JP2012203195A - Method for manufacturing lens module and imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To completely close air vent ports.SOLUTION: An approximately rectangular first adhesive layer 24 which surrounds each of first lens parts 15a and has slit-like air vent ports 25 is formed on a first opposite surface 21a of a first wafer level lens (hereafter, referred to as a WLL) array 21. An approximately frame-shaped second adhesive layer 26 which surrounds each of second lens parts 16a and has convex portions 26a projecting toward the air vent ports 25 is formed on a second opposite surface 22a of a second WLL array 22. The first WLL array 21 and the second WLL array 22 are bonded to each other so that the respective air vent ports 25 and respective convex portions 26a are put one over the other. The respective convex portions 26a are inserted to the respective air vent ports 25 to completely close the air vent ports 25 with an adhesive after bonding.

Description

  The present invention relates to a method for manufacturing a lens module formed by laminating a plurality of lenses via an adhesive layer, and an imaging device including the lens module.

  A portable electronic device such as a cellular phone is equipped with a small and thin imaging device. This image pickup apparatus includes a solid-state image pickup device chip and a lens module provided on the solid-state image pickup device chip and formed by stacking a plurality of wafer level lenses, and is manufactured at a wafer level (see Patent Document 1). ).

  In Patent Document 1, a plurality of wafer level lens arrays having a plurality of lens portions are stacked through an adhesive layer formed so as to surround each lens portion to form a laminate. In this laminate, a plurality of closed spaces (hereinafter referred to as cavities) surrounded by both opposing surfaces of the wafer level lens array and the adhesive layer are formed. Next, a lens module is generated by dividing the laminated body of the wafer level lens array into pieces by dicing. Hereinafter, an individual wafer level lens array is referred to as a wafer level lens.

  By the way, when wafer level lens arrays are bonded to each other via an adhesive layer having a shape surrounding each lens portion, a difference occurs in the formation timing of the cavities due to variations in the thickness between the adhesive layers. For this reason, the part in which the cavity was previously formed at the time of adhesion is further pressed, and the air in the cavity expands or ruptures the adhesive layer.

  In Patent Documents 2 to 4, a slit-like air vent hole is formed in the adhesive layer before adhering the wafer level lens arrays to each other, and the air in the cavity is released from the air vent hole, whereby the adhesive layer A manufacturing method for preventing rupture and expansion of the resin is described. This air vent hole is closed and disappears by the restoring force of the adhesive (for example, an action such as surface tension).

JP 2009-086092 A JP 2005-252183 A JP 2003-204053 A JP-A-63-84051

  As described in Patent Documents 2 to 4, by previously forming an air vent hole in the adhesive layer, the adhesive layer can be prevented from rupturing or expanding, but depending on the size of the air vent hole, the adhesive The restoring force alone cannot be completely closed, and there is a possibility that the adhesive layer has a hole. As a result, there arises a problem that the yield of the lens module is lowered.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a lens module capable of completely closing an air vent hole, and an image pickup apparatus including the lens module.

  In order to achieve the above object, a method for manufacturing a lens module according to the present invention includes stacking a plurality of wafer level lens arrays having a plurality of lens portions via a substantially frame-like adhesive layer surrounding each of the lens portions, In the lens module manufacturing method of generating a lens module by cutting a laminated body of wafer level lens arrays between the respective adhesive layers, each of the lens portions is provided on one of both opposing surfaces of the wafer level lens array to be bonded to each other. A first adhesive layer forming step of forming a substantially frame-shaped first adhesive layer having a substantially slit-like air vent hole in a part thereof, and facing the air vent hole on the other of the opposing surfaces A second adhesive layer forming step of forming a second adhesive layer having a convex portion protruding toward the air vent hole at a position where the air vent hole and the convex portion are overlapped with each other. A bonding step of bonding the serial wafer-level lens array with each other, and having a.

  In the second adhesive layer forming step, it is preferable that the second adhesive layer is formed in a substantially frame shape surrounding each lens portion.

  In the second adhesive layer forming step, it is preferable that the convex portion is formed by making the thickness of the portion of the second adhesive layer facing the air vent hole thicker than the other portions. In the second adhesive layer forming step, it is preferable that the width of the portion of the second adhesive layer facing the air vent hole is wider than the other portions.

  Before the second adhesive layer forming step, it has a base layer forming step of forming a base layer in a portion of the other facing surface facing the air vent hole, and the second adhesive layer is formed by the base layer. It is preferable that the convex portion is formed on the surface.

