CN101459866A - Electric microphone module for microcomputer and manufacturing method - Google Patents
Electric microphone module for microcomputer and manufacturing method Download PDFInfo
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- CN101459866A CN101459866A CNA2007101959735A CN200710195973A CN101459866A CN 101459866 A CN101459866 A CN 101459866A CN A2007101959735 A CNA2007101959735 A CN A2007101959735A CN 200710195973 A CN200710195973 A CN 200710195973A CN 101459866 A CN101459866 A CN 101459866A
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Abstract
The invention relates to a microcomputer electric microphone module and a making method, wherein the method comprises the following steps: through allocating the thickness dimension of a transparent temporary cover board which is temporarily set in an existing plastic packing structure, after the model forming technique of a plastic protective body, reducing the adhesiveness between the temporary cover board and the back surface of a microcomputer electro-acoustic wave sensing chip through shooting by UV light, then after moving the temporary cover board, the left space is the main source of the volume of a rear vocal cavity of the microcomputer electric microphone, finally covering a label part on the upper portion of the plastic protective body to define the volume of the whole rear vocal cavity to form a closed rear vocal cavity volume. The volume of the rear vocal cavity in the making method is equal to the area of the microcomputer electric microphone chip, which can define the volume of the rear vocal cavity.
Description
Technical field
The present invention is about a kind of micro electronmechanical (MEMS) microphone module and manufacture method, particularly relevant for a kind of electric microphone module for microcomputer and its manufacture method that increases back operatic tunes volume.
Background technology
Aspect the integrated circuit (IC)-components product that is equipped with microphone, the demand of micro-electro-mechanical microphone there is the trend of expansion.For example, on the tendency of present global cell phone manufacturer, except the microphone demand of conversing essential, for camera function is equipped with a microphone in addition again, with the convenience in the realistic use.Design in this respect also slowly appear at present on the portable audio frequency and digital camera product that adopts micro harddisk or flash memory (flash memory), so micro-electro-mechanical microphone might have considerable occupation rate of market in above-mentioned application future.
Micro-electro-mechanical microphone not only thin thickness, volume is little, also can carry out the surface adhering method by reflow soldering (solder reflow), can reduce assembly cost effectively.Therefore want the little and low demand of cost of cube in the face of mobile phone etc., dynamo-electric microphone is capturing original Electret Condencer Microphone (ECM step by step, ElectricCondenser Microphone) market, in addition because micro-electro-mechanical microphone has the innate advantage of low power consumption (160uA), its power consumption is about 1/3 of Electret Condencer Microphone, for the mobile phone of limited reserve of electricity, the advantage of power saving also is to impel micro-electro-mechanical microphone to replace significant motive force of Electret Condencer Microphone.
Please join shown in Figure 1A to Figure 1B, U.S. Patent Publication No. is that US20050185812 adopts the central authorities vibrations film 13 relative position places at the relative micro-electro-mechanical microphone chip 12 with it of supporting substrate 11, in a mode of emptying and do not penetrate supporting substrate 11 downwards, define the back operatic tunes volume 14 of microphone package, in addition, the supporting substrate of printed circuit board (PCB) that cooperates the clamping plate adhesion technique again is at the intermediate course of clamping plate, make the regional overlaids that interlayer adhesion and interlayer hole 15 zones and supporting substrate 11 are emptied with the form of hole 15, with the purpose of operatic tunes volume 14 as the extension of back operatic tunes volume 14 and after realizing strengthening.Design with general electric microphone module for microcomputer, the die size size of general micro-electro-mechanical microphone is approximately 2.0 X 2.0mm, and the diameter region of sound wave Vibration induction film is about 1.0mm, in addition with the supporting substrate of 0.2～0.3mm thickness, interlayer cavity thickness possible in the middle of it is approximately about 0.07mm, the structure of above-mentioned patent, operatic tunes volume is on the supporting substrate thereafter, down extending and do not penetrate supporting substrate with the diameter region of sound wave Vibration induction film is scope.Generally speaking, in the clamping plate process for pressing of actual bearer base material, the hole thickness in intermediate layer is wayward to make it possess homogeneity, and the extendible degree of depth under the diameter region with sound wave Vibration induction film, limited by the thickness of supporting substrate, its space that can form is limited.
