CN101459866B - Electric microphone module for microcomputer and manufacture method - Google Patents
Electric microphone module for microcomputer and manufacture method Download PDFInfo
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- CN101459866B CN101459866B CN200710195973.5A CN200710195973A CN101459866B CN 101459866 B CN101459866 B CN 101459866B CN 200710195973 A CN200710195973 A CN 200710195973A CN 101459866 B CN101459866 B CN 101459866B
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Abstract
The present invention discloses a kind of electric microphone module for microcomputer and manufacture method, by allocating in existing plastic encapsulation structure, the gauge of the transparent interim cover plate temporarily arranged, after the mould moulding process of plastic cement protective, penetrate with UV illumination and reduce the adherence at interim cover plate and the micro electronmechanical sound wave sensor chip back side, then after removing interim cover plate, space left by it is the main rear operatic tunes volume source of micro-electro-mechanical microphone, finally above plastic cement protective, cover a tab member, to define whole rear operatic tunes volume and to form a rear operatic tunes volume closed.Rear operatic tunes volume size in above-mentioned manufacture method is the size of whole MEMS microphone chip, and definable operatic tunes volume thereafter.
Description
Technical field
The present invention, about micro electronmechanical (MEMS) microphone module of one and manufacture method, relates to a kind of electric microphone module for microcomputer and its manufacture method that increase rear operatic tunes volume especially.
Background technology
In the integrated circuit (IC)-components product being equipped with microphone, the demand of micro-electro-mechanical microphone is had to the trend of expansion.Illustrate, in the tendency of current global cell phone manufacturer, except the microphone demand conversing required, for camera function is equipped with a microphone in addition again, with the convenience in realistic use.Design in this respect, also slowly appear at present on the portable audio frequency adopting micro harddisk or flash memory (flashmemory) and digital camera product, therefore micro-electro-mechanical microphone will likely have considerable occupation rate of market in above-mentioned application future.
Not only thickness is thin for micro-electro-mechanical microphone, volume is little, also carries out adhesive surface method by reflow soldering (solderreflow), effectively can reduce assembly cost.Therefore in the face of the demand that cube is little and cost is low wanted by mobile phone etc., dynamo-electric microphone is capturing original Electret Condencer Microphone (ECM step by step, ElectricCondenserMicrophone) market, in addition because micro-electro-mechanical microphone has the innate advantage of low power consumption (160uA), its power consumption is about 1/3 of Electret Condencer Microphone, for the mobile phone of limited reserve of electricity, the advantage of power saving is also impel micro-electro-mechanical microphone to replace Electret Condencer Microphone significant motive force.
Shown in please refer to the drawing 1A to Figure 1B, U.S. Patent Publication No. is central authorities' vibrations film 13 relative position that US20050185812 adopts in supporting substrate 11 MEMS microphone chip 12 corresponding thereto, empty downwards with one and do not penetrate the mode of supporting substrate 11, define the rear operatic tunes volume 14 of microphone package, in addition, coordinate the intermediate course of supporting substrate at clamping plate of the printed circuit board (PCB) of clamping plate adhesion technique again, interlayer adhesion is made and the region that interlayer hole 15 region and supporting substrate 11 are emptied overlaps with the form of hole 15, using the object of operatic tunes volume 14 after strengthening as the extension realizing of rear operatic tunes volume 14.Design with general electric microphone module for microcomputer, the die size size of general micro-electro-mechanical microphone is approximately 2.0 × 2.0mm, and the diameter region of acoustic wave vibrations sensor film is about 1.0mm, in addition with the supporting substrate of 0.2 ~ 0.3mm thickness, interlayer cavity thickness possible in the middle of it is approximately about 0.07mm, the structure of above-mentioned patent, operatic tunes volume is on supporting substrate thereafter, does not penetrate supporting substrate for scope with the diameter region of acoustic wave vibrations sensor film toward downward-extension.Generally speaking, in the clamping plate process for pressing of actual bearer base material, the hole thickness in intermediate layer is wayward makes it possess homogeneity, and with the degree of depth extendible under the diameter region of acoustic wave vibrations sensor film, thickness by supporting substrate limited, its limited space that can be formed.
