JP2007229793A - Laser scribing method, electrooptic device, electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser scribing method for preventing troubles caused by a pattern burning or a pattern breakage of a substrate by suppressing the transmission of laser beams, and to provide an electrooptic device and an electronic equipment. <P>SOLUTION: The laser scribing method comprises a substrate manufacturing step (Figs. (a) and (b)) in which a first substrate 11 formed with a terminal part 11a and a second substrate 12 facing a surface of the first substrate 11 and having the terminal part 11a are arranged; a first cut-scheduled line L1 for cutting the second substrate 12 is provided; and a liquid crystal member 25b as a suppressing member for suppressing the transmission of laser beams 59 is provided between the terminal part 11a and a surface of the second substrate 12 facing the terminal part 11a at least on the first cut-scheduled line L1, and an irradiation step (Fig. (c)) of irradiating the laser beams 59 from a surface opposite to the surface of the second substrate 12 arranged opposite to the surface of the first substrate 11 having the terminal part 11a so that a condensing point P of the laser beams 59 is moved inside the second substrate 12 along the first cut-scheduled line L1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laser scribing method, an electro-optical device, and an electronic apparatus.

  Conventionally, a laser scribing method for cutting a substrate using laser light is known. For example, in the laser scribing method described in Patent Document 1, the laser beam is focused on the substrate to be cut so that the laser beam condensing point is aligned, that is, the laser beam power density is maximized at the condensing point. And a modified region is formed at the condensing point portion by utilizing the phenomenon of multiphoton absorption. Then, by applying an external force, the substrate is cut starting from the modified region.

JP 2002-192371 A

  However, when a condensing point is set from above the upper substrate to the inside of the upper substrate and irradiated with laser light, the irradiated laser light is transmitted through the upper substrate and formed on the lower substrate. However, there is a problem in that it tends to cause an electrical connection failure due to pattern burning or pattern cutting.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a laser scribing method and an electric device capable of suppressing the transmission of laser light and preventing problems caused by pattern burning or pattern cutting of the substrate. To provide an optical device and an electronic apparatus.

  In order to solve the above problem, in the present invention, a first substrate on which a pattern is formed, and a second substrate are disposed so as to face the surface of the first substrate on which the pattern is formed, and the second substrate is cut. A substrate manufacturing process comprising a suppression member that suppresses transmission of laser light between the pattern and the surface of the second substrate facing the pattern, at least on the planned cutting line, and a pattern The condensing point of the laser beam moves to the inside of the second substrate along the scheduled cutting line from the surface opposite to the surface of the second substrate disposed opposite to the surface of the first substrate on which is formed. And an irradiation step of irradiating with laser light.

  According to the laser scribing method of the present invention, in the substrate manufacturing process, the suppression member that suppresses the transmission of the laser light is on the line to be cut and between the pattern and the surface of the second substrate facing the pattern. Provided. In the irradiation step, the laser light further transmitted beyond the condensing point set inside the second substrate among the laser light irradiated along the planned cutting line reaches the suppression member. The laser beam that reaches the suppression member is suppressed from being transmitted by the suppression member. Therefore, the progress of the laser light beyond the condensing point is suppressed by the suppression member, and the intensity of the laser light is weaker than the pattern formed at the location exceeding the suppression member. Can be prevented.

  In the substrate manufacturing process of the laser scribing method of the present invention, the suppressing member may be a liquid crystal material.

  According to this, the transmission of the irradiated laser light can be suppressed by the liquid crystal material.

  The substrate manufacturing process of the laser scribing method of the present invention includes a liquid crystal material application process for applying a liquid crystal material as a display material between the first substrate and the second substrate. The same material as the liquid crystal material may be used.

  According to this, the same material as the liquid crystal material as the display material is used as the liquid crystal material as the restraining member, so that man-hours such as material selection can be omitted and the working efficiency can be improved.

  In the liquid crystal material application step of the laser scribing method of the present invention, the liquid crystal material as the suppressing member and the liquid crystal material as the display material may be applied at the same time.

