JP2009086092A - Method of manufacturing optical component and method of manufacturing photographing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an optical component and a method of manufacturing a photographing device by which cutting failure and contamination of products less likely occur as compared with the prior arts. <P>SOLUTION: A cemented lens module 12 is manufactured by a manufacturing method including: a sticking process of sticking a first wafer 16w and a second wafer 18w including a plurality of lens parts 30a together using an adhesive 22; and a dividing process of cutting the first wafer 16w and the second wafer 18w in a region where no adhesive 22 is stuck thereon and dividing the first wafer 16w and the second wafer 18w into the cemented lens module 12 in which a region where the adhesive 22 is attached at a side inner than the cut position exists and in which the first wafer 16w includes at least one lens part 16a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention provides, for example, a method for manufacturing an optical component such as a cemented lens in which a light-transmitting substrate or lens is cemented, and a light receiving device such as a CMOS (Complementary Metal Oxide Semiconductor) sensor. The present invention relates to a method of manufacturing a photographing apparatus that is equipped with an element and is used as, for example, a camera built in a mobile phone.

  A microlens is arranged on the light receiving surface of a semiconductor optical sensor formed on the front surface side of the silicon substrate, a contact electrode electrically connected to the semiconductor sensor by a conduction through hole is provided on the back surface, and a transparent cover is provided on the silicon substrate. A large number of solid-state imaging devices are formed by directly bonding the microlens to the microlens via a transparent adhesive layer having a refractive index of 1.4 or less, and then divided into chip size packages by dicing, and the transparent cover and the A technique of a solid-state imaging device in which a solid-state imaging device is made substantially the same size is known (Patent Document 1).

JP 2007-88118 A

  However, in the technique described in Patent Document 1, when the dicing blade deteriorates due to adhesion of the adhesive during dicing, or when division is attempted by laser irradiation, the irradiated laser is reflected by the adhesive. As a result, there has been a problem that the substrate may not be cut or divided satisfactorily. Further, there is a problem that the adhesive is scattered at the time of division, and an optical component manufactured with the scattered adhesive may be contaminated.

  It is an object of the present invention to provide a method for manufacturing an optical component and a method for manufacturing a photographing apparatus, which are less likely to cause cutting defects and product contamination as compared with conventional techniques.

  The first feature of the present invention is that the first substrate and the second substrate having a plurality of optical element portions are pasted using an adhesive, and the first step is affixed to each other. The first substrate and the second substrate were cut in a region where the adhesive was not attached, and the first substrate and the second substrate were cut into the first substrate and the second substrate. There is a method of manufacturing an optical component including a division step in which an area where an adhesive is attached is present on the inner side of the position, and the first substrate is divided into optical components having at least one optical element portion.

  Preferably, in the dividing step, the first substrate and the second substrate are cut by laser irradiation.

  Preferably, in the dividing step, the first substrate and the second substrate are cut by dicing.

  Preferably, in the dividing step, the first substrate is divided along a notch formed in the first substrate.

  Preferably, in the dividing step, the second substrate is divided along a notch formed in the second substrate.

  Further, the second feature of the present invention is that the first substrate and the second substrate having a plurality of optical element portions are pasted to each other using an adhesive, and the first substrate and the second substrate having a plurality of optical element portions are pasted to each other. The first substrate and the second substrate are cut in a region where no adhesive is attached, and the first substrate and the second substrate are separated from the first substrate and the second substrate. There is a region where the adhesive is attached inside the cut position, and the first substrate is divided into optical components having at least one optical element portion, and the light receiving element is mounted on the optical component. And a method of manufacturing the photographing apparatus.

  According to the present invention, it is possible to provide a method for manufacturing an optical component and a method for manufacturing a photographing apparatus that are less likely to cause cutting defects and product contamination as compared with the conventional technique.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a camera 10 manufactured by a method for manufacturing a photographing apparatus according to an embodiment of the present invention. The camera 10 is used as a photographing apparatus, and includes a cemented lens module 12 used as an optical component, and a light receiving element 14 attached to the cemented lens module 12.

