CN215735462U - Soaking structure and electronic equipment - Google Patents
Soaking structure and electronic equipment Download PDFInfo
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- CN215735462U CN215735462U CN202121067468.4U CN202121067468U CN215735462U CN 215735462 U CN215735462 U CN 215735462U CN 202121067468 U CN202121067468 U CN 202121067468U CN 215735462 U CN215735462 U CN 215735462U
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Abstract
The application discloses soaking structure, which comprises a plate body, the district and the condensation zone that is located the district periphery that generates heat have, the district that generates heat is used for connecting the source that generates heat, the plate body is equipped with a plurality of first capillary structures and a plurality of second capillary structure, a plurality of first capillary structures use the district that generates heat to be radial distribution to the condensation zone as the center, form first liquid passage in the first capillary structure, second capillary structure extends to the condensation zone from first capillary structure along the first direction or the second direction of plate body, form second liquid passage in the second capillary structure, form gas passage between two adjacent capillary structure, first direction is mutually perpendicular with the second direction. Make first capillary structure use the district that generates heat to be radial distribution to the condensation area as the center, can shorten the route of liquid backward flow, make second capillary structure extend along first direction or second direction, can reduce the planning design degree of difficulty of the distribution of second capillary structure on the plate body. In addition, the application also discloses an electronic device comprising the heat soaking structure.
Description
Technical Field
The utility model relates to the technical field of heat dissipation structures, in particular to a soaking structure and electronic equipment.
Background
In the use process of the electronic equipment, the electronic devices in the electronic equipment generate large heat, which causes the ambient temperature of the electronic devices to rise, however, the electronic devices are in a high temperature environment for a long time, which causes the service life of the electronic devices to be shortened. In the related art, in order to consider the light and thin design of electronic equipment, a VC (vacuum Chamber soaking structure heat dissipation technology) soaking structure is mostly adopted to dissipate heat of electronic devices (such as chips, batteries, and the like), the VC soaking structure mainly comprises an upper heat conducting strip and a lower heat conducting strip, a closed cavity is formed between the upper heat conducting strip and the lower heat conducting strip, and a plurality of channel type structures for guiding heat conducting fluid are arranged on the upper heat conducting strip, so that the working fluid can circularly flow back and forth between a heating area and a condensation area of the heat conducting strip by using the channel type structures. However, because the working chamber is a closed chamber, the interference of the phase change process of the working fluid in the liquid state and the gaseous state exists in the closed chamber, which affects the heat conduction rate in the closed chamber, and further affects the heat dissipation effect of the soaking structure.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model discloses a soaking structure and electronic equipment, which can ensure that the phase change process of working fluid in a closed cavity between a liquid state and a gaseous state does not interfere with each other, effectively improve the heat conduction rate of the soaking structure and improve the heat dissipation effect of the soaking structure.
In order to achieve the above object, in a first aspect, the present application discloses a heat equalizing structure comprising:
the plate body is provided with a heating area and a condensation area positioned on the periphery of the heating area;
the plate body is provided with a plurality of first capillary structures and a plurality of second capillary structures, the first capillary structures are radially distributed towards the condensation area by taking the heating area as a center, a gas channel is formed between every two adjacent first capillary structures, and a first liquid channel is formed in each first capillary structure;
in the plurality of first capillary structures, a plurality of second capillary structures are arranged between two adjacent first capillary structures, one ends of the second capillary structures are arranged close to the first capillary structures, the other ends of the second capillary structures extend to the condensation area along the first direction and/or the second direction of the plate body, the gas channel is formed between the two adjacent second capillary structures, the gas channel formed between the second capillary structures is communicated with the gas channel formed between the first capillary structures, a second liquid channel used for liquid flowing is formed in each second capillary structure, and the second liquid channel is communicated with the first liquid channel;
the first direction of the plate body is perpendicular to the second direction, the gas is gaseous working fluid, the liquid is liquid working fluid, and the working fluid can be water, ethanol or fluids such as ethylene glycol.
It is understood that the heat equalizing structure may be applied to the electronic apparatus to correspond to the heat generating source arrangement of the electronic apparatus. The region of the soaking structure corresponding to the heat-generating source can be defined as a heat-generating region of the soaking structure, and the region of the soaking structure far away from the heat-generating source or the region at the periphery of the heat-generating source can be defined as a condensing region.
Through set up a plurality of first capillary structures and a plurality of second capillary structure on the plate body, and make and form gas passage between two adjacent first capillary structures and the second capillary structure, make gas passage and the first liquid passage that first capillary structure self formed and the second liquid passage that second capillary structure self formed separate, thereby can effectively prevent that the working fluid from taking place the problem of interference at liquid and gaseous phase transition in-process, make the emergence of working fluid's phase transition more smooth and easy, effectively improve soaking structure's radiating effect.
In addition, through setting up a plurality of first capillary structures and using the district that generates heat to be radial distribution to the condensation zone as the center, reduce the path length that liquid working fluid that forms at the condensation zone condensation flows back to the district that generates heat by a wide margin, improve soaking structure's radiating efficiency. Simultaneously, through setting up a plurality of second capillary structures between two adjacent first capillary structures, the one end of second capillary structure is close to first capillary structure, the other end of second capillary structure extends to the condensation zone along the first direction or the second direction of plate body, thereby not only can make liquid from the arbitrary department in condensation zone flow back to the district that generates heat, in order to avoid the liquid working fluid in the district that generates heat not enough and take place the condition of dry combustion, and can also make the distribution of second capillary structure on the plate body more regular, reduce the distribution planning design degree of difficulty of second capillary structure on the plate body.
As an alternative implementation manner, in an embodiment of the first aspect of the present application, the first capillary structure includes a plurality of sets of first capillary units, and two adjacent sets of the first capillary units are spaced apart from each other to form the first liquid channel;
the second capillary structure includes multiunit second capillary unit, and is adjacent two sets of interval sets up in order to form between the second capillary unit the second liquid passageway, like this, can set up gas passage and first liquid passageway and second liquid passageway looks interval, can prevent effectively that the working fluid from taking place the problem of interference at liquid and gaseous phase transition in-process for the phase transition of working fluid takes place more smoothly, thereby can effectively promote the rate of heat dissipation of soaking structure, and then effectively improve the radiating effect of soaking structure.
