CN111409326A - Conductive adhesive structure and display device - Google Patents
Conductive adhesive structure and display device Download PDFInfo
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- CN111409326A CN111409326A CN202010356060.2A CN202010356060A CN111409326A CN 111409326 A CN111409326 A CN 111409326A CN 202010356060 A CN202010356060 A CN 202010356060A CN 111409326 A CN111409326 A CN 111409326A
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- adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 50
- 239000012790 adhesive layer Substances 0.000 claims abstract description 83
- 239000002245 particle Substances 0.000 claims abstract description 64
- 239000010410 layer Substances 0.000 claims abstract description 54
- 239000010408 film Substances 0.000 claims description 49
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000006260 foam Substances 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 2
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- 229920000742 Cotton Polymers 0.000 description 4
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- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
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- 239000010409 thin film Substances 0.000 description 2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
- B32B3/085—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts spaced apart pieces on the surface of a layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/12—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The invention relates to the technical field of display, and discloses a conductive adhesive structure and a display device, wherein the conductive adhesive structure comprises: the first adhesive layer, the conducting layer and the second adhesive layer are sequentially stacked, a plurality of conducting particle filling areas distributed at intervals are arranged in the first adhesive layer, conducting particles are arranged in the conducting particle filling areas, and the conducting particles are electrically connected with the conducting layer. In this conductive adhesive structure for when the display panel back, can dredge the dispersion even with the response electric charge that the display panel back produced in the whole face at the display panel back, can not cause the condition of response electric charge gathering, alleviate the problem that fingerprint unblock district turns dark, guarantee that unblock area and other display areas show that luminance is even unanimous, make display panel's whole luminance show evenly.
Description
Technical Field
The invention relates to the technical field of display, in particular to a conductive adhesive structure and a display device.
Background
At present, in order to meet the demand of consumers for technology perception, more and more new technologies are gradually applied to the mobile phone display module, wherein a large fingerprint unlocking area is a key loop even for a half-screen and full-screen fingerprint unlocking area, but as the area of the fingerprint unlocking area is enlarged, the window opening area of the heat dissipation film on the back of the O L ED Panel is increased and a large area of U-film (protection film) is exposed, the surface impedance of the U-film is very large and almost non-conductive, the induced charge accumulation generated on the surface of the U-film can adversely affect the TFT characteristics of the display Panel through Panel, so that the phenomenon of fingerprint hole Mura occurs in the fingerprint hole area, that is, the display brightness of the fingerprint hole area is not uniform with that of the rest areas of the Panel, and the fingerprint hole area is dark, so that the problem of the occurrence of the fingerprint hole Mura in the fingerprint hole area is urgently needed to be solved.
Disclosure of Invention
The invention discloses a conductive adhesive structure and a display device, wherein when the conductive adhesive structure is used for displaying the back of a display panel, induced charges generated at the back of the display panel can be dispersed and dispersed uniformly in the whole back of the display panel, the condition of induced charge aggregation can not be caused, the problem of darkening of a fingerprint unlocking area is relieved, the display brightness of the unlocking area and other display areas is ensured to be uniform and consistent, and the overall brightness of the display panel is uniformly displayed.
In order to achieve the purpose, the invention provides the following technical scheme:
a conductive paste structure comprising: the first glue film, conducting layer and the second glue film that stack gradually the setting, be equipped with a plurality of interval distribution's conductive particle filling area in the first glue film, be equipped with conductive particle in the conductive particle filling area, conductive particle with the conducting layer electricity is connected.
