JP6809624B1 - Film set for attaching functional layers and insulating film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film set for attaching a functional layer and an insulating film used for the film set for attaching the functional layer, which can cover a functional layer with an excellent coating accuracy on a sticking base material having irregularities. SOLUTION: An insulating film having an insulating layer (release layer 1) and a functional film having a functional layer (protective layer 3) are provided, and unevenness 6 of a sticking base material (electronic component mounting substrate 45) is formed as a functional layer. A film set for attaching a functional layer (film 100 for attaching a protective layer) used for coating with, in which an insulating film and a functional film are laminated with the functional film on the attachment base side. By pushing the functional layer corresponding to the shape of the unevenness, the unevenness is covered with the functional layer, and the insulating layer has a storage elastic modulus of A [MPa] at 100 ° C. in its MD and at 100 ° C. in its TD. When the storage elastic modulus of is B [MPa], A / B is 0.7 or more and 1.3 or less. [Selection diagram] Fig. 3

Description

The present invention relates to a film set for attaching a functional layer and an insulating film.

Conventionally, electronic devices such as mobile phones, smartphones, calculators, electronic newspapers, tablet terminals, videophones, and personal computers have electronic component mounting boards on which electronic components such as semiconductor elements, capacitors, and coils are mounted. Although mounted on a substrate, the electronic component mounting substrate may be sealed with a resin for the purpose of preventing contact with external factors such as moisture and dust.

Such resin sealing is performed by, for example, a potting method in which a substrate on which an electronic component is mounted is placed in a metal cavity and then a thermosetting resin such as a highly fluid urethane resin is injected and sealed, as well as heat. A coating method is known in which a plastic resin is applied to an electronic component mounting substrate in a molten state and then solidified to coat (seal) the applied area.

However, in the potting method, it takes time to cure the thermosetting resin, and further, since a metal cavity is usually required for sealing, there is a problem that the weight of the obtained electronic device is increased. Further, the coating method has a problem that it takes time and labor to control the viscosity of the thermoplastic resin to be in a molten state and to separately coat the coated area of the thermoplastic resin.

For the purpose of solving such a problem, it has been proposed to attach a barrier film having hot melt property to an electronic component mounting substrate as a protective layer (functional layer) (see, for example, Patent Document 1).

However, in this case, the protective layer cannot sufficiently follow the unevenness formed due to the electronic component mounting substrate provided with the electronic component, and as a result, the barrier property against external factors such as moisture and dust is provided. It has not been improved sufficiently.

Therefore, it is conceivable to prepare a film having a protective layer on the base material (insulating layer) and transfer the protective layer from this film to cover the unevenness of the electronic component mounting substrate with the protective layer. However, in this case, there is a problem that the side surface of the electronic component forming the convex portion of the unevenness cannot be covered with excellent covering accuracy. In particular, in the region of the electronic component mounting substrate in which a plurality of electronic components having the same shape are arranged in a grid pattern on the substrate, such a problem becomes more remarkable when the electronic component mounting substrate is coated with the protective layer. It was the fact that it was recognized. In this case, the protective layer (functional layer) is covered with an electronic component mounting substrate including a plurality of electronic components arranged in a grid pattern, and the attachment is provided with irregularities including a configuration in which a plurality of recesses are arranged side by side. The base material is composed.

In addition to the case where the protective layer is attached (transferred) from the film provided on the base material (insulating layer) to the unevenness of the electronic component mounting substrate, the protective layer as a functional layer is also a problem. The same applies to the case where the noise suppression layer (electromagnetic wave shield layer) as the functional layer is attached (transferred) from the film to the unevenness provided on the electronic component mounting substrate.

Japanese Unexamined Patent Publication No. 2009-9417

An object of the present invention is a film set for attaching a functional layer capable of coating a functional layer on a sticking base material having irregularities with excellent coating accuracy, and an insulation used in the film set for attaching the functional layer. To provide the film.

Such an object is achieved by the present invention described in the following (1) to ( 10 ).
(1) A functional layer affixing film set comprising an insulating film having an insulating layer and a functional film having a functional layer, which is used to cover the unevenness of the affixing base material with the functional layer.
A heating temperature of 90 ° C. or higher and 140 ° C. or lower using a vacuum compressed air molding method or a press molding method in a state where the insulating film and the functional film are laminated with the functional film on the side of the base material for attachment. Then, by pushing the functional layer corresponding to the shape of the unevenness, the unevenness is covered with the functional layer.
The insulating layer has an A / B of 0.7 or more when the storage elastic modulus at 100 ° C. in the MD is A [MPa] and the storage elastic modulus at 100 ° C. in the TD is B [MPa]. A film set for attaching a functional layer, which is characterized by being 3 or less.

(2) The insulating layer is composed of a plurality of thermoplastic resins, and among the plurality of the thermoplastic resins, those having the highest melting point among those having a content of more than 10% by weight in the insulating layer. When the melting point is Tm (Max) [° C.] and the melting point of the one having the lowest melting point is Tm (Min) [° C.], Tm (Max) -Tm (Min) is less than 50 ° C. (1). Film set for attaching functional layers as described in.

(3) The film set for attaching a functional layer according to (2) above, wherein the melting point Tm (Min) of the thermoplastic resin having the lowest melting point is 95 ° C. or higher and 160 ° C. or lower .

(4) The film set for attaching a functional layer according to (2) or (3) above, wherein the thermoplastic resin contains a polyolefin resin.

(5) The film set for attaching a functional layer according to any one of (1) to (4) above, wherein the insulating layer has an average thickness of 5 μm or more and 1000 μm or less.

( 6 ) The film set for attaching a functional layer according to any one of (1) to ( 5 ) above, wherein the insulating layer further has a release layer laminated on the surface on the functional film side.

( 7 ) The film set for attaching a functional layer according to ( 6 ) above, wherein the release layer has an average thickness of 5 μm or more and 500 μm or less.

( 8 ) The film set for attaching a functional layer according to any one of (1) to ( 7 ) above, wherein the insulating film and the functional film are integrally formed.

( 9 ) The above-mentioned (1) to ( 8 ), wherein the insulating film is peeled off from the functional film after coating the functional layer on the unevenness of the sticking base material. Film set for attaching functional layers.