As an alternative implementation manner, in an embodiment of the first aspect of the present application, an end of the second capillary structure adjacent to the first capillary structure is connected to the second capillary structure, so that the first liquid passage can be directly communicated with the second liquid passage, and the liquid can more easily flow between the first liquid passage and the second liquid passage.
As an alternative implementation manner, in an embodiment of the first aspect of the present application, in the plurality of second capillary structures, a part of the second capillary structures are first sub-capillary structures, another part of the second capillary structures are second sub-capillary structures, one end of the first sub-capillary structure is connected to the first capillary structure, the other end of the first sub-capillary structure extends to the condensation area along the first direction of the plate body, one end of the second sub-capillary structure is connected to the first capillary structure, and the other end of the second sub-capillary structure extends to the condensation area along the second direction of the plate body;
the gas channel is formed between each two adjacent first sub-capillary structures, each two adjacent second sub-capillary structures, and each adjacent first sub-capillary structure and each adjacent second sub-capillary structure, and the second liquid channel of the first sub-capillary structure is communicated with the second liquid channel of the second sub-capillary structure, so that one end of each first sub-capillary structure and each second sub-capillary structure, which extends to the condensation area, can flow the liquid working fluid to the first liquid channel formed by the first sub-capillary structure along the second liquid channel formed by the first sub-capillary structure or the second sub-capillary structure, and flow the liquid working fluid into the heat-generating area through the first liquid channel, so that the liquid can flow from any position of the condensation area back to the heat-generating area.
As an alternative implementation, in the embodiments of the first aspect of the present application, the width b1 of the first capillary structure is the same as the width b2 of the second capillary structure, and the width b1 of the first capillary structure is 0.2mm to 2.5 mm; the width d of the gas channel is 0.2mm-2.5 mm; the width h1 of the first liquid channel is the same as the width h2 of the second liquid channel, and the width h1 of the first liquid channel is 10-200 μm, so that the volume of the first liquid channel formed by the first capillary structure and the volume of the second liquid channel formed by the second capillary structure can meet the use requirement of ensuring sufficient liquid backflow, and meanwhile, the phenomenon that the gasified working fluid is difficult to discharge to a gas channel due to the fact that the first liquid channel or the second liquid channel is too wide, the phenomenon that the phase change process of the working fluid in liquid and gas states is interfered is avoided, and the heat conduction rate in the closed cavity is influenced.
As an alternative implementation manner, in an embodiment of the first aspect of the present application, a surface of the plate body on which the first capillary structure and the second capillary structure are disposed is a first surface, and a total area obtained by adding areas of the first capillary structure and the second capillary structure on the first surface is S1Said gas channel on said first surfaceTotal area of S2，S1And S2The ratio of (2) is in the range of 0.6-1.5, so that the first plate body can be provided with the first liquid channel, the second liquid channel and the gas channel with enough areas, more working fluid can flow between the heating area and the condensation area, and the heat dissipation effect of the soaking structure is improved.
As an alternative implementation manner, in the embodiment of the first aspect of the present application, on the first surface, the sum of the areas of the first capillary structure and the second capillary structure in the heat generating region is S3The total area of the gas channel in the heating area is S4，S3And S4The ratio range of (1-5) to the first liquid passageway and the second liquid that can have enough area in the soaking structure generates heat are led to, make more liquid can flow back to in the district that generates heat, avoid because of the gasification rate of the liquid in the district that generates heat is too fast, and lead to generating dry combustion method phenomenon in the district that generates heat, improve the radiating effect of soaking structure.
As an optional implementation manner, in an embodiment of the first aspect of the present application, the plate body is a rectangular plate, the plate body has two perpendicular sides, the first direction is parallel to one of the two sides of the plate body, and the second direction is parallel to the other of the two sides of the plate body, so that the arrangement of the second capillary structure on the plate body is more regular, the arrangement of the second capillary structure on the plate body is facilitated, and the processing difficulty of forming the second capillary structure on the plate body is reduced.
As an optional implementation manner, in an embodiment of the first aspect of the present application, the plate body includes a first plate body and a second plate body hermetically connected to the first plate body, the first plate body and the second plate body are provided with the first capillary structure and the second capillary structure, each of the first plate body is provided with the first capillary structure and the second capillary structure is provided with the second plate body, and the first capillary structure and the second capillary structure are correspondingly connected to each of the second plate body, so as to ensure that the thickness of the soaking structure is not increased, and at the same time, the volumes of the gas channel, the first liquid channel and the second liquid channel are increased, so as to increase the amount of the working fluid that can be sealed into the soaking structure, and improve the heat dissipation efficiency of the soaking structure.
In a second aspect, the present application further discloses an electronic apparatus including a heat generating source and the heat equalizing structure according to the first aspect, wherein the heat generating source is disposed corresponding to the heat generating region of the heat equalizing structure. Utilize soaking structure, can realize dispelling the heat fast to electronic equipment's the source that generates heat to can prevent to generate heat the source and lead to the problem that operation trouble probably appears because of the high temperature, improve electronic equipment's use reliability. In addition, the soaking structure is adopted, the whole thickness is small, the occupied space of the electronic equipment is small, and the light and thin design requirements of the electronic equipment can be met.
Compared with the prior art, the utility model has the beneficial effects that:
the heat soaking structure and the electronic equipment provided by the embodiment of the utility model can realize the spaced arrangement of the gas channel and the liquid channel, effectively prevent the problem of interference of the working fluid in the liquid and gaseous phase change process, enable the phase change of the working fluid to be smoother, and further effectively improve the heat dissipation rate of the heat soaking structure, thereby effectively improving the heat dissipation effect of the heat soaking structure. In addition, because a plurality of first capillary structures use the district that generates heat to become radial distribution to the condensation zone center, can shorten the liquid backward flow of condensation zone to the path length of the district that generates heat, promote soaking structure's radiating efficiency, and because a plurality of second capillary structures extend to the condensation zone along first direction or with first direction looks vertically second direction from first capillary structure, like this, can make liquid (promptly, liquid working fluid) can backward flow to the district that generates heat from arbitrary department of condensation zone, in order to avoid the liquid working fluid in the district that generates heat not enough and produce the dry combustion method, simultaneously, because second capillary structure extends along the first direction or the second direction of plate body, can reduce the planning design degree of difficulty of the distribution of second capillary structure on the plate body.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a soaking structure disclosed in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a capillary structure disposed on a first plate according to an embodiment of the present disclosure;
FIG. 3 is an enlarged view at A in FIG. 2;
fig. 4 is another structural diagram of the capillary structure disposed on the first plate body according to the embodiment of the present application;
fig. 5 is a schematic view of another structure of the capillary structure disposed on the first plate according to the embodiment of the present application;
fig. 6 is a schematic view of another structure of the capillary structure disposed on the first plate according to the embodiment of the present application;
fig. 7 is a partial schematic view of a capillary structure disposed on a first plate according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application.
