CN112133682A - Chip assembly, heat dissipation circuit device and mobile terminal - Google Patents
Chip assembly, heat dissipation circuit device and mobile terminal Download PDFInfo
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- CN112133682A CN112133682A CN202010927617.3A CN202010927617A CN112133682A CN 112133682 A CN112133682 A CN 112133682A CN 202010927617 A CN202010927617 A CN 202010927617A CN 112133682 A CN112133682 A CN 112133682A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a chip assembly, a heat dissipation circuit device and a mobile terminal. The chip assembly includes: a chip; the heat dissipation piece is fixedly connected to the surface of the chip and comprises at least one micro-channel for liquid to flow, a first flow guide hole and a second flow guide hole, wherein the first flow guide hole and the second flow guide hole are correspondingly communicated with the micro-channel. The printed circuit board comprises at least one mounting groove formed by sinking the surface, and a third flow guide hole and a fourth flow guide hole which penetrate through the printed circuit board, wherein the third flow guide hole and the fourth flow guide hole are distributed at intervals and are communicated with the at least one mounting groove. The chip is connected to the printed circuit board, the heat dissipation piece is located in the mounting groove, the first flow guide hole is communicated with the third flow guide hole correspondingly, and the second flow guide hole is communicated with the fourth flow guide hole correspondingly.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a chip assembly, a heat dissipation circuit device and a mobile terminal.
Background
The technology microwave millimeter wave radio frequency integrated circuit technology is the basis of modern national defense weaponry and internet industry, and with the rapid rise of the economy of internet plus such as intelligent communication, intelligent home, intelligent logistics, intelligent traffic and the like, the microwave millimeter wave radio frequency integrated circuit which bears the functions of data access and transmission also has huge practical requirements and potential markets.
For a high-frequency micro-system, the area of the antenna array is smaller and smaller, and the distance between the antennas needs to be kept within a certain specific range, so that the whole module has excellent communication capability. However, the area of an analog device chip based on a radio frequency chip cannot be reduced by the same magnification as a digital chip, so that a radio frequency micro system with a very high frequency cannot provide a sufficient area and simultaneously lay out PA (Power Amplifier)/LNA (Low Noise Amplifier). In the related art, a PA/LNA stack design is required to meet layout requirements, however, the stack design causes great difficulty in heat dissipation of a chip and affects system performance stability, so improvement is required.
Disclosure of Invention
In view of the above, it is necessary to provide a chip assembly, a heat dissipation circuit apparatus and a mobile terminal for solving the problem of high difficulty in heat dissipation of chips in a stacked design.
The invention discloses a chip assembly, comprising:
a chip;
the heat dissipation piece is fixedly connected to the surface of the chip and comprises at least one micro-channel for liquid to flow, a first flow guide hole and a second flow guide hole, wherein the first flow guide hole and the second flow guide hole are correspondingly communicated with the micro-channel;
the printed circuit board comprises at least one mounting groove formed by sinking from the surface, and a third flow guide hole and a fourth flow guide hole which penetrate through the printed circuit board, wherein the third flow guide hole and the fourth flow guide hole are distributed at intervals and are communicated with the at least one mounting groove;
the chip is connected to the printed circuit board, the heat dissipation piece is located in the mounting groove, the first flow guide hole is communicated with the third flow guide hole correspondingly, and the second flow guide hole is communicated with the fourth flow guide hole correspondingly.
In one embodiment, the heat dissipation member includes more than two micro flow channels distributed at intervals on the surface of the chip, and the micro flow channels of adjacent heat dissipation members are relatively independent.
In one embodiment, the chip assembly further comprises a communication piece for sequentially connecting two adjacent heat dissipation pieces, wherein the communication piece is provided with a connection channel for communicating micro channels of the adjacent heat dissipation pieces.
In one embodiment, the chip assembly further includes a first bus bar connected to one end of the heat sink and a second bus bar connected to the other end of the heat sink, the first bus bar includes a first bus channel communicated with the micro channel and a first bus hole communicated to the first bus channel, the second bus bar includes a second bus channel communicated with the micro channel and a second bus hole communicated to the second bus channel, two or more of the heat sink are connected to the first and second bus channels, respectively, the first bus hole is communicated with the third flow guide hole, and the second bus hole is communicated with the fourth flow guide hole.
In one embodiment, the heat sink includes two or more micro flow channels, and the heat sink is integrally inserted into the mounting groove.
