JP4285062B2 - Built-in pump - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a built-in pump that is optimally incorporated in an electronic device and is used for circulation of a refrigerant for cooling an electronic component, fuel circulation of a fuel cell, and the like.
[0002]
[Prior art]
The speeding up of processing in electronic devices in recent years has been extremely rapid, and the clock frequency of the CPU has become much larger than before. For this reason, a method of cooling LSI etc. by circulating a refrigerant inside has been studied. In addition, fuel cells, which have been developed in recent years, have been increasingly miniaturized year by year, and are being considered for incorporation in notebook personal computers, portable information terminals (hereinafter referred to as “PDAs”), and the like.
[0003]
A small built-in pump is often used to circulate the refrigerant used for such cooling or the fuel of the fuel cell. By incorporating a miniaturized pump inside the electronic device, circulation of the refrigerant and fuel inside the electronic device has been realized (for example, Patent Document 1).
[0004]
At this time, in mounting the built-in pump on the electronic device, the built-in pump main body is first fixed to the housing or the like. Next, in order to supply an electric signal to a motor stator built in the built-in pump, a flexible tape or a lead wire is pulled out from the built-in pump. The pulled-out flexible tape and lead wire are connected to a processing circuit on the electronic substrate via a connector or the like, and the mounting is performed.
[0005]
FIG. 12 is a mounting diagram of a built-in pump in the prior art.
[0006]
Reference numeral 100 denotes a built-in pump, 101 denotes a flexible tape, 102 denotes a processing circuit, 103 denotes an electronic board, 104 denotes a part of a housing, 105 denotes a connector, and 106 denotes a board pattern.
[0007]
The built-in pump 100 is fixed to a part 104 of the housing. In fixing, an adhesive, welding, screwing, or the like is used. The flexible tape 101 is electrically connected to a motor stator built in the built-in pump 100 to supply power, control signals, etc. to the motor stator, and to transmit a status signal from the motor stator to the processing circuit 102. Used. One side of the flexible tape 101 is inserted into a connector 105 mounted on the electronic substrate 103. The metal terminal of the connector 105 is soldered and mounted on the electronic substrate 103, and the substrate pattern 106 from the metal terminal of the connector 105 is formed on the electronic substrate 103 and connected to the terminal of the processing circuit 102. . As a result, mounting of the built-in pump 100 inside the electronic device is realized, and the electric operation of the built-in pump 100 is realized.
[0008]
[Patent Document 1]
JP-A-7-142886
[0009]
[Problems to be solved by the invention]
However, there is an increasing demand for downsizing and cost reduction in recent electronic devices. For this reason, miniaturization and high-density mounting of various electronic components are progressing more and more. Under such circumstances, there is an increasing demand for mounting efficiency of a built-in pump that circulates refrigerant and the like.
[0010]
Under such circumstances, the conventional method of mounting a lead wire or flexible tape via a connector has a problem of requiring an extra mounting area. In addition, since the built-in pump is connected to the electronic substrate via a lead wire or the like, these configurations and components prevent high-density mounting, resulting in a number of problems that are disadvantageous for electronic devices intended for miniaturization. It was. Furthermore, extra parts costs such as lead wires and connectors are also generated.
[0011]
In addition, the built-in pump often requires a higher voltage than other LSI components such as processing circuits, which may cause the signal flowing through the lead wire to generate noise on the electronic board. The problem is likely to occur. Or lead wires or flexible tape may bend in the electronic equipment and touch the surface of the housing, causing noise and ripples in the housing and changing its ground level, causing malfunctions and failures of each electronic component. There was also a problem.
[0012]
Accordingly, an object of the present invention is to provide a built-in pump that can be mounted while maintaining a reduction in size, thickness, and cost of electronic devices.
[0013]
[Means for Solving the Problems]
In order to solve the above problems, an impeller in which a large number of blades are formed on the outer periphery and a magnet rotor is provided on the inner periphery, a shaft that supports the impeller, a motor stator that is inserted on the inner periphery side of the magnet rotor, A built-in pump having a suction port, a discharge port, and a casing, wherein a metal terminal provided in the built-in pump is directly mounted on an electronic board.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
  The invention according to claim 1 of the present invention is a built-in pump having a circulating means for circulating fluid, a suction port for sucking fluid into the circulating means, a discharge port for discharging fluid to the outside of the circulating means, and a casing. The metal terminal provided in the built-in pump is directly mounted on the electronic board.Is a thingThe pump for incorporation can be incorporated without adversely affecting the performance of the electronic device while maintaining the downsizing and cost reduction of the electronic device.
  Also, a vibration absorbing plate is installed in an empty space inside the metal terminal provided on the outer peripheral end side of the bottom surface of the built-in pump, and the casing is in contact with the surface of the electronic substrate through the vibration absorbing plate. The vibration generated by the built-in pump can be prevented from adversely affecting other components on the electronic board.