Summary of the invention
The invention provides a kind of electric microphone module for microcomputer, comprise: a supporting substrate has a sound wave hand-hole; One MEMS microphone chip has a sound wave and senses machine-processed district, and sound wave senses machine-processed district and is fixed on supporting substrate, as sound wave sensing cell; The all devices in top of the coated supporting substrate except MEMS microphone chip upper surface of one plastic body, and the formal structure main body forming electric microphone module for microcomputer; And one the outer surface of tab member and plastic body bond, using as rear resonant cavity volume.
In the present invention, the sound wave hand-hole of its supporting substrate is vertical through hole or ladder hole.
In the present invention, its tab member more comprises at least one circle, polygon or other erose through holes at the scope place of the MEMS microphone chip of corresponding below.
In the present invention, the arrays of openings of its tab member is that array or staggered eradiation distribute or Arbitrary distribution; And the diameter of the single through hole of tab member or long limit diameter are less than or equal to the length of side of MEMS microphone chip; The position of the single through hole of its tab member can in the geometric center of the scope of the MEMS microphone chip of corresponding below or any position.
The invention provides a kind of manufacture method of MEMS microphone chip assembly, its step comprises: provide a micro-electro-mechanical microphone silicon chip with multiple MEMS microphone chip, it has many chip separation lines of cut, an active surface and a back side; A transparent interim cover plate is close in the center, the back side of micro-electro-mechanical microphone silicon chip with a UV stalemate agent; Interim cover plate upper surface forms many grooves, and corresponds to each chip separation line of cut; Fill up an expendable material in groove space; Exposure imaging technique is used to form many sacrifice layers; And cutting groove is to form multiple MEMS microphone chip assembly, operatic tunes cover plate after making the interim cover plate of each MEMS microphone chip assembly form, and the displacement layer formed by expendable material is left in surrounding.
The invention provides a kind of manufacture method of electric microphone module for microcomputer, comprise: a supporting substrate is provided, it has the weld pad of multiple unit and multiple corresponding sound wave hand-hole, more fixing and the MEMS microphone chip assembly of the technique of the above-mentioned MEMS microphone chip assembly of electric property coupling and the integrated circuit (IC)-components of application thereof are on supporting substrate; Plastic body is formed with coated integrated circuit (IC)-components in encapsulating mould, and around the side of dynamo-electric microphone chip assembly with operatic tunes cover plate thereafter; Remove the displacement layer of rear operatic tunes cover plate surrounding; Remove the space that rear operatic tunes cover plate forms resonant cavity volume after; Engage a tab member in plastic body outer surface, make to form a closed rear resonant cavity volume with the space at original rear operatic tunes cover plate place; And cutting supporting substrate and plastic body form single electric microphone module for microcomputer.
The beneficial effect that the present invention possesses is: due to rear operatic tunes volume last in the present invention, can be decided by the thickness of the interim cover plate in manufacture craft, and the increase of thickness can easily and determined clearly, be different from the design restriction that may not exceed supporting substrate thickness of prior art, and the interlayer hole caliper uniformity design aspect of supporting substrate that the prior art cannot be controlled completely, the present invention has its relative advantage.On the other hand, due to the extension substrate of rear operatic tunes volume of the present invention, be the size of whole MEMS microphone chip, efficiently can increase the rear operatic tunes volume of electric microphone module for microcomputer.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Figure 1A to Figure 1B is depicted as the electric microphone module for microcomputer schematic diagram of operatic tunes volume after the increasing of prior art;
Fig. 2 A to Fig. 2 E is depicted as the Structure and Process schematic diagram of the manufacture method embodiment of MEMS microphone chip assembly of the present invention;
Fig. 3 A to Fig. 3 F is depicted as the Structure and Process schematic diagram of the manufacture method embodiment of electric microphone module for microcomputer of the present invention;
Figure 4 shows that the cutaway view of electric microphone module for microcomputer embodiment of the present invention;
Figure 5 shows that the tab member of Fig. 4 embodiment offers the cutaway view of hole-thru embodiment;
Figure 6 shows that the cutaway view of another embodiment of electric microphone module for microcomputer of the present invention; And
Figure 7 shows that the cutaway view of electric microphone module for microcomputer of the present invention 3rd embodiment.
