CN108337801A - Circuit board with high heat conduction double-face aluminium substrate - Google Patents
Circuit board with high heat conduction double-face aluminium substrate Download PDFInfo
- Publication number
- CN108337801A CN108337801A CN201810338873.1A CN201810338873A CN108337801A CN 108337801 A CN108337801 A CN 108337801A CN 201810338873 A CN201810338873 A CN 201810338873A CN 108337801 A CN108337801 A CN 108337801A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic component
- layer
- heat conduction
- board layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 239000004411 aluminium Substances 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910000831 Steel Chemical group 0.000 claims description 3
- 239000010959 steel Chemical group 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Abstract
The present invention relates to a kind of circuit boards with high heat conduction double-face aluminium substrate, including：First circuit board layer has the first conducting wire for being distributed in first circuit board layer；The first electronic component being set on the first circuit board layer is realized by first conducting wire and is electrically connected；Second circuit board layer has the second conducting wire for being distributed in second circuit board layer；The second electronic component being set on the downside of the second circuit board layer is realized by second conducting wire and is electrically connected；Metallic heat radiating plate, with upper side and the downside opposite with the upper side, first electronic component and second electronic component are contacted respectively at the downside of the metallic heat radiating plate and upper side, to first electronic component, first circuit board layer and the second electronic component, the heat dissipation of second circuit board layer.The above-mentioned circuit board with high heat conduction double-face aluminium substrate reaches efficient heat dissipation effect by covering metallic heat radiating plate on electronic component, solves the problems, such as that the rate of heat dissipation of current wiring board existing on the market is inadequate.
Description
Technical field
The present invention relates to PCB circuit board fields, more particularly to a kind of circuit board with high heat conduction double-face aluminium substrate.
Background technology
In PCB (Printed Circuit Board, printed circuit board) field, the heat dissipation for PCB circuit board is one
A very important link, the pcb board material being widely used at present are to cover copper/epoxy glass fabric base material or phenolic resin glass cloth base
Material, the paper-based copper-coated board material also used on a small quantity.Although these base materials have excellent electric property and processing performance, heat dissipation
Property it is poor, as the sinking path of high heater element, can hardly look to conducting heat by PCB resins itself, but from element
It radiates into surrounding air on surface.But as electronic product has enter into component miniaturization, high-density installation, thermalization occurred frequently assembling
Epoch, if only the very small element surface of Pictest area to radiate is very inadequate.Simultaneously because the surfaces such as QFP, BGA are installed
A large amount of uses of element, the heat that component generates are transmitted to pcb board, are less useful for the heat dissipation of PCB circuit board in large quantities.
Invention content
Based on this, it is necessary to for above-mentioned pcb board can not high efficiency heat radiation the problem of, providing one kind being capable of high efficiency heat radiation
The circuit board with high heat conduction double-face aluminium substrate.
A kind of circuit board with high heat conduction double-face aluminium substrate, including：
First circuit board layer has the first conducting wire for being distributed in first circuit board layer；
The first electronic component being set on the first circuit board layer is electrically connected by first conducting wire realization
It connects；
Second circuit board layer has the second conducting wire for being distributed in second circuit board layer；
The second electronic component being set on the downside of the second circuit board layer is realized electrical by second conducting wire
Connection；
Metallic heat radiating plate has upper side and the downside opposite with the upper side, the first electronic component and described the
Two electronic components are contacted respectively at the downside of the metallic heat radiating plate and upper side, to first electronic component, the
One board layer and the second electronic component, second circuit board layer radiate.
In a wherein preferred embodiment, in first electronic component with the metallic heat radiating plate and described
There is flexible thermal heat conduction with phase change pad between second electronic component and the metallic heat radiating plate.
In a wherein preferred embodiment, there is copper on the first circuit board layer and the second circuit board layer
Foil.
In a wherein preferred embodiment, the first circuit board layer, the second circuit board layer or the metal
Heat sink layer has several thermal holes.
In a wherein preferred embodiment, the circuit board with high heat conduction double-face aluminium substrate further includes：
The first heating column being connected between the first circuit board layer and the metallic heat radiating plate layer；
The second heating column being connected between the second circuit board layer and the metallic heat radiating plate layer.
In a wherein preferred embodiment, first heating column or second heating column are aluminium or steel structure.
In a wherein preferred embodiment, the thickness of the metallic heat radiating plate layer is 3mm between 5mm.
In a wherein preferred embodiment, the metallic heat radiating plate layer is aluminum substrate structure.