Icon: 1. a uniform heating structure; 10. a plate body; 10a, a heating area; 10b, a condensation zone; 100. a first plate body; 101. a second plate body; 11. a first capillary structure; 110. a first capillary unit; 12. a second capillary structure; 120. a second capillary unit; 120a, a sub-capillary unit; 121. a first sub-capillary structure; 122. a second sub-capillary structure; 1a, a gas channel; 1b, a first liquid channel; 1c, a second liquid channel; 1d, capillary grooves; 20. an electronic device; 21. a heat generating source.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.
The embodiment of the application discloses a heat equalizing structure in a first aspect, and the heat equalizing structure disclosed in the embodiment can be applied to electronic equipment to dissipate heat of a heat generating source (such as a chip, a battery and the like) in the electronic equipment so as to ensure normal operation of the electronic equipment. Specifically, as shown in fig. 1 to 3, the heat equalizing structure 1 includes a plate body 10, the plate body 10 has a heat generating region 10a and a condensing region 10b located at the periphery of the heat generating region 10a, the plate body 10 is provided with a plurality of first capillary structures 11 and a plurality of second capillary structures 12, the plurality of first capillary structures 11 are radially distributed toward the condensing region 10b with the heat generating region 10a as the center, a gas channel 1a for allowing gas to flow between the heat generating region 10a and the condensing region 10b is formed between two adjacent first capillary structures 11 (as shown in a blank between two adjacent first capillary structures 11 in fig. 2), a first liquid channel 1b for allowing liquid to flow between the heat generating region 10a and the condensing region 10b is formed in each first capillary structure 11, the plurality of first capillary structures 11 are provided with the plurality of second capillary structures 12 between two adjacent first capillary structures 11, one end of each second capillary structure 12 is disposed adjacent to the first capillary structure 11, the other end of the second capillary structure 12 extends to the condensation zone 10b along the first direction X and/or the second direction Y of the plate body 10, a gas channel 1a for gas to flow is formed between two adjacent second capillary structures 12 (as shown in the blank between two adjacent second capillary structures 12 in fig. 2), a second liquid channel 1c for liquid to flow is formed in the second capillary structure 12, the second liquid channel 1c is communicated with the first liquid channel 1b, the gas channel 1a formed by the first capillary structure 11 is communicated with the gas channel 1a formed by the second capillary structure 12, wherein the first direction X of the plate body 10 is perpendicular to the second direction Y, and for convenience of understanding and distinguishing, the first capillary structure 11 is shown by a thick solid line in fig. 2 and 3, the second capillary structure 12 is shown by a thin solid line, it can be understood that, the thickness of the solid line is only used to distinguish the distribution positions of the first capillary structure 11 and the second capillary structure 12, and does not indicate the presence or absence of a difference in the structure of the first capillary structure 11 or the second capillary structure 12.
The gas is a gaseous working fluid, the liquid is a liquid working fluid, and the working fluid can be water, ethanol or fluids such as ethylene glycol.
It should be noted that "adjacent" in the above description may refer to a case where two structures are close to each other and are spaced apart from each other, and may also refer to a case where two structures are connected to each other, that is, "one end of the second capillary structure 12 is disposed adjacent to the first capillary structure 11" may refer to that one end of the second capillary structure 12 is close to the first capillary structure 11 and one end of the second capillary structure 12 is disposed spaced apart from the first capillary structure 11, and may also refer to that one end of the second capillary structure 12 is connected to the first capillary structure 11.
It should be further noted that an included angle θ may be formed between two first capillary structures 11, and as long as there is no other first capillary structure 11 in the range of the included angle θ, the two first capillary structures 11 may be considered to be adjacent, where the included angle θ satisfies: 0 ° ≦ θ ≦ 360 °, i.e., the included angle θ may be 0 °, 45 °, 90 °, 135 °, 180 °, 225 °, 270 °, 315 °, or 360 °, etc., it being understood that when the included angle θ is 0 °, 180 °, or 360 °, the two first capillary structures 11 are parallel or collinear. As shown in fig. 2, four first capillary structures 11 are shown, and an included angle θ formed between any two adjacent first capillary structures 11 in the four first capillary structures 11 is approximately 0 ° or 180 °, wherein a second capillary structure 12 is arranged between two adjacent first capillary structures 11 having an included angle θ of approximately 180 °, and a gas channel 1a is formed between two adjacent first capillary structures 11 having an included angle θ of approximately 0 °.
Further, a second capillary structure 12 is disposed between two adjacent first capillary structures 11, in other words, the second capillary structure 12 may be disposed between all adjacent first capillary structures 11, or the second capillary structure 12 may be disposed between some adjacent first capillary structures 11. For example, as shown in fig. 2, the number of the first capillary structures 11 is four, and the four first capillary structures 11 form four pairs of adjacent first capillary structures 11, wherein the second capillary structure 12 is disposed between two pairs of adjacent first capillary structures 11, and only the gas channel 1a is formed between the other two pairs of adjacent first capillary structures 11, and the second capillary structure 12 is not disposed. It is to be understood that the number of the first capillary structures 11 is not limited to four, and the foregoing list is only one preferred embodiment and should not be construed as limiting the technical solution.