In one embodiment, the heat dissipation element comprises a substrate layer, an insulating layer attached to the substrate layer and a cover plate layer attached to the insulating layer, wherein the substrate layer comprises groove-shaped guide grooves, the guide grooves penetrate through the insulating layer, the cover plate layer closes the notches of the guide grooves to form the micro channel, and the first guide holes and the second guide holes penetrate through the cover plate layer and are communicated with the guide grooves.
In one embodiment, the width of the diversion trench is set as B, and B is more than or equal to 10 micrometers and less than or equal to 5000 micrometers; the groove depth of the diversion groove is set as H, and H is more than or equal to 1 micrometer and less than or equal to 500 micrometers.
In one embodiment, the thickness of the base layer is set to t, 200 microns ≦ t ≦ 2000 microns.
In one embodiment, the substrate layer and the surface of the chip are connected by metal fusion bonding or by adhesive bonding.
In one embodiment, the material of the substrate layer includes one of titanium, copper, aluminum, silver, palladium, gold, thallium, tin, nickel, glass, quartz, silicon carbide, alumina, epoxy resin, and polyurethane.
In one embodiment, an adhesive is filled between the outer peripheral wall of the heat sink and the groove wall of the mounting groove.
The invention discloses a heat dissipation circuit device which comprises a mainboard, a liquid circulation assembly arranged on the mainboard and the chip assembly, wherein the liquid circulation assembly is connected to a third diversion hole and a fourth diversion hole so as to drive liquid to circularly flow along a micro-channel.
The invention discloses a mobile terminal which comprises a shell and the heat dissipation circuit device, wherein the heat dissipation circuit device is arranged on the shell.
The invention has the beneficial effects that: the heat dissipation piece is fixed on the surface of the chip to dissipate heat through liquid flowing in the micro-channel, so that the temperature rise of the chip is kept stable. The heat dissipation piece is provided with the micro channel which is communicated with the printed circuit board only through the first flow guide hole and the second flow guide hole, so that liquid is prevented from permeating the printed circuit board, the performance stability of the printed circuit board is kept, and the operation stability of the chip assembly is improved.
Drawings
Fig. 1 is a schematic diagram of a transverse cross-sectional structure of a chip assembly with two heat dissipation members spaced apart.
Fig. 2 is a schematic longitudinal sectional structure view of a chip assembly with two heat dissipation members spaced apart.
Fig. 3 is a schematic view of a lateral cross-sectional structure of a chip assembly in which a plurality of heat dissipation members are connected by a communication member.
Fig. 4 is a schematic longitudinal sectional view of a chip assembly in which a plurality of heat dissipation members are connected by a communication member.
Fig. 5 is a schematic longitudinal sectional view of a chip assembly in which a plurality of heat dissipation members are connected by a first bus bar and a second bus bar.
Fig. 6 is a schematic view of a transverse cross-sectional structure of the heat sink.
In the figure, 10, the heat sink 10; 11. a micro flow channel; 12. a first flow guide hole; 13. a second flow guide hole; 14. a base layer; 141. a diversion trench; 15. an insulating layer; 16. a cover plate layer; 20. a printed circuit board; 21. a third flow guide hole; 22. a fourth diversion hole; 23. mounting grooves; 30. a chip; 40. a communicating member; 41. a connecting channel; 50. a first bus bar; 51. a first manifold hole; 52. a first bus duct; 60. a second bus bar; 61. a second manifold hole; 62. a second bus duct.
Detailed Description
The chip assembly, the heat dissipating circuit device and the mobile terminal provided by the present invention will be further described below.
As shown in fig. 1 and 2, the present invention provides a chip assembly including a chip 30, a heat sink 10, and a printed circuit board 20, the heat sink 10 being fixedly attached to a surface of the chip 30. The heat sink 10 includes at least one micro flow channel 11 for flowing liquid, and a first flow guide hole 12 and a second flow guide hole 13 correspondingly communicated with the micro flow channel 11. The heat sink 10 is attached to the surface of the chip 30, and a flowing liquid for absorbing heat generated by the chip 30 is disposed in the micro flow channel 11, so as to stabilize the operating temperature of the chip 30 and maintain stable operating performance of the chip 30.
