KR101403543B1 - Touch panel sensor and manufacturing method of the same - Google Patents

Touch panel sensor and manufacturing method of the same Download PDF

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Publication number
KR101403543B1
KR101403543B1 KR1020130056714A KR20130056714A KR101403543B1 KR 101403543 B1 KR101403543 B1 KR 101403543B1 KR 1020130056714 A KR1020130056714 A KR 1020130056714A KR 20130056714 A KR20130056714 A KR 20130056714A KR 101403543 B1 KR101403543 B1 KR 101403543B1
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South Korea
Prior art keywords
base layer
laminated film
film
laminated
electrode pattern
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KR1020130056714A
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Korean (ko)
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박철
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(주)삼원에스티
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Abstract

A touch panel sensor and a manufacturing method thereof that can simplify the structure and manufacturing process and improve reliability can be provided. A method of manufacturing a touch panel sensor disposed on a display and sensing a contact position of a target object includes a release film, a base layer formed on an upper surface of the release film, a first electrode pattern formed on an upper surface of the base layer, Providing a first laminated film comprising a first wire member electrically connected to the first laminated film; Providing a second laminated film; Stacking the first laminated film and the second laminated film so that the release film is exposed to the outside; Removing the release film; And exposing one end of the first wire member to the bottom surface of the exposed base layer by removing the release film.

Description

TECHNICAL FIELD [0001] The present invention relates to a touch panel sensor,

The present invention relates to a touch panel sensor and a method of manufacturing the touch panel sensor, and more particularly, to a touch panel sensor capable of sensing a contact position of an object approaching a display.

1 is a perspective view illustrating a conventional capacitive touch panel sensor.

1, in a conventional touch panel sensor, a lower insulating sheet 10 and an upper insulating sheet 20 are bonded at a predetermined interval. The lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the opposing surfaces of the lower insulating sheet 10 and the upper insulating sheet 20. Specifically, The upper ITO electrode 40 is oriented from the upper side to the lower side on the bottom surface of the upper insulating sheet 20.

The touch panel sensor has a predetermined capacitance corresponding to the area of each intersection at each intersection of the lower ITO electrode 30 and the upper ITO electrode 40 arranged to cross each other, The area of the upper ITO electrode 40 disposed on the upper part may be added to the area of the body part to change the capacitance value.

A connection line 48 made of a metal is connected from the end of the upper ITO electrode 40 to the upper insulating sheet 20 to electrically connect the upper ITO electrode 40 and the electrode 52 of the external circuit board 50 And the lower ITO electrode 20 is connected to the circuit board 50 by a separate connection line.

At this time, the connecting line 48, which is generally made of metal, is shiny with metallic luster and can not be seen through the transparent upper insulating sheet 20 because the light does not pass through. Conventionally, a separate non-transmissive film for the window decoration 65 is formed on the bottom surface of the reinforced substrate 60 such as a separate glass or translucent reinforced plastic so that the connecting line 48 and the circuit board 50 can not be visually recognized , And the reinforcing substrate (60) is disposed on the upper insulating sheet (20). For details of the conventional touch panel sensor described above, refer to the touch panel sensor disclosed in Japanese Patent Application Laid-Open No. 10-2011-0137231 (December 22, 2011).

However, providing a separate reinforcing substrate 60 on the upper insulating sheet 20 causes an increase in the thickness of the touch panel sensor and complicates the assembling process, and an increase in the thickness of the touch panel sensor It may cause the transparency and sharpness of the touch panel sensor to deteriorate, and the sensitivity of the touch panel sensor may be lowered.

Accordingly, in recent years, a variety of researches have been conducted in order to simplify the manufacturing process of the touch panel sensor, to reduce the thickness thereof, and to improve the sensitivity.

The present invention provides a touch panel sensor capable of contributing to slimming and capable of improving touch sensitivity and a method of manufacturing the same.

The present invention also provides a touch panel sensor and a method of manufacturing the same that can simplify the manufacturing process and shorten the manufacturing time.

In addition, the present invention provides a touch panel sensor capable of reducing the defect rate and reducing the manufacturing cost, and a method of manufacturing the same.

According to another aspect of the present invention, there is provided a method of manufacturing a touch panel sensor, the touch panel sensor including a release film, a base Providing a first laminated film including a first electrode pattern formed on an upper surface of the base layer, and a first wire member electrically connected to the first electrode pattern; Providing a second laminated film; Stacking the first laminated film and the second laminated film so that the release film is exposed to the outside; Removing the release film; And exposing one end of the first wire member to the bottom surface of the exposed base layer by removing the release film.

The first laminated film and the second laminated film can be provided in various structures and methods according to the required conditions and design specifications.

For example, providing the first laminated film may include providing a release film, forming a base layer on the top surface of the release film, forming a first electrode pattern on the top surface of the base layer, And forming a first wire member on an upper surface of the base layer so as to be electrically connected to the pattern. The step of providing the second laminated film may further include the steps of providing a film member, forming a second electrode pattern on the upper surface of the film member, and forming a second electrode pattern on the upper surface of the film member to be electrically connected to the second electrode pattern. And forming a wire member. For reference, the order of providing the first laminated film and the second laminated film may be changed according to required conditions and design specifications.

