KR100506087B1 - Electronic apparatus having high efficient cooling means - Google Patents

Abstract

An electronic device having a high efficiency cooling means is disclosed. The disclosed electronic device includes a heating member having at least one heat source mounted on at least one surface thereof, and cooling means for cooling the heating member, wherein the cooling means has at least one groove for inserting and fixing the heating member. It is characterized by including. By using the present invention, since the entire heating member can be cooled evenly regardless of the mounting position of the heating member, the temperature difference for each region in the heating member can be minimized. In addition, since the cooling means can be manufactured using a semiconductor process, the volume of the region in which the heat generating member is mounted can be reduced, and this result corresponds to the miniaturization of the electronic device.

Description

Electronic apparatus having high efficient cooling means

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly, to an electronic device provided with cooling means capable of obtaining an even cooling effect across an entire heating element such as a memory module provided in a computer.

With the development of semiconductor technology, as the degree of integration of memory chips has increased, the volume of memory devices (memory modules) composed of a plurality of memory chips has been greatly reduced. However, as the degree of integration of memory chips increases, the amount of heat generated in the unit area of the memory chips also increases, and the heat generation problem of not only the CPU but also the memory device has become one of the important issues for estimating the reliability of the memory device.

Accordingly, a cooling fan is provided as a means for cooling the high heat generating element using air circulation in an electronic device, for example, a computer in which high heat generating elements such as a CPU and a memory module are incorporated.

When the cooling fan is installed in the computer, the heat generation problem with the CPU and the heat generation problem with the memory module mounted around the CPU seem to be solved. However, the heat generation problem of the memory module depends on the mounting position of the memory module and the thermal environment in the computer. Requires the introduction of new cooling methods, such as selective cooling, which selectively cools only certain heating elements, rather than computer-wide cooling using cooling fans.

Specifically, a 2GB (Giga Byte) memory module generates about 27.7W of heat, and when such a memory module is mounted perpendicular to the cooling fan or mounted behind the CPU, air and memory supplied from the cooling fan are installed. Since the real area to which the modules come in contact becomes very narrow, the above-mentioned memory module is difficult to cool sufficiently. For this reason, the temperature of the memory module mounted vertically to the cooling fan and the memory chip mounted to the memory module mounted to the rear of the CPU is frequently raised above the maximum allowable temperature set for stable operation of the memory chip.

Given the trend toward higher capacity memory modules, this is expected to become more frequent. For example, for a 4GB memory module, the heat generation is expected to be about 50W, much higher than 2GB. Therefore, a cooling means separate from the cooling fan is required only for the memory module mounted vertically to the cooling fan and the memory module mounted to the rear of the CPU.

Accordingly, the memory module cooling means as shown in FIG. 1 has recently been proposed.

Referring to FIG. 1, the memory module cooling means (hereinafter, referred to as a conventional cooling means) shown in FIG. 1 uses a solid heat diffusion convection method, and includes first and second portions respectively provided at both sides of the memory module 10. It consists of thin plates 18 and 24. A plurality of chips 12 are mounted on the first and second surfaces of the memory module 10, respectively. The plurality of chips 12 are mounted to face each other on the first and second surfaces. Since the first and second thin plates 18 and 24 are in contact with the chips 12 mounted on the first and second surfaces of the memory module 10, the heat generated from the chips 12 is first and second. It spreads quickly throughout the two thin plates 18 and 24. This spread heat is removed from the first and second thin plates 18, 24 by air supplied from a cooling fan (not shown). Through this process, the chip 12 is cooled. Both the first and second thin plates 18 and 24 are composed of two parts. The first thin plate 18 has a first thermal interface material (TIM) 14 and a chip 12 in direct contact with the chip 12. The first heat conduction plate 16 is configured to spread heat from the large area, and the second thin plate 24 includes the second TIM 20 and the first heat conduction plate 16 which are equivalent to the first TIM 14. And a second heat conductive plate 22 equivalent to. The first and second heat conductive plates 16 and 22 are both aluminum plates.

As shown in FIG. 2, the first and second TIMs 14 and 20 serve to attach the first and second thermal conductive plates 16 and 22 to the chip 12, respectively.

On the other hand, the total heat resistance (R) for the conventional cooling means shown in Figure 1 is represented by the following equation (1).

In Equation 1, T _W and T _air are the heat source, that is, the temperature of the memory module 10 and the air temperature around the memory module 10, respectively, and Q is from the first or second side of the memory module 10. Total calories generated.

As can be seen in FIG. 1, the total thermal resistance R in one direction of the memory module 10, for example, the direction facing the first surface, is determined by the thermal resistance R _TIM due to the first TIM 14. 1 The sum of the heat resistance (R _plate ) attributable to the heat conduction plate 16 and the heat resistance (R _air ) attributable to _air .

The thermal resistance R _plate due to the first thermal conductive plate 16 and the thermal resistance R _air due to _air are given by Equations 2 and 3, respectively.

In Equations 2 and 3, k is heat conduction, A is the area of the first surface of the first heat conduction plate 16, t is the thickness of the first heat conduction plate 16, and h is the flow velocity of air.

In the case of the conventional cooling means described above, there is an advantage that the mounting is simple and the price is low.

However, in electronic devices such as computers, the airflow of the cooling fan is constant. Therefore, even when a thin plate for heat transfer is provided between the memory modules, the heat conduction capability of the thin plate is reduced due to the narrow space between the memory modules.

In order to avoid such a problem, the distance between the memory modules must be further increased, in which case, the area in which the memory module is mounted in the electronic device is widened, thereby increasing the volume of the electronic device. Given the current trend in miniaturization of electronic devices, this result is undesirable.

SUMMARY OF THE INVENTION The present invention has been made in an effort to improve the above-described problems of the related art, and to provide an electronic device having a high cooling efficiency for a heating element and a cooling means capable of reducing a volume.

In order to achieve the above technical problem, the present invention includes a heat generating member having at least one heat source mounted on at least one surface of the electronic device, and cooling means for cooling the heat generating member, wherein the cooling means includes the heat generating unit. An electronic device comprising at least one groove for inserting and fixing a member.

Preferably, the cooling means is formed in a single body and the groove is in the shape of an elongated slot.

Wrinkles extending in a predetermined direction are formed on either or both of the outer and inner surfaces of the cooling means.

The cooling means is inserted into and fixed in direct contact with the heat generating member.

Both ends of the cooling means are further provided with a flat plate heat transfer device for removing heat emitted from the groove.

The flat plate heat transfer device is attached to the lower plate mounted at both ends of the cooling means, the lower plate is in close contact with the edge of the lower plate at a position facing the lower plate, and the upper plate spaced apart from the lower plate by a predetermined interval and the predetermined area of the lower plate. It consists of a wick plate.

The region between the upper surface of the cooling means and the groove extends by a predetermined length in the longitudinal direction, and the heat pipe is embedded in the extended region.

A heat transfer device for cooling the heat pipe is further mounted on the bottom or top of the extended area.

Wrinkles are formed on at least one side of the cooling means.

The present invention also provides an electronic device having a memory module equipped with a memory chip and a cooling means for cooling the memory module in order to achieve the technical problem, wherein the cooling means is a memory mounted on one side of the memory module; A first heat transfer device for cooling a chip and a cooling means for cooling the chip mounted on the other side of the memory module, wherein the first heat transfer device is a memory mounted on one side of the memory module. A bottom plate in contact with the chip at the same time; An upper plate that is in close contact with the edge of the lower plate and is spaced apart from the lower plate by a predetermined distance internally; And it provides an electronic device comprising a wick plate mounted in a predetermined region of the lower plate.

In this case, the cooling means includes a lower plate which is in contact with the memory chip mounted on the other surface of the memory module; An upper plate closely contacted with an edge of the lower plate, and spaced apart from the lower plate by a predetermined distance internally; And a wick plate mounted on a predetermined region of the lower plate.

The wick plate is provided with a wick region in one-to-one correspondence with the memory chip.

A partition for dividing the inner region of the upper plate by the number of memory chips mounted on any one surface of the memory module is provided inside the upper plate.

Wrinkles are formed in at least one of an outer surface and an inner surface of the upper plate in a predetermined direction.

The first and second heat transfer devices are integrally formed, and wrinkles are formed on each surface thereof.

The present invention also provides an electronic device having a memory module equipped with a memory chip and a cooling means for cooling the memory module in order to achieve the technical problem, wherein the cooling means includes at least two to which the memory module can be inserted. A heat transfer apparatus having a single body having two grooves formed therein, wherein the heat transfer apparatus includes: a lower structure in which the at least two grooves are formed and a predetermined space is secured between the grooves; A wick structure provided along a surface of the substructure; And an upper structure surrounding the groove, wherein a space for accommodating vapor generated in the process of vaporizing the liquid refrigerant flowing between the lower structure and the wick structure is provided between the upper structure and the wick structure, and the lower structure An electronic device is provided in which sealing panels are adhered to both ends of a structure, a wick structure, and an upper structure.

Wrinkles are formed on at least one of an outer surface and an inner surface of the upper structure.

In the space between the wick structure and the upper structure, a partition wall for dividing the space into a plurality of regions is provided in the longitudinal direction of the memory module.

Wrinkles are formed on the surface of the upper structure.