Summary of the invention
The invention provides a kind of electric microphone module for microcomputer, comprise: a supporting substrate has a sound wave hand-hole; One micro-electro-mechanical microphone chip has sound wave sensing mechanism district, and sound wave sensing mechanism district is fixed on the supporting substrate, as the sound wave sensing cell; One plastic body coats all devices of top of the supporting substrate except that the micro-electro-mechanical microphone chip upper surface, and forms the formal structure main body of electric microphone module for microcomputer; And the outer surface of tab member and a plastic body is bonding, with as back resonant cavity volume.
Among the present invention, the sound wave hand-hole of its supporting substrate is vertical through hole or ladder hole.
Among the present invention, the scope place of the micro-electro-mechanical microphone chip of its tab member below corresponding more comprises at least one circle, polygon or other erose through holes.
Among the present invention, the arrays of openings of its tab member is that array or staggered eradiation distribute or distribute arbitrarily; And the diameter of the single through hole of tab member or long limit diameter are less than or equal to the length of side of micro-electro-mechanical microphone chip; The position of the single through hole of its tab member can be in the geometric center or any position of the scope of the micro-electro-mechanical microphone chip below corresponding.
The invention provides a kind of manufacture method of micro-electro-mechanical microphone chip assembly, its step comprises: the micro-electro-mechanical microphone silicon chip with a plurality of micro-electro-mechanical microphone chips is provided, and it has many chips and cuts apart line of cut, an active surface and a back side; Be close to a transparent interim cover plate in micro-electro-mechanical microphone silicon chip back center with a UV stalemate agent; Interim cover plate upper surface forms many grooves, and cuts apart line of cut corresponding to each chip; Fill up an expendable material in the ditch slot space; Utilization exposure imaging technology forms many sacrifice layers; And the cutting groove makes the interim cover plate of each micro-electro-mechanical microphone chip assembly form a back operatic tunes cover plate to form a plurality of micro-electro-mechanical microphone chip assemblies, and in around leave by the formed displacement layer of expendable material.
The invention provides a kind of manufacture method of electric microphone module for microcomputer, comprise: a supporting substrate is provided, it has the weld pad and a plurality of corresponding sound wave hand-holes of a plurality of units, and the micro-electro-mechanical microphone chip assembly of the fixing more also technology of the above-mentioned micro-electro-mechanical microphone chip assembly of electric property coupling and the integrated circuit (IC)-components of application thereof are on supporting substrate; In encapsulating mould, form plastic body coating integrated circuit (IC)-components, and around the dynamo-electric microphone chip assembly and the side of operatic tunes cover plate thereafter; Remove back operatic tunes cover plate displacement layer all around; Remove the space that back operatic tunes cover plate forms a back resonant cavity volume; Engage a tab member in the plastic body outer surface, make a back resonant cavity volume that forms sealing with the space at former priority operatic tunes cover plate place; And cutting supporting substrate and plastic body form single electric microphone module for microcomputer.
The beneficial effect that the present invention possessed is: because last back operatic tunes volume among the present invention, can decide by the thickness of the interim cover plate in the manufacture craft, and the increase of thickness can be determined easily and clearly, be different from the design limit that can not surpass supporting substrate thickness of prior art, and the interlayer hole thickness homogeneity design aspect of the supporting substrate that the prior art can't be controlled fully, the present invention has its relative advantage.On the other hand, because the extension substrate of back of the present invention operatic tunes volume is whole micro-electro-mechanical microphone area of chip size, can increase the back operatic tunes volume of electric microphone module for microcomputer more efficiently.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Figure 1A to Figure 1B is depicted as the electric microphone module for microcomputer schematic diagram of operatic tunes volume after the increasing of prior art;
Fig. 2 A to Fig. 2 E is depicted as the structure schematic flow sheet of the manufacture method embodiment of micro-electro-mechanical microphone chip assembly of the present invention;
Fig. 3 A to Fig. 3 F is depicted as the structure schematic flow sheet of the manufacture method embodiment of electric microphone module for microcomputer of the present invention;
Figure 4 shows that the cutaway view of electric microphone module for microcomputer embodiment of the present invention;
Figure 5 shows that the tab member of Fig. 4 embodiment offers the cutaway view of through hole embodiment;
Figure 6 shows that the cutaway view of another embodiment of electric microphone module for microcomputer of the present invention; And
Figure 7 shows that the cutaway view of electric microphone module for microcomputer the 3rd embodiment of the present invention.
