CN113130610A - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN113130610A CN113130610A CN202110390004.5A CN202110390004A CN113130610A CN 113130610 A CN113130610 A CN 113130610A CN 202110390004 A CN202110390004 A CN 202110390004A CN 113130610 A CN113130610 A CN 113130610A
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- Prior art keywords
- layer
- display
- adhesive layer
- heat dissipation
- display substrate
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- 239000010410 layer Substances 0.000 claims abstract description 114
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 230000017525 heat dissipation Effects 0.000 claims abstract description 67
- 239000012790 adhesive layer Substances 0.000 claims abstract description 57
- 239000002131 composite material Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 11
- 239000004744 fabric Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000003068 static effect Effects 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 238000009825 accumulation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the invention provides a display module and a display device, wherein the display module comprises a display substrate and a heat dissipation composite layer arranged on one side of the display substrate, which is far away from the display side of the display substrate, the heat dissipation composite layer comprises a first adhesive layer and a heat dissipation layer, the first adhesive layer is stacked on one side of the display substrate, which is far away from the display side of the display substrate, the heat dissipation layer is arranged on one side of the first adhesive layer, which is far away from the display substrate, the first adhesive layer is a conductive adhesive layer, the heat dissipation layer is made of a conductive material, and the display substrate is connected with the heat dissipation layer through; the problem of display module assembly because static gathers influences the display effect is solved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
An Organic Light Emitting Diode (OLED) is an active light emitting display device, and has the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, and high response speed. With the continuous development of display technology, a flexible display device (flexiple display) using an OLED as a light emitting device and performing signal control by a Thin Film Transistor (TFT) has become a mainstream product in the display field at present.
However, the OLED display substrate has a complicated circuit, is thin, and is sensitive to charges, and when charges are accumulated on the OLED display substrate, the OLED display substrate is likely to turn green and flicker.
Disclosure of Invention
The embodiment of the invention provides a display module and a display device, and solves the problem that the display module influences the display effect due to electrostatic aggregation.
In a first aspect, an embodiment of the present invention provides a display module, which includes a display substrate and a heat dissipation composite layer disposed on a side of the display substrate away from a display side of the display substrate, where the heat dissipation composite layer includes a first adhesive layer stacked on the side of the display substrate away from the display side of the display substrate and a heat dissipation layer disposed on the side of the first adhesive layer away from the display substrate, the first adhesive layer is a conductive adhesive layer, the heat dissipation layer is made of a conductive material, and the first adhesive layer connects the display substrate and the heat dissipation layer.
In an exemplary embodiment, the heat dissipation composite layer further includes a conductive structure disposed between the first adhesive layer and the heat dissipation layer, the conductive structure connecting the first adhesive layer and the heat dissipation layer.
In an exemplary embodiment, the display substrate comprises a border region, and a perpendicular projection of the conductive structure on the display substrate overlaps at least a portion of the border region.
In an exemplary embodiment, the conductive structure is a ring structure.
In an exemplary embodiment, the frame region has a rectangular ring shape, and a vertical projection of the conductive structure on the display substrate overlaps at least one side of the frame region.
In an exemplary embodiment, the heat dissipation composite layer further includes a buffer layer disposed between the first adhesive layer and the heat dissipation layer, and the conductive structure is located on a peripheral side of the buffer layer.
In an exemplary embodiment, the display substrate includes a display region, and a perpendicular projection of the buffer layer on the display substrate overlaps at least a portion of the display region.
In an exemplary embodiment, the heat dissipation composite layer further includes a second adhesive layer disposed between the buffer layer and the heat dissipation layer, the second adhesive layer is an insulating adhesive layer, and the conductive structure is located on a peripheral side of the second adhesive layer.
In an exemplary embodiment, the conductive structure is made of conductive adhesive or conductive cloth; or, the conductive structure comprises a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer and conductive cloth, wherein the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are arranged in a stacked mode, and the conductive cloth is arranged between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.
In an exemplary embodiment, the heat dissipation layer is a metal layer.
In an exemplary embodiment, the first glue layer has an impedance of less than 107Ohm.
In an exemplary embodiment, a grid pattern is disposed on a surface of the first adhesive layer near one side of the display substrate.
In a second aspect, an embodiment of the present invention further provides a display device, including the foregoing display module.
