CN207652755U - A kind of hardware radiating insulating protection board - Google Patents
A kind of hardware radiating insulating protection board Download PDFInfo
- Publication number
- CN207652755U CN207652755U CN201721492350.XU CN201721492350U CN207652755U CN 207652755 U CN207652755 U CN 207652755U CN 201721492350 U CN201721492350 U CN 201721492350U CN 207652755 U CN207652755 U CN 207652755U
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- layer
- heat radiation
- insulating protective
- protective layer
- radiation material
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Abstract
The utility model provides a kind of hardware radiating insulating protection board, including PCB circuit board, heat radiation material layer, insulating protective layer and component layer, the heat radiation material layer is made of heat sink material, including the first heat radiation material layer and the second heat radiation material layer, it is separately positioned on the PCB circuit board both sides, the insulation protection layer surface is coated with insulating materials, including the first insulating protective layer and the second insulating protective layer, it is separately positioned on the first heat radiation material layer and the second heat radiation material layer side, the component layer includes the first component layer and the second component layer, it is separately positioned on the first insulating protective layer and the second insulating protective layer side.The utility model improves the self-radiating ability on battery management system hardware circuit, extend hardware service life, improve battery use reliability, it is short-circuit caused by preventing damage and dust of the extraneous medium component on battery management system hardware, the external interferences such as Electro-static Driven Comb or noise have been greatly reduced to risk caused by battery management system.
Description
Technical field
The utility model is related to field of electronic devices, more particularly to a kind of hardware radiating insulating protection board.
Background technology
With the development and progress of science and technology, people have increasingly paid attention to the development and utilization of new energy, and electric energy is as pollution
New energy that is smaller and relatively easily developing, use scope are more and more extensive.In recent years, electric vehicle gradually took
For original motorcycle, electric vehicle also gradually grows up, and has come into operation.In the evolution of electric vehicle
In, need power battery to provide energy, and power battery management system is connect vehicle mounted dynamic battery and electric vehicle important
Tie, major function include：Battery physical parameter monitors in real time, battery status estimation, inline diagnosis and early warning, charging and discharging
With preliminary filling control, balanced management and heat management etc..Therefore, power battery management system is developed to pass weight for electric vehicle
It wants.
The heat dissipation problem of each power battery management system battery protecting apparatus at this stage always is battery industry and moves
The bottleneck of power battery management system hardware advances, power battery management system hardware and power battery management system software it is mutual
Cooperation is the work such as battery status monitoring, battery status analysis, cell safety protection, energy hole management and battery information management
Basis.If the protection circuit device temperature of power battery management system hardware is excessively high, the service life of component can be made
It reduces, can also influence the reliability that power battery management system hardware uses in the battery, prodigious safety is brought to battery
Hidden danger.
The utility model provides a kind of hardware radiating insulating protection board, improves on battery management system hardware circuit
Self-radiating ability extends hardware service life, improves battery use reliability.The utility model prevents extraneous Jie
Short circuit caused by the damage of component and dust, has been greatly reduced Electro-static Driven Comb or has made an uproar on confrontation battery management system hardware
The external interferences such as sound are to risk caused by battery management system.
Invention content
The problem of the technical problems to be solved in the utility model is hardware heat radiation protection.
In order to solve the above-mentioned technical problem, the utility model discloses a kind of hardware radiating insulating protection boards, including PCB electricity
Road plate, heat radiation material layer, insulating protective layer and component floor, it is characterised in that：The heat radiation material layer includes the first heat dissipation material
The bed of material and the second heat radiation material layer are separately positioned on the PCB circuit board both sides；
The insulating protective layer includes the first insulating protective layer and the second insulating protective layer, is separately positioned on the first heat dissipation material
The bed of material and the second heat radiation material layer side；
The component layer include the first component layer and the second component layer, be separately positioned on the first insulating protective layer and
Second insulating protective layer side；
Specifically, the heat radiation protection device is used in the two-sided setting heat radiation material layer in PCB circuit board both sides, double-sided insulation
Protection and the two-sided design for putting component；
Further, the heat radiation material layer is made of radiation conductive material, and the insulation protection layer surface is coated with insulation
Material, such as group solder paste ink material；
Further, the heat radiation material layer and the shapes and sizes of the insulating protective layer are consistent；
Further, the heat radiation material layer and the shape of the insulating protective layer can phases with battery management system hardware
Together, it can also be different；
Further, the shapes and sizes of the heat radiation material layer are designed according to component calorific value and operating power；
Preferably, the heat radiation material layer is arranged near heating element, and the heat radiation material layer is pressed together on fever member
Above device；
Further, the hardware radiating insulating protective layer further includes antistatic protection layer, the antistatic protection layer patch
The one side of nearly electronic component layer uses static dissipative material, and another side uses conductive material, and is arranged in the component
Layer side；
Further, the insulating protective layer can also be designed as waveform platy structure, and in the insulating protective layer
Frame is arranged in surrounding, and the height of the frame is greater than or equal to the sum of the peaks and troughs of the insulating protective layer；
Further, the PCB circuit board, heat radiation material layer, insulating protective layer and component layer integrate.