( 10 ) An insulating film having an insulating layer.
In order to cover the unevenness of the sticking substrate with the functional layer, it is used together with the functional film having the functional layer.
A heating temperature of 90 ° C. or higher and 140 ° C. or lower using a vacuum compressed air molding method or a press molding method in a state where the insulating film and the functional film are laminated with the functional film on the side of the base material for attachment. Then, by pushing the functional layer corresponding to the shape of the unevenness, it is used when the unevenness is covered with the functional layer.
The insulating layer has an A / B of 0.7 or more when the storage elastic modulus at 100 ° C. in the MD is A [MPa] and the storage elastic modulus at 100 ° C. in the TD is B [MPa]. An insulating film characterized by being 0.3 or less.

According to the film set for attaching the functional layer of the present invention, the functional layer can be coated with excellent coating accuracy on the attachment base material having irregularities. In particular, even if the substrate for attachment has a region in which a plurality of recesses are arranged side by side, such as a region in which a plurality of electronic components are arranged in a grid pattern, the functional layer is excellent for such recesses. It can be coated with the same coating accuracy.

Further, according to the insulating film of the present invention having an insulating layer, it is a sticking base material having a region in which a plurality of recesses are arranged side by side, such as a region in which a plurality of electronic components are arranged in a grid pattern. Even so, for example, in a state where the insulating film and the functional film having the functional layer are laminated on the concave portion with the functional film on the side of the base material for attachment, the functional layer corresponds to the shape of the unevenness. The functional layer can be coated with excellent coating accuracy when pushed in.

It is a vertical cross-sectional view which shows a part of embodiment of the protective layer coating electronic component mounting substrate manufactured by using the film set for attaching a functional layer of this invention. It is a top view which shows the electronic component mounting substrate included in the protective layer coating electronic component mounting substrate shown in FIG. It is a vertical cross-sectional view for demonstrating the manufacturing method which manufactures the protective layer coating electronic component mounting substrate shown in FIG. 1 by using the film set for attaching a functional layer of this invention. FIG. 3B is a plan view showing a state in which the film set for attaching the functional layer of the present invention is arranged on the electronic component mounting substrate.

Hereinafter, the film set for attaching the functional layer and the insulating film of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

In the following, prior to explaining the functional layer attaching film set and the insulating film of the present invention, first, a functional layer attaching film set having a protective layer as a functional layer (the functional layer attaching film set of the present invention) is provided. , A protective layer-coated electronic component mounting substrate manufactured by pasting on an electronic component mounting substrate as a sticking base material will be described.

<Board for mounting electronic components coated with protective layer>
FIG. 1 is a vertical sectional view showing a part of an embodiment of a protective layer-coated electronic component mounting substrate manufactured by using the film set for attaching a functional layer of the present invention, and FIG. 2 is a protective layer-coated electron shown in FIG. It is a top view which shows the electronic component mounting board included in the component mounting board. In the following description, the upper side in FIG. 1, the front side of the paper surface in FIG. 2 is referred to as "upper", the lower side in FIG. 1, and the back side of the paper surface in FIG. 2 are referred to as "lower".

The protective layer-coated electronic component mounting substrate 50 (electronic device) shown in FIG. 1 is composed of a substrate 5, an electronic component 4 mounted (mounted) on the substrate 5, and the substrate 5 and the electronic component 4. It has a protective layer 3 (functional layer) that covers the electronic component mounting substrate 45 on the upper surface side of the substrate 5.

The substrate 5 is a flat plate for supporting the electronic component 4, and its plan view shape is usually a quadrangle such as a square or a rectangle. The substrate 5 includes, for example, sheet-shaped wiring (wiring plate) and resin layers that cover the wiring above and below the sheet, and the wiring is exposed at a position corresponding to the terminal of the electronic component 4. It is composed of a printed wiring board having a part.

Examples of the electronic component 4 include semiconductor elements, capacitors, coils, connectors, resistors, and the like. Such an electronic component 4 is mounted on the substrate 5 in a state where the terminals of the electronic component 4 are electrically connected to the wiring in the exposed portion. Then, in the present embodiment, a plurality of electronic components 4 having the same shape are arranged in a grid pattern (matrix shape) on the substrate 5 in the regions shown in FIGS. 1 and 2.

The electronic component mounting board 45 is composed of the board 5 and the electronic component 4, and in the electronic component mounting board 45, when the electronic component 4 is mounted on the board 5, the convex portion 61 and the concave portion 62 are formed on the board 5. Concavities and convexities 6 are formed (see FIGS. 1, 2, and 3 (a)). In particular, in the regions shown in FIGS. 1 and 2, a plurality of electronic components 4 having the same shape are arranged in a grid pattern on the substrate 5, so that a plurality of recesses 62 formed along the X direction and Y A plurality of recesses 62 formed along the direction are arranged side by side in a state of being orthogonal (intersected at 90 °) at a cross portion 63 in which they overlap.

The protective layer 3 is provided so as to cover the upper surface of the electronic component 4, the side surface of the electronic component 4, and the upper surface of the substrate 5 exposed from the electronic component 4, whereby the electronic component on the substrate 5 is provided. It covers the unevenness 6 formed by mounting the 4. The formation of the protective layer 3 improves the barrier property of the electronic component mounting substrate 45, particularly the electronic component 4, for suppressing or preventing contact with external factors such as moisture and dust. The protective layer 3 is formed by using the film set for attaching the functional layer of the present invention or the insulating film of the present invention, and a detailed description thereof will be given later.

In the present embodiment, the electronic components 4 mounted on the substrate 5 have the same shape in the regions shown in FIGS. 1 and 2, and are arranged in a grid pattern. The electronic component 4 is not limited to the configuration, and for example, in the regions shown in FIGS. 1 and 2, those having different shapes may be randomly arranged, and further, other than the regions shown in FIGS. 1 and 2. Then, those having the same shape may be arranged in a grid pattern, or those having different shapes may be randomly arranged.

(Manufacturing method of board for mounting electronic components coated with protective layer)
The film set for attaching the functional layer of the present invention is used for manufacturing a substrate on which a protective layer-coated electronic component has a structure as described above.

That is, in the film set for attaching the functional layer of the present invention, the unevenness 6 provided on the electronic component mounting substrate 45 as the attachment base material is covered with the protective layer as the functional layer, so that the protective layer-coated electronic component mounting substrate 50 ( It is used for manufacturing electronic components), and more specifically, it includes an insulating film having an insulating layer and a functional film having a protective layer 3 (functional layer), and these insulating films and functional films. The unevenness 6 is covered with the protective layer (functional layer) by pushing the protective layer corresponding to the shape of the unevenness 6 in a state where the functional film (protective layer) is laminated on the electronic component mounting substrate 45 side. It is used to do so. Then, in the present invention, when the storage elastic modulus at 100 ° C. in the MD is A [MPa] and the storage elastic modulus at 100 ° C. in the TD is B [MPa], the A / B is Satisfies the relationship of 0.7 or more and 1.3 or less.