By using the cooling means provided in the electronic device of the present invention, it is possible to evenly cool the entire heat generating member regardless of the mounting position of the heat generating member, for example, the memory module, on which the heat generating element such as a semiconductor chip is mounted. Therefore, it is possible to minimize the temperature difference by region in the heat generating member. In addition, since the cooling means can be manufactured using a semiconductor process, it is possible to reduce the volume of the region in which the heat generating member is mounted. This result corresponds to the miniaturization of the electronic device.

Hereinafter, a memory module having a cooling means and an electronic device having the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this process, the thicknesses of layers or regions illustrated in the drawings are exaggerated for clarity.

First, the configuration of an electronic device (hereinafter referred to as a computer) according to an embodiment of the present invention will be briefly described.

As shown in FIG. 3, the computer 38 includes a central processing unit 40, a main / secondary storage device 42, an I / O interface 44 to which an input / output device is connected, a power supply 46, and the like. do. In the main and auxiliary memory device 42, the main memory device is composed of a plurality of memory modules composed of ROM and RAM, and the auxiliary memory device is composed of a hard disk, a floppy disk, an optical disk, and the like. At this time, cooling means (not shown) are provided in the memory modules constituting the main memory. The cooling means will be described later. The cooling means is not a thin plate form in contact with the memory chips provided on one side of the memory module as in the prior art but is a unit having a groove formed to cover the entire memory module or at least two or more memory modules, respectively. Preferred but may be in form or case. Therefore, by using the cooling means, it is possible to simultaneously cool all the memory chips mounted on one memory module or at least two or more memory modules by one cooling means. The groove is preferably an elongated slot. Therefore, the groove may have various shapes according to the object to be inserted.

Next, the cooling means will be described.

<First Embodiment>

The cooling means (hereinafter referred to as first cooling means) 50 according to the first embodiment relates to a cooling means used for cooling one memory module, that is, a cooling means having one groove. Hereinafter, the groove is called a slot.

Specifically, as shown in FIG. 4, the first cooling means 50 is a form or case that can wrap the entire memory module (see 10 of FIG. 1), and has a first length L1 equivalent to that of the memory module. Has It is preferable that the material of the 1st cooling means 50 is aluminum. If necessary, it may be made of another material having excellent thermal conductivity such as copper or silver. When the first cooling means 50 is mounted to the memory module, all of the memory chips (see 12 in FIG. 1) mounted on both surfaces of the memory module are preferably covered by the first cooling means 50. Therefore, the height H of the first cooling means 50, preferably the height of the slot 52, which is a space into which the memory module is inserted, is the height H ₀ of the memory chip 12, the memory chip 12, and the memory. It is preferably at least equal to the sum of the intervals d ₀ between the tops of the modules 10. Two surfaces having a predetermined first thickness t1, which are in contact with the memory chips 12 mounted on both surfaces of the memory module 10 of the first cooling means 50, are connected upwards of the memory module 10. In other words, the first cooling means 50 is a single structure or a single housing having a structure that is in contact with the entire memory chip 12 mounted on both sides of the memory module 10 at the same time.

11 or 12, when the first cooling means 50 is mounted on the memory module 92, the first cooling means 50 is mounted on the two surfaces of the first cooling means 50 and the memory module 92. It is preferable that the front surface of the memory chip 92a is completely in contact with no gap. Therefore, the gap between the two surfaces of the first cooling means 50, that is, the width W of the slot 52, is exactly the same as the thickness T of the portion where the memory chip 92a of the memory module 92 is mounted. It is preferable.

Second Embodiment

This is a case where the surface shape of the first cooling means 50 is modified in order to widen the surface area in contact with the wind supplied by the cooling fan.

In the following examples including the second embodiment, the same reference numerals or symbols used in the first embodiment are used for the same members as those mentioned in the first embodiment. The description of the same member is omitted.

Referring to FIG. 5, the cooling means (hereinafter referred to as a second cooling means) 50 ′ according to the second embodiment of the present invention has the same shape as the first cooling means 50. However, wrinkles 54 are formed on the surface of the second cooling means 50 '. The corrugation 54 is formed in the direction of the first length L1 of the second cooling means 50 '. The corrugation 54 is preferably formed in such a way that the wind coming from the cooling fan can come into contact with a larger area of the second cooling means 50 'in consideration of the position where the cooling fan is installed. Accordingly, the pleats 54 may be formed in a direction perpendicular to the first length L1 direction or diagonally. In addition, unlike in the drawings, the wrinkles may be formed only on a portion of the surface of the second cooling means 50 ′, for example, the portion that is most exposed to the wind coming from the cooling fan, or vice versa. have. Since the pleats 54 are formed on the second cooling means 50 'periodically, the thickness of the second cooling means 50' also changes periodically. It is preferable that the thickness (hereinafter referred to as a second thickness) t2 of the portion where the pleats 54 of the second cooling means 50 'are convex is the same as the first thickness t1 of the first cooling means 50. .

Third Embodiment

The present invention relates to cooling means capable of cooling the entire memory module at once when at least two or more memory modules are concentrated. For convenience of explanation, assuming that three memory modules are concentrated, a description will be given of cooling means for cooling the three memory modules at once.

Specifically, referring to Figure 6, the cooling means (hereinafter referred to as the third cooling means) 56 according to the third embodiment of the present invention is the same as the first cooling means 50, the first length (L1) And height (H). First to third slots 58, 60, and 62 are formed in the third cooling means 56. One memory module is inserted into each of the first to third slots 58, 60, and 62. Each of the first to third slots 58, 60, 62 has the same width W as the slot 52 of the first cooling means 50. It is preferable that other conditions of each of the first to third slots 58, 60, and 62 are also equivalent to the slots 52 of the first cooling means 50. The first partition wall 56a exists between the first and second slots 58 and 60, and the second partition wall 56b exists between the second and third slots 60 and 62. In addition, the third cooling means 56 includes a first outer wall 57a that defines a region of the first slot 58 together with the first partition 56a, and a third slot 62 together with the second partition 56b. There is a second outer wall 57b defining the region. The first and second partition walls 56a and 56b and the first and second outer walls 57b both have a first thickness t1, and may be different thicknesses. In particular, in the case of the first and second barrier ribs 56a and 56b, it is desirable to be as thin as possible in order to reduce the volume of the area where the memory module is mounted by narrowing the distance between the memory modules. Upper ends of the first and second partition walls 56a and 56b and the first and second outer walls 57a and 57b are connected to an upper end of the memory module. Thus, like the first cooling means 50, the third cooling means 56 is also in the form of a form or case that can simultaneously wrap three memory modules.

13 and 14 illustrate a case in which the third cooling means 56 is mounted on the first to third memory modules 94, 96, and 98 mounted on the PCB substrate 90.

As shown in FIGS. 13 and 14, the third cooling means 56 is mounted to surround all of the first to third memory modules 94, 96, and 98 at once. As shown in FIG. 14, the third cooling means 56 is mounted in close contact with the memory chips 94a, 96a and 98a mounted on both surfaces of the first to third memory modules 94, 96 and 98.

Fourth Example

The same premise as that applied to the third embodiment applies.

Referring to FIG. 7, the memory module cooling means (hereinafter referred to as a fourth cooling means) 56 ′ according to the fourth embodiment of the present invention has the same shape as that of the third cooling means (56 in FIG. 6). As a result, wrinkles 64 are present on the surface. The wrinkles 64 are formed periodically in the direction of the first length L1. This corrugation 64 is preferably formed on the front surface of the fourth cooling means 56 'as shown in the figure, but the area in contact with a portion of the surface of the fourth cooling means 56', for example, the wind from the cooling fan. It can only be formed in this non-wide part. As the corrugations 64 are formed periodically, the thicknesses of the remaining portions of the fourth cooling means 56 'except for the first and second partition walls 56a and 56b also change periodically. It is preferable that the convex part of the corrugation 64 is 1st thickness t1, and it is preferable that the 1st and 2nd partitions 56a and 56b also become 1st thickness t1. The remaining part of the fourth cooling means 56 ′ is the same as the third cooling means 56.

Meanwhile, in FIGS. 13 and 14, the third cooling means 56 mounted on the main memory device 100 composed of the first to third memory modules 94, 96, and 98 is the fourth cooling means 56 ′. Can be replaced by). Therefore, when the main memory device 100 is mounted to the rear of the CPU or mounted in a direction perpendicular to the cooling fan, the cooling efficiency of the main memory device 100 can be improved by mounting the third cooling means 56 to the main memory device 100. It can raise more fully. In addition, a uniform cooling effect may be obtained over the entire area of the main memory device 100. When the third cooling means 56 is replaced by the fourth cooling means 56 ′ having the pleats 64 formed on the surface, the surface area of the fourth cooling means 56 ′ is much higher than that of the third cooling means 56. Since it is wide, the cooling efficiency and cooling uniformity of the main memory 100 become higher.

Fifth Embodiment

The same premise as that applied to the third embodiment applies.

Referring to Fig. 8, the cooling means (hereinafter referred to as the fifth cooling means) 56 "according to the fifth embodiment of the present invention is composed of two parts. The first portion 65 is mounted to the memory module. Body, for example, the third cooling means 56 or the fourth cooling means 56 '. The second portions 66 and 68 are flat plate heat transfer devices mounted at both ends of the first portion 65. When the fifth cooling means 56 ″ is mounted on the memory module, all sides of the memory module are surrounded by the cooling means. In other words, since the first portion 65 of the fifth cooling means 56 "is in contact with all the memory chips mounted in the memory module, both sides of the memory module are surrounded by the first portion 65, and Since the two parts 66 and 68 are mounted at both end surfaces of the first part 65, both ends of the memory module are surrounded by the second part 65.