Wherein, Reference numeral
11 supporting substrates
12 MEMS microphone chip
13 vibrations films
Operatic tunes volume after 14
15 holes
20 MEMS microphone chip assemblies
21 dynamo-electric microphone silicon chips
211 active surfaces
212 back sides
22 MEMS microphone chip
2201 chip upper surfaces
2202 chip lower surfaces
221 sound waves sense machine-processed district
222 depressions
23UV stalemate agent
24 interim cover plates
Operatic tunes cover plate after 241
25 grooves
26 expendable materials
261 displacement layer
30 supporting substrates
301 weld pads
302 sound wave hand-holes
31 integrated circuit (IC)-components
Filler bottom 32
40 plastic bodies
Resonant cavity volume after 50
60,60a, 60b tab member
601a, 601b bottom recess
602 top surfaces
61 through holes
62 label annotations
70 electric microphone module for microcomputer
Embodiment
For making there is further understanding to object of the present invention, structure, feature and function thereof, embodiment is hereby coordinated to be described in detail as follows.
Refer to the Structure and Process schematic diagram that Fig. 2 A to Fig. 2 E is depicted as the manufacture method embodiment of MEMS microphone chip assembly of the present invention.Its MEMS microphone chip assembly 20 manufacture method step comprises: provide a micro-electro-mechanical microphone silicon chip 21 with multiple MEMS microphone chip 22, and it has active surface 211 and a back side 212; A transparent interim cover plate 24 is close in the center, the back side 212 (as Fig. 2 A) of micro-electro-mechanical microphone silicon chip 21 with a UV stalemate agent 23; Correspond to each MEMS microphone chip periphery at interim cover plate 24 upper surface and form many grooves 25 (as Fig. 2 B); Then an expendable material 26 is filled up in groove 25 space (as Fig. 2 C); Use exposure imaging technique, make expendable material 26 form many sacrifice layers; And align groove 25 and cut to form multiple MEMS microphone chip assembly 20 (as Fig. 2 D and Fig. 2 E), the cutting width of its cutter should be less than the width of each groove 25, and the peripheral regions of the rear operatic tunes cover plate 241 formed to make the interim cover plate 24 of each MEMS microphone chip assembly 20 still leaves the displacement layer 261 be made up of expendable material 26.
MEMS microphone chip assembly 20 disclosed in above-mentioned Fig. 2 E, its structure comprises: a MEMS microphone chip 22, it has chip upper surface 2201 and a chip lower surface 2202, chip upper surface 2201 has the sound wave sensing parts that sound wave senses machine-processed district 221, chip lower surface 2202 has the pothole structure of a depression 222; And a hybrid rear operatic tunes cover plate assembly, operatic tunes cover plate 241 and a displacement layer 261 after it comprises one, and displacement layer 261 is looped around rear operatic tunes cover plate 241 surrounding, its hybrid rear operatic tunes cover plate assembly is combined with the chip lower surface 2202 of MEMS microphone chip 22, and senses the sound wave sensing parts in machine-processed district 221 with sound wave and MEMS microphone chip 22 defines an enclosure space.
