JP5094802B2 - Optical element wafer manufacturing method - Google Patents

Description

  The present invention relates to an optical element wafer such as a lens wafer or an optical functional element wafer provided with a plurality of lenses as a plurality of optical elements that collect incident light, and a method for manufacturing the same. The present invention relates to an optical element cut into pieces by batch cutting from an optical element wafer, and an optical element module cut into pieces from an optical element wafer module in which a plurality of optical element wafers are stacked. The present invention relates to an electronic element wafer module such as a sensor wafer module in which an optical element or an optical element module is integrated with an imaging element wafer provided with a plurality of imaging elements that photoelectrically convert image light from a subject. The present invention also relates to an electronic element module in which the electronic element wafer module is collectively cut into individual pieces, or the optical element or the optical element module is modularized with an electronic element. The present invention uses a digital camera such as a digital video camera and a digital still camera, an image input camera, a scanner device, a facsimile device, and a camera-equipped mobile phone using the sensor module as the electronic element module as an image input device in an image pickup unit. The present invention relates to electronic information equipment such as devices and television telephone devices.

  As a conventional optical element wafer of this type, a lens wafer in which a plurality of convex lenses are arranged in a matrix is positioned and focused on each image sensor of the image sensor wafer and pasted as a camera module. It is integrated.

  A method for manufacturing a convex lens wafer as an optical element wafer is disclosed in Patent Document 1.

  FIG. 9 is a schematic diagram for explaining a conventional method of manufacturing a convex lens wafer disclosed in Patent Document 1. In FIG.

  In FIG. 9, in the conventional reference grid manufacturing apparatus 100, a photo-curing resin 105 is interposed between the fine uneven shape pattern 102 of the flat plate transfer master 101 and the molding plane 104 of the replica base 103, and the fine uneven shape is obtained. In a state where the pattern 102 is pressed against the photocurable resin 105, the photocurable resin 105 is cured by irradiating ultraviolet rays from below the photocurable resin 105 with an ultraviolet light source 106. Thereby, the fine uneven | corrugated shape pattern which transferred the fine uneven | corrugated shape pattern 102 on the upper surface of the photocurable resin 105 is completed. As described above, in the method of forming the fine concavo-convex pattern 102 using the conventional reference lattice manufacturing apparatus 100, the fine concavo-convex pattern 102 can be processed with high accuracy and efficiency regardless of the size of the reference lattice. It becomes.

  An example of the process of the conventional method for manufacturing a convex lens wafer will be described in detail with reference to FIGS. 10 (a) to 10 (d) and FIGS. 11 (a) to 11 (c).

  10 (a) to 10 (d) are longitudinal sectional views for explaining a mold manufacturing process for manufacturing a conventional convex lens wafer, and FIGS. 11 (a) to 11 (c). ) Are main part longitudinal sectional views for explaining the manufacturing process of the conventional convex lens wafer.

  First, as shown in the replica mold forming step of FIG. 10A, a resin material 202 is discharged to a predetermined position on a base material 201 made of a glass substrate or a silicon substrate. The resin material 202 is pressed from above using the master mold 203. As a result, the lower surface shape of the master mold 203 is transferred to the upper surface of the resin material 202 to form the resin replica 204. By repeating this in sequence, replica molds of a plurality of resin replicas 204 are formed at equal intervals on the base material 201 as shown in FIG. 9B.

  As shown in FIG. 10C, the replica molds of the plurality of resin replicas 204 on the substrate 201 are transferred to the stamper mold 205 of the upper mold of the wafer using the replica molds of the plurality of resin replicas 204.

  As shown in FIG. 10D, the wafer size stamper mold 205 is released from the replica molds of the plurality of resin replicas 204 on the base material 201 to obtain an upper mold stamper mold 205. Similarly, after the replica molds of the plurality of resin replicas 204 formed on the substrate 201 are transferred to the stamper mold 206 of the lower mold shown in FIG. A mold stamper mold 206 is obtained.

  As shown in FIG. 11 (a), an appropriate amount of a molding resin 207 for the lens is discharged to the center position on the lower mold stamper mold 206, and this is pressed from above by the upper mold stamper mold 205, The molding resin 207 is sandwiched from above and below by the stamper molds 205 and 206, and the lens wafer 208 is press-molded as shown in FIG. At this time, the molding resin 207 is spread by controlling the upper and lower molds to have a desired lens thickness.

  Further, after the molding resin 207 is cured, the upper and lower stamper molds 205 and 206 are opened and released, and the desired lens wafer 208 is taken out from the upper and lower molds as shown in FIG. In this way, a lens wafer 208 having a desired shape can be obtained.

JP 2006-64455 A

  However, in the conventional configuration disclosed in Patent Document 1, the resin replica 204 sticks to the master mold 203 when the master mold 203 is released after the resin replica 204 is molded, as shown in FIG. Thus, peeling occurs at the interface between the resin replica 204 and the base material 201. Further, when the anchor coat material 204a is applied to the surface of the substrate 201, the adhesion between the resin replica 204 and the anchor coat material 204a is increased, but peeling occurs at the interface between the anchor coat material 204a and the substrate 201, Or the crack 204b may generate | occur | produce in resin replica 204 itself.

  In addition, when the resin replica 204 is individually manufactured by the master mold 203, it is formed due to the wettability between the surface of the base material 201 and the surface of the master mold 203, the pressure during molding, the viscosity of the resin material 202, and the like. The side shape of the resin replica 204 may not be vertical. For example, as shown in FIG. 13 (a), there is a problem when the stamper mold 205 is released later due to the swelling 204c on the side surface of the resin replica 204, the recess 204d on the side surface of the resin replica 204, and the reverse taper 204e on the side surface of the resin replica 204. appear. That is, after the stamper mold 205 is manufactured, when the stamper mold 205 is released from the resin replica 204, the stamper mold 205 bites into the side surface of the resin replica 204, as shown in FIGS. 13B and 13C. As described above, when the resin replica 204 is lifted together with the stamper mold 205, or when the mold is forcibly released, the resin replica 204 is cracked, and the resin remains in the stamper mold 205.

