weldable material 7421a and the second weldable material 7422c.

Referring to fig. 40 and 38 (fig. 38 is not a drawing of embodiment eight, and here, reference is made to fig. 38 only for illustrating the portion of the third cold plate 742' in embodiment eight), the edge of the first cover plate 7421' is located outside the water nozzle 746', and the edge of the second cover plate 7422' is located outside the water nozzle 746', which may be welded, for example, by a no-cream process. That is, the distance between the portion where the edge of the first cover plate 7421' is connected to the water nozzle 746' and the portion where the edge of the second cover plate 7422' is connected to the water nozzle 746' may be large and formed with a flare so as to match the size of the water nozzle 746 '. The spacing between other portions of the edge of the first cover plate 7421 'and other portions of the edge of the second cover plate 7422' may be small to facilitate welding of the first cover plate 7421 'to the second cover plate 7422'.

In the eighth embodiment, it can be understood that the supporting portion of the third cold plate 742' and the cover plate supported by the supporting portion can be welded together, for example, by a laser welding or diffusion welding process without solder paste. In other embodiments, the supporting portion and the cover plate supported by the supporting portion may be soldered by using a solder paste, such as soldering with a solder paste.

It is understood that in other embodiments, one of the first and second cover plates 7421' and 7422' of the third cold plate 742' may be a composite material. The nozzle 746 'and the third cold plate 742' may also be soldered with solder paste.

Example eight

In the eighth embodiment, unlike the above-described embodiments, the drive pump may be the piezoelectric pump 88. The piezoelectric pump 88 can pump both air and liquid. As will be explained below.

Fig. 41 shows a schematic structure of a piezoelectric pump 88 according to an eighth embodiment. As shown in fig. 41, the piezoelectric pump 88 may include a micro-pump mount 885, and first and second

piezoelectric vibrators

886, 887 located on opposite sides of the micro-pump mount 885, respectively.

As shown in fig. 41, one side of the micro pump mount 885 can have a first inlet channel 88a, a first inlet valve 888, a first outlet valve 889, and a first outlet channel 88c. The first inlet valve 888 can be disposed at an end of the first inlet channel 88a, and an end of the first inlet channel 88a distal from the first inlet valve 888 can be the first inlet. A first outlet valve 889 may be provided at an end of the first outlet flow passage 88c, and an end of the first outlet flow passage 88c remote from the first outlet valve 889 may be a first outlet. A first outlet valve 889 and a first inlet valve 888 can be positioned between the first inlet and the first outlet.

As shown in fig. 41, the other side of the micro pump mount 885 may also have a second inlet flow channel 88f, a second inlet valve 891, a second outlet valve 890, and a second outlet flow channel 88d. The second inlet valve 891 may be disposed at an end of the second inlet flow passage 88f, and the end of the second inlet flow passage 88f distal from the second inlet valve 891 may be a second inlet. The second outlet valve 890 may be provided at one end of the second outlet flow passage 88d, and the end of the second outlet flow passage 88d remote from the second outlet valve 890 may be a second outlet. The second outlet valve 890 and the second inlet valve 891 may be located between the second inlet and the second outlet.

In this embodiment, the first inlet valve 888, the first outlet valve 889, the second inlet valve 891, and the second outlet valve 890 can be all check valves (or called check valves), and the use of the check valves can prevent the fluid in the driving pump from flowing backwards, so as to ensure the heat dissipation effect. Other types of valves may also be employed as desired.

In this embodiment, the first piezoelectric vibrator 886 and the second piezoelectric vibrator 887 may have the same structure. The first piezoelectric vibrator 886 will be described as an example.

As shown in fig. 41, the first piezoelectric vibrator 886 may include a piezoelectric sheet 881, an adhesive layer 882, a substrate 883, and a diaphragm 884, which are sequentially stacked. Adhesive layer 882 bonds piezoelectric patch 881 to substrate 883, and membrane 884 is disposed on a side of substrate 883 opposite piezoelectric patch 881.

As shown in fig. 41, the piezoelectric sheet 881 may be a sheet. Piezoelectric patch 881 may be fabricated from a piezoelectric material, including but not limited to a piezoelectric ceramic. The piezoelectric sheet 881 has an inverse piezoelectric effect, and can be deformed by vibration under the action of an electric field.

The base plate 883 may be sheet-like or plate-like. The substrate 883 may be made of a material having good structural strength and good vibration performance, such as metal. The substrate 883 can increase the structural strength of the piezoelectric vibrator, and ensure that the piezoelectric piece 881 can stably vibrate. The substrate 883 is also capable of amplifying the smaller range vibrations of the piezoelectric patch 881 to larger range vibrations to increase the flow rate of the piezoelectric pump 88.

The membrane 884 has an impermeable and isolating function, and is used for isolating a working medium in a pump chamber (described below) from the base plate 883 to prevent the working medium from corroding the base plate 883. The diaphragm 884 may be fabricated using, for example, a plastic material.

The above-described configuration of the first piezoelectric vibrator 886 is merely illustrative. The first piezoelectric vibrator 886 may have other configurations, depending on the product requirements.

As shown in fig. 41, the diaphragm 884 of the first piezoelectric vibrator 886 is coupled to one side of the micro-pump mount 885, e.g., the periphery of the diaphragm 884 may be coupled to one side of the micro-pump mount 885. The interior of the membrane 884 may be suspended relative to the micro-pump mount 885 and enclose a first pump chamber 88b with the micro-pump mount 885. Similarly, the diaphragm 884 of the second piezoelectric vibrator 887 is coupled to the other side of the micro-pump mount 885, e.g., the periphery of the diaphragm 884 can be coupled to the other side of the micro-pump mount 885. The interior of the diaphragm 884 may be suspended relative to the micro-pump mount 885 and enclose a second pump chamber 88e with the micro-pump mount 885. The first pump chamber 88b and the second pump chamber 88e are respectively located at two opposite sides of the micro pump mount 885, and are isolated by the micro pump mount 885 and are not communicated.

As shown in FIG. 41, both the first inlet valve 888 and the first outlet valve 889 can be positioned within the first pumping chamber 88b. Wherein a first inlet valve 888 may connect the first inlet channel 88a with the first pumping chamber 88b. When the first inlet valve 888 is open, the first inlet flow passage 88a communicates with the first pumping chamber 88 b; when the first inlet valve 888 is closed, the first inlet flow passage 88a is isolated from the first pumping chamber 88b. A first outlet valve 889 may connect the first outlet flow passage 88c with the first pumping chamber 88b. When the first outlet valve 889 is opened, the first outlet flow passage 88c communicates with the first pumping chamber 88 b; when the first outlet valve 889 is closed, the first outlet flow passage 88c is isolated from the first pumping chamber 88b.

As shown in fig. 41, both the second inlet valve 891 and the second outlet valve 890 may be located within the second pumping chamber 88e. Wherein a second inlet valve 891 may connect the second inlet flow passage 88f with the second pumping chamber 88e. When the second inlet valve 891 is open, the second inlet flow passage 88f communicates with the second pump chamber 88 e; when the second inlet valve 891 is closed, the second inlet flow passage 88f is isolated from the second pump chamber 88e. A second outlet valve 890 may connect the second outlet flow passage 88d with the second pumping chamber 88e. When the second outlet valve 890 is opened, the second outlet flow passage 88d communicates with the second pump chamber 88 e; when the second outlet valve 890 is closed, the second outlet flow passage 88d is isolated from the second pump chamber 88e.

In this embodiment, both the first inlet flow passage 88a and the first outlet flow passage 88c may communicate with the liquid cooling conduit, and the first inlet flow passage 88a, the first pumping chamber 88b, and the first outlet flow passage 88c may be used for the flow of the cooling liquid. The second inlet flow passage 88f may communicate with the internal space of the mobile terminal device or the external environment, the second outlet flow passage 88d may communicate with the internal space of the mobile terminal device, and the second inlet flow passage 88f, the second pump chamber 88e, and the second outlet flow passage 88d may be used for the flow of air. Thus, the piezoelectric pump 88 can be considered to include a liquid pumping portion and an air pumping portion that are isolated from each other.

For the liquid pump portion, where the flowing coolant has a corrosive effect on the substrate 883, the membrane 884 may be designed to isolate the coolant from the substrate 883. In other embodiments, if a non-corrosive coolant is used as the working fluid, the diaphragm 884 may be eliminated and the coolant may directly contact the substrate 883. For the gas pump portion, if a corrosive gas is used as the working medium, the membrane 884 may be designed to isolate the gas from the substrate 883. If a non-corrosive gas is used as the working fluid, the membrane 884 may be eliminated and the gas may directly contact the substrate 883.

The piezoelectric pump 88 may be operated under signal drive.