Hereinafter, a method for manufacturing the protective layer-coated electronic component mounting substrate 50 using the film set for attaching the functional layer of the present invention will be described in detail.

FIG. 3 is a vertical sectional view for explaining a manufacturing method for manufacturing the protective layer-coated electronic component mounting substrate shown in FIG. 1 using the film set for attaching the functional layer of the present invention, and FIG. 4 is FIG. 3 (b). ), It is a top view which shows the state which the film set for attaching the functional layer of this invention is arranged with respect to the electronic component mounting substrate. In the following description, the upper side in FIG. 3 and the front side of the paper surface in FIG. 4 are referred to as “upper”, and the lower side in FIG. 3 and the back side of the paper surface in FIG. 4 are referred to as “lower”.

[1] First, an electronic component mounting board 45 on which the electronic component 4 is mounted is prepared on the board 5 (preparation step).

The electronic component mounting substrate 45 mounts the electronic component 4 on the substrate 5 so that the terminals of the electronic component 4 are electrically connected to the wiring in the exposed portion where the wiring of the substrate 5 is exposed from the resin layer. Can be obtained by

In the substrate 5, the exposed portion where the wiring is exposed from the resin layer is formed in the same number as the number of terminals provided in the electronic component 4 corresponding to the position where the electronic component 4 should be mounted, and is formed in the exposed portion. The electronic component 4 is mounted on the substrate 5 by the electrical connection with the terminal of the corresponding electronic component 4.

When the electronic components 4 are mounted on the substrate 5, the electronic components 4 are arranged on the substrate 5 in a grid pattern (matrix shape) in the regions shown in FIGS. 1 and 2. With such an arrangement of the electronic components 4, the side surfaces of the electronic components 4 are exposed between the adjacent electronic components 4 along two directions orthogonal to each other in the X direction (short direction) and the Y direction (longitudinal direction). The recesses 62 are arranged side by side. That is, the plurality of recesses 62 formed along the X direction and the plurality of recesses 62 formed along the Y direction are formed in a state of being orthogonal (intersected at 90 °) at the cross portion 63 where they overlap each other. Will be done.

[2] Next, using the film set for attaching the functional layer of the present invention, the protective layer 3 (functional layer) that covers the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 is formed. Form (protective layer forming step).

In the present embodiment, as the film set for attaching the functional layer of the present invention, the insulating film and the functional film are composed of a release layer 1 (insulation layer) and a protective layer 3, respectively, and the release layer 1 and the protective layer are formed. An example will be described in which a protective layer attaching film 100, which is integrally formed in a state in which 3 and 3 are laminated, is used.

Using this protective layer attaching film 100, the protective layer 3 is formed, for example, by going through the following steps [2-1] and the following steps [2-2].

[2-1] First, as the functional layer attaching film set of the present invention, the above-mentioned protective layer attaching film 100 is prepared, that is, the release layer 1 (insulating layer) and the protective layer laminated on the release layer 1. A film 100 for attaching a protective layer having 3 (functional layer) is prepared (see FIG. 3A), and the electronic component mounting substrate 45 has a surface side (upper surface side) on which the electronic component 4 is mounted on the substrate 5. ), The protective layer affixing film 100 is laminated (attached) to the electronic component 4 with the protective layer 3 on the electronic component 4 side (see FIG. 3C; affixing step).

The method of attaching the protective layer attaching film 100 to the electronic component 4 is not particularly limited, and examples thereof include a vacuum compressed air forming method and a press forming method.

The vacuum pressure air forming method is, for example, a method of covering the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 with the protective layer attaching film 100 using a vacuum pressure type laminator. First, as shown in FIG. 3B, the surface of the electronic component 4 opposite to the substrate 5 and the surface of the protective layer attaching film 100 on the protective layer 3 side in a closed space that can be in a vacuum atmosphere. The electronic component mounting substrate 45 and the protective layer attaching film 100 are set in a state of being overlapped with each other so as to face each other, and then, under heating, the protective layer is uniformly attached from the protective layer attaching film 100 side. This is carried out by creating a vacuum atmosphere in the closed space and then pressurizing the closed space so that the film 100 and the electronic component 4 included in the electronic component mounting substrate 45 are close to each other.

As described above, the release layer 1 pushes the protective layer 3 corresponding to the shape of the recess 62 by uniformly applying pressure from the protective layer sticking film 100 side and creating the closed space in a vacuum atmosphere. At the same time, the protective layer 3 located on the electronic component 4 side of the release layer 1 is deformed according to the shape of the recess 62. As a result, as shown in FIG. 3C, the protective layer 3 is exposed from the upper surface and the side surface of the electronic component 4 and the electronic component 4 in a state where the protective layer 3 is pushed in corresponding to the shape of the recess 62. The upper surface of the substrate 5 is covered.

In this way, the protective layer 3 covers the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4, so that the protective layer-coated electronic component mounting substrate 50 obtained is covered with moisture and dust. It is possible to impart protection (barrier property) that accurately suppresses or prevents contact with external factors such as.

According to the sticking method using the protective layer sticking film 100 (the functional layer sticking film set of the present invention) as described above, the protective layer 3 is pushed by the release layer 1 corresponding to the shape of the recess 62. .. As a result, the upper surface and side surfaces of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 are covered with the protective layer 3 (coating layer).

Here, in the present invention, in the release layer 1 (insulating layer) included in the protective layer attaching film 100, the storage elastic modulus of the release layer 1 at 100 ° C. in the MD is set to A [MPa], and the release layer 1 has a TD. When the storage elastic modulus at 100 ° C. is B [MPa], the relationship that A / B is 0.7 or more and 1.3 or less is satisfied.

On the other hand, as in the conventional case, when the A / B showing the relationship between the storage elastic modulus A and the storage elastic modulus B at 100 ° C. does not satisfy 0.7 or more and 1.3 or less, the vacuum pressure air forming method or the press forming method. In particular, when the electronic component mounting substrate 45 is covered with the protective layer 3 at a heating temperature in a relatively low temperature region as described later, the upper surface and side surfaces of the electronic component 4 and the substrate exposed from the electronic component 4 are exposed. Among the upper surfaces of No. 5, there is a problem that the side surface of the electronic component 4 and the upper surface of the substrate 5 cannot be coated with excellent coating accuracy.

When the present inventor has investigated such a problem, the following contents are factors, and the protective layer 3 can be coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 with excellent coating accuracy. It was speculated that it could not be done.