For convenience of description, in the present solution, the stacking direction in which the first adhesive layer, the conductive layer, and the second adhesive layer are stacked is taken as a longitudinal direction, and the direction along the plane where the first adhesive layer is located is taken as a horizontal direction. The conductive adhesive structure comprises a first adhesive layer, wherein a plurality of conductive particle filling areas distributed at intervals are arranged in the first adhesive layer, conductive particles are arranged in each conductive particle filling area, a conductive layer stacked with the first adhesive layer is arranged on the first adhesive layer, the conductive particles in the first adhesive layer are electrically connected with the conductive layer, a second adhesive layer is arranged on the conductive layer, namely a multilayer structure of the first adhesive layer, the conductive layer and the second adhesive layer is formed, the conductive particle filling areas in the first adhesive layer are distributed at intervals, other parts, different from the conductive particle filling areas, in the first adhesive layer still have good cohesiveness, the first adhesive layer has good cohesiveness on the technology with longitudinal conductive performance and can be adhered with other film layers or devices, and the second adhesive layer is arranged on one side, away from the first adhesive layer, and plays a role in adhering, so that the conductive adhesive structure with the first adhesive layer has the advantages of good cohesiveness, good, Both sides of the conductive adhesive structure of the multilayer structure of the conductive layer and the second adhesive layer have adhesive property, so that the conductive adhesive structure has an adhesive effect; when the conductive adhesive structure is applied to the back of the display panel, the first adhesive layer faces the back of the display panel and is adhered to the back of the display panel, the first adhesive layer comprises conductive particles which can conduct induced charges generated on the surface of the back of the display panel to the conductive layer along the longitudinal direction, the conductive layer is conducted in the whole layer and can conduct the induced charges along the horizontal direction, so that the induced charges are uniformly distributed, the induced charges generated on the surface of the back of the whole display panel are uniformly distributed in the whole surface of the back of the display panel, the influence of charge aggregation on the characteristics of a TFT (thin film transistor) in the display panel is avoided, the brightness of the display panel is uniform, particularly when a fingerprint unlocking area is arranged in the display panel, the situation that the induced charges are aggregated at the position corresponding to the fingerprint unlocking area on the back of the display panel can be avoided, and the problem that the fingerprint unlocking area, the display brightness of the unlocking area and the display brightness of other display areas are ensured to be uniform.
Therefore, when the conductive adhesive structure is used for the back of the display panel, the induced charges generated on the back of the display panel can be dredged and dispersed uniformly in the whole back of the display panel, the condition of induced charge aggregation cannot be caused, the problem of darkening of a fingerprint unlocking area is solved, the display brightness of the unlocking area and the display brightness of other display areas are uniform and consistent, and the whole brightness of the display panel is uniform.
Optionally, the first adhesive layer is a grid adhesive layer, the conductive particles are arranged in part of grids in the grid adhesive layer to form a plurality of conductive particle filled regions, and the conductive particles are not arranged in another part of grids in the grid adhesive layer to form a plurality of adhesive layer regions, wherein at least part of grids in the grids adjacent to the grids provided with the conductive particles form the adhesive layer regions.
Optionally, the conductive particle filling regions are uniformly spaced.
Optionally, the conductive particle filling regions are distributed in a matrix.
Optionally, the conductive layer comprises a conductive cloth.
Optionally, the second glue layer comprises an insulating flat glue.
Optionally, the conductive adhesive structure has an opening penetrating through the first adhesive layer, the conductive cloth, and the second adhesive layer, and the opening is used for being arranged opposite to the fingerprint unlocking region of the display panel.
Based on the same inventive concept, the invention further provides a display device, which comprises a display panel and a heat dissipation film arranged on the back surface of the display panel, wherein the heat dissipation film is bonded with the display panel through any one of the conductive adhesive structures provided by the technical scheme, a first adhesive layer in the conductive adhesive structure is bonded with the heat dissipation film, a second adhesive layer is bonded with the display panel, the display panel is provided with a fingerprint unlocking area, and through holes penetrating through the conductive adhesive structure and the heat dissipation film and opposite to the fingerprint unlocking area are formed in the conductive adhesive structure and the heat dissipation film.
Optionally, the heat dissipation membrane is including the cotton layer of bubble and the copper foil of range upon range of setting, the copper foil is located the cotton layer of bubble deviates from one side of conductive adhesive structure, the cotton layer of bubble with have in the copper foil with the opening of through-hole central axis coincidence, the opening is in orthographic projection on the display panel with the trompil is in orthographic projection on the display panel coincides completely.
