CN205232669U - Miniflow way heat radiation structure - Google Patents
Miniflow way heat radiation structure Download PDFInfo
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- CN205232669U CN205232669U CN201521097443.3U CN201521097443U CN205232669U CN 205232669 U CN205232669 U CN 205232669U CN 201521097443 U CN201521097443 U CN 201521097443U CN 205232669 U CN205232669 U CN 205232669U
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Abstract
The utility model relates to a give the radiating miniflow way heat radiation structure of base plate, this structure includes the heating panel, is provided with first miniflow way in this heating panel, should first miniflow say and delimit out first section and second section, first section is in first miniflow is said to go up and is constituted warm area low relatively, the second section is in on saying, first miniflow constitutes relative high -temperature region, heat radiation structure further includes second miniflow way, and this second miniflow says and delimit out A section and B section, the A section constitutes the relative high -temperature region that the second miniflow was said, the B section constitutes relative low temperature area on the 2nd miniflow is said, the B section that the second miniflow was said corresponds the position of the second section that first miniflow was said sets up. The utility model discloses an adopting the second miniflow to say and further reducing relative high -temperature region that first miniflow said like the temperature of the base plate of exit correspondence, the distribution of temperature is even everywhere for messenger's base plate, has improved cooling efficiency simultaneously.
Description
Technical field
The utility model relates generally to a kind of fluid channel radiator structure, particularly relates to a kind of ltcc substrate fluid channel radiator structure.
Background technology
In recent years, along with developing rapidly of microelectric technique, the miniature of electronic equipment has become the main trend of modern electronic equipment development, and electronic device features size constantly reduces.SOC (system on a chip) (SOC) i.e. integrated complete system on a single chip, comprise central processing unit (CPU), memory and peripheral circuit etc., and the chip that package system (SIP) is about to have certain function is sealed in the case body adapted with it, the also constantly progress thereupon of these two kinds of technology, the function that microelectronic chip realizes and functional density all exponentially increase.While function increases, its power consumption and heating also increase thereupon, and research shows, the electronic equipment more than 55% lost efficacy and all causes by temperature is too high, and the encapsulation therefore for chip or integrated system proposes very high requirement.The quality of base plate for packaging performance determines reliability and the useful life of product to a great extent.Wherein LTCC (LTCC) substrate has good heat resistance due to it, thermal conductivity is high, thermal coefficient of expansion is little, and miniaturization wiring such as to be easier at the feature, has been widely used in large scale integrated circuit and hybrid circuit (HIC) encapsulation.Traditional general mode adopting external radiating tube of ltcc substrate heat radiation, along with the increase of component density on ltcc substrate and the increase of the substrate number of plies, this traditional heat-dissipating mode has been difficult to the radiating requirements meeting system.In recent years, the fluid channel heat dissipation technology based on MEMS (micro electro mechanical system) (MEMS) technology starts to be applied in ltcc substrate heat radiation.MEMS (micro electro mechanical system) is a kind of industrial technology microelectric technique and mechanical engineering are fused together, and its opereating specification is in micrometer range.MEMS (micro electro mechanical system) is the manufacturing technology platform of a kind of advanced person, and it grows up based on semiconductor fabrication, have employed a series of prior art and the material such as the photoetching in semiconductor technology, burn into film.Fluid channel heat radiation is on very thin silicon chip, metal or other suitable substrates, the runner that cross sectional shape only has tens to up to a hundred microns is processed with photoetching, etching and accurate cutting process, fluid takes away the heat on matrix when flowing through these fluid channel, it is the object utilizing the heat-exchange performance of minute yardstick to reach high efficiency cooling.Conventional package chip and LTCC two dimension micro-channel structure are as shown in Figure 1.It is by processing fluid channel on LTCC substrate.Wherein the structure of fluid channel can be many row's straight trough shapes, spirality, snakelike, fold-line-shaped, I-shaped and tree-like etc. as shown in the figure.
There is a shortcoming in tradition fluid channel heat dissipation technology.As shown in Figure 2, heating panel 1 ' has fluid channel 10 ', fluid channel 10 ' has entrance 101 ' and outlet 102 '.Because entrance 101 ' place fluid temperature is low, large with the heating panel 1 ' temperature difference, radiating efficiency is high, and export 102 ' place due to liquid absorption after heat temperature raise, diminishing with the heating panel 1 ' temperature difference causes radiating efficiency to reduce, therefore the phenomenon that this two-dimentional runner ubiquity temperature field is uneven, can cause whole ltcc substrate non-uniform temperature.Local overheating can cause adverse effect to chip, and the too high meeting of temperature causes chip failure.
