CN102347437A - Electronic heating module and manufacturing method thereof - Google Patents

Electronic heating module and manufacturing method thereof Download PDF

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Publication number
CN102347437A
CN102347437A CN 201010243072 CN201010243072A CN102347437A CN 102347437 A CN102347437 A CN 102347437A CN 201010243072 CN201010243072 CN 201010243072 CN 201010243072 A CN201010243072 A CN 201010243072A CN 102347437 A CN102347437 A CN 102347437A
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CN
China
Prior art keywords
abaculus
electronic heating
heat
substrate
heating module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201010243072
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Chinese (zh)
Inventor
袁海平
陈小棉
李皓
杨灿邦
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Osram GmbH
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Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Priority to CN 201010243072 priority Critical patent/CN102347437A/en
Priority to PCT/EP2011/062375 priority patent/WO2012013546A1/en
Publication of CN102347437A publication Critical patent/CN102347437A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention relates to an electronic heating module, which comprises an electronic heating body (1), a substrate (2) and a heat sink (3), wherein the electronic heating body (1) is arranged on the substrate (2); a unique through hole (4) is arranged in the substrate (2); a heat-conducting insert block (6) is arranged in the through hole (4); and the insert block (6) is contacted with the electronic heating body (1) at one side and is contacted with the heat sink (3) at the other side. According to the electronic heating module, a good heat dissipation effect is obtained. The electronic heating module can be applied to thermoelectric separating assemblies and thermoelectric integral type assemblies, and is easier to assemble and produce. Moreover, the invention also relates to a method for manufacturing the electronic heating module of the type.