[0015]
  According to a second aspect of the present invention, there is provided an impeller in which a large number of blades are formed on the outer periphery and a magnet rotor is provided on the inner periphery, a shaft that supports the impeller, and a motor stator that applies a rotational force to the magnet rotor. A pump for incorporation having a casing provided with a suction port for sucking fluid, a discharge port for discharging fluid, and a metal terminal for supplying an electric signal to the motor stator, the metal terminal provided on the casing being attached to the electronic substrate Characterized by direct implementationIs a thingThe pump for incorporation can be incorporated without adversely affecting the performance of the electronic device while maintaining the downsizing and cost reduction of the electronic device.
  Also, a vibration absorbing plate is installed in an empty space inside the metal terminal provided on the outer peripheral end side of the bottom surface of the built-in pump, and the casing is in contact with the surface of the electronic substrate through the vibration absorbing plate. The vibration generated by the built-in pump can be prevented from adversely affecting other components on the electronic board.
[0016]
  According to a third aspect of the present invention, there is provided an impeller in which a large number of blades are formed on the outer periphery and a magnet rotor is provided on the inner periphery, a shaft that supports the impeller, a rotational force is applied to the magnet rotor, and an electric signal A motor stator provided with a metal terminal for supplying air, a separation plate that hermetically partitions the impeller and the motor stator, a suction port for sucking fluid, a discharge port for discharging fluid, and a built-in pump having a casing The metal terminals provided on the motor stator are directly mounted on the electronic board.Is a thingThe pump for incorporation can be incorporated without adversely affecting the performance of the electronic device while maintaining the downsizing and cost reduction of the electronic device.
  Also, a vibration absorbing plate is installed in an empty space inside the metal terminal provided on the outer peripheral end side of the bottom surface of the built-in pump, and the casing is in contact with the surface of the electronic substrate through the vibration absorbing plate. The vibration generated by the built-in pump can be prevented from adversely affecting other components on the electronic board.
[0017]
The invention according to claim 4 of the present invention is characterized in that, after the metal terminals provided on the motor stator are directly mounted on the electronic board, the parts other than the motor stator are mounted. Therefore, it is possible to incorporate the pump for incorporation without adversely affecting the performance of the electronic device while maintaining the reduction in size and cost of the electronic device.
[0020]
  Claims of the invention5The invention described in claim 14A socket having a size, a shape, and a thickness for housing the built-in pump according to any one of the above, and having a terminal terminal corresponding to a metal terminal provided in either the casing or the motor stator is directly mounted on the electronic board. A pump for installation characterized by being electrically mounted by being inserted into the socket, and is installed without adversely affecting the performance of the electronic device while maintaining the downsizing and cost reduction of the electronic device. The pump can be installed very easily.
[0021]
  Claims of the invention6The invention according to claim 1, wherein the socket has a vibration absorbing function.5It is possible to avoid the vibration generated by the built-in pump from adversely affecting other components on the electronic board.
[0022]
  Claims of the invention7The invention according to claim 1, wherein the metal terminal is a ball bump terminal, and is soldered and directly mounted on a terminal land made of a metal film provided on the surface of the electronic substrate.6Any one of the built-in pumps can be directly mounted on an electronic board.
[0023]
  Claims of the invention8The invention according to claim 1, wherein the metal terminal is a pin grid terminal, and the pin grid terminal is inserted into a via hole provided in an electronic board and soldered, and directly mounted.6Any one of the built-in pumps can be directly mounted on an electronic board.
[0024]
  Claims of the invention9In the invention described in the above, when the length of the built-in pump is L1, the width is L2, and the thickness is L3, the size of the built-in pump is:
5.0mm ≦ L1 ≦ 30.0mm
5.0mm ≦ L2 ≦ 30.0mm
5.0mm ≦ L3 ≦ 20.0mm
1 to 3, characterized in that8Any one of the built-in pumps has an effect of further promoting the downsizing of the electronic device.
[0025]
  Claims of the invention10The invention according to claim 1, wherein a conduit is connected to the suction port and the discharge port.9In any one of the built-in pumps, it is possible to avoid the difficulty in connecting the conduits constituting the circulation path after mounting.
[0026]
  Claims of the invention11The invention described in claim 110A pump for mounting directly mounted on an electronic board as set forth in any one of the above-mentioned pumps is sealed with a resin mold, and causes liquid leakage from the pump for mounting to other electronic components. This can avoid this and increase the durability of the electronic device.
[0027]
  Claims of the invention12The invention described in claim 111It is a pump module characterized in that any one of the built-in pumps is directly mounted on an electronic board, and the incorporation of the built-in pump into an electronic device can be facilitated.
[0028]
  Claims of the invention13The invention described in claim 3Or4. A pump module characterized in that the motor stator provided with the metal terminals described in 4 is directly mounted on an electronic board, which facilitates the incorporation of a pump for incorporation into an electronic device, and increases the flexibility of incorporation. Can be increased.