As a second laminated film, only a film member in which a second electrode pattern and a second wire member are separately formed on the upper surface may be used alone, and after an insulating layer is formed on the upper surface of the first laminated film, It is also possible to form the second electrode pattern and the second wire member on the upper surface of the layer. Alternatively, it is also possible to arrange that the touch panel sensor has a single-layer electrode pattern structure, that is, an electrode pattern is formed only on the first laminated film and no separate electrode pattern is formed on the second laminated film.

The base layer can be formed in various ways depending on the required conditions and design specifications. For example, the base layer may be provided by applying a liquid curing agent to the upper surface of the release film, and then curing the liquid curing agent. As another example, the base layer may be provided using a synthetic resin film. For reference, a plastic film in which an electrode pattern is formed is generally provided to have a thickness of about several hundreds of micrometers. The reason for this is that in order to form an electrode pattern directly on the plastic film by laying an electrode layer on the plastic film and patterning process such as photolithography, the thickness of the plastic film must be at least several hundreds of micrometers. However, in the present invention, since the base layer is formed on the release film and the first electrode pattern to be described later is formed on the upper surface of the base layer, there is no problem in forming the first electrode pattern even if the thickness of the base layer is thin. For example, the base layer may be provided using a synthetic resin film having a thickness of 10 to 30 탆, which does not require a separate thermal curing treatment or ultraviolet curing treatment.

The first electrode pattern and the second electrode pattern may be formed using a conductive material and a transparent material, and the present invention is not limited or limited by the material of the first electrode pattern and the second electrode pattern. For example, the first electrode pattern and the second electrode pattern may be formed using ITO, IZO, ATO, AZO, carbon nanotubes, transparent organic materials, or the like. In some cases, the first electrode pattern and the second electrode pattern may be formed using a metal fiber such as silver nano fiber, and the first electrode pattern formed using the metal fiber solution may be very thin The fibrous metal fibers are connected to each other, so that they can maintain high conductivity and can be formed to have a very thin thickness of 1 탆 or less. Alternatively, a metal mesh having a thickness of about 10 mu m or less may be applied instead of the first electrode pattern and the second electrode pattern.

The first laminated film and the second laminated film may be laminated to each other so that the release film is exposed to the outside. Herein, the first laminated film and the second laminated film are laminated so that the release film is exposed to the outside, The first laminated film is stacked on the upper surface of the second laminated film so that the first laminated film is disposed on the uppermost surface of the second laminated film or the case where the first laminated film is laminated on the bottom surface of the second laminated film such that the release film is disposed on the lowest surface . For example, the first laminated film may be laminated on the upper surface of the second laminated film such that the first electrode pattern faces the second electrode pattern.

The first laminated film and the second laminated film may be laminated via an intermediate adhesive layer. The intermediate adhesive layer can be provided in various ways depending on the required conditions and design specifications. For example, the intermediate adhesive layer may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing. In some cases, the intermediate adhesive layer may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film together with a liquid adhesive.

The manner of exposing one end of the first wire member to the bottom surface of the base layer can be variously changed according to the required conditions and design specifications. In one example, the base layer may be partially removed to expose one end of the first wire member to the bottom surface of the base layer. That is, the first penetration can be formed in the base layer by partially removing the base layer from the exposed bottom surface of the base layer (the top surface of the laminated structure in which the first laminated film and the second laminated film are laminated) as the release film is removed And one end of the first wire member can be exposed to the bottom surface of the base layer through the first penetration. In another example, when the base layer is formed, the first penetrating portion may be formed together with the base layer, and one end of the first wire member is exposed to the bottom surface of the base layer through the first penetration portion exposed by removing the release film . For reference, when the base layer is formed, the first penetrating portion is formed together with the base layer. The resin for forming the base layer is applied or printed except for the first penetrating region, One penetrating portion may be formed together.

In addition, the first penetration portion can be formed in the base layer by conventional laser processing, etching, machining, or the like, and the present invention is not limited or limited by the method of forming the first penetration portion. In some cases, the first penetrating portion may be formed by etching or other method.

Further, the base layer may be provided with a second penetrating portion in the same or similar manner as the first penetrating portion, and one end of the second wire member may be exposed to the bottom surface of the base layer through the second penetrating portion.

In addition, through holes corresponding to the second penetration portions may be formed in the adhesive layer for mutually stacking the first laminated film and the second laminated film. When the through holes are formed in the adhesive layer as described above, since the first penetrating portion and the second penetrating portion are processed only by the thickness of the base layer, the processing conditions of the first penetrating portion and the second penetrating portion can be set to be the same have. For example, when the first penetration portion and the second penetration portion are respectively formed by laser machining, the laser processing conditions for forming the first penetration portion and the laser processing conditions for forming the second penetration portion may be set to be equal to each other . Here, the same laser processing conditions are understood to mean that the processing conditions such as the laser output and intensity during processing of the first penetration portion are the same as the processing conditions such as the laser output and intensity at the processing of the second penetration portion have.

The through hole may be formed together with the adhesive layer when the intermediate adhesive layer is formed. For example, when a liquid adhesive for forming an intermediate adhesive layer is applied or printed except for the through hole area, through holes may be formed together when the intermediate adhesive layer is formed. In some cases, when the second penetrating portion is formed by laser machining, a through hole is not formed separately on the intermediate adhesive layer, and not only the second penetrating portion but also the adhesive layer portion between the second penetrating portion and the second wire member To the through hole region).

