KR101573900B1 - Electric tape haiving outstanding electro-magnetic wave shielding function and radiant heat efficiency - Google Patents

Abstract

The present invention relates to an electronic tape with a superior electromagnetic wave shielding function and superior heat emitting efficiency which comprises: a bonding layer for attachment to an electronic component; a heat diffusing layer which is arranged on the bonding layer and diffuses heat to the electronic component; and a heat emitting layer which is arranged on the heat diffusing layer and emits heat conducted from the heat diffusing layer.

Description

ELECTRIC TAPE HAIVING OUTSTANDING ELECTRO-MAGNETIC WAVE SHIELDING FUNCTION AND RADIANT HEAT EFFICIENCY < RTI ID = 0.0 >

The present invention relates to an electronic tape which has an electromagnetic wave shielding function and is excellent in heat radiation efficiency, which is applied to a smart phone or the like.

Recently, according to trends of high quality of portable terminals such as smart phones or tablets, the specifications of portable terminals are becoming higher and higher. In order to realize such high performance, an increasing number of circuit modules are housed in the terminal, and each of these circuit modules itself is becoming higher in performance.

The high performance of such a circuit module can be mainly achieved by increasing the operating speed. However, such an increase in the operating speed entails a high temperature, which can shorten the life of the circuit module.

In addition, the high performance of the circuit module may be achieved by the high integration of the circuit module. However, the high integration of such a circuit module reduces the line width between the internal transistors, thereby causing the circuit module to easily malfunction due to an external impact, and causing malfunction even by electromagnetic interference (EMI) and the like.

Accordingly, it is required to provide an electromagnetic wave shielding function and an excellent heat dissipation efficiency on an electronic tape for attaching electronic parts of a smart phone.

An object of the present invention is to provide an electronic tape capable of increasing the heat dissipation efficiency for an electronic part having a large heat dissipation problem and shielding electromagnetic waves generated from the electronic part more efficiently.

An electronic tape excellent in electromagnetic wave shielding function and heat dissipation efficiency, which is one embodiment of the present invention which is devised to solve the above-described problems, includes an adhesive layer for attaching to an electronic component; A thermal diffusion layer disposed on the adhesive layer to diffuse heat from the electronic component; And a heat dissipation layer disposed on the thermal diffusion layer to dissipate heat conducted from the thermal diffusion layer.

Here, the thermal diffusion layer may include a conductive fabric sheet.

Wherein the conductive fabric sheet comprises: a fabric interwoven with a plurality of filaments; And a plating layer formed by plating on the filament, so that the electromagnetic wave can be shielded by the vortex phenomenon.

Here, the plating layer may include at least one of nickel and copper.

Here, the heat dissipation layer may include a metal sheet having a hole in the form of a matrix.

Here, the heat dissipation layer may further include a Graphene layer coated on the metal sheet to improve the heat radiation efficiency and improve the electromagnetic wave shielding function.

Here, the metal sheet may include at least one of copper, aluminum, silver, and gold.

The electronic tape may further include a buffer layer disposed on the heat dissipation layer to buffer an external impact.

Here, the buffer layer may be formed by extrusion, casting, or foam molding of at least one of polyethylene, polyurethane, and polypropylene, or by extruding or casting thermoplastic polyurethane.

Here, when the buffer layer is formed by extrusion or casting, the buffer layer may further include a cling adhesion layer to adhere the buffer layer and the heat dissipation layer to each other.

Here, the electronic tape may further include a waterproof layer disposed on the heat dissipation layer.

Here, the waterproof layer may include polyethylene terephthalate.

Here, the waterproof layer may have a porosity of 1 to 50%.

Here, the adhesive layer may be a conductive adhesive layer for enhancing the conductivity of heat from the electronic component.

According to an embodiment of the present invention having the above-described structure, the heat generated from the electronic component in the thermal diffusion layer is absorbed, and the heat dissipation layer dissipates it to the outside.

Further, according to one embodiment of the present invention, it is possible to confirm excellent electromagnetic wave shielding function in a conductive fabric sheet used as a thermal diffusion layer.