The printed circuit board 20 comprises at least one mounting groove 23 formed by sinking from the surface, and a third diversion hole 21 and a fourth diversion hole 22 penetrating through the printed circuit board 20, wherein the third diversion hole 21 and the fourth diversion hole 22 are distributed at intervals and are communicated with the at least one mounting groove 23. The chip 30 is connected to the printed circuit board 20, the heat sink 10 is located in the mounting groove 23, the first flow guiding hole 12 is correspondingly communicated with the third flow guiding hole 21, and the second flow guiding hole 13 is correspondingly communicated with the fourth flow guiding hole 22.
The mounting groove 23 is recessed from the surface of the printed circuit board 20 to form a groove structure for accommodating the heat sink 10, so that the chip 30 can be smoothly mounted on the surface of the printed circuit board 20, and the connection stability between the chip 30 and the printed circuit board 20 is improved. The heat sink 10 is provided with the micro channel 11 which is communicated with the printed circuit board 20 only through the first flow guiding hole 12 and the second flow guiding hole 13, so that liquid is prevented from permeating the printed circuit board 20, the performance stability of the printed circuit board 20 is kept, and the operation stability of the chip assembly is improved.
The heat sink 10 is attached to the chip 30, wherein the number of the heat sink 10 may be one or more, and the layout manner thereof may be adaptively adjusted according to the heat dissipation requirement and the connection requirement between the chip 30 and the printed circuit board 20, so as to improve the temperature control effect of the chip 30 and maintain a good connection effect. Hereinafter, the chip assembly will be further described by the following specific examples.
Example one
As shown in fig. 1 and 2, the heat dissipation member 10 includes more than two micro channels 11 that are distributed at intervals on the surface of the chip 30, and the micro channels 11 of adjacent heat dissipation members 10 are relatively independent. The heat sink 10 is provided with two or more micro channels 11 to form independent micro channels, so that the temperature of the designated area of the chip 30 can be correspondingly reduced, and the controllability of the cooling area is high. Alternatively, the extending directions of two adjacent heat dissipation members 10 are parallel to each other. Optionally, three or more heat dissipation members 10 are equidistant to maintain the heat dissipation balance of the chip 30; or, three or more heat dissipation members 10 are distributed at different intervals to expand the heat dissipation range of the chip 30.
Example two
As shown in fig. 3 and 4, in the first embodiment, the chip assembly further includes a communication member 40 for sequentially connecting two adjacent heat dissipation members 10, the communication member 40 is provided with a connection channel 41, and the connection channel 41 communicates with the micro flow channel 11 of the adjacent heat dissipation member 10. The communication member 40 is used to communicate the microchannels 11 of two adjacent heat dissipation members 10 to form a structure of the microchannels 11 which are continuously curved, thereby enlarging the liquid flow range. Optionally, the first flow guiding hole 12 and the second flow guiding hole 13 are arranged as one and communicate with the continuous microchannel 11 structure to reduce the input and output interfaces of the liquid. Alternatively, the heat sink 10 and the communication member 40 are integrally formed, and the communication member 40 is a bent connection portion of the heat sink 10. The communicating member 40 is provided with the structure of the microchannel 11 such as a curved channel structure, a linear channel structure, a curved and linear combined connecting channel 41 structure, and the like, so as to improve the flexibility of the arrangement of the microchannel 11.
EXAMPLE III
As shown in fig. 5, in the first embodiment, the chip module further includes a first bus bar 50 connected to one end of the heat sink 10 and a second bus bar 60 connected to the other end of the heat sink 10, the first bus bar 50 includes a first bus passage 52 communicating with the micro flow channel 11 and a first bus hole 51 communicating to the first bus passage 52, and the second bus bar 60 includes a second bus passage 62 communicating with the micro flow channel 11 and a second bus hole 61 communicating to the second bus passage 62. Two or more of the heat sink 10 are connected to a first collecting channel 52 and a second collecting channel 62, respectively, the first collecting hole 51 is correspondingly communicated with the third guide hole 21, and the second collecting hole 61 is correspondingly communicated with the fourth guide hole 22.
The first confluence member 50 serves as a liquid-joining input channel, the second confluence member 60 serves as a liquid-joining output channel, and both ends of the micro flow channels 11 of the plurality of heat sinks 10 are connected to the first confluence channel 52 and the second confluence channel 62, respectively. The liquid flows from the first confluence hole 51 into the first confluence channel 52, then flows along two or more micro channels 11, flows out along the micro channels 11, and then is merged into the second confluence channel 62. The micro channels 11 are distributed in parallel to enlarge the contact area between the heat sink 10 and the chip 30, and then are collected by the first collecting flow piece 50 and the second collecting flow piece 60 to reduce the liquid input and output channels, thereby improving the performance stability of the printed circuit board 20. Optionally, the first bus bar 50, the second bus bar 60, and the plurality of heat sinks 10 are integrally molded to form an integral structure.