The cemented lens module 12 is manufactured by the method of manufacturing an optical component according to the embodiment of the present invention, and includes a first substrate 16, a second substrate 18, and a third substrate 20, and the first substrate. 16 and the second substrate 18 are attached with an adhesive 22, and the first substrate 16 and the third substrate 20 are attached with an adhesive 24. The first substrate 16 is made of a light-transmitting material such as glass or resin, and has a lens portion 16a formed so as to protrude upward at a substantially central portion.
In this embodiment, the lens portion 16a is formed as a convex shape protruding upward having a spherical or aspherical shape, but the lens portion 16a may be formed as a concave shape. In this embodiment, one lens portion 16 a is formed on the first substrate 16. For example, four lens portions 16 a may be formed on the first substrate 16. .

  The second substrate 18 is formed on the light transmitting plate 26 made of a light-transmitting material such as glass, a holding plate 28 provided so as to overlap the light transmitting plate 26, and the holding plate 28. And a resin portion 30 provided so as to be fitted into the through hole h. The holding plate 28 is made of, for example, silicon, and is used for maintaining the resin constituting the resin portion 30 in a highly fluid state, such as a liquid, above the translucent plate 26 at the stage of manufacturing the substrate 18. It is done. The resin part 30 consists of resin which can be hardened | cured from the state which has fluidity | liquidity, such as photocurable resin and heat-permeable resin, for example.

  The resin portion 30 is formed with a lens portion 30a that is used as an optical element portion and is formed so as to protrude upward at a substantially central portion. In this embodiment, the lens portion 30a is formed as a convex shape protruding upward having a spherical or aspherical shape, but the lens portion 30a may be formed as a concave shape. In this embodiment, one lens portion 30a is formed on the second substrate 18, but at least one lens portion 30a may be formed. For example, four lens portions 30a are formed on the substrate 18. The lens portion 30 a may be formed in the same manner as the first substrate 16.

  Each of the lens portion 16a and the lens portion 30a includes a region where the adhesive 22 of the first substrate 16 is attached, a region where the adhesive 24 is attached, a region where the adhesive 22 of the second substrate 18 is attached, and a first portion. 3 is formed at a position where it does not overlap in the vertical direction with the region where the adhesive 24 of the substrate 3 is attached.

  The light receiving element 14 is composed of, for example, a COMS sensor, has a photodiode region 34, and is an element used for recording an image by converting inputted light into an electric signal. As the light receiving element 14, for example, a CCD sensor or the like can be used instead of the COMS sensor.

FIG. 2 shows the camera 10.
When light is incident from above the camera 10, the light is refracted so as to converge at the lens unit 30a, and further refracted so as to be converged at the lens unit 16a, and is incident on the photodiode region 34. Light is converted into an electrical signal.

FIG. 3 shows a method for manufacturing the above-described cemented lens module 12 and a method for manufacturing the camera 10.
First, as shown in FIG. 3A, a first wafer 16w used as a first substrate and formed with a plurality of lens portions 16a and a second substrate are used. For example, the lens portion 16a A second wafer 18w on which approximately the same number of lens portions 30a are formed and a third wafer 20w are prepared. Here, as the first wafer 16w and the second wafer 18w, for example, those in which about 1500 to 2300 lens portions 16a and 30a (see FIG. 1) are formed can be used. The lens portions 16a and 30a can be formed on the first wafer 16w and the second wafer 18w by using a photocurable resin and applying nanoimprint to the photocurable resin.

  Next, the first wafer 16w and the second wafer 18w are attached using the adhesive 22 (see FIG. 1), and the first wafer 16w and the third wafer 20w are used using the adhesive 24. As shown in FIG. 3B, the cemented lens array 100 is fabricated in which the first wafer 16w, the second wafer 18w, and the third wafer 20w are cemented.

  Next, as shown in FIG. 3C, in the cemented lens array 100 produced in the pasting process, the first wafer 16w has at least one lens portion 16a, and the second wafer 18w has at least A plurality of cemented lens modules 12 (see FIG. 1) are formed by being divided so as to have one lens portion 30a. In FIG. 3C, six cemented lens modules 12 are shown for convenience of illustration, but the number of cemented lens modules 12 to be produced is determined by how many the cemented lens array 100 is divided.

  Next, as shown in FIG. 3D, the light receiving element 14 is attached to each of the cemented lens modules 12, and the camera 10 is manufactured. The camera 10 is used as, for example, a camera built in a mobile phone.