As can be seen from the foregoing, since the heat equalizing structure 1 can be applied to an electronic device and is disposed corresponding to a heat generating source of the electronic device, a position of the heat equalizing structure 1 corresponding to the heat generating source can be defined as a heat generating region 10a of the heat equalizing structure 1, the heat generating region 10a is mainly used for evaporating a liquid working fluid, a region of the heat equalizing structure 1 away from the heat generating source or a region located at an outer periphery of the heat generating source can be defined as a condensing region 10b, and the condensing region 10b is mainly used for condensing a gaseous working fluid into a liquid working fluid, so that the liquid working fluid can flow in the condensing region 10b and the heat generating region 10a to dissipate heat.
That is, adopt soaking structure 1 of this application embodiment, through making to form gas channel 1a between two adjacent first capillary structures 11 and the second capillary structure 12, make gas channel 1a and first liquid channel 1b that first capillary structure 11 self formed and second liquid channel 1c that second capillary structure 12 self formed separate, thereby can effectively prevent that the working fluid from taking place the problem of interference at liquid and gaseous phase transition in-process, make the emergence of the phase transition of working fluid more smooth and easy, effectively improve soaking structure 1's radiating effect.
In addition, the plurality of first capillary structures 11 are radially distributed towards the condensation zone 10b by taking the heating zone 10a as the center, so that the path length of the liquid working fluid condensed in the condensation zone 10b and flowing back to the heating zone 10a is greatly reduced, and the heat dissipation efficiency of the soaking structure 1 is improved. Meanwhile, by arranging the plurality of second capillary structures 12 between two adjacent first capillary structures 11, one end of each second capillary structure 12 is close to each first capillary structure 11, and the other end of each second capillary structure 12 extends to the condensation area 10b along the first direction X or the second direction Y of the plate body 10, so that not only can liquid (i.e., liquid working fluid) flow back from any position of the condensation area 10b to the heat generation area 10a, but also the situation that the liquid working fluid in the heat generation area 10a is insufficient and dry burning occurs can be avoided, the distribution of the second capillary structures 12 on the plate body 10 can be more regular, and the difficulty in designing the distribution of the second capillary structures 12 on the plate body 10 can be reduced.
Further, by making the first liquid passage 1b communicate with the second liquid passage 1c, the working fluid in the liquid state can be made to flow along the first liquid passage 1b to the second liquid passage 1c and into the heat generation region 10a through the second liquid passage 1c, so that the liquid (i.e., the working fluid in the liquid state) can be made to flow back to the heat generation region 10a from any one of the condensation regions 10b in a shorter path. Correspondingly, the gas channels 1a formed by the first capillary structure 11 are communicated with the gas channels 1a formed by the second capillary structure 12, so that the gas pressure between the gas channels 1a can be balanced, and the gas in the gas channel 1a with higher gas pressure is prevented from diffusing into the adjacent gas channel 1a due to the difference of the gas pressure between different gas channels 1a, thereby preventing the working fluid from being interfered in the phase change process of liquid and gas.
It can be understood that the gas channel 1a is formed between the two adjacent first capillary structures 11 and second capillary structures 12, and since the first capillary structures 11 and second capillary structures 12 are disposed on the plate body 10, the gas channel 1a is formed at a position of the plate body 10 where the first capillary structures 11 and second capillary structures 12 are not disposed, the first liquid channel 1b is formed at a position of the first capillary structures 11, and the second liquid channel 1c is formed at a position of the second capillary structures 12. Thus, the gas channel 1a is not required to be additionally arranged, and the gas channel 1a and the first liquid channel 1b and the second liquid channel 1c can be separated, so that the working fluids can not interfere with each other in the phase change generation process of the liquid and the gas.
In some embodiments, the plate body 10 of the soaking structure 1 may include a first plate body 100 and a second plate body 101, and the first plate body 100 and the second plate body 101 are hermetically connected to each other to form a sealed cavity therebetween. Specifically, when the first capillary structure 11 and the second capillary structure 12 are provided, the first capillary structure 11 and the second capillary structure 12 may be provided on the first plate body 100, or on the second plate body 101, or both the first plate body 100 and the second plate body 101 (for example, as shown in fig. 1, fig. 1 shows that the first capillary structure 11 and the second capillary structure 12 are both provided on the first plate body 100 and the second plate body 101), so that the first capillary structure 11 and the second capillary structure 12 may be selectively provided on the first plate body 100 and/or the second plate body 101 according to actual conditions, and the application range of the soaking structure 1 is wider.
As shown in fig. 1, further, when the first plate 100 and the second plate 101 are both provided with the first capillary structures 11 and the second capillary structures 12, the first capillary structures 11 on the first plate 100 are correspondingly connected with the first capillary structures 11 on the second plate 101, and the second capillary structures 12 on the first plate 100 are correspondingly connected with the second capillary structures 12 on the second plate 101, so that the gas passages 1a on the first plate 100 and the second plate 101 can be just correspondingly communicated, and the first liquid passages 1b and the second liquid passages 1c on the first plate 100 and the second plate 101 can also be just correspondingly communicated, so that compared with the case where only the first capillary structures 11 and the second capillary structures 12 are provided on the first plate 100 or only the second plate 101, a sealed cavity with a larger volume can be obtained while the total thickness of the plate 10 is not changed, therefore, the volumes of the gas channel 1a, the first liquid channel 1b, and the second liquid channel 1c can be increased to increase the amount of the working fluid that can be enclosed in the soaking structure 1, thereby improving the heat dissipation efficiency of the soaking structure 1.
Further, in order to match the heat source of the electronic device, the entire plate body 10 may be a circular plate, a circular-like (e.g., elliptical) plate, or a polygonal plate such as a rectangle, a regular pentagon, a regular hexagon, or an irregular polygon. That is, each of the first plate 100 and the second plate 101 may have a circular shape, a circular plate shape, or a polygonal plate shape such as a rectangular shape. The plate body 10 may be in a sheet shape in consideration of the small thickness of the entire soaking structure 1, that is, the soaking structure 1 is an ultra-thin soaking structure 1. Specifically, the first board body 100 may be made of a metal sheet, and may be exemplified by a copper sheet, a stainless steel sheet, an aluminum sheet, and the like. Accordingly, the second board body 101 may also be made of copper sheet, stainless steel sheet, aluminum sheet, or the like.