Description

Electronic heating module and manufacturing approach thereof
Technical field
The present invention relates to a kind of electronic heating module and manufacturing approach thereof.
Background technology
In current light structures, the LED assembly often is placed on the MCPCB plate (metal-core printed circuit board), passes to fin apace with the heat that LED assembly self is produced.The MCPCB plate has good heat-conducting, but it is very expensive.In the LED light structures, the highest 10%-30% that can be total cost of the cost of MCPCB plate.With respect to the cost of MCPCB plate, the cost of FR4 printed circuit board (PCB) only is the 20%-35% of its cost.If with the FR4 printed circuit board applications in light structures, the total cost of the light structures 6.5%-24% that can descend so.But the heat management of lower conductive coefficient (0.2-0.5W/m*k) the illumination structure of FR4 material has caused restriction.
In order to improve the heat conductivility of the printed circuit board (PCB) that adopts the FR4 material, be perfused with the material that itself has high conductive coefficient carrying in the heat radiation through hole of FR4 printed circuit board (PCB) usually, for example copper.These heat radiation through holes can be arranged on the part heat transferred of LED assembly generation itself heat sink on the FR4 printed circuit board (PCB) opposite side.Yet the size of these heat radiation through holes is very little usually, utilizes these through holes can not conduct heat well.Simultaneously, such structure also only is suitable for thermoelectric separate type electronic building brick, and it is inapplicable for thermoelectric integral type electronic building brick.
Summary of the invention
Therefore, the objective of the invention is to propose a kind of electronic heating module of having improved heat dispersion, it can use thermoelectric separate type electronic building brick and thermoelectric integral type electronic building brick.In addition, the invention still further relates to a kind of manufacturing approach of electronic heating module of the above-mentioned type.
First purpose of the present invention realizes through a kind of electronic heating module; This electronic heating module comprises electronic heating body, substrate and heat sink; The electronic heating body is placed on the substrate; Wherein, In substrate, offer unique through hole; The abaculus of heat conduction is installed in this through hole, and abaculus contacts with the electronic heating body and contacts with heat sink at opposite side in a side.In design according to the present invention owing to be the abaculus that heat conduction is installed in this through hole, rather than as the heat radiation through hole of the very small dimensions that carries of FR4 plate of the prior art, therefore, the possibility of the abaculus that embeds large-sized heat conduction is provided.And a unique through hole and abaculus have only been offered; Therefore might obtain maximum contact area between the heat conducting disk of abaculus and heat sink and electronic heating body; Thereby can be very effectively the heat of electronic heating body self is passed to effectively heat sink, thereby reach the purpose of improving radiating effect.
According to a preferred design of the present invention, the electronic heating body comprises the heat conducting disk that contacts with abaculus, and the size of this abaculus is more than or equal to the size of heat conducting disk.Through this design, the whole face of heat conducting disk can both fully contact with abaculus, thereby between abaculus and heat conducting disk, obtains maximum contact area, to transmit heat effectively.
According to a preferred design of the present invention, between abaculus and heat conducting disk, be provided with heat-conducting interface material, heat conductive silica gel for example, this has further improved the heat transference efficiency between abaculus and heat conducting disk.
According to a preferred design of the present invention, abaculus is installed in the through hole with the mode of interference fit.This has prevented that to a great extent abaculus from skidding off from through hole, and has simplified production technology.
Preferably, abaculus is by Cu, Fe, Au, AlN, Al 2O 3Or graphite is processed.Above-mentioned material has good heat-conducting, further improved the electronic heating body and heat sink between heat transference efficiency.
Preferably, when electronic heating module according to the present invention adopted thermoelectric integral type electronic building brick, abaculus was designed to electric conductor, for example Cu, Fe, Au.Thus, this abaculus not only can be used as heat carrier and uses, and the conductive part that also can be used as thermoelectric integral type electronic building brick assigns to use.
Preferably, in the technical scheme of thermoelectric integral type, substrate and heat sink between be provided with electric insulation layer, thereby between them, form electric insulation effectively, wherein, electric insulation layer is that heat conduction synthetic material between the 0.1-0.15mm is processed by thickness.
According to design of the present invention, substrate is designed to the FR4 printed circuit board (PCB).Because the lower cost of FR4 material is so the cost of whole electronic heating module is also by great reduction.
Another object of the present invention realizes through a kind of method of making lighting module; This method may further comprise the steps: a) on substrate, offer unique through hole; B) abaculus with heat conduction is installed in the through hole; C) with the LED assembly and the heat sink said substrate both sides that are installed in respectively of lighting module, abaculus is contacted respectively with heat sink with the LED assembly.Embed the heat conduction abaculus through having made again after the substrate, the invention provides the possibility of the abaculus that embeds large-sized heat conduction and abaculus is provided with the heat conducting disk of heat sink and electronic heating body between the possibility of acquisition maximum contact area.The lighting module of processing through the method according to this invention has improved heat dispersion, can use thermoelectric separated LED assembly and thermoelectric integral LED assembly and its and be more prone to assembling and produce.
Preferably, the size of abaculus is more than or equal to the size of heat conducting disk.Through this design, heat conducting disk fully contacts with abaculus, thereby between abaculus and heat conducting disk, obtains maximum contact area, to transmit heat effectively.
The method according to this invention also is included between abaculus and the heat conducting disk before the step c) heat-conducting interface material is set, heat conductive silica gel for example, and this has further improved the heat transference efficiency between abaculus and heat conducting disk.
Preferably, when adopting thermoelectric integral LED assembly, substrate and heat sink between electric insulation layer is set, thereby between them, form electric insulation effectively.
Below the contrast tabulation according to the heat dissipation of electronic heating module of the present invention and scheme of the prior art has been described in chart.
Figure BSA00000214336600041
Should be appreciated that above generality is described and following detailed description is all enumerated and illustrative, purpose is in order to the present invention who requires to protect further explanation to be provided.
Description of drawings
Accompanying drawing constitutes the part of this specification, is used to help further understand the present invention.These accompanying drawing diagrams embodiments of the invention, and be used for illustrating principle of the present invention with specification.Identical in the accompanying drawings parts are represented with identical label.Shown in the figure:
Fig. 1 shows the LED lighting module according to prior art, and it has a plurality of heat radiation through holes,
Fig. 2 is the sketch map according to first embodiment of electronic heating module of the present invention,
Fig. 3 is the sketch map according to second embodiment of electronic heating module of the present invention.
Embodiment
Fig. 1 shows the LED lighting module according to prior art, and this module comprises LED assembly 1; Substrate 2; And heat sink 3, wherein substrate 2 has a plurality of heat radiation through holes 4, and the size of these heat radiation through holes is very little, and in the heat radiation through hole of substrate 2, is perfused with the material that itself has high conductive coefficient, for example copper.Visible from figure, owing to be used for through hole small-sized of heat conduction, so the contact area of the heat conducting disk of these through holes and LED assembly 1 is also very little, utilizes these through holes can not conduct heat well.Simultaneously, this design only can be applicable to thermoelectric separated LED assembly, and it is inapplicable for thermoelectric integral LED assembly.
Illustrated among Fig. 2 according to electronic heating module of the present invention, it comprises: electronic heating body 1 is designed to the LED assembly 1 of thermoelectric separate type in the present embodiment; Substrate 2; And heat sink 3.LED assembly 1 is placed on the substrate 2, wherein, offers unique through hole 4 in the substrate 2, and the abaculus 6 of heat conduction wherein is installed with the mode of interference fit in this through hole 4, and this abaculus 6 contacts with LED assembly 1 and contacts with heat sink 3 at opposite side in a side.In the present embodiment, abaculus 6 can be by Cu, Fe, Au, AIN, AI 2O 3Or graphite is processed.
LED assembly 1 comprises the LED assembly heat conducting disk 5 that contacts with abaculus 6; The size of this abaculus 6 is more than or equal to the size of heat conducting disk 5; The whole face of heat conducting disk 5 can both fully contact with abaculus 6 like this; Thereby between abaculus 6 and heat conducting disk 5, obtain maximum contact area, to transmit heat effectively.
In addition, visible from Fig. 2, between abaculus 6 and heat conducting disk 5, also be provided with heat-conducting interface material 7, heat conductive silica gel for example, this has further improved the heat transference efficiency between abaculus 6 and heat conducting disk 5.
Figure 3 illustrates sketch map according to second embodiment of electronic heating module of the present invention; The difference of embodiment shown in itself and Fig. 2 is; The electronic heating module has adopted the LED assembly 1 of thermoelectric integral type; Wherein, Abaculus 6 is by conductive metallic material; For example Cu, Fe, Au process, and heat sink 3 and substrate 2 between additionally applied one deck electric insulation layer 8, thereby make heat sink 3 with substrate 2 electric insulations.
Be the preferred embodiments of the present invention only below, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All any modifications of within spirit of the present invention and principle, being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Reference numeral
1 electronic heating body (LED assembly)
2 substrates
3 is heat sink
4 through holes
5 heat conducting disk
6 abaculus
7 heat-conducting interface material
8 electric insulation layers.