FIG. 4 shows a second wafer 18w to which an adhesive has been applied in the attaching step shown in FIG. 3 (b).
The second wafer 18w is surrounded by each lens unit 30a so as not to overlap with the lens unit 30a in a direction perpendicular to the direction in which light is incident (see FIG. 2) when used as the cemented lens module 12. The adhesive 22 is applied so as to surround it. The adhesive 22 can be applied by using, for example, screen printing. In this embodiment, the adhesive 22 is applied to the lower surface of the first wafer 18w, but instead of this, the adhesive 22 is applied to the upward surface of the first wafer 16w. It may be applied.

  In order to attach the first wafer 18w and the third wafer 20w, the adhesive 24 is applied so as to surround the lens portion 16a on the downward surface of the first wafer 18w so as not to overlap the lens portion 16a. Is made. Alternatively, or in combination with this, the adhesive 24 may be applied to the upward surface of the third wafer 20w.

FIG. 5 illustrates details of the dividing step shown in FIG.
In the dividing step, the first wafer 16w, the second wafer 18w, and the third wafer are irradiated by irradiating a laser using a laser irradiation device 102 from at least one of the upper side and the lower side of the cemented lens array 100. A 20w cut is made. At this time, the laser emits a region where the adhesive 22 of the first wafer 16w is attached, a region where the adhesive 24 of the first wafer 16w is attached, a region where the adhesive 22 of the first wafer 18 is attached, The area other than the area where the adhesive 24 of the third wafer 20w is attached is irradiated. For this reason, the laser is reflected by the adhesive 22 or the adhesive 24 as in the case of irradiating the region to which the adhesive 22 is adhered or the region to which the adhesive 24 is adhered. There is no problem. Further, as in the case of irradiating the region where the adhesive 22 or the adhesive 24 is attached with a laser, the adhesive 22. There is no problem that the adhesive 24 is scattered and the scattered adhesive 22 and the cemented lens module 12 manufactured by the adhesive 24 are contaminated.

  As indicated by a two-dot chain line in FIG. 5, after the cutting at one place is completed, the relative positional relationship between the laser irradiation device 102 and the cemented lens array 100 is changed, and the other place is cut. . In these dividing steps, as described above, the positions where the adhesive 22 or the adhesive 24 of the first wafer 16w, the second wafer 18w, and the third wafer 20w are not attached are cut and cut. In the cemented lens module 12 formed after that, the region where the adhesive 22 and the adhesive 24 are attached is located on the inner side of the position where the first substrate 16 and the second substrate 18 are cut (position where the laser is irradiated). The first wafer 16w, the second wafer 18w, and the second wafer 18 so that there is at least one lens portion 16a on the first substrate 16 and at least one lens portion 30a on the second substrate 18. The third wafer 20w is cut. For this reason, after cutting, the first substrate 16 and the second substrate 18 do not separate from each other, and the first substrate 16 and the third substrate 20 do not separate from each other. Moreover, the cemented lens module 12 after the division has at least one lens portion 16a and at least one lens portion 30a.

  In this embodiment, the cemented lens array 100 is divided by irradiating a laser using the laser irradiation device 102. However, instead, for example, the cemented lens array 100 may be divided by cutting by dicing. . When the cemented lens array 100 is cut by dicing, the laser irradiation position shown in FIG. 5 is cut by a dicing blade. At this time, the cutting position is a region where the adhesive 22 and the adhesive 24 of the first wafer 16w, the second wafer 18w, and the third wafer 20w are not attached. There is no problem that the agent 22 or the adhesive 24 adheres and the subsequent cutting is not performed well. Also, when cutting with a dicing blade, the adhesive 22 and the adhesive 24 do not scatter as in the case of cutting with laser irradiation.

FIG. 6 illustrates a modification of the dividing step shown in FIG.
In the above-described method, the cemented lens array 100 is cut by laser irradiation or the cemented lens array 100 is cut by using a dicing blade. In this modification, for example, a tape expand is used to The cemented lens array 100 is formed along the scribe layer (notched portion) S1 formed on the first wafer 16w, the scribe layer S2 formed on the second wafer 18w, and the scribe layer S3 formed on the third substrate. Divided.

  The scribe layers S1, S2, and S3 are formed on the surface of the first wafer 16w, the second wafer 18w, and the third wafer 20w before or after the bonding process shown in FIG. Each is formed inside. The scribe layers S1, S2, and S3 can be formed, for example, by irradiating the first wafer 16w, the second wafer 18w, and the third wafer 20w with laser. Here, the scribe layers S1, S2, and S3 are desirably formed inside the first wafer 16w, the second wafer 18w, and the third wafer 20w, respectively. If formed inside, there is no problem that each substrate is contaminated by scraping and scattering the material constituting each substrate, which may occur when each scribe layer is formed on the surface of each substrate. .