Upon signal actuation, the first piezoelectric vibrator 886 of the pumping section will deform (e.g., bow upward in the perspective of fig. 41) to expand the first pump chamber 88b. At this time, the first inlet valve 888 is opened, the first outlet valve 889 is closed, and the coolant enters the first pump chamber 88b from the first inlet channel 88a to pump the coolant into the pump portion. Upon signal actuation, the first piezoelectric transducer 886 of the pumping portion will deform in the opposite direction (e.g., dome downward in the view of fig. 41) to cause the first pump chamber 88b to contract. At this time, the first inlet valve 888 is closed, the first outlet valve 889 is opened, and the coolant enters the first outlet flow passage 88c from the first pump chamber 88b and is pumped out of the liquid pump section. It will be appreciated that the first piezoelectric vibrator 886 will vibrate back and forth at a set frequency to continue pumping in and out the cooling fluid in response to the drive signal.

The air pump part works on the same principle as the liquid pump part. Under signal driving, the second piezoelectric vibrator 887 of the air pump portion will deform (e.g., bow downward in the perspective of fig. 41) to expand the second pump chamber 88e. At this time, the second inlet valve 891 is opened, the second outlet valve 890 is closed, and air enters the second pump chamber 88e from the second inlet flow passage 88f to pump air into the air pump portion. Under signal driving, the second piezoelectric vibrator 887 of the air pump portion will be deformed in the reverse direction (e.g., upwardly arched in the view of fig. 41) to contract the second pump chamber 88e. At this time, the second inlet valve 891 is closed, the second outlet valve 890 is opened, and air enters the second outlet flow passage 88d from the second pump chamber 88e and is pumped out from the air pump section. It will be appreciated that the second piezoelectric vibrator 887 will vibrate back and forth at a set frequency to continue pumping air in and out in response to the drive signal.

In this embodiment, the driving signals of the piezoelectric pump 88 can be controlled to make the vibration directions of the two piezoelectric sheets in the air pump portion and the liquid pump portion opposite to each other, so that the vibration and the noise of the air pump portion and the liquid pump portion can be cancelled out (partially cancelled out or completely cancelled out), and the resonance amplification of the vibration and the noise can be avoided.

In other embodiments, the piezoelectric pump may eliminate the valve in the liquid pump portion and/or the valve in the air pump portion, and the flow passage may be specially designed to replace the check valve.

For example, as shown in fig. 42, the air pump portion of the piezoelectric pump 88' may be provided without a second inlet valve, and the end of the second inlet flow passage 88f adjacent to the second pump chamber 88e may have an expansion opening 88g. The bore of the end of the second inlet flow passage 88f adjacent the second pump chamber 88e may increase in size in the direction from the second inlet flow passage 88f to the second pump chamber 88e. For example, in the view of fig. 42, the expanded opening 88g may be approximately a trapezoidal structure with a small top and a large bottom. The second outlet valve of the air pump portion may be eliminated and the end of the second outlet flow passage 88d adjacent to the second pump chamber 88e may be designed as a constricted opening 88h. The diameter of the end of the second outlet flow passage 88d adjacent the second pumping chamber 88e may decrease in the direction from the second outlet flow passage 88d to the second pumping chamber 88e. For example, in the view of fig. 42, the contraction opening 88h may be approximately a trapezoidal structure with a large top and a small bottom.

The air pump portion of the piezoelectric pump 88' shown in fig. 42 operates as follows:

when the second piezoelectric vibrator 887 is driven to vibrate downward, the second pump chamber 88e expands, and the gas in the second inlet flow passage 88f and the second outlet flow passage 88d can enter the second pump chamber 88e. However, due to micro-diffusion, the resistance in the second outlet flow passage 88d is greater, resulting in a greater flow of gas from the second inlet flow passage 88f into the second pumping chamber 88e, which is generally manifested as gas entering the second pumping chamber 88e from the second inlet flow passage 88 f.

When the second piezoelectric vibrator 887 is driven to vibrate upward, the second pump chamber 88e is contracted, and gas flows from the second pump chamber 88e into the second inlet flow passage 88f and the second outlet flow passage 88d simultaneously. However, due to micro-diffusion, the resistance in the second inlet flow passage 88f is greater, resulting in more gas flowing from the second pumping chamber 88e into the second outlet flow passage 88d, which is generally represented by gas entering the second outlet flow passage 88d from the second pumping chamber 88e.

Therefore, the air in the air pump portion flows unidirectionally in its entirety along the path of the second inlet flow passage 88f, the second pump chamber 88e, and the second outlet flow passage 88d.

The piezoelectric pump of example eight, in which the air pump portion is integrated with the liquid pump portion, can be reduced in volume, for example, the overall thickness of the piezoelectric pump can be as thin as 2mm, and the volume thereof is only 10% of the volume of the mechanical pump. The piezoelectric pump is suitable for being used as a driving part in a liquid cooling heat dissipation system with low flow and high impedance. The active liquid cooling heat dissipation system using the piezoelectric pump is small in size and can be suitable for a mobile terminal with a small size. In the first embodiment of the eighth embodiment, the piezoelectric pump can be used in the wearable device 80 with blood pressure detection function, wherein the air pump portion can be used for inflation and deflation of the air bag, and the liquid pump portion is used for active liquid cooling and heat dissipation. The following description will be made by taking the example of having the piezoelectric pump 88 in the wearable device 80. It will be appreciated that a piezoelectric pump 88' may also be used with the wearable device 80.

Fig. 43 is a block diagram showing a configuration of a wearable device 80 to which a piezoelectric pump 88 is applied in the first embodiment. The wearable device 80 may be, for example, a smart watch, and the wristband 81 thereof may have an air bag 82 built therein, the air bag 82 being in communication with the outside. The human blood pressure detection can be realized by controlling the inflation and deflation of the air bag 82. Liquid cooling conduits 89 may be distributed within the watch body 84. The liquid pumping portion of the piezoelectric pump 88 may be in communication with the liquid cooling conduit 89, and the liquid pumping portion may drive a cooling liquid to circulate within the liquid cooling conduit 89 to absorb heat from the system-on-chip 14 and release heat from the cold plate 83. The cold plate 83 may have the composite material design and welding process design described above, or may be a conventional cold plate. In other embodiments, the cold plate 83 may not be provided.

As shown in fig. 43 and 41 in combination, both the second inlet flow passage 88f and the second outlet flow passage 88d of the air pump portion of the piezoelectric pump 88 can communicate with the air bladder 82. The air pump part can suck the outside air into the air bag 82 when in work, so that the air bag 82 expands and boosts pressure; or the air in the air cell 82 is discharged to the outside, so that the air cell 82 is contracted to reduce the pressure. The expansion and contraction of the air bag 82 can facilitate the detection of the blood pressure of the human body.

As shown in fig. 43 and 41, both the first inlet flow passage 88a and the second outlet flow passage 88c of the liquid pumping portion of the piezoelectric pump 88 can communicate with the liquid cooling pipe 89. Therefore, the liquid pump part can drive the cooling liquid to circularly flow, and heat dissipation is realized.

The active liquid cooling heat dissipation and the air inflation and deflation of the air bag 82 can be simultaneously realized through the single piezoelectric pump 88, the space can be saved, the function of the active heat dissipation system can be favorably expanded, the miniaturization of the active heat dissipation system is realized, and the active heat dissipation system can be applied to the wearable equipment 80 with smaller size.

Fig. 44 is a block diagram showing another wearable device 80' using a piezoelectric pump according to the first embodiment. Unlike the wearable device 80 described above, the liquid cooling pipe 89 is distributed not only in the watch body 84' but also in the band 81. This kind of design can also regard as heat radiating area with watchband 81, can greatly promote the radiating efficiency.

In the second embodiment of the eighth embodiment, both the air pump portion and the liquid pump portion of the piezoelectric pump 88 are used for heat dissipation. Fig. 45 is a heat dissipation block diagram of a mobile terminal device 85 to which such a piezoelectric pump 88 is applied. As shown in fig. 45, the liquid pumping portion of the piezoelectric pump 88 may drive a coolant to circulate through the liquid cooling conduits 89 to absorb heat from the system-on-chip 14 and release heat from the cold plates 83. The air pump portion of the piezoelectric pump 88 may draw air inside/outside the mobile terminal apparatus 85 and improve heat dissipation efficiency of the cold plate 83 by blowing the air toward the cold plate 83. The cold plate 83 may have the composite material design and welding process design described above, or may be a conventional cold plate. In other embodiments, the cold plate 83 may not be provided.

In the second embodiment, the driving components of air cooling and liquid cooling can be integrated, so that compared with the traditional scheme of using a fan and a liquid pump, the space is saved, the active heat dissipation system is miniaturized, and the active heat dissipation system can be applied to the mobile terminal device 85 with a smaller size.

The foregoing describes a mobile terminal device integrated with an active liquid-cooled heat dissipation system that is capable of independently dissipating heat and equalizing temperature of the mobile terminal device. An electronic system including a mobile terminal device incapable of autonomous heat dissipation and a peripheral device having an active liquid cooling heat dissipation capability, through which the mobile terminal device is cooled and equalized, will be described hereinafter. The electronic system can be called an open type active liquid cooling heat dissipation system.

Example nine

As shown in fig. 46, an implementation of example nine provides an electronic system 100 that may include a mobile terminal device 110 and a peripheral device 120, both of which may be removably coupled.

