JP6705535B1 - Film set for attaching functional layers and insulating film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film set for sticking a functional layer capable of covering a sticking substrate having irregularities with a functional layer with excellent covering accuracy. A functional layer-adhering film set of the present invention includes an insulating film having an insulating layer and a functional film having a functional layer, and is used for coating the unevenness of a sticking base material with the functional layer. That is, the insulating film and the functional film, in a state in which the functional film is laminated on the sticking substrate side, by pressing the functional layer corresponding to the shape of the unevenness, When the unevenness is covered with the functional layer, and the insulating layer has a storage elastic modulus at 130° C. in MD of A [MPa] and a storage elastic modulus at 130° C. of B in the TD is B [MPa]. , A/B is 0.75 or more and 1.25 or less. [Selection diagram] Fig. 3

Description

The present invention relates to a film set for sticking a functional layer and an insulating film.

Conventionally, in electronic devices such as mobile phones, smartphones, calculators, electronic newspapers, tablet terminals, videophones, and personal computers, for example, electronic component mounting boards on which electronic components such as semiconductor elements, capacitors, and coils are mounted. Although mounted on a substrate, this electronic component mounting substrate may be sealed with resin for the purpose of preventing contact with external factors such as moisture and dust.

Such sealing with a resin includes, for example, a potting method in which a thermosetting resin such as a urethane resin having a high fluidity is injected and sealed after the electronic component mounting substrate is placed in a metal cavity, and a thermosetting resin is also used. A coating method is known in which a plastic resin is applied in a molten state to an electronic component mounting substrate and then the applied region is coated (sealed) by solidifying.

However, the potting method has a problem that it takes a long time to cure the thermosetting resin and further usually requires a metal cavity for sealing, which results in weight increase of the obtained electronic device. Further, the coating method has a problem that it takes time and labor to manage the viscosity of the thermoplastic resin in a molten state and to apply the thermoplastic resin separately to the application area.

For the purpose of solving such a problem, it has been proposed to attach a barrier film having a hot melt property to an electronic component mounting substrate as a protective layer (functional layer) (see, for example, Patent Document 1).

However, in this case, the conformability of the protective layer to the irregularities formed due to the electronic component mounting substrate having the electronic component is not sufficiently obtained, and as a result, the barrier property against external factors such as moisture and dust is not obtained. It has not been fully improved.

Therefore, it is also possible to prepare a film in which a protective layer is provided on the base material (insulating layer) and transfer the protective layer from this film to cover the unevenness of the electronic component mounting board with the protective layer. However, in this case, there is a problem that the side surface of the electronic component forming the convex and concave portions cannot be coated with excellent coating accuracy. In particular, in a region in which a plurality of electronic components having the same shape are arranged in a grid on the electronic component mounting board, such a problem becomes more remarkable when the electronic component mounting board is covered with the protective layer. It was the actual situation that was recognized. In addition, in this case, for sticking with unevenness including a configuration in which a plurality of recesses are arranged side by side, the protective layer (functional layer) is covered by an electronic component mounting board including a plurality of electronic components arranged in a grid pattern. A substrate is constructed.

In addition, such a problem is caused by sticking (transferring) a protective layer as a functional layer onto the unevenness of the electronic component mounting board from the film in which the protective layer is provided on the base material (insulating layer), The same applies to the case where the noise suppression layer (electromagnetic wave shield layer) as the functional layer is attached (transferred) from the film to the unevenness provided on the electronic component mounting board.

JP, 2009-99417, A

An object of the present invention is to provide a functional layer sticking film set capable of covering a sticking base material having irregularities with a functional layer with excellent covering accuracy.

Such an object is achieved by the present invention described in (1) to (11) below.
(1) A functional layer laminating film set comprising an insulating film having an insulating layer and a functional film having a functional layer, the functional layer laminating film set being used for covering the irregularities of a laminating substrate with the functional layer,
The unevenness of the sticking substrate is such that a plurality of concave portions formed along one direction and a plurality of concave portions formed along a direction orthogonal to the one direction are orthogonal to each other at a cross portion where they overlap each other. It is formed side by side in the state,
The insulating film and the functional film, in a state where the functional film is laminated with the sticking substrate side, by pushing the functional layer corresponding to the shape of the unevenness, the unevenness has the function Coated with layers,
When the storage elastic modulus at 130° C. in MD of the insulating layer is A [MPa] and the storage elastic modulus at 130° C. in TD thereof is B [MPa], A/B is 0.75 or more 1 A film set for sticking a functional layer, characterized in that the film set is 25 or less.

(2) The functional layer-attaching film set according to (1), wherein the insulating layer is made of a thermoplastic resin having a melting point of 110° C. or higher.

(3) The film set for sticking a functional layer according to (2), wherein the thermoplastic resin contains a polyolefin resin.

(4) The functional layer laminating film set according to any one of (1) to (3), wherein the insulating layer has an average thickness of 5 μm or more and 1000 μm or less.

(5) The functional layer laminating film set according to any one of (1) to (4), wherein the storage elastic modulus A at 130° C. in MD of the insulating layer is 1 MPa or more and 1000 MPa or less.

(6) The functional layer sticking film according to any one of (1) to (5), wherein the insulating film further has a release layer laminated on at least the surface of the insulating layer on the functional film side. set.

(7) The functional layer laminating film set according to (6), wherein the release layer has an average thickness of 5 μm or more and 500 μm or less.

(8) The functional layer laminating film set according to any of (1) to (7) above, wherein the functional layer is a protective layer that protects the laminating substrate.

(9) The functional layer laminating film set according to any one of (1) to (8), wherein the insulating film and the functional film are integrally formed.

(10) The insulating film is peeled from the functional film after coating the functional layer on the irregularities of the sticking substrate, according to any one of the above (1) to (9). Film set for attaching functional layers.

(11) An insulating film having an insulating layer,
Used to cover the unevenness of the sticking substrate with a functional layer provided by the functional film, in a state where the insulating film and the functional film are laminated with the functional film being the sticking substrate side. By pressing the functional layer corresponding to the shape of the unevenness, the unevenness is covered with the functional layer,
The unevenness of the sticking substrate is such that a plurality of concave portions formed along one direction and a plurality of concave portions formed along a direction orthogonal to the one direction are orthogonal to each other at a cross portion where they overlap each other. It is formed side by side in the state,
When the storage elastic modulus at 130° C. in MD of the insulating layer is A [MPa] and the storage elastic modulus at 130° C. in TD thereof is B [MPa], A/B is 0.75 or more 1 An insulating film having a thickness of 25 or less.

