201037054 六、發明說明： 【發明所屬之技術領域】 本發明係有關一種異方性導電膠膜及製造方法，尤 其是具有不同導電粒子密度之多層堆疊排列的漸層式異 方性導電膠膜。可依據運用的設計種類的不同’選擇搭 配最佳的漸層結構。 【先前技4餘】 由於薄膜電晶體液晶顯示器（Thin Film Transistor Liquid Crystal Display，TFT-LCD)具有輕薄短小且較 低耗電量的優點’目前已是個人電腦以及筆記型電腦的 最主要顯示裝置’而消費型的TFT_LCD電視機也逐年在 增加中。TFT-LCD需有特定的驅動裝置，一般稱為LCD 驅動積體電路（IntegratedCircuit，1C)，TFT-LCD 驅動 1C與基板連接主要是利用金凸塊(G〇id Bumping)以接合 膠接合方式進行接合，但是金凸塊的間距一般較小，約 20um〜40um，且金凸塊的熔點相對與錫鉛凸塊高很多，所 以很難使用傳統的鍚鉛迴焊製程進行焊接，而目前主要 的接合方式是利用異方性導電膠膜(ACF : Anis〇tiOpie Conductive Film) ° ACF的組成主要包含導電粒子及絕緣膠材，導電粒 子包含在絕轉材内，砂絕緣雜在地下具有魏滞 201037054 性，且在外來垂直壓力下，其中的導電粒子向受壓方向 上移動，進而相互接觸或擠壓變形，因而形成受壓垂直 縱方向上具有電氣導通的效應，但在未受擠壓的水平橫 方向上因導電粒子仍被絕緣膠材隔離開而形成絕緣性的 電氣狀態，當經過一段時間使絕緣膠材固化後，導電粒 子便不再焚外力而移動而形成垂直導通但水平絕緣的穩 定結構。因此，使TFT—LCD驅動IC與基板形成良好的電 Ο 氣連接。 導電粒子的種類可分為碳黑、金屬球及外鍍金屬之 樹脂球等。礙黑為早期產品，目前使用已不多。金屬球 則以錄球為大宗’伽在於其高硬度、低縣，尖角狀 突起可插人接財以增加接觸面積；缺闕在其可能破 壞脆弱的接點、容綠化而影料料。為克服鎳球之 减問題’可在鎳球表面鑛金喊域金轉。目前錄 ❹ 球《導電粒子多用於與PCB之連接，LCD面板之™電極 連接則不適用’主要原因在於金屬球質硬且多尖角，怕 其對1T〇線路造成損傷。因此，用於TFT-LCD的ACF是 以鑛金鎳之触球為线，由於獅球郷性，不但不 a傷σ ΙΤ0線路，且在加壓勝合的過程中，球體將變形 呈橢球狀以增加接觸面積。 ACF中之|電粒子扮演垂直導通的關鍵角色，絕緣 膠材巾導電粒子數目越乡餅餘子_積越大，垂直 201037054 方向的接觸電阻越小，導通效果也就越好。然而，過多 或過大的導電粒子可能會在熱壓合時，橫向的金凸塊間 容易彼此接觸而造成橫向導通的短路，使得電氣功能不 正常或甚至失效而導致整個TFT-LCD損壞。 由於TFT-LCD解析度要求曰益提高，驅動ic的接腳 數目也隨著增加’而相對地金凸塊與基板上連接墊片的 尺寸就愈來愈細窄化，亦即朝向細小間距（finepitch)。 在接觸面積縮小的情況下，為了能維持住足夠的導通電 里就必須提高導電粒子的捕捉率。以傳統的製備方式來 製備的話，須增加導電粒子的添加量，相對的也就增加 了製造成本，而不利於市場競爭。此外，增加導電粒子 的添加量會降低橫向上的電氣絕緣，因橫向的導電粒子 有可能㈣：!：加壓產錢向推擠的效躺相互接觸形成 電氣導通。 因此，需要-種不需增加|電粒子密度而能在間距 縮小下提S料餘子捕捉率的異方性導，藉以 增加產品良率並降低原物料成本。 【發明内容】 本發月之主要目的在提供一種漸層式異方性導電膠 膜，係包括複數轉材層，每瓣材層包含硕的導電 粒子选度’且導電粒子的密度由低而高漸層式變化，因 • 201037054 此可在不增加導電粒子的密度下增加粒子捕捉率，而能 在間距縮小時達到所需的垂直導通電阻值，並避免發生 橫向導通，大幅提高產品的良率。 本發明之另一目的在提供一種漸層式異方性導電膠 膜的製造方法，係先製造包含不同導電粒子密度的膠 材，再將低導電粒子密度的膠材塗佈到基材上，經加熱 供烤後形成第-膠材層，接著將較高導電粒子密度的膠 〇 材塗佈到第一膠材層上，經加熱烘烤後形成第二膠材 層’依此方式逐步將導電粒子密度較高的膠材塗佈到上 -層導電粒子密度較_騎層上，錢去除基材形成 漸層式異方性導電膠膜。 本發明之另-目的在提供一種漸層式異方性導電膠 膜的製造方法，係先將未添加導電粒子的原始膠材塗佈 到基材上’再以喷墨方式喷灑導電粒子埋入原始膠材層 〇 ⑽祕材層’並重複進行該步驟且改时墨壓力以改 變導電粒子統’進㈣成具不同導絲子密度的多層 狀漸層式異方性導電膠膜。 【實施方式】 以下配合®式及元件符號對本發明之實施方式做更 詳細的綱，俾使«綱聽者在·本·書後能 據以實施。 201037054 參閱第一圖，本發明漸層式異方性導電膠膜的示意 圖。如第一圖所示，本發明的漸層式異方性導電膠膜1〇 包括複數個膠材層，比如第一膠材層21、第二膠材層22 以及第二膠材層23,每個膠材層具有絕緣膠3〇以及導電 粒子40，且導電粒子4〇的密度係由低而高變化，亦即第 膠材層21的導電粒子密度低於第二膠材層的導電 粒子费度，而第二膠材層22的導電粒子密度又低於第三 Ο 膠材層23的導電粒子密度。 要注意的是，第一圖顯示第一膠材層21、第二膠材 層22以及第三膠材層23財便說明本發曰月漸層式異方 ! 生V電膠膜的特點，並非用以限定本發明範圍，因此本 發明的漸層式異方性導電膠膜係具有大於一個以上的任 意整數個騎層。親轉包括魏翻旨以及硬化劑， 藉加熱熟化而形成固態狀。 ❹ 參閱第二圖’本發明麟式異紐導轉膜的製造 方法之流糊。如第二圖所示，本發明的製造方法係由 步驟S100開始，將複數個_電粒子加入絕緣膠内，形成 膠材’並重複财式，觀魏科錄子的數目而形 成複數個包含不同導電粒子密度的膠材，並進入步驟 S110。在步驟S110中，將低導電粒子密度的膠材塗佈到 基材上，接著進入步驟S120，進行加熱烘烤以形成膠材 層，進入步驟S130。在步驟S130中，將較高導電粒子密 201037054 度1膠材到塗佈前—步驟中所形成的較低導電粒子密度 的膠材層上’接著進入步驟sl4〇，進行加熱烘烤以形成 膠材層，並進入步驟S150。在步驟S150中，如果已完成 最後的膠材層’則進入步驟S160，如果還未完成最後的 膠材層’則回到步驟sl3〇，重複上述操作。在步驟sl6〇 中’去除紐鄉成所f的麟式異方性導f膠膜，並 進入步驟S180，結束本製造方法的操作。 〇 參閱第二圖’本發明漸層式異方性導電膠膜的另- 製造方法之流程圖。如第三圖所示，本發明的另一製造 方法係由步驟S200開始’將未添加導電粒子的絕緣膠塗 佈到基材上，接著在步驟S210中，設定噴墨壓力，並進 入步驟S22Q。在步驟S22〇巾’以喷墨方式將導電粒子喷 灑到絕緣膠上並進而埋入絕緣膠内，接著在步驟 中，進行加熱供烤以形成膠材層，並進入步驟S24〇。在 〇 步驟S240中，將未添加導電粒子的絕緣膠塗佈到前一步 驟的膠材層上，接著在步驟S250中，增加噴墨壓力，並 進入步驟S260。在步驟S260中，以噴墨方式將導電粒子 噴灑到絕緣膠上並進而埋入絕緣膠内，接著在步驟S27〇 中，進行加熱供烤以形成另一膠材層，並進入步驟S28〇。 在步驟S280中，如果已完成最後膠材層，則進入步驟 S285 ’如果未完成最後膠材層，則回到步驟從4〇，重複 上述操作。在步驟S285中，去除基材以形成所需的漸層 201037054 式異方性導電膠膜，並進人步驟S29G，結束本製造方法 的操作。 本發明的漸層式異方性導電賴具有較低的粒子密 度’較而的導電粒子補捉率以及較低的導通電阻，如表 一户斤示。