In addition, since the second wire member has a relatively thick thickness compared to the second electrode pattern and the second penetrating portion is formed on the upper portion of the second wire member, the laser processing for forming the second penetrating portion (including the through hole region) Is not very precise, the thickness of the second wire member can maintain a certain level of machining stability and reliability. In other words, there is a possibility that a part of the upper surface of the second wire member is damaged by laser processing. However, even if the upper surface portion of the second wire member is damaged because the second wire member has a relatively thick thickness, Can be maintained.

An adhesive layer may be formed on the upper surface of the laminated structure in which the first laminated film and the second laminated film are laminated, and a glass substrate may be laminated via the adhesive layer. The adhesive layer can be provided in various ways depending on the required conditions and design specifications. For example, the adhesive layer may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing, or may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film or the like.

In addition, window decorations may be formed in the lower portion of the glass substrate before the glass substrate is laminated. Here, the window decoration is formed at the bottom of the glass substrate. The window decoration is formed on the bottom surface of the glass substrate, or the window decoration is formed on one surface of the base layer or the film member facing the bottom surface of the glass substrate . ≪ / RTI >

According to another preferred embodiment of the present invention, there is provided a method of manufacturing a touch panel sensor, including: forming a release film, a base layer formed on an upper surface of the release film, a first electrode pattern formed on an upper surface of the base layer, Providing a first laminated film comprising a first wire member connected to the second wire; Providing a second laminated film including a film member, a second electrode pattern formed on an upper surface of the film member, and a second wire member electrically connected to the second electrode pattern; Stacking the first laminated film and the second laminated film so that the release film is exposed to the outside; Removing the release film; And exposing one end of the first wire member to the bottom surface of the base layer by partially removing the base layer, wherein the first laminated film has the first electrode pattern facing the bottom surface of the film member, It can be stacked on the bottom.

An insulating printed layer may be formed on the first laminated film so as to cover one end of the first wire member. The insulating printing layer may be provided to improve laser processing characteristics, and various functional layers may be used as an insulating printing layer depending on the required conditions and design specifications. As an example, the insulating printed layer can be formed using a non-conductive colored printing.

The base layer may be partially removed from the bottom surface of the base layer to form a first penetration in the base layer and one end of the first wire member may be exposed to the bottom surface of the base layer through the first penetration. In addition, in the step of partially removing the base layer, a portion where the base layer is partially removed may correspond to a portion where the insulating print layer is formed. That is, the base layer can be removed by a region where the insulating printing layer is formed corresponding to the insulating printing layer.

Further, since the second laminated film is laminated on the upper surface of the first laminated film, the second electrode pattern of the second laminated film can be exposed to the upper surface of the second laminated film.

According to another preferred embodiment of the present invention, the first laminated film and the second laminated film may be provided corresponding to at least one or more glass substrates, and the first laminated film and the second laminated film may be laminated on a glass substrate The glass substrate may be cut to a size corresponding to the glass substrate. For example, the first laminated film and the second laminated film can be formed at once in an array of 4 * 4, 5 * 5, 6 * 6, 3 * 4, etc. according to required conditions and design specifications, The present invention is not limited or limited by the arrangement of the second laminated film.

According to the touch panel sensor and the manufacturing method thereof according to the present invention, the manufacturing process can be simplified and can contribute to slimming down.

Particularly, according to the present invention, since the base layer, the first electrode pattern and the first wire member can be transferred onto the second laminated film at a time, it is possible to shorten the process time, It is possible to minimize the occurrence of defects due to position errors.

In addition, since an electrode layer for an electrode pattern is conventionally formed and an electrode pattern is formed directly on a plastic film through a patterning process such as a photolithography process, the thickness of the plastic film used in the conventional touch panel sensor must be maintained at least several hundreds of micrometers did. However, in the touch panel sensor and the manufacturing method thereof according to the present invention, since the base layer is provided on the release film and the electrode pattern is formed on the base layer, there is no problem in forming the electrode pattern even if the thickness of the base layer is thin, The base layer can be made thinner. Accordingly, the thickness of the touch panel sensor can be further reduced, and the sensitivity of the touch panel sensor can be improved to enhance the merchantability of the product.

In addition, according to the present invention, the first laminated film and the second laminated film can be circulated in an almost finished state in which they are laminated to each other, and the manufacturer can complete the product by simply forming the penetrating portion and connecting the circuit board.

Further, according to the present invention, since the circuit board can be attached to the outer surface of the laminated structure in a state where the first laminated film and the second laminated film are laminated, space utilization and design between the first laminated film and the second laminated film The degree of freedom can be maximized, and the manufacturing process can be further simplified.

In addition, according to the present invention, since a laminated structure corresponding to a plurality of glass substrates can be made and cut and used, a natural finishing process can be performed in the cutting process. Therefore, a separate finishing treatment is not required, so that it is possible to shorten the time required for finishing the components such as the base layer on the release film, the adhesive layer that can be formed in the middle of the laminated structure, and the like.

1 is a perspective view illustrating a conventional touch panel sensor.
2 is a view showing a touch panel sensor according to the present invention.
3 to 8 are views for explaining a method of manufacturing a touch panel sensor according to the present invention.
9 to 16 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention.
17 is a view for explaining each method of manufacturing a touch panel sensor according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments. For reference, the same numbers in this description refer to substantially the same elements and can be described with reference to the contents described in the other drawings under these rules, and the contents which are judged to be obvious to the person skilled in the art or repeated can be omitted.

