CN107979913A - A kind of hollow built-in type blind slot heat elimination printed circuit board - Google Patents
A kind of hollow built-in type blind slot heat elimination printed circuit board Download PDFInfo
- Publication number
- CN107979913A CN107979913A CN201711458655.3A CN201711458655A CN107979913A CN 107979913 A CN107979913 A CN 107979913A CN 201711458655 A CN201711458655 A CN 201711458655A CN 107979913 A CN107979913 A CN 107979913A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- blind slot
- pcb
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Abstract
The present invention provides a kind of hollow built-in type blind slot heat elimination printed circuit board, it includes printed circuit board (PCB) body, a certain depth is equipped with embedded layer in the printed circuit board (PCB) body, the blind slot as coolant fluid channel groove is embedded with it, the blind slot is equipped with the multiple blind holes for penetrating the printed circuit board (PCB), and the multiple blind hole includes the internal heat emission hole filled with heat dissipating substance and a liquid enters hole and a liquid portals；Coolant enters hole by the liquid and enters the blind slot, takes away heat by liquid spilling of portalling, in the blind slot in flow process, the heat entrained by coolant is transmitted to outside printed circuit board (PCB) coolant by the heat dissipating substance in the heat emission hole at the same time.The present invention sets blind slot in printed circuit board (PCB), does not influence appearance, and heat dissipation effect is lasting, stablizes, and is the important breakthrough in printed-board technology field.
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB) preparation field, more particularly to a kind of inside to be embedded with the printing electricity of radiating groove
Road plate.
Background technology
In recent years, with the continuous development of microelectromechanical-systems, heat transfer and flowing under minute yardstick are widely paid close attention to, it
There is superpower heat transfer effect, preferable security, there is no Seepage, working fluid good heat dissipation effect.Excite people couple
The research interest of miniflow dynamic characteristic, microchannel have been widely used for manufacture heat exchanger, heater, printer head, instead
Answer thing transmission to be separated with particle etc., there is very big development prospect.
The said goods are required to use circuit plate module, mainly meet the wiring board production of heat dissipation effect in industry at present
Product, mostly by the metal substrate heat conduction such as aluminium base, copper-based, to achieve the purpose that heat dissipation, common metal substrate on the market,
It can not meet the design of microelectromechanical-systems complexity.Generally require, by designing microchannel in assist side, to make coolant class I liquid I
The flowing of injection microchannel is radiated, so as to meet cooling requirements.
The content of the invention
The technical problems to be solved by the invention are, there is provided a kind of printed circuit board (PCB) with more preferable heat dissipation effect.
The purpose of the present invention is what is be achieved through the following technical solutions：
A kind of hollow built-in type blind slot heat elimination printed circuit board, it includes printed circuit board (PCB) body, it is characterised in that：It is described
A certain depth is equipped with embedded layer in printed circuit board (PCB) body, and the blind slot as coolant fluid channel groove is equipped with the embedded layer,
The blind slot is equipped with the multiple blind holes for penetrating the printed circuit board (PCB), and the multiple blind hole includes inside and is filled with heat dissipating substance
Heat emission hole and a liquid enters hole and a liquid portals；The liquid, which enters hole, and liquid portals is arranged to：Coolant is by liquid
Body enters hole into behind all paths for flowing through the blind slot after blind slot as far as possible, then takes away heat by liquid spilling of portalling, and cools down
In the blind slot in flow process, the heat entrained by coolant is transmitted to liquid by the heat dissipating substance in the heat emission hole at the same time
Outside printed circuit board (PCB).
The heat dissipating substance is starched for copper or silver paste.
The fluid channel groove is level trough.
The liquid enters hole and liquid portals is opened in the both ends of the blind slot respectively.
The blind slot is arranged in the embedded layer, and the embedded layer is not flowed for one or more layers or low flowing semi-solid preparation
Piece is formed by stacking, alternatively, not flowed by upper and lower two layers or low flowing prepreg and the sandwiched rigidity for not setting layers of copper therebetween
Plate, that is, tabula rasa is formed by stacking.