According to the functional layer laminating film set of the present invention, the functional layer can be coated with excellent coating accuracy on the laminating substrate having the irregularities. In particular, even if it is a sticking base material having a region in which a plurality of recesses are arranged in parallel, such as a region in which a plurality of electronic components are arranged in a grid pattern, a functional layer is excellent for such recesses. It can be coated with high coating accuracy.

Further, according to the insulating film of the present invention having an insulating layer, it is a sticking substrate having a region in which a plurality of recesses are juxtaposed, such as a region in which a plurality of electronic components are arranged in a grid pattern. Even in such a recess, for example, in a state in which the insulating film and a functional film having a functional layer are laminated with the functional film on the sticking substrate side, the functional layer corresponds to the uneven shape. When pushed in, the functional layer can be coated with excellent coating accuracy.

It is a longitudinal cross-sectional view which shows a part of embodiment of the protective layer coating electronic component mounting substrate manufactured using the film set for functional layer sticking of this invention. It is a top view which shows the electronic component mounting substrate with which the protective layer coating electronic component mounting substrate shown in FIG. 1 is equipped. It is a longitudinal cross-sectional view for explaining the manufacturing method which manufactures the protective layer coating electronic component mounting substrate shown in FIG. 1 using the film set for functional layer sticking of this invention. It is a top view which shows the state which has arrange|positioned the film set for functional layer attachment of this invention with respect to the electronic component mounting substrate in FIG.3(b).

Hereinafter, the functional layer-adhering film set of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

In the following, prior to explaining the functional layer sticking film set of the present invention, first, the functional layer sticking film set having a protective layer as a functional layer (the functional layer sticking film set of the present invention) is used for sticking. A protective layer-covered electronic component mounting substrate manufactured by sticking to an electronic component mounting substrate as a base material will be described.

<Substrate with electronic components coated with protective layer>
FIG. 1 is a vertical cross-sectional view showing a part of an embodiment of a protective layer-covered electronic component mounting board manufactured using the functional layer laminating film set of the present invention, and FIG. 2 is a protective layer-covered electron shown in FIG. It is a top view which shows the electronic component mounting board with which a component mounting board is equipped. In the following description, the upper side in FIG. 1, the front side in the plane of FIG. 2 are referred to as “upper”, the lower side in FIG. 1 and the rear side in FIG. 2 are referred to as “lower”.

A protective layer-covered electronic component mounting substrate 50 (electronic device) shown in FIG. 1 is composed of a substrate 5, an electronic component 4 mounted (placed) on the substrate 5, and the substrate 5 and the electronic component 4. The electronic component mounting substrate 45 has a protective layer 3 (functional layer) that covers the upper surface side of the substrate 5.

The substrate 5 is a flat plate for supporting the electronic component 4, and its plan view shape is usually a quadrangle such as a square or a rectangle. The substrate 5 includes, for example, a sheet-shaped wiring (wiring board) and a resin layer that covers the wiring above and below the wiring, and the wiring is exposed at a position corresponding to a terminal included in the electronic component 4. And a printed wiring board having parts.

Examples of the electronic component 4 include semiconductor elements, capacitors, coils, connectors and resistors. Such an electronic component 4 is mounted on the substrate 5 in a state where the terminals of the electronic component 4 are electrically connected to the wiring at the exposed portion. In the present embodiment, a plurality of electronic components 4 having the same shape are arranged in a grid (matrix) on the substrate 5 in the regions shown in FIGS. 1 and 2.

An electronic component mounting substrate 45 is configured by the substrate 5 and the electronic component 4. In the electronic component mounting substrate 45, by mounting the electronic component 4 on the substrate 5, a convex portion 61 and a concave portion 62 are formed on the substrate 5. The unevenness 6 is formed (see FIGS. 1, 2, and 3A). In particular, in the regions shown in FIGS. 1 and 2, a plurality of electronic components 4 having the same shape are arranged on the substrate 5 in a grid pattern, so that a plurality of concave portions 62 formed along the X direction and a Y portion. A plurality of recesses 62 formed along the direction are formed side by side in a state of being orthogonal (intersecting at 90°) at a cross portion 63 where these recesses overlap each other.

The protective layer 3 is provided so as to cover the upper surface of the electronic component 4, the side surface of the electronic component 4, and the upper surface of the substrate 5 exposed from the electronic component 4, whereby the electronic component on the substrate 5 is provided. The unevenness 6 formed by mounting 4 is covered. The formation of the protective layer 3 improves the barrier property of the electronic component mounting substrate 45, particularly the electronic component 4, for suppressing or preventing contact with external factors such as moisture and dust. The protective layer 3 is formed using the film set for sticking a functional layer of the present invention, and its detailed description will be given later.

In the present embodiment, the electronic components 4 mounted on the substrate 5 have the same shape arranged in a grid in the regions shown in FIGS. 1 and 2, but are arranged in this manner. The electronic component 4 is not limited to the configuration, and, for example, the electronic components 4 having different shapes may be randomly arranged in the regions shown in FIGS. 1 and 2, and further, other than the regions shown in FIGS. 1 and 2. In the above, those having the same shape may be arranged in a grid pattern, or those having different shapes may be randomly arranged.

(Method for manufacturing a protective layer-covered electronic component mounting board)
The functional layer-adhering film set of the present invention is used in the production of the protective layer-covered electronic component mounting board having the above-described structure.

That is, in the functional layer sticking film set of the present invention, the unevenness 6 included in the electronic component mounting board 45 as the sticking base material is covered with the protective layer as the functional layer to cover the protective layer-covered electronic part mounting board 50 ( It is used for manufacturing an electronic component), and more specifically, includes an insulating film having an insulating layer and a functional film having a protective layer 3 (functional layer), and the insulating film and the functional film. And the functional film (protective layer) are laminated on the electronic component mounting substrate 45 side, and the protective layer is pushed in according to the shape of the unevenness 6 to cover the unevenness 6 with the protective layer (functional layer). It is used to do. In the present invention, when the storage elastic modulus at 130° C. in MD of the insulating layer is A [MPa] and the storage elastic modulus at 130° C. in TD thereof is B [MPa], A/B is The relationship of 0.75 or more and 1.25 or less is satisfied.

Hereinafter, a method of manufacturing the protective layer-covered electronic component mounting board 50 using the functional layer laminating film set of the present invention will be described in detail.