The above-mentioned circuit board with high heat conduction double-face aluminium substrate reaches high by covering metallic heat radiating plate on electronic component
The heat dissipation effect of effect solves the problems, such as that the rate of heat dissipation of current wiring board existing on the market is inadequate.
Description of the drawings
Fig. 1 is the structural representation of the circuit board with high heat conduction double-face aluminium substrate in a preferred embodiment of the invention
Figure.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being set to " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
As shown in Figure 1, a preferred embodiment of the invention discloses a kind of circuit board with high heat conduction double-face aluminium substrate
100, it includes first circuit board layer 110, the first electronic component 120, second that should have the circuit board 100 of high heat conduction double-face aluminium substrate
Board layer 140, the second electronic component 150 and metallic heat radiating plate layer 130.
In present embodiment, above-mentioned first circuit board layer 110 is generally a rectangular slab, and first is distributed in the rectangular slab
Conducting wire (not shown).Above-mentioned first electronic component 120 is arranged on first circuit board layer 110, usually, above-mentioned first electricity
Subcomponent 120 be fixed on foregoing circuit plate layer 110 by the form of welding, and first electronic component 120 with distribution
Conducting wire in first circuit board layer 110 is electrically connected.
Similarly, it is also a rectangular slab, size and above-mentioned first circuit board layer 110 that above-mentioned second circuit board layer 140 is general
It is identical, the second conducting wire (not shown) is distributed in the second circuit board layer 140.Above-mentioned second electronic component 150 is arranged
In the side of second circuit board layer 140, usually, above-mentioned second electronic component 150 be fixed on by the form of welding it is above-mentioned
On second circuit board layer 140, and second electronic component 150 and be distributed in second circuit board layer 140 conducting wire electricity
Property connection.
Above-mentioned metallic heat radiating plate 130 has upper side 131 and the downside 132 opposite with the upper side 131, the first electricity
Subcomponent 120 and second electronic component 150 are contacted respectively at the downside of the metallic heat radiating plate 132 and upper side 132,
To be dissipated to first electronic component 120, first circuit board layer 110 and the second electronic component 150, second circuit board layer 140
Heat.
Specifically, to make 130 and first electronic component 120 of above-mentioned metallic heat radiating plate layer and the second electronic component 150 fully
Contact, first electronic component 120 with the metallic heat radiating plate 130 and second electronic component 150 with it is described
There is flexible thermal heat conduction with phase change pad 160 between metallic heat radiating plate 130.It in this way comes into full contact with just the two and reaches efficient heat dissipation
Effect.
In more detail, there is copper foil on above-mentioned first circuit board layer 110 and above-mentioned second circuit board layer 140.And
Above-mentioned first circuit board layer 110, the second circuit board layer 140 or the metallic heat radiating plate layer 130 have several thermal holes.
To reach more preferably heat dissipation effect.
In the present embodiment, the above-mentioned circuit board 100 with high heat conduction double-face aluminium substrate further includes being connected to described
The first heating column 170 between one board layer and the metallic heat radiating plate layer and it is connected to the second circuit board layer and institute
State the second heating column 180 between metallic heat radiating plate layer.Above-mentioned first heating column 170 or above-mentioned second heating column 180 can be
Aluminium or steel structure.
In present embodiment, the thickness of above-mentioned metallic heat radiating plate layer is 3mm between 5mm.Above-mentioned metallic heat radiating plate layer is
Aluminum substrate structure.More preferably, 3.8 ± 0.38mm of above-mentioned metallic heat radiating plate layer, and show to be processed into heavy nickel gold.
The above-mentioned circuit board with high heat conduction double-face aluminium substrate reaches high by covering metallic heat radiating plate on electronic component
The heat dissipation effect of effect, and one piece of heat-dissipating metal sheet pair, two board layers are carried out while being radiated, and are increased radiating efficiency, are simplified
Radiator structure solves the problems, such as that the rate of heat dissipation of current wiring board existing on the market is inadequate.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of circuit board with high heat conduction double-face aluminium substrate, which is characterized in that including：
First circuit board layer has the first conducting wire for being distributed in first circuit board layer；
The first electronic component being set on the first circuit board layer is realized by first conducting wire and is electrically connected；
Second circuit board layer has the second conducting wire for being distributed in second circuit board layer；
The second electronic component being set on the downside of the second circuit board layer is electrically connected by second conducting wire realization
It connects；
Metallic heat radiating plate has upper side and the downside opposite with the upper side, the first electronic component and second electricity
Subcomponent is contacted respectively at the downside of the metallic heat radiating plate and upper side, to first electronic component, the first electricity
Road plate floor and the second electronic component, second circuit board floor radiate.