The printed circuit board (PCB) more than embedded layer is top plate, is below lower plywood, the top and bottom of the blind slot
The top surface of the bottom surface of the top plate and the top surface of the lower plywood, the bottom surface of the top plate and the lower plywood is abutted respectively
It is rigid layer；The bottom surface of the top plate and the top surface of lower plywood contacted with the top and bottom of the blind slot and it is neighbouring
Part needs partially plating gold to handle, i.e., is slightly over the edge of the blind slot equipped with Gold plated Layer, gold-plated scope, i.e., gold-plated area is big
In the area that blind slot is contacted with the top plate.The purpose so designed is to prevent from subsequently having pressed after plate that liquid medicine passes through institute in flow
The liquid access hole for stating blind slot causes to open a way into blind slot internal corrosion heat dissipating substance.
Thickness >=0.5um of the Gold plated Layer, preferably 3um.
The big 0.2-2.0mm in each edge of the Gold plated Layer blind slot.
The present invention also provides a kind of preparation method of hollow built-in type blind slot heat elimination printed circuit board, it includes following step
Suddenly：
The top plate is conventionally prepared, therebetween, is drilled with after laminating the multiple using as the blind hole
Hole, using as heat dissipating substance is clogged in the hole of the heat emission hole, to the top surface with the blind slot of the bottom surface of the top plate
Do gold-plated processing in part around contact and the contact surface；
The lower plywood is conventionally prepared, therebetween, to the top surface with the blind slot of the top surface of the lower plywood
Do gold-plated processing in part around contact and the contact surface；
The embedded layer is prepared, therebetween, including prepares the blind slot；
It will be pressed after the top plate, embedded layer and lower plywood order contraposition overlapping.
The blind slot is arranged in the embedded layer, and the embedded layer is not flowed for one or more layers or low flowing semi-solid preparation
Piece is formed by stacking, alternatively, not flowed by upper and lower two layers or low flowing prepreg and the sandwiched rigidity for not setting layers of copper therebetween
Plate, that is, tabula rasa is formed by stacking.
When the embedded layer to be prepared do not flowed by upper and lower two layers or low flowing prepreg and sandwiched therebetween
It is described to prepare the blind slot when tabula rasa is formed by stacking, including to it is described do not flow for two layers up and down or low flowing prepreg and
The groove operation processed of the tabula rasa for not setting layers of copper of sandwiched therebetween.
To it is described do not flow or the groove processed of low flowing prepreg during, make each edge of the groove both with respect to
The edge of the groove of its corresponding tabula rasa inside contracts so that the groove footpath on the prepreg is slightly larger than on the tabula rasa corresponding to it
Groove footpath.
In edge of each edge of the groove of the prepreg compared with the groove of the tabula rasa corresponding to it
Contracting 0.3-1.0mm.
The heat dissipating substance is starched for copper or silver paste.
The fluid channel groove is level trough.
The liquid enters hole and liquid portals is opened in the both ends of the blind slot respectively.
Compared to the prior art, the present invention has the following advantages：
The present invention has started a kind of new wiring board radiating mode, and provides the circuit board structure using which, real
The preparation method of the printed circuit board (PCB) of existing which, blind slot is set in printed circuit board (PCB), does not influence appearance, also from extraneous shadow
Ring, after device installation, enter hole injection coolant from liquid, coolant enters microchannel (blind slot) path in plate, and coolant is covered
Being flowed out after all microchannels (blind slot) from liquid outflow port, hot while cooled liquid band is walked caused by device running in plate, with
This moves in circles, and achievees the purpose that heat dissipation, lasts, stabilization, is the important breakthrough in printed-board technology field.
Brief description of the drawings
Fig. 1 is the theory structure schematic diagram of the printed circuit board (PCB) of the embodiment of the present invention one.
Fig. 2 is the theory structure schematic diagram of the printed circuit board (PCB) of the embodiment of the present invention two.
Embodiment
The present invention and its advantage are described in further detail below in conjunction with embodiment, still, this hair
Bright embodiment is not limited thereto.