201037054 VI. Description of the Invention: [Technical Field] The present invention relates to an anisotropic conductive film and a method of fabricating the same, and more particularly to a multilayered conductive film having a multi-layer stack arrangement of different conductive particle densities. The optimum gradation structure can be selected according to the type of design used. [Previous Technology 4] Since Thin Film Transistor Liquid Crystal Display (TFT-LCD) has the advantages of being light, thin, and low in power consumption, it is currently the main display device for personal computers and notebook computers. 'The consumer TFT_LCD TV is also increasing year by year. TFT-LCD requires a specific driving device, generally called LCD driver integrated circuit (Integrated Circuit, 1C). The TFT-LCD driver 1C is connected to the substrate mainly by means of G〇id Bumping. Bonding, but the pitch of the gold bumps is generally small, about 20um~40um, and the melting point of the gold bumps is much higher than that of the tin-lead bumps, so it is difficult to solder using the conventional lead-lead reflow process. The bonding method is to use an anisotropic conductive film (ACF: Anis〇tiOpie Conductive Film). The composition of ACF mainly includes conductive particles and insulating rubber materials. The conductive particles are contained in the absolute material, and the sand insulation is mixed in the ground with Wei stag 201037054. And under the external vertical pressure, the conductive particles move in the direction of compression, and then contact or squeeze deformation, thereby forming an electrical conduction effect in the vertical direction of the compression, but at the level of uncompressed In the lateral direction, the conductive particles are still insulated by the insulating material to form an insulating electrical state. When the insulating rubber is cured for a period of time, the conductive particles are no longer External force moves while forming a vertical insulated conductive but stable level structure. Therefore, the TFT-LCD driver IC is made to form a good electrical connection with the substrate. The types of conductive particles can be classified into carbon black, metal balls, and resin balls coated with metal. Black is an early product and it is not used much at present. The metal ball is recorded as a large ball. The gamma is high in hardness and low in the county. The sharp horns can be inserted into the money to increase the contact area. The defect is that it may damage the fragile joints and allow for greening. In order to overcome the problem of the reduction of the nickel ball, the gold mine on the surface of the nickel ball can be turned over. At present, the ❹ ball "conductive particles are mostly used for connection with PCB, and the TM electrode connection of LCD panel is not applicable." The main reason is that the metal ball is hard and has many sharp corners, which may cause damage to the 1T 〇 line. Therefore, the ACF used for the TFT-LCD is based on the contact of the gold-nickel nickel. Due to the sturdy nature of the lion ball, not only does the σ ΙΤ0 line not be injured, but also the spheroid will be deformed during the process of pressurization. Shape to increase the contact area. The electric particle in ACF plays a key role in vertical conduction. The number of conductive particles in the insulating rubber towel is larger. The larger the product is, the smaller the contact resistance in the vertical direction of 201037054 is, the better the