It is described in the utility model to have the advantages that using above-mentioned technical proposal：
1) the utility model greatly improves battery management system by the two-sided increase heat dissipating layer in hardware PCB circuit board
The heat-sinking capability of itself；
2) the utility model is by being arranged double-sided insulation protective layer, it is therefore prevented that extraneous medium is to battery management system hardware package
The oxidation and corrosion of backplate；
3) the utility model also prevents extraneous medium and causes component internal short-circuit on battery management system hardware
Occur；
4) the utility model greatly reduces the external interferences such as Electro-static Driven Comb or noise and causes wind to battery management system
The probability of danger.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the utility model
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is a kind of hardware radiating insulating protection board schematic diagram provided by the utility model；
Fig. 2 is a kind of heat radiation material layer of hardware radiating insulating protection board provided by the utility model；
Fig. 3 is a kind of insulating protective layer for hardware insulating protecting plate that the embodiments of the present invention provide.
It remarks additionally below to attached drawing：
1- the first component layers；The first insulating protective layers of 2-；3- heat radiation material layers；4-PCB circuit boards；The heat dissipation materials of 5- second
The bed of material；The second insulating protective layers of 6-；7- the second component layers.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work
Lower obtained every other embodiment, shall fall within the protection scope of the present invention.
Embodiment one：
A kind of hardware radiating insulating protection board, as shown in Figure 1, 2, including PCB circuit board 4, heat radiation material layer, insulation protection
Layer and component layer；
The heat radiation material layer includes the first heat radiation material layer 3 and the second heat radiation material layer 5, is separately positioned on the PCB
4 both sides of circuit board, the insulating protective layer include the first insulating protective layer 2 and the second insulating protective layer 6, are separately positioned on first
5 side of heat radiation material layer 3 and the second heat radiation material layer, the component layer include the first component layer 1 and the second component layer
7, it is separately positioned on 6 side of the first insulating protective layer 2 and the second insulating protective layer；
The heat radiation protection device use the two-sided setting heat radiation material layer in 4 both sides of PCB circuit board, double-sided insulation protection and
The two-sided design for putting component, heat radiation material layer two-sided can radiate to PCB circuit board 4, and insulating protective layer can be two-sided right
Heat radiation material layer and PCB circuit board 4 insulate；
Preferably, heat radiation material layer described in the heat radiation material layer is made of radiation conductive material, is pressed together on the PCB
The size and shape of 4 both sides of circuit board, the heat radiation material layer can be done accordingly according to component calorific value and operating power
Design and adjustment, improve the heat-sinking capability of battery management system hardware；
Preferably, the insulating protective layer surface spraying has materials, insulating protective layer and the heat radiation material layers such as group solder paste ink
Ink is uniformly coated in heat radiation material layer using spraying or by the technique of scraper and halftone, it is therefore prevented that extraneous medium
To the damage on battery management system hardware and the short circuit caused by dust, the external worlds such as Electro-static Driven Comb or noise are greatly reduced
Interference is to risk caused by battery management system；
The heat radiation material layer and the shapes and sizes of the insulating protective layer orthographic projection are consistent, the component layer
The component of design is attached on the pad of corresponding component layer, should disperse to put by component as possible in the PCB circuit board 4
It puts, reduces influence of the high temperature aggregation to current region component reliability and precision, wherein IC chip, triode and shunt resistance
Component etc. easy fever should be arranged and hold on circuit boards, it is not easy to which the component of fever should be arranged in circuit board lower end；
The utility model is using two-sided component, two-sided setting insulating protective layer and the two-sided setting heat radiation material layer of putting
The area of circuit protection plate can not only be reduced by designing, reduction cost, the design capacity appropriate that can also increase battery core, and double
Face, which is radiated, can preferably improve the heat-sinking capability of battery management system itself.