Continue referring to Fig. 3 A to Fig. 3 F, be depicted as the Structure and Process schematic diagram of the manufacture method embodiment of electric microphone module for microcomputer of the present invention.It uses above-mentioned MEMS microphone chip assembly 20, is fixed on a supporting substrate 30 of weld pad 301 and multiple corresponding sound wave hand-hole 302 with multiple unit, and is fixedly mated the integrated circuit (IC)-components 31 of application equally; The chip upper surface 2201 of electric property coupling MEMS microphone chip assembly 20 is with integrated circuit (IC)-components 31 in supporting substrate 30, and the method for its electric property coupling can apply chip bonding and bottom filler technology is carried out; Protection plastic body 40 is formed with coated integrated circuit (IC)-components 31 and around the lateral side regions of dynamo-electric microphone chip assembly 20 with operatic tunes cover plate 241 thereafter in encapsulating mould (not shown); Application etching process removes the displacement layer 261 of rear operatic tunes cover plate 241 surrounding; Irradiate the stickiness of the interim cover plate UV stalemate agent 23 of UV light subduction bonding, to remove the space that rear operatic tunes cover plate 241 forms resonant cavity volume 50 after; Engage a tab member 60 in plastic body 40 outer surface, make to form a closed rear resonant cavity volume 50 with the space at original rear operatic tunes cover plate 241 place; And cutting supporting substrate 30 and plastic body 40 and form single electric microphone module for microcomputer 70.
In above-described embodiment, its tab member 60 upper surface more comprises and forms label annotation 62, and label annotation 62 uses radium-shine, printing, burn into punch die, printing or transfer printing process; Again, the juncture of the outer surface of tab member 60 lower surface and plastic body 40 adopts viscose glue heat fusion or heat hardening technique; The cohort that its tab member 60 composition material is selected from simple metal, pure nonmetal and composite material forms.
In above-described embodiment, its plastic body 40 outer surface position can higher than the chip lower surface 2202 of MEMS microphone chip 22, and its plastic body 40 one resin transfer is shaping or the liquid dotting glue method formation of box dam/fillings.
Please refer to the cutaway view that Figure 4 shows that electric microphone module for microcomputer embodiment of the present invention.Its structure comprises: a supporting substrate 30 has multiple weld pad 301 and a sound wave hand-hole 302, and sound wave hand-hole 302 can be vertical through hole or ladder hole; One MEMS microphone chip 22 is with after its chip upper surface 2201 chip bonding, insert primer, make it to be engaged on supporting substrate 30, this chip upper surface 2201 also has a sound wave and senses machine-processed district 221, relative to the chip lower surface 2202 of sensing machine-processed district 221 opposite side, there is a depression 222, depression 222 also corresponds to sound wave hand-hole 302 position, using as sound wave sensing cell; The all devices in top (comprising integrated circuit (IC)-components 31) of the coated above-mentioned supporting substrate 30 of one plastic body 40, but do not comprise the chip lower surface 2202 of MEMS microphone chip 22, to form the formal structure main body of electric microphone module for microcomputer 70; Resonant cavity volume 50 after one tab member 60 and the outer surface of plastic body 40 bond and formed.
In above-described embodiment, tab member 60 more comprises at least one through hole 61 (as shown in Figure 5) at the scope place of the MEMS microphone chip 22 of corresponding below, the diameter of the single through hole 61 of tab member 60 or long limit diameter are less than or equal to the length of side of MEMS microphone chip 22, its through hole 61 can be circle, polygon or other are irregularly shaped, and its arrangement mode can be array or the distribution of staggered eradiation or Arbitrary distribution.
Please refer to shown in Fig. 6, relative to the embodiment of above-mentioned Fig. 4, its tab member 60a has a bottom recess 601a, and when tab member 60a fits in the end face of plastic body 40, its bottom recess 601a also senses position, machine-processed district 221 corresponding to sound wave.
Shown in Fig. 7, another embodiment of electric microphone module for microcomputer, its structure comprises: a supporting substrate 30 with multiple weld pad 301 and a sound wave hand-hole 302, one MEMS microphone chip 22 is fixed on supporting substrate 30 with chip bonding after inserting primer with its chip upper surface 2201, MEMS microphone chip 22 has a sound wave and senses machine-processed district 221, and sense machine-processed district 221 opposite side relative to sound wave there is a depression 222, using as sound wave sensing cell, one tab member 60b, it is fixedly arranged on the chip lower surface 2202 of MEMS microphone chip 22, tab member 60b has a bottom recess 601b, its bottom recess 601b is right against sound wave and senses machine-processed district 221, and a plastic body 40, the all devices in surface of its coated supporting substrate 30 and expose tab member 60b top surface 602.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art can make various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the present invention.
