KR101655899B1 - Adhesive tape and method for fabricating the same - Google Patents

Abstract

A method for manufacturing a bonding tape and a bonding tape is provided. The bonding tape comprises a substrate and a cushioning pattern layer disposed on one side of the substrate, the cushioning pattern layer including a plurality of fine patterns protruded on one side, and a plurality of fine patterns arranged on one surface of the cushioning pattern layer, Wherein the spacing of the plurality of fine patterns is smaller than the height of the fine pattern exposed to the air layer without penetrating the first bonding layer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bonded tape,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a bonded tape and a method of manufacturing the same. More particularly, the present invention relates to a bonded tape used in electronic equipment and a method of manufacturing the same.

It is increasingly necessary to attach films having functions such as shading in various electronic devices such as mobile terminals such as smart phones and tablet PCs, digital TVs such as LED TVs and OLED TVs, and flexible displays. In the case of mobile terminals, models with shock absorbers attached to protect against external impacts are increasing.

These functions can generally be implemented by attaching various functional tapes. The functional tapes are manufactured by separate processes and have a structure in which a plurality of adhesive layers are integrated. For example, the shock absorber is manufactured through an extrusion process, followed by foaming the absorber, and the light-shielding layer for a light-shielding function is manufactured by a general coating process such as gravure coating. These different processes are difficult to manufacture a plurality of functional layers in a continuous process. In this case, a plurality of release films and the like are required. The release film is used for transferring each functional layer and for separating each functional layer from an external impact or an environmental foreign matter, And then used as a consumable in the process of lamination of each functional layer, which is a major factor in cost increase.

These functional layers can be separately manufactured and then attached to various electronic devices individually. However, in this case, the manufacturing of functional layers is easy, but the manufacturing cost is increased. When applied to electronic devices using the functional layers, there is a problem in that the burden on the quality and manufacturing cost is significantly increased. Also, when individually applied, it is not easy to make the thickness of the parts and / or products thin. For example, thin-walled raw materials are not easy to manufacture, may cause quality problems in manufacturing or assembling processes, and may be deformed due to environmental factors such as heat or moisture, such as shrinkage, expansion, have. Thus, there is a limit to securing thinning, low cost, high quality, and high reliability with current technology.

A problem to be solved by the present invention is to provide a bonding tape having a uniform shock absorbing function.

Another object of the present invention is to provide a method of manufacturing a bonding tape having a uniform shock absorbing function.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a bonding tape comprising a base material, a cushioning pattern layer disposed on one side of the base material, the cushioning pattern layer including a plurality of fine patterns protruded to one side, And a first bonding layer disposed on one side of the pattern layer, the plurality of fine patterns penetrating and bonding at least partially, wherein the interval of the plurality of fine patterns is exposed to the air layer without being infiltrated into the first bonding layer Is smaller than the height of the fine pattern.

According to another aspect of the present invention, there is provided a method of manufacturing a bonding tape, comprising the steps of: providing a composition for a cushioning pattern layer on a substrate; disposing a forming mold on the molding die, Transferring the fine pattern to a composition for a pattern layer, and curing the composition for a cushioning pattern layer.

The details of other embodiments are included in the detailed description and drawings.

According to the embodiment of the present invention, at least the following effects are obtained.

The bonding tape according to the embodiment of the present invention can absorb and recover shocks without a separate foaming process, and it is possible to form a uniform fine pattern by using the established imprint process. Therefore, it is possible to make the degree of shock absorption per position uniform.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

1 is a sectional view of a bonding tape according to an embodiment of the present invention.
2 is a perspective view of the cushioning pattern layer of Fig.
3 is an enlarged view of the area A in Fig.
FIG. 4 is a schematic view for explaining a process of attaching the bonding tape of FIG. 1 to an object to be attached and then absorbing the impact; FIG.
5 is a schematic view of a method of manufacturing a bonding tape according to an embodiment of the present invention.
6 is a perspective view of a cushioning pattern layer of a bonding tape according to another embodiment of the present invention.
7 is a cross-sectional view of a bonding tape according to another embodiment of the present invention.
8 is a cross-sectional view of a bonding tape according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

It is to be understood that elements or layers are referred to as being "on " other elements or layers, including both intervening layers or other elements directly on or in between. On the other hand, a device being referred to as "directly on" refers to not intervening another device or layer in the middle. Like reference numerals refer to like elements throughout the specification. "And / or" include each and any combination of one or more of the mentioned items.