Therefore be necessary to propose a kind of new fluid channel radiator structure, the problem that the heat radiation of traditional fluid channel is uneven can be solved.
Utility model content
For the problems referred to above, the utility model provides a kind of fluid channel radiator structure, and the fluid channel radiating mode of this structure mainly through adopting additional second fluid channel to carry out heat radiation further, Temperature Distribution is comparatively even everywhere to make substrate.
A kind of fluid channel radiator structure for dispelling the heat to substrate that the utility model provides, comprise heating panel, be provided with the first fluid channel in this heating panel, this first fluid channel delimit out first paragraph and second segment.Described first paragraph forms relative low temperature district in described first fluid channel, and described second segment forms relatively-high temperature district in described first fluid channel.Described radiator structure comprises the second fluid channel further, and this second fluid channel delimit out A section and B section.Described A section forms the relatively-high temperature district of described second fluid channel, and described B section forms the relative low temperature district in described second fluid channel.The position of the second segment of corresponding described first fluid channel of B section of described second fluid channel is arranged.
Above-mentioned fluid channel radiator structure, described first fluid channel and described second fluid channel lay respectively at the both sides of described substrate or are positioned at the same side of described substrate.
Above-mentioned fluid channel radiator structure, described first fluid channel and described second fluid channel are positioned at same heating panel or different heating panel.
Above-mentioned fluid channel radiator structure, described first fluid channel and described second fluid channel are respectively in snakelike or straight trough shape or fold-line-shaped or tree-like or spirality or I-shaped; The shape of described first fluid channel and described second fluid channel is identical or different.
Above-mentioned fluid channel radiator structure, the described heating panel of described radiator structure is parallel to described substrate and places.
Above-mentioned fluid channel radiator structure, can by adjacent for the outlet of the entrance of described first fluid channel and described second fluid channel or be positioned at the same side and arrange, by adjacent for the entrance of the outlet of described first fluid channel and described second fluid channel or be positioned at the same side and arrange.
Above-mentioned fluid channel radiator structure, the direction of flow in described first fluid channel can be set to first direction, the direction of flow in described second fluid channel is set to second direction, and described first direction is contrary with described second direction.
The technical solution of the utility model, by adopting additional second fluid channel and this second fluid channel can be dispelled the heat for the substrate that the first fluid channel high-temperature area is as corresponding in exit region further further, make chip substrate uniformity of temperature profile everywhere, reduce the chip failure risk caused because chip substrate local temperature is too high, extend the useful life of chip.Simultaneously because adopting the mode of plural fluid channel equilibrium heat radiation, improve cooling effectiveness than adopting the mode of unidirectional fluid channel heat radiation.
Accompanying drawing explanation
Fig. 1 is conventional package chip and two-dimentional fluid channel radiator structure schematic diagram;
Fig. 2 is a kind of conventional two-dimensional fluid channel radiator structure schematic diagram;
Fig. 3 is one two fluid channel radiator structure schematic diagrames of the utility model first embodiment;
Fig. 4 is one two fluid channel radiator structure schematic diagrames of the utility model second embodiment; And
Fig. 5 is one more than two articles fluid channel radiator structure schematic diagrames of the utility model the 3rd embodiment.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in more details, the advantage of scheme of the present utility model and various aspects can be understood better.But embodiment described below and embodiment are only the objects illustrated, instead of to restriction of the present utility model.
With ltcc substrate fluid channel, embodiment of the present utility model illustrates that this kind comprises the radiator structure of at least two fluid channel.