The mobile terminal device 110 includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a wearable device, a car machine, etc. Like the mobile terminal device 10 of the first embodiment, the mobile terminal device 110 may include a housing 11, and heat generating components (such as the camera module 12, the sensor 13, the chip scale system 14, the charging module 16, and the battery 17), a liquid cooling control device 15, and a liquid cooling pipe 111 located in the housing 11.

The liquid cooling pipe 111 may be the same as the liquid cooling pipe 19 in the first embodiment. The liquid cooling pipes 111 may be arranged in series. The liquid cooling pipeline 111 may be an external liquid cooling pipeline, that is, the liquid cooling pipeline 111 may be attached to the surface of the heat generating device through a thermal interface material, and the liquid cooling pipeline 111 is in indirect contact with the heat generating device.

The liquid cooling conduits 111 are used to interface with liquid cooling conduits (described below) in the peripheral device 120. The liquid cooling pipe 111 may have a waterproof and dustproof function, and may be in a normally closed state when not in butt joint, so that water vapor or solid foreign matter cannot enter. Working medium leakage can be avoided during non-butt joint, in the butt joint process and after butt joint.

Different from the mobile terminal device 10 of the first embodiment, the mobile terminal device 110 does not include a driving pump, and therefore the mobile terminal device 110 cannot independently drive the working medium to flow, and cannot independently perform heat dissipation and temperature equalization.

As shown in fig. 46, the mobile terminal device 110 may further include a first interface 112 capable of being detachably connected with the peripheral device 120, so as to electrically connect the mobile terminal device 110 with the peripheral device 120. The specific structure of the first interface 112 may be designed as required, and for example, may include a self-locking mechanism for preventing abnormal falling, and the present embodiment is not limited thereto.

The peripheral device 120 includes, but is not limited to, a charger, a back clip (the back clip is detachably fastened to the back of the mobile terminal device 110, and the structure may be similar to a protective case, the back clip has a circuit inside, which can be used to charge the mobile terminal device 110), a handle, or an electronic device (e.g., a mobile terminal device) with an active liquid cooling heat dissipation system.

As shown in fig. 46, the peripheral device 120 may include a second interface 121, a liquid-cooled conduit 122, a liquid-cooled control device 123, and a drive pump 124.

The specific structure of the second interface 121 may be designed as needed, and for example, the second interface may include a self-locking mechanism for preventing abnormal falling, and the embodiment is not limited. The second interface 121 is used for detachably connecting with the first interface 112 of the mobile terminal device 110, so as to electrically connect the peripheral 120 with the mobile terminal device 110. For example, when the second interface 121 is connected to the first interface 112, the peripheral 120 may charge the mobile terminal device 110 (the peripheral 120 may be a charger or a back clip, for example), or the mobile terminal device 110 may supply power to the peripheral 120 (the peripheral 120 may be a mobile terminal device, for example), or signal interaction between the mobile terminal device 110 and the peripheral 120 (the peripheral 120 may be a handle, for example) may be implemented.

The liquid cooling pipe 122 connects the liquid cooling control device 123 and the drive pump 124.

The liquid cooling conduit 122 may be an internal liquid cooling conduit as described above, or an external liquid cooling conduit as described above. Taking the liquid cooling pipeline 122 as an external liquid cooling pipeline as an example, the liquid cooling pipeline 122 may be rigid and not easy to bend and deform; or can be flexible and easily bent and deformed. The liquid cooling pipeline 122 may be a plastic corrugated pipe, a metal corrugated pipe, a flexible plastic pipe, a flexible metal pipe, or the like. To avoid evaporation (evaporation loss) of the working medium in the liquid cooling pipe 122, a surface (which may be an outer surface or an inner surface) of the liquid cooling pipe 122 may be coated with a lyophobic layer. The liquid cooling pipes 122 may be arranged in series, parallel or series-parallel.

Alternatively, the liquid cooling conduit 122 may be integrated within the cable of the peripheral device 120. Fig. 47 and 48 are schematic cross-sectional views of two different configurations of the cable 125, respectively.

In one embodiment, as shown in FIG. 47, the cross-section of cable 125 is schematically circular. The cross-section of the cable 125 may also be rectangular, oval, or other shapes, depending on the product requirements.

As shown in fig. 47, cable 125 may include an insulating outer layer 1251, and liquid-cooled duct 122 and wires 1252 within insulating outer layer 1251, wherein liquid-cooled duct 122 is juxtaposed to wires 1252. After the liquid cooling pipe 122 is shown in a cross-sectional view, the liquid cooling pipe 122 may include a first portion 122a and a second portion 122b, the first portion 122a and the second portion 122b are different loops of the liquid cooling pipe 122, and the flow directions of the working mediums in the first portion 122a and the second portion 122b are opposite. Both the first portion 122a and the second portion 122b can be connected to the liquid cooling pipe 111 of the mobile terminal apparatus 110. The wires 1252 may include at least one of a power wire, a control wire, a shield mesh/shield wire, a ground wire.

In another embodiment, as shown in fig. 48, unlike the previous embodiments, the cable 125 may include an insulating outer layer 1251, and the liquid-cooled conduit 122 and the wires 1252 are positioned within the insulating outer layer 1251. Wherein the liquid cooling pipe 122 is concentric (or coaxial) with the wire 1252. Specifically, the liquid-cooling duct 122 may include a first portion 122a and a second portion 122b, the first portion 122a may surround the outer periphery of the wire 1252, and the wire 1252 may surround the outer periphery of the second portion 122 b.

Illustratively, the liquid cooling control device 123 may be a liquid storage tank, which can store working medium and also has a gas-liquid separation function. Alternatively, the liquid cooling control device 123 may also be another device capable of adjusting indexes such as a flowing mode and a flowing speed of the working medium to prevent impurities from entering the driving pump 124 or a narrow part of a flowing pipeline of the working medium, and may include at least one of flow control devices such as a flow distributor, an expansion valve, a stop valve, a safety valve, a gas-liquid separator, a dryer, a gas collection and dust removal device, and the like. In other embodiments, the liquid cooling control device 123 may not be provided.

Illustratively, the actuation pump 124 may be a piezoelectric pump, such as the piezoelectric pump described above. Alternatively, the actuation pump 124 may be a micromechanical actuation pump, a capillary pump, an electroosmotic pump, or a MEMS micropump as described above.

The number of the drive pumps 124 may be one or more, for example, 4 as shown in fig. 46. Multiple drive pumps 124 may be arranged as desired to achieve the desired head and flow. For example, as shown in fig. 46, two driving pumps 124 are connected in series to form one path, another two driving pumps 124 are connected in series to form another path, and the two driving pumps 124 are arranged in parallel. The driving pump 124 is connected in series to increase the lift, and connected in parallel to increase the flow.

The working voltage of the driving pump 124 is approximately equal to 220V and is consistent with the output specification of civil alternating current in China. This design allows the ac signal output from the outlet to drive the drive pump 124 without boosting the ac voltage when the peripheral device 120 is connected to a commercial ac power outlet.

The arrows in fig. 46 indicate the direction of flow of the working substance, as follows. As shown in fig. 46, the working medium is filtered by the liquid cooling control device 123 and then enters the driving pump 124, so that foreign matters and impurities in the working medium are prevented from entering the driving pump 124.

The operation principle of the electronic system 100 according to the first embodiment of the ninth embodiment is as follows: after the peripheral device 120 is connected to the mobile terminal device 110, the liquid cooling pipeline 122 of the peripheral device 120 may be connected to the liquid cooling pipeline 111 of the mobile terminal device 110, and the driving pump 124 may operate, so that the peripheral device 120 and the mobile terminal device 110 may form an active liquid cooling heat dissipation system. The driving pump 124 drives the working medium to flow circularly, so as to dissipate heat and equalize temperature of the mobile terminal device 110.

The solution of the first embodiment of example nine has the following advantages:

1) A channel is established for the mobile terminal device 110 to connect with an external active liquid-cooled heat sink. After the working medium absorbs heat inside the mobile terminal device 110, the working medium can flow into the peripheral device 120 and diffuse the heat to the outside, so that the mobile terminal device 110 can realize forced active heat dissipation far higher than natural heat dissipation, and the temperature of the mobile terminal device 110 is greatly reduced.

2) The liquid cooling pipeline 111 inside the mobile terminal device 110 can be connected with various different peripherals, and the heat dissipation capability of the mobile terminal device 110 is greatly improved by means of stronger external liquid cooling driving force. And can adapt to different peripherals, so that the mobile terminal device 110 has sufficient heat dissipation capability in various different and complex use scenes.

3) The drive pump 124 is disposed outside the mobile terminal device 110, which does not occupy the limited structural space of the mobile terminal device 110, and can also avoid the influence of Electromagnetic Compatibility (EMC) high-frequency noise in the mobile terminal device 110 on the drive circuit of the drive pump 124 (e.g., a piezoelectric pump).

4) If the driving pump 124 is a piezoelectric pump (a boost circuit is provided in the piezoelectric pump, and the volume of the high-voltage-resistant capacitor required by the boost circuit is large), and the peripheral device 120 is a charger, the voltage in the charger is high, so that the volume requirement of the high-voltage-resistant capacitor by the piezoelectric pump in the charger can be reduced, and the volume of the boost circuit can be reduced. Moreover, since the piezoelectric pump is disposed outside the mobile terminal device 110, the problem of a large volume of a boost circuit does not exist, which is advantageous for making the mobile terminal device 110 thin.