FIG. 2 is a view showing a touch panel sensor according to the present invention, and FIGS. 3 to 8 are views for explaining a method of manufacturing a touch panel sensor according to the present invention.

2 to 8, a touch panel sensor according to the present invention is placed on a display and can be used for detecting a contact position of a target object. The touch panel sensor includes a first laminated film 100, a second laminated film 200, And a substrate 400.

Since the glass substrate 400 is directly touched by a part of a body such as a finger or a touch tool, a rigid glass substrate which is excellent in strength and can not be easily refracted is used, or a polycarbonate having a light- Reinforced plastic can be used.

The first laminated film 100 may include a release film 110, a base layer 120, a first electrode pattern 130, and a first wire member 140 which are sequentially stacked.

The second laminated film 200 may include a film member 210, a second electrode pattern 220 and a second wire member 230 which are sequentially stacked.

The first laminated film 100 and the second laminated film 200 may be laminated to each other such that the release film 110 is exposed to the outside. The first laminated film 100 and the second laminated film 200 are laminated so that the release film 110 is exposed to the outside. The first laminated film 100 Is stacked on the upper surface of the second laminated film 200 or the first laminated film 100 is laminated on the lower surface of the second laminated film 200 so that the release film 110 is disposed on the lowest surface But may be understood to include both.

The release film 110 may be removed after the first and second laminated films 100 and 200 are laminated and the bottom surface of the base layer 120 may be removed as the release film 110 is removed. And can be exposed to the outside.

The bottom surface of the base layer 120 exposed to the outside may be partially removed so that one end of the first wire member 140 may be exposed to the bottom surface of the base layer 120, May be electrically connected to the first wire member 140 mounted on the bottom surface of the base layer 120 and exposed to the bottom surface of the base layer 120. In some cases, the base layer may be formed with a first penetration portion when the base layer is formed. When the release film is removed, one end of the first wire member is exposed to the bottom surface of the base layer through the exposed first penetration portion It is also possible to configure it to be exposed.

The second wire member 230 is bonded to the second layered film 200 in a manner similar to the first wire member 140 according to the vertical stacking method of the first laminated film 100 with respect to the second laminated film 200. [ 120 may be removed to expose the bottom surface of the base layer 120 or exposed to the top surface of the second laminated film 200 to be electrically connected to the external circuit board 500.

The bottom surface of the base layer 120 is formed by stacking the first laminated film 100 and the second laminated film 200 as the first laminated film 100 is laminated on the upper surface or the lower surface of the second laminated film 200, May be disposed on the uppermost surface or the lowermost surface of the laminated structure 300.

In addition, the window decoration (330) may be formed under the glass substrate (400) before the glass substrate (400) is laminated. The window decoration 330 is formed below the glass substrate 400. The window decoration 330 is formed on the bottom of the glass substrate 400 or the window decoration 330 is formed on the glass substrate 400, The base layer 120 facing the bottom of the film member 210 or the structure formed on one side of the film member 210. [

Hereinafter, a method of manufacturing a touch panel sensor according to the present invention will be described with reference to FIGS. 4 is a view for explaining a second laminated film, and Fig. 5 is a view for explaining a step of laminating the first laminated film and the second laminated film. Fig. FIG. 7 is a view for explaining the step of partially removing the base layer to form the first penetration portion and the second penetration portion, and Fig. 8 is a view for explaining the step of removing the release layer, A window decoration, an adhesive layer, and a glass substrate.

The touch panel sensor according to the present invention includes a release film 110, a base layer 120 formed on the upper surface of the release film 110, a first electrode pattern 130 formed on the upper surface of the base layer 120, , And a first wire member (140) electrically connected to the first electrode pattern (130); Providing a second laminated film (200); Laminating the first laminated film (100) and the second laminated film (200) to each other so that the release film (110) is exposed to the outside; Removing the release film (110); And exposing one end of the first wire member 140 to the bottom surface of the base layer 120 exposed when the release film 110 is removed.

For reference, in the embodiment of the present invention, the first laminated film 100 is provided earlier than the second laminated film 200. However, in some cases, The film 200 may be provided first.

Referring to FIG. 3, a first laminated film 100 may be provided. The first laminated film 100 includes a release film 110, a base layer 120 formed on the upper surface of the release film 110, a first electrode pattern 130 formed on the upper surface of the base layer 120, And a first wire member 140 electrically connected to the first electrode pattern 130.

The first laminated film 100 may be provided in various ways according to required conditions and design specifications. For example, first, a release film 110 may be provided, and a base layer 120 may be formed on an upper surface of the release film 110.

As the release film 110, a common synthetic resin film may be used. In some cases, a thin metal plate may be used as the release film, or a synthetic resin film having a metal coating on one side thereof may be used.

For reference, the release adhesive layer 112 may be formed on the upper surface of the release film 110. The dummy adhesive layer 112 may be formed in a layer state and may be laminated on the release film 110 as it is. In this case, since the bubbles may enter or be displaced in the laminating process, A liquid material for forming the layer 112 is applied on the release film 110 and the release material 110 is rotated to uniformly spread the liquid material on the release film 110 and then cured .

The base layer 120 may be formed in various ways according to required conditions and design specifications.