Wherein, Reference numeral
11 supporting substrates
12 micro-electro-mechanical microphone chips
13 vibrations films
14 back operatic tunes volumes
15 holes
20 micro-electro-mechanical microphone chip assemblies
21 dynamo-electric microphone silicon chips
211 active surfaces
212 back sides
22 micro-electro-mechanical microphone chips
2201 chip upper surfaces
2202 chip lower surfaces
221 sound wave sensings mechanism district
222 depressions
23 UV stalemate agents
24 interim cover plates
241 back operatic tunes cover plates
25 grooves
26 expendable materials
261 displacement layer
30 supporting substrates
301 weld pads
302 sound wave hand-holes
31 integrated circuit (IC)-components
32 bottom fillers
40 plastic bodies
50 back resonant cavity volumes
60,60a, 60b tab member
601a, 601b bottom shrinkage pool
602 top surfaces
61 through holes
62 label annotations
70 electric microphone module for microcomputer
Embodiment
For making purpose of the present invention, structure, feature and function thereof there are further understanding, cooperate embodiment to be described in detail as follows now.
See also the structure schematic flow sheet that Fig. 2 A to Fig. 2 E is depicted as the manufacture method embodiment of micro-electro-mechanical microphone chip assembly of the present invention.Its micro-electro-mechanical microphone chip assembly 20 manufacture method steps comprise: the micro-electro-mechanical microphone silicon chip 21 with a plurality of micro-electro-mechanical microphone chips 22 is provided, and it has an active surface 211 and a back side 212; Be close to a transparent interim cover plate 24 in 212 centers, the back side of micro-electro-mechanical microphone silicon chip 21 (as Fig. 2 A) with a UV stalemate agent 23; Form many grooves 25 (as Fig. 2 B) at interim cover plate 24 upper surfaces corresponding to each micro-electro-mechanical microphone chip periphery; Then fill up an expendable material 26 in groove 25 spaces (as Fig. 2 C); Utilization exposure imaging technology makes expendable material 26 form many sacrifice layers; And align groove 25 cuttings to form a plurality of micro-electro-mechanical microphone chip assemblies 20 (as Fig. 2 D and Fig. 2 E), the cutting width of its cutter should be less than the width of each groove 25, so that the peripheral regions of the interim cover plate 24 formed back operatic tunes cover plates 241 of each micro-electro-mechanical microphone chip assembly 20 still leaves the displacement layer 261 that is made of expendable material 26.
The disclosed micro-electro-mechanical microphone chip assembly 20 of above-mentioned Fig. 2 E, its structure comprises: a micro-electro-mechanical microphone chip 22, it has a chip upper surface 2201 and a chip lower surface 2202, chip upper surface 2201 has the sound wave sensing parts in sound wave sensing mechanism district 221, has the pothole structure of a depression 222 on the chip lower surface 2202; And one mixed year back operatic tunes cover plate assembly, it comprises a back operatic tunes cover plate 241 and a displacement layer 261, and displacement layer 261 is looped around around the back operatic tunes cover plate 241, it mix to carry back operatic tunes cover plate assembly and combines with the chip lower surface 2202 of micro-electro-mechanical microphone chip 22, and distinguishes 221 sound wave sensing parts and micro-electro-mechanical microphone chip 22 with sound wave sensing mechanism and define an enclosure space.