As shown in fig. 49, the electronic system 200 in the second embodiment of the ninth embodiment may include a mobile terminal device 110 and a peripheral device 210, which are detachably connected. The second embodiment is different from the first embodiment mainly in the composition of the peripheral device 210, and will be described below.

As shown in fig. 49, the peripheral device 210 includes a second interface 211, a liquid-cooled conduit 212, a cold plate 213, a drive pump 214, a liquid-cooled control device 215, and a fan 220.

The second interface 211 is used for being detachably connected with the first interface 112 of the mobile terminal device 110, so as to electrically connect the peripheral 210 with the mobile terminal device 110. The liquid cooling pipe 212 may be connected to the driving pump 214, the liquid cooling control device 215 and the cold plate 213 with the liquid cooling pipe 122 and the liquid cooling pipe 212. The cold plate 213 may have the composite material design and welding process design described above, or may be a conventional cold plate. The drive pump 214 may be the same as the drive pump 124 described above, or may be a conventional drive pump.

Illustratively, the liquid cooling control device 215 may include an air exhauster 216, a liquid make-up device 217, a liquid storage tank 218, and a filter screen 219. Wherein, the air exhauster 216 and the liquid supplementing device 217 are both connected with the liquid storage tank 218. A filter screen 219 is mounted within the reservoir 218. The filter screen 219 may be positioned at a lower location within the reservoir 218, such as at an outlet at the bottom of the reservoir 218 (at the lower right corner of the reservoir 218 in the view of fig. 49).

The liquid reservoir 218 with the filter net 219 mounted thereon can achieve gas-liquid separation (similar to the liquid cooling control apparatus 15 in fig. 19). The gas rising to the high level of the reservoir 218 can be vented through the vent 216 to ensure that the available volume of the reservoir 218 is within design limits. The liquid supplementing device 217 is used for supplementing working medium to the liquid storage tank 218 so as to make up for the loss of the working medium in the circulating flow.

The fan 220 is used to output an air flow to the cold plate 213 to dissipate heat absorbed by the cold plate 213.

The second embodiment of the ninth embodiment is a very precise driving pump 214 and has severe working conditions. For example, when the drive pump 214 is a piezoelectric pump, the amplitude of the piezoelectric vibrator is 150um or less. When the drive pump 214 is a micromachine drive pump, the seal gap of the dynamic seal is 0.1 μm to 500 μm, for example, 1 μm to 20 μm. This causes foreign substances to seriously affect the operational performance of the driving pump 214, resulting in noise generation of the driving pump 214. The liquid cooling control device 215 is designed to ensure that the drive pump 214 can operate reliably for a long period of time. The operation principle of the electronic system 200 according to the second embodiment of the ninth embodiment is as follows: after the peripheral device 210 is connected to the mobile terminal device 110, the liquid cooling pipeline 212 of the peripheral device 210 may be connected to the liquid cooling pipeline 111 of the mobile terminal device 110, and the driving pump 214 and the fan 220 may operate, so that the peripheral device 210 and the mobile terminal device 110 may form an active liquid cooling heat dissipation system. The driving pump 214 drives the working medium to circularly flow, and the liquid cooling control device 215, the cold plate 213 and the fan 220 all play respective roles, so that the heat dissipation and the temperature equalization of the mobile terminal device 110 are realized.

It is understood that the fan 220 and the cold plate 213 are not required in the second embodiment. The above-described composition of the liquid cooling control device 215 is not essential, and even the liquid cooling control device 215 may be eliminated.

In the peripheral device 210 according to the second embodiment of the ninth embodiment, the cold plate 213 and the fan 220 are designed, so that the heat dissipation efficiency is higher. And the function of the liquid cooling control device 215 is stronger, so that the working reliability of the active liquid cooling heat dissipation system is higher, and the heat dissipation performance of the active liquid cooling heat dissipation system is improved.

As shown in fig. 50, the electronic system 300 in the third embodiment of the ninth embodiment may include a mobile terminal device 310 and a peripheral device 320, which are detachably connected. The peripheral device 320 may be the same as the peripheral device 120 or the peripheral device 210, and thus, the detailed components of the peripheral device 320 will not be described in detail. Unlike the mobile terminal apparatus 110 in the first or second embodiment, the liquid-cooling pipes 39 in the mobile terminal apparatus 310 are designed in parallel. As will be explained below.

As shown in fig. 50, the liquid cooling pipes 39 connect the respective heat generating devices in parallel. By "parallel" it is meant that the liquid-cooled conduit 39 may include a main conduit 391 and a plurality of branch conduits (e.g., branch conduit 392, branch conduit 393, branch conduit 394), each communicating at both ends with the main conduit 391, the branch conduits being arranged side-by-side and spaced apart (similar to a parallel circuit).

In fig. 50, a main duct 391 may be schematically represented by a thick frame located around the main duct 391, and the camera module 12, the on-chip system 14, and the liquid cooling control device 15 may be connected to the main duct 391. The branch conduit 392, the branch conduit 393, and the branch conduit 394 may be schematically represented by thick lines located within an area enclosed by the main conduit 391 and connected at both ends to the main conduit 391. Branch conduit 392 is also connected to charging module 16, and branch conduit 393 and branch conduit 394 are both connected to battery 17.

It should be understood that the shape and position of the main conduit 391 and each branch conduit shown in fig. 50, the number of each branch conduit and the connected heat generating devices are illustrative and not limiting.

The liquid cooling pipes 39 cover the heating devices in parallel, and the working medium is distributed from the main pipe 391 to the branch pipes, exchanges heat with the heating devices connected to the branch pipes, and then is collected into the main pipe 391.

The parallel connection of the heating devices has the advantages that: the working medium begins to enter each heating device along the flowing direction of the working medium, and the temperature is lower because the working medium does not absorb heat, so that the working medium has larger heat absorption capacity, and the heat dissipation and temperature equalization of the heating devices are facilitated. And the total flow resistance of the liquid cooling pipes 39 in parallel is smaller than that of the liquid cooling pipes in series. On the premise that the input power of the driving pump in the peripheral device 320 is not changed, the total flow of the liquid cooling pipelines 39 can be ensured to be larger, and the heat dissipation performance of the active liquid cooling heat dissipation system can be improved; on the premise that the total flow rate of the liquid cooling pipes 39 is constant, the input power of the drive pump can be made small, which is beneficial to reducing the rotating speed of the drive pump and inhibiting the vibration noise generated by the drive pump.

As shown in fig. 51, the electronic system 400 in the fourth implementation manner of the ninth embodiment may include a mobile terminal device 410 and a peripheral device 420, which are detachably connected. The peripheral device 420 may be the same as the peripheral device 120 or the peripheral device 210, and thus, the specific components of the peripheral device 420 will not be described in detail. Unlike the mobile terminal apparatus in the first to third embodiments, the liquid-cooling pipe 39 in the mobile terminal apparatus 410 is of a hybrid design. As will be explained below.

The liquid cooling pipes 49 connect the respective heat generating devices in a series-parallel manner. By "parallel-series" is meant that the liquid cooling lines 49 are both in series and in parallel.

Illustratively, the liquid cooling conduits 49 may include a main conduit 491, a branch conduit 492, a branch conduit 493, a branch conduit 494, and a branch conduit 495. Therein, the main conduit 491 may be a conduit extending from both ends of the chip-scale system 14. Branch line 492 is connected in parallel with branch line 493, and both may be connected to battery 17. The branch conduit 494 is connected in parallel with the branch conduit 495. Wherein the branch conduit 494 may be connected with the charging module 16; the branch conduit 495 may connect the camera module 12 and the sensor 13 in series. Branch conduit 492 may be considered to be connected in parallel with branch conduit 493 to form a first branch conduit, and branch conduit 494 may be considered to be connected in parallel with branch conduit 495 to form a second branch conduit, the first branch conduit being in series relationship with the second branch conduit.

It should be understood that the shapes and positions of the main conduit 491 and the branch conduits shown in fig. 51, the number of the branch conduits and the connected heat generating devices are illustrative and not limiting.

The fourth embodiment can combine the advantages of the first to third embodiments:

In addition, compared to the design in which the liquid cooling pipes are completely connected in series, the total flow resistance of the liquid cooling pipe 49 connected in series is smaller. On the premise that the input power of the driving pump in the peripheral device 420 is not changed, the total flow of the liquid cooling pipelines 49 can be ensured to be larger, and the heat dissipation performance of the active liquid cooling heat dissipation system can be improved; on the premise that the total flow rate of the liquid cooling pipes 49 is constant, the input power of the drive pump can be made small, which is beneficial to reducing the rotating speed of the drive pump and inhibiting the vibration noise generated by the drive pump.

In the ninth embodiment, the liquid cooling pipeline of the mobile terminal device is an external liquid cooling pipeline. In the tenth embodiment to be described below, the liquid cooling pipe of the mobile terminal device may include a built-in liquid cooling pipe.