Claims (15)
1. an electric microphone module for microcomputer, is characterized in that, this electric microphone module for microcomputer comprises:
One supporting substrate, it has multiple weld pad and a sound wave hand-hole;
One MEMS microphone chip, it has a chip upper surface and a chip lower surface, this chip upper surface chip bonding is in this supporting substrate, and this chip upper surface has a sound wave senses machine-processed district, and relative to the chip lower surface that this sound wave senses machine-processed district opposite side, there is a depression, using as sound wave sensing cell;
One plastic body, all devices in top of its coated supporting substrate except this chip lower surface of this MEMS microphone chip, and form the formal structure main body of this electric microphone module for microcomputer; And
One tab member, the outer surface bonding of itself and this plastic body, using as rear resonant cavity volume;
Wherein, this microphone chip is positioned at directly over sound wave hand-hole, and the corresponding sound wave hand-hole of this depression.
2. electric microphone module for microcomputer according to claim 1, is characterized in that, this tab member has more a bottom recess and senses machine-processed district corresponding to this sound wave.
3. electric microphone module for microcomputer according to claim 1, is characterized in that, this tab member more comprises at least one through hole at the scope place of this MEMS microphone chip of corresponding below.
4. electric microphone module for microcomputer according to claim 3, is characterized in that, this through hole of this tab member is circular, polygon or other are irregularly shaped.
5. electric microphone module for microcomputer according to claim 3, is characterized in that, this through hole of this tab member be arranged as Arbitrary distribution.
6. electric microphone module for microcomputer according to claim 3, is characterized in that, the diameter of the single through hole of this tab member or long limit diameter are less than or equal to the length of side of this MEMS microphone chip.
7. electric microphone module for microcomputer according to claim 3, is characterized in that, the position of the single through hole of this tab member can in the geometric center of the scope of this MEMS microphone chip of corresponding below.
8. an electric microphone module for microcomputer, is characterized in that, this electric microphone module for microcomputer comprises:
One supporting substrate, it has multiple weld pad and a sound wave hand-hole;
One MEMS microphone chip, it has a chip upper surface and a chip lower surface, this chip upper surface chip bonding is in this supporting substrate, and this chip upper surface has a sound wave senses machine-processed district, and sense machine-processed district opposite side chip lower surface relative to this sound wave there is a depression, using as sound wave sensing cell;
One tab member, it is fixedly arranged on this chip lower surface of this MEMS microphone chip to comprise a top surface and a lower surface, and this tab member has a bottom recess and is aligned with this sound wave and senses machine-processed district; And
One plastic body, all devices in top of its this supporting substrate coated and expose this top surface of this tab member, wherein fit between this tab member and this plastic body completely;
Wherein, this microphone chip is positioned at directly over sound wave hand-hole, and the corresponding sound wave hand-hole of this depression.
9. a MEMS microphone chip assembly, is characterized in that, comprises:
One MEMS microphone chip, it has a chip upper surface and a chip lower surface, and this chip upper surface has a sound wave sensing parts, this chip lower surface has a pothole structure; And
One hybrid rear operatic tunes cover plate assembly, operatic tunes cover plate and a displacement layer after it comprises one, and this displacement layer is looped around this rear operatic tunes cover plate surrounding, this hybrid rear operatic tunes cover plate assembly is combined with this chip lower surface of this MEMS microphone chip, and defines an enclosure space with this sound wave sensing parts and this microphone chip.