  Furthermore, as shown in FIGS. 14 (a) and 14 (b), since the thickness of the resin portion 208a between adjacent resin patterns becomes thinner as the resin thickness at the time of replica production of the resin replica 204 is larger, When the lens wafer 208, which is a large resin plate, is produced, a problem arises in strength. 14A, when the molding resin 207 is sandwiched from above and below by the stamper molds 205 and 206 to spread the molding resin 207, the air in the molding resin 207, the stamper molds 205 and 206, It is difficult for air to escape in a narrow space, and bubbles tend to remain on the lens wafer 208 that is a resin plate. If the bubbles remain in the lens function portion of the lens wafer 208, the light condensing on the image sensor is hindered.

  The present invention solves the above-mentioned conventional problems. In addition to forming a resin replica with high precision and forming upper and lower stamper molds with high precision, there are strength problems and bubble remaining even when making a large lens wafer. Optical element wafers such as lens wafers and methods for manufacturing the same, optical elements separated from the optical element wafers into individual pieces, and optical element wafer modules in which a plurality of optical element wafers are stacked together An optical element module separated into individual pieces, an electronic element wafer module in which an optical element or an optical element module and an electronic element wafer are integrated, or the optical element wafer module is cut into pieces and separated into individual pieces. Alternatively, an electronic element module obtained by modularizing an optical element module with an electronic element module, and the electronic element And to provide an electronic information device such as a mobile phone device or a television telephone apparatus equipped with a camera using the imaging unit Joule as a sensor module.

The method for manufacturing an optical element wafer of the present invention is the manufacturing method of the optical element wafer having a plurality of optical elements are arranged two-dimensionally, replica forming step of forming a replica within a plurality of recesses formed in the substrate A stamper mold forming step of forming a stamper mold by transferring the shape of each optical element formed on the surface side of the replica embedded in the recess of the base material; An optical element wafer forming step of transferring an element shape to form an optical element wafer, wherein the replica forming step includes a step of discharging a replica material into a plurality of recesses formed in the base material, and a master mold are those having an optical element shape transfer step of the optical element shapes in the master mold to press on the replica material transferred to the surface side of the replica material using the above objects attained by its It is.

  Preferably, in the optical element wafer manufacturing method of the present invention, the replica forming step forms an upper replica in which the optical element shape for the surface is formed on the surface side in the plurality of recesses formed on the base material. An upper replica forming step, and a lower replica forming step of forming a lower replica in which the shape of the optical element for the back surface is formed on the front surface side in a plurality of concave portions formed on another base material.

Further preferably, in the optical element wafer forming step of the optical element wafer manufacturing method of the present invention, a flat portion having a predetermined thickness is provided on the outer peripheral side of the optical element shape, and is between the adjacent optical element shapes. The optical element wafer is formed in which the flat portions are connected by a connecting portion made of the same material as the shape of the optical element .

  Further preferably, in the method for producing an optical element wafer of the present invention, the depth of the recess of the base material is set so that a contact area between the base material and the replica is larger than a contact area between the replica and the master mold. Set the size.

  Further preferably, in the method for producing an optical element wafer of the present invention, the depth of the recess of the base material is set so that a contact area between the base material and the replica is larger than a contact area between the replica and the stamper mold. Set the size.

  Further preferably, the stamper mold forming step in the method of manufacturing an optical element wafer of the present invention includes an upper stamper mold forming step of forming an upper stamper mold by transferring each optical element shape of the upper replica, A lower stamper mold forming step of transferring the shape of each optical element of the lower replica to form a lower stamper mold.

  Still preferably, in an optical element wafer manufacturing method of the present invention, the optical element wafer molding step is an optical element material pressing step in which the optical element material is pressed to a predetermined thickness by the upper stamper mold and the lower stamper mold. And an optical element material curing step for photocuring or thermosetting the optical element material.

  Still preferably, in an optical element wafer manufacturing method of the present invention, the optical element is one or a plurality of lenses.

Further preferably, the optical element in the method of manufacturing an optical element wafer according to the present invention is an optical functional element that causes outgoing light to go straight and emit, and bends incident light to enter in a predetermined direction.

  The optical element wafer of the present invention is manufactured by the method for manufacturing an optical element wafer, thereby achieving the above object.

Optics wafer of the present invention is manufactured by the manufacturing method of the optical element wafer of the present invention, an optical element wafers arranged plurality of optical elements two-dimensionally, at least one of the wafer surface and the wafer back surface A plurality of optical element regions are provided, and a flat portion having a predetermined thickness is provided on the outer peripheral side of the optical element region, and the thickness of the flat portion between adjacent optical element regions and between the flat portions The thickness of the continuous portion is in the range of half to the equivalent thickness, whereby the above object is achieved.

  Further preferably, in the optical element wafer of the present invention, the thickness of the flat portion between the adjacent optical element regions is equal to 4/3 or 3/4 of the thickness of the connecting portion between the flat portions. Is in the thickness range.

  Further preferably, the optical element in the optical element wafer of the present invention is one or a plurality of lenses.

  Further preferably, the optical element in the optical element wafer of the present invention is an optical functional element that causes the outgoing light to go straight and to be emitted, and also causes the incident light to be bent and incident in a predetermined direction.