conduction effect is. However, too much or too large conductive particles may easily contact each other when the thermocompression is in contact with each other to cause a lateral conduction short circuit, resulting in an abnormal electrical function or even failure to cause damage to the entire TFT-LCD. As the resolution of the TFT-LCD is increased, the number of pins driving the ic is also increased. The size of the gold bumps and the pads on the substrate is relatively narrower, that is, toward a fine pitch ( Finepitch). In the case where the contact area is reduced, it is necessary to increase the trapping rate of the conductive particles in order to maintain sufficient conduction. In the conventional preparation method, the addition amount of the conductive particles must be increased, which in turn increases the manufacturing cost and is not conducive to market competition. In addition, increasing the amount of conductive particles added reduces the electrical insulation in the lateral direction, because lateral conductive particles are possible (4):!: Pressurization produces contact with the push effect to form electrical conduction. Therefore, it is necessary to increase the product yield and reduce the cost of raw materials by increasing the density of the electric particles without increasing the density of the electric particles. SUMMARY OF THE INVENTION The main purpose of this month is to provide a layered anisotropic conductive film, which comprises a plurality of layers of conductive material, each of which contains a large selection of conductive particles and the density of the conductive particles is low. High gradual change, because 201037054, this can increase the particle capture rate without increasing the density of conductive particles, and can achieve the required vertical on-resistance value when the pitch is reduced, and avoid lateral conduction, greatly improving the product. Yield. Another object of the present invention is to provide a method for manufacturing a layered anisotropic conductive film, which is to first manufacture a rubber material containing different conductive particle densities, and then apply a low conductive particle density rubber material to the substrate. After being heated for baking, a first layer of glue is formed, and then a rubber material having a higher conductive particle density is applied onto the first layer of glue, and after baking by heating, a second layer of glue is formed. The rubber material with a higher density of conductive particles is applied to the upper layer of the conductive particles at a higher density than the riding layer, and the money removing substrate forms a layered anisotropic conductive film. Another object of the present invention is to provide a method for manufacturing a graded anisotropic conductive film by first applying an original rubber material to which no conductive particles are added to a substrate, and then spraying the conductive particles by an inkjet method. Into the original rubber layer 10 (10) secret material layer 'and repeat this step and change the ink pressure to change the conductive particle system into (four) into a multi-layered layered anisotropic conductive film with different filament density. [Embodiment] Hereinafter, the embodiment of the present invention will be described in more detail with reference to the