That is, as shown in FIG. 4, the protective layer attaching film 100 is placed on the electronic component 4 in the Y direction (longitudinal direction) of the electronic component 4 and the protective layer attaching film 100 (release layer 1 (insulating layer)). ) Is generally in the same direction (parallel) with the MD (or TD) because the protective layer attaching film 100 can be used efficiently. Further, the protective layer attaching film 100 (particularly, the release layer 1) that covers the electronic component mounting substrate 45 is unavoidably or intentionally MD (flow direction) and TD (flow) due to the manufacturing method or the like. The draw ratio is different from that of the direction perpendicular to.

In such a state, the protective layer 3 is pushed by the release layer 1 corresponding to the shape of the recess 62 at a heating temperature in a relatively low temperature region as described later by using a vacuum pressure air forming method, a press forming method, or the like. Due to the difference in stretching ratio between the MD (flow direction) and TD (direction perpendicular to the flow) of the protective layer attachment film 100, the storage elastic modulus A [of the release layer 1 in the MD at 100 ° C. The relationship between [MPa] and the storage elastic modulus B [MPa] at 100 ° C. in the TD of the release layer 1 does not satisfy A / B of 0.7 or more and 1.3 or less, and as a result, the Y direction (longitudinal direction). ), The recess 62 along the X direction (short direction), and the cross portion 63 on which these recesses 62 overlap each other, there is a difference in the pushing speed of the protective layer 3.

More specifically, when a vacuum pressure air forming method, a press forming method, or the like is used as the heating temperature in a relatively low temperature region as described later, for example, in the release layer 1, the MD stretching ratio is higher than the TD stretching ratio. In the case, the pushing speed (Y direction) of the release layer 1 in the recess 62 along the Y direction (longitudinal direction) and the pushing speed (X direction) of the release layer 1 in the recess 62 along the X direction (short direction). The pushing speed of the peeling layer 1 in the cross portion 63 (cross portion 63) is the pushing speed (peeling layer 1, cross portion 63)> pushing speed (peeling layer 1, X direction)> pushing speed (peeling layer 1, Y). A speed difference that satisfies the relationship of speeds (directions) will occur.

Therefore, with respect to the protective layer 3 pushed into the recess 62 by the release layer 1, the pushing speed (Y direction) of the protective layer 3 in the recess 62 along the Y direction (longitudinal direction) and the X The pushing speed of the protective layer 3 in the recess 62 along the direction (short direction) (X direction) and the pushing speed of the protective layer 3 in the cross 63 (cross 63) are the pushing speeds (protective layer 3, cross). Part 63)> Pushing speed (protective layer 3, X direction)> Pushing speed (protective layer 3, Y direction), a speed difference satisfying the relationship of speed is generated.

Therefore, the protective layer 3 pushed by the release layer 1 corresponding to the shape of the recess 62 has the cross portion 63, the recess 62 along the X direction (short direction) and the Y direction (with respect to the bottom of the recess 62). It reaches in the order of the recesses 62 along the longitudinal direction). Therefore, the protective layer 3 that has previously arrived at the cross portion 63 spreads with respect to the recess 62 along the Y direction (longitudinal direction), which is the slowest to reach, and the protective layer 3 floats. In the recess 62 located in the peripheral portion of the cross portion 63, a clear protrusion of the protective layer 3 was observed, and as a result, the protective layer 3 was excellently coated on the side surface of the electronic component 4 and the upper surface of the substrate 5. It was speculated that it would not be possible to cover with precision.

As described above, when the protective layer 3 is pushed in corresponding to the shape of the recess 62 by pushing the release layer 1 using a vacuum pressure air forming method, a press molding method, or the like as the heating temperature in a relatively low temperature region as described later. In addition, it was presumed that the protective layer 3 could not be coated with excellent coating accuracy due to the anisotropy between the MD and TD of the release layer 1, but the present inventor of the present invention has such a point. As a result of further investigation, the difference in speed when pushing the protective layer 3 due to the anisotropy between the MD and TD of the release layer 1 is the storage elastic modulus of the release layer 1 (insulating layer) in the MD. It was found that the storage elastic modulus of the release layer 1 in TD is closely related. In particular, when the storage elastic modulus of the release layer 1 in MD at 100 ° C. is A [MPa] and the storage elastic modulus of the release layer 1 in TD at 100 ° C. is B [MPa], A / B is 0. The present inventor has found that the anisotropy between MD and TD of the release layer 1 is improved by satisfying the relationship of 7 or more and 1.3 or less. As a result, the anisotropy between MD and TD of the protective layer 3 is also improved, so that the pushing speed of the protective layer 3 and the peeling layer 1 (Y direction) and the pushing speed of the protective layer 3 and the peeling layer 1 (X). Since the direction) can be set to be substantially equal to the above-mentioned speed, the relationship between the speeds described above is as follows: pushing speed (protective layer 3 and peeling layer 1, cross 63)> pushing speed (protective layer 3 and peeling layer 1, X direction). It is possible to satisfy the relationship of ≈ pushing speed (protective layer 3 and peeling layer 1, Y direction). Therefore, the spread of the protective layer 3 that has previously arrived at the cross portion 63 is spread with respect to both the recess 62 along the Y direction (longitudinal direction) and the recess 62 along the X direction (short direction). Since it can be suppressed to the same extent, the protective layer 3 can be coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 with excellent coating accuracy.

The width of the recess 62 is preferably set to 0.05 mm or more and 1 mm or less, more preferably 0.1 mm or more and 0.5 mm or less, and the depth thereof is preferably 0.1 mm or more and 3 mm or less, more preferably 0. It is set to .5 mm or more and 1 mm or less. According to the present invention, the protective layer 3 can be coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 with excellent coating accuracy even for the recess 62 having such a width and depth. ..

Further, the press molding method is a state in which, for example, a protective layer affixing film 100 is arranged on an electronic component 4 mounted on a substrate 5, and a cushion material is further arranged on the protective layer affixing film 100. Then, these are held by two flat plates from the upper surface side and the lower surface side thereof, and then the two flat plates are brought close to each other and pressed.

In this way, the release layer 1 corresponds to the shape of the recess 62 even when the protective layer affixing film 100 and the electronic component 4 are brought close to each other with the cushioning material arranged on the protective layer affixing film 100. The protective layer 3 is pushed in, and the protective layer 3 located closer to the electronic component 4 than the release layer 1 can be deformed according to the shape of the recess 62 in accordance with the pushing. Therefore, as shown in FIG. 3C, the protective layer 3 is exposed from the upper surface and the side surface of the electronic component 4 and the electronic component 4 in a state where the protective layer 3 is pushed in corresponding to the shape of the recess 62. The upper surface of the substrate 5 can be covered.