In an alternative example, the plate body 10 may be a rectangular plate, and in this case, the plate body 10 has two perpendicular sides, the first direction X may be parallel to one of the two sides of the plate body 10, and the second direction Y may be parallel to the other of the two sides of the plate body 10. For example, the plate body 10 may be a rectangular plate, and in this case, the plate body 10 has two perpendicular sides, one of which is a long side and the other of which is a short side, the first direction X may be parallel to the length direction of the plate body 10, and the second direction Y may be parallel to the width direction of the plate body 10, that is, the second capillary structures 12 may extend along the length direction of the plate body 10 or may extend along the width direction of the plate body 10. In this way, the arrangement of the second capillary structure 12 on the plate body 10 is more regular, which facilitates the arrangement of the second capillary structure 12 on the plate body 10 and reduces the difficulty in forming the second capillary structure 12 on the plate body 10.
In another alternative example, the plate body 10 is a circular sheet or an oval sheet, and the first direction X and the second direction Y are two perpendicular radial directions of the plate body 10, respectively, so that the arrangement of the second capillary structures 12 on the plate body 10 is more regular, which facilitates the arrangement of the second capillary structures 12 on the plate body 10, and reduces the difficulty in forming the second capillary structures 12 on the plate body 10.
The following description will be made by taking an example in which the first plate 100 is a rectangular plate, the first capillary structure 11 and the second capillary structure 12 are provided on the first plate 100, the first direction X is the longitudinal direction of the first plate 100, and the second direction Y is the width direction of the first plate 100.
Alternatively, the heat generating region 10a may be located approximately in the middle of the plate body 10, and the condensing region 10b may be located at the periphery of the heat generating region 10a, that is, the condensing region 10b may be located at the edge of the plate body 10, so that the plurality of first fine structures extend toward the edge of the plate body 10 (that is, the condensing region 10b) with the middle of the plate body 10 (that is, the heat generating region 10a) as the center, in this case, when the working fluid is in a liquid state or a gaseous state, the liquid state flow path or the gaseous state diffusion path of the working fluid is short, the backflow rate of the working fluid can be increased, and thus the heat dissipation efficiency of the soaking structure 1 can be increased.
It is understood that in other embodiments, the heat generating region 10a may be located near the edge of the board body 10. In other words, the heat-generating region 10a may be located in the middle of the board body 10, or may be located near the edge of the board body 10, so that the heat-equalizing structure 1 may be disposed according to the positions of different heat-generating sources of the electronic device, and thus the applicability of the heat-equalizing structure 1 may be improved.
In the embodiment, the heat generating region 10a is located approximately in the middle of the plate body 10, and the heat generating region 10a may form a circular region or a square region.
Alternatively, an end of the second capillary structure 12 adjacent to the first capillary structure 11 is connected to the second capillary structure 12, so that the first liquid passage 1b can be directly communicated with the second liquid passage 1c, and the liquid can more easily flow between the first liquid passage 1b and the second liquid passage 1 c.
It is understood that a gas channel 1a may also be formed between the adjacent first capillary structure 11 and the second capillary structure 12 to allow gas to flow through, as shown in fig. 4, a gas channel 1a is formed between the adjacent first capillary structure 11 and the second capillary structure 12, where a blank portion in fig. 4 is the gas channel 1a, a portion filled with a cross pattern is the first capillary structure 11, a portion filled with a dot matrix is the second capillary structure 12, and a boundary between the first capillary structure 11 and the second capillary structure 12 is roughly marked by a dotted line.
Optionally, the edges of the first capillary structure 11 and the second capillary structure 12 may be in a zigzag shape or a wave shape, so that the contact area between the first capillary structure 11 and the gas channel 1a and the contact area between the second capillary structure 12 and the gas channel 1a can be increased, and the contact area between the first liquid channel 1b and the gas channel 1a and the contact area between the second liquid channel 1c and the gas channel 1b can be increased, so that the working fluid vaporized in the first liquid channel 1b or the second liquid channel 1c can move from the first liquid channel 1b or the second liquid channel 1c to the gas channel 1a more easily, and the problem that the working fluid interferes in the liquid and gaseous phase transition processes can be further prevented, and the heat dissipation effect of the heat equalizing structure 1 can be improved. It is understood that in other embodiments, the edges of the first capillary structure 11 and the second capillary structure 12 may be linear.
In some embodiments, to meet different requirements of use, the plurality of second capillary structures 12 may extend along the first direction X, or may extend along the second direction Y, or some of the plurality of second capillary structures 12 may extend along the first direction X, and another part of the plurality of second capillary structures 12 may extend along the second direction Y.
In an alternative example, one end of each of the plurality of second capillary structures 12 is adjacent to the first capillary structure 11, and the other end of each of the plurality of second capillary structures 12 extends to the condensation area 10b along the first direction X of the plate body 10, so that the distribution manner of the second capillary structures 12 is simplest, and the difficulty of the distribution design of the second capillary structures 12 is reduced to the greatest extent, as shown in fig. 2 and 4, and fig. 2 and 4 respectively show a structure in which two kinds of the plurality of second capillary structures 12 extend along the first direction X.
Referring to fig. 5 and fig. 6, in another alternative example, in the plurality of second capillary structures 12, a part of the second capillary structures 12 is a first sub-capillary structure 121, another part of the second capillary structures 12 is a second sub-capillary structure 122, one end of the first sub-capillary structure 121 is connected to the first capillary structure 11, the other end of the first sub-capillary structure 121 extends to the condensation region 10b along the first direction X of the plate body 10, one end of the second sub-capillary structure 122 is connected to the first capillary structure 11, the other end of the second sub-capillary structure 122 extends to the condensation region 10b along the second direction Y of the plate body 10, two adjacent first sub-capillary structures 121, two adjacent second sub-capillary structures 122, and a gas passage 1a is formed between the adjacent first sub-capillary structure 121 and the adjacent second sub-capillary structure 122, the second liquid passage 1c of the first sub-capillary structure 121 is communicated with the second liquid passage 1c of the second sub-capillary structure 122, in this way, one end of the first sub-capillary structure 121 and the second sub-capillary structure 122 extending to the condensation area 10b can flow the liquid working fluid to the first liquid channel 1b formed by the first capillary structure 11 along the second liquid channel 1c formed by the first sub-capillary structure 121 or the second sub-capillary structure 122, and flow into the heat generation area 10a through the first liquid channel 1b, so that the liquid (i.e., the liquid working fluid) can flow from any one of the condensation areas 10b back to the heat generation area 10a, as shown in fig. 5 and 6, two configurations of the second capillary structure 12 comprising a first sub-capillary structure 121 and a second sub-capillary structure 122 are shown in figures 5 and 6 respectively, in fig. 5 and 6, the blank portion is a gas channel 1a, the portion filled with the cross pattern is a first capillary structure 11, and the portion filled with the lattice is a second capillary structure 12.
