CN215268461U - Heat dissipation device and camera - Google Patents

Abstract

The patent refers to the field of 'pictorial communication,'. The heat dissipation device comprises an airflow generating assembly and a silencing assembly. The airflow generation assembly is used for generating heat dissipation airflow and comprises a connecting part, an air supply part and an air inlet part arranged opposite to the air supply part, and the connecting part is used for being connected with the casing and enabling the air supply part to face the casing. At least part of the silencing assembly is arranged at the air inlet part of the airflow generating assembly, so that at least part of the air inlet part can intake air through the silencing assembly. The heat dissipation device can reduce the operation noise; the heat dissipation structure is applied to the camera, so that the heat dissipation efficiency of the camera can be improved, and the noise generated when the camera is used can be reduced.

Description

Heat dissipation device and camera

Technical Field

The present disclosure relates to the field of electronic devices, and in particular, to a heat dissipation device and a camera.

Background

At present, a camera is widely used for hand-held shooting, aerial shooting, monitoring and the like as an image acquisition device. In order to satisfy more shooting functions of users, more electronic devices are often required to be integrated. Meanwhile, the requirement of miniaturization development of the camera is met, so that the space inside the camera is more and more compact; the increase of electronic devices causes more and more heat to be generated when the camera is used, so that the heat dissipation efficiency of the camera needs to be improved continuously.

Most cameras improve the heat dissipation efficiency of the camera by integrating a heat dissipation fan. However, the use of the heat dissipation fan causes a large noise when the camera is used.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a heat dissipation device and a camera. The heat dissipation device can reduce the operation noise; the heat dissipation device is applied to the camera, can improve the heat dissipation efficiency of the camera, and is favorable for reducing the noise generated when the camera is used.

The technical scheme is as follows:

according to a first aspect of the embodiments of the present disclosure, there is provided a heat dissipation device, including an airflow generating assembly and a noise reduction assembly; the airflow generating assembly is used for generating heat dissipation airflow and comprises a connecting part, an air supply part and an air inlet part opposite to the air supply part, and the connecting part is used for being connected with the shell and enabling the air supply part to face the shell; at least part of the silencing assembly is arranged at the air inlet part of the airflow generating assembly, so that at least part of the air inlet part can intake air through the silencing assembly.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the heat dissipation device is connected with the shell of the camera through the connecting portion and used for providing heat dissipation airflow for the camera so as to improve the heat dissipation efficiency of the camera. And when the airflow generating assembly acts to generate heat dissipation airflow, because at least part of the air inlet part is used for air inlet through the silencing assembly, the wind noise can be effectively reduced, and the noise generated when the camera is cooled and dissipated by air is further reduced.

The technical solution of the present disclosure is further explained below:

in one embodiment, the sound attenuating assembly includes at least one of sound attenuating cotton or a sound attenuating panel.

In one embodiment, the connecting portion is provided with an elastic layer for elastically abutting against the casing.

In one embodiment, the connecting portion includes a bracket, and the elastic layer is disposed on an outer side wall of the bracket to elastically abut against the housing.

According to a second aspect of the embodiments of the present disclosure, there is also provided a camera, including a housing and the heat dissipation device in any of the embodiments, wherein the airflow generating assembly is disposed on the housing through a connection portion.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

when the camera disclosed by the disclosure is used, the airflow generation assembly can be utilized to generate heat dissipation airflow, the air flow outside and/or inside the camera is disturbed, and air cooling heat dissipation is carried out, so that the heat dissipation efficiency of the camera is improved. Meanwhile, when the airflow generating assembly acts to generate heat dissipation airflow, because at least part of the air inlet part is used for air inlet through the silencing assembly, the wind noise can be effectively reduced, and the noise generated when the camera is used for air cooling heat dissipation is further reduced.

In one embodiment, the housing is provided with a containing cavity, and the airflow generating assembly is arranged in the containing cavity.

In one embodiment, the casing is provided with an air outlet part communicated with the accommodating cavity, and the air outlet part is communicated with the air supply part.

In one embodiment, the camera further includes a base and a rotating member rotatably connected to the base, and the rotating member is fixedly connected to the housing to rotate the housing.

In one embodiment, the camera further comprises a circuit board disposed on the base, the circuit board including heat-generating electronics in thermally conductive engagement with the rotatable member.

In one embodiment, the camera further comprises a thermally conductive gel, and the electronic device is in thermal conductive cooperation with the rotating member through the thermally conductive gel.

In one embodiment, the housing is provided with a containing cavity, the containing cavity is provided with a through hole arranged towards the base, so that the containing cavity and the base are matched to form a protection space, and the airflow generating assembly, the circuit board and the rotating part are arranged in the protection space.