  The optical element of the present invention is an optical element cut from the optical element wafer of the present invention and separated into pieces, and an optical surface is provided at the center, and a predetermined thickness is provided on the outer peripheral side of the optical surface. A spacer portion is provided, and thereby the above object is achieved.

  The optical element module of the present invention is cut and separated from an optical element wafer module in which a plurality of the optical element wafers of the present invention are laminated with the optical surfaces coincided with each other, whereby the above object is achieved. The

  The optical element module of the present invention preferably has a light-shielding holder that shields light from the upper surface other than the uppermost optical surface and the side surfaces of the plurality of optical elements.

  The optical element module of the present invention has a light-shielding holder that shields light from the upper surface and side surfaces other than the optical surface of the optical element of the present invention, thereby achieving the above object.

  An electronic element wafer module of the present invention includes an electronic element wafer in which a plurality of electronic elements having through electrodes are disposed, a resin adhesive layer formed in a predetermined region on the electronic element wafer, and the electronic element wafer. A transparent support substrate that is covered and fixed on the resin adhesive layer, and the optical element according to the present invention is bonded and integrated on the transparent support substrate so that each optical element corresponds to each of the plurality of electronic elements. And the above object is achieved.

  Preferably, the optical element wafer in the electronic element wafer module of the present invention includes three lenses, an aberration correction lens, a diffusion lens, and a condenser lens, each having a predetermined thickness provided on each outer peripheral side of these lenses. This is a lens wafer module in which flat portions having thickness are stacked in this order from the bottom.

  Still preferably, in an electronic element wafer module according to the present invention, the electronic element is an imaging element having a plurality of light receiving sections that image-convert image light from a subject.

  Further preferably, the electronic elements in the electronic element wafer module of the present invention are a light emitting element for generating outgoing light and a light receiving element for receiving incident light.

  The electronic element module of the present invention is cut from the electronic element wafer module of the present invention one by one or plural pieces, thereby achieving the above object.

  The electronic information device according to the present invention uses the electronic element module cut and separated from the electronic element wafer module according to the present invention as a sensor module in an imaging unit, thereby achieving the above object. .

  An electronic information device according to the present invention uses an electronic element module cut and separated from the electronic element wafer module according to the present invention for an information recording / reproducing unit, thereby achieving the above object. .

  With the above configuration, the operation of the present invention will be described below.

  In the present invention, as a method for manufacturing an optical element wafer, a replica forming step of forming a replica in which an optical element shape is formed on the surface side in a plurality of recesses formed on a substrate, and each optical element of this replica A stamper mold forming step of forming a stamper mold using the shape, and an optical element wafer molding step of molding the optical element wafer by transferring the optical element shape to the optical element material using the stamper mold. Thus, the optical element wafer of the present invention is provided with a plurality of optical element regions on at least one of the wafer front surface and the wafer back surface, and a flat portion having a predetermined thickness is provided on the outer peripheral side of the optical element region. ing. The thickness of the flat portion between the optical element regions adjacent to each other and the thickness of the continuous portion between the flat portions are in the range of half to the equivalent thickness. Preferably, the thickness of the flat portion between the optical element regions adjacent to each other is in a range of equivalent thickness from 4/3 or 3/4 of the thickness of the connecting portion between the flat portions.

  Therefore, a replica is formed by embedding part or all of the side surface of the replica in a plurality of recesses dug into the base material. For this reason, the contact area between the substrate and the replica is larger than the contact area between the replica and the master mold, and the contact area between the substrate and the replica is larger than the contact area between the replica and the stamper mold. As a result, the mold release of the master type and the stamper type is smooth, and the thickness of the connecting portion between the flat portions is increased by the depth of the concave portion, whereby a replica is accurately formed and the upper and lower stampers are accurately formed. A mold can be formed. In addition, even when a large lens wafer is made, the strength problem can be solved. Further, the step on the surface is relaxed, and the problem of remaining bubbles can be solved.

  As described above, according to the present invention, a replica is formed by embedding a part or all of the side surface of the replica in the plurality of recesses dug into the base material. Since the contact area between the base and the replica is larger than the contact area between the replica and the stamper mold, the master mold and stamper mold can be released smoothly and the recess The thickness of the connecting part between the flat parts is increased by the depth, which makes it possible to accurately form replicas to form the upper and lower stamper molds and to produce large lens wafers. Problems can be solved, and the step on the surface can be relaxed to eliminate the problem of remaining bubbles.