For example, the base layer 120 may be provided by applying or printing a liquid curing agent on the upper surface of the release film 110, and then curing the liquid curing agent. In some cases, the liquid curing agent can be applied by spin coating or other methods, and the present invention is not limited or limited by the application method of the liquid curing agent. Hereinafter, as a liquid curing agent, an ordinary ultraviolet curing agent is used. In some cases, a heat curing agent may be used instead of the ultraviolet curing agent as a liquid curing agent. Alternatively, it is possible that the base layer is formed in other ways such as printing, etching or the like.

As another example, the base layer 120 may be provided using a synthetic resin film. For reference, a plastic film in which an electrode pattern is formed is generally provided to have a thickness of about several hundreds of micrometers. The reason for this is that in order to form an electrode pattern directly on the plastic film by laying an electrode layer on the plastic film and patterning process such as photolithography, the thickness of the plastic film must be at least several hundreds of micrometers. However, in the present invention, since the base layer 120 is formed on the release film 110 and the first electrode pattern 130 to be described later is formed on the upper surface of the base layer 120, the thickness of the base layer 120 There is no problem in forming the first electrode pattern 130. For example, the base layer 120 may be provided using a synthetic resin film having a thickness of 10 to 30 탆, which does not require a separate thermal curing treatment or ultraviolet curing treatment.

As the synthetic resin film, plastic films such as polyethylene, polypropylene, acryloyl, and polyethylene terephthalate (PET) having transparency may be used. Depending on the type and characteristics of the synthetic resin film, Or < / RTI >

Next, a first electrode pattern 130 is formed on the upper surface of the base layer 120.

The first electrode pattern 130 may be formed to have various shapes and structures according to required conditions and design specifications. For example, the first electrode pattern 130 may be formed to have a square or diamond shape, and in some cases, the first electrode pattern may have a general line shape, or an upper or lower portion of the line may be connected, As shown in FIG.

The first electrode pattern 130 may be formed of a conductive material and a transparent material. The present invention is not limited to the first electrode pattern 130. For example, the first electrode pattern 130 may be formed using ITO, IZO, ATO, AZO, carbon nanotubes, transparent organic materials, or the like. In some cases, the first electrode pattern 130 may be formed using metal fibers such as silver nano fibers, and even if the first electrode pattern formed using the metal fiber solution is formed to be very thin Since the fibrous metal fibers are connected to each other, high conductivity can be maintained, and it is also possible to form a very thin thickness of 1 탆 or less. Alternatively, a metal mesh having a thickness of about 10 mu m or less may be applied instead of the first electrode pattern.

The first electrode pattern 130 may be formed by forming a first electrode layer (not shown) on the entire upper surface of the base layer 120, and then patterning the first electrode layer into a predetermined shape by a conventional etching method. In some cases, it is possible to form the first electrode pattern by printing or other methods.

Next, a first wire member 140 is formed on the upper surface of the base layer 120 to be electrically connected to the first electrode pattern 130.

The first wire member 140 may be formed by a conventional printing process using a silver paste. In some cases, the first wire member may be formed by a metal thin film deposition process or a metal electrode etching process. For example, in the embodiment of the present invention, the first electrode pattern and the first wire member are respectively formed to be formed by separate processes. However, in some cases, the first electrode pattern and the first wire member may be single It is also possible to constitute them simultaneously.

Next, as shown in FIG. 4, a second laminated film 200 is provided. The second laminated film 200 includes a film member 210, a second electrode pattern 220 formed on the upper surface of the film member 210, and a second electrode pattern 220 electrically connected to the second electrode pattern 220. A wire member 230 may be provided.

The second electrode pattern 220 and the second wire member 230 may be sequentially formed on the upper surface of the film member 210. The film member 210 may be formed of a synthetic resin film. The second electrode pattern 220 and the second wire member 230 are formed on the upper surface of the film member 210 in the same or similar manner as the first electrode pattern 130 and the first wire member 140 .

Next, as shown in FIG. 5, the first laminated film 100 and the second laminated film 200 are laminated to each other so that the release film 110 is exposed to the outside. For example, the first laminated film 100 may be stacked on the upper surface of the second laminated film 200 such that the first electrode pattern 130 faces the second electrode pattern 220.

For example, the first laminated film 100 and the second laminated film 200 may be laminated via the intermediate adhesive layer 310. The intermediate adhesive layer 310 may be provided in various ways according to required conditions and design specifications. For example, the intermediate adhesive layer 310 may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and then curing. In some cases, the intermediate adhesive layer may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film together with a liquid adhesive.

Next, as shown in FIG. 6, the release film 110 is removed from the first laminated film 100. By removing the release film 110, the bottom surface of the base layer 120 can be exposed to the outside.

Next, as shown in FIG. 7, the base layer 120 is partially removed to expose one end of the first wire member 140 to the bottom surface of the base layer 120. For example, when the release film 110 is removed, the base layer 120 is exposed from the bottom surface (the top surface of the laminated structure 300 in which the first laminated film and the second laminated film 200 are stacked) of the exposed base layer 120 And the first end of the first wire member 140 is connected to the base layer 120 through the first penetration 121. The first penetration part 121 may be formed in the base layer 120, As shown in FIG.

The first through-hole 121 may be formed in a hole shape in the base layer 120 by conventional laser processing, etching, machining, or the like. By the method of forming the first through hole 121, But are not limited to. In some cases, the first penetrating portion may be formed by etching or other method.

The base layer 120 may be partially removed from the bottom surface of the base layer 120 in the same or similar manner as the first through-hole 121 to form the second through-hole 122 in the base layer 120 And one end of the second wire member 230 may be exposed to the bottom of the base layer 120 through the second penetration portion 122.