It is understood that the first sub-capillary structure 121 and the second sub-capillary structure 122 each have the second capillary unit 120, so that portions of the second liquid passage 1c can be formed in both the first sub-capillary structure 121 and the second sub-capillary structure 122.
In some embodiments, the gas channels 1a formed between the first sub-capillary structures 121 and the second sub-capillary structures 122 may be partially formed to be radially distributed toward the condensation zone 10b with the heat generating zone 10a as a center to shorten a diffusion path of the gas, so that the gas can diffuse from the heat generating zone 10a to the condensation zone 10b quickly for condensation, thereby improving the heat dissipation efficiency of the heat spreader structure 1, as shown in fig. 6, fig. 6 shows a plurality of first capillary structures 11, two adjacent first capillary structures 11 and an edge of the first plate 100 enclose a substantially square space, a plurality of first sub-capillary structures 121 are distributed at intervals in the square space, and each of the plurality of first sub-capillary structures 121 extends from one of the first capillary structures 11 to the condensation zone 10b, a plurality of second sub-capillary structures 122 are distributed at intervals in the square space, and each of the plurality of second sub-capillary structures 122 extends from another one of the first sub-capillary structures 11 to the condensation zone 10b, the ends of the plurality of first sub-capillary structures 121 extending along the first direction X are spaced from the ends of the plurality of second sub-capillary structures 122 extending along the second direction, so as to form gas channels 1a radially distributed from the heat generating region 10a to the condensing region.
Referring to fig. 2, 3 and 7, specifically, each first capillary structure 11 includes a plurality of sets of first capillary units 110, two adjacent sets of first capillary units 110 are spaced apart from each other to form a first liquid channel 1b for liquid to flow in the heat generating region 10a and the condensing region 10b (as shown by the spacing between two adjacent first capillary units 110 in fig. 3), each second capillary structure 12 includes a plurality of sets of second capillary units 120, two adjacent sets of second capillary units 120 are spaced apart from each other to form a second liquid channel 1c for liquid to flow, the widths of the first liquid channel 1b and the second liquid channel 1c are smaller, so that the liquid in the condensation area 10b can be refluxed to the heat generating area 10a along the first liquid passage 1b or along the second liquid passage 1c and the first liquid passage 1b by using the siphon principle.
It is understood that the specific structure of the second capillary structure 12 is substantially the same as the specific structure of the first capillary structure 11, and the second capillary structure 12 will be described below as an example.
Further, each group of the second capillary units 120 may include a plurality of sub-capillary units 120a, a capillary groove 1d is formed between two adjacent sub-capillary units 120a, and the capillary groove 1d is communicated with the second liquid channel 1c, so that the second liquid channel 1c of each second capillary structure 12 is communicated by using the capillary groove 1d, so that the liquid working fluid can flow in each second liquid channel 1c, which is beneficial for the working fluid to flow between the heat generating area 10a and the condensing area 10b more quickly, and thus, the capillary effect of the second capillary structure 12 can be improved.
In some embodiments, in two adjacent sets of second capillary units 120, each set of second capillary units 120 may include the same or different number of sub-capillary units 120 a. For example, each group of the second capillary units 120 may include 30 sub-capillary units 120a from the heat generating region 10a to the condensing region 10b, or, in two adjacent groups of the second capillary units 120, the number of the sub-capillary units 120a included in one group of the second capillary units 120 may be 30, and the number of the sub-capillary units 120a included in the other group of the second capillary units 120 may be 40, that is, the number of the sub-capillary units 120a included in each group of the second capillary units 120 may be adjusted according to actual situations, which is not limited in this embodiment.
Further, in two adjacent groups of the second capillary units 120, the capillary grooves 1d formed by two adjacent sub-capillary units 120a of one group of the second capillary units 120 and the capillary grooves 1d formed by two adjacent sub-capillary units 120a of the other group of the second capillary units 120 are arranged in a staggered manner, so that the respective staggered capillary grooves 1d are utilized, and each capillary groove 1d is communicated with the second liquid channel 1c, so that the liquid working fluid can rapidly flow back to the second liquid channel 1c through each capillary groove 1d, and the rapid condensation and backflow of the liquid working fluid can be realized. It is understood that, in other embodiments, the capillary grooves 1d formed by two adjacent sub-capillary units 120a of each group of second capillary units 120 in two adjacent groups of second capillary units 120 may also be correspondingly arranged.
In some embodiments, the surface of the first plate 100 on which the first capillary structure 11 and the second capillary structure 12 are disposed is a first surface, and the sum of the areas of the first capillary structure 11 and the second capillary structure 12 on the first surface is S1The total area of the gas passages 1a on the first surface is S2In order to avoid dry burning of the heating area 10a caused by too small area of the liquid passage and too small amount of liquid backflow, or avoid dry burning caused by too small amount of liquid backflow and too small amount of liquid backflow caused by insufficient liquefaction of the gas and insufficient movement of the gas to the condensing area 10b caused by too small area of the liquid passage1And S2The ratio of (A) may range from 0.6 to 1.5. Exemplary, S1And S2The ratio of (a) may be 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, etc. Thus, the first plate body 100 can have the first liquid passage 1b, the second liquid passage 1c, and the gas passage 1a with sufficient areas, so that more working fluid can flow between the heat generating region 10a and the condensing region 10b, and the heat dissipation effect of the heat soaking structure 1 is improved.