FIG. 3 is a vertical cross-sectional view for explaining a manufacturing method for manufacturing the protective layer-covered electronic component mounting board shown in FIG. 1 using the functional layer laminating film set of the present invention, and FIG. 3] is a plan view showing a state in which the film for attaching a functional layer of the present invention is arranged on the electronic component mounting substrate in FIG. In the following description, the upper side of FIG. 3 and the front side of the paper surface of FIG. 4 are referred to as “upper”, and the lower side of FIG. 3 and the rear side of the paper surface of FIG. 4 are referred to as “lower”.

[1] First, an electronic component mounting substrate 45 in which the electronic component 4 is mounted on the substrate 5 is prepared (preparing step).

The electronic component mounting board 45 mounts the electronic component 4 on the substrate 5 so that the terminals of the electronic component 4 are electrically connected to the wiring at the exposed portions where the wiring of the substrate 5 is exposed from the resin layer. It can be obtained.

In the substrate 5, the exposed portion where the wiring is exposed from the resin layer is formed in the same number as the number of terminals included in the electronic component 4 corresponding to the position where the electronic component 4 is to be mounted. The electronic component 4 is mounted on the substrate 5 by electrical connection with the terminals of the corresponding electronic component 4.

When the electronic components 4 are mounted on the substrate 5 as described above, the electronic components 4 are arranged on the substrate 5 in a grid shape (matrix shape) in the regions shown in FIGS. 1 and 2. Due to such arrangement of the electronic components 4, the side surfaces of the electronic components 4 are exposed between the adjacent electronic components 4 along two directions of the X direction (short direction) and the Y direction (longitudinal direction) orthogonal to each other. The recesses 62 are arranged side by side. That is, the plurality of recesses 62 formed along the X direction and the plurality of recesses 62 formed along the Y direction are formed in a state of being orthogonal (intersecting at 90°) at the cross portion 63 where these are overlapped. To be done.

[2] Next, the protective layer 3 (functional layer) that covers the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 is formed by using the film set for sticking a functional layer of the present invention. Form (protective layer forming step).

In addition, in this embodiment, the insulating film and the functional film are each comprised by the peeling layer 1 (insulating layer) and the protective layer 3 as the functional layer sticking film set of this invention. The case where the protective layer sticking film 100, which is integrally formed in the state where 3 and 3 are laminated, is used will be described as an example.

Using the protective layer sticking film 100, the protective layer 3 is formed by, for example, the following step [2-1] and the following step [2-2].

[2-1] First, as the functional layer sticking film set of the present invention, the above-mentioned protective layer sticking film 100 is prepared, that is, the release layer 1 (insulating layer) and the protective layer laminated on the release layer 1. A protective layer laminating film 100 having 3 (functional layer) is prepared (see FIG. 3A), and in the electronic component mounting board 45, the surface side on which the electronic component 4 is mounted (top surface side) ), the protective layer laminating film 100 is laminated (attached) on the electronic component 4 with the protective layer 3 on the electronic component 4 side (see FIG. 3C; attaching step).

The method for sticking the protective layer sticking film 100 to the electronic component 4 is not particularly limited, and examples thereof include a vacuum pressure molding method or a press molding method.

The vacuum pressure forming method is, for example, a method of covering the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 with the protective layer sticking film 100 using a vacuum pressure type laminator. First, as shown in FIG. 3( b ), the surface of the electronic component 4 opposite to the substrate 5 and the surface of the protective layer sticking film 100 on the protective layer 3 side are provided in a closed space that can be under a vacuum atmosphere. The electronic component mounting substrate 45 and the protective layer sticking film 100 are set in a state of being superposed so that and face each other, and then these are heated and the protective layer sticking film 100 is evenly stuck from the protective layer sticking film 100 side. The closed space is placed in a vacuum atmosphere so that the film 100 and the electronic component 4 provided on the electronic component mounting substrate 45 come close to each other, and then pressure is applied.

As described above, the pressure is evenly applied from the protective layer sticking film 100 side, and the closed space is placed in a vacuum atmosphere so that the peeling layer 1 pushes the protective layer 3 corresponding to the shape of the recess 62, At the same time, the protective layer 3 located closer to the electronic component 4 than the peeling layer 1 is deformed according to the shape of the recess 62. As a result, as shown in FIG. 3C, with the protective layer 3 being pushed in corresponding to the shape of the concave portion 62, the protective layer 3 exposes the upper surface and side surfaces of the electronic component 4 and the electronic component 4. The upper surface of the substrate 5 is covered.

As described above, by covering the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 with the protective layer 3, the obtained protective layer-covered electronic component mounting substrate 50 is provided with moisture and dust. It is possible to impart a protective property (barrier property) for appropriately suppressing or preventing contact with an external factor such as.

According to the sticking method using the protective layer sticking film 100 (the functional layer sticking film set of the present invention) as described above, the protective layer 3 is pressed by the release layer 1 in correspondence with the shape of the recess 62. .. As a result, the upper surface and side surfaces of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4 are covered with the protective layer 3 (covering layer).

Here, in the present invention, in the peeling layer 1 (insulating layer) included in the protective layer sticking film 100, the storage elastic modulus at 130° C. in MD of the peeling layer 1 is A [MPa], and in the TD of the peeling layer 1. When the storage elastic modulus at 130° C. is B [MPa], the relationship that A/B is 0.75 or more and 1.25 or less is satisfied.

On the other hand, as in the conventional case, when A/B does not satisfy the relationship of 0.75 or more and 1.25 or less, among the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4, In particular, there is a problem that the side surface of the electronic component 4 and the upper surface of the substrate 5 cannot be coated with excellent coating accuracy.

The inventors of the present invention have studied this problem and found that the side surface of the electronic component 4 and the upper surface of the substrate 5 are coated with the protective layer 3 with excellent coating accuracy due to the following factors. It is presumed that it is no longer possible.

That is, as shown in FIG. 4, the protective layer sticking film 100 is placed on the electronic component 4 in the Y direction (longitudinal direction) of the electronic part 4 and the protective layer sticking film 100 (peeling layer 1 (insulating layer)). It is general that the protective layer sticking film 100 can be used efficiently so that the MD (or TD) of the above) is in the same direction (parallel). In addition, the protective layer sticking film 100 (particularly the peeling layer 1) that covers the electronic component mounting substrate 45 is unavoidably or intentionally caused by the manufacturing method or the like of MD (flow direction) and TD (flow). (Direction perpendicular to the direction).