One end of the first wire member 140 and one end of the second wire member 230 are connected to the base layer 120 by forming the first penetration portion 121 and the second penetration portion 122 in the base layer 120, The first wire member 140 and the second wire member 230 may be electrically connected to the external circuit board 500 attached to the bottom surface of the base layer 120. [ For reference, the external circuit board 500 may be attached by conventional ACF bonding, and the present invention is not limited or limited by the method of attaching the external circuit board 500. In some cases, it is also possible to attach the circuit board to the outside after filling the inner space of the first penetrating portion and the second penetrating portion with a conductive material.

The through hole 312 corresponding to the second through hole 122 may be formed in the intermediate adhesive layer 310 for stacking the first and second laminated films 100 and 200. When the through hole 312 is formed in the intermediate adhesive layer 310 as described above, the first through hole 121 and the second through hole 122 are formed only by the thickness of the base layer 120, respectively The first through-hole 121, and the second through-hole 122 can be set to be the same. For example, when the first through-hole 121 and the second through-hole 122 are respectively formed by laser machining, the laser processing conditions for forming the first through-hole 121 and the laser- The laser processing conditions for forming the laser beam 122 can be set to be equal to each other. The laser machining conditions are the same as the processing conditions such as the laser output and intensity at the time of processing the first penetration portion 121 and the laser output and intensity at the processing of the second penetration portion 122 It can be understood that they are the same with the same processing conditions.

The through hole 312 may be formed with the intermediate adhesive layer 310 when the intermediate adhesive layer 310 is formed. For example, when a liquid adhesive for forming the intermediate adhesive layer 310 is applied except for the region of the through hole 312, the through hole 312 can be formed together when the intermediate adhesive layer 310 is formed.

In the above-described embodiment of the present invention, the through hole corresponding to the second through hole is formed in the intermediate adhesive layer. In some cases, however, no through hole is formed on the intermediate adhesive layer, (Corresponding to the through hole region) between the second penetrating portion and the second wire member, as well as the second penetrating portion, when formed by additional laser processing.

In addition, since the second wire member 230 has a relatively thick thickness compared to the second electrode pattern 220 and the second through hole 122 is formed on the second wire member 230, Even if the laser processing for forming the second through hole 122 (including the through hole area) is not very precise, the thickness of the second wire member 230 can maintain the machining stability and reliability above a certain level. In other words, there is a possibility that a portion of the upper surface of the second wire member 230 may be damaged by laser processing. However, since the second wire member 230 has a relatively thick thickness, The electrical characteristics of the second wire member 230 can be maintained.

8, the adhesive layer 320 may be formed on the upper surface of the laminated structure 300 in which the first laminated film 100 and the second laminated film 200 are laminated. The adhesive layer 320 may be formed on the upper surface of the laminated structure 300, The glass substrate 400 can be stacked.

The adhesive layer 320 may be provided in various ways depending on the required conditions and design specifications. For example, the adhesive layer 320 may be provided by applying a liquid adhesive (for example, an ultraviolet curing agent) and curing, or may be provided using an optical adhesive film or an OCA (Optically Clear Adhesive) film.

In addition, a window decoration 330 may be formed under the glass substrate 400 before the glass substrate 400 is laminated. For example, a window decoration 330 may be formed on the bottom surface of the glass substrate 400.

The window decoration 330 includes a first wire member 140, a second wire member 230, and a circuit board (not shown) disposed at the edge of the touch panel sensor, for example, 500), and can be formed by an ordinary printing process or the like. In some cases, the window decoration may be formed on the bottom surface of the base layer facing the glass substrate (the top surface of the laminated structure in which the first laminated film and the second laminated film are laminated).

9 to 16 are views for explaining a method of manufacturing a touch panel sensor according to another embodiment of the present invention. 12 and 13 are views for explaining the second laminated film, and Fig. 13 is a view for explaining the step of laminating the first laminated film and the second laminated film Fig. 15 is a view for explaining the step of partially removing the base layer to form the first penetration portion, Fig. 16 is a view for explaining a step of removing the release film, And a step of laminating the glass substrate. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