formula and the symbol of the device, so that the "listener" can implement it after the book. 201037054 Referring to the first figure, a schematic diagram of a graded anisotropic conductive film of the present invention. As shown in the first figure, the layered anisotropic conductive film 1 of the present invention comprises a plurality of layers of glue, such as a first glue layer 21, a second glue layer 22, and a second glue layer 23, Each of the rubber layers has an insulating adhesive 3 〇 and conductive particles 40, and the density of the conductive particles 4 由 varies from low to high, that is, the conductive particles of the first rubber layer 21 have a lower density than the conductive particles of the second adhesive layer. The cost is higher, and the conductive particle density of the second adhesive layer 22 is lower than the conductive particle density of the third silicone layer 23. It should be noted that the first figure shows the first glue layer 21, the second glue layer 22, and the third glue layer 23, which illustrate the characteristics of the 曰 层 式 ! !! It is not intended to limit the scope of the invention, and thus the layered anisotropic conductive film of the present invention has more than one arbitrary number of riding layers. The pro-revolution includes the Wei and the hardener, which are solidified by heat curing.参阅 Refer to the second figure, the paste of the manufacturing method of the lining type guide film of the present invention. As shown in the second figure, the manufacturing method of the present invention starts from step S100, and a plurality of _ electric particles are added into the insulating rubber to form a rubber material, and the financial formula is repeated, and the number of Weiko recordings is formed to form a plurality of inclusions. The rubber material having different conductive particle densities, and proceeds to step S110. In step S110, the rubber material having a low conductive particle density is applied onto the substrate, and then proceeds to step S120, and heat baking is performed to form a rubber layer, and the process proceeds to step S130. In step S130, the higher conductive particles are densely bonded to the adhesive layer of the lower conductive particle density formed in the pre-coating step, and then proceed to step s14, and heat-baked to form a glue. The material layer proceeds to step S150. In step S150, if the final glue layer has been completed, the process proceeds to step S160, and if the final glue layer has not been completed, the process returns to step s13, and the above operation is repeated. In step s1, ’, the lining anisotropic f-film of New Zealand is removed, and the process proceeds to step S180 to end the operation of the manufacturing method.参阅 Referring to the second figure, a flow chart of another manufacturing method of the progressively anisotropic conductive film of the present invention. As shown in the third figure, another manufacturing method of the present invention starts from step S200 by applying an insulating paste to which no conductive particles are added to the substrate, and then in step S210, setting the ink ejection pressure, and proceeds to step S22Q. . In step S22, the conductive particles are sprayed onto the insulating paste by ink jetting and then buried in the insulating paste, and then, in the step, heating is