  According to this, by providing the liquid crystal material as the suppressing member and the liquid crystal material as the display material at the same time, it is possible to improve the working efficiency in manufacturing the substrate.

  In the substrate manufacturing process of the laser scribing method of the present invention, the restraining member may be a spacer material.

  According to this, the spacer material can suppress the transmission of the irradiated laser beam and can perform dry processing.

  In the laser scribing method of the present invention, the spacer material as the suppressing portion may be the same material as the spacer material included in the liquid crystal material as the display material.

  According to this, since the spacer material as the restraining member is the same material as the spacer material included in the liquid crystal material as the display material, man-hours such as material selection can be omitted and work efficiency can be improved.

  In the laser scribe substrate manufacturing process of the present invention, the restraining member is a resin material.

  According to this, transmission of the irradiated laser beam can be suppressed by the resin material.

  In the substrate manufacturing process of the laser scribing method of the present invention, the suppression member may be a metal material.

  According to this, transmission of the irradiated laser beam can be suppressed by the metal material.

  The gist of the electro-optical device of the invention is that it is manufactured by the laser scribing method.

  According to this, when a part of the second substrate is cut by irradiating the laser beam, the pattern formed on the first substrate corresponding to the portion exceeding the suppression portion with respect to the irradiation direction of the laser beam is burned or cut. Since defects such as pattern defects are suppressed, a highly reliable electro-optical device can be provided.

  The gist of an electrical apparatus of the present invention is that the above electro-optical device is mounted.

  According to this, a highly reliable electronic device can be provided.

  Hereinafter, first and second embodiments embodying the present invention will be described with reference to the drawings. In the embodiment of the present invention, a laser scribing method for scribing a substrate on which a liquid crystal display panel as an electro-optical device is formed is irradiated with a laser beam, a liquid crystal display panel manufactured by the laser scribing method, and An electronic device will be described as an example.

  [First embodiment]

(Substrate structure)
First, the configuration of the substrate will be described. FIG. 1 shows the structure of a substrate, FIG. 1 (a) shows a plan view, and FIG. 1 (b) shows a schematic cross-sectional view taken along line AA of FIG. 1 (a).

  1A and 1B, a substrate 10 has a wafer shape, and includes a liquid crystal display panel 20 as a plurality of electro-optical devices by bonding a first substrate 11 and a second substrate 12 together. . One liquid crystal display panel 20 is divided from the substrate 10 by cutting along a scheduled cutting line provided in a partition formation region of the liquid crystal display panel 20 of the substrate 10.

(Configuration of electro-optical device)
Next, the configuration of the electro-optical device will be described. 2 shows a configuration of a liquid crystal display panel as an electro-optical device, FIG. 2 (a) is a plan view, and FIG. 2 (b) is a schematic cross-sectional view taken along line BB in FIG. 2 (a). Indicates.

  2, the liquid crystal display panel 20 includes a first substrate 11 having a thin film transistor (TFT) element 23 and a second substrate 12 having a counter electrode 26, as shown in FIGS. 2 (a) and 2 (b). And a liquid crystal material 25 as a display material filled in a gap between the substrates 11 and 12 bonded by the sealing material 24. The first substrate 11 is projected in a frame shape that is slightly larger than the second substrate 12, and a terminal portion 11 a as a pattern is formed on one surface of the projected first substrate 11.

  The first substrate 11 uses a quartz glass substrate having a thickness of about 1.2 mm, and has a pixel electrode (not shown) constituting a pixel on its surface and a TFT in which one of the three terminals is connected to the pixel electrode. An element 23 is formed. The remaining two terminals of the TFT element 23 are connected to a data line (not shown) and a scanning line (not shown) which are arranged in a grid in a state of being insulated from each other so as to surround the pixel electrode. The data line is drawn out in the Y-axis direction and connected to a data line driving circuit unit 29 formed in the terminal unit 11a. The scanning lines are drawn in the X-axis direction and are individually connected to two scanning line driving circuit units 33 formed in the left and right frame regions. The input side wirings of the data line driving circuit unit 29 and the scanning line driving circuit unit 33 are connected to the mounting terminals 31 arranged along the terminal unit 11a. In the frame region opposite to the terminal portion 11a, a wiring 32 that connects the two scanning line driving circuit portions 33 is provided.

  The second substrate 12 is a transparent glass substrate having a thickness of approximately 1.0 mm, and is provided with a counter electrode 26 as a common electrode. The counter electrode 26 is electrically connected to the wiring provided on the first substrate 11 side via the vertical conduction parts 34 provided at the four corners of the second substrate 12, and the wiring is also a mounting terminal provided in the terminal portion 11a. 31 is connected.

  Alignment films 27 and 28 are formed on the surface of the first substrate 11 and the surface of the second substrate 12 facing the liquid crystal material 25, respectively.

  In the liquid crystal display panel 20, a relay substrate that is electrically connected to an external drive circuit is connected to the mounting terminal 31. An input signal from the external drive circuit is input to each data line drive circuit unit 29 and the scan line drive circuit unit 33, whereby the TFT element 23 is switched for each pixel electrode, and the pixel electrode and the counter electrode 26 are switched. In the meantime, a drive voltage is applied to display.

(Configuration of laser irradiation device)
Next, to irradiate the laser beam toward the planned cutting line provided in the partition formation region of the liquid crystal display panel 20 formed on the substrate 10, and to form a modified layer in the portion irradiated with the laser beam. The configuration of the laser irradiation apparatus will be described.

  FIG. 3 is a schematic diagram showing the configuration of the laser irradiation apparatus. In FIG. 3, a laser irradiation device 40 includes a laser light source 41 that emits a pulsed laser beam, a dichroic mirror 42 that reflects the emitted pulsed laser beam, and a collection unit that collects the reflected pulsed laser beam. And an optical lens 43. Further, a stage 47 on which the substrate 10 is placed and an X-axis slide part 48 and a Y-axis slide part 51 as moving means for moving the stage 47 in the X and Y axis directions with respect to the condenser lens 43 are provided. . Further, a Z-axis slide mechanism 54 as an adjusting means for adjusting the position of the condensing point of the pulse laser beam by changing the position of the condensing lens 43 in the Z-axis direction with respect to the substrate 10 placed on the stage 47 is provided. I have. Furthermore, an imaging device 55 is provided that is located on the opposite side of the condenser lens 43 with the dichroic mirror 42 interposed therebetween.

  The laser irradiation device 40 includes a main computer 60 that controls each of the above components. The main computer 60 includes image processing for processing image information captured by the imaging device 55 in addition to a CPU and various memories (not shown). A portion 61 is provided. The imaging device 55 incorporates a coaxial incident light source and a CCD (solid-state imaging device). Visible light emitted from the coaxial incident light source passes through the condenser lens 43 and is focused.

  Connected to the main computer 60 are an input unit 63 for inputting data of various processing conditions used during laser processing and a display unit 64 for displaying various information during laser processing. A laser control unit 66 that controls the output, pulse width, and pulse period of the laser light source 41 and a lens control unit 67 that drives the Z-axis slide mechanism 54 to control the position of the condenser lens 43 in the Z-axis direction. It is connected. Further, a stage control unit 70 is connected to drive a servo motor (not shown) that moves the X-axis slide unit 48 and the Y-axis slide unit 51 along rails 68 and 69, respectively.

  The Z-axis slide mechanism 54 that moves the condenser lens 43 in the Z-axis direction has a built-in position sensor that can detect the movement distance, and the lens control unit 67 detects the output of the position sensor and collects the light. The position of the lens 43 in the Z-axis direction can be controlled. Therefore, the thickness of the substrate 10 can be measured by moving the condenser lens 43 in the Z-axis direction so that the visible light emitted from the coaxial incident light source of the imaging device 55 is in focus with the surface of the substrate 10. It is.

  The laser light source 41 is a so-called femtosecond laser that emits laser light using, for example, titanium sapphire as a solid light source with a pulse width of femtoseconds. In this case, the pulsed laser light has wavelength dispersion characteristics, the center wavelength is 800 nm, and the half width is about 20 nm. The pulse width is about 300 fs (femtosecond), the pulse period is 1 kHz, and the output is about 700 mW.

  In this case, the condenser lens 43 is an objective lens having a magnification of 100 times, a numerical aperture (NA) of 0.8, and a WD (Working Distance) of 3 mm. The condenser lens 43 is supported by a slide arm 54 a extending from the Z-axis slide mechanism 54.

  In this embodiment, the stage 47 is supported by the Y-axis slide unit 51, but is supported by the X-axis slide unit 48 by reversing the positional relationship between the X-axis slide unit 48 and the Y-axis slide unit 51. It is good also as a form. Moreover, it is preferable to support the stage 47 on the Y-axis slide part 51 via a θ table (not shown). According to this, it is possible to make the board | substrate 10 into a more perpendicular | vertical state with respect to the optical axis 41a.

(Laser scribing method)
Next, the laser scribing method according to the first embodiment will be described. FIG. 4 is a process diagram showing the scribing method in this embodiment.

  First, the substrate manufacturing process will be described. In the liquid crystal application step of FIG. 4A, after the sealing material 24 is formed on the surface of the first substrate on which the TFT elements 23, the terminal portions 11a, and the like are formed, the first and second sections partitioned by the sealing material 24. A liquid crystal material 25 (25a, 25b) is applied to each of the regions S1, S2. The first partition region S1 is a region where the TFT elements 23 and the like are formed, and the second partition region S2 is a region where the terminal portions 11a are formed. Of the applied liquid crystal material 25, the liquid crystal material 25 applied to the first partition region S1 is a liquid crystal material 25a as a display material, and the liquid crystal material 25 applied to the second partition region S2 is a subsequent process. Is a liquid crystal material 25b as a suppressing member that suppresses the transmission of the laser light, and the liquid crystal material 25a is on the first scheduled cutting line L1 provided for cutting at least a part of the second substrate 12, The coating is applied between the terminal portion 11 a of the first substrate 11 and the surface of the second substrate 12 facing the first substrate 11. Note that the liquid crystal material 25 may include a spacer material for securing a space between the first substrate 11 and the second substrate 12.

  Next, in FIG. 4B, the first substrate 11 and the second substrate 12 on which the counter electrode 26 and the like are formed are bonded by the adhesive force of the sealing material 24.

  Through the above steps, the substrate 10 is formed.

  Next, the irradiation process will be described. In the irradiation step of FIG. 4C, the laser beam 59 is used along the first scheduled cutting line L1 among the first and second scheduled cutting lines L1 and L2 provided on the substrate 10 using the laser irradiation device 40. Irradiate. The first scheduled cutting line L1 is a line provided for partially cutting the second substrate 12, and the terminal portion 11a of the first substrate 11 is formed on the extended line of the first scheduled cutting line L1. Yes. The second scheduled cutting line L2 is a line provided for cutting the first and second substrates 11 and 12 and dividing them into the liquid crystal display panel 20.

  The laser beam 59 is directed from the surface opposite to the surface on which the counter electrode 26 and the like of the second substrate 12 are formed toward the second substrate 12 in a direction substantially perpendicular to the second substrate 12 and the first scheduled cutting line L1. The laser beam 59 is irradiated so that the condensing point P of the laser beam 59 is positioned inside the second substrate 12.

  Then, along the first scheduled cutting line L1, the condensing point P is set in a direction approaching the surface of the second substrate 12 irradiated with the laser beam, and scanning is performed while irradiating the laser beam 59. By scanning this multiple times, the modified layer Rc1 along the first cutting scheduled line L1 is formed inside the second substrate 12.

  Next, as shown in FIG. 4D, the laser irradiation device 40 is used to irradiate the laser beam 59 along the second scheduled cutting line L <b> 2 provided on the substrate 10. Then, similarly to FIG. 5C, the modified layer Rc2 is formed along the second scheduled cutting line L2 in the first and second substrates 11 and 12 by scanning a plurality of times while irradiating the laser beam 59. Is done.

  4E, by applying an external force to the substrate 10, the first and second substrates 11 and 12 are cut from the modified layers Rc1 and Rc2, and the liquid crystal display panel 20 is formed.