  In the dividing direction according to this modification, the cemented lens array 100 in which the scribe layers S1, S2, and S3 are formed on the first wafer 16w, the second wafer 18w, and the third wafer 20w, respectively, has an upward surface that is adhesive. And placed on an expandable tape 104 made of a stretchable material. Then, the expanding tape is extended in the circumferential direction from the center of the cemented lens array 100. Then, the first wafer 16w, the second wafer 18w, and the third wafer 20w are respectively divided at the positions of the scribe layers S1, S2, and S3 where the strength is reduced compared to the other positions, and the cemented lens is obtained. The array 100 is divided into a plurality of cemented lens modules 12.

  As described above, the present invention, for example, includes a method for manufacturing an optical component such as a cemented lens in which a light-transmitting substrate or lens is cemented, and a cemented lens module including a light receiving element such as a CMOS sensor. For example, the present invention can be applied to a method of manufacturing a photographing apparatus that is mounted, for example, used as a camera built in a mobile phone.

FIG. 1A shows a cemented lens module manufactured by an optical component manufacturing method according to an embodiment of the present invention and a camera manufactured by an imaging device manufacturing method according to an embodiment of the present invention, and FIG. FIG. 1B is a cross-sectional view taken along line AA in FIG. It is sectional drawing which shows the camera manufactured with the manufacturing method of the imaging device which concerns on embodiment of this invention. Processes of the optical component manufacturing method according to the embodiment of the present invention and the photographing apparatus manufacturing method according to the embodiment of the present invention will be described. FIG. 3A shows the substrate before being attached, and FIG. FIG. 4B shows a divided substrate, FIG. 4D is an explanatory view showing a divided substrate on which a light receiving element is mounted. It is a top view which shows the board | substrate with which the adhesive agent was made | formed in the sticking process in the manufacturing method of the optical component which concerns on embodiment of this invention, and the manufacturing method of the imaging device which concerns on embodiment of this invention. It is explanatory drawing explaining the division | segmentation process in the manufacturing method of the optical component which concerns on embodiment of this invention, and the manufacturing method of the imaging device concerning embodiment of this invention. It is explanatory drawing explaining the modification of the division | segmentation process in the manufacturing method of the optical component which concerns on embodiment of this invention, and the manufacturing method of the imaging device concerning embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Camera 12 Joint lens module 14 Light receiving element 16 1st board | substrate 16a Lens part 16w 1st wafer 18 2nd board | substrate 18w 1st wafer 20 3rd board | substrate 20w 3rd wafer 22 Adhesive 24 Adhesive 30 Resin Part 30a Lens part 100 Joint lens array 102 Laser irradiation apparatus 104 Expanding tape S1 Scribe layer S2 Scribe layer S3 Scribe layer

Claims (6)

An attaching step of attaching the first substrate and the second substrate having a plurality of optical element portions using an adhesive;
The first substrate and the second substrate attached to each other are cut in a region where no adhesive is attached, and the first substrate and the second substrate are cut into the first substrate and the second substrate. A dividing step in which a region where the adhesive is attached is present inside the cut position of the second substrate, and the first substrate is divided into optical components having at least one optical element portion;
The manufacturing method of the optical component which has this.   The method of manufacturing an optical component according to claim 1, wherein in the dividing step, the first substrate and the second substrate are cut by irradiating a laser.   The method of manufacturing an optical component according to claim 1, wherein in the dividing step, the first substrate and the second substrate are cut by dicing.   The method of manufacturing an optical component according to claim 1, wherein, in the dividing step, the first substrate is divided along a notch formed in the first substrate.   The method for manufacturing an optical component according to claim 1, wherein in the dividing step, the second substrate is divided along a notch formed in the second substrate. An attaching step of attaching the first substrate and the second substrate having a plurality of optical element portions using an adhesive;
The first substrate and the second substrate attached to each other are cut in a region where no adhesive is attached, and the first substrate and the second substrate are cut into the first substrate and the second substrate. A dividing step in which a region where the adhesive is attached is present inside the cut position of the second substrate, and the first substrate is divided into optical components having at least one optical element portion;
Attaching a light receiving element to the optical component;
A method of manufacturing a photographing apparatus having

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