Embodiment two：
In a feasible embodiment of the utility model, damage of the electrostatic to PCB circuit board 4 in order to prevent, in reality
It applies and adds antistatic protection layer on the basis of example one, the antistatic protection layer also uses two-sided setting, close to electronic component
The one side of layer uses static dissipative material, and in addition one side uses conductive material.The static dissipative material is for consuming
Electrostatic charge through generation prevents the internal electrostatic generated, the conductive material to be used for exterior static interference.
Embodiment three：
In a feasible embodiment of the utility model, as shown in figure 3, the insulating protective layer in embodiment is designed
For waveform platy structure, and frame is set in the surrounding of the insulating protective layer, is convenient for insulating protective layer and heat radiation material layer
And the fitting of component layer, the height of the circumferential side frame can be greater than or equal to insulating protective layer peaks and troughs height it
With the purpose of this design is to make heat radiation material layer and insulating protective layer incomplete contact between, improves its heat-sinking capability, and effectively
The interference and influence for preventing dust to generate circuit board.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all in this practicality
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (10)
1. a kind of hardware radiating insulating protection board, including PCB circuit board (4), heat radiation material layer, insulating protective layer and component
Layer, it is characterised in that：The heat radiation material layer includes the first heat radiation material layer (3) and the second heat radiation material layer (5), is respectively set
In the PCB circuit board (4) both sides；
The insulating protective layer includes the first insulating protective layer (2) and the second insulating protective layer (6), is separately positioned on the first heat dissipation
Material layer (3) and the second heat radiation material layer (5) side；
The component layer includes the first component layer (1) and the second component layer (7), is separately positioned on the first insulating protective layer
(2) and the second insulating protective layer (6) side.
2. a kind of hardware radiating insulating protection board according to claim 1, it is characterised in that：The heat radiation material layer is by dissipating
Thermal conductivity electric material is constituted.
3. a kind of hardware radiating insulating protection board according to claim 1, it is characterised in that：The insulation protection layer surface
It is coated with insulating materials.
4. a kind of hardware radiating insulating protection board according to claim 1, it is characterised in that：The heat radiation material layer and institute
The shapes and sizes for stating insulating protective layer front projection are consistent.
5. a kind of hardware radiating insulating protection board according to claim 1 or 4, it is characterised in that：The heat radiation material layer
It can be identical as hardware circuit board with the shape of the insulating protective layer.
6. a kind of hardware radiating insulating protection board according to claim 1 or 2, it is characterised in that：The heat radiation material layer
It is pressed together on above heating element.
7. a kind of hardware radiating insulating protection board according to claim 1, it is characterised in that：The PCB circuit board (4),
Heat radiation material layer, insulating protective layer and component layer integrate.
8. a kind of hardware radiating insulating protection board according to claim 1, it is characterised in that：It further include antistatic protection
The one side of layer, the antistatic protection layer close to electronic component layer uses static dissipative material, another side to use conduction material
Material, and be arranged in component layer side.
9. a kind of hardware radiating insulating protection board according to claim 1 or 3, it is characterised in that：The insulating protective layer
It can also be designed as waveform platy structure, and frame is set in the surrounding of the insulating protective layer, the height of the frame is more than
Or the sum of the peaks and troughs equal to the insulating protective layer.
10. a kind of battery management system, it is characterised in that：It is protected including any hardware radiating insulating in claim 1-9
Backplate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721492350.XU CN207652755U (en) | 2017-11-10 | 2017-11-10 | A kind of hardware radiating insulating protection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721492350.XU CN207652755U (en) | 2017-11-10 | 2017-11-10 | A kind of hardware radiating insulating protection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207652755U true CN207652755U (en) | 2018-07-24 |
Family
ID=62888773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721492350.XU Expired - Fee Related CN207652755U (en) | 2017-11-10 | 2017-11-10 | A kind of hardware radiating insulating protection board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207652755U (en) |
-
2017
- 2017-11-10 CN CN201721492350.XU patent/CN207652755U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180724 Termination date: 20201110 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |