CN106604607B - A kind of no liquid-sucking core ultrathin heat pipe device - Google Patents
A kind of no liquid-sucking core ultrathin heat pipe device Download PDFInfo
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- CN106604607B CN106604607B CN201611050154.7A CN201611050154A CN106604607B CN 106604607 B CN106604607 B CN 106604607B CN 201611050154 A CN201611050154 A CN 201611050154A CN 106604607 B CN106604607 B CN 106604607B
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- Prior art keywords
- heat pipe
- channel
- hydrophobic
- liquid
- hydrophilic
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Abstract
The invention discloses a kind of no liquid-sucking core ultrathin heat pipe device, which is suitable for the cooling of high heat flow rate per unit area microelectronic component.Its technical solution is by preparing the water-wetted surface and hydrophobic surface that are spaced apart respectively on ultrathin heat pipe inner wall, and upper wall surface and lower wall surface are in symmetrical structure, hydrophilic channel area and hydrophobic channel area are separately constituted, and will be filled in heat pipe from wetting liquid as working medium.Wherein hydrophobic channel area is the gas phase transport channel of working medium, and hydrophilic channel area is the liquid-phase reflux channel of working medium.The present invention is by the building of the close and distant water surface in heat pipe inner wall face and realizes the effective of no liquid sucting core structure ultrathin heat pipe from the use of wetting working medium and runs and efficient heat transfer, has the characteristics that structure is simple, thickness is thin, heat transfer property and to dryout the limit high.
Description
Technical field
The present invention relates to the cooling technical field of microelectronic component or smart phone, specially a kind of no liquid-sucking core is super
Thin heat-pipe apparatus.
Background technique
In recent years, with the fast development of technology, various information communication products just realize height at an unprecedented rate
Integrated and microminaturization directly results in dramatically increasing for its work thermic load and unit area calorific value, seriously affects entire
The security reliability of system shortens product service life, and becomes the important bottleneck for restricting its development.By taking smart phone as an example,
For computer heat radiation, heat-dissipating space size substantially reduces, and radiating condition is more difficult, and to the portable of radiator
Property also has bigger requirement.And ultrathin heat pipe has the characteristics that small in size, light-weight and thermal conductivity is high, sets for modern electronics
The heat dissipation of standby (the especially smart phone of space structure highly compact) provides a kind of effective means.But how to drop
Its high thermal conductivity is maintained while low-heat tube thickness, is a problem urgently to be resolved in current ultrathin heat pipe research.It is passing
In the ultrathin heat pipe of system, liquid sucting core structure is its crucial component part, is the important prerequisite realizing heat pipe and effectively working.Such as public affairs
The number of opening is that the patent of 103940274A proposes a kind of intracavitary ultrathin heat pipe containing groove and powder sintered portion, axially extending
Groove it is integral by sinter bonded with the metal mesh that adheres to thereon, not only heat pipe sizes can substantially reduce, while also can
Enough guarantee good heat transfer efficiency and stability.But this kind of composite liquid sucking cored structure will also improve ultrathin heat pipe manufacturing process
Complexity and cost, and liquid sucting core structure does not allow heat pipe itself to generate certain deformation, therefore limits its application neck
Domain and size further decrease.What Lewis etc. was delivered on " Science Bulletin " (2015,60 (7): 701-706)
" Microfabricated Ultra-thin All-polymer Thermal Ground Planes " text proposes one kind
The flexible ultra-thin heat pipe made using high molecular material, and columnar arrays are produced on its surface by photoetching technique realize suction
The function of wick-containing structure, made heat pipe thickness is only 0.3mm, and has good heat transfer property and dryout characteristic.But it examines
Consider the bigger promotion of process costs and heat transfer property, find or realizes liquid-sucking core knot using other eased practical methods
The function of structure has very high potential using value promoting ultrathin heat pipe technical aspect.
Summary of the invention
For the deficiencies in the prior art, the present invention provides a kind of no liquid-sucking core ultrathin heat pipe devices, by certainly
Effective operation that working medium unique phase transformation shuttling movement in ultrathin heat pipe realizes heat pipe is soaked, overcoming traditional ultrathin heat pipe needs
The limitation of complicated liquid sucting core structure can preferably be applied to the heat dissipation to microelectronic components such as smart phone, smartwatch
It is cooling.
The present invention is to realize above-mentioned technical purpose by following technological means.
