CN111798746A - Display substrate, display panel and display device - Google Patents
Display substrate, display panel and display device Download PDFInfo
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- CN111798746A CN111798746A CN202010680007.8A CN202010680007A CN111798746A CN 111798746 A CN111798746 A CN 111798746A CN 202010680007 A CN202010680007 A CN 202010680007A CN 111798746 A CN111798746 A CN 111798746A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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Abstract
The application provides a display substrate, a display panel and a display device. The display substrate comprises a display area, the display area comprises a first display area and a second display area, and the light transmittance of the first display area is greater than that of the second display area. The display substrate comprises a heat dissipation film, a transparent conducting layer located on one side of the heat dissipation film and a display module located on one side, deviated from the heat dissipation film, of the transparent conducting layer. The heat dissipation film comprises a conductive material layer, and the heat dissipation film covers the display area; the heat dissipation film comprises a through hole penetrating through the heat dissipation film, and the through hole is located in the first display area. And the orthographic projection of the transparent conducting layer on the heat dissipation film covers the through hole. The display panel comprises the display substrate. The display device includes the display panel.
Description
Technical Field
The present disclosure relates to display technologies, and particularly to a display substrate, a display panel and a display device.
Background
Along with the rapid development of electronic equipment, the requirement of a user on the screen occupation ratio is higher and higher, so that the comprehensive screen display of the electronic equipment receives more and more attention in the industry, and the camera under the screen or the fingerprint sensing technology under the screen comes along with the development.
The electronic equipment comprises a display module and a heat dissipation film positioned on the back of the display module, wherein the heat dissipation film comprises a metal layer so as to realize the heat dissipation of the display module and guide away induced charges generated in the working engineering of the display module. In order to avoid the influence of the heat dissipation film on the work of the camera under the screen or the fingerprint sensor under the screen, the through hole is formed in the position, corresponding to the camera under the heat dissipation film and the screen, of the electronic equipment, so that the brightness of the area, corresponding to the opening hole, of the electronic equipment at the work is different from the brightness of other areas, and the use experience of a user is influenced.
Disclosure of Invention
According to a first aspect of embodiments of the present application, there is provided a display substrate. The display substrate comprises a display area, the display area comprises a first display area and a second display area, and the light transmittance of the first display area is greater than that of the second display area;
the display substrate comprises a heat dissipation film, a transparent conducting layer positioned on one side of the heat dissipation film and a display module positioned on one side of the transparent conducting layer, which is far away from the heat dissipation film;
the heat dissipation film comprises a conductive material layer, and the heat dissipation film covers the display area; the heat dissipation film comprises a through hole penetrating through the heat dissipation film, and the through hole is positioned in the first display area;
and the orthographic projection of the transparent conducting layer on the heat dissipation film covers the through hole.
In one embodiment, the transparent conductive layer is electrically connected to the layer of conductive material.
In one embodiment, the display substrate further comprises a non-display area, the non-display area comprises a bending area and a binding area, the bending area is adjacent to the display area and the binding area, and the binding area is positioned on one side of the display area, which is far away from the display side; the heat dissipation film is positioned in the display area;
the display substrate further comprises a first connecting part positioned in the bending area and a second connecting part positioned in the binding area, and the first connecting part is connected with the transparent conductive layer and the second connecting part; the second connecting portion is overlapped with the conductive material layer.
In one embodiment, the first connection portion and/or the second connection portion are formed in the same process step as the transparent conductive layer.
In one embodiment, the transparent conductive layer covers the display region, or the area of the transparent conductive layer is smaller than the area of the display region.
In one embodiment, the non-display region comprises an edge region and a central region, which are respectively adjacent to the display region; the first connecting portion is located in the edge region.
In one embodiment, the second connecting portion is located at least at the edge region, and a dividing slit is present between the edge region and the central region.
In one embodiment, the non-display region comprises an edge region and a central region, which are respectively adjacent to the display region; the central area comprises a first central area positioned in the bending area;
the display substrate further comprises a base layer located between the display module and the transparent conductive layer, and the base layer comprises a hollow portion located in the first central area.