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a sectional view of a bonding tape according to an embodiment of the present invention. 2 is a perspective view of the cushioning pattern layer of Fig. 3 is an enlarged view of the area A in Fig.

1 to 3, the bonding tape 11 according to the present embodiment includes a substrate 110, a cushioning pattern layer 200 disposed on the substrate 110, a cushioning layer 200 disposed on the cushioning pattern layer 200, And a bonding layer (300). A release film may be disposed on the bonding layer 300.

The substrate 110 serves to support the cushioning pattern layer 200, the bonding layer 300, and the like. The substrate 110 may have a uniform thickness. The substrate 110 may be formed of a material selected from the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polymethyl methacrylate (PMMA), polycarbonate (PC), polyvinyl chloride PVC, triacetyl cellulose (TAC), and the like.

A cushioning pattern layer 200 is disposed on one surface of the substrate 110. The cushioning pattern layer 200 is formed so as to cover the entire surface of the substrate 110. The cushioning pattern layer 200 may be formed directly on one side of the substrate 110.

The cushioning pattern layer 200 may include a plurality of fine patterns 210 projected on the relaxation portion 220 and the relaxation portion 220. The lower ends of the fine patterns 210 are connected through the mitigating part 220. The relaxed portion 220 is disposed adjacent to one side of the substrate 110 and the fine pattern 210 is disposed relatively adjacent to the bonding layer 300.

The fine pattern 210 may be, for example, a columnar shape. The top of the fine pattern 210 may be curved. The fine pattern 210 may have a larger width from the upper end to the lower end. If the width of the upper end of the fine pattern 210 is narrow, penetration into the bonding layer 300 is easy. When the width of the lower end is wide, the possibility that the fine pattern 210 is physically broken or broken in the process of receiving the impact is reduced. However, the present invention is not limited thereto, and the fine pattern 210 may be formed in a cylindrical shape having a flat upper end and a width equal to that of the upper end and the lower end. In addition, the fine pattern 210 may have a polygonal columnar shape.

The thickness (height) h1 of the fine pattern 210 may be from 40 to 240 mu m and the thickness h2 of the mitigating portion 220 may be from 10 mu m to 50 mu m. Therefore, the total thickness h3 of the cushioning pattern layer 200 may be 50 to 290 m. The width w of the lower end of the fine pattern 210 may be 25 占 퐉 to 50 占 퐉. The aspect ratio h1 / w of the fine pattern 210 may be in the range of 0.8 to 9.6.

The fine patterns 210 may be arranged at a constant interval d and a pitch p. And may be a lattice or a matrix array arranged along a first direction X and a second direction Y perpendicular to the first direction X. [ It is preferable that the unit fine patterns 210 have an interval that can be supported by the neighboring fine patterns 210 when the unit fine patterns 210 are laid down by an external force. Thus, it is possible to prevent the fine pattern 210 from being excessively laid down and deteriorating the cushioning function. Therefore, it is preferable that the interval d is smaller than the non-penetration height h 5 of the fine pattern 210.

The depth h4 at which the cushioning pattern layer 200 penetrates the bonding layer 300 is about 5 to 25 占 퐉. Therefore, the height at which the fine pattern 210 does not penetrate the bonding layer 300, that is, the minimum value of the non-penetration height h5 is 15 占 퐉, and the maximum value is 235 占 퐉. Therefore, the distance d between the lower ends of the fine patterns 210 that can be sufficiently supported when the fine pattern 210 is laid down on the external force can be equal to or greater than 0 and equal to or less than 235 占 퐉.

The pitch p of the fine patterns 210 may be 25 占 퐉 (when the minimum width 25 占 퐉 is continuously arranged) to 285 占 퐉 (when the maximum width 50 占 퐉 is arranged at the maximum value of the non-penetration height 235 占 퐉 intervals). However, the present invention is not limited thereto, and the fine patterns 210 may be arranged at random.

The ratio of the area occupied by the lower end portion of the fine pattern 210 to the entire plane area of the cushioning pattern layer 200 is set such that the width d of the lower end portion of the fine pattern 210 And the width w of the lower end of the fine pattern 210 is 50 占 퐉 and the pitch p of the fine pattern 210 is 50 占 퐉 and the pitch p of the fine pattern 210 is 50 占 퐉, ) Is 50 m, it can have a maximum value. From this viewpoint, the ratio of the area occupied by the lower end portion of the fine pattern 210 to the entire plane area of the cushioning pattern layer 200 may be 0.79% to 78.5%.