In some embodiments, since the heat generating region 10a is close to the heat generating source, when the soaking structure 1 operates, the ambient temperature in the heat generating region 10a is the highest, and the liquid is gasified at the fastest speed, so that, in order to avoid the dry burning phenomenon of the heat generating region 10a caused by too small liquid channel area and too small liquid backflow amount, the total area of the capillary structure in the heat generating region 10a is S on the first surface3The total area of the gas passages 1a in the heat generation region 10a is S4，S3And S4The ratio of (A) may range from 1 to 5. Exemplary, S3And S4The ratio of (a) may be 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0, 4.5, or 5.0, etc. Thus, the first liquid passage 1b and the second liquid passage 1c can have a sufficient area in the heat generation region 10a of the soaking structure 1, so that more liquid can be suppliedThe liquid flows back to the heating area 10a, so that the phenomenon of dry burning in the heating area 10a caused by the too high gasification rate of the liquid in the heating area 10a is avoided, and the heat dissipation effect of the soaking structure 1 is improved.
It can be understood that S is only provided with the first capillary structure 11 in the heat generating region 10a of the first plate body 1003When the second capillary structure 12 and the first capillary structure 11 are simultaneously disposed in the heat generating region 10a of the first plate body 100, S is the total area of the first capillary structure 11 in the heat generating region 10a3Is the total area of the second capillary structure 12 and the first capillary structure 11 in the heat generation region 10 a.
In some embodiments, the width b1 of the first capillary structure 11 and the width b2 of the second capillary structure 12 may be the same or different. In an alternative example, the width b1 of the first capillary structure 11 may be wider than the width b2 of the second capillary structure, so as to increase the volume of the first liquid channel 1b formed by the first capillary structure 11, so that the first capillary structure 11 can accommodate the liquid flowing in from each second capillary structure 12, and avoid the liquid from stagnating in the second liquid channel 1c formed by each second capillary structure 12 due to too small liquid accommodation amount of the first liquid channel 1b formed by the first capillary structure 11, so as to ensure that the liquid reflowing speed is fast, thereby improving the heat dissipation efficiency of the heat spreader structure 1.
In another alternative example, the width b1 of the first capillary structure 11 is the same as the width b2 of the second capillary structure 12, so that the distribution planning and design of the first capillary structure 11 and the second capillary structure 12 can be further simplified.
In the present embodiment, the width b1 of the first capillary structure 11 is the same as the width b2 of the second capillary structure 12. In some embodiments, in order to ensure that the volume of the second liquid channel 1c formed by the second capillary structure 12 can satisfy the usage requirement of ensuring a sufficient amount of liquid backflow, and avoid the phenomenon that the vaporized working fluid is difficult to be discharged to the gas channel 1a due to the excessively wide second liquid channel 1c, and the phase change process of the working fluid in the liquid and gas states is disturbed, and the heat conduction rate in the closed cavity is affected, and further the heat dissipation effect of the soaking structure 1 is affected, the width b2 of each second capillary structure 12 may be 0.2mm to 2.5mm, for example, the width b2 of each second capillary structure 12 may be 0.2mm, 0.4mm, 0.6mm, 1.0mm, 1.5mm, 2.0mm, or 2.5mm, and the like.
Optionally, in order to ensure that the gas channel 1a formed between two adjacent second capillary structures 12 can meet the use requirement that the gaseous working fluid flows from the heat generating region 10a to the condensing region 10b quickly, and at the same time, avoid that the liquid condensed in the gas channel 1a by the working fluid due to the too wide gas channel 1a is retained in the gas channel 1a because the liquid cannot contact with the second liquid channel 1c, which affects the backflow of the liquid, thereby affecting the heat dissipation effect of the heat soaking structure 1, the width d of each gas channel 1a may be 0.2mm-2.5mm, for example, the width d of each gas channel 1a may be 0.2mm, 0.4mm, 0.6mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, or 2.5 mm.
Alternatively, the width h2 of the second liquid channel 1c may be the same as the width h1 of the first liquid channel 1b and the width h3 of the capillary groove 1d, and the width h2 of the second liquid channel 1c may satisfy 10 μm to 200 μm, for example, the width h2 of the second liquid channel 1c may be 10 μm, 30 μm, 50 μm, 70 μm, 90 μm, 110 μm, 150 μm, or 200 μm, etc., the width h2 of the second liquid channel 1c is not too large, and if the width h2 of the second liquid channel 1c is too large, the capillary force of the second liquid channel 1c is insufficient, which may affect the flow of the working fluid in the liquid state in the second liquid channel 1 c. If the width h2 of the second liquid passage 1c is too small, the second liquid passage 1c is formed in the plate body 10 with a high degree of difficulty. Therefore, when the second liquid passage 1c is formed between the adjacent two sets of the second capillary units 120, the width h2 of the second liquid passage 1c may be set to 10 μm to 200 μm.
Adopt soaking structure 1 that this application embodiment disclosed, through making to form gas channel 1a between two adjacent first capillary 11 and the second capillary 12, make gas channel 1a and first liquid channel 1b and second liquid channel 1c spaced apart, thereby can effectively prevent that the working fluid from taking place the problem of interference at liquid and gaseous phase transition in-process, make the emergence of the phase transition of working fluid more smooth and easy, effectively improve soaking structure 1's radiating effect.
More specifically, by arranging the plurality of first capillary structures 11 to be radially distributed toward the condensation zone 10b with the heat-generating zone 10a as the center, the path length of the liquid working fluid condensed in the condensation zone 10b to flow back to the heat-generating zone 10a is greatly reduced, the heat dissipation efficiency of the heat-equalizing structure 1 is improved, by arranging the plurality of second capillary structures 12 between two adjacent first capillary structures 11, one end of each second capillary structure 12 is adjacent to the first capillary structure 11, and the other end of each second capillary structure 12 extends to the condensation zone 10b along the first direction X or the second direction Y of the plate body 10, so that not only the liquid can flow back from any position of the condensation zone 10b to flow to the first capillary structure 11 through the second capillary structure 12 to flow back to the heat-generating zone 10a, thereby avoiding the dry burning caused by insufficient liquid working fluid in the heat-generating zone 10a, but also the distribution of the second capillary structures 12 on the plate body 10 can be more regular, the difficulty of planning and designing the distribution of the second capillary structures 12 on the plate body 10 is reduced.