In the above-described embodiments of the present invention, the first laminated film is overlaid on the upper surface of the second laminated film and is stacked. However, in some cases, the first laminated film is laminated on the bottom surface of the second laminated film It is also possible.
Referring to FIG. 9, a method of manufacturing a touch panel sensor according to another embodiment of the present invention includes a release film 1110, a base layer 1120 formed on the top surface of the release film 1110, Providing a first laminated film 1100 including a first electrode pattern 1130 formed on an upper surface of the first electrode pattern 1130 and a first wire member 1140 electrically connected to the first electrode pattern 1130; Providing a second laminated film (1200); Stacking the first laminated film 1100 and the second laminated film 1200 together so that the release film 1110 is exposed to the outside; Removing the release film (1110); And exposing one end of the first wire member 1140 to the bottom surface of the base layer 1120 exposed by removing the release film 1110. The first laminated film 1100 may include a first The electrode pattern 1130 may be laminated on the bottom surface of the second laminated film 1200 so as to face the bottom surface of the film member 1210.
Referring to FIG. 10, a first laminated film 1100 is first provided. The first laminated film 1100 includes a release film 1110, a base layer 1120 formed on the upper surface of the release film 1110, a first electrode pattern 1130 formed on the upper surface of the base layer 1120, And a first wire member 1140 electrically connected to the first electrode pattern 1130.
Referring to FIG. 11, an insulating printed layer 1150 may be formed on the first laminated film 1100 so as to cover one end of the first wire member 1140. The insulating print layer 1150 may be provided to improve laser processing characteristics, and various functional layers may be used as the insulating print layer 1150 according to required conditions and design specifications. For example, the insulating printed layer 1150 may be formed using a non-conductive colored printing (e.g., black printing), and may be formed to cover the entire one end of the plurality of first wire members 1140 .
Next, as shown in FIG. 12, a second laminated film 1200 is provided. The second laminated film 1200 includes a film member 1210, a second electrode pattern 1220 formed on the upper surface of the film member 1210, and a second electrode pattern 1220 electrically connected to the second electrode pattern 1220. [ May be provided, including a wire member 1230.
Next, as shown in FIG. 13, the first laminated film 1100 and the second laminated film 1200 are laminated. The first laminated film 1100 may be laminated on the bottom of the second laminated film 1200 so that the first electrode pattern 1130 faces the bottom of the film member 1210.
Next, as shown in FIG. 14, the release film 1110 is removed from the first laminated film 1100. The bottom surface of the base layer 1120 can be exposed to the lowest surface of the laminated structure 1300 in which the first laminated film 1100 and the second laminated film 1200 are laminated by removing the release film 1110. [
Next, as shown in FIG. 15, the base layer 1120 is partially removed to expose one end of the first wire member 1140 to the bottom of the base layer 1120. The base layer 1120 is partially removed from the bottom surface of the base layer 1120 exposed as the release film 1110 is removed (the lowest surface of the laminated structure in which the first laminated film and the second laminated film are stacked) A first penetration part 1121 may be formed in the base layer 1120 and one end of the first wire member 1140 may be exposed to the bottom surface of the base layer 1120 through the first penetration part 1121 .
In addition, in the step of partially removing the base layer 1120, a portion where the base layer 1120 is partially removed may correspond to a portion where the insulating print layer 1150 is formed. That is, the base layer 1120 may be removed by a region corresponding to the insulating printing layer 1150, where the insulating printing layer 1150 is formed.
Since the second laminated film 1200 is laminated on the upper surface of the first laminated film 1100, the second electrode pattern 1220 of the second laminated film 1200 is formed on the upper surface of the second laminated film 1200 And can be exposed to the upper surface.
16, the first wire member 1140 and the second wire member 1230 may be electrically connected to the external circuit board 1500 attached to the upper and lower surfaces of the laminated structure 1300, The glass substrate 1400 can be laminated via the adhesive layer 1320 formed on the upper surface of the structure 1300. [ In addition, a window decoration 1330 may be formed on the bottom surface of the glass substrate 1400 before the glass substrate 1400 is stacked.

9 to 16, a transmitter electrode is formed on the first laminated film, and a receiver electrode is formed on the second laminated film. However, in the case of FIGS. 9 to 16, It is also possible to form a receiver electrode on the first laminated film and a transmitter electrode on the second laminated film. In addition, in the structure in which the receiver electrode is formed on the first laminated film, a separate protective layer for protecting the receiver electrode exposed to the outside in a state where the first laminated film and the second laminated film are stacked may be formed, A glass substrate may be laminated on the bottom surface of the laminated structure in which the laminated film and the second laminated film are laminated.

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17 is a view for explaining each method of manufacturing a touch panel sensor according to another embodiment of the present invention. In addition, the same or equivalent portions as those in the above-described configuration are denoted by the same or equivalent reference numerals, and a detailed description thereof will be omitted.

Referring to FIG. 17, a laminated structure 300 'in which a first laminated film (see 100 in FIG. 2) and a second laminated film (see 200 in FIG. 2) ), And the stacked structure 300 'may be provided in a size corresponding to that of the glass substrate before laminated on the glass substrate. For example, the stacked structures 300 can be formed at once in an array of 4 * 4, 5 * 5, 6 * 6, 3 * 4, etc. according to required conditions and design specifications, The present invention is not limited thereto.

Although the present invention has been described with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that

100: first laminated film 110: release film
120: base layer 130: first electrode pattern
140: first wire member 200: second laminated film
210: Film member 220: Second electrode pattern
230: second wire member 300: laminated structure
310: intermediate adhesive layer 320: adhesive layer
330: Window decoration 400: Glass substrate
500: circuit board

Claims (27)