[0029]
  Claims of the invention14The invention according to claim 1, wherein a plurality of motor stators provided with metal terminals are directly mounted on an electronic board.13It is a pump module as described in above, Comprising: The mounting pump of the size desired by the user who mounts can be integrated flexibly later.
[0030]
  Claims of the invention15The invention described in (1) includes an impeller having a plurality of blades formed on the outer periphery and a magnet rotor provided on the inner periphery, a shaft supporting the impeller, a suction port for sucking fluid, a discharge port for discharging fluid, and a casing. And claims13 or 14A mechanism module that is combined with a motor stator directly mounted on an electronic board as described in the above, and constitutes a built-in pump. Can be incorporated.
[0031]
  Claims of the invention16The invention described in claim12An electronic device characterized by having a pump module, a processing device, a man-machine interface, and a housing for storing them, as described above, and reducing the size and cost of the electronic device incorporating the pump for incorporation. Can be realized.
[0032]
  Claims of the invention17The invention described in claim 1, wherein the electronic device is a notebook personal computer.16It is possible to achieve downsizing and cost reduction of the notebook personal computer in which the built-in pump is incorporated.
[0033]
  Claims of the invention18The invention described in claim 1 is characterized in that the electronic device is a PDA (Personal Digital Assistant).16It is possible to achieve a reduction in size and cost of a PDA in which the pump for incorporation is incorporated.
[0034]
  Claims of the invention19The invention described in claim12A fuel cell characterized by having a pump module, a power supply terminal, a fuel tank, and a housing for storing them, and realizing a reduction in size and cost of the fuel cell in which the pump for incorporation is incorporated can do.
[0035]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0036]
Here, in this specification, a vortex pump (also referred to as a Wesco pump, a regeneration pump, or a friction pump) is described as an example of the fluid circulation means, but the same applies to a centrifugal pump. The same applies to other pumps such as a compression pump.
[0037]
Further, the fluid circulation means is described as an example in which the fluid circulation means is constituted by an impeller, a magnet rotor, a motor stator, and the like.
[0038]
(Embodiment 1)
FIG. 1 is an exploded view of a built-in pump according to Embodiment 1 of the present invention. 1 is a casing, 2 is a suction port, 3 is a discharge port, 4 is an impeller, 5 is a blade, and is provided on the outer periphery of the impeller 4. 6 is a pump chamber, 7 is a shaft, 8 is a separation plate, 9 is a motor stator, and 10 is a metal terminal.
[0039]
As the material of the casing 1, it is appropriate to select a metal material such as copper or aluminum or a synthetic resin for weight reduction. The suction port 2 and the discharge port 3 may be bonded or fitted to the casing 1 after being formed separately, or may be formed integrally with the casing 1. Further, it may be formed of the same material as that of the casing 1, or it is also preferable to use a lightweight plastic or the like for the suction port 2 and the discharge port 3 only for cost and weight reduction. Furthermore, since it may be difficult to connect the circulation path to the short suction port 2 and the discharge port 3 after mounting on the electronic board described later, a conduit as a circulation path is connected in advance. It is also suitable. This conduit may be formed of a resin material or a metal material, similar to the suction port 2 or the like, or may be formed of a rubber tube or the like.
[0040]
A large number of blades 5 are formed on the outer periphery of the impeller 4, and turbulence is caused around the blades 5 by the rotation of the impeller 4. At this time, the water repellent finish is applied to the surface of the blade 5 so that the initial rotation can be made smooth. Although not shown in FIG. 1, a magnet rotor is attached to the inner side of the impeller 4, and a rotational force is generated in the magnet rotor in response to the magnetic field generated by the motor stator 9, which rotates together with the impeller 4. Will do.
[0041]
The pump chamber 6 is a region in which the refrigerant and fuel flowing in from the suction port 2 are taken in, and the circulation of the refrigerant and fuel is generated by the turbulent flow generated inside the pump chamber 6.
[0042]
The shaft 7 is for supporting the impeller 4 and has a diameter and strength balanced with the stress generated in the impeller 4. The separation plate 8 is for airtightly separating the mechanical region where the pump chamber 6 and the impeller 4 in which a liquid such as refrigerant and fuel circulates and the electrically connected motor stator 9 are separated. This prevents liquid from adhering to the motor stator 9 which is an electric member. Thereby, failure of the motor stator 9 is prevented. As shown in FIG. 1, the separation plate 8 may be formed separately from the casing 1 and may be integrated later by screwing, bonding, fitting, or the like, or may be formed integrally with the casing 1 in advance.
[0043]
In addition, a space for inserting the motor stator 9 is formed inside the separation plate 8. After the motor stator 9 is assembled into the separation plate 8, an assembling pump is configured together with the casing 1 and the like. Of course, the motor stator 9 including the motor stator 9 may be stored in the casing 1, and after the motor stator 9 is stored in a space inside the separation plate, a cover may be provided on the bottom surface thereof. In this case, there are advantages such as improvement in strength and durability. Further, the motor stator 9 may be inserted inside the magnet rotor without the separation plate 8.
