WO2023011400A1

WO2023011400A1 - Drive pump, cold plate assembly, mobile terminal apparatus and electronic system

Info

Publication number: WO2023011400A1
Application number: PCT/CN2022/109391
Authority: WO
Inventors: 靳林芳; 吴睿康; 陈奇; 王英先; 刘毅; 陈丘; 王风平; 刘用鹿; 李思杨
Original assignee: 华为技术有限公司
Priority date: 2021-08-02
Filing date: 2022-08-01
Publication date: 2023-02-09
Also published as: CN116438930A; CN114340305A; CN114340305B

Abstract

Provided in the present application are a drive pump, a cold plate assembly, a mobile terminal apparatus and an electronic system. An impeller of the drive pump is connected to a bearing as a whole, a rotating shaft is connected to a base as a whole, and the bearing is rotatably fitted to the rotating shaft, and can rotate around the rotating shaft. The cold plate assembly comprises a cold plate and a water nozzle connected to the cold plate, and the thickness of the cold plate is not greater than 1.5 mm. The mobile terminal apparatus comprises the drive pump or the cold plate assembly. The electronic system comprises the mobile terminal apparatus and a peripheral device, the mobile terminal apparatus can independently perform liquid-cooling heat dissipation, and the mobile apparatus is internally provided with a three-way device. The peripheral device is detachably connected to the mobile terminal apparatus, and when the peripheral devic is connected to the mobile terminal apparatus, the three-way device can communicate an internal liquid cooling pipeline of the mobile terminal apparatus with an external liquid cooling pipeline of the peripheral device, such that the peripheral device and the mobile terminal apparatus integrally constitute a liquid-cooling heat dissipation system. By means of the solution of the present application, the product performance of the drive pump and the cold plate assembly can be improved, and therefore the heat dissipation performance of the liquid-cooling heat dissipation system is guaranteed.

Description

Drive pumps, cold plate assemblies, mobile terminal equipment and electronic systems

This application claims the priority of the Chinese patent application with the application number 202110881933.6 and the application name "cold plate and cold plate assembly" filed with the China Patent Office on August 2, 2021, and the Chinese patent filed on September 29, 2021 Bureau, application number 202111151033.2, application title "Drive pump, cold plate assembly, mobile terminal equipment and electronic system", the entire content of which is incorporated in this application by reference.

technical field

The present application relates to the technical field of terminal equipment, in particular to a driving pump, a cold plate assembly, a mobile terminal equipment and an electronic system.

Background technique

With more and more functions and stronger performance of mobile terminal equipment, the heat generated by it also increases sharply. If there is no effective heat dissipation design, the accumulation of heat or cold will cause the temperature of the mobile terminal device to be too high or too low, resulting in degraded and limited device performance, poor user thermal experience, reduced reliability of the device, battery safety, etc. Influence. Therefore, the heat dissipation design of mobile terminals has not only become one of the important bottlenecks in improving the device performance and reliability of mobile terminals, but also one of the most concerned indicators for consumers.

However, some components in the heat dissipation system formed by the existing mobile terminal equipment, due to product defects, lead to poor heat dissipation performance of the entire heat dissipation system, which cannot meet the heat dissipation needs of the product.

Contents of the invention

The technical solution of the present application provides a driving pump, a cold plate assembly, a mobile terminal device and an electronic system, which can improve the heat dissipation performance of the heat dissipation system by optimizing the product design of the components in the heat dissipation system.

In the first aspect, the technical solution of the present application provides a driving pump. The driving pump includes a volute, a base assembly and an impeller assembly; the surface of the volute is provided with a first pump liquid tank; connected as a whole, the surface of the base is provided with a second pump liquid tank, and the second pump liquid tank surrounds the outer periphery of the rotating shaft; the surface of the base with the second pump liquid tank is assembled with the surface of the volute provided with the first pump liquid tank, The second pump liquid tank and the first pump liquid tank form a pump liquid space; the impeller assembly includes a bearing and an impeller, and the bearing and the impeller are connected as a whole; the impeller assembly is located between the base and the volute and is located in the pump liquid space, and the bearing can rotate The ground is sleeved on the outer periphery of the rotating shaft, so that the impeller assembly can rotate around the rotating shaft.

In the solution of this application, by making the rotating shaft and the base into one, and making the bearing and the impeller into one, it is easy to control the dimensional accuracy, runout, coaxiality and surface roughness of the rotating shaft, and the concentricity and runout of the impeller. Accuracy, dimensional accuracy, coaxiality, runout and surface roughness of the bearing, dimensional accuracy and surface roughness of the blade, and dimensional accuracy, coaxiality and surface roughness of the pump fluid space, so that the formed impeller assembly and The base assembly can form a high-precision, low-noise fit only through a simple self-fitting assembly method, without the need for additional high-precision assembly fixtures, which can greatly improve the rotation accuracy and performance of the drive pump, thereby making the drive pump reliable. The performance is improved, which is conducive to improving the heat dissipation performance of the liquid cooling system.

In an implementation manner of the first aspect, the impeller includes an impeller main body and a plurality of blades, the plurality of blades are connected to the periphery of the impeller main body, and every two adjacent blades are arranged at intervals; the bearing is connected with the impeller main body; the impeller The main body and the tank wall of the first pump liquid tank form a first motion fit gap, and the impeller main body and the tank wall of the second pump liquid tank form a second motion fit gap, wherein the first motion fit gap and the second motion fit gap are both Dimensions along the radial direction of the impeller; each vane forms a third motion fit gap and a fourth motion fit gap with the inner wall of the pump fluid space, wherein the third motion fit gap is the size along the radial direction of the impeller, and the fourth motion fit gap is The motion fit gap is the dimension along the axial direction of the impeller; the first motion fit gap, the second motion fit gap, the third motion fit gap and the fourth motion fit gap are all 0.1 μm-500 μm.

The numerical values of the above-mentioned moving sealing chambers can be designed according to requirements, and can be different, or at least two of them can be the same. The aforementioned kinematic fit clearance of the impeller assembly and the inner wall of the pump fluid space is a key design parameter affecting the performance of the driven pump. By designing the movement fit clearance in the range of 0.1 μm-500 μm, it is possible to avoid the large friction, high noise, high input power, weak resistance to drop deformation and damage to the working medium caused by the drive pump when the movement fit clearance is too small. The solid foreign matter is sensitive, easy to interfere or even stalled, and can avoid defects such as performance degradation of the drive pump due to excessive motion fit clearance. Therefore, the above-mentioned movement and clearance design can not only ensure the performance of the driving pump, but also take into account the working reliability of the driving pump. The heat dissipation performance of the liquid cooling system is also optimized due to the improved performance and reliability of the drive pump.

In an implementation manner of the first aspect, the rotating shaft and the base are integrated through an injection molding process, and the base has a characteristic injection molding structure; and/or, the bearing and the impeller are integrated through an injection molding process, and the impeller has a characteristic injection molding structure.

In this solution, the use of injection molding technology can ensure the manufacturing accuracy, thereby ensuring the assembly accuracy, thereby ensuring the working reliability of the drive pump, and improving the heat dissipation performance of the liquid cooling system. Injection molded features are structural features that remain on the molded part after injection molding. Injection features include, but are not limited to, gate structures or ejector pin structures.

In an implementation manner of the first aspect, a second installation groove and a third installation groove are provided on the side of the base away from the second pump liquid tank, and a wire harness groove is provided on the top surface of the groove wall of the second installation groove; The pump includes a flexible circuit board and a coil winding; the flexible circuit board is installed in the third installation slot; the coil winding is installed in the second installation slot, and the lead wires in the coil winding pass through the harness slot and are welded to the pads on the flexible circuit board .

In this solution, the coil winding welded to the welding pad on the flexible circuit board is used to generate electromagnetic force when electrified, and the electromagnetic force can drive the impeller assembly to rotate. By opening the wire harness groove, the lead wires of the coil winding can be limited and guided, which is convenient for welding the lead wires and ensures the welding quality. Moreover, the design of opening the wire harness groove to accommodate the lead wires can save space, and is well suited for the assembly of base components with relatively compact structure size and relatively narrow structure space.

In an implementation manner of the first aspect, the impeller includes an impeller main body and an odd number of blades; the odd number of blades are connected to the periphery of the impeller main body, and every two adjacent blades are arranged at intervals; the bearing is integrated with the impeller main body.

In this solution, the number of blades is odd, which can reduce or avoid resonance noise generated when the driving pump is working.

In an implementation manner of the first aspect, the drive pump includes a liquid inlet pipe and a liquid outlet pipe connected to the base, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, and both the liquid inlet pipe and the liquid outlet pipe are located in the second pump liquid tank The outer side of the impeller is connected with the second pump liquid tank; the impeller includes a main body of the impeller and a plurality of blades connected to the periphery of the main body of the impeller; the bearing is connected with the main body of the impeller; an interval is formed between every two adjacent blades; When the impeller assembly rotates around the rotating shaft, each interval can communicate with the liquid inlet pipe to suck the working medium into the interval from the liquid inlet pipe; each interval can also communicate with the liquid outlet pipe to discharge the working medium from the liquid outlet pipe; , the pressure of the working fluid discharged from the outlet pipe is higher than the pressure of the working fluid before entering the liquid inlet pipe.

In this solution, each compartment rotates with the impeller, and when the compartment is aligned with the liquid inlet pipe, the working medium is sucked into the interval from the liquid inlet pipe and rotates with the impeller. During this process, the working fluid is gradually boosted. When the gap is aligned with the liquid outlet pipe, the working fluid is pumped out from the liquid outlet pipe. This design can ensure that the working fluid maintains sufficient flow and velocity in the entire liquid cooling pipeline, which is conducive to improving the heat dissipation performance of the heat dissipation system.

In the second aspect, the technical solution of the present application provides a mobile terminal device, including a liquid-cooled pipeline, a heating device, and the above-mentioned drive pump; the liquid-cooled pipeline passes through the heating device from inside or outside the heating quality; the base of the driving pump is connected with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, the liquid inlet pipe is connected to one end of the second pump liquid tank and the liquid cooling pipe, and the liquid outlet pipe is connected to the second pump liquid The other end of the tank is connected to the liquid cooling pipeline; the drive pump is used to suck the working fluid in the liquid cooling pipeline into the pump liquid space through the liquid inlet pipe, boost the working fluid in the pump liquid space, and release the boosted working fluid It is discharged from the liquid outlet pipe to the liquid cooling pipeline to drive the working medium to circulate in the liquid cooling pipeline.

This solution can effectively improve the heat dissipation performance of mobile terminal equipment by designing a drive pump with high precision, low noise, and high operating reliability.

In the third aspect, the technical solution of the present application provides a cold plate assembly, the cold plate assembly includes a water nozzle and a cold plate; the cold plate includes a first cover plate and a second cover plate, and the first cover plate and the second cover plate are laminated And welding, the first cover plate and the second cover plate form a cold plate cavity, the cold plate cavity has an opening communicating with the outside world; the thickness of the cold plate is less than or equal to 1.5mm; the water nozzle and the first cover plate and/or the second The cover plate is connected, the water nozzle has a channel, and the channel communicates with the cold plate cavity through the opening.

The cold plate assembly in this solution can be used in mobile terminal equipment, thereby enhancing the heat dissipation performance of the mobile terminal equipment. Wherein, the water nozzle of the cold plate assembly can communicate with the liquid cooling pipeline in the mobile terminal device. In order to ensure that the overall thickness of the mobile terminal device is small, the cold plate is made very thin, for example, the thickness is ≤1.5mm. The thickness of the faucet is usually greater than that of the cold plate in order to connect with the larger-diameter liquid-cooled pipe. The water nozzle can be arranged at a non-thickness bottleneck position in the mobile terminal device. Therefore, the cold plate assembly of the present solution can also reduce the thickness of the whole machine by connecting the ultra-thin cold plate with the faucet.

In an implementation manner of the third aspect, the opening is formed on the side of the first cover plate away from the second cover plate; the water nozzle is connected to the side of the first cover plate away from the cold plate cavity. The connection structure between the faucet and the cold plate is simple in design and good in mass production.

In an implementation manner of the third aspect, the opening is surrounded by a part of the edge of the first cover and a part of the edge of the second cover; a part of the first cover and the second cover that enclose the opening A part of the area of the plate is located in the channel of the water nozzle and connected with the water nozzle. This solution provides another connection structure between the faucet and the cold plate, which is simple in design and good in mass production.

In an implementation manner of the third aspect, the overall dimension of the cold plate is at least 10 times the wall thickness of the first cover plate or the wall thickness of the second cover plate; the material of the first cover plate is a composite material, and the first cover plate is made of a composite material. The composite material of the cover plate includes a first easily weldable material close to the second cover plate and a reinforcing material away from the second cover plate, the first weldable material of the first cover plate is welded to the second cover plate; and/or, the second cover plate The material of the cover plate is a composite material, and the composite material of the second cover plate includes the first easy-weldable material close to the first cover plate and the reinforcement material far away from the first cover plate, and the first weldable material of the second cover plate and the first easy-weld material Cover welded.

In this solution, the overall dimension refers to the distance occupied by the cold plate in the X direction, Y direction or Z direction in the XYZ coordinate system. By designing the relationship between the overall dimensions of the cold plate and the wall thickness as above, the cold plate can be made lighter and thinner; the cold plate can also have a larger area to enhance the heat dissipation effect. In addition, by designing at least one cover plate of the cold plate as a composite material, the reinforcing material in the composite material can increase the structural strength and rigidity, and the easily weldable material in the composite material can increase the welding performance of the cold plate, so that the overall On the one hand, the working reliability of the cold plate is guaranteed, which is beneficial to improving the heat dissipation performance of the mobile terminal equipment.

In an implementation manner of the third aspect, the first weldable material is discontinuously distributed on the surface of the reinforcing material, so as to expose a part of the surface of the reinforcing material.

In this solution, the easily weldable material can be divided into several regions separated from each other, and the interval between each region exposes the surface of the reinforcing material. This design can save the amount of easily weldable materials. Cold plate assemblies with this design are able to accommodate non-corrosive working fluids.

In an implementation manner of the third aspect, the yield strength of the reinforcing material is greater than or equal to 150Mpa, and/or, the surface hardness of the reinforcing material is greater than or equal to HV100, and/or, the modulus of elasticity of the reinforcing material is greater than or equal to 120Mpa. This kind of reinforced material has high strength and hardness, and has good deformation resistance. This can make the cold plate have better structural strength and rigidity, which is beneficial to realize a large-area cold plate, thereby improving the heat dissipation performance of the cold plate.

In an implementation manner of the third aspect, the reinforcing material includes stainless steel, titanium, titanium alloy, tungsten, tungsten alloy, chromium or chromium alloy. The above-mentioned reinforcing material has good manufacturability and is easy to be mass-produced.

In an implementation manner of the third aspect, the melting point of the first easily weldable material is ≤950° C.; and/or, the first easily weldable material includes copper, copper alloy, nickel or nickel alloy. The above-mentioned easy-to-weld material has good manufacturability and is easy to be mass-produced.

In an implementation manner of the third aspect, the material of the first cover is a composite material, the composite material of the first cover further includes a second easily weldable material, and the second easily weldable material of the first cover is located on the first cover. The reinforcement material of the plate is away from the side of the second cover plate; the water nozzle is welded with the second easily weldable material of the first cover plate.

In this solution, by making the side connecting the first cover plate and the water nozzle also be made of easy-weld material, the welding quality between the cold plate and the water nozzle can be improved, the working reliability of the cold plate assembly can be ensured, and the heat dissipation of the cold plate can be improved. performance.

In an implementation manner of the third aspect, at least a part of the faucet has a weldable material, and the weldable material of the faucet is welded to the second weldable material of the first cover plate.

In this solution, the easily weldable material of the faucet can be formed through various processes, including but not limited to electroplating process, coating process, assembly process or composite material forming process. The welding quality between the water nozzle and the cold plate can be further enhanced by making the water nozzle also have an easily weldable material.

In an implementation manner of the third aspect, the water nozzle and the first cover plate are welded by solder paste, or welded by a process without solder paste. In this solution, solder paste welding may be, for example, brazing, which has a mature welding process and low cost. Paste-free processes refer to soldering processes that do not use solder paste, such as laser welding or diffusion welding. The precision of the no-solder paste process is high, which can ensure the welding quality.

In an implementation manner of the third aspect, the material of the second cover plate is a composite material, the composite material of the second cover plate also includes a second easily weldable material, and the second easily weldable material of the second cover plate is located on the second cover plate. The reinforcement material of the plate faces away from the side of the first cover plate; the nozzle is also welded with the second easily weldable material of the second cover plate.

In this solution, by making the side where the second cover plate is connected to the faucet also be made of easy-weld material, the welding quality between the cold plate and the faucet can be improved, the working reliability of the cold plate assembly can be ensured, and the heat dissipation of the cold plate can be improved. performance.

In an implementation manner of the third aspect, at least a part of the faucet has a weldable material, and the weldable material of the faucet is also welded to the second weldable material of the second cover plate.

In an implementation manner of the third aspect, the water nozzle and the second cover plate are welded by solder paste, or welded by a process without solder paste. In this solution, solder paste welding may be, for example, brazing, which has a mature welding process and low cost. Paste-free processes refer to soldering processes that do not use solder paste, such as laser welding or diffusion welding. The precision of the no-solder paste process is high, which can ensure the welding quality.

In an implementation manner of the third aspect, the faucet is made of easily weldable materials. In this solution, the faucet is made of easily weldable materials. This design makes the water nozzle have good welding performance, and can further enhance the welding quality of the water nozzle and the cold plate.

In an implementation manner of the third aspect, the melting point of the second easily weldable material is ≤950° C.; and/or, the second easily weldable material includes copper, copper alloy, nickel or nickel alloy. The above-mentioned easy-to-weld material has good manufacturability and is easy to be mass-produced.

In an implementation manner of the third aspect, the melting point of the easily weldable material of the faucet is ≤950°C; and/or, the easily weldable material of the faucet includes copper, copper alloy, nickel or nickel alloy. The above-mentioned easy-to-weld material has good manufacturability and is easy to be mass-produced.

In an implementation manner of the third aspect, the surface of the first cover plate facing the second cover plate and the surface of the second cover plate facing the second cover plate both include an edge area and a support area, and the edge area surrounds the support area Outer periphery; the support area of the first cover is protruded with a support part, and the support part is used to support the second cover, and the support part and the second cover are welded by solder paste or welded by a solder paste-free process; or, the second The support area of the cover plate is protruded with a support portion for supporting the first cover plate, and the support portion and the first cover plate are welded by solder paste or solder paste-free process.

In this solution, the support part in the cold plate and the cover plate supported by the support part can be welded together. The support root can be formed by stamping process or etching process. If the support part is formed by stamping, the material of the support part is the same as that of the cover plate it is connected to; if the support part is formed by etching, the material of the support part is the same as the easily weldable material on the side of the cover plate it is connected to. By designing the supporting part, the structural strength and rigidity of the cold plate can be enhanced to ensure the working reliability of the cold plate. By welding the support part and the corresponding cover plate, the connection strength between the support part and the corresponding cover plate can be ensured, so that the support part can reliably play a supporting role.

In an implementation manner of the third aspect, the edge area of the first cover plate and the edge area of the second cover plate are welded by solder paste, or welded by a process without solder paste. In this solution, the process of solder paste welding is mature and the cost is low. The solder paste-free process has high welding precision, and can also avoid the problem of solder paste overflow in the solder paste process, which can ensure the yield rate of the soldering process and reduce the production cost.

In the fourth aspect, the technical solution of the present application provides a mobile terminal device, including a liquid-cooled pipeline, a heat-generating device, and the cold plate assembly according to any one of claims 8-26; the liquid-cooled pipeline passes through the heat-generating device inside or outside Device, the liquid cooling pipeline is equipped with working fluid; the cold plate in the cold plate assembly is connected to the heating device; the cold plate assembly includes two water nozzles, the two water nozzles have intervals, and the channels of the two water nozzles are connected to the liquid cooling pipeline . In this solution, by applying a cold plate to the mobile terminal device, the heat dissipation performance of the mobile terminal device can be effectively improved.

In an implementation manner of the fourth aspect, the cold plate is connected to the heat generating device through a thermal interface material. In this solution, the thermal conductivity of the thermal interface material can be greater than or equal to 0.8 (W/m K), such as 1 (W/m K), 10 (W/m K), or even more than 100 (W/m · K). Thermal interface materials include, but are not limited to, carbon fiber thermal pads, graphene thermal pads, or liquid metal thermal interface materials. The cold plate and the heating device are connected through the thermal interface material, which can reduce the contact thermal resistance and help improve the heat dissipation performance.

In the fifth aspect, the technical solution of the present application provides an electronic system, including mobile terminal equipment, peripherals, and working fluid; Through the heating device, the driving pump and the tee device of the mobile terminal equipment are connected with the internal liquid cooling pipeline; the peripheral equipment includes the driving pump and the external liquid cooling pipeline, and the driving pump of the peripheral equipment is connected with the external liquid cooling pipeline; the peripheral equipment and the mobile terminal The device is detachably connected; when the peripheral device is connected to the mobile terminal device, the three-way device is in the first state where the internal liquid cooling pipe communicates with the external liquid cooling pipe, and the driving pump of the mobile terminal device and/or the driving pump of the peripheral device can drive The working fluid circulates in the external liquid cooling pipeline and the internal liquid cooling pipeline; after the peripheral device is separated from the mobile terminal device, the three-way device is in the second state of closing the internal liquid cooling pipeline, and the driving pump of the mobile terminal device can drive the working fluid Circulating flow in internal liquid-cooled pipes.

In this solution, the mobile terminal device can independently dissipate heat on itself, and the peripherals also have heat dissipation capabilities. When the peripheral device is connected to the mobile terminal device through the three-way device, the three-way device can connect the internal liquid cooling pipe of the mobile terminal device with the external liquid cooling pipe of the peripheral device, so that the peripheral device and the mobile terminal device as a whole form a mixed internal and external system. Liquid cooling system. Therefore, through the joint participation of the mobile terminal device and the peripheral device in heat dissipation, a stronger heat dissipation capability against the environment can be achieved, and the heat dissipation performance can be greatly improved. In common scenarios where the mobile terminal device is not connected to peripherals, it can rely on the active liquid cooling system inside the mobile terminal device to achieve active heat dissipation with high heat dissipation performance and high temperature uniformity. Therefore, this solution can not only greatly reduce the temperature of the mobile terminal equipment, but also greatly release the performance of the heating device, so that the mobile terminal equipment can run stably under full load or even overload, and meet the thermal experience needs of users.

Description of drawings

In order to illustrate the technical solution in the embodiment of the present application or the background art, the following will describe the drawings that need to be used in the embodiment of the present application or the background art.

FIG. 1 is a schematic structural block diagram of a mobile terminal device in Embodiment 1 of the present application;

FIG. 2 is a schematic diagram of a three-dimensional structure of a drive pump of the mobile terminal device in FIG. 1 at a viewing angle;

Fig. 3 is a schematic diagram of the three-dimensional structure of the driving pump in Fig. 2 from another perspective;

Fig. 4 is a schematic diagram of an exploded structure of the driving pump in Fig. 2;

Fig. 5 is a three-dimensional structural schematic view of the volute of the drive pump in Fig. 4;

Fig. 6 is a perspective view of the three-dimensional structure of the impeller assembly driving the pump in Fig. 4;

Fig. 7 is a schematic perspective view of the three-dimensional structure of the impeller assembly in Fig. 6 from another perspective;

Fig. 8 is a schematic diagram of an exploded structure of the impeller assembly in Fig. 7;

Fig. 9 is a schematic perspective view of the base assembly driving the pump in Fig. 4;

Fig. 10 is a schematic perspective view of the three-dimensional structure of the base assembly in Fig. 9 from another perspective;

Fig. 11 is a schematic diagram of the assembled structure of the base assembly, the coil winding and the flexible circuit board of the drive pump in Fig. 4;

Fig. 12a is a schematic diagram of the A-A sectional structure of the driving pump in Fig. 2;

Figure 12b is a schematic diagram of a partially enlarged structure at W in Figure 12a;

Fig. 13 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

Fig. 14 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

Fig. 15 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

Fig. 16 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

Fig. 17 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

Fig. 18 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

Fig. 19 is a schematic structural diagram of the liquid cooling control device of the mobile terminal device in Fig. 1;

FIG. 20 is a schematic structural block diagram of a mobile terminal device in Embodiment 2 of the present application;

FIG. 21 is a schematic structural block diagram of a mobile terminal device in Embodiment 3 of the present application;

FIG. 22 is a schematic structural block diagram of a mobile terminal device in Embodiment 4 of the present application;

Fig. 23 is a schematic cross-sectional structure diagram of a third liquid cooling pipeline of the mobile terminal device in Fig. 22;

Fig. 24 is another schematic cross-sectional structure diagram of the third liquid cooling pipeline of the mobile terminal device in Fig. 22;

Fig. 25 is a schematic structural diagram of the circuit board assembly in Embodiment 5 of the present application;

FIG. 26 is a schematic structural diagram of a system-in-package module in Embodiment 6 of the present application;

Fig. 27 is a schematic structural diagram of a capillary pump in Embodiment 7 of the present application;

Fig. 28 is a schematic diagram of the three-dimensional structure of the cold plate in Embodiment 7 of the present application;

Fig. 29 is a schematic diagram of an exploded structure of the cold plate in Fig. 28;

Fig. 30 is a partial cross-sectional structural schematic diagram of the cold plate in Fig. 28;

Fig. 31 is a partial cross-sectional structural schematic diagram of the cold plate in Fig. 28;

Fig. 32 is a partial cross-sectional structural schematic diagram of the cold plate in Fig. 28;

Fig. 33 is a partial cross-sectional structural schematic diagram of the cold plate in Fig. 28;

FIG. 34 is a schematic structural diagram of a mobile terminal device in Embodiment 7 of the present application;

FIG. 35 is another schematic structural diagram of the mobile terminal device in Embodiment 7 of the present application;

FIG. 36 is a schematic structural diagram of a mobile terminal device in Embodiment 7 of the present application;

Fig. 37 is a schematic diagram of the assembly structure of the third cold plate and the faucet of the mobile terminal device in Fig. 36;

Fig. 38 is a schematic diagram of the exploded structure of the third cold plate and water nozzle in Fig. 37;

Fig. 39 is a schematic cross-sectional structure diagram of the third cold plate and water nozzle in Fig. 37;

Fig. 40 is another schematic cross-sectional structure diagram of the third cold plate and water nozzle of the mobile terminal device in Fig. 36;

Fig. 41 is a schematic cross-sectional structure diagram of the piezoelectric pump in Embodiment 8 of the present application;

Fig. 42 is another schematic cross-sectional structure diagram of the piezoelectric pump in Embodiment 8 of the present application;

Fig. 43 is a schematic structural diagram of a wearable device in Embodiment 8 of the present application;

Fig. 44 is another schematic structural diagram of the wearable device in Embodiment 8 of the present application;

Fig. 45 is a schematic structural diagram of a mobile terminal device in Embodiment 8 of the present application;

Fig. 46 is a schematic structural block diagram of the electronic system in Embodiment 9 of the present application;

Fig. 47 is a schematic cross-sectional structure diagram of a cable of a peripheral device of the electronic system in Fig. 46;

Fig. 48 is another schematic cross-sectional structure diagram of cables of peripheral devices of the electronic system in Fig. 46;

Fig. 49 is another schematic structural block diagram of the electronic system in Embodiment 9 of the present application;

Fig. 50 is another schematic structural block diagram of the electronic system in Embodiment 9 of the present application;

Fig. 51 is another schematic structural block diagram of the electronic system in Embodiment 9 of the present application;

Fig. 52 is a schematic structural block diagram of the electronic system in Embodiment 10 of the present application;

Fig. 53 is another schematic structural block diagram of the electronic system in Embodiment 10 of the present application;

Fig. 54 is another schematic structural block diagram of the electronic system in Embodiment 10 of the present application;

Fig. 55 is another schematic structural block diagram of the electronic system in Embodiment 10 of the present application;

Fig. 56 is a schematic structural block diagram of the electronic system in Embodiment 11 of the present application;

Fig. 57 is another schematic structural block diagram of the electronic system in Embodiment 11 of the present application;

Fig. 58 is a schematic structural block diagram of the electronic system in Embodiment 12 of the present application;

Fig. 59 is another schematic structural block diagram of the electronic system in Embodiment 12 of the present application.