First ltcc substrate is provided.Low-temperature sintered ceramics powder is made the green band that thickness is accurate and fine and close, green band utilize the techniques such as laser drilling, micropore slip casting, accurate conductor paste printing make required circuitous pattern, and multiple passive component (as low capacitance electric capacity, resistance, filter, impedance transducer, coupler etc.) is imbedded in multilayer ceramic substrate, make band circuit substrate.Be not with on circuit substrate in part simultaneously, process with photoetching, etching and accurate cutting process the fluid channel that cross sectional shape only has tens to up to a hundred microns, prepare fluid channel heating panel and the substrate with gateway.Then the substrate of band circuit substrate, fluid channel heating panel and band gateway is overlapped together, the entrance centering wherein with the entrance on the substrate of gateway and fluid channel heating panel, be with the exit centering of outlet on the substrate of gateway and fluid channel heating panel.Fluid channel heating panel can be placed in the surface that can produce thermal source, also can be placed in below it.The substrate laminated and heating panel at high temperature sinter, and make the non-interfering high-density circuit of three dimensions, also can be made into the three-dimensional circuit board of built-in passive component, can mount IC and active device on its surface, make passive/active integrated functional module.
Fluid channel on fluid channel heating panel is connected with extraneous pipeline by the gateway of band gateway substrate, and the terminal of this pipeline is connected with pump.Pipeline is provided with the transducer of test pipeline inner fluid temperature, pressure etc., and regulates and close the control valve of fluid channel internal pressure.When circuit ON power supply, when substrate is in running order, the substrate of band circuit constantly can produce heat, the chipset that whole substrate package becomes can temperature raise.Supply heat recipient fluid by pump in fluid channel, heat recipient fluid circulates in fluid channel, and by heat conducting principle, heat recipient fluid takes away the heat at thermal source place.Heat recipient fluid is the mixture of liquid or gas or liquids and gases.Liquid can be water, alcohol, the mixed liquor of water and alcohol, freon, or small organic molecule.Gas can be cold air or nitrogen etc.
Fluid channel radiator structure of the present utility model is illustrated below in conjunction with legend.
First embodiment
Fig. 3 is a kind of fluid channel radiator structure schematic diagram of the utility model first embodiment.This structure comprises the two-way fluid channel heating panel 1 which is provided with one group of opposite course, and two-way fluid channel comprises the first fluid channel 10 and the second fluid channel 11 of structural similarity, and in this embodiment, the shape of fluid channel is snakelike.The outlet 112 of the entrance 101 of the first fluid channel with the second fluid channel 11 is disposed adjacent, the entrance 111 of the outlet 102 of the first fluid channel 10 with the second fluid channel 11 is disposed adjacent.
Wherein, the first fluid channel 10 delimit out first paragraph 103 and second segment 104, and described first paragraph 103 forms relative low temperature district in described first fluid channel, and described second segment 104 forms relatively-high temperature district in described first fluid channel.
Correspondingly, the second fluid channel 11 delimit out A section 113 and B section 114, and described A section 113 forms the relatively-high temperature district of described second fluid channel, and described B section 114 forms the relative low temperature district in described second fluid channel.As shown in the figure, the position of the second segment 104 of corresponding described first fluid channel of the B section 114 of described second fluid channel is arranged.
In above-described embodiment, described one group of two-way fluid channel is arranged in same plane, is produced on same substrate 1, described first fluid channel 10 is laterally arranged side by side with described second fluid channel 11.
The heat recipient fluid passed in described first fluid channel 10 with described second fluid channel 11 is water.
In fluid channel during logical heat recipient fluid heat radiation, the direction of flow in the first fluid channel 10 is set to first direction, and the direction of flow in the second fluid channel 11 is set to second direction, and this both direction is contrary, defines two-way fluid channel.
With pump, described heat recipient fluid is flowed, thus the temperature of substrate is reduced and evenly.
Second embodiment
Fig. 4 is a kind of fluid channel radiator structure schematic diagram of the utility model second embodiment.This structure comprises one group of fluid channel, is the 3rd fluid channel 20 and the 4th fluid channel 21.3rd fluid channel 20 is arranged on heating panel 2, and the 4th fluid channel is arranged on heating panel 3, and the 3rd fluid channel 20 is identical with the shape of the 4th fluid channel 21, is all snakelike.During encapsulation, heating panel 2 is placed in above the substrate 4 of generation thermal source, heating panel 3 is placed in the below of thermal source substrate 4, and immediately below the outlet 212 entrance 201 of the 3rd fluid channel 20 being arranged on the 4th fluid channel 21, immediately below the entrance 211 outlet 202 of the 3rd fluid channel 20 being arranged on the 4th fluid channel 21.The entrance 201 of the 3rd fluid channel 20 and the outlet 212 of the 4th fluid channel 21 are arranged in the same side, and the outlet 202 of the 3rd fluid channel 20 and the entrance 211 of the 4th fluid channel 21 are arranged in the same side.Material is thus formed fluid channel longitudinally placed side by side.