(Configuration of electronic equipment)
Next, the configuration of the electronic device will be described. FIG. 5 is a perspective view showing a configuration of a projector as an electronic apparatus. In FIG. 5, the liquid crystal display panel 20 is mounted on the optical system constituting the projector 80.

  Therefore, according to the first embodiment, there are the following effects.

  (1) When the laser light 59 is irradiated along the first scheduled cutting line L1, the laser light 59 transmitted beyond the condensing point P is first cut between the first substrate 11 and the second substrate 12. Since the liquid crystal material 25b formed on the planned line L1 is reflected, scattered or absorbed, the transmission of the laser light 59 is substantially suppressed, and the irradiation of the mounting portion 31 and the like of the terminal portion 11a can be substantially suppressed. Accordingly, it is possible to reduce defects such as pattern burning and pattern defects of the terminal portion 11a.

  (2) Since the liquid crystal material 25b as the suppressing member uses the same material as the liquid crystal material 25a as the display material, management such as material selection can be omitted and work efficiency can be improved.

  (3) Since the liquid crystal materials 25a and 25b are formed at the same time in the liquid crystal material application step, the working efficiency can be improved.

[Second Embodiment]
Next, a second embodiment will be described. The configuration of the substrate, the configuration of the liquid crystal display panel as the electro-optical device, the configuration of the laser irradiation device, and the configuration of the projector as the electronic apparatus are the same as those in the first embodiment, and thus description thereof is omitted.

(Laser scribing method)
FIG. 6 is a process diagram showing the scribing method in the present embodiment.

  First, the substrate manufacturing process will be described. In FIG. 6A, after the sealing material 24 is formed on the surface of the first substrate on which the TFT element 23, the terminal portion 11a and the like are formed, the first and second partitioned regions S1, S2 partitioned by the sealing material 24 are formed. Among them, the liquid crystal material 25 is applied to the first partition region S1, and the spacer material 90 as a restraining member is sprayed on the second partition region S2. The spacer material 90 is on a first scheduled cutting line L <b> 1 provided for cutting at least a part of the second substrate 12, and is opposed to the terminal portion 11 a of the first substrate 11 and the first substrate 11. It is applied between the surface of the substrate 12. As the spacer material 90, glass fiber, silica, plastic, or the like can be used. In addition, the spacer material 90 can use the same thing as the spacer material contained in the liquid crystal material 25 apply | coated to 1st division area S1.

  Next, in FIG. 6B, the first substrate 11 and the second substrate 12 on which the counter electrode 26 and the like are formed are bonded by the adhesive force of the sealing material 24.

  Through the above steps, the substrate 10 is formed.

  Next, the irradiation process will be described. In the irradiation step of FIG. 6C, the laser beam 59 is used along the first scheduled cutting line L1 among the first and second scheduled cutting lines L1 and L2 provided on the substrate 10 using the laser irradiation device 40. Irradiate. The first scheduled cutting line L1 is a line provided for partially cutting the second substrate 12, and the terminal portion 11a of the first substrate 11 is formed on the extended line of the first scheduled cutting line L1. Yes. The second scheduled cutting line L2 is a line provided for cutting the first and second substrates 11 and 12 and dividing them into the liquid crystal display panel 20.

  The laser beam 59 is directed from the surface opposite to the surface on which the counter electrode 26 and the like of the second substrate 12 are formed toward the second substrate 12 in a direction substantially perpendicular to the second substrate 12 and the first scheduled cutting line L1. The laser beam 59 is irradiated so that the condensing point P of the laser beam 59 is positioned inside the second substrate 12.

  Then, along the first scheduled cutting line L1, the condensing point P is set in a direction approaching the surface of the second substrate 12 irradiated with the laser beam, and scanning is performed while irradiating the laser beam 59. By scanning this multiple times, the modified layer Rc1 along the first cutting scheduled line L1 is formed inside the second substrate 12.