Example ten

As shown in fig. 52, in a first implementation of the tenth embodiment, an electronic system 500 may include a mobile terminal device 510 and a peripheral device 520, which are detachably connected. The peripheral 520 may be the same as the peripheral 120 or the peripheral 210 in the ninth embodiment, and thus, a detailed description thereof will not be provided.

As shown in fig. 52, the mobile terminal device 510 may include a system in package module 511, and the system in package module 511 may include, for example, the system on chip 14 and the charging module 16 integrated together. The closed space of the system-in-package module 511 can be used as a built-in liquid cooling pipeline (the same as the design of the sixth embodiment), or a liquid cooling channel can be embedded inside the package substrate in the system-in-package module 511, and the liquid cooling channel can be used as a built-in liquid cooling pipeline.

The mobile terminal unit 510 may further include a liquid cooling conduit 512, which may be an external liquid cooling conduit. The liquid cooling pipe 512 is communicated with the built-in liquid cooling pipe of the system-in-package module 511, and the two pipes form a complete liquid cooling pipe. Wherein, the heating device in the mobile terminal device 510 can be connected in series to the complete liquid cooling pipeline.

In the first embodiment of the tenth embodiment, the liquid cooling pipeline includes a built-in liquid cooling pipeline, which can reduce thermal contact resistance between the working medium and the system-in-package module 511, greatly improve heat dissipation performance and temperature equalization performance of the system-in-package module 511, and further improve heat dissipation performance and temperature equalization performance of the mobile terminal device 510.

In other embodiments, the system-in-package module 511 may not have the internal liquid cooling pipe, but be disposed on a cold plate, and the cold plate is connected to the external liquid cooling pipe, so as to achieve heat dissipation and temperature equalization of the system-in-package module 511.

In a second implementation of the tenth embodiment, as shown in FIG. 53, the electronic system 600 may include a mobile terminal device 610 and a peripheral device 520, both of which may be removably coupled. In contrast to the tenth embodiment, for the complete liquid cooling pipeline in the electronic system 600, the battery 17 and the system-in-package module 511 of the mobile terminal device 610 are connected in parallel to the complete liquid cooling pipeline, and the liquid cooling pipeline 612 (external liquid cooling pipeline) connected to the battery 17 may include two branch pipelines connected in parallel.

The second embodiment of the tenth embodiment can further improve the heat dissipation performance and the temperature equalization performance of the battery 17 with a large heat value, so as to improve the heat dissipation performance and the temperature equalization performance of the mobile terminal device 610.

As shown in fig. 54, in a third implementation of the tenth embodiment, an electronic system 700 may include a mobile terminal device 710 and a peripheral device 520, which may be detachably connected.

As shown in fig. 54, the mobile terminal device 710 may include a battery enclosure module 702, and the battery enclosure module 702 may include, for example, a charging module 16 and a battery 17 integrated together. The enclosed space of the battery package module 702 may be used as a built-in liquid cooling pipe (same as the design of the sixth embodiment), or a liquid cooling channel may be embedded inside the package substrate of the battery package module 702, and the liquid cooling channel may be used as a built-in liquid cooling pipe.

The mobile terminal apparatus 710 may further include a liquid cooling pipe 701, which may be an external liquid cooling pipe. The liquid cooling pipe 701 is communicated with the built-in liquid cooling pipe of the battery encapsulation module 702, and the built-in liquid cooling pipe form a complete liquid cooling pipe. The camera module 12 and the chip-scale system 14 may be connected in series, and both the camera module 12 and the chip-scale system 14 are connected in parallel with the battery packaging module 702.

In other embodiments, the battery encapsulation module 702 may not have the internal liquid cooling pipe, but may be disposed on a cold plate, and the cold plate is connected to the external liquid cooling pipe to achieve heat dissipation and temperature equalization for the battery encapsulation module 702.

The third embodiment of the tenth embodiment can further improve the heat dissipation and temperature equalization performance of the battery 17 with a large heat value, so as to improve the heat dissipation performance and temperature equalization performance of the mobile terminal device 710.

In a fourth implementation of the tenth embodiment, as shown in fig. 55, the electronic system 800 may include a mobile terminal device 810 and a peripheral 520, both of which may be removably coupled.

Unlike the mobile terminal apparatus 710 in the third embodiment of the tenth embodiment, as shown in fig. 55, the mobile terminal apparatus 810 may further include a chip-scale system packaging module 811, and the chip-scale system packaging module 811 may include the chip-scale system 14, for example. The closed space of the chip scale system package module 811 may be used as a built-in liquid cooling pipe (same as the above design of the sixth embodiment), or a liquid cooling channel may be embedded inside the package substrate of the chip scale system package module 811, and the liquid cooling channel may be used as a built-in liquid cooling pipe.

The mobile terminal device 810 may also include a liquid cooling conduit 812, which may be an external liquid cooling conduit. The liquid cooling pipeline 812 is communicated with the built-in liquid cooling pipeline of the chip-scale system packaging module 811 and the built-in liquid cooling pipeline of the battery packaging module 702, and the three form a complete liquid cooling pipeline. Wherein the chip scale system package module 811 and the battery package module 702 may be connected in parallel.

The scheme of the fourth implementation manner of the tenth embodiment can greatly reduce the thermal contact resistance of the working medium, and greatly improve the heat dissipation performance and the temperature equalization performance of the mobile terminal device 810.

EXAMPLE eleven

As shown in fig. 56, a first implementation of the eleventh embodiment provides an electronic system 900 that may include a mobile terminal device 910 and a peripheral device 920, which may be detachably connected. The peripheral devices 920 may be the same as those described above and will not be described in detail herein.

Unlike the ninth embodiment and the tenth embodiment, the mobile terminal device 910 may be a foldable device, such as a foldable mobile phone or a notebook computer. The mobile terminal apparatus 910 may be substantially identical to the structure of the mobile terminal apparatus 40 shown in fig. 22, for example: the mobile terminal device 910 may comprise a first part 911 and a second part 914 connected by a hinge 913. The hinge 913 can produce a mechanical movement to enable the first portion 911 and the second portion 914 to fold and unfold relative to each other. One of the first portion 911 and the second portion 914 may be, for example, a main screen portion, and the other may be, for example, a sub-screen portion.

As shown in fig. 56, a first liquid cooling pipeline 916 is disposed in the first portion 911, and the first liquid cooling pipeline 916 may be an external liquid cooling pipeline. The first liquid cooling conduits 916 are not limited to being arranged in series, parallel, or series-parallel configurations. A second liquid cooling pipeline 915 is arranged in the second portion 914, and the second liquid cooling pipeline 915 may be an external liquid cooling pipeline or may include an internal liquid cooling pipeline. The second liquid-cooled pipes 915 are not limited to be arranged in series, parallel or series-parallel.

As shown in fig. 56, the mobile terminal device 910 may further include a third liquid-cooling conduit 912 (which may be referred to as an transaxial liquid-cooling conduit) that spans the hinge 913, in the sense that the third liquid-cooling conduit 912 extends in a direction that intersects the axis of rotation of the first portion 911 (i.e., the axis of rotation of the hinge 913). Two third liquid cooling pipes 912 are shown, and in practice, the number of the third liquid cooling pipes 912 may be determined according to the layout of the liquid cooling pipes. Opposite ends of the third liquid-cooling pipeline 912 are respectively connected to the first liquid-cooling pipeline 916 and the second liquid-cooling pipeline 915. Thus, the first liquid-cooled conduit 916, the third liquid-cooled conduit 912, and the second liquid-cooled conduit 915 are in communication and form a loop, enabling heat exchange between the first portion 911 and the second portion 914.

The third liquid cooling pipe 912 has flexibility and can be bent and deformed. The third liquid-cooled conduit 912 may be constructed and constructed in accordance with the third liquid-cooled conduit 492 of the fourth embodiment and will not be described again here.

Example eleven the solution of implementation one, a channel is established for connection of the foldable device to an external active liquid-cooled heat sink. After the working medium absorbs heat inside the foldable device, the working medium can flow into the peripheral 920 and diffuse the heat to the outside, so that the foldable device can realize forced active heat dissipation far higher than natural heat dissipation, and the temperature of the foldable device is greatly reduced. And the liquid cooling pipeline in the foldable equipment can be connected with various different peripherals, so that the heat dissipation capacity of the foldable equipment can be greatly improved by means of stronger external liquid cooling driving force. And moreover, the foldable equipment can have sufficient heat dissipation capacity under various different and complex use scenes by being matched with different peripherals.

As shown in fig. 57, in a second implementation of the eleventh embodiment, an electronic system 1000 may include a mobile terminal device 1110 and a peripheral device 920, which are detachably connected. Unlike the previous embodiment, the mobile terminal device 1110 further comprises a system-in-package module 1111, and the system-in-package module 1111 may comprise, for example, the chip-scale system 14 and the charging module 16 integrated together. The closed space of the system-in-package module 1111 may be used as a built-in liquid cooling pipeline, or a liquid cooling channel may be embedded in the package substrate of the system-in-package module 1111, and the liquid cooling channel may be used as a built-in liquid cooling pipeline.