It is a principal part longitudinal cross-sectional view which shows the structural example of the lens wafer which concerns on embodiment of this invention. FIG. 5 is a longitudinal sectional view of a main part for explaining a replica manufacturing process of the method for manufacturing the lens wafer of FIG. 1. It is a perspective view which shows typically the example of schematic structure of the digging base material used for the replica preparation process of FIG. (A)-(c) is a principal part longitudinal cross-sectional view for demonstrating the metal mold | die preparation process for manufacturing the lens wafer of FIG. (A) And (b) is a principal part longitudinal cross-sectional view for demonstrating the shaping | molding process of the lens wafer of FIG. (A) is a longitudinal sectional view showing a modified example of a lens separated from the lens wafer of FIG. 1, (b) is a longitudinal sectional view showing an example of a lens module in which a plurality of lenses are laminated, and (c) is shown. The top view of the 2nd lens of (b), (d) is the top view of the 1st lens of (b), (e) is a longitudinal cross-sectional view of the lens module at the time of combining a 1st lens and a light-shielding holder. (F) is a longitudinal cross-sectional view of a lens module when a modified example of the lens module of (b) is combined with a light-shielding holder, and (g) is a stack of a light-shielding holder wafer, a first lens wafer, and a second lens wafer. It is a longitudinal cross-sectional view which shows the example of a principal part structure of a lens wafer module. It is a longitudinal cross-sectional view which shows the principal part structural example of the sensor module which concerns on Embodiment 3 of this invention. As a fourth embodiment of the present invention, the sensor module of the third embodiment in which the lens module and the image sensor chip are integrated, or the sensor module 10A in which the lens and the lens module of the second embodiment and the image sensor chip are integrated. 1 is a block diagram illustrating a schematic configuration example of an electronic information device using a solid-state imaging device including an imaging unit as an imaging unit. It is a schematic diagram for demonstrating the manufacturing method of the conventional convex lens wafer currently disclosed by patent document 1. FIG. (A)-(d) is a principal part longitudinal cross-sectional view for demonstrating the metal mold | die preparation process for manufacturing the conventional convex lens wafer. (A)-(c) is a principal part longitudinal cross-sectional view for demonstrating the shaping | molding process of the conventional convex lens wafer. It is a principal part longitudinal cross-sectional view which shows the replica shaping | molding process for demonstrating the problem which generate | occur | produces at the time of mold release of the master metal mold | die after resin replica shaping | molding. (A)-(c) is a principal part longitudinal cross-sectional view which shows the stamper type | mold formation process for demonstrating the problem at the time of releasing a stamper type | mold from a resin replica. (A) And (b) is a principal part longitudinal cross-sectional view which shows the lens wafer shaping | molding process for demonstrating the problem which generate | occur | produces at the time of shaping | molding of a lens wafer.

  Hereinafter, a case where the present invention is applied to a lens wafer and a manufacturing method thereof as Embodiment 1 of the optical element wafer and the manufacturing method thereof will be described in detail with reference to the drawings. Further, a lens and a lens module will be described in detail as Embodiment 2 of an optical element obtained by dividing an optical element wafer into pieces and an optical element module obtained by dividing an optical element wafer module in which a plurality of optical elements are laminated, with reference to the drawings. To do. Furthermore, as a third embodiment of the electronic element module that is collectively cut from the electronic element wafer module of the present invention, the lens wafer of the first embodiment and a plurality of imaging elements that photoelectrically convert image light from a subject are provided. The case where the sensor module integrated with the obtained imaging device wafer is applied will be described in detail with reference to the drawings. Drawing 3 about Embodiment 3 of electronic information equipment, such as a mobile telephone apparatus with a camera, a television telephone apparatus, etc. which used this sensor module or a sensor module using an optical element module concerning Embodiment 2 for an image pick-up part as an image input device Will be described in detail with reference to FIG.

(Embodiment 1)
FIG. 1 is a longitudinal sectional view of an essential part showing a configuration example of a lens wafer according to an embodiment of the present invention.

  In FIG. 1, a lens wafer 1 as an optical element wafer of Embodiment 1 has a plurality of lens areas 2 as optical element areas formed on at least one of a front surface and a back surface, and an outer peripheral side of the lens area 2. The flat portion 3 having a predetermined thickness is provided, and the relationship between the thickness D1 of the flat portion 3 between the adjacent lens regions 2 and the thickness D2 of the connecting portion 4 between the flat portions 3 is doubled. A relationship within a range from half (2/1 or 1/2) to an equivalent range, preferably, the thickness D1 of the flat portion 3 between adjacent lens regions 2 is the thickness of the connecting portion 4 between the flat portions 3. The relationship is within the same range from 4/3 (or 3/4) of the length D2.

  Here, the resin thickness D2 between the individual resin patterns in the lens region 2 as the optical element region and the flat portion 3 around the lens region 2 is configured to be thick and approximately equal (uniform) to the resin thickness D1 of the resin pattern. Yes. As a result, the unevenness of the front and back surfaces of the lens wafer 1 is reduced (the level difference is reduced). Therefore, it is difficult to hinder the fluidity of the resin, and it is difficult for bubbles to remain in the lens wafer 1.

  Each process of the manufacturing method of the lens wafer 1 as an optical element wafer of the said structure is demonstrated in detail using FIGS.

  FIG. 2 is a longitudinal sectional view of an essential part for explaining a replica manufacturing process of the lens wafer manufacturing method of FIG. FIG. 3 is a perspective view schematically showing a schematic configuration example of the digging base material used in the replica manufacturing process of FIG.

  On the surface of the base material 11 made of a glass substrate, a silicon substrate, or a resin substrate, a plurality of recesses 11a as shown in FIG. 3 are arranged in a matrix. First, the resin material 12 is discharged into the recess 11a of the substrate 11 as shown in the replica mold forming step of FIG. Next, the resin material 12 is pressed from above using the master mold 13 to transfer the predetermined lens shape of the master mold 13 to the surface of the resin material 12 to form the resin replica 14. This is repeated sequentially to form replica molds of a plurality of resin replicas 14 on the substrate 11 at equal intervals.

  Thus, the side surface of the resin replica 14 is embedded in the digging shape of the base material 11 (inside the recess 11a), so that the contact area of the resin material 12 of the resin replica 14 with the base material 11 is increased. Due to this and the anchor effect by the side surface of the concave portion 11a (digging portion) of the base material 11, the adhesion between the base material 11 and the resin material 12 is improved, and the master mold 13 from the resin replica 14 is improved. Even during mold release, conventional resin cracking and resin peeling can be reduced.

  Next, as shown in FIGS. 4 (a) and 4 (b), the base material 11 is used by using each replica mold of the plurality of resin replicas 14 embedded in the recessed portion 11a of the base material 11 dug. The replica mold of the plurality of resin replicas 14 is transferred to the upper stamper mold 15 of the wafer size as a lens surface shape. Further, as shown in FIG. 4C, the upper mold stamper mold 15 is released from the replica mold of the plurality of resin replicas 14 on the base material 11 to obtain the upper mold stamper mold 15. In the same manner, a replica mold of a plurality of resin replicas 14 formed on the substrate 11 is transferred to a stamper mold 16 to be described later, and then released to obtain a stamper mold 16 of a lower mold. Can do.