[0044]
Although the metal terminal 10 is connected to the motor stator 9 in FIG. 1, the metal terminal 10 may be drawn out after being internally connected to the motor stator 9 and formed on the bottom surface of the casing 1. Or the metal terminal 10 may be formed in the side surface of the casing 1 as a lead terminal. Further, when a cover is provided on the bottom surface of the motor stator 9, the metal terminal 10 is provided on the bottom surface of the cover and used for mounting on the electronic substrate. The metal terminal 10 is provided to give an electric signal to the motor stator 9, and if it has a pin grid shape, it is inserted into a via hole provided in the electronic substrate and then mounted by soldering or the like. Or if it is a ball-bump shape, it will board-mount by the surface mounting soldered to the terminal land provided in the electronic substrate surface. Or if it is a lead terminal, it will be board-mounted by the surface mounting soldered to the electrode pad provided in the electronic board.
[0045]
Next, the operation of this built-in pump will be described. Refrigerant and fuel are sucked from the suction port 2 and flow into the pump chamber 6. When an electric signal is applied to the motor stator 9, an electric field and a magnetic field are generated in the winding. In response to the generated magnetic field, a repulsive force is generated in the magnet rotor attached to the inside of the impeller 4, and this repulsive force is connected to a rotating operation, and the magnet rotor starts rotating. Since the magnet rotor is fixed to the impeller 4, as a result, the impeller 4 also starts rotating. At this time, it is also possible to switch the speed and intensity of the rotating operation according to the strength of the applied electric signal and the pulse pattern. Since the impeller 4 rotates inside the pump chamber 6, a turbulent flow is caused and refrigerant and fuel circulate inside the pump chamber 6. The refrigerant and fuel circulated in the pump chamber 6 are eventually discharged from the discharge port 3 to the outside. The discharged refrigerant and fuel are circulated in a circulation path (not shown) connecting the suction port 2 and the discharge port 3, and the refrigerant and fuel are circulated by the built-in pump.
[0046]
If the electronic device incorporating the built-in pump is a notebook personal computer, PDA or the like, and its purpose is cooling of the heat-generating electronic components, the purpose is to circulate the refrigerant, and if it is a fuel cell battery, the fuel for the fuel cell Is the purpose of circulation.
[0047]
FIG. 2 is a cross-sectional view of the built-in pump according to Embodiment 1 of the present invention. Reference numeral 11 denotes a magnet rotor which is attached and fixed inside the impeller 4. The rotating operation of the impeller 4 is realized by this magnet rotor.
[0048]
Next, direct mounting of the built-in pump on the electronic board will be described.
[0049]
FIG. 3 is a mounting diagram of the built-in pump according to the first embodiment of the present invention. The case where the built-in pump described in FIGS. 1 and 2 is directly mounted on the electronic board is shown.
[0050]
Reference numeral 12 denotes a built-in pump, 13 an electronic board, 14 a solder land, 15 a fixed screw, and 16 a processing circuit. The built-in pump 12 is first physically fixed to the electronic board 13 by a fixing screw 15. Next, the metal terminals 10 provided on the bottom surface of the motor stator 9 or the casing 1 are inserted into vias provided on the electronic board 13, fixed by solder lands 14, and electrically connected to realize direct mounting. A substrate pattern is formed in the via to which the metal terminal 10 is connected, and electrical connection with the signal line of the processing circuit 16 is realized by the substrate pattern. Of course, when a sufficient fixing strength can be obtained only by the solder connection of the metal terminal 10, the fixing pump 12 does not need to be fixed by the fixing screw 15.
[0051]
Although the pin grid type terminal has been described as an example of the metal terminal 10, a terminal such as a ball bump terminal or a lead terminal may be used. In the case of a ball bump terminal, mounting on the electronic substrate 13 is realized by soldering with a solder land 14 provided on the surface of the electronic substrate 13. In the case of a lead terminal, mounting on the electronic substrate 13 is realized by solder connection with an electrode pad provided on the surface of the electronic substrate 13.
[0052]
Further, as the size of the built-in pump 12, when the vertical length is L1, the horizontal length is L2, and the thickness is L3,
5.0mm ≦ L1 ≦ 30.0mm
5.0mm ≦ L2 ≦ 30.0mm
5.0mm ≦ L3 ≦ 20.0mm
In many cases, a small-sized pump such as a so-called 20 mm square, 10 mm square, and 5 mm square is used. As electronic devices become smaller and smaller year by year, the built-in pump 12 becomes smaller and the smaller the built-in pump 12 is mounted on the electronic board 13 in order to achieve further miniaturization. This is because it is important to be directly mounted.