In such a state, when the protective layer 3 is pushed in by the release layer 1 so as to correspond to the shape of the concave portion 62 using a vacuum pressure forming method or a press molding method, the MD of the protective layer sticking film 100 (flow direction). ) And TD (direction perpendicular to the flow) are different in draw ratio, the storage elastic modulus A [MPa] at 130° C. in MD of the release layer 1 and the 130° C. in TD of the release layer 1. The relationship A/B with the storage elastic modulus B [MPa] does not satisfy 0.75 or more and 1.25 or less, and as a result, the concave portion 62 along the Y direction (longitudinal direction) and the X direction (short side). The pressing speed of the protective layer 3 is different between the concave portion 62 along the (direction) and the cross portion 63 where the concave portions 62 overlap each other.

More specifically, for example, in the peeling layer 1, when the MD stretching ratio is higher than the TD stretching ratio, the pushing speed (Y direction) of the peeling layer 1 in the concave portion 62 along the Y direction (longitudinal direction) is , The pushing speed of the peeling layer 1 in the concave portion 62 along the X direction (short direction) (X direction) and the pushing speed of the peeling layer 1 in the cross portion 63 (cross portion 63) are the pushing speed (the peeling layer 1 , Cross portion 63)>pushing speed (peeling layer 1, X direction)>pushing speed (peeling layer 1, Y direction).

Therefore, also for the protective layer 3 pushed into the recess 62 by the peeling layer 1, the pushing speed (Y direction) of the protective layer 3 in the concave portion 62 along the Y direction (longitudinal direction) and X as in the peeling layer 1. The pushing speed of the protective layer 3 in the concave portion 62 (X direction) along the direction (widthwise direction) and the pushing speed of the protective layer 3 in the cross portion 63 (cross portion 63) are the pushing speeds (the protective layer 3 and the cross portion). Part 63)>pushing speed (protective layer 3, X direction)>pushing speed (protective layer 3, Y direction).

Therefore, the protective layer 3 pressed by the peeling layer 1 corresponding to the shape of the recess 62 has the cross portion 63, the recess 62 along the X direction (short direction) and the Y direction (with respect to the bottom of the recess 62). The recesses 62 arrive in this order along the longitudinal direction). Therefore, the protective layer 3 that has reached the cross portion 63 first spreads with respect to the concave portion 62 along the Y direction (longitudinal direction) that is the slowest to reach, and the protective layer 3 floats. As a result, clear protrusions of the protective layer 3 are recognized in the recesses 62 located around the cross portion 63, and as a result, the side surface of the electronic component 4 and the upper surface of the substrate 5 are covered with the excellent protective layer 3. It was presumed that the coating could not be performed with accuracy.

As described above, when the protective layer 3 is pushed in according to the shape of the concave portion 62 due to the pushing of the peeling layer 1, anisotropy between MD and TD of the peeling layer 1 is generated, so that the protective layer 3 is formed. It is presumed that the coating cannot be coated with excellent coating accuracy. However, as a result of further study by the present inventor on this point, the protection due to the anisotropy between MD and TD of the release layer 1 It has been found that the difference in speed when the layer 3 is pushed in is closely related to the storage elastic modulus in MD of the release layer 1 (insulating layer) and the storage elastic modulus in TD of the release layer 1. In particular, when the storage elastic modulus at 130° C. in MD of the release layer 1 is A [MPa] and the storage elastic modulus at 130° C. in TD of the release layer 1 is B [MPa], A/B is 0. The present inventors have found that satisfying the relationship of 75 or more and 1.25 or less improves the anisotropy of MD and TD of the release layer 1. Thereby, the anisotropy between MD and TD of the protective layer 3 is also improved. Therefore, the pushing speed of the protective layer 3 and the peeling layer 1 (Y direction) and the pushing speed of the protective layer 3 and the peeling layer 1 (X Direction) can be set to be substantially equal to each other. Therefore, the relationship of the above-described speeds can be expressed by pressing speed (protective layer 3 and peeling layer 1, cross portion 63)> pressing speed (protective layer 3 and peeling layer 1, X direction). It is possible to satisfy the relationship of ≅pushing speed (protective layer 3 and peeling layer 1, Y direction). Therefore, the spread of the protective layer 3 that has reached the cross portion 63 earlier is determined with respect to both the concave portion 62 along the Y direction (longitudinal direction) and the concave portion 62 along the X direction (transverse direction). Since they can be suppressed to the same degree, the side surface of the electronic component 4 and the upper surface of the substrate 5 can be coated with the protective layer 3 with excellent coating accuracy.

The width of the recess 62 is preferably 0.05 mm or more and 1 mm or less, more preferably 0.1 mm or more and 0.5 mm or less, and the depth thereof is preferably 0.1 mm or more and 3 mm or less, more preferably 0 mm or more. It is set to 0.5 mm or more and 1 mm or less. According to the present invention, the side surface of the electronic component 4 and the upper surface of the substrate 5 can be coated with the protective layer 3 with excellent coating accuracy even for the recess 62 having such a width and depth. ..

In addition, the press molding method means, for example, a state in which the protective layer sticking film 100 is arranged on the electronic component 4 mounted on the substrate 5, and the cushion material is arranged on the protective layer sticking film 100. Then, these are held by two flat plates from the upper surface side and the lower surface side thereof, and then the two flat plates are brought close to each other and pressed.

As described above, the release layer 1 corresponds to the shape of the recess 62 also by bringing the protective layer sticking film 100 and the electronic component 4 close to each other in the state where the cushion material is arranged on the protective layer sticking film 100. The protective layer 3 is pushed in by pressing the protective layer 3 and the protective layer 3 located on the electronic component 4 side of the peeling layer 1 can be deformed corresponding to the shape of the recess 62 in accordance with the pushing. Therefore, as shown in FIG. 3C, in a state where the protective layer 3 is pushed in corresponding to the shape of the recess 62, the protective layer 3 exposes the upper surface and the side surface of the electronic component 4 and the electronic component 4. The upper surface of the substrate 5 can be coated.

In the pasting step [2-1] using the vacuum pressure forming method or the press molding method as described above, the temperature to be pasted is not particularly limited, but is preferably 15°C or higher and 220°C or lower, and more preferably 20°C or higher. The temperature is in the range of ℃ to 210 ℃

The pressure to be applied is not particularly limited, but is preferably 0.1 MPa or more and 20.0 MPa or less, more preferably 0.5 MPa or more and 15.0 MPa or less.