As can be seen through the third or fourth cooling means 56, 56 ′, only the first portion 65 of the fifth cooling means 56 ″ can achieve a sufficient cooling effect on the memory module. Since both ends of the first to third slots 58, 60, and 62 of the third cooling means 56 or the fourth cooling means 56 'are open, the heat generated in the memory module is reduced by a small amount. The second portions 66 and 68 are for quickly removing heat from the memory module through the open areas of the first to third slots 58, 60 and 62.

The second portions 66, 68 of the fifth cooling means 56 ″ are provided with a first flat plate heat transfer device 66 mounted at one end of the first portion 65 and a second flat plate heat transfer device mounted at the other end ( 68. The first and second flat plate heat transfer devices 66 and 68 each have a configuration as shown in FIG.

Specifically, referring to FIG. 9, the first plate heat transfer device 66 or the second plate heat transfer device 68 is a lower plate 70, a wick plate 72 mounted on a predetermined region of the lower plate 70. The upper plate 74 is in contact with the rest of the lower plate 70 on which the wick plate 72 is mounted. The lower plate 70 is in contact with both ends of the first portion 65 of the fifth cooling means 56 ". Thus, through both ends of the first portion 65, the third cooling means 56 or the fourth cooling means. Heat released through the open areas of the first to third slots 58, 60, 62 of the means 56 ′ is transferred to the second portions 66, 68 through the bottom plate 70. Although not, the wick plate 72 is formed with a plurality of holes, which are regions in which the liquid refrigerant supplied between the wick plate 72 and the lower plate 70 is evaporated, and a planar wick exists between the plurality of holes. As the heat is transferred to the second portions 66 and 68, the liquid refrigerant evaporates through the plurality of holes of the wick plate 72. The liquid refrigerant is lower plate 70 and the wick plate through the planar wick. It is supplied between the 72. For the supply of this liquid refrigerant, a capillary force is applied between the wick plate 72 and the lower plate 70. There is a small gap that can be seen There is a predetermined space 76 between the top plate 74 and the wick plate 72. In the space 76, the plurality of holes of the wick plate 72 is formed. The steam generated therethrough is located in. Since the outer surface of the top plate 74 is in contact with the wind supplied from the cooling fan, the steam present in the space 76 is cooled in contact with the top plate 74. As a result, The liquid refrigerant flows down the lower plate 70 along the inner surface of the upper plate 74, and the liquid refrigerant thus flowed down the wick plate 72 through the planar wick of the wick plate 72, as described above. ) And the bottom plate 70 is supplied.

On the other hand, since the surface of the upper plate 74 is cooled by the wind coming from the cooling fan, it is preferable to make the surface area of the outer surface as wide as possible. To this end, wrinkles (not shown) may be formed on the top plate 74. In this case, the wrinkles may be equivalent to the wrinkles 54 and 64 as shown in FIG. 5 or FIG. 7. Instead of forming the pleats on the surface of the top plate 74, all or a portion of the top plate 74, for example, the top itself may be formed to be pleated. In addition, in order to smoothly supply the liquid refrigerant from the upper plate 74 to the lower plate 70, a capillary pattern may be provided inside the side surface of the upper plate 74.

Sixth Embodiment

The premise of the third embodiment applies.

Referring to FIG. 10, the cooling means (hereinafter referred to as a sixth cooling means) 80 according to the sixth embodiment includes first to third slots 58, 60, and 62 having a first length L1. And a portion 84 formed of a second length L2 on which the portion 82 and the second cooling fan F are mounted. Therefore, the total length L3 (hereinafter referred to as a third length) of the sixth cooling means 80 is equal to the sum of the first length L1 and the second length L2. The portion 84 formed with the second length L2 has an upper portion except for the first to third slots 58, 60, and 62 in the portion 82 where the first to third slots 58, 60, and 62 are formed. 82a is extended by the 2nd length L2 in one direction. Thus, the two parts are integrated. On the bottom of the portion extending to the second length L2, a fan (hereinafter referred to as a dedicated cooling fan) F for cooling only the heat pipe separately from the cooling fan (hereinafter referred to as a system cooling fan) is mounted. have. The dedicated cooling fan F may be provided at the top instead of the bottom of the extended portion. The portion extending by the second length L2 has a predetermined thickness H1, which is the thickness of the slot at the thickness H2 of the portion where the first to third slots 58, 60, and 62 are formed. Same as limiting height. Heat pipe 86 in the upper portion except for the first to third slots 58, 60 and 62 having a predetermined thickness H1 in the portion 82 where the first to third slots 58, 60 and 62 are formed. ) Is implied. The heat pipes 86 are preferably equal to the slots so as to correspond to the first to third slots 58, 60, and 62 one by one. The heat pipes 86 are provided in parallel with each other from one side of the first to third slots 58, 60, 62 to the end of the portion extending to the second length L2. The two parts integrated are made of a material having excellent thermal conductivity, such as aluminum, copper or silver, as in the first to fifth cooling means. When the sixth cooling means 80 is mounted to the memory module and used to cool the memory module, the heat generated from the memory module is transferred to the first and second partition walls 56a and 56b of the sixth cooling means 80. And through the first and second outer walls 57a, 57b to the upper portion 82a of the first to third slots 58, 60, 62. There is a heat pipe 86 in the upper portion 82a, and the heat pipe 86 is embedded up to the extended portion having the second length L2.

On the other hand, the heat pipe 86 is composed of an outer shell 86b having a predetermined thickness and an air portion 86a surrounded by the outer shell 86b, as shown in the cross section on the right side of FIG. 10. The air portion 86a is a region in which vapor generated in the process of vaporizing the liquid refrigerant is moved, and the outer shell 86b is a heat source (herein, the first to third slots in which the memory module is inserted) by the capillary force. 58, 60, 62) is a path to be moved to).

The heat concentrated by the heat pipe 86 to the upper portion 82a of the portion 82 in which the first to third slots 58, 60, and 62 are formed is supplied to the shell 86b of the heat pipe 86. The liquid refrigerant is vaporized, and the steam generated in this process is moved through the air portion 86a of the heat pipe 86 to the extended portion 84 and cooled by the dedicated cooling fan. At this time, the heat of the steam is removed to the outside.

When the heat pipe 86 is provided as the sixth cooling means 80, the first thickness H1 of the upper portion 82a of the first to third slots 58, 60, and 62 is third to fifth. It is true that it is thicker than the thickness of the corresponding part of the cooling means 56, 56 ', 56 ". However, the heat transfer characteristics of the heat pipe 86 are excellent. And the heat pipe 86 and the first to third slots are excellent. The spacing between 58, 60, 62 is equal to or less than the thickness of the corresponding portion of the third to fifth cooling means 56, 56 ′, 56 ″. Therefore, when the heat pipe 86 is provided as one element of the cooling means, heat can be removed from the memory module more quickly than otherwise, and heat is concentrated in any part or area of the memory module. Can be prevented.

Although not shown in the figure, the sixth cooling means 80 may be provided with other heat transfer means instead of the heat pipe 86, which serves an equivalent. For example, a flat plate heat transfer device 66 shown in FIG. 9 having a third length L3 at the location where the heat pipe 86 is embedded may be embedded.

Seventh Example

A cooling means for cooling a single memory module.

Referring to FIG. 15, the cooling means (hereinafter, referred to as a seventh cooling means) 120 and 122 according to the seventh embodiment may include first to sixth cooling means 50, 50 ′, 56, 56 ′, 56 ″. Unlike the integrated form, 80 is provided on both sides of the memory module 110. The cooling means 120 provided on the left side of the memory module 110 among the seventh cooling means 120 and 122. (Hereinafter, referred to as a first element) is in contact with memory chips mounted on the left side of the memory module 110 among the memory chips 110a mounted on the memory module 110, and cooling means 122 provided on the right side. (Hereinafter, referred to as a second element) is in contact with memory chips mounted on the right side of the memory module 110. The first and second elements 120 and 122 both have a predetermined height H3. The height H3 is preferably at least greater than the height of the memory chip 110a. The first and second elements 120 and 122 are symmetric about the memory module 110. The first and second elements 120, In the latter case, the first element 120 is a flat plate heat transfer device, and the second element 122 is a heat transfer device. The configuration may be other flat heat transfer devices or may consist of multiple heat pipes.

FIG. 16 is a perspective view showing a configuration of one element (eg, the second element 122) when both the first and second elements 120 and 122 are configured in the same manner. When 120 and 122 are configured differently, it may be a perspective view showing the configuration of any one element.