Claims (13)

1. electronic heating module; Comprise electronic heating body (1), substrate (2) and heat sink (3); Said electronic heating body (1) is placed on the said substrate (2); It is characterized in that; Offer unique through hole (4) in the said substrate (2); The abaculus (6) of heat conduction wherein is installed in said through hole (4), and said abaculus (6) contacts with said electronic heating body (1) and contacts with said heat sink (3) at opposite side in a side.
2. electronic heating module according to claim 1 is characterized in that, said electronic heating body (1) comprises the heat conducting disk (5) that contacts with said abaculus (6), and the size of said abaculus (6) is more than or equal to the size of said heat conducting disk (5).
3. electronic heating module according to claim 2 is characterized in that, between said abaculus (6) and said heat conducting disk (5), is provided with heat-conducting interface material (7).
4. electronic heating module according to claim 1 is characterized in that, said abaculus (6) is installed in the said through hole (4) with the mode of interference fit.
5. electronic heating module according to claim 1 is characterized in that, said abaculus (6) is by Cu, Fe, Au, AlN, Al 2O 3Or graphite is processed.
6. according to each described electronic heating module in the claim 1 to 5, it is characterized in that said abaculus (6) is an electric conductor.
7. electronic heating module according to claim 6 is characterized in that, between said substrate (1) and said heat sink (3), is provided with electric insulation layer (8).
8. electronic heating module according to claim 7 is characterized in that, said electric insulation layer (8) is the heat conduction synthetic material between the 0.1-0.15mm for thickness.
9. according to each described electronic heating module in the claim 1 to 5, it is characterized in that said substrate (2) is designed to the FR4 printed circuit board (PCB).
10. method of making lighting module is characterized in that following steps:
A) on substrate (2), offer unique through hole (4),
B) abaculus (6) with heat conduction is installed in the said through hole (4),
C) LED assembly and heat sink (3) with said lighting module are installed in said substrate (2) both sides respectively, and said abaculus (6) is contacted with said heat sink (3) with said LED assembly respectively.
11. method according to claim 10 is characterized in that, the size of said abaculus (6) is more than or equal to the size of the heat conducting disk (5) of said LED assembly.
12. method according to claim 10 is characterized in that, before step c), also is included between said abaculus (6) and the said heat conducting disk (5) heat-conducting interface material (7) is set.
13. method according to claim 10 is characterized in that, between said substrate (2) and said heat sink (3), electric insulation layer (8) is set.
CN 201010243072 2010-07-30 2010-07-30 Electronic heating module and manufacturing method thereof Pending CN102347437A (en)