Furthermore, the time of application is not particularly limited, but is preferably 5 seconds or more and 90 minutes or less, and more preferably 30 seconds or more and 10 minutes or less.

By setting the conditions in the pasting step within the above range, the protective layer 3 is pushed into the concave portions 62 between the adjacent electronic components 4, and the upper surface and the side surface of the electronic component 4 are protected by the protective layer 3. The upper surface of the substrate 5 exposed from the electronic component 4 can be coated with excellent coating accuracy.

In the protective layer sticking film 100 as described above, the release layer 1 pushes the protective layer 3 in conformity with the shape of the recess 62 to thereby expose the upper surface and the side surface of the electronic component 4 and the substrate exposed from the electronic component 4. When the upper surface of 5 is covered, the protective layer 3 is pushed in, and it functions as a protective (buffer) material for preventing the pushed protective layer 3 from breaking. In the next step [2-2], the protective layer 3 is peeled off.

In the present invention, the release layer 1 has an A/B of 0 when the storage elastic modulus at 130° C. in MD is A [MPa] and the storage elastic modulus at 130° C. in TD is B [MPa]. The relationship of 0.75 or more and 1.25 or less is satisfied. Thereby, as described above, the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 can be coated with the protective layer 3 with excellent coating accuracy.

The constituent material of the release layer 1 is not particularly limited as long as A/B can be set within the range of 0.75 or more and 1.25 or less, and examples thereof include polyethylene, polypropylene, and polymethylpentene. Α-olefin polymers such as ethylene, propylene, butene, pentene, hexene, methylpentene, etc. as copolymer components, copolymers of α-olefins such as ethylene and (meth)acrylic acid esters, ethylene and acetic acid Examples include α-olefin copolymers such as copolymers with vinyl, thermoplastic resins such as engineering plastics resins such as polyether sulfone and polyphenylene sulfide, and a combination of one or more of them. Can be used. Among these, a thermoplastic resin having a melting point of 110° C. or higher is preferable, and an olefin resin having a melting point of 110° C. or higher is more preferable. Thereby, the peeling layer 1 can surely satisfy the relationship that A/B is 0.75 or more and 1.25 or less.

The average thickness of the release layer 1 is not particularly limited, but is preferably 5 μm or more and 1000 μm or less, more preferably 20 μm or more and 500 μm or less, and further preferably 200 μm or more and 350 μm or less. As a result, the function of the release layer 1 described above can be reliably exhibited.

Further, as described above, in the peeling layer 1, the relation A/B between the storage elastic modulus A [MPa] at 130° C. in MD and the storage elastic modulus B [MPa] at 130° C. in TD is 0. It suffices to satisfy 0.75 or more and 1.25 or less, but 0.9 or more and 1.1 or less is preferable, and 1.0 is more preferable. Accordingly, the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62 can be coated with the protective layer 3 with higher coating accuracy.

Furthermore, the storage elastic modulus A [MPa] at 130° C. in MD of the release layer 1 is preferably 1 MPa or more and 1000 MPa or less, more preferably 10 MPa or more and 500 MPa or less, and 50 MPa or more and 300 MPa or less. More preferable. When satisfying the relationship that A/B is 0.75 or more and 1.25 or less, by setting the storage elastic modulus A [MPa] within the above range, A/B is 0.75 or more and 1.25 or less. The effect obtained when satisfying the relationship can be more remarkably exhibited.

The storage elastic modulus A and the storage elastic modulus B of the release layer 1 can be obtained by using, for example, a dynamic viscoelasticity measuring device (“Model DMS6100” manufactured by SII Nanotechnology Inc.).

Further, in the present embodiment, the protective layer sticking film 100 is formed by integrally forming an insulating film and a functional film, and the insulating film is composed of a single layer body of the release layer 1 (insulating layer). However, the present invention is not limited to such a configuration, and for example, the first release layer and the second release layer provided on the upper surface (the surface on the side opposite to the protective layer 3) and the lower surface (the surface on the protective layer 3 side) of the release layer 1, respectively. It may include at least one of the mold layers.

In this step [2-1], the first release layer is used in a pressing portion or a press molding method used in a vacuum pressure air molding method when the protective layer 3 is pressed into the irregularities 6 on the electronic component mounting substrate 45. This is for reliably imparting the function of releasability from the flat plate to the protective layer sticking film 100. Further, it is for propagating the pressing force from the pressing portion or the flat plate to the release layer 1 side.

In addition, the second release layer peels off the release layer 1 in the next step [2-2] after the protective layer 3 is pushed into the irregularities 6 on the electronic component mounting substrate 45 in this step [2-1]. In doing so, the function of releasability from the protective layer 3 is more surely imparted to the protective layer sticking film 100. In addition, in this step [2-1], the second release layer has a followability function of following the uneven shape on the electronic component mounting substrate 45, and is pressed against the release layer 1 side. It is for propagating the pressing force from the part or the flat plate.

Examples of the constituent materials of the first release layer and the second release layer include syndiotactic polystyrene, polymethylpentene, polybutylene terephthalate, polypropylene, cyclic olefin polymer, and resin materials such as silicone. Among these, it is preferable to use syndiotactic polystyrene. As described above, by using polystyrene having a syndiotactic structure, polystyrene can be made to have crystallinity. Due to this, the first release layer and the second release layer are caused. The function as can be surely exhibited.

The average thickness of the first release layer and the second release layer is not particularly limited, but is preferably 5 μm or more and 1000 μm or less, more preferably 20 μm or more and 100 μm or less. Accordingly, the functions of the first release layer and the second release layer described above can be reliably exerted in each of the first release layer and the second release layer.

In the present embodiment, the protective layer 3 (functional layer) is provided so as to cover the upper surface and side surfaces of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4.

The protective layer 3 is a barrier that suppresses or prevents contact between the electronic component mounting board 45, particularly the electronic component 4, and external factors such as moisture and dust from the upper surface side of the electronic component mounting board 45 (electronic component 4). And a function of imparting the property to the protective layer-covered electronic component mounting substrate 50.

Such a protective layer 3 is mainly composed of a resin material, and the resin material is not particularly limited as long as it has a barrier property against external factors such as moisture and dust. , For example, epoxy resin, phenol resin, amino resin, unsaturated polyester resin, thermosetting resin such as thermosetting elastomer, acrylic resin, polyester resin, vinyl chloride resin, styrene resin, styrene-based thermoplastic elastomer, olefin-based heat Examples thereof include thermoplastic resins such as thermoplastic elastomers such as a thermoplastic elastomer, and one kind or a combination of two or more kinds thereof can be used.