1 is a sectional view of a first embodiment of an electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, which is an embodiment of the present invention.
2 is a sectional view of a second embodiment of an electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, which is an embodiment of the present invention.
3 is a sectional view of a third embodiment of an electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, which is an embodiment of the present invention
4 is a perspective view of a metal sheet used for an electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, which is one embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of an electronic tape 100 according to a first embodiment of the present invention, which is excellent in electromagnetic wave shielding function and heat dissipation efficiency. 1, the first embodiment of the electronic tape 100 according to the present invention may include an adhesive layer 110, a thermal diffusion layer 120, and a heat dissipation layer 130.

The adhesive layer 110 is a structure for providing adhesion to a skin complex (electronic component: heat source). In the present invention, the adhesive layer 110 also has a function of transferring heat generated from a skin complex, which is composed of a conductive adhesive layer. The adhesive layer 110 may include a polymer resin and a conductive additive. The polymer resin is an element for providing an adhesive force, and may include at least one of an acryl-based resin, a rubber-based resin, and an epoxy-based resin. The conductive additive is an element for enhancing thermal conductivity and providing electromagnetic shielding function, and the conductive additive may include at least one of silver, copper, aluminum, nickel, and graphene

The thermal diffusion layer 120 may be made of a conductive fabric sheet for diffusing heat from a skin complex causing heat generation.

The conductive fabric sheet 120 may comprise a cloth, and a plated layer. The fabric can be formed by weaving a plurality of filaments. The plating layer may be formed by plating a metal having excellent conductivity, such as nickel and copper, on the filament. The plating layer can be plated on the cloth through an electroplating process or the like. In addition, the conductive fabric sheet 120 may have a thickness of 10 [mu] m to 100 [mu] m. The conductive fabric sheet having such a structure is relatively light in weight, excellent in workability, and has excellent thermal diffusivity. Furthermore, the electromagnetic wave is shielded even more by the vortex effect on the electromagnetic wave (that is, the effect generated by the formation of the closed curve by the crossing of the filament).

The heat dissipation layer 130 is a component for dissipating the heat conducted in the heat dissipation layer 120 to the outside. The heat-radiating layer 130 may include a metal sheet. The metal sheet 130 is a structure for imparting not only a heat radiation function but also an EMI shielding function. The metal sheet 130 may be formed of at least one of copper, aluminum, silver, and gold, which are conductive materials having excellent thermal conductivity. Such a metal sheet 130 can be obtained by rolling the alloy described above, and by this rolling, the metal sheet can have the form of a metal thin film. In addition, the metal sheet 130 may have a thickness of 10 to 100 mu m for slimming down the product. This metal sheet 130 will be described in more detail with reference to FIG.

Hereinafter, a second embodiment of the electronic tape 100 having the electromagnetic wave shielding function and the excellent heat dissipation efficiency further having the buffering function will be described in detail with reference to FIG.

2 is a sectional view of a second embodiment of an electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, which is an embodiment of the present invention. The second embodiment 120 'differs from the first embodiment in that it further includes a buffer layer 140. For the sake of simplicity, the description of the same configuration as in the first embodiment will be omitted.

As shown in FIG. 2, the second embodiment 120 'may further include a buffer layer 140 and a cladding layer 135.

The buffer layer 140 is disposed on the heat-dissipating layer 130 to buffer external shocks. The buffer layer 140 may be formed by extrusion, casting, or foam molding of at least one of polyethylene, polyurethane, and polypropylene, or by extruding or casting thermoplastic polyurethane. Here, thermoplastic polyurethane (TPU) is excellent in chemical resistance and abrasion resistance due to friction, has excellent elasticity and flexibility, and is easily returned to its original shape when the applied pressure is released .

Can be obtained by producing polymers by extrusion or casting molding methods. Casting molding is a type of film forming method in which the buffer layer 140 can be obtained by flowing a polymer in a molten state onto a substrate having a certain surface and solidifying it at normal pressure.

The buffer layer 140 thus formed may have a thickness of 10 mu m to 200 mu m. Specifically, if the buffer layer 140 has a thickness of 10 μm or more, which is the minimum thickness required for compression, and the buffer layer 140 is too thick, the buffer layer 140 may be slimmed The buffer layer 140 may have a thickness of 200 mu m or less.