In one embodiment, part of the rotating part is arranged in the accommodating cavity through the through hole, the rotating part is provided with an avoiding cavity, the electronic device is arranged in the avoiding cavity, the airflow generating assembly is arranged outside the avoiding cavity, the rotating part is provided with an air vent communicated with the avoiding cavity, and the air vent is arranged towards the air inlet.

In one embodiment, the camera further comprises a heat dissipation plate disposed on the base.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

Brief description of the drawingsthe accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and are not intended to limit the disclosure.

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic view of a configuration of a camera shown in an embodiment.

Fig. 2 is a partially cut-away schematic view of a camera shown in an embodiment.

Fig. 3 is an enlarged schematic view of a shown in fig. 2.

Fig. 4 is a partial cross-sectional schematic view of a camera shown in another embodiment.

Description of reference numerals:

10. a camera; 100. a housing; 110. an accommodating chamber; 111. a through hole; 120. an air outlet part; 200. a heat sink; 210. an airflow generating assembly; 211. a connecting portion; 201. a support; 212. an air supply part; 213. an air inlet part; 214. an elastic layer; 300. a base; 400. a rotating member; 410. an avoidance cavity; 420. a vent hole; 500. a circuit board; 510. an electronic device; 600. a thermally conductive gel; 700. a heat sink.

Detailed Description

For the purpose of making the purpose, technical solutions and advantages of the present disclosure more apparent, the present disclosure will be described in further detail below with reference to the accompanying drawings and detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the disclosure, are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein in the description of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.

As is known from the background art, the heat generated when the camera is used is increasing due to the miniaturization of the camera and the increase of the internal electronic devices, and thus the heat dissipation efficiency of the camera needs to be improved. In addition, when the camera is used for a long time, if the heat dissipation is not timely, the internal electric elements of the camera are overheated, so that the camera is halted and even damaged. If the camera is used for monitoring video, if the camera is halted or damaged, the monitoring picture is lost within a period of time, which is not beneficial to improving the reliability of camera monitoring.

At present, most cameras adopt a cooling fan to perform air cooling and heat dissipation to improve the heat dissipation efficiency of the camera, but the use of the cooling fan causes the noise of the camera during use to be larger.

Based on this, this disclosure provides a heat abstractor can reduce the running noise through initiative amortization for utilize this heat abstractor to carry out radiating camera, the radiating efficiency is good, and the running noise is low.

For a better understanding of the heat sink of the present disclosure, reference is made to a camera to which the heat sink is applied. The explanation is further carried out by combining the attached drawings.

Fig. 1 to 4 are structural views of a camera and a heat dissipation device thereof in some embodiments. Fig. 1 is a schematic structural diagram of a camera shown in an embodiment. Fig. 2 is a partially cut-away schematic view of a camera shown in an embodiment. Fig. 3 is an enlarged view of a shown in fig. 2, which is also an installation view of the heat dissipation device. FIG. 4 is a schematic partial cross-sectional view of a camera shown in another embodiment

As shown in fig. 1-3, in some embodiments of the present disclosure, a camera 10 is provided that includes a housing 100 and a heat sink 200. The heat dissipation device 200 includes an airflow generating assembly 210 and a noise reduction assembly. The airflow generating assembly 210 is used for generating a heat dissipating airflow, the airflow generating assembly 210 includes a connecting portion 211, an air supplying portion 212, and an air inlet portion 213 disposed opposite to the air supplying portion 212, the connecting portion 211 is connected to the casing 100, so that the airflow generating assembly 210 is fixed to the casing 100, and the air supplying portion 212 is disposed toward the casing 100. At least part of the noise reduction assembly is disposed at the air inlet portion 213 of the airflow generation assembly 210, so that at least part of the air inlet portion 213 is supplied with air through the noise reduction assembly.

When the video camera 10 of the present disclosure is used, the airflow generating assembly 210 may generate a heat dissipating airflow to disturb the air flow outside and/or inside the video camera 10 (for example, the air supply portion 212 is disposed toward the outside of the casing 100, or the airflow generating assembly 210 is disposed inside the casing 100, and the air supply portion 212 may be communicated with the outside, or the air inlet portion 213 may be communicated with the outside), so as to perform air cooling and heat dissipation, thereby improving the heat dissipating efficiency of the video camera 10. Meanwhile, when the airflow generating assembly 210 acts to generate a heat dissipating airflow, since at least part of the air inlet portion 213 is supplied with air through the noise reduction assembly, the wind noise can be effectively reduced, and the noise generated when the camera 10 performs air cooling heat dissipation can be further reduced. The camera 10 of the present disclosure has high heat dissipation efficiency and low operation noise, which is beneficial to ensuring the reliability of the camera 10 for long-term use. Furthermore, the camera 10 of the present disclosure is applied to a monitoring scene, and can effectively ensure the reliability of monitoring camera shooting.