  Next, as shown in FIG. 6D, the laser irradiation device 40 is used to irradiate the laser beam 59 along the second scheduled cutting line L <b> 2 provided on the substrate 10. Then, similarly to FIG. 5C, the modified layer Rc2 is formed along the second scheduled cutting line L2 in the first and second substrates 11 and 12 by scanning a plurality of times while irradiating the laser beam 59. Is done.

  6E, by applying an external force to the substrate 10, the first and second substrates 11 and 12 are cut from the modified layers Rc1 and Rc2, and the liquid crystal display panel 20 is formed.

  Therefore, according to said 2nd Embodiment, there exists an effect shown below.

  (1) When the laser light 59 is irradiated along the first scheduled cutting line L1, the laser light 59 transmitted beyond the condensing point P is first cut between the first substrate 11 and the second substrate 12. Since the spacer material 90 formed on the planned line L1 is reflected, scattered or absorbed, the transmission of the laser light 59 is substantially suppressed, and the irradiation of the terminal portion 11a on the mounting terminal 31 and the like can be substantially suppressed. Accordingly, it is possible to reduce defects such as pattern burning and pattern defects of the terminal portion 11a.

  (2) Since the spacer material 90 as the restraining member uses the same material as the spacer material included in the liquid crystal material 25, management work such as material selection can be omitted and work efficiency can be improved.

  (3) Since the spacer material 90 is a solid substance, it can be easily removed when the substrate 10 is divided.

[Third embodiment]
Next, a third embodiment will be described. The configuration of the substrate, the configuration of the liquid crystal display panel as the electro-optical device, the configuration of the laser irradiation device, and the configuration of the projector as the electronic apparatus are the same as those in the first embodiment, and thus description thereof is omitted.

(Laser scribing method)
FIG. 7 is a process diagram showing a scribing method in the present embodiment.

  First, the substrate manufacturing process will be described. In FIG. 7A, after the sealing material 24 is formed on the surface of the first substrate on which the TFT element 23, the terminal portion 11a, and the like are formed, the first and second partitioned regions S1, S2 partitioned by the sealing material 24 are formed. Among them, the liquid crystal material 25 is applied to the first partition region S1, and the resin material 100 as a restraining member is disposed in the second partition region S2. The resin material 100 is on the first scheduled cutting line L <b> 1 provided for cutting at least a part of the second substrate 12, and is the second portion facing the terminal portion 11 a of the first substrate 11 and the first substrate 11. It arrange | positions between the surfaces of the board | substrate 12. FIG. As the resin material 100, for example, an epoxy resin, a vinyl chloride resin, or the like can be used. Further, the color of the resin material 100 is preferably black, but may be translucent.

  Next, in FIG. 7B, the first substrate 11 and the second substrate 12 on which the counter electrode 26 and the like are formed are bonded by the adhesive force of the sealing material 24.

  Through the above steps, the substrate 10 is formed.

  Next, the irradiation process will be described. In the irradiation step of FIG. 7C, the laser beam 59 is used along the first scheduled cutting line L1 among the first and second scheduled cutting lines L1 and L2 provided on the substrate 10 using the laser irradiation device 40. Irradiate. The first scheduled cutting line L1 is a line provided for partially cutting the second substrate 12, and the terminal portion 11a of the first substrate 11 is formed on the extended line of the first scheduled cutting line L1. Yes. The second scheduled cutting line L2 is a line provided for cutting the first and second substrates 11 and 12 and dividing them into the liquid crystal display panel 20.

  The laser beam 59 is directed from the surface opposite to the surface on which the counter electrode 26 and the like of the second substrate 12 are formed toward the second substrate 12 in a direction substantially perpendicular to the second substrate 12 and the first scheduled cutting line L1. The laser beam 59 is irradiated so that the condensing point P of the laser beam 59 is positioned inside the second substrate 12.

  Then, along the first scheduled cutting line L1, the condensing point P is set in a direction approaching the surface of the second substrate 12 irradiated with the laser beam, and scanning is performed while irradiating the laser beam 59. By scanning this multiple times, the modified layer Rc1 along the first cutting scheduled line L1 is formed inside the second substrate 12.