  As described above, when forming the replica molds of the plurality of resin replicas 14 on the base material 11, the side surfaces of the replica molds of the resin replica 14 are embedded in the recesses 11 a of the base material 11 having vertical side walls. For this reason, as in the prior art, the side surface of the resin replica 14 is swollen or dented due to the wettability between the surface of the base material 11 and the surface of the master mold 13, the pressure during molding, the viscosity of the resin material 12, and the like. Without going down or becoming a reverse taper, it becomes vertical in the recess 11a of the base material 11, and the subsequent release of the stamper dies 15 and 16 becomes smooth. Resin residue is not generated in the stamper molds 15 and 16.

  Subsequently, as shown in FIG. 5A, an appropriate amount of the molding resin 17 for the lens is discharged onto the center portion of the stamper mold 16 of the lower mold. Next, this is pressed from above with a stamper die 15 of an upper mold, and a molding resin 17 is sandwiched from above and below by the stamper dies 15 and 16, and press-molded onto the lens wafer 1 as shown in FIG. . As a result, the molding resin 17 is spread by the upper and lower molds so as to obtain a desired lens thickness.

  Thereafter, the molded molding resin 17 is cured by ultraviolet rays or heat, and then the upper and lower stamper molds 15 and 16 are opened and released up and down to release the desired lens wafer 1 in the upper and lower molds as shown in FIG. Take out from. In this way, a lens wafer 1 in which a plurality of desired lens shapes are regularly repeated can be obtained.

  That is, the manufacturing method of the lens wafer 1 as the optical element wafer according to the first embodiment includes a step of discharging the replica material into the plurality of recesses 11 a formed on the base material 11, The upper surface replica forming step of forming the upper resin replica 14 by transferring the surface lens shape of the master die 13 to the surface side of the replica material by pressing and a plurality of concave portions 11a formed on another substrate 11 The step of discharging the replica material into the inside and pressing the replica material with another master die 13 to transfer the back lens shape of the master die 13 to the surface side of the replica material to form the lower resin replica 14 A lower replica forming process, an upper stamper mold forming process for forming the upper stamper mold 15 by transferring the surface shape of each lens of the upper resin replica 14, and the lower resin replica 1 A lower stamper mold forming step for transferring the shape of each lens back surface to form a lower stamper mold 16 and an optical element material press for pressing the lens material to a predetermined thickness by the upper stamper mold 15 and the lower stamper mold 16. And an optical element material curing step for photocuring or thermosetting the lens material.

  In this case, the resin replica 14 is formed by embedding part or all of the side surfaces of the resin replica 14 in the plurality of recesses 11 a dug into the base material 11. Further, the contact area between the base material 11 and the resin replica 14 is larger than the contact area between the resin replica 14 and the master mold 13, and the contact area between the base material 11 and the resin replica 14 is equal to the resin replica 14 and the stamper mold 15. The depth of the recess 11a of the base material 11 is set so as to be larger than the contact area of 16.

  Thus, since the resin material 12 which comprises the resin replica 14 is embedded in the dug part (recessed part 11a) of the base material 11 when shape | molding the resin replica 14 separately, between each resin pattern Since the resin thickness and the resin pattern between the resin patterns are uniform, the strength of the lens wafer 1 which is a large resin plate is also good. Further, when the molding resin 17 is sandwiched from above and below by the stamper molds 15 and 16 and the molding resin 17 is spread, the stamper molds 15 and 16 have less irregularities than the prior art, and the fluidity of the resin is hardly hindered. In addition, bubbles hardly remain on the lens wafer 1.

  In the production of the resin replica 14, the performance required for the substrate 11 to be used is (1) flatness affecting the inclination and height variation of the final lens, (2) material and characteristics of the replica resin material 12 (selected shape) (3) High adhesion to the resin for making a replica mold of the resin replica 14 is required. By providing a dug portion (recess 11a) in the replica-producing base material 11, the size of the resin replica 14, for example, the replica diameter can be easily controlled, and the parallelism between the mold surface and the glass surface is obtained. It is easy and the inclination of the shape can be reduced. Since the digging shape increases the adhesion area with the resin, the adhesion of the replica resin material 12 is improved with respect to any material.

  Further, the replica resin material 12 is structured to be embedded in the digging portion (recessed portion 11 a) of the base material 11. For this reason, the level difference between the surface of the resin replica 14 and the surface of the substrate 11 is reduced, and the contact area between the upper and lower stamper dies 15 and 16 after forming the upper and lower stamper dies 15 and 16 is also reduced. The amount of resin biting into the concave and convex shapes 15 and 16 is also reduced. This makes it easy to release the stamper dies 15 and 16 from the resin replica 14.

  Further, the replica resin material 12 is embedded in the digging portion (recess 11a) of the base material 11. For this reason, the level difference between the surface of the resin replica 14 and the surface of the substrate 11 is reduced, and when the lens is formed by the upper and lower stamper molds 15 and 16, the thickness of the lens resin plate is thick and uniform. , WL lens (wafer level lens; lens wafer) can be easily molded.

(Embodiment 2)
In the second embodiment, a modified example of the lens as an optical element obtained by dividing the lens wafer 1 as an optical element wafer formed by the upper stamper mold 15 and the lower stamper mold 16 in the first embodiment, and A modification of the lens module as an optical element module in which a plurality of lenses are laminated will be described in detail.