Optionally, a protective film is further arranged on the back of the display panel, the protective film is located between the display panel and the conductive adhesive structure, and the first adhesive layer is bonded with the protective film.
Drawings
Fig. 1 is a schematic structural diagram of a film layer of a conductive paste structure according to an embodiment of the present invention;
fig. 2 is a schematic top view of a portion of a first adhesive layer according to an embodiment of the disclosure;
fig. 3 is a schematic diagram of a display surface side of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present invention;
icon: 1-conductive paste structure; 2-a heat dissipation film; 3-a display panel; 4-protective film; 5-a through hole; 11-a first glue layer; 12-a conductive layer; 13-a second glue layer; 21-foam cotton; 22-copper foil; 111-conductive particle filled region; 112-glue layer area.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, 2 and 3, a conductive paste structure 1 includes: the first adhesive layer 11, the conductive layer 12 and the second adhesive layer 13 are sequentially stacked, a plurality of conductive particle filling areas 111 distributed at intervals are arranged in the first adhesive layer 11, conductive particles are arranged in the conductive particle filling areas 111, and the conductive particles are electrically connected with the conductive layer 12.
For convenience of description, in the present embodiment, the stacking direction in which the first glue layer 11, the conductive layer 12 and the second glue layer 13 are stacked is taken as a longitudinal direction, and the direction along the plane of the first glue layer 11 is taken as a horizontal direction. The conductive adhesive structure 1 includes a first adhesive layer 11, a plurality of conductive particle filling areas 111 are disposed in the first adhesive layer 11 at intervals, conductive particles are disposed in each conductive particle filling area 111, a conductive layer 12 is disposed on the first adhesive layer 11 and stacked with the first adhesive layer 11, the conductive particles in the first adhesive layer 11 are electrically connected to the conductive layer 12, a second adhesive layer 13 is disposed on the conductive layer 12, that is, a multi-layer structure of the first adhesive layer 11, the conductive layer 12, and the second adhesive layer 13 is formed, the conductive particle filling areas 111 in the first adhesive layer 11 are spaced, so that other portions of the first adhesive layer 11 different from the conductive particle filling areas 111 still have good adhesion, the first adhesive layer 11 has good adhesion on the basis of having longitudinal conductive performance and can be adhered to other film layers or devices, the second adhesive layer 13 is disposed on a side of the conductive layer 12 away from the first adhesive layer 11, the adhesive function is achieved, so that both sides of the conductive adhesive structure 1 with the multilayer structure of the first adhesive layer 11, the conductive layer 12 and the second adhesive layer 13 have adhesive property, and the conductive adhesive structure 1 has the adhesive function; when the conductive adhesive structure 1 is applied to the back of a display panel, the first adhesive layer 11 faces the back of the display panel and is adhered to the back of the display panel, the first adhesive layer 11 includes conductive particles which can longitudinally conduct induced charges generated on the surface of the back of the display panel to the conductive layer 12, the conductive layer 12 is conducted in the whole layer and can conduct the induced charges in the horizontal direction, so that the induced charges are uniformly distributed, the induced charges generated on the surface of the back of the whole display panel are uniformly distributed in the whole surface of the back of the display panel, the influence of charge aggregation on the characteristics of a TFT (thin film transistor) in the display panel is avoided, the brightness of the display panel is uniform, particularly when a fingerprint unlocking area is arranged in the display panel, the situation that the induced charges are aggregated at the position corresponding to the fingerprint unlocking area on the back of the display panel is avoided, and the problem that the fingerprint unlocking area is darkened is, the display brightness of the unlocking area and the display brightness of other display areas are ensured to be uniform.
Therefore, when the conductive adhesive structure 1 is used for the back surface of a display panel, induced charges generated on the back surface of the display panel can be uniformly dispersed in the whole back surface of the display panel, the condition of induced charge aggregation cannot be caused, the problem of darkening of a fingerprint unlocking area is solved, the display brightness of the unlocking area and the display brightness of other display areas are uniform and consistent, and the whole brightness of the display panel is uniform.