According to a second aspect of embodiments of the present application, there is provided a display panel including the display substrate described above.
According to a third aspect of the embodiments of the present application, a display device is provided, where the display device includes the above display panel and a photosensitive element, the photosensitive element is located on a side of the heat dissipation film away from the display module, and is opposite to the first display area, and the photosensitive element can emit or receive light through the first display area.
The embodiment of the application achieves the main technical effects that:
according to the display substrate, the display panel and the display device, the display substrate comprises the first display area and the second display area, so that the photosensitive element can be arranged below the first display area, and the normal work of the photosensitive element is guaranteed; the heat dissipation film comprises a through hole positioned in the first display area, and the through hole is beneficial to improving the light transmittance of the first display area; the display substrate can generate induced charges in the working process, the conductive material layer of the heat dissipation film can conduct away the induced charges in the area corresponding to the display substrate and the conductive material layer in time, the transparent conductive layer can conduct away the induced charges in the area corresponding to the through hole in time, the phenomenon that the distribution of the induced charges in different areas of the display substrate is different to influence the characteristics of a thin film transistor of a pixel circuit can be avoided, the uniformity of the display brightness of the display substrate can be improved, and the use experience of a user is facilitated to be improved.
Drawings
FIG. 1 is a top view of a display substrate provided in an exemplary embodiment of the present application;
FIG. 2 is an exploded view of a display substrate provided in an exemplary embodiment of the present application;
FIG. 3 is a cross-sectional view of the display substrate shown in FIG. 1 taken along line AA;
FIG. 4 is a cross-sectional view of the display substrate shown in FIG. 1 taken along line BB;
FIG. 5 is a top view of a transparent conductive film layer and a base layer of a display substrate according to an exemplary embodiment of the present disclosure;
FIG. 6 is a top view of a transparent conductive film layer and a base layer of a display substrate according to another exemplary embodiment of the present disclosure;
FIG. 7 is a top view of a transparent conductive film layer and a base layer of a display substrate according to yet another exemplary embodiment of the present application;
fig. 8 is a cross-sectional view of a display panel provided in an exemplary embodiment of the present application.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
The embodiment of the application provides a display substrate, a display panel and a display device, which can solve the problems. Hereinafter, the display substrate, the display panel, and the display device in the embodiments of the present application will be described in detail with reference to the drawings. Features in the embodiments described below may complement or be combined with each other without conflict.
The embodiment of the application provides a display substrate. Referring to fig. 1 and 2, the display substrate 100 includes a display region 110, the display region 110 includes a first display region 111 and a second display region 112, and a light transmittance of the first display region 111 is greater than a light transmittance of the second display region 112.
Referring to fig. 3 and 4, the display substrate 100 includes a heat dissipation film 10, a transparent conductive layer 20 on one side of the heat dissipation film 10, and a display module 30 on one side of the transparent conductive layer 20 away from the heat dissipation film 10. The heat dissipation film 10 covers the display area 110. The heat dissipation film 10 includes a layer 11 of conductive material. The heat dissipation film 10 includes a through hole 101 penetrating the heat dissipation film 10, and the through hole 101 is located in the first display region 111. The orthographic projection of the transparent conductive layer 20 on the heat dissipation film 10 covers the through hole 101.
The orthographic projection of the transparent conductive layer 20 on the heat dissipation film 10 covers the through hole 101, that is, the area of the orthographic projection of the transparent conductive layer 20 on the heat dissipation film 10 is larger than the area of the through hole 101, or the area of the orthographic projection of the transparent conductive layer 20 on the heat dissipation film 10 is equal to the area of the through hole 101. The area of the through hole 101 may be equal to the area of the first display region 111.
The display substrate 100 provided in the embodiment of the application includes the first display area 111 and the second display area 112, so that the photosensitive element can be disposed below the first display area 111 to ensure the normal operation of the photosensitive element; the heat dissipation film 10 includes a through hole 101 in the first display region 111, and the through hole 101 helps to improve the light transmittance of the first display region 111; the display substrate 100 generates induced charges during operation, the conductive material layer 11 of the heat dissipation film 10 can conduct away the induced charges in the region corresponding to the display substrate and the conductive material layer 11 in time, the transparent conductive layer 20 can conduct away the induced charges in the region corresponding to the through hole 101 in time, so as to prevent the induced charges in different regions of the display substrate 100 from being distributed differently to affect the characteristics of the thin film transistor of the pixel circuit, improve the uniformity of the display brightness of the display substrate 100, and contribute to improving the user experience.