The clad adhesion layer 135 is a component that allows the buffer layer 140 and the heat dissipation layer 130 to adhere to each other when the buffer layer 140 is formed by extrusion or casting. The adhesion adhering layer 135 may be composed of at least one of an acrylic-based resin, a rubber-based resin, and an epoxy-based resin, or a sticky or adhesive polymer resin. The cladding layer 135 thus formed is formed through a gravure printing method so that the buffer layer 140 and the heat dissipation layer 130 are laminated and adhered to each other.

The adhesive layer 150 is a structure for providing the adhesive force of the electronic tape 100 'as the second embodiment to the object to be attached. The adhesion layer 150 may be composed of a sticky or adhesive polymer resin. Specifically, the polymer resin may include at least one of an acrylic-based resin, a rubber-based resin, and an epoxy-based resin.

The adhesion layer 150 may have a concavo-convex pattern formally. According to the concavo-convex pattern, even if the thickness of the adhesion layer 150 becomes thick, the inside air bubbles can be smoothly discharged to the outside. The concavo-convex pattern can be formed directly on the adhesion layer 150 through mechanical pressing or the like. Alternatively, it is also possible to form the adhesion layer 150 by a release paper film transfer method.

On the other hand, the adhesion layer 150 may have a thickness of 1 占 퐉 to 100 占 퐉. If the thickness of the adhesive layer 150 is less than 1 μm, the adhesive force of the adhesive layer 150 is relatively lowered. If the thickness of the adhesive layer 150 exceeds 100 μm, peeling of the metal sheet as the heat radiation layer 130 may occur have. Accordingly, the thickness of the adhesion layer 150 can be appropriately adjusted within the above-mentioned range in consideration of the above-mentioned problems and slimming of the object to be adhered.

Hereinafter, a third embodiment of the electronic tape having the electromagnetic wave shielding function and the excellent heat dissipation efficiency further having the waterproof function will be described in detail with reference to FIG.

3 is a sectional view of a third embodiment of an electronic tape having an electromagnetic wave shielding function and heat radiation efficiency, which is an embodiment of the present invention. The third embodiment 100 "is different from the first and second embodiments in that it further includes a waterproof layer 160. For the sake of simplicity of explanation, the same configuration as that of the first embodiment and the second embodiment Will be omitted.

The waterproof layer 160 disposed on the heat dissipation layer 130 may be formed of polyethylene terephthalate.

Polyethylene terephthalate is a saturated polyester obtained by condensation polymerization of terephthalic acid and ethylene glycol, and has high heat resistance and oil resistance as well as excellent water resistance.

The waterproof layer 160 may have a porosity of 1% to 50%. Specifically, when the pores are excessively formed in the waterproof layer 160, water can permeate through these pores. Accordingly, in order to provide a waterproof function, it is preferable that polyethylene terephthalate has a low porosity of 50% or less.

In addition, the waterproof layer 160 having the above structure may have a thickness of 10 to 50 탆. Specifically, if the thickness of the waterproof layer 160 is less than 10 mu m, the waterproofing ability may be lowered by the above-described pores, and if the thickness of the waterproof layer 160 exceeds 50 mu m, the entire thickness of the electronic tape 100 " The waterproof layer 160 can be appropriately adjusted within the above-mentioned range since the slimness of the finished product to which the electronic tape 100 "is attached can be inhibited.

The waterproof layer 160 may include a corona treated surface on at least one of its two major surfaces. Here, the corona treatment is a method for modifying the surface of a film. In this method, a corona salt is generated by using a discharge processor, and the surface is modified by passing the water through the waterproof layer 160. The corona-treated surface thus treated can be prevented from peeling due to an increased adhesion force. Such a corona-treated surface can be disposed in contact with the buffer layer 140 to enhance the adhesion with the buffer layer 140.

Although the waterproofing layer 160 made of PET has been described above, the waterproofing layer 160 may be made of another polymer such as thermoplastic polyurethane. In this case, the thermoplastic polyurethane can be produced by extrusion or casting molding so as to have a porosity of 1% to 50% in order to provide a waterproof function.