  6A is a longitudinal sectional view showing a modified example of the lens separated from the lens wafer of FIG. 1, and FIG. 6B is a longitudinal sectional view showing an example of a lens module in which a plurality of lenses are stacked. 6C is a top view of the second lens in FIG. 6B, FIG. 6D is a top view of the first lens in FIG. 6B, and FIG. 6E is the first lens. 6F is a longitudinal cross-sectional view of the lens module when the light-shielding holder is combined, and FIG. 6F is a vertical cross-sectional view of the lens module when the light-shielding holder is combined with the modification of the lens module of FIG. (G) is a longitudinal sectional view showing an example of a principal part configuration of a lens wafer module in which a light shielding holder wafer 187B, a first lens wafer 65B, and a second lens wafer 185B are laminated.

  The upper stamper mold 15 and the lower stamper mold 16 of the first embodiment are cut along the dicing line DL, respectively, with the first lens wafer and the second lens wafer formed by upper and lower molds having different lens surfaces. As shown in FIG. 6A, a large number of first lenses 84 and a large number of second lenses 85 can be obtained. Each of the first lens 84 and the second lens 85 is provided with a spacer portion having a predetermined thickness on the outer peripheral side of the optical surface A at the center. As shown in FIG. 6 (d), the spacer portion is a convex shape of the optical surface A from the circular outer peripheral end B surrounding the optical surface A, as shown by the hatched portion of the quadrangular outer shape in plan view and the inner circular shape. It becomes the flat part F1 which protruded more. In the first lens 84 and the second lens 85, the optical surface A and the spacer portion are collectively formed of a transparent resin material. In addition, the second lens 85 having a quadrangular shape in plan view has a circular outer peripheral end portion that surrounds the optical surface A such that the spacer portion on the surface side is shown by an annular shaded portion as shown in FIG. An annular projecting portion F2 projecting from the convex shape of the optical surface A from B is formed. The surface of the annular protrusion F2 is also a flat surface.

  Further, as shown in FIG. 6B, the first lens wafer on which the plurality of first lenses 84A are formed and the second lens wafer on which the plurality of second lenses 85A are formed are vertically bonded with an adhesive material 7. In a state of being bonded, the lens module 86 shown in FIG. 6B can be obtained by collectively cutting along the dicing line DL. At the time of this cutting, similarly to the cutting of the first lens 84A and the second lens 85A, the cutting holding tape is applied to the flat portion F1 of the lower second lens wafer, and for protecting the lens surface. Then, a surface protection tape is attached to the flat portion F1 of the upper first lens wafer. Thus, at the time of cutting, the lens optical surfaces of the first lens 84A and the second lens 85A are sealed and protected by the cutting holding tape and the surface protection tape, and the lens optical surfaces are not soiled by the cutting water.

  In this case, the annular flat surfaces of the spacer portion of the upper first lens 84A and the spacer portion of the lower second lens 85A are in direct contact with each other, and the space surrounded by the bottom portion on the outer peripheral side of each flat surface. The adhesive 7 is disposed in the portion, and the first lens 84A and the second lens 85A are bonded.

  Further, in FIG. 6A, the back surface is flat like the first lens 84a indicated by the broken line, and the optical surface A and the flat portion F1 protruding beyond the surface are provided only on the front surface. In this case, the second lens 85 is set. Moreover, the 1st lens 84 and the 2nd lens 85a shown with a broken line become a set. Even if the optical surface A on the surface of the second lens 85a protrudes, it fits into the recess on the back surface of the first lens 84. Only the back surface of the second lens 85a is provided with the optical surface A and a flat portion F1 protruding beyond the optical surface A. Also by this, as described above, each lens optical surface A is not soiled by the cutting water.

  In short, the optical surface A and the protruding portion F2 or flat portion F1 that protrudes more than this need only be provided on at least one of the front surface and the back surface.

  Further, as shown in FIG. 6E, the lens module 88 can be formed by incorporating the first lens 84 of FIG. Further, as shown in FIG. 6F, a lens module 86A including the first lens 61A and the second lens 85A of FIG. Thus, the light shielding holder 87 is set on the lens, and this is also used as a lens module.

  An image sensor as an electronic element can be stacked on any of the first lens 84, the second lens 85, and the lens modules 88 and 89 to obtain a sensor module as an electronic element module.

  The lens wafer 1 according to the first embodiment is laminated on an imaging element wafer as an electronic element wafer to integrally form a sensor wafer module as an electronic element wafer module, and the sensor wafer module is collectively cut into individual pieces. A large number of sensor modules can be obtained at one time. This sensor module will be described in detail as a second embodiment with reference to FIG.

(Embodiment 3)
FIG. 7 is a longitudinal sectional view showing an example of the configuration of the main part of a sensor module according to Embodiment 3 of the present invention.

  In FIG. 7, the sensor module 10 as the electronic element module according to the third embodiment has an image sensor 21 having a plurality of light receiving units that photoelectrically convert image light from a subject to be imaged. An image sensor chip 20 provided with a through electrode 22 with respect to 21, a resin adhesive layer 30 formed between the image sensors 21 on the image sensor chip 20, and a resin adhesive layer covering the image sensor chip 20 A transparent support substrate 40 such as a glass plate bonded and fixed on 30, and a lens module 50 provided on the transparent support substrate 40 so as to correspond to the imaging element 21 are provided.

The image sensor chip 20 is provided with an image sensor 21 (provided with a plurality of light receiving portions constituting a plurality of pixels) at the center of the surface, and a pad 23 is connected to the image sensor 21. A plurality of through holes penetrating from the back surface to the bottom of the front surface pad 23 (electrode pad) are formed. The side wall and the back surface side of the through hole are covered with an insulating film, and a wiring layer 24 having a contact with the pad 23 is formed as a through electrode 22 through the through hole to the back surface. An insulating film is formed on the wiring layer 24 and on the back surface, and a portion of the wiring layer 24 where the solder balls 25 are formed on the external connection terminals is opened to expose the solder balls 25 to the outside. Is formed.