The invention provides a display module and a display device, wherein a display substrate is connected with a heat dissipation layer through a first adhesive layer, so that static electricity generated on the display substrate can be conducted to the heat dissipation layer through the first adhesive layer, static electricity accumulation on the display substrate is avoided, and the display problems of greening and the like caused by static electricity accumulation on the display substrate are solved.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
Fig. 1 is an exploded view of a display module according to an embodiment of the disclosure;
fig. 2 is a schematic structural diagram of a heat dissipation composite layer in a display module according to an embodiment of the disclosure;
fig. 3 is a cross-sectional view of a heat dissipation composite layer in a display module according to an embodiment of the disclosure;
fig. 4 is an enlarged view of a heat dissipation composite layer in a display module according to an embodiment of the disclosure;
fig. 5 is a schematic structural diagram of a first adhesive layer in a display module provided in the embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a conductive structure in a display module according to an embodiment of the disclosure;
fig. 7 is a schematic structural diagram of a heat dissipation layer in a display module according to an embodiment of the disclosure;
fig. 8 is a schematic structural diagram of a buffer layer in a display module according to an embodiment of the disclosure;
fig. 9 is a schematic structural diagram of a second adhesive layer in the display module provided in the embodiment of the disclosure.
Detailed Description
The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
Fig. 1 is an exploded view of a display module according to an embodiment of the disclosure. As shown in fig. 1, the display module according to the embodiment of the disclosure includes a display substrate 100 and a heat dissipation composite layer 200 disposed on a side of the display substrate 100 away from a display side of the display substrate 100. The heat dissipation composite layer 200 is attached to the display substrate 100, and can dissipate heat, which is helpful for dissipating heat generated by the display substrate 100 during operation. The display substrate 100 may be a rigid or flexible OLED display substrate.
Fig. 2 is a schematic structural diagram of a heat dissipation composite layer in a display module according to an embodiment of the disclosure; fig. 3 is a cross-sectional view of a heat dissipation composite layer in a display module according to an embodiment of the disclosure; fig. 4 is an enlarged view of a heat dissipation composite layer in a display module according to an embodiment of the disclosure. The structure of the display module according to the embodiment of the disclosure is described by taking fig. 3 as a cross-sectional view along the direction a-a in fig. 2 and fig. 4 as an enlarged view at a in fig. 3 as an example. As shown in fig. 2, fig. 3 and fig. 4, the heat dissipation composite layer 200 includes a first adhesive layer 1 stacked on one side of the display substrate 100 away from the display side of the display substrate 100 and a heat dissipation layer 3 stacked on one side of the first adhesive layer 1 away from the display substrate 100, the first adhesive layer 1 is a conductive adhesive layer, the heat dissipation layer 3 is a conductive material, the first adhesive layer 1 connects the display substrate 100 with the heat dissipation layer 3, so that the first adhesive layer 1 can conduct static electricity generated on the display substrate 100 to the heat dissipation layer 3, thereby avoiding static electricity accumulation on the display substrate 100, and solving the display problem of greenness caused by static electricity accumulation on the display substrate 100. Wherein the conductive adhesive layer is an adhesive layer containing conductive particles or metal ions. The heat dissipation layer 3 may be a metal layer.
In an exemplary embodiment, the heat dissipation layer 3 may play a role of dissipating heat, which helps to quickly dissipate heat generated when the display substrate 100 operates; and the heat dissipation layer 3 can remove static electricity on the display substrate 100.
In an exemplary embodiment, the display module further includes a middle frame, and the heat dissipation layer 3 is disposed on the middle frame at a side away from the display substrate 100 and connected to the middle frame, so that the heat dissipation layer 3 is grounded through the middle frame, thereby eliminating static electricity on the heat dissipation layer 3 and preventing the static electricity from being conducted back to the display substrate 100.
In an exemplary embodiment, the heat dissipation composite layer 200 further includes a conductive structure 2 disposed between the first adhesive layer 1 and the heat dissipation layer 3, and the conductive structure 2 connects the first adhesive layer 1 and the heat dissipation layer 3. The conductive structure 2 has a conductive property, and can conduct static electricity on the first adhesive layer 1 to the heat dissipation layer 3.