Please continue F, be depicted as the structure schematic flow sheet of the manufacture method embodiment of electric microphone module for microcomputer of the present invention with reference to Fig. 3 A to Fig. 3.It uses above-mentioned micro-electro-mechanical microphone chip assembly 20, is fixed on the supporting substrate 30 of weld pad 301 with a plurality of units and a plurality of corresponding sound wave hand-holes 302, and fixedly is mated the integrated circuit (IC)-components 31 of application equally; The chip upper surface 2201 of electric property coupling micro-electro-mechanical microphone chip assembly 20 and integrated circuit (IC)-components 31 are in supporting substrate 30, and the method for its electric property coupling can use chip bonding and bottom filler technology is carried out; In the encapsulating mould (not shown), form protection plastic body 40 to coat integrated circuit (IC)-components 31 and around the dynamo-electric microphone chip assembly 20 and the side regions of operatic tunes cover plate 241 thereafter; Use etching process and remove back operatic tunes cover plate 241 displacement layer 261 all around; The stickiness of the interim cover plate UV stalemate agent 23 of irradiation UV light subduction bonding is to remove the space that back operatic tunes cover plate 241 forms a back resonant cavity volume 50; Engage a tab member 60 in plastic body 40 outer surfaces, make a back resonant cavity volume 50 that forms sealing with the space at former priority operatic tunes cover plate 241 places; And cutting supporting substrate 30 forms single electric microphone module for microcomputer 70 with plastic body 40.
In the foregoing description, its tab member 60 upper surfaces more comprise and form label annotation 62, and label annotation 62 is used radium-shine, printing, burn into punch die, printing or transfer printing process; Again, the juncture of the outer surface of tab member 60 lower surfaces and plastic body 40 adopts the viscose glue heating to merge or heat hardening technology; Its tab member 60 composition materials are selected from simple metal, pure nonmetal and cohort that composite material is formed.
In the foregoing description, its plastic body 40 outer surface positions can be higher than the chip lower surface 2202 of micro-electro-mechanical microphone chip 22, and the liquid dotting glue method of its plastic body 40 one resin transfer moulding or box dam/filling forms.
Please refer to the cutaway view that Figure 4 shows that electric microphone module for microcomputer embodiment of the present invention.Its structure comprises: a supporting substrate 30 has a plurality of weld pads 301 and a sound wave hand-hole 302, and sound wave hand-hole 302 can be vertical through hole or ladder hole; One micro-electro-mechanical microphone chip 22 with its chip upper surface 2201 chip bondings after, insert primer, make it to be engaged on the supporting substrate 30, this chip upper surface 2201 also has sound wave sensing mechanism district 221, chip lower surface 2202 with respect to sensing mechanism district 221 opposite sides has a depression 222, depression 222 and corresponding to sound wave hand-hole 302 positions is with as the sound wave sensing cell; One plastic body 40 coats all devices of top (comprising integrated circuit (IC)-components 31) of above-mentioned supporting substrate 30, but does not comprise the chip lower surface 2202 of micro-electro-mechanical microphone chip 22, to form the formal structure main body of electric microphone module for microcomputer 70; One tab member 60 and the bonding formation of the outer surface of plastic body 40 back resonant cavity volume 50.
In the foregoing description, the scope place of the micro-electro-mechanical microphone chip 22 of tab member 60 below corresponding more comprises at least one through hole 61 (as shown in Figure 5), the diameter of the single through hole 61 of tab member 60 or long limit diameter are less than or equal to the length of side of micro-electro-mechanical microphone chip 22, its through hole 61 can be circle, polygon or other are irregularly shaped, and its arrangement mode can be array or staggered eradiation distributes or distributes arbitrarily.
Please refer to shown in Figure 6ly, with respect to the embodiment of above-mentioned Fig. 4, its tab member 60a has a bottom shrinkage pool 601a, when tab member 60a fits in the end face of plastic body 40, and its bottom shrinkage pool 601a and corresponding to 221 positions, sound wave sensing mechanism district.