A method of manufacturing a capacitive touch panel sensor, the touch panel sensor comprising:
A base layer having a uniform thickness formed on the top surface of the release film, a first electrode pattern formed on an upper surface of the base layer while maintaining a uniform thickness of the base layer and sensing a touch of a target object, Providing a first laminated film including a first wire member electrically connected to the one-electrode pattern;
Providing a second laminated film;
Laminating the first laminated film and the second laminated film to each other through an intermediate adhesive layer so that the release film is exposed to the outside in a state where the release film is attached to the base layer;
The release film is removed in a state where the first laminated film and the second laminated film are laminated to each other to transfer the base layer, the first electrode pattern and the first wire member to the second laminated film all at once step; And
After removing the release film, the base layer region corresponding to the bottom surface of the first wire member is partially removed from the exposed bottom surface of the base layer by a laser so that one end of the first wire member is bonded to the bottom surface of the base layer The method comprising:
The base layer is formed on the base layer and the base layer is formed on the base layer, and the base layer is formed on the base layer, After the region is partially removed by the laser, an arrangement state of one end of the first wire member is held by the intermediate adhesive layer. The method according to claim 1,
Wherein the second laminated film includes a film member, a second electrode pattern formed on an upper surface of the film member and sensing a touch of a target object, and a second wire member electrically connected to the second electrode pattern. A method of manufacturing a touch panel sensor. 3. The method of claim 2,
Wherein the first laminated film is laminated on the upper surface of the second laminated film such that the first electrode pattern faces the second electrode pattern. The method of claim 3,
The base layer is partially removed from the bottom surface of the base layer to form a first penetration in the base layer,
Wherein one end of the first wire member is exposed to the bottom surface of the base layer through the first penetration. 5. The method of claim 4,
The base layer is partially removed from the bottom surface of the base layer to form a second penetration in the base layer,
And one end of the second wire member is exposed to the bottom surface of the base layer through the second penetrating portion. 6. The method of claim 5,
Wherein the first laminated film and the second laminated film are laminated via an intermediate adhesive layer,
And a through hole corresponding to the second through hole is formed in the intermediate adhesive layer. 6. The method of claim 5,
Wherein the first penetrating portion and the second penetrating portion are formed by laser processing,
Wherein laser processing conditions for forming the first penetrating portion and laser processing conditions for forming the second penetrating portion are the same. delete 3. The method of claim 2,
Wherein the first laminated film is laminated on the bottom surface of the second laminated film such that the first electrode pattern faces the bottom surface of the second laminated film. 10. The method of claim 9,
The base layer is partially removed from the bottom surface of the base layer to form a first penetration portion in the base layer, one end of the first wire member is exposed to the bottom surface of the base layer through the first penetration portion,
Wherein the second electrode pattern is exposed on an upper surface of the second laminated film. 10. The method of claim 9,
Wherein the base layer is provided with a first penetrating portion and one end of the first wire member is exposed to the bottom surface of the base layer through the first penetrating portion exposed by removing the release film. Gt; 10. The method of claim 9,
Before the first laminated film and the second laminated film are laminated to each other,
And forming an insulating printed layer to cover one end of the first wire member. 13. The method of claim 12,
Wherein the insulating printed layer is formed using colored printing. 13. The method of claim 12,
Wherein the base layer is removed corresponding to a portion where the insulating print layer is formed,
And a circuit board electrically connected to the first electrode pattern is disposed at a portion where the base layer is removed. The method according to claim 1,
And laminating a glass substrate after laminating the first laminated film and the second laminated film to each other. 16. The method of claim 15,
Further comprising the step of forming a window decoration on a lower portion of the glass substrate before the glass substrate is laminated. 16. The method of claim 15,
The laminated structure in which the first laminated film and the second laminated film are laminated is provided corresponding to at least one of the glass substrates, and the laminated structure is cut and provided corresponding to the glass substrate before laminated on the glass substrate Wherein the touch panel sensor comprises a plurality of touch panels. 16. The method of claim 15,
Wherein the glass substrate is laminated via an adhesive layer. 19. The method of claim 18,
Wherein the adhesive layer is provided by curing a liquid adhesive, or is provided using an adhesive film. delete The method according to claim 1,
Wherein the base layer is provided by applying a liquid curing agent on the release film, and then curing the liquid curing agent. The method according to claim 1,
Wherein the base layer is provided using a synthetic resin film. delete The method according to claim 1,
Wherein the intermediate adhesive layer is provided by curing a liquid adhesive, or is provided using an adhesive film. 3. The method of claim 2,
Wherein the first electrode pattern and the second electrode pattern are provided using at least one of indium tin oxide (ITO), indium zinc oxide (IZO), metal fiber, and metal mesh . The method according to claim 1,
Wherein providing the first laminated film comprises:
Providing the release film;
Forming the base layer on an upper surface of the release film;
Forming the first electrode pattern on the upper surface of the base layer; And
And forming the first wire member on the upper surface of the base layer to be electrically connected to the first electrode pattern. delete
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US9965112B2 (en) 2014-07-30 2018-05-08 Lg Innotek Co., Ltd. Touch panel

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KR20070106014A (en) * 2005-01-24 2007-10-31 니폰샤신인사츠가부시키가이샤 Lead wire connection method for touch panel
KR20100109233A (en) * 2009-03-31 2010-10-08 주식회사 잉크테크 Process for preparation of laminated metal film
KR20120018059A (en) * 2010-08-20 2012-02-29 미래나노텍(주) Substrate for touch screen panel, touch screen panel and fabrication method thereof

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Publication number Priority date Publication date Assignee Title
KR20070106014A (en) * 2005-01-24 2007-10-31 니폰샤신인사츠가부시키가이샤 Lead wire connection method for touch panel
KR20100109233A (en) * 2009-03-31 2010-10-08 주식회사 잉크테크 Process for preparation of laminated metal film
KR20120018059A (en) * 2010-08-20 2012-02-29 미래나노텍(주) Substrate for touch screen panel, touch screen panel and fabrication method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9965112B2 (en) 2014-07-30 2018-05-08 Lg Innotek Co., Ltd. Touch panel
US10437403B2 (en) 2014-07-30 2019-10-08 Lg Innotek Co., Ltd. Touch panel

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