The average thickness of the protective layer 3 is not particularly limited, but is preferably 1 μm or more and 300 μm or less, and more preferably 2 μm or more and 100 μm or less.

[2-2] Next, as shown in FIG. 3D, the release layer 1 (insulating layer) is released from the protective layer application film 100 attached to the electronic component 4.

That is, after forming the protective layer 3 using the protective layer sticking film 100, the release layer 1 is peeled from the protective layer 3.

In the peeling of the peeling layer 1, peeling occurs at the interface between the peeling layer 1 and the protective layer 3 in the protective layer sticking film 100, and as a result, the peeling layer 1 is peeled from the protective layer 3. As a result, with the release layer 1 peeled from the protective layer 3, the protective layer 3 covers the upper surface and the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed from the electronic component 4, and the protective layer-covered electronic component is mounted. The substrate 50 can be obtained.

The method for peeling the release layer 1 is not particularly limited, but, for example, manual peeling is preferable.

In the manual peeling, for example, first, one end of the peeling layer 1 is gripped, the peeling layer 1 is peeled from the protective layer 3 from the gripped end, and then the peeling layer 1 is further separated from the end to the center. The peeling layer 1 is peeled from the protective layer 3 by sequentially peeling off the peeling layer 1 to the other end.

The peeling temperature is preferably 180° C. or lower, more preferably 165° C. or lower, still more preferably 150° C. or lower.

Through the steps [2-1] and [2-2] as described above, with the release layer 1 peeled from the protective layer 3, the upper surface and the side surface of the electronic component 4 by the protective layer 3, and the electron. It is possible to obtain the protective layer-covered electronic component mounting substrate 50 in which the upper surface of the substrate 5 exposed from the component 4 is coated.
Through the steps described above, the protective layer-covered electronic component mounting board 50 is manufactured.

In the present embodiment, the electronic component 4 mounted on the substrate 5 has a cross portion 63 formed by arranging components having the same shape in a grid pattern in the regions shown in FIGS. According to the present invention, the protective layer 3 is pushed into the recessed portion 62, and the protective layer 3 is excellent also on the side surface of the electronic component 4 and the upper surface of the substrate 5 exposed in the recessed portion 62 having such a configuration. Although it has been described that the coating can be performed with the coating accuracy, the configuration of the recess into which the protective layer 3 can be pushed by applying the present invention is not limited to the recess 62 having the cross portion 63 as described above. Absent. That is, the recess may be formed by randomly arranging the electronic components 4 having different shapes. According to the present invention, the recess has a fine shape like the recess 62 having the cross portion 63. The protective layer 3 can be coated on an object with excellent coating accuracy. Therefore, the recesses 62 formed by the random arrangement can be coated with the protective layer 3 with excellent coating accuracy.

The film set for sticking a functional layer of the present invention has been described above, but the present invention is not limited to these.

For example, in the above-described embodiment, the electronic component mounting substrate 45 having the unevenness 6 as the sticking base material is protected by covering the protective layer 3 as the functional layer with the functional layer sticking film set of the present invention. The case of obtaining the layer-covered electronic component mounting substrate 50 has been described, but the present invention is not limited to this, and the functional layer-adhering film set of the present invention has a functional film having an electromagnetic wave shielding layer as a functional layer. It may be used to press the electromagnetic wave shield layer in correspondence with the shape of the unevenness of the sticking substrate by using the functional film set having the constitution.

Further, in the above-described embodiment, when the protective layer 3 is formed on the electronic component mounting substrate 45 having the unevenness 6 by using the functional layer-adhesive film set of the present invention, the insulating layer 1 (insulating layer) is used as the insulating layer. The case where the protective layer sticking film 100 in which the film and the functional film composed of the protective layer 3 (functional layer) are integrated in the thickness direction is used as a film set has been described. The present invention is not limited to the constitution, and for example, an insulating film composed of the peeling layer 1 (insulating layer) and a functional film composed of the protective layer 3 (functional layer) are provided as separate bodies, and these are superposed. It may be a film set to be used.

Further, in the above-described embodiment, the case where the protective layer 3 is formed on almost the entire surface of the unevenness 6 of the electronic component mounting board 45 by using the functional layer laminating film set of the present invention has been described. The area to be formed is not limited to substantially the entire surface of the unevenness 6, and may be a part of the unevenness 6. In this way, when a part of the unevenness 6 is covered with the protective layer 3, a functional layer laminating film set in which the protective layer 3 is selectively formed corresponding to the region where the protective layer 3 is to be formed is used. By preparing and pressing the protective layer 3 into the unevenness 6 in a state where the protective layer 3 is arranged so as to correspond to such a region, a part of the unevenness 6 can be selectively covered with the protective layer 3.

The insulating film having an insulating layer (release layer) according to the present invention has a storage elastic modulus at 130° C. in MD of A [MPa] and a storage elastic modulus at 130° C. in TD of B [MPa]. Then, A/B is 0.75 or more and 1.25 or less. Thereby, for example, when used as a release layer of the protective layer sticking film 100, the protective layer 3 is also coated with excellent coating accuracy on the side surface of the electronic component 4 and the upper surface of the substrate 5 in the recess 62. be able to. In addition, the insulating film having an insulating layer is used as a release layer of the protective layer sticking film 100, and for example, lamination of a functional film on the insulating film is omitted, and the insulating film alone is used as a sticking substrate. By pressing the insulating layer corresponding to the shape of the concavities and convexities in the laminated state, it can be used for the purpose of covering the concavities and convexities with the insulating layer.

Further, the same material and method as those used for the release layer 1 can be used for the structure and the manufacturing method of the insulating film, and therefore the description of the release layer 1 is applied correspondingly.

Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited thereto.

<Example 1>
1. Manufacture of a film for sticking a protective layer First, in order to obtain a laminate in which a first release layer and a second release layer are laminated on the upper surface and the lower surface of the release layer 1, respectively, first and second release layers are formed. Polymethylpentene (melting point: 230° C., manufactured by Mitsui Chemicals, Inc., trade name: TPX DX231) was prepared as a resin material for this purpose. Further, as a resin material for forming the release layer 1, 60 wt% of polypropylene (melting point: 160° C., manufactured by Prime Polymer Co., trade name: E-203GP), polymethylpentene (melting point: 230° C., manufactured by Mitsui Chemicals, Inc.) A mixture containing 40 wt% of trade name: TPX DX231) was prepared.