As shown in fig. 1 and fig. 2, in the above-mentioned conductive adhesive structure, the first adhesive layer 11 is a grid adhesive layer, a part of grids in the grid adhesive layer is provided with conductive particles to form a plurality of conductive particle filled regions 111, and another part of grids in the grid adhesive layer is free of conductive particles to form a plurality of adhesive layer regions 112, wherein at least a part of grids in the grids adjacent to the grids provided with conductive particles form the adhesive layer regions 112. The surface that the net glue film deviates from the conductive part is formed with the grid structure, has the glue film of grid structure promptly, pours into conductive particle into in partial net, and sets up conductive particle in the net of interval in the net glue film, makes to have the net that does not set up conductive particle between conductive particle's the net to form the interval, can play the bonding effect, and the difficult gassing that produces of net glue film pasting, and is good at display panel back adaptability, is convenient for paste.
Specifically, the conductive particle filling regions 111 in the first adhesive layer 11 are uniformly spaced, and the conductive particle filling regions 111 are uniformly disposed, which is favorable for improving uniformity of inducing charge dispersion.
As shown in fig. 2, for the specific distribution of the conductive particle filled regions 111 in the first adhesive layer 11, the conductive particle filled regions 111 may be distributed in a matrix, for example, the conductive particle filled regions 111 are distributed in a matrix of rows and columns, the conductive particle filled regions 111 in each row are uniformly spaced along the row direction, and the conductive particle filled regions 111 in each column are uniformly spaced along the column direction; specifically, two rows of conductive particle filled regions 111 adjacent to each other are disposed with a gap therebetween, that is, the conductive particle filled regions 111 in the next row are opposite to the conductive particle filled regions 111 in the previous row. The conductive particle filling regions 111 are distributed in a matrix form, which is convenient for preparation and has good uniformity, wherein it should be noted that the conductive particle filling regions 111 may also be distributed in other uniform manners, and this embodiment is not limited.
Specifically, in the conductive adhesive structure, the conductive layer 12 may be a conductive cloth, which is easy to set and low in cost; the second adhesive layer 13 may be an insulating flat adhesive, which has a good adhesive function.
Specifically, the conductive adhesive structure has an opening penetrating through the first adhesive layer 11, the conductive cloth, and the second adhesive layer 13, and the opening is used for being opposite to the fingerprint unlocking region of the display panel.
Based on the same inventive concept, as shown in fig. 3 and 4, the present invention further provides a display device, which includes a display panel 3 and a heat dissipation film 2 disposed on the back surface of the display panel 3, the heat dissipation film 2 and the display panel 3 are bonded by the conductive adhesive structure 1 provided in the above embodiment, the first adhesive layer 11 in the conductive adhesive structure 1 is bonded to the heat dissipation film 2, the second adhesive layer 13 is bonded to the display panel 3, the display panel 3 has a fingerprint unlocking region a, and the conductive adhesive structure 1 and the heat dissipation film 2 have a through hole 5 penetrating through the conductive adhesive structure 1 and the heat dissipation film 2 and opposite to the fingerprint unlocking region a. The conductive adhesive structure 1 is provided with the first adhesive layer 11 and the conductive layer 12 which are provided with conductive particles, so that induced charges at the position corresponding to the back of the display panel 3 and the fingerprint unlocking area can be conducted to other positions, the induced charges on the whole back of the display panel 3 are uniformly distributed, uneven display brightness between the fingerprint unlocking area and other display areas is avoided, and the uniformity of the whole display brightness of the display panel 3 is improved.