The display substrate 100 further includes a base layer 40 located between the display module 30 and the transparent conductive layer 20. The inventors have found that induced charges are generated on the surface of the base layer 40 during the operation of the display substrate 100, and in the conventional scheme, the charges in the region corresponding to the base layer 40 and the through hole 101 are different from the charges in other regions, which affects the characteristics of the thin film transistor of the pixel circuit, thereby causing the display luminance distribution of the display substrate 100 to be non-uniform. Based on this, the inventors thought to adopt the solution of the present application to solve the above-described problems.
In the illustrated embodiment, the first display area 111 is substantially rectangular. In other embodiments, the first display area 111 may have other shapes, such as a circle, an ellipse, a diamond, etc.
In one embodiment, the heat dissipation film 10 further includes an adhesive layer 12 and a foam layer 13, the foam layer 13 is located between the adhesive layer 12 and the conductive material layer 11, and the adhesive layer 12 is located on a side of the foam layer 13 close to the transparent conductive layer 20. The heat dissipation film 10 plays a role in buffering, shading and heat dissipation for the display module. Wherein the adhesive layer 12 adheres the heat dissipation film 10 and the transparent conductive layer 20 together. The foam layer 13 has good heat transfer performance, and can rapidly transfer heat generated by the display module 30 to the conductive material layer 11, and the conductive material layer 11 dissipates the heat, thereby preventing the temperature of the display substrate 100 from being too high. The material of the conductive material layer 11 may be a metal such as metallic copper or a metal alloy such as stainless steel. The metal has excellent heat dissipation performance and electrical conductivity, and can effectively dissipate heat and quickly conduct away induced charges of the display substrate 100.
The heat dissipation film 10 covers the display area 110 of the display substrate 100, and the heat dissipation film 10 is provided with a through hole 101 corresponding to the first display area 10, that is, the material of the heat dissipation film 10 covers the second display area 112. Therefore, the area of the material of the heat dissipation film 10 is large, the heat dissipation effect is good, and the induced charges of the second display area can be conducted away.
In one embodiment, the material of the transparent conductive layer 20 may be a conductive material with good light transmittance, such as indium tin oxide, indium zinc oxide, and the like.
In one embodiment, the display module 100 includes a substrate, a pixel circuit layer on the substrate, and a light emitting layer on the pixel circuit layer. The light emitting layer includes a plurality of sub-pixels positioned in the display area 110. The plurality of sub-pixels in the display area 110 includes sub-pixels of at least three colors, for example, the sub-pixels in the display area 110 may include sub-pixels of red, sub-pixels of green, and sub-pixels of blue. The pixel circuit includes pixel circuits corresponding to the plurality of sub-pixels one to one, and the pixel circuit includes a thin film transistor and a capacitor. The pixel circuit is connected to the anode of the corresponding sub-pixel to drive the corresponding sub-pixel. The display side of the display substrate 100 is the side of the display substrate 100 facing away from the heat spreading film 10.
In one embodiment, the conductive material layer 11 and the transparent conductive layer 20 may be grounded to conduct away the induced charges of the display substrate 100 in time.
In one embodiment, the transparent conductive layer 20 is electrically connected to the layer of conductive material 11. In this way, one of the transparent conductive layer 20 and the conductive material layer 11 is grounded, and the other is grounded through the other, so that a grounded wire is not required, which helps to simplify the structural complexity of the display substrate 100.