Embodiment one：
Present embodiment provides a kind of hollow built-in type blind slot heat elimination printed circuit board, it includes printed circuit board (PCB) body,
The printed circuit board (PCB) body is as shown in Figure 1, be Floor 12 harden structure, multiple-plate a certain depth is embedded layer 3, should
It is rigid plate 1 on embedded layer, is rigid plate 2 under the embedded layer, the embedded layer 3 is solid by prepreg 31- tabula rasas 32- half
The interlayer for changing piece 33 is formed, and is equipped with fluid channel groove 5 in the embedded layer 3, it is blind slot.The fluid channel groove 5 is equipped with and wears upwards
For the saturating rigid plate 1 until the liquid of the printed circuit board top surface enters hole and liquid portals 6, coolant enters hole by the liquid
Into the fluid channel groove 5, portalled spilling by the liquid.The fluid channel groove 5 is level trough.The liquid enters hole and liquid
Portal 6 both ends for being opened in the fluid channel groove 5 respectively.The fluid channel groove 5, which is additionally provided with, multiple leads to the printed circuit board (PCB)
Upper surface heat dissipation blind hole, landfill is useful for the silver paste or copper slurry of heat dissipation in it.The prepreg 31,33 uses and rises brightness
VT-47PP, the tabula rasa 32 do not set the pure tabula rasa of layers of copper for upper bottom surface.
Rigid plate 1 and 2 is 6 Rotating fields, it intersects pressing by three layers of rigid layer 8 and two layers of common PP layer 9 respectively and is formed.
Specifically, the preparation flow of six layers of rigid layer 8 is：Sawing sheet → interior photoimaging (acid etching) → punching → internal layer
Etching inspection → supporting center → brown；
Four layers of common PP9 preparation flows are：Sawing sheet → auxiliary material is supporting.
Using the rigid layer and common PP layers of preparation rigid plate 1,2 prepared, following steps are specifically included：
1 preparation flow of rigid plate:(tooling hole, heat dissipation blind hole and the liquid for preparing printed circuit board (PCB) enter hole for lamination → drilling
Portal 6) → heavy copper → panel plating → outer photoimaging → plating copper and tin (only copper facing is not tin plating, two-sided point plating) → alkalescence erosion with liquid
Quarter → copper slurry consent (clogs heat dissipating substance in the heat dissipation blind hole：Copper is starched or silver paste) baking → ceramics nog plate after → welding resistance → sink
Supporting → interior photoimaging (the acid etching) → punching of 2 → drying-plate of copper → instrument → internal layer etching inspection → partially plating gold → alkalescence erosion
Carve and (move back film with examining) → choose conducting wire → supporting center → brown；
2 preparation flow of rigid plate:Supporting → interior light of lamination → drilling (tooling hole for preparing printed circuit board (PCB)) → instrument into
As (acid etching) → punching → internal layer etching inspection → outer photoimaging → partially plating gold → chooses conducting wire → supporting center → brown.
The preparation flow of embedded layer 3 includes tabula rasa 32 and rises brightness VT-47PP31,33 preparation flow for two layers, is specially：
The preparation flow of tabula rasa 32：Supporting → interior photoimaging → punching of sawing sheet → instrument → internal layer etching inspection → groove milling
(preparing blind slot 5) → supporting center → melanism；
Rise brightness VT-47PP preparation flows：Sawing sheet → auxiliary material instrument is supporting → and groove milling (preparing blind slot 5) → auxiliary material is supporting,
During this, PP inside contracts 0.5mm than the unilateral of blind slot, and optional scope is 0.3-1.0mm；
Then tabula rasa 32 and two layers are risen into brightness VT-47PP31,33 contrapositions are overlapped into embedded layer 3；
Then, the rigid plate 1, embedded layer 3, rigid plate 2 are sequentially aligned into pressing, blind slot 5 is entered hole, liquid with liquid
Body, which portals, 6 to be communicated.
The partially plating gold refers to：The top surface or bottom surface contact position of rigid plate 1 and rigid plate 2 and microchannel blind slot
And the position periphery needs partially plating gold to handle (AU thickness >=0.5-3um), gold-plated scope big 1mm more unilateral than microchannel blind slot,
Optional scope is 0.2-2.0mm.Purpose of this design be prevent from subsequently having pressed after plate in flow liquid medicine by micro channels liquid into
Portal and cause to open a way into microchannel blind slot internal corrosion copper.
In the present embodiment, tabula rasa 32, rise groove milling flow in brightness VT-47PP31,33 work flow for upper and lower two layers,
It is the microchannel blind slot position advance comprising in order to ensure before pressing, it is micro- that i.e. achievable built-in type is subsequently aligned during pressing
Passage blind slot, otherwise can not realize.