The housing 100 contains at least a lens assembly and may contain electronics and other mounting components commonly used in cameras 10, such as a sensor element (image sensor).

The airflow generating assembly 210 can be implemented in various ways, such as an active heat dissipating device, such as a fan with an axial flow, a bladeless fan, a negative pressure generator, a positive pressure generator, and the like, and a passive heat dissipating structure, such as a heat dissipating fin, integrated on any one of the active heat dissipating devices.

In some embodiments, the airflow generating assembly 210 includes a heat dissipation fan. Further, the conventional heat dissipation fan can be integrated into the camera 10, which is beneficial to reducing the heat dissipation cost while ensuring the heat dissipation efficiency. At this time, the air blowing portion 212 is an air blowing end of the cooling fan, and the air inlet portion 213 is an air inlet end of the cooling fan.

It should be noted that the sound-absorbing component is also called sound-absorbing component, and is provided with at least one of an air inlet, an air inlet channel or an air inlet gap. In some embodiments, the sound attenuating assembly includes at least one of sound attenuating cotton or a sound attenuating panel. Therefore, the noise reduction device can be flexibly selected according to actual needs to meet different noise reduction requirements or installation requirements.

The silencing cotton comprises silencing foam cotton, nano silencing foam cotton and the like.

The sound-absorbing plate comprises a sound-absorbing plate (such as a wood wool sound-absorbing plate) and the like.

As shown in fig. 3, optionally, in some embodiments, the sound attenuation component is a sound attenuation foam, and is disposed to wrap the air inlet 213. Thus, the air inlet portion 213 needs to be ventilated through the silencing cotton, which further reduces the noise generated by the airflow generating assembly 210 and improves the heat dissipation silence of the camera 10.

In addition to any of the above embodiments, as shown in fig. 3, in some embodiments, the connection portion 211 is provided with an elastic layer 214 for elastically abutting against the casing 100. In this way, the elastic layer 214 can absorb and buffer the vibration generated when the airflow generating assembly 210 operates, and thus, the vibration amplitude can be effectively reduced, the noise generated by the airflow generating assembly 210 of the camera 10 can be further reduced, and the silence of the camera 10 can be further improved.

Furthermore, it can be understood that the provision of the elastic layer 214 can effectively fill the gap between the connection portion 211 and the housing 100 due to manufacturing errors and/or assembly errors, and not only can improve the reliability of the connection between the airflow generating module 210 and the housing 100, but also can reduce the occurrence of operational collision due to the existence of the gap, thereby further reducing the noise generated by the airflow generating module 210 by the camera 10.

Specific implementations of the elastic layer 214 include, but are not limited to, a cushion, silicone, rubber, and the like.

As shown in fig. 3, optionally, the connecting portion 211 includes a bracket 201, and an elastic layer 214 is disposed on an outer side wall of the bracket 201 to elastically abut the bracket 201 and the casing 100. In this way, the airflow generating assembly 210 can be more easily mounted on the rack by using the bracket 201, and the elastic layer 214 is used to improve the connection tightness and reduce noise and damp vibration.

The specific structure of the support 201 can be realized in the conventional technology, such as a plurality of support seats, a ring-shaped support plate, and the like.

In addition to any of the above embodiments, as shown in fig. 2 and fig. 4, in some embodiments, the camera 10 further includes a base 300 and a rotating member 400 rotatably connected to the base 300, wherein the rotating member 400 is fixedly connected to the housing 100 to drive the housing 100 to rotate. In this way, the base 300 is used to fix the camera 10 to a fixed component (such as a wall, a fixing rod, etc.), and the rotating member 400 is used to rotate the casing 100 relative to the base 300, so as to adjust the position of the casing 100 and thus the shooting position.

It should be noted that the connection between the rotating member 400 and the base 300 and the casing 100 can be realized by conventional techniques, and will not be described herein.

In addition, the rotation mode of the casing 100 may be various, including but not limited to manual rotation or electric control rotation.