In one embodiment, the display substrate 100 further includes a non-display area 120, the non-display area 120 includes a bending area 121 and a binding area 122, the bending area 121 is adjacent to the display area 110 and the binding area 122, and the binding area 122 is located on a side of the display area 110 facing away from the display side. The heat dissipation film 10 is located only in the display area 110. The display module 30 is located in the display area 110, the bending area 121 and the binding area 122. The display substrate 100 further includes a first connection portion 41 located in the bending region 121 and a second connection portion 42 located in the bonding region 122, wherein the first connection portion 41 connects the transparent conductive layer 20 and the second connection portion 42; the second connection portion 42 overlaps the conductive material layer 11. The first connecting portion 41 is bent, one end of the first connecting portion 41 is connected to the second connecting portion 42, and the other end is connected to the transparent conductive layer 20.
In this way, the transparent conductive layer 20 is electrically connected to the conductive material layer 11 through the first connection portion 41 and the second connection portion 42. The bonding region 122 is bonded with a chip, and the bending region 121 is provided with a connection trace, which electrically connects a trace (e.g., a data line, a scan line) in the display region 110 with the chip.
In one embodiment, the first connection portion 41 and/or the second connection portion 42 are formed in the same process step as the transparent conductive layer 20. Thus, the first connection portion 41 and/or the second connection portion 42 and the transparent conductive layer 20 can be formed at the same time, which helps to simplify the manufacturing process of the display substrate 100.
In one embodiment, referring to fig. 5, the transparent conductive layer 20 covers the display area. That is, the area of the transparent conductive layer 20 is equal to the area of the display region 110. Thus, the area of the transparent conductive layer 20 is large, so that the resistance of the transparent conductive layer 20 is small, which is helpful for the transparent conductive layer 20 to rapidly conduct away the induced charges at the region corresponding to the through hole 101.
In another embodiment, referring to fig. 6 and 7, the area of the transparent conductive layer 20 is smaller than the area of the display region 110. The area of the orthographic projection of the transparent conductive layer 20 on the heat dissipation film 10 may be slightly larger than the area of the through hole 101. Thus, the area of the transparent conductive layer 20 is smaller, and the material for preparing the transparent conductive layer 20 can be saved.
In this embodiment, the display substrate further includes a third connecting portion 43 located in the display region 110, and the third connecting portion 43 connects the transparent conductive layer 20 and the first connecting portion 41. The transparent conductive layer 20 is connected to the first connection portion 41 through the third connection portion 43.
In some embodiments, as shown in fig. 6 and 7, the third connection portion 43 includes a first section 431 located in a central region of the display area 110 and a second section 432 located in an edge region of the display area 110, the first section 431 connects the transparent conductive layer 20 and the second section 432, and the second section 432 connects the first section 431 and the first connection portion 41. In the illustrated embodiment, the second segments 432 extend to an end of the display substrate 100 away from the bonding region 122, and the two second segments 432 are electrically connected by a connecting wire. In other embodiments, the second section 432 may be located only between the first section 431 and the first connection 41.
In one embodiment, referring to fig. 7, the non-display region 120 includes an edge region and a central region, which are respectively adjacent to the display region 110, and the first connection portion 41 is located at the edge region. The central area includes a first central area 1212 located in the bending area 121 and a second central area 1222 located in the binding area 122, the edge areas include a first edge area 1211 located in the bending area 121 and a second edge area 1221 located in the binding area 122, the first edge area 1211 of the bending area 121 is adjacent to the display area 110 and the second edge area 1221 of the binding area 122, and the first central area 1212 of the bending area 121 is adjacent to the display area 110 and the second central area 1222 of the binding area 122. The first central area 1212 of the bending area 121 is not provided with the first connection portion 41, and a thickness of a portion of the display substrate 100 located in the first central area 1212 is smaller than a thickness of a portion of the display substrate 100 located in the first edge area 1211. The area of the first central area 1212 is larger, and because the thickness of the first central area 1212 is smaller, the first central area 1212 of the display substrate 100 is easier to bend when the bending area 121 is bent, and the folding of the film layer is avoided.
In one embodiment, the second connecting portion 42 is located at least at the edge region, and a separation slit is present between the edge region and the central region of the non-display region 120. By arranging the second connection portion 42 at least at the edge region, the first connection portion 41 and the second connection portion 42 can be electrically connected; by providing the edge region and the central region of the non-display region 120 with a separation slit, and the thickness of the first edge region 1211 of the bending region 121 is greater than the thickness of the first central region 1212, when the bending region 121 is bent, the bending radius of the first edge region 1211 is greater than the bending radius of the first central region 1212, which is helpful for preventing the film layer of the display substrate 100 from wrinkling.