performed for baking to form a rubber layer, and the process proceeds to step S24. In 〇 step S240, the insulating paste to which the conductive particles are not added is applied onto the glue layer of the previous step, and then, in step S250, the ink ejection pressure is increased, and the process proceeds to step S260. In step S260, the conductive particles are sprayed onto the insulating paste by ink jetting and then buried in the insulating paste, and then heated in step S27 to be heated to form another adhesive layer, and the process proceeds to step S28. In step S280, if the final glue layer has been completed, the process proceeds to step S285'. If the final glue layer is not completed, the process returns to step 4, and the above operation is repeated. In step S285, the substrate is removed to form a desired graded 201037054 anisotropic conductive film, and proceeds to step S29G to end the operation of the manufacturing method. The layered anisotropic conductive ray of the present invention has a lower particle density, a lower conductivity of the conductive particles, and a lower on-resistance, as shown in Table 1.
表一 樣品 導電粒子密度 (pcs/mm2) 導通阻值（Ω)Table 1 Sample Conductive particle density (pcs/mm2) Conductivity (Ω)
由表一可知，傳統ACF需增加導電粒子密度以降低導通 阻值’但導電粒子捕捉率為8 pcs/buinp，低於本發明仰 的15pcs/bump，且本發明ACF的導電粒子密度為32213 pcs/mm2而導通阻值為丨.2 Ω，分別優於傳統ACF的4〇243 pcs/刪2以及1.4Q。It can be seen from Table 1 that the conventional ACF needs to increase the density of the conductive particles to reduce the conduction resistance value 'but the conductive particle capture rate is 8 pcs/buinp, which is lower than the 15pcs/bump of the present invention, and the conductive particle density of the ACF of the present invention is 32213 pcs. /mm2 and the conduction resistance is 丨.2 Ω, which is better than the traditional ACF of 4〇243 pcs/deleted 2 and 1.4Q.
參閱第四圖，本發明第二實施例之漸層式異方性導電 膠膜的示意圖。如第四圖所示，第二實施例的漸層式異 方性導電膠膜12具有與第一圖相類似的結構，不同點僅 在於第四圖的漸層式異方性導電膠膜12的薄層排列次序 與第一圖的漸層式異方性導電膠膜1〇相反。 參閱第五圖，本發明第三實施例之漸層式異方性導電 膠膜的示意圖。如第五圖所示，第三實施例的漸層式異 方性導電膠膜14具有絕緣膠3〇與導電粒子4〇，且導電 201037054 粒子40在絕緣膠30的分佈濃度係由高濃度逐漸降低至 低濃度，再由低濃度逐漸增加至高濃度，如第一膠材層 51、第一膠材層52、第三膠材層53、第四膠材層54以 及第五膠材層55。要注意的是，本實施例可包括任意數 目的膠材層。 參閱第六圖，本發明第四實施例之漸層式異方性導電 膠膜的示意®。如第六圖所示，第四實施例的漸層式異 〇 方性導電膠膜16具有絕緣膠30與導電粒子40，且導電 粒子40在絕緣膠30的分佈濃度係由低濃度逐漸增加至 同濃度’再由高濃度逐漸降健低濃度，如第一膠材層 6卜第二勝材層62、第三膠材層63、第四膠材層64以 及第五膠材層65。要注意的是，本實施例可包括任意數 目的膠材層。 以上所述者僅為用以解釋本發明之較佳實施例，並 Ο 非企_⑽本發明餘何形式上之關，是以，凡有 在相同之發明精神下所作有關本發明之任何修飾或變 更，皆仍應包括在本發明意圖保護之範疇。 【圖式簡單說明】 第圖為本發明第_貫施例之漸層式異方性導電膠膜的 示意圖。 、 第二圖為本發明漸層式異方性導電膠膜的製造方法之流 程圖。 201037054 第二圖為本發明漸層式異方性導電賴的另—製造方法 之流程圖。 第四圖為本㈣第二實施例之漸層式異綠導電膠膜的 示意圖。 第五圖為本發明第三實施例之漸層式異方性導電膠膜的 不意圖。 第六圖為本發明第四實施例之漸層式異方性導電膠膜的 〇 示意圖。 【主要元件符號說明】 10漸層式異方性導電膠膜 12漸層式異方性導電膠膜 14漸層式異方性導電膠膜 16漸層式異方性導電膠膜 ^ 21第一膠材層 22第二膠材層 23第三膠材層 30絕緣膠 40導電粒子 51第一膠材層 52第二膠材層 53第三膠材層 201037054 54第四膠材層 55第五膠材層 61第一膠材層 62第二膠材層 63第三膠材層 64第四膠材層 65第五膠材層 S100〜S180步驟 S200〜S290步驟Referring to Figure 4, there is shown a schematic view of a progressively shaped anisotropic conductive film of a second embodiment of the present invention. As shown in the fourth figure, the progressive anisotropic conductive film 12 of the second embodiment has a structure similar to that of the first figure, except for the stepwise anisotropic conductive film 12 of the fourth figure. The order of the thin layer arrangement is opposite to that of the layered anisotropic conductive film 1第一 of the first