Detailed ways

Mobile terminal equipment can include mobile phones, tablet computers, smart watches, laptops, wearable devices, etc., and can also include chargers, game controllers, back clips, car machines or electric vehicles in a broad sense. With more and more functions and stronger performance of mobile terminal equipment, the heat generated by it also increases sharply. For example, stronger computing chips, 5G technology that consumes more power than 4G, and fast charging technology with higher current will all bring about a significant increase in heat generation, and put forward higher requirements for the heat dissipation performance of the device. If there is no effective heat dissipation design, the accumulation of heat or cold will cause the temperature of the mobile terminal device to be too high or too low, resulting in the following adverse effects:

(1) Performance degradation and limitation

For semiconductor devices, high temperature will affect their efficiency and performance, such as increased leakage current and decreased quantum efficiency. On the other hand, when the temperature is too high, for the purpose of protecting the device, the temperature control strategy of the device will also be triggered, and the power consumption will be controlled by reducing the frequency and frame, thereby reducing the temperature of the device. For lithium-ion batteries, at a low temperature exceeding -20°C, the actual capacity decay can exceed 50%, and even the internal resistance is too high to start normally or the instantaneous high power consumption at low temperature triggers an abnormal shutdown. For mobile terminal devices such as mobile phones, when the battery is discharged, the internal resistance is small and the heat generation is low. In a low-temperature environment, the heat from the central processing unit must be transferred to the battery area to improve battery performance.

(2) User thermal experience is poor

Excessively high temperature will cause strong discomfort to the user of the handheld device, which greatly affects the user experience.

(3) The reliability of the equipment is reduced

Mobile terminal equipment can work in different regions or seasons, and needs to work in an environment with a high temperature of 45°C and a low temperature of -40°C. High temperature will generate thermal stress in the structural materials of each layer of the equipment, which may cause the material to age and fail due to long-term thermal stress, or cause deformation and damage to the device. If the temperature exceeds the safe temperature threshold of the material and device, it will directly cause the device to fail and become unusable.

(4) Battery safety

If the operating temperature of the organic diaphragm material in the lithium-ion battery pack exceeds 70°C during charging and discharging, an irreversible exothermic reaction will occur, resulting in battery short circuit and safety accidents.

Therefore, the heat dissipation design of mobile terminals has not only become one of the important bottlenecks in improving the device performance and reliability of mobile terminals, but also one of the most concerned indicators for consumers. Taking mobile phones as an example, it has experienced four generations of heat dissipation technology evolution: the first generation is characterized by the application of local thermal interface materials (TIM), with a thermal conductivity of 1(W/m K)-10(W/m K), the latest developments include liquid metal TIM, carbon fiber/graphene TIM, etc., and the thermal conductivity can be increased to 100 (W/m K). The second generation is characterized by the large-area application of thin artificial graphite soaking film, with a thermal conductivity of 800(W/m·K)-1500(W/m·K). The latest development is a high heat flux thick graphene film (t≥0.1mm), and the thermal conductivity can be increased to 2000 (W/m·K). Due to flexible design, adjustable thickness, and small ineffective area, it has a tendency to replace two-phase heat dissipation devices such as heat pipes. The third generation is characterized by application of heat pipe (HP), loop heat pipe (LHP), and vapor chamber (VC), with a thermal conductivity of 5000 (W/m K)-15000 (W/m·K). The latest development is to replace copper and copper alloy VC with high-strength VC such as stainless steel, titanium or composite materials, and use it as a load-bearing structural support for mobile phones for large-scale use. The fourth-generation forced-air cooling technology features a built-in fan. There are air inlets/outlets on the outer shell of the mobile phone, and air ducts inside the mobile phone. Due to the precious internal space occupied by the mobile phone, the cold air cannot be directly blown to the main heating chip, and the heat dissipation effect is limited. The mobile phone industry and the industrial chain have not yet mass-produced, and it has not become an industry development trend. It should be pointed out that the above-mentioned four generations of heat dissipation technologies are evolving at the same time on mobile phones, and they are not mutually substituted.

However, the thermal conductivity of the above-mentioned heat dissipation technology is still low, and cannot fully exchange heat with the heat-generating device, and cannot effectively reduce the temperature of the heat-generating device. Moreover, it is impossible to properly arrange pipelines according to the power consumption and architecture layout of different heating devices, resulting in the inability to transfer the heat from the high-temperature area of the equipment to the low-temperature area, resulting in uneven temperature distribution of the whole machine.

In view of this, the embodiment of the present application provides an active liquid cooling heat dissipation scheme, which can overcome the defects that the conventional heat dissipation scheme cannot sufficiently dissipate heat and make the temperature of the whole machine uniform, which will be described in detail below. In the following descriptions of the embodiments of the present application, unless otherwise specified, "and/or" is used to describe the association relationship between objects, indicating that there may be three relationships among objects. For example, A and/or B are used to indicate: A exists alone, A and B exist simultaneously, and B exists alone.

In the following description of the embodiments of the present application, "plurality" refers to two or more than two.

In the following description of the embodiments of the present application, terms such as "first" and "second" are only used to distinguish technical features for clear description, and should not be understood as implying relative importance, or implicitly indicating The number of technical characteristics indicated.

The orientation terms mentioned in the embodiments of the present application, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", "Top", "bottom" and so on are only referring to the directions of the drawings. Therefore, the term of orientation is for better and clearer description and understanding of the embodiments of the present application, rather than expressly or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood To limit the embodiment of this application.

In the description of the embodiments of this application, unless otherwise specified and limited, the terms "installation", "connection", "connection", and "set on..." should be interpreted in a broad sense. For example, "connection" can be A detachable connection may also be a non-detachable connection; it may be a direct connection or an indirect connection through an intermediary.

Embodiment one

FIG. 1 shows a structural frame diagram of a mobile terminal device 10 in the first embodiment. As shown in FIG. 1 , the mobile terminal device 10 may include a housing 11, and the housing 11 may be a single housing or a housing assembly assembled from several housings.

As shown in FIG. 1 , the mobile terminal device 10 may further include a heating element located in the casing 11 , a driving pump 18 , a liquid cooling control device 15 and a liquid cooling pipeline 19 . The liquid cooling pipeline 19 is connected to the driving pump 18 and the liquid cooling control device 15, and can pass through the heating element. There is flowable working medium in the liquid cooling pipeline 19 , the driving pump 18 and the liquid cooling control device 15 , and the liquid cooling pipeline 19 , the driving pump 18 and the liquid cooling control device 15 can constitute a flow pipeline of the working fluid.

The working medium can be cooling liquid, such as water, ethylene glycol solution, propylene glycol solution or fluorinated liquid, etc., and the working medium can also include gas. The working fluid may be a single component, or may be a mixture of at least two working fluids (such as a mixture of at least two cooling fluids). The working fluid can maintain a single phase (that is, no phase change) or two phases (that is, switch between liquid and gas phases) during the flow process.

A heating device refers to a single device that has certain functions and can generate heat during operation, or a module or module composed of several single devices. Heat generating devices include but not limited to camera module 12, sensor 13, system on chip (SOC) 14, charging module (Charge IC) 16, battery 17, system in package (system in package, SIP) module, speaker modules, circuit board assemblies, etc. The heating element is arranged on the circuit board. The circuit board can be a single-layer board, or a multi-layer board stacked and arranged at intervals. For multilayer boards, heat generating devices can be arranged on each layer. For example, a sandwich circuit board or a four-sandwich circuit board includes two layers of circuit boards. Wherein, the three surfaces of the two circuit boards of the sandwich circuit board (the opposite two surfaces of one circuit board, and one surface of the other circuit board) can be arranged with heating devices, and the four surfaces of the two circuit boards of the four-sandwich circuit board (Two surfaces of each circuit board, four surfaces in total) may be arranged with heat generating devices.

In the first embodiment, the heating device, the driving pump 18, the liquid cooling control device 15, the liquid cooling pipeline 19 and the working medium can constitute an active liquid cooling heat dissipation system, and the active liquid cooling heat dissipation system can perform good active heat dissipation on the mobile terminal device 10 .

The driving pump 18 , the liquid cooling control device 15 and the liquid cooling pipeline 19 will be described in detail below one by one.

As shown in FIG. 1 , the driving pump 18 can be connected to the liquid cooling pipeline 19 , and the driving pump 18 is used to drive the working medium to circulate in the liquid cooling pipeline 19 . According to actual needs, there can be at least one driving pump 18 . The position of the drive pump 18 can be designed according to product requirements. The drive pump 18 includes, but is not limited to, a micromechanical drive pump, a piezoelectric pump, an electroosmotic pump, or a micro-electro-mechanical system (MEMS) micropump. The structure of a micromechanically driven pump will be described below.

As shown in FIGS. 2 , 3 and 4 , the drive pump 18 may include a volute 181 , a sealing ring 182 , an impeller assembly 183 , a gasket 184 , a base assembly 185 , a coil winding 186 and a flexible circuit board 187 . The following will describe one by one.

As shown in FIG. 4 and FIG. 5 , the volute 181 may also be referred to as an upper cover, an upper case, or a first housing, and the like. The volute 181 may be approximately plate-shaped. A sealing groove 181b and a first pumping liquid groove 181c are defined on the plate surface 181a (the surface whose normal line is along the thickness direction) of the volute 181, and the sealing groove 181b surrounds the outer periphery of the first pumping liquid groove 181c. The sealing groove 181b may be circular and used for installing the sealing ring 182 .

As shown in FIG. 5 , the first pumping tank 181c may include a main body area 181f, a first liquid guiding area 181d and a second liquid guiding area 181e. The main body area 181f may be approximately a circular area. Both the first liquid guiding area 181d and the second liquid guiding area 181e may be approximately linear. The first liquid guiding area 181d and the second liquid guiding area 181e are respectively connected to different positions of the main body area 181f, and both the first liquid guiding area 181d and the second liquid guiding area 181e extend to the outside of the main body area 181f. The distance between the first liquid guide area 181d and the second liquid guide area 181e may not be greater than 15 times the distance between two adjacent blades of the impeller (the impeller will be described later), this design is beneficial to ensure the lift and performance of the driving pump 18 . The center C1 of the main body region 181f and the center C2 of the sealing groove 181b may not coincide, but are arranged eccentrically.

The first pump liquid tank 181c is used to accommodate the impeller assembly 183, which will be described below.

As shown in FIGS. 6 to 8 , the impeller assembly 183 may include an impeller 183a, a bearing 183e, a magnet 183f and a magnetically permeable ring 183g. Each will be described below.

As shown in FIG. 7 and FIG. 8 , the impeller 183a may include an impeller main body 183b and a plurality of blades 183c connected to the periphery of the impeller main body 183b, and the impeller main body 183b and the blades 183c may be connected as one.

The impeller main body 183b may be substantially disc-shaped, and a central through hole 183d is opened thereon, and the axis of the central through hole 183d passes through the center of the impeller main body 183b. One side surface of the impeller main body 183b can be provided with a shaft sleeve 183h, and the shaft sleeve 183h can be integrated with the impeller main body 183b, and the two can be formed by integral injection molding. The lumen of the sleeve 183h communicates with and aligns with the central through hole 183d.

The shape of the blade 183c (may be referred to as leaf shape) can be designed according to needs, which is not limited in Embodiment 1. The number of blades 183c can be designed according to needs, for example, it can be greater than or equal to 5. The number of blades 183c may be an odd number, illustratively a prime number. The number of blades 183c is odd, which can reduce or avoid resonance noise generated when the driving pump 18 is working. All the vanes 183c may be evenly distributed around the central through hole 183d, with intervals between two adjacent vanes 183c.

As shown in FIGS. 7 and 8 , the bearing 183e may be approximately in the shape of a cylindrical tube. The bearing 183e can be located in the shaft sleeve 183h, and can be integrated with the shaft sleeve 183h.

As shown in FIG. 7 and FIG. 8 , the magnetic conduction ring 183g can be in the shape of a ring, which is located on the side of the impeller body 183b provided with the shaft sleeve 183h, and the magnetic conduction ring 183g can be integrated with the impeller body 183b. The magnetically conductive ring 183g surrounds the outer periphery of the sleeve 183h and can be concentric with the central through hole 183d. The outer peripheral surface of the magnetic conducting ring 183g may be close to the root of the blade 183c, the blade 183c may be located on the outer circumference of the magnetic conducting ring 183g, and the blade 183c may not overlap with the magnetic conducting ring 183g.

As shown in FIGS. 7 and 8 , the magnet 183f may be in the shape of a ring. The magnet 183f can be fixed on the inner peripheral surface of the magnetic conducting ring 183g, for example, the magnet 183f can be glued to the inner peripheral surface of the magnetic conducting ring 183g. The magnet 183f and the magnetic permeable ring 183g may be concentric.

In Embodiment 1, the impeller 183a, the bearing 183e and the magnetically conductive ring 183g can be formed through an integral molding process, such as an insert injection molding process, an insert injection molding process, an integrated sintering process, and a 3D printing process. One-piece molding can ensure product accuracy and lower cost.

As shown in Fig. 6 and Fig. 7, after the impeller 183a, the bearing 183e and the magnetic conduction ring 183g are integrally injection molded, the impeller main body 183b has a visible injection molding feature structure, and the injection molding feature structure includes but not limited to the injection port structure or the thimble structure. Wherein, the injection port structure can be a groove (or pit) or a columnar structure (the columnar structure can be polished after injection molding to form a groove), and the thimble structure can be a groove (or pit). For example, the injection port structure 183i shown in FIG. 6 is a pit formed after injection molding, and FIG. 7 shows that the ejector pin structure 183j is a pit formed by an ejector pin after injection molding. There may be at least one injection molding feature structure on the impeller main body 183b, for example, there are multiple injection port structures 183i and ejector pin structures 183j.

Different from the integral injection molding described above, in other embodiments, the impeller 183a, the bearing 183e and the magnetic conducting ring 183g may be separate parts and connected by assembly.

In the first embodiment, the shaft sleeve 183h of the impeller assembly 183 can rotate with the rotating shaft in the base assembly 185, and the impeller assembly 183 can rotate around the rotating shaft (continued description below). Wherein, the shaft sleeve 183h can increase the rotation stability of the impeller assembly 183 . In other embodiments, there may be no sleeve 183h on the impeller body 183b.

FIG. 9 and FIG. 10 are schematic structural diagrams of the base assembly 185 at different viewing angles, and FIG. 10 shows the back structure of the base assembly 185 in FIG. 9 .

As shown in FIG. 9 and FIG. 10 , the base assembly 185 may also be called a lower cover, a lower shell, or a second shell, and the like. The base assembly 185 may include a base (185a) and a rotating shaft 185j, which may be connected as one. The base (185a) and the rotating shaft 185j can be formed through an integrated molding process (such as plug-in injection molding process, insert injection molding process, integrated sintering process or 3D printing process), which can reduce costs and ensure product accuracy. In other embodiments, the base ( 185 a ) and the rotating shaft 185 j can also be manufactured separately, and then assembled.

As shown in FIG. 9 , the base ( 185 a ) can be approximately plate-shaped, and a second pumping groove 185 e is provided on a plate surface 185 d (the surface whose normal line is along the thickness direction) on one side of the base ( 185 a ). The second pumping tank 185e may include a main body area 185h, a third liquid guiding area 185g and a fourth liquid guiding area 185f. The body region 185h may be approximately a circular region. Both the third liquid guiding area 185g and the fourth liquid guiding area 185f may be approximately linear. The third fluid guiding area 185g and the fourth fluid guiding area 185f are respectively connected to different positions of the main body area 185h, and both the third liquid guiding area 185g and the fourth fluid guiding area 185f extend to the outside of the main body area 185h. The distance between the third liquid-guiding area 185g and the fourth liquid-guiding area 185f may not be greater than 15 times the distance between two adjacent vanes 183c. This design is beneficial to ensure the lift and performance of the driving pump 18 .

As shown in FIG. 9 , a second liquid pipe 185b and a first liquid pipe 185c can protrude from the side of the base (185a) (the surface vertically connected to the plate surface 185d). The second liquid pipe 185b and the first liquid pipe 185c are distributed at intervals. The second liquid pipe 185b communicates with the fourth liquid conducting area 185f, and the first liquid pipe 185c communicates with the third liquid conducting area 185g. Thus, both the second liquid pipe 185b and the first liquid pipe 185c communicate with the second pump liquid tank 185e. One of the second liquid pipe 185b and the first liquid pipe 185c can be used as a liquid inlet pipe (or liquid inlet) for driving the pump 18 , and the other can be used as a liquid outlet pipe (or liquid outlet) for driving the pump 18 .

As shown in FIG. 9 and FIG. 1 , both the first liquid pipe 185c and the second liquid pipe 185b communicate with the liquid cooling pipeline 19 . Thus, driving the pump 18 can drive the working fluid to circulate in the liquid cooling pipeline 19 and the liquid cooling control device 15 .

As shown in FIG. 9 , the base ( 185 a ) can be provided with a first installation groove 185 i , and the first installation groove 185 i is located inside the second pump liquid groove 185 e, and the two are spaced apart from each other. The rotating shaft 185j is located in the first installation groove 185i and has a gap with the inner wall of the first installation groove 185i. This gap is used to accommodate a bushing 183h (to be described later).

In this embodiment, the base (185a) and the rotating shaft 185j can be integrally injection molded. As shown in FIG. 9, after the base (185a) and the rotating shaft 185j are integrally injection molded, there are visible injection molding features 185r on the base (185a). The injection molding feature structure 185r may be, for example, a thimble structure, and the thimble structure may be a groove or a pit formed after injection molding. There may be multiple injection molded features 185r.

As shown in FIG. 4 and FIG. 9 , the washer 184 can be sleeved on the rotating shaft 185j and installed at the bottom of the first installation groove 185i.

As shown in FIG. 10, a second mounting groove 185k may be formed on the base (185a). The top surface of the groove wall of the second installation groove 185k can define a harness groove 185q, and the harness groove 185q can pass through the inner surface and the outer surface of the groove wall. The harness groove 185q shown in FIG. 10 is a single larger groove. Or according to needs, the wire harness slot 185q may also include at least two smaller slots, and these slots are separated by a plurality of walls extending along the radial direction of the second installation slot 185k. A limit column 185m may be provided in the second installation groove 185k, and the limit column 185m is spaced from the inner wall of the second installation groove 185k.

As shown in FIG. 10 , after the base ( 185 a ) and the rotating shaft 185 j are integrally injection molded, there are visible injection molding

characteristic structures

185 s and 185 n on the base ( 185 a ). The injection molding feature structure 185s may be located on the top surface of the groove wall of the second installation groove 185k, for example, the injection molding feature structure 185s may be a thimble structure, and the thimble structure may be a groove or a pit formed after injection molding. Injection molded features 185s may have multiple locations. The injection molding characteristic structure 185n may be located at the top of the limiting post 185m, for example, the injection molding characteristic structure 185n may be a glue injection port structure, and the injection port structure may be a columnar protrusion formed after injection molding. There may be multiple injection molded features 185n.

As shown in FIG. 10, a third installation groove 185p may be formed on the base (185a). The third installation slot 185p may be adjacent to the wire harness slot 185q. The third installation slot 185p can pass through the side of the base (185a). The outline of the invisible third mounting groove 185p is schematically shown in dotted line in FIG. 9 .

FIG. 11 shows the assembly structure of the coil winding 186, the flexible circuit board 187 and the base (185a).

As shown in FIG. 11 , the coil winding 186 can be installed in the second installation groove 185k and sleeved on the outer periphery of the limiting post 185m. The lead wires 186a of the coil winding 186 (three lead wires are shown in bold straight lines in FIG. 11 ) can be accommodated in the wire harness groove 185q, and the wire harness groove 185q has a limiting and guiding effect on the lead wires 186a.

As shown in FIG. 11, the flexible circuit board 187 is installed in the third installation groove 185p. One end of the flexible circuit board 187 can protrude from the third installation slot 185p so as to be connected to the main board of the mobile terminal device 10 . The flexible circuit board 187 has a pad 187a to which the lead 186a protruding from the wire harness groove 185q can be soldered. In order to increase the connection strength, glue can be dispensed on the pad 187a after the wire 186a is soldered to the pad 187a, and the glue covers the pad and the end of the wire 186a connected to the pad 187a.

In the first embodiment, the lead wire 186a can be limited and guided by opening the wire harness groove 185q, which facilitates the welding operation of the lead wire 186a and ensures the welding quality. Moreover, the design of opening the harness groove 185q to accommodate the lead wires 186a can save space, and is well suited for the assembly of the base assembly 185 with a relatively compact structure size and a relatively narrow structure space.

Fig. 12a is a schematic diagram of the A-A sectional structure of the drive pump 18 shown in Fig. 2 , wherein the coil winding 186 is not shown for clarity of illustration, but this representation does not affect the key assembly structure.

The impeller assembly 183 may be mounted to a base assembly 185 as shown in FIG. 12a. Wherein, the shaft sleeve 183h in the impeller assembly 183 can be installed into the first mounting groove 185i on the base assembly 185, the bearing 183e in the impeller assembly 183 can be sleeved on the rotating shaft 185j in the base assembly 185, and the lower end surface of the bearing 183e can be connected with Spacers 184 may or may not be in contact. The blades 183c, the magnetically conductive ring 183g and the magnet 183f in the impeller assembly 183 can be installed in the second pump liquid tank 185e on the base assembly 185 . In the axial direction of the rotating shaft 185j, among the blade 183c, the magnetically conductive ring 183g and the magnet 183f, a part of each part can be located in the second pump liquid groove 185e, and the other part can be exposed in the second pump liquid groove 185e outside. In the axial direction of the rotating shaft 185j, the impeller main body 183b in the impeller assembly 183 may be located outside the second pump liquid tank 185e.

As shown in FIG. 12 a , the sealing ring 182 is installed in the sealing groove 181 b of the volute 181 . The volute 181 can be fixedly connected with the base (185a) in the base assembly 185, wherein the surface of the volute 181 provided with the sealing groove 181b can cooperate with the surface of the base (185a) provided with the second pump liquid groove 185e. Due to the limitation of manufacturing precision and/or assembly precision, the surface of the volute 181 and the surface of the base (185a) may not be matched with zero clearance, and a small assembly gap may be formed between the two.

As shown in Figure 12a, the base (185a) can cover the sealing groove 181b. After the base (185a) and the volute 181 are installed and assembled, the area inside the seal groove 181b (the seal groove 181b surrounds the periphery of this area) can be called a static seal chamber, which not only includes the pump liquid space 18a described below , also includes the above-mentioned small assembly gap between the volute 181 and the base (185a) between the sealing groove 181b and the pump liquid space 18a. The sealing ring 182 located in the sealing groove 181b is compressed, thereby sealing the static sealing cavity.

As shown in FIG. 12a, the first pumping liquid tank 181c of the volute 181 and the second pumping liquid tank 185e of the base (185a) can form a pumping liquid space 18a. The seal ring 182 surrounds the outer periphery of the pump liquid space 18a, and the seal ring 182 can prevent the working medium in the pump liquid space 18a from leaking. The seal ring 182 is separated from the pump liquid space 18a by the volute 181 and the surface of the base (185a), and the effect of the separation between the seal ring 182 and the pump liquid space 18a will be described below.

As shown in FIG. 5 and FIG. 9 , the first liquid guide area 181d of the first pump liquid tank 181c can correspond to the third liquid guide area 185g of the second pump liquid tank 185e; the main body area 181f of the first pump liquid tank 181c , may correspond to the main body area 185h of the second pumping tank 185e; the second liquid guiding area 181e of the first pumping tank 181c may correspond to the fourth liquid guiding area 185f of the second pumping tank 185e.

As shown in Figure 12a, in the axial direction of the rotating shaft 185j, among the vanes 183c, the magnetically conductive ring 183g and the magnet 183f, the part of each component beyond the second pump liquid tank 185e can extend into the first pump liquid tank 181c Inside. The impeller body 183b may be located in the first pump liquid tank 181c. That is, the impeller assembly 183 is accommodated in the pump liquid space 18a.

As shown in FIG. 12a, the impeller assembly 183 has a slight motion fit clearance with the inner wall of the pump liquid space 18a. For example, as shown in FIG. 12b, the impeller main body 183b and the groove wall of the first pump liquid groove 181c form a first motion matching gap d1, and the first motion matching gap d1 is a dimension along the radial direction of the impeller 183a. The impeller main body 183b and the groove wall of the second pump liquid groove 185e form a second kinematic fit gap d2, and the second kinematic fit gap d2 is a dimension along the radial direction of the impeller 183a. The single vane 183c can form a third kinematic fit gap d3 with the inner wall of the pump liquid space 18a, and the third kinematic fit gap d3 is a dimension along the radial direction of the impeller 183a. The single vane 183c can also form a fourth motion fit gap with the inner wall of the pump liquid space 18a, and the fourth motion fit gap is a dimension along the axial direction of the impeller 183a. For example, the single vane 183c and the groove wall of the second pump liquid groove 185e form the fourth kinematic fit gap d41, the single blade 183c and the groove wall of the first pump liquid groove 181c form the fourth kinematic fit gap d42, and the fourth kinematic fit gap d41 and the fourth kinematic fit gap d42 are both dimensions along the axial direction of the impeller 183a. The above-mentioned first motion fit gap d1, second motion fit gap d2, third motion fit gap d3, fourth motion fit gap d41 and fourth motion fit gap d42 can all be 0.1 μm-500 μm, such as 0.1 μm, 1 μm, 20μm, 100μm or 500μm. Schematically, each of the aforementioned movement fit gaps may be in the range of 1 μm-20 μm (endpoints included). It can be understood that the size of each movement fitting gap in Fig. 12b is only a schematic representation, and its specific values can be designed according to product requirements, and can be different, or at least two of them can be the same.