Embodiment two：
The present embodiment is similar with embodiment one, and difference lies in as shown in Fig. 2, its top plate 10 and lower plywood 20 are list
Panel, embedded layer 30 do not include tabula rasa, only include one layer and rise brightness VT-47PP.In figure, microchannel blind slot enters for 50,60 for liquid
Hole or liquid portal, and heat dissipation blind hole is not shown in figure.In the preparation method of the printed circuit board (PCB), the preparation step not including tabula rasa
Suddenly, to one or more layers press rise the preparation blind slot of brightness VT-47PP during, also avoid the need for consideration and rise brightness VT-
The groove of 47PP inside contracts problem relative to the edge of the blind slot of tabula rasa.
When embedded layer height is of less demanding, this structure of embodiment two or Multi-layer force fit can be used to rise brightness VT-
47PP.Either laminate is multi-layer board or mono-/bis-laminate up and down, may use burying for above-described embodiment one or embodiment two
If the structure of layer, whether embedded layer needs to use tabula rasa, is determined by the height of the microchannel blind slot needed, but no matter which kind of feelings
Condition, is required to use and does not flow or partly flow prepreg.
Embodiment of the present invention is that it is not flow PP to rise brightness VT-47PP, uses this using the purpose for rising brightness VT-47PP
Kind PP is that PP gummosis enters microchannel blind slot blocking microchannel blind slot when pressing in order to prevent, and PP first handle and microchannel before pressing is blind
The corresponding PP gongs of groove location fall, more unilateral big 0.3-1.0mm than microchannel blind slot position, preferably 0.5mm, prevent gummosis after pressing
Enter microchannel blind slot to block.
In the rigid plate 1 and rigid plate 2 of microchannel blind slot position correspondence, in addition to passing in and out liquid pores, do not allow to set
Through hole is put, after preventing plank from making, coolant is overflowed.Such as need to set through hole, then the liquid of microchannel blind slot enters hole and liquid discharge
Hole must carry out silver paste consent or copper slurry consent flow, block hole, prevent coolant from overflowing.
In fact, the present invention can not flow PP or low flowings PP using any, it is not limited to rise brightness VT-47, remaining product
As long as board PP meets and do not flow or low flowing PP characteristics, can be selected.
Microchannel blind slot size is unrestricted, and in theory, as long as excessive glue control is proper, all size width can be achieved.
The height of fluid channel blind slot can be between 0.5-5.0mm, according to specific PCB design.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and be carried out, and it is not intended to limit the scope of the present invention, it is all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all cover within the scope of the present invention.
Claims (10)
1. a kind of hollow built-in type blind slot heat elimination printed circuit board, it includes printed circuit board (PCB) body, it is characterised in that：The print
A certain depth is equipped with embedded layer in printed circuit board body, and the blind slot as coolant fluid channel groove, institute are equipped with the embedded layer
State blind slot and be equipped with the multiple blind holes for penetrating the printed circuit board (PCB), the multiple blind hole includes inside and is filled with heat dissipating substance
Heat emission hole and a liquid enter hole and a liquid portals；The liquid, which enters hole, and liquid portals is arranged to：Coolant is by liquid
Enter hole into behind all paths for flowing through the blind slot after blind slot as far as possible, then heat, coolant are taken away by liquid spilling of portalling
In the blind slot in flow process, the heat entrained by coolant is transmitted to print by the heat dissipating substance in the heat emission hole at the same time
Outside printed circuit board.
2. printed circuit board (PCB) according to claim 1, it is characterised in that：The heat dissipating substance is starched for copper or silver paste.
3. printed circuit board (PCB) according to claim 1, it is characterised in that：The fluid channel groove is level trough.
4. printed circuit board (PCB) according to claim 1, it is characterised in that：The liquid enters hole and liquid portals opens up respectively
In the both ends of the blind slot.
5. printed circuit board (PCB) according to claim 1, it is characterised in that：The blind slot is arranged in the embedded layer, institute
State that embedded layer does not flow for one or more layers or low flowing prepreg is formed by stacking, alternatively, not flowed by upper and lower two layers or low
The rigid plate for the not setting layers of copper i.e. tabula rasa of flowing prepreg and sandwiched therebetween is formed by stacking.