A kind of no liquid-sucking core ultrathin heat pipe device, which is characterized in that including heat pipe package, working medium,
The heat pipe package is closing shell, including evaporator section, adiabatic section, condensation segment；
The heat pipe package be provided in the side surface of condensation segment vacuumize/fill fluid apertures；
The evaporator section and condensation segment, including hydrophilic channel；The adiabatic section includes hydrophilic channel, hydrophobic channel；
Transition of the intersection of the evaporator section, adiabatic section and condensation segment there are hydrophobic surface regions to hydrophobic surface area
Area, the inner wall of heat pipe package is hydrophobe gradient energy surface, i.e. working medium connecing on the inner wall of heat pipe package in transition region
Feeler changes from small to big and changes in gradient, and heat pipe package inner wall becomes hydrophobic hydrophobic surface regions by hydrophobic surface regions.
The adiabatic section is divided into three channels, and two wing passages of bilateral symmetry are hydrophilic channel, and intermediate channel is single dredges
Aquaporin or combination for several hydrophilic channels and hydrophobic channel that are spaced apart；
Hydrophilic channel, the hydrophobic channel of the adiabatic section run through adiabatic section along its length；
The hydrophilic channel is interconnected by evaporator section, adiabatic section, condensation segment.
The material of the heat pipe package is easy processing moulding, the metal material that heating conduction is strong, heat resistance and air-tightness are good
Or high molecular material.
The heat pipe package makes mutual corresponding water-wetted surface on the upper and lower surface for the heat pipe package of metal material
Region, hydrophobic surface area are to obtain hydrophilic channel, hydrophobic channel；Or it adds and applies in the upper and lower surface inside heat pipe package
Layer makes mutual corresponding hydrophobic surface regions, hydrophobic surface area to obtain hydrophilic channel, hydrophobic channel；Wherein, hydrophobic
Vapor transportation space of the channel as heat pipe intraductal working medium, hydrophilic channel are then the liquid-phase reflux spaces of working medium.
The working medium is from wetting working medium, and the inverse Marangani effect having from wetting working medium can make its spontaneous from heat
The condensation segment of pipe flows back into evaporator section, completes the phase transformation shuttling movement of working medium.The building of close and distant aquaporin and certainly wetting working medium
It uses, makes ultrathin heat pipe it is not necessary that effective operation can be realized in the case where liquid sucting core structure；
The coating uses Nano-meter SiO_2 in hydrophobic surface regions2Hydrophilic coating material uses stone in hydrophobic surface area
Ink film or the organic siliconresin class nano paint or fluorine carbon type nano paint for having self-cleaning characteristic.
The adiabatic section intermediate channel, the channel width ratio that hydrophilic channel and hydrophobic channel are successively spaced are 1: 1 or 1: 2.
The cross-sectional shape of the heat pipe package is trapezoidal, rectangle or triangle.
It, will be with the hydrophobic surface regions and hydrophobic surface area being spaced apart when production is without liquid-sucking core ultrathin heat pipe device
Two pieces of sheet metals or macromolecule material film in domain, by silver soldering, cementing or other related process by symmetrical two pieces of thin plates
It is connected as one in engagement.Or hydrophobic surface regions and hydrophobic surface are directly produced on closed heat pipe package inner wall
Region, and ultrathin heat pipe is made as by flattening technique.
The present invention compared with the existing technology, has the following advantages that and effect:
By using constructing hydrophobic surface regions and hydrophobic surface area from wetting liquid and on heat pipe package inner wall,
Made ultrathin heat pipe device can realize effective work in the case where being not necessarily to liquid sucting core structure, can greatly optimize life
Production. art simultaneously effectively reduces cost.The device not only can make the integral thickness of heat pipe thinner due to not having liquid sucting core structure,
And more traditional ultrathin heat pipe has bigger vapour transport space, to improve the steam flow limit of intraductal working medium, reduces edge
The temperature gradient of heat pipe length direction.Meanwhile the working medium of wetting certainly used spontaneous can flow back into evaporator section from condensation segment, the spy
Property can significantly improve the limit of dryouting of ultrathin heat pipe, in working performance side when making up Micro/Miniature Heat Pipes as efficient heat transfer device
The deficiency in face.Made can be made without liquid-sucking core ultrathin heat pipe by metal or processing of high molecular material, can preferably be expired
A variety of application demands such as sufficient smartwatch, smart phone or other mobile devices, and effective guarantee high power microelectronic component
It is maintained in safe range using temperature.Therefore, the present invention can effectively ensure that its work while reducing ultrathin heat pipe thickness
Performance, device overall structure is simpler, has many advantages, such as highly reliable, low manufacture cost, has a wide range of application.