In the first embodiment, the liquid cooling pipeline in the second embodiment includes a built-in liquid cooling pipeline, which can reduce thermal contact resistance between the working medium and the system-in-package module 1111, greatly improve heat dissipation performance and temperature equalization performance of the system-in-package module 1111, and further improve heat dissipation performance and temperature equalization performance of the foldable device.

The electronic systems described in the ninth to eleventh embodiments are open active liquid-cooled heat dissipation systems, in which the mobile terminal device needs to rely on a peripheral device for active liquid-cooled heat dissipation. The internal and external hybrid active liquid cooling heat dissipation system will be described below, in which the mobile terminal device and the external device are both provided with driving pumps, and both of them can perform active liquid cooling heat dissipation.

Example twelve

As shown in fig. 58, a first implementation of the twelfth example provides an electronic system 2000 that may include a mobile terminal device 2100 and a peripheral device 2200 that are removably connectable. The peripheral device 2200 may be the same as the peripheral devices described above (with a drive pump in the peripheral device 2200), and will not be described in detail herein.

As shown in fig. 58, the mobile terminal device 2100 may be a non-foldable device, such as a straight-sided mobile phone, a tablet computer. The mobile terminal apparatus 2100 includes heat generating devices (e.g., a camera module 12, a system-in-package module 2101, and a battery 17, wherein the system-in-package module 2101 may include a chip-in-package system 14 and a charging module 16 integrated together), a liquid cooling control device 15, a driving pump 2103, a liquid cooling pipe 2104, and a tee fitting 2102.

The drive pump 2103 is not limited to a micro-mechanical drive pump, a piezoelectric pump, a capillary pump, or other drive pumps. The liquid cooling conduit 2104 may be an external liquid cooling conduit. The liquid-cooled tubes 2104 may be arranged in parallel. The liquid-cooled conduit 2104 is used to interface with liquid-cooled conduits (described below) in the peripheral device 2200. The liquid-cooled conduit 2104 may have a waterproof and dustproof function and be in a normally closed state when not docked, so that water vapor or solid foreign matter cannot enter. Working medium leakage can be avoided during butt joint, in the butt joint process and after butt joint.

The closed space of the system-in-package module 2101 may be used as a built-in liquid cooling pipe, or a liquid cooling channel may be embedded inside the package substrate in the system-in-package module 2101, and the liquid cooling channel may be used as a built-in liquid cooling pipe. The liquid cooling pipe 2104 and the built-in liquid cooling pipe may be connected, and together they constitute a liquid cooling passage inside the mobile terminal apparatus 2100.

The liquid-cooling ducts inside the mobile terminal apparatus 2100 will be hereinafter referred to as internal liquid-cooling ducts, and the liquid-cooling channels inside the peripheral device 2200 will be hereinafter referred to as external liquid-cooling ducts.

As shown in fig. 58, the tee 2102 may be located at an edge of the mobile terminal apparatus 2100, and the tee 2102 may be provided on the liquid-cooled pipe 2104. There may be two tee fittings 2102, and the two tee fittings 2102 may be provided at the inlet and the outlet of the liquid-cooled pipe 2104, respectively. The three-way device 2102 may be, for example, a three-way valve.

Tee fitting 2102 functions to: when the mobile terminal device 2100 is connected to the peripheral device 2200, the three-way device 2102 may be switched to the first state, so that the internal liquid cooling channel of the mobile terminal device 2100 is communicated with the external liquid cooling channel of the peripheral device 2200, and the internal liquid cooling channel and the external liquid cooling channel are connected in series to form a working medium circulation loop. When the mobile terminal device 2100 is disconnected from the peripheral device 2200, the three-way device 2102 may be switched to the second state, so that the internal liquid cooling channel of the mobile terminal device 2100 forms a working medium circulation loop, and the working medium in the internal liquid cooling channel cannot leak.

The electronic system 2000 operates as follows:

after the mobile terminal device 2100 is connected to the peripheral device 2200, the tee-joint device 2102 may be switched to the first state, where the internal liquid cooling channel of the mobile terminal device 2100 is communicated with the external liquid cooling channel of the peripheral device 2200, and the internal liquid cooling channel is connected in series with the external liquid cooling channel to form a working medium circulation loop. At this time, the driving pump 2103 of the mobile terminal device 2100 and/or the driving pump of the peripheral device 2200 may be operated, and a driving fluid circulates in the circulation loop, thereby transferring heat inside the mobile terminal device 2100 to the peripheral device 2200 and diffusing the heat to the outside.

When the mobile terminal device 2100 is disconnected from the peripheral device 2200, the three-way device 2102 may be switched to the second state, and the internal liquid cooling channel of the mobile terminal device 2100 itself forms a working medium circulation loop. The driving pump 2103 of the mobile terminal device 2100 can work to drive the working medium to circularly flow in the circulation loop, so that the active liquid cooling heat dissipation system in the mobile terminal device 2100 can dissipate heat of a heating device, and uniformly diffuse the heat to other parts of the whole machine, thereby improving the temperature uniformity of the whole machine.

The solution of the first embodiment of the twelfth example has the following advantages: aiming at the non-foldable mobile terminal device 2100, the active heat dissipation with high heat dissipation performance and high temperature uniformity can be realized by an active liquid cooling heat dissipation system in the mobile terminal device 2100 under the common scene that the mobile terminal device 2100 is not connected with the peripheral device 2200; in a complex scenario where the mobile terminal device 2100 is connected to the peripheral 2200, the internal and external active liquid cooling heat dissipation systems can be used to achieve a stronger heat dissipation capability to the environment. Therefore, the solution of the embodiment can not only greatly reduce the temperature of the mobile terminal device 2100, but also greatly release the performance of the heating device, so that the mobile terminal device 2100 can stably operate under full load or even overload, and the thermal experience requirement of the user can be met.

As shown in fig. 59, a second implementation of the twelfth embodiment provides an electronic system 3000 that may include a mobile terminal device 3100 and a peripheral device 3200, both of which may be detachably connected. The peripheral 3200 can be the same as the peripheral described above (with the drive pump in the peripheral 2200), and will not be described in detail herein.

As shown in fig. 59, the mobile terminal device 3100 may be a foldable device, such as a foldable cellular phone or a notebook computer. The mobile terminal device 3100 is different from the mobile terminal device 1000 shown in fig. 57 in that: the mobile terminal device 3100 further comprises a drive pump 3102 and a three-way device 3101. The drive pump 3102 may be identical to the drive pump 2103 described above, and the tee device 3101 may be identical to the tee device 2102 described above, and will not be described again here.

The electronic system 3000 operates as follows:

when the mobile terminal device 3100 is connected to the peripheral device 3200, the three-way device 3101 may be switched to the first state, the internal liquid cooling channel of the mobile terminal device 3100 is communicated with the external liquid cooling channel of the peripheral device 3200, and the internal liquid cooling channel and the external liquid cooling channel are connected in series to form a working medium circulation loop. At this time, the driving pump 3102 of the mobile terminal device 3100 and/or the driving pump of the peripheral device 3200 may be operated, and the driving fluid circulates in the circulation loop, thereby transferring the heat inside the mobile terminal device 3100 to the peripheral device 3200 and diffusing the heat to the outside.

When the mobile terminal device 3100 is disconnected from the peripheral device 3200, the three-way device 3101 may be switched to the second state, and the internal liquid cooling channel of the mobile terminal device 3100 itself forms a working medium circulation loop. The driving pump 3102 of the mobile terminal device 3100 can work to drive working medium to circularly flow in the circulation loop, so that the active liquid cooling heat dissipation system in the mobile terminal device 3100 can dissipate heat of the heating device, and uniformly diffuse the heat to other parts of the whole machine, thereby improving the temperature uniformity of the whole machine.

The second embodiment of the twelfth embodiment has the following advantages: aiming at the foldable mobile terminal device 3100, the active heat dissipation with high heat dissipation performance and high temperature uniformity can be realized by an active liquid cooling heat dissipation system in the mobile terminal device 3100 under a common scene that the mobile terminal device 3100 is not connected with the peripheral device 3200, and the stronger heat dissipation capacity to the environment can be realized by an internal and external active liquid cooling heat dissipation system under a complex scene that the mobile terminal device 3100 is connected with the peripheral device 3200. Therefore, the scheme of the embodiment can not only greatly reduce the temperature of the mobile terminal device 3100, but also greatly release the performance of the heating device, so that the mobile terminal device 3100 can stably operate under full load or even overload, and the thermal experience requirements of users are met.

Thirteen examples

A thirteenth embodiment of the present application provides a mobile terminal device, including a driving pump, a liquid cooling control device, a cold plate assembly, a liquid cooling pipeline and a heating device, where the driving pump, the liquid cooling control device and the cold plate assembly are all communicated with the liquid cooling pipeline, a working medium is in the liquid cooling pipeline, and the cold plate assembly contacts with the heating device; the driving pump is used for driving the working medium to circularly flow in the driving pump, the liquid cooling control device, the cold plate assembly and the liquid cooling pipeline; the liquid cooling control device is used for controlling the flow of the working medium.