6. printed circuit board (PCB) according to claim 1, it is characterised in that：The printed circuit board (PCB) more than embedded layer is upper
Laminate, is below lower plywood, and the top and bottom of the blind slot abut the bottom surface of the top plate and the lower plywood respectively
The top surface of top surface, the bottom surface of the top plate and the lower plywood is rigid layer.
7. printed circuit board (PCB) according to claim 6, it is characterised in that：The top plate and lower plywood are multi-layer board；
Or it is lamina or doubling plate；Or one of top plate and lower plywood are multi-layer board, another is lamina or doubling plate.
8. printed circuit board (PCB) according to claim 7, it is characterised in that：The multiple-plate top plate or lower plywood with
The top surface of the blind slot or bottom surface contact and neighbouring part need partially plating gold to handle, i.e., are equipped with Gold plated Layer, gold-plated scope
Slightly larger than the edge of the blind slot, i.e., gold-plated area is more than the area that blind slot is contacted with the top plate.
9. printed circuit board (PCB) according to claim 1, it is characterised in that：Thickness >=0.5um of the Gold plated Layer.
10. printed circuit board (PCB) according to claim 1, it is characterised in that：Each edge of the Gold plated Layer exceeds it
The edge 0.2-2.0mm of corresponding blind slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711458655.3A CN107979913A (en) | 2017-12-28 | 2017-12-28 | A kind of hollow built-in type blind slot heat elimination printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711458655.3A CN107979913A (en) | 2017-12-28 | 2017-12-28 | A kind of hollow built-in type blind slot heat elimination printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107979913A true CN107979913A (en) | 2018-05-01 |
Family
ID=62008179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711458655.3A Pending CN107979913A (en) | 2017-12-28 | 2017-12-28 | A kind of hollow built-in type blind slot heat elimination printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107979913A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511093A (en) * | 2020-04-09 | 2020-08-07 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN112133682A (en) * | 2020-09-07 | 2020-12-25 | 浙江集迈科微电子有限公司 | Chip assembly, heat dissipation circuit device and mobile terminal |
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| JP2008153400A (en) * | 2006-12-15 | 2008-07-03 | Fujitsu Ltd | Circuit board, its manufacturing method, and semiconductor device |
| US20080286531A1 (en) * | 2007-05-15 | 2008-11-20 | Son Jae Hyun | Printed circuit board provided with heat circulating medium and method for manufacturing the same |
| WO2014008891A2 (en) * | 2012-07-11 | 2014-01-16 | Curamik Electronics Gmbh | Metal-ceramic substrate |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| CN105491822A (en) * | 2016-02-04 | 2016-04-13 | 中国电子科技集团公司第二十六研究所 | Multi-layer printed circuit board integrated liquid-cooling channel manufacturing method |
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2017
- 2017-12-28 CN CN201711458655.3A patent/CN107979913A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008153400A (en) * | 2006-12-15 | 2008-07-03 | Fujitsu Ltd | Circuit board, its manufacturing method, and semiconductor device |
| US20080286531A1 (en) * | 2007-05-15 | 2008-11-20 | Son Jae Hyun | Printed circuit board provided with heat circulating medium and method for manufacturing the same |
| WO2014008891A2 (en) * | 2012-07-11 | 2014-01-16 | Curamik Electronics Gmbh | Metal-ceramic substrate |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| CN105491822A (en) * | 2016-02-04 | 2016-04-13 | 中国电子科技集团公司第二十六研究所 | Multi-layer printed circuit board integrated liquid-cooling channel manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111511093A (en) * | 2020-04-09 | 2020-08-07 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN111511093B (en) * | 2020-04-09 | 2021-09-24 | 东莞万钧电子科技有限公司 | Liquid cooling circuit board |
| CN112133682A (en) * | 2020-09-07 | 2020-12-25 | 浙江集迈科微电子有限公司 | Chip assembly, heat dissipation circuit device and mobile terminal |
| CN112133682B (en) * | 2020-09-07 | 2022-11-25 | 浙江集迈科微电子有限公司 | Chip assembly, heat dissipation circuit device and mobile terminal |
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