As shown in Figure 7, Figure 12a and Figure 12b, the impeller 183a can rotate in the pump liquid space 18a, every two adjacent blades 183c in the impeller 183a, the peripheral side of the impeller main body 183b of the impeller 183a, and the pump liquid space 18a The inner wall of the blade 183c may enclose a moving sealing chamber, and the moving sealing chamber includes a space between two adjacent blades 183c. There are a plurality of moving sealing chambers, and the number is related to the number of blades 183c of the impeller 183a. All moving seal chambers are distributed around the shaft 185j. All the moving sealing chambers are part of the static sealing chamber mentioned above, so the projections of all the moving sealing chambers on the base (185a) are located within the projection of the static sealing chambers on the base (185a).

As shown in Fig. 5, Fig. 9 and Fig. 12a, in Embodiment 1, the main body area 181f of the first pump liquid groove 181c on the volute 181 is arranged eccentrically with the sealing groove 181b, and the distance between the main body area 181f and the sealing groove 181b is relatively wide area corresponding to the third installation groove 185p on the base (185a), the advantage of this design is: under the premise of ensuring that the sealing groove 181b surrounds the outer circumference of the first pump liquid groove 181c, the sealing groove 181b faces toward the main body area 181f The direction offset near the third installation groove 185p (to realize the eccentric design) can make the sealing groove 181b occupy the space corresponding to the third installation groove 185p on the volute 181, which is beneficial to reduce the area surrounded by the sealing groove 181b diameter, so as to ensure that the external dimensions of the volute 181 are small (the external dimensions of the base (185a) and the volute 181 can be basically the same), and ultimately help to reduce the external dimensions of the drive pump 18. On the contrary, if the center of the main body region 181f is aligned with the center of the sealing groove 181b, the diameter of the area surrounded by the sealing groove 181b needs to be enlarged, which will cause the external dimension of the volute 181 to increase (for example, in the viewing angle of FIG. 5, the volute The lower boundary of the shell 181 needs to be expanded), which is not conducive to the miniaturization of the drive pump 18.

In the first embodiment, the coil winding 186 and the impeller assembly 183 can constitute a motor for driving the pump 18 . The coil winding 186 and the impeller assembly 183 are installed on opposite sides of the base (185a), that is, the motor is split. The design of the split motor cancels the waterproof cover structure of the traditional micro-mechanical drive pump (the structure used for waterproof shielding of the coil winding 186), and the waterproof isolation of the coil winding 186 is carried out through the base (185a), thereby saving space and reducing The thickness of the micromechanically driven pump.

The total thickness (dimension along the extension direction of the rotating shaft 185j ) of the drive pump 18 in the first embodiment is relatively small, for example, it may be less than or equal to 20 mm, and may even be no more than 10 mm. Such a drive pump 18 may be referred to as a micro drive pump. The micro-driven pump can save space, and can be applied to the mobile terminal device 10 with a small overall size.

In Embodiment 1, the driving signal of the mobile terminal device 10 can be applied to the coil winding 186 of the drive pump 18 through the flexible circuit board 187, so that electromagnetic induction is generated between the coil winding 186 and the magnet 183f, and a torque for driving the magnet 183f to rotate is generated. Thus, the impeller assembly 183 is driven to rotate around the rotating shaft 185j. According to different driving signals, the impeller assembly 183 can rotate forward or reversely.

When the impeller assembly 183 rotates, the working medium can be drawn into the pump liquid space 18a through the first liquid pipe 185c, and the working medium can be pumped out of the pump liquid space 18a through the second liquid pipe 185b; or the working medium can be pumped out of the pump liquid space 18a through the second liquid pipe 185b. It is sucked into the pump liquid space 18a, and the working medium is pumped out of the pump liquid space 18a through the first liquid pipe 185c. Wherein, for the single moving sealing chamber, the moving sealing chamber will communicate with the first liquid pipe 185c or the second liquid pipe 185b at a certain moment (the space between two adjacent blades 183c will be connected with the first liquid pipe 185b). 185c or the second liquid pipe 185b), and suck the working medium of lower pressure. As the impeller assembly 183 rotates, the pressure of the working fluid in the moving sealing chamber gradually increases. When the moving sealing chamber communicates with the second liquid pipe 185b or the first liquid pipe 185c (the space between two adjacent blades 183c will communicate with the second liquid pipe 185b or the first liquid pipe 185c), it will discharge Higher pressure working fluid. That is, the pressure of the working fluid pumped out from the liquid outlet is greater than the pressure of the working fluid that will enter the liquid inlet.

The pressure of the working medium in the pump liquid space 18a is relatively high, and the pressure of the working medium outside the pump liquid space 18a is relatively small. As shown in FIG. 12 a , under the action of the pressure difference, the working medium in the pump liquid space 18 a will leak toward the sealing ring 182 . As mentioned above, the pump liquid space 18a and the sealing ring 182 are separated by the volute 181 and the surface of the base ( 185a ). When the working fluid flows through the gap between the pump liquid space 18a and the sealing ring 182, the pressure of the working fluid is gradually reduced, and finally the pressure of the working fluid leaking to the sealing ring 182 is relatively small, and the sealing ring 182 can ensure that the The depressurized working fluid is cut off so that the working fluid cannot continue to leak, thereby sealing the working fluid inside the drive pump 18 .

In this embodiment, the above-mentioned motion matching clearance between the impeller assembly 183 and the inner wall of the pump liquid space 18 a is a key design parameter affecting the performance of the driving pump 18 . By designing the motion fit clearance in the range of 0.1 μm-500 μm, it is possible to avoid the large friction, high noise, high input power, weak drop resistance and deformation resistance of the driving pump 18 during operation due to too small motion fit clearance, and the impact on the working medium. The solid foreign matter in the pump is sensitive, easy to interfere or even stalled, and can avoid defects such as performance degradation of the drive pump 18 due to excessive motion fit clearance. The design of the movement and clearance in this embodiment can not only ensure the performance of the driving pump 18 , but also take into account the working reliability of the driving pump 18 .

In the first embodiment, the rotating shaft 185j and the base (185a) are integrally formed, and the rotating shaft 185j and the base (185a) remain stationary when the driving pump 18 is working. The bearing 183e is integrally formed with the impeller 183a, and the bearing 183e rotates with the impeller 183a when the driving pump 18 works. Since the integral molding process (such as an injection molding process) is easy to control the dimensional accuracy, runout, coaxiality and surface roughness of the rotating shaft 185j, the coaxiality and runout of the impeller 183a, and the dimensional accuracy, coaxiality, etc. of the bearing 183e degree, runout and surface roughness, etc., as well as the dimensional accuracy and surface roughness of the blade 183c, as well as the dimensional accuracy, coaxiality and surface roughness of the pump liquid space 18a, so that the formed impeller assembly 183 and base assembly 185 High-precision, low-noise fit can be formed only through a simple self-fit assembly method, without the need for additional high-precision assembly fixtures, so the rotation accuracy and performance of the drive pump 18 can be greatly improved, and the production yield can be greatly improved ,cut costs.

In Embodiment 1, the liquid cooling control device 15 is used to adjust the flow mode, flow speed and other indicators of the working fluid and other flow indicators to meet the heat dissipation requirements of the system, and prevent non-condensable gas and foreign matter from entering the flow tube of the driving pump 18 or the working fluid. The narrow part of the road will cause the drive pump 18 to stall, abnormal friction or noise. The liquid cooling control device 15 can be arranged in the low-pressure area of the flow pipeline of the working fluid, for example, in the low-pressure area of the liquid inlet of the driving pump 18, the downstream low-pressure area of the pipe diameter of the flow pipeline, or the cold plate (hereinafter referred to as The flow rate dip zone in the cold plate will be described. The quantity and position of the liquid cooling control device 15 can be set according to design requirements, and are not limited to those shown in FIG. 1 .

The liquid cooling control device 15 may include at least one of flow control devices such as a flow distributor, an expansion valve, a stop valve, a safety valve, a gas-liquid separator, a dryer, and a gas collection and dust removal device. The following description will be made by taking the liquid cooling control device 15 as an example of a gas collection and dust removal device.

As shown in FIG. 13 , in Embodiment 1, the liquid cooling control device 15 may include a housing 151 and a filter 152 installed in the housing 151 . Wherein, the housing 151 has an inner cavity, and the inner cavity has an inlet 151a and an outlet 151b. The part of the casing 151 near the filter screen 152 can be made of transparent material, so as to observe the working state of the filter screen 152 . Schematically, the entire casing 151 can be made of transparent materials. The filter screen 152 is installed in the cavity, and is located between the inlet 151a and the outlet 151b.

The filter screen 152 may have a large number of grid structures, and the pore size of the grids may be relatively small, for example, approximately 50 μm. Schematically, the end of the filter 152 facing the inlet 151a can form a guide tip. The guide tip may be approximately cone-shaped, with the tip of the cone facing the inlet 151a. The filter screen 152 can be made of materials compatible with the working fluid, so that the working fluid will not react with the filter screen 152 and the working fluid will not corrode the filter screen 152 . For example, filter screen 152 can adopt conductive material (such as metal) to make, and filter screen 152 can produce stronger adsorption force to impurity when electrified, so that promote the filtering effect to impurity (will describe filter screen 152 to the adsorption of impurity below. and filtering).

Both the inlet 151 a and the outlet 151 b of the liquid cooling control device 15 are in communication with the liquid cooling channel 19 , and the working medium can enter the liquid cooling control device 15 . FIG. 13 shows the working fluid entering the housing 151 of the liquid-cooling control device 15 with dotted hatching. When the active liquid cooling system is working, solid impurities may be produced (for example, plastic particles or plastic fibers will be shed from injection molded parts under the friction and impact of the working medium) and non-condensable gases may be introduced, so the working medium may also be mixed with solid impurities and Non-condensable gases (hereinafter collectively referred to as impurities). Figure 13 uses black solid circles to represent solid impurities and hollow circles to represent non-condensable gases.

As shown in FIG. 13 , after the working fluid carries impurities into the inner cavity of the housing 151 from the inlet 151a, the impurities are absorbed by the filter 152, and the working fluid can pass through the filter 152 and flow out from the outlet 151b. Wherein, the shape design of the guide tip of the filter net 152 can reduce fluid resistance and avoid fluid turbulence, so that the drive pump 18 does not need a larger pressure head, and can also avoid reducing the flow rate of the working fluid.

The scheme of Embodiment 1 can absorb impurities in the filter screen 152 by designing the liquid cooling control device 15, thereby blocking impurities in the liquid cooling control device 15, preventing them from entering the driving pump 18, and ensuring the working performance of the driving pump 18 , to avoid abnormalities such as stalling and noise in the drive pump 18.

As shown in FIG. 14 , different from the liquid cooling control device 15 in Embodiment 1, the liquid cooling control device 15 in Embodiment 2 may include at least two filters, such as a first filter 153 , a second filter 154 and The third filter screen 155 . The first filter 153 , the second filter 154 and the third filter 155 are arranged in sequence, the first filter 153 is close to the inlet 151 a, and the third filter 155 is close to the outlet 151 b. Each filter net can be connected, or can not be connected and keep a distance, for example, the first filter net 153 and the second filter net 154 can be connected, and the second filter net 154 and the third filter net 155 can keep a distance. The shape of each filter net and the quantity (or number of stages) of the filter net can be designed according to actual needs, and what is shown in FIG. 14 is only an illustration.

In the direction from the inlet 151a to the outlet 151b, the apertures of the meshes of the filter screens decrease sequentially. For example, the aperture size relation of the grid of the first filter screen 153, the second filter screen 154 and the third filter screen 155 is: the aperture of the first filter screen 153>the aperture of the second filter screen 154>the aperture of the third filter screen 155 . The pore size of the meshes of all the filter screens may be in the range of 10 μm-200 μm.

The working principle of the liquid cooling control device 15 in the second embodiment is: when the working fluid carries impurities from the inlet 151a into the inner cavity of the housing 151, the impurities with larger particle sizes will be absorbed by the first filter screen 153, and the particles with larger particle sizes will be absorbed by the first filter screen 153. Medium ones will be adsorbed by the second filter screen 154 , and those with smaller particle diameters will be adsorbed by the third filter screen 155 . That is to say, the liquid cooling control device 15 has a hierarchical filtering function.

The scheme of Embodiment 2 can make the total fluid impedance of the liquid cooling control device 15 smaller by designing multi-stage filter nets, with better filtering effect, high reliability and longer replacement period.

As shown in Figure 15, different from the above embodiments, the housing 151 of the liquid cooling control device 15 in the third embodiment may include a first part 151c, a second part 151d and a third part 151e connected in sequence, the second part The pipe diameter of the pipe 151d is larger than the pipe diameters of the first part 151 and the third part 151e. The second part 151d may protrude relative to the first part 151 and the third part 151e, and the three together define the inner cavity of the casing 151 .

As shown in FIG. 15 , a first filter 156 and a second filter 157 may be disposed inside the housing 151 , both of which may be located in the area surrounded by the second part 151d. The first filter net 156 and the second filter net 157 can be integrally formed, and the two can be an integral structure. Wherein, the first filter screen 156 can surround the outer periphery of the second filter screen 157, and the side of the first filter screen 156 facing the outlet 151b (for example, the right side of the first filter screen 156 in FIG. 15 ) can be attached to the second part 151d , the remaining sides of the first filter 156 (for example, the left side and the upper side of the first filter 156 in FIG. 15 ) may have a first interval 15a from the second portion 151d. An end of the second filter 157 facing the inlet 151a (for example, the left end of the second filter 157 in FIG. 15 ) may have a second distance from the first portion 151 and the second portion 151d.

The working principle of the liquid cooling control device 15 in Embodiment 3 is: when the working fluid carries impurities from the inlet 151a into the inner cavity of the housing 151, part of the fluid will enter the first compartment 15a with a smaller fluid impedance, and the impurities therein will Adsorbed by the first filter net 156. Another part of the fluid will flow through the second filter screen 157 , and impurities therein will be absorbed by the second filter screen 157 .

The solution of the third embodiment can filter more impurities by increasing the cross-sectional area of the filter, avoiding the accumulation of foreign matter in the dead corner of the flow, reducing the load and impedance of the filter, and prolonging the replacement cycle.

It is easy to understand that in the third embodiment, only the side of the first filter 156 facing the inlet 151a (for example, the left side of the first filter 156 in FIG. The rest of the sides (for example, the upper side and the right side of the first filter 156 in FIG. 15 ) are all attached to the second part 151d, which can also play the role of diverting fluid and filtering impurities.

As shown in FIG. 16 , based on the solution of the third embodiment, in the fourth embodiment, the second part 151d of the housing 151 of the liquid cooling control device 15 may be provided with an anti-backflow structure 15b. The anti-backflow structure 15b can be protruded on any area on the inner surface of the second part 151d, and what is shown in Fig. 16 is only a schematic.

The shape of the anti-backflow structure 15b may be approximately plate-shaped or strip-shaped, and the figure shown in FIG. 16 is only a schematic representation.

The anti-backflow structure 15b may be inclined toward the flow direction of the fluid, that is, the anti-backflow structure 15b is inclined along the direction from the inlet of the first compartment 15a to the inside of the first compartment 15a. For example, as shown in FIG. 16 , the anti-reflux structure 15b located on the left side of the inner surface of the second part 151d extends to the upper right or lower right, and the anti-reflux structure 15b located on the right side of the inner surface of the second part 151d extends to the upper left or Bottom left extension.

The number of anti-backflow structures 15b can be designed according to needs, and what is shown in FIG. 16 is only an illustration.

Under the action of gravity, the fluid entering the second part 151d may flow back, which may cause impurities in the fluid in the second part 151d to flow back into the first part 151c, weakening the first filter 156 in the second part 151d The filtering effect, or make the first filter screen 156 lose the filtering effect.

In the fourth embodiment, by designing the anti-backflow structure 15b in the second part 151d, the anti-backflow structure 15b is inclined toward the flow direction of the fluid in the second part 151d. The anti-backflow structure 15b has a relatively large flow resistance to solid foreign matter in the fluid, and has a strong adsorption effect on non-condensable gas in the fluid, thereby ensuring the stable deposition of solid foreign matter and non-condensable gas in the second part 151d The dead angle of the flow, to avoid its reverse flow into the first part 151c. Therefore, the scheme of Embodiment 4 can reduce or avoid the fluid backflow in the second part 151d, ensure that the second filter screen 157 can reliably perform the filtering function, and prolong the replacement cycle of the first filter screen 156 and the second filter screen 157 and service life.

As shown in FIG. 17 , based on the solution of the third embodiment, in the fifth embodiment, the outer surface of the second part 151d of the casing 151 of the liquid cooling control device 15 can be provided with a waterproof and breathable layer 158, and the waterproof and breathable layer 158 can be arranged on The second portion 151d is most convex than the first portion 151c. The waterproof and air-permeable layer 158 may surround the second part 151d, or may not surround the entire circumference.

The waterproof and breathable layer 158 can be made of a waterproof and breathable material, for example, can be made of a waterproof and breathable film. The waterproof and air-permeable layer 158 allows gas with small molecules to pass through, but liquids and solids with large molecules cannot pass through. After the waterproof and breathable layer 158 is designed, when the pressure in the active liquid cooling system is greater than the external atmospheric pressure, the gas in the fluid in the second part 151d will escape to the outside through the waterproof and breathable layer 158, so that the liquid cooling control device 15 The environment of the internal cavity can meet the heat dissipation requirements, for example, the internal cavity has a sufficient effective volume, so that the gas content in the internal cavity is not higher than the design threshold, etc.

In Embodiment 5, the waterproof and air-permeable layer 158 is designed on the outer surface of the second part 151d because the gas in the fluid tends to accumulate in a large amount in the second part 151d. It is easy to understand that the waterproof and breathable layer 158 may also be designed on the outer surface of the first part 151c and/or the outer surface of the third part 151e.

In addition, the waterproof and breathable layer 158 can also be designed based on the scheme of the fourth embodiment, that is, the liquid cooling control device 15 can include the anti-backflow structure 15b and the waterproof and breathable layer 158 at the same time. In fact, the design of the waterproof and air-permeable layer 158 is applicable to the first to fourth embodiments described above, wherein the waterproof and air-permeable layer 158 can be provided on any area of the outer surface of the casing 151 .

As shown in Figure 18, different from the third embodiment, the first filter screen 156 in the sixth embodiment is towards the side of the inlet 151a (for example, the left side of the first filter screen 156 in Figure 18), and towards the outlet One side of 151b (for example, the right side of the first filter screen 156 in FIG. upper side) may be spaced from the second housing 151d. The end of the second filter 157 towards the inlet 151a can be staggered with the end of the first filter 156 towards the inlet 151a, and the end of the first filter 156 towards the inlet 151a is closer to the inlet 151a, while the second filter 157 is towards the inlet One end of 151a is farther away from inlet 151a. The end of the second filter 157 towards the outlet 151b can be staggered with the end of the first filter 156 towards the outlet 151b, and the end of the first filter 156 towards the outlet 151b is far from the outlet 151b, while the second filter 157 is towards the outlet One end of 151b is closer to the outlet 151b.

In other embodiments, all sides of the first filter screen 156 can be attached to the second housing 151d; One end is basically aligned.

In the scheme of Embodiment 6, the fluid will flow along the path with the least flow resistance, and the impurities in the fluid will be preferentially absorbed by the second filter screen 157, and the impurities with larger particles will gather in the second filter screen 157 towards the inlet 151a. one end. The fluid will also pass through the first filter 156, and the first filter 156 can also absorb impurities in the fluid.

In addition, in the sixth embodiment, the outer surface of the casing 151 may also be designed with a waterproof and breathable layer 158 .

As shown in FIG. 19 , different from the above-mentioned embodiments, the first part 151c and the third part 151e in the casing 151 of the liquid cooling control device 15 of the seventh embodiment may have a step difference, that is, the first part 151c is in the second part. The connection position on 151d is not collinear with the connection position of the third part 151e on the second part 151d, and the two connection positions have a step difference (for example, there is a step difference in the vertical direction in FIG. 19 ). For example, the first part 151c can be close to the top of the second part 151d (the top refers to the end opposite to the liquid level of the working fluid in the second part 151d), and the third part 151e is then close to the bottom of the second part 151d (the bottom is the second the end opposite the top of portion 151d).

Schematically, the filter screen 159 in the second part 151d may be arranged at a corner of the second part 151d close to the third part 151e.

In Embodiment 6, the pipe diameter and volume of the second part 151d are larger, and it can be used as a liquid storage tank. Due to the larger pipe diameter and volume of the second part 151d, the flow rate of the fluid entering the second part 151d from the first part 151c will decrease, which is conducive to the rise of the gas and the fall of the solid in the fluid, thereby realizing gas-liquid separation. The sinking solid impurities will be adsorbed by the filter screen 159 . The third part 151e is connected to the bottom of the second part 151d, which facilitates the fluid filtered by the filter 159 to flow out from the second part 151d.

In Embodiment 7, a waterproof and breathable layer 158 may also be designed on the outer surface of the casing 151 .

The driving pump 18 in the first embodiment is very precise, and the sealing gap of its dynamic seal is 0.1 μm-500 μm, for example, 1 μm-20 μm, and its working conditions are relatively harsh. This makes the foreign matters seriously affect the working performance of the driving pump 18 and cause the driving pump 18 to generate noise. However, by designing the liquid cooling control device 15, the long-term and reliable operation of the driving pump 18 can be ensured.

In the first embodiment to the seventh embodiment above, the liquid-cooling control device 15 may be an independent component, which facilitates the maintenance of the liquid-cooling control device 15 separately. In other embodiments, the above-mentioned filter screen, waterproof breathable membrane and anti-reflux structure may be integrated into the driving pump 18, the liquid cooling pipeline 19 and/or the cold plate.

In Embodiment 1, the material of the liquid cooling pipeline 19 includes but not limited to plastic, metal or composite material. The liquid cooling pipe 19 can be rigid and not easy to bend and deform; or it can be flexible and easy to bend and deform, so that it can buffer the impact of the mobile terminal device 10 when it is dropped and deformed during use, or it can be suitable for the mobile terminal device 10. Collapse the scene. Specifically, the liquid cooling pipe 19 may be, for example, a plastic corrugated pipe, a metal corrugated pipe, a flexible plastic pipe, a flexible metal pipe, and the like.

In Embodiment 1, in order to avoid evaporation (evaporative loss) of the working fluid in the liquid cooling pipeline 19, the surface (which may be the outer surface or the inner surface) of the liquid cooling pipeline 19 may be coated with a liquid-repellent layer.

In Embodiment 1, the liquid cooling pipe 19 can be attached to the surface of the heating device through a thermal interface material, and the liquid cooling pipe 19 is in indirect contact with the heating device (or the liquid cooling pipe 19 passes through the heating device from the outside of the heating device). This kind of liquid cooling pipeline 19 may be called an external liquid cooling pipeline. The thermal conductivity of the thermal interface material can be greater than or equal to 0.8 (W/m K), such as 1 (W/m K), 10 (W/m K), or even more than 100 (W/m K) . The thermal interface material includes but not limited to carbon fiber thermal pad, graphene thermal pad or liquid metal thermal interface material. The thermal interface material may also have certain elasticity, and the compressibility of the thermal interface material may be greater than or equal to 5%. The elastic thermal interface material can fully squeeze out the air between the two to ensure that the two are in close contact.

As shown in FIG. 1 , the liquid cooling pipeline 19 in the first embodiment is connected to each heating device in sequence, and connects each heating device in series. The working fluid flows through each heating device in turn without shunting. The advantage of the series connection of the heating elements is that the flow rate of the working medium passing through each heating element is equal, without shunting and attenuation, which is conducive to fully dissipating heat for each heating element.

The working principle of the active liquid cooling system of Embodiment 1 is as follows: the driving pump 18 drives the working medium to circulate in the liquid cooling pipeline 19, and when the working medium flows through the heating device, it absorbs the heat of the heating device and releases the heat to the mobile terminal device 10 in other low-temperature areas, so that the heat dissipation of the heat-generating device and the temperature uniformity of the whole machine can be realized. According to needs, the liquid cooling control device 15 can adjust the flow mode, flow speed and other indicators of the working fluid to meet the heat dissipation requirements of the system, and prevent air bubbles and foreign objects from entering the narrow part of the driving pump 18 or the flow pipeline of the working fluid.

Heat transfer coefficient can be used to characterize heat dissipation efficiency. The heat transfer coefficient of the active liquid cooling system in Embodiment 1 can reach 10W/(m ² ·℃)-1000W/(m ² ·℃), for example, 50W/(m ² ·℃)-500W/(m ² · °C), which indicates that the active liquid cooling system has high heat dissipation efficiency, can fully dissipate heat from the mobile terminal device 10, and reduce the temperature of the heat-generating device.

Temperature uniformity can be characterized by temperature difference. In the first embodiment, taking the mobile terminal device 10 as an example of a foldable mobile phone with the active liquid cooling system, the temperature difference between the main screen and the secondary screen of the foldable mobile phone is ≤8°C. In particular, for some heat-generating components in the mobile terminal device 10, the temperature difference thereon may be less than or equal to 2° C., and the temperature may also be kept constant. This shows that the active liquid cooling system can make the mobile terminal device 10 maintain good temperature uniformity.

In Embodiment 1, when the working fluid can produce a phase change in the flow process (that is, the active liquid cooling system adopts phase change active cooling technology), the working medium in the flow pipeline can pass the phase change latent heat (referring to the unit mass The substance absorbs or releases heat in the process of changing from one phase to another under the condition of isothermal and equal pressure) to absorb heat, and the equivalent specific heat of the working medium is 10 times to 10,000 times that when no phase change occurs. This makes the active liquid cooling system require less working fluid. For example, compared with the conventional type that only absorbs heat through the sensible heat of temperature rise of the working fluid, the solution of this embodiment can reduce the demand for working fluid by more than 80%. This can greatly reduce the demand on the lift and pressure head of the driving pump 18, and can make the working noise of the driving pump 18 relatively low, and can even be made silent.

Moreover, the active liquid cooling system in Embodiment 1 can use a drive pump, so that the volume of the active liquid cooling system can be small, and it is suitable for mobile terminals with small sizes, which greatly improves the heat dissipation performance and uniformity of mobile terminals. temperature performance.

Embodiment two

As shown in FIG. 20 , different from the above-mentioned first embodiment, in the mobile terminal device 20 of the second embodiment, the liquid cooling pipe 19 connects the heating devices in parallel. "Parallel connection" means that the liquid cooling pipeline 19 can include a main pipeline 191 and several branch pipelines (such as a branch pipeline 192, a branch pipeline 193, and a branch pipeline 194), and the two ends of each branch pipeline are all communicated with the main pipeline 191. The pipes are arranged side by side and at intervals (similar to a parallel circuit). The number of branch pipelines shown in FIG. 20 is only an illustration, and the second embodiment is not limited thereto. In fact, there may be at least one branch pipeline in the second embodiment. In FIG. 20 , the trunk pipeline 191 can be schematically represented by thick lines around it, and the trunk pipeline 191 connects the camera module 12 , the driving pump 18 , the chip-level system 14 and the liquid cooling control device 15 . Branch pipes 192 , branch pipes 193 and branch pipes 194 can be schematically represented by thick lines located within the area surrounded by trunk pipe 191 and connected to trunk pipe 191 at both ends. The branch pipeline 192 is also connected to the charging module 16 , the branch pipeline 193 is also connected to the battery 17 , and the branch pipeline 194 is also connected to the battery 17 .