  The resin adhesive layer 30 is formed on the periphery of the imaging element 21 on the surface, and bonds the imaging element chip 20 and the transparent support substrate 40. When the upper surface of the semiconductor is covered with the transparent support substrate 40, the resin adhesive layer 30 seals the internal space on the sensor region where the image sensor 21 as an electronic element on the image sensor chip 20 is provided. The resin adhesive layer 30 is formed at a predetermined location on the image pickup device chip 20 by a normal photolithography technique, and the transparent support substrate 40 is adhered thereon. In addition to this photolithography technique, a screen printing technique or a dispensing technique is used. Can be formed.

  The lens module 50 is a module in which three lens wafers 1 of the first embodiment are stacked, and a first lens 51, a second lens 52, and a third lens 53 are sequentially provided on the transparent support substrate 40 from above. ing. Each of the lenses 51 to 53 has a lens region at the center, and a spacer portion having a predetermined thickness is provided on the outer peripheral side of the lens region. The third lens 53 is an aberration correction lens, the second lens 52 is a diffusing lens, the first lens 51 is a condenser lens, and has a predetermined thickness provided on each outer peripheral side of each of these lenses. Each of the spacer portions is stacked and arranged in this order from the bottom. The first lens 51 and the second lens 52 are bonded by an adhesive layer 61, and the second lens 52 and the third lens 53 are bonded by an adhesive layer 62.

(Embodiment 4)
FIG. 8 shows, as Embodiment 4 of the present invention, the sensor module 10 of Embodiment 3 of the present invention in which the lens module 50 and the image sensor chip 20 are integrated, or the lens, lens module and image sensor chip of Embodiment 2 described above. 2 is a block diagram illustrating a schematic configuration example of an electronic information device using a solid-state imaging device including a sensor module 10A integrated with the imaging unit as an imaging unit.

  In FIG. 8, the electronic information device 90 of the fourth embodiment is a solid-state imaging device that obtains a color image signal by performing various signal processing on the imaging signal from the sensor module 10 of the third embodiment or the sensor module 10A of the second embodiment. A device 91, a memory unit 92 such as a recording medium capable of recording data after a predetermined signal processing is performed on the color image signal from the solid-state imaging device 91, and the color image signal from the solid-state imaging device 91 is displayed. Display means 93 such as a liquid crystal display device which can be displayed on a display screen such as a liquid crystal display screen after predetermined signal processing for use, and color signal signals from the solid-state imaging device 91 are subjected to predetermined signal processing for communication. The communication means 94 such as a transmission / reception device that enables communication processing after the image processing and predetermined signal processing for printing the color image signal from the solid-state imaging device 91 are performed. And an image output means 95 such as a printer which allows printing process after. The electronic information device 90 is not limited to this, but in addition to the solid-state imaging device 91, at least one of a memory unit 92, a display unit 93, a communication unit 94, and an image output unit 95 such as a printer. You may have.

  As described above, the electronic information device 90 includes, for example, a digital camera such as a digital video camera and a digital still camera, an in-vehicle camera such as a surveillance camera, a door phone camera, and an in-vehicle rear surveillance camera, and a video phone camera. An electronic apparatus having an image input device such as an image input camera, a scanner device, a facsimile device, a camera-equipped mobile phone device, a television phone device, and a portable terminal device (PDA) is conceivable.

  Therefore, according to the fourth embodiment, on the basis of the color image signal from the solid-state imaging device 91, the color image signal is favorably displayed on the display screen by the display means 93, or the color image signal is displayed on the paper surface. Then, the image output means 95 prints out the image satisfactorily, or the communication means 94 communicates the color image signal as communication data by wire or wirelessly. Data compression processing can be performed for good storage and various data processing can be performed favorably.

  Note that the electronic information device 90 is not limited to the electronic information device 90 of the fourth embodiment, and may be an electronic information device such as a pickup device using the electronic element module of the present invention for an information recording / reproducing unit. The optical element of the pickup device in this case is an optical functional element (for example, a hologram optical element) that causes the outgoing light to go straight and output, and also bends the incident light and makes it incident in a predetermined direction. Further, the electronic elements of the pickup device include a light emitting element (for example, a semiconductor laser element or a laser chip) for generating emitted light and a light receiving element (for example, a photo IC) for receiving incident light.

  As described above, according to the first embodiment, the resin replica 14 is formed by embedding a part or all of the side surfaces of the resin replica 14 in the plurality of recesses 11 a dug into the base material 11. Therefore, the contact area between the base material 11 and the resin replica 14 is larger than the contact area between the resin replica 14 and the master mold 13, and the contact area between the base material 11 and the resin replica 14 is equal to the resin replica 14 and the stamper mold 15. , 16 is larger than the contact area. Therefore, the master mold 13 and the stamper molds 15 and 16 are released smoothly, and the connecting portion 4 between the flat portions 3 becomes thicker by the depth of the recess 11a. As a result, the side surfaces of the resin replica 14 can be accurately formed to form the upper and lower stamper molds 15 and 16, and the strength problem can be solved even when a large lens wafer is manufactured. The step (D1-D2) is relaxed and the problem of remaining bubbles can be solved.

  Although not particularly described in Embodiments 1 to 4, as a method for manufacturing an optical element wafer, a replica in which the optical element shape is formed on the surface side is formed in a plurality of recesses formed in the base material. Forming a replica, forming a stamper mold using each optical element shape of the replica, and forming an optical element wafer by transferring the optical element shape to an optical element material using the stamper mold And an optical element wafer forming step. This makes it possible to accurately form a resin replica to form the upper and lower stamper molds and to achieve the purpose of eliminating the problem of strength and remaining bubbles even when making a large lens wafer. it can.