In the above-described embodiment, each heat sink 10 is provided with at least one micro flow channel 11 for liquid flow. The heat sink 10 includes two or more micro channels 11, and the heat sink 10 is integrally inserted into the mounting groove 23. The micro channels 11 are disposed at intervals on the heat sink 10 to form micro channels 11 distributed in parallel. The microchannels 11 between adjacent ones are separated by a partition. It should be noted that, when the chip 30 is connected to a heat sink 10, the heat sink 10 is provided with a plurality of micro channels 11 distributed in parallel along one extending direction of the chip 30, so as to increase the number of micro channels 11 and enlarge the contact area with the chip 30. One heat sink 10 is provided to facilitate the connection of the chip 30 to the heat sink 10.
The heat dissipation member 10 is integrally embedded into the mounting groove 23 of the printed circuit board 20, the relative positions of the heat dissipation member and the mounting groove are accurately assembled, the concentricity of the first diversion hole 12 and the third diversion hole 21 is improved, and the concentricity of the second diversion hole 13 and the fourth diversion hole 22 is improved. In an embodiment, an adhesive is filled between the outer peripheral wall of the heat sink 10 and the wall of the mounting groove 23 to improve the bonding tightness between the two, and further improve the anti-leakage effect between the heat sink 10 and the printed circuit board 20.
The communication member 40, the first bus bar member 50 and the second bus bar member 60 may be connected to the heat sink 10 or integrally formed with the heat sink 10 to realize different flow scenarios of the liquid. The heat dissipation member 10 is formed by processing and then superposing a plurality of layers of materials; alternatively, the heat sink 10 is a structural member having the micro flow channels 11 formed by processing the heat sink 10 by a three-dimensional printing technique, and the structure and the processing method of the heat sink 10 are exemplified below.
As shown in the subject 1 and fig. 6, in an embodiment, the heat sink 10 includes a substrate layer 14, an insulating layer 15 attached to the substrate layer 14, and a cover plate layer 16 attached to the insulating layer 15, wherein the substrate layer 14 includes a groove-shaped channel 141, and the channel 141 penetrates through the insulating layer 15. The cover plate layer 16 closes the notch of the guide groove 141 to form the micro channel 11, and the first guide hole 12 and the second guide hole 13 penetrate through the cover plate layer 16 and are communicated with the guide groove 141.
An insulating layer 15 is disposed on the surface of the substrate layer 14 to prevent the heat sink 10 from electrically connecting the chip 30 and the printed circuit board 20. The base layer 14 is made of a metal material such as titanium, copper, aluminum, silver, palladium, gold, thallium, tin, nickel, or the like; alternatively, the substrate layer 14 may be made of a non-metallic material such as glass, quartz, silicon carbide, or alumina; alternatively, the material used for the base layer 14 includes organic materials such as epoxy resin and polyurethane. Of course, the materials used for the base layer 14 include, but are not limited to, those disclosed above.
Among them, the metal material used for the base layer 14 has high thermal conductivity, and the heat dissipation efficiency of the bonding of the base layer 14 and the chip 30 is high. Preferably, the base layer 14 is made of copper or copper alloy to adapt the expansion coefficient of the printed circuit board 20 so as to maintain the structural and dimensional stability of the joint with the printed circuit board 20.
The base layer 14 and the insulating layer 15 are provided with a long groove-shaped flow guide groove 141, and the cover plate layer 16 is covered on the insulating layer 15 and seals the groove opening of the flow guide groove 141, so that a porous micro channel 11 is formed between the flow guide groove 141 and the surface of the cover plate layer 16, and the size and the flow direction of the micro channel 11 are convenient to process.