Referring to FIG. 16, the second element 122 may include a lower plate 122a in contact with the memory chip 110a and a wick plate 122b mounted on the rear surface of the region in contact with the memory chip 110a of the lower plate 122a. And an upper plate 122c in close contact with the lower plate 122a at a position facing the lower plate 122a about the wick plate 122b. Although the wick plate 122b may be simply mounted on the rear surface of the lower plate 122a, the area PA in which the wick plate 122b of the lower plate 122a is mounted is thick as shown in the drawing. After removing as much, it is preferable to mount the wick plate 122b there. When the wick plate 122b is mounted as in the latter case, the wick plate 122b can be easily mounted and the movement of the wick plate 122b can be reduced after the wick plate 122b is mounted. The contact of the wick plate 122b and the lower plate 122a is maintained by the surface tension of the liquid refrigerant flowing between both sides. In order to allow the liquid refrigerant to flow between the lower plate 122a and the wick plate 122b, and the liquid refrigerant introduced between the lower plate 122a and the wick plate 122b is absorbed and vaporized from the memory chip 110a. In order to be able to do so, there are a plurality of wick regions WA1, WA2,... WAn in which a wick pattern is formed in the wick plate 122b. The wick regions WA1, WA2,... WAn correspond one-to-one with the memory chip 110a mounted in the memory module 110, respectively. In the wick regions WA1, WA2,... WAn, various types of wick patterns may be formed to induce capillary forces with respect to the liquid refrigerant. In addition, a pattern (eg, protrusion) (not shown) may be provided between the plurality of wick regions WA1, WA2,... WAn to maintain a minute gap between the lower plate 122a and the wick plate 122b. have. This pattern is for allowing the liquid refrigerant to be smoothly supplied between each of the wick regions WA1, WA2,... WAn, corresponding to the minute gap between the lower plate 122a and the wick plate 122b. It can be replaced by having a spacer with a thickness. The plurality of wick regions WA1, WA2,... WAn may be connected to one another without being divided as shown in the drawing.

17A to 17G show various examples of the wick plate 122b.

First, referring to (a), the plurality of wick regions WA1, WA2,... WAn are spaced apart by a predetermined interval d. As shown in (b), when the wick is formed evenly over the entire area of the wick plate 122b, the entire area of the wick plate 122b becomes one wick area. The interval between WA2, ... WAn) becomes unnecessary. Since the wick regions WA1, WA2,... WAn respectively correspond one-to-one with the memory chip 110a, the interval d between the wick regions WA1, WA2,... WAn is the memory module 110. It is preferable to correspond to the interval between the memory chip (110a) mounted on the). Since the wick regions WA1, WA2,... WAn formed in the wick plate 122b are all equivalent, the description of the first wick region WA1 is performed on the remaining wick regions WA2,... WAn. Replace description.

Specifically, the first hole h1 is formed in the first wick area WA1. The first holes h1 are uniformly formed at the first interval D1 in the horizontal direction, and are spaced apart at the same interval as the first interval D1 in the vertical direction. The wick 124 is formed between the first holes h1. Accordingly, the first interval D1 is preferably such that the capillary force is applied to at least the liquid refrigerant flowing into the wick plate 122b. The first hole h1 is a region in which steam generated in the process of vaporizing the liquid refrigerant supplied through the wick 124 is discharged. The first hole h1 is a rectangle formed in a direction perpendicular to the longitudinal direction of the wick plate 122b, that is, in a vertical direction. This shape of the first hole h1 is related to the direction in which the liquid refrigerant is fed back. 15 and 16, when the vapor discharged through the first hole h1 comes into contact with the top plate 122c, the top plate 122c is subjected to a surface temperature of the memory chip 110a by the system cooling fan. Maintained at a much lower temperature. Therefore, as the vapor contacts the upper plate 122c, a liquid refrigerant forms on the inner surface of the upper plate 122c. The liquid refrigerant thus formed is fed back to the lower plate along the inner surface of the upper plate 122c. Soon, feedback is made to the bottom of the wick plate 122b. Therefore, in order to supply the liquid refrigerant from the bottom of the wick plate 122b to the top, it is preferable that the wick 124 is elongated upward from the bottom of the wick plate 122b. For this reason, it is preferable that the first hole h1 is formed in a long rectangle from the bottom of the wick plate 122b to an upward direction, that is, in a direction perpendicular to the longitudinal direction. Of course, as described below, according to the shape in which the memory module is mounted, for example, when the memory module is mounted on the vertical plane, the direction in which the first hole h may be formed may vary.

Considering that the sizes of the first holes h1 and the wicks 124 are small enough to induce capillary forces, the direction in which the first holes h1 are formed does not significantly affect the pumping of the liquid refrigerant using capillary forces. Although it may not be, it is preferable to point out the above except inevitable cases.

On the other hand, as described above, when the liquid refrigerant is supplied to the lower side of the wick plate 122b, the liquid refrigerant flows down the inside of the vertical plane of the upper plate 122c, and then the lower side contacting the wick plate 122b horizontally. It is supplied to the wick plate 122b along the side inner side. Therefore, it is preferable that the capillary pattern is formed on the inner side of the liquid refrigerant so that the capillary force can be easily received while reaching the inner side of the lower side of the upper plate 122c.

Subsequently, in the wick plate 122b, as illustrated in FIG. 17B, the first hole h1 may be distributed at a uniform density throughout the entire region. In (b), reference numeral 126 denotes a longitudinal wick perpendicular to the longitudinal direction of the wick plate 122b, and 128 denotes a transverse line existing between the row and the row of the first hole h1. Represents a wick in a direction. In addition, reference numeral 130 denotes a process in which the liquid refrigerant spreads to the entire area of the wick plate 122b by capillary force when liquid refrigerant is supplied from the left side of the wick plate 122b, and 132 is a liquid refrigerant supplied below. In the case, the liquid refrigerant spreads, and 134 shows a process in which the liquid refrigerant spreads when the liquid refrigerant is supplied from the right side of the wick plate 122b.

FIG. 17C shows holes W1, H2, H3 and wicks 136, 138, 140 having different sizes in the wick regions WA1, WA2,... WAn of the wick plate 122b. As an example of the case, wicks 136, 138, and 140 having different widths and first to third holes h1, h2, and h3 having different sizes and intervals are formed in the first wick region WA1. have. In addition, there are wicks 136, 138, and 140 having different widths, including the first hole h1 in the remaining wick regions WA2,... WAn. In any wick region, the widths of the wicks 136, 138, 140, that is, the intervals of the holes h1, h2, h3, become gradually narrower upwards in the direction perpendicular to the longitudinal direction of the wick plate 122b. In the case of the first wick area WA1, the size of the holes also decreases upwards, so that the first hole h1 formed in the lower area is widest, and the second hole h2 formed in the middle area is next wider. The third hole h3 formed in the upper region is the narrowest. In any wick region, the first hole h1 formed in the lower region is formed at the widest first interval D1. The first hole h1 formed in the middle region of the first wick region WA1 and the first hole h1 formed in the middle region of the remaining wick regions WA2,... It is formed at a narrower second interval D2. In addition, the third hole h3 formed in the upper region of the first wick region and the first hole h1 formed in the upper region of the remaining wick regions WA2,... WAn are narrower than the second interval D2. It is formed in 3rd space | interval D3. As described above, the interval in which the holes h1, h2, and h3 are formed in each of the wick regions WA1, WA2, .... WAn becomes gradually narrower toward the upper region. This means that the widths of the wicks 136, 138, and 140 become narrower from the lower region to the upper region, and thus, the liquid coolant becomes smaller from the lower region to the upper region of each of the wick regions WA1, WA2, ... WAn. The capillary force becomes large. "Large" and "small" on both sides of the figure indicate this.

FIG. 17D illustrates a case in which one type of hole, for example, a first hole h1, is formed in a direction perpendicular to the length direction of the wick plate 122b over the entire area of the wick plate 122b. The first hole h1 is formed at a first interval D1 in the lower region of the wick plate 122b, at a second interval D2 in the middle region, and at a third interval D3 in the upper region. have. Thus, the capillary force increases toward the upper region. When the liquid refrigerant is supplied above the wick plate 122b, the interval between the first holes h1 for each region is reversed in order to increase the capillary force toward the lower region.

FIG. 17E illustrates a case in which first to third holes h1, h2, and h3 having different sizes are formed in the entire region of the wick plate 122b without dividing the wick region, as in FIG.

Specifically, the first hole h1 is formed in the lower region of the wick plate 122b, the second hole h2 is formed in the middle region, and the third hole h3 is formed in the upper region, respectively. The first to third holes h1, h2, and h3 are formed in a direction perpendicular to the longitudinal direction of the wick plate 122b. The first and second holes h1 and h2 are formed at the first and second intervals D1 and D2, respectively, and the third hole h3 is formed at the third interval D3. As the first to third holes h1, h2, and h3 are formed narrower toward the upper region of the wick plate 122b, the capillary force increases toward the upper region.

(F) of FIG. 17 shows a case where holes and wicks are formed in the length direction of the wick plate, that is, in the length direction of the memory module.

Referring to this, the fourth hole h4 is formed in the wick plate 122b at a uniform density in the longitudinal direction of the wick plate 122b. The fourth holes h4 are spaced apart by the first interval D1 in a direction perpendicular to the longitudinal direction of the wick plate 122b. Since the fourth holes h4 are distributed at a uniform density, the wicks 136 formed between the fourth holes h4 are also distributed at a uniform density over the entire area of the wick plate 122b, and the width thereof is also equal to that of the fourth holes h4. The same throughout the area.

On the other hand, in FIG. 4 (f), the fourth hole h4 may be spaced apart by the second interval D2 or the third interval D3 instead of the first interval D1. In addition, the fourth hole h4 may be replaced with the second hole h2 or the third hole h3. The replaced hole in which either hole is replaced is the first interval D1 and the second hole. It may be spaced apart by the interval D2 or the third interval D3.