  In the first adhesive layer forming step and the second adhesive layer forming step, it is preferable to form a plurality of the air vent holes and the convex portions, respectively.

  The first adhesive layer and the second adhesive layer are formed in a substantially rectangular shape, and the air vent hole and the convex portion are formed at corners of the first adhesive layer and the second adhesive layer, respectively. It is preferable.

  In the first adhesive layer forming step and the second adhesive layer forming step, it is preferable that the first adhesive layer and the second adhesive layer are formed by applying an adhesive to the facing surface by screen printing, respectively.

  An image pickup apparatus according to the present invention includes: a lens module manufactured by the method for manufacturing a lens module according to any one of claims 1 to 8; and an image pickup device that picks up subject light transmitted through the lens module. It is characterized by that.

  A method for manufacturing a lens module according to the present invention and an image pickup apparatus including the lens module perform bonding between wafer level lens arrays so that convex portions of the second adhesive layer are superimposed on air bleeding holes of the first adhesive layer. Since it did in this way, the air vent hole of an contact bonding layer can be plugged up completely. As a result, a decrease in the yield of the lens module due to the presence of holes in the adhesive layer is prevented.

It is sectional drawing of an imaging device. It is sectional drawing which follows the II-II line | wire in FIG. It is explanatory drawing for demonstrating a 1st contact bonding layer formation process. It is sectional drawing which follows the IV-IV line in a figure. It is explanatory drawing for demonstrating a 2nd contact bonding layer formation process. It is sectional drawing which follows the VI-VI line in a figure. It is explanatory drawing for demonstrating screen printing. It is sectional drawing of the contact bonding layer formed by screen printing. It is explanatory drawing for demonstrating the reason the four corners of an contact bonding layer become thick. It is explanatory drawing for demonstrating a WLL array adhesion process. It is explanatory drawing for demonstrating that the air vent hole of a 1st contact bonding layer is block | closed by the convex part of a 2nd contact bonding layer. It is sectional drawing after completion of a WLL array adhesion process. It is explanatory drawing for demonstrating the comparative example which does not form a convex part in a 2nd contact bonding layer. It is explanatory drawing for demonstrating the state which had the defect hole in the contact bonding layer. It is explanatory drawing for demonstrating a dicing process. It is explanatory drawing for demonstrating a lens module attachment process. It is explanatory drawing for demonstrating the lamination process of an image pick-up element board | substrate, a 1st WLL array, and a 2nd WLL array in 2nd Embodiment. It is explanatory drawing for demonstrating the dicing process of 2nd Embodiment. It is explanatory drawing for demonstrating the 2nd contact bonding layer formation process of 3rd Embodiment. It is explanatory drawing for demonstrating the 2nd contact bonding layer formation process different from FIG. It is a front view of the 2nd adhesion layer of a 4th embodiment. It is a front view of the 1st adhesion layer of a 4th embodiment. It is explanatory drawing for demonstrating the formation method of the convex part of FIG. 22 concretely. It is a front view of the 1st adhesion layer of a 5th embodiment. It is a front view of the 2nd adhesion layer of a 5th embodiment. It is a front view of the 2nd adhesion layer of a 6th embodiment. 6 is an explanatory diagram for explaining thicknesses of first and second adhesive layers of Example 1. FIG. 6 is an explanatory diagram for explaining the thicknesses of first to second adhesive layers of Example 2. FIG.

[First Embodiment]
As shown in FIG. 1, the imaging device 10 is manufactured at a wafer level, and is mounted on various small electronic devices (not shown) such as a mobile phone. The image pickup apparatus 10 includes a solid-state image sensor chip 11 and a lens module 13 provided on the solid-state image sensor chip 11 via a spacer 12. In each figure, in order to clarify each part of the imaging device 10, the ratio of the thickness and the width is ignored and a part thereof is exaggerated.

  The solid-state image sensor chip 11 includes an image sensor 11a such as a CCD element or a CMOS element, and electrodes and logic circuits (not shown). The imaging element 11a converts subject light incident from the lens module 13 into an electrical imaging signal. The imaging signal output from the imaging element 11a is converted into digital image data by performing signal processing in various signal processing circuits (not shown) provided in the small electronic device. The spacer 12 has a substantially frame shape so as to surround the image sensor 11 a on the surface of the solid-state image sensor chip 11.