Further, as shown in fig. 2 and 4, in some embodiments, the camera 10 further includes a circuit board 500, the circuit board 500 is disposed on the base 300, the circuit board 500 includes a heat-generating electronic device 510, and the electronic device 510 is in thermal conductive engagement with the rotation member 400. Thus, the electronic device 510 can dissipate heat by using the rotating part 400, and the rotating part 400 is connected with the casing 100, so that part of heat can be transferred to the casing 100, the airflow generating component 210 on the casing 100 is used for accelerating heat dissipation, and therefore the heat dissipation efficiency of the electronic device 510 can be improved, and the camera 10 is prevented from being locally overheated to influence the camera performance, and even from being halted or damaged.

The heat generating electronic device 510 includes, but is not limited to, a semiconductor device (e.g., a chip, a processor, etc.), a device with a large resistance (e.g., a temperature sensor), and other electronic devices with a relatively high heat generation amount.

Optionally, the heat generating electronic device 510 is a chip.

In addition to any of the above embodiments of the electronic device 510, as shown in fig. 2 and 4, in some embodiments, the camera 10 further includes a thermal conductive adhesive 600, and the electronic device 510 is thermally coupled to the rotation member 400 through the thermal conductive adhesive 600. Therefore, the gap between the electronic device 510 and the rotating member 400 can be fully filled by the heat conductive colloid 600, the heat conductive area is increased, the heat transfer efficiency between the electronic device 510 and the rotating member 400 is further improved, and the heat dissipation efficiency of the electronic device 510 is further improved.

The guide colloid comprises heat-conducting silica gel and the like.

In addition to any of the above embodiments, as shown in fig. 2 and fig. 4, in some embodiments, the housing 100 is provided with a receiving cavity 110, and the airflow generating assembly 210 is disposed in the receiving cavity 110. Thus, the airflow generating assembly 210 can disturb the airflow inside the accommodating cavity 110, and can dissipate the heat of the parts with higher temperature, so that the temperature inside the accommodating cavity 110 is more uniform, and the heat can be dissipated by fully utilizing the casing 100.

In addition to any of the above embodiments, as shown in fig. 2 and 3, in some embodiments, the casing 100 is provided with an air outlet part 120 communicated with the accommodating cavity 110, and the air outlet part 120 is communicated with the air supply part 212. In this way, the interaction between the internal air and the external air in the accommodating cavity 110 is realized, and the heat dissipation efficiency of the camera 10 is further improved.

It can be understood that the camera 10 of the present disclosure has high heat dissipation efficiency, and further can integrate an electronic device 510 with a larger heat value, such as an intelligent chip (e.g., an IA chip), so that the camera 10 of the present disclosure is more intelligent, and can automatically recognize a specific image (e.g., a human face, an animal, etc.) to automatically send recognition information to a control terminal (e.g., a monitoring computer or a monitoring mobile phone), etc. At this time, the circuit board 500 is a control circuit board 500.

As shown in fig. 4, optionally, in some embodiments, at least two heat dissipation devices 200 are disposed in the accommodating cavity 110 at intervals, and the chassis 100 is provided with air outlets 120 corresponding to the heat dissipation devices 200 one by one. Therefore, the heat dissipation efficiency of the camera 10 can be further improved, the camera 10 can be guaranteed to have higher calculation performance, the phenomena of blocking and dead halt are reduced, and intelligent monitoring, intelligent aerial photography and the like are reliably realized.

The air outlet part 120 includes at least one air outlet hole, an air outlet gap, an air outlet channel, etc.

On the basis of any of the above embodiments of the circuit board 500, as shown in fig. 2 or fig. 4, in some embodiments, the accommodating cavity 110 is provided with a through hole 111 disposed toward the base 300, so that the accommodating cavity 110 and the base 300 cooperate to form a protection space, and the airflow generating assembly 210, the circuit board 500 and the rotating member 400 are disposed in the protection space. Thus, the airflow generating assembly 210 can send the higher temperature air in the protection space out of the casing 100, and meanwhile, the negative pressure is generated near the base 300, so that the external air is sucked from the upper part of the accommodating cavity 110, the flow direction of the heat dissipation airflow inside the camera 10 is more reasonable, and the heat dissipation effect is better.

On the basis of the above embodiments, as shown in fig. 4, in some embodiments, a part of the rotating member 400 is disposed in the accommodating chamber 110 through the through hole 111, the rotating member 400 is provided with an avoiding chamber 410, the electronic device 510 is disposed in the avoiding chamber 410, the airflow generating assembly 210 is disposed outside the avoiding chamber 410, the rotating member 400 is provided with a vent hole 420 communicated with the avoiding chamber 410, and the vent hole 420 is disposed toward the air inlet portion 213. Thus, the air entering the avoidance cavity 410 can flow to the air inlet portion 213 from the vent hole 420, which is beneficial to guiding the heat dissipation airflow to enter the avoidance cavity 410 to bring the heat of the electronic device 510 out; meanwhile, the heat dissipation of the rotating member 400 is accelerated by utilizing the heat dissipation airflow, so that the heat of the electronic device 510 is conveniently transferred to the rotating member 400, and the heat dissipation efficiency of the electronic device 510 can be effectively improved.