The wick plate 122b shown in (e) is suitable for the case where the liquid refrigerant is supplied from the right side or the left side of the wick plate 122b, and thus the flat plate heat transfer device used for cooling the memory module mounted vertically on the vertical plane. Suitable for

Figure 17 (g) shows an example of the case where the width of the wick, that is, the spacing between the holes in the wick plate is not uniform along the length direction of the wick plate.

Referring to this, the fourth hole h4 is formed in the wick plate 122b in the longitudinal direction of the wick plate 122b. The fourth hole h4 is spaced apart from the right region of the wick plate 122b by the first interval D1 in the direction perpendicular to the longitudinal direction, and spaced apart from the middle region by the second interval D2, and the left region. Are spaced apart by a third interval D3. Accordingly, the width of the wick 144 formed in the middle region is narrower than that of the wick 142 formed in the right region of the wick plate 122b, and the width of the wick 146 formed in the left region is the wick 144 formed in the intermediate region. Narrower than As a result, the distribution density of the fourth hole h4 varies depending on the region of the wick plate 122b, which is the lowest in the right region of the wick plate 122b and becomes higher toward the left region. Although the fourth hole h4 is formed in the longitudinal direction of the wick plate 122b, the fourth hole h4 forms a column in a direction perpendicular to the longitudinal direction. Accordingly, since the rows and the rows of the fourth holes h4 form minute intervals, the wicks 148, 150, and 152 exist between the rows and the rows of the fourth holes h4. The fourth holes h4 form a row such that the width between the rows is wider in the right region of the wick plate 122b and narrower toward the left region. Therefore, the wick 148 between the rows existing in the right region of the wick plate 122b is wider than the wick 150 between the columns existing in the intermediate region, and the wick 152 between the columns existing in the left region is the intermediate region. It is narrower than the wick 150 between the columns present in. Accordingly, when the liquid refrigerant is supplied from the right side of the wick plate 122b, the capillary force in the longitudinal direction and the direction perpendicular to the liquid refrigerant increases toward the left side of the wick plate 122b.

Meanwhile, in relation to FIG. 17G, other conditions may be the same, and the fourth hole h4 may be replaced with one corresponding to the second hole h2 or the third hole h3. Another condition may be the same, and the widths of the wicks 148, 150, and 152 between the columns formed in the respective regions of the wick plate 122b may be the same. In addition, when the wick plate 122b is divided into wick regions WA1, WA2, ..., WAn, the hole shape formed in each wick region is not limited to only one type of rectangle, but may be configured in at least two types. . This case can also be applied to the case where holes are formed in the entire area of the wick plate 122b.

FIG. 18 is a perspective view of a portion of the second element 122 shown in FIG. 16 facing the inner side of the top plate 122c, that is, the wick plate 122b, and reference numerals A1 to A4 denote the wick plate 122b, respectively. The first to fourth inner surfaces of the four sidewalls are shown. The side wall has a second thickness t2. When the upper plate 122c is coupled to the lower plate 122a as shown in FIG. 16, the liquid refrigerant descends on the side facing the wick plate 122b of the upper plate 122c to form the first inner surface A1. Along the wick plate 122b. Therefore, it is preferable that a wick pattern is formed on the first inner surface A1 in the wick plate 122b direction as described above.

When the memory module 110 illustrated in FIG. 15 is vertically mounted unlike the illustrated example, since the upper plate 122c is also vertically erected, the liquid refrigerant may be the second inner surface A2 or the third inner surface A3. It flows into the wick plate 122b along. Therefore, in this case, it is preferable that a wick pattern is formed on the second inner surface A2 or the third inner surface A3 of the upper plate 122c in the wick plate 122b direction. As a result, it is preferable that a wick pattern is formed on all of the first to fourth inner surfaces A1, A2, A3, and A4 of the upper plate 122c.

Meanwhile, as illustrated in FIG. 19, a plurality of partitions 160 may be provided in an inner region of the upper plate 122c. The partitions 160 divide the inner region of the upper plate 122c into a plurality of regions, and the partition 160 divides the inner region of the upper plate 122c by the number of wick regions WA1, WA2,... It is preferred to be provided. According to the partition 160, the inner region of the upper plate 122c is divided into wick regions WA1, WA2,... WAn and equal number of chambers C1, C2,... Each of the chambers C, C2, ... Cn has a width corresponding to the fourth interval D4, and the fourth interval D4 is preferably at least larger than the width of the memory chip 110a. In addition, since the partition 160 is present, the first and fourth inner surfaces A1 and A4 of the upper plate 122c shown in FIG. 18 are separated from the wick regions WA1 and WA2, respectively, as shown in FIG. ... divided by the same number of inner surfaces A11, ..., A1n and A41, ... A4n. It is preferable that a wick pattern is formed on each of the divided inner surfaces A11,..., A1n and A41,... A4n. In addition, a wick pattern may be formed on both side surfaces of the partition 160 in the wick plate 122b direction.

When the wick plate 122b shown in FIG. 17A or 17C and the top plate 122c shown in FIG. 19 are used for the second element 122, the partition 160 of the top plate 122c is used. 20 is in close contact with each other between the wick regions WA1, WA2, ... WAn of the wick plate 122b. Accordingly, the wick regions WA1, WA2,... WAn of the wick plate 122b are also completely separated by the partition 160. In this case, the second element 122 shown in FIG. 15 or FIG. 16 has the same number of micro heat transfer devices as the memory chip 110 a so that one micro heat transfer device or micro cooling device per memory chip 110 a corresponds. Or as a whole a single cooling means composed of a micro cooling device. As described above, the micro heat transfer device or the micro cooling device includes any one of the chambers C1 and Cn of the upper plate 122c, for example, the first chamber C1 and the first wick region WA1 corresponding thereto. And a lower plate 122a.

Meanwhile, a downward protrusion (not shown) having the same length as the partition 160 may be provided on the rear surface of the wick plate 122b in contact with the partition 160. The downward protrusions preferably protrude so that the capillary force acts on the liquid refrigerant flowing between the wick regions WA1, WA2, ... WAn and the wick plate mounting region PA of the lower plate 122a. As the wick plate 122b is mounted on the lower plate 122a by the downward protrusion, the wick plate mounting area PA is divided into equal numbers with the wick areas WA1, WA2,...

The top plate 122c may have wrinkles 162 only on its outer surface, as shown in FIG. 21, or the top plate 122c itself may have wrinkles, or wrinkles may exist on both sides, as shown in FIGS. 22 and 23.

Specifically, referring to FIG. 21, wrinkles 162 are periodically formed on the entire outer surface of the upper plate 122c. The valleys and peaks of the corrugation 162 are parallel to the longitudinal direction (direction to enter the ground) of the upper plate 122c. Since the pleats 162 are intended to widen the surface area of the upper plate 122c, it is preferable that the pleats 162 are concentrated on a narrow area of the upper plate 122c that is in contact with the wind supplied from the system cooling fan. It is also formed in the other part of 122c), and heat can be removed more quickly from the inside of the upper plate 122c. The third thickness t3 of the top plate 122c measured at the peak of the wrinkles 162 is preferably the same as the third thickness t3 (see FIG. 18) of the top plate 122c without the wrinkles 162 being formed. Do. Although not shown in the drawings, there may be wrinkles in the top plate 122c in which the peaks and valleys are respectively parallel to the direction perpendicular to the longitudinal direction of the top plate 122c, and thus the peaks and valleys of the wrinkles 162.

As illustrated in FIG. 22, wrinkles 164a and 164b may be present on both surfaces of the portion facing the wick plate 122b of the upper plate 122c, respectively. At this time, it is preferable that the corrugations 164a and 164b are formed so that the peaks and valleys are parallel to the direction perpendicular to the longitudinal direction of the upper plate 122c (the direction entering the ground). It is preferable that the two wrinkles 164a and 164b are formed in parallel so that the peaks and valleys of the wrinkles 164a formed on the inner surface exactly match the peaks and valleys of the wrinkles 164b formed on the outer surface. In the case of the upper plate 122c in which the pleats 164a and 164b are formed, the liquid refrigerant is rapidly moved along the valleys and mountains of the pleats 164a and 164b in the direction perpendicular to the longitudinal direction along the pleats 164a and 164b. The upper plate 122c shown in FIG. 22 may be applied to the first and second elements 120 and 122 for cooling the memory module 110 mounted horizontally on a horizontal plane as shown in FIG. 15. It is preferable.

Meanwhile, as shown in FIG. 23, corrugations 162 and 166 may be present on both surfaces of the upper plate 122c such that the peaks and valleys are parallel to the longitudinal direction of the upper plate 122c (the direction into the ground). The upper plate 122c having the wrinkles 162 and 166 may be disposed at both sides of the memory module 110 to cool the memory module 110 mounted vertically on the PCB 170 mounted on the vertical surface, as shown in FIG. 24. Is applied to the first and second elements 120 and 122 provided in contact with the memory chip 110a. In Fig. 23, reference numeral g denotes a gravitational acceleration.

<Eighth Embodiment>

A single unit cooling means for cooling a memory chip mounted on both sides of a single memory module.