In the pasting step [2-1] using the vacuum compressed air molding method or the press molding method as described above, the sticking temperature is relatively low when the protective layer sticking film 100 having the above-mentioned structure is used. It is set in the temperature range, and specifically, it is preferably 90 ° C. or higher and 140 ° C. or lower, more preferably 100 ° C. or higher and 130 ° C. or lower, and further preferably 110 ° C. or higher and 120 ° C. or lower. By setting the heating temperature of the protective layer attaching film 100 when the vacuum compressed air molding method or the press molding method is used within the above range, the protective layer 3 is provided to the side surface of the electronic component 4 and the upper surface of the substrate 5. It can be coated with excellent coating accuracy.

The pressure for sticking is not particularly limited, but is preferably 0.1 MPa or more and 30.0 MPa or less, and more preferably 0.5 MPa or more and 25.0 MPa or less.

Further, the sticking time is not particularly limited, but is preferably 5 seconds or more and 90 minutes or less, and more preferably 30 seconds or more and 10 minutes or less.

By setting the conditions in the sticking process within the above range, the protective layer 3 is pushed into the recess 62 between the adjacent electronic components 4, and the protective layer 3 is used to cover the upper surface and the side surface of the electronic component 4 and the side surface thereof. , The upper surface of the substrate 5 exposed from the electronic component 4 can be coated with excellent coating accuracy.

In the protective layer attaching film 100 as described above, the release layer 1 follows the shape of the recess 62 and pushes the protective layer 3 into the upper surface and side surfaces of the electronic component 4 and the electronic component 4 as described above. When covering the upper surface of the substrate 5 exposed from the surface, the protective layer 3 is pushed in and functions as a protective (cushioning) material for preventing the pushed-in protective layer 3 from breaking. Further, in the next step [2-2], the protective layer 3 is peeled off.

In the present invention, the release layer 1 has an A / B of 0 when the storage elastic modulus at 100 ° C. in MD is A [MPa] and the storage elastic modulus at 100 ° C. in TD is B [MPa]. Satisfies the relationship of 0.7 or more and 1.3 or less. As a result, as described above, the protective layer 3 can be coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 with excellent coating accuracy.

As the constituent material of such a release layer 1, A / B showing the relationship between the storage elastic coefficient A and the storage elastic coefficient B at 100 ° C. can be set within the range of 0.7 or more and 1.3 or less. For example, the present invention is not particularly limited, and for example, an olefin polymer such as polyethylene, polypropylene, polymethylpentene, or an olefin such as ethylene having ethylene, propylene, butene, penten, hexene, methylpentene or the like as a copolymer component ( Examples thereof include copolymers with meth) acrylic acid esters, olefin-based copolymers such as copolymers of ethylene and vinyl acetate, and thermoplastic resins such as engineering plastics-based resins such as polyether sulfone and polyphenylene sulfide. , One or a combination of two or more of these can be used. Among these, a thermoplastic resin having a melting point of 90 ° C. or higher is preferable, and an olefin resin having a melting point of 95 ° C. or higher is more preferable. As a result, the release layer 1 can be surely satisfied with the relationship that the A / B is 0.7 or more and 1.3 or less.

Further, when the above-mentioned material is used as the constituent material of the release layer 1, the melting point of the one having the highest melting point among those having a content exceeding 10% by weight in the release layer 1 is Tm (Max) [. ℃], and when the melting point of the one having the lowest melting point is Tm (Min) [° C], it is preferable that Tm (Max) -Tm (Min) is less than 50 ° C. It is more preferable that the temperature is 50 ° C. or higher and lower than 30 ° C., and it is even more preferable that the temperature is 20 ° C. or higher and lower than 30 ° C. As a result, the release layer 1 can be more reliably satisfied with the relationship in which the A / B is 0.7 or more and 1.3 or less. Therefore, the protective layer 3 can be reliably coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 with excellent coating accuracy.

Further, in this case, among the thermoplastic resins having a content of more than 10% by weight in the release layer 1, the thermoplastic resin having the lowest melting point preferably has a melting point Tm (Min) of 90 ° C. or higher. Although it is selected, it is more preferably 95 ° C. or higher and 160 ° C. or lower, and further preferably 95 ° C. or higher and 125 ° C. or lower. By using a thermoplastic resin having a melting point of Tm (Min) as described above as a thermoplastic resin having the lowest melting point, the above (Tm (Max) -Tm (Min)) can be relatively easily obtained at 50 ° C. It can be set to have a size less than. Therefore, the protective layer 3 can be reliably coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 with excellent coating accuracy.

Specific examples of the constituent material of the release layer 1 having the highest melting point Tm (Max) and the constituent material (thermoplastic resin) of the peeling layer 1 having the lowest melting point Tm (Min) include, for example. A combination of random polypropylene (r-PP) with a melting point of 142 ° C. and linear low-density polyethylene (LLDPE) with a melting point of 115 ° C., random polypropylene (r-PP) with a melting point of 139 ° C. and a direct melting point of 115 ° C. Combination with chain low density polyethylene (LLDPE), combination of random polypropylene (r-PP) with a melting point of 142 ° C. and linear low density polyethylene (LLDPE) with a melting point of 93 ° C., random polypropylene with a melting point of 132 ° C. A combination of (r-PP) and linear low-density polyethylene (LLDPE) having a melting point of 115 ° C., random polypropylene (r-PP) having a melting point of 127 ° C. and linear low-density polyethylene (LLDPE) having a melting point of 115 ° C. ), A combination of linear low-density polypropylene (LLDPE) with a melting point of 124 ° C. and linear low-density polypropylene (LLDPE) with a melting point of 115 ° C. LLDPE) and linear low-density polyethylene (LLDPE) having a melting point of 113 ° C., random polypropylene (r-PP) having a melting point of 142 ° C. and ethylene-methylmethacrylate copolymer (EMMA) having a melting point of 101 ° C. Combinations and the like can be mentioned. By using a combination of the constituent materials of the release layer 1 as described above, which satisfies the condition that (Tm (Max) −Tm (Min)) is less than 50 ° C., the size of the A / B can be ensured. It can be set within the range of 0.7 or more and 1.3 or less. Therefore, the protective layer 3 can be reliably coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 with excellent coating accuracy.