In an exemplary embodiment, the first glue layer 1 has an adhesive property capable of adhering the conductive structure 2 to a side of the display substrate 100 facing away from the display side of the display substrate 100; and the first glue layer 1 also has a conductive property, and can conduct static electricity on the display substrate 100 to the conductive structure 2.
In an exemplary embodiment, the display substrate 100 includes a display area and a frame area surrounding the display area, and a vertical projection of the conductive structure 2 on the display substrate 100 overlaps at least a portion of the frame area, so that the vertical projection of the conductive structure 2 on the display substrate 100 does not overlap the display area, thereby avoiding affecting the adhesion of the display area.
Fig. 6 is a schematic structural diagram of a conductive structure in a display module according to an embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 4 and 6, the conductive structure 2 may be a ring structure. The conductive structure 2 is disposed corresponding to a frame region of the display substrate 100. The conductive structure 2 may be made of a conductive adhesive layer, for example, the conductive structure 2 may be made of a conductive adhesive or a conductive cloth, and the conductive adhesive and the conductive cloth are convenient to set and low in price; or, the conductive structure 2 is a composite structure, and the conductive structure 2 includes a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer and a conductive cloth arranged between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.
In one exemplary embodiment, the conductive structure may also take other shapes, for example, the frame area of the display substrate is rectangular ring-shaped, and the vertical projection of the conductive structure on the display substrate overlaps with at least one side of the frame area. Illustratively, the vertical projection of the conductive structure on the display substrate overlaps at least one of two long sides oppositely arranged with the frame region; or the vertical projection of the conductive structure on the display substrate is overlapped with at least one of two short sides oppositely arranged with the frame area.
Fig. 5 is a schematic structural diagram of a first adhesive layer in a display module provided in the embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 4 and 5, the first adhesive layer 1 is made of a low-impedance material. In an example, the impedance of the material of the first glue layer 1 is less than 107Ohm. The first adhesive layer 1 is attached to a side of the display substrate 100 away from the display side of the display substrate 100, and is used for conducting static electricity on the display substrate 100 to the conductive structure 2, and the conductive structure 2 conducts the static electricity to the heat dissipation layer 3. The first adhesive layer 1 may be made of a double-sided adhesive tape.
In an exemplary embodiment, as shown in fig. 5, a mesh pattern 101 is disposed on a surface of the first adhesive layer 1 near one side of the display substrate. The grid pattern 101 is a plurality of grooves arranged crosswise on the surface of the first glue layer 1. The first adhesive layer 1 can press the adhesive surface with the grooves arranged crosswise by grid pressing. The grid pattern 101 is used for exhausting air in the process of attaching the first adhesive layer 1 to the display substrate, so that attaching air bubbles are prevented, and attaching tightness of the heat dissipation composite layer and the display substrate is enhanced.
Fig. 7 is a schematic structural diagram of a heat dissipation layer in a display module according to an embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 4 and 7, the heat dissipation layer 3 may be a metal layer. The metal layer can be silver, copper, aluminum or alloy thereof, so that the heat dissipation layer 3 has good heat dissipation effect on one hand and good electric conduction effect on the other hand, and can eliminate static electricity on the display substrate.
Fig. 8 is a schematic structural diagram of a buffer layer in a display module according to an embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 4 and 8, the heat dissipation composite layer 200 further includes a buffer layer 4 disposed between the first adhesive layer 1 and the heat dissipation layer 3, and the buffer layer 4 plays a role in buffering, so as to prevent the display substrate 100 from being damaged by the bonding pressure during the bonding process between the heat dissipation composite layer 200 and the display substrate 100 or buffer external force on the display module. The conductive structure 2 is located on the peripheral side of the buffer layer 4. The material of the buffer layer 4 may be Foam (Foam).
In the exemplary embodiment, a vertical projection of the buffer layer 4 on the display substrate 100 overlaps at least a portion of the display region, that is, the buffer layer 4 is disposed corresponding to the display region, and the conductive structure 2 is disposed corresponding to the frame region. The buffer layer 4 can prevent the damage of the bonding pressure to the display area in the bonding process.