Then, the prepared resin material for forming the first release layer, the release layer 1 and the second release layer is formed into a film by co-extrusion using a feed block and a multi-manifold die to form a first release layer. A laminate was obtained in which the mold layer, the release layer 1 and the second release layer were laminated in this order.

Further, as a resin material (liquid material) for forming the protective layer 3, 22 parts by weight of an epoxy resin (manufactured by DIC, trade name: EPICRON N-670), acrylic rubber (manufactured by Nagase Chemtex Co., trade name: SG-708-6) was contained in an amount of 22 parts by weight, and a phenol novolac resin (manufactured by Sumitomo Bakelite Co., Ltd., trade name: PR-HF-3) was included in an amount of 11 parts by weight, and a solvent containing methyl ethyl ketone as a solvent was prepared.

Then, between the delivery roller and the winding roller, the resin material for forming the protective layer 3 is applied to the delivered laminated body and then dried to form the protective layer 3 to form the protective layer. A sticking film 100 was produced.

In the obtained protective layer sticking film 100, the release layer 1 had a thickness of 300 μm, and the protective layer 3 had an average thickness of 40 μm.

Further, when the storage elastic modulus A of MD and the storage elastic modulus B of TD at 130° C. were measured, they were 227 MPa and 206 MPa, respectively.

2. Manufacture of Electronic Component Mounting Substrate Provided with Recesses In order to obtain the electronic component mounting substrate 45 provided with the recesses 62, first, FR4 substrate (glass fiber cloth is sealed with a cured product of epoxy resin to form) By arranging Si substrates (pseudo electronic components) of 5 mm in length×10 mm in width×0.8 mm in thickness on the pseudo wiring substrate) so that the distance between adjacent Si substrates is 0.2 mm. The electronic component mounting board 45 was obtained.

3. Evaluation The following evaluation was performed on the produced protective layer sticking film 100 using the electronic component mounting substrate 45 provided with the recesses 62.

The protective layer sticking film 100 is placed on the electronic component mounting board 45 having the recess 62, and the longitudinal direction of the protective layer sticking film 100 (release layer 1) is parallel to the longitudinal direction of the electronic component mounting board 45. So that

Next, using a vacuum pressurizing laminator, in a vacuum atmosphere, pressure is applied under conditions of a pressure of 2 MPa, a temperature of 170° C., and a time of 240 seconds so that the protective layer sticking film 100 and the electronic component mounting substrate 45 come close to each other. Then, by attaching the protective layer attaching film 100 to the electronic component mounting substrate 45, the protective layer 3 included in the protective layer attaching film 100 is made to correspond to the shape of the concave portion 62 provided in the electronic component mounting substrate 45. Pushed into.

Then, the release layer 1 was peeled from the protective layer application film 100 attached to the electronic component mounting substrate 45 by holding one end of the release layer 1.

After that, with respect to the protective layer 3 pressed so as to correspond to the shape of the concave portion 62, the coating accuracy with respect to the bottom of the concave portion 62 was visually observed, and the result was evaluated based on the evaluation criteria shown below.

[Evaluation criteria]
⊚: The protective layer 3 covers the bottom of the recess 62,
No protrusion due to floating from the bottom of the recess 62 of the protective layer 3 is observed.
◯: The protective layer 3 covers the bottom of the recess 62,
A slight protrusion of the protective layer 3 is observed around the cross portion 63.
X: The protective layer 3 covers the bottom of the recess 62,
Due to the floating of the protective layer 3 from the bottom of the concave portion 62 in the peripheral portion of the cross portion 63.
Obvious protrusions are observed.

<Example 2>
As a resin material for forming the release layer 1, 40 wt% of polypropylene (melting point: 160° C., manufactured by Prime Polymer, trade name: E-203GP), polymethylpentene (melting point: 230° C., manufactured by Mitsui Chemicals, Inc., product Name: TPX DX 231) except that a mixture containing 60 wt% was prepared, and the protective layer 3 was pressed in the same manner as in Example 1 so as to correspond to the shape of the recess 62 provided in the electronic component mounting board 45. After that, the peeling layer 1 was peeled from the protective layer sticking film 100.

Then, in Example 2, the coating accuracy of the protective layer 3 pressed into the recess 62 with respect to the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.

<Example 3>
As a resin material for forming the release layer 1, 20 wt% polypropylene (melting point: 160° C., manufactured by Prime Polymer Co., Ltd., trade name: E-203GP), polymethylpentene (melting point: 230° C., manufactured by Mitsui Chemicals, Inc., product Name: TPX DX231) 80% by weight of the mixture was prepared, and the protective layer 3 was pressed in the same manner as in Example 1 so as to correspond to the shape of the recess 62 provided in the electronic component mounting board 45. After that, the peeling layer 1 was peeled from the protective layer sticking film 100.

Then, in Example 3, the coating accuracy of the protective layer 3 pressed into the recess 62 with respect to the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.

<Example 4>
As a resin material for forming the peeling layer 1, 60 wt% of polyethylene (melting point: 130° C., manufactured by Prime Polymer Co., Ltd., product name: Hi-Zex 3300F), polymethylpentene (melting point: 230° C., manufactured by Mitsui Chemicals, Inc., product name) : TPX DX231) was prepared in the same manner as in Example 1 except that a mixture containing 40 wt% of TPX DX231) was prepared, and the protective layer 3 was pressed into the recess 62 provided in the electronic component mounting substrate 45. Then, the peeling layer 1 was peeled from the protective layer sticking film 100.

Then, in Example 4, the covering precision of the protective layer 3 pushed into the concave portion 62 with respect to the bottom of the concave portion 62 was visually observed, and the result was evaluated based on the above-mentioned evaluation criteria.

<Example 5>
As a resin material for forming the peeling layer 1, 40 wt% of polyethylene (melting point: 130° C., made by Prime Polymer Co., Ltd., trade name: Hi-Zex 3300F), polymethylpentene (melting point: 230° C., manufactured by Mitsui Chemicals Co., Ltd., trade name : TPX DX231) was prepared in the same manner as in Example 1 except that a mixture containing 60 wt% of TPX DX231) was prepared, and the protective layer 3 was pressed so as to correspond to the shape of the concave portion 62 provided in the electronic component mounting substrate 45. Then, the peeling layer 1 was peeled from the protective layer sticking film 100.

Then, in Example 5, the covering accuracy of the protective layer 3 pressed into the recess 62 with respect to the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.