  Next, as illustrated in FIG. 7D, the laser beam 59 is irradiated along the second scheduled cutting line L <b> 2 provided on the substrate 10 using the laser irradiation device 40. Then, similarly to FIG. 5C, the modified layer Rc2 is formed along the second scheduled cutting line L2 in the first and second substrates 11 and 12 by scanning a plurality of times while irradiating the laser beam 59. Is done.

  7E, by applying an external force to the substrate 10, the first and second substrates 11 and 12 are cut from the modified layers Rc1 and Rc2, and the liquid crystal display panel 20 is formed.

  Therefore, according to the third embodiment, there are the following effects.

  (1) When the laser light 59 is irradiated along the first scheduled cutting line L1, the laser light 59 transmitted beyond the condensing point P is first cut between the first substrate 11 and the second substrate 12. Since the resin material 100 arranged on the planned line L1 is reflected, scattered or absorbed, the transmission of the laser light 59 is substantially suppressed, and the irradiation to the mounting terminal 31 of the terminal portion 11a can be substantially suppressed. Accordingly, it is possible to reduce defects such as pattern burning and pattern defects of the terminal portion 11a.

[Fourth embodiment]
Next, a fourth embodiment will be described. The configuration of the substrate, the configuration of the liquid crystal display panel as the electro-optical device, the configuration of the laser irradiation device, and the configuration of the projector as the electronic apparatus are the same as those in the first embodiment, and thus description thereof is omitted.

(Laser scribing method)
FIG. 8 is a process diagram showing the scribing method in the present embodiment.

  First, the substrate manufacturing process will be described. In FIG. 8A, after the sealing material 24 is formed on the surface of the first substrate on which the TFT element 23, the terminal portion 11a, and the like are formed, the first and second partitioned regions S1, S2 partitioned by the sealing material 24 are used. Among them, the liquid crystal material 25 is applied to the first partition region S1, and the metal material 110 as a restraining member is disposed in the second partition region S2. The metal material 110 is on a first scheduled cutting line L1 provided for cutting at least a part of the second substrate 12 and is opposite to the terminal portion 11a of the first substrate 11 and the first substrate 11. It arrange | positions between the surfaces of the board | substrate 12. FIG.

  Next, in FIG. 8B, the first substrate 11 and the second substrate 12 on which the counter electrode 26 and the like are formed are bonded by the adhesive force of the sealing material 24.

  Through the above steps, the substrate 10 is formed.

  Next, the irradiation process will be described. In the irradiation process of FIG. 8C, the laser beam 59 is used along the first scheduled cutting line L1 out of the first and second scheduled cutting lines L1 and L2 provided on the substrate 10 using the laser irradiation device 40. Irradiate. The first scheduled cutting line L1 is a line provided for partially cutting the second substrate 12, and the terminal portion 11a of the first substrate 11 is formed on the extended line of the first scheduled cutting line L1. Yes. The second scheduled cutting line L2 is a line provided for cutting the first and second substrates 11 and 12 and dividing them into the liquid crystal display panel 20.

  The laser beam 59 is directed from the surface opposite to the surface on which the counter electrode 26 and the like of the second substrate 12 are formed toward the second substrate 12 in a direction substantially perpendicular to the second substrate 12 and the first scheduled cutting line L1. The laser beam 59 is irradiated so that the condensing point P of the laser beam 59 is positioned inside the second substrate 12.

  Then, along the first scheduled cutting line L1, the condensing point P is set in a direction approaching the surface of the second substrate 12 irradiated with the laser beam, and scanning is performed while irradiating the laser beam 59. By scanning this multiple times, the modified layer Rc1 along the first cutting scheduled line L1 is formed inside the second substrate 12.

  Next, as illustrated in FIG. 8D, the laser irradiation device 40 is used to irradiate the laser beam 59 along the second scheduled cutting line L <b> 2 provided on the substrate 10. Then, similarly to FIG. 5C, the modified layer Rc2 is formed along the second scheduled cutting line L2 in the first and second substrates 11 and 12 by scanning a plurality of times while irradiating the laser beam 59. Is done.