[0053]
4 (a) and 4 (b) are mounting diagrams of the built-in pump according to the first embodiment of the present invention. FIG. 4 (a) shows a case where mounting is performed with ball bump terminals. 4 (b) shows a case where it is mounted with lead terminals. Reference numeral 17 denotes a ball bump terminal, and reference numeral 18 denotes a solder land, which is provided on the surface of the electronic substrate 13 so as to be in the same position as the ball bump terminal 17. When heat is applied to the ball bump terminal 17 and the solder land 18, each is melted and connected. Gold, silver, or the like is used as the ball bump terminal 17. Alternatively, a non-conductive cover may be provided in the periphery, and the non-conductive cover may be broken by contact pressure with the solder land 18 so that the internal conductive portion and the solder land 18 are electrically connected.
[0054]
19 is a lead terminal, and 20 is an electrode pad. The lead terminal 19 is similar to a terminal of an LSI package called QFP. Mounting is realized by soldering to an electrode pad 20 provided so as to be at the same position as the lead terminal 19.
[0055]
Note that the metal terminal 10 may be a pin grid terminal, a ball bump terminal, a lead terminal, or the number of terminals corresponding to the number of necessary signals, which increases the fixing strength at the time of mounting. In order to achieve this, an extra connection terminal to the ground or the power supply may be provided.
[0056]
FIG. 5 is a mounting diagram of the built-in pump according to the first embodiment of the present invention, and is a diagram showing the electronic substrate 13 from a perspective direction. Reference numeral 21 denotes a substrate pattern, which connects the metal terminal of the built-in pump 12 and the signal terminal of the processing circuit 16 to realize electrical connection. It is also preferable to seal with a mold resin in order to prevent liquid leakage such as refrigerant from the built-in pump 12 from adversely affecting other electronic components on the electronic substrate 13. In this case, there is a merit that the durability of the built-in pump 12 is improved.
[0057]
FIG. 6 is a mounting diagram of the built-in pump according to the first embodiment of the present invention. First, the motor stator 9 including the metal terminals 10 is mounted on the electronic board 13, and then mechanical components such as the impeller 4 and the casing 1 are mounted. The case where it is mounted is shown. Reference numeral 22 denotes a fixing hole, which is a part for fixing a screw or the like for physically fixing the built-in pump 12. This is not necessary when the fixing strength is sufficient.
[0058]
The motor stator 9 is an electrical component that is wound and supplied with an electrical signal, and the casing 1 and the impeller 4 are mechanical components that are not electrically connected. The motor stator 9 that is an electrical component, the impeller 4 that is a mechanical component, and the like are hermetically partitioned by the separation plate 8, and thus can be easily formed individually. For this reason, as shown in FIG. 6, first, the metal terminals 10 provided on the motor stator 9 which is an electrical component are mounted on the electronic board 13 with solder or the like, and then the remaining mechanical components such as the separation plate 8 are sequentially fitted. The built-in pump 12 is directly mounted on the electronic board 13. This is because such mounting may be performed in accordance with the mounting procedure of electronic equipment and the status of parts distribution. Of course, the mechanism portion from the casing 1 to the separation plate 8 may be configured as one mechanism module in advance, and this mechanism module may be fitted and mounted on the motor stator 9 mounted on the electronic board 13.
[0059]
Note that a pump module in which only the motor stator 9 is mounted on the electronic substrate 13 and a mechanism module made up of mechanism parts such as the casing 1 and the impeller 4 may be configured separately and each may be provided as a separate part. In this case, there is an advantage that the flexibility of mounting various components inside the electronic device is further increased.
[0060]
FIG. 7 is a perspective view of the pump module according to Embodiment 1 of the present invention. Only the motor stator 9 is a pump module mounted on the electronic board 13, and a user who performs the mounting can retrofit the mechanism module. Of course, it may be a pump module in which the built-in pump 12 is directly mounted in advance, and by providing these mounted pump modules, the incorporation into the electronic device becomes easy.
[0061]
  FIG. 8 is a perspective view of the pump module and the mechanism module according to Embodiment 1 of the present invention. In FIG.substrate13 shows a pump module in which a plurality of motor stators of different sizes are mounted.
[0062]
Reference numerals 9a, 9b, and 9c denote motor stators having different sizes and different conditions such as the number of windings. For this reason, it is possible to vary the size of the impeller that can be rotated by the motor stators 9a, 9b, and 9c, and it is also possible to vary the rotational ability.
[0063]
Reference numerals 23a, 23b, and 23c are mechanism modules including mechanism portions such as the impeller 4 and the separation plate 8, and the size, shape, and number of blades of the impeller 4 are different. By mounting these mechanism modules 23a, 23b, 23c by fitting them to the motor stators 9a, 9b, 9c, mounting of a plurality of built-in pumps is realized. Alternatively, it is possible to improve the flexibility of incorporating a pump for incorporation into an electronic device by selecting and implementing only a mechanism module having a size desired by the user performing the mounting from among mechanism modules of different sizes. There is a merit that can be done. For example, when a user wants to incorporate a large-sized built-in pump, a mechanism module 23c that fits the largest 9c of the mounted motor stators may be selected and mounted.