figure. Referring to Fig. 5, there is shown a schematic view of a progressively shaped anisotropic conductive film of a third embodiment of the present invention. As shown in the fifth figure, the progressive anisotropic conductive film 14 of the third embodiment has an insulating paste 3 〇 and conductive particles 4 〇, and the distribution concentration of the conductive 201037054 particles 40 in the insulating paste 30 is gradually increased from a high concentration. The concentration is lowered to a low concentration, and then gradually increased from a low concentration to a high concentration, such as the first rubber layer 51, the first rubber layer 52, the third rubber layer 53, the fourth rubber layer 54, and the fifth rubber layer 55. It is to be noted that this embodiment may include any number of layers of glue. Referring to Figure 6, a schematic representation of a graded anisotropic conductive film of a fourth embodiment of the present invention. As shown in the sixth figure, the progressively different isotropic conductive film 16 of the fourth embodiment has the insulating paste 30 and the conductive particles 40, and the distribution concentration of the conductive particles 40 in the insulating paste 30 is gradually increased from a low concentration to The same concentration 'gradually lowers the low concentration from the high concentration, such as the first rubber layer 6 and the second winning material layer 62, the third rubber layer 63, the fourth rubber layer 64, and the fifth rubber layer 65. It is to be noted that this embodiment may include any number of layers of glue. The above description is only for the purpose of explaining the preferred embodiments of the present invention, and is not intended to be a limitation of the present invention, and any modifications relating to the present invention in the spirit of the same invention. Changes or modifications are intended to be included within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The figure is a schematic view of a progressive anisotropic conductive film of the first embodiment of the present invention. The second figure is a flow chart of a method for manufacturing a graded anisotropic conductive film of the present invention. 201037054 The second figure is a flow chart of another method for manufacturing a layered anisotropic conductive layer according to the present invention. The fourth figure is a schematic view of the progressively-shaped iso-green conductive film of the second embodiment of the present invention. The fifth figure is not intended to be a progressive type anisotropic conductive film of the third embodiment of the present invention. Fig. 6 is a schematic view showing the 渐 of the progressive anisotropic conductive film of the fourth embodiment of the present invention. [Main component symbol description] 10 Gradient anisotropic conductive film 12 Gradient anisotropic conductive film 14 Gradient anisotropic conductive film 16 Gradient anisotropic conductive film ^ 21 first Rubber layer 22 second glue layer 23 third glue layer 30 insulating glue 40 conductive particles 51 first glue layer 52 second glue layer 53 third glue layer 201037054 54 fourth glue layer 55 fifth glue Material layer 61 first glue layer 62 second glue layer 63 third glue layer 64 fourth glue layer 65 fifth glue layer S100~S180 steps S200~S290 steps