Priority Applications (2)

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CN 201010243072 CN102347437A (en) 2010-07-30 2010-07-30 Electronic heating module and manufacturing method thereof
PCT/EP2011/062375 WO2012013546A1 (en) 2010-07-30 2011-07-19 An electronic heating module and a method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201010243072 CN102347437A (en) 2010-07-30 2010-07-30 Electronic heating module and manufacturing method thereof

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102610737A (en) * 2012-03-21 2012-07-25 广州市鸿利光电股份有限公司 Heat-radiating device of high-power LED (Light Emitting Diode)
CN102620269A (en) * 2012-04-17 2012-08-01 林荣炽 High-power LED (Light Emitting Diode) combined heat radiator
CN106090838A (en) * 2016-06-22 2016-11-09 中南大学 High-capacity LED cooling system and control method thereof
CN106879166A (en) * 2017-03-06 2017-06-20 华南理工大学 A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure
CN107278030A (en) * 2017-06-26 2017-10-20 胜宏科技（惠州）股份有限公司 The preparation method that a kind of thermoelectricity separates LED board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103972367A (en) * 2013-02-04 2014-08-06 美中全照光电股份有限公司 LED device
US9763317B2 (en) * 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960535A (en) * 1997-10-28 1999-10-05 Hewlett-Packard Company Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
DE10335129B3 (en) * 2003-07-31 2005-06-23 Kathrein-Werke Kg Cooling arrangement for arranged on a printed circuit board electrical components, in particular SMD components
DE102004036960A1 (en) * 2004-07-30 2006-03-23 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Printed circuit board and method for producing such a printed circuit board
TWI343233B (en) * 2007-10-19 2011-06-01 Au Optronics Corp Circuit board assembly and backlight module comprising the same
TW200928203A (en) * 2007-12-24 2009-07-01 Guei-Fang Chen LED illuminating device capable of quickly dissipating heat and its manufacturing method
TWI382565B (en) * 2008-10-15 2013-01-11 Young Optics Inc Light emitting diode apparatus and optical engine using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102610737A (en) * 2012-03-21 2012-07-25 广州市鸿利光电股份有限公司 Heat-radiating device of high-power LED (Light Emitting Diode)
CN102620269A (en) * 2012-04-17 2012-08-01 林荣炽 High-power LED (Light Emitting Diode) combined heat radiator
CN106090838A (en) * 2016-06-22 2016-11-09 中南大学 High-capacity LED cooling system and control method thereof
CN106879166A (en) * 2017-03-06 2017-06-20 华南理工大学 A kind of Printed circuit board and manufacturing methods with hot pipe cooling structure
CN107278030A (en) * 2017-06-26 2017-10-20 胜宏科技（惠州）股份有限公司 The preparation method that a kind of thermoelectricity separates LED board

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C53 Correction of patent for invention or patent application
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Address after: Munich, Germany

Applicant after: Osram Co., Ltd.

Address before: Munich, Germany

Applicant before: Osram GMBH

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Free format text: CORRECT: APPLICANT; FROM: OSRAM GMBH TO: GERMANY OSRAM STOCK COMPANY LIMITED

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Application publication date: 20120208