[0064]
FIG. 9 is a bottom view of the built-in pump according to the first embodiment of the present invention. It is the figure seen from the bottom face which contacts when mounting pump 12 with electronic substrate 13.
[0065]
Reference numeral 24 denotes a bottom surface of the built-in pump 12, and reference numeral 25 denotes a vibration absorbing plate. The metal terminal 10 is provided on the outer peripheral end side of the bottom surface 24. The metal terminal 10 is mounted on an electronic substrate 13 not shown in FIG. 9 by being electrically connected to a terminal land or the like provided at the same position as the metal terminal 10 by soldering or the like.
[0066]
When the built-in pump 12 is directly mounted on the electronic board 13, the vibration generated from the impeller 4 or the like may be transmitted to the electronic board 13 because it is directly installed on the surface of the electronic board 13. When such vibration is conducted to the electronic substrate 13, the performance of other electronic components mounted on the electronic substrate 13 is deteriorated, or vibration is accumulated in the solder connection portion, resulting in problems such as cracking. It may be caused. For this reason, the vibration absorbing plate 25 is installed in a space inside the metal terminal 10 and mounted by being sandwiched between the electronic board 13 and the built-in pump 12 so that vibration is not transmitted to the electronic board 13. To do. The vibration absorbing plate 25 is preferably made of a material that easily absorbs vibration, such as a rubber sheet. The thickness of the vibration absorbing plate 25 is substantially the same as the thickness of the metal terminal, so In this case, an extra gap is not generated, and the mounting thickness is not increased. Thus, by mounting the vibration absorbing plate 25 between the built-in pump 12 and the electronic substrate 13, adverse effects such as malfunctions and mounting deterioration of other electronic components can be avoided. For this reason, it is important to secure the installation space for the vibration absorbing plate 25 by installing the metal terminal 10 on the outer peripheral end side of the bottom surface 24.
[0067]
  The same effect can be obtained by installing the metal terminal 10 near the center and mounting the vibration absorbing plate 25 at a portion other than the vicinity of the center. At this time, the electronic substrate 13 connected to the metal terminal 10substratePattern on electronic board13Is preferably formed on the back surface or the inner layer because the vibration absorbing plate 25 is not in direct contact with the substrate pattern.
[0068]
Further, when the metal terminal 10 is provided on the motor stator 9, the metal terminal 10 is pulled out from the motor stator 9 so as to be installed on the outer peripheral side of the bottom surface of the built-in pump 12. A similar effect can also be obtained by providing the vibration absorbing plate 25 on the electronic board and mounting it on the electronic board.
[0069]
FIG. 10 is a mounting diagram of the built-in pump according to the first embodiment of the present invention. A socket having a shape and size suitable for storing the built-in pump 12 is mounted on the electronic board 13 in advance, and the built-in pump 12 is fitted into this socket, thereby realizing direct mounting on the board. It is expressed.
[0070]
Reference numeral 26 denotes a socket, and a terminal land is provided in the socket 26 at the same position as the metal terminal 10 provided on the bottom surface of the built-in pump 12. Further, a fixing claw or the like is provided so that the mounting pump 12 is fixed to the socket 26, and the mounting pump 12 inserted into the socket 26 is fixed by the pressure of the claw or the like.
[0071]
By previously mounting the socket 26 in this way, the built-in pump 12 can be mounted on the electronic board later, and the mounting flexibility is increased. Further, there is an advantage that when the built-in pump 12 is broken, it can be replaced without replacing the electronic board 13.
[0072]
As described above, by directly mounting the built-in pump on the electronic substrate 13 by various methods, it is possible to reduce the cost of extra parts such as lead wires and flexible tape that have been conventionally required, and to reduce the mounting area. Furthermore, problems such as malfunctions and noise caused by flexible tape and the like are also eliminated.
[0073]
In addition, the pump module in which the pump 12 for mounting or the pump module in which only the motor stator 9 is mounted can be easily incorporated into an electronic device, and there are advantages such as improvement in mounting efficiency.
[0074]
(Embodiment 2)
FIG. 11 is a configuration diagram of an electronic device according to the second embodiment of the present invention.
[0075]
Reference numeral 30 denotes an electronic device, and a notebook personal computer is shown as an example of the electronic device. Reference numeral 31 denotes a first housing, 32 denotes an electronic substrate, 33 denotes a built-in pump, 34 denotes a second housing, 35 denotes a display surface, and 36 denotes a circulation path.
[0076]
In the electronic device 30, for example, a case where the refrigerant is circulated by the built-in pump 33 is shown for cooling a heat generating electronic component that generates heat by high-speed operation. The built-in pump 33 is directly mounted on the electronic board 32 as described in the first embodiment. By incorporating the built-in pump 33 directly mounted on the electronic substrate 32 into the electronic device 30, it is possible to reduce extra parts such as conventional lead wires and flexible tape, thereby reducing costs and downsizing the electronic device. .