In an implementation manner of the thirteenth embodiment, the driving pump includes a micro-pump base, a first piezoelectric vibrator and a second piezoelectric vibrator, the first piezoelectric vibrator and the second piezoelectric vibrator are respectively connected to two opposite sides of the micro-pump base, the first piezoelectric vibrator and the micro-pump base enclose a first pump cavity, the second piezoelectric vibrator and the micro-pump base enclose a second pump cavity, and the first pump cavity is isolated from the second pump cavity; a first inlet flow channel and a first outlet flow channel are arranged on one side, close to the first piezoelectric vibrator, of the micropump base, one end of the first inlet flow channel is communicated with the first pump cavity, the other end of the first inlet flow channel is communicated with the liquid cooling pipeline, one end of the first outlet flow channel is communicated with the first pump cavity, and the other end of the first outlet flow channel is communicated with the liquid cooling pipeline; a second inlet channel and a second outlet channel are arranged on one side, close to the second piezoelectric vibrator, of the micro pump base, and the second inlet channel and the second outlet channel are communicated with the second pump cavity; the second inlet flow passage is used for allowing air to flow into the second pump chamber, and the second outlet flow passage is used for allowing air in the second pump chamber to flow out.

In one implementation of embodiment thirteen, the actuation pump includes a one-way valve; the first inlet flow passage is communicated with the first pump chamber through the one-way valve, and the first outlet flow passage is communicated with the first pump chamber through the one-way valve; and/or the second inlet flow passage is in communication with the second pumping chamber through the one-way valve and the second outlet flow passage is in communication with the second pumping chamber through the one-way valve.

In one implementation of example thirteen, an end of the second inlet flow passage adjacent to the second pump chamber has an expansion opening, and an aperture of the expansion opening increases in a direction from the second inlet flow passage to the second pump chamber, and the expansion opening communicates with the second pump chamber; one end of the second outlet flow passage adjacent to the second pump chamber is provided with a contraction opening, the caliber of the contraction opening is reduced from the second outlet flow passage to the second pump chamber, and the contraction opening is communicated with the second pump chamber.

In an implementation manner of the thirteenth embodiment, the mobile terminal device is a wearable device, and the wearable device includes an air bag, and the air bag is communicated with the outside; the second inlet channel and the second outlet channel of the drive pump are both communicated with the air bag.

In an implementation manner of the thirteenth embodiment, one end of the second inlet flow passage is communicated with the second pump chamber, and the other end of the second inlet flow passage is communicated with an internal space of the mobile terminal device or the outside; one end of the second outlet flow passage is communicated with the second pump cavity, and the other end of the second outlet flow passage is communicated with the inner space of the mobile terminal device.

In one implementation of embodiment thirteen, the actuation pump includes a body, a capillary structure, an inlet tube, and an outlet tube; the body has a cavity; the capillary structure is arranged in the cavity of the main body and occupies a part of the space of the cavity of the main body; one end of the inlet pipe is communicated with the liquid cooling pipeline, and the other end of the inlet pipe is communicated with the cavity of the main body; one end of the outlet pipe is communicated with the cavity of the main body, and the other end of the outlet pipe is communicated with the liquid cooling pipeline.

In an implementation manner of the thirteenth embodiment, the liquid cooling control device includes a gas collecting and dust removing device, and the gas collecting and dust removing device includes a housing and a filter screen; the shell is provided with an inner cavity, the inner cavity of the shell is provided with an inlet and an outlet, and the inlet and the outlet are communicated with the liquid cooling pipeline; the filter screen is installed in the inner cavity of the shell and is positioned between the inlet and the outlet.

In one implementation of embodiment thirteen, the filter screens are at least two; the at least two filter screens are sequentially arranged along the direction from the inlet to the outlet, and the apertures of the meshes of the at least two filter screens are sequentially reduced.

In one implementation of embodiment thirteen, the housing comprises a first portion, a second portion, and a third portion, the first portion, the second portion, and the third portion being sequentially connected and collectively enclosing an interior cavity of the housing, the first portion having the inlet, the third portion having the outlet; the pipe caliber of the second part is larger than the pipe calibers of the first part and the third part; the filter screen is positioned in the second part; the filter screens comprise a first filter screen and a second filter screen; the first filter screen surrounds the periphery of the second filter screen, one side of the first filter screen facing the outlet is attached to the second part, and the other sides of the first filter screen are spaced from the second part; an end of the second filter facing the inlet is spaced from both the first portion and the second portion.

In one implementation of the thirteenth embodiment, the inner surface of the second portion is provided with a backflow preventing structure, and the backflow preventing structure is inclined towards the flowing direction of the working medium flowing into the second portion.

In one implementation of embodiment thirteen, the housing includes a first portion, a second portion, and a third portion, the first portion, the second portion, and the third portion are sequentially connected, the first portion is near a top of the second portion, the third portion is near a bottom of the second portion, the first portion, the second portion, and the third portion together enclose an interior cavity of the housing, the first portion has the inlet, and the third portion has the outlet; the volume of the second portion is greater than the volume of the first portion and the volume of the third portion; the filter screen is arranged in the second part and close to the third part.

In one implementation of embodiment thirteen, the outer surface of the shell has a waterproof breathable layer, the material of which is a waterproof breathable material.

In an implementation manner of the thirteenth embodiment, the liquid cooling pipeline includes a flexible liquid cooling pipeline, and a pipe wall of the flexible liquid cooling pipeline is made of a flexible material; the flexible liquid cooling pipeline is in a flat sheet shape; the pipe wall of the flexible liquid cooling pipeline is enclosed to form a channel, and the channel is used for flowing of working media.

In an implementation manner of the thirteenth embodiment, the flexible liquid cooling pipeline includes at least three layers of pipe walls, and the channel is formed between every two adjacent layers of the pipe walls.

In one implementation of the thirteenth embodiment, the inner surface and/or the outer surface of the pipe wall has a barrier layer for blocking evaporation of the working medium in the channel.

In one implementation of embodiment thirteen, the mobile terminal device comprises a first portion, a hinge and a second portion, the hinge connecting the first portion and the second portion, the hinge being capable of generating a mechanical motion to enable the first portion and the second portion to be folded and unfolded; the drive pump, the liquid cooling control device, the cold plate assembly and the heat generating device may be located within the first portion and/or the second portion; the liquid cooling pipes comprise a first liquid cooling pipe positioned in the first part and a second liquid cooling pipe positioned in the second part; the flexible liquid cooling pipeline stretches across the hinge, the extending direction of the flexible liquid cooling pipeline is intersected with the rotating axis of the first part, and two opposite ends of the flexible liquid cooling pipeline are respectively communicated with the first liquid cooling pipeline and the second liquid cooling pipeline.

In an implementation manner of the thirteenth embodiment, the heat generating device includes a circuit board, a liquid cooling channel is embedded in the circuit board, the liquid cooling channel is located between two opposite device arrangement surfaces of the circuit board, and the liquid cooling channel is used as a part of the liquid cooling pipeline.

In an implementation manner of the thirteenth embodiment, the heat generating device includes a first package substrate, a second package substrate, and a sealing frame connected between the first package substrate and the second package substrate, the first package substrate, the second package substrate, and the sealing frame enclose an enclosed space, and the enclosed space is used as a part of the liquid cooling pipeline.

In an implementation manner of the thirteenth embodiment, there are at least two heat generating devices, and the liquid cooling pipe connects the at least two heat generating devices in series; the cold plate assembly is in contact with at least one of the at least two heat generating devices.

In one implementation of the thirteenth embodiment, the liquid cooling pipeline includes a trunk pipeline and branch pipelines, the trunk pipeline surrounds the periphery of the branch pipelines, and opposite ends of the branch pipelines are both communicated with the trunk pipeline; the number of the heating devices is at least two, wherein one part of the heating devices are connected with the main pipeline, and the other part of the heating devices are connected with the branch pipelines; the cold plate assembly is in contact with at least one of the heat generating devices.

In an implementation manner of the thirteenth embodiment, the liquid cooling pipe includes a main pipe, a first branch pipe and a second branch pipe, the first branch pipe is connected in series with the second branch pipe, two opposite ends of the first branch pipe are communicated with the main pipe, and two opposite ends of the second branch pipe are communicated with the main pipe; the first branch conduit comprises at least two branch conduits, the at least two branch conduits of the first branch conduit being connected in parallel; the second branch conduit comprises at least two branch conduits, the at least two branch conduits of the second branch conduit being connected in parallel; the number of the heating devices is at least two, the main pipeline is connected with at least one heating device, each branch pipeline in the first branch pipelines is connected with at least one heating device, and each branch pipeline in the second branch pipelines is connected with at least one heating device; the cold plate assembly is connected with at least one of the heat generating devices.