Specifically, as shown in fig. 4, the heat dissipation film 2 includes a foam 21 layer and a copper foil 22 which are stacked, the copper foil 22 is located on a side of the foam 21 layer away from the conductive adhesive structure 1, the foam 21 layer and the copper foil 22 have openings coinciding with the central axis of the through hole 5, and an orthographic projection of the openings on the display panel 3 completely coincides with an orthographic projection of the openings on the display panel 3. That is, the opening in the heat dissipation film 2 coincides with the through hole 5, the conductive adhesive structure 1 has openings penetrating through the first adhesive layer 11, the conductive layer 12, and the second adhesive layer 13, the openings coincide with the through hole 5, and the opening in the heat dissipation film 2 and the openings in the conductive adhesive structure 1 constitute the through hole 5.
As shown in fig. 4, a protection film 4 is further disposed on the back surface of the display panel 3, the protection film 4 is located between the display panel 3 and the conductive adhesive structure 1, the first adhesive layer 11 is adhered to the protection film 4, and the protection film 4 is made of an insulating material and disposed on the back surface of the display panel 3 to protect the display panel 3.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A conductive paste structure, comprising: the first glue film, conducting layer and the second glue film that stack gradually the setting, be equipped with a plurality of interval distribution's conductive particle filling area in the first glue film, be equipped with conductive particle in the conductive particle filling area, conductive particle with the conducting layer electricity is connected.
2. The conductive adhesive structure according to claim 1, wherein the first adhesive layer is a mesh adhesive layer, a part of the mesh adhesive layer is provided with the conductive particles therein to form a plurality of the conductive particle-filled regions, and another part of the mesh adhesive layer is free of the conductive particles to form a plurality of adhesive layer regions, wherein at least a part of the mesh adjacent to the mesh provided with the conductive particles forms the adhesive layer region.
3. The conductive paste structure according to claim 1 or 2, wherein the conductive particle-filled regions are arranged at regular intervals.
4. The conductive paste structure according to claim 3, wherein the conductive particle-filled regions are distributed in a matrix.
5. The conductive paste structure of claim 1 wherein the conductive layer comprises a conductive cloth.
6. The conductive paste structure of claim 1 wherein the second paste layer comprises an insulating flat paste.
7. The conductive adhesive structure of claim 1, wherein the conductive adhesive structure has an opening therein through the first adhesive layer, the conductive cloth, and the second adhesive layer, the opening being configured to be disposed opposite to the fingerprint unlocking region of the display panel.
8. The display device is characterized by comprising a display panel and a heat dissipation film arranged at the back of the display panel, wherein the heat dissipation film is adhered to the display panel through the conductive adhesive structure according to any one of claims 1 to 7, a first adhesive layer in the conductive adhesive structure is adhered to the heat dissipation film, a second adhesive layer is adhered to the display panel, the display panel is provided with a fingerprint unlocking area, and a through hole which penetrates through the conductive adhesive structure and the heat dissipation film and is opposite to the fingerprint unlocking area is formed in the heat dissipation film.
9. The display device according to claim 8, wherein the heat dissipation film comprises a foam layer and a copper foil which are stacked, the copper foil is located on a side of the foam layer facing away from the conductive adhesive structure, an opening coinciding with the central axis of the through hole is formed in the foam layer and the copper foil, and an orthographic projection of the opening on the display panel completely coincides with an orthographic projection of the opening on the display panel.
10. The display device according to claim 8, wherein a protective film is further disposed on the back surface of the display panel, the protective film is located between the display panel and the conductive adhesive structure, and the first adhesive layer is bonded to the protective film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010356060.2A CN111409326B (en) | 2020-04-29 | 2020-04-29 | Conductive adhesive structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010356060.2A CN111409326B (en) | 2020-04-29 | 2020-04-29 | Conductive adhesive structure and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111409326A true CN111409326A (en) | 2020-07-14 |
| CN111409326B CN111409326B (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010356060.2A Active CN111409326B (en) | 2020-04-29 | 2020-04-29 | Conductive adhesive structure and display device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111798746A (en) * | 2020-07-15 | 2020-10-20 | 京东方科技集团股份有限公司 | Display substrate, display panel and display device |
| CN113130610A (en) * | 2021-04-12 | 2021-07-16 | 京东方科技集团股份有限公司 | Display module and display device |
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| CN111409326B (en) | 2022-07-29 |
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