Detailed description of the invention
Fig. 1 is a kind of structural profile illustration of no liquid-sucking core ultrathin heat pipe device of the present invention.
Fig. 2 is a kind of structural schematic diagram of the adiabatic section of no liquid-sucking core ultrathin heat pipe device of the present invention.
Fig. 3 is the adiabatic section structural schematic diagram that intermediate channel hydrophobe channel width ratio of the present invention is 1: 1.
Fig. 4 is the adiabatic section structural schematic diagram that intermediate channel hydrophobe channel width ratio of the present invention is 1: 2.
Wherein, 1, evaporator section, 2, adiabatic section, 3, condensation segment, 4, vacuumize/fill fluid apertures, 5, hydrophobic surface area, 6, parent
Water surface region, 7, hydrophilic channel, 8, hydrophobic channel, 9, heat pipe package.
Specific embodiment
With reference to embodiment and attached drawing the present invention is described in further detail, but embodiment party of the invention
Formula is without being limited thereto.
A kind of no liquid-sucking core ultrathin heat pipe, which is characterized in that including heat pipe package 9, working medium,
The heat pipe package 9 is closing shell, including, evaporator section 1, adiabatic section 2, condensation segment 3；
The heat pipe package 9 is provided in the side surface of condensation segment 3 vacuumizes/fills fluid apertures 4；
The evaporator section 1 and condensation segment 3, including hydrophilic channel 7；Adiabatic section 2 includes hydrophilic channel 7, hydrophobic channel 8；
There are hydrophobic surface regions 6 to hydrophobic surface area 5 for the intersection of the evaporator section 1, adiabatic section 2 and condensation segment 3
Transition region, the inner wall of heat pipe package 9 is hydrophobe gradient energy surface, i.e. inner wall of the working medium in heat pipe package 9 in transition region
Contact angle on face changes from small to big and changes in gradient, and 9 inner wall of heat pipe package becomes hydrophobic water-wetted surface by hydrophobic surface regions 6
Region 5.
The adiabatic section 2 is divided for three channels, and two wing passages of bilateral symmetry are hydrophilic channel 7, and intermediate channel is single
Hydrophobic channel 8 or several hydrophilic channels being spaced apart 7 and hydrophobic channel 8；
Hydrophilic channel 7, the hydrophobic channel 8 of the adiabatic section 2 run through adiabatic section 2 along its length；
The hydrophilic channel 7 is interconnected by evaporator section 1, adiabatic section 2, condensation segment 3.
The material of the heat pipe package 9 is easy processing moulding, the metal material that heating conduction is strong, heat resistance and air-tightness are good
Or high molecular material.
The heat pipe package 9 is made on the upper and lower surface for the heat pipe package 9 of metal material mutually by chemical method
Corresponding hydrophobic surface regions 6, hydrophobic surface area 5 are to obtain hydrophilic channel 7, hydrophobic channel 8；The heat pipe package 9 leads to
It crosses physical method and adds the mutual corresponding hydrophobic surface regions 6 of coating production, hydrophobic surface in the upper and lower surface of heat pipe package 9
Region 5 is to obtain hydrophilic channel 7, hydrophobic channel 8, wherein hydrophobic channel 8 is empty as the vapor transportation of heat pipe intraductal working medium
Between, hydrophilic channel 7 is then the liquid-phase reflux space of working medium.
The working medium is from wetting working medium, and the inverse Marangani effect having from wetting working medium can make its spontaneous from heat
The condensation segment 3 of pipe flows back into evaporator section 1, completes the phase transformation shuttling movement of working medium；Hydrophilic channel 7, hydrophobic channel 8 building and from
The use for soaking working medium makes ultrathin heat pipe it is not necessary that effective operation can be realized in the case where liquid sucting core structure.
Working principle without liquid sucting core structure ultrathin heat pipe of the invention is as follows:
The working medium of wetting certainly first in the evaporator section of heat pipe 1, pipe is by thermal evaporation, along hydrophobic channel 8 under pressure action
Transfer heat to condensation segment 3 and complete heat exchange, since heat pipe evaporator section 1 and condensation segment 3 are there are the temperature difference, condense formation from soaking
Liquid spontaneous under the action of surface tension gradient can flow back from condensation segment 3 to evaporator section 1, to complete from the phase for soaking working medium
Become shuttling movement and heat transfer exchange.Meanwhile for the hydrophilic channel 7 of heat pipe inner wall face two sides, the flat knot of heat pipe itself
Structure, which is formed by edge, to be conducive to the starting and biography that improve heat pipe to provide additional capillary force from the reflux of wetting liquid
Hot property.