  The optical element wafer is specifically a lens wafer, but the optical element may be a prism or a hologram element in addition to the lens. In these cases, it becomes a prism wafer or a hologram element wafer.

  As mentioned above, although this invention has been illustrated using preferable Embodiment 1-4 of this invention, this invention should not be limited and limited to this Embodiment 1-4. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range from the description of specific preferred embodiments 1 to 4 of the present invention based on the description of the present invention and the common general technical knowledge. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention relates to an optical element wafer such as a lens wafer or an optical functional element wafer provided with a plurality of lenses as a plurality of optical elements for condensing incident light, a method for manufacturing the same, and an individual piece cut from the optical element wafer. Optical elements, optical element wafers obtained by cutting a single piece from an optical element wafer module in which a plurality of optical element wafers are stacked, and optical element wafers or optical element wafer modules, and image light from a subject is photoelectrically converted and imaged An electronic element wafer module such as a sensor wafer module integrated with an imaging element wafer provided with a plurality of imaging elements, an electronic element module cut from the electronic element wafer module into individual pieces, and the electronic element For example, if a sensor module as a module is used as an image input device In the field of electronic information equipment such as digital cameras such as digital video cameras and digital still cameras, image input cameras, scanner devices, facsimile devices, camera-equipped mobile phone devices, and television telephone devices, some or all of the side surfaces of replicas Are embedded in a plurality of recesses dug into the base material to form replicas, so that the contact area between the base material and the replica is larger than the contact area between the replica and the master mold, and between the base material and the replica. Since the contact area is larger than the contact area of the replica and stamper type, the mold release of the master type and stamper type is smooth, and the thickness of the connecting part between the flat parts is increased by the depth of the recess. In this way, when replicas are accurately formed, the upper and lower stamper molds are accurately formed, and a large lens wafer is made. Also, it is possible to eliminate the strength problem, a step of surface is relieved can be eliminated air bubbles remaining issues.

DESCRIPTION OF SYMBOLS 1 Lens wafer 10, 10A Sensor module 11 Base material 11a Recessed part 12 Resin material 13 Master mold 14 Resin replica 15 Upper mold stamper type 16 Lower mold stamper type 20 Imaging element chip 21 Imaging element 22 Through electrode 23 Pad 24 Wiring layer 25 Solder ball 30 Resin adhesive layer 40 Transparent support substrate 50 Lens module 51 First lens 52 Second lens 53 Third lens 61, 62 Adhesive layer 61A, 84, 84A, 84a First lens 85, 85A, 85a Second Lens 86, 86A Lens module 87 Shading holder 88, 89 Lens module 90 Electronic information device 91 Solid-state imaging device 92 Memory unit 93 Display unit 94 Communication unit 95 Image output unit A Optical surface B Optical surface outer peripheral end DL Dicing line F1 Flat portion F2 annular Out section

Claims (9)

In the method of manufacturing an optical element wafer in which a plurality of optical elements are arranged two-dimensionally,
A replica forming step of forming a replica in a plurality of recesses formed on the substrate;
A stamper mold forming step of forming a stamper mold by transferring each optical element shape formed on the surface side of the replica embedded in the concave portion of the substrate;
An optical element wafer forming step of forming an optical element wafer by transferring an optical element shape to an optical element material using the stamper mold,
The replica forming step includes a step of discharging a replica material into a plurality of recesses formed on the base material, and pressing the replica material using a master die to change the shape of the master type optical element to the replica material. An optical element wafer manufacturing method comprising: an optical element shape transfer step for transferring to the surface side of the optical element wafer.   The replica forming step is formed on an upper replica forming step for forming an upper replica in which the optical element shape for the surface is formed on the surface side in a plurality of concave portions formed on the substrate, and on the other base material. The method for producing an optical element wafer according to claim 1, further comprising: a lower replica forming step of forming a lower replica in which the shape of the optical element for the back surface is formed on the front surface side in the plurality of concave portions formed.   In the optical element wafer forming step, a flat portion having a predetermined thickness is provided on the outer peripheral side of the optical element shape, and the flat portions between the adjacent optical element shapes are connected with the same material as the optical element shape. The method of manufacturing an optical element wafer according to claim 1, wherein the optical element wafers connected at a portion are formed.   The method of manufacturing an optical element wafer according to claim 1, wherein the depth of the concave portion of the base material is set so that a contact area between the base material and the replica is larger than a contact area between the replica and the master mold. .   2. The method of manufacturing an optical element wafer according to claim 1, wherein the depth of the concave portion of the base material is set so that a contact area between the base material and the replica is larger than a contact area between the replica and the stamper mold. .   In the stamper mold forming step, an upper stamper mold forming step for forming the upper stamper mold by transferring each optical element shape of the upper replica, and a lower stamper by transferring each optical element shape of the lower replica. The method for producing an optical element wafer according to claim 2, further comprising a lower stamper mold forming step of forming a stamper mold.   The optical element wafer molding step includes an optical element material pressing step for pressing the optical element material to a predetermined thickness by the upper stamper mold and the lower stamper mold, and an optical for photocuring or thermosetting the optical element material. An optical element wafer manufacturing method according to claim 6, further comprising an element material curing step.   The method of manufacturing an optical element wafer according to claim 1, wherein the optical element is one or a plurality of lenses. 2. The method of manufacturing an optical element wafer according to claim 1, wherein the optical element is an optical functional element that causes the emitted light to go straight and emit, and bends the incident light to be incident in a predetermined direction.