In a second aspect, referring to fig. 8, the present application further discloses an electronic device 2, and the electronic device 2 of the present application includes a heat generating source 21 and the soaking structure 1 as described in the first aspect. The soaking structure 1 is connected to the heat generating source 21. Specifically, the electronic device 2 may include, but is not limited to, a smart phone, a smart watch, a tablet computer, a handheld game console, and the like. The heat generating source 21 may be an electronic device in the electronic apparatus 2 that emits heat during operation, and may illustratively be a battery, a chip (or a motherboard), a camera, a flash, a speaker, or the like.
When actually setting up, because of generating heat source 21 is located inside electronic equipment 2, then correspond with it, this soaking structure 1 also sets up in electronic equipment 2's inside, and this soaking structure 1 can adopt and directly paste the mode of establishing on generating heat source 21 and link to each other with generating heat source 21 to can carry out the condensation in conduction to soaking structure 1 with the heat as much as possible, and then reach heat dissipation, cooling effect.
The electronic equipment 2 disclosed in the second aspect of the embodiment of the present application can achieve the effects of rapid heat dissipation and cooling by performing heat treatment on the heat generation source 21 through the arrangement of the soaking structure 1. In addition, because the whole thickness of the soaking structure 1 is very light and thin, the soaking structure is arranged in the electronic equipment 2, and the occupied space of the electronic equipment 2 is small, so that the soaking structure 1 can be suitable for the electronic equipment 2 with high requirements on light and thin design, and the application range is wide.
The heat equalizing structure and the electronic device disclosed in the embodiments of the present invention are described in detail above, and the principle and the embodiments of the present invention are explained in the present document by applying specific examples, and the description of the embodiments above is only used to help understanding the heat equalizing structure and the electronic device of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A heat equalizing structure, comprising: the plate body is provided with a heating area and a condensation area positioned on the periphery of the heating area;
the plate body is provided with a plurality of first capillary structures and a plurality of second capillary structures, the first capillary structures are radially distributed towards the condensation area by taking the heating area as a center, a gas channel is formed between every two adjacent first capillary structures, and a first liquid channel is formed in each first capillary structure;
in the plurality of first capillary structures, a plurality of second capillary structures are arranged between two adjacent first capillary structures, one ends of the second capillary structures are arranged close to the first capillary structures, the other ends of the second capillary structures extend to the condensation area along the first direction and/or the second direction of the plate body, the gas channel is formed between the two adjacent second capillary structures, the gas channel formed between the second capillary structures is communicated with the gas channel formed between the first capillary structures, a second liquid channel is formed in the second capillary structures, and the second liquid channel is communicated with the first liquid channel;
wherein the first direction of the plate body is perpendicular to the second direction.
2. The heat soaking structure according to claim 1, wherein the first capillary structure comprises a plurality of groups of first capillary units, and two adjacent groups of the first capillary units are arranged at intervals to form the first liquid channel;
the second capillary structure comprises a plurality of groups of second capillary units, and the second liquid channels are formed between two adjacent groups of second capillary units at intervals.
3. The heat equalizing structure according to claim 1, wherein an end of the second capillary structure adjacent to the first capillary structure is connected to the second capillary structure.
4. The vapor permeation structure according to claim 3, wherein a part of the plurality of second capillary structures are first sub-capillary structures, and another part of the plurality of second capillary structures are second sub-capillary structures, one end of the first sub-capillary structure is connected to the first capillary structure, the other end of the first sub-capillary structure extends to the condensation zone along the first direction of the plate body, one end of the second sub-capillary structure is connected to the first capillary structure, and the other end of the second sub-capillary structure extends to the condensation zone along the second direction of the plate body;
the gas channels are formed between two adjacent first sub-capillary structures, two adjacent second sub-capillary structures and between the adjacent first sub-capillary structures and the adjacent second sub-capillary structures, and the second liquid channels of the first sub-capillary structures are communicated with the second liquid channels of the second sub-capillary structures.
5. The heat equalizing structure according to any one of claims 1 to 4, wherein the width b1 of the first capillary structure is the same as the width b2 of the second capillary structure, and the width b1 of the first capillary structure is 0.2mm to 2.5 mm; the width d of the gas channel is 0.2mm-2.5 mm; the width h1 of the first liquid channel is the same as the width h2 of the second liquid channel, and the width h1 of the first liquid channel is 10 μm to 200 μm.
6. The heat equalizing structure according to any one of claims 1 to 4, wherein the surface of the plate body on which the first capillary structure and the second capillary structure are provided is a first surface, and the sum of the areas of the first capillary structure and the second capillary structure on the first surface is S1The total area of the gas passages on the first surface is S2，S1And S2The ratio of (A) is in the range of 0.6-1.5.
7. The heat soaking structure according to claim 6, wherein the sum of areas of the first and second capillary structures in the heat generating region on the first surface is S3The total area of the gas channel in the heating area is S4，S3And S4The ratio of (A) is in the range of 1 to 5.
8. The soaking structure according to any one of claims 1 to 4, wherein the plate body is a rectangular plate having two sides perpendicular to each other, the first direction is parallel to one of the two sides of the plate body, and the second direction is parallel to the other of the two sides of the plate body.
9. The soaking structure according to any one of claims 1 to 4, wherein the plate body comprises a first plate body and a second plate body hermetically connected to the first plate body, the first plate body and the second plate body are provided with the first capillary structure and the second capillary structure, and each of the first capillary structure and the second capillary structure on the first plate body is correspondingly connected to each of the first capillary structure and the second capillary structure on the second plate body.
10. An electronic apparatus characterized by comprising a heat generation source and the heat equalizing structure according to any one of claims 1 to 9, the heat generation source being provided in correspondence with the heat generation region of the heat equalizing structure.
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Effective date of registration: 20220510 Address after: Room 1020, 2nd floor, Yangke Road, Xinchang District, Xinjiang District, Jiangxi Province Patentee after: Jiangxi Xinfei New Material Co.,Ltd. Address before: Room 422, 4th floor, building 1, Linrui youth apartment, 955 rulehu street, Airport Economic Zone, Nanchang City, Jiangxi Province 330000 Patentee before: Jiangxi zhanyao Microelectronics Co.,Ltd. |