Example fourteen

An embodiment fourteen of the application provides an electronic system, which comprises a mobile terminal device, a peripheral and a working medium; the mobile terminal equipment comprises a first interface, a heating device and a liquid cooling pipeline connected with the heating device; the peripheral comprises a second interface, a driving pump and a liquid cooling pipeline, and the driving pump is communicated with the liquid cooling pipeline of the peripheral; the second interface is detachably connected with the first interface so that the peripheral is connected with the mobile terminal equipment and forms electric connection; the external liquid cooling pipeline is communicated with the liquid cooling pipeline of the mobile terminal equipment; and the driving pump is used for driving the working medium to circularly flow in the liquid cooling pipeline of the peripheral equipment and the liquid cooling pipeline of the mobile terminal equipment.

In one implementation of the fourteenth embodiment, the peripheral device includes a cable, and the cable includes an insulating outer layer and a conductive wire, and the insulating outer layer wraps the conductive wire; the external liquid cooling pipeline is positioned in the insulating outer layer and is adjacent to the lead; the second interface is electrically connected with the wires in the cable.

In an implementation manner of the fourteenth embodiment, the liquid cooling pipes of the peripheral device are adjacent to the wires side by side.

In an implementation manner of the fourteenth embodiment, the liquid cooling pipeline of the peripheral device includes a first portion and a second portion, the first portion surrounds an outer periphery of the conducting wire, and the conducting wire surrounds an outer periphery of the second portion.

In an implementation manner of the fourteenth embodiment, the external devices include a fan, a cold plate, a liquid storage tank, a filter screen, an air exhauster and a liquid replenishing device; the fan is used for carrying out air cooling heat dissipation on the cold plate; the cold plate is communicated with the liquid cooling pipeline of the external device and the liquid storage tank; the liquid storage tank is communicated with a liquid cooling pipeline of the peripheral device; the filter screen is arranged in the liquid storage tank; the air exhauster and the liquid supplementing device are communicated with the liquid storage tank, the air exhauster is used for exhausting gas in the liquid storage tank, and the liquid supplementing device is used for supplementing working media to the liquid storage tank.

Example fifteen

An embodiment fifteen of the application provides an electronic system, which comprises a mobile terminal device, a peripheral and a working medium; the mobile terminal equipment comprises a heating device, a driving pump, a three-way device and an internal liquid cooling pipeline, wherein the heating device is connected with the internal liquid cooling pipeline, and the driving pump and the three-way device of the mobile terminal equipment are both communicated with the internal liquid cooling pipeline;

the peripheral equipment comprises a driving pump and an external liquid cooling pipeline, and the driving pump of the peripheral equipment is communicated with the external liquid cooling pipeline;

the external equipment is detachably connected with the mobile terminal equipment, the three-way device is in a first state that the internal liquid cooling pipeline is communicated with the external liquid cooling pipeline, and the driving pump of the mobile terminal equipment and/or the driving pump of the external equipment can drive the working medium to circularly flow in the external liquid cooling pipeline and the internal liquid cooling pipeline; after the peripheral and the mobile terminal equipment are separated, the three-way device is in a second state that the internal liquid cooling pipeline is closed, and the driving pump of the mobile terminal equipment can drive the working medium to circularly flow in the internal liquid cooling pipeline.

In one implementation of embodiment fifteen, the three-way device is a three-way valve.

The above description is only for the specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A drive pump (18) characterized in that,

the drive pump (18) comprising a volute (181), a base assembly (185), and an impeller assembly (183);

a first pump liquid groove (181 c) is formed in the surface (181 a) of the volute (181);

the base component (185) comprises a base (185 a) and a rotating shaft (185 j), the rotating shaft (185 j) and the base (185 a) are connected into a whole, a second pump liquid tank (185 e) is arranged on the surface (185 d) of the base (185 a), and the second pump liquid tank (185 e) surrounds the periphery of the rotating shaft (185 j); the surface (185 d) of the base (185 a) provided with the second pump liquid tank (185 e) is assembled with the surface (181 a) of the volute (181) provided with the first pump liquid tank (181 c), and the second pump liquid tank (185 e) and the first pump liquid tank (181 c) enclose a pump liquid space (18 a);

the impeller component (183) comprises a bearing (183 e) and an impeller (183 a), and the bearing (183 e) and the impeller (183 a) are connected into a whole;

the impeller assembly (183) is located between the base (185 a) and the volute (181) and located in the pumping space (18 a), and the bearing (183 e) is rotatably sleeved on the periphery of the rotating shaft (185 j) so that the impeller assembly (183) can rotate around the rotating shaft (185 j).

2. Drive pump (18) according to claim 1,

the impeller (183 a) comprises an impeller main body (183 b) and a plurality of blades (183 c), the blades (183 c) are connected to the periphery of the impeller main body (183 b), and every two adjacent blades (183 c) are arranged at intervals; the bearing (183 e) is connected with the impeller main body (183 b) into a whole;

the impeller main body (183 b) and the groove wall of the first pump liquid groove (181 c) form a first movement fit clearance (d 1), the impeller main body (183 b) and the groove wall of the second pump liquid groove (185 e) form a second movement fit clearance (d 2), wherein the first movement fit clearance (d 1) and the second movement fit clearance (d 2) are both the size along the radial direction of the impeller (183 a);

each vane (183 c) forms a third motion fit clearance (d 3) and a fourth motion fit clearance (d 41, d 42) with the inner wall of the pumping space (18 a), wherein the third motion fit clearance (d 3) is a dimension along the radial direction of the impeller (183 a), and the fourth motion fit clearance (d 41, d 42) is a dimension along the axial direction of the impeller (183 a);

the first kinematic fitting clearance (d 1), the second kinematic fitting clearance (d 2), the third kinematic fitting clearance (d 3) and the fourth kinematic fitting clearance (d 41, d 42) are all 0.1-500 μm.

3. Drive pump (18) according to claim 1 or 2,

the rotating shaft (185 j) and the base (185 a) are integrated through an injection molding process, and the base (185 a) is provided with injection molding features (185n, 185r, 185s);

and/or the bearing (183 e) is integrated with the impeller (183 a) through an injection molding process, and the impeller (183 a) is provided with injection molding characteristics (183i, 183j).

4. Drive pump (18) according to claim 1 or 2,

a second mounting groove (185 k) and a third mounting groove (185 p) are formed in one side, away from the second pump liquid groove (185 e), of the base (185 a), and a wiring groove (185 q) is formed in the top surface of the wall of the second mounting groove (185 k);

the drive pump (18) comprises a flexible circuit board (187) and coil windings (186); the flexible circuit board (187) is mounted in the third mounting groove (185 p); the coil winding (186) is mounted in the second mounting groove (185 k), and a lead (186 a) of the coil winding (186) passes through the bundling groove (185 q) and is soldered to a pad (187 a) on the flexible circuit board (187).

5. Drive pump (18) according to claim 1 or 2,

the impeller (183 a) includes an impeller main body (183 b) and an odd number of blades (183 c); the odd number of blades (183 c) are connected to the periphery of the impeller main body (183 b), and every two adjacent blades (183 c) are arranged at intervals; the bearing (183 e) is integrally connected to the impeller main body (183 b).

6. Drive pump (18) according to claim 1 or 2,

the driving pump (18) comprises a liquid inlet pipe and a liquid outlet pipe which are connected with the base (185 a), the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, and the liquid inlet pipe and the liquid outlet pipe are both positioned at the outer side of the second pump liquid tank (185 e) and are both communicated with the second pump liquid tank (185 e);

the impeller (183 a) includes an impeller main body (183 b) and a plurality of blades (183 c) connected to a circumference of the impeller main body (183 b); the bearing (183 e) is connected with the impeller main body (183 b) into a whole; a space is formed between every two adjacent blades (183 c);

when the impeller assembly (183) rotates around the rotating shaft (185 j), each interval can be communicated with the liquid inlet pipe so as to suck working media into the interval from the liquid inlet pipe; each interval can be communicated with the liquid outlet pipe so as to discharge the working medium from the liquid outlet pipe; the pressure of the working medium discharged from the liquid outlet pipe is greater than that of the working medium before entering the liquid inlet pipe.

7. A mobile terminal device (10, 20,30,40, 2100, 3100),

comprising a liquid cooling conduit (19, 51a,55a, 60a), a heat generating device (12, 13,14,16, 17) and a drive pump (18) according to any of claims 1 to 6;

the liquid cooling pipeline (19, 51a,55a, 60a) passes through the heat generating device (12, 13,14,16, 17) from the inside or the outside of the heat generating device (12, 13,14,16, 17), and working medium is filled in the liquid cooling pipeline (19, 51a,55a, 60a);

the base (185 a) of the driving pump (18) is connected with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, the liquid inlet pipe is communicated with one end of the second pump liquid tank (185 e) and the liquid cooling pipeline (19, 51a,55a, 60a), and the liquid outlet pipe is communicated with the other end of the second pump liquid tank (185 e) and the liquid cooling pipeline (19, 51a,55a, 60a);

the driving pump (18) is used for sucking the working medium in the liquid cooling pipeline (19, 51a,55a, 60a) into the liquid pumping space (18 a) through the liquid inlet pipe, boosting the working medium in the liquid pumping space (18 a), and discharging the boosted working medium from the liquid outlet pipe to the liquid cooling pipeline (19, 51a,55a, 60a) so as to drive the working medium to circularly flow in the liquid cooling pipeline (19, 51a,55a, 60a).