A bonding layer 300 is disposed on the cushioning pattern layer 200. The bonding layer 300 may be made of an adhesive or a pressure-sensitive adhesive. The bonding layer 300 may include a copolymer such as a rubber type, a polyurethane type, a modified silicone type, an acrylic type, or the like. In addition, when the bonding layer 300 includes a urethane-based resin, excellent restoring force and shock absorption function of the bonding layer 300 itself can be further added. The viscosity of the bonding layer 300 may be 10 to 100,000 cps, preferably 500 to 3,000 cps, and more preferably 1,000 to 2,000 cps. The bonding layer 300 may contain metal particles to further perform an electromagnetic wave shielding function, a heat radiation function, and the like. The metal particles may be Ag, Al, BN, Cu, or an alloy thereof, but are not limited thereto. The thickness l of the bonding layer 300 may be 10 to 70 占 퐉, but is not limited thereto.

One side of the bonding layer 300 may be flat.

The fine pattern 210 of the cushioning pattern layer 200 penetrates at least partly into the bonding layer 300 and bonds. The upper end of the fine pattern 210 of the cushioning pattern layer 200 penetrates into the bonding layer 300 and the lower end of the fine pattern 210 or the relaxed portion 220 of the cushioning pattern layer 200 ) Surface may be spaced from the bonding layer 300. An air gap AG may be formed between the surface of the bonding layer 300 and the relaxed portions 220 and 220 of the cushioning pattern layer 200.

In order to ensure a sufficient bonding force, the depth h4 of the cushioning pattern layer 200 penetrating the bonding layer 300 may be 5 to 25 占 퐉. The non-penetration height h5 of the fine pattern 210, that is, the height of the air gap AG may be 15 to 235 m.

In another embodiment, all of the fine patterns 210 of the cushioning pattern layer 200 may penetrate into the bonding layer 300. In this case, the air gap AG will not be generated.

The upper end of the fine pattern 210 may be located at an intermediate portion in the thickness direction of the bonding layer 300 but the upper end of the fine pattern 210 may penetrate to the upper surface of the bonding layer 300 deeply You may.

The cushioning pattern layer 200 has a constant repulsive force and restitution property depending on the shape of the fine pattern 210. The cushioning pattern layer 200 may be made of a restoring resin or an elastic resin in order to lower the repulsive force and improve the stability. Examples of the restoration resin or elastic resin applicable to the cushioning pattern layer 200 include an acrylic resin, a urethane resin, and a silicone resin. However, the present invention is not limited thereto, and other kinds of restoration / elastic resin may be applied, or a material having no resilience or elasticity may be applied to itself.

A release film 120 is disposed on the bonding layer 300. The release film 120 is disposed in close contact with one surface of the bonding layer 300. The release film 120 is peeled off when the bonding tape 11 is used to expose one side of the bonding layer 300. Therefore, the bonding layer 300 and the release film 120 need not be firmly coupled.

As the release film 120, a polymer-coated paper having a silicone release coating, a polyethylene terephthalate (PET) film, a polyethylene-coated PET film, or the like can be applied.

FIG. 4 is a schematic view for explaining a process of attaching the bonding tape of FIG. 1 to an object to be attached and then absorbing the impact; FIG.

Referring to Fig. 4, the bonding tape 11 is attached to the unattached object 600. Fig. The release film 120 is peeled off when the adhesive tape 11 is attached.

An external impact may be applied in a state where the bonding tape 11 is attached to the unattached object 600. [ The external impact may be applied from one side (upper side in the drawing) of the bonding tape 11 or from the other side (lower side in the drawing). In Fig. 4, the case where the impact is applied from the top is shown, but the same operation is performed even when the impact is applied from below.

The fine pattern 210 of the bonding tape 11 in the portion subjected to the external impact is sagged to the side or collapsed in the impact direction (downward in the drawing) to reduce the thickness and absorb the external impact in the process. Since the fine patterns 210 are spaced apart from each other, they can absorb external shocks to a considerable extent even if they fall sideways or collapse to increase the width. Thereafter, when the external impact is removed, the original shape of the fine pattern 210 can be restored. Further, when a plurality of adjacent fine patterns 210 are disposed at intervals of not more than the height of the non-penetrating region of the fine pattern 210 not bonded to the bonding layer 300, the external impact absorbing force and the restoring force can be further increased . It will be understood that the restoration becomes easier when the cushioning pattern layer 200 is made of restorative resin or elastic resin.

When the cushion foam is used as the shock absorber, the pores are generated through the foaming process. Since the pores are randomly formed, it is difficult to expect a uniform shock absorption at each position. In addition, the foaming process is a high temperature process which not only complicates the process itself, but may also affect other layers already deposited.