[0077]
The built-in pump 33 sucks the refrigerant from the suction port, circulates the refrigerant by the rotation of the internal impeller, and discharges it from the discharge port. The discharged refrigerant circulates in the circulation path 36, returns to the suction port again, flows again into the built-in pump 33 from the suction port, and the refrigerant is circulated. For example, when a heat receiving surface is formed on the bottom surface of the built-in pump 33 and a heat generating electronic component is in contact with the heat receiving surface, the heat generated by the heat generating electronic component is received by the heat receiving surface, and the temperature-increased refrigerant circulates. Circulate through path 36. By providing a heat radiating portion or the like in the circulation path 36, the heat received by the refrigerant is dissipated, and the temperature of the refrigerant decreases again. The refrigerant whose temperature has fallen flows into the built-in pump 33 and takes heat again from the heat generating electronic component, so that the temperature of the heat generating electronic component can be kept below a certain level.
[0078]
In FIG. 11, a notebook personal computer has been described as an example of an electronic device. However, a portable terminal such as a PDA may be used, and a built-in pump 33 for cooling a heat generating electronic component inside the electronic device may be incorporated. Thus, a reduction in mounting area and cost can be realized in the same manner.
[0079]
Furthermore, when a fuel cell, which will be important for environmental measures in the future, is incorporated into an electronic device, a fuel cell-type battery also needs a built-in pump for fuel circulation. Even when used in this fuel cell, the built-in pump can be directly mounted on a substrate as described in the first embodiment, or a pump module mounted on an electronic substrate in advance can be reduced in size. A built-in pump can be incorporated while maintaining a low cost.
[0080]
【The invention's effect】
As described above, the built-in pump according to the present invention is directly mounted on the electronic substrate, so that unnecessary parts such as lead wires and flexible tape, which have been conventionally required, are unnecessary, and the cost can be reduced.
[0081]
In addition, since the extra parts can be reduced, the mounting area can be reduced, and the electronic device can be reduced in size.
[0082]
In addition, problems such as malfunctions and performance degradation of other electronic components can be eliminated by noise generated by conventional lead wires and flexible tapes, etc., further reducing the size and improving the performance of electronic devices. There is an effect.
[0083]
In addition, the metal terminal arrangement of the built-in pump is concentrated on a fixed part such as the outer peripheral end side, and a space is provided in the other part, and a vibration absorbing plate is installed and mounted in the space. It is possible to directly mount the built-in pump on the electronic board while maintaining the above, and further, there is an effect of not causing performance deterioration or mounting breakage due to vibration generated by the built-in pump.
[0084]
Furthermore, by providing a pump module in which a built-in pump is directly mounted on an electronic board in advance, it is possible to facilitate incorporation into an electronic device. Furthermore, by providing a pump module in which only the motor stator is directly mounted on the electronic board, only the mechanism portion can be mounted later, and the mounting flexibility is improved.
[0085]
In addition, by incorporating a built-in pump mounted directly on these electronic boards, effective refrigerant and fuel circulation in electronic devices and fuel cells can be realized, and downsizing of electronic devices can be realized. It becomes.
[Brief description of the drawings]
FIG. 1 is an exploded view of a built-in pump according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a built-in pump according to Embodiment 1 of the present invention.
FIG. 3 is a mounting diagram of a built-in pump according to the first embodiment of the present invention.
4A is a mounting diagram of a built-in pump according to the first embodiment of the present invention. FIG.
(B) Mounting diagram of the built-in pump according to the first embodiment of the present invention
FIG. 5 is a mounting diagram of a built-in pump according to the first embodiment of the present invention.
FIG. 6 is a mounting diagram of the built-in pump according to the first embodiment of the present invention.
FIG. 7 is a perspective view of a pump module according to Embodiment 1 of the present invention.
FIG. 8 is a perspective view of a pump module and a mechanism module according to Embodiment 1 of the present invention.
FIG. 9 is a bottom view of the built-in pump according to the first embodiment of the present invention.
FIG. 10 is a mounting diagram of a built-in pump according to the first embodiment of the present invention.
FIG. 11 is a configuration diagram of an electronic device according to a second embodiment of the present invention.
FIG. 12 is a mounting diagram of a built-in pump in the prior art.