It can be understood that the shape and position of the main pipe 191 and each branch pipe shown in FIG. 20 , the number of each branch pipe and the connected heating devices are all illustrative and not limiting to the solution of this embodiment.

In the second embodiment, the liquid cooling pipeline 19 covers each heating device in a parallel manner, and the working medium is shunted from the main pipeline 191 to each branch pipeline, and performs heat exchange with the heating devices connected to each branch pipeline, and then converges to In the trunk pipeline 191.

The advantage of the parallel connection of heating devices is that the working fluid that enters each heating device along the flow direction of the working fluid has a relatively low temperature because it has not yet absorbed heat, and the working fluid has a large heat absorption capacity, which is beneficial to the heat dissipation and average temperature. And compared with the liquid-cooled pipelines connected in series, the total flow resistance of the parallel-connected liquid-cooled pipelines 19 is smaller. Under the premise that the input power of the drive pump 18 remains unchanged, this can ensure that the total flow of the liquid cooling pipeline 19 is large, which is conducive to improving the heat dissipation performance of the active liquid cooling heat dissipation system; under the premise that the total flow of the liquid cooling pipeline 19 is constant , which can make the input power of the driving pump 18 smaller, which is beneficial to reduce the rotational speed of the driving pump 18 and suppress the vibration and noise generated by the driving pump 18.

In the second embodiment, the liquid cooling control device 15 may be provided at the entrance or midway of the branch pipe 192 , the branch pipe 193 and/or the branch pipe 194 as required. During the use of the mobile terminal device 20, corresponding adjustments may be made for different scenarios. For example, in a shooting scene, the charging module 16 connected to the branch pipe 192 does not generate heat, and the liquid cooling control device 15 located on the branch pipe 192 can close the branch pipe 192 . Or for the game scene, the battery 17 connected to the branch pipe 193 and the branch pipe 194 generates little heat, and the liquid cooling control device 15 located on the branch pipe 193 and the branch pipe 194 can close the branch pipe 193 and the branch pipe 194 .

Embodiment three

As shown in FIG. 21 , different from the above-mentioned first and second embodiments, in the mobile terminal device 30 of the third embodiment, the liquid cooling pipe 19 connects all heating devices in a parallel manner. "Hybrid connection" means that the liquid cooling pipelines 19 are both connected in series and in parallel.

Schematically, the liquid cooling pipeline 19 may include a main pipeline 191 , a branch pipeline 192 , a branch pipeline 193 , a branch pipeline 194 and a branch pipeline 195 . Wherein, the trunk pipeline 191 may be a pipeline extending from both ends of the driving pump 18 , the two ends of the liquid cooling control device 15 , and the two ends of the chip-level system 14 . The branch pipeline 192 is connected in parallel with the branch pipeline 193 , and both of them can be connected with the battery 17 . The branch pipe 194 is connected in parallel with the branch pipe 195 . Wherein, the branch pipe 194 can be connected with the charging module 16 ; the branch pipe 195 can connect the camera module 12 and the sensor 13 in series. It can be considered that branch pipe 192 is connected in parallel with branch pipe 193 to form a first branch pipe, branch pipe 194 is connected in parallel with branch pipe 195 to form a second branch pipe, and the first branch pipe and the second branch pipe are in series relationship.

It can be understood that the shape and position of the main pipe 191 and each branch pipe shown in FIG. 21 , the number of each branch pipe and the connected heating devices are all illustrative and not limiting to the solution of this embodiment.

Embodiment 3 can combine the advantages of Embodiment 1 and Embodiment 2:

For heating devices or heating device groups in series (consisting of at least two heating devices), the flow rate of the working medium passing through each heating device or heating device group is equal, without shunting and attenuation, which is beneficial to each heating device or heating The device group is adequately dissipated.

For parallel-connected heating devices or heating device groups, the working fluid that enters each heating device or heating device group along the flow direction of the working fluid has a relatively large heat absorption capacity because it has not absorbed heat yet and the temperature is low. It is beneficial to the heat dissipation and uniform temperature of the heating device or the heating device group.

Moreover, compared with the design of completely series-connected liquid-cooled pipelines, the total flow resistance of the mixed-connected liquid-cooled pipelines 19 is smaller. Under the premise that the input power of the drive pump 18 remains unchanged, this can ensure that the total flow of the liquid cooling pipeline 19 is large, which is conducive to improving the heat dissipation performance of the active liquid cooling heat dissipation system; under the premise that the total flow of the liquid cooling pipeline 19 is constant , which can make the input power of the driving pump 18 smaller, which is beneficial to reduce the rotational speed of the driving pump 18 and suppress the vibration and noise generated by the driving pump 18.

The three layout modes (series, parallel, and mixed) of the liquid cooling pipelines 19 are respectively described above. In fact, you can choose a suitable layout method according to your needs. For example, the layout of the liquid cooling pipeline 19 can be determined based on a comprehensive evaluation of factors such as the pressure loss and flow rate of the liquid cooling pipeline 19 , the output performance of the drive pump 18 , the heat generation of the heating element, and the layout. In this way, through proper flow pipe design and flow distribution method, the heating device can achieve the lowest temperature and the highest temperature uniformity of the whole machine under the lowest liquid cooling power consumption.

Embodiment four

This embodiment will describe a flexible and bendable liquid cooling pipe. The liquid cooling pipe can be used in foldable devices, such as folding mobile phones or laptops. The liquid cooling pipe can also be used in wearable devices, such as smart watches, smart bracelets, etc. For example, the liquid cooling pipe can be set in the wristband of a smart watch to adapt to the winding and unfolding of the wristband, and enable the wristband to participate in heat dissipation to improve the heat dissipation performance of the wearable device.

FIG. 22 is a schematic structural block diagram of a foldable mobile terminal device 40 . As shown in FIG. 22 , the mobile terminal device 40 may include a first part 41 and a second part 43 connected by a hinge 42 . The hinge 42 can generate mechanical movement, so that the first part 41 and the second part 43 can be folded and unfolded relative to each other. One of the first part 41 and the second part 43 may be, for example, a main screen part, and the other may be, for example, a secondary screen part.

As shown in Figure 22, the first part 41 is provided with a first liquid cooling pipeline 491, and the first liquid cooling pipeline 491 may be the external liquid cooling pipeline described above (or the built-in liquid cooling pipeline described below) ), not limited to series, parallel or hybrid layout. The second part 43 is provided with a second liquid cooling pipeline 493, and the second liquid cooling pipeline 493 may be the external liquid cooling pipeline described above (or the built-in liquid cooling pipeline described below), and is not limited to the use of Series, parallel or mixed layout.

As shown in FIG. 22 , the mobile terminal device 40 may also include a third liquid cooling pipe 492 (which may be referred to as a cross-axis liquid cooling pipe) across the hinge 42, and the meaning of "straddling" is the extension of the third liquid cooling pipe 492. The direction intersects the axis of rotation of the first part 41 (that is, the axis of rotation of the hinge 42). The figure shows two third liquid-cooling pipes 492 , but actually the number of the third liquid-cooling pipes 492 can be determined according to the layout of the liquid-cooling pipes. The opposite ends of the third liquid-cooled pipeline 492 are respectively connected to the first liquid-cooled pipeline 491 and the second liquid-cooled pipeline 493 (FIG. Three liquid-cooled pipelines 492, hereinafter adopt the same representation). Thus, the first liquid cooling pipe 491 , the third liquid cooling pipe 492 and the second liquid cooling pipe 493 communicate and form a circuit, so that heat exchange can be realized between the first part 41 and the second part 43 .

FIG. 23 shows a schematic cross-sectional structure of the third liquid cooling pipe 492 in the mobile terminal device 40 . As shown in FIG. 23 , the third liquid cooling pipe 492 may be a hollow structure, and its pipe wall 492a encloses a channel 492c. Channel 492c is used for flow of working fluid. The pipe wall 492a is flexible and can be bent, so the third liquid cooling pipe 492 is a flexible liquid cooling pipe. The material of the pipe wall 492a includes, but is not limited to, a polymer material (such as polyimide), or a metal-plastic composite material (polyimide copper-clad material). The third liquid cooling pipe 492 has a bendable area 492b. When the first part 41 is folded or unfolded relative to the second part 43 , the bendable area 492 b can be bent or unfolded accordingly. The number of bendable regions 492b can be designed according to needs, and is not limited to that shown in FIG. 23 .

FIG. 24 shows another schematic cross-sectional structure of the third liquid cooling pipe 492 in the mobile terminal device 40 . Different from the structure shown in FIG. 23, the tube wall 492a of the third liquid cooling tube 492 in FIG. 24 may have at least two layers, for example, three layers. Channels 492c are formed between every adjacent two layers of pipe walls 492a, and each channel 492c can supply working fluid. The third liquid cooling pipe 492 has a larger flow rate, which is beneficial to improving the heat exchange efficiency of the working fluid, thereby improving the heat dissipation performance and temperature uniformity performance of the mobile terminal device.

The hinge 42 is usually the thickest part of the mobile terminal device 40 . In order to make the product thinner, the thickness of the product at the hinge 42 is controlled, so the thickness and dimension space of the mobile terminal device 40 at the hinge 42 is relatively limited. In order to meet this requirement, the third liquid cooling pipe 492 across the hinge 42 can be in the shape of a flat plate (similar to a sheet-shaped flexible circuit board). For example, the width of the third liquid cooling pipe 492 can be 4mm-5mm, and the thickness can be 0.8mm. mm or less. The third liquid cooling pipe 492 can be arranged in such a way that when the third liquid cooling pipe 492 is bent, the thickness direction of the third liquid cooling pipe 492 can point to the rotation axis of the hinge 42 .

In order to avoid loss of the working fluid in the channel 492c due to evaporation, a barrier layer may be provided on the surface of the tube wall 492a. For example, for the third liquid-cooled pipe 492 shown in FIG. 23 , a barrier layer may be provided on the inner surface and/or outer surface of any pipe wall 492a. For the third liquid-cooled pipeline 492 shown in Figure 24, a barrier layer can be arranged on the surface of any tube wall 492a; or, a barrier layer can be set on the surface of a part of the tube wall 492a, such as the outermost side of the third liquid-cooled pipeline 492 Barrier layers are provided on the outer surfaces of the two tube walls 492a.

Materials of the barrier layer include but are not limited to metals (such as copper) or inorganic substances. The barrier layer may have at least one layer. The manufacturing process of the barrier layer includes but not limited to sticking, spraying and so on. The barrier layer has the function of blocking working fluid.

In the fourth embodiment, by designing the flexible third liquid-cooled pipe 492, not only can it meet the folding requirements of the mobile terminal device 40, but also realize the heat exchange between the first part 41 and the second part 43 of the mobile terminal device 40, It is beneficial to further realize the uniform temperature of the whole machine, and can also diffuse the heat of the main heating area to the whole machine, maximize the use of the heat dissipation area of the whole machine, and improve the heat dissipation performance of the mobile terminal device 40 .

The above-mentioned liquid cooling pipes (liquid cooling pipe 19, first liquid cooling pipe 491 or second liquid cooling pipe 493) are all attached to the surface of the heating device, and the liquid cooling pipe is in indirect contact with the heating device. The pipes may be referred to as external liquid cooling pipes. The liquid cooling pipeline described below is located inside the heat source and is in direct contact with the heating device. This kind of liquid cooling pipeline can be called a built-in liquid cooling pipeline.

Embodiment five

FIG. 25 is a schematic diagram of the cross-sectional structure of the circuit board assembly 50 in the mobile terminal device of the fifth embodiment. For clarity, the cross-section of the device is not indicated by hatching.

As shown in FIG. 25 , the circuit board assembly 50 may include a first circuit board 51 and a second circuit board 55 , and the first circuit board 51 and the second circuit board 55 are stacked and spaced apart. The first circuit board 51 and the second circuit board 55 can be connected and supported by the frame 54 , and the first circuit board 51 , the frame 54 and the second circuit board 55 can form a closed space. Heating devices can be arranged on the first circuit board 51 and the second circuit board 55, such as the heating device 52 and the heating device 53 can be arranged on the first circuit board 51, and the heating device 56 and the heating device 57 can be arranged on the second circuit board 55 And heating device 58. Since the heat of the heat-generating device can be transferred to the circuit board, the circuit board can also be considered as a heat-generating device.

As shown in Figure 25, the inside of the first circuit board 51 may have a first liquid cooling channel 51a, and the first liquid cooling channel 51a is located on the upper and lower surfaces of the first circuit board 51 (both the upper and lower surfaces are device layout surfaces) between. The first liquid cooling channel 51a can pass through the side of the first circuit board 51 along the extension direction of the first circuit board 51 (the direction perpendicular to the thickness direction) (the normal direction of the side can be basically the same as the thickness direction of the first circuit board 51). vertical). There may be at least one first liquid-cooling channel 51a, and what is shown in FIG. 25 is only an illustration. The first liquid cooling channels 51a may be separated from each other, or at least a part of them may be connected.

As shown in FIG. 25 , the second circuit board 55 may have a second liquid cooling passage 55 a inside, and the second liquid cooling passage 55 a is located between the upper and lower surfaces of the second circuit board 55 . The second liquid cooling channel 55a can pass through the side of the second circuit board 55 along the extension direction of the second circuit board 55 (the direction perpendicular to the thickness direction) (the normal direction of the side can be basically the same as the thickness direction of the second circuit board 55). vertical). There may be at least one second liquid cooling channel 55a, and what is shown in FIG. 25 is only a schematic. The second liquid cooling passages 55a may be separated from each other, or at least a part of them may be connected.

In Embodiment 5, since the first liquid cooling channel 51a is embedded in the first circuit board 51 and the second liquid cooling channel 55a is embedded in the second circuit board 55, the first liquid cooling channel 51a and the second liquid cooling channel 55a It can be called a built-in liquid cooling pipeline.

In Embodiment 5, other areas in the mobile terminal device also have liquid cooling pipes (hereinafter referred to as other liquid cooling pipes), and the other liquid cooling pipes may include external liquid cooling pipes (the external liquid cooling pipes are not limited to series, Parallel or series connection), and/or built-in liquid-cooled pipelines (such as the built-in liquid-cooled pipelines in Embodiment 5, or the built-in liquid-cooled pipelines to be described below). Both the first liquid cooling passage 51a and the second liquid cooling passage 55a in the electrical panel assembly 50 are in communication with the other liquid cooling pipes. Thus, the working fluid can enter the first liquid cooling channel 51a and the second liquid cooling channel 55a through other liquid cooling channels. The working fluid in the first liquid cooling channel 51 a can dissipate heat from the heat generating device on the first circuit board 51 , and the working fluid in the second liquid cooling channel 55 a can dissipate heat from the heat generating device on the second circuit board 55 .

In Embodiment 5, the working fluid in the first liquid cooling channel 51a and the second liquid cooling channel 55a is in direct contact with the circuit board without passing through a heat conducting medium, so that the contact thermal resistance between the working fluid and the circuit assembly 50 is reduced, greatly reducing The total thermal resistance of the circuit board assembly 50 is reduced, so that more heat of the circuit board assembly 50 can be absorbed by the working fluid, thereby greatly improving the heat dissipation performance of the circuit board assembly 50.

It is easy to understand that both the first circuit board 51 and the second circuit board 55 in the circuit board assembly 50 are provided with built-in liquid cooling pipes, which is just an example. In fact, only one of the first circuit board 51 and the second circuit board 55 is provided with a built-in liquid cooling pipe. In addition, the design of the built-in liquid cooling channel in the fifth embodiment can also be applied to a single-layer circuit board.

Embodiment six

FIG. 26 is a schematic diagram of a cross-sectional structure of the system-in-package module 60 in the mobile terminal device of Embodiment 6. For clarity, the cross-section of the device is not indicated by hatching.

As shown in FIG. 26 , the system-in-package module 60 may include a first packaging substrate 61 , a second packaging substrate 70 and a sealing frame 66 between the first packaging substrate 61 and the second packaging substrate 70 . The first packaging substrate 61 and the second packaging substrate 70 are laminated and spaced apart, the sealing frame 66 connects the first packaging substrate 61 and the second packaging substrate 70, and the first packaging substrate 61, the sealing frame 66 and the second packaging substrate 70 can form a Closed space 60a. A heat generating device 63 , a heat generating device 64 and a heat generating device 65 may be arranged on the first packaging substrate 61 . The second packaging substrate 70 may arrange the heat generating device 67 , the heat generating device 68 and the heat generating device 69 . The heat generating device 62, the heat generating device 63, the heat generating device 65, the heat generating device 67 and the heat generating device 69 may be located in the enclosed space 60a.

In the sixth embodiment, the closed space 60a of the system-in-package module 60 can also be used as a liquid cooling pipeline, and the liquid cooling pipeline is a built-in liquid cooling pipeline (the liquid cooling pipeline is represented by a shaded area in FIG. 26 ).

In Embodiment 6, other areas in the mobile terminal device also have liquid cooling pipes (hereinafter referred to as other liquid cooling pipes), and the other liquid cooling pipes may include external liquid cooling pipes (the external liquid cooling pipes are not limited to series, parallel or mixed), and/or built-in liquid-cooled pipelines (such as the built-in liquid-cooled pipelines in Embodiment 5, or the built-in liquid-cooled pipelines in Embodiment 6). The closed space 60a of the system-in-package module 60 is in communication with the other liquid-cooling pipes.

Thus, the working medium can enter the closed space 60a through other liquid cooling pipes, and contact the

heating devices

63, 65, 67 and 69 in the closed space 60a, that is, these heating devices can be immersed in the working medium . Therefore, the working fluid can dissipate heat from these heat generating devices. It can be understood that the heat of the heating devices (such as heating device 64 and heating device 68 ) located outside the closed space 60a can also be absorbed by the working fluid in the closed space 60a, so these heating devices can also dissipate heat through the working fluid.

In Embodiment 6, since the closed space 60a of the system-in-package module 60 is used as a liquid-cooled pipeline, the working fluid is in direct contact with the heat-generating device without passing through a heat-conducting medium, so that the contact thermal resistance between the working fluid and the system-in-package module 60 is greatly increased. The total thermal resistance of the system-in-package module 60 is greatly reduced, so that more heat of the system-in-package module 60 can be absorbed by the working fluid, thereby greatly improving the heat dissipation performance of the system-in-package module 60 .

It can be understood that Embodiment 6 describes the built-in liquid cooling pipe with the system-in-package module 60 as an object, which is only an example. In fact, the built-in liquid cooling pipeline can be applied to any heating device with an inner cavity.

The structure and layout of the liquid cooling pipelines in the above embodiments are applicable to the embodiments described below. For the sake of brevity, the structure and layout of the liquid-cooled pipeline will not be clearly described below.

Embodiment seven

In the seventh embodiment, different from the foregoing embodiments, the driving pump in the mobile terminal device may be a capillary pump, and the mobile terminal device may further include a cold plate. In the following, the designs of the capillary pump and the cold plate are firstly described, and then the heat dissipation design of the mobile terminal equipment including the capillary pump and the cold plate is explained.

Figure 27 illustrates the schematic structure of a capillary pump. As shown in Figure 27, the capillary pump 78 may include an inlet pipe 781, a main body 782 and an outlet pipe 785, and the inlet pipe 781 and the outlet pipe 785 are respectively connected to different positions of the main body 782. It should be understood that the inlet pipe 781 and the outlet pipe 785 shown in the figure are respectively connected to opposite sides of the main body 782, which is only a schematic illustration and not a limitation to this embodiment.

As shown in FIG. 27 , the body 782 may have a cavity 783 communicating with the inlet tube 781 . A capillary structure 784 is provided in the cavity 783 , and the capillary structure 784 only occupies part of the space of the cavity 783 . There are a large number of microchannels in the capillary structure 784. The microchannels have capillary action and can absorb liquid working fluids, but have no adsorption effect on gaseous working fluids. The capillary structure 784 can be made of, for example, sintered powder, porous felt, porous cotton, foam metal, fiber bundle or other materials with capillary action. Capillary structure 784 may be adjacent to cavity 783 .

In Embodiment 7, the working medium circulating in the liquid cooling pipeline can undergo a phase change between gaseous and liquid states, and the liquid working medium absorbs heat when flowing through the heating device and becomes a gaseous working medium; When heated, it becomes a liquid working substance. Since the power consumption load of the heating device varies, and sometimes does not reach a higher power consumption level, the heat generation of the heating device is not significant. This causes insufficient phase transition between the liquid working medium and the gaseous working medium, that is, a part of the liquid working medium is transformed into a gaseous working medium, and the other part of the liquid working medium does not undergo a phase transition. The gaseous working fluid may not be sufficiently cooled to release heat, causing a part of the gaseous working medium to liquefy into a liquid working medium, while the other part of the gaseous working medium does not undergo a phase change. Therefore, the working fluid in the liquid cooling pipeline may be a gas-liquid mixed working fluid.

The gas-liquid mixed working medium can enter the cavity 783 of the capillary pump 78 from the inlet pipe 781 in the capillary pump 78 . At this time, the liquid working medium in the gas-liquid mixed working medium is adsorbed by the capillary structure 784, and the gaseous working medium remains in the cavity 783, thereby separating the gas-liquid mixed working medium. The liquid working medium adsorbed by the capillary structure 784 can absorb the heat of the heating device and be vaporized into a gaseous working medium. The gaseous working medium vaporized from the liquid working medium can break away from the capillary structure 784 under the action of capillary force and enter the outlet pipe 785 . A part of the gaseous working medium can be liquefied in the outlet pipe 785 and become a liquid working medium; another part of the gaseous working medium can remain in a gaseous state. Therefore, what flows out of the capillary pump 78 through the outlet pipe 785 may be a gas-liquid mixed working medium.

In Embodiment 7, both the inlet pipe 781 and the outlet pipe 785 of the capillary pump 78 are in communication with the liquid cooling pipeline, so that the capillary pump 78 can drive the gas-liquid mixture to circulate in the liquid cooling pipeline.

The capillary pump body in the seventh embodiment is extremely small, so that the volume of the active liquid cooling heat dissipation system can be small, and it can be applied to a mobile terminal with a small size.

In the seventh embodiment, the cold plate is connected with the liquid cooling pipeline. The cold plate has a cold plate cavity, which communicates with the liquid cooling pipeline, and the working medium in the liquid cooling pipeline can enter and exit the cold plate cavity. The cold plate is connected to the heating device, and the connection may be that the cold plate directly contacts the heating device, or the cold plate is connected to the heating device through a thermal interface material. The cold plate can absorb the heat of the heating device, and perform heat equalization and heat dissipation on the heating device. The cold plate can have other accessories, such as shielding, snap-fit, heat dissipation accessories, etc. Due to the large area of the cold plate, the requirements for its strength and flatness are relatively high.

As shown in Fig. 28 to Fig. 30, the cold plate 71 of the seventh embodiment may include a first cover plate 711 and a second cover plate 712, the first cover plate 711 and the second cover plate 712 are stacked and can be surrounded by a cold plate Cavity 71b. The first cover plate 711 and the second cover plate 712 are fixedly connected, for example, can be welded together. The wall thickness of the first cover plate 711 and the second cover plate 712 is relatively small, for example, only 0.15mm, so that the cold plate 71 is suitable for a mobile terminal with a small size.

As shown in FIG. 29 , the surface of the second cover plate 712 facing the first cover plate 711 may include an edge area 713 and a support area 714, the edge area 713 serves as the edge of the surface, and the edge area 713 surrounds and connects to the support area 714's perimeter. The support area 714 can be protruded to form a plurality of support portions 715 , and each support portion 715 can be spaced apart from each other. The supporting portion 715 is integrated with the supporting area 714 . The structure of the support part 715 can be designed as required, for example, it can be approximately a circular frustum structure, or a wall-shaped structure. The support portion 715 can be made by stamping or etching the second cover plate 712 . The support portion 715 can be used to support the first cover plate 711 .

In particular, the gas in the cold plate cavity 71b needs to be collected at a designed position (eg, a higher position), and the gas is not allowed to flow backward. The support part 715 having a special wall-shaped structure can also play a role in preventing gas backflow.

In other embodiments, the supporting portion 715 may also be protrudingly disposed on the surface of the first cover plate 711 facing the second cover plate 712 , and the second cover plate 712 is not provided with the supporting portion 715 . Alternatively, both surfaces of the first cover plate 711 and the second cover plate 712 facing each other can have support portions 715 protruding, and the support portions 715 on the two surfaces are staggered from each other so as not to interfere with each other.

In the seventh embodiment, at least one cover plate of the cold plate 71 is made of composite material, and the composite material is composed of at least two layers of different materials, and the materials of different layers can be laminated together. The composite includes at least weldable material and reinforcing material. The manufacturing process of the composite material includes but not limited to pressing, diffusion welding, electroplating, chemical deposition and the like. The first easy-weldable material and the second easy-weldable material appearing below are only names for distinguishing the position of the material layer, and actually both belong to the easy-weldable material. Moreover, the first easy-weld material and the second easy-weld material can be the same or different.

The designs of several cold plates of the seventh embodiment will be described below.

As shown in Figure 30, in the first implementation of the seventh embodiment, the second cover plate 712 is made of composite material, and the composite material includes two layers of different materials: the inner layer of easy-weld material 712a (which can be referred to as the first easy-weld material 712a The welding material 712a) and the reinforcement material 712b of the outer layer, the easy-weld material 712a and the reinforcement material 712b are laminated together. Wherein, if the support portion 715 is formed by stamping, the material of the support portion 715 is also the composite material; if the support portion 715 is formed by etching, the material of the support portion 715 is the easy-weld material 712a.

Among them, the easily weldable material 712a is a material with better welding performance, its melting point is ≤950°C, for example, 750°C, its welding temperature is relatively low, and its welding quality is high. The solderable material 712a includes, but is not limited to, copper or copper alloys, nickel or nickel alloys, phosphorus, and the like.

The overall dimension of the cold plate 71 is much larger than its own wall thickness. The wall thickness refers to the wall thickness of the first cover plate 711 or the second cover plate 712. The wall thickness may be 0.15 mm, for example. For example, the overall dimension of the cold plate 71 is at least 10 times the wall thickness of the first cover plate 711 or the wall thickness of the second cover plate 722 .

Wherein, as shown in FIG. 30 , the overall external dimension refers to the distance occupied by the cold plate 71 in the X direction, Y direction or Z direction in the XYZ coordinate system. For example, the length of the cold plate 71 can be defined as the distance occupied by the cold plate 71 in the Y direction. The width of the cold plate 71 can be defined as the distance occupied by the cold plate 71 in the X direction. The thickness of the cold plate 71 can be defined as the distance occupied by the cold plate 71 in the Z direction. The thickness of the cold plate 71 may be less than or equal to 1.5 mm.