Wherein, the 3rd fluid channel 20 delimit out first paragraph 203 and second segment 204, and described first paragraph 203 forms relative low temperature district in described first fluid channel, and described second segment 204 forms relatively-high temperature district in described first fluid channel.This is because, when fluid just flows into fluid channel, its temperature is minimum, along with fluid constantly absorbs heat, fluid temperature (F.T.) constantly raises, thus the highest at the outlet temperature of fluid outflow, namely, because of fluid heat absorption, thus form fluid from entering the porch of fluid channel to the process in exit flowing out substrate regions, temperature raises gradually.
Correspondingly, the 4th fluid channel 11 delimit out A section 213 and B section 214, and described A section 213 forms the relatively-high temperature district of described 4th fluid channel, and described B section 214 forms the relative low temperature district in described 4th fluid channel.As shown in the figure, the position of the second segment 204 of corresponding described 3rd fluid channel of the B section 214 of described 4th fluid channel is arranged.
The heat recipient fluid passed in described 3rd fluid channel 20 with described 4th fluid channel 21 is the mixed liquor of water and alcohol.
With pump, described heat recipient fluid is flowed, thus the temperature of substrate is reduced.
In fluid channel during logical heat recipient fluid heat radiation, the circulating direction of the heat recipient fluid in the 3rd fluid channel 20 and the 4th fluid channel 21 is contrary, defines two-way fluid channel.
3rd embodiment
Fig. 5 is a kind of fluid channel radiator structure schematic diagram of the utility model the 3rd embodiment.This structure comprises array fluid channel, and comprises two kinds of different micro-channel structure shapes, is snakelike respectively and straight trough shape.Wherein snakelike two-way fluid channel is longitudinally corresponding up and down, and the fluid channel of straight trough shape is both longitudinally corresponding up and down, and left and right is laterally corresponding again.
Particularly, heating panel 5 is provided with straight trough shape fluid channel and is respectively the 5th fluid channel the 50, six fluid channel the 51, seven fluid channel the 52, eight fluid channel 53; The snakelike fluid channel arranged is 54.Heating panel 7 is provided with straight trough shape fluid channel and is respectively the 9th fluid channel the 70, ten fluid channel the 71, the 11 fluid channel 72, the 12 fluid channel 73; The snakelike fluid channel arranged is 74.During encapsulation, heating panel 7 is placed in above the substrate 6 of generation thermal source, and heating panel 5 is placed in the below of thermal source substrate 6.
For straight trough shape fluid channel, immediately below the outlet 702 entrance 501 of the 5th fluid channel 50 being arranged on the 9th fluid channel 70, immediately below the entrance 701 outlet 502 of the 5th fluid channel 50 being arranged on the 9th fluid channel 70.In like manner, successively the entrance 531 of the entrance 521 of the entrance 511 of the 6th fluid channel 51, the 7th fluid channel 52 and the 8th fluid channel 53 respectively with the outlet 712 of the tenth fluid channel 71, the outlet 722 of the 11 fluid channel 72, the outlet about 732 of the 12 fluid channel 73 is corresponding.Corresponding with the entrance about 732 of entrance the 722, the 12 fluid channel 73 of entrance the 712, the 11 fluid channel 72 of the tenth fluid channel 71 respectively for the outlet 531 of the outlet 521 of the outlet 511 of the 6th fluid channel 51, the 7th fluid channel 52 and the 8th fluid channel 53, material is thus formed four groups of two-way fluid channel at longitudinal direction.Meanwhile, laterally, the entrance 501 of the outlet 512 of the 6th fluid channel 51 with the 5th fluid channel 50 is disposed adjacent, the outlet 502 of the entrance 511 of the 6th fluid channel 51 with the 5th fluid channel 50 is disposed adjacent.The entrance 511 of the outlet 522 of the 7th fluid channel 52 with the 6th fluid channel 51 is disposed adjacent, the outlet 512 of the entrance 521 of the 7th fluid channel 52 with the 6th fluid channel 51 is disposed adjacent.The entrance 521 of the outlet 532 of the 8th fluid channel 53 with the 7th fluid channel 52 is disposed adjacent, the outlet 532 of the entrance 531 of the 8th fluid channel 53 with the 7th fluid channel 53 is disposed adjacent.Like this, the fluid channel of straight trough shape just defines arbitrary neighborhood two fluid channel up and down becomes the two-way fluid channel of one group of opposite course.