On the other hand, in the case of this embodiment, shock absorption and restoration can be performed without a separate foaming process, and uniform fine patterns 210 can be formed by using the established imprint process. Therefore, it is possible to make the degree of shock absorption per position uniform.

5 is a schematic view of a method of manufacturing a bonding tape according to an embodiment of the present invention.

5, the manufacturing apparatus used for manufacturing the bonding tape 11 may include a forming mold 410, a composition providing unit 420, and a guide roll 430. [

The forming mold 410 has a surface pattern corresponding to the fine pattern 210. Although a molding mold of a hard mold type is illustrated in the drawings, a molding mold of a soft mold type may be used.

The composition providing part 420 provides a composition for the cushioning pattern layer 200. For example, the substrate 110 may be located at a location proximate to the forming mold to provide a composition for the cushioning pattern layer 200 on the substrate 110 passing through the location. Alternatively, the composition for the cushioning pattern layer 200 may be provided inside the surface engraving pattern of the forming mold 410, and the composition for the cushioning pattern layer 200 may be transferred from the forming mold 410 onto the substrate 110 . Alternatively, a composition for the cushioning pattern layer 200 may be provided both on the base material 110 and inside the surface engraving pattern of the forming mold 410.

The guide roll 430 guides the path through which the substrate 110 moves.

A method of manufacturing the bonding tape 11 using the apparatus for manufacturing a bonding tape 11 will be described.

From the winding roll, the base material 110 is wound and moved to the forming mold 410 side. The composition for the cushioning pattern layer 200 is provided on the substrate 110 in a region where the substrate 110 is close to the molding mold 410. [ The shaping mold 410 transfers the pattern shape of the surface to the composition for the cushioning pattern layer 200 on the substrate 110 disposed adjacent to the shaping mold while rotating in the direction in which the substrate 110 is moved.

Next, the composition for the cushioning pattern layer 200 is cured to form the cushioning pattern layer 200. The manner of curing the composition for the cushioning pattern layer 200 may be appropriately selected depending on the composition. In the drawing, a method of curing using UV is illustrated. This can be effectively applied when the composition for the cushioning pattern layer 200 is a UV curable material or contains a UV curable material. If the composition for the cushioning pattern layer 200 is a thermosetting material, a heat treatment process may be added instead of UV irradiation.

The substrate 110 on which the cushion pattern layer 200 is formed on one side is separated from the molding die 410 while continuing to proceed.

Disposing the bonding layer 300 and / or the release film 120 on the cushioning pattern layer 200 thereafter follows a conventional method well known to those skilled in the art.

The cushioning pattern layer 200 is separated from the molding die 410 after the curing process. However, after the composition for the cushioning pattern layer 200 is dried and separated by the molding die 410 It may be hardened.

Hereinafter, other embodiments of the present invention will be described.

6 is a perspective view of a cushioning pattern layer of a bonding tape according to another embodiment of the present invention.

Referring to FIG. 6, the bonding tape according to the present embodiment is different from the embodiment of FIG. 2 in that the fine pattern 211 of the cushioning pattern layer 200 extends in the first direction X. That is, the fine patterns 211 are arranged in a line type extending in the first direction X without being arranged in an island shape. In this case, the intensity of the fine pattern 211 will increase as compared with the embodiment of FIG. However, in order to absorb shock, the fine pattern 211 differs from the embodiment of FIG. 2 in that the direction in which the fine pattern 211 is tilted in the second direction Y perpendicular to the first direction X is not distinguished .

7 is a cross-sectional view of a bonding tape according to another embodiment of the present invention.

Referring to FIG. 7, the bonding tape 13 according to the present embodiment is different from the embodiment of FIG. 2 in that the base 110 of FIG. 1 and the cushioning pattern layer 200 are integrated. In this embodiment, the fine pattern 211 is formed directly on the base material 111 itself. Therefore, it will be understood that the function will be substantially the same as that of FIG.

8 is a cross-sectional view of a bonding tape according to another embodiment of the present invention. Fig. 8 illustrates that various various functional layers may be additionally disposed on the bonding tape 11 of Fig.