4 is a perspective view of a metal sheet used for an electronic tape 100 having an electromagnetic wave shielding function and heat radiation efficiency, which is an embodiment of the present invention.

As shown in FIG. 4, the metal sheet as the heat-radiating layer 130 may be a metal sheet having a hole in the form of a matrix. With the above configuration, not only the weight of the sheet itself can be reduced but also the heat radiation efficiency can be increased. In addition, a graphene layer is coated on the metal sheet, thereby further increasing the heat radiation efficiency.

According to an embodiment of the present invention having the above-described structure, the heat generated from the electronic component in the thermal diffusion layer is absorbed, and the heat dissipation layer dissipates it to the outside.

Further, according to one embodiment of the present invention, it is possible to confirm excellent electromagnetic wave shielding function in a conductive fabric sheet used as a thermal diffusion layer.

The electronic tape having the electromagnetic wave shielding function and heat dissipation efficiency as described above is not limited to the configuration and the operation manner of the embodiments described above. The above embodiments may be configured so that all or some of the embodiments may be selectively combined to make various modifications.

100: electronic tape
110: (conductive) adhesive layer
120: thermal diffusion layer (conductive fabric sheet)
130: heat-radiating layer (metal sheet)
135:
140: buffer layer (buffer film)
150: adhesion layer
160: Waterproof layer

Claims (14)

An adhesive layer for attachment to electronic components;
A thermal diffusion layer disposed on the adhesive layer to diffuse heat from the electronic component; And
And a heat dissipation layer disposed on the thermal diffusion layer for dissipating heat conducted from the thermal diffusion layer,
Wherein the thermal diffusion layer comprises a conductive fabric sheet,
Wherein the conductive fabric sheet comprises:
A fabric knitted with a plurality of filaments; And
An electromagnetic wave shielding function and an excellent heat dissipation efficiency, which shield electromagnetic waves by a vortex phenomenon occurring in a closed curve formed by intersecting the filaments, comprising a plated layer formed by plating on the filament.
delete delete The method according to claim 1,
Wherein the plating layer comprises:
Nickel, and copper, and has excellent electromagnetic wave shielding function and heat radiation efficiency.
The method according to claim 1,
The heat-
An electronic tape excellent in electromagnetic wave shielding function and heat dissipation efficiency, comprising a metal sheet having holes in the form of a matrix.
6. The method of claim 5,
The heat-
An electronic tape having an electromagnetic wave shielding function and a high heat dissipation efficiency, which further comprises a Graphene layer coated on the metal sheet to improve a heat radiation efficiency and an electromagnetic shielding function.
The method according to claim 6,
The metal sheet may include:
An electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, comprising at least one of copper, aluminum, silver, and gold.
The method according to claim 1,
And a buffer layer disposed on the heat dissipation layer and buffering an external impact, the electronic tape having an electromagnetic wave shielding function and excellent heat dissipation efficiency.
9. The method of claim 8,
The buffer layer,
An electronic tape excellent in electromagnetic wave shielding function and heat radiation efficiency, wherein at least one of polyethylene, polyurethane, and polypropylene is extruded, cast or foam molded, or thermoplastic polyurethane is extruded or cast.
10. The method of claim 9,
Wherein the buffer layer and the heat dissipation layer adhere to each other when the buffer layer is formed by extrusion or casting, the electromagnetic interference shielding function and heat dissipation efficiency being excellent.
The method according to claim 1,
Further comprising a waterproof layer disposed on the heat dissipation layer, wherein the electromagnetic interference shielding function and the heat dissipation efficiency are excellent.
12. The method of claim 11,
Wherein the waterproof layer comprises polyethylene terephthalate, and has excellent electromagnetic wave shielding function and heat radiation efficiency.
13. The method of claim 12,
Wherein the waterproof layer has a porosity of 1 to 50% and is excellent in electromagnetic wave shielding function and heat radiation efficiency.
The method according to claim 1,
The adhesive layer
Which is an electroconductive adhesive layer for enhancing the conductivity of heat from the electronic component, is excellent in electromagnetic wave shielding function and heat dissipation efficiency.

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