Referring to FIG. 25, a memory module cooling means (hereinafter, referred to as an eighth cooling means) 180 according to an eighth embodiment may include a heat transfer device including a slot 182 into which one memory module may be inserted. It is a chiller. The width W of the slot 182 is equal to the thickness of the memory module 110 measured at the portion where the memory chip 110a is mounted. In addition, the slot 182 preferably has a depth such that the memory chip can be completely covered. The slot 182 is formed in the lower structure 180b. The lower structure 180b includes a top plate a having a fourth length L4 and a predetermined width W, and first and second sidewalls b and c in which both ends of the top plate a extend vertically downward. It consists of. The first and second sidewalls b, c extend each the depth of the slot 182. For convenience, the lower structure 180b is divided into the upper plate a and the first and second sidewalls b and c, but the actual lower structure 180b is the upper plate a and the first and second as shown in the drawings. The second side walls b and c are unitary structures formed of one kind of material. The lower structure 180b has the same width as the width W of the slot 182 area and the same shape as one surface is removed from the rectangular cylinder having the fourth length L4. A wick structure 180c having a fine wick pattern and holes is mounted on the lower structure 180b so that capillary force can be applied to the liquid refrigerant in the same manner as the wick plate 122b. The wick structure 180c may be regarded as having the wick plate 122b shown in FIGS. 17A to 17G mounted along the surface of the lower structure 180b. The wick patterns and holes of the wick structure 180c may be equivalent to the wicks and holes formed in the wick plate 122b described above. However, considering the structure of the lower structure 180b, the liquid refrigerant flowing from the lower ends of the first and second sidewalls (b, c) is supplied to the upper plate (a) along the first and second sidewalls (b, c). Since it should be, the wick pattern formed on the wick structure 180c mounted to the first and second sidewalls b and c of the lower structure 180b is less than that of the wick structure 180c formed on the upper plate a. It is preferable that the capillary force with respect to the liquid refrigerant is formed to be large.

The wick structure 180c may be stably mounted on the surface of the lower structure 180b due to the surface tension of the liquid refrigerant. However, the wick structure 180c may generate a gap during an external impact or a process in which the mounted electronic device is moved. 180c is preferably mounted on a predetermined area of the lower structure 180b such that its edge is pressed by the upper structure 180a as shown in the figure. The region where the wick structure 180c of the lower structure 180b is mounted is removed by the thickness of the wick structure 180c. In other words, the area where the wick structure 180c of the lower structure 180b is mounted is thinner than other portions of the lower structure 180b.

The upper structure 180a through which the vapor is condensed is formed of a top plate a 'having a first length L1 and a first width W1, and a third and a third having a first length L1 and a first height H1. 4 sidewalls b 'and c'. The upper plate a 'is spaced apart from the wick structure mounted on the upper plate of the lower structure 180b upward by a predetermined distance. The third and fourth sidewalls b 'and c' are also horizontally spaced apart from the first and second sidewalls b and c of the lower structure 180b by a predetermined distance, respectively. The third and fourth sidewalls b 'and c' are respectively perpendicularly downwards such that both edges of the upper structure 180a are parallel to the first and second sidewalls b and c of the lower structure 180b. It is extended to the same value as 1 height H1. Accordingly, the upper plate a 'of the upper structure 180a may have the upper plate (a') of the lower structure 180b such that the third and fourth sidewalls b 'and c' are parallel to the first and second sidewalls b and c. It is preferable to be provided longer than a).

As such, the upper plate a 'and the third and fourth sidewalls b' and c 'of the upper structure 180a are respectively the upper plate a and the first and second sidewalls b and c of the lower structure 180b. Spaced apart from the upper and lower structures 180a and 180b, the space represented by the product of the predetermined interval and the fourth length L1 exists. The space is a place where steam generated during the process of vaporizing the liquid refrigerant supplied between the wick structure 180c and the lower structure 180b by heat transferred from the memory module is discharged through the holes formed in the wick structure 180c. to be. The vapor collected in the space comes into contact with the upper structure 180a and dissipates the heat it has through the upper structure 180a and forms a liquid refrigerant on the inner surface of the upper structure 180a. Lower ends of the third and fourth sidewalls b 'and c' are bent toward the lower structure 180b and extended by a predetermined length, and then adhered to the lower ends of the lower structure 180b. At this time, the edge of the wick structure 180c is bonded to the extended portions d 'and e' at the bottom of the third and fourth sidewalls b 'and c' together with the lower structure 180b. ) Is pressed by the extended portions d ', e'. Lower ends of the third and fourth sidewalls b 'and c' are bent toward the lower structure 180b so that the extended lengths correspond to the sidewalls of the lower structure 180b, for example, the upper structure 180a corresponding to the first sidewall b. ), Such as the spacing between the third sidewalls b '. The upper plate a 'of the upper structure 180a has a fourth thickness t4, and the thicknesses of the third and fourth sidewalls b' and c 'are also preferably the fourth thickness t4.

In the drawings, reference numeral T1 denotes a gap between one sidewall of the lower structure 180b, for example, an inner surface of the first sidewall b and an outer surface of the third sidewall b '. This is equal to the spacing between the slot 182 and the outer surface of the third sidewall b 'or the fourth sidewall c'.

FIG. 26 illustrates a process in which the eighth cooling unit 180 described above is mounted on the memory module 110 mounted on the PCB 170 horizontally placed. It can be seen that the memory module 110 is inserted into the slot 182 of the eighth cooling unit 180.

Meanwhile, as shown in FIG. 27 in which FIG. 25 is cut in the 27-27 'direction, wrinkles 184 may be present on the outer surface of the upper structure 180a to widen the surface area. The corrugation 184 is preferably present throughout the outer surface, but only to a portion, for example connecting the third and fourth sidewalls b ', c' or the third and fourth sidewalls b ', c'. It may be present only in the upper plate (a '). The wrinkles 184 are formed in parallel in the longitudinal direction (direction perpendicular to the ground) of the upper structure 180a. The wrinkles 184 are formed periodically with mountains and valleys. It is preferable that the thickness of the upper structure 180a where the acid of the wrinkles 184 is located is the same as the thickness when the wrinkles 184 are not present. However, the thickness where the valley is located may be the same as the thickness when no wrinkles 184 are present. In addition, the thickness of the places where the hills and valleys may be any thickness irrespective of the thickness when the wrinkles 184 are not present. The direction in which the wrinkles 184 are formed may be present in a direction different from the length direction of the upper structure 180a. For example, the pleats 184 may exist in a direction perpendicular to the longitudinal direction of the upper structure 180a.

In FIG. 27, reference numeral 186 denotes a process in which the liquid refrigerant introduced between the lower structure 180b and the wick structure 180c is vaporized by heat transferred from the memory module 110 inserted into the slot 182 to the lower structure 180b. It indicates the steam generated from. Vapor 186 is discharged through holes (not shown) formed in wick structure 180c. The liquid refrigerant flows between the lower structure 180b and the wick structure 180c through the wick (not shown) existing between the holes. For the holes and wicks formed in the wick structure 180c, the first to fourth holes h1, h2, h3, and h4 and the wicks 126, 128, shown in FIGS. 17A to 17G are illustrated. 136, 138, 140, 148, 152, 156. Since the upper structure 180a is maintained at a lower temperature than the memory module 110 by the system cooling fan, the liquid refrigerant forms on the inner surface of the upper structure 180a while the vapor 186 contacts the upper structure 180a. do. The liquid refrigerant thus formed flows down along the inner surfaces of the third and fourth sidewalls b 'and c' of the upper structure 180a, thereby lowering the lower structure of the third and fourth sidewalls b 'and c'. It is moved to the wick structure 180c through the bent portion 190 toward the first and second sidewalls b, c of 180b. Therefore, a predetermined wick pattern is formed in the curved portions 190 of the third and fourth sidewalls b 'and c' to allow the liquid refrigerant to smoothly and quickly flow into the wick structure 180c. desirable. In this case, the wick pattern is preferably a pattern in consideration of the direction in which the liquid refrigerant is to be moved, and may be any one of the wicks shown in FIG. 17, but may be a different pattern from this.

On the other hand, the upper structure 180a of the eighth cooling means 180 is a pleat 184 (hereinafter referred to as a first pleat) present on the outer surface of the upper structure 180a, as shown in FIG. In addition, a second pleat 192 may be present on the inner surface. The second pleats 192 may be present in a form independent of the first pleats 184, but are preferably formed at the same period as the first pleats 184, and may also be formed in the mountains of the first and second pleats 184 and 192. And preferably formed so that the valleys coincide. This case is the same as the case where the upper structure 180a itself is provided to be corrugated. The second pleats 192 are formed in parallel with the peaks and valleys in the longitudinal direction (direction perpendicular to the ground) of the upper structure 180a. However, depending on the form in which the eighth cooling unit 180 is mounted, the direction in which the peaks and valleys of the second wrinkles 192 are formed may vary depending on the form in which the memory module 110 is mounted. For example, the peaks and valleys of the second pleats 192 may be formed in parallel to the direction perpendicular to the longitudinal direction of the upper structure 180a.

FIG. 29 is a cross-sectional perspective view showing an example, in which an outer surface of the upper structure 180a has corrugations 194 in a direction perpendicular to the length direction of the upper structure 180a, and an inner surface of the upper structure 180a. There is a wrinkle 196 corresponding to the wrinkle 194. The two folds 194 and 196 are preferably formed so that the mountain and the valley coincide. The two corrugations 194 and 196 may extend along the third and fourth sidewalls b 'and c'.

In the case of the eighth cooling unit 180 illustrated in FIG. 28, considering the direction of the wrinkles 192 formed on the inner surface of the upper structure 180a, the eighth cooling unit 180 may be mounted on a memory module horizontally mounted on a horizontally installed PCB. However, as shown in FIG. 24, it is preferable to mount the memory module 110 mounted vertically on the PCB 170 installed vertically. In other words, the flow direction of the liquid refrigerant flowing along the inner surface of the upper structure 180a is more suitable when the direction of the length of the memory module becomes.

On the contrary, in the case of the eighth cooling means 180 illustrated in FIG. 29, since the wrinkles 196 formed on the inner surface of the upper structure 180a are formed in a direction perpendicular to the longitudinal direction of the upper structure 180a, Unlike the eighth cooling unit 180 shown in FIG. 28, the memory module may be mounted on a horizontally mounted memory module and a memory module mounted horizontally on a vertically mounted PCB. That is, it is more suitable when the flow direction of the liquid refrigerant becomes a direction perpendicular to the longitudinal direction of the memory module.

<Example 9>

Based on the memory chip mounted on one side of the memory module, the space between the upper structure and the wick structure is divided by the number of the memory chip.

Specifically, referring to FIG. 30, the cooling means (hereinafter, referred to as a ninth cooling means) 180 ′ according to the ninth embodiment includes the space in the space between the upper structure 180a and the wick structure 180c. A plurality of partitions 200 to be divided are provided. The partition wall 200 is provided at predetermined intervals 202 in the longitudinal direction of the upper structure 180a. The spacing 202 of the partition wall 200 is preferably at least equal to the size of one memory chip (110a in FIG. 26). Due to the partition 202, a plurality of chambers are formed between the upper structure 180a and the wick structure 180c. One chamber is used to simultaneously cool two memory chips mounted opposite both sides of the memory module 110. In view of this, each chamber may be viewed as a unit heat transfer device or a unit cooler (uniformly described as a one-phase unit heat transfer device) provided for cooling one of the two memory chips. 180 ') is substantially the same as that consisting of a plurality of unit heat transfer devices. In this case, the total number of unit heat transfer devices provided in the ninth cooling means 180 'is equal to half of the entire memory chip 110a mounted in the memory module 110.

Meanwhile, in the drawings illustrating the eighth and ninth cooling means 180 and 180 ', the space between the upper structure 180a and the wick structure 180c is shown to be opened in the longitudinal direction of the upper structure 180a. This is to show the internal structure of each of the cooling means 180, 180 ', and in fact, both ends of the space are sealed with a panel (not shown) having the same shape as the cross section of the space. At this time, as in the case where the eighth or ninth cooling means (180, 180 ') is mounted to the vertically mounted memory module 110, as shown in Figure 24, the liquid refrigerant along the inner surface of the panel wick structure In case of being supplied to 180c, a wick pattern may be provided on the inner surface of the panel to apply capillary force to the liquid refrigerant.

<Example 10>

The present invention relates to a cooling means capable of simultaneously cooling at least two or more memory modules using a liquid refrigerant, and for convenience, a cooling means capable of simultaneously cooling two memory modules will be described. However, this description is applicable to cooling means that can simultaneously cool three or more memory modules. This also applies to the eleventh embodiment as it is.

Referring to FIG. 31, a memory module cooling means (hereinafter, referred to as a tenth cooling means) 210 according to a tenth embodiment of the present invention has a fourth length L1 and has a third length in a direction perpendicular to the length direction. An upper structure 210a having a width W, a lower structure 210b positioned inside the upper structure 210a, and a wick structure 210c provided along the surface of the lower structure 210b. The upper structure 210a differs in size and is identical to the upper structure of the eighth cooling means 180 (180a of FIG. 25). In addition, the lower structure 210b is the same as connecting two lower structures 180b of the eighth cooling unit 180 to have a second width W2 in parallel in the longitudinal direction of the upper structure 210a. In this way, the first and second slots 208a and 208b in which the memory module is mounted are provided in the lower structure 210b. The first and second slots 208a and 208b have a first width W, respectively. The first width W is preferably equal to the thickness of the portion where the memory chip of the memory module fitted into the slots 208a and 208b is mounted. There is a space having a second width W2 between the lower structure 210b between the first and second slots 208a and 208b and the sidewalls composed of the wick structure 210c. The space is in the opposite direction to the first and second slots 208a and 208b. The space existing between the first and second slots 208a, 208b is a space around the first and second slots 208a, 208b, that is, another space between the upper structure 210a and the wick structure 210c. It is connected to the space of the part and one.

33 and 34, when the first and second memory modules 220 and 222 are inserted into the first and second slots 208a and 208b, respectively, the first and second memory modules 220 are provided. The memory chips 220a and 222a mounted in the second and second sides 222 are in close contact with the lower structure 210b in which the first and second slots 208a and 208b are formed. For this reason, the spacing T2 between the first and second slots 208a and 208b is preferably the same as the spacing T3 between the first and second memory modules 220 and 222. In addition, the first and second slots 208a and 208b have a predetermined depth H3, which is not higher than the height H4 of the first and second memory modules 220 and 222. desirable. However, when the tenth cooling means 210 is mounted on the first and second memory modules 220 and 222, the depth H3 may be defined by the memory chips 220a and 222a of the first and second slots 208a and 208b. Should not be exposed outside.

Referring back to FIG. 31, the wick structure 210c has holes and wicks on the front surface thereof, like the wick structure 180c of the eighth cooling means 180. When there is a minute gap between the wick and the lower structure 210b, and the liquid refrigerant flows between the wick and the lower structure 210b due to the gap, the liquid refrigerant receives a capillary force and receives the wick structure along the wick. It is moved to the entire area between 210c and the lower structure 210b. In order to smoothly flow the liquid refrigerant from the upper structure 210a into the wick structure 210c, the upper structure 210a of the tenth cooling means 210, like the upper structure 180a of the eighth cooling means 180 A predetermined wick pattern may exist in the edge region 212 connected to the lower structure 210b of the. The thickness of the region in which the wick structure 210c is mounted in the lower structure 210b is thinner than the thickness of the region in which the wick structure 210c is mounted. The wick structure 210c is mounted to a portion connected to the lower structure 210b and the upper structure 210a. Accordingly, as the lower structure 210b and the upper structure 210a are connected, the edge of the wick structure 210c is pressed by the upper structure 210a. As a result, the wick structure 210c is fixed. The upper structure 210a has a fifth thickness t5, which is equal to the fourth thickness t4 of the eighth cooling means 180.

Both ends of the space between the upper structure 210a and the wick structure 210c of the tenth cooling means 210 are preferably completely sealed to prevent leakage of the liquid refrigerant or steam. To this end, a sealing panel 214 as shown in FIG. 32 may be provided at both ends of the tenth cooling means 210. The sealing panel 214 has the same height and the same third width W3 as the upper structure 210a. The portions corresponding to the first and second slots 208a and 208b are open.

When the tenth cooling means 210 is mounted in the memory module mounted perpendicularly to the vertical plane, since the liquid refrigerant flows along the inner surface of the upper structure 210a in the longitudinal direction, the liquid refrigerant eventually seals the panel 214. It is moved to the wick structure 210c through the inner surface of the). Therefore, when there is a wick pattern toward the wick structure 210c on the inner side of the sealing panel 214, the liquid refrigerant reaching the sealing panel 214 may be moved to the wick structure 210c more smoothly by capillary force. Can be. At this time, the wick pattern shown in FIG. 17 may be formed on the inner surface of the sealing panel 214, as well as various wick patterns not shown.

On the other hand, as shown in Figure 35, the predetermined wrinkles 226 may be present on the surface of the upper structure (210a) of the tenth cooling means (210). The pleats 226 may be formed in the longitudinal direction of the upper structure 210a, such as the pleats (184 of FIG. 27) present on the outer surface of the upper structure 180a of the eighth cooling means 180, the length direction It may be formed in a direction perpendicular to the. Therefore, the wrinkles 226 is preferably formed in consideration of the mounting direction of the tenth cooling means 210.

<Eleventh embodiment>

The case where the space is divided in the longitudinal direction of the superstructure in the space between the superstructure and the wick structure.

Referring to FIG. 36, the memory module cooling means (hereinafter referred to as eleventh cooling means) 210 ′ according to the eleventh embodiment of the present invention may include the upper structure 210a of the tenth cooling means (210 of FIG. 31). And a plurality of partitions 300 in the space between the wick structure 210c. The partition 300 is provided at regular intervals in the longitudinal direction of the upper structure 210a. In this case, the fifth gap D5 between the barrier ribs 300 may be at least equal to the length of the memory chip 110a mounted in the memory module 110a measured in the longitudinal direction of the upper structure 210a. By the partition 300, a plurality of chambers are formed between the upper structure 210a and the wick structure 210c.

A total of two memory modules are inserted into the first and second slots 208a and 208b into the eleventh cooling means 210 ', respectively, and memory chips are mounted on both sides of the memory module. The chip corresponds. As a result, each of the plurality of chambers becomes a unit heat transfer device capable of moving heat generated from four memory chips to another spaced apart from the four memory chips. In this respect, the eleventh cooling means 210 ′ is equivalent to that consisting of a plurality of unit heat transfer devices.