The overall dimension of the cold plate 71 is much larger than its own wall thickness, and there is a risk of insufficient strength and rigidity.

In order to avoid irreversible plastic deformation of the cold plate 71 and affect the performance of the cold plate 71 , the cover plate of the cold plate 71 can use a reinforcing material 712 b. The reinforcing material 712b has high strength and hardness, and has good deformation resistance. For example, the yield strength of the reinforcing material 712b may be greater than or equal to 150Mpa, the surface hardness may be greater than or equal to HV100, and the modulus of elasticity may be greater than or equal to 120Mpa. In this embodiment, the values of the yield strength, surface hardness and elastic modulus of the reinforcing material 712b may be independent of each other, as long as at least one of the three parameters satisfies the above numerical range. The reinforcing material 712b includes but not limited to stainless steel or stainless steel alloy, titanium or titanium alloy, tungsten or tungsten alloy, aluminum or aluminum alloy, chromium or chromium alloy, aluminum or aluminum alloy, and the like.

The following table lists the material parameters of several common easy-weld materials 712a and reinforcement materials 712b. It can be understood that the practical application of this embodiment is not limited thereto.

Table 1. Physical parameters of metal materials (normal temperature)

Table 2. Comparison table of performance parameters of cold plates made of stainless steel or copper alloy materials

As shown in FIG. 30 , the weldable material 712 a of the second cover 712 faces the first cover 711 , and the reinforcing material 712 b faces away from the first cover 711 . The easily weldable material 712a is welded to the second cover plate 712 . Specifically, the easily weldable material 712a on the support portion 715 of the second cover plate 712 is welded to the corresponding area of the first cover plate 711, and the easily weldable material 712a on the edge area 713 of the second cover plate 712 is welded to the corresponding area of the first cover plate 711. The corresponding area is welded. Soldering may be, for example, soldering using solder paste (black hatching in FIG. 30 indicates solder paste 71a and solder paste 71c).

In the welding process of the cold plate, graphite fixtures are required. The cover plate of the conventional cold plate is made of stainless steel, and its welding temperature is relatively high. At such a high welding temperature, the metal components in the stainless steel material are easily precipitated and bonded to the graphite fixture, resulting in wear and tear of the graphite fixture. This not only affects the welding quality (such as empty welding, weld seam fluctuations and other abnormalities, wherein empty welding will lead to poor sealing of the cold plate 71), but also increases the cost. Moreover, the welding of stainless steel materials needs to be carried out in an environment-friendly environment. For example, ammonia needs to be decomposed into hydrogen and nitrogen first, and then the hydrogen is fed into the welding tunnel furnace to provide a weldable atmosphere. Since hydrogen is flammable and explosive, it needs to be operated in a safe and environmentally friendly environment. In addition, for titanium and titanium alloy materials, because the surface protective layer is destroyed at high temperature, titanium and titanium alloys are very active and easy to oxidize and nitride, so they need to be welded in a special protective environment of inert gas, and ultra-low Vacuum environment. Therefore, products need to be sent out to supply chain manufacturers with environmental protection qualifications for processing, but this will lead to a too long process chain, increase the difficulty of process control, and prolong the delivery cycle.

In view of this, the second cover plate 712 in Embodiment 1 uses a composite material, and the welding temperature of the easy-to-weld material 712a is relatively low, and there will be no defects that cause the wear and tear of the graphite fixture due to the precipitation of metal components, so the welding quality Higher, the cost can be reduced. Moreover, the welding of the easily weldable material 712a does not require hydrogen, inert gas or ultra-low vacuum environment, and there is no need to send the product to a supply chain manufacturer with environmental protection qualifications for processing, so the process chain can be shortened and the difficulty of process control can be reduced. In addition, suitable easy-welding material 712a can be selected to ensure that the easy-welding material 712a and the liquid working medium in the cold plate cavity 71b will not produce a galvanic microreaction, thereby ensuring the reliability of the cold plate 71 .

On the other hand, the second cover plate 712 in Embodiment 1 uses a composite material, and the reinforcing material therein can make the second cover plate 712 have greater strength and is not easily deformed, thereby meeting the requirements of high strength and high strength of the cold plate 71. flatness requirements.

As shown in FIG. 31 , in the second embodiment of the seventh embodiment, different from the first embodiment above, both the first cover plate 711 and the second cover plate 712 can be made of composite materials. Wherein, the first cover plate 711 may include an outer layer of reinforcement material 711b and an inner layer of easy-weld material 711a (which may be referred to as a first easy-weld material 711a). The second cover plate 712 may include an outer layer of reinforcing material 712b and an inner layer of easy-welding material 712a. Schematically, the easily weldable material 712a may be discontinuously distributed on the surface of the reinforcing material 712b, and the easily weldable material 712a may be divided into several mutually spaced regions, and the interval between each region exposes the surface of the reinforcing material 712b. Alternatively, the easily weldable material 712a may also be continuously distributed on the surface of the reinforcing material 712b to completely cover the surface of the reinforcing material 712b.

Reinforcement material 711b and reinforcement material 712b may be the same or different, and both may be selected from the reinforcement materials listed above. The solderable material 711a and the solderable material 712a may be the same or different, and both may be selected from the solderable materials listed above.

The easily weldable material 711 a of the first cover plate 711 is welded to the easily weldable material 712 a of the second cover plate 712 . Specifically, the easily weldable material 712a on the support portion 715 of the second cover plate 712 is welded to the corresponding area of the easily weldable material 711a on the first cover plate 711, and the easily weldable material 712a on the edge of the second cover plate 712 is welded to the first The easily weldable material 711a on the edge of the cover plate 711 is welded. Soldering may be, for example, soldering using solder paste (black hatching in FIG. 31 indicates solder paste 71a and solder paste 71c). The cold plate 71 shown in Figure 31, because the first cover plate 711 and the second cover plate 712 are all made of composite materials, can make the cold plate 71 have very high strength and flatness, and can also effectively reduce the welding process difficulty, improve The welding yield ensures the sealing performance of the cold plate 71, reduces the cost, and further improves the reliability of the cold plate 71.

As shown in Figure 32, in the third embodiment of the seventh embodiment, different from the second embodiment above, the first cover plate 711 may include the surface functional material 711c of the outer layer, the reinforcement material 711b in the middle, and the easy Solder material 711a. The second cover plate 712 may include an outer surface functional material 712c, a middle reinforcement material 712b, and an inner layer of an easy-to-weld material 712a. Hereinafter, the surface functional material 711c and the surface functional material 712c are collectively referred to as the surface functional material, and the reinforcing material 711b and the reinforcing material 712b are collectively referred to as the reinforcing material.

Wherein, the surface functional material can be used for surface treatment of the reinforcing material, so that the first cover plate 711 or the second cover plate 712 has corresponding properties. For example, the surface functional material can be nickel, and an anti-corrosion layer can be formed by nickel plating on the reinforcing material; or, the surface functional material can be copper, and the first cover plate 711 or the second cover plate 712 can be lifted by copper plating on the reinforcing material. Alternatively, the surface functional material can be gold, and the conductive performance of the first cover plate 711 or the second cover plate 712 can be improved by partially gold-plated on the reinforcing material (the cold plate 71 can be used as the common ground of the antenna and the camera module. , which requires the cold plate 71 to have better electrical conductivity); or, the reinforcing material can be galvanized to improve the anti-corrosion performance of the first cover plate 711 or the second cover plate 712; or, the reinforcing material can be painted , so as to improve the anti-corrosion performance of the first cover plate 711 or the second cover plate 712 or meet the requirement of appearance color.

The surface functional material 711c may be provided only in a local area of the reinforcement material 711b, or may be provided in all areas of the reinforcement material 711b. The distribution of surface functional material 712c can also be designed in this way.

In this embodiment, the surface functional material 712c in the second cover 712 may be the same as or different from the surface functional material 711c in the first cover 711 . In other embodiments, it is sufficient that one of the first cover plate 711 and the second cover plate 712 has a surface functional material, and it is not necessary for both of them to have a surface functional material.

As shown in FIG. 32 , the first cover plate 711 and the second cover plate 712 can be welded. Specifically, the easily weldable material 712a on the support portion 715 of the second cover plate 712 is welded to the corresponding area of the easily weldable material 711a of the first cover plate 711, and the easily weldable material 712a on the edge of the second cover plate 712 is welded to the first The easily weldable material 711a of the edge of the cover plate 711 is welded. Soldering can be performed, for example, with solder paste (black shading in Figure 32 indicates solder paste). After the first cover plate 711 and the second cover plate 712 are welded, the surface functional material 711c of the first cover plate 711 and the surface functional material 712c of the second cover plate 712 are all located on the outside of the cold plate 71, and the first cover plate 711 is easily Both the welding material 711 a and the easily weldable material 712 a of the second cover plate 712 are located inside the cold plate 71 .

In the solution of the third embodiment, the composite material containing the surface functional material is used to manufacture the cover plate, which can further enhance the processability or serviceability of the cold plate 71 .

As shown in FIG. 33 , in the fourth embodiment of the seventh embodiment, the difference from the above third embodiment is that the easily weldable material 712a on the edge of the second cover plate 712 and the easily weldable material 711a on the edge of the first cover plate 711 , can be welded by a paste-free welding process, such as laser welding, diffusion welding (such as pressure diffusion welding), etc. In Fig. 33, the welding position between the edge of the second cover plate 712 and the edge of the first cover plate 711 is represented by a dotted line.

During the welding process of the cold plate 71, a graphite fixture is required. The edge of the conventional cold plate is welded with solder paste, and the solder paste is easy to overflow and contaminate the graphite fixture, resulting in shortened life of the graphite fixture and a sharp increase in cost.

On the contrary, in the fourth embodiment, the edge of the second cover plate 712 and the edge of the first cover plate 711 are soldered without solder paste, which can effectively avoid problems caused by overflow of solder paste, thereby reducing costs.

In addition, in Embodiment 4, solder paste can be used to solder the corresponding regions of the easily solderable material 712a on the support portion 715 of the second cover plate 712 and the easily solderable material 711a of the first cover plate 711. This is due to the efficiency of solder paste soldering. Higher, and the quality is easy to guarantee. And even if the solder paste overflows, there is no problem of contaminating the graphite fixture.

In this embodiment, solder paste-free soldering is not used for all the welding areas of the first cover 711 and the second cover 712 because of the large number of supporting parts 715 on the second cover 712 and the first cover 711. If the soldering process is performed without solder paste, the efficiency will be low, and the soldering quality is not easy to guarantee (especially if laser soldering is used). In other embodiments, according to actual needs, all welding areas of the first cover plate 711 and the second cover plate 712 may be soldered without solder paste.

The above implementations of Embodiment 7 describe the composite material design of the cover plate of the cold plate 71 and the welding process design of the cover plate. The designs on these two levels can be independent of each other and can be combined according to needs, and are not limited to those shown in Fig. 30-shown in Figure 33. For example, the welding design in the first to third embodiments above can be modified to: the edges of the first cover plate 711 and the second cover plate 712 are welded without solder paste.

FIG. 34 is a structural block diagram of the mobile terminal device 72 in the fifth embodiment of the seventh embodiment. The mobile terminal device 72 can be, for example, a smart watch, and the mobile terminal device 72 can use the above-mentioned capillary pump 78 and cold plate 71 (for ease of distinction, hereinafter referred to as the first cold plate 71 ).

As shown in FIG. 34 , the mobile terminal device 72 may include a main body 722 and two straps 721 . The main body 722 serves as the functional main body 722 of the mobile terminal device 72 , which may include, for example, a housing 723 and a heating element installed in the housing 723 , a capillary pump 78 , a liquid cooling control device 15 , and a first cold plate 71 and other components. The heat generating device may be, for example, the chip-level system 14 and the sensor 13 . The system-on-chip 14 and the sensor 13 can be in contact with the first cold plate 71 . "Contact" can refer to direct contact (rigid contact) or indirect contact through a thermal interface material (elastic contact).

As shown in FIG. 34 , the mobile terminal device 72 may further include a second cold plate 73 and a liquid-cooled control device 15 arranged in a watch strap 721 . For example, there may be two second cold plates 73 , and the two second cold plates 73 are both connected to the liquid cooling control device 15 . The second cold plate 73 can be made of a flexible and easily bendable composite material, and the second cold plate 73 can be bent or rolled along with the strap 721 . The second cold plate 73 can be of composite material design as described above, or can be fabricated from conventional materials.

As shown in FIG. 34 , a liquid cooling pipeline 79 may be arranged in the housing 723 , and the liquid cooling pipeline 79 connects the capillary pump 78 , the first cold plate 71 and the liquid cooling control device. The liquid cooling pipe 79 can extend from the housing 723 to the strap 721 . The part of the liquid-cooling pipe 79 located in the wristband 721 can be sequentially connected to a second cold plate 73 , the liquid-cooling control device 15 and another second cold plate 73 . Finally, the liquid cooling pipeline 79 connects the capillary pump 78 in the housing 723 , the liquid cooling control device 15 , the first cold plate 71 , and the second cold plate 73 in the strap 721 and the liquid cooling control device 15 . It can be understood that the positions of the capillary pump 78 , the liquid cooling control device 15 , the first cold plate 71 , the second cold plate 73 , and the liquid cooling control device 15 on the liquid cooling pipeline 79 and the relative positions of the housing 723 and the strap 721 The location can be flexibly designed according to needs, and is not limited to what is shown in the figure.

Referring to FIG. 34 , the capillary pump 78 can drive the cooling liquid to circulate in the liquid cooling control device 15 , the first cold plate 71 , the second cold plate 73 and the liquid cooling pipeline 79 . The first cold plate 71 can absorb the heat of the chip-level system 14 and the sensor 13 to dissipate heat from the chip-level system 14 and the sensor 13 . Through the circulating coolant, the first cold plate 71 can exchange heat with the second cold plate 73, so that the heat can be exchanged between the main body 722 and the strap 721, so that the temperature balance between the main body 722 and the strap 721 can be realized, and The heat can be dissipated to the outside through the strap 721 having a larger area. Therefore, the solution of the fifth embodiment can realize the uniformity of the mobile terminal device 72 and the heat dissipation of the heat-generating device.

In other implementation manners, the second cold plate 73 in the mobile terminal device 72 may not be designed with composite materials, but made of conventional materials.

Fig. 35 is a structural block diagram of the mobile terminal device 72' in the sixth embodiment of the seventh embodiment. The main difference from the fifth embodiment above is that the second cold plate 73 can be arranged inside the two straps 721 of the mobile terminal device 72'. Wherein, a second cold plate 73 may be arranged in a watch strap 721 (such as the watch strap 721 on the left in the figure). Two second cold plates 73 may be arranged in another watch strap 721 (for example, the right watch strap 721 in FIG. 35 ).

As shown in FIG. 35 , the sixth embodiment is different from the fifth embodiment above in that the capillary pump 78 and the first cold plate 71 may not be included in the casing of the mobile terminal device. Two capillary pumps 78 can be arranged in the strap 721 on the right side in Fig. 35, and the two capillary pumps 78 can be connected in series, which can reduce the system fluid impedance of the mobile terminal device 72'. It can be understood that the two capillary pumps 78 can also be connected in parallel, which can increase the working fluid flow rate of the system. There may be no liquid cooling control device 15 in the strap 721 on the right side. This design takes into account that the internal space of the housing 723 is relatively limited, and the internal space of the strap 721 can be used to arrange the capillary pump 78 .

As shown in FIG. 35 , the liquid cooling pipeline 79 connects the liquid cooling control device 15 , the chip-level system 14 , the sensor 13 in the casing 723 , and the second cold plate 73 and the capillary pump 78 in the watch band 721 . It can be understood that the positions of the capillary pump 78, the liquid cooling control device 15, and the second cold plate 73 on the liquid cooling pipe 79 and the positions relative to the housing 723 and the strap 721 can be flexibly designed according to needs, and are not limited to Figure 35 shows.

In the solution of the sixth embodiment, since the second cold plate 73 is provided in the two watch straps 721, the heat exchange and heat dissipation area can be increased, and thus the uniform temperature and heat dissipation performance can be further improved.

Embodiment 5 and Embodiment 6 of Embodiment 7 describe the application of the capillary pump 78 and the cold plate in the smart watch, which is just an example. In fact, the capillary pump 78 and the cold plate can also be applied to other types of mobile terminal devices, such as mobile phones and tablet computers. In addition, the capillary pump 78 and the cold plate can be arranged independently of each other, and do not have to be used in the same mobile terminal device at the same time. That is, for any type of mobile terminal equipment, at least one of the capillary pump 78 and the cold plate can be used as required.

In other embodiments of the seventh embodiment, the second cold plate 73 in the strap can also be replaced by a flexible liquid-cooled pipeline (such as the liquid-cooled pipeline 492 described above), and the flexible liquid-cooled pipeline can have a certain cooling capacity.

FIG. 36 is a schematic structural diagram of the mobile terminal device 74 in the seventh implementation manner of the seventh embodiment. The mobile terminal device 74 can be, for example, a notebook computer, which can include a screen part 741 , a hinge 743 and a keyboard part 747 . The screen part 741 may include a screen, an upper case on which the screen is installed, a camera module installed on the upper case and other components, and the keyboard part 747 may include a keyboard, a lower case on which the keyboard is installed, a main board installed in the lower case, etc. . The screen part 741 is rotatably connected to the keyboard part 747 through a hinge 743 . There is a channel inside the hinge 743 , and the channel of the hinge 743 also serves as a part of the liquid cooling pipeline of the mobile terminal device 74 .

As shown in FIG. 36 , the mobile terminal device 74 may further include a water nozzle 746 , a third cold plate 742 , a fourth cold plate 745 and a driving pump 744 . In the embodiment of the present application, the nozzle is a communication component, which is used to communicate the cold plate with other components with internal passages (such as the hinge 743 ). The structure of the faucet can be designed as required. It can be understood that the name "faucet" does not limit the structure of the communicating component.

As shown in FIG. 36 , both the water nozzle 746 and the third cold plate 742 can be located inside the screen portion 741 . The water nozzle 746 can be welded to the third cold plate 742 and is rotatably connected with the hinge 743 . There is a channel inside the water nozzle 746 , and the channel communicates with the cold plate cavity of the third cold plate 742 . A fourth cold plate 745 may be installed inside the keyboard portion 747 . The fourth cold plate 745 can also be connected with a faucet.

In this embodiment, the third cold plate 742 and the fourth cold plate 745 are laid in a large area in the mobile terminal device 74 to fully dissipate heat from the heat generating device. The area of the third cold plate 742 and the area of the fourth cold plate 745 are all much larger than the area of the faucet 746. For example, the area of the third cold plate 742 and the area of the fourth cold plate 745 can be at least the area of the faucet 746. 10 times. Wherein, the area of the cold plate is the projected area of the cold plate in its own thickness direction, and the area of the water nozzle 746 is the projected area of the water nozzle 746 in the thickness direction of the cold plate.

In this embodiment, in order to ensure that the overall thickness of the mobile terminal device 74 is small, the third cold plate 742 and the fourth cold plate 745 are very thin, for example, the thickness of both is ≤1.5 mm. The water nozzle 746 is disposed at a non-thickness bottleneck position in the mobile terminal device 74 , but the thickness of the water nozzle 746 is much larger than that of the third cold plate 742 and the fourth cold plate 745 . The third cold plate 742 needs to be connected with the water nozzle 746 so as to be connected to the liquid cooling pipe with a larger diameter, so as to realize the thinnest thickness of the whole machine.

Drive pump 744 may be located inside keyboard portion 747 . The driving pump 744 can communicate with the cold plate cavity of the fourth cold plate 745 and the channel of the hinge 743 . Thus, the pump 744 is driven to connect the third cold plate 742 with the fourth cold plate 745 , so that the working fluid can circulate between the third cold plate 742 and the fourth cold plate 745 . The drive pump 744 includes, but is not limited to, a micromechanical drive pump, a piezoelectric pump, or a capillary pump.

Figure 37, Figure 38 and Figure 39 can show the assembly structure of the third cold plate 742 and the faucet 746, wherein Figure 38 is a schematic diagram of the exploded structure of the structure shown in Figure 37, and Figure 39 is a schematic partial cross-sectional view of B-B in Figure 37. The third cold plate 742 and the nozzle 746 can constitute a cold plate assembly 748 .

As shown in FIG. 38 and FIG. 39 , an opening 742a and an opening 742c may be designed on the edge of the first cover plate 7421 of the third cold plate 742 . The opening 742 a communicates with the cold plate cavity 742 b of the third cold plate 742 . In other implementation manners, the opening 742a and the opening 742c may also be provided at other positions of the first cover plate 7421, not limited to the edge. The nozzle 746 can be welded to the first cover plate 7421 to close the opening 742a and the opening 742c. The channel 746a of the water nozzle 746 communicates with the opening 742a and the opening 742c, so that the channel 746a of the water nozzle 746 communicates with the cold plate cavity 742b through the opening 742a.

As shown in FIG. 39 , the first cover plate 7421 of the third cold plate 742 can be made of composite material. The first cover plate 7421 may include a second easy-weld material 7421a on the outer layer, a reinforcement material 7421b in the middle, and a first easy-weld material 7421c on the inner layer. The second easy-weld material 7421a faces away from the cold plate cavity 742b. A solderable material 7421c faces the cold plate cavity 742b. The second easy-to-solder material 7421a and the nozzle 746 can be welded by a solder paste-free process, which can avoid the problem of solder paste overflowing and contaminating the graphite fixture, and can reduce costs. In other implementation manners, according to actual needs, the second easy-to-weld material 7421a and the water nozzle 746 may also be welded with solder paste.

In Embodiment 7, the faucet 746 is a rotating part. Considering the wear resistance and strength requirements, the faucet 746 can be made of high-strength materials such as stainless steel through 3D printing or metal powder metallurgy. In order to further enhance the welding quality of the water nozzle 746 and the first cover plate 7421, an easy-to-weld material 7461 can be set on the outer surface of the water nozzle 746 (as shown in Figure 39 ) or in the welding area in the outer surface, and the easy-to-weld material 7461 is for example Can be formed by nickel plating or copper plating. The easily weldable material 7461 is welded to the second easily weldable material 7421a of the first cover plate 7421 . Alternatively, the faucet 746 can be fabricated directly using easily weldable materials.

As shown in FIG. 39 , the composite material of the second cover plate 7422 of the third cold plate 742 may include an inner layer of easily weldable material 7422a (which may be referred to as a first easily weldable material 7422a ) and an outer layer of reinforcing material 7422b. The easily weldable material 7422a of the second cover plate 7422 is welded to the first easily weldable material 7421c of the first cover plate 7421, for example, welding without solder paste, such as laser welding or diffusion welding without solder paste. In other embodiments, the easily-weldable material 7422a and the first easy-weld material 7421c may also be welded by solder paste, such as brazing with solder paste.

In Embodiment 7, it can be understood that the support portion in the third cold plate 742 and the cover plate supported by the support portion can be welded together, for example, by laser welding or diffusion welding without solder paste.

The overall dimension of the third cold plate 742 is much larger than its own wall thickness. For example, the overall dimension of the third cold plate 742 is at least 10 times the wall thickness of the first cover plate 7421 or the wall thickness of the second cover plate 7422 . Wherein, as shown in FIG. 37 , the overall dimension refers to the distance occupied by the third cold plate 742 in the X direction, Y direction or Z direction in the XYZ coordinate system. For example, the length of the third cold plate 742 can be defined as the distance occupied by the third cold plate 742 in the Y direction, which is approximately equal to the distance in the Y direction from one water nozzle 746 to another water nozzle 746. Similarly, the width of the third cold plate 742 can be defined as the distance occupied by the third cold plate 742 in the X direction, which is approximately the distance from the lowest point of the third cold plate 742 to the highest point of the arch. Similarly, the thickness of the third cold plate 742 can be defined as the distance occupied by the third cold plate 742 in the Z direction. The thickness of the third cold plate 742 may be less than or equal to 1.5 mm. In addition, a span can also be defined for the approximately bridge-shaped third cold plate 742, the span refers to the length of the contour curve of the third cold plate 742, and the length of the contour curve can be the curve length of the outside of the third cold plate 742 in Figure 37 , may also be the curve length of the inner side of the third cold plate 742 . The wall thickness of the third cold plate 742 may be 0.15mm, for example.

The overall dimension of the third cold plate 742 is much larger than its own wall thickness, so there is a risk of insufficient strength and rigidity. However, the reinforcing material in the third cold plate 742 can make the third cold plate 742 have greater strength and is not easily deformed, so that the third cold plate 742 has high strength and high flatness.

The main difference between Embodiment 7 and Embodiment 1 to Embodiment 4 above is that in order to improve the welding quality between the third cold plate 742 and the faucet 746, the outer layer of the first cover plate 7421 of the third cold plate 742 can also use an easy-to-weld Material.

It can be understood that openings can also be provided on the second cover plate 7422 , and the water nozzle 746 can also be welded to the second cover plate 7422 . In addition, the design of the composite material of the third cold plate 742 shown in FIG. 39 is only an illustration. On the premise that the welding side of the cold plate 742 and the faucet 746 is made of an easily weldable material, the third cold plate 742 can also be designed with composite materials in any of the above-mentioned embodiments. In the seventh embodiment of the seventh embodiment, the nozzle 746 is welded to a cover plate of the third cold plate 742 . Different from the seventh embodiment, in the cold plate assembly in the eighth embodiment of the seventh embodiment, the water nozzle can be welded to both cover plates of the third cold plate. It will be described below.

As shown in FIG. 40 , in the eighth embodiment, the part of the edge of the first cover plate 7421 ′ of the third cold plate 742 ′ of the cold plate assembly 748 ′, and the part of the edge of the second cover plate 7422 ′ can be Inserted into the channel 746a' of the water nozzle 746', the cold plate cavity 742b' of the third cold plate 742' communicates with the channel 746a' of the water nozzle 746'.

As shown in FIG. 40, the first cover plate 7421' is a composite material, which includes a second easy-weld material 7421a, a reinforcing material 7421b and a first easy-weld material 7421c. The second cover plate 7422' is a composite material that includes a first weldable material 7422a, a reinforcement material 7422b, and a second weldable material 7422c. Wherein, the second easy-weldable material 7421a and the second easy-weldable material 7422c are arranged opposite to each other, and the first easy-weldable material 7421c is arranged opposite to the first easy-weldable material 7422a, that is, in the perspective of FIG. 40, the second easy-weldable material 7421a The second easy-welding material 7422c is located on the outside, and the first easy-welding material 7421c and the first easy-welding material 7422a are located on the inside.

As shown in Figure 40, the faucet 746' can also be made of composite materials. The composite material of the faucet 746' may include a weldable material 7461' on the inside, and a matrix material 7462' on the outside. The easy-weld material 7461' can be the same as or different from the first easy-weld material 7421a and the first easy-weld material 7422c, but the easy-weld material 7461' can be selected from the above-mentioned easy-weld materials. The matrix material 7462' can have high wear resistance and strength properties, such as stainless steel, titanium alloy, etc., but is not limited to the above-mentioned reinforcement materials.