Please continue with reference to shown in Figure 7, another embodiment of electric microphone module for microcomputer, its structure comprises: one has the supporting substrate 30 of a plurality of weld pads 301 and a sound wave hand-hole 302, one micro-electro-mechanical microphone chip 22 is fixed in supporting substrate 30 with its chip upper surface 2201 with chip bonding and after inserting primer, micro-electro-mechanical microphone chip 22 has sound wave sensing mechanism district 221, and has a depression 222 with respect to sound wave sensing mechanism district 221 opposite sides, with as the sound wave sensing cell, one tab member 60b, it is fixedly arranged on the chip lower surface 2202 of micro-electro-mechanical microphone chip 22, tab member 60b has a bottom shrinkage pool 601b, its bottom shrinkage pool 601b is right against sound wave sensing mechanism district 221, and a plastic body 40, it coats all devices of surface of supporting substrate 30 and exposes tab member 60b top surface 602.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (15)
1. an electric microphone module for microcomputer is characterized in that, this electric microphone module for microcomputer comprises:
One supporting substrate, it has a plurality of weld pads and a sound wave hand-hole;
One micro-electro-mechanical microphone chip, it has a chip upper surface and a chip lower surface, this chip upper surface chip bonding is in this supporting substrate, and this chip upper surface has sound wave sensing mechanism district, and have a depression with respect to the chip lower surface of this sound wave sensing mechanism district opposite side, with as the sound wave sensing cell;
One plastic body, it coats all devices of top of the supporting substrate except this chip lower surface of this micro-electro-mechanical microphone chip, and forms the formal structure main body of this electric microphone module for microcomputer; And
One tab member, the outer surface of itself and this plastic body is bonding, with as back resonant cavity volume.
2. electric microphone module for microcomputer according to claim 1 is characterized in that, this tab member has more a bottom shrinkage pool corresponding to this sound wave sensing mechanism district.
3. electric microphone module for microcomputer according to claim 1 is characterized in that, the scope place of this micro-electro-mechanical microphone chip of this tab member below corresponding more comprises at least one through hole.
4. electric microphone module for microcomputer according to claim 3 is characterized in that, this through hole of this tab member is that circular, polygon or other are irregularly shaped.
5. electric microphone module for microcomputer according to claim 3 is characterized in that, be arranged as array or the staggered eradiation of this through hole of this tab member distribute or distribute arbitrarily.
6. electric microphone module for microcomputer according to claim 3 is characterized in that, the diameter of the single through hole of this tab member or long limit diameter are less than or equal to the length of side of this micro-electro-mechanical microphone chip.
7. electric microphone module for microcomputer according to claim 3 is characterized in that, the position of the single through hole of this tab member can be in the geometric center of the scope of this micro-electro-mechanical microphone chip below corresponding.
8. an electric microphone module for microcomputer is characterized in that, this electric microphone module for microcomputer comprises:
One supporting substrate, it has a plurality of weld pads and a sound wave hand-hole;
One micro-electro-mechanical microphone chip, it has a chip upper surface and a chip lower surface, this chip upper surface chip bonding is in this supporting substrate, and this chip upper surface has sound wave sensing mechanism district, and have a depression with respect to this sound wave sensing mechanism district opposite side chip lower surface, with as the sound wave sensing cell;
One tab member, it is fixedly arranged on this chip lower surface of this micro-electro-mechanical microphone chip, and this tab member has a bottom shrinkage pool and is aligned with this sound wave sensing mechanism district; And
One plastic body, this top surface that it coats all devices of top of this supporting substrate and exposes this tab member.
9. a micro-electro-mechanical microphone chip assembly is characterized in that, comprises:
One micro-electro-mechanical microphone chip, it has a chip upper surface and a chip lower surface, and this chip upper surface has a sound wave sensing parts, has a pothole structure on this chip lower surface; And
One mixes a year back operatic tunes cover plate assembly, it comprises a back operatic tunes cover plate and a displacement layer, and this displacement layer is looped around around this back operatic tunes lid, should mix a year back operatic tunes cover plate assembly and combine, and define an enclosure space with this sound wave sensing parts and this microphone chip with this chip lower surface of this micro-electro-mechanical microphone chip.