While many details are set forth in the foregoing description, they should be construed as illustrative of preferred embodiments, rather than to limit the scope of the invention. For example, a person having ordinary skill in the art may include a conventional cooling means outside the array in an array consisting of a plurality of memory modules, and any one selected from the first to eleventh cooling means inside the array. It may be provided. In addition, a plurality of heat pipes may be provided in a space inserted between the memory modules constituting the array, for example, a space between the first and second slots 208a and 208b of the tenth cooling means 210. In addition, the slot or the groove may be configured in various forms according to the shape of the object to be inserted. Therefore, the scope of the present invention should not be defined by the described embodiments, but should be determined by the technical spirit described in the claims.

By using the present invention as described above, since the entire memory module can be cooled evenly regardless of the memory module mounting position, it is possible to minimize the temperature difference for each region in one memory module. In addition, since the cooling means can be manufactured by using a semiconductor process, the volume of the region in which the memory module is mounted can be reduced, and this result corresponds to the miniaturization of the electronic device.

1 is a perspective view separately showing a memory module and a cooling means in a memory module having a cooling means according to the prior art.

FIG. 2 is a cross-sectional view of FIG. 1 taken in a 2-2 'direction.

3 is a block diagram schematically showing the configuration of an electronic device (computer) equipped with a memory module including cooling means according to an embodiment of the present invention.

4 to 8 are perspective views showing memory module cooling means according to the first to fifth embodiments of the present invention, respectively.

9 is a cross-sectional view of a cooling apparatus applied to a memory module cooling means according to a fifth embodiment of the present invention.

10 is a perspective view showing a memory module cooling means according to a sixth embodiment of the present invention.

11 is a perspective view illustrating a process in which the memory module cooling means according to the first embodiment of the present invention is mounted to the memory module.

FIG. 12 is a cross-sectional view taken along the line 12-12 ′ of FIG. 11.

FIG. 13 is a perspective view illustrating a result of mounting the memory module cooling means according to the third embodiment of the present invention to a memory module. FIG.

FIG. 14 is a cross-sectional view taken along the 14-14 ′ direction of FIG. 13.

15 is a perspective view illustrating a process in which the memory module cooling means according to the seventh embodiment of the present invention is mounted to the memory module.

FIG. 16 is an exploded perspective view of the memory module cooling unit shown in FIG. 15.

FIG. 17 is a view illustrating a wick plate provided in the memory module cooling unit of FIG. 16, (a) is a perspective view, and (b) to (g) are plan views showing various modifications.

FIG. 18 is a perspective view illustrating an inner side of an upper plate provided in the memory module cooling unit illustrated in FIG. 16.

19 is a perspective view illustrating a modification of the upper plate illustrated in FIG. 18.

20 is an exploded perspective view illustrating a coupling relationship between the upper plate, the wick plate, and the lower plate shown in FIG. 19.

21 to 23 are cross-sectional views showing another modified example of the upper plate provided in the memory module cooling means shown in FIG. 16, respectively.

FIG. 24 is a perspective view illustrating a process in which a memory module cooling means according to a seventh embodiment of the present invention is mounted on a memory module mounted on a vertical printed circuit board (PCB).

25 is a perspective view showing a memory module cooling means according to an eighth embodiment of the present invention.

FIG. 26 is a perspective view illustrating a process of combining the memory module cooling unit and the memory module illustrated in FIG. 25.

27 and 28 are cross-sectional views illustrating a case where wrinkles exist in an upper structure of a memory module cooling unit according to an eighth embodiment of the present invention.

FIG. 29 is a cross-sectional view of FIG. 25 taken along the direction 29-29 '.

30 and 31 are perspective views of memory module cooling means according to the ninth and tenth embodiments of the present invention, respectively.

FIG. 32 is a perspective view of a sealing panel mounted at both ends of the memory module cooling means shown in FIG. 31.

33 is a perspective view in which a memory module cooling means according to a tenth embodiment of the present invention is mounted on a memory module.

FIG. 34 is a cross-sectional view taken along the 34-34 'direction of FIG.

35 are cross-sectional views illustrating a modified example of the upper structure of the memory module cooling unit according to the tenth embodiment of the present invention.

36 is a perspective view of a memory module cooling means according to an eleventh embodiment of the present invention.

 * Description of Signs of Major Parts of Drawings *

38: Computer 52, 182: Slot

50, 50 ', 56, 56', 56 ", 80, 118, 180, 180 ', 210, 210': first to eleventh cooling means

54, 64, 162, 164a, 164b, 166, 194, 196, 226

56a, 56b: first and second partitions 57a, 57b: first and second outer walls

58, 208a: first slot 60, 208b: second slot

62: third slot 65: first portion

66, 68: Second parts 70, 122a: Bottom plate

72, 122b: Wick plate 74, 122c: Top plate

76: space 86: heat pipe

84: portion formed with the second length of the sixth cooling means

90, 170: PCB (Print Circuit Board)

120, 122: first and second elements of the seventh cooling means

124, 126, 128, 136, 138, 140, 148, 152, 156: wick

160: partition

180a, 210a: upper structure 180b, 210b: lower structure

180c, 210c: Wick structure 184, 192: First and second pleats

D1, D2, D3, D4, D5: first to fifth intervals

h1, h2, h3, h4: first to fourth holes

H: height of the first cooling means H1, H2: thickness

H3: height of the first and second elements of the seventh cooling means

H4: Height of the memory module

L1, L2, L3, L4: first to fourth lengths

t1, t2, t3, t4, t5: first to fifth thickness

PA: Wick plate mounting area W: Slot width

WA1, WA2, ... WAn: Multiple Wick Zones

Claims (19)

In the electronic device, A heat generating member having at least one heat source mounted on at least one surface thereof; It includes cooling means for cooling the heat generating member, The cooling means has at least one groove for inserting and fixing the heat generating member, the electronic device, characterized in that the wrinkles extending in a predetermined direction on one or both of the outer surface and the inner surface of the cooling means is formed; . The electronic device of claim 1, wherein the cooling means is formed in a unitary body, and the groove has an elongated slot shape. delete The electronic device of claim 1, wherein the cooling unit is inserted into and fixed in direct contact with the heat generating member. The electronic device according to claim 1, further comprising flat plate heat transfer devices for removing heat emitted from the grooves at both ends of the cooling means. According to claim 5, The plate heat transfer device is mounted on both ends of the cooling means, the lower plate is in close contact with the edge of the lower plate in a position facing the lower plate, the upper plate and the lower plate spaced by a predetermined interval Electronic device, characterized in that consisting of a wick plate mounted in a predetermined region of the. The electronic device according to claim 1, wherein an area between the upper surface of the cooling means and the groove extends by a predetermined length in a longitudinal direction, and a heat pipe is embedded in the extended area. 8. The electronic device of claim 7, wherein a heat transfer device for cooling the heat pipe is further mounted on a bottom surface or a top surface of the extended area. The electronic device of claim 8, wherein a wrinkle is formed on at least one surface of the cooling means. An electronic device comprising a memory module equipped with a memory chip and cooling means for cooling the memory module, The cooling means is composed of a first heat transfer device for cooling the memory chip mounted on one side of the memory module and cooling means for cooling the memory chip mounted on the other side of the memory module, The first heat transfer device A lower plate which is in contact with a memory chip mounted on one side of the memory module; An upper plate that is in close contact with the edge of the lower plate and is spaced apart from the lower plate by a predetermined distance internally; And And a wick plate mounted on a predetermined region of the lower plate. The method of claim 10, wherein the cooling means, A lower plate which is in contact with a memory chip mounted on the other side of the memory module; An upper plate closely contacted with an edge of the lower plate, and spaced apart from the lower plate by a predetermined distance internally; And And a second heat transfer device including a wick plate mounted on a predetermined region of the lower plate. 12. The electronic device of claim 11, wherein a wick region is provided on the wick plate in a one-to-one correspondence with the memory chip. 12. The memory module according to claim 10 or 11, wherein a partition for dividing an inner region of the upper plate by the number of memory chips mounted on any one surface of the memory module is provided inside the upper plate. The memory module according to claim 10 or 11, wherein wrinkles are formed on at least one of an outer surface and an inner surface of the upper plate in a predetermined direction. 12. The memory module of claim 11, wherein the first and second heat transfer devices are integrally formed and wrinkled on each surface thereof. An electronic device comprising a memory module equipped with a memory chip and cooling means for cooling the memory module, The cooling means is a unitary heat transfer device having at least two grooves into which the memory module can be inserted, The heat transfer device includes a lower structure in which the at least two grooves are formed, and a predetermined space is secured between the grooves; A wick structure provided along a surface of the substructure; And Including an upper structure surrounding the groove, A space is provided between the upper structure and the wick structure for accommodating vapor generated in the process of vaporizing the liquid refrigerant flowing between the lower structure and the wick structure, The sealing device is in close contact with both ends of the lower structure, the wick structure and the upper structure. The electronic device of claim 16, wherein a wrinkle is formed on at least one of an outer surface and an inner surface of the upper structure. 17. The electronic device of claim 16, wherein a partition for dividing the space into a plurality of regions is provided in the space between the wick structure and the upper structure in a length direction of the memory module. The electronic device of claim 18, wherein wrinkles are formed on a surface of the upper structure.