As shown in Fig. 40, the easily weldable material 7461' of the faucet 746' can be welded with the second easily weldable material 7421a and the second easily weldable material 7422c.

Referring to Figure 40 and Figure 38 (Figure 38 is not a drawing of the eighth embodiment, the reference to Figure 38 here is only to illustrate the position of the third cold plate 742' in the eighth embodiment), the edge of the first cover plate 7421' is located The part outside the water nozzle 746' and the edge of the second cover plate 7422' outside the water nozzle 746' can be welded, for example, by using a solder paste-free process. That is to say, the edge of the first cover plate 7421' is connected to the water nozzle 746' and the edge of the second cover plate 7422' is connected to the water nozzle 746'. Matches the size of the spout 746'. The distance between other parts of the edge of the first cover plate 7421' and other parts of the edge of the second cover plate 7422' can be small, so as to realize the welding of the first cover plate 7421' and the second cover plate 7422'.

In the eighth embodiment, it can be understood that the support part in the third cold plate 742' and the cover plate supported by the support part can be welded together, for example, by laser welding or diffusion welding without solder paste. In other embodiments, the supporting part and the cover plate supported by the supporting part may also be welded by solder paste, such as brazing with solder paste.

It can be understood that, in other embodiments, one of the first cover plate 7421' and the second cover plate 7422' of the third cold plate 742' is made of a composite material. The water nozzle 746' and the third cold plate 742' can also be welded with solder paste.

Embodiment Eight

In the eighth embodiment, different from the above-mentioned embodiments, the driving pump may be a piezoelectric pump 88 . The piezoelectric pump 88 can pump both air and liquid. The description will be expanded below.

FIG. 41 shows a schematic structure of a piezoelectric pump 88 of the eighth embodiment. As shown in FIG. 41 , the piezoelectric pump 88 may include a micropump base 885 , and a first piezoelectric vibrator 886 and a second piezoelectric vibrator 887 respectively located on opposite sides of the micropump base 885 .

As shown in FIG. 41 , one side of the micropump base 885 may have a first inlet channel 88a, a first inlet valve 888, a first outlet valve 889, and a first outlet channel 88c. The first inlet valve 888 may be disposed at one end of the first inlet channel 88a, and the end of the first inlet channel 88a away from the first inlet valve 888 may be the first inlet. The first outlet valve 889 may be disposed at one end of the first outlet channel 88c, and the end of the first outlet channel 88c away from the first outlet valve 889 may be a first outlet. The first outlet valve 889 and the first inlet valve 888 may be located between the first inlet and the first outlet.

As shown in FIG. 41 , the other side of the micropump base 885 may also have a second inlet channel 88f, a second inlet valve 891 , a second outlet valve 890 and a second outlet channel 88d. The second inlet valve 891 may be disposed at one end of the second inlet channel 88f, and the end of the second inlet channel 88f away from the second inlet valve 891 may be a second inlet. The second outlet valve 890 may be disposed at one end of the second outlet channel 88d, and the end of the second outlet channel 88d away from the second outlet valve 890 may be a second outlet. The second outlet valve 890 and the second inlet valve 891 may be located between the second inlet and the second outlet.

In this embodiment, the first inlet valve 888, the first outlet valve 889, the second inlet valve 891 and the second outlet valve 890 can all be one-way valves (or check valves or non-return valves). It can prevent the reverse flow of the fluid in the driving pump and ensure the heat dissipation effect. Other types of valves can also be used as desired.

In this embodiment, the structures of the first piezoelectric vibrator 886 and the second piezoelectric vibrator 887 may be the same. The first piezoelectric vibrator 886 will be described below as an example.

As shown in FIG. 41 , the first piezoelectric vibrator 886 may include a piezoelectric sheet 881 , an adhesive layer 882 , a substrate 883 and a diaphragm 884 , which are stacked in sequence. Wherein, the adhesive layer 882 bonds the piezoelectric sheet 881 and the substrate 883 , and the diaphragm 884 is located on a side of the substrate 883 away from the piezoelectric sheet 881 .

As shown in FIG. 41 , the piezoelectric sheet 881 may be in the shape of a sheet. The piezoelectric sheet 881 can be made of piezoelectric materials, including but not limited to piezoelectric ceramics. The piezoelectric sheet 881 has an inverse piezoelectric effect, and can vibrate and deform under the action of an electric field.

The substrate 883 may be in the form of a sheet or a plate. The substrate 883 can be made of a material with good structural strength and good vibration performance, such as metal. The substrate 883 can increase the structural strength of the piezoelectric vibrator to ensure that the piezoelectric sheet 881 can vibrate stably. The substrate 883 can also amplify the vibration of the piezoelectric sheet 881 in a small range to a vibration in a large range, so as to increase the flow rate of the piezoelectric pump 88 .

The diaphragm 884 has anti-permeation and isolation functions, and is used to isolate the working fluid in the pump chamber (to be described below) from the substrate 883 to prevent the substrate 883 from being corroded by the working fluid. Diaphragm 884 can be manufactured using plastic material, for example.

The above configuration of the first piezoelectric vibrator 886 is merely an illustration. In fact, according to product requirements, the first piezoelectric vibrator 886 may have other structures.

As shown in FIG. 41 , the diaphragm 884 of the first piezoelectric vibrator 886 is connected to one side of the micropump base 885 , for example, the periphery of the diaphragm 884 may be connected to one side of the micropump base 885 . The interior of the diaphragm 884 can be suspended relative to the micropump base 885 and form a first pump chamber 88b with the micropump base 885 . Similarly, the diaphragm 884 of the second piezoelectric vibrator 887 is connected to the other side of the micropump base 885 , for example, the periphery of the diaphragm 884 may be connected to the other side of the micropump base 885 . The inside of the diaphragm 884 can be suspended relative to the micropump base 885, and surrounds the second pump chamber 88e with the micropump base 885. The first pump chamber 88b and the second pump chamber 88e are respectively located on opposite sides of the micropump base 885 , the two are isolated by the micropump base 885 , and the two are not connected.

As shown in FIG. 41 , both the first inlet valve 888 and the first outlet valve 889 can be located in the first pump chamber 88b. Wherein, the first inlet valve 888 can connect the first inlet channel 88a and the first pump chamber 88b. When the first inlet valve 888 is open, the first inlet channel 88a communicates with the first pump chamber 88b; when the first inlet valve 888 is closed, the first inlet channel 88a is isolated from the first pump chamber 88b. The first outlet valve 889 can connect the first outlet channel 88c and the first pump chamber 88b. When the first outlet valve 889 is open, the first outlet channel 88c communicates with the first pump chamber 88b; when the first outlet valve 889 is closed, the first outlet channel 88c is isolated from the first pump chamber 88b.

As shown in FIG. 41 , both the second inlet valve 891 and the second outlet valve 890 can be located in the second pump chamber 88e. Wherein, the second inlet valve 891 can connect the second inlet channel 88f and the second pump chamber 88e. When the second inlet valve 891 is opened, the second inlet channel 88f communicates with the second pump chamber 88e; when the second inlet valve 891 is closed, the second inlet channel 88f is isolated from the second pump chamber 88e. The second outlet valve 890 can connect the second outlet channel 88d and the second pump chamber 88e. When the second outlet valve 890 is open, the second outlet channel 88d communicates with the second pump chamber 88e; when the second outlet valve 890 is closed, the second outlet channel 88d is isolated from the second pump chamber 88e.

In this embodiment, both the first inlet flow channel 88a and the first outlet flow channel 88c can communicate with the liquid cooling pipeline, and the first inlet flow channel 88a, the first pump chamber 88b and the first outlet flow channel 88c can be used to supply cooling liquid flow. The second inlet channel 88f can communicate with the internal space of the mobile terminal device or the external environment, the second outlet channel 88d can communicate with the internal space of the mobile terminal device, the second inlet channel 88f, the second pump chamber 88e and the second Outlet flow channel 88d may be used for air flow. Therefore, it can be considered that the piezoelectric pump 88 includes a liquid pump part and an air pump part, and the liquid pump part and the air pump part are isolated from each other.

For the part of the liquid pump, the flowing cooling liquid has a corrosive effect on the substrate 883, so the diaphragm 884 can be designed to isolate the cooling liquid from the substrate 883. In other embodiments, if non-corrosive cooling liquid is used as the working fluid, the diaphragm 884 can be omitted, and the cooling liquid can directly contact the substrate 883 . For the gas pump part, if corrosive gas is used as the working fluid, a diaphragm 884 can be designed to isolate the gas from the substrate 883 . If a non-corrosive gas is used as the working medium, the diaphragm 884 can be omitted, and the gas can directly contact the substrate 883 .

The piezoelectric pump 88 can work under signal drive.

Driven by the signal, the first piezoelectric vibrator 886 of the liquid pump part will deform (for example, arch upward in the perspective of FIG. 41 ), so as to expand the first pump chamber 88b. At this time, the first inlet valve 888 is opened, the first outlet valve 889 is closed, and the cooling liquid enters the first pump chamber 88b from the first inlet channel 88a to pump the cooling liquid into the liquid pump part. Driven by the signal, the first piezoelectric vibrator 886 of the liquid pump part will produce reverse deformation (for example, arch downward in the perspective of FIG. 41 ), so as to make the first pump cavity 88b shrink. At this time, the first inlet valve 888 is closed, the first outlet valve 889 is opened, and the coolant enters the first outlet channel 88c from the first pump cavity 88b and is pumped out from the liquid pump part. It can be understood that, according to the driving signal, the first piezoelectric vibrator 886 will reciprocate and vibrate at a set frequency to continuously pump in and out the coolant.

The working principle of the air pump part is the same as that of the liquid pump part. Driven by the signal, the second piezoelectric vibrator 887 of the air pump part will be deformed (for example, arched downward in the perspective of FIG. 41 ), so as to expand the second pump chamber 88e. At this time, the second inlet valve 891 is opened, the second outlet valve 890 is closed, and the air enters the second pump chamber 88e from the second inlet channel 88f to pump the air into the air pump part. Driven by the signal, the second piezoelectric vibrator 887 of the air pump part will produce reverse deformation (for example, arch upward in the perspective of FIG. 41 ), so that the second pump cavity 88e shrinks. At this time, the second inlet valve 891 is closed, the second outlet valve 890 is opened, and the air enters the second outlet channel 88d from the second pump chamber 88e and is pumped out from the air pump part. It can be understood that, according to the driving signal, the second piezoelectric vibrator 887 will reciprocate and vibrate at a set frequency to continuously pump in and out air.

In this embodiment, by controlling the driving signal of the piezoelectric pump 88, the vibration directions of the two piezoelectric plates in the air pump part and the liquid pump part are opposite, so that the vibration and noise of the air pump part and the liquid pump part cancel each other ( Partial offset or full offset), to avoid resonance amplification of vibration and noise.

In other embodiments, the piezoelectric pump can also omit the valve in the liquid pump part and/or the valve in the air pump part, and replace the one-way valve by making a special design on the flow channel.

For example, as shown in FIG. 42, the air pump part of the piezoelectric pump 88' may not be provided with a second inlet valve, and the end of the second inlet channel 88f adjacent to the second pump chamber 88e has an expansion opening 88g. In the direction from the second inlet flow passage 88f to the second pump chamber 88e, the caliber of the end of the second inlet flow passage 88f adjacent to the second pump chamber 88e may tend to increase. For example, in the viewing angle of FIG. 42 , the expansion opening 88g may be approximately a trapezoidal structure with a small top and a large bottom. The second outlet valve of the air pump part can be eliminated, and the end of the second outlet channel 88d adjacent to the second pump chamber 88e is designed as a constricted opening 88h. In the direction from the second outlet flow channel 88d to the second pump chamber 88e, the diameter of the end of the second outlet flow channel 88d adjacent to the second pump chamber 88e may show a decreasing trend. For example, in the viewing angle of FIG. 42 , the constricted opening 88h may be approximately a trapezoidal structure with a large top and a small bottom.

The working principle of the air pump part of the piezoelectric pump 88' shown in Figure 42 is as follows:

When the second piezoelectric vibrator 887 is driven to vibrate downward, the second pump chamber 88e expands, and the gas in the second inlet channel 88f and the second outlet channel 88d can enter the second pump chamber 88e. However, due to micro-diffusion, the resistance in the second outlet channel 88d is relatively large, resulting in more gas flowing into the second pump chamber 88e from the second inlet channel 88f, and the overall performance is that the gas enters the second pump chamber 88e from the second inlet channel 88f Pump chamber 88e.

When the second piezoelectric vibrator 887 is driven to vibrate upward, the second pump chamber 88e shrinks, and the gas flows from the second pump chamber 88e into the second inlet channel 88f and the second outlet channel 88d simultaneously. However, due to micro-diffusion, the resistance in the second inlet channel 88f is relatively large, resulting in more gas flowing from the second pump chamber 88e into the second outlet channel 88d, and the overall performance is that the gas enters the second pump chamber 88e from the second pump chamber 88e. Outlet runner 88d.

Therefore, the gas in the air pump part generally flows in one direction along the path of the second inlet channel 88f-the second pump chamber 88e-the second outlet channel 88d.

The piezoelectric pump of the eighth embodiment integrates the air pump part and the liquid pump part, and the volume is reduced. For example, the total thickness of the piezoelectric pump can be as thin as 2mm, and its volume is only 10% of the volume of the mechanical pump. The piezoelectric pump is suitable as a driving component in a liquid-cooled heat dissipation system with low flow rate and high impedance. The active liquid cooling system using piezoelectric pumps is small in size and can be applied to small-sized mobile terminals. In the first embodiment of the eighth embodiment, the piezoelectric pump can be used in the wearable device 80 with blood pressure detection function, wherein the air pump part can be used to inflate and deflate the air bag, and the liquid pump part can be used for active liquid cooling and heat dissipation. The following description will be made by taking the piezoelectric pump 88 in the wearable device 80 as an example. It is understood that a piezoelectric pump 88' can also be used with the wearable device 80.

FIG. 43 is a block diagram showing the structure of the wearable device 80 to which the piezoelectric pump 88 is applied in the first embodiment. The wearable device 80 may be, for example, a smart watch, and its strap 81 may have an airbag 82 built in, and the airbag 82 communicates with the outside world. By controlling the inflation and deflation of the air bag 82, the blood pressure detection of the human body can be realized. Liquid cooling pipes 89 may be distributed within the surface body 84 . The liquid pump part of the piezoelectric pump 88 can communicate with the liquid cooling pipe 89 , and the liquid pump part can drive the cooling liquid to circulate in the liquid cooling pipe 89 to absorb the heat of the chip-level system 14 and dissipate heat on the cold plate 83 . The cold plate 83 can have the above-mentioned composite material design and welding process design, and can also be a conventional cold plate. In other embodiments, the cold plate 83 may not be provided.

As shown in FIG. 43 and FIG. 41 , both the second inlet channel 88f and the second outlet channel 88d of the air pump part of the piezoelectric pump 88 can communicate with the air bag 82 . The air pump part can suck the outside air into the air bag 82 during work, so that the air bag 82 expands and boosts the pressure; The expansion and contraction of the airbag 82 can facilitate the detection of human blood pressure.

As shown in conjunction with FIG. 43 and FIG. 41 , both the first inlet channel 88 a and the second outlet channel 88 c of the liquid pump part of the piezoelectric pump 88 can communicate with the liquid cooling pipeline 89 . As a result, the liquid pump part can drive the cooling liquid to circulate and flow to realize heat dissipation.

This embodiment can realize active liquid cooling and heat dissipation and air bag 82 inflation and deflation through a single piezoelectric pump 88 at the same time, which can save space, is conducive to expanding the function of the active cooling system, and realizes the miniaturization of the active cooling system, so that the active cooling system can be applied For smaller size wearable devices 80 .

Fig. 44 shows a structural block diagram of another wearable device 80' using a piezoelectric pump in Embodiment 1. Different from the wearable device 80 mentioned above, the liquid cooling pipeline 89 is not only distributed in the watch body 84', but also distributed in the watch band 81. This design can also use the strap 81 as a heat dissipation area, which can greatly improve heat dissipation efficiency.

In the second embodiment of the eighth embodiment, both the air pump part and the liquid pump part of the piezoelectric pump 88 are used for heat dissipation. FIG. 45 is a block diagram of the heat dissipation principle of the mobile terminal device 85 using such a piezoelectric pump 88 . As shown in FIG. 45 , the liquid pump part of the piezoelectric pump 88 can drive the cooling liquid to circulate in the liquid cooling pipe 89 to absorb the heat of the chip-level system 14 and release heat on the cold plate 83 . The air pump part of the piezoelectric pump 88 can extract the internal/external air of the mobile terminal device 85 and blow it to the cold plate 83 , thereby improving the cooling efficiency of the cold plate 83 . The cold plate 83 can have the above-mentioned composite material design and welding process design, and can also be a conventional cold plate. In other embodiments, the cold plate 83 may not be provided.

Embodiment 2 can integrate air-cooled and liquid-cooled driving components. Compared with the traditional solution of using fans + liquid pumps, it saves space and is conducive to the miniaturization of the active cooling system. The active cooling system can be applied to Smaller size mobile terminal equipment 85 .

The foregoing content describes a mobile terminal device integrated with an active liquid cooling system, and the mobile terminal device can independently perform heat dissipation and temperature uniformity on itself. An electronic system will be described below. The electronic system includes a mobile terminal device that cannot dissipate heat independently, and peripherals with active liquid cooling and heat dissipation performance. The peripherals can dissipate heat and equalize the temperature of the mobile terminal device. This electronic system can be called an open active liquid cooling system.

Embodiment nine

As shown in FIG. 46 , the first implementation of the ninth embodiment provides an electronic system 100 , which may include a mobile terminal device 110 and an external device 120 , both of which can be detachably connected.

The mobile terminal device 110 includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a wearable device, a car machine, and the like. The same as the mobile terminal device 10 in Embodiment 1, the mobile terminal device 110 may include a casing 11, and heat-generating devices (such as a camera module 12, a sensor 13, a chip-level system 14, a charging module 16) located in the casing 11 and battery 17), liquid cooling control device 15 and liquid cooling pipeline 111.

Wherein, the liquid cooling pipeline 111 can be the same as the liquid cooling pipeline 19 in the first embodiment. The layout of the liquid cooling pipelines 111 may be in series. The liquid cooling pipe 111 may be an external liquid cooling pipe, that is, the liquid cooling pipe 111 may be attached to the surface of the heating device through a thermal interface material, and the liquid cooling pipe 111 is in indirect contact with the heating device.

The liquid cooling pipe 111 is used to connect with the liquid cooling pipe (described below) in the peripheral device 120 . The liquid cooling pipe 111 may have a waterproof and dustproof function, and is in a normally closed state when not connected, so that water vapor or solid foreign matter cannot enter. Working medium leakage can be avoided when not docking, during docking and after docking.

Different from the mobile terminal device 10 in the first embodiment, the mobile terminal device 110 does not contain a drive pump, so the mobile terminal device 110 cannot independently drive the flow of working fluid, and cannot independently perform heat dissipation and temperature uniformity.

As shown in FIG. 46 , the mobile terminal device 110 may further include a first interface 112 that can be detachably connected to the peripheral device 120 to realize the electrical connection between the mobile terminal device 110 and the peripheral device 120 . The specific structure of the first interface 112 can be designed according to needs, for example, it can include mechanisms such as self-locking to prevent abnormal falling off, which is not limited in this embodiment.

Peripherals 120 include but are not limited to chargers, back clips (the back clips are detachably fastened on the back of the mobile terminal device 110, and the structure can be similar to a protective shell. There is a circuit inside the back clip, which can be used to charge the mobile terminal device 110) , handles, or electronic devices with active liquid cooling systems (such as mobile terminal equipment).

As shown in FIG. 46 , the peripheral device 120 may include a second interface 121 , a liquid cooling pipeline 122 , a liquid cooling control device 123 and a driving pump 124 .

The specific structure of the second interface 121 can be designed according to needs, for example, it can include mechanisms such as self-locking to prevent abnormal falling off, which is not limited in this embodiment. The second interface 121 is used for detachably connecting with the first interface 112 of the mobile terminal device 110 to realize the electrical connection between the peripheral device 120 and the mobile terminal device 110 . For example, when the second interface 121 is connected to the first interface 112, the peripheral device 120 can be implemented to charge the mobile terminal device 110 (the peripheral device 120 can be a charger or a back clip, for example), or the mobile terminal device 110 can supply power to the peripheral device 120 ( The peripheral device 120 may be, for example, a mobile terminal device), or realize signal interaction between the mobile terminal device 110 and the peripheral device 120 (the peripheral device 120 may be, for example, a joystick).

The liquid cooling pipeline 122 is connected to the liquid cooling control device 123 and the driving pump 124 .

The liquid-cooling pipeline 122 may be the above-mentioned built-in liquid-cooling pipeline, or may be the above-mentioned external liquid-cooling pipeline. Taking the liquid cooling pipe 122 as an example of an external liquid cooling pipe, the liquid cooling pipe 122 may be rigid and not easy to bend or deform; or it may be flexible and easy to bend and deform. The liquid cooling pipe 122 may specifically be a plastic corrugated pipe, a metal corrugated pipe, a flexible plastic pipe, a flexible metal pipe, and the like. In order to avoid evaporation (evaporative loss) of the working fluid in the liquid cooling pipeline 122 , the surface (which may be the outer surface or the inner surface) of the liquid cooling pipeline 122 may be coated with a lyophobic layer. The layout of the liquid cooling pipelines 122 may be serial, parallel or mixed.

Alternatively, the liquid cooling pipe 122 can be integrated into the cable of the peripheral device 120 . 47 and 48 are schematic cross-sectional views of cables 125 with two different structures.

As shown in FIG. 47 , in one embodiment, the cross section of the cable 125 is schematically circular. According to product requirements, the cross section of the cable 125 may also be rectangular, oval or other shapes.

As shown in FIG. 47 , the cable 125 may include an insulating outer layer 1251 , and a liquid cooling pipe 122 and wires 1252 inside the insulating outer layer 1251 , wherein the liquid cooling pipe 122 and the wires 1252 are arranged side by side. After the liquid cooling pipeline 122 is shown in cross section, the liquid cooling pipeline 122 may include a first part 122a and a second part 122b, the first part 122a and the second part 122b are respectively different circuits of the liquid cooling pipeline 122, the first part 122a and the second The flow direction of the working fluid in section 122b is reversed. Both the first part 122 a and the second part 122 b can be connected to the liquid cooling pipeline 111 of the mobile terminal device 110 . The wire 1252 may include at least one of a power wire, a control wire, a shielding wire/shielding wire, and a ground wire.

As shown in FIG. 48 , in another embodiment, different from the above embodiments, the cable 125 may include an insulating outer layer 1251 , and a liquid cooling pipe 122 and wires 1252 located in the insulating outer layer 1251 . Wherein, the liquid cooling pipe 122 is co-cored (or coaxial) with the wire 1252 . Specifically, the liquid cooling pipe 122 may include a first part 122a and a second part 122b, the first part 122a may surround the outer circumference of the wire 1252, and the wire 1252 may surround the outer circumference of the second part 122b.

Schematically, the liquid cooling control device 123 may be a liquid storage tank, which can store working fluid and also have a gas-liquid separation function. Alternatively, the liquid cooling control device 123 can also be other devices that can adjust the flow mode and flow speed of the working fluid, and prevent impurities from entering the narrow part of the flow pipeline of the driving pump 124 or the working fluid, for example, it can include a flow distributor, At least one of flow control devices such as expansion valves, stop valves, safety valves, gas-liquid separators, dryers, and gas-collecting and dust-removing devices. In other implementation manners, the liquid cooling control device 123 may not be provided.

Schematically, the driving pump 124 may be a piezoelectric pump, such as the piezoelectric pump described above. Alternatively, the drive pump 124 can also be the micromechanical drive pump, capillary pump, electroosmotic pump or MEMS micropump described above.

The number of driving pumps 124 may be one or more, for example, four are shown in FIG. 46 . A plurality of drive pumps 124 can be arranged according to needs, so as to obtain the required head and flow. For example, as shown in FIG. 46 , two drive pumps 124 are connected in series to one circuit, and the other two drive pumps 124 are connected in series to another circuit, and the drive pumps 124 of two circuits are arranged in parallel. Wherein, driving the pumps 124 in series can increase the lift, and connecting them in parallel can increase the flow.

The working voltage of the driving pump 124 is ≈220V, which is consistent with the current AC output specification for civil use in my country. This design makes it possible for the AC signal output by the socket to drive the pump 124 when the peripheral device 120 is connected to the civilian AC socket without boosting the voltage.

The arrows in Figure 46 indicate the flow direction of the working fluid, the same below. As shown in FIG. 46 , the working fluid enters the driving pump 124 after being filtered by the liquid-cooling control device 123 , so that foreign matter in the working fluid will not enter the driving pump 124 .

The working principle of the electronic system 100 in the first embodiment of the ninth embodiment is as follows: when the peripheral device 120 is connected to the mobile terminal device 110, the liquid cooling pipeline 122 of the peripheral device 120 and the liquid cooling pipeline 111 of the mobile terminal device 110 can be connected. , the drive pump 124 can work, and thus the peripheral device 120 and the mobile terminal device 110 can form an active liquid cooling system. The driving pump 124 drives the working fluid to circulate, so as to dissipate heat and uniform temperature of the mobile terminal device 110 .

The scheme of the first embodiment of the ninth embodiment has the following advantages:

1) A channel for connecting the mobile terminal device 110 to an external active liquid cooling device is established. After the working fluid absorbs heat inside the mobile terminal device 110, it can flow into the peripheral device 120 and spread the heat to the outside, so that the mobile terminal device 110 can achieve forced active heat dissipation much higher than the natural heat dissipation, thereby greatly reducing the heat dissipation of the mobile terminal device 110. own temperature.

2) The liquid cooling pipe 111 inside the mobile terminal device 110 can be connected to various peripheral devices, and the heat dissipation capability of the mobile terminal device 110 can be greatly improved with the help of a stronger external liquid cooling driving force. And it can be adapted to different peripherals, so that the mobile terminal device 110 has sufficient heat dissipation capability in various and complex usage scenarios.

3) The drive pump 124 is arranged outside the mobile terminal device 110, which will not take up the limited structural space of the mobile terminal device 110, and can also avoid the impact of high-frequency noise on the drive due to electromagnetic compatibility (Electromagnetic Compatibility, EMC) in the mobile terminal device 110. The effect of the drive circuit of the pump 124 (eg, piezoelectric pump).

4) If the driving pump 124 is a piezoelectric pump (the piezoelectric pump is provided with a boost circuit, and the volume of the high-voltage-resistant capacitor required by the boost circuit is relatively large), and the peripheral device 120 is a charger, since the voltage in the charger is relatively high, The piezoelectric pump in the charger can reduce the volume requirement for the high-voltage-resistant capacitor, thereby helping to reduce the volume of the boost circuit. Moreover, since the piezoelectric pump is arranged outside the mobile terminal device 110, there is no problem of a large volume of the boost circuit, which is conducive to making the mobile terminal device 110 thinner.