2. the circuit board according to claim 1 with high heat conduction double-face aluminium substrate, which is characterized in that in first electricity
Subcomponent has flexible thermal phase with the metallic heat radiating plate and between second electronic component and the metallic heat radiating plate
Become heat conductive pad.
3. the circuit board according to claim 1 with high heat conduction double-face aluminium substrate, which is characterized in that in first electricity
There is copper foil on road plate floor and the second circuit board floor.
4. the circuit board according to claim 1 with high heat conduction double-face aluminium substrate, which is characterized in that first circuit
Plate layer, the second circuit board layer or the metallic heat radiating plate layer have several thermal holes.
5. the circuit board according to claim 1 with high heat conduction double-face aluminium substrate, which is characterized in that described to be led with height
The circuit board of hot double-face aluminium substrate further includes：
The first heating column being connected between the first circuit board layer and the metallic heat radiating plate layer；
The second heating column being connected between the second circuit board layer and the metallic heat radiating plate layer.
6. the circuit board according to claim 5 with high heat conduction double-face aluminium substrate, which is characterized in that first heat conduction
Column or second heating column are aluminium or steel structure.
7. the circuit board according to claim 1 with high heat conduction double-face aluminium substrate, which is characterized in that the heat dissipation metal
The thickness of plate layer is 3mm between 5mm.
8. the circuit board according to claim 1 with high heat conduction double-face aluminium substrate, which is characterized in that the heat dissipation metal
Plate layer is aluminum substrate structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810338873.1A CN108337801A (en) | 2018-04-16 | 2018-04-16 | Circuit board with high heat conduction double-face aluminium substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810338873.1A CN108337801A (en) | 2018-04-16 | 2018-04-16 | Circuit board with high heat conduction double-face aluminium substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108337801A true CN108337801A (en) | 2018-07-27 |
Family
ID=62934322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810338873.1A Pending CN108337801A (en) | 2018-04-16 | 2018-04-16 | Circuit board with high heat conduction double-face aluminium substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108337801A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1750261A (en) * | 2004-09-17 | 2006-03-22 | 台湾积体电路制造股份有限公司 | Packaging device of ic circuit and its producing method |
| CN101206100A (en) * | 2007-12-20 | 2008-06-25 | 黄崇贤 | Pole-shaped radiator with thermal fin |
| CN102460689A (en) * | 2009-04-16 | 2012-05-16 | 莫列斯公司 | Cooling device, electronic substrate and electronic device |
| CN202695551U (en) * | 2012-06-04 | 2013-01-23 | 昆山市华涛电子有限公司 | Heat dissipation structure for LED (Light Emitting Diode) |
| CN205648176U (en) * | 2016-04-18 | 2016-10-12 | 北京星原丰泰电子技术股份有限公司 | Circuit board heating element's heat conduction structure |
| CN208424885U (en) * | 2018-04-16 | 2019-01-22 | 昆山市华涛电子有限公司 | Circuit board with high thermal conductivity double-face aluminium substrate |
-
2018
- 2018-04-16 CN CN201810338873.1A patent/CN108337801A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1750261A (en) * | 2004-09-17 | 2006-03-22 | 台湾积体电路制造股份有限公司 | Packaging device of ic circuit and its producing method |
| CN101206100A (en) * | 2007-12-20 | 2008-06-25 | 黄崇贤 | Pole-shaped radiator with thermal fin |
| CN102460689A (en) * | 2009-04-16 | 2012-05-16 | 莫列斯公司 | Cooling device, electronic substrate and electronic device |
| CN202695551U (en) * | 2012-06-04 | 2013-01-23 | 昆山市华涛电子有限公司 | Heat dissipation structure for LED (Light Emitting Diode) |
| CN205648176U (en) * | 2016-04-18 | 2016-10-12 | 北京星原丰泰电子技术股份有限公司 | Circuit board heating element's heat conduction structure |
| CN208424885U (en) * | 2018-04-16 | 2019-01-22 | 昆山市华涛电子有限公司 | Circuit board with high thermal conductivity double-face aluminium substrate |
Non-Patent Citations (1)
| Title |
|---|
| 高瑞平: "《电工电子实训基础》", 30 September 2009, 上海：同济大学出版社, pages: 94 - 95 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108633238A (en) * | 2018-08-03 | 2018-10-09 | 中国航空工业集团公司雷华电子技术研究所 | It is a kind of to be used for radiator of the two panels to making sheet of printing in |
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