Fig. 9 is a schematic structural diagram of a second adhesive layer in the display module provided in the embodiment of the disclosure. In an exemplary embodiment, as shown in fig. 4 and 9, the heat dissipation composite layer 200 further includes a second adhesive layer 5 disposed between the buffer layer 4 and the heat dissipation layer 3, the second adhesive layer 5 is an insulating adhesive layer, and the conductive structure 2 is located on a peripheral side of the second adhesive layer 5. The second glue layer 5 is used for bonding the buffer layer 4 and the heat dissipation layer 3. The second adhesive layer 5 may be polyester resin (PET) or Polyimide (PI).
The embodiment of the present disclosure further provides a display device, including the foregoing display module. The display device includes, for example, a mobile phone, a tablet computer, a smart wearable product (smart watch, bracelet), a Personal Digital Assistant (PDA), a vehicle-mounted computer, and the like. The embodiment of the present application does not specifically limit the specific form of the display device.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (13)
1. The utility model provides a display module assembly, its characterized in that, including display substrate and set up in display substrate deviates from the heat dissipation composite bed of display substrate demonstration side one side, the heat dissipation composite bed including range upon range of set up in display substrate deviates from the first glue film of display substrate demonstration side one side and set up in first glue film deviates from the heat dissipation layer of display substrate one side, first glue film is conductive adhesive layer, the heat dissipation layer is electrically conductive material, first glue film will display substrate with the heat dissipation layer is connected.
2. The display module of claim 1, wherein the heat-dissipating composite layer further comprises a conductive structure disposed between the first adhesive layer and the heat-dissipating layer, the conductive structure connecting the first adhesive layer and the heat-dissipating layer.
3. The display module of claim 2, wherein the display substrate comprises a border region, and a vertical projection of the conductive structure on the display substrate overlaps at least a portion of the border region.
4. The display module of claim 3, wherein the conductive structure is a ring structure.
5. The display module of claim 3, wherein the frame area is a rectangular ring shape, and a vertical projection of the conductive structure on the display substrate overlaps at least one edge of the frame area.
6. The display module of claim 2, wherein the heat dissipation composite layer further comprises a buffer layer disposed between the first adhesive layer and the heat dissipation layer, and the conductive structure is disposed on a peripheral side of the buffer layer.
7. The display module of claim 6, wherein the display substrate comprises a display area, and a vertical projection of the buffer layer on the display substrate overlaps at least a portion of the display area.
8. The display module of claim 6, wherein the heat dissipation composite layer further comprises a second adhesive layer disposed between the buffer layer and the heat dissipation layer, the second adhesive layer is an insulating adhesive layer, and the conductive structure is located on a peripheral side of the second adhesive layer.
9. The display module assembly of claim 2, wherein the conductive structure is made of conductive adhesive or conductive cloth; or, the conductive structure comprises a first pressure-sensitive adhesive layer, a second pressure-sensitive adhesive layer and conductive cloth, wherein the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer are arranged in a stacked mode, and the conductive cloth is arranged between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer.
10. The display module of claim 1, wherein the heat dissipation layer is a metal layer.
11. The display module of claim 1, wherein the impedance of the first glue layer is less than 107Ohm.
12. The display module of claim 1, wherein a grid pattern is disposed on a surface of the first adhesive layer adjacent to the display substrate.
13. A display device comprising the display module according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110390004.5A CN113130610A (en) | 2021-04-12 | 2021-04-12 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110390004.5A CN113130610A (en) | 2021-04-12 | 2021-04-12 | Display module and display device |
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| CN113130610A true CN113130610A (en) | 2021-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110390004.5A Pending CN113130610A (en) | 2021-04-12 | 2021-04-12 | Display module and display device |
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| CN (1) | CN113130610A (en) |
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| CN113867027A (en) * | 2021-09-29 | 2021-12-31 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113963632A (en) * | 2021-10-25 | 2022-01-21 | 武汉天马微电子有限公司 | Display module and display device |
| CN115810313A (en) * | 2021-09-13 | 2023-03-17 | 乐金显示有限公司 | Display device and display apparatus |
| WO2024140226A1 (en) * | 2022-12-27 | 2024-07-04 | 华为技术有限公司 | Middle frame assembly and electronic device |
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| WO2024140226A1 (en) * | 2022-12-27 | 2024-07-04 | 华为技术有限公司 | Middle frame assembly and electronic device |
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