As shown in FIG. 49 , the electronic system 200 in the second implementation manner of the ninth embodiment may include a mobile terminal device 110 and an external device 210 , both of which can be detachably connected. The main difference between the second embodiment and the first embodiment lies in the composition of the peripheral device 210 , which will be described below.

As shown in FIG. 49 , the peripheral device 210 includes a second interface 211 , a liquid cooling pipeline 212 , a cold plate 213 , a driving pump 214 , a liquid cooling control device 215 and a fan 220 .

Wherein, the second interface 211 is used for detachably connecting with the first interface 112 of the mobile terminal device 110 , so as to realize the electrical connection between the peripheral device 210 and the mobile terminal device 110 . The liquid cooling pipeline 212 can be the same as the above liquid cooling pipeline 122 , and the liquid cooling pipeline 212 is connected to the driving pump 214 , the liquid cooling control device 215 and the cold plate 213 . The cold plate 213 can have the above-mentioned composite material design and welding process design, and can also be a conventional cold plate. The driving pump 214 can be the same as the above-mentioned driving pump 124, and can also be a conventional driving pump.

Schematically, the liquid cooling control device 215 may include an exhauster 216 , a liquid replenisher 217 , a liquid storage tank 218 and a filter 219 . Wherein, both the exhaust device 216 and the liquid replacement device 217 are connected to the liquid storage tank 218 . The filter screen 219 is installed in the liquid storage tank 218, and the filter screen 219 can be arranged at a lower position in the liquid storage tank 218, for example, at the outlet at the bottom of the liquid storage tank 218 (in Fig. 49, it is the bottom of the liquid storage tank 218 bottom right corner).

The liquid storage tank 218 installed with a filter screen 219 can realize gas-liquid separation (similar to the liquid cooling control device 15 in FIG. 19 ). The gas rising to the high level of the liquid storage tank 218 can be discharged through the exhaust device 216 to ensure that the usable volume of the liquid storage tank 218 is within the design range. The liquid replenisher 217 is used to replenish the working fluid to the liquid storage tank 218 to make up for the loss of the working fluid in the circulating flow.

The fan 220 is used to output airflow to the cold plate 213 to dissipate the heat absorbed by the cold plate 213 .

The driving pump 214 in the second embodiment of the ninth embodiment is very precise, and the working conditions are relatively harsh. For example, when the driving pump 214 is a piezoelectric pump, the amplitude of the piezoelectric vibrator is ≤150 um. When the driving pump 214 is a micromechanical driving pump, the sealing gap of its dynamic seal is 0.1 μm˜500 μm, for example, 1 μm˜20 μm. This makes the foreign matter seriously affect the working performance of the driving pump 214 and cause the driving pump 214 to generate noise. However, by designing the liquid cooling control device 215, it is possible to ensure the long-term and reliable operation of the driving pump 214. The working principle of the electronic system 200 in the second embodiment of the ninth embodiment is as follows: when the peripheral device 210 is connected to the mobile terminal device 110, the liquid cooling pipeline 212 of the peripheral device 210 can communicate with the liquid cooling pipeline 111 of the mobile terminal device 110 , the drive pump 214 and the fan 220 can work, so that the peripheral device 210 and the mobile terminal device 110 can form an active liquid cooling system. The driving pump 214 drives the circulation of the working medium, and the liquid cooling control device 215 , the cold plate 213 and the fan 220 all play their respective roles, thereby achieving heat dissipation and uniform temperature of the mobile terminal device 110 .

It can be understood that in the second embodiment, the fan 220 and the cold plate 213 are not necessary. The above composition of the liquid-cooling control device 215 is not necessary, and even the liquid-cooling control device 215 can also be omitted.

The peripheral device 210 in the second embodiment of the ninth embodiment has higher heat dissipation efficiency due to the design of the cold plate 213 and the fan 220 . Moreover, the function of the liquid cooling control device 215 is more powerful, so that the working reliability of the active liquid cooling heat dissipation system is higher, and the heat dissipation performance of the active liquid cooling heat dissipation system is improved.

As shown in FIG. 50 , the electronic system 300 in the third implementation manner of the ninth embodiment may include a mobile terminal device 310 and an external device 320 , both of which can be detachably connected. Wherein, the peripheral device 320 may be the same as the above-mentioned peripheral device 120 or peripheral device 210, and thus the specific composition of the peripheral device 320 will not be described in detail. Different from the mobile terminal device 110 in Embodiment 1 or Embodiment 2 above, the liquid cooling pipes 39 in the mobile terminal device 310 are designed in parallel. It will be explained below.

As shown in FIG. 50 , the liquid-cooling pipeline 39 connects the heating devices in parallel. "Parallel connection" means that the liquid cooling pipeline 39 can include a main pipeline 391 and several branch pipelines (such as a branch pipeline 392, a branch pipeline 393, and a branch pipeline 394). The pipes are arranged side by side and at intervals (similar to a parallel circuit).

In FIG. 50 , the main pipeline 391 can be schematically represented by a thick line frame around it, and the main pipeline 391 connects the camera module 12 , the chip-level system 14 and the liquid cooling control device 15 . The branch pipe 392 , the branch pipe 393 and the branch pipe 394 can be schematically represented by thick lines located in the area surrounded by the main pipe 391 and connected to the main pipe 391 at both ends. The branch pipeline 392 is also connected to the charging module 16 , and both the branch pipeline 393 and the branch pipeline 394 are connected to the battery 17 .

It can be understood that the shape and position of the main pipeline 391 and each branch pipeline shown in FIG. 50 , the number of each branch pipeline and the connected heating devices are all illustrative, and not intended to limit the solution of this embodiment.

The liquid cooling pipeline 39 covers each heating device in a parallel manner, and the working medium is divided from the main pipeline 391 to each branch pipeline, and performs heat exchange with the heating components connected to each branch pipeline, and then converges into the main pipeline 391 .

The advantage of the parallel connection of heating devices is that the working fluid that enters each heating device along the flow direction of the working fluid has a relatively low temperature because it has not yet absorbed heat, and the working fluid has a large heat absorption capacity, which is beneficial to the heat dissipation and average temperature. And compared with the liquid cooling pipelines connected in series, the total flow resistance of the liquid cooling pipelines 39 connected in parallel is smaller. Under the premise that the input power of the drive pump in the peripheral device 320 remains unchanged, this can ensure that the total flow of the liquid cooling pipeline 39 is relatively large, which is conducive to improving the heat dissipation performance of the active liquid cooling heat dissipation system; the total flow of the liquid cooling pipeline 39 must be constant On the premise that the drive pump has a lower input power, it is beneficial to reduce the speed of the drive pump and suppress the vibration and noise generated by the drive pump.

As shown in FIG. 51 , the electronic system 400 in the fourth implementation manner of the ninth embodiment may include a mobile terminal device 410 and an external device 420 , both of which can be detachably connected. Wherein, the peripheral device 420 may be the same as the above-mentioned peripheral device 120 or peripheral device 210, and thus the specific composition of the peripheral device 420 will not be described in detail. Different from the mobile terminal devices in Embodiment 1 to Embodiment 3 above, the liquid cooling pipeline 39 in the mobile terminal device 410 is a hybrid design. It will be explained below.

The liquid-cooling pipeline 49 connects all heating devices in parallel. "Hybrid connection" means that the liquid cooling pipelines 49 are both connected in series and in parallel.

Schematically, the liquid cooling pipeline 49 may include a main pipeline 491 , a branch pipeline 492 , a branch pipeline 493 , a branch pipeline 494 and a branch pipeline 495 . Wherein, the main pipe 491 may be a pipe extending from both ends of the system on chip 14 . The branch pipeline 492 is connected in parallel with the branch pipeline 493 , and both can be connected with the battery 17 . The branch pipe 494 is connected in parallel with the branch pipe 495 . Wherein, the branch pipe 494 can be connected with the charging module 16 ; the branch pipe 495 can connect the camera module 12 and the sensor 13 in series. It can be considered that the branch pipe 492 is connected in parallel with the branch pipe 493 to form a first branch pipe, the branch pipe 494 is connected in parallel with the branch pipe 495 to form a second branch pipe, and the first branch pipe and the second branch pipe are connected in series.

It can be understood that the shape and position of the main pipe 491 and each branch pipe shown in FIG. 51 , the number of each branch pipe and the connected heating devices are all illustrative, and not intended to limit the solution of this embodiment.

Embodiment 4 can combine the advantages of Embodiment 1 to Embodiment 3:

Moreover, compared with the design of completely series-connected liquid-cooled pipelines, the total flow resistance of the mixed-connected liquid-cooled pipelines 49 is smaller. Under the premise that the input power of the driving pump in the peripheral device 420 remains unchanged, this can ensure that the total flow of the liquid cooling pipeline 49 is large, which is conducive to improving the heat dissipation performance of the active liquid cooling heat dissipation system; the total flow of the liquid cooling pipeline 49 is constant. On the premise that the drive pump has a lower input power, it is beneficial to reduce the speed of the drive pump and suppress the vibration and noise generated by the drive pump.

In the above ninth embodiment, the liquid cooling pipeline of the mobile terminal device is an external liquid cooling pipeline. In the tenth embodiment to be described below, the liquid cooling pipe of the mobile terminal device may include a built-in liquid cooling pipe.

Embodiment ten

As shown in FIG. 52 , in the first implementation manner of the tenth embodiment, the electronic system 500 may include a mobile terminal device 510 and an external device 520 , both of which can be detachably connected. Wherein, the peripheral device 520 may be the same as the peripheral device 120 or the peripheral device 210 in the ninth embodiment, and thus no detailed description thereof will be given.

As shown in FIG. 52 , a mobile terminal device 510 may include a system-in-package module 511 , and the system-in-package module 511 may include, for example, a chip-level system 14 and a charging module 16 integrated together. The closed space of the system-in-package module 511 can be used as a built-in liquid cooling pipeline (same as the design of the sixth embodiment above), or a liquid-cooling channel can be embedded inside the package substrate in the system-in-package module 511, and the liquid-cooling channel can be As a built-in liquid cooling pipe.

The mobile terminal device 510 may also include a liquid cooling pipe 512, which may be an external liquid cooling pipe. The liquid cooling pipeline 512 communicates with the built-in liquid cooling pipeline of the system-in-package module 511 , and the two form a complete liquid cooling pipeline. Wherein, the heating device in the mobile terminal device 510 can be connected in series to the complete liquid cooling pipeline.

The liquid cooling pipe in the first embodiment of the tenth embodiment includes a built-in liquid cooling pipe, which can reduce the contact thermal resistance between the working fluid and the system-in-package module 511, and greatly improve the heat dissipation performance and temperature uniformity performance of the system-in-package module 511 , thereby improving the heat dissipation performance and temperature uniformity performance of the mobile terminal device 510 .

In other implementations, the system-in-package module 511 may not have a built-in liquid-cooled pipeline, but it is arranged on a cold plate, and the cold plate is connected to an external liquid-cooled pipeline to realize the cooling of the system-in-package module 511. Heat dissipation and uniform temperature.

As shown in FIG. 53 , in the second implementation manner of the tenth embodiment, the electronic system 600 may include a mobile terminal device 610 and an external device 520 , both of which can be detachably connected. The difference from Embodiment 1 of Embodiment 10 is that for the complete liquid-cooled pipeline in the electronic system 600, the battery 17 and the system-in-package module 511 of the mobile terminal device 610 are connected in parallel to the complete liquid-cooled pipeline, In addition, the liquid cooling pipeline 612 (external liquid cooling pipeline) connected to the battery 17 may include two parallel branch pipelines.

The scheme of the implementation mode 2 of the tenth embodiment can further improve the heat dissipation performance and temperature uniformity performance of the battery 17 which generates a large amount of heat, thereby improving the heat dissipation performance and temperature uniformity performance of the mobile terminal device 610 .

As shown in FIG. 54 , in the third implementation manner of the tenth embodiment, the electronic system 700 may include a mobile terminal device 710 and an external device 520 , both of which can be detachably connected.

As shown in FIG. 54 , the mobile terminal device 710 may include a battery packaging module 702 , and the battery packaging module 702 may include, for example, the charging module 16 and the battery 17 integrated together. The closed space of the battery packaging module 702 can be used as a built-in liquid cooling pipeline (same as the design of the sixth embodiment above), or a liquid cooling channel can be embedded inside the packaging substrate in the battery packaging module 702, and the liquid cooling channel can be used as a built-in cooling channel. liquid-cooled pipes.

The mobile terminal device 710 may also include a liquid cooling pipe 701, which may be an external liquid cooling pipe. The liquid cooling pipeline 701 communicates with the built-in liquid cooling pipeline of the battery packaging module 702, and the two form a complete liquid cooling pipeline. Wherein, the camera module 12 and the chip-level system 14 can be connected in series, and both the camera module 12 and the chip-level system 14 are connected in parallel with the battery packaging module 702 .

In other embodiments, the battery packaging module 702 may not have a built-in liquid cooling pipe, but it is arranged on a cold plate, and the cold plate is connected with an external liquid cooling pipe to realize heat dissipation and cooling of the battery packaging module 702. average temperature.

The solution of the third embodiment of the tenth embodiment can further improve the heat dissipation and temperature uniformity performance of the battery 17 which generates a large amount of heat, thereby improving the heat dissipation performance and temperature uniformity performance of the mobile terminal device 710 .

As shown in FIG. 55 , in the fourth implementation manner of the tenth embodiment, the electronic system 800 may include a mobile terminal device 810 and an external device 520 , which can be detachably connected.

Different from the mobile terminal device 710 in Embodiment 3 of Embodiment 10, as shown in FIG. 55 , the mobile terminal device 810 may further include a chip-level system in package module 811, and the chip-level system in package module 811 may include, for example, a chip-level system 14. The closed space of the system-on-chip package module 811 can be used as a built-in liquid cooling pipeline (same as the design of the sixth embodiment above), or a liquid-cooling channel can be embedded inside the package substrate in the system-on-chip package module 811, and the liquid cooling Channels can be used as built-in liquid cooling pipes.

The mobile terminal device 810 may also include a liquid cooling pipe 812, which may be an external liquid cooling pipe. The liquid cooling pipeline 812 communicates with the built-in liquid cooling pipeline of the system-on-a-chip package module 811 and the built-in liquid cooling pipeline of the battery packaging module 702, and the three constitute a complete liquid cooling pipeline. Wherein, the system-on-a-chip packaging module 811 and the battery packaging module 702 may be connected in parallel.

The solution of the fourth embodiment of the tenth embodiment can greatly reduce the contact thermal resistance of the working fluid, and greatly improve the heat dissipation performance and temperature uniformity performance of the mobile terminal device 810 .

Embodiment Eleven

As shown in FIG. 56 , the first implementation of the eleventh embodiment provides an electronic system 900 , which may include a mobile terminal device 910 and an external device 920 , both of which can be detachably connected. The peripheral device 920 may be the same as the above peripheral device, and will not be described in detail here.

Different from the ninth embodiment and the tenth embodiment, the mobile terminal device 910 may be a foldable device, such as a foldable mobile phone or a notebook computer. The mobile terminal device 910 may basically have the same structure as the mobile terminal device 40 shown in FIG. The hinge 913 can generate mechanical movement so that the first part 911 and the second part 914 can be folded and unfolded relative to each other. One of the first part 911 and the second part 914 may be, for example, a main screen part, and the other may be, for example, a secondary screen part.

As shown in FIG. 56 , the first part 911 is provided with a first liquid cooling pipeline 916 , and the first liquid cooling pipeline 916 may be an external liquid cooling pipeline. The first liquid cooling pipeline 916 is not limited to be arranged in series, in parallel or in combination. The second part 914 is provided with a second liquid cooling pipeline 915, and the second liquid cooling pipeline 915 may be an external liquid cooling pipeline, or may include an internal liquid cooling pipeline. The second liquid cooling pipeline 915 is not limited to be arranged in series, in parallel or in combination.

As shown in FIG. 56 , the mobile terminal device 910 may also include a third liquid cooling pipe 912 (which may be called a cross-axis liquid cooling pipe) across the hinge 913, and the meaning of "spanning" is the extension of the third liquid cooling pipe 912. The direction intersects the rotation axis of the first part 911 (ie, the rotation axis of the hinge 913). The figure shows two third liquid-cooling pipes 912, but actually the number of the third liquid-cooling pipes 912 can be determined according to the layout of the liquid-cooling pipes. The opposite ends of the third liquid cooling pipeline 912 are respectively connected to the first liquid cooling pipeline 916 and the second liquid cooling pipeline 915 . Thus, the first liquid cooling pipeline 916 , the third liquid cooling pipeline 912 and the second liquid cooling pipeline 915 communicate and form a loop, so that heat exchange can be realized between the first part 911 and the second part 914 .

The third liquid cooling pipe 912 is flexible and can be bent and deformed. The structure and material of the third liquid cooling pipe 912 may be the same as that of the third liquid cooling pipe 492 in Embodiment 4, so the description will not be repeated here.

In the solution of the first embodiment of the eleventh embodiment, a channel for connecting the foldable device to the external active liquid cooling device is established. After the working medium absorbs heat inside the foldable device, it can flow into the peripheral device 920 and spread the heat to the outside, so that the foldable device can achieve forced active heat dissipation much higher than natural heat dissipation, thereby greatly reducing the temperature of the foldable device itself . Moreover, the liquid cooling pipes inside the foldable device can be connected to various peripherals, so that the heat dissipation capability of the foldable device can be greatly improved with the help of a stronger external liquid cooling driving force. Moreover, by adapting different peripherals, the foldable device can have sufficient heat dissipation capacity in various and complex usage scenarios.

As shown in FIG. 57 , in the second implementation manner of the eleventh embodiment, the electronic system 1000 may include a mobile terminal device 1110 and an external device 920 , both of which can be detachably connected. Different from the first embodiment above, the mobile terminal device 1110 further includes a system-in-package module 1111 , and the system-in-package module 1111 may include, for example, a chip-level system 14 and a charging module 16 integrated together. The closed space of the system-in-package module 1111 can be used as a built-in liquid cooling pipeline, or the package substrate in the system-in-package module 1111 can be embedded with a liquid cooling channel, and the liquid cooling channel can be used as a built-in liquid cooling pipeline.

The liquid cooling pipe in the second embodiment of the eleventh embodiment includes a built-in liquid cooling pipe, which can reduce the contact thermal resistance between the working fluid and the system-in-package module 1111, and greatly improve the heat dissipation performance and uniform temperature of the system-in-package module 1111 Performance, thereby improving the heat dissipation performance and temperature uniformity performance of foldable devices.

The electronic systems described in the ninth to eleventh embodiments above are open active liquid cooling systems, in which the mobile terminal device needs to rely on peripherals for active liquid cooling. The following will describe the internal and external hybrid active liquid cooling system, in which the mobile terminal equipment and peripherals are equipped with driving pumps, and both can perform active liquid cooling.

Embodiment 12

As shown in FIG. 58 , the first implementation of the twelfth embodiment provides an electronic system 2000 , which may include a mobile terminal device 2100 and an external device 2200 , both of which can be detachably connected. The peripheral device 2200 can be the same as the above peripheral device (the drive pump is provided in the peripheral device 2200), and will not be described in detail here.

As shown in FIG. 58, the mobile terminal device 2100 may be a non-foldable device, such as a straight-edge mobile phone or a tablet computer. The mobile terminal device 2100 includes a heating device (such as a camera module 12, a system-in-package module 2101 and a battery 17, wherein the system-in-package module 2101 may include an integrated chip-level system 14 and a charging module 16), a liquid cooling control device 15 , drive pump 2103, liquid cooling pipeline 2104 and tee device 2102.

Wherein, the driving pump 2103 is not limited to be a micromechanical driving pump, a piezoelectric pump, a capillary pump or other driving pumps. The liquid cooling pipeline 2104 may be an external liquid cooling pipeline. The layout of the liquid cooling pipelines 2104 may be in parallel. The liquid cooling pipe 2104 is used to connect with the liquid cooling pipe (described below) in the peripheral device 2200 . The liquid cooling pipe 2104 may have waterproof and dustproof functions, and is in a normally closed state when it is not connected, so that water vapor or solid foreign matter cannot enter. Working medium leakage can be avoided when not docking, during docking and after docking.

The closed space of the system-in-package module 2101 can be used as a built-in liquid cooling pipeline, or a liquid cooling channel can be embedded inside the packaging substrate in the system-in-package module 2101, and the liquid cooling channel can be used as a built-in liquid cooling pipeline. The liquid cooling pipeline 2104 can communicate with the built-in liquid cooling pipeline, and the two together form a liquid cooling channel inside the mobile terminal device 2100 .

Hereinafter, the liquid cooling pipeline inside the mobile terminal device 2100 is called an internal liquid cooling pipeline, and the liquid cooling channel in the peripheral device 2200 is called an external liquid cooling pipeline.

As shown in FIG. 58 , the three-way device 2102 can be located on the edge of the mobile terminal device 2100 , and the three-way device 2102 can be set on the liquid cooling pipe 2104 . There may be two three-way devices 2102, and the two three-way devices 2102 may be respectively arranged at the inlet and outlet of the liquid cooling pipeline 2104. The three-way device 2102 may be, for example, a three-way valve.

The function of the three-way device 2102 is: when the mobile terminal device 2100 is connected to the peripheral device 2200, the three-way device 2102 can be switched to the first state, so that the internal liquid cooling channel of the mobile terminal device 2100 and the external liquid cooling channel of the peripheral device 2200 The internal liquid cooling channel is connected in series with the external liquid cooling channel to form a circulation loop of working fluid. When the mobile terminal device 2100 is disconnected from the peripheral device 2200, the three-way device 2102 can be switched to the second state, so that the internal liquid cooling channel of the mobile terminal device 2100 forms a circulation loop of the working fluid, and the working fluid of the internal liquid cooling channel The quality cannot be disclosed.

The working principle of the electronic system 2000 is as follows:

When the mobile terminal device 2100 is connected to the peripheral device 2200, the three-way device 2102 can be switched to the first state, the internal liquid cooling channel of the mobile terminal device 2100 communicates with the external liquid cooling channel of the peripheral device 2200, and the internal liquid cooling channel communicates with the external liquid cooling channel. The cold aisles are connected in series to form a circulation loop for the working fluid. At this time, the driving pump 2103 of the mobile terminal device 2100 and/or the driving pump of the peripheral device 2200 can work, and the driving medium circulates in the circulation loop, thereby transferring the heat inside the mobile terminal device 2100 to the peripheral device 2200 , and spread to the outside world.

When the mobile terminal device 2100 is disconnected from the peripheral device 2200, the three-way device 2102 can be switched to the second state, and the internal liquid cooling channel of the mobile terminal device 2100 itself forms a circulation loop of working fluid. The driving pump 2103 of the mobile terminal device 2100 can work, and the driving fluid circulates in the circulation loop, so that the active liquid cooling system in the mobile terminal device 2100 can dissipate the heat from the heat-generating device and evenly spread the heat to the whole other parts of the machine to improve the temperature uniformity of the whole machine.

The solution of Embodiment 1 of Embodiment 12 has the following advantages: For the non-foldable mobile terminal device 2100, it can rely on the active liquid cooling inside the mobile terminal device 2100 in common scenarios where the mobile terminal device 2100 is not connected to the peripheral device 2200 The heat dissipation system realizes active heat dissipation with high heat dissipation performance and high temperature uniformity; it can also rely on the internal and external active liquid cooling system to achieve stronger heat dissipation against the environment in complex scenarios where the mobile terminal device 2100 is connected to the peripheral device 2200. Therefore, the solution of this embodiment can not only greatly reduce the temperature of the mobile terminal device 2100, but also greatly release the performance of the heating element, so that the mobile terminal device 2100 can run stably under full load or even overload, and meet the thermal experience needs of users.

As shown in FIG. 59 , the second implementation mode of the twelfth embodiment provides an electronic system 3000 , which may include a mobile terminal device 3100 and an external device 3200 , both of which can be detachably connected. The peripheral device 3200 can be the same as the peripheral device described above (the drive pump is provided in the peripheral device 2200 ), and will not be described in detail here.

As shown in FIG. 59 , the mobile terminal device 3100 may be a foldable device, such as a foldable mobile phone or a notebook computer. The difference between the mobile terminal device 3100 and the mobile terminal device 1000 shown in FIG. 57 is that the mobile terminal device 3100 also includes a driving pump 3102 and a three-way device 3101 . The driving pump 3102 can be the same as the above-mentioned driving pump 2103, and the three-way device 3101 can be the same as the above-mentioned three-way device 2102, and the description will not be repeated here.

The working principle of the electronic system 3000 is as follows:

After the mobile terminal device 3100 is connected to the peripheral device 3200, the three-way device 3101 can be switched to the first state, the internal liquid cooling channel of the mobile terminal device 3100 communicates with the external liquid cooling channel of the peripheral device 3200, and the internal liquid cooling channel communicates with the external liquid cooling channel. The cold aisles are connected in series to form a circulation loop for the working fluid. At this time, the driving pump 3102 of the mobile terminal device 3100 and/or the driving pump of the peripheral device 3200 can work, and the driving fluid circulates in the circulation loop, thereby transferring the heat inside the mobile terminal device 3100 to the peripheral device 3200 , and spread to the outside world.

When the mobile terminal device 3100 is disconnected from the peripheral device 3200, the three-way device 3101 can be switched to the second state, and the internal liquid cooling channel of the mobile terminal device 3100 itself forms a circulation loop of working fluid. The drive pump 3102 of the mobile terminal device 3100 can work, and the driving fluid circulates in the circulation loop, so that the active liquid cooling system in the mobile terminal device 3100 can dissipate heat from the heat-generating device and spread the heat evenly throughout the other parts of the machine to improve the temperature uniformity of the whole machine.

The solution of the second embodiment of the twelveth embodiment has the following advantages: for the foldable mobile terminal device 3100, it can rely on the active liquid cooling inside the mobile terminal device 3100 in common scenarios where the mobile terminal device 3100 is not connected to the peripheral device 3200 The heat dissipation system realizes active heat dissipation with high heat dissipation performance and high temperature uniformity, and can also rely on internal and external active liquid cooling systems to achieve stronger heat dissipation against the environment in complex scenarios where the mobile terminal device 3100 is connected to the peripheral device 3200. Therefore, the solution in this embodiment can not only greatly reduce the temperature of the mobile terminal device 3100, but also greatly release the performance of the heat-generating device, so that the mobile terminal device 3100 can run stably under full load or even overload, and meet the thermal experience needs of users.

Embodiment Thirteen

Embodiment 13 of the present application provides a mobile terminal device, including a driving pump, a liquid cooling control device, a cold plate assembly, a liquid cooling pipeline, and a heat generating device. The driving pump, the liquid cooling control device and the cooling The plate assemblies are all in communication with the liquid cooling pipeline, there is a working medium in the liquid cooling pipeline, and the cold plate assembly is in contact with the heating device; the driving pump is used to drive the working fluid in the driving pump, The liquid-cooling control device, the cold plate assembly and the liquid-cooling pipeline are circulated; the liquid-cooling control device is used to control the flow of the working fluid.