  The lens module 13 includes a first wafer level lens (hereinafter simply referred to as WLL) 15, a second WLL 16, and an adhesive layer 17. The first WLL 15 has a substantially concave first lens portion 15a. The second WLL 16 is provided on the first WLL 15 via the adhesive layer 17, and has a substantially convex second lens portion 16a. The first to second WLLs 15 and 16 are generated by dicing a wafer level lens array (see FIG. 4), and have an optical axis passing through the center of the light receiving surface of the image sensor 11a. The first to second WLLs 15 and 16 image subject light on the light receiving surface of the image sensor 11a.

  As shown in FIG. 2, the adhesive layer 17 is formed in a substantially rectangular shape so as to surround the lens portions 15a and 16a. A sealed cavity 19 is formed between the adhesive layer 17 and the opposing surfaces of the first and second WLLs 15 and 16. The adhesive layer 17 holds the second WLL 16 at a predetermined interval on the first WLL 15.

  Next, the manufacturing process of the imaging device 10 having the above configuration will be described. The manufacturing process of the imaging device 10 is roughly divided into a lens module manufacturing process for manufacturing the lens module 13 and a lens module mounting process for mounting the lens module 13 on the solid-state imaging device chip 11.

  In the lens module manufacturing process, a second WLL array in which the second lens portion 16a is two-dimensionally arranged on a first wafer level lens array (hereinafter simply referred to as a WLL array) in which the first lens portions 15a are two-dimensionally arranged. Is formed, and the lens module 13 is generated by separating the stacked body into individual pieces. This lens module manufacturing process includes four processes including a first adhesive layer forming process, a second adhesive layer forming process, a WLL array bonding process, and a dicing process. In addition, the size of the first to second WLL arrays, the number of arrangement of the lens portions 15a and 16a, the arrangement pattern, and the arrangement pitch are all formed the same.

  As shown in FIGS. 3 and 4, in the first adhesive layer forming step, an adhesive is applied on the first facing surface 21a of the first WLL array 21 facing the second WLL array 22 using a screen printing method. The first adhesive layer 24 having a substantially rectangular shape is formed so as to surround each first lens portion 15a. At this time, slit-shaped air vent holes 25 are simultaneously formed in the corner portions of the four corners (hereinafter simply referred to as the four corner portions) in the first adhesive layer 24.

  The thickness of the first adhesive layer 24 is adjusted to 20 μm to 40 μm, for example. The width of the first adhesive layer 24 is adjusted to 200 to 300 μm, for example. The width of the air vent hole 25 is adjusted to, for example, 100 to 300 μm.

  As shown in FIGS. 5 and 6, in the second adhesive layer forming step, an adhesive is applied on the second facing surface 22a of the second WLL array 22 facing the first WLL array 21 using a screen printing method. The second adhesive layer 26 having a substantially rectangular shape and substantially the same shape (including thickness and width) as the first adhesive layer 24 is formed so as to surround each of the second lens portions 16a. At this time, the second adhesive layer 26 is formed with convex portions 26a projecting toward the first facing surface 21a at the four corners. Specifically, when the second adhesive layer 26 is positioned on the first adhesive layer 24, each convex portion 26a is formed at a position that protrudes toward the air vent hole.

  The method for forming the convex portion 26a is not particularly limited. For example, when a rectangular layer is generally formed by a screen printing method, the thickness of the four corners tends to be thicker than other portions. For example, as shown in FIG. 7, a step of setting a printing plate B having an opening pattern P corresponding to the second adhesive layer 26 on the second WLL array 22, a step of applying an adhesive on the printing plate B, The adhesive is embedded only in the opening pattern P by executing the step of removing excess adhesive on the printing plate B with the squeegee S. In addition, the code | symbol M in a figure is the mesh provided in the printing plate B. FIG.

  Next, by removing the printing plate B from the second WLL array 22, the second adhesive layer 26 is formed on the second WLL array 22. At this time, the adhesive remains on the side wall (hereinafter referred to as pattern side wall) of the opening pattern P of the printing plate B. For this reason, as shown in FIG. 8, the cross section of the part other than the four corners of the second adhesive layer 26 is formed in a substantially kamaboko shape.

  On the other hand, as shown in FIG. 9, the four corners of the second adhesive layer 26 have pattern sidewalls as compared to portions other than the four corners because the portions indicated by two-dot chain lines in the figure do not contact the pattern sidewalls. There are fewer parts to touch. For this reason, the four corners are thicker because the amount of adhesive applied is greater than that of the other parts. Therefore, in this embodiment, the convex part 26a is naturally formed in the four corner parts by forming the 2nd contact bonding layer 26 in a rectangular shape using the screen printing method. In addition, this convex part 26a becomes high about 10-20 micrometers compared with another part.