<Example 6>
As a resin material for forming the protective layer 3, 12 parts by weight of epoxy resin (manufactured by DIC, trade name: EPICRON N-670), acrylic rubber (manufactured by Nagase Chemtex, trade name: SG-708-6) And a phenol novolak resin (Sumitomo Bakelite Co., Ltd., trade name: PR-HF-3) in an amount of 6 parts by weight, the protective layer 3 was formed in the same manner as in Example 1 except that a mixture was prepared. Then, the release layer 1 was peeled off from the protective layer sticking film 100 after being pushed in so as to correspond to the shape of the concave portion 62 provided in the electronic component mounting substrate 45.

Then, with respect to Example 6, the covering precision of the bottom of the recess 62 of the protective layer 3 pressed into the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.

<Example 7>
The protective layer 3 was formed in the shape of the recess 62 provided in the electronic component mounting substrate 45 in the same manner as in Example 1 except that the protective layer sticking film 100 having a thickness of the release layer 1 of 200 μm was prepared. After pressing in a corresponding manner, the release layer 1 was released from the protective layer-adhesive film 100.

Then, in Example 7, the coating accuracy of the protective layer 3 pressed into the recess 62 with respect to the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.

<Example 8>
The protective layer 3 was formed into the shape of the recess 62 provided in the electronic component mounting substrate 45 in the same manner as in Example 1 except that the protective layer sticking film 100 having a thickness of the release layer 1 of 150 μm was prepared. After pressing in a corresponding manner, the release layer 1 was released from the protective layer-adhesive film 100.

Then, in Example 8, the coating accuracy of the protective layer 3 pressed into the recess 62 with respect to the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.

<Comparative Example 1>
As a resin material for forming the release layer 1, 50 wt% of ethylene-methyl acrylate copolymer (melting point: 100° C., Mitsui DuPont Polychemical Co., Ltd., trade name: Nucrel AN4214C), polypropylene (melting point: 160° C., The procedure described above was performed except that a mixture containing 30 wt% of Prime Polymer Co., Ltd., trade name: E-203GP) and 20 wt% of polymethylpentene (melting point: 230° C., Mitsui Chemicals Co., trade name: TPX DX231) was prepared. In the same manner as in Example 1, the protective layer 3 was pressed so as to correspond to the shape of the recess 62 provided in the electronic component mounting substrate 45, and then the release layer 1 was peeled from the protective layer sticking film 100.

Then, in Comparative Example 1, the covering accuracy of the protective layer 3 pressed into the recess 62 with respect to the bottom of the recess 62 was visually observed, and the result was evaluated based on the evaluation criteria.
The results of these evaluations are shown in Table 1.

As shown in Table 1, in each example, the relation A/B between the storage elastic modulus A [MPa] of the release layer 1 at 130° C. in MD and the storage elastic modulus B [MPa] at 130° C. of TD. Satisfies 0.75 or more and 1.25 or less, and as a result, no obvious protrusion due to the floating of the protective layer 3 from the bottom of the recess 62 is observed, and the protective layer 3 is superior to the recess 62. It has been revealed that the coating can be performed with high coating accuracy.

On the other hand, in the comparative example, the A/B does not satisfy the range of 0.75 or more and 1.25 or less, and as a result, the apparent protrusion due to the floating of the concave portion 62 of the protective layer 3 from the bottom is generated. Therefore, the result was that the protective layer 3 could not be coated on the recess 62 with excellent coating accuracy.

DESCRIPTION OF SYMBOLS 1 peeling layer 3 protective layer 4 electronic component 5 substrate 6 unevenness 45 electronic component mounting substrate 50 protective layer coating electronic component mounting substrate 61 convex portion 62 concave portion 63 cross portion 100 protective layer sticking film

Claims (11)

An insulating film having an insulating layer, and a functional film having a functional layer, a functional layer sticking film set used for covering the unevenness of the sticking substrate with the functional layer,
The unevenness of the sticking substrate is such that a plurality of concave portions formed along one direction and a plurality of concave portions formed along a direction orthogonal to the one direction are orthogonal to each other at a cross portion where they overlap each other. It is formed side by side in the state,
The insulating film and the functional film, in a state where the functional film is laminated with the sticking substrate side, by pushing the functional layer corresponding to the shape of the unevenness, the unevenness has the function Coated with layers,
When the storage elastic modulus at 130° C. in MD of the insulating layer is A [MPa] and the storage elastic modulus at 130° C. in TD thereof is B [MPa], A/B is 0.75 or more 1 A film set for sticking a functional layer, characterized in that the film set is 25 or less. The film set for attaching a functional layer according to claim 1, wherein the insulating layer is made of a thermoplastic resin having a melting point of 110° C. or higher. The functional layer laminating film set according to claim 2, wherein the thermoplastic resin contains a polyolefin resin. The functional layer sticking film set according to any one of claims 1 to 3, wherein the insulating layer has an average thickness of 5 µm or more and 1000 µm or less. The functional layer sticking film set according to any one of claims 1 to 4, wherein the insulating layer has a storage elastic modulus A at 130°C in MD of 1 MPa or more and 1000 MPa or less. 6. The functional layer laminating film set according to claim 1, wherein the insulating film further has a release layer laminated on at least the surface of the insulating layer on the functional film side. The functional layer sticking film set according to claim 6, wherein the release layer has an average thickness of 5 μm or more and 500 μm or less. The functional layer laminating film set according to any one of claims 1 to 7, wherein the functional layer is a protective layer that protects the laminating substrate. The functional layer sticking film set according to any one of claims 1 to 8, wherein the insulating film and the functional film are integrally formed. The functional layer sticking according to any one of claims 1 to 9, wherein the insulating film is peeled from the functional film after coating the functional layer on the irregularities of the sticking base material. Film set. An insulating film having an insulating layer,
Used to cover the unevenness of the sticking substrate with a functional layer provided by the functional film, in a state where the insulating film and the functional film are laminated with the functional film being the sticking substrate side. By pressing the functional layer corresponding to the shape of the unevenness, the unevenness is covered with the functional layer,
The unevenness of the sticking substrate is such that a plurality of concave portions formed along one direction and a plurality of concave portions formed along a direction orthogonal to the one direction are orthogonal to each other at a cross portion where they overlap each other. It is formed side by side in the state,
When the storage elastic modulus at 130° C. in MD of the insulating layer is A [MPa] and the storage elastic modulus at 130° C. in TD thereof is B [MPa], A/B is 0.75 or more 1 An insulating film having a thickness of 25 or less.

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