Embodiment 1
As depicted in figs. 1 and 2, a kind of no liquid-sucking core ultrathin heat pipe device of the embodiment of the present invention is mainly by heat pipe package 9
Inner wall production has the two pieces of copper foils up and down for the hydrophobic surface regions 6 and hydrophobic surface area 5 being spaced apart to constitute, the implementation
Evaporator section 1, adiabatic section 2 and condensation segment 3 are respectively 20mm, 70mm and 30mm along the length of heat pipe axial direction in example.
When making the hydrophobic surface regions 6 without liquid-sucking core ultrathin heat pipe device, hydrophobic surface area 5, firstly, by heat pipe
Shell 9 cleans surface by dilute sulfuric acid and cleaning agent, is put into after dry by 2.5mol/L potassium hydroxide and 0.065mol/
In the corrosive liquid that L potassium peroxydisulfate mixes, corrosion temperature is 70 DEG C, is corroded 30 minutes, forms one on the surface of heat pipe package 9
Layer copper oxide coating；
Further, the heat pipe package 9 that material is copper foil is entirely immersed in the wax of melting, wax is made to be covered on heating pipe
The surface of shell 9 forms corrosion protective layer, takes out, and after cooling, removes the wax for needing to be made into hydrophobic surface regions 6；
Further, copper oxide coating is rinsed with deionized water, and 180 DEG C heating 30 minutes in an oven, in copper oxide
Coating surface obtains ultra-hydrophilic surface；
Further, ultra-hydrophilic surface is impregnated 20 minutes in dilute sulfuric acid, copper coating disappearance rear surface to be oxidized leaves
Corrode micro-structure, forms hydrophobic surface regions 6；
Further, heat pipe package 9 is immersed again in the paraffin of melting, removing will be made into hydrophobic surface area 5
Wax, cleaning impregnate heat pipe package 9 30 minutes after air-drying in the 18 burning base thiol solutions of 0.0025mol/L, soaking temperature
It is 70 DEG C, forms corrosion surface；
Finally, taking out heat pipe package 9, corrosion surface is cleaned with ethyl alcohol, hydrophobic surface area 5 is prepared.
It hydrophilic channel 7 composed by the hydrophobic surface regions 6 of upper and lower two pieces of copper foils preparation, hydrophobic surface area 5 and dredges
The width ratio of water channel 8 is 1:2.
Embodiment 2
As depicted in figs. 1 and 2, with embodiment 1 the difference is that heat pipe package material used is graphite film or macromolecule
Material PI film, and hydrophobic surface regions 6, hydrophobic surface area are constructed directly on film using the physical method of addition coating
5.To hydrophilic channel 7, selection uses Nano-meter SiO_22Hydrophilic coating material；For hydrophobic channel 8, the materials such as graphite film can be directly utilized
Expect the hydrophobic property of itself, to enhance hydrophobicity, also may be selected to apply using organic siliconresin class nano paint or fluorine carbon type nanometer
The self-cleaning coatings such as material.
Embodiment 3
Such as Fig. 3, with embodiment 1, embodiment 2, except that in 2 cross section of heat pipe insulation section, except tube wall two sides are
Outside hydrophilic channel 7, middle section is several hydrophilic channels 7 and hydrophobic channel 8 for being spaced apart, and adjacent single hydrophilic logical
Road 7 is equal with 8 width of hydrophobic channel.
Embodiment 4
If Fig. 4 is with embodiment 1, embodiment 2, except that in 2 cross section of heat pipe insulation section, except tube wall two sides are parent
Outside aquaporin, the hydrophilic channel 7 and hydrophobic channel 8 that middle section is spaced apart for several, and adjacent single hydrophilic channel 7
It is 1:2 with 8 width ratio of hydrophobic channel.
Embodiment 5
With embodiment 1, embodiment 2, except that the working medium of heat pipe be mass concentration be respectively 0.5%, 1.0% or
1.5% n-amyl alcohol aqueous solution or mass concentration is respectively 0.05%, 0.10% or 0.15% n-heptanol aqueous solution.