When it is satisfied that the above (Tm (Max) -Tm (Min)) is less than 50 ° C., the constituent material contained in the release layer 1 is 10% by weight or less. , The one having a melting point higher than that of Tm (Max) may be included, or the one having a melting point lower than that of Tm (Min) may be contained. Even if such a constituent material is contained in the release layer 1, the constituent material of the release layer 1 having the highest melting point Tm (Max) and the constituent material of the release layer 1 having the lowest melting point Tm (Min) The size of the A / B can be set within the range of 0.7 or more and 1.3 or less by appropriately selecting the combination of.

The average thickness of the release layer 1 is not particularly limited, but is preferably 5 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and further preferably 200 μm or more and 350 μm or less. As a result, the above-mentioned function as the release layer 1 can be surely exhibited.

Further, as described above, the release layer 1 has a relationship A / B between the storage elastic modulus A [MPa] at 100 ° C. in its MD and the storage elastic modulus B [MPa] at 100 ° C. in TD of 0. It suffices to satisfy 7.7 or more and 1.3 or less, but preferably 0.75 or more and 1.20 or less, and more preferably 0.85 or more and 1.15 or less. As a result, the protective layer 3 can be coated on the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 with better coating accuracy.

Further, the storage elastic modulus A [MPa] of the release layer 1 in the MD at 100 ° C. is preferably 1 MPa or more and 1000 MPa or less, more preferably 10 MPa or more and 500 MPa or less, and 50 MPa or more and 300 MPa or less. More preferred. When the relationship that A / B is 0.7 or more and 1.3 or less is satisfied, the storage elastic modulus A [MPa] is set within the above range, so that A / B is 0.7 or more and 1.3 or less. The effect obtained when satisfying the relationship can be exerted more remarkably.

The storage elastic modulus A and the storage elastic modulus B of the release layer 1 can be obtained by using, for example, a dynamic viscoelasticity measuring device (“DMS6100” manufactured by SII Nanotechnology Co., Ltd.).

Further, in the protective layer attaching film 100, in the present embodiment, the insulating film and the functional film are integrally formed, and the insulating film is further composed of a single layer of the release layer 1 as the insulating layer. The insulating layer constituting the insulating film is provided on the upper surface (the surface opposite to the protective layer 3) and the lower surface (the surface on the protective layer 3 side) of the release layer 1, respectively. It may be composed of a laminated body including at least one of a first release layer and a second release layer.

The first release layer is used in the pressing portion or the press molding method used in the vacuum compressed air molding method when the protective layer 3 is pushed into the unevenness 6 on the electronic component mounting substrate 45 in this step [2-1]. This is for surely imparting the function of releasability from the flat plate by the protective layer attaching film 100. Further, it is for propagating the pressing force from the pressing portion or the flat plate to the release layer 1 side.

Further, in the second release layer, the protective layer 3 is pushed into the unevenness 6 on the electronic component mounting substrate 45 in the main step [2-1], and then the peeling layer 1 is peeled off in the next step [2-2]. This is for surely imparting the function of releasability from the protective layer 3 by the protective layer attaching film 100. Further, in this step [2-1], the second release layer has a followability function to follow according to the uneven shape on the electronic component mounting substrate 45, and is pressed against the release layer 1. It is for propagating the pressing force from the part or the flat plate.

Examples of the constituent materials of the first release layer and the second release layer include resin materials such as syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, polyethylene, cyclic olefin polymer, and silicone. Be done. Further, when the constituent material of the release layer 1 satisfies the above (Tm (Max) -Tm (Min)) of less than 50 ° C., the lowest melting point Tm (Min) or more and the highest melting point Tm A material having a melting point of (Max) or less can also be used as a constituent material of the first release layer and the second release layer. By using a constituent material such as these, the functions as the first release layer and the second release layer can be surely exhibited.

The average thickness of the first release layer and the second release layer is not particularly limited, but is preferably 5 μm or more and 500 μm or less, and more preferably 20 μm or more and 100 μm or less. As a result, the functions of the first release layer and the second release layer described above can be reliably exerted in each of the first release layer and the second release layer.

In the present embodiment, the protective layer 3 (functional layer) is provided so as to cover the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4.

The protective layer 3 is a barrier that suppresses or prevents contact between the electronic component mounting substrate 45, particularly the electronic component 4, and the electronic component mounting substrate 45 (electronic component 4) from the upper surface side with external factors such as moisture and dust. It has a function of imparting properties to the protective layer-coated electronic component mounting substrate 50.

Such a protective layer 3 is composed of a resin material as a main material, and the resin material is not particularly limited as long as it has a barrier property against external factors such as moisture and dust. For example, thermosetting resins such as epoxy resin, phenol resin, amino resin, unsaturated polyester resin, thermosetting elastomer, acrylic resin, polyester resin, vinyl chloride resin, styrene resin, styrene thermoplastic elastomer, olefin heat. Examples thereof include thermoplastic resins such as thermoplastic elastomers such as thermoplastic elastomers, and one or a combination of two or more of these can be used.

The average thickness of the protective layer 3 is not particularly limited, but is preferably 1 μm or more and 300 μm or less, and more preferably 2 μm or more and 100 μm or less.

[2-2] Next, as shown in FIG. 3D, the release layer 1 (insulating layer) is peeled from the protective layer attaching film 100 attached to the electronic component 4.

That is, after the protective layer 3 is formed on the electronic component mounting substrate 45 using the protective layer attaching film 100, the release layer 1 is peeled from the protective layer 3.

In the peeling of the peeling layer 1, peeling occurs at the interface between the peeling layer 1 and the protective layer 3 in the protective layer attaching film 100, and as a result, the peeling layer 1 is peeled from the protective layer 3. As a result, the protective layer-coated electronic component is mounted in which the upper surface and side surfaces of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 are covered by the protective layer 3 with the release layer 1 peeled from the protective layer 3. The substrate 50 can be obtained.

The method of peeling the peeling layer 1 is not particularly limited, but for example, manual peeling is preferable.

In this manual peeling, for example, one end of the peeling layer 1 is first gripped, the peeling layer 1 is peeled from the protective layer 3 from the gripped end, and then further from this end to the central part. Separates the release layer 1 from the protective layer 3 by sequentially peeling the release layer 1 to the other end.

The peeling temperature is preferably 180 ° C. or lower, more preferably 165 ° C. or lower, and further preferably 150 ° C. or lower.

By going through the steps [2-1] and [2-2] as described above, in a state where the release layer 1 is peeled from the protective layer 3, the upper surface and side surfaces of the electronic component 4 and the electrons are formed by the protective layer 3. It is possible to obtain a protective layer-coated electronic component mounting substrate 50 in which the upper surface of the substrate 5 exposed from the component 4 is coated.
Through the above steps, the protective layer-coated electronic component mounting substrate 50 is manufactured.