  As shown in FIGS. 10 and 11, in the WLL array bonding step, first, each air vent hole 25 on the first facing surface 21a and each convex portion 26a on the second facing surface 22a are positioned. Next, the first WLL array 21 and the second WLL array 22 are bonded so that the first adhesive layers 24 and the second adhesive layers 26 are overlapped. As a result, as shown in FIG. 12, an adhesive layer 17 in which each first adhesive layer 24 and each second adhesive layer 26 are integrated is formed, and the adhesive layer 17 and the first to second WLL arrays 21, A sealed cavity 19 is formed by the two opposing surfaces 22.

  Even when a difference occurs in the formation timing of the cavity 19 due to variations in the thickness of each of the first and second adhesive layers 24 and 26, the air vent holes 25 are formed in the first adhesive layers 24 in advance. The air inside the previously formed cavity 19 escapes to the outside through the air vent hole 25 when the cavity 19 is pressed. Thereby, expansion | swelling and rupture of the contact bonding layer 17 are prevented.

  Furthermore, in this embodiment, when each 1st contact bonding layer 24 and each 2nd contact bonding layer 26 are piled up, when each convex part 26a each enters each air vent hole 25, the air vent hole 25 becomes adhesive agent. It is completely blocked by. Since the adhesive has viscosity, it takes a certain time until the air vent hole 25 is completely closed. For this reason, the air bleeding from the cavity 19 is not hindered.

  On the other hand, in FIG. 13 showing the comparative example, when the convex portions 26 a are not formed on each second adhesive layer 26, the first adhesive layers 24 and the second adhesive layers 26 are overlapped to form the adhesive layer 17. In some cases, the air vent hole 25 may not be completely blocked. As a result, as shown in FIG. 14, the adhesive layer 17 has a hole (hereinafter referred to as a defect hole) 28, and the yield of the lens module 13 decreases.

  In contrast to such a comparative example, in the present invention, by forming the convex portions 26a in each second adhesive layer 26 in advance, the air vent hole 25 is completely blocked, and a defective hole 28 is generated in the adhesive layer 17. Is prevented. This prevents a decrease in the yield of the lens module 13.

  As shown in FIG. 15, in the dicing process, after the adhesive layer 17 is cured, the first to second WLL arrays 21 and 22 are diced along dicing lines (indicated by alternate long and short dash lines) set between the adhesive layers 17. To do. Thereby, the lens module 13 formed by dividing the first to second WLL arrays 21 and 22 into pieces is generated. This completes the lens module manufacturing process.

  As shown in FIG. 16, in the lens module mounting step, the lens module 13 is mounted on the solid-state image sensor chip 11 via the spacer 12. Thereby, the imaging device 10 shown in FIG. 1 is generated.

  In the first embodiment, the first adhesive layer 24 having the air vent hole 25 is formed on the first opposing surface 21a, and the second adhesive layer 26 having the convex portion 26a is formed on the second opposing surface 22a. On the contrary, the air vent hole 25 may be formed in the second adhesive layer 26, and the convex portion 26a may be formed in the first adhesive layer 24 (the same applies to the second and subsequent embodiments).

[Second Embodiment]
In the first embodiment, the lens module 13 is formed by the wafer level method, and the imaging device 10 is formed by mounting the lens module 13 on the solid-state imaging device chip 11. However, the lens module 13 and the solid-state imaging device are formed. The chip 11 may be integrally formed.

  Specifically, as shown in FIG. 17, a first WLL array 21 and a second WLL array 22 are stacked on an image sensor substrate 31 in which a plurality of image sensors 11a are two-dimensionally arranged. In this case, a substantially rectangular first adhesive layer 32 is formed on the facing surface 31a of the image pickup device substrate 31 facing the first WLL array 21 so as to surround each image pickup device 11a and have an air vent hole 25 in a part thereof. To do. A rectangular second adhesive layer having a convex portion 33a on the opposing surface 21b of the first WLL array 21 facing the imaging element substrate 31 so as to surround each first lens portion 15a and to face the air vent hole 25. 33 is formed.

  The first adhesive layer 32 and the second adhesive layer 33 are basically the same as the first adhesive layer 24 and the second adhesive layer 26 of the above embodiment. Accordingly, the imaging element substrate 31 and the first WLL array 21 are bonded so that the first bonding layers 32 and the second bonding layers 33 are overlapped. As a result, an adhesive layer 35 (see FIG. 18) formed by integrating the first adhesive layers 32 and the second adhesive layers 33 is formed. In this case, as in the first embodiment, the adhesive layer 35 can be prevented from expanding and rupturing, and the air vent hole 25 can be completely blocked to prevent the yield from decreasing.