The second connection portion 42 is located at least at the edge region, which means that the second connection portion 42 is located only at the second edge region 1221 of the bonding region 122, or the second connection portion 42 is located at the second edge region 1221 and the second center region 1222 of the bonding region 122. In the embodiment shown in fig. 5 and 6, the second connecting portion 42 is located at the second edge region 1221 and the second center region 1222 of the bonding region 122, and in the embodiment shown in fig. 7, the second connecting portion 42 is located only at the second edge region 1221 of the bonding region 122.
In one embodiment, matrix layer 40 includes a hollowed-out portion located in first central region 1212 of bending region 121. That is, the base layer 40 is not disposed in the first central area 1212 of the bending area 121, so that the thickness of the portion of the display substrate 100 located in the first central area 1212 is smaller, the bending area 121 is easy to bend, and the problem of wrinkling when the film layer is bent is improved. Transparent conductive layer 20 may be formed on base layer 40.
In some embodiments, the base layer 40 is a flexible base layer with high light transmittance, so as to prevent the display substrate 100 from being wrinkled when being bent, and prevent the base layer 40 from affecting the light transmittance of the first display region 111. The material of the base layer 40 may be, for example, an organic material such as polyethylene terephthalate (PET) or Polyimide (PI).
The embodiment of the application also provides a preparation method of the display substrate 100. The preparation method comprises the following steps:
firstly, preparing a display module 30, a transparent conductive layer 20 and a heat dissipation film 10; the display area of the display module 30 includes a first display area and a second display area, and the light transmittance of the first display area is greater than the light transmittance of the second display area. The heat dissipation film 10 includes a conductive material layer 11, and a through hole 101 is formed in the heat dissipation film 10.
Subsequently, the heat dissipation film 10 and the display module 30 are respectively attached to two sides of the transparent conductive layer 20, the through hole 101 is located in the first display area, and the orthographic projection of the transparent conductive layer 20 on the heat dissipation film 10 covers the through hole 101. When the display substrate 100 includes the base layer 40, the heat dissipation film 10 is attached to the transparent conductive layer 20, and the display module 30 is attached to a side of the base layer 40 away from the transparent conductive layer 20.
In some embodiments, the display substrate 100 further includes a non-display region 120, the non-display region 120 includes a bending region 121 and a binding region 122, and the bending region 121 is adjacent to the display region 110 and the binding region 122. The display substrate 100 further includes a first connection portion 41 located in the bending region 121 and a second connection portion 42 located in the bonding region 122, wherein the first connection portion 41 connects the transparent conductive layer 20 and the second connection portion 42.
Attaching the heat dissipation film 10 and the display module 20 to two sides of the transparent conductive layer 20 respectively to obtain an intermediate structure, wherein the preparation method further comprises: bending the part of the middle structure located in the bending region 121, after bending, the binding region 122 is located on the side of the display region 110 away from the display side, and the second connection portion 42 is overlapped with the conductive material layer 11.
For the method embodiment, since it basically corresponds to the embodiment of the product, the description of the relevant details and beneficial effects may refer to the partial description of the product embodiment, and will not be repeated.
The embodiment of the application also provides a display panel. Referring to fig. 8, the display panel 200 includes the display substrate 100 according to any of the embodiments.
The display panel 200 may further include a polarizer 50, where the polarizer 50 is located on a side of the display substrate 100 away from the heat dissipation film 10, and covers the display area of the display substrate 100. The polarizer 50 may reduce the emission rate of the ambient light incident to the display panel 200, which is helpful to improve the user experience.
The display panel 200 may further include a cover plate 60, where the cover plate 60 is located on a side of the polarizer 50 away from the display module 30, and the cover plate 60 may protect the polarizer 50 and the film layers of the display substrate 100. The cover plate 60 may be a glass cover plate.