For the snakelike fluid channel of this embodiment, immediately below the outlet 742 entrance 541 of fluid channel 54 being arranged on fluid channel 74, immediately below the entrance 741 outlet 542 of fluid channel 54 being arranged on fluid channel 74, fluid channel 54 and fluid channel 74 form about one group longitudinally two-way fluid channel side by side.
Wherein, the 5th fluid channel 50 delimit out first paragraph 503 and second segment 504, and described first paragraph 503 forms relative low temperature district in described 5th fluid channel, and described second segment 504 forms relatively-high temperature district in described 5th fluid channel.
Correspondingly, as shown in the figure, the 7th fluid channel 70 delimit out A section 703 and B section 704, and described A section 703 forms the relatively-high temperature district of described 7th fluid channel, and described B section 704 forms the relative low temperature district in described 7th fluid channel.The position of the second segment 504 of corresponding described 5th fluid channel of B section 704 of described 7th fluid channel is arranged.
In like manner, other corresponding fluid channel all as equally with the 7th fluid channel in above-mentioned 5th fluid channel can delimit out first paragraph and second segment and A section and B section, and each section corresponding respectively, illustrates no longer one by one at this.
The heat recipient fluid passed in above-mentioned fluid channel is nitrogen.
With pump, described heat recipient fluid is flowed, thus the temperature of substrate is reduced.
As mentioned above, according to the utility model, when prior art only arranges one group of unidirectional fluid channel, this group of fluid channel (namely, first group of fluid channel) more close to its outlet (namely leaving the position of substrate regions), temperature is higher, can become worse and worse the radiating effect of substrate.Inventor of the present utility model notices this phenomenon, and take pains this phenomenon of elimination, therefore, the present inventor in this group of fluid channel close near exit region, add and be provided with second group of fluid channel, and the high-temperature region of the corresponding above-mentioned first group of fluid channel of the entrance area of this second group of fluid channel and low-temperature space is arranged, to strengthen radiating effect, and make the heat radiation of substrate even further.Because above-described embodiment is only for illustrating, therefore, select fairly simple fluid channel shape, but in practice, the shapes of fluid channel etc. can be selected arbitrarily as required, the flow direction of the fluid in the arrangement form of fluid channel and fluid channel, all can change, as long as the heat radiation of substrate regions corresponding to the relatively-high temperature district enabling the additional second group of fluid channel arranged strengthen first group of fluid channel.
In addition, in embodiment 2 and 3 as above, the fluid channel shape on the heating panel that substrate is upper and lower be identical and radiator structure work time its fluid the flow direction be contrary, but this all not necessarily.According to the utility model, can be as the case may be, as made the fluid channel of other shapes according to radiating requirements, set the fluid channel of identical or different group of number, the direction of flow in fluid channel also can not limit, as long as energy efficiently radiates heat, namely, as long as delimit out relatively-high temperature section and relative low temperature section often organizing fluid channel, and corresponding with low temperature section for the high temperature section often organizing fluid channel, just can reach goal of the invention of the present utility model.So, countless fluid channel radiator structures can be converted out, but these fluid channel radiator structures, as long as have employed the radiating effect that the second additional fluid channel strengthens the first fluid channel, if and the relative low temperature district of described second fluid channel is set in the relatively-high temperature district of the first fluid channel, namely should be included in scope of the present utility model.
As mentioned above, according to the utility model, by the radiating effect adopting one or more groups additional fluid channel to strengthen the first fluid channel further, Temperature Distribution is more even everywhere to make chip substrate, thus reduce the chip failure risk caused because chip substrate local temperature is too high, extend the useful life of chip.Particularly, as described in above-described embodiment 1-3, according to the mode that two-way fluid channel is dispelled the heat, cooling effectiveness can be improved further.
Last it is noted that obviously, above-described embodiment is only for the utility model example is clearly described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of amplifying out or variation be still among protection range of the present utility model.