  8E, by applying an external force to the substrate 10, the first and second substrates 11 and 12 are cut from the modified layers Rc1 and Rc2, and the liquid crystal display panel 20 is formed.

  Therefore, according to the fourth embodiment, there are the following effects.

  (1) When the laser light 59 is irradiated along the first scheduled cutting line L1, the laser light 59 transmitted beyond the condensing point P is first cut between the first substrate 11 and the second substrate 12. Since it is reflected or scattered by the metal material 110 disposed on the planned line L1, the transmission of the laser light 59 is substantially suppressed, and the irradiation of the mounting portion 31 and the like of the terminal portion 11a can be substantially suppressed. Accordingly, it is possible to reduce defects such as pattern burning and pattern defects of the terminal portion 11a.

  The present invention is not limited to the first to fourth embodiments described above, and the following modifications can be given.

  (Modification 1) In the first embodiment, the liquid crystal material 25b is applied to fill the second partition region S2. However, the present invention is not limited to this, and may be at least enough to cover the terminal portion 11a. Even in this case, damage or the like of the terminal portion 11a due to the laser beam 59 can be prevented.

The structure of a board | substrate is shown, (a) is a top view, (b) schematic sectional drawing. The structure of the liquid crystal display panel as an electro-optical apparatus is shown, (a) is a top view, (b) is a schematic sectional drawing. The schematic diagram which shows the structure of a laser irradiation apparatus. Process drawing which shows the scribing method in 1st Embodiment. The perspective view which shows the structure of the projector as an electronic device. Process drawing which shows the scribe method in 2nd Embodiment. Process drawing which shows the scribe method in 3rd Embodiment. Process drawing which shows the scribe method in 4th Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 11 ... 1st board | substrate, 11a ... Terminal part as a pattern, 12 ... 2nd board | substrate, 24 ... Sealing material, 25 ... Liquid crystal material, 25a ... Liquid crystal material as a display material, 25b ... Liquid crystal as a suppression member 31 ... Mounting terminal, 40 ... Laser irradiation device, 59 ... Laser light, 80 ... Projector, 90 ... Spacer material as deterrence member, 100 ... Resin material as deterrence member, 110 ... Metal material as deterrence member, S1 ... 1st division area, S2 ... 2nd division area, L1 ... 1st scheduled cutting line, L2 ... 2nd scheduled cutting line, P ... Condensing point, Rc1, Rc2 ... Modified layer.

Claims (10)

A first substrate on which a pattern is formed, a second substrate is disposed opposite to the surface of the first substrate on which the pattern is formed, and a cutting line for cutting the second substrate is provided, and at least A substrate manufacturing process comprising a suppression member that suppresses transmission of laser light between the pattern and the surface of the second substrate facing the pattern on the planned cutting line;
Condensing laser light into the second substrate from the surface opposite to the surface of the second substrate disposed opposite to the surface of the first substrate on which the pattern is formed, along the planned cutting line. And an irradiation step of irradiating the laser beam so that the point moves. The laser scribing method according to claim 1, wherein
In the substrate manufacturing process, the restraining member is a liquid crystal material. The laser scribing method according to claim 2, wherein
The substrate manufacturing step includes a liquid crystal material application step of applying a liquid crystal material as a display material between the first substrate and the second substrate,
The laser scribing method, wherein the liquid crystal material as the suppression unit is the same material as the liquid crystal material as the display material. The laser scribing method according to claim 2 or 3,
In the liquid crystal material application step, a liquid crystal material as the suppressing member and a liquid crystal material as the display material are applied at the same time. The laser scribing method according to claim 1, wherein
In the substrate manufacturing process, the restraining member is a spacer material. In the laser scribing method according to any one of claims 1 to 5,
The laser scribing method, wherein the spacer material as the restraining portion is the same material as the spacer material included in the liquid crystal material as the display material. The laser scribing method according to claim 1, wherein
In the substrate manufacturing process, the restraining member is a resin material. The laser scribing method according to claim 1, wherein
In the substrate manufacturing process, the restraining member is a metal material.   An electro-optical device manufactured by the laser scribing method according to claim 1. An electronic apparatus comprising the electro-optical device according to claim 9.