8, the cushioning pattern layer 200, the first bonding layer 300, the electromagnetic wave shielding layer 230, the second bonding layer 310, and the first bonding layer 310 are formed in the direction of one surface of the base 110 The light shielding layer 240, the third bonding layer 320 and the second release film 130 are sequentially arranged on the other surface of the base 110. [

The substrate 110, the cushioning pattern layer 200, and the first bonding layer 300 are substantially the same as the substrate, the cushioning pattern layer, and the bonding layer in Fig. However, there is a difference in that the second bonding layer 310 and the third bonding layer 320 are attached to the outside, not the portion where the first bonding layer 300 is attached to the outside. The bonding tape 14 according to the present embodiment is a double-sided bonded tape. The constituent materials of the first to third bonding layers 300, 310, and 320 may be selected from materials listed in the bonding layer 300 of FIG.

The first release film 120 and the second release film 130 disposed on the surfaces of the second bonding layer 310 and the third bonding layer 320 are substantially the same as the release film 120 of FIG.

The electromagnetic wave shielding layer 230 imparts a function of shielding the electromagnetic wave to the bonding tape 14 and includes an electromagnetic wave shielding structure. The electromagnetic wave shielding structure may include a metal thin film, a metal coating layer, or the like. The metal thin film layer may be made of Cu, Ni, Au, Ag, Zn, Sn, or the like, but is not limited thereto. Instead of the metal thin film layer, CNT, metal nanowire, conductive polymer, graphene, or the like may be applied as a constituent material of the electromagnetic wave shielding layer 230.

The electromagnetic wave shielding layer 230 may have a surface resistivity Max of about 10? /? And a minimum shielding effectiveness of about 60 dB or more. The electromagnetic wave shielding layer 230 may have uniform conductivity on the entire surface.

The light shielding layer 240 serves to shield light from the bonding tape 11, and may include a light shielding material such as a black pigment. Examples of the black pigment include carbon black, CNT, iron oxide, and the like. The light shielding layer 240 may include one or more black pigments. The black pigment ratio in the light-shielding layer 240 may be about 5 to 15% by weight or about 10% by weight based on the total composition of the light-shielding layer 240.

8, the cushioning pattern layer 200 is disposed on one side of the base 110 and the light-blocking layer 240 is disposed on the other side of the base 110. However, the present invention is not limited thereto, May be disposed between the substrate 110 and the cushioning pattern layer 200 to further enhance the light shielding effect by optical characteristics such as light reflection and light refraction of a plurality of cushion patterns.

In another embodiment of the present invention, a color layer representing a different color may be applied in place of the light shielding layer 240, or may be replaced with a heat dissipation layer or the like.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

110: substrate
120: release film
200: cushion pattern layer
210: fine pattern
300: bonding layer

Claims (11)

materials;
A cushioning pattern layer disposed on one surface of the substrate, the cushioning pattern layer including a plurality of fine patterns protruded to one side; And
And a first bonding layer disposed on one side of the cushioning pattern layer and at least partially penetrating and bonding the plurality of fine patterns,
Wherein the spacing of the plurality of fine patterns is smaller than the height of the fine pattern exposed to the air layer without penetrating into the first bonding layer. The method according to claim 1,
Wherein the fine pattern has an upper end width smaller than a lower end width. 3. The method of claim 2,
Wherein the upper end of the fine pattern is a curved surface. 3. The method of claim 2,
And the depth of penetration of the fine pattern into the first bonding layer is from 5 탆 to 25 탆. The method according to claim 1,
The width of the lower end of the fine pattern is 25 占 퐉 to 50 占 퐉,
Wherein the interval between the adjacent fine patterns is greater than 0 and equal to or less than 235 占 퐉. The method according to claim 1,
Wherein the cushioning pattern layer is disposed adjacent to the substrate and further comprises a relaxation portion connecting the lower ends of the plurality of fine patterns. The method according to claim 1,
Wherein the cushioning pattern layer comprises a restoring resin or an elastic resin. The method according to claim 1,
And a release film disposed on the first bonding layer. The method according to claim 1,
An electromagnetic wave shielding layer disposed on one surface of the first bonding layer,
A second bonding layer disposed on one surface of the electromagnetic wave shielding layer,
A first release film disposed on the upper surface of the second bonding layer,
A light-shielding layer disposed on the other surface of the substrate,
A third bonding layer disposed on the other surface of the light shielding layer, and
And a second release film disposed on the other side of the third bonding layer. The method of claim 1,
And a light shielding layer disposed between the substrate and the cushioning pattern layer. Providing a composition for a cushioning pattern layer on a substrate;
Disposing a forming mold having a fine pattern on its surface on the composition for a cushioning pattern layer to transfer the fine pattern to the composition for a cushioning pattern layer;
Curing the composition for a cushioning pattern layer; And
And arranging the bonding layer on the cured cushioning pattern layer of the composition for cushioning pattern layer.

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