[Explanation of symbols]
1 casing
2 Suction port
3 Discharge port
4 impeller
5 feathers
6 Pump room
7 axes
8 Separation plate
9 Motor stator
10 Metal terminal
11 Magnet rotor
12 Built-in pump
13 Electronic board
14, 18 Solder Land
15 Fixing screw
16 Processing circuit
17 Ball bump terminal
19 Lead terminal
20 electrode pads
21 Substrate pattern
22 fixing holes
23a, 23b, 23c Mechanism module
24 Bottom
25 Vibration absorber
26 Socket
30 Electronic equipment
31 First housing
32 Electronic board
33 Built-in pump
34 Second housing
35 Display surface
36 Circuit
100 Built-in pump
101 flexible tape
102 Processing circuit
103 Electronic board
104 Part of the enclosure
105 connector
106 Substrate pattern

Claims (19)

A circulation means for circulating the fluid;
A suction port for sucking fluid into the circulation means;
A discharge port for discharging fluid out of the circulation means;
A built-in pump having a casing,
The metal terminal provided in the pump for incorporation is directly mounted on the electronic board ,
The metal terminal is provided on the outer peripheral end of the bottom surface of the built-in pump, a vibration absorbing plate is installed in an empty space inside the metal terminal, and the casing is in contact with the surface of the electronic substrate through the vibration absorbing plate. As a result, the pump for mounting is characterized in that it is directly mounted on an electronic board . An impeller having a large number of blades formed on the outer periphery and a magnet rotor provided on the inner periphery;
A shaft that supports the impeller;
A motor stator for applying a rotational force to the magnet rotor;
A suction port for sucking fluid;
A discharge port for discharging fluid;
A built-in pump having a casing provided with a metal terminal for supplying an electric signal to the motor stator,
The metal terminal provided in the casing is directly mounted on the electronic board ,
The metal terminal is provided on the outer peripheral end of the bottom surface of the built-in pump, a vibration absorbing plate is installed in an empty space inside the metal terminal, and the casing is in contact with the surface of the electronic substrate through the vibration absorbing plate. As a result, the pump for mounting is characterized in that it is directly mounted on an electronic board . An impeller having a large number of blades formed on the outer periphery and a magnet rotor provided on the inner periphery;
A shaft that supports the impeller;
A motor stator provided with metal terminals for applying a rotational force to the magnet rotor and supplying an electrical signal;
A separating plate that hermetically partitions the impeller and the motor stator;
A suction port for sucking fluid;
A discharge port for discharging fluid;
A built-in pump having a casing,
The metal terminal provided on the motor stator is directly mounted on the electronic board ,
The metal terminal is provided on the outer peripheral end of the bottom surface of the built-in pump, a vibration absorbing plate is installed in an empty space inside the metal terminal, and the casing is in contact with the surface of the electronic substrate through the vibration absorbing plate. As a result, the pump for mounting is characterized in that it is directly mounted on an electronic board . 4. The built-in pump according to claim 3, wherein a metal terminal provided on the motor stator is directly mounted on an electronic board, and then a part other than the motor stator is mounted. A socket having a size, shape, and thickness for housing the pump for incorporation according to any one of claims 1 to 4, and having a terminal receiver corresponding to a metal terminal provided in either the casing or the motor stator is an electronic device. A built-in pump that is mounted directly on a substrate and electrically mounted by being inserted into the socket. The built-in pump according to claim 5 , wherein the socket has a vibration absorbing function. A said metal terminal ball bump terminals, for incorporation of claim 1-6 or 1, wherein a is directly mounted is soldered to the terminal lands made of a metal film provided on the electronic substrate surface pump. The assembly according to any one of claims 1 to 6, wherein the metal terminal is a pin grid terminal, and the pin grid terminal is inserted into a via hole provided in an electronic substrate and soldered directly. Pump. When the length of the built-in pump is L1, the width is L2, and the thickness is L3, the size of the built-in pump is:
5.0mm ≦ L1 ≦ 30.0mm
5.0mm ≦ L2 ≦ 30.0mm
5.0mm ≦ L3 ≦ 20.0mm
And characterized in that, according to claim 1-8 or 1 embedded pump according. The suction port and, according to claim 1-9 or 1 embedded pump, wherein the conduit to the discharge port is connected. Embedded pump directly implemented built pump electronic board according to claim 1-10 or 1, wherein is equal to or sealed with the resin mold. A pump module, wherein the built-in pump according to any one of claims 1 to 11 is directly mounted on an electronic board. Pump module, characterized in that the motor stator in which a metal terminal according to claim 3 or 4 is provided is directly mounted on an electronic board. The pump module according to claim 13 , wherein a plurality of motor stators provided with the metal terminals are directly mounted on an electronic board. An impeller having a large number of blades formed on the outer periphery and a magnet rotor provided on the inner periphery;
A shaft that supports the impeller;
A suction port for sucking fluid;
A discharge port for discharging fluid;
15. A mechanism module comprising a casing and comprising a built-in pump by being combined with a motor stator mounted directly on an electronic board according to claim 13 or 14 . A pump module according to claim 12 ;
A processing device;
A man-machine interface,
An electronic device comprising a housing for storing these. The electronic device according to claim 16 , wherein the electronic device is a notebook personal computer. The electronic device according to claim 16 , wherein the electronic device is a PDA (Personal Digital Assistant). A pump module according to claim 12 ;
A power terminal;
A fuel tank,
A fuel cell comprising a housing for storing these.

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