10. a manufacture method for MEMS microphone chip assembly, is characterized in that, its step comprises:
There is provided a micro-electro-mechanical microphone silicon chip chip with multiple MEMS microphone chip, it has many chip separation lines of cut, an active surface and a back side;
A transparent interim cover plate is close in this center, back side of this micro-electro-mechanical microphone silicon chip chip with a UV stalemate agent;
Form many grooves in this interim cover plate upper surface, this groove corresponds to this chip separation line of cut of each this micro-electro-mechanical microphone silicon chip;
Fill up an expendable material in this groove space;
Use exposure imaging technique, make this expendable material form many sacrifice layers; And
Cut this groove to form multiple MEMS microphone chip assembly, its cutting width is less than the width of each this groove, operatic tunes cover plate after making this interim cover plate of each this MEMS microphone chip assembly form one, and leave in this rear operatic tunes cover plate surrounding displacement layer formed by this expendable material.
The manufacture method of 11. 1 kinds of electric microphone module for microcomputer, is characterized in that, comprises:
There is provided a supporting substrate, it has the weld pad of multiple unit and multiple corresponding sound wave hand-hole;
One MEMS microphone chip assembly is provided, this MEMS microphone chip assembly comprises a MEMS microphone chip and a hybrid rear operatic tunes cover plate assembly, this MEMS microphone chip has a chip upper surface and a chip lower surface, this chip upper surface has a sound wave sensing parts, this chip lower surface has a pothole structure, operatic tunes cover plate and a displacement layer after this hybrid rear operatic tunes cover plate assembly comprises one, and this displacement layer is looped around this rear operatic tunes cover plate surrounding, this hybrid rear operatic tunes cover plate assembly is combined by UV stalemate agent with this chip lower surface of this MEMS microphone chip, and define an enclosure space with this sound wave sensing parts and this microphone chip,
Application chip bonding and bottom filler technique fix and this chip upper surface of this MEMS microphone chip assembly of electric property coupling and at least one integrated circuit (IC)-components on this supporting substrate;
Plastic body is formed with this integrated circuit (IC)-components coated in encapsulating mould, and around the side of this dynamo-electric microphone chip assembly and its this rear operatic tunes cover plate;
Remove the displacement layer of this rear operatic tunes cover plate surrounding;
Irradiate the viscosity that UV light reduces this UV stalemate agent, to remove the space that this rear operatic tunes cover plate forms resonant cavity volume after;
Engage a tab member in this plastic body outer surface, make to form a closed rear resonant cavity volume with the space at this rear operatic tunes cover plate place original, wherein fit completely between this tab member and this plastic body; And
Cut this supporting substrate and this plastic body forms single electric microphone module for microcomputer.
The manufacture method of 12. electric microphone module for microcomputer according to claim 11, is characterized in that, this tab member upper surface more comprises and forms label annotation, and this label annotation uses radium-shine, printing, burn into punch die, printing or transfer printing process.
The manufacture method of 13. electric microphone module for microcomputer according to claim 11, is characterized in that, the juncture of the outer surface of this tab member lower surface and this plastic body adopts viscose glue heat fusion or heat hardening technique.
The manufacture method of 14. electric microphone module for microcomputer according to claim 11, is characterized in that, the cohort that this tab member composition material is selected from simple metal, pure nonmetal and composite material forms.
The manufacture method of 15. electric microphone module for microcomputer according to claim 11, is characterized in that, this plastic body liquid dotting glue method that is shaping with one resin transfer or box dam/filling is formed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200710195973.5A CN101459866B (en) | 2007-12-14 | 2007-12-14 | Electric microphone module for microcomputer and manufacture method |
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| CN200710195973.5A CN101459866B (en) | 2007-12-14 | 2007-12-14 | Electric microphone module for microcomputer and manufacture method |
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| CN101459866A CN101459866A (en) | 2009-06-17 |
| CN101459866B true CN101459866B (en) | 2016-02-03 |
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| CN106205584A (en) * | 2016-07-06 | 2016-12-07 | 南京大学 | A kind of broadband noise elimination pipeline of Helmholtz resonator based on adjustable resonant frequency |
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