In the present embodiment, the electronic components 4 mounted on the substrate 5 have a cross portion 63 formed by arranging electronic components 4 having the same shape in a grid pattern in the regions shown in FIGS. 1 and 2. The protective layer 3 is pushed into the recess 62 having the same structure, and according to the present invention, the protective layer 3 is also excellent against the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed in the recess 62 having such a configuration. Although it has been explained that coating can be performed with coating accuracy, the configuration of the recess into which the protective layer 3 can be pushed is not limited to the recess 62 having the cross portion 63 as described above by applying the present invention. Absent. That is, the recess may be formed by randomly arranging electronic components 4 having different shapes, and according to the present invention, the recess has a fine shape such as a recess 62 having a cross portion 63. The protective layer 3 can be coated with excellent coating accuracy. Therefore, the protective layer 3 can be coated with excellent coating accuracy even on the recesses 62 formed by being randomly arranged.

The film set for attaching the functional layer of the present invention has been described above, but the present invention is not limited thereto.

For example, in the above-described embodiment, the electronic component mounting substrate 45 having the unevenness 6 as the attachment base material is protected by covering the protective layer 3 as the functional layer with the film set for attaching the functional layer of the present invention. The case of obtaining the layer-coated electronic component mounting substrate 50 has been described, but the present invention is not limited to this, and the film set for attaching the functional layer of the present invention has a functional film having an electromagnetic wave shielding layer as the functional layer. The functional film set having the configuration may be used to push the electromagnetic wave shield layer corresponding to the uneven shape of the sticking substrate.

Further, in the above-described embodiment, when the protective layer 3 is formed on the electronic component mounting substrate 45 provided with the unevenness 6 by using the film set for attaching the functional layer of the present invention, the insulation composed of the release layer 1 (insulating layer) is formed. The case where the protective layer attaching film 100, which is integrated by laminating the film and the functional film composed of the protective layer 3 (functional layer) in the thickness direction, is used as a film set has been described, but the film set used is such. The structure is not limited to that. For example, an insulating film composed of a release layer 1 (insulating layer) and a functional film composed of a protective layer 3 (functional layer) are provided as separate bodies, and these are superposed. It may be a film set to be used.

Further, in the above embodiment, the case where the protective layer 3 is formed on almost the entire surface of the unevenness 6 provided on the electronic component mounting substrate 45 by using the film set for attaching the functional layer of the present invention has been described. The region to be formed is not limited to almost the entire surface of the unevenness 6, and may be a part of the unevenness 6. In this way, when a part of the unevenness 6 is covered with the protective layer 3, a film set for attaching the functional layer in which the protective layer 3 is selectively formed corresponding to the region where the protective layer 3 should be formed is formed. By pushing the protective layer 3 into the unevenness 6 in a state where the protective layer 3 is prepared and arranged so as to correspond to such a region, a part of the unevenness 6 can be selectively covered with the protective layer 3.

Further, in the present invention, the insulating film having such an insulating layer (release layer) has a storage elastic modulus at 100 ° C. in its MD as A [MPa] and a storage elastic modulus in its TD at 100 ° C. as B [MPa]. ], The A / B is 0.7 or more and 1.3 or less. As a result, when this insulating film is used as, for example, a release layer of the protective layer attaching film 100, the protective layer 3 is excellent with respect to the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62. It can be coated with coating accuracy. In addition to using the insulating film having an insulating layer as a release layer of the protective layer attaching film 100, for example, laminating a functional film on the insulating film is omitted, and this insulating film is used alone as a base material for attaching. By pushing the insulating layer corresponding to the shape of the unevenness in the laminated state, it can also be used for applications such as covering the unevenness with the insulating layer.

Further, since the same materials and methods as those for the release layer 1 can be used for the structure and manufacturing method of the insulating film, the description contents of the release layer 1 are applied mutatis mutandis.

Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited thereto.

<Example 1>
1. 1. Production of Film for Attaching Protective Layer First, first and second release layers are formed in order to obtain a laminate in which the first release layer and the second release layer are laminated on the upper surface and the lower surface of the release layer 1, respectively. Random polypropylene (r-PP, melting point: 132 ° C., manufactured by Sumitomo Chemical Co., Ltd., trade name: S313) was prepared as a resin material for this purpose. Further, as a resin material for forming the release layer 1, linear low-density polyethylene (LLDPE, melting point: 115 ° C., manufactured by Nippon Polyethylene Co., Ltd., trade name: LF280H) having the lowest melting point Tm (Min). A mixture containing 50% by weight of random polypropylene (r-PP, melting point: 142 ° C., manufactured by Nippon Polypro Co., Ltd., trade name: EG7FTB) as having the highest melting point Tm (Max) was prepared.

Next, the prepared resin materials for forming the first release layer, the release layer 1 and the second release layer are formed into a film by coextrusion using a feed block and a multi-manifold die to form the first release layer. A laminate in which the mold layer, the release layer 1 and the second release layer were laminated in this order was obtained.

Further, as a resin material (liquid material) for forming the protective layer 3, an epoxy resin (manufactured by DIC, trade name: EPICRON N-670) is 22 parts by weight, and an acrylic rubber (manufactured by Nagase ChemteX, trade name: A solvent containing 22 parts by weight of SG-708-6), 11 parts by weight of a phenol novolac resin (manufactured by Sumitomo Bakelite, trade name: PR-HF-3), and methyl ethyl ketone as a solvent was prepared.

Next, the protective layer 3 is formed by applying a resin material for forming the protective layer 3 to the delivered laminated body between the delivery roller and the take-up roller and then drying the resin material. A sticking film 100 was produced.

In the obtained film 100 for attaching the protective layer, the thickness of the release layer 1 was 300 μm, and the average thickness of the protective layer 3 was 40 μm.

Further, with respect to the protective layer attaching film 100, the storage elastic modulus A of MD and the storage elastic modulus B of TD at 100 ° C. are measured by using a dynamic viscoelasticity measuring device (“DMS6100” manufactured by SII Nanotechnology Co., Ltd.). It was 105 MPa and 100 MPa, respectively.

2. 2. Manufacture of Electronic Component Mounting Board with Recesses In order to obtain the electronic component mounting board 45 with recesses 62, it was first formed by sealing a FR4 substrate (glass fiber cloth with a cured product of epoxy resin). By arranging Si substrates (pseudo-electronic components) with a length of 5 mm, a width of 10 mm, and a thickness of 0.8 mm on a pseudo-wiring board) in a grid pattern so that the separation distance between adjacent Si substrates is 0.2 mm. An electronic component mounting board 45 was obtained.