Claims (7)
1. the fluid channel radiator structure for dispelling the heat to substrate, comprise heating panel, the first fluid channel is provided with in this heating panel, this first fluid channel delimit out first paragraph and second segment, described first paragraph forms relative low temperature district in described first fluid channel, described second segment forms relatively-high temperature district in described first fluid channel, it is characterized in that
Described radiator structure comprises the second fluid channel further, this second fluid channel delimit out A section and B section, described A section forms the relatively-high temperature district of described second fluid channel, described B section forms the relative low temperature district in described second fluid channel, and the position of the second segment of corresponding described first fluid channel of B section of described second fluid channel is arranged.
2. fluid channel radiator structure as claimed in claim 1, it is characterized in that, described first fluid channel and described second fluid channel lay respectively at the both sides of described substrate or are positioned at the same side of described substrate.
3. fluid channel radiator structure as claimed in claim 1 or 2, it is characterized in that, described first fluid channel and described second fluid channel are positioned at same heating panel or different heating panel.
4. fluid channel radiator structure as claimed in claim 1 or 2, is characterized in that, described first fluid channel and described second fluid channel are respectively in snakelike or straight trough shape or fold-line-shaped or tree-like or spirality or I-shaped; The shape of described first fluid channel and described second fluid channel is identical or different.
5. fluid channel radiator structure as claimed in claim 1 or 2, is characterized in that, the described heating panel of described radiator structure is parallel to described substrate and places.
6. fluid channel radiator structure as claimed in claim 1 or 2, it is characterized in that, the entrance of described first fluid channel is adjacent with the outlet of described second fluid channel or be positioned at the same side, and the outlet of described first fluid channel is adjacent with the entrance of described second fluid channel or be positioned at the same side.
7. fluid channel radiator structure as claimed in claim 1 or 2, it is characterized in that, direction of flow in described first fluid channel is set to first direction, and the direction of flow in described second fluid channel is set to second direction, and described first direction is contrary with described second direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521097443.3U CN205232669U (en) | 2015-12-24 | 2015-12-24 | Miniflow way heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201521097443.3U CN205232669U (en) | 2015-12-24 | 2015-12-24 | Miniflow way heat radiation structure |
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| CN205232669U true CN205232669U (en) | 2016-05-11 |
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| CN201521097443.3U Withdrawn - After Issue CN205232669U (en) | 2015-12-24 | 2015-12-24 | Miniflow way heat radiation structure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611801A (en) * | 2015-12-24 | 2016-05-25 | 深圳市华讯方舟微电子科技有限公司 | Micro-channel cooling structure and method |
| CN107809879A (en) * | 2016-09-09 | 2018-03-16 | 深圳联品激光技术有限公司 | A kind of cooling mechanism and the equipment with thermal source |
| CN116540368A (en) * | 2023-06-25 | 2023-08-04 | 之江实验室 | Chip cooling structure, manufacturing method thereof and photon integrated chip |
-
2015
- 2015-12-24 CN CN201521097443.3U patent/CN205232669U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611801A (en) * | 2015-12-24 | 2016-05-25 | 深圳市华讯方舟微电子科技有限公司 | Micro-channel cooling structure and method |
| CN105611801B (en) * | 2015-12-24 | 2017-09-29 | 深圳市华讯方舟微电子科技有限公司 | Fluid channel radiator structure and method |
| CN107809879A (en) * | 2016-09-09 | 2018-03-16 | 深圳联品激光技术有限公司 | A kind of cooling mechanism and the equipment with thermal source |
| CN107809879B (en) * | 2016-09-09 | 2020-04-03 | 深圳联品激光技术有限公司 | Heat dissipation mechanism and equipment with heat source |
| CN116540368A (en) * | 2023-06-25 | 2023-08-04 | 之江实验室 | Chip cooling structure, manufacturing method thereof and photon integrated chip |
| CN116540368B (en) * | 2023-06-25 | 2024-01-09 | 之江实验室 | Chip cooling structure, manufacturing method thereof and photon integrated chip |
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Address after: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Patentee after: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY CO., LTD. Patentee after: Shenzhen Huaxunark Technology Co., Ltd. Address before: 518102 Guangdong Province, Baoan District Xixiang street Shenzhen City Tian Yi Lu Chen Tian Bao Industrial District 37 Building 2 floor East Patentee before: SHENZHEN HUAXUN FANGZHOU MICROELECTRONIC SCIENCE & TECHNOLOGY CO., LTD. Patentee before: Shenzhen City Huaxun Fangzhou Technology Co., Ltd. |
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