Embodiment 6
With embodiment 1, embodiment 2, except that the cross-sectional shape of heat pipe package 9 is trapezoidal, rectangle or triangle.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are included at least one embodiment or example of the invention.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (6)
1. a kind of no liquid-sucking core ultrathin heat pipe device, which is characterized in that including heat pipe package (9) and working medium,
The heat pipe package (9) is closing shell, including evaporator section (1), adiabatic section (2), condensation segment (3)；
The heat pipe package (9) is provided in the side surface of condensation segment (3) vacuumizes/fills fluid apertures (4)；
The evaporator section (1) and condensation segment (3) include hydrophilic channel (7)；Adiabatic section (2) includes hydrophilic channel (7), hydrophobic
Channel (8)；
The adiabatic section (2) is divided into three channels, and two wing passages of bilateral symmetry are hydrophilic channel (7), and intermediate channel is single
The combination of hydrophobic channel (8) or the hydrophilic channel (7) being spaced apart for several and hydrophobic channel (8)；
Hydrophilic channel (7), the hydrophobic channel (8) of the adiabatic section (2) run through adiabatic section (2) along its length；
The hydrophilic channel (7) is interconnected by evaporator section (1), adiabatic section (2), condensation segment (3)；
The heat pipe package (9), have in the internal upper and lower surface of heat pipe package (9) mutual corresponding hydrophobic surface regions (6),
Hydrophobic surface area (5) is to form hydrophilic channel (7), hydrophobic channel (8)；
Or the heat pipe package (9), there is mutual corresponding hydrophobic surface regions (6) painting in the upper and lower surface of heat pipe package (9)
Layer, hydrophobic surface area (5) coating, to form hydrophilic channel (7), hydrophobic channel (8).
2. a kind of no liquid-sucking core ultrathin heat pipe device according to claim 1, characterized in that the working medium is from wetting work
Matter.
3. a kind of no liquid-sucking core ultrathin heat pipe device according to claim 1, characterized in that the heat pipe package (9)
The metal material or high molecular material that material is easy processing moulding, heating conduction is strong.
4. a kind of no liquid-sucking core ultrathin heat pipe device according to claim 1, characterized in that the coating, in hydrophilic table
Face region (6) uses Nano-meter SiO_22Hydrophilic coating material using graphite film or has self-cleaning characteristic in hydrophobic surface area (5)
Organic siliconresin class nano paint or fluorine carbon type nano paint.
5. a kind of no liquid-sucking core ultrathin heat pipe device according to claim 1, characterized in that the adiabatic section (2) is intermediate
The channel width ratio that channel, hydrophilic channel (7) and hydrophobic channel (8) are successively spaced is 1:1 or 1:2.
6. a kind of no liquid-sucking core ultrathin heat pipe device according to claim 1, characterized in that the heat pipe package (9)
Cross-sectional shape is trapezoidal, rectangle or triangle.
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| CN106604607B true CN106604607B (en) | 2019-01-08 |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131660A (en) * | 2017-06-28 | 2017-09-05 | 广东工业大学 | Solar energy loop circuit heat pipe heat pump hybrid system based on Fresnel Lenses thermal-arrest |
| CN108235666B (en) * | 2018-02-11 | 2024-03-01 | 中国科学院工程热物理研究所 | Surface-regulated flexible micro-groove group heat sink, heat dissipation device and method |
| CN111238277A (en) * | 2020-01-09 | 2020-06-05 | 广东工业大学 | Flat heat pipe with composite liquid absorption core structure |
| RU2745379C1 (en) * | 2020-03-24 | 2021-03-24 | Федеральное государственное бюджетное научное учреждение "Российский научно-исследовательский институт проблем мелиорации" (ФГБНУ "РосНИИПМ") | Device for reducing hydraulic losses in pipeline |
| CN112261830B (en) * | 2020-09-17 | 2024-01-30 | 华南理工大学 | Hydrophilic and hydrophobic matching plate, preparation method and soaking plate |
| CN112601418B (en) * | 2020-11-20 | 2022-10-18 | 上海航天控制技术研究所 | Integrated heat conduction microstructure of space ray apparatus structure |
| CN112781421B (en) * | 2021-02-04 | 2022-09-27 | 广东机电职业技术学院 | Ultrathin heat pipe with bionic liquid absorption core |
| CN112702899B (en) * | 2021-02-07 | 2024-04-05 | 广东省华创热控科技有限公司 | Ultrathin vapor chamber based on self-wetting fluid as working fluid and application thereof |
| CN113655053A (en) * | 2021-08-09 | 2021-11-16 | 立讯电子科技（昆山）有限公司 | Cuvette and preparation method thereof |
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