In one embodiment, the width of the guiding groove 141 is set as B, and B is greater than or equal to 10 micrometers and less than or equal to 5000 micrometers; the depth of the diversion trench 141 is set as H, and H is not less than 1 micrometer and not more than 500 micrometers. The width and depth of the guide groove 141 are adjusted adaptively according to the thickness of the base layer 14 and the cross-sectional area of the microchannel 11. Wherein, the thickness of the substrate layer 14 is t, t is more than or equal to 200 micrometers and less than or equal to 2000 micrometers. The guiding groove 141 is disposed on the substrate layer 14, and the thickness of the substrate layer 14 is adaptively adjusted according to the difference of the chip 30, so as to reduce the distance between the chip 30 and the groove bottom of the guiding groove 141, and improve the efficiency of temperature adjustment of the chip 30. Wherein the substrate layer 14 and the surface of the chip 30 are connected by metal fusion bonding or adhesive bonding with an adhesive so as to be tightly integrated.
When the heat sink 10 is made of a silicon wafer, the manufacturing method includes:
step one, manufacturing an RDL and a bonding pad on the surface of the first silicon wafer, and etching a groove to form a diversion trench 141.
In this step, step 101 is included, the surface of the first silicon wafer is deposited with materials such as silicon oxide or silicon nitride to obtain an insulating layer 15; alternatively, the surface of the first silicon wafer is directly thermally oxidized to obtain the insulating layer 15. Wherein the insulating layer 15 has a thickness in the range of 10nm to 100 μm.
And 102, manufacturing a seed layer above the insulating layer 15 through a physical sputtering, magnetron sputtering or evaporation process, wherein the thickness of the seed layer ranges from 1nm to 100 micrometers. The seed layer comprises one or more layers, and the adopted metal material comprises one of titanium, copper, aluminum, silver, palladium, gold, thallium, tin and nickel.
Step 103, defining the RDL and the position of the bonding pad through photoetching, and forming the RDL and the bonding pad through a metal electroplating process. The number of the electroplated layers comprises one or more layers, and the adopted metal material comprises one of titanium, copper, aluminum, silver, palladium, gold, thallium, tin and nickel.
And 104, etching the seed layer.
Step 105, manufacturing a diversion trench 141 on the surface of the first silicon wafer through photoetching and dry etching processes, wherein the depth H of the diversion trench 141 is between 1 μm and 500 μm, and the width B of the diversion trench 141 is between 10 μm and 5000 μm. Wherein, the first silicon chip comprises a 4-inch wafer, a 6-inch wafer, an 8-inch wafer, a 12-inch wafer, etc., and the thickness t is in the range of 200 μm to 2000 μm.
And step two, manufacturing the RDL and the bonding pad on the surface of the second silicon wafer, and etching the blind hole. The process for manufacturing the RDL and the bonding pad on the surface of the second silicon wafer is the same as the process for manufacturing the first silicon wafer, and is not described herein again. The difference is that the second silicon wafer is used for manufacturing blind holes through photoetching and dry etching processes, the depth range of the blind holes is between 1 mu m and 500 mu m, and the diameter of the blind holes is between 10 mu m and 5000 mu m.
In this step, step 201 is further included, the back surface of the second silicon wafer is thinned and polished, so that the blind holes become the third diversion holes 21 and the fourth diversion holes 22.
Step 202, forming a stacked wafer by wafer-level bonding a first silicon wafer and a second silicon wafer, wherein the first silicon wafer is used as a substrate layer 14, the second silicon wafer is used as a cover plate layer 16, and the first silicon wafer and the second silicon wafer are bonded to each other to form a blank structural member with a microchannel 11.
And step three, separating the blank structural part to form the heat dissipation part 10.
This step also includes step 301 of cutting the blank structure to form a heat sink 10 having a micro flow channel 11, and welding one or more heat sinks 10 to the surface of the chip 30.
Step 302, cutting the blank structure to form a heat sink 10 having two or more micro flow channels 11, and welding the heat sink 10 having the plurality of micro flow channels 11 to the surface of the chip 30.
And fourthly, manufacturing an installation groove 23, a third diversion hole 21 communicated to the installation groove 23 and a fourth diversion hole 22 on the surface of the printed circuit board 20 by using an etching or milling cutter process.
The heat sink 10 fabricated in step 301 and/or step 302 is insert-fitted to the mounting groove 23, wherein a gap between the heat sink 10 and the mounting groove 23 is filled with an adhesive.
The chip assembly disclosed by the embodiment is used for a heat dissipation circuit control device to improve the working performance stability of the heat dissipation circuit device. In one embodiment, the heat dissipation circuit device includes a main board, a liquid circulation component mounted on the main board, and the chip component as described above, wherein the liquid circulation component is connected to the third flow guiding hole 21 and the fourth flow guiding hole 22 to drive the liquid to flow along the micro channel 11 in a circulation manner. The liquid circulation assembly is provided with a liquid driving mechanism to drive liquid to flow, so that the heat dissipation efficiency of the chip 30 is improved.