  Next, as in the above embodiment, the second WLL array 22 is stacked on the first WLL array 21. As a result, as shown in FIG. 18, a stacked body in which the imaging element substrate 31 and the first to second WLL arrays 21 and 22 are stacked is formed. Then, the imaging device substrate 31 and the first to second WLL arrays 21 and 22 are diced along a dicing line (indicated by a one-dot chain line) set between the adhesive layers 17 and 35. Thereby, an imaging device in which the solid-state imaging device chip 11 and the first to second WLLs 15 and 16 are integrated is generated.

[Third Embodiment]
In each of the above embodiments, the second adhesive layer 26 is formed by the screen printing method so that the convex portions 26a are naturally formed at the four corners of the second adhesive layer 26. It may be positively formed. For example, as shown in FIG. 19, before forming the second adhesive layer 26, a base layer 37 is formed in advance at a position facing the air vent hole 25 of the second facing surface 22 a (hereinafter referred to as a hole facing position). deep. Thereby, when the 2nd contact bonding layer 26 is formed in the 2nd opposing surface 22a, the convex part 26a can be formed in the hole opposing position of the 2nd contact bonding layer 26 by the base layer 37. FIG. The underlayer 37 may be formed integrally with the second WLL array 22.

  Further, as shown in FIGS. 20A and 20B, after the second adhesive layer 26 is formed on the second facing surface 22a, an adhesive is further applied to the hole facing position of the second adhesive layer 26. Alternatively, the convex portion 26a may be formed by performing so-called twice coating.

[Fourth Embodiment]
In each of the above embodiments, the first adhesive layer 24 having the air vent hole 25 is formed on the first opposing surface 21a, and the second adhesive layer 26 having the convex portion 26a is formed on the second opposing surface 22a. You may form both an air vent hole and a convex part in one contact bonding layer. For example, as shown in FIG. 21, the air vent hole 40 may be formed at a position different from the convex portion 26 a of the second adhesive layer 26. Furthermore, in this case, as shown in FIG. 22, a convex portion 41 is formed at a position facing the air vent hole 40 of the first adhesive layer 24. In this case, the same effect as the first embodiment can be obtained.

  At this time, when forming convex portions other than the four corners of the first adhesive layer 24, for example, as shown in FIG. 23, the width of the portion facing the air vent hole 40 of the first adhesive layer 24 is set to be larger than others. By increasing the width, the thickness of this portion is increased. Thereby, the convex part 41 is formed. In addition, you may form the convex part of other embodiment by partially expanding the width | variety of a contact bonding layer.

[Fifth Embodiment]
In each of the above embodiments, the air vent hole 25 and the convex portion 26a are formed at the four corners of the first to second adhesive layers 24 and 26. For example, as shown in FIGS. In addition to the four corners of the adhesive layers 24 and 26, air vent holes 40 and convex portions 41 similar to those in the fourth embodiment may be provided. The convex portion 41 may be provided in the first adhesive layer 24 and the air vent hole 40 may be provided in the second adhesive layer 26. Moreover, the formation position of the air vent hole 40 and the convex part 41 is not specifically limited.

[Sixth Embodiment]
In each of the above embodiments, the second adhesive layer 26 is formed in a substantially rectangular shape. However, as shown in FIG. 26, the adhesive is applied only to the position facing the air vent hole 25 on the second facing surface 22a. And you may form the 2nd contact bonding layer 43 which consists of the convex part 43a which protruded toward the air vent hole 25. FIG. In this case, the same effect as the first embodiment can be obtained.

  In each of the above embodiments, each adhesive layer is formed in a rectangular shape, but may be formed in various frame shapes such as a circular shape and a polygonal shape. Moreover, in each embodiment, you may change suitably the position which forms an air vent hole and a convex part. When the polygonal adhesive layer is formed by screen printing, convex portions are naturally formed at the corners as described with reference to FIGS.

  In each of the embodiments described above, the two layers of the first to second WLLs 15 and 16 are stacked on the solid-state imaging device chip 11, but one layer or three or more layers of WLL may be stacked. Further, the shapes of the first and second lens portions 15a and 16a are not particularly limited.