3. 3. Evaluation The produced film 100 for attaching the protective layer was evaluated as follows using the electronic component mounting substrate 45 provided with the recess 62.

The film 100 for attaching the protective layer is placed on the electronic component mounting substrate 45 provided with the recess 62, and the longitudinal direction of the protective layer attaching film 100 (release layer 1) is parallel to the longitudinal direction of the electronic component mounting substrate 45. Arranged as.

Next, using a vacuum pressurizing laminator, the pressure is applied under the conditions of a pressure of 13 MPa, a temperature of 115 ° C., and a time of 240 seconds so that the protective layer attaching film 100 and the electronic component mounting substrate 45 come close to each other in a vacuum atmosphere. By attaching the protective layer attaching film 100 to the electronic component mounting substrate 45, the protective layer 3 provided in the protective layer attaching film 100 can correspond to the shape of the recess 62 provided in the electronic component mounting substrate 45. I pushed it into.

Next, the release layer 1 was peeled off from the protective layer attachment film 100 attached to the electronic component mounting substrate 45 by holding one end of the release layer 1.

Then, with respect to the protective layer 3 pushed in so as to correspond to the shape of the recess 62, the coating accuracy of the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria shown below.

[Evaluation criteria]
⊚: The protective layer 3 can be covered up to the bottom of the recess 62.
No protrusions due to floating from the bottom of the recess 62 of the protective layer 3 are observed.
◯: Although the protective layer 3 can be covered up to the bottom of the recess 62,
A slight protrusion of the protective layer 3 is observed around the cross portion 63.
X: The protective layer 3 can be covered up to the bottom of the recess 62,
Due to the floating of the protective layer 3 from the bottom of the recess 62 in the peripheral portion of the cross portion 63.
Obvious protrusions are observed.

<Examples 2 to 10, Comparative Examples 1 to 3>
Among the resin materials for forming the first and second release layers and the resin material for forming the release layer 1, the resin material has the highest melting point Tm (Max) and the lowest melting point Tm (Min). The protective layer 3 is provided in the recess provided in the electronic component mounting substrate 45 in the same manner as in the first embodiment, except that at least one of those contained as the resin material is changed to the one shown in Table 1. After pushing in so as to correspond to the shape of 62, the release layer 1 was peeled from the protective layer attaching film 100.

Then, in each of Examples 2 to 10 and Comparative Examples 1 to 3, the accuracy of covering the bottom of the recess 62 of the protective layer 3 pushed into the recess 62 was visually observed, and the results were observed as described above. Evaluation was made based on the evaluation criteria.
The results of these evaluations are shown in Table 1.

As shown in Table 1, in each example, the relationship A / B between the storage elastic modulus A [MPa] of the release layer 1 in MD at 100 ° C. and the storage elastic modulus B [MPa] at 100 ° C. in TD. Satisfied with 0.7 or more and 1.3 or less, and as a result, no obvious protrusion due to the floating of the concave portion 62 of the protective layer 3 from the bottom was observed, and the protective layer 3 was superior to the concave portion 62. It was clarified that it can be coated with the same coating accuracy.

On the other hand, in the comparative example, the A / B does not satisfy 0.7 or more and 1.3 or less, and as a result, a clear protrusion caused by the floating of the concave portion 62 of the protective layer 3 from the bottom is formed. As a result, the protective layer 3 could not be coated on the recess 62 with excellent coating accuracy.

1 Peeling layer 3 Protective layer 4 Electronic component 5 Substrate 6 Concavo-convex 45 Electronic component mounting board 50 Protective layer coated electronic component mounting board 61 Convex part 62 Concave part 63 Cross part 100 Protective layer attachment film

Claims (10)

A functional layer affixing film set comprising an insulating film having an insulating layer and a functional film having a functional layer, which is used to cover the unevenness of the affixing base material with the functional layer.
A heating temperature of 90 ° C. or higher and 140 ° C. or lower using a vacuum compressed air molding method or a press molding method in a state where the insulating film and the functional film are laminated with the functional film on the side of the base material for attachment. Then, by pushing the functional layer corresponding to the shape of the unevenness, the unevenness is covered with the functional layer.
The insulating layer has an A / B of 0.7 or more when the storage elastic modulus at 100 ° C. in the MD is A [MPa] and the storage elastic modulus at 100 ° C. in the TD is B [MPa]. A film set for attaching a functional layer, which is characterized by being 3 or less. The insulating layer is composed of a plurality of thermoplastic resins, and the melting point of the plurality of thermoplastic resins having the highest melting point among those having a content of more than 10% by weight in the insulating layer is Tm. The function according to claim 1, wherein Tm (Max) -Tm (Min) is less than 50 ° C. when (Max) [° C.] and the melting point of the one having the lowest melting point is Tm (Min) [° C.]. Film set for layer attachment. The film set for attaching a functional layer according to claim 2, wherein the melting point Tm (Min) of the thermoplastic resin having the lowest melting point is 95 ° C. or higher and 160 ° C. or lower . The film set for attaching a functional layer according to claim 2 or 3, wherein the thermoplastic resin contains a polyolefin resin. The film set for attaching a functional layer according to any one of claims 1 to 4, wherein the insulating layer has an average thickness of 5 μm or more and 1000 μm or less. The film set for attaching a functional layer according to any one of claims 1 to 5 , wherein the insulating layer further has a release layer laminated on the surface on the functional film side. The film set for attaching a functional layer according to claim 6 , wherein the release layer has an average thickness of 5 μm or more and 500 μm or less. The film set for attaching a functional layer according to any one of claims 1 to 7 , wherein the insulating film and the functional film are integrally formed. The functional layer for sticking according to any one of claims 1 to 8 , wherein the insulating film is peeled off from the functional film after coating the functional layer on the unevenness of the sticking base material. Film set. An insulating film having an insulating layer
In order to cover the unevenness of the sticking substrate with the functional layer, it is used together with the functional film having the functional layer.
A heating temperature of 90 ° C. or higher and 140 ° C. or lower using a vacuum compressed air molding method or a press molding method in a state where the insulating film and the functional film are laminated with the functional film on the side of the base material for attachment. Then, by pushing the functional layer corresponding to the shape of the unevenness, it is used when the unevenness is covered with the functional layer.
The insulating layer has an A / B of 0.7 or more when the storage elastic modulus at 100 ° C. in the MD is A [MPa] and the storage elastic modulus at 100 ° C. in the TD is B [MPa]. An insulating film characterized by being 0.3 or less.

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