The embodiment of the application also provides a display device. The display device comprises the display panel 200 and a photosensitive element, wherein the photosensitive element is positioned on one side of the heat dissipation film 10 departing from the display module 30 and is opposite to the first display area 111, and the photosensitive element can emit or receive light through the first display area 111.
The photosensitive element can comprise one or more of a front camera, a face recognition sensor, a distance sensor, an optical fingerprint sensor and the like.
The display device may further include a housing, the photosensitive element may be fixed within the housing, and the display panel 200 may be embedded within the housing.
The display device provided by the embodiment of the application can be any equipment with a display function, such as a mobile phone, a tablet computer, a television, a notebook computer and the like.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element may also be present. Like reference numerals refer to like elements throughout.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (10)
1. The display substrate is characterized by comprising a display area, wherein the display area comprises a first display area and a second display area, and the light transmittance of the first display area is greater than that of the second display area;
the display substrate comprises a heat dissipation film, a transparent conducting layer positioned on one side of the heat dissipation film and a display module positioned on one side of the transparent conducting layer, which is far away from the heat dissipation film;
the heat dissipation film comprises a conductive material layer, and the heat dissipation film covers the display area; the heat dissipation film comprises a through hole penetrating through the heat dissipation film, and the through hole is positioned in the first display area;
and the orthographic projection of the transparent conducting layer on the heat dissipation film covers the through hole.
2. The display substrate of claim 1, wherein the transparent conductive layer is electrically connected to the conductive material layer.
3. The display substrate according to claim 2, further comprising a non-display area, wherein the non-display area comprises a bending area and a binding area, the bending area is adjacent to the display area and the binding area, and the binding area is located on a side of the display area away from the display side; the heat dissipation film is positioned in the display area;
the display substrate further comprises a first connecting part positioned in the bending area and a second connecting part positioned in the binding area, and the first connecting part is connected with the transparent conductive layer and the second connecting part; the second connecting portion is overlapped with the conductive material layer.
4. The display substrate according to claim 3, wherein the first connection portion and/or the second connection portion are formed in the same process step as the transparent conductive layer.
5. The display substrate according to claim 3, wherein the transparent conductive layer covers the display region, or wherein an area of the transparent conductive layer is smaller than an area of the display region.
6. The display substrate according to claim 3, wherein the non-display region comprises an edge region and a central region, and the edge region and the central region are respectively adjacent to the display region; the first connecting portion is located in the edge region.
7. The display substrate of claim 6, wherein the second connecting portion is at least located at the edge region, and a dividing slit is located between the edge region and the central region.
8. The display substrate according to claim 3, wherein the non-display region comprises an edge region and a central region, and the edge region and the central region are respectively adjacent to the display region; the central area comprises a first central area positioned in the bending area;
the display substrate further comprises a base layer located between the display module and the transparent conductive layer, and the base layer comprises a hollow portion located in the first central area.
9. A display panel comprising the display substrate according to any one of claims 1 to 8.
10. A display device, comprising the display panel of claim 9 and a photosensitive element, wherein the photosensitive element is located on a side of the heat dissipation film facing away from the display module and opposite to the first display area, and the photosensitive element can emit or receive light through the first display area.
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| CN202010680007.8A CN111798746A (en) | 2020-07-15 | 2020-07-15 | Display substrate, display panel and display device |
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| CN202010680007.8A CN111798746A (en) | 2020-07-15 | 2020-07-15 | Display substrate, display panel and display device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112419895A (en) * | 2020-11-18 | 2021-02-26 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and display device |
| CN113362724A (en) * | 2021-06-29 | 2021-09-07 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113362723A (en) * | 2021-06-29 | 2021-09-07 | 京东方科技集团股份有限公司 | Display module and display device |
| CN113411939A (en) * | 2021-06-09 | 2021-09-17 | 武汉华星光电技术有限公司 | Display module |
| CN115116335A (en) * | 2022-07-19 | 2022-09-27 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| WO2023142958A1 (en) * | 2022-01-30 | 2023-08-03 | 京东方科技集团股份有限公司 | Display apparatus and display panel |
| WO2023240614A1 (en) * | 2022-06-17 | 2023-12-21 | 京东方科技集团股份有限公司 | Display module and electronic device |
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