The heat dissipation circuit device disclosed by the embodiment enables the mobile terminal to work stably and the temperature rise is small. In one embodiment, a mobile terminal includes a housing and a heat dissipating circuit device as described above mounted to the housing.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A chip assembly, comprising:
a chip;
the heat dissipation piece is fixedly connected to the surface of the chip and comprises at least one micro-channel for liquid to flow, a first flow guide hole and a second flow guide hole, wherein the first flow guide hole and the second flow guide hole are correspondingly communicated with the micro-channel;
the printed circuit board comprises at least one mounting groove formed by sinking from the surface, and a third flow guide hole and a fourth flow guide hole which penetrate through the printed circuit board, wherein the third flow guide hole and the fourth flow guide hole are distributed at intervals and are communicated with the at least one mounting groove;
the chip is connected to the printed circuit board, the heat dissipation piece is located in the mounting groove, the first flow guide hole is communicated with the third flow guide hole correspondingly, and the second flow guide hole is communicated with the fourth flow guide hole correspondingly.
2. The chip assembly according to claim 1, wherein the heat dissipation member comprises two or more micro channels spaced apart from each other on the surface of the chip, and the micro channels of the adjacent heat dissipation members are relatively independent.
3. The chip module according to claim 2, further comprising a communication member sequentially connecting two adjacent heat dissipation members, the communication member being provided with a connection channel that communicates with the micro flow channel of the adjacent heat dissipation member.
4. The chip assembly according to claim 2, further comprising a first bus bar connected to one end of the heat sink and a second bus bar connected to the other end of the heat sink, wherein the first bus bar includes a first bus passage communicating with the microchannel and a first bus hole communicating to the first bus passage, the second bus bar includes a second bus passage communicating with the microchannel and a second bus hole communicating to the second bus passage, two or more of the heat sink are connected to the first and second bus passages, respectively, the first bus hole communicates with the third guide hole, and the second bus hole communicates with the fourth guide hole.
5. The chip assembly according to any one of claims 1 to 4, wherein the heat sink comprises more than two micro flow channels, and the heat sink is integrally embedded in the mounting groove.
6. The chip assembly of claim 1, wherein the heat sink includes a substrate layer, an insulating layer attached to the substrate layer, and a cover plate layer attached to the insulating layer, wherein the substrate layer includes a groove-shaped channel extending through the insulating layer, the cover plate layer closes a notch of the channel to form the microchannel, and the first and second flow holes extend through the cover plate layer and communicate with the channel.
7. The chip assembly of claim 6, wherein a channel width of the flow guide channel is set to be B, wherein B is greater than or equal to 10 micrometers and less than or equal to 5000 micrometers; the groove depth of the diversion groove is set as H, and H is more than or equal to 1 micrometer and less than or equal to 500 micrometers.
8. The chip assembly of claim 6, wherein the base layer has a thickness t, 200 microns ≦ t ≦ 2000 microns.
9. The chip assembly according to claim 6, wherein the substrate layer is adhesively bonded to the surface of the chip by metal fusion bonding or by an adhesive.
10. The chip assembly according to claim 6, wherein the substrate layer is made of a material selected from the group consisting of titanium, copper, aluminum, silver, palladium, gold, thallium, tin, nickel, glass, quartz, silicon carbide, aluminum oxide, epoxy, and polyurethane.
11. The chip assembly according to claim 1, wherein an adhesive is filled between the outer peripheral wall of the heat sink and the groove wall of the mounting groove.
12. A heat dissipating circuit device comprising a main board, a liquid circulation component mounted on the main board, and the chip assembly according to any one of claims 1 to 11, wherein the liquid circulation component is connected to the third flow guiding hole and the fourth flow guiding hole to drive liquid to circulate along the micro channel.
13. A mobile terminal comprising a housing and the heat dissipating circuit assembly of claim 12 mounted to the housing.
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| CN202010927617.3A CN112133682B (en) | 2020-09-07 | 2020-09-07 | Chip assembly, heat dissipation circuit device and mobile terminal |
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| CN202010927617.3A CN112133682B (en) | 2020-09-07 | 2020-09-07 | Chip assembly, heat dissipation circuit device and mobile terminal |
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| CN112133682B (en) | 2022-11-25 |
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