  Hereinafter, Examples 1-2 for demonstrating the effect of this invention are shown, and this invention is demonstrated concretely. However, the present invention is not limited to these examples. In both Examples 1 and 2, as described in the first embodiment, the first adhesive layer 24 having the air vent hole 25 is formed on the first opposing surface 21a, and the convex portion 26a is provided on the second opposing surface 22a. A second adhesive layer 26 was formed. At this time, UVX-8536 (manufactured by DENKA) was used as an adhesive, and the first and second adhesive layers 24 and 26 were formed in a rectangular shape having a length and width of about 3.4 mm by screen printing. In addition, as the printing plate B used for screen printing, the one having a mesh M having a wire diameter of 30 to 50 μm and an opening diameter of 100 μm or more was used.

  In Example 1, as shown in FIG. 27, the thickness of the first adhesive layer 24 was 20 μm, and the thickness of the second adhesive layer 26 was 40 μm. In Example 2, as shown in FIG. 28, the thickness of the first adhesive layer 24 was 40 μm, and the thickness of the second adhesive layer 26 was 20 μm. Next, the first WLL array 21 and the second WLL array 22 of each example were bonded under the conditions of a pressure of 0.3 to 0.5 Mpa and a speed of 0.05 to 0.30 mm / sec. As a result, an adhesive layer 17 having a thickness of about 40 μm formed by superposing the first adhesive layer 24 and the second adhesive layer 26 was formed.

  After the adhesive layer 17 was cured, the first to second WLL arrays 21 and 22 were diced to generate the lens module 13. Next, whether or not the air vent hole 25 of the adhesive layer 17 of the lens module 13 was completely closed was observed visually or with an optical microscope. As a result, in both Examples 1 and 2, it was confirmed that the air vent hole 25 was completely closed.

DESCRIPTION OF SYMBOLS 10 Imaging device 11 Solid-state image sensor chip 13 Lens module 15 1st WLL
16 Second WLL
17 Adhesive layer 21 1st WLL array 22 2nd WLL array 24, 32 1st adhesive layer 25, 40 Air vent hole 26, 33, 43 2nd adhesive layer 26a, 33a, 41, 43a Convex part

Claims (9)

A plurality of wafer level lens arrays having a plurality of lens portions are laminated via a substantially frame-like adhesive layer surrounding each of the lens portions, and the laminate of the wafer level lens arrays is cut between the adhesive layers. In the manufacturing method of the lens module for generating the lens module,
A first frame-shaped first adhesive layer is formed on one of the opposing surfaces of the wafer level lens array to be bonded to each other. An adhesive layer forming step;
A second adhesive layer forming step of forming, on the other of the opposing surfaces, a second adhesive layer having a convex portion protruding toward the air vent hole at a position facing the air vent hole;
Adhering step of adhering the wafer level lens arrays so as to overlap the air vent hole and the convex part,
A method for manufacturing a lens module, comprising:   2. The method of manufacturing a lens module according to claim 1, wherein in the second adhesive layer forming step, the second adhesive layer is formed in a substantially frame shape surrounding each of the lens portions.   The said 2nd contact bonding layer formation process forms the said convex part by making the thickness of the part facing the said air bleeding hole of the said 2nd contact bonding layer thicker than another part. The manufacturing method of the lens module of description.   4. The method of manufacturing a lens module according to claim 3, wherein, in the second adhesive layer forming step, a width of a portion of the second adhesive layer facing the air vent hole is made wider than other portions.   Before the second adhesive layer forming step, it has a base layer forming step of forming a base layer in a portion of the other facing surface facing the air vent hole, and the second adhesive layer is formed by the base layer. The method for manufacturing a lens module according to claim 1, wherein the convex portion is formed on the lens module.   6. The method of manufacturing a lens module according to claim 1, wherein in the first adhesive layer forming step and the second adhesive layer forming step, a plurality of the air vent holes and the convex portions are formed, respectively. .   The first adhesive layer and the second adhesive layer are formed in a substantially rectangular shape, and the air vent hole and the convex portion are formed at corners of the first adhesive layer and the second adhesive layer, respectively. The method for manufacturing a lens module according to claim 1, wherein:   In the first adhesive layer forming step and the second adhesive layer forming step, the first adhesive layer and the second adhesive layer are formed by applying an adhesive to the opposing surface by screen printing, respectively. The manufacturing method of the lens module of any one of Claim 1 thru | or 7. A lens module manufactured by the method for manufacturing a lens module according to any one of claims 1 to 8,
An image pickup device comprising: an image pickup device that picks up subject light that has passed through the lens module.

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