10. the manufacture method of a micro-electro-mechanical microphone chip assembly is characterized in that, its step comprises:
Micro-electro-mechanical microphone silicon chip chip with a plurality of micro-electro-mechanical microphone chips is provided, and it has many chips and cuts apart line of cut, an active surface and a back side;
Be close to a transparent interim cover plate in this center, back side of this micro-electro-mechanical microphone silicon chip chip with a UV stalemate agent;
Form many grooves in this interim cover plate upper surface, this groove is cut apart line of cut corresponding to this chip of each this micro-electro-mechanical microphone silicon chip;
Fill up an expendable material in this ditch slot space;
Utilization exposure imaging technology makes this expendable material form many sacrifice layers; And
Cut this groove to form a plurality of micro-electro-mechanical microphone chip assemblies, its cutting width is less than the width of each this groove, make this interim cover plate of each this micro-electro-mechanical microphone chip assembly form a back operatic tunes cover plate, and around this back operatic tunes cover plate, leave by the formed displacement layer of this expendable material.
11. the manufacture method of an electric microphone module for microcomputer is characterized in that, comprises:
One supporting substrate is provided, and it has the weld pad and a plurality of corresponding sound wave hand-holes of a plurality of units;
One micro-electro-mechanical microphone chip assembly is provided, this micro-electro-mechanical microphone chip assembly comprises a micro-electro-mechanical microphone chip and and mixes a year back operatic tunes cover plate assembly, this micro-electro-mechanical microphone chip has a chip upper surface and a chip lower surface, this chip upper surface has a sound wave sensing parts, has a pothole structure on this chip lower surface, should mix a year back operatic tunes cover plate assembly and comprise a back operatic tunes cover plate and a displacement layer, and this displacement layer is looped around around this back operatic tunes lid, should mix a year back operatic tunes cover plate assembly and combine, and define an enclosure space with this sound wave sensing parts and this microphone chip with this chip lower surface of this micro-electro-mechanical microphone chip;
This chip upper surface of fixing also this micro-electro-mechanical microphone chip assembly of electric property coupling of application chip bonding and bottom filler technology and at least one integrated circuit (IC)-components are on this supporting substrate;
In encapsulating mould, form plastic body coating this integrated circuit (IC)-components, and around this electromechanics microphone chip assembly and its back side of operatic tunes cover plate;
Remove this back operatic tunes cover plate displacement layer all around;
Irradiation UV light reduces the viscosity of this UV stalemate agent, to remove the space that this back operatic tunes cover plate forms a back resonant cavity volume;
Engage a tab member in this plastic body outer surface, make a back resonant cavity volume that forms sealing with the space at original this operatic tunes cover plate place, back; And
Cut this supporting substrate and this plastic body forms single electric microphone module for microcomputer.
12. the manufacture method of electric microphone module for microcomputer according to claim 11 is characterized in that, this tab member upper surface more comprises and forms the label annotation, and this label annotation is used radium-shine, printing, burn into punch die, printing or transfer printing process.
13. the manufacture method of electric microphone module for microcomputer according to claim 11 is characterized in that, the juncture of the outer surface of this tab member lower surface and this plastic body adopts the viscose glue heating to merge or heat hardening technology.
14. the manufacture method of electric microphone module for microcomputer according to claim 11 is characterized in that, this tab member composition material is selected from simple metal, pure nonmetal and cohort that composite material is formed.
15. the manufacture method of electric microphone module for microcomputer according to claim 11 is characterized in that, this plastic body forms with the liquid dotting glue method of the moulding of one resin transfer or box dam/filling.
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| CN200710195973.5A CN101459866B (en) | 2007-12-14 | 2007-12-14 | Electric microphone module for microcomputer and manufacture method |
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| CN200710195973.5A CN101459866B (en) | 2007-12-14 | 2007-12-14 | Electric microphone module for microcomputer and manufacture method |
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