In an implementation manner of Embodiment 13, the driving pump includes a micropump base, a first piezoelectric vibrator and a second piezoelectric vibrator, and the first piezoelectric vibrator is connected to the second piezoelectric vibrator respectively On opposite sides of the micropump base, the first piezoelectric vibrator and the micropump base enclose a first pump cavity, and the second piezoelectric vibrator and the micropump base enclose a second pump cavity , the first pump chamber is isolated from the second pump chamber; the side of the micropump base close to the first piezoelectric vibrator has a first inlet channel and a first outlet channel, and the first inlet One end of the flow channel communicates with the first pump chamber, the other end of the first inlet flow channel communicates with the liquid cooling pipeline, and one end of the first outlet flow channel communicates with the first pump chamber, so The other end of the first outlet channel communicates with the liquid cooling pipeline; the side of the micropump base close to the second piezoelectric vibrator has a second inlet channel and a second outlet channel, and the second Both the inlet channel and the second outlet channel are in communication with the second pump chamber; the second inlet channel is used for supplying gas to flow into the second pump chamber, and the second outlet channel is used for supplying The gas in the second pump chamber flows out.

In an implementation manner of the thirteenth embodiment, the driving pump includes a one-way valve; the first inlet channel communicates with the first pump cavity through the one-way valve, and the first outlet channel communicate with the first pump chamber through the one-way valve; and/or, the second inlet channel communicates with the second pump chamber through the one-way valve, and the second outlet channel communicates with the The second pump chamber is communicated through the one-way valve.

In an implementation manner of the thirteenth embodiment, one end of the second inlet channel adjacent to the second pump chamber has an expansion opening, and the direction from the second inlet channel to the second pump chamber, The caliber of the expansion opening tends to increase, and the expansion opening communicates with the second pump chamber; the end of the second outlet channel adjacent to the second pump chamber has a contraction opening, and the second outlet channel In the direction from the flow path to the second pump chamber, the diameter of the constricted opening tends to decrease, and the constricted opening communicates with the second pump chamber.

In an implementation manner of Embodiment 13, the mobile terminal device is a wearable device, and the wearable device includes an airbag, and the airbag communicates with the outside world; the second inlet channel of the drive pump and the The second outlet channels are all in communication with the air bag.

In an implementation manner of Embodiment 13, one end of the second inlet channel communicates with the second pump chamber, and the other end of the second inlet channel communicates with the internal space of the mobile terminal device or communicate with the outside world; one end of the second outlet channel communicates with the second pump chamber, and the other end of the second outlet channel communicates with the internal space of the mobile terminal device.

In an implementation manner of Embodiment 13, the driving pump includes a main body, a capillary structure, an inlet pipe, and an outlet pipe; the main body has a cavity; the capillary structure is arranged in the cavity of the main body, and Occupies a part of the cavity of the main body; one end of the inlet pipe communicates with the liquid cooling pipeline, and the other end of the inlet pipe communicates with the cavity of the main body; one end of the outlet pipe communicates with the The cavity of the main body communicates, and the other end of the outlet pipe communicates with the liquid cooling pipeline.

In an implementation manner of the thirteenth embodiment, the liquid cooling control device includes a gas collection and dust removal device, and the gas collection and dust removal device includes a housing and a filter screen; the housing has an inner cavity, and the housing has The inner chamber has an inlet and an outlet, both of which are in communication with the liquid cooling pipeline; the filter screen is installed in the inner chamber of the housing, and is located between the inlet and the outlet.

In an implementation manner of Embodiment 13, there are at least two filter screens; along the direction from the inlet to the outlet, the at least two filter screens are arranged in sequence, and the at least two filter screens The pore size of the grid decreases sequentially.

In an implementation manner of the thirteenth embodiment, the housing includes a first part, a second part and a third part, and the first part, the second part and the third part are connected in sequence and together form a In the inner cavity of the housing, the first part has the inlet, and the third part has the outlet; the pipe diameter of the second part is larger than the pipe diameter of the first part and the pipe diameter of the third part pipe caliber; the filter is located in the second part; the filter includes a first filter and a second filter; the first filter surrounds the outer periphery of the second filter, the second One side of the filter net facing the outlet abuts against the second part, and the other side of the first filter net is spaced from the second part; the end of the second filter net facing the inlet is in contact with the second part. Both the first part and the second part have intervals.

In an implementation manner of the thirteenth embodiment, the inner surface of the second part is provided with an anti-backflow structure, and the anti-backflow structure is inclined toward the flow direction of the working fluid flowing into the second part.

In an implementation manner of the thirteenth embodiment, the housing includes a first part, a second part and a third part, the first part, the second part and the third part are connected in sequence, and the first part A part is close to the top of the second part, the third part is close to the bottom of the second part, and the first part, the second part and the third part jointly enclose the inner cavity of the housing, The first part has the inlet, and the third part has the outlet; the volume of the second part is greater than the volume of the first part and the volume of the third part; the filter is arranged on the A location within the second section adjacent to the third section.

In an implementation manner of the thirteenth embodiment, the outer surface of the casing has a waterproof and breathable layer, and the material of the waterproof and breathable layer is a waterproof and breathable material.

In an implementation manner of Embodiment 13, the liquid-cooled pipeline includes a flexible liquid-cooled pipeline, and the material of the pipe wall of the flexible liquid-cooled pipeline is a flexible material; the flexible liquid-cooled pipeline is flat; the The pipe wall of the flexible liquid cooling pipe encloses a channel, and the channel is used for the flow of working fluid.

In an implementation manner of the thirteenth embodiment, the flexible liquid-cooled pipe includes at least three layers of pipe walls, and the channel is formed between every two adjacent layers of the pipe walls.

In an implementation manner of the thirteenth embodiment, the inner surface and/or the outer surface of the pipe wall has a barrier layer, and the barrier layer is used to block the evaporation of the working fluid in the channel.

In an implementation manner of Embodiment 13, the mobile terminal device includes a first part, a hinge, and a second part, the hinge connects the first part and the second part, and the hinge can generate mechanical movement, so that the first part and the second part can be folded and unfolded relative to each other; the driving pump, the liquid cooling control device, the cold plate assembly and the heating device can all be located in the first part and/or In the second part; the liquid cooling pipeline includes a first liquid cooling pipeline in the first part, and a second liquid cooling pipeline in the second part; the flexible liquid cooling pipeline spans the The hinge, the extension direction of the flexible liquid-cooled pipe intersects the rotation axis of the first part, and the opposite ends of the flexible liquid-cooled pipe communicate with the first liquid-cooled pipe and the second liquid-cooled pipe respectively.

In an implementation manner of the thirteenth embodiment, the heating device includes a circuit board, and the circuit board is embedded with a liquid cooling channel, and the liquid cooling channel is located on two opposite device layout surfaces of the circuit board. Between, the liquid cooling channel is a part of the liquid cooling pipeline.

In an implementation manner of Embodiment 13, the heat generating device includes a first packaging substrate, a second packaging substrate, and a sealing frame connected between the first packaging substrate and the second packaging substrate, the The first packaging substrate, the second packaging substrate and the sealing frame enclose a closed space, and the closed space is a part of the liquid cooling pipeline.

In an implementation manner of Embodiment 13, there are at least two heating devices, and the liquid cooling pipeline connects the at least two heating devices in series; the cold plate assembly and the at least two At least one of the heat generating devices is in contact.

In an implementation manner of the thirteenth embodiment, the liquid cooling pipeline includes a main pipeline and a branch pipeline, the main pipeline surrounds the outer periphery of the branch pipeline, and the opposite ends of the branch pipeline are connected to the main pipeline. The pipeline is connected; there are at least two heating devices, one part of the heating device is connected to the main pipeline, and the other part of the heating device is connected to the branch pipeline; the cold plate assembly is connected to at least one of the heating devices touch.

In an implementation manner of Embodiment 13, the liquid cooling pipeline includes a main pipeline, a first branch pipeline and a second branch pipeline, the first branch pipeline is connected in series with the second branch pipeline, and the first The opposite ends of the branch pipeline communicate with the main pipeline, and the opposite ends of the second branch pipeline communicate with the main pipeline; the first branch pipeline includes at least two branch pipelines, and the first branch pipeline The at least two branch pipes are connected in parallel; the second branch pipe includes at least two branch pipes, and the at least two branch pipes in the second branch pipe are connected in parallel; there are at least two of the heating devices, and the The main pipe is connected to at least one of the heating devices, each branch pipe in the first branch pipe is connected to at least one of the heat generating devices, and each branch pipe in the second branch pipe is connected to at least one The heating device is connected; the cold plate assembly is connected to at least one of the heating devices.

Embodiment Fourteen

Embodiment 14 of the present application provides an electronic system, including a mobile terminal device, peripherals, and a working fluid; the mobile terminal device includes a first interface, a heating device, and a liquid cooling pipeline connected to the heating device; The peripheral device includes a second interface, a driving pump and a liquid cooling pipeline, and the driving pump communicates with the liquid cooling pipeline of the peripheral device; the second interface is detachably connected to the first interface, so that the external device It is provided to be connected with the mobile terminal equipment and form an electrical connection; the liquid cooling pipeline of the peripheral equipment is communicated with the liquid cooling pipeline of the mobile terminal equipment; the driving pump is used to drive the working medium in the peripheral equipment The liquid cooling pipeline circulates with the liquid cooling pipeline of the mobile terminal device.

In an implementation manner of Embodiment 14, the peripheral device includes a cable, and the cable includes an insulating outer layer and a wire, and the insulating outer layer wraps the wire inside; the liquid of the peripheral device The cold pipe is located in the insulating outer layer and adjacent to the wire; the second interface is electrically connected to the wire in the cable.

In an implementation manner of Embodiment 14, the liquid cooling pipe of the peripheral device is adjacent to the wire side by side.

In an implementation manner of the fourteenth embodiment, the liquid cooling pipe of the peripheral device includes a first part and a second part, the first part surrounds the outer circumference of the wire, and the wire surrounds the second part the periphery.

In an implementation manner of the fourteenth embodiment, the peripheral device includes a fan, a cold plate, a liquid storage tank, a filter, an exhauster, and a liquid replenisher; the fan is used to air-cool the cold plate to dissipate heat The cold plate communicates with the liquid cooling pipeline of the peripheral equipment and the liquid storage tank; the liquid storage tank communicates with the liquid cooling pipeline of the external equipment; the filter screen is installed in the liquid storage tank The exhauster and the liquid replenisher are both in communication with the liquid storage tank, the exhaust device is used to discharge the gas in the liquid storage tank, and the liquid replenisher is used to replenish working fluid to the liquid storage tank .

Embodiment 15

Embodiment 15 of the present application provides an electronic system, including mobile terminal equipment, peripherals, and working medium; Connected to the internal liquid cooling pipeline, the driving pump of the mobile terminal equipment and the tee device are both connected to the internal liquid cooling pipeline;

The peripheral device includes a driving pump and an external liquid cooling pipeline, and the driving pump of the peripheral device communicates with the external liquid cooling pipeline;

The peripheral device is detachably connected to the mobile terminal device, the three-way device is in a first state in which the internal liquid cooling pipeline communicates with the external liquid cooling pipeline, and the drive pump and/or the mobile terminal equipment Or the driving pump of the peripheral device can drive the working medium to circulate in the external liquid cooling pipeline and the internal liquid cooling pipeline; after the peripheral device is separated from the mobile terminal device, the three-way device In the second state where the internal liquid cooling pipeline is closed, the driving pump of the mobile terminal device can drive the working fluid to circulate in the internal liquid cooling pipeline.

In an implementation manner of the fifteenth embodiment, the three-way device is a three-way valve.

The above is only a specific embodiment of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. Should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.

Claims

A drive pump (18), characterized in that,

The drive pump (18) includes a volute (181), a base assembly (185) and an impeller assembly (183);

The surface (181a) of the volute (181) is provided with a first pump liquid groove (181c);

The base assembly (185) includes a base (185a) and a rotating shaft (185j), the rotating shaft (185j) is integrated with the base (185a), and the surface (185d) of the base (185a) is provided with a second A pump liquid groove (185e), the second pump liquid groove (185e) surrounds the outer periphery of the rotating shaft (185j); the base (185a) is provided with the surface (185d) of the second pump liquid groove (185e) ) is assembled with the surface (181a) of the volute (181) provided with the first pump liquid groove (181c), and the second pump liquid groove (185e) is surrounded by the first pump liquid groove (181c) into the pump liquid space (18a);

The impeller assembly (183) includes a bearing (183e) and an impeller (183a), and the bearing (183e) is integrated with the impeller (183a);

The impeller assembly (183) is located between the base (185a) and the volute (181) and in the pump liquid space (18a), and the bearing (183e) is rotatably sleeved on the shaft (185j) so that the impeller assembly (183) can rotate around the shaft (185j).
Drive pump (18) according to claim 1, characterized in that,

The impeller (183a) includes an impeller main body (183b) and a plurality of blades (183c), and the plurality of blades (183c) are connected to the periphery of the impeller main body (183b), and every adjacent two blades (183c) uniformly spaced; the bearings (183e) are integrated with the impeller main body (183b);

The impeller main body (183b) forms a first kinematic fit gap (d1) with the tank wall of the first pump liquid tank (181c), and the impeller main body (183b) and the second pump liquid tank (185e) The groove wall forms a second kinematic fit gap (d2), wherein both the first kinematic fit gap (d1) and the second kinematic fit gap (d2) are dimensioned along the radial direction of the impeller (183a);

Each of the blades (183c) forms a third kinematic fit gap (d3) and a fourth kinematic fit gap (d41, d42) with the inner wall of the pump liquid space (18a), wherein the third kinematic fit The gap (d3) is a dimension along the radial direction of the impeller (183a), and the fourth kinematic fit gap (d41, d42) is a dimension along the axial direction of the impeller (183a);

The first kinematic fit gap (d1), the second kinematic fit gap (d2), the third kinematic fit gap (d3) and the fourth kinematic fit gap (d41, d42) are all 0.1 μm- 500 μm.
Drive pump (18) according to claim 1 or 2, characterized in that,

The rotating shaft (185j) is integrated with the base (185a) through an injection molding process, and the base (185a) has injection molding characteristic structures (185n, 185r, 185s);

And/or, the bearing (183e) is integrated with the impeller (183a) through an injection molding process, and the impeller (183a) has an injection molding characteristic structure (183i, 183j).
The driving pump (18) according to any one of claims 1-3, characterized in that,

A second installation groove (185k) and a third installation groove (185p) are provided on the side of the base (185a) away from the second pump liquid groove (185e), and the groove wall of the second installation groove (185k) The top surface is provided with a harness groove (185q);

The driving pump (18) includes a flexible circuit board (187) and a coil winding (186); the flexible circuit board (187) is installed in the third installation groove (185p); the coil winding (186) is installed In the second installation groove (185k), the lead wire (186a) in the coil winding (186) passes through the wire harness groove (185q) and connects with the soldering pad on the flexible circuit board (187) ( 187a) Welding.
The driving pump (18) according to any one of claims 1-4, characterized in that,

Described impeller (183a) comprises impeller main body (183b) and odd blade (183c); Evenly spaced; the bearing (183e) is integrated with the impeller main body (183b).
The driving pump (18) according to any one of claims 1-5, characterized in that,

The drive pump (18) includes a liquid inlet pipe and a liquid outlet pipe connected to the base (185a), the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, the liquid inlet pipe and the liquid outlet pipe are all located outside the second pumping tank (185e), and are in communication with the second pumping tank (185e);

The impeller (183a) includes an impeller main body (183b) and a plurality of blades (183c) connected to the periphery of the impeller main body (183b); the bearing (183e) is integrated with the impeller main body (183b); A space is formed between every adjacent two blades (183c);

When the impeller assembly (183) rotates around the rotating shaft (185j), each of the intervals can communicate with the liquid inlet pipe, so as to suck the working fluid into the interval from the liquid inlet pipe; The spacer can also communicate with the liquid outlet pipe to discharge the working fluid from the liquid outlet pipe; wherein, the pressure of the working fluid discharged from the liquid outlet pipe is higher than the pressure of the working fluid before entering the liquid inlet pipe .
A mobile terminal device (10, 20, 30, 40, 2100, 3100), characterized in that,

Comprising liquid cooling pipelines (19, 51a, 55a, 60a), heating devices (12, 13, 14, 16, 17) and the drive pump (18) described in any one of claims 1-6;

The liquid cooling pipeline (19, 51a, 55a, 60a) passes through the heat generating device (12, 13, 14, 16, 17) from inside or outside the heat generating device (12, 13, 14, 16, 17) , the liquid cooling pipeline (19, 51a, 55a, 60a) is equipped with a working fluid;

The base (185a) of the driving pump (18) is connected with a liquid inlet pipe and a liquid outlet pipe, the liquid inlet pipe and the liquid outlet pipe are arranged at intervals, and the liquid inlet pipe communicates with the second pump liquid. One end of the tank (185e) is connected to the liquid cooling pipeline (19, 51a, 55a, 60a), and the liquid outlet tube communicates with the other end of the second pump liquid tank (185e) and the liquid cooling pipeline (19, 51a, 55a, 60a);

The drive pump (18) is used to suck the working medium in the liquid cooling pipeline (19, 51a, 55a, 60a) into the pump liquid space (18a) through the liquid inlet pipe, and in the pump liquid space (18a) pressurizes the working fluid, and discharges the boosted working fluid from the liquid outlet pipe to the liquid cooling pipeline (19, 51a, 55a, 60a), so as to drive the working fluid in the liquid Circulating flow in the cold pipes (19, 51a, 55a, 60a).
A cold plate assembly (748, 748') characterized in that,

The cold plate assembly (748, 748') includes a nozzle (746, 746') and a cold plate (71, 742, 742');

The cold plate (71, 742, 742') includes a first cover plate (711, 7421, 7421') and a second cover plate (712, 7422, 7422'), and the first cover plate (711, 7421, 7421' ) and the second cover plate (712, 7422, 7422’) are stacked and welded, and the first cover plate (711, 7421, 7421’) is surrounded by the second cover plate (712, 7422, 7422’) into a cold plate cavity (71b, 742b, 742b'), the cold plate cavity (71b, 742b, 742b') has an opening (742a, 742c, 742a') communicating with the outside; the cold plate (71, 742, 742' ) has a thickness less than or equal to 1.5 mm;

The water nozzle (746, 746') is connected to the first cover plate (711, 7421, 7421') and/or the second cover plate (712, 7422, 7422'), and the water nozzle (746, 746') There are channels (746a, 746a') communicating with the cold plate chambers (71b, 742b, 742b') through the openings (742a, 742c, 742a').
The cold plate assembly (748) of claim 8, wherein,

The openings (742a, 742c) are formed on the side of the first cover plate (7421) away from the second cover plate (7422); the faucets (746) and the first cover plate (7421) The side away from the cold plate cavity (742b) is connected.
The cold plate assembly (748') of claim 8, wherein,

The opening (742a') is surrounded by a part of the edge of the first cover (7421') and a part of the edge of the second cover (7422'); surrounding the opening (742a' The part of the first cover (7421') and the part of the second cover (7422') are located in the channel (746a) of the faucet (746') '), and are all connected with the faucet (746').
The cold plate assembly (748, 748') according to any one of claims 8-10, characterized in that,

The overall outer dimension of the cold plate (71, 742, 742') is at least the wall thickness of the first cover plate (711, 7421, 7421') or the wall thickness of the second cover plate (712, 7422, 7422') 10 times thicker;

The material of the first cover (711, 7421, 7421') is a composite material, and the composite material of the first cover (711, 7421, 7421') includes 7422') of first weldable material (711a, 7421c) and reinforcing material (711b, 7421b) away from said second cover plate (712, 7422, 7422'), said first cover plate (711, 7421, 7421') first weldable material (711a, 7421c) is welded to said second cover plate (712, 7422, 7422'); and/or,

The material of the second cover (712, 7422, 7422') is a composite material, and the composite material of the second cover (712, 7422, 7422') includes 7421') first weldable material (712a, 7422a) and reinforcing material (712b, 7422b) away from said first cover plate (711, 7421, 7421'), said second cover plate (712, 7422, 7422') of the first easily weldable material (712a, 7422a) is welded to the first cover plate (711, 7421, 7421').
The cold plate assembly (748, 748') of claim 11 wherein,

The first easy-to-weld material (711a, 7421c, 712a, 7422a) is discontinuously distributed on the surface of the reinforcing material (711b, 7421b, 712b, 7422b), so that the reinforcing material (711b, 7421b, 712b, 7422b ) with partial surface exposure.
A cold plate assembly (748, 748') according to claim 11 or 12, characterized in that,

The yield strength of the reinforcing material (711b, 7421b, 712b, 7422b) is greater than or equal to 150Mpa, and/or,

The surface hardness of the reinforcing material (711b, 7421b, 712b, 7422b) is greater than or equal to HV100, and/or,

The elastic modulus of the reinforcing material (711b, 7421b, 712b, 7422b) is greater than or equal to 120Mpa.
The cold plate assembly (748, 748') of claim 13, wherein,

The reinforcing material (711b, 7421b, 712b, 7422b) includes stainless steel, titanium, titanium alloy, tungsten, tungsten alloy, chromium or chromium alloy.
The cold plate assembly (748, 748') according to any one of claims 11-14, characterized in that,

The melting point of the first easy-weldable material (711a, 7421c, 712a, 7422a) is ≤950°C; and/or, the first easy-weldable material (711a, 7421c, 712a, 7422a) includes copper, copper alloy, nickel or nickel alloy.
The cold plate assembly (748, 748') according to any one of claims 11-15, characterized in that,

The material of the first cover (7421, 7421') is a composite material, and the composite material of the first cover (7421, 7421') also includes a second easy-to-weld material (7421a), and the first cover (7421, 7421') of said second weldable material (7421a) located away from said second cover (7422, 7422') of said first cover (7421, 7421') reinforcement material (7421b) side;

The nozzle (746, 746') is welded to the second easily weldable material (7421a) of the first cover plate (7421, 7421').
The cold plate assembly (748, 748') of claim 16, wherein,

At least part of the water nozzle (746,746') has easy-weld material (7461,7461'), and the easy-weld material (7461,7461') of the water nozzle (746,746') is connected with the first cover plate (7421 , 7421') of said second easily weldable material (7421a) for welding.
A cold plate assembly (748, 748') according to claim 16 or 17, characterized in that,

The water nozzle (746, 746') is welded to the first cover plate (7421, 7421') by solder paste, or soldered by a process without solder paste.
The cold plate assembly (748') according to any one of claims 16-18, characterized in that,

The material of the second cover (7422') is a composite material, and the composite material of the second cover (7422') also includes a second easy-to-weld material (7422c), and the second cover (7422') The second easy-to-weld material (7422c) is located on the side of the reinforcing material (7422b) of the second cover plate (7422′) facing away from the first cover plate (7421′);

The nozzle (746') is also welded to the second easily weldable material (7422c) of the second cover plate (7422').
The cold plate assembly (748') of claim 19, wherein,

At least part of the water nozzle (746') has easy-weld material (7461'), and the easy-weld material (7461') of the water nozzle (746') is also connected with the second cover plate (7422'). The second easily weldable material (7422c) welds.
The cold plate assembly (748') according to claim 19 or 20, characterized in that,

The nozzle (746') and the second cover plate (7422') are welded with solder paste, or soldered with no solder paste.
The cold plate assembly (748, 748') according to any one of claims 16-21, characterized in that,

The faucets (746, 746') are constructed of easily weldable materials.
The cold plate assembly (748, 748') according to any one of claims 16-22, characterized in that,

The melting point of the second easily weldable material (7421a, 7422c) is ≤950°C; and/or, the second easily weldable material (7421a, 7422c) includes copper, copper alloy, nickel or nickel alloy.
The cold plate assembly (748, 748') according to any one of claims 16-23, characterized in that,

The melting point of the weldable material of the water nozzle (746, 746') is ≤950°C; and/or, the weldable material of the water nozzle (746, 746') includes copper, copper alloy, nickel or nickel alloy.
The cold plate assembly (748, 748') according to any one of claims 8-24, characterized in that,

The surface of the first cover plate (711) facing the second cover plate (712) and the surface of the second cover plate facing the second cover plate each comprise an edge area (713) and a support area (714 ), the edge region (713) surrounds the periphery of the support region (714);

The support area (714) of the first cover plate (711) is protrudingly provided with a support portion, and the support portion is used to support the second cover plate (712), and the support portion and the second cover The board (712) is soldered by solder paste or by a solder paste-free process; or,

The support area (714) of the second cover plate (712) is protrudingly provided with a support portion (715), the support portion (715) is used to support the first cover plate (711), and the support portion (715) Weld with the first cover plate (711) by solder paste or solder paste-free process.
The cold plate assembly (748, 748') of claim 25, wherein,

The edge area of the first cover plate (711) is welded with the edge area (713) of the second cover plate (712) by solder paste, or welded by a process without solder paste.
A mobile terminal device (74), characterized in that,

Comprising a liquid-cooled pipeline, a heating device, and the cold plate assembly (748) according to any one of claims 8-26;

The liquid-cooled pipeline passes through the heat-generating device from the inside or outside of the heat-generating device, and the liquid-cooled pipeline is filled with working fluid;

The cold plate (742) in the cold plate assembly (748) is connected to the heating device; the cold plate assembly (748) includes two water nozzles (746), and two water nozzles ( 746) has a gap, and the channels (746a) of the two water nozzles (746) are all in communication with the liquid cooling pipeline.
Mobile terminal device (74) according to claim 27, characterized in that,

The cold plate is connected to the heat generating device through a thermal interface material.
An electronic system (2000, 3000), characterized in that,

Including mobile terminal equipment (2100, 3100), peripherals (2200, 3200) and working medium;

The mobile terminal equipment (2100, 3100) includes a heating device (12, 14, 16, 17), a driving pump, a three-way device (2102, 3101) and an internal liquid cooling pipeline, and the internal liquid cooling pipeline passes through the heating The devices (12, 14, 16, 17), the driving pump of the mobile terminal equipment (2100, 3100) and the three-way device (2102, 3101) are all in communication with the internal liquid cooling pipeline;

The peripheral device (2200, 3200) includes a driving pump and an external liquid cooling pipeline, and the driving pump of the peripheral device (2200, 3200) communicates with the external liquid cooling pipeline; the peripheral device (2200, 3200) is connected to the external liquid cooling pipeline The mobile terminal equipment (2100, 3100) is detachably connected;

When the peripheral device (2200, 3200) is connected to the mobile terminal device (2100, 3100), the three-way device (2102, 3101) is in a position where the internal liquid cooling pipeline communicates with the external liquid cooling pipeline In the first state, the drive pump of the mobile terminal device (2100, 3100) and/or the drive pump of the peripheral device (2200, 3200) can drive the working fluid between the external liquid cooling pipeline and the internal liquid Circulating flow in cold pipes;

After the peripheral device (2200, 3200) is separated from the mobile terminal device (2100, 3100), the three-way device (2102, 3101) is in a second state in which the internal liquid cooling pipeline is closed, and the mobile The drive pump of the terminal equipment (2100, 3100) can drive the working medium to circulate in the internal liquid cooling pipeline.