In addition to any of the above embodiments, as shown in fig. 2 or fig. 4, in some embodiments, the camera 10 further includes a heat dissipation plate 700, the heat dissipation plate 700 is disposed on the base 300, and the circuit board 500 is disposed on the base 300. Thus, the heat dissipation plate 700 can improve the heat dissipation efficiency of the circuit board 500, thereby facilitating the heat dissipation of the electronic device 510.

The heat dissipation plate 700 includes heat dissipation fins, a heat equalization plate, and the like.

It should be noted that the "connecting portion 211" may be one of the parts of the module "airflow generating assembly 210", that is, the "airflow generating assembly is assembled with the" other components "to form a module, and then the module is assembled modularly; or may be separate from "other components of the airflow generating assembly 210" and may be installed separately, i.e., may be integrated with "other components of the airflow generating assembly 210" in the present apparatus.

Equivalently, the components included in the "assembly," "the housing 100," and the "circuit board 500" of the present disclosure can also be flexibly combined, i.e., can be produced in a modularized manner according to the actual situation, and can be assembled in a modularized manner as an independent module; the modules may be assembled separately, and one module may be constructed in the present apparatus. The division of the above-mentioned components in the present disclosure is only one embodiment, which is convenient for reading and not limiting the scope of protection of the present disclosure, and the technical solutions equivalent to the present disclosure should be understood as if they are included and the functions are the same.

In the description of the present disclosure, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present disclosure and to simplify the description, but are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present disclosure.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include at least one of the feature. In the description of the present disclosure, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.

In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In the present disclosure, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above examples only show several embodiments of the present disclosure, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the concept of the present disclosure, and these changes and modifications are all within the scope of the present disclosure.

Claims (13)

1. A heat dissipating device, comprising:

the airflow generating assembly is used for generating heat dissipation airflow and comprises a connecting part, an air supply part and an air inlet part opposite to the air supply part, and the connecting part is used for being connected with the shell and enabling the air supply part to face the shell; and

and at least part of the silencing assembly is arranged at the air inlet part of the airflow generation assembly so that at least part of the air inlet part can be used for air inlet through the silencing assembly.

2. The heat dissipating device of claim 1, wherein the sound attenuating element is sound attenuating cotton and is wrapped around the air inlet portion.

3. The heat dissipating device as claimed in claim 1 or 2, wherein the connecting portion is provided with an elastic layer for elastically abutting against the case.

4. The heat dissipation device as claimed in claim 3, wherein the connecting portion comprises a bracket, and the elastic layer is disposed on an outer sidewall of the bracket to elastically abut the bracket against the housing.

5. A camera comprising a housing and the heat sink of any one of claims 1 to 4, wherein the airflow generating assembly is disposed on the housing through the connecting portion.

6. The camera of claim 5, wherein the housing defines a receiving cavity, and the airflow generating assembly is disposed within the receiving cavity.

7. The camera according to claim 6, wherein the housing is provided with an air outlet portion communicating with the accommodating chamber, the air outlet portion communicating with the air blowing portion.

8. The camera of any one of claims 5 to 7, further comprising a base and a rotating member rotatably coupled to the base, wherein the rotating member is fixedly coupled to the housing to rotate the housing.

9. The camera of claim 8, further comprising a circuit board disposed on the base, the circuit board including heat generating electronics in thermally conductive engagement with the rotatable member.

10. The camera of claim 9, further comprising a thermally conductive gel, wherein the electronics are in thermally conductive engagement with the rotatable member via the thermally conductive gel.

11. The camera of claim 9, wherein the housing has a receiving cavity, the receiving cavity has a through hole disposed toward the base, so that the receiving cavity and the base cooperate to form a protection space, and the airflow generating assembly, the circuit board and the rotating member are disposed in the protection space.

12. The camera of claim 11, wherein a portion of the rotating member is disposed in the accommodating cavity through the through hole, the rotating member is provided with an avoiding cavity, the electronic device is disposed in the avoiding cavity, the airflow generating assembly is disposed outside the avoiding cavity, the rotating member is provided with a vent hole communicated with the avoiding cavity, and the vent hole is disposed toward the air inlet portion.

